Embedded wiring board with heat dissipation structure and manufacturing method thereof

Abstract

This application provides a method for manufacturing an embedded circuit board with a heat dissipation structure, comprising the following steps: providing a copper-clad substrate, the copper-clad substrate including a base layer, a first copper foil layer, and a second copper foil layer; forming a heat dissipation frame in the copper-clad substrate; etching the first copper foil layer and a portion of the second copper foil layer to respectively form a first conductive circuit layer and a second conductive circuit layer; removing the base layer corresponding to the heat dissipation frame to form a first receiving groove; placing components in the first receiving groove; sequentially depositing a first adhesive layer and a third conductive circuit layer on the first conductive circuit layer and the components, and sequentially depositing a second adhesive layer and a fourth conductive circuit layer on the second conductive circuit layer and the second copper foil layer, thereby obtaining the embedded circuit board with a heat dissipation structure. This application has a better heat dissipation effect. This application also provides an embedded circuit board with a heat dissipation structure.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing technology, and in particular to an embedded circuit board with a heat dissipation structure and its manufacturing method. Background Technology

[0002] In recent years, with the miniaturization of electronic devices, there has been a demand for miniaturization of circuit boards and entire modules. Therefore, while optimizing circuit board design and increasing wiring density, embedding components within the circuit board maximizes the use of its internal space, further achieving miniaturization. However, because these embedded components are located inside the circuit board, the heat generated during operation often cannot be dissipated in a timely manner, easily causing localized overheating and posing certain safety hazards. Summary of the Invention

[0003] In view of this, this application provides a method for manufacturing an embedded circuit board with a heat dissipation structure that has a better heat dissipation effect.

[0004] Additionally, it is necessary to provide an embedded circuit board with a heat dissipation structure that has a better heat dissipation effect.

[0005] One embodiment of this application provides a method for manufacturing an embedded circuit board with a heat dissipation structure, comprising the following steps:

[0006] A copper-clad substrate is provided, the copper-clad substrate comprising a base layer and a first copper foil layer and a second copper foil layer respectively located on two opposite surfaces of the base layer;

[0007] A blind trench is formed in the copper-clad substrate. The blind trench includes a first blind trench portion, a second blind trench portion, a third blind trench portion, and a fourth blind trench portion connected in sequence. The first blind trench portion and the third blind trench portion are opposite to each other, and the second blind trench portion and the fourth blind trench portion are opposite to each other. The first blind trench portion, the second blind trench portion, the third blind trench portion, and the fourth blind trench portion all penetrate the second copper foil layer and the base layer in sequence. The bottom of the first blind trench portion, the bottom of the second blind trench portion, the bottom of the third blind trench portion, and the bottom of the fourth blind trench portion all correspond to the first copper foil layer.

[0008] A first heat dissipation section, a second heat dissipation section, a third heat dissipation section, and a fourth heat dissipation section are respectively formed in the first blind slot section, the second blind slot section, the third blind slot section, and the fourth heat dissipation section, together with a portion of the second copper foil layer, form a heat dissipation frame.

[0009] The first copper foil layer and another portion of the second copper foil layer are etched to form the first conductive circuit layer and the second conductive circuit layer, respectively.

[0010] Remove the base layer corresponding to the heat sink frame to form a first receiving groove;

[0011] Place the components in the first receiving slot;

[0012] A first adhesive layer and a third copper foil layer are sequentially disposed on the first conductive circuit layer and the component, and a second adhesive layer and a fourth copper foil layer are sequentially disposed on the second conductive circuit layer and the second copper foil layer.

[0013] A first through-hole is formed in the fourth copper foil layer and the second adhesive layer;

[0014] A heat dissipation column is formed in the first through hole to enable thermal conductivity between the heat dissipation column and the heat dissipation frame; and

[0015] The third copper foil layer and the fourth copper foil layer are etched to form the third conductive circuit layer and the fourth conductive circuit layer, respectively, thereby obtaining the embedded circuit board with heat dissipation structure.

[0016] Another embodiment of this application provides an embedded circuit board with a heat dissipation structure, including:

[0017] A circuit board includes a base layer and a first conductive circuit layer and a second conductive circuit layer respectively located on two opposite surfaces of the base layer. The circuit board has a first heat dissipation part, a second heat dissipation part, a third heat dissipation part and a fourth heat dissipation part connected in sequence. A second copper foil layer is also provided on the surface of the base layer having the second conductive circuit layer. The first heat dissipation part, the second heat dissipation part, the third heat dissipation part, the fourth heat dissipation part and the second copper foil layer together form a heat dissipation frame. A first receiving groove is provided in the heat dissipation frame.

[0018] The components are located in the first receiving slot;

[0019] The first adhesive layer is located on the first conductive circuit layer and the component;

[0020] The third conductive circuit layer is located on the first adhesive layer;

[0021] A second adhesive layer is located on the second conductive circuit layer and the second copper foil layer. The second adhesive layer contains heat dissipation pillars, and the heat dissipation pillars and the heat dissipation frame are thermally connected.

[0022] The fourth conductive circuit layer is located on the second adhesive layer.

[0023] The heat generated by the components in this application can be dissipated along the X-axis (i.e., towards the first heat dissipation part and the third heat dissipation part), the Y-axis (i.e., towards the second heat dissipation part and the fourth heat dissipation part), and the Z-axis (i.e., towards the second copper foil layer) to achieve a 3D heat dissipation mode. Subsequently, the heat on the heat dissipation frame is dissipated through the heat dissipation column, thereby giving the embedded circuit board a better heat dissipation effect. Attached Figure Description

[0024] Figure 1 This is a cross-sectional view of the copper-clad substrate provided in the first embodiment of this application.

[0025] Figure 2 This is a bottom view of the copper-clad substrate provided in the first embodiment of this application.

[0026] Figure 3 Is Figure 1 The cross-sectional view shown is of a copper-clad substrate after a blind trench has been created.

[0027] Figure 4 Is Figure 2 The image shows a bottom view of a copper-clad substrate after a blind slot has been created.

[0028] Figure 5 Is Figure 3 The cross-sectional view shown after the first, second, third, and fourth blind slot portions have the first, second, third, and fourth heat dissipation portions formed, respectively.

[0029] Figure 6 Is Figure 4 The top view after the first, second, third, and fourth blind slot portions are formed, respectively, are shown.

[0030] Figure 7 It is Figure 5 The cross-sectional view shown is the one after the base layer corresponding to the heat sink frame has been removed.

[0031] Figure 8 It is Figure 6 The top view shown is after the base layer corresponding to the heat sink frame has been removed.

[0032] Figure 9 Is Figure 7 The cross-sectional view shown is after the heat dissipation layer has been placed in the first receiving slot.

[0033] Figure 10 Is Figure 8 The top view shown is of the first receiving slot after the heat dissipation layer has been placed.

[0034] Figure 11 Is Figure 9 The cross-sectional view shown is of the heat dissipation layer after the second receiving groove has been opened.

[0035] Figure 12 Is Figure 10 The top view of the heat dissipation layer after the second receiving slot is opened.

[0036] Figure 13 Is Figure 11 The cross-sectional view shown is after the components have been placed in the second receiving slot.

[0037] Figure 14 Is Figure 12 The top view shown is after the components have been placed in the second receiving slot.

[0038] Figure 15 Is Figure 13 The diagram shows a cross-sectional view of a first conductive circuit layer and a first adhesive layer and a third copper foil layer sequentially stacked on the first conductive circuit layer and the component, and a second adhesive layer and a fourth copper foil layer sequentially stacked on the second conductive circuit layer and the second copper foil layer.

[0039] Figure 16 It is Figure 15 The diagram shows a cross-sectional view of an embedded circuit board with a heat dissipation structure obtained after etching the third and fourth copper foil layers.

[0040] Figure 17 This is a cross-sectional view of an embedded circuit board with a heat dissipation structure provided in the second embodiment of this application.

[0041] Explanation of main component symbols

[0042] Embedded circuit boards 100, 200

[0043] Copper clad substrate 10

[0044] Grassroots 101

[0045] First copper foil layer 102

[0046] Second copper foil layer 103

[0047] Blind slot 11

[0048] First blind groove section 111

[0049] Second blind groove section 112

[0050] Third blind slot section 113

[0051] Fourth blind slot section 114

[0052] First heat dissipation section 20

[0053] Second heat dissipation section 21

[0054] Third heat dissipation section 22

[0055] Fourth heat dissipation section 23

[0056] Heat sink 24

[0057] First conductive circuit layer 30

[0058] Second conductive circuit layer 31

[0059] Circuit board 32

[0060] First containment tank 40

[0061] Heat dissipation layer 50

[0062] Second containment tank 51

[0063] Components 60 and 61

[0064] Ontology 601, 611

[0065] Electrodes 602, 612

[0066] First adhesive layer 70

[0067] Second adhesive layer 71

[0068] Third copper foil layer 80

[0069] Fourth copper foil layer 81

[0070] Conductive part 82

[0071] Heat sink 83

[0072] Third conductive circuit layer 90

[0073] Fourth conductive layer 91

[0074] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0075] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0076] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0077] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0078] The first embodiment of this application provides a method for manufacturing an embedded circuit board with a heat dissipation structure, including the following steps:

[0079] Step S11, please refer to Figure 1 and Figure 2 A copper-clad substrate 10 is provided.

[0080] In this embodiment, the copper-clad substrate 10 includes a base layer 101 and a first copper foil layer 102 and a second copper foil layer 103 respectively located on opposite surfaces of the base layer 101.

[0081] The base layer 101 can be made of one of the following resins: epoxy resin, polypropylene (PP), BT resin, polyphenylene oxyether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the base layer 101 is made of polypropylene.

[0082] Step S12, please refer to Figure 3 and Figure 4 A blind groove 11 is formed in the copper-clad substrate 10.

[0083] In this embodiment, the blind slot 11 includes a first blind slot portion 111, a second blind slot portion 112, a third blind slot portion 113, and a fourth blind slot portion 114 connected in sequence. The first blind slot portion 111 and the third blind slot portion 113 are opposite each other, and the second blind slot portion 112 and the fourth blind slot portion 114 are opposite each other. The first blind slot portion 111, the second blind slot portion 112, the third blind slot portion 113, and the fourth blind slot portion 114 all sequentially penetrate the second copper foil layer 103 and the base layer 101, and the bottom of the first blind slot portion 111, the bottom of the second blind slot portion 112, the bottom of the third blind slot portion 113, and the bottom of the fourth blind slot portion 114 all correspond to the first copper foil layer 102.

[0084] In one embodiment, the blind groove 11 can be formed by laser drilling or blind retrieval.

[0085] Step S13, please refer to Figure 5 and Figure 6 A first heat dissipation portion 20, a second heat dissipation portion 21, a third heat dissipation portion 22, and a fourth heat dissipation portion 23 are respectively formed in the first blind slot portion 111, the second blind slot portion 112, the third blind slot portion 113, and the fourth blind slot portion 114.

[0086] Specifically, copper can be electroplated in the first blind slot 111, the second blind slot 112, the third blind slot 113 and the fourth blind slot 114 to form the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22 and the fourth heat dissipation part 23 respectively.

[0087] The first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, the fourth heat dissipation part 23, and a portion of the second copper foil layer 103 (i.e., the second copper foil layer 103 corresponding to the area enclosed by the projections of the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, and the fourth heat dissipation part 23 onto the second copper foil layer 103) together form a heat dissipation frame 24.

[0088] Step S14: Etch the first copper foil layer 102 and another portion of the second copper foil layer 103 to form the first conductive line layer 30 and the second conductive line layer 31 respectively, to obtain the circuit substrate 32.

[0089] Step S15, please refer to Figure 7 and Figure 8 Remove the base layer 101 corresponding to the heat dissipation frame 24 to form a first receiving groove 40.

[0090] The first receiving groove 40 has four side walls, namely the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, and the fourth heat dissipation part 23, and the bottom surface of the first receiving groove 40 is the second copper foil layer 103. In this embodiment, the first receiving groove 40 is approximately rectangular.

[0091] In one embodiment, the first receiving groove 40 can be formed by laser drilling or mechanical drilling. That is, the base layer 101 corresponding to the heat sink frame 24 can be removed by laser drilling or mechanical drilling.

[0092] Step S16, please refer to Figure 9 and Figure 10The heat dissipation layer 50 is placed in the first receiving groove 40, and the heat dissipation layer 50 is connected to the bottom surface and side wall of the heat dissipation frame 24.

[0093] Specifically, the heat dissipation layer 50 is connected (i.e. in contact) with the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, the fourth heat dissipation part 23 and the second copper foil layer 103, so that the heat dissipation layer 50 and the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, the fourth heat dissipation part 23 and the second copper foil layer 103 are all thermally conductive.

[0094] In this embodiment, the heat dissipation layer 50 can be made of graphene. Graphene has a high thermal conductivity. Specifically, the thermal conductivity of graphene is as high as 550–900 W / (m·K).

[0095] In this embodiment, the surface of the heat dissipation layer 50 away from the second conductive line layer 31 and the surface of the heat dissipation frame 24 away from the second conductive line layer 31 are approximately flush.

[0096] Step S17, please refer to Figure 11 and Figure 12 A second receiving groove 51 is formed in the heat dissipation layer 50.

[0097] The second receiving groove 51 does not penetrate the heat dissipation layer 50. In this embodiment, the second receiving groove 51 is approximately rectangular in shape.

[0098] In one embodiment, the second receiving groove 51 can be formed by laser drilling or fixed-depth cutting drilling.

[0099] Step S18, please refer to Figure 13 and Figure 14 The component 60 is placed in the second receiving slot 51.

[0100] In this embodiment, the surface of the component 60 away from the second conductive line layer 31 is approximately flush with the surface of the heat dissipation layer 50 away from the second conductive line layer 31. The dimensions of the component 60 and the volume of the second receiving groove 51 are approximately equal.

[0101] In this embodiment, the component 60 includes a body 601 and an electrode 602 electrically connected to the body 601. The component 60 may be a capacitor, resistor, inductor, or chip, etc., that generates heat.

[0102] Step S19, please refer to Figure 15A first adhesive layer 70 and a third copper foil layer 80 are sequentially stacked on the first conductive circuit layer 30 and the component 60 and then pressed together. A second adhesive layer 71 and a fourth copper foil layer 81 are sequentially stacked on the second conductive circuit layer 31 and the second copper foil layer 103 and then pressed together.

[0103] Both the first adhesive layer 70 and the second adhesive layer 71 can be made of resins selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxyether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, both the first adhesive layer 70 and the second adhesive layer 71 are made of polyimide.

[0104] For step S20, please refer to... Figure 16 A second through hole (not shown) is formed in the third copper foil layer 80 and the first adhesive layer 70, and a first through hole (not shown) is formed in the fourth copper foil layer 81 and the second adhesive layer 71.

[0105] The second through-hole sequentially penetrates the third copper foil layer 80 and the first adhesive layer 70, and the bottom of the second through-hole corresponds to the electrode 602. The first through-hole sequentially penetrates the fourth copper foil layer 81 and the second adhesive layer 71, and the bottom of the first through-hole corresponds to the heat sink frame 24.

[0106] In step S21, a conductive portion 82 is formed in the second through hole, and a heat dissipation column 83 is formed in the first through hole.

[0107] Specifically, copper can be electroplated in the second through hole to form the conductive part 82, and copper can be electroplated in the first through hole to form the heat dissipation column 83.

[0108] The heat dissipation column 83 and the heat dissipation frame 24 are thermally connected, thereby making the heat dissipation column 83 and the heat dissipation layer 50 thermally connected.

[0109] Step S22: Etch the third copper foil layer 80 and the fourth copper foil layer 81 to form the third conductive line layer 90 and the fourth conductive line layer 91 respectively, thereby obtaining the embedded circuit board 100 with heat dissipation structure.

[0110] The third conductive line layer 90 is electrically connected to the electrode 602 through the conductive part 82, so that the third conductive line layer 90 is electrically connected to the component 60 through the conductive part 82.

[0111] Please see Figure 17 The second embodiment of this application provides a method for manufacturing an embedded circuit board with a heat dissipation structure. The difference between the manufacturing method provided in the second embodiment and the manufacturing method provided in the first embodiment is that steps S16 and S17 are omitted. In step S18, the component 61 is directly placed in the first receiving groove 40. The size of the component 61 is approximately equal to the volume of the first receiving groove 40. The component 61 includes a body 611 and electrodes 612 electrically connected to the body 611.

[0112] Please see Figure 16 The first embodiment of this application provides an embedded circuit board 100 with a heat dissipation structure. The embedded circuit board 100 includes a circuit board 32, a heat dissipation layer 50, components 60, a first adhesive layer 70, a third conductive circuit layer 90, a second adhesive layer 71, and a fourth conductive circuit layer 91.

[0113] In this embodiment, the circuit board 32 includes a base layer 101 and a first conductive circuit layer 30 and a second conductive circuit layer 31 located on opposite surfaces of the base layer 101.

[0114] The base layer 101 can be made of one of the following resins: epoxy resin, polypropylene (PP), BT resin, polyphenylene oxyether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the base layer 101 is made of polypropylene.

[0115] The base layer 101 has a second copper foil layer 103 on its surface where the second conductive circuit layer 31 is located.

[0116] The circuit board 32 is provided with a first heat dissipation part 20, a second heat dissipation part 21, a third heat dissipation part 22, and a fourth heat dissipation part 23 connected in sequence. In this embodiment, the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, and the fourth heat dissipation part 23 are all made of copper.

[0117] The first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, the fourth heat dissipation part 23, and the second copper foil layer 103 together form a heat dissipation frame 24. The heat dissipation frame 24 has a first receiving groove 40. Specifically, the four side walls of the first receiving groove 40 are the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, and the fourth heat dissipation part 23, respectively, and the bottom surface of the first receiving groove 40 is the second copper foil layer 103. In this embodiment, the first receiving groove 40 is approximately rectangular.

[0118] The heat dissipation layer 50 is located in the first receiving groove 40, and the heat dissipation layer 50 is connected to the bottom surface and side wall of the heat dissipation frame 24. Specifically, the heat dissipation layer 50 is connected (i.e. in contact) with the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, the fourth heat dissipation part 23, and the second copper foil layer 103, so that the heat dissipation layer 50 and the first heat dissipation part 20, the second heat dissipation part 21, the third heat dissipation part 22, the fourth heat dissipation part 23, and the second copper foil layer 103 are thermally conductive.

[0119] In this embodiment, the heat dissipation layer 50 can be made of graphene. Graphene has a high thermal conductivity. Specifically, the thermal conductivity of graphene is as high as 550–900 W / (m·K).

[0120] In this embodiment, the surface of the heat dissipation layer 50 away from the second conductive line layer 31 and the surface of the heat dissipation frame 24 away from the second conductive line layer 31 are approximately flush.

[0121] A second receiving groove 51 is provided in the heat dissipation layer 50. The second receiving groove 51 does not penetrate the heat dissipation layer 50. In this embodiment, the second receiving groove 51 is approximately rectangular in shape.

[0122] In this embodiment, the component 60 is located in the second receiving slot 51. In this embodiment, the surface of the component 60 away from the second conductive line layer 31 is approximately flush with the surface of the heat dissipation layer 50 away from the second conductive line layer 31. The size of the component 60 and the volume of the second receiving slot 51 are approximately equal.

[0123] In this embodiment, the component 60 includes a body 601 and an electrode 602 electrically connected to the body 601. The component 60 may be a capacitor, resistor, inductor, or chip, etc., that generates heat.

[0124] The first adhesive layer 70 is located on the first conductive circuit layer 30 and the component 60. A conductive portion 82 is formed in the first adhesive layer 70. In this embodiment, the conductive portion 82 is made of copper.

[0125] The first adhesive layer 70 can be made of one of the following resins: epoxy resin, polypropylene (PP), BT resin, polyphenylene oxyether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the first adhesive layer 70 is made of polyimide.

[0126] The third conductive circuit layer 90 is located on the first adhesive layer 70. The third conductive circuit layer 90 is electrically connected to the electrode 602 via the conductive portion 82, thereby enabling the third conductive circuit layer 90 to be electrically connected to the component 60 via the conductive portion 82.

[0127] The second adhesive layer 71 is located on the second conductive circuit layer 31 and the second copper foil layer 103. A heat dissipation column 83 is formed in the second adhesive layer 71. In this embodiment, the heat dissipation column 83 is made of copper. The heat dissipation column 83 and the heat dissipation frame 24 are thermally connected, thereby enabling thermal connectivity between the heat dissipation column 83 and the heat dissipation layer 50.

[0128] In this embodiment, the material of the second adhesive layer 71 may be the same as that of the first adhesive layer 70. For details, please refer to the material of the first adhesive layer 70, which will not be described in detail here.

[0129] In this embodiment, the fourth conductive circuit layer 91 is located on the second adhesive layer 71.

[0130] Please see Figure 17 The second embodiment of this application provides an embedded circuit board 200 with a heat dissipation structure. The difference between the embedded circuit board 200 provided in the second embodiment and the embedded circuit board 100 provided in the first embodiment is that the embedded circuit board 200 does not include the heat dissipation layer 50, and the component 61 is located in the first receiving groove 40. The size of the component 61 is approximately equal to the volume of the first receiving groove 40. The component 61 includes a body 611 and an electrode 612 electrically connected to the body 611.

[0131] The heat generated by the component 60 in this application can be dissipated through the heat dissipation layer 50 to the X-axis (i.e., to the first heat dissipation part 20 and the third heat dissipation part 22), the Y-axis (i.e., to the second heat dissipation part 21 and the fourth heat dissipation part 23), and the Z-axis (i.e., to the second copper foil layer 103) to achieve a 3D heat dissipation mode. Subsequently, the heat on the heat dissipation frame 24 is dissipated through the heat dissipation column 83, thereby giving the embedded circuit board 100 a better heat dissipation effect.

[0132] In addition, the heat dissipation layer 50 in this application is made of graphene, and the graphene has a high thermal conductivity, which is beneficial to the continuous and stable operation of the component 60, extends the life of the component 60, and thus improves the reliability of the embedded circuit board 100.

[0133] The above description is merely an optimized implementation of this application, but in actual applications, it should not be limited to this implementation.

Claims

1. A method for manufacturing an embedded circuit board with a heat dissipation structure, characterized in that, Includes the following steps: A copper-clad substrate is provided, the copper-clad substrate comprising a base layer and a first copper foil layer and a second copper foil layer respectively located on two opposite surfaces of the base layer; A blind trench is formed in the copper-clad substrate. The blind trench includes a first blind trench portion, a second blind trench portion, a third blind trench portion, and a fourth blind trench portion connected in sequence. The first blind trench portion and the third blind trench portion are opposite to each other, and the second blind trench portion and the fourth blind trench portion are opposite to each other. The first blind trench portion, the second blind trench portion, the third blind trench portion, and the fourth blind trench portion all penetrate the second copper foil layer and the base layer in sequence. The bottom of the first blind trench portion, the bottom of the second blind trench portion, the bottom of the third blind trench portion, and the bottom of the fourth blind trench portion all correspond to the first copper foil layer. A first heat dissipation section, a second heat dissipation section, a third heat dissipation section, and a fourth heat dissipation section are respectively formed in the first blind slot section, the second blind slot section, the third blind slot section, and the fourth heat dissipation section, together with a portion of the second copper foil layer, form a heat dissipation frame. The first copper foil layer and another portion of the second copper foil layer are etched to form the first conductive circuit layer and the second conductive circuit layer, respectively. Remove the base layer corresponding to the heat sink frame to form a first receiving groove; The heat dissipation layer is placed in the first receiving slot, and the heat dissipation layer is connected to the bottom surface and side wall of the heat dissipation frame; A second receiving groove is formed in the heat dissipation layer; The components are placed in the second receiving slot; A first adhesive layer and a third copper foil layer are sequentially disposed on the first conductive circuit layer and the component, and a second adhesive layer and a fourth copper foil layer are sequentially disposed on the second conductive circuit layer and the second copper foil layer. A first through-hole is formed in the fourth copper foil layer and the second adhesive layer; A heat dissipation column is formed in the first through hole to make the heat dissipation column and the heat dissipation frame thermally connected; as well as The third copper foil layer and the fourth copper foil layer are etched to form the third conductive circuit layer and the fourth conductive circuit layer, respectively, thereby obtaining the embedded circuit board with heat dissipation structure.

2. The method of manufacturing a built-in wiring board having a heat dissipation structure according to claim 1, wherein The heat dissipation layer is made of graphene.

3. The method for manufacturing an embedded circuit board with a heat dissipation structure as described in claim 1, characterized in that, The surface of the component away from the fourth conductive line layer is flush with the surface of the heat sink frame away from the fourth conductive line layer and the surface of the heat sink layer away from the fourth conductive line layer.

4. The method of manufacturing a built-in wiring board having a heat dissipation structure according to claim 1, wherein The materials of the first heat dissipation part, the second heat dissipation part, the third heat dissipation part, and the fourth heat dissipation part are all copper.

5. An embedded circuit board with a heat dissipation structure prepared by the method of manufacturing an embedded circuit board with a heat dissipation structure as described in any one of claims 1-4, characterized in that, include: A circuit board includes a base layer and a first conductive circuit layer and a second conductive circuit layer respectively located on two opposite surfaces of the base layer. The circuit board has a first heat dissipation part, a second heat dissipation part, a third heat dissipation part and a fourth heat dissipation part connected in sequence. A second copper foil layer is also provided on the surface of the base layer having the second conductive circuit layer. The first heat dissipation part, the second heat dissipation part, the third heat dissipation part, the fourth heat dissipation part and the second copper foil layer together form a heat dissipation frame. A first receiving groove is provided in the heat dissipation frame. The components are located in the first receiving slot; The first adhesive layer is located on the first conductive circuit layer and the component; The third conductive circuit layer is located on the first adhesive layer; The second adhesive layer is located on the second conductive circuit layer and the second copper foil layer. The second adhesive layer is provided with heat dissipation pillars, and the heat dissipation pillars and the heat dissipation frame are thermally connected. as well as The fourth conductive circuit layer is located on the second adhesive layer.

6. The built-in wiring board having a heat radiating structure according to claim 5, wherein Also includes: A heat dissipation layer is located in the first receiving groove, and the heat dissipation layer is connected to the bottom surface and side wall of the heat dissipation frame. A second receiving groove is provided in the heat dissipation layer. The component is located in the second receiving slot.

7. The built-in wiring board having a heat radiating structure according to claim 5, wherein The heat dissipation layer is made of graphene.

8. The built-in wiring board having a heat radiating structure according to claim 5, wherein The surface of the component away from the fourth conductive line layer is flush with the surface of the heat sink frame away from the fourth conductive line layer and the surface of the heat sink layer away from the fourth conductive line layer.

9. The embedded circuit board with a heat dissipation structure as described in claim 5, characterized in that, The materials of the first heat dissipation part, the second heat dissipation part, the third heat dissipation part, and the fourth heat dissipation part are all copper.

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