A liquid crystal panel cutting method, system, processing device and storage medium

Abstract

The embodiment of the present application discloses a liquid crystal panel cutting method, which is used for cutting a liquid crystal panel. The liquid crystal panel comprises an upper substrate and a lower substrate arranged oppositely, a liquid crystal layer between the upper substrate and the lower substrate, the liquid crystal layer comprising at least one liquid crystal area and a frame glue area between each liquid crystal area. The liquid crystal panel cutting method comprises the following steps: positioning a liquid crystal panel to be cut, obtaining position information of the frame glue area of the liquid crystal panel to be cut, obtaining a laser scanning route based on the position information and cutting parameters of a cutter wheel; driving a laser to emit laser, so that the laser is shot to the frame glue area, and a light spot of the laser in the frame glue area moves along the scanning route. The present application can effectively improve the product yield of the liquid crystal panel.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a method, system, processing equipment, and storage medium for cutting liquid crystal panels. Background Technology

[0002] An adhesive ring surrounds the outer edge of the liquid crystal area of ​​an LCD panel to secure the liquid crystal within the ring. During LCD panel cutting, a cutting path is typically defined based on the adhesive area, and a cutting wheel follows this pre-set path. While the cutting wheel can effectively cut the upper and lower substrates of the LCD panel, it cannot effectively cut the adhesive ring. This results in the adhesive remaining adhered after the cutting operation, hindering efficient LCD panel cutting and leading to a low yield rate for the cut products. Summary of the Invention

[0003] Based on this, it is necessary to propose a liquid crystal panel cutting method, system, processing equipment, and storage medium to address the above problems.

[0004] A method for cutting a liquid crystal panel, the liquid crystal panel comprising:

[0005] The upper and lower substrates are positioned opposite each other;

[0006] A liquid crystal layer located between the upper substrate and the lower substrate, the liquid crystal layer comprising at least one liquid crystal region and a sealant region located between each of the liquid crystal regions;

[0007] The liquid crystal panel cutting method includes the following steps:

[0008] Position the LCD panel to be cut, obtain the position information of the frame adhesive area of ​​the LCD panel to be cut, and obtain the laser scanning path based on the position information and the cutting parameters of the cutter wheel;

[0009] The laser is driven to emit a laser beam, which is directed to the frame adhesive area, and the laser spot in the frame adhesive area moves along the scanning path.

[0010] The cutting parameters include at least one of cutting accuracy, cutting width, and cutting deviation.

[0011] The step of obtaining the laser scanning path based on the position information and the cutting parameters of the cutter wheel includes:

[0012] The target cutting path of the cutter wheel is obtained based on the position information and the cutting parameters, and the path width of the scanning path is obtained based on the target cutting path and the cutting parameters;

[0013] The size of the laser spot on the liquid crystal layer is adjusted based on the path width.

[0014] The step of the driving laser emitting a laser beam, causing the laser beam to hit the frame adhesive area, and the laser beam moving along the scanning path on the liquid crystal layer after the step includes:

[0015] The cutting wheel is driven to cut the LCD panel to be cut according to the target cutting path, thereby obtaining the target LCD panel.

[0016] The steps of locating the liquid crystal panel to be cut, obtaining the position information of the frame adhesive area of ​​the liquid crystal panel to be cut, and obtaining the laser scanning path based on the position information and the cutting parameters of the cutter wheel include:

[0017] Based on the positioning of the liquid crystal panel to be cut, the key processing points are obtained, and the target cutting path and the scanning path of the laser are set based on the key processing points.

[0018] The step of the driving laser emitting a laser beam, causing the laser beam to hit the adhesive area, and the laser spot on the liquid crystal layer moving along the scanning path includes:

[0019] Obtain the frame adhesive information of the frame adhesive area and the heat resistance information of the liquid crystal panel. The frame adhesive information includes at least one of the frame adhesive material, thickness, and density.

[0020] The speed at which the light spot moves along the scanning path is set based on the frame adhesive information and the heat resistance information.

[0021] The step of setting the speed at which the light spot moves along the scanning path based on the frame adhesive information includes:

[0022] The initial focal length of the laser beam hitting the frame area is obtained, and the laser is defocused based on the initial focal length to obtain the target focal length. The laser is then driven to emit the laser beam according to the target focal length.

[0023] The step of driving the laser to emit a laser beam, causing the laser beam to hit the adhesive area, and having the laser spot on the liquid crystal layer move along the scanning path includes:

[0024] The direction in which the light spot moves along the scanning path is consistent with the cutting direction of the cutter wheel.

[0025] A liquid crystal panel cutting system for cutting liquid crystal panels, the liquid crystal panels comprising:

[0026] The upper and lower substrates are positioned opposite each other;

[0027] A liquid crystal layer located between the upper substrate and the lower substrate, the liquid crystal layer comprising at least one liquid crystal region and a sealant region located between each of the liquid crystal regions;

[0028] The liquid crystal panel cutting system includes the following modules:

[0029] The positioning module is used to position the LCD panel to be cut, obtain the position information of the frame adhesive area of ​​the LCD panel to be cut, and obtain the laser scanning path based on the position information and the cutting parameters of the cutter wheel.

[0030] A laser module is used to drive a laser to emit laser light, so that the laser light is directed to the frame adhesive area, and the laser spot on the liquid crystal layer moves along the scanning path.

[0031] A computer device includes a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps described above.

[0032] A computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to perform the steps described above.

[0033] The embodiments of the present invention have the following beneficial effects:

[0034] Before the cutting wheel cuts the LCD panel, the laser scanning path is obtained based on the position information of the frame adhesive area and the cutting parameters of the cutting wheel. The laser is then driven to emit laser light, which is directed to the frame adhesive area. The laser spot on the LCD layer moves along the scanning path, which can remove the frame adhesive in the area to be cut by the cutting wheel before the cutting wheel cuts. This allows the cutting wheel to cut the LCD panel effectively, improving the success rate of processing and the product yield. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] in:

[0037] Figure 1 This is a flowchart illustrating the first embodiment of the liquid crystal panel cutting method provided by the present invention;

[0038] Figure 2 This is a schematic diagram of the structure of the liquid crystal panel provided by the present invention;

[0039] Figure 3 This is a comparative schematic diagram of the target cutting path, actual cutting area, and scanning path of the cutter wheel provided by the present invention;

[0040] Figure 4 This is a schematic diagram of an embodiment of the liquid crystal panel cutting system provided by the present invention;

[0041] Figure 5 An internal structural diagram of a computer device in one embodiment is shown. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a flowchart illustrating the first embodiment of the liquid crystal panel cutting method provided by the present invention. Figure 2 This is a schematic diagram of the structure of a liquid crystal panel provided by the present invention. The liquid crystal panel 10 includes an upper substrate 11 and a lower substrate 12 disposed opposite to each other. A liquid crystal layer 13 is disposed between the upper substrate 11 and the lower substrate 12. The liquid crystal layer 13 includes at least one liquid crystal region 131 and a retainer region 132 located between each liquid crystal region 131. The retainer region 132 surrounds each liquid crystal region 131, and the positions of the retainer region 132 and the liquid crystal region 131 are known.

[0044] The liquid crystal panel cutting method provided by this invention includes the following steps:

[0045] S101: Position the LCD panel to be cut, obtain the position information of the frame adhesive area of ​​the LCD panel to be cut, and obtain the laser scanning path based on the position information and the cutting parameters of the cutter wheel.

[0046] In a specific implementation scenario, the positioning of the LCD panel to be cut can be achieved using CCD (charge-coupled device) cameras, positioning sensors, positioning posts, and other facilities. This allows for the acquisition of the LCD panel's position, and based on this position, the location information of the liquid crystal area and / or the frame adhesive area is obtained. A cutting wheel is used to cut at the corresponding position in the frame adhesive area, thus cutting the LCD panel into multiple target LCD panels. It is crucial to ensure that each target LCD panel after cutting includes at least one liquid crystal area, and that each liquid crystal area is still surrounded by the frame adhesive area; otherwise, leakage may occur, leading to product defects.

[0047] In this implementation scenario, the cutting wheel can cut the upper and lower substrate materials, but it cannot effectively cut the adhesive material in the frame adhesive area. This leads to poor cutting results; for example, the frame adhesive area between the target LCD panels may still be stuck together, or the cut area may deviate from the preset range, causing leakage and other defects. Therefore, before the cutting wheel starts cutting, a laser can be used to remove the frame adhesive from the cutting path. This allows the cutting wheel to directly cut the upper and lower substrates, resulting in a better cutting effect.

[0048] The cutting wheel has its own cutting parameters, including cutting speed, cutting path deviation error, and cutting kerf width. An initial laser scanning path is obtained based on the position information and the CAD drawing of the target LCD panel. The initial laser scanning path is then adjusted and compensated according to the cutting wheel parameters to obtain the final scanning path. The error during laser scanning is extremely small and negligible compared to the deviation error of the cutting wheel. The laser scanning path is planned based on the cutting wheel parameters and the position information of the frame adhesive area, ensuring that after the cutting wheel cuts the upper / lower substrates, there is no adhesion of frame adhesive between adjacent LCD panels, allowing for easy separation without defects such as chipping.

[0049] In one implementation scenario, the target cutting path of the cutting wheel is obtained based on the location information of the frame adhesive area, the user's actual cutting requirements (e.g., the target LCD panel size required by the user, the width of the frame adhesive area of ​​the target LCD panel set by the user), and the cutting parameters of the cutting wheel (e.g., the cutting width, cutting accuracy, cutting deviation error of the cutting wheel). The cutting wheel cuts along the target cutting path so that the cut target LCD panel meets the user's needs.

[0050] After obtaining the target cutting path of the cutter wheel, the actual cutting area of ​​the cutter wheel can be obtained by combining the cutting parameters of the cutter wheel (such as cutting accuracy, cutting width, and cutting deviation). The path width of the scanning route is then planned based on the actual cutting area. In this implementation scenario, the laser scans only in one direction, and each path is scanned only once. Therefore, the size of the laser spot hitting the frame adhesive area is set based on the path width so that the frame adhesive removed after the laser scan matches the actual cutting area of ​​the cutter wheel. Please refer to [reference needed]. Figure 3 , Figure 3 This is a comparative schematic diagram of the target cutting path, actual cutting area, and scanning path of the cutter wheel provided by this invention. In one implementation scenario, the path width is 300μm-400μm.

[0051] S102: Drive the laser to emit a laser beam, so that the laser beam hits the frame adhesive area, and the laser spot in the frame adhesive area moves along the scanning path.

[0052] In a specific implementation scenario, after determining the scanning path, the laser's operating parameters are adjusted so that the laser can set the frame adhesive area and remove the frame adhesive in the frame adhesive area. The laser spot that is driven to the liquid crystal layer moves along the scanning path, thereby removing the frame adhesive in the frame adhesive area corresponding to the scanning path.

[0053] After the laser device emits a laser beam, the drive blade wheel cuts the LCD panel to be cut along the target cutting path to obtain the target LCD panel. This can be done either after the laser spot has moved along the scanning path and finished, or after the laser spot has moved for a period of time before the drive blade wheel cuts; the key is to ensure that the same area is scanned by the laser spot before being cut by the blade wheel.

[0054] In one implementation scenario, after locating the LCD panel to be cut, key processing points are obtained. Based on these key processing points, the target cutting path and the laser scanning path are set. These key processing points can be intersections of the target cutting path or the laser scanning path, or bends in either the target cutting path or the scanning path. By setting the target cutting path and the laser scanning path based on these key processing points, the cutter wheel and laser spot can complete as many cutting tasks as possible in a single movement.

[0055] In a given scenario, different types of frame adhesive require different laser operating parameters. For example, thicker, denser adhesive requires a higher laser cleaning power to effectively remove it. This cleaning power can be improved by increasing the laser's emission energy or by reducing the laser spot's movement speed. A lower spot movement speed results in a higher overlap rate between adjacent spots, meaning the overlapping area receives significantly more cleaning energy, leading to better cleaning. However, a higher overlap rate also means higher heat in the overlapping area, which could damage the LCD panel and the device. Therefore, setting the spot movement speed, i.e., the overlap rate of adjacent spots, ensures that the frame adhesive can be removed without damaging the LCD panel and the device.

[0056] In one implementation scenario, before removing the frame adhesive, the initial focal length of the laser beam hitting the frame area is obtained. Based on the initial focal length, the target focal length is obtained after defocusing. The laser is then driven to emit the laser beam according to the target focal length. This ensures that the laser beam does not pass through the frame adhesive and the lower substrate and hit the fixture, causing damage to the fixture, or that the secondary reflection of the light hitting the fixture causes it to be reflected into the substrate, resulting in damage to the LCD screen quality.

[0057] In another implementation scenario, ensuring the roundness of the laser spot in the adhesive area is crucial. This guarantees consistent cleaning results in both the horizontal and vertical directions when removing the adhesive, ensuring a better cleaning outcome. If the roundness of the laser spot does not meet the requirements, a circular aperture stop can be added to the external optical path of the laser to improve its roundness.

[0058] In one implementation scenario, the direction of movement of the driving light spot along the scanning path is consistent with the cutting direction of the cutter wheel. This effectively ensures consistent cutting results and a smooth cut surface.

[0059] As described above, in this embodiment, before the cutter wheel cuts the LCD panel, the laser scanning path is obtained based on the position information of the frame adhesive area and the cutting parameters of the cutter wheel. The laser is then driven to emit laser light, so that the laser beam hits the frame adhesive area. The laser spot on the LCD layer moves along the scanning path, which can remove the frame adhesive in the area to be cut by the cutter wheel before the cutter wheel cuts. This allows the cutter wheel to cut the LCD panel well, improving the success rate of processing and the product yield.

[0060] Please refer to the following: Figure 2 and Figure 4 , Figure 4 This is a schematic diagram of an embodiment of the liquid crystal panel cutting system provided by the present invention. The liquid crystal panel cutting system 20 is used for cutting... Figure 2 The LCD panel shown is shown. The LCD panel cutting system 20 includes a positioning module 21 and a laser module 22.

[0061] The positioning module 21 is used to position the LCD panel to be cut, obtain the position information of the frame adhesive area of ​​the LCD panel to be cut, and obtain the laser scanning path based on the position information and the cutting parameters of the cutter wheel; the laser module 22 is used to drive the laser to emit laser light, so that the laser light is emitted to the frame adhesive area, and the laser spot on the liquid crystal layer moves along the scanning path.

[0062] The cutting parameters include at least one of cutting accuracy, cutting width, and cutting deviation; the positioning module 21 is used to obtain the path width of the scanning path based on the position information, the target cutting path, and the cutting parameters; and to adjust the size of the laser spot on the liquid crystal layer based on the path width.

[0063] The laser module 22 is used to drive the cutter wheel to cut the LCD panel to be cut according to the target cutting path, and obtain the target LCD panel.

[0064] The positioning module 21 is used to obtain the processing key points based on the positioning of the LCD panel to be cut, and to set the target cutting path and the laser scanning path based on the processing key points.

[0065] The laser module 22 is used to acquire frame adhesive information and heat resistance information of the LCD panel. The frame adhesive information includes at least one of the frame adhesive material, thickness, and density. Based on the frame adhesive information and heat resistance information, the laser spot moves at a certain rate along the scanning path.

[0066] The laser module 22 is used to obtain the initial focal length of the laser beam hitting the frame area, perform defocusing based on the initial focal length, obtain the target focal length, and drive the laser to emit laser beams according to the target focal length.

[0067] The laser module 22 is used to drive the light spot to move in the same direction as the cutting direction of the blade wheel along the scanning path.

[0068] As described above, in this embodiment, before the liquid crystal panel cutting system cuts the liquid crystal panel, it first obtains the laser scanning path based on the position information of the frame adhesive area and the cutting parameters of the cutting wheel, drives the laser to emit laser light, so that the laser light hits the frame adhesive area, and the laser spot on the liquid crystal layer moves along the scanning path. This allows the frame adhesive in the area to be cut by the cutting wheel to be removed by the laser before the cutting wheel cuts, so that the cutting wheel can cut the liquid crystal panel well, improving the success rate of processing and the product yield.

[0069] Figure 5 An internal structural diagram of a computer device in one embodiment is shown. This computer device can specifically be a terminal or a server. Figure 5As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system and may also store a computer program that, when executed by the processor, enables the processor to implement an age recognition method. The internal memory may also store a computer program that, when executed by the processor, enables the processor to implement the age recognition method. Those skilled in the art will understand that... Figure 5 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0070] In one embodiment, a computer device is provided, including a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform... Figure 1 The method shown.

[0071] In one embodiment, a computer-readable storage medium is provided storing a computer program that, when executed by a processor, causes the processor to perform... Figure 1 The method shown.

[0072] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0073] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for cutting a liquid crystal panel, characterized in that, For cutting liquid crystal panels, the liquid crystal panels include: The upper and lower substrates are positioned opposite each other; A liquid crystal layer located between the upper substrate and the lower substrate, the liquid crystal layer comprising at least one liquid crystal region and a sealant region located between each of the liquid crystal regions; The liquid crystal panel cutting method includes the following steps: The process involves locating the LCD panel to be cut, obtaining the position information of the frame adhesive area of ​​the LCD panel to be cut, and obtaining the laser scanning path based on the position information and the cutting parameters of the cutting wheel; wherein, the cutting parameters include at least one of cutting accuracy, cutting width, and cutting deviation. The laser is driven to emit a laser beam, which is directed to the frame adhesive area, and the laser spot in the frame adhesive area moves along the scanning path; The step of obtaining the laser scanning path based on the position information and the cutting parameters of the cutter wheel includes: The target cutting path of the cutter wheel is obtained based on the position information and the cutting parameters, and the path width of the scanning path is obtained based on the target cutting path and the cutting parameters; The size of the laser spot on the liquid crystal layer is adjusted based on the path width.

2. The liquid crystal panel cutting method according to claim 1, characterized in that, The step of the driving laser emitting a laser beam, causing the laser beam to hit the adhesive area, and the laser beam moving along the scanning path on the liquid crystal layer, includes: The cutting wheel is driven to cut the LCD panel to be cut according to the target cutting path to obtain the target LCD panel.

3. The liquid crystal panel cutting method according to claim 1, characterized in that, The steps of locating the liquid crystal panel to be cut, obtaining the position information of the frame adhesive area of ​​the liquid crystal panel to be cut, and obtaining the laser scanning path based on the position information and the cutting parameters of the cutter wheel include: Based on the positioning of the liquid crystal panel to be cut, the key processing points are obtained, and the target cutting path and the scanning path of the laser are set based on the key processing points.

4. The liquid crystal panel cutting method according to claim 1, characterized in that, The step of the driving laser emitting a laser beam, causing the laser beam to hit the adhesive area, and the laser spot on the liquid crystal layer moving along the scanning path includes: Obtain the frame adhesive information of the frame adhesive area and the heat resistance information of the liquid crystal panel. The frame adhesive information includes at least one of the frame adhesive material, thickness, and density. The speed at which the light spot moves along the scanning path is set based on the frame adhesive information and the heat resistance information.

5. The liquid crystal panel cutting method according to claim 4, characterized in that, The step of setting the speed at which the light spot moves along the scanning path based on the frame adhesive information includes: The initial focal length of the laser beam hitting the frame adhesive area is obtained, and the laser is defocused based on the initial focal length to obtain the target focal length. The laser is then driven to emit the laser beam according to the target focal length.

6. The liquid crystal panel cutting method according to claim 1, characterized in that, The step of driving a laser to emit a laser beam, causing the laser beam to hit the adhesive area, and having the laser spot on the liquid crystal layer move along the scanning path includes: The direction in which the light spot moves along the scanning path is consistent with the cutting direction of the cutter wheel.

7. A liquid crystal panel cutting system, characterized in that, For cutting liquid crystal panels, the liquid crystal panels include: The upper and lower substrates are positioned opposite each other; A liquid crystal layer located between the upper substrate and the lower substrate, the liquid crystal layer comprising at least one liquid crystal region and a sealant region located between each of the liquid crystal regions; The liquid crystal panel cutting system includes the following modules: The positioning module is used to position the LCD panel to be cut, obtain the position information of the frame adhesive area of ​​the LCD panel to be cut, and obtain the laser scanning path based on the position information and the cutting parameters of the cutter wheel; wherein, the cutting parameters include at least one of cutting accuracy, cutting width, and cutting deviation. A laser module is used to drive a laser to emit laser light, so that the laser light is directed to the frame adhesive area, and the laser spot on the liquid crystal layer moves along the scanning path; The step of obtaining the laser scanning path based on the position information and the cutting parameters of the cutter wheel includes: The target cutting path of the cutter wheel is obtained based on the position information and the cutting parameters, and the path width of the scanning path is obtained based on the target cutting path and the cutting parameters; The size of the laser spot on the liquid crystal layer is adjusted based on the path width.

8. A computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to perform the steps of the method as claimed in any one of claims 1 to 6.

9. A processing apparatus comprising a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps of the method as claimed in any one of claims 1 to 6.

Images