一种抗电磁干扰的集成硅基光接收芯片及其制备方法
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
- Filing Date
- 2023-02-23
- Publication Date
- 2026-07-17
AI Technical Summary
Silicon-based optical receiver chips are susceptible to electromagnetic interference at high frequencies, which can lead to a decline in device performance. In particular, interference is exacerbated when the channel spacing is reduced in multi-channel designs.
A U-shaped electromagnetic shielding ring is set around the detector array, including a U-shaped bottom layer structure, a metal ring and an electrode layer. A multi-layer structure is formed by etching and deposition processes to enhance the anti-electromagnetic interference capability.
This enhances the detector's resistance to electromagnetic interference, allowing for a further reduction in the distance between adjacent detectors and enabling a more integrated silicon-based optical receiver chip design.
Smart Images
Figure CN116259609B_ABST