A chiller system combining semiconductor TEC and compressor

Abstract

This invention discloses a chiller system combining a semiconductor TEC (Cooling Technology) and a compressor, comprising a semiconductor TEC assembly and a second heat exchanger. The semiconductor TEC assembly includes a TEC cooling chip, with a first heat-conducting plate on one side and a second heat-conducting plate on the other side. The refrigerant passage of the second heat exchanger serves as a first refrigeration branch connected to the main refrigeration cycle, and the first heat-conducting plate, connected in series with a first solenoid valve, serves as a second refrigeration branch connected to the main refrigeration cycle. The water passage of the second heat exchanger and the second heat-conducting plate are respectively connected to a water circulation system for refrigeration. A first water temperature sensor is installed at the outlet of the water passage, and a second water temperature sensor is installed at the outlet of the second heat-conducting plate. This invention employs a two-stage refrigeration method combining compressor refrigeration and a semiconductor TEC cooling chip, selecting different refrigeration methods according to different chilled water preparation temperatures, resulting in rapid cooling and high refrigeration efficiency; simultaneously, no additional defrosting device is required.

Description

Technical Field

[0001] This invention relates to the field of chiller technology, and in particular to a chiller system that combines a semiconductor TEC and a compressor. Background Technology

[0002] Industrial chillers are widely used in various industrial refrigeration processes that require chilled water, such as semiconductors, chemicals, electronics, pharmaceuticals, and food processing. Currently, most chiller units on the market operate using a single compressor for refrigeration. When the required chilled water temperature range is large, especially when the required chilled water temperature is low, the actual cooling capacity of the internal compressor is small, the power consumption is high, the cooling speed is slow, the refrigeration efficiency is low, and the power resources are wasted. Moreover, when producing low-temperature chilled water, the refrigeration system needs to be defrosted regularly, and the defrosting process requires an additional defrosting device.

[0003] A chiller unit disclosed in Chinese patent literature, publication number CN216080455U, published on March 18, 2022, includes: a shell, a heat exchanger, a compressor, a condenser, a throttling element, and connecting pipes. The heat exchanger forms a first heat exchange flow path and a second heat exchange flow path. The first heat exchange flow path, compressor, condenser, and throttling element are connected end-to-end via connecting pipes to form a closed-loop refrigerant flow path. The second heat exchange flow path is connected to an external cooling pipe. This technology uses the principle of compression refrigeration to cool the coolant flowing in from the external cooling pipe. The compressor has a reliable structure and a long service life. However, this technology still uses a single compressor for refrigeration. When the required chilled water temperature is low, the actual cooling capacity of the compressor is small, the cooling is slow, and the power consumption is high; furthermore, a defrosting device is still required for defrosting. Summary of the Invention

[0004] This invention aims to overcome the problems of existing water chiller units, which operate using a single compressor for refrigeration. When the required chilled water temperature is low, the compressor has a small cooling capacity, slow cooling speed, and low refrigeration efficiency. The invention provides a water chiller system that combines a semiconductor TEC (thermal energy storage device) and a compressor. It employs a two-stage refrigeration method combining compressor refrigeration and a semiconductor TEC refrigeration chip. Different refrigeration methods are selected according to different chilled water preparation temperatures, resulting in rapid cooling and high refrigeration efficiency. Furthermore, it eliminates the need for an additional defrosting device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A chiller system combining a semiconductor TEC and a compressor includes a semiconductor TEC assembly and a second heat exchanger. The semiconductor TEC assembly includes a TEC cooling chip, one side of which is provided with a first heat-conducting plate, and the other side with a second heat-conducting plate. The refrigerant passage of the second heat exchanger serves as a first refrigeration branch connected to the main refrigeration cycle, and the first heat-conducting plate is connected in series with a first solenoid valve as a second refrigeration branch connected to the main refrigeration cycle. The water passage of the second heat exchanger and the second heat-conducting plate are respectively connected to a water circulation system for refrigeration.

[0007] This invention employs a two-stage refrigeration system combining a semiconductor TEC (Thermal Design Technology) refrigeration chip and a compressor. This system offers high temperature control accuracy and stability, and the semiconductor TEC refrigeration chip compensates for the slow cooling and low efficiency of compressors when preparing chilled water at lower temperatures. The chiller system comprises two circulation systems: a first refrigeration circulation system, including a main refrigeration circuit, a first refrigeration branch circuit, and a second refrigeration branch circuit, with all components connected by welded copper pipes, and the circulating medium being an environmentally friendly refrigerant; and a second water circulation system, with all components connected by water pipes, and the circulating medium being a low-temperature resistant aqueous solution, the degree of which is determined by the chiller's minimum refrigeration temperature. Furthermore, defrosting can be completed solely through the forward and reverse current conduction of the TEC refrigeration chip, eliminating the need for an additional defrosting device.

[0008] Preferably, the main refrigeration cycle includes a compressor, the outlet of which is connected to port b of a four-way reversing valve, and the inlet of which is connected to port d of the four-way reversing valve; port a of the four-way reversing valve is connected to one end of an electronic expansion valve through a first heat exchange component; the other end of the electronic expansion valve is connected to one end of a refrigerant passage and a first solenoid valve, respectively, and port c of the four-way reversing valve is connected to the other end of the refrigerant passage and a first heat-conducting plate, respectively.

[0009] In this invention, the first heat exchange component includes a first heat exchanger and a fan. The chiller also includes a control module that can control the conduction direction of the four-way reversing valve and the current direction of the TEC cooling chip to determine whether the chiller is cooling water or producing hot water. It can also control the specific opening degree of the electronic expansion valve based on the detection data of the first water temperature sensor to control the dryness of the refrigerant after throttling, thereby controlling the heat exchange efficiency at the second heat exchanger and the first heat conduction plate.

[0010] Preferably, the water circulation system includes a water tank, the outlet of which is connected to the inlet of a water passage via a water pump; the outlet of the water passage is connected to one end of a load via a third solenoid valve; the outlet of the water passage is also connected to the inlet of a second heat-conducting plate via a second solenoid valve, and the outlet of the second heat-conducting plate is connected to one end of the load via a fourth solenoid valve; the other end of the load is connected to the inlet of the water tank; a first water temperature sensor is installed at the outlet of the water passage, and a second water temperature sensor is installed at the outlet of the second heat-conducting plate.

[0011] In this invention, the load is the cooling or heating point in the water circulation system. When cooling is required, the cooled water flows through the heat source load to be cooled and then returns to the water tank to recirculate the water. When heating is required, the heated water flows through the cold source load to be heated and then returns to the water tank to recirculate the water. The second, third, and fourth solenoid valves control the water flow direction of the water circulation system by closing and opening. The opening and closing of the solenoid valves can be controlled by the control module according to the temperature of the water that needs to be cooled or heated.

[0012] Preferably, the outlet of the water pump is also connected to one end of the fifth solenoid valve, and the other end of the fifth solenoid valve is connected between the outlet of the water passage and the first water temperature sensor.

[0013] In this invention, the first water temperature sensor is used to detect the temperature of the water flowing out of the water passage, and the second water temperature sensor is used to detect the temperature of the water flowing out of the second heat-conducting plate. Based on the temperature values ​​detected by the water temperature sensors, the control module can adjust the opening of the electronic expansion valve and the current flowing through the TEC cooling chip to control the precise temperature of the final water production. The connected fifth solenoid valve allows the circulating water in the water circulation system to circulate directly between the water tank and the second heat-conducting plate.

[0014] Preferably, when producing chilled water with a temperature range of [tb, tc], the main refrigeration cycle circuit and the first refrigeration branch circuit are connected, the refrigerant in the refrigerant passage absorbs heat, the second and fourth solenoid valves are closed, and the third solenoid valve is opened; tb is the economic refrigeration temperature of the compressor, and tc is the upper limit temperature of the chilled water.

[0015] In this invention, the compressor's economic cooling temperature is only at a certain sub-zero temperature when the compressor's cooling capacity and energy consumption are balanced. When the required cooling water temperature is lower than this temperature, the compressor's energy consumption increases but its cooling efficiency decreases. At this time, the shortcomings of compressor cooling can be solved by using TEC cooling plates. The upper limit temperature of the chilled water is determined according to the actual ambient temperature, usually 25 degrees Celsius. When preparing higher temperature chilled water, only the compressor is needed for cooling, and the water circulation system only flows through the second heat exchanger.

[0016] Preferably, when producing chilled water with a temperature range of [ta, tb], the first and second refrigeration branches are simultaneously connected to the main refrigeration cycle. The refrigerant in the refrigerant passage absorbs heat, and the side of the TEC cooling chip closest to the second heat-conducting plate is cooled. The second and fourth solenoid valves are opened, and the third solenoid valve is closed. ta is the minimum cooling temperature of the TEC cooling chip, and tb is the economic cooling temperature of the compressor.

[0017] In this invention, the minimum cooling temperature of the TEC cooling chip is determined according to the different models of the cooling chip, and different minimum cooling temperatures can be selected as needed. When preparing low-temperature chilled water, the cooling efficiency of the compressor alone is low. At this time, the compressor and the TEC cooling chip are used simultaneously for secondary cooling. The water in the water tank first undergoes preliminary cooling through the second heat exchanger, and then flows through the second heat conduction plate for further cooling through the TEC cooling chip, thereby generating low-temperature chilled water to cool the load. This cooling method is suitable for situations where the water temperature in the water circulation system is higher than the economic cooling temperature when the chiller starts to cool, and it can cool more quickly.

[0018] Preferably, when producing chilled water with a temperature range of [ta, tb], the second refrigeration branch is connected to the main refrigeration cycle, the side of the TEC cooling chip closest to the second heat-conducting plate is refrigerated, the second, fourth, and fifth solenoid valves are opened, and the third solenoid valve is closed; ta is the minimum refrigeration temperature of the TEC cooling chip, and tb is the economic refrigeration temperature of the compressor.

[0019] In this invention, the on / off state of the solenoid valve can also be used to cool down the water circulation system through the TEC cooling chip. This cooling method is suitable when the water temperature in the water circulation system is lower than the economic cooling temperature after the chiller has been cooling for a period of time. In this case, the compressor is not required and the cooling can be achieved directly through the TEC cooling chip, which is more efficient and has more precise temperature control.

[0020] Preferably, when producing hot water in the temperature range of [td, te], the first refrigeration branch is connected to the refrigeration cycle branch, the refrigerant in the refrigerant passage condenses and releases heat, the second and fourth solenoid valves are closed, and the third solenoid valve is opened; td is the lower limit temperature of hot water, and te is the economic heating temperature of the compressor.

[0021] In this invention, the lower limit temperature of hot water can be determined according to the actual ambient temperature, and 35 degrees Celsius is selected under normal circumstances; the definition of the economic heating temperature of the compressor is similar to that of the economic cooling temperature of the compressor; when producing hot water at a lower temperature, it is only necessary to select the compressor mode for heating, that is, the water circulation system only passes through the second heat exchanger.

[0022] Preferably, when producing hot water in the temperature range of [te, tf], the first and second refrigeration branches are simultaneously connected to the main refrigeration cycle. The refrigerant in the refrigerant passage condenses and releases heat, and the side of the TEC cooling chip closest to the first heat-conducting plate is cooled. The second and fourth solenoid valves are opened, and the third solenoid valve is closed. te is the economic heating temperature of the compressor, and tf is the maximum heating temperature of the TEC cooling chip.

[0023] In this invention, the highest heating temperature of the TEC cooling chip is the highest temperature that its hot surface can heat. The appropriate TEC cooling chip can be selected according to actual needs. When producing hot water at a higher temperature, the heating methods of the compressor and the TEC cooling chip can be combined to improve the efficiency of hot water production. The water in the tank is first preheated by the second heat exchanger and then further heated by the second heat conduction plate to generate high-temperature hot water to heat the load.

[0024] This invention has the following advantages: it employs a two-stage refrigeration method combining compressor refrigeration and semiconductor TEC cooling chips, selecting different refrigeration methods according to different cold water preparation temperatures, resulting in rapid cooling and high refrigeration efficiency, while also achieving high-efficiency hot water preparation; defrosting is achieved simply by applying forward and reverse currents to the TEC cooling chips to alternate between the cold and hot sides, eliminating the need for an additional defrosting device; frequent compressor starts and stops are not required during refrigeration or heating operations, extending the compressor's lifespan; and cold and hot water can be produced in segments according to temperature, allowing for rapid and precise temperature control as needed. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the chiller that combines a semiconductor TEC and a compressor according to the present invention;

[0026] Figure 2 This is a schematic diagram of the chiller mechanism for chilling water according to Embodiment 1 of the present invention;

[0027] Figure 3 This is a schematic diagram of the chiller mechanism for chilling water in Embodiment 2 of the present invention;

[0028] Figure 4 This is a schematic diagram of the chiller mechanism for chilling water in Embodiment 3 of the present invention;

[0029] Figure 5 This is a schematic diagram of the cold water mechanism for hot water in Embodiment 4 of the present invention;

[0030] Figure 6 This is a schematic diagram of the cold water mechanism for hot water in Embodiment 5 of the present invention;

[0031] In the diagram: 1. Compressor; 2. Four-way reversing valve; 3. First heat exchanger; 4. Fan; 5. Electronic expansion valve; 6. Second heat exchanger; 7. First solenoid valve; 8. First heat conduction plate; 9. Insulation material; 10. TEC cooling chip; 11. Thermal grease; 12. Second heat conduction plate; 13. Second solenoid valve; 14. Third solenoid valve; 15. Load; 16. Liquid level switch; 17. Water tank; 18. Water pump; 19. Discharge pressure sensor; 20. Discharge temperature sensor; 21. Suction pressure sensor; 22. Suction temperature sensor; 23. First water temperature sensor; 24. Second water temperature sensor; 25. Fourth solenoid valve; 26. Fifth solenoid valve; 61. Refrigerant passage; 62. Water passage. Detailed Implementation

[0032] The present invention will now be further described with reference to the accompanying drawings and specific embodiments.

[0033] like Figure 1 As shown, a chiller system combining a semiconductor TEC and a compressor includes a semiconductor TEC assembly and a second heat exchanger 6. The semiconductor TEC assembly includes a TEC cooling chip 10, with a first heat-conducting plate 8 on one side and a second heat-conducting plate 12 on the other side. The TEC cooling chip 10 is fixed between the first heat-conducting plate 8 and the second heat-conducting plate 12 by a heat-insulating material 9, and both sides of the TEC cooling chip 10 are covered with thermally conductive silicone grease 11. The refrigerant passage 61 of the second heat exchanger 6 serves as a first refrigeration branch connected to the main refrigeration cycle, and the first heat-conducting plate 8 and a first solenoid valve 7 are connected in series as a second refrigeration branch connected to the main refrigeration cycle. The water passage 62 of the second heat exchanger 6 and the second heat-conducting plate 12 are respectively connected to a water circulation system for refrigeration. A first water temperature sensor 23 is installed at the outlet of the water passage 62, and a second water temperature sensor 24 is installed at the outlet of the second heat-conducting plate 12.

[0034] The main circuit of the refrigeration cycle includes compressor 1. The outlet of compressor 1 is connected to port b of four-way reversing valve 2, and the inlet of compressor 1 is connected to port d of four-way reversing valve 2. Ports b and d of four-way reversing valve 2 are opposite to each other. An exhaust pressure sensor 19 and an exhaust temperature sensor 20 are installed at the outlet of compressor 1, and an intake pressure sensor 21 and an intake temperature sensor 22 are installed at the inlet of compressor 1.

[0035] Port a of the four-way reversing valve 2 is connected to one end of the electronic expansion valve 5 through the first heat exchange component, which includes the first heat exchanger 3 and the fan 4; the other end of the electronic expansion valve 5 is connected to one end of the refrigerant passage 61 and the first solenoid valve 7, respectively; and port c of the four-way reversing valve 2 is connected to the other end of the refrigerant passage 61 and the first heat-conducting plate 8, respectively.

[0036] The water circulation system includes a water tank 17, which is equipped with a level switch 16. The outlet of the water tank 17 is connected to the inlet of the water passage 62 via a water pump 18. The outlet of the water passage 62 is connected to one end of the load 15 via a third solenoid valve 14. The outlet of the water passage 62 is also connected to the inlet of the second heat-conducting plate 12 via a second solenoid valve 13. The outlet of the second heat-conducting plate 12 is connected to one end of the load 15 via a fourth solenoid valve 25. The other end of the load is connected to the inlet of the water tank 17.

[0037] The outlet of the water pump 18 is also connected to one end of the fifth solenoid valve 26, and the other end of the fifth solenoid valve 26 is connected between the outlet of the water passage 62 and the first water temperature sensor 23.

[0038] This invention employs a two-stage refrigeration system combining a semiconductor TEC (Thermal Design Technology) refrigeration chip and a compressor. This system offers high temperature control accuracy and stability, and the semiconductor TEC refrigeration chip compensates for the slow cooling and low efficiency of compressors when preparing chilled water at lower temperatures. The chiller system comprises two circulation systems: a first refrigeration circulation system, including a main refrigeration circuit, a first refrigeration branch circuit, and a second refrigeration branch circuit, with all components connected by welded copper pipes, and the circulating medium being an environmentally friendly refrigerant; and a second water circulation system, with all components connected by water pipes, and the circulating medium being a low-temperature resistant aqueous solution, the degree of which is determined by the chiller's minimum refrigeration temperature. Furthermore, defrosting can be completed solely through the forward and reverse current conduction of the TEC refrigeration chip, eliminating the need for an additional defrosting device.

[0039] Two pressure sensors in the main refrigeration cycle circuit monitor the pressure at the compressor's suction and discharge ports, while two temperature sensors monitor the temperature at the compressor's suction and discharge pipes. When an abnormality is detected, the control module can stop the chiller and issue an alarm. A level switch in the water tank monitors the water level and replenishes water when it falls below a warning level. Two water temperature sensors detect and control the water temperature before it enters the load.

[0040] In this invention, the first heat exchange component includes a first heat exchanger and a fan. The chiller also includes a control module that can control the conduction direction of the four-way reversing valve and the current direction of the TEC cooling chip to determine whether the chiller is cooling water or producing hot water. It can also control the specific opening degree of the electronic expansion valve based on the detection data of the first water temperature sensor to control the dryness of the refrigerant after throttling, thereby controlling the heat exchange efficiency at the second heat exchanger and the first heat conduction plate.

[0041] In this invention, the load is the cooling or heating point in the water circulation system. When cooling is required, the cooled water flows through the heat source load to be cooled and then returns to the water tank to recirculate the water. When heating is required, the heated water flows through the cold source load to be heated and then returns to the water tank to recirculate the water. The second, third, and fourth solenoid valves control the water flow direction of the water circulation system by closing and opening. The opening and closing of the solenoid valves can be controlled by the control module according to the temperature of the water that needs to be cooled or heated.

[0042] In this invention, the first water temperature sensor is used to detect the temperature of the water flowing out of the water passage, and the second water temperature sensor is used to detect the temperature of the water flowing out of the second heat-conducting plate. Based on the temperature values ​​detected by the water temperature sensors, the control module can adjust the opening of the electronic expansion valve and the current flowing through the TEC cooling chip to control the precise temperature of the final water production. The connected fifth solenoid valve allows the circulating water in the water circulation system to circulate directly between the water tank and the second heat-conducting plate.

[0043] In this invention, the compressor's economic cooling temperature is only at a certain sub-zero temperature when the compressor's cooling capacity and energy consumption are balanced. When the required cooling water temperature is lower than this temperature, the compressor's energy consumption increases but its cooling efficiency decreases. At this time, the shortcomings of compressor cooling can be solved by using TEC cooling plates. The upper limit temperature of the chilled water is determined according to the actual ambient temperature, usually 25 degrees Celsius. When preparing higher temperature chilled water, only the compressor is needed for cooling, and the water circulation system only flows through the second heat exchanger.

[0044] In this invention, the minimum cooling temperature of the TEC cooling chip is determined according to the different models of the cooling chip, and different minimum cooling temperatures can be selected as needed. When preparing low-temperature chilled water, the cooling efficiency of the compressor alone is low. At this time, the compressor and the TEC cooling chip are used simultaneously for secondary cooling. The water in the water tank first undergoes preliminary cooling through the second heat exchanger, and then flows through the second heat conduction plate for further cooling through the TEC cooling chip, thereby generating low-temperature chilled water to cool the load. This cooling method is suitable for situations where the water temperature in the water circulation system is higher than the economic cooling temperature when the chiller starts to cool, and it can cool more quickly.

[0045] In this invention, the on / off state of the solenoid valve can also be used to cool down the water circulation system through the TEC cooling chip. This cooling method is suitable when the water temperature in the water circulation system is lower than the economic cooling temperature after the chiller has been cooling for a period of time. In this case, the compressor is not required and the cooling can be achieved directly through the TEC cooling chip, which is more efficient and has more precise temperature control.

[0046] In this invention, the lower limit temperature of hot water can be determined according to the actual ambient temperature, and 35 degrees Celsius is selected under normal circumstances; the definition of the economic heating temperature of the compressor is similar to that of the economic cooling temperature of the compressor; when producing hot water at a lower temperature, it is only necessary to select the compressor mode for heating, that is, the water circulation system only passes through the second heat exchanger.

[0047] In this invention, the highest heating temperature of the TEC cooling chip is the highest temperature that its hot surface can heat. The appropriate TEC cooling chip can be selected according to actual needs. When producing hot water at a higher temperature, the heating methods of the compressor and the TEC cooling chip can be combined to improve the efficiency of hot water production. The water in the tank is first preheated by the second heat exchanger and then further heated by the second heat conduction plate to generate high-temperature hot water to heat the load.

[0048] In embodiments of the present invention, the temperatures for preparing cold water are divided into [-60℃, -20℃] and [-20℃, 25℃]; the temperatures for preparing hot water are divided into [35℃, 50℃] and [50℃, 80℃]; and the circulating medium of the water circulation system is a low-temperature aqueous solution that can withstand temperatures as low as -60℃.

[0049] Example 1, such as Figure 2 As shown, when producing chilled water with a temperature range of [tb, tc], the main refrigeration cycle circuit and the first refrigeration branch circuit are connected. Ports a and b of the four-way reversing valve 2 are connected, and ports c and d are connected. The refrigerant in the refrigerant passage absorbs heat. The second solenoid valve 13, the fourth solenoid valve 25, and the fifth solenoid valve 26 are closed, and the third solenoid valve 14 is opened. tb is the economic refrigeration temperature of the compressor, which is -20 degrees Celsius, and tc is the upper limit temperature of the chilled water, which is 25 degrees Celsius.

[0050] Low-temperature, low-pressure refrigerant is compressed into high-temperature, high-pressure refrigerant gas by compressor 1. The high-temperature, high-pressure refrigerant gas flows to the first heat exchanger 3 under the action of the four-way reversing valve 2. In the first heat exchanger, the refrigerant gas is condensed into low-temperature, high-pressure refrigerant liquid by forced convection heat exchange through fan 4. The low-temperature, high-pressure refrigerant liquid is throttled and depressurized by electronic expansion valve 5 into a low-temperature, low-pressure gas-liquid two-phase refrigerant. The first solenoid valve 7 is closed, and the refrigerant flows to the refrigerant passage of the second heat exchanger 6. The refrigerant absorbs heat in the second heat exchanger 6, which lowers the water temperature in the water circulation system and turns it into low-temperature, low-pressure refrigerant gas. The low-temperature, low-pressure refrigerant gas flows back to compressor 1 after passing through the four-way reversing valve 2.

[0051] In the water circulation system: the high-temperature water in the water tank 17 is transported by the water pump 18 to the water passage of the second heat exchanger 6 to exchange heat with the refrigerant and become cold water. After passing through the third solenoid valve 14, the cold water flows to the heat source load 15, causing the load temperature to decrease. After the cold water temperature rises, it returns to the water tank 17. In the water circulation system, based on the temperature value of the first water temperature sensor 23, the control module can adjust the opening of the electronic expansion valve 5 to control the dryness of the refrigerant after throttling, so that the water temperature reaches the required temperature.

[0052] Example 2, as follows Figure 3 As shown, when producing chilled water with a temperature range of [ta, tb], the connection method of the four-way reversing valve 2 is the same as in Embodiment 1, and the first solenoid valve 7 is opened. At the same time, the first and second refrigeration branches are connected to the main refrigeration cycle. The refrigerant in the refrigerant passage absorbs heat, and the side of the TEC cooling chip near the second heat-conducting plate cools. The second solenoid valve 13, the fourth solenoid valve 25, and the fifth solenoid valve 26 are opened, and the third solenoid valve 14 is closed. ta is the minimum cooling temperature of the TEC cooling chip, -60 degrees Celsius, and tb is the economic cooling temperature of the compressor, -20 degrees Celsius. This embodiment is suitable for initial startup or when the water temperature in the water tank is high.

[0053] Low-temperature, low-pressure refrigerant is compressed into high-temperature, high-pressure refrigerant gas by compressor 1. The high-temperature, high-pressure refrigerant gas flows to the first heat exchanger 3 under the action of the four-way reversing valve 2. In the first heat exchanger, the refrigerant gas is condensed into low-temperature, high-pressure refrigerant liquid by forced convection heat exchange through fan 4. The low-temperature, high-pressure refrigerant liquid is throttled and depressurized by electronic expansion valve 5 into low-temperature, low-pressure gas-liquid two-phase refrigerant. The first solenoid valve 7 is opened, and part of the throttled refrigerant passes through the refrigerant passage of the second heat exchanger 6. The refrigerant absorbs heat in the second heat exchanger 6, which initially lowers the water temperature of the water circulation system and at the same time becomes low-temperature, low-pressure refrigerant gas. A positive current is applied to the TEC cooling chip 10, and the side of the TEC cooling chip 10 that is in contact with the first heat-conducting plate 8 is heated, while the cooling side of the TEC cooling chip is in contact with the second heat-conducting plate 12. The other part of the refrigerant after throttling flows through the first solenoid valve 7 and enters the first heat-conducting plate 8. After absorbing the heat from the hot end of the TEC cooling chip, it evaporates into a low-temperature, low-pressure gas. The two parts of evaporated refrigerant gas merge and flow back to the compressor 1 after passing through the four-way reversing valve 2.

[0054] In the water circulation system: High-temperature water in water tank 17 is transported by water pump 18 to the water passage of the second heat exchanger 6 to exchange heat with the refrigerant and initially lower the water temperature. The cooled water flows through the second solenoid valve 13 to the second heat-conducting plate 12, where it is further cooled. The low heat dissipation temperature at the hot end of the TEC cooling chip (low refrigerant side temperature) allows the cooled water at the cold end of the TEC cooling chip to be lowered to a minimum of -60℃. The low-temperature cooled water produced by the second heat-conducting plate 12 flows through the fourth solenoid valve 25 to the heat source load 15, lowering the load temperature. After the cooled water temperature rises, it returns to water tank 17. In the water circulation system, the control module adjusts the opening of the electronic expansion valve 5 according to the temperature value of the first water temperature sensor 23 to control the dryness of the refrigerant after throttling, ensuring that the water temperature reaches the required initial cooled water temperature during the first cooling. The water then flows into the second heat-conducting plate, and the current input to the TEC cooling chip is adjusted according to the value of the second water temperature sensor 24 to control the water temperature.

[0055] Example 3, as follows Figure 4 As shown, when producing chilled water with a temperature range of [ta, tb], the connection method of the four-way reversing valve 2 is the same as in Embodiment 1. The first solenoid valve 7 is opened, connecting the first and second refrigeration branches to the main refrigeration cycle. The side of the TEC cooling chip closest to the second heat-conducting plate is refrigerated. The second solenoid valve 13, the fourth solenoid valve 25, and the fifth solenoid valve 26 are opened, and the third solenoid valve 14 is closed. ta is the minimum refrigeration temperature of the TEC cooling chip, -60 degrees Celsius, and tb is the economic refrigeration temperature of the compressor, -20 degrees Celsius. This embodiment is suitable for situations where the water temperature in the entire water tank and water circulation system is lower than the economic refrigeration temperature of -20 degrees Celsius after the machine has been running for a period of time, preferably between -30 and -40 degrees Celsius.

[0056] The refrigerant circulation process in this embodiment is the same as in the previous embodiment, except in the water circulation system:

[0057] High-temperature water in water tank 17 is transported by water pump 18, flows directly to second solenoid valve 13 via fifth solenoid valve 26, and then flows to second heat-conducting plate 12. Cold water is cooled on second heat-conducting plate 12. The low heat dissipation temperature of the hot end of the TEC cooling chip (low refrigerant side temperature) allows the cold water at the cold end of the TEC cooling chip to be reduced to a minimum of -60℃. The low-temperature cold water produced by second heat-conducting plate 12 flows to heat source load 15 via fourth solenoid valve 25, reducing the load temperature. After the cold water temperature rises, it returns to water tank 17. In the water circulation system, the water temperature is controlled by adjusting the current value input to the TEC cooling chip directly based on the value of the second water temperature sensor 24 via the control module.

[0058] Example 4, as follows Figure 5As shown, when producing hot water in the temperature range of [td, te], ports a and d of the four-way reversing valve 2 are connected, and ports c and b are connected, connecting the first refrigeration branch with the refrigeration cycle branch. The refrigerant in the refrigerant passage condenses and releases heat, closing the second solenoid valve 13, the fourth solenoid valve 25, and the fifth solenoid valve 26, and opening the third solenoid valve 14; td is the lower limit temperature of hot water, 35 degrees Celsius, and te is the economic heating temperature of the compressor, 50 degrees Celsius.

[0059] Low-temperature, low-pressure refrigerant is compressed into high-temperature, high-pressure refrigerant gas by compressor 1. The first solenoid valve 7 is closed, and the high-temperature, high-pressure refrigerant gas flows into the refrigerant passage of the second heat exchanger 6 under the action of the four-way reversing valve 2. The high-temperature, high-pressure refrigerant gas condenses and exchanges heat in the second heat exchanger 6, and the refrigerant exchanges heat with the circulating water and condenses into low-temperature, high-pressure liquid refrigerant. The low-temperature, high-pressure liquid refrigerant passes through the electronic expansion valve 5 to reduce its pressure into a low-temperature, low-pressure gas-liquid two-phase refrigerant. The low-temperature, low-pressure refrigerant undergoes forced convection heat exchange in the first heat exchanger 3 by fan 4, causing the low-temperature, low-pressure refrigerant to absorb heat and evaporate into low-temperature, low-pressure gas in the first heat exchanger 3. The low-temperature, low-pressure refrigerant gas returns to compressor 1 through the four-way reversing valve 2.

[0060] In the water circulation system: the high-temperature water in the water tank 17 is transported by the water pump 18 to the water passage of the second heat exchanger 6 to exchange heat with the refrigerant and become hot water. After being heated, the hot water flows through the third solenoid valve 14 to the cold source load 15, causing the load temperature to rise. After passing through the load, the hot water temperature drops and returns to the water tank 17. The water circulation system regulates the water temperature according to the temperature value of the first water temperature sensor 23, and adjusts the opening of the electronic expansion valve 5 through the control module to make the water temperature reach the required temperature.

[0061] Example 5, such as Figure 6 As shown, when producing hot water in the temperature range of [te, tf], the connection method of the four-way reversing valve 2 is the same as in Example 4, and the solenoid valve 7 is opened. At the same time, the first refrigeration branch and the second refrigeration branch are connected to the main refrigeration cycle. The refrigerant in the refrigerant passage condenses and releases heat, and the side of the TEC cooling chip near the first heat-conducting plate is cooled. The second solenoid valve 13, the fourth solenoid valve 25 and the fifth solenoid valve 26 are opened, and the third solenoid valve 14 is closed. te is the economic heating temperature of the compressor, 50 degrees Celsius, and tf is the maximum heating temperature of the TEC cooling chip, 80 degrees Celsius.

[0062] Low-temperature, low-pressure refrigerant is compressed into high-temperature, high-pressure refrigerant gas by compressor 1. The first solenoid valve 7 opens, and under the action of the four-way reversing valve 2, a portion of the high-temperature, high-pressure refrigerant gas condenses and exchanges heat in the refrigerant passage of the second heat exchanger 6. The refrigerant exchanges heat with circulating water and condenses into low-temperature, high-pressure refrigerant liquid. A reverse current is applied to the TEC cooling chip 10, and another portion of the high-temperature, high-pressure refrigerant gas passes through the first heat-conducting plate 8, which is in contact with the cooling surface of the TEC cooling chip 10, and then passes through the semiconductor TEC cooling assembly 1. The heating surface 0 is in contact with the second heat-conducting plate 12. This part of the refrigerant condenses into a low-temperature, high-pressure liquid in the first heat-conducting plate 8. After condensation, the two parts of low-temperature, high-pressure refrigerant liquid merge and enter the electronic expansion valve 5. The electronic expansion valve 5 throttles and reduces the pressure to form a low-temperature, low-pressure gas-liquid two-phase refrigerant. The low-temperature, low-pressure refrigerant undergoes forced convection heat exchange in the first heat exchanger 3 through the fan 4, causing the low-temperature, low-pressure refrigerant to absorb heat and evaporate into a low-temperature, low-pressure gas in the first heat exchanger 3. The low-temperature, low-pressure refrigerant gas returns to the compressor 1 through the four-way reversing valve 2.

[0063] In the water circulation system: Cold water in water tank 17 is transported by water pump 18 to the water passage of the second heat exchanger 6 to exchange heat with the refrigerant, initially raising the water temperature. The heated water then flows through the second solenoid valve 13 to the second heat-conducting plate 12, where it is further heated. A reverse current is applied to the TEC cooling chip, raising its heating surface to 80°C and thus increasing the temperature of the second heat-conducting plate 12. The high-temperature hot water produced by the second heat-conducting plate flows through the fourth solenoid valve 25 to the cold source load 15, raising the load temperature. After the hot water temperature decreases, it returns to water tank 17. In the water circulation system, the control module adjusts the opening of the electronic expansion valve 5 based on the temperature value of the first water temperature sensor 23 to control the dryness of the refrigerant after throttling, ensuring that the water temperature reaches the required initial hot water temperature before flowing into the second heat-conducting plate. The current input to the TEC cooling chip is adjusted based on the value of the second water temperature sensor 24 to control the water temperature.

[0064] The above embodiments are further elaborations and descriptions of the present invention to facilitate understanding, and are not intended to limit the present invention in any way. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chiller system combining a semiconductor TEC and a compressor, characterized in that, The device includes a semiconductor TEC module and a second heat exchanger. The semiconductor TEC module includes a TEC cooling chip, one side of which is provided with a first heat-conducting plate and the other side with a second heat-conducting plate. The refrigerant passage of the second heat exchanger is connected to the main refrigeration cycle as a first refrigeration branch. The first heat-conducting plate is connected in series with a first solenoid valve as a second refrigeration branch connected to the main refrigeration cycle. The water passage and the second heat-conducting plate of the second heat exchanger are respectively connected to a water circulation system for refrigeration. The water circulation system includes a water tank, the outlet of which is connected to the inlet of the water passage via a water pump; the outlet of the water passage is connected to one end of the load via a third solenoid valve; the outlet of the water passage is also connected to the inlet of the second heat-conducting plate via a second solenoid valve; the outlet of the second heat-conducting plate is connected to one end of the load via a fourth solenoid valve; and the other end of the load is connected to the inlet of the water tank. The outlet of the water passage is equipped with a first water temperature sensor, and the outlet of the second heat-conducting plate is equipped with a second water temperature sensor; the outlet of the water pump is also connected to one end of the fifth solenoid valve, and the other end of the fifth solenoid valve is connected between the outlet of the water passage and the first water temperature sensor.

2. The chiller system combining a semiconductor TEC and a compressor according to claim 1, characterized in that, The main circuit of the refrigeration cycle includes a compressor (1), the outlet of the compressor (1) is connected to port b of a four-way reversing valve (2), and the inlet of the compressor (1) is connected to port d of the four-way reversing valve (2). Port a of the four-way reversing valve (2) is connected to one end of an electronic expansion valve (5) through a first heat exchange component. The other end of the electronic expansion valve (5) is connected to one end of a refrigerant passage (61) and a first solenoid valve (7). Port c of the four-way reversing valve (2) is connected to the other end of the refrigerant passage (61) and a first heat-conducting plate (8).

3. The chiller system combining a semiconductor TEC and a compressor according to claim 1, characterized in that, When producing chilled water with a temperature range of [tb, tc], the main refrigeration cycle circuit and the first refrigeration branch circuit are connected. The refrigerant in the refrigerant passage absorbs heat, the second and fourth solenoid valves are closed, and the third solenoid valve is opened. tb is the economic refrigeration temperature of the compressor, and tc is the upper limit temperature of the chilled water.

4. A chiller system combining a semiconductor TEC and a compressor according to claim 1 or 3, characterized in that, When producing chilled water with a temperature range of [ta, tb], the first and second refrigeration branches are simultaneously connected to the main refrigeration cycle. The refrigerant in the refrigerant passage absorbs heat, and the side of the TEC cooling chip closest to the second heat-conducting plate cools. The second and fourth solenoid valves are opened, and the third solenoid valve is closed. ta is the minimum cooling temperature of the TEC cooling chip, and tb is the economic cooling temperature of the compressor.

5. A chiller system combining a semiconductor TEC and a compressor according to claim 1, characterized in that, When producing chilled water with a temperature range of [ta, tb], the second refrigeration branch is connected to the main refrigeration cycle circuit, and the side of the TEC cooling chip closest to the second heat-conducting plate is cooled. The second, fourth, and fifth solenoid valves are opened, and the third solenoid valve is closed. ta is the minimum cooling temperature of the TEC cooling chip, and tb is the economic cooling temperature of the compressor.

6. A chiller system combining a semiconductor TEC and a compressor according to claim 1, characterized in that, When producing hot water in the temperature range of [td, te], the first refrigeration branch is connected to the refrigeration cycle branch. The refrigerant in the refrigerant passage condenses and releases heat. The second and fourth solenoid valves are closed, and the third solenoid valve is opened. td is the lower limit temperature of the hot water, and te is the economic heating temperature of the compressor.

7. A chiller system combining a semiconductor TEC and a compressor according to claim 1 or 6, characterized in that, When producing hot water in the temperature range of [te, tf], the first and second refrigeration branches are simultaneously connected to the main refrigeration cycle. The refrigerant in the refrigerant passage condenses and releases heat, and the side of the TEC cooling chip closest to the first heat-conducting plate is cooled. The second and fourth solenoid valves are opened, and the third solenoid valve is closed. te is the economic heating temperature of the compressor, and tf is the maximum heating temperature of the TEC cooling chip.

8. A chiller system combining a semiconductor TEC and a compressor according to claim 1, characterized in that, The water tank is equipped with a level switch to monitor the water level and replenish water when the water level is below the warning line.

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