Film bonding module and semiconductor strip cutting and sorting apparatus comprising the same

By designing a film bonding module, the problem of automated attachment and separation of semiconductor packages in EMI shielding process was solved, realizing automated processing of semiconductor packages and improving production efficiency and accuracy.

CN116259561BActive Publication Date: 2026-06-19SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SYSTEM ENGINEERING MEGA SOLUTION CO LTD
Filing Date
2022-11-24
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In the EMI shielding process of semiconductor packages, existing technologies struggle to effectively attach the semiconductor package to the release film and automate the process during cutting and sorting.

Method used

A membrane bonding module was designed, including a hopper loader module, a membrane handling module, a membrane lifting module, and a conveyor module. By magnetically bonding the clamping tray and the release film, the module enables automated bonding and separation of the clamping tray and the release film, supporting automated attachment and separation of semiconductor packages.

Benefits of technology

This technology enables automated attachment of semiconductor packages to release film and automated removal processes before EMI shielding, improving production efficiency and precision.

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Abstract

Embodiments of the present invention provide a film bonding module for bonding and separating a release film with attached semiconductor packages from a fixture tray, and a semiconductor strip cutting and sorting apparatus including the same. The semiconductor strip cutting and sorting apparatus according to the present invention includes: a loading section for supplying semiconductor strips; a cutting section for cutting the semiconductor strips supplied from the loading section to individualize the semiconductor strips into multiple semiconductor packages; a sorting section for inspecting the individualized semiconductor packages and sorting the semiconductor packages according to the inspection results and bonding them to a release film; and a film bonding module disposed adjacent to the sorting section, which bonds the fixture tray and the release film to the sorting section and separates the fixture tray and the release film recovered from the sorting section.
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