Camera module, processing method thereof and electronic device

Abstract

The present disclosure relates to a camera module and a processing method thereof, and an electronic device, wherein the camera module comprises a support, a lens assembly arranged on the support, and a circuit board assembly comprising a circuit substrate and components arranged on the circuit substrate; wherein the support covers at least part of the structure of the circuit board assembly to connect the circuit board assembly and the support. The support of the camera module is connected to the circuit board assembly by covering at least part of the structure of the circuit board assembly, without the need for dispensing, screwing and other operations. In addition, the circuit board assembly and the support can be assembled as a whole with other structures in the camera module, improving assembly efficiency and thus production efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of electronic devices, and in particular to a camera module and its processing method, and electronic devices. Background Technology

[0002] With the continuous development of electronic technology, mobile phones, tablets, and other electronic devices are widely used in people's daily lives, providing users with a variety of functions. Considering the popularity of camera functions among users, most electronic devices are now equipped with camera modules for recording video.

[0003] However, the aforementioned camera module assembly process is cumbersome and affects production efficiency. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this disclosure provides a camera module and its processing method, as well as an electronic device.

[0005] According to a first aspect of this disclosure, a camera module is provided, comprising:

[0006] support;

[0007] The lens assembly is mounted on the bracket;

[0008] A circuit board assembly, including a circuit board substrate and components disposed on the circuit board substrate;

[0009] The bracket covers at least a portion of the structure of the circuit board assembly to connect the circuit board assembly to the bracket.

[0010] In some embodiments of this disclosure, the circuit board includes a body, and the components are disposed on the body;

[0011] The bracket is frame-shaped, and at least one side of the bracket covers the body and the components.

[0012] In some embodiments of this disclosure, the body is in the form of a frame adapted to the bracket.

[0013] In some embodiments of this disclosure, the bracket includes four side plates that are opposite each other in pairs, each side plate forming a frame of the bracket, and the body is arranged parallel to the side plate to which it is located.

[0014] In some embodiments of this disclosure, the bracket includes a first end and a second end opposite to each other, and the lens assembly is disposed at the first end of the bracket;

[0015] The camera module includes a chip located at the second end of the bracket. A first electrical connection portion is provided on the edge of the body near the second end. The first electrical connection portion extends from the body in a direction away from the first end and is electrically connected to the chip.

[0016] In some embodiments of this disclosure, the camera module includes a support member disposed at the second end of the bracket, the support member being used to support the chip;

[0017] The carrier is provided with a second electrical connection part, and the chip is electrically connected to the first electrical connection part through the second electrical connection part.

[0018] In some embodiments of this disclosure, the second electrical connection portion includes multiple conductive lines, one end of which is connected to the first electrical connection portion, and the other end of which is connected to the chip.

[0019] In some embodiments of this disclosure, a recess is provided on a first surface of the carrier near the bracket, the chip is located in the recess, and the conductive lines are disposed on the first surface and located around the recess.

[0020] In some embodiments of this disclosure, an extension is provided on one side edge of the body near the second end, a connector is provided on the extension, and a clearance groove is provided on the carrier to avoid the extension.

[0021] In some embodiments of this disclosure, the bracket is connected to the carrier by injection molding.

[0022] In some embodiments of this disclosure, the circuit board is a flexible circuit board.

[0023] In some embodiments of this disclosure, the bracket is an injection-molded part and covers at least a portion of the structure of the circuit board assembly by injection molding.

[0024] According to a second aspect of this disclosure, a method for processing a camera module is provided, the method comprising:

[0025] Provide circuit board assemblies;

[0026] The bracket is formed by injection molding, and the bracket covers at least a portion of the structure of the circuit board assembly;

[0027] The lens assembly is mounted on the bracket.

[0028] In some embodiments of this disclosure, the processing method includes:

[0029] Provide load-bearing components;

[0030] The chip is mounted on the carrier;

[0031] When the support is formed by injection molding, the support covers at least a portion of the structure of the circuit board assembly and at least a portion of the structure of the carrier.

[0032] In some embodiments of this disclosure, a protective layer is provided on the outer surface of the circuit board assembly before the support is formed by injection molding.

[0033] According to a third aspect of this disclosure, an electronic device is provided, including a camera module, wherein the camera module is as described above, and / or the camera module is manufactured using the processing method described above.

[0034] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: the bracket of the camera module is connected to the circuit board assembly by covering at least part of the structure of the circuit board assembly, without the need for gluing, screwing or other operations. In addition, the circuit board assembly and the bracket can be assembled as a whole with other structures in the camera module, which improves assembly efficiency and thus improves production efficiency.

[0035] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0037] Figure 1 This is a perspective view of a camera module according to an exemplary embodiment;

[0038] Figure 2 This is an exploded view of a camera module according to an exemplary embodiment;

[0039] Figure 3 This is a front view of a camera module shown according to an exemplary embodiment;

[0040] Figure 4 yes Figure 3 Sectional view along line AA;

[0041] Figure 5 yes Figure 3 Sectional view along the BB direction;

[0042] Figure 6 This is a schematic diagram of the circuit board assembly of a camera module according to an exemplary embodiment;

[0043] Figure 7This is a schematic diagram illustrating the mating structure of the circuit board assembly, chip, and carrier of a camera module according to an exemplary embodiment;

[0044] Figure 8 This is a schematic diagram illustrating the mating structure of a camera module chip and a carrier according to an exemplary embodiment;

[0045] Figure 9 This is a schematic diagram of the structure of a carrier component for a camera module according to an exemplary embodiment;

[0046] Figure 10 This is a flowchart illustrating a processing method for a camera module according to an exemplary embodiment;

[0047] Figure 11 This is a flowchart illustrating a processing method for a camera module according to an exemplary embodiment;

[0048] Figure 12 This is a flowchart illustrating a processing method for a camera module according to an exemplary embodiment. Detailed Implementation

[0049] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0050] In related technologies, camera modules typically include a bracket and a lens assembly and a circuit board assembly mounted on the bracket. The bracket and circuit board assembly are usually fixed together by methods such as glue application and screwing, which is a cumbersome process. Furthermore, the screwing method requires setting threaded holes, which can affect the structural reliability of the circuit board assembly and the bracket.

[0051] To address the aforementioned technical issues, this disclosure provides a camera module in which the bracket connects the circuit board assembly to the bracket by covering at least a portion of the circuit board assembly structure, eliminating the need for gluing, screwing, or other operations. Furthermore, the circuit board assembly and bracket can be assembled as a whole with other structures within the camera module, improving assembly efficiency and consequently, production efficiency.

[0052] This disclosure provides a camera module, such as... Figures 1 to 5 As shown, the camera module includes a bracket 10, a lens assembly 20, and a circuit board assembly 30. The bracket 10 is used to provide support for the lens assembly 20 and the circuit board assembly 30.

[0053] Among them, such as Figure 6As shown, the circuit board assembly 30 includes a circuit board 31 for components 32 disposed on the circuit board 31. In some embodiments, the circuit board 31 is a PCB (Printed Circuit Board), and in other embodiments, the circuit board 31 is an FPC (Flexible Printed Circuit). In this embodiment, the support 10 covering part of the structure of the circuit board assembly 30 can also provide reliable support for the FPC. Exemplarily, the components 32 on the circuit board 31 may include one or more of capacitors, resistors, inductors, diodes, or other types of circuit components; this embodiment is not limited in this respect.

[0054] The bracket 10 covers at least a portion of the structure of the circuit board assembly 30 to connect the circuit board assembly 30 to the bracket 10. This covering method achieves the connection between the circuit board assembly 30 and the bracket 10, eliminating the need for gluing, screwing, or other operations, effectively improving assembly efficiency. The bracket 10 can completely or partially cover the circuit board assembly 30, as long as it secures the circuit board assembly 30 to the bracket 10. In some embodiments, at least a portion of the structure of the circuit board assembly 30 is embedded in the bracket 10 and can be bonded to the bracket 10 via an adhesive layer. In other embodiments, the bracket 10 is an injection molded part, covering at least a portion of the structure of the circuit board assembly 30 through injection molding. For example, the circuit board assembly 30 is placed in an injection mold, and the bracket 10 is formed by injection molding on the circuit board assembly 30. Thus, the connection between the bracket 10 and the circuit board assembly 30 is achieved simultaneously during the processing of the bracket 10, making the bracket 10 and the circuit board assembly 30 a single integrated structure, thereby further improving the production and assembly efficiency of the camera module.

[0055] The camera module also includes a chip 40 electrically connected to the circuit board assembly 30. The chip 40, for example, is a photosensitive chip, positioned opposite the lens assembly 20, for sensing the imaging signal of the lens assembly 20. As an example, such as... Figure 2 As shown, the lens assembly 20 includes a voice coil motor 21 (VCM) and a lens group 22. The voice coil motor 21 drives the lens group 22 to move, thereby achieving autofocus. The image sensor uses CMOS (Complementary Metal Oxide Semiconductor), which integrates a DSP (Digital Signal Processor) chip into a single unit. Of course, the chip 40 can also be made of other materials, such as CCD (Charge Coupled Device), but this embodiment does not limit this.

[0056] A filter 50 is disposed between the photosensitive chip and the lens assembly 20. During the shooting process, the light from the subject first passes through the lens assembly 20, and then is filtered by the filter 50 before reaching the photosensitive chip. According to the photoelectric effect, photons in the light hit the photosensitive chip and generate movable charges. The movable charges collect to form an electrical signal, which is then converted from analog to digital by an A / D converter, that is, the charge signal is converted into a digital signal. The digital signal is sent to the DSP (Digital Signal Processor) for processing, and finally transmitted through the circuit board assembly 30 to the motherboard of the electronic device where the camera module is located, and further formed into a display image, thus realizing the shooting of the subject.

[0057] As an example, such as Figure 5 As shown, the circuit board 31 includes an extension 311, which extends out of the bracket 10. A connector 312 is provided on the extension 311. The connector 312 is used to electrically connect with the motherboard of the electronic device where the camera module is located, thereby transmitting the signal generated by the chip 40 to the motherboard of the electronic device.

[0058] In one embodiment, the chip 40 is disposed on the circuit board 31 and is disposed opposite to the lens assembly 20. The bracket 10 includes a first frame portion (not shown in the figure) and a second frame portion (not shown in the figure) connected together. One end of the first frame portion is connected to the lens assembly 20 and the other end is connected to the second frame portion. The cross-section of the second frame portion is C-shaped with the opening facing the circuit board 31, so that the second frame portion covers the entire outer edge of the circuit board 31.

[0059] In another embodiment, such as Figure 2 As shown, the circuit board 31 includes a body 313, components 32 are disposed on the body 313, and a bracket 10 is frame-shaped, with at least one side frame of the bracket 10 covering the body 313 and the components 32. Figure 2As shown, the bracket 10 has a first end 101 and a second end 102. For ease of description, the direction from its first end 101 to its second end 102 is defined as the first direction of the frame-shaped bracket 10. By arranging the body 313 and components 32 on the side of the bracket 10, the size of the bracket 10 in the first direction is no longer limited by the height of the components 32 (the distance between the side of the component 32 facing away from the body and the body 313), thereby further reducing the size of the bracket 10 in the first direction and improving space utilization. Typically, the lens assembly 20 is located at the first end 101 of the bracket 10. Arranging the body 313 and components 32 on the side of the bracket 10 further reduces the size of the camera module in the first direction, making the structure of the camera module more compact, and thus enabling the electronic device using this camera module to be thinner and lighter. Furthermore, the bracket 10 can completely cover the body 313 and its components 32, thereby providing excellent protection for the body 313 and its components 32, and thus improving the lifespan of the camera module.

[0060] For example, such as Figure 2 As shown, the bracket 10 includes a first frame 11, a second frame 12, a third frame 13, and a fourth frame 14 connected in sequence. The first frame 11 and the third frame 13 are arranged opposite each other, and the second frame 12 and the fourth frame 14 are arranged opposite each other. The shape of the body can be set according to the specifications of the camera module. For example, the body 313 can be strip-shaped, and the strip-shaped body 313 and its components 32 can be set in any one of the first frame 11, the second frame 12, the third frame 13, and the fourth frame 14. As another example, the body 313 can be L-shaped, and the L-shaped body 313 and its components 32 can be set in any two adjacent frames of the first frame 11, the second frame 12, the third frame 13, and the fourth frame 14. The body 313 can also be n-shaped, and the n-shaped body 313 and its components 32 can be set in any three adjacent frames of the first frame 11, the second frame 12, the third frame 13, and the fourth frame 14.

[0061] When the camera module is large, the main body 313 is in the shape of a frame that fits the bracket 10, such as... Figure 2 and Figure 6 As shown, the body 313 includes a first strip 313a, a second strip 313b, a third strip 313c, and a fourth strip 313d connected in sequence. The first strip 313a, the second strip 313b, the third strip 313c, and the fourth strip 313d are respectively disposed within the first border 11, the second border 12, the third border 13, and the fourth border 14.

[0062] In one embodiment, such as Figure 2As shown, the frame of the bracket 10 has a plate-like structure, that is, the bracket 10 includes four side plates that are opposite each other in pairs. The four side plates enclose the bracket 10, and each side plate constitutes a frame of the bracket 10. The body 313 is arranged parallel to its side plate. As an example, Figure 2 As shown, the first frame 11 is parallel to the first strip 313a, the second frame 12 is parallel to the second strip 313b, the third frame 13 is parallel to the third strip 313c, and the fourth frame 14 is parallel to the fourth strip 313d. This design facilitates the positioning and connection of the bracket 10 and the circuit board assembly 30. For example, in an embodiment where the bracket 10 is an injection molded part, the body 313 is arranged parallel to the side plate on which it is located, which facilitates the positioning of the body 313 when the bracket 10 is injection molded.

[0063] It is understood that the parallel arrangement of the body 313 and the side plate mentioned here refers to the parallel arrangement of a certain surface of the body 313 and a certain surface of the side plate. For example, if the body 313 is usually sheet-shaped, then the inner surface of the side plate can be parallel to the surface of the body 313 inside it.

[0064] Continue to refer to Figure 2 , Figure 4 and Figure 5 The lens assembly 20 is disposed at the first end 101 of the bracket 10, and the chip 40 is disposed at the second end 102 of the bracket 10, such that the lens assembly 20 and the chip 40 are disposed opposite to each other. A first electrical connection portion 314 is disposed on one edge of the body 313 near the second end 102 of the bracket 10. The first electrical connection portion 314 extends from the body 313 in a direction away from the first end 101 and is electrically connected to the chip 40, so that the signal generated by the chip 40 can be transmitted to the motherboard of the electronic device where the camera module is located via the circuit board assembly 30. In an embodiment where the body 313 is parallel to its side plate, the parallelism between the body 313 and its side plate also allows the first electrical connection portion 314 extending from the body 313 to extend vertically toward the chip 40, thereby improving the reliability of the electrical connection between the first electrical connection portion 314 and the chip 40.

[0065] It is understood that the lens assembly 20 is disposed at the first end 101 of the bracket 10, and the chip 40 is disposed at the second end 102 of the bracket 10. This is only used to illustrate the placement of the lens assembly 20 and the chip 40 relative to the bracket 10. That is, the lens assembly 20 is disposed within the area of ​​the first end 101 of the bracket 10. The lens assembly 20 can be fitted to the end face of the first end 101 of the bracket 10, or a portion of its structure can extend into the bracket 10 through the port of the first end 101 of the bracket 10, or it can be indirectly connected to the first end 101 of the bracket 10 through other structures. Similarly, the chip 40 is disposed within the area of ​​the second end 102 of the bracket 10. The chip 40 can be fitted to the end face of the second end 102 of the bracket 10, or a portion of its structure can extend into the bracket 10 through the port of the second end 102 of the bracket 10, or it can be indirectly connected to the second end 102 of the bracket 10 through other structures.

[0066] The first electrical connection portion 314 may include a plurality of first electrical connection contacts. For example, multiple first electrical connection contacts may be formed by multiple pins. Alternatively, the first electrical connection portion 314 may be a gold finger, on which a plurality of first electrical connection contacts are formed. In some embodiments, the first electrical connection portion 314 is directly electrically connected to the chip 40. For example, the chip 40 is provided with a plurality of second electrical connection contacts that correspond one-to-one with the plurality of first electrical connection contacts, and each first electrical connection contact makes contact with its corresponding second electrical connection contact to achieve electrical connection. In other embodiments, the first electrical connection portion 314 may also be indirectly electrically connected to the chip 40 through other conductive structures (described in detail later).

[0067] The first electrical connection portion 314 can be disposed on any one or more sides of the body 313. In one embodiment, such as... Figure 6 As shown, the first electrical connection portion 314 is disposed on the opposite first strip portion 313a and third strip portion 313c of the body 313. Correspondingly, the chip 40 is provided with second electrical connection contact points in the areas corresponding to the first strip portion 313a and the third strip portion 313c. In this embodiment, the extension portion 311 can be connected to the second strip portion 313b or the fourth strip portion 313d, that is, the extension portion 311 is formed by extending from the second strip portion 313b or the fourth strip portion 313d to the outside of the bracket 10. This makes the overall structural layout of the circuit board 31 more reasonable and facilitates the layout of other devices connected to the circuit board 31, further improving the structural compactness of the camera module.

[0068] In one embodiment, the chip 40 is connected to the first electrical connection portion 314 by soldering, thereby both fixing the chip 40 and electrically connecting the chip 40 to the first electrical connection portion 314. In another embodiment, as... Figure 3 and Figure 4 And refer to Figure 7As shown, the camera module includes a support member 60 disposed at the second end 102 of the bracket 10. The support member 60 is used to support the chip 40, providing support and protection for the chip 40, thereby further improving the reliability of the chip 40. It is understood that the placement of the support member 60 at the second end 102 of the bracket 10 is only used to illustrate the position of the support member 60 relative to the bracket 10; that is, the support member 60 is disposed within the area of ​​the second end 102 of the bracket 10. The support member 60 may be fitted to the end face of the second end 102 of the bracket 10, or a portion of its structure may extend into the bracket 10 through the port of the second end 102, or it may be indirectly connected to the second end 102 of the bracket 10 through other structures. For example, as... Figure 8 and Figure 9 As shown, the carrier 60 is sheet-shaped, and the chip 40 is attached to the first surface 60S of the carrier 60 near the bracket 10, thereby providing reliable support for the chip 40.

[0069] In one exemplary embodiment, the support member 60 is a heat dissipation material, thereby improving the heat dissipation effect of the chip 40 while providing support for the chip 40. For example, the support member 60 is a steel sheet.

[0070] In the embodiment where the carrier 60 is provided, the chip 40 on the carrier 60 can be directly electrically connected to the first electrical connection portion 314, or it can be as follows: Figure 9 As shown, the carrier 60 is provided with a second electrical connection portion 61. The chip 40 is electrically connected to the first electrical connection portion 314 through the second electrical connection portion 61. By providing the second electrical connection portion 61 on the carrier 60 for conversion, the wiring operation of the chip 40 is more convenient, and the reliability of the electrical connection between the chip 40 and the first electrical connection portion 314 via the second electrical connection portion 61 is ensured. In addition, in this embodiment, a third electrical connection portion (not shown in the figure) can also be provided on the carrier 60 for electrically connecting the lens assembly 20 and the circuit board assembly 30.

[0071] In one embodiment, the second electrical connection portion 61 includes multiple conductive lines 611. One end of each conductive line 611 is connected to the first electrical connection portion 314, and the other end is connected to the chip 40. The conductive lines 611 are, for example, electronic circuits etched onto the carrier 60. As an example, the first electrical connection portion 314 includes multiple first electrical contact points, and the chip 40 has multiple second electrical contact points corresponding to the multiple first electrical contact points. The second electrical connection portion 61 includes multiple conductive lines 611 corresponding to the multiple first electrical contact points. The first end of each conductive line 611 is electrically connected to the corresponding first electrical contact point, for example, by welding. The second end of each conductive line 611 is electrically connected to the corresponding second electrical contact point, for example, by gold wire bonding.

[0072] In this embodiment, as Figure 9 As shown, the length of the line segment obtained by connecting the endpoints of the first ends of each conductive line 611 in sequence is less than the length of the line segment obtained by connecting the endpoints of the second ends of each conductive line 611 in sequence. The positions of the second electrical connection contacts on the chip 40 are usually fixed, and the second ends of each conductive line 611 correspond to the positions of the corresponding second electrical connection contacts. The endpoints of the first ends of each conductive line 611 are arranged relatively closely, thereby reducing the connection area between the second electrical connection portion 61 and the first electrical connection portion 314, reducing the risk of connection misalignment, and thus ensuring the reliability of the electrical connection between the first electrical connection portion 314 and the second electrical connection portion 61. As an example, at least some of the conductive lines 611 are bent lines, so that the multiple conductive lines 611 converge from their first ends to their second ends.

[0073] For example, such as Figure 9 As shown, the carrier 60 is square in shape that matches the outer contour of the end face of the bracket 10. The second electrical connection portion 61 is provided on the first and third sides of the carrier 60, corresponding to the first electrical connection portion 314 provided on the first strip portion 313a and the third strip portion 313c.

[0074] In one embodiment, a recess 62 is provided on the first surface 60S of the carrier 60, the chip 40 is located in the recess 62, and the second electrical connection portion 61 is disposed on the first surface 60S and located around the recess 62. By providing the recess 62, on the one hand, it is convenient to position and install the chip 40, and on the other hand, it is possible to further reduce the size of the camera module along the first direction, thereby making the structure of the camera module more compact. In an embodiment where the second electrical connection portion 61 includes multiple conductive lines 611, the second end of the conductive lines 611 penetrates through the sidewall of the recess 62 to facilitate electrical connection between the second end of the conductive lines 611 and the chip 40.

[0075] In one embodiment, the carrier 60 is fixedly connected to the bracket 10. For example, the carrier 60 is bonded to the bracket 10. Or, the bracket 10 is connected to the carrier 60 by injection molding. That is, the connection between the carrier 60 and the bracket 10 is achieved at the same time as the bracket 10 is formed by injection molding. For example, the circuit board assembly 30 and the carrier 60 are both placed in the injection mold, and the bracket 10 is formed by injection molding on the circuit board assembly 30 and the carrier 60, thereby further improving the production efficiency of the camera module.

[0076] In one exemplary embodiment, the bracket 10 covers at least a portion of the structure of the support member 60. For example, the bracket 10 covers the entire outer edge of the support member 60 to achieve a fixed connection between the bracket 10 and the support member 60. In another exemplary embodiment, a filling groove is provided on the surface of the support member 60 opposite to the bracket 10. During the injection molding process, the bracket 10 fills the filling groove to achieve a fixed connection between the bracket 10 and the support member 60. The cross-section of the filling groove can be, for example, an inverted T-shape, a trapezoid, or other shapes, thereby ensuring the reliability of the connection between the bracket 10 and the support member 60.

[0077] In another embodiment, such as Figure 5 As shown, the carrier 60 is fitted to the bracket 10, that is, the first surface 60S of the carrier 60 is fitted to the end face of the second end 102 of the bracket 10. This allows the carrier 60 and the bracket 10 to enclose a relatively enclosed space, ensuring the reliability of the internal components and extending their service life. In this embodiment, the carrier 60 can be fixedly connected to the bracket 10 by bonding or other methods, or the second electrical connection 61 can be fixedly connected to the first electrical connection 314 on the bracket 10 by welding or other methods. Since the first electrical connection 314 is relatively fixed to the bracket 10, and the second electrical connection 61 is fixed relative to the carrier 60, the relative position of the carrier 60 and the bracket 10 is fixed.

[0078] Continue to refer to Figure 7 and Figure 9 The protrusion 311 is located on one edge of the body 313 near the second end 102. The support member 60 has a clearance groove 63 to allow the protrusion 311 to pass. This design allows the support member 60 to be positioned closer to the bracket 10, for example, in close contact with the bracket 10, thereby reducing the size of the camera module along the first direction. As an example, the protrusion 311 is located on the second strip 313b of the body 313, and the clearance groove 63 is located on the second side of the support member 60 adjacent to its first and third sides.

[0079] In one embodiment, such as Figure 2 , Figure 4 and Figure 5 As shown, a protruding structure 15 is provided on the inner wall of the bracket 10 to support the filter 50, so that the lens assembly 20 can be fitted to the end face of the first end 101 of the bracket 10, thereby further reducing the size of the camera module along the first direction. As an example, the protruding structure 15 is a ring structure extending around the inner wall of the bracket 10.

[0080] Another embodiment of this disclosure also provides a method for processing a camera module, for example, for processing the camera modules described in the above embodiments, such as... Figure 10 As shown, the processing method includes:

[0081] S100 provides circuit board assemblies.

[0082] A circuit board assembly includes a circuit board substrate and components disposed on the circuit board substrate. The circuit board substrate may be, for example, a PCB or FPC. Components may include one or more of capacitors, resistors, inductors, diodes, or other types of circuit parts. For example, the components are disposed on the circuit board using SMT (Surface Mount Technology).

[0083] S200. A bracket is formed by injection molding, such that the bracket covers at least a portion of the structure of the circuit board assembly.

[0084] In this step, at least a portion of the circuit board assembly is encapsulated by injection molding to achieve a fixed connection between the bracket and the circuit board assembly. The bracket can be a partial structure that encapsulates the circuit board assembly or it can completely encapsulate the circuit board assembly. For details, please refer to the previous descriptions of the various embodiments of the camera module, which will not be repeated here.

[0085] S300, mount the lens assembly onto the bracket.

[0086] As an example, a dedicated focusing machine is used to fix the lens assembly to the bracket, for example by gluing it to the bracket, thereby ensuring the accuracy of the lens assembly installation.

[0087] In the processing method provided in this embodiment, the bracket and the circuit board assembly are connected at the same time as the bracket is processed, so that the bracket and the circuit board assembly form an integral structure, thereby improving the production and assembly efficiency of the camera module.

[0088] In an exemplary embodiment, such as Figure 11 As shown, step S200 includes:

[0089] S210. Place the circuit board assembly in a preheating device for preheating.

[0090] In this step, preheating increases the surface temperature of the circuit board assembly, preventing thermal shock to the components during subsequent injection molding and thus avoiding damage to the components. The preset temperature is, for example, 50°C to 60°C.

[0091] S220. Place the preheated circuit board assembly into the injection mold, and inject molding into the injection mold to form a support.

[0092] S230. Slowly cool down the molded bracket.

[0093] This step ensures the integrity of the internal structure of the scaffold.

[0094] In one exemplary embodiment, a protective layer is formed on the outer surface of the circuit board assembly before the support is formed by injection molding to protect the circuit board assembly and prevent damage to the circuit board assembly during the subsequent injection molding process. As an example, the protective layer is a layer of insulating adhesive coated on the surface of the circuit board assembly.

[0095] In one embodiment, such as Figure 12 As shown, the processing method also includes:

[0096] S400 provides load-bearing components.

[0097] The carrier can be, for example, a steel sheet, and has a second electrical connection portion for electrically connecting the first electrical connection portion on the circuit board assembly to the chip. For example, it can electrically connect multiple first electrical connection contacts on the circuit board assembly to multiple second electrical connection contacts on the chip. The second electrical connection portion can be formed, for example, by etching electronic circuitry on the carrier.

[0098] S500, the chip is mounted on the carrier.

[0099] In this step, the chip can be glued to the carrier, and the second electrical contact points on the chip are electrically connected to the second electrical connection parts on the carrier, for example, by gold wire bonding.

[0100] S600: Connect the carrier with the chip mounted to the circuit board assembly on the bracket.

[0101] As an example, the first electrical connection portion of the circuit board assembly is connected to the second electrical connection portion on the carrier by soldering, while the carrier and the bracket are bonded together using adhesive.

[0102] The steps S400, S500 and S600 described above are usually completed before step S300. That is, after the assembly of the bracket, circuit board assembly, carrier and chip is completed, the lens assembly is then installed on the bracket to avoid the assembly process such as welding affecting the installation accuracy of the lens assembly.

[0103] In another embodiment, in step S200, when the bracket is formed by injection molding, the bracket covers at least a portion of the structure of the circuit board assembly and at least a portion of the structure of the carrier. Thus, the connection between the carrier and the bracket is achieved simultaneously during the injection molding process, eliminating the need for steps such as bonding the carrier and the bracket, and welding the second electrical connection on the carrier to the first electrical connection on the circuit board assembly, further improving the production efficiency of the camera module.

[0104] This disclosure also provides an electronic device including a camera module. The camera module can adopt the structure of the above embodiments and can be processed by the above processing methods. Since the camera module has a compact structure and high production efficiency, the electronic device with the camera module also has the same advantages.

[0105] For example, the electronic device may be a mobile phone, tablet computer, e-reader, laptop computer, or other electronic device, and this disclosure does not limit it.

[0106] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0107] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A camera module, characterized in that, include: support; The lens assembly is mounted on the bracket; A circuit board assembly, including a circuit board substrate and components disposed on the circuit board substrate; The bracket covers at least a portion of the structure of the circuit board assembly to connect the circuit board assembly to the bracket; The bracket includes a side plate that forms the frame of the bracket. The circuit board includes a body that is sheet-shaped and is arranged parallel to the side plate. The components are disposed on the inner side of the body. The body is disposed in at least one of the frames, and the frames completely cover the body and the components.

2. The camera module according to claim 1, characterized in that, The support is frame-shaped.

3. The camera module according to claim 2, characterized in that, The main body is in the shape of a frame that is adapted to the support.

4. The camera module according to claim 2, characterized in that, The support includes four side plates that are opposite each other in pairs.

5. The camera module according to claim 2, characterized in that, The bracket includes a first end and a second end opposite to each other, and the lens assembly is disposed at the first end of the bracket; The camera module includes a chip located at the second end of the bracket. A first electrical connection portion is provided on the edge of the body near the second end. The first electrical connection portion extends from the body in a direction away from the first end and is electrically connected to the chip.

6. The camera module according to claim 5, characterized in that, The camera module includes a support member disposed at the second end of the bracket, the support member being used to support the chip; The carrier is provided with a second electrical connection part, and the chip is electrically connected to the first electrical connection part through the second electrical connection part.

7. The camera module according to claim 6, characterized in that, The second electrical connection portion includes multiple conductive lines, one end of which is connected to the first electrical connection portion, and the other end of which is connected to the chip.

8. The camera module according to claim 6, characterized in that, A recessed portion is provided on the first surface of the carrier near the bracket, the chip is located in the recessed portion, and the second electrical connection portion is provided on the first surface and located around the recessed portion.

9. The camera module according to claim 6, characterized in that, An extension is provided on one side edge of the main body near the second end, a connector is provided on the extension, and a clearance groove is provided on the carrier to avoid the extension.

10. The camera module according to claim 6, characterized in that, The bracket is connected to the load-bearing component by injection molding.

11. The camera module according to any one of claims 1 to 10, characterized in that, The circuit board is a flexible circuit board.

12. The camera module according to any one of claims 1 to 10, characterized in that, The bracket is an injection-molded part, and at least a portion of the structure of the circuit board assembly is encapsulated by injection molding.

13. A method for processing a camera module, characterized in that, The processing method includes: A circuit board assembly is provided, the circuit board assembly including a circuit board substrate and components disposed on the circuit board substrate; A bracket is formed by injection molding, and the bracket covers at least a portion of the structure of the circuit board assembly; wherein the bracket includes a side plate, the side plate forming the frame of the bracket, the circuit board includes a body, the body is sheet-shaped, the body is arranged parallel to the side plate, the components are disposed on the inner side of the body, the body is disposed in at least one frame, and the frame completely covers the body and the components. The lens assembly is mounted on the bracket.

14. The processing method of the camera module according to claim 13, characterized in that, The processing method includes: A support member is provided, the bracket includes a first end and a second end opposite to each other, the lens assembly is disposed at the first end of the bracket, and the support member is disposed at the second end of the bracket; The chip is mounted on the carrier; When the support is formed by injection molding, the support covers at least a portion of the structure of the circuit board assembly and at least a portion of the structure of the carrier.

15. The processing method of the camera module according to claim 13, characterized in that, A protective layer is applied to the outer surface of the circuit board assembly before the support is formed by injection molding.

16. An electronic device, characterized in that, The device includes a camera module, wherein the camera module is the camera module as described in any one of claims 1 to 12, and / or the camera module is processed using the processing method as described in any one of claims 13 to 15.

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