Earphone and electronic device

CN116249047BActive Publication Date: 2026-09-25VIVO MOBILE COMM CO LTD
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Patent Information

Application Number
CN202310170819.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-02-27
Publication Date
2026-09-25
Estimated Expiration
2043-02-27

AI Technical Summary

Technical Problem

[0003]本申请旨在提供一种耳机和一种电子设备,至少解决了相关技术中,耳机的降噪效果差的技术问题

Benefits of technology

[0010]本申请的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses an earphone and an electronic device. The earphone comprises a shell, an electro-acoustic conversion assembly arranged in the shell, a front cavity and a rear cavity enclosed between the electro-acoustic conversion assembly and an inner surface of the shell, a loudspeaker included in the electro-acoustic conversion assembly, the loudspeaker comprising a magnetically conductive support provided with a channel and a moving coil part arranged on the magnetically conductive support and located on a circumferential side of the channel, a first microphone arranged in the channel, the first microphone separating the channel into a first conducting section and a second conducting section, the first conducting section and the first microphone being in communication with the front cavity, the second conducting section being in communication with the rear cavity, and a second microphone arranged in the front cavity.
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Description

Technical Field

[0001] This application belongs to the field of headphone technology, specifically relating to a headphone and an electronic device. Background Technology

[0002] In related technologies, due to the limited space of headphones, a microphone is placed inside the front cavity (the cavity that connects to the ear canal) to pick up noise signals. Noise reduction is achieved by playing an inverse sound signal that cancels out the noise. However, the limited capacity of a single microphone results in poor noise reduction performance in the headphones. Summary of the Invention

[0003] This application aims to provide an earphone and an electronic device that at least solves the technical problem of poor noise reduction performance of earphones in the related art.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application provide an earphone, comprising: a housing; an electroacoustic conversion assembly disposed within the housing, wherein a front cavity and a rear cavity are formed between the electroacoustic conversion assembly and the inner surface of the housing, the electroacoustic conversion assembly comprising: a speaker, the speaker comprising: a magnetic support having a channel; and a dynamic coil disposed on the magnetic support and located on the periphery of the channel; a first microphone disposed in the channel, the first microphone dividing the channel into a first conductive segment and a second conductive segment, the first conductive segment and the first microphone both communicating with the front cavity, the second conductive segment communicating with the rear cavity; and a second microphone disposed in the front cavity.

[0006] Secondly, embodiments of this application provide an electronic device, including: headphones as described in any of the embodiments of the first aspect.

[0007] In embodiments of this application, the earphone includes a housing and an electroacoustic conversion assembly. The electroacoustic conversion assembly includes a speaker, a first microphone, and a second microphone. The speaker includes a magnetic support and a dynamic coil.

[0008] The magnetic support has a channel, and a first microphone is located in this channel. The first microphone divides the channel into a first conductive section and a second conductive section. The first conductive section is connected to the front cavity, and the first microphone is also connected to the front cavity. A second microphone is located in the front cavity. In other words, the first and second microphones work together to pick up noise signals, allowing for the capture of more noise signals and thus achieving a deeper noise reduction effect in the headphones. Specifically, based on the noise reduction effect achieved by the second microphone, the first microphone in the channel further reduces the noise level, resulting in an even deeper noise reduction effect. Furthermore, the first microphone in the channel can further pick up music signals and feed them back to the headphone controller for analysis of the music signal playback effect, thereby improving the music signal playback quality.

[0009] Furthermore, the magnetic support has a channel, on which the first microphone is located, and the first microphone divides the channel into a first conductive section and a second conductive section. In other words, the channel serves to install and fix the first microphone. Through a rationally designed structure of the magnetic support, the first microphone is installed and fixed using the internal space of the magnetic support. This design, while increasing the number of microphones in the headphones, reuses the magnetic support of the speaker; that is, the dynamic driver and the first microphone are placed on the same magnetic support, achieving integrated installation of the first microphone within the speaker. Thus, while improving the noise reduction and music playback effects of the headphones, it does not increase the occupancy of the headphones' internal space, providing more possibilities for integrating other functional sensors into the headphones.

[0010] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0011] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0012] Figure 1 This is a cross-sectional view of the speaker and the first microphone of the first embodiment of this application;

[0013] Figure 2 This is a schematic diagram of the structure of the earphone according to the first embodiment of this application;

[0014] Figure 3 This is a cross-sectional view of the speaker, first microphone, and third microphone according to the second embodiment of this application;

[0015] Figure 4 This is a schematic diagram of the structure of the earphone according to the second embodiment of this application.

[0016] Figure label:

[0017] Figures 1 to 4 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0018] 100 Headphones, 110 Housing, 112 Sound Outlet, 114 Pressure Relief Outlet, 120 Electroacoustic Conversion Component, 122 Magnetic Conductor Support, 124 Channel, 126 Dynamic Coil, 128 First Conducting Section, 130 Second Conducting Section, 132 First Opening, 134 Chamber, 136 Connecting Tube, 138 Connecting Plate, 140 Dynamic Coil Housing, 142 Magnet, 144 Magnetic Conductor Plate, 146 Diaphragm, 148 Voice Coil, 152 First Annular Groove, 154 Second Annular Groove, 156 First Metal Ring, 158 Second Metal Ring, 160 Tuning Mesh, 170 Front Chamber, 180 Rear Chamber, 190 First Microphone, 200 Second Microphone, 210 Third Microphone, 220 Ear Cap, 230 Speaker. Detailed Implementation

[0019] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or a link; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] The following is combined Figures 1 to 4 This application describes an earphone 100 and an electronic device according to embodiments thereof.

[0023] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, an earphone 100 according to some embodiments of this application includes: a housing 110; an electroacoustic conversion assembly 120 disposed within the housing 110, the electroacoustic conversion assembly 120 and the inner surface of the housing 110 enclosing a front cavity 170 and a rear cavity 180, the electroacoustic conversion assembly 120 including: a speaker 230, the speaker 230 including: a magnetic guide bracket 122, the magnetic guide bracket 122 having a channel 124; and a dynamic coil portion 126 disposed on the magnetic guide bracket 122 and located on the periphery of the channel 124; a first microphone 190 disposed on the channel 124, the first microphone 190 dividing the channel 124 into a first conducting segment 128 and a second conducting segment 130, the first conducting segment 128 and the first microphone 190 both communicating with the front cavity 170, the second conducting segment 130 communicating with the rear cavity 180; and a second microphone 200 disposed on the front cavity 170.

[0024] In this embodiment, the earphone 100 includes a housing 110 and an electroacoustic conversion assembly 120. The electroacoustic conversion assembly 120 includes a speaker 230, a first microphone 190 and a second microphone 200. The speaker 230 includes a magnetic support 122 and a dynamic coil portion 126.

[0025] The magnetic support 122 has a channel 124, and a first microphone 190 is located in the channel 124. The first microphone 190 divides the channel 124 into a first conducting section 128 and a second conducting section 130. The first conducting section 128 is connected to the front cavity 170, and the first microphone 190 is also connected to the front cavity 170. A second microphone 200 is located in the front cavity 170. In other words, the first microphone 190 and the second microphone 200 work together to pick up noise signals, thus capturing more noise and achieving a deeper noise reduction effect for the headphones 100. Specifically, based on the noise reduction effect achieved by the second microphone 200, the first microphone 190 in the channel 124 further reduces the noise level, achieving an even deeper noise reduction effect. Furthermore, the first microphone 190 in the channel 124 can further capture music signals and feed them back to the controller of the headphones 100 for analysis of the music signal playback effect, thereby improving the music signal playback quality.

[0026] Furthermore, the magnetic support 122 is provided with a channel 124, on which the first microphone 190 is disposed, and the first microphone 190 divides the channel 124 into a first conducting section 128 and a second conducting section 130. That is, the channel 124 serves to install and fix the first microphone 190. Through a reasonable structural design of the magnetic support 122, the first microphone 190 is installed and fixed using the internal space of the magnetic support 122. This design, while increasing the number of microphones in the headphones 100, reuses the magnetic support 122 of the speaker 230; that is, the dynamic coil 126 and the first microphone 190 are simultaneously placed on the same magnetic support 122, achieving integrated installation of the first microphone 190 within the speaker 230. In this way, while improving the noise reduction and music playback effects of the headphones 100, the internal space occupancy of the headphones 100 is not increased, providing more possibilities for further integration of other functional sensors into the headphones 100.

[0027] Specifically, the front cavity 170 of the earphone 100 is connected to the user's ear canal.

[0028] Specifically, the housing 110 is provided with a pressure relief port 114, which is connected to the rear cavity 180.

[0029] Specifically, the earphone 100 also includes an ear cap 220, which is disposed on the housing 110 and is correspondingly disposed with the front cavity 170.

[0030] Specifically, the housing 110 is provided with a sound outlet 112, which is connected to the front cavity 170, and the second microphone 200 is located at the sound outlet 112.

[0031] In some embodiments, such as Figure 3 and Figure 4 As shown, the electroacoustic conversion assembly 120 also includes a third microphone 210, which is located in the second conduction section 130.

[0032] In this embodiment, by reasonably configuring the structure of the earphone 100, the electroacoustic conversion component 120 further includes a third microphone 210. That is, the earphone 100 includes a first microphone 190, a second microphone 200, and a third microphone 210.

[0033] The first microphone 190 and the second microphone 200 simultaneously pick up the sound signal from the front cavity 170. The second microphone 200 picks up the noise signal from the front cavity 170 of the earphone 100. When the noise reduction effect achieved by the earphone 100 can no longer be further optimized, the first microphone 190 is used to further pick up the noise signal from the front cavity 170 of the earphone 100, thereby providing the controller of the earphone 100 with further optimization of the noise reduction depth.

[0034] The third microphone 210 is used to pick up external sound signals entering through the leakage hole of the rear cavity 180 of the earphone 100, thereby determining the external sound environment in which the wearer of the earphone 100 is located, and thus alerting the wearer to potential safety risks. This helps improve the product's performance and market competitiveness.

[0035] Furthermore, the third microphone 210 is located in the second conductive section 130, meaning that both the first microphone 190 and the third microphone 210 are located in channel 124. In other words, channel 124 serves to mount and fix the first microphone 190 and the third microphone 210. Through a well-designed structure of the magnetic support 122, the first microphone 190 and the third microphone 210 are mounted and fixed using the internal space of the magnetic support 122. This arrangement, while increasing the number of microphones in the headphones 100, reuses the magnetic support 122 of the speaker 230. That is, the dynamic coil 126, the first microphone 190, and the third microphone 210 are simultaneously placed on the same magnetic support 122, achieving an integrated setup of the first microphone 190 and the third microphone 210 within the speaker 230. Thus, while improving the noise reduction and music playback effects of the headphones 100, it does not increase the occupancy rate of the internal space of the headphones 100, providing more possibilities for further integration of other functional sensors into the headphones 100.

[0036] In some embodiments, such as Figure 3 and Figure 4 As shown, the third microphone 210 is stacked on the side of the first microphone 190 away from the front cavity 170.

[0037] In this embodiment, the mating structure of the first microphone 190 and the third microphone 210 is further defined, such that the three microphones are stacked on the side of the first microphone 190 facing away from the front cavity 170. That is, the first microphone 190 and the third microphone 210 are stacked. This arrangement ensures the effectiveness and feasibility of assembling the first microphone 190 and the third microphone 210 while maximizing the volume of the front cavity 170 and the rear cavity 180.

[0038] In some embodiments, such as Figure 3 and Figure 4 As shown, there are multiple first microphones 190 and multiple third microphones 210, and the multiple first microphones 190 and multiple third microphones 210 are stacked along the length direction of channel 124.

[0039] In this embodiment, the number of first microphones 190 and third microphones 210 can be set according to specific actual usage requirements. For example, there can be multiple first microphones 190 and multiple third microphones 210. Furthermore, the cooperative structure of the multiple first microphones 190 and multiple third microphones 210 is defined as follows: the multiple first microphones 190 are stacked along the length direction of the channel 124, and the multiple third microphones 210 are stacked along the length direction of the channel 124. This arrangement makes reasonable use of the internal space of the channel 124 and does not increase the occupancy rate of the internal space of the earphone 100.

[0040] Depending on the specific functions and usage scenarios of the headset 100, the operation of multiple first microphones 190 can be controlled. For example, some of the first microphones 190 can be controlled to work, or multiple first microphones 190 can be controlled to work simultaneously.

[0041] Depending on the specific functions and usage scenarios of the headset 100, the operation of multiple third microphones 210 can be controlled. For example, some of the third microphones 210 can be controlled to work, or multiple third microphones 210 can be controlled to work simultaneously.

[0042] In some other embodiments, the number of the first microphone 190 and the third microphone 210 is one.

[0043] In some other embodiments, the number of first microphones 190 is one, and the number of third microphones 210 is multiple.

[0044] In some other embodiments, the number of third microphones 210 is one, and the number of first microphones 190 is multiple.

[0045] Specifically, along the length of channel 124, a plurality of first microphones 190 and a plurality of third microphones 210 are stacked.

[0046] Specifically, along the length of channel 124, multiple first microphones 190 are arranged at intervals, and multiple third microphones 210 are arranged at intervals.

[0047] In some embodiments, the housing 110 is provided with a sound outlet 112, which communicates with the front cavity 170. The second microphone 200 is located at the sound outlet 112, and the first microphone 190 is disposed opposite to the second microphone 200.

[0048] In this embodiment, such as Figure 2 and Figure 4As shown, the housing 110 has a sound outlet 112 and defines the cooperative structure of the sound outlet 112, the first microphone 190, and the second microphone 200, such that the second microphone 200 is located at the sound outlet 112, and the first microphone 190 and the second microphone 200 are arranged opposite each other. This arrangement makes it easier for the first microphone 190 and the second microphone 200 to pick up noise signals, which helps to ensure the noise reduction effect.

[0049] In some embodiments, such as Figure 1 and Figure 3 As shown, the cross-sectional area of ​​the first conducting section 128 is smaller than the cross-sectional area of ​​the second conducting section 130.

[0050] In this embodiment, the mating structure of the first conductive section 128 and the second conductive section 130 is further defined such that the cross-sectional area of ​​the current flow of the first conductive section 128 is smaller than that of the second conductive section 130. It is understood that a stepped surface is formed at the connection between the first conductive section 128 and the second conductive section 130, and this stepped surface is used for mounting and fixing the first microphone 190. This arrangement helps to increase the mating area and mating angle between the first microphone 190 and the magnetic support 122, thereby improving the assembly stability and reliability of the first microphone 190 and the magnetic support 122.

[0051] Specifically, the cross-sectional area of ​​the first conducting section 128 refers to the area enclosed by the outline of the first conducting section 128 when the first conducting section 128 is cut along a cross-section perpendicular to its length.

[0052] Specifically, the cross-sectional area of ​​the second conducting section 130 refers to the area enclosed by the outline of the second conducting section 130 when the second conducting section 130 is cut along a cross-section perpendicular to its length.

[0053] In some embodiments, such as Figure 1 and Figure 3 As shown, the magnetic support 122 is also provided with a first opening 132, which is located on one side of the channel 124; the moving coil 126 and the magnetic support 122 enclose a cavity 134, and the cavity 134 and the rear cavity 180 are connected through the first opening 132.

[0054] In this embodiment, the structure of the magnetic guide bracket 122 is further defined, such that the magnetic guide bracket 122 also has a first opening 132, which is located on one side of the channel 124. A cavity 134 is formed between the moving coil portion 126 and the magnetic guide bracket 122. The cavity 134 communicates with the first opening 132, and the rear cavity 180 also communicates with the first opening 132. That is, the cavity 134 and the rear cavity 180 are connected through the first opening 132. When the moving coil portion 126 is compressed by an external force, the gas inside the cavity 134 can flow through the first opening 132 to the rear cavity 180 of the earphone 100. The first opening 132 has a pressure relief function, which effectively solves the problem of excessive air pressure inside the cavity 134 causing poor bass performance in the earphone 100 due to the inability of gas to flow out in time, thus improving the bass reproduction effect of the earphone 100.

[0055] In some embodiments, such as Figure 1 and Figure 3 As shown, the magnetic guide bracket 122 includes: a connecting cylinder 136 forming a channel 124; and a connecting plate 138 connected to the periphery of the connecting cylinder 136, the connecting plate 138 having a first opening 132, and the connecting plate 138 being used to support the moving coil portion 126.

[0056] In this embodiment, the structure of the magnetic guide bracket 122 is further defined. The magnetic guide bracket 122 includes a connecting cylinder 136 and a connecting plate 138. The connecting cylinder 136 forms a channel 124, and the connecting plate 138 is located on the periphery of the connecting cylinder 136 and is connected to the connecting cylinder 136. It can be understood that the connecting plate 138 extends from the connecting cylinder 136 in a direction away from the connecting cylinder 136. The connecting plate 138 is an annular plate, and it is connected to the outer surface of the connecting cylinder 136. The connecting plate 138 serves to connect the moving coil portion 126. The connecting cylinder 136 serves to mount and fix the first microphone 190 and the third microphone 210. Furthermore, the cooperative structure of the connecting cylinder 136 and the connecting plate 138 ensures the balance of vibration.

[0057] Specifically, both the channel 124 and the moving coil 126 are axisymmetric structures, and the axis of the channel 124 and the axis of the moving coil 126 are collinear.

[0058] By rationally setting the matching structure of channel 124 and moving coil 126, both channel 124 and moving coil 126 are axially symmetrical structures, and the axis of channel 124 and the axis of moving coil 126 are collinear. This is beneficial to improving space utilization. While ensuring the performance of the headphone 100, it is also beneficial to reduce the overall size of the speaker 230, thereby reducing the occupancy rate of the internal space of the headphone 100.

[0059] In some embodiments, such as Figure 1 and Figure 3 As shown, the moving coil portion 126 includes: a moving coil housing 140 connected to the periphery of the connecting plate 138; a magnet 142 disposed on the connecting plate 138, with a gap between the magnet 142 and the connecting cylinder 136; a magnetic guide plate 144 disposed on the side of the magnet 142 away from the connecting plate 138; a diaphragm 146 connected between the connecting cylinder 136 and the moving coil housing 140, and located on the side of the magnetic guide plate 144 away from the magnet 142; and a voice coil 148 extending from the diaphragm 146 to the gap between the magnet 142 and the connecting cylinder 136; wherein the moving coil housing 140, the magnetic guide support 122, the magnet 142, the magnetic guide plate 144, and the diaphragm 146 enclose a cavity 134.

[0060] In this embodiment, the moving coil portion 126 includes a moving coil housing 140, a magnet 142, a magnetic guide plate 144, a diaphragm 146, and a voice coil 148.

[0061] The diaphragm 146, the magnetic plate 144, the magnet 142 and the connecting plate 138 are arranged sequentially along the length of the connecting cylinder 136.

[0062] The voice coil 148 is located around the connecting cylinder 136, extending from the diaphragm 146 to the gap between the magnet 142 and the connecting cylinder 136. In other words, the magnet 142 is located outside the voice coil 148, surrounding it. Alternatively, the speaker 230 can be described as having an external magnet structure. This arrangement helps save space for accommodating the first microphone 190, allowing more space in the middle of the magnetic support 122 to accommodate a larger first microphone 190.

[0063] Specifically, magnet 142 is a ferrite magnet 142 or a neodymium iron boron magnet 142, etc., which will not be listed here.

[0064] In some embodiments, the moving ring housing 140 is provided with a second opening, through which the front cavity 170 and the rear cavity 180 are connected.

[0065] In this embodiment, by rationally configuring the structure of the dynamic coil housing 140, a second opening is provided, allowing the front cavity 170 and the rear cavity 180 to communicate through the second opening. The second opening serves a pressure relief function, preventing excessive ear pressure and reducing discomfort caused by excessive ear pressure when the user wears the headphones 100. This is beneficial for improving the product's performance and market competitiveness.

[0066] In some embodiments, such as Figure 1 and Figure 3As shown, the end of the connecting cylinder 136 is provided with a first annular groove 152, the moving coil housing 140 is provided with a second annular groove 154, and the moving coil part 126 further includes: a first metal ring 156, which is provided in the first annular groove 152 and the diaphragm 146 is connected to the first metal ring 156; a second metal ring 158, which is provided in the second annular groove 154 and the diaphragm 146 is connected to the second annular groove 154; and a tuning mesh 160, which is provided at both the first opening 132 and the second opening.

[0067] In this embodiment, the end of the connecting cylinder 136 is provided with a first annular groove 152, the moving ring housing 140 is provided with a second annular groove 154, and the moving ring portion 126 further includes a first metal ring 156 and a second metal ring 158. The first metal ring 156 is disposed in the first annular groove 152, and the second metal ring 158 is disposed in the second annular groove 154. The first annular groove 152 serves to install and fix the first metal ring 156, and the second annular groove 154 serves to install and fix the second metal ring 158.

[0068] This arrangement increases the fit and angle between the connecting cylinder 136 and the first metal ring 156, allowing the first metal ring 156 to be securely mounted on the connecting cylinder 136. Furthermore, this arrangement increases the fit and angle between the moving ring housing 140 and the second metal ring 158, allowing the second metal ring 158 to be securely mounted on the moving ring housing 140.

[0069] Specifically, the diaphragm 146 is connected to the first metal ring 156, and the diaphragm 146 is connected to the second metal ring 158.

[0070] The tuning mesh 160 is located at the first opening 132 and the tuning mesh 160 is located at the second opening.

[0071] The combination of the second opening and the 160mm tuning mesh structure can solve the problem of excessive ear pressure.

[0072] The combination of the first opening 132 and the tuning mesh 160 can solve the problem of poor bass.

[0073] An electronic device according to some embodiments of this application includes: the earphone 100 of any of the above embodiments.

[0074] The electronic device according to the embodiments of this application includes the earphone 100 of the above embodiments, and therefore has all the beneficial effects of the earphone 100, which will not be described in detail here.

[0075] Specifically, the electronic device includes headphones 100. The electronic device can be a mobile terminal such as a mobile phone, wearable device, tablet computer, laptop computer, mobile computer, augmented reality device (also known as AR device), virtual reality device (also known as VR device), and handheld game console, etc.

[0076] Specifically, the headphones 100 include an electroacoustic conversion component 120, which includes a speaker 230, a first microphone 190, and a second microphone 200. The first microphone 190 is disposed on the magnetic support 122 of the speaker 230, that is, the speaker 230 and the first microphone 190 are assembled as a whole. This configuration achieves the purpose of significantly reducing noise in the wearer's ear, enabling the pickup of more noise signals, while reducing the space occupied by electroacoustic components within the headphones 100, and optimizing the audio playback effect of the headphones 100.

[0077] Specifically, the speaker 230 is an external magnet dynamic speaker 230 structure, with the first microphone 190 embedded inside. Building upon the noise reduction depth achieved by the second microphone 200, the first microphone 190 further reduces the noise level, thus achieving a deeper noise reduction effect. Simultaneously, the first microphone 190 can further pick up music signals and then feed them back to the controller of the headphone 100 for analysis of the music signal playback effect, thereby improving the music signal playback effect of the headphone 100. Because the first microphone 190 is embedded inside the external magnet dynamic speaker 230, forming an integrated speaker 230 microphone module, the occupancy rate of the internal space of the headphone 100 is relatively low.

[0078] Specifically, such as Figure 1 and Figure 2 As shown, the earphone 100 includes a speaker 230, a first microphone 190, and a second microphone 200. By making reasonable use of the internal space of the speaker 230, the speaker 230 and the first microphone 190 are integrated together to achieve modularity. The first microphone 190 and the second microphone 200 both refer to device units that pick up sound signals, including but not limited to microelectromechanical system microphones, and can also be condenser microphones, etc., which will not be listed here.

[0079] Specifically, such as Figure 1 As shown, the loudspeaker 230 includes a magnetic support 122 and a moving coil portion 126. The moving coil portion 126 includes a diaphragm 146, a voice coil 148, a magnetic plate 144, a magnet 142, a moving coil housing 140, and a tuning mesh 160. The moving coil portion 126 adopts an external magnet design, that is, the magnet 142 surrounds the voice coil 148. The magnetic support 122 adopts a concave design, and the first microphone 190 is assembled in the concave cavity and fixed by glue.

[0080] Specifically, such as Figure 2As shown, the speaker 230 and the first microphone 190 are built into the housing 110 of the earphone 100. The electroacoustic conversion assembly 120 divides the internal space of the earphone 100 into a front cavity 170 and a rear cavity 180. The second microphone 200 is placed in the front cavity 170. The first microphone 190 and the second microphone 200 simultaneously pick up the sound signal from the front cavity 170 of the earphone 100. When the noise signal picked up by the second microphone 200 from the front cavity 170 of the earphone 100 can no longer be optimized, the first microphone 190 is used to further pick up the noise signal from the front cavity 170 of the earphone 100, thereby supplying it to the controller of the earphone 100 to further optimize the noise reduction depth.

[0081] like Figure 3 and Figure 4 As shown, the headphone 100 includes a speaker 230, a first microphone 190, a second microphone 200, and a third microphone 210. The speaker 230 includes a magnetic support 122 and a dynamic coil 126. The dynamic coil 126 includes a diaphragm 146, a voice coil 148, a magnetic plate 144, a magnet 142, a dynamic coil housing 140, and a tuning mesh 160. The dynamic coil 126 employs an external magnet design, meaning the magnet 142 surrounds the voice coil 148. The first microphone 190 is used to pick up noise signals from the front cavity 170 of the headphone 100, and the third microphone 210 is used to pick up noise signals from the rear cavity 180 of the headphone 100.

[0082] Specifically, the first microphone 190 and the second microphone 200 simultaneously pick up the sound signal from the front cavity 170 of the earphone 100. When the noise signal picked up by the second microphone 200 from the front cavity 170 of the earphone 100 can no longer be optimized for noise reduction, the first microphone 190 is used to further pick up the noise signal from the front cavity 170 of the earphone 100, thereby supplying it to the controller of the earphone 100 to further optimize the noise reduction depth. The third microphone 210 is used to pick up the external sound signal entering from the pressure relief port 114 of the rear cavity 180 of the earphone 100, thereby knowing the external sound environment where the earphone wearer is located, and thus being able to alert the earphone wearer to potential safety risks and other information.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0084] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An earphone, characterized in that, include: case; An electroacoustic conversion assembly is disposed within the housing, and a front cavity and a rear cavity are formed between the electroacoustic conversion assembly and the inner surface of the housing. The electroacoustic conversion assembly includes: The speaker includes: A magnetically conductive support, the magnetically conductive support having a channel and a first opening, the magnetically conductive support including a connecting cylinder and a connecting plate, the connecting cylinder forming the channel, and the connecting plate connected to the periphery of the connecting cylinder; and The moving coil is disposed on the magnetic guide bracket and located on the periphery of the channel; A first microphone, disposed in the channel, divides the channel into a first conductive segment and a second conductive segment. Both the first conductive segment and the first microphone are connected to the front cavity, and the second conductive segment is connected to the rear cavity. A stepped surface is formed at the connection between the first and second conductive segments. The stepped surface is used to mount and fix the first microphone, which does not protrude from the magnetic support. A second microphone is located in the front cavity; The moving coil portion includes: A moving ring housing is connected to the periphery of the connecting plate, and the moving ring housing is provided with a second opening; Tuning mesh fabric is provided at both the first opening and the second opening.

2. The earphone according to claim 1, characterized in that, The electroacoustic conversion component also includes: The third microphone is located in the second conduction segment.

3. The earphone according to claim 2, characterized in that, The third microphone is stacked on the side of the first microphone that is away from the front cavity.

4. The earphone according to claim 2, characterized in that, There are multiple first microphones and multiple third microphones, and the multiple first microphones and multiple third microphones are stacked along the length direction of the channel.

5. The headphones according to any one of claims 1 to 4, characterized in that, The housing is provided with a sound outlet, which is connected to the front cavity. The second microphone is located at the sound outlet, and the first microphone and the second microphone are arranged opposite to each other.

6. The earphone according to any one of claims 1 to 4, characterized in that, The cross-sectional area of ​​the first conducting segment is smaller than that of the second conducting segment.

7. The earphone according to any one of claims 1 to 4, characterized in that, The first opening is located on one side of the channel; The moving coil and the magnetic guide bracket enclose a cavity, and the cavity and the rear cavity are connected through the first opening.

8. The earphone according to claim 7, characterized in that, The connecting plate is provided with the first opening, and the connecting plate is used to support the moving coil.

9. The headphones according to claim 8, characterized in that, The moving coil also includes: A magnet is disposed on the connecting plate, and there is a gap between the magnet and the connecting cylinder; A magnetic guide plate is disposed on the side of the magnet away from the connecting plate; A diaphragm is connected between the connecting cylinder and the moving coil housing, and is located on the side of the magnetic guide plate away from the magnet; A voice coil that extends from the diaphragm to the gap between the magnet and the connecting cylinder; The cavity is formed by the moving coil shell, the magnetic guide bracket, the magnet, the magnetic guide plate, and the diaphragm.

10. The earphone according to claim 9, characterized in that, The front cavity and the rear cavity are connected through the second opening.

11. The earphone according to claim 10, characterized in that, The end of the connecting cylinder is provided with a first annular groove, the moving ring housing is provided with a second annular groove, and the moving ring portion further includes: A first metal ring is disposed in the first annular groove, and the diaphragm is connected to the first metal ring; A second metal ring is disposed in the second annular groove, and the diaphragm is connected to the second metal ring.

12. An electronic device, characterized in that, include: The headphones as described in any one of claims 1 to 11.

Citation Information

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