Encapsulation material for light emitting device, display module, and encapsulation method

Abstract

The application belongs to the technical field of light emitting devices. The application discloses a packaging material of a light emitting device, which comprises a light-transmitting layer and a dark layer; the dark layer is arranged on one side of the light-transmitting layer; and the softening point of the light-transmitting layer is greater than that of the dark layer. The application further discloses a display module comprising a light emitting module and a packaging layer. The application further discloses a packaging method of the display module. The softening point of the dark layer in the packaging material is low, and the flowability is better, so that the dark layer can sufficiently fill the gaps of the light emitting device, and the reliability of the packaging material is improved.

Description

Technical Field

[0001] This invention belongs to the field of light-emitting device technology, and particularly relates to a packaging material, display module and packaging method for a light-emitting device. Background Technology

[0002] LED light-emitting components are becoming increasingly popular due to their smaller size and higher pixel density. However, direct-display light-emitting components have a higher density of light-emitting devices and smaller spacing between adjacent devices, making the packaging of direct-display light-emitting devices more difficult.

[0003] In existing technologies, LED light-emitting components are typically encapsulated by dispensing encapsulation material into the gaps of the light-emitting device using a needle.

[0004] However, in the process of implementing the technical solution in the embodiments of this application, the applicant discovered that the above-mentioned technology has at least the following technical problems:

[0005] In LED light-emitting components, the gaps between LED chips are small. When using dispensing for encapsulation, it is unavoidable to obstruct the LED chips, which will adversely affect the light emission effect. In subsequent processes, it is necessary to remove the encapsulation material on the surface of the LED chips through methods such as etching, which is a complex process and can easily damage the LED chips. Summary of the Invention

[0006] This application provides a packaging material for light-emitting devices, which solves the problem that existing packaging materials cannot completely fill the gaps between light-emitting devices and are prone to damaging them. The packaging material in this application can both meet the gap filling requirements and avoid damaging the light-emitting devices, thereby improving the packaging effect and reliability.

[0007] This application provides a packaging material for a light-emitting device, which includes a light-transmitting layer and a dark layer; the dark layer is disposed on one side of the light-transmitting layer; the softening point of the light-transmitting layer is greater than the softening point of the dark layer.

[0008] Furthermore, the difference between the softening point of the light-transmitting layer and the softening point of the dark layer is greater than or equal to 5°C.

[0009] Furthermore, the softening point of the light-transmitting layer is greater than or equal to 25°C and less than or equal to 150°C, and the softening point of the dark layer is greater than or equal to 25°C and less than or equal to 65°C.

[0010] Furthermore, in the Lab value of the light-transmitting layer, the L value is 65 to 80, the a value is -0.1 to -0.7, and the b value is 1.5 to 3; in the Lab value of the dark layer, the L value is less than or equal to 70, the a value is -10 to 10, and the b value is -10 to 10.

[0011] Furthermore, the dark layer comprises inorganic pigments, the ratio of the particle size of the inorganic pigments to the thickness of the dark layer being greater than or equal to 8.0 × 10⁻⁶. -4 And less than or equal to 3.0 × 10 -3 .

[0012] Furthermore, the difference between the transmittance of the dark layer and the transmittance of the light layer is greater than or equal to 70% and less than or equal to 90%.

[0013] Furthermore, the light transmittance of the dark layer is less than 5%, and the light transmittance of the light-transmitting layer is greater than or equal to 80% and less than or equal to 95%.

[0014] Furthermore, the haze of the light-transmitting layer is 3% to 10%, the gloss of the light-transmitting layer is 10-70 GU, and the gloss of the dark layer is 8-20 GU.

[0015] Furthermore, the ratio of the thickness of the dark layer to the thickness of the light-transmitting layer is greater than or equal to 0.2 and less than or equal to 0.6.

[0016] Furthermore, the thickness of the dark layer is greater than 0 μm and less than or equal to 70 μm, and the thickness of the light-transmitting layer is greater than 0 μm and less than or equal to 300 μm.

[0017] Furthermore, the encapsulation material also includes a protective layer, which is located on the side of the light-transmitting layer away from the dark layer. The thickness of the protective layer is greater than 0 μm and less than or equal to 250 μm, and the light transmittance of the protective layer is greater than or equal to 80% and less than or equal to 95%.

[0018] Furthermore, the hardness of the protective layer is greater than that of the light-transmitting layer, and the hardness of the protective layer is greater than that of the dark layer.

[0019] Furthermore, the hardness of the protective layer is greater than or equal to 90HA.

[0020] This application also provides a display module, which includes a light-emitting module and an encapsulation layer disposed on the light-emitting module; the light-emitting module includes a substrate and a light-emitting device disposed on the substrate, and the encapsulation layer is formed of the aforementioned encapsulation material.

[0021] Furthermore, the flatness of the surface of the encapsulation layer on the side away from the light-emitting module is greater than or equal to 0 μm and less than or equal to 2.5 μm.

[0022] Furthermore, the encapsulation layer includes a transparent portion formed by a light-transmitting layer and a dark portion formed by a dark layer, wherein the weight of the dark portion located at the top of the light-emitting device in the encapsulation layer accounts for 0 to 40% of the total weight of the dark portion in the encapsulation layer.

[0023] This application also provides a packaging method, which uses the above-mentioned packaging material to package a display module; the packaging method specifically includes pressing the packaging material with the light-emitting module in a manner where a dark layer is close to the light-emitting device; during the pressing process, the pressing temperature is 30-65℃, the pressing pressure is 1-10 atm, and the pressing time is 30-120s; after pressing, the energy content is 400-6000mJ / cm³. 2 Light treatment at energy levels, followed by placement at 100–200°C for 15–90 minutes.

[0024] In this application, the softening point of the dark layer of the encapsulation material is lower than that of the light-transmitting layer, resulting in a difference in fluidity between the light-transmitting layer and the dark layer during hot pressing. That is, the dark layer has better fluidity and can more easily fill the gaps in the light-emitting device, while the light-transmitting layer can better maintain a higher flatness, which can improve the encapsulation effect and reliability of the encapsulation material. Attached Figure Description

[0025] Figure 1 This is a cross-sectional structural diagram of the display module in one embodiment of this application;

[0026] Figure 2 This is a cross-sectional structural diagram of the encapsulation material in one embodiment of this application;

[0027] Figure 3 This is a cross-sectional structural diagram of the display module in another embodiment of this application;

[0028] Figure 4 This is a cross-sectional structural diagram of the encapsulation material in another embodiment of this application;

[0029] Figure 5 This is a cross-sectional structural diagram of the display module in another embodiment of this application.

[0030] In the figure: display module 100, light-emitting module 11, substrate 111, light-emitting device 112, encapsulation layer 12, transparent part 121, dark part 122; encapsulation material 200, light-transmitting layer 21, dark layer 22, protective layer 23. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present invention, the technical solutions in specific embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0032] This application provides a method such as Figure 1The display module 100 shown includes a light-emitting module 11 and an encapsulation layer 12, with the encapsulation layer 12 disposed on one side of the light-emitting module 11. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. Specifically, the light-emitting device 112 can be a direct-view LED light-emitting device, and the substrate 111 can be a PCB board, with the light-emitting device 112 soldered onto the substrate. The encapsulation layer 12 is composed of... Figure 2 The encapsulation material 200 shown is fabricated from this material. The encapsulation material 200 includes a light-transmitting layer 21 and a dark layer 22, with the dark layer 22 disposed on one side of the light-transmitting layer 21. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22. The transparent portion 121 is disposed on one side of the light-emitting device 112, and can protect the light-emitting device 112 and the dark portion 122, improving the weather resistance of the light-emitting module 11 and the reliability of the encapsulation layer 12. The light-transmitting layer 21 has good light transmittance, ensuring that the formed transparent portion 121 also has good light transmittance, ensuring that the light emitted by the light-emitting device 112 can pass through the transparent portion 121. The dark layer 22 is disposed on one side of the light-transmitting layer 21, and can improve the contrast between light and dark of the light-emitting device 112, making the color of the light-emitting device 112 more vivid. That is, in the encapsulated display module 100, the dark layer 22 is basically disposed in the gap between adjacent light-emitting devices 112, ensuring that the light-emitting device 112 has a good light-emitting effect. In this encapsulation material 200, the softening point of the light-transmitting layer 21 is greater than that of the dark layer 22. The encapsulation material 200 is then hot-pressed onto the light-emitting module 11. The difference in softening points results in a difference in the flowability of the light-transmitting layer 21 and the dark layer 22 during hot pressing. The softening point of the light-transmitting layer 21 is greater than that of the dark layer 22, ensuring that the light-transmitting layer 21 has lower flowability and the dark layer 22 has higher flowability during hot pressing. During hot pressing, while maintaining a good structure, the dark layer 22 can flow better into the gaps of the light-emitting device 112, ensuring a clear boundary between the transparent portion 121 and the dark portion 122. The dark portion 122 is primarily located within the gaps of the light-emitting device 112.

[0033] As an optional implementation, in the encapsulation material 200, the difference between the softening point of the light-transmitting layer 21 and the softening point of the dark layer 22 is greater than or equal to 5°C, ensuring that the dark layer 22 can fully fill the gaps in the light-emitting device 112 during hot pressing. Preferably, the softening point of the light-transmitting layer 21 is greater than or equal to 25°C and less than or equal to 150°C; more preferably, the softening point of the light-transmitting layer 21 is 25°C to 100°C, 25°C to 90°C, or 25°C to 80°C. Preferably, the softening point of the dark layer 22 is greater than or equal to 25°C and less than or equal to 65°C; more preferably, the softening point of the dark layer 22 is 25°C to 60°C, 25°C to 55°C, 25°C to 50°C, or 25°C to 45°C. This makes the softening of the light-transmitting layer 21 and the dark layer 22 easier to control, and also prevents damage to the light-emitting device 112 due to excessively high temperatures during softening.

[0034] As an optional implementation, in the encapsulation material 200, the Lab value of the light-transmitting layer 21 has an L value of 65-80, an a value of -0.1--0.7, and a b value of 1.5-3, ensuring that the light-transmitting layer 21 has sufficient light transmittance to allow light of various colors to pass through. In the dark layer 22, the Lab value has an L value less than or equal to 70, preferably less than or equal to 50 or 40, an a value of -10-10, and a b value of -10-10. The dark layer 22 should have sufficient black value to improve contrast while covering the color of the substrate 111, making the color of the light-emitting device 112 more vivid.

[0035] As an optional implementation, the dark layer 22 in the encapsulation material 200 further includes inorganic pigments. The ratio between the thickness of the dark layer 22 and the particle size of the inorganic pigments is greater than or equal to 8.0 × 10⁻⁶. -4 And less than or equal to 3.0 × 10 -3 Inorganic pigments can improve the contrast between light and dark areas of the light-emitting device 112. The ratio between the thickness of the dark layer 22 and the particle size of the black pigment is greater than or equal to 8.0 × 10⁻⁶. -4 And less than or equal to 3.0 × 10 -3 This ensures that the black pigment is better dispersed in the dark layer 22, and that the surface roughness of the dark layer 22 is not too large due to the excessive particle size of the black pigment. This ensures that the formed dark part 122 has uniform color and better gloss, making the light-emitting device 112 more beautiful.

[0036] As an optional implementation, in the encapsulation material 200, the difference between the light transmittance of the dark layer 22 and the light transmittance of the light-transmitting layer 21 is greater than or equal to 70% and less than or equal to 90%. Light emitted by the light-emitting device 112 is emitted through the light-transmitting layer 21. The difference between the light transmittance of the dark layer 22 and the light transmittance of the light-transmitting layer 21 being greater than or equal to 70% and less than or equal to 90% can improve contrast, making the light from the display module 100 brighter.

[0037] As an optional implementation, in the encapsulation material 200, the light transmittance of the dark layer 22 is less than 5%, and the light transmittance of the light-transmitting layer 21 is greater than or equal to 80% and less than or equal to 95%. The light transmittance of the dark layer 22 being less than or equal to 5% ensures that after the dark portion 122 is formed, there will be no light crosstalk between adjacent light-emitting devices 112, thus improving the light-emitting effect of the light-emitting devices 112. The light transmittance of the light-transmitting layer 21 being greater than or equal to 80% and less than or equal to 95% ensures that the display module 100 has a high brightness.

[0038] As an optional implementation, in the encapsulation material 200, the haze of the light-transmitting layer 21 is 3% to 10%, and the gloss of the light-transmitting layer 21 is 10 to 70 GU, preferably 10-60 GU. Light emitted by the light-emitting device 112 is emitted through the light-transmitting layer 21. The haze of 3-10% in the light-transmitting layer 21 ensures that the light emitted through the light-transmitting layer is clear and not glaring, exhibiting good light uniformity and brightness. The gloss of the dark layer 22, with a gloss of 8-20 GU, can make the contrast between light and dark more pronounced and improve light uniformity.

[0039] As an optional implementation, in the encapsulation material 200, the thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:(0.2~0.6). During hot pressing, this ensures that the dark layer 22 can fully fill the gaps of the light-emitting device 112 under the compression of the light-transmitting layer 21, and ensures that the light emission intensity of the display module 100 is high and the light uniformity is good. Preferably, the thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:(0.3~0.5). Within this ratio range, the light-transmitting layer 21 has a smaller impact on the light emission intensity, the dark layer 22 fills more fully, and the light uniformity of the display module 100 is better.

[0040] As an optional implementation, in the encapsulation material 200, the thickness of the dark layer is greater than 0 μm and less than or equal to 70 μm, and the thickness of the light-transmitting layer is greater than 0 μm and less than or equal to 300 μm. Preferably, the thickness of the light-transmitting layer 21 is greater than or equal to 60 μm and less than or equal to 120 μm, and the thickness of the dark layer 22 is greater than or equal to 15 μm and less than or equal to 45 μm. The light-transmitting layer 21 needs to have sufficient thickness to ensure high adhesion and good encapsulation effect. If the light-transmitting layer 21 is too thick, its light transmittance will decrease, resulting in weak light emission intensity of the display module. The thickness of the dark layer 22 is greater than or equal to 15 μm and less than or equal to 45 μm, ensuring that the dark layer 22 can fully fill the gaps without obscuring the light-emitting device 112.

[0041] As an optional implementation method, such as Figure 4 As shown, the encapsulation material 200 also includes a protective layer 23, which is disposed on the side of the light-transmitting layer 21 away from the dark layer 22. Figure 5As shown, during encapsulation, a protective layer is placed on the outermost layer of the display module 100. The thickness of the protective layer 23 is greater than 0 μm and less than or equal to 250 μm. The protective layer 23 protects the light-emitting device 112, preventing it from being damaged by external impacts. The light transmittance of the protective layer 23 is greater than or equal to 80% and less than or equal to 95%, ensuring high light transmittance above the light-emitting device 112 and minimizing the impact of the protective layer 23 on the light emission intensity of the display module 100.

[0042] As an optional implementation, in the encapsulation material 200, the hardness of the protective layer 23 is greater than that of the light-transmitting layer 21, and the hardness of the protective layer 23 is greater than that of the dark layer 22. The protective layer 23 is located on the outermost layer of the display module 100. The fact that the hardness of the protective layer 23 is greater than that of the light-transmitting layer 21 and the dark layer 22 ensures that the protective layer 23 can effectively protect the other layers of the encapsulation material 200. Preferably, the hardness of the protective layer 23 is greater than or equal to 90HA, ensuring that the protective layer 23 has sufficient strength to withstand a certain degree of impact, thus improving the reliability of the encapsulation material 200.

[0043] As an optional implementation, the flatness of the surface of the encapsulation layer 12 away from the light-emitting module 11 is greater than or equal to 0 μm and less than or equal to 2.5 μm. In this embodiment, the side of the encapsulation layer 12 away from the light-emitting module 11 is a transparent portion 121 obtained by laminating the light-transmitting layer 21. Because the light-transmitting layer 21 has a high softening temperature, it can maintain a good shape and its original high flatness during the lamination process. The high flatness of the transparent portion 121 ensures that the light emitted by the light-emitting device 112 does not undergo significant deflection when passing through the encapsulation layer, thereby improving the light emission effect of the display module 100.

[0044] As an optional implementation, the ratio of the weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 to the total weight of the dark portion 122 in the encapsulation layer 12 is greater than or equal to 0 and less than or equal to 40%. Preferably, the ratio of the weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 to the total weight of the dark portion 122 in the encapsulation layer 12 is 0-35%, 0-30%, 0-25%, or 0-20%. In this embodiment, the dark portion 122 is formed by laminating the dark layer 22. During the lamination process, due to the high fluidity of the dark layer 22, it can better fill the gaps in the light-emitting device 112, leaving as little or no residue on the top surface of the light-emitting device 112 as possible. This ensures that the dark portion 122 does not obstruct the light-emitting device 112, and ensures that the display module 100 has a good light emission effect.

[0045] This application also provides a packaging method for a display module 100. First, a light-emitting device 112 is connected to a substrate 111 to assemble a light-emitting module 11. Then, a packaging material 200 is pressed onto the light-emitting module 11 with a dark layer 22 close to the light-emitting device 112. The pressing temperature is 30–65°C, the pressing pressure is 1–10 atm, and the pressing time is 30–120 s. After pressing, the output voltage is 400–6000 mJ / cm³. 2 The encapsulation material 200 is subjected to light irradiation under high energy. After light irradiation, it is placed at 100–200°C for 15–90 minutes to allow the encapsulation material 200 to form the encapsulation layer 12, thus completing the encapsulation. The dark layer 22 has high fluidity, and during hot pressing, the dark layer 22 can fill the gaps in the light-emitting device 112. The dark layer 22 and the light-transmitting layer 21 have low softening points and low pressing temperatures, which can prevent excessive temperature from damaging the light-emitting device 112. The encapsulation material 200 is formed into the encapsulation layer 12 through photothermal dual curing. Photocuring can give the encapsulation material 200 a certain strength and form a basic cured structure, ensuring that the structure of the encapsulation material 200 will not change significantly in the subsequent thermal curing stage. Based on photocuring, thermal curing can further cure the encapsulation material to complete the entire curing process. This photothermal dual curing method can ensure that the surface of the encapsulation layer 12 has a high degree of flatness.

[0046] The present application will be further described below with reference to the embodiments, but the scope of protection of the present application is not limited to the embodiments.

[0047] Example 1

[0048] like Figure 1 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0049] Specifically, the thickness of the light-transmitting layer 21 is 80 μm, and its softening point is 58℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 30 μm, and its softening point is 35℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.375, and the difference between the softening points of the light-transmitting layer and the dark layer is 23℃. The particle size of the black inorganic pigment is 0.03 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(1.0×10⁻⁶). -3 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 15% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0050] The packaging method for the above-mentioned display module 100 is as follows: The light-emitting device 112 is connected to the substrate 111 to assemble a light-emitting module 11. Then, the encapsulation material 200, with a dark layer 22 close to the light-emitting device 112, is pressed onto the light-emitting module 11. The pressing temperature is 40°C, the pressing pressure is 8 atm, and the pressing time is 60 seconds. After pressing, the temperature is 1000 mJ / cm². 2 The material is treated with light under high energy, and then placed at 100°C for 60 minutes to allow the encapsulation material 200 to be photothermally cured to form the encapsulation layer 12, thus completing the encapsulation process.

[0051] Example 2

[0052] like Figure 3 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 4 The encapsulation material 200 shown is prepared from the encapsulation material 200. The encapsulation material 200 sequentially includes a protective layer 23, a light-transmitting layer 21, and a dark layer 22. For example... Figure 5 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0053] Specifically, the protective layer 23 has a thickness of 50 μm, a light transmittance of 93.54%, and a hardness of 3HA. The light-transmitting layer 21 has a thickness of 80 μm and a softening point of 67℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 30 μm, and a softening point of 38℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.375, and the difference between the softening points of the light-transmitting layer and the dark layer is 29℃. The particle size of the black inorganic pigment is 0.03 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(1.0×10⁻⁶).-3 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 18% of the total weight of the dark portion 122 in the encapsulation layer 12. The encapsulation method of the above-described display module 100 is as follows: the light-emitting device 112 is connected to the substrate 111 to assemble a light-emitting module 11. Then, the encapsulation material 200 is pressed against the light-emitting module 11 with the dark layer 22 close to the light-emitting device 112. The pressing temperature is 40°C, the pressing pressure is 10 atm, the pressing time is 90 s, and the final pressure is 1200 mJ / cm². 2 The material is treated with light under high energy, and then placed at 120°C for 90 minutes to allow the encapsulation material 200 to be photothermally cured to form the encapsulation layer 12, thus completing the encapsulation process.

[0054] Example 3

[0055] Except for the following technical features, everything else is the same as in Example 1.

[0056] The softening point of the light-transmitting layer 21 is adjusted to 134°C, the softening point of the dark layer 22 is adjusted to 62°C, the difference between the softening point of the light-transmitting layer and the softening point of the dark layer is adjusted to 72°C, and the weight of the dark part 122 located at the top of the light-emitting device 112 in the encapsulation layer 12 accounts for 11% of the total weight of the dark part 122 in the encapsulation layer 12.

[0057] Example 4

[0058] Except for the following technical features, everything else is the same as in Example 1.

[0059] The softening point of the light-transmitting layer 21 is adjusted to 35°C, the softening point of the dark layer 22 is adjusted to 27°C, the difference between the softening point of the light-transmitting layer and the softening point of the dark layer is adjusted to 8°C, and the weight of the dark part 122 located at the top of the light-emitting device 112 in the encapsulation layer 12 accounts for 20% of the total weight of the dark part 122 in the encapsulation layer 12.

[0060] Example 5

[0061] Except for the following technical features, everything else is the same as in Example 1.

[0062] The softening point of the light-transmitting layer 21 is adjusted to 54°C, the softening point of the dark layer 22 is adjusted to 46°C, the difference between the softening point of the light-transmitting layer and the softening point of the dark layer is adjusted to 9°C, and the weight of the dark part 122 located at the top of the light-emitting device 112 in the encapsulation layer 12 accounts for 21% of the total weight of the dark part 122 in the encapsulation layer 12.

[0063] Example 6

[0064] like Figure 1As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0065] Specifically, the thickness of the light-transmitting layer 21 is 70 μm, and its softening point is 63℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 45 μm, and its softening point is also 43℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.6, and the difference between their softening points is 20℃. The particle size of the black inorganic pigment is 0.04 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(8.9 × 10⁻⁶). -4 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 29% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0066] The packaging method of the above-mentioned display module 100 is the same as that in Embodiment 1.

[0067] Example 7

[0068] like Figure 1 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0069] Specifically, the thickness of the light-transmitting layer 21 is 120 μm, and its softening point is 54℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 24 μm, and its softening point is 39℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.2, and the difference between the softening points of the light-transmitting layer and the dark layer is 15℃. The particle size of the black inorganic pigment is 0.03 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(1.25×10⁻⁶). -3 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 23% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0070] The packaging method of the above-mentioned display module 100 is the same as that in Embodiment 1.

[0071] Example 8

[0072] like Figure 1 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0073] Specifically, the thickness of the light-transmitting layer 21 is 300 μm, and its softening point is 69℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 70 μm, and its softening point is 46℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.23, and the difference between the softening points of the light-transmitting layer and the dark layer is 23℃. The particle size of the black inorganic pigment is 0.06 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(8.57×10⁻⁶). -4 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 17% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0074] The packaging method of the above-mentioned display module 100 is the same as that in Embodiment 1.

[0075] Example 9

[0076] like Figure 1As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0077] Specifically, the thickness of the light-transmitting layer 21 is 90 μm, and its softening point is 58℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 38 μm, and its softening point is 39℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.42, and the difference between the softening points of the light-transmitting layer and the dark layer is 19℃. The particle size of the black inorganic pigment is 0.03 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(8.0 × 10⁻⁶). -4 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 24% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0078] The packaging method of the above-mentioned display module 100 is the same as that in Embodiment 1.

[0079] Example 10

[0080] like Figure 1 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0081] Specifically, the thickness of the light-transmitting layer 21 is 80 μm, and its softening point is 65℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 17 μm, and its softening point is 38℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.21, and the difference between the softening points of the light-transmitting layer and the dark layer is 27℃. The particle size of the black inorganic pigment is 0.05 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(3.0 × 10⁻⁶). -3 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 14% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0082] The packaging method of the above-mentioned display module 100 is the same as that in Embodiment 1.

[0083] Example 11

[0084] like Figure 1 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0085] Specifically, the thickness of the light-transmitting layer 21 is 350 μm, and its softening point is 62℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 70 μm, and its softening point is 45℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.2, and the difference between the softening points of the light-transmitting layer and the dark layer is 17℃. The particle size of the black inorganic pigment is 0.06 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(8.57×10⁻⁶). -4 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 22% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0086] The packaging method of the above-mentioned display module 100 is the same as that in Embodiment 1.

[0087] Example 12

[0088] like Figure 1As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0089] Specifically, the thickness of the light-transmitting layer 21 is 130 μm, and its softening point is 96℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 40 μm, and its softening point is 37℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.31, and the difference between the softening points of the light-transmitting layer and the dark layer is 61℃. The particle size of the black inorganic pigment is 0.004 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(1.0×10⁻⁶). -4 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 25% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0090] The packaging method of the above-mentioned display module 100 is the same as that in Embodiment 1.

[0091] Example 13

[0092] like Figure 1 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 is a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11, and the encapsulation layer 12 is made of a material such as... Figure 2 The encapsulation material 200 shown is prepared from the material shown. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22. For example... Figure 3 As shown, the encapsulation layer 12 includes a transparent portion 121 formed by the light-transmitting layer 21 and a dark portion 122 formed by the dark layer 22.

[0093] Specifically, the thickness of the light-transmitting layer 21 is 100 μm, and its softening point is 64℃. The dark layer 22 comprises epoxy resin and black inorganic pigment, has a thickness of 35 μm, and its softening point is 43℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.35, and the difference between the softening points of the light-transmitting layer and the dark layer is 21℃. The particle size of the black inorganic pigment is 0.14 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(4.0×10⁻⁶). -3 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 18% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0094] The packaging method of the above-mentioned display module 100 is the same as that in Embodiment 1.

[0095] Comparative Example 1

[0096] like Figure 1 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 includes a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11. Figure 5 As shown, the encapsulation layer 12 is composed of an encapsulation material 200 for encapsulating a direct-view LED light-emitting device. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22.

[0097] Specifically, the light-transmitting layer 21 is a semi-transparent matte film with a thickness of 80 μm and a softening point of 62℃. The dark layer 22 is formed by curing an adhesive containing black inorganic pigment, with a thickness of 30 μm and a softening point of 34℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.375, and the difference between the softening points of the light-transmitting layer and the dark layer is 28℃. The particle size of the black inorganic pigment is 0.03 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(1.0×10⁻⁶). -3 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 20% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0098] The packaging method of the above-mentioned display module 100 is as follows: A light-emitting device 112 is connected to a substrate 111. Adhesive containing black pigment is injected into the gaps of the light-emitting device 112 through a needle, and after heating and curing, a dark layer 22 is formed. The dark layer 22 is then cut, ground, and polished. A translucent matte film is then bonded to the dark layer 22 and the light-emitting device 112 using a transparent adhesive.

[0099] Comparative Example 2

[0100] like Figure 1 As shown, a display module 100 includes a light-emitting module 11 and an encapsulation layer 12. The light-emitting module 11 includes a substrate 111 and a light-emitting device 112, wherein the light-emitting device 112 is disposed on the substrate 111. The light-emitting device 112 includes a direct-view LED light-emitting device. The encapsulation layer 12 is disposed on one side of the light-emitting module 11. Figure 5 As shown, the encapsulation layer 12 is composed of an encapsulation material 200 for encapsulating a direct-view LED light-emitting device. The encapsulation material 200 sequentially includes a light-transmitting layer 21 and a dark layer 22.

[0101] Specifically, the light-transmitting layer 21 is a semi-transparent matte film with a thickness of 80 μm and a softening point of 67℃. The dark layer 22 is formed by melting and re-curing a solid adhesive containing black inorganic pigment, resulting in a thickness of 30 μm and a softening point of 38℃. The thickness ratio of the light-transmitting layer 21 to the dark layer 22 is 1:0.375, and the difference between the softening points of the light-transmitting layer and the dark layer is 29℃. The particle size of the black inorganic pigment is 0.03 μm, and the ratio between the thickness of the dark layer 22 and the particle size of the black inorganic pigment is 1:(1.0×10⁻⁶). -3 The weight of the dark portion 122 located on top of the light-emitting device 112 in the encapsulation layer 12 accounts for 15% of the total weight of the dark portion 122 in the encapsulation layer 12.

[0102] The packaging method of the above-mentioned display module 100 is as follows: A light-emitting device 112 is connected to a substrate 111. A solid adhesive containing black pigment is filled into the gaps of the light-emitting device 112. High-temperature pressing is then performed to allow the black pigment solid adhesive to flow again and finally cure. Finally, the light-transmitting layer 21 is pressed onto the dark layer 22 and the light-emitting device 112.

[0103] Comparative Example 3

[0104] Except for the following technical features, everything else is the same as in Example 1.

[0105] The softening point of the light-transmitting layer 21 is adjusted to 32°C, the softening point of the dark layer 22 is adjusted to 32°C, the difference between the softening point of the light-transmitting layer and the softening point of the dark layer is adjusted to 0°C, and the weight of the dark part 122 located at the top of the light-emitting device 112 in the encapsulation layer 12 accounts for 42% of the total weight of the dark part 122 in the encapsulation layer 12.

[0106] I. Performance Testing:

[0107] The performance of the light-emitting device packaging material 100 in the above embodiments and comparative examples was tested.

[0108] 1. Color value test: Using a spectrophotometer (Konica-Minolta CM-26d), with a color temperature light source of 6500K and a 10° viewing window, five points were randomly selected on the surface of the test sample to measure the L value. * a * b * The values ​​are averaged.

[0109] 2. Haze test: The test method refers to standard GB / T 2410-2008, and the haze of the film in the visible light band is determined by ultraviolet-visible spectrophotometer.

[0110] 3. Gloss test: The gloss value of the sample under test was measured using a gloss meter (model: BGD-516 / 3; BGD Corporation) according to ASTM D523 method.

[0111] 4. Peel strength test: The test method refers to standard GB / T2790 "Adhesives - 180° Peel Strength Test Method - Flexible Materials vs. Rigid Materials". Specimen size: 100mm*10mm; Tensile speed: 100mm / min.

[0112] 5. Transmittance test: Using a spectrophotometer (Color Spectrum CS-700), under the conditions of 6500K color temperature and 10° viewing window, 5 points were randomly selected on the surface of the test sample, and the transmittance at each point was measured. The average value of the results was taken.

[0113] 6. Flatness test: Use the FPACT-HION optical surface flatness measuring instrument to measure and record the difference between the maximum and minimum thickness values ​​at 10 evenly selected points on the surface of the test sample.

[0114] 7. Light uniformity test: Using a lux meter (Konica-Minolta T-10A), select 20 points evenly on the surface of the test sample, measure the illuminance, and calculate the ratio of minimum illuminance to average illuminance.

[0115] 8. Softening point test: The test method refers to the standard GB-T1633-2000 "Determination of Vicat softening temperature (VST) of thermoplastic plastics".

[0116] 9. Pigment particle size test: The median particle size D50 was determined using a laser diffraction particle size distribution measuring device (Nikkiso Microtrac MT3300EX).

[0117] II. Performance Test Results:

[0118] The performance test results of the encapsulating films in the above embodiments and comparative examples are shown in Tables 1, 2 and 3.

[0119] Table 1: Test results of color values ​​in Examples 1-13 and Comparative Examples 1-3

[0120]

[0121]

[0122] Table 2: Performance test results of Examples 1-13 and Comparative Examples 1-3

[0123]

[0124] Table 3: Test results of other performance characteristics in Examples 1-13 and Comparative Examples 1-3

[0125]

[0126]

[0127] As shown in Table 1 above, the light-transmitting layer and the dark layer of the encapsulation material in Examples 1-13 all reach the target Lab value, which can ensure that the light-transmitting layer can transmit light without having too much impact on the color of the light, and the dark part can also improve the contrast well.

[0128] As shown in Table 2 above, the haze of the light-transmitting layer of the encapsulation material in Examples 1-13 is between 3% and 10%, and the gloss of the light-transmitting layer is between 10 and 70 GU, ensuring that the light passing through the light-transmitting layer is clear and not glaring. The gloss of the dark layer of the encapsulation material in Examples 1-13 is between 8 and 20 GU, which can effectively improve the contrast. In the preferred embodiments, the gloss of the dark layer is less than or equal to 10 GU, which can make the light of the display module softer and the picture quality more advanced. In Examples 1-13, the peel strength between the light-transmitting layer and the dark layer is high, ensuring that the light-transmitting layer and the dark layer will not separate during long-term use, thus improving the reliability of the encapsulation material; the peel strength between the encapsulation layer and the light-emitting module is also high, ensuring the reliability of the encapsulation.

[0129] As shown in Table 3 above, the difference between the transmittance of the dark layer and the transmittance of the light layer in Examples 1-13 is greater than or equal to 70% and less than or equal to 90%, ensuring that the light from the display module is brighter. Examples 1-13 all exhibit good flatness and light uniformity, ensuring a good encapsulation effect for the display module. Comparing Comparative Examples 1 and 2 with Example 1, it can be seen that when the difference between the softening point of the light layer and the softening point of the dark layer is greater than or equal to 5°C, the dark areas formed by different encapsulation methods also have good flatness, and the encapsulated display modules also have good light uniformity. However, with the same parameters for each layer, the display module encapsulated through dual photothermal treatment in Example 1 has better flatness, ensuring better light emission from the light-emitting device. The flatness of the dark areas in Examples 1-13 is also superior to that in Comparative Examples 1 and 2. As can be seen from the comparison between Examples 1-13 and Comparative Example 3, since the softening points of the light-transmitting layer and the dark layer are the same in Comparative Example 3, the dark layer cannot completely fill the gaps between the light-emitting devices during lamination, resulting in too much dark part at the top of the light-emitting device, which leads to lower flatness and light uniformity. The difference between the softening points of the light-transmitting layer and the dark layer is greater than or equal to 5°C, which can significantly improve the flatness of the encapsulation material and the light uniformity of the display module.

[0130] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A packaging material for a light-emitting device, characterized in that, include: Translucent layer; A dark layer is disposed on one side of the light-transmitting layer; The softening point of the light-transmitting layer is greater than that of the dark layer, the difference between the softening point of the light-transmitting layer and the softening point of the dark layer is greater than or equal to 5°C, and the softening point of the dark layer is greater than or equal to 25°C and less than or equal to 60°C. The encapsulation material is pressed at a temperature greater than or equal to 30°C and less than or equal to 65°C during encapsulation, and the encapsulation material is a photothermal dual-curing material.

2. The encapsulation material according to claim 1, characterized in that: The softening point of the light-transmitting layer is greater than or equal to 25°C and less than or equal to 150°C.

3. The encapsulation material according to claim 1, characterized in that: In the Lab value of the light-transmitting layer, the L value is 65~80, the a value is -0.1~-0.7, and the b value is 1.5~3; In the Lab value of the dark layer, the L value is less than or equal to 70, the a value is -10 to 10, and the b value is -10 to 10.

4. The encapsulation material according to claim 1, characterized in that: The dark layer comprises inorganic pigments, wherein the ratio of the particle size of the inorganic pigments to the thickness of the dark layer is greater than or equal to 8.0 × 10⁻⁶. -4 And less than or equal to 3.0 × 10 -3 .

5. The encapsulation material according to claim 1, characterized in that: The difference between the light transmittance of the dark layer and the light transmittance of the light-transmitting layer is greater than or equal to 70% and less than or equal to 90%.

6. The encapsulation material according to claim 1, characterized in that: The light transmittance of the dark layer is less than 5%, and the light transmittance of the light-transmitting layer is greater than or equal to 80% and less than or equal to 95%.

7. The encapsulation material according to claim 1, characterized in that: The haze of the light-transmitting layer is 3%~10%, the gloss of the light-transmitting layer is 10-70 GU, and the gloss of the dark layer is 8-20 GU.

8. The encapsulation material according to claim 1, characterized in that: The ratio of the thickness of the dark layer to the thickness of the light-transmitting layer is greater than or equal to 0.2 and less than or equal to 0.

6.

9. The encapsulation material according to claim 1, characterized in that: The thickness of the dark layer is greater than 0 μm and less than or equal to 70 μm, and the thickness of the light-transmitting layer is greater than 0 μm and less than or equal to 300 μm.

10. The encapsulation material according to claim 1, characterized in that: The encapsulation material further includes a protective layer disposed on the side of the light-transmitting layer away from the dark layer. The thickness of the protective layer is greater than 0 μm and less than or equal to 250 μm, and the light transmittance of the protective layer is greater than or equal to 80% and less than or equal to 95%.

11. The encapsulation material according to claim 10, characterized in that: The hardness of the protective layer is greater than that of the light-transmitting layer, and the hardness of the protective layer is greater than that of the dark layer.

12. The encapsulation material according to claim 10, characterized in that: The hardness of the protective layer is greater than or equal to 90HA.

13. A display module, characterized in that: The display module includes a light-emitting module and an encapsulation layer disposed on the light-emitting module; The light-emitting module includes a substrate and a light-emitting device disposed on the substrate, and the encapsulation layer is formed of the encapsulation material as described in any one of claims 1 to 12.

14. The display module according to claim 13, characterized in that: The flatness of the surface of the encapsulation layer on the side away from the light-emitting module is greater than or equal to 0 μm and less than or equal to 2.5 μm.

15. The display module according to claim 14, characterized in that: The encapsulation layer includes a transparent portion formed by the light-transmitting layer and a dark portion formed by the dark layer. The weight of the dark portion located at the top of the light-emitting device in the encapsulation layer accounts for 0 to 40% of the total weight of the dark portion in the encapsulation layer.

16. A packaging method, characterized in that: The encapsulation method uses the encapsulation material described in any one of claims 1 to 12 to encapsulate the display module described in any one of claims 13 to 15; The encapsulation method specifically includes pressing the encapsulation material with the light-emitting module in such a way that the dark layer is close to the light-emitting device; In the pressing process, the pressing temperature is 30~65℃, the pressing pressure is 1~10 atm, and the pressing time is 30~120s; after pressing, the energy content is 400~6000mJ / cm³. 2 Light treatment at energy levels, followed by placement at 100-200℃ for 15-90 minutes.

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