Ultra-wideband dual-polarized tight-coupling phased array antenna and array thereof

Abstract

The application provides an ultra-wideband dual-polarized tight-coupling phased array antenna and an array thereof, and relates to the technical field of phased array antennas.In the application, the antenna unit of the ultra-wideband dual-polarized tight-coupling phased array antenna is composed of a tight-coupling dipole radiation layer, a wideband wide-angle scanning impedance matching layer, a metal gradient parallel double-line balun, a metal floor and a radio frequency connector.On one hand, the tight-coupling dipole radiation layer and the wideband wide-angle scanning impedance matching layer are printed on a dielectric substrate;the wideband wide-angle scanning impedance matching layer is composed of one layer of parasitic dipole matching layer and two layers of frequency selective surface matching layer, and is located above the tight-coupling dipole radiation layer to realize wideband wide-angle scanning impedance matching of the antenna unit.On the other hand, the metal gradient parallel double-line balun is a pure metal structure, the upper end of which is connected to the tight-coupling dipole, and the lower end of which is connected to the metal floor and the radio frequency connector respectively to realize impedance transformation and feeding of the antenna unit.

Description

Technical Field

[0001] This invention relates to the field of phased array antenna technology, specifically to an ultra-wideband dual-polarized tightly coupled phased array antenna and its array. Background Technology

[0002] With the rapid development of multifunctional and integrated electronic information equipment, the demand for ultra-wideband array antennas is becoming increasingly urgent. Ultra-wideband tightly coupled phased array antennas are one of the most popular research directions in recent years, as they are very suitable for airborne, shipborne, and other carrier platforms with strict requirements on carrier size and weight due to their low profile and lightweight characteristics.

[0003] The basic element form of a tightly coupled phased array antenna is the dipole element. By introducing strong capacitive coupling between adjacent dipole elements, a continuous current sheet structure is formed, thereby achieving ultra-wideband characteristics. The wider the operating bandwidth covered by the ultra-wideband tightly coupled phased array antenna element, the more difficult impedance matching becomes. Currently, common ultra-wideband tightly coupled phased array antenna element impedance matching optimization designs mainly focus on two aspects: 1) Optimization design of the antenna element feed balun. The feed balun can realize impedance transformation between the feed port impedance and the antenna element's own input impedance within the ultra-wide operating frequency band, thereby improving the impedance matching of the antenna element. However, commonly used antenna baluns based on dielectric substrates are prone to introducing common-mode resonance, ring-mode resonance, and other resonant singularities that affect the operating bandwidth within the operating frequency band, thus affecting the operating bandwidth of the antenna element; 2) Adding a wide-bandwidth angle-scanning impedance matching layer above the antenna element. The wide-bandwidth angle-scanning impedance matching layer can realize impedance transformation between the antenna element's radiation impedance and free-space wave impedance, thereby improving the impedance matching of the antenna element. Currently, the common technique is to use a dielectric layer with a certain thickness as the wide-bandwidth angle-scanning impedance matching layer. The thick dielectric layer increases the weight of the antenna element, affecting its lightweight design.

[0004] Therefore, optimizing the electrical performance of ultra-wideband tightly coupled phased array antennas requires improvements through multiple technical approaches, such as feed structure design and wide bandwidth angle scanning impedance matching layer design. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides an ultra-wideband dual-polarized tightly coupled phased array antenna and its array, which solves the technical problems of traditional feed baluns being prone to in-band resonance singularities and the heavy weight resulting from the use of thick pure dielectric material in the wide bandwidth angle scanning impedance matching layer.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] An ultra-wideband dual-polarized tightly coupled phased array antenna, the antenna element comprising a first dielectric substrate, a second dielectric substrate, a third dielectric substrate and a fourth dielectric substrate stacked non-contactly from top to bottom, as well as a metal graded parallel double-line balun, a metal ground plane and an RF connector.

[0010] The first dielectric substrate has a first frequency-selective surface matching layer printed on its upper surface; the second dielectric substrate has a second frequency-selective surface matching layer printed on its upper surface; the third dielectric substrate has a parasitic dipole matching layer printed on its upper surface, including a polarization-1 parasitic dipole and a polarization-2 parasitic dipole; and the fourth dielectric substrate has a tightly coupled dipole radiation layer printed on its upper surface, including a polarization-1 radiation dipole and a polarization-2 radiation dipole.

[0011] The metal gradient parallel double-line balun includes a polarization-one metal gradient parallel double-line balun and a polarization-two metal gradient parallel double-line balun, and any metal gradient parallel double-line balun includes a grounding gradient metal plate and a power supply gradient metal plate.

[0012] The upper ends of both the grounding gradient metal plate and the feeding gradient metal plate pass through the fourth dielectric substrate and are respectively welded to the two electric arms of the corresponding radiating dipole. The lower end of the grounding gradient metal plate is connected to the metal ground plate, and the lower end of the feeding gradient metal plate is connected to the inner conductor of the RF connector.

[0013] The radio frequency connector penetrates the metal floor.

[0014] Preferably, the polarization-one metal gradient parallel double-line balun and / or polarization-two metal gradient parallel double-line balun are pure metal structures.

[0015] Preferably, the grounding gradient metal plate and / or the power supply gradient metal plate gradually narrow from the bottom to the top, and the gradient shape includes a straight gradient, a curved gradient, or a stepped gradient.

[0016] Preferably, the grounding gradient metal plate and / or the power supply gradient metal plate are filled with air.

[0017] Preferably, the first frequency-selective surface matching layer and / or the second frequency-selective surface matching layer are composed of printed metal patches, the shapes of which include square, rectangular, circular, triangular, trapezoidal, annular or cross-shaped.

[0018] Preferably, the number of metal patches is greater than or equal to four.

[0019] Preferably, the first polarization parasitic dipole and the second polarization parasitic dipole are perpendicular and orthogonal.

[0020] Preferably, the polarization-1 radiation dipole and the polarization-2 radiation dipole are perpendicular and orthogonal.

[0021] Preferably, the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate, and the metal ground plane are arranged parallel to each other, and the polarization one metal gradient parallel double-line balun and / or the polarization two metal gradient parallel double-line balun are arranged perpendicular to the metal ground plane.

[0022] An ultra-wideband dual-polarized tightly coupled phased array antenna array includes several ultra-wideband dual-polarized tightly coupled phased array antennas as described in any of the preceding claims, with rectangular grids arranged between each of the ultra-wideband dual-polarized tightly coupled phased array antennas.

[0023] Preferably, the ultra-wideband dual-polarized tightly coupled phased array antenna has a size of not less than 8×8, and the distance between the elements is greater than or equal to 0.4 wavelengths of the highest operating frequency.

[0024] (III) Beneficial Effects

[0025] This invention provides an ultra-wideband dual-polarized tightly coupled phased array antenna and its array. Compared with the prior art, it has the following advantages:

[0026] In this invention, a first frequency-selective surface matching layer is printed on the upper surface of a first dielectric substrate; a second frequency-selective surface matching layer is printed on the upper surface of a second dielectric substrate; a parasitic dipole matching layer, including a polarization-1 parasitic dipole and a polarization-2 parasitic dipole, is printed on the upper surface of a fourth dielectric substrate; and a tightly coupled dipole radiating layer, including a polarization-1 radiating dipole and a polarization-2 radiating dipole, is printed on the upper surface of a fourth dielectric substrate. The wide bandwidth angle scanning impedance matching layer, composed of the parasitic dipole matching layer and the two frequency-selective surface matching layers, replaces the traditional thick dielectric wide bandwidth angle scanning impedance matching layer, resulting in a lightweight antenna element. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 An exploded view of an ultra-wideband dual-polarized tightly coupled phased array antenna element provided in this embodiment of the invention;

[0029] Figure 2 A side view of an ultra-wideband dual-polarized tightly coupled phased array antenna element provided in this embodiment of the invention;

[0030] Figure 3A schematic diagram of a metal gradient parallel double-line balun provided in this embodiment of the invention;

[0031] Figure 4 This invention provides a schematic diagram illustrating the E-plane scanning voltage standing wave ratio (VSWR) of an ultra-wideband dual-polarized tightly coupled phased array antenna element as a function of frequency.

[0032] Figure 5 This invention provides a schematic diagram illustrating the variation of the H-plane scanning voltage standing wave ratio (VSWR) of an ultra-wideband dual-polarized tightly coupled phased array antenna element with frequency, as shown in this embodiment.

[0033] Figure 6 This is a schematic diagram of the structure of an ultra-wideband dual-polarized tightly coupled phased array antenna array provided in an embodiment of the present invention. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] This application provides an ultra-wideband dual-polarized tightly coupled phased array antenna and its array, which solves the technical problem that traditional wideband angle matching layers use thicker pure dielectric materials and are therefore heavier.

[0036] The technical solution in this application is to solve the above-mentioned technical problems, and the general idea is as follows:

[0037] This invention proposes an ultra-wideband dual-polarized tightly coupled phased array antenna, which employs a metallic graded parallel double-line balun for feeding. The antenna features wide bandwidth, lightweight design, simple feeding structure, and ease of engineering application.

[0038] The ultra-wideband dual-polarized tightly coupled phased array antenna's antenna element comprises a tightly coupled dipole radiating layer, a wide bandwidth angle scanning impedance matching layer, a metallic graded parallel double-line balun, a metal ground plane, and an RF connector. On one hand, both the tightly coupled dipole radiating layer and the wide bandwidth angle scanning impedance matching layer are printed on a dielectric substrate. The wide bandwidth angle scanning impedance matching layer, consisting of a parasitic dipole matching layer and two frequency-selective surface matching layers, is located above the tightly coupled dipole radiating layer, achieving wide bandwidth angle scanning impedance matching for the antenna element. On the other hand, the metallic graded parallel double-line balun is a pure metal structure, with its upper end connected to the tightly coupled dipole and its lower end connected to the metal ground plane and the RF connector, respectively, realizing impedance transformation and feeding for the antenna element.

[0039] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0040] In a first aspect, embodiments of the present invention provide an ultra-wideband dual-polarized tightly coupled phased array antenna, wherein the antenna element includes a first dielectric substrate 11, a second dielectric substrate 12, a third dielectric substrate 13 and a fourth dielectric substrate 14 stacked from top to bottom in a non-contact manner, as well as a metal gradient parallel double-line balun, a metal ground plane 41 and an RF connector 52.

[0041] Non-contact stacking refers to the fact that the dielectric substrates do not directly contact each other, but use lightweight materials such as foam boards and dielectric pillars for structural support between layers.

[0042] The first dielectric substrate 11 has a first frequency-selective surface matching layer 21 printed on its upper surface; the second dielectric substrate 12 has a second frequency-selective surface matching layer 22 printed on its upper surface; the third dielectric substrate 13 has a parasitic dipole matching layer printed on its upper surface, including a polarization-1 parasitic dipole 23 and a polarization-2 parasitic dipole 24; and the fourth dielectric substrate 14 has a tightly coupled dipole radiation layer printed on its upper surface, including a polarization-1 radiation dipole 25 and a polarization-2 radiation dipole 26.

[0043] The metal gradient parallel double-line balun includes a polarization-one metal gradient parallel double-line balun 31 and a polarization-two metal gradient parallel double-line balun 32. Each metal gradient parallel double-line balun includes a grounding gradient metal plate 61 and a power supply gradient metal plate 62.

[0044] The upper ends of the grounding gradient metal plate 61 and the feeding gradient metal plate 62 both pass through the fourth dielectric substrate 14 and are respectively welded to the two electric arms of the corresponding radiating dipole. The lower end of the grounding gradient metal plate 61 is connected to the metal ground plate 41, and the lower end of the feeding gradient metal plate 62 is connected to the inner conductor of the radio frequency connector 51.

[0045] The radio frequency connector 51 penetrates the metal floor 41.

[0046] The embodiments of the present invention consist of a parasitic dipole matching layer and two frequency selective surface matching layers to form a wide bandwidth angle scanning impedance matching layer, which replaces the traditional thick dielectric wide bandwidth angle scanning impedance matching layer, and the antenna unit has the characteristics of lightweight design.

[0047] Furthermore, for ultra-wideband tightly coupled phased array antennas, it is necessary not only to solve the impedance matching problem within the ultra-wide operating frequency band, but also to have a certain ability to suppress resonance singularities such as common-mode resonance and ring-mode resonance. Accordingly:

[0048] In an optional embodiment, both the polarization-one metallic gradient parallel double-line balun 31 and the polarization-two metallic gradient parallel double-line balun 32 are pure metallic structures.

[0049] The grounding gradient metal plate 61 and / or the power supply gradient metal plate 62 are filled with air, so that the electrical dimensions of the current path transmitted by the polarization one metal gradient parallel double-line balun 31 and the polarization two metal gradient parallel double-line balun 32 are kept to the shortest possible under the same physical size.

[0050] The grounding gradient metal plate 61 and the power supply gradient metal plate 62 gradually narrow from the bottom to the top, and the gradient shape includes a straight gradient, a curved gradient, or a stepped gradient.

[0051] The improved feed balun described above can effectively suppress ring mode resonance in the high-frequency operating band. At the same time, the metal graded parallel bilinear balun also has the advantages of simple structure and high structural strength.

[0052] In an optional embodiment, the first frequency selective surface matching layer 21 and / or the second frequency selective surface matching layer 22 are composed of printed metal patches, the shapes of which include square, rectangular, circular, triangular, trapezoidal, annular, or cross-shaped; the number of the metal patches is greater than or equal to four. The printed metal patches are equivalent to capacitors and inductors, and when loaded above the antenna element, they can change the real and imaginary parts of the antenna element's input impedance. By adjusting the size and number of the printed metal patches, the equivalent capacitance and inductance values ​​can be adjusted to achieve impedance matching optimization.

[0053] In an optional embodiment, the first polarization parasitic dipole 23 and the second polarization parasitic dipole 24 are perpendicularly orthogonal; the first polarization radiating dipole 25 and the second polarization radiating dipole 26 are perpendicularly orthogonal. It is easy to understand that the first polarization metallic graded parallel double-line balun 31 and the second polarization metallic graded parallel double-line balun 32 should also be set to be perpendicularly orthogonal. Perpendicular orthogonal arrangement results in high isolation between the two polarized antennas, which is beneficial to the cross-polarization performance of the dual-polarized antenna.

[0054] In an optional embodiment, the first dielectric substrate 11, the second dielectric substrate 12, the third dielectric substrate 13, the fourth dielectric substrate 14, and the metal ground plate 41 are arranged parallel to each other, and the polarization one metal gradient parallel double line balun 31 and the polarization two metal gradient parallel double line balun 32 are arranged perpendicular to the metal ground plate 41.

[0055] Example 1:

[0056] A schematic diagram of the antenna element structure of an ultra-wideband dual-polarized tightly coupled phased array antenna is shown below. Figure 1 , Figure 2As shown, the antenna element consists of a tightly coupled dipole radiating layer, a wide bandwidth scanning impedance matching layer, a metallic graded parallel double-line balun, a metal ground plane, and an RF connector, with a unit spacing of 37.5 mm. The frequency selective surface matching layer dielectric substrate 11, frequency selective surface matching layer dielectric substrate 12, and parasitic dipole matching layer dielectric substrate 13 are made of Rogers 4350B material with a relative permittivity of 3.5 and a thickness of 0.508 mm; the tightly coupled dipole radiating layer dielectric substrate 14 is also made of Rogers 4350B material with a relative permittivity of 3.5 and a thickness of 0.762 mm. The frequency selective surface matching layer 21 consists of 7mm × 7mm square patches arranged in a 4×4 pattern with equal spacing, at a height of 30mm from the tightly coupled dipole radiating layer dielectric substrate 14. The frequency selective surface matching layer 22 consists of 4mm × 4mm square patches arranged in a 4×4 pattern with equal spacing, at a height of 18mm from the tightly coupled dipole radiating layer dielectric substrate 14. The first polarization parasitic dipole 23 and the second polarization parasitic dipole 24 are identical in shape and size to the first polarization radiating dipole 25 and the second polarization radiating dipole 26, respectively, and are at a height of 11mm from the tightly coupled dipole radiating layer dielectric substrate 14. The tightly coupled dipole radiating layer dielectric substrate 14 is 25mm from the metal ground plane 41.

[0057] like Figure 3 As shown, the grounding gradient metal plate 61 of polarization-one metal gradient parallel double-line balun 31 and polarization-two metal gradient parallel double-line balun 32 is a straight gradient, with a height of 26mm, a thickness of 2mm, a width of 1.5mm at the top, and a width of 15mm at the bottom; the feeding gradient metal plate 62 of polarization-one metal gradient parallel double-line balun 31 and polarization-two metal gradient parallel double-line balun 32 is a straight gradient, with a height of 24.5mm, a thickness of 2mm, a width of 1.5mm at the top, a width of 8.5mm at the bottom, and a gap of 1.5mm between the bottom and the metal ground plate. The upper ends of the grounding gradient metal plate 61 and the power feeding gradient metal plate 62 have rectangular bosses with dimensions of 2mm×1.5mm×1.762mm, which are used to pass through the tightly coupled dipole radiating layer dielectric substrate 14 and weld to the electric arms of the polarization one radiating dipole 25 and the polarization two radiating dipole 26 on the upper surface of the tightly coupled dipole radiating layer dielectric substrate 14.

[0058] The grounding gradient metal plate 61 and the feeding gradient metal plate 62 of the metal gradient parallel double-line balun are filled with air, which does not require dielectric support. This can ensure that the current path of electromagnetic wave transmission is the shortest under the same height. The surface current transmission path of the antenna unit and the feeding balun and other internal structures is the shortest, resulting in a higher resonant frequency of the ring mode resonance, which is less likely to occur in the high-frequency operating band.

[0059] The antenna element design frequency provided in this embodiment is 0.8-4GHz. Figure 4 , Figure 5 The simulation results of voltage standing wave ratio (VSWR) for 60-degree scanning in the E-plane and 60-degree scanning in the H-plane are shown respectively. The antenna element can meet the requirements of VSWR less than 3 and octave bandwidth ≥ 5 when scanning in the normal direction, 30-degree, 45-degree, and 60-degree scanning in the E-plane, and 30-degree, 45-degree, and 60-degree scanning in the H-plane. It has ultra-wideband and wide-angle scanning characteristics, and no common-mode resonance, ring-mode resonance, or other resonance singularities appear in the operating frequency band.

[0060] Secondly, embodiments of the present invention provide an ultra-wideband dual-polarized tightly coupled phased array antenna array, including a plurality of the aforementioned ultra-wideband dual-polarized tightly coupled phased array antennas, wherein each of the ultra-wideband dual-polarized tightly coupled phased array antennas is arranged in a rectangular grid.

[0061] Example 2:

[0062] like Figure 6 As shown, an ultra-wideband dual-polarized tightly coupled phased array antenna array includes several ultra-wideband dual-polarized tightly coupled phased array antennas as described in Embodiment 1. Each ultra-wideband dual-polarized tightly coupled phased array antenna element is arranged in a rectangular grid, the array size is 8×8, the element spacing is 37.5mm, and it is half the wavelength of the highest operating frequency of 4GHz.

[0063] In an optional embodiment, the ultra-wideband dual-polarized tightly coupled phased array antenna has a size of not less than 8×8, and the distance between the elements is greater than or equal to 0.4 wavelengths of the highest operating frequency.

[0064] In summary, compared with existing technologies, it has the following beneficial effects:

[0065] 1. The present invention provides a wide bandwidth angle scanning impedance matching layer composed of a parasitic dipole matching layer and two frequency selective surface matching layers, which replaces the traditional thick dielectric wide bandwidth angle scanning impedance matching layer, and the antenna unit has the characteristics of lightweight.

[0066] 2. The embodiments of the present invention propose a metal gradient parallel double-line balun, with air filling between the parallel double lines. Under the same physical size, it can ensure the shortest electrical size of the current path, which can effectively suppress the occurrence of ring mode resonance in the high-frequency operating band. At the same time, the metal gradient parallel double-line balun also has the advantages of simple structure and high structural strength.

[0067] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0068] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An ultra-wideband dual-polarized tightly coupled phased array antenna, characterized in that, Its antenna unit includes a first dielectric substrate (11), a second dielectric substrate (12), a third dielectric substrate (13) and a fourth dielectric substrate (14) stacked from top to bottom in a non-contact manner, as well as a metal gradient parallel double-line balun, a metal ground plane (41) and an RF connector (52). The first dielectric substrate (11) has a first frequency-selective surface matching layer (21) printed on its upper surface; the second dielectric substrate (12) has a second frequency-selective surface matching layer (22) printed on its upper surface; the third dielectric substrate (13) has a parasitic dipole matching layer printed on its upper surface, including a polarization-1 parasitic dipole (23) and a polarization-2 parasitic dipole (24) arranged perpendicularly and orthogonally to each other; the fourth dielectric substrate (14) has a tightly coupled dipole radiation layer printed on its upper surface, including a polarization-1 radiation dipole (25) and a polarization-2 radiation dipole (26). The metal gradient parallel double-line balun is composed of a polarization-one metal gradient parallel double-line balun (31) and a polarization-two metal gradient parallel double-line balun (32). Each metal gradient parallel double-line balun includes a grounding gradient metal plate (61) and a power supply gradient metal plate (62). The upper ends of the grounding gradient metal plate (61) and the feeding gradient metal plate (62) both pass through the fourth dielectric substrate (14) and are respectively welded to the two electric arms of the corresponding radiating dipole. The lower end of the grounding gradient metal plate (61) is connected to the metal ground plate (41), and the lower end of the feeding gradient metal plate (62) is connected to the inner conductor of the radio frequency connector (51). The radio frequency connector (51) penetrates the metal floor (41). The polarization-one metal gradient parallel double baron (31) and / or polarization-two metal gradient parallel double baron (32) are pure metal structures; The grounding gradient metal plate (61) and / or the power supply gradient metal plate (62) are filled with air.

2. The ultra-wideband dual-polarized tightly coupled phased array antenna as described in claim 1, characterized in that, The grounding gradient metal plate (61) and / or the power supply gradient metal plate (62) gradually narrow from the bottom to the top, and the gradient shape includes a straight gradient, a curved gradient or a stepped gradient.

3. The ultra-wideband dual-polarized tightly coupled phased array antenna as described in claim 1 or 2, characterized in that, The first frequency-selective surface matching layer (21) and / or the second frequency-selective surface matching layer (22) are composed of printed metal patches, the shapes of which include square, rectangular, circular, triangular, trapezoidal, annular or cross-shaped.

4. The ultra-wideband dual-polarized tightly coupled phased array antenna as described in claim 3, characterized in that, The number of metal patches is greater than or equal to four.

5. The ultra-wideband dual-polarized tightly coupled phased array antenna as described in claim 1 or 2, characterized in that, The polarization-1 radiation dipole (25) and the polarization-2 radiation dipole (26) are perpendicular and orthogonal.

6. The ultra-wideband dual-polarized tightly coupled phased array antenna as described in claim 1 or 2, characterized in that, The first dielectric substrate (11), the second dielectric substrate (12), the third dielectric substrate (13), the fourth dielectric substrate (14), and the metal ground plate (41) are arranged parallel to each other, and the polarization-one metal gradient parallel double line balun (31) and / or the polarization-two metal gradient parallel double line balun (32) are arranged perpendicular to the metal ground plate (41).

7. An ultra-wideband dual-polarized tightly coupled phased array antenna array, characterized in that, It includes several ultra-wideband dual-polarized tightly coupled phased array antennas as described in any one of claims 1 to 6, wherein each of the ultra-wideband dual-polarized tightly coupled phased array antennas is arranged in a rectangular grid.

8. The ultra-wideband dual-polarized tightly coupled phased array antenna array as described in claim 7, characterized in that, The ultra-wideband dual-polarized tightly coupled phased array antenna has a size of not less than 8×8, and the distance between the elements is greater than or equal to 0.4 wavelengths of the highest operating frequency.

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