Electronic device, card connector, card holder, and card holder assembly

Abstract

The application discloses an electronic device, a card connector, a card seat and a card seat assembly. Ten elastic sheets of the card seat are arranged into first to fifth rows of elastic sheets along a first direction. The center distance between the second row of elastic sheets and the third row of elastic sheets and the center distance between the third row of elastic sheets and the fourth row of elastic sheets are greater than the center distance between the first row of elastic sheets and the second row of elastic sheets and the center distance between the fourth row of elastic sheets and the fifth row of elastic sheets. When the electronic device is inserted into a Nano SIM card, the second to fourth rows of elastic sheets are electrically connected to six gold fingers of the Nano SIM card one by one, and the first row of elastic sheets and the fifth row of elastic sheets abut against the Nano SIM card. When the electronic device is inserted into a second NM card, the ten elastic sheets are electrically connected to ten gold fingers of the second NM card one by one. The card seat assembly of the electronic device can be compatible with the Nano SIM card and the second NM card, and a card seat assembly for separately adapting a storage card is not required, which is beneficial to the thinning of the electronic device.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an electronic device, a card connector, a card socket, and a card socket assembly. Background Technology

[0002] With the development of electronic devices, multiple information cards are needed to meet their functional requirements. Taking mobile phones as an example, they typically need to include a Subscriber Identification Module (SIM) card and a memory card. Each type of information card requires a corresponding card slot component. Therefore, electronic devices usually need to have multiple card slot components, which increases the required board space for these components, consuming internal space and severely restricting the development of thinner and lighter electronic devices. Summary of the Invention

[0003] This application provides an electronic device, a card connector, a card socket, and a card socket assembly. The card socket assembly of the electronic device is compatible with Nano SIM cards and second NM cards, eliminating the need for a separate card socket assembly for adapting memory cards, which is beneficial for the thinner and lighter design of the electronic device.

[0004] In a first aspect, this application provides an electronic device, including a card holder and a card tray, wherein the card tray is detachably inserted into the card holder. The card holder assembly of the electronic device includes the aforementioned card holder and card tray. The card holder includes ten spring contacts arranged in an array, the ten spring contacts being arranged along a first direction to form a first row of spring contacts to a fifth row of spring contacts; the center-to-center distance between the second row of spring contacts and the third row of spring contacts is greater than the center-to-center distance between the first row of spring contacts and the second row of spring contacts, and is also greater than the center-to-center distance between the fourth row of spring contacts and the fifth row of spring contacts; the center-to-center distance between the third row of spring contacts and the fourth row of spring contacts is greater than the center-to-center distance between the first row of spring contacts and the second row of spring contacts, and is also greater than the center-to-center distance between the fourth row of spring contacts and the fifth row of spring contacts.

[0005] When a Nano SIM card is installed in the card tray, the second to fourth rows of spring contacts are electrically connected to the six gold fingers of the Nano SIM card, and the first and fifth rows of spring contacts hold the Nano SIM card in place. When a second NM card is installed in the card tray, the ten spring contacts are electrically connected to the ten gold fingers of the second NM card, and the size of the second NM card body is the same as that of the Nano SIM card body.

[0006] In this application, by setting the arrangement and center spacing of multiple spring contacts, various combinations can be formed. The number and position of the spring contacts in these combinations can be adapted to the number and position of the gold fingers of various types of information cards (e.g., Nano SIM cards and second NM cards), enabling the card connector to communicate with different types of information cards, achieving multi-card compatibility and good scalability. Therefore, when the card connector is applied to the card slot assembly of an electronic device, the electronic device can adapt to multiple types of information cards through a single card slot assembly, thereby reducing the number of card slot assemblies, reducing the space occupied inside the electronic device, and contributing to the thinner and lighter design of the electronic device.

[0007] In some possible implementations, the center-to-center distance between the first and second rows of spring clips can be in the range of 1.0 mm to 3.0 mm, for example, in the range of 1.0 mm to 1.7 mm; the center-to-center distance between the second and third rows of spring clips can be in the range of 1.0 mm to 3.0 mm, for example, in the range of 1.5 mm to 2.8 mm; the center-to-center distance between the third and fourth rows of spring clips is in the range of 1.5 mm to 2.8 mm; and the center-to-center distance between the fourth and fifth rows of spring clips is in the range of 1.0 mm to 1.7 mm.

[0008] Because the Nano SIM card and the second NM card have different numbers, shapes, arrangements, and spacing of gold fingers, the unique design of the spacing between the first to tenth springs allows the card connector to effectively reduce the risk of short circuits between the Nano SIM card's gold fingers and the card connector's springs when the Nano SIM card is placed in the card connector, and the risk of short circuits between the second NM card's gold fingers and the card connector's springs when the second NM card is placed in the card connector. This ensures a reliable electrical connection between the card connector and the Nano SIM card and the second NM card, allowing the Nano SIM card and the second NM card to share the same card connector in different time slots.

[0009] In some possible implementations, ten shrapnel fragments are arranged in a first column and a second column along a second direction, which is perpendicular to the first direction. The first column includes a first, third, fifth, seventh, and ninth shrapnel fragment arranged along the first direction, and the second column includes a second, fourth, sixth, eighth, and tenth shrapnel fragment arranged along the first direction.

[0010] When a Nano SIM card is installed in the card tray, the first and third spring contacts are electrically connected to the same gold finger of the Nano SIM card, and the second and fourth spring contacts are electrically connected to the same gold finger of the Nano SIM card; or, the first row of spring contacts abuts against the card body of the Nano SIM card; and / or, when a Nano SIM card is installed in the card tray, the ninth and seventh spring contacts are electrically connected to the same gold finger of the Nano SIM card, and the tenth and eighth spring contacts are electrically connected to the same gold finger of the Nano SIM card; or, the fifth row of spring contacts abuts against the card body of the Nano SIM card.

[0011] In some possible implementations, the electronic device also includes a processor, which comprises an interface controller, a memory card controller, and a SIM card controller. The interface controller is electrically connected to the memory card controller and the SIM card controller, and is also electrically connected to ten contact springs. When a Nano SIM card is installed in the card tray, the interface controller controls the SIM card controller to communicate with the Nano SIM card; when a second Nano SIM card is installed in the card tray, the interface controller controls the memory card controller to communicate with the second Nano SIM card.

[0012] In this implementation, the electronic device can automatically identify the information card type through the processor and control the controller corresponding to the information card to connect with the card connector, so that the information card can automatically match with the electronic device and communicate, thereby improving the user experience.

[0013] For example, the processor can identify the type of information card connected to the card connector in various ways. For instance, the processor can sequentially connect multiple controllers to the card connector, and identify the information card type based on the matching status between the controllers and the information card. Alternatively, the processor can also include a detection circuit for detecting the information card type, and the processor can identify the information card type based on the detection result of the detection circuit. This application does not strictly limit the specific method by which the processor identifies the information card type.

[0014] In some possible implementations, when the card tray contains a first NM card, the second to fifth rows of spring contacts are electrically connected one-to-one to the eight gold fingers of the first NM card. The first row of spring contacts holds the first NM card, and the size of the first NM card body is the same as that of the Nano SIM card body. In this implementation, the electronic device is compatible with Nano SIM cards, the first NM card, and the second NM card.

[0015] In some possible implementations, ten contact springs are arranged in a first column and a second column along a second direction, perpendicular to the first direction. The first column includes a first, third, fifth, seventh, and ninth contact spring arranged along the first direction, and the second column includes a second, fourth, sixth, eighth, and tenth contact spring arranged along the first direction. When a first NM card is installed in the card tray, the first and third contact springs are electrically connected to the same gold finger of the first NM card, and the second and fourth contact springs are also electrically connected to the same gold finger of the first NM card; alternatively, the first column of contact springs abuts against the body of the Nano SIM card.

[0016] In this implementation, the third to eighth springs of the card connector can abut against and electrically connect to the first to sixth gold fingers of the Nano SIM card, the third to tenth springs of the card connector can abut against and electrically connect to the first to eighth gold fingers of the first NM card, and the first to tenth springs of the card connector can abut against and electrically connect to the first to tenth gold fingers of the second NM card. Therefore, the card connector is compatible with Nano SIM cards, first NM cards, and second NM cards.

[0017] The center-to-center distance between the second and third rows of spring contacts and between the third and fourth rows of spring contacts in the card connector is set within the range of 1.5mm to 2.8mm. The center-to-center distance between the first and second rows of spring contacts is set within the range of 1.0mm to 1.7mm. The center-to-center distance between the fourth and fifth rows of spring contacts is set within the range of 1.0mm to 1.7mm. This allows the third to eighth spring contacts to communicate with the six gold fingers of the Nano SIM card, the third to tenth spring contacts to communicate with the eight gold fingers of the first NM card, and the first to tenth spring contacts to communicate with the ten gold fingers of the second NM card.

[0018] Because the Nano SIM card, the first NM card, and the second NM card have different numbers of gold fingers, different shapes of gold fingers, different arrangement positions of gold fingers, and different spacing distances of gold fingers, the unique design of the spacing between the first to tenth springs allows the card connector to effectively reduce the risk of short circuits between the gold fingers of the Nano SIM card and the springs of the card connector when the Nano SIM card is placed in the card connector, the risk of short circuits between the gold fingers of the first NM card and the springs of the card connector when the first NM card is placed in the card connector, and the risk of short circuits between the gold fingers of the second NM card and the springs of the card connector when the second NM card is placed in the card connector. This ensures a reliable electrical connection between the card connector and the Nano SIM card, the first NM card, and the second NM card, allowing the Nano SIM card, the first NM card, and the second NM card to share the same card connector at different times.

[0019] In some possible implementations, the electronic device further includes a processor, which comprises an interface controller, a SIM card controller, a first memory card controller, and a second memory card controller. The interface controller is electrically connected to the SIM card controller, the first memory card controller, and the second memory card controller, and is also electrically connected to ten contact springs. When a Nano SIM card is installed in the card tray, the interface controller controls the SIM card controller to communicate with the Nano SIM card; when a first NM card is installed in the card tray, the interface controller controls the first memory card controller to communicate with the first NM card; and when a second NM card is installed in the card tray, the interface controller controls the second memory card controller to communicate with the second NM card. In this implementation, the electronic device is compatible with Nano SIM cards, the first NM card, and the second NM card.

[0020] In some possible implementations, each spring includes a fixed end, an abutting end, and a movable end, arranged sequentially along the extension direction of the spring, which is perpendicular to a first direction. The holder also includes an insulating body, with the fixed end fixed to the insulating body, the abutting end protruding from one side of the insulating body, and the movable end movably mounted on the insulating body.

[0021] The conductor can be formed by stamping a single metal sheet. The conductor includes ten spring contacts and ten fixing members. The ten spring contacts can include the first to tenth spring contacts mentioned above. The ten fixing members are connected one-to-one to the ten spring contacts, and both the fixing members and the spring contacts are made of conductive material. The conductor also includes ten conductive blocks, with one fixing member and one spring contact located on the same conductive block, and the ten conductive blocks are spaced apart from each other. The ten fixing members are embedded in the insulating body to fix it in place, and the ten spring contacts are fixedly connected to the insulating body through the ten fixing members.

[0022] In this implementation, when the card connector is connected to the information card, the abutting end abuts against the information card and moves towards the insulating body. The movable end is displaced relative to the insulating body, and the spring clip deforms smoothly. The elastic force of the spring clip abutting against the information card is moderate, which enables the information card to be smoothly connected to the card connector and reduces the risk of damaging the information card due to excessive elastic force of the spring clip, thereby improving reliability.

[0023] The spring contact also includes a first connecting segment and a second connecting segment. The first connecting segment connects the fixed end and the abutting end, and the second connecting segment connects the abutting end and the movable end. The abutting end protrudes relative to the first and second connecting segments. That is, in the thickness direction of the card connector, the abutting end is at the highest point, followed by the first and second connecting segments, and the fixed end and the movable end are at the lowest point. When the spring contact is connected to the information card, the spring contact is held and electrically connected to the information card by the abutting end. The first connecting segment, the fixed end, the second connecting segment, and the movable end do not contact the information card and form a gap with the information card.

[0024] The abutting end may include a raised contact point with a certain contact area. When the card connector is connected to the information card, the contact point abuts against the gold fingers of the information card, so that the card connector electrically connects to the information card.

[0025] In some possible implementations, the insulating body is provided with a connecting hole, the movable end is movably inserted into the connecting hole, and the end of the movable end includes a stop block, which cooperates with the insulating body to form an anti-detachment structure.

[0026] In this implementation, the anti-detachment structure effectively prevents the movable end of the spring from detaching from the insulating body, improving the connection reliability between the spring and the insulating body, and making the card connector highly reliable.

[0027] The width of the connecting hole in the locking direction is smaller than the width of the stop block in the locking direction. The locking direction can be any direction. The size of the connecting hole in a certain direction is smaller than the size of the stop block in the same direction. This allows the stop block to cooperate with the insulating body to form an anti-detachment structure, preventing the stop block from passing through the connecting hole and causing the movable end of the spring to detach from the insulating body.

[0028] In some implementations, each conductive block of the conductor also includes solder feet, which are used to fix and connect to a fastener. The solder feet are used to solder to the circuit board so that the card connector is fixedly connected to the circuit board, and the spring contacts are electrically connected to the circuit board. Each conductive block has at least one solder foot.

[0029] For example, each conductive block has at least one solder foot including a first solder foot, which is located near the fixed end of the spring clip. That is, the first solder foot is connected to the end of the fixing member near the fixed end of the spring clip. During the insertion of the information card, friction is generated between the information card and the contact end of the spring clip. This friction causes the spring clip to tend to move in the insertion direction (i.e., the second direction), and the fixed end of the spring clip is subjected to tension. By setting the first solder foot near the fixed end of the spring clip, the conductive block transmits the force on the spring clip to the circuit board. The fixing member of the conductive block is less prone to deformation, and the connection between the fixing member and the insulating body is stable, which helps to improve the reliability of the card connector and card holder assembly. It is understood that the first solder foot can also transmit stress during the removal of the information card.

[0030] In this design, at least one solder joint of the conductive block may also include a second solder joint, which is located near the movable end of the spring clip. That is, the second solder joint is connected to the end of the fixing member near the movable end of the spring clip. During the card removal process, friction is generated between the card and the contact end of the spring clip. This friction causes the spring clip to tend to move in the card removal direction (i.e., the opposite direction of the second direction). The movable end of the spring clip exerts a pulling force on the insulating body through the anti-disengagement structure. The conductive block, by providing a second solder joint near the movable end of the spring clip, and the second solder joint welding the circuit board, allows the force on the insulating body to be transferred to the circuit board through the second solder joint. This prevents the fixing member of the conductive block from deforming, and ensures a stable connection between the fixing member and the insulating body, thus improving the reliability of the card connector and card holder assembly. It is understood that during the card removal process, the first solder joint can also transmit stress. During the card insertion process, both the first and second solder joints can transmit stress.

[0031] Secondly, this application also provides a card connector, including ten spring contacts arranged in an array, the ten spring contacts being arranged along a first direction to form a first row of spring contacts to a fifth row of spring contacts; the center-to-center distance between the second row of spring contacts and the third row of spring contacts is greater than the center-to-center distance between the first row of spring contacts and the second row of spring contacts, and is also greater than the center-to-center distance between the fourth row of spring contacts and the fifth row of spring contacts; the center-to-center distance between the third row of spring contacts and the fourth row of spring contacts is greater than the center-to-center distance between the first row of spring contacts and the second row of spring contacts, and is also greater than the center-to-center distance between the fourth row of spring contacts and the fifth row of spring contacts. When the card connector is connected to a Nano SIM card, the second row of spring contacts to the fourth row of spring contacts are electrically connected to the six gold fingers of the Nano SIM card in a one-to-one correspondence, and the first row of spring contacts and the fifth row of spring contacts abut against the Nano SIM card. When the card connector is connected to a second NM card, the ten spring contacts are electrically connected to the ten gold fingers of the second NM card in a one-to-one correspondence, and the size of the second NM card body is the same as the size of the Nano SIM card body.

[0032] In this application, by setting the arrangement and center spacing of multiple spring contacts, various combinations can be formed. The number and position of the spring contacts in these combinations can be adapted to the number and position of the gold fingers of various types of information cards (e.g., Nano SIM cards and second NM cards), enabling the card connector to communicate with different types of information cards, achieving multi-card compatibility and good scalability. Therefore, when the card connector is applied to the card slot assembly of an electronic device, the electronic device can adapt to multiple types of information cards through a single card slot assembly, thereby reducing the number of card slot assemblies, reducing the space occupied inside the electronic device, and contributing to the thinner and lighter design of the electronic device.

[0033] In some possible implementations, the center-to-center distance between the first and second rows of spring clips is in the range of 1.0 mm to 1.7 mm; the center-to-center distance between the second and third rows of spring clips is in the range of 1.5 mm to 2.8 mm; the center-to-center distance between the third and fourth rows of spring clips is in the range of 1.5 mm to 2.8 mm; and the center-to-center distance between the fourth and fifth rows of spring clips is in the range of 1.0 mm to 1.7 mm.

[0034] Because the Nano SIM card and the second NM card have different numbers, shapes, arrangements, and spacing of gold fingers, the unique design of the spacing between the first to tenth springs allows the card connector to effectively reduce the risk of short circuits between the Nano SIM card's gold fingers and the card connector's springs when the Nano SIM card is placed in the card connector, and the risk of short circuits between the second NM card's gold fingers and the card connector's springs when the second NM card is placed in the card connector. This ensures a reliable electrical connection between the card connector and the Nano SIM card and the second NM card, allowing the Nano SIM card and the second NM card to share the same card connector in different time slots.

[0035] In some possible implementations, ten shrapnels are arranged in a first column and a second column along a second direction, which is perpendicular to the first direction. The first column includes a first, third, fifth, seventh, and ninth shrapnel arranged along the first direction, and the second column includes a second, fourth, sixth, eighth, and tenth shrapnel arranged along the first direction.

[0036] When the card connector is connected to the Nano SIM card, the first and third spring contacts are electrically connected to the same gold finger of the Nano SIM card, and the second and fourth spring contacts are electrically connected to the same gold finger of the Nano SIM card; or, the first row of spring contacts abuts against the body of the Nano SIM card; and / or, when the card connector is connected to the Nano SIM card, the ninth and seventh spring contacts are electrically connected to the same gold finger of the Nano SIM card, and the tenth and eighth spring contacts are electrically connected to the same gold finger of the Nano SIM card; or, the fifth row of spring contacts abuts against the body of the Nano SIM card.

[0037] In some possible implementations, when the card tray contains a first NM card, the second to fifth rows of spring contacts are electrically connected one-to-one to the eight gold fingers of the first NM card. The first row of spring contacts holds the first NM card, and the size of the first NM card body is the same as that of the Nano SIM card body. In this implementation, the electronic device is compatible with Nano SIM cards, the first NM card, and the second NM card.

[0038] In some possible implementations, ten contact springs are arranged in a first column and a second column along a second direction, perpendicular to the first direction. The first column includes a first, third, fifth, seventh, and ninth contact spring arranged along the first direction, and the second column includes a second, fourth, sixth, eighth, and tenth contact spring arranged along the first direction. When a first NM card is installed in the card tray, the first and third contact springs are electrically connected to the same gold finger of the first NM card, and the second and fourth contact springs are also electrically connected to the same gold finger of the first NM card; alternatively, the first column of contact springs abuts against the body of the Nano SIM card.

[0039] In this implementation, the third to eighth springs of the card connector can abut against and electrically connect to the first to sixth gold fingers of the Nano SIM card, the third to tenth springs of the card connector can abut against and electrically connect to the first to eighth gold fingers of the first NM card, and the first to tenth springs of the card connector can abut against and electrically connect to the first to tenth gold fingers of the second NM card. Therefore, the card connector is compatible with Nano SIM cards, first NM cards, and second NM cards.

[0040] The center-to-center distance between the second and third rows of spring contacts and between the third and fourth rows of spring contacts in the card connector is set within the range of 1.5mm to 2.8mm. The center-to-center distance between the first and second rows of spring contacts is set within the range of 1.0mm to 1.7mm. The center-to-center distance between the fourth and fifth rows of spring contacts is set within the range of 1.0mm to 1.7mm. This allows the third to eighth spring contacts to communicate with the six gold fingers of the Nano SIM card, the third to tenth spring contacts to communicate with the eight gold fingers of the first NM card, and the first to tenth spring contacts to communicate with the ten gold fingers of the second NM card.

[0041] Because the Nano SIM card, the first NM card, and the second NM card have different numbers of gold fingers, different shapes of gold fingers, different arrangement positions of gold fingers, and different spacing distances of gold fingers, the unique design of the spacing between the first to tenth springs allows the card connector to effectively reduce the risk of short circuits between the gold fingers of the Nano SIM card and the springs of the card connector when the Nano SIM card is placed in the card connector, the risk of short circuits between the gold fingers of the first NM card and the springs of the card connector when the first NM card is placed in the card connector, and the risk of short circuits between the gold fingers of the second NM card and the springs of the card connector when the second NM card is placed in the card connector. This ensures a reliable electrical connection between the card connector and the Nano SIM card, the first NM card, and the second NM card, allowing the Nano SIM card, the first NM card, and the second NM card to share the same card connector at different times.

[0042] In some possible implementations, each spring includes a fixed end, an abutting end, and a movable end, which are arranged sequentially along the extension direction of the spring, and the extension direction of the spring is perpendicular to the first direction; the card holder also includes an insulating body, the fixed end is fixed to the insulating body, the abutting end protrudes from one side surface of the insulating body, and the movable end is movably installed on the insulating body.

[0043] The conductor can be formed by stamping a single metal sheet. The conductor includes ten spring contacts and ten fixing members. The ten spring contacts can include the first to tenth spring contacts mentioned above. The ten fixing members are connected one-to-one to the ten spring contacts, and both the fixing members and the spring contacts are made of conductive material. The conductor also includes ten conductive blocks, with one fixing member and one spring contact located on the same conductive block, and the ten conductive blocks are spaced apart from each other. The ten fixing members are embedded in the insulating body to fix it in place, and the ten spring contacts are fixedly connected to the insulating body through the ten fixing members.

[0044] In this implementation, when the card connector is connected to the information card, the abutting end abuts against the information card and moves towards the insulating body. The movable end is displaced relative to the insulating body, and the spring clip deforms smoothly. The elastic force of the spring clip abutting against the information card is moderate, which enables the information card to be smoothly connected to the card connector and reduces the risk of damaging the information card due to excessive elastic force of the spring clip, thereby improving reliability.

[0045] The spring contact also includes a first connecting segment and a second connecting segment. The first connecting segment connects the fixed end and the abutting end, and the second connecting segment connects the abutting end and the movable end. The abutting end protrudes relative to the first and second connecting segments. That is, in the thickness direction of the card connector, the abutting end is at the highest point, followed by the first and second connecting segments, and the fixed end and the movable end are at the lowest point. When the spring contact is connected to the information card, the spring contact is held and electrically connected to the information card by the abutting end. The first connecting segment, the fixed end, the second connecting segment, and the movable end do not contact the information card and form a gap with the information card.

[0046] The abutting end may include a raised contact point with a certain contact area. When the card connector is connected to the information card, the contact point abuts against the gold fingers of the information card, so that the card connector electrically connects to the information card.

[0047] In some possible implementations, the insulating body is provided with a connecting hole, the movable end is movably inserted into the connecting hole, and the end of the movable end includes a stop block, which cooperates with the insulating body to form an anti-detachment structure.

[0048] In this implementation, the anti-detachment structure effectively prevents the movable end of the spring from detaching from the insulating body, improving the connection reliability between the spring and the insulating body, and making the card connector highly reliable.

[0049] The width of the connecting hole in the locking direction is smaller than the width of the stop block in the locking direction. The locking direction can be any direction. The size of the connecting hole in a certain direction is smaller than the size of the stop block in the same direction. This allows the stop block to cooperate with the insulating body to form an anti-detachment structure, preventing the stop block from passing through the connecting hole and causing the movable end of the spring to detach from the insulating body.

[0050] In some implementations, each conductive block of the conductor also includes solder feet, which are used to fix and connect to a fastener. The solder feet are used to solder to the circuit board so that the card connector is fixedly connected to the circuit board, and the spring contacts are electrically connected to the circuit board. Each conductive block has at least one solder foot.

[0051] For example, each conductive block has at least one solder foot including a first solder foot, which is located near the fixed end of the spring clip. That is, the first solder foot is connected to the end of the fixing member near the fixed end of the spring clip. During the insertion of the information card, friction is generated between the information card and the contact end of the spring clip. This friction causes the spring clip to tend to move in the insertion direction (i.e., the second direction), and the fixed end of the spring clip is subjected to tension. By setting the first solder foot near the fixed end of the spring clip, the conductive block transmits the force on the spring clip to the circuit board. The fixing member of the conductive block is less prone to deformation, and the connection between the fixing member and the insulating body is stable, which helps to improve the reliability of the card connector and card holder assembly. It is understood that the first solder foot can also transmit stress during the removal of the information card.

[0052] In this design, at least one solder joint of the conductive block may also include a second solder joint, which is located near the movable end of the spring clip. That is, the second solder joint is connected to the end of the fixing member near the movable end of the spring clip. During the card removal process, friction is generated between the card and the contact end of the spring clip. This friction causes the spring clip to tend to move in the card removal direction (i.e., the opposite direction of the second direction). The movable end of the spring clip exerts a pulling force on the insulating body through the anti-disengagement structure. The conductive block, by providing a second solder joint near the movable end of the spring clip, and the second solder joint welding the circuit board, allows the force on the insulating body to be transferred to the circuit board through the second solder joint. This prevents the fixing member of the conductive block from deforming, and ensures a stable connection between the fixing member and the insulating body, thus improving the reliability of the card connector and card holder assembly. It is understood that during the card removal process, the first solder joint can also transmit stress. During the card insertion process, both the first and second solder joints can transmit stress.

[0053] Thirdly, this application also provides a card holder, including a base and a card connector as described above, the card connector being fixedly connected to the base. The card holder may include one or more card connectors. The card holder described above is compatible with various information cards of the same size.

[0054] Fourthly, this application also provides a card holder assembly, including a card tray and the aforementioned card holder, wherein the card tray is detachably inserted into the card holder. The aforementioned card holder assembly is compatible with multiple information cards of the same size. Attached Figure Description

[0055] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0056] Figure 2 yes Figure 1 The diagram shows the structural layout of the card slot assembly in some usage states.

[0057] Figure 3 yes Figure 2An exploded view of the card holder shown.

[0058] Figure 4 yes Figure 2 The diagram shows the structure of the cassette at another angle;

[0059] Figure 5 This is a schematic diagram of the structure of a card connector provided in an embodiment of this application;

[0060] Figure 6 yes Figure 5 The diagram shows the structure of the card connector from another angle. Figure 1 ;

[0061] Figure 7 yes Figure 6 A schematic diagram of the conductor structure of the card connector shown;

[0062] Figure 8 yes Figure 6 A schematic diagram of the internal structure of the connector at point A shown in the diagram;

[0063] Figure 9 yes Figure 5 The diagram shows the structure of the card connector from another angle. Figure 2 ;

[0064] Figure 10 This is a schematic block diagram of a Nano SIM card provided in an embodiment of this application;

[0065] Figure 11 yes Figure 10 The diagram shown is a structural schematic of a Nano SIM card in some embodiments;

[0066] Figure 12 yes Figure 11 The Nano SIM card shown is... Figure 5 The diagram shows the structure when the card connector is connected.

[0067] Figure 13 This is a schematic block diagram of a first NM card provided in an embodiment of this application;

[0068] Figure 14 yes Figure 13 The diagram shown is a structural schematic of the first NM card in some embodiments;

[0069] Figure 15 yes Figure 14 The first NM card shown is Figure 5 The diagram shows the structure when the card connector is connected.

[0070] Figure 16 This is a schematic block diagram of a second NM card provided in an embodiment of this application;

[0071] Figure 17 yes Figure 16 The diagram shown is a structural schematic of the second NM card in some embodiments;

[0072] Figure 18 yes Figure 17 The second NM card shown is Figure 5 The diagram shows the structure when the card connector is connected.

[0073] Figure 19 yes Figure 1 The diagram shows a schematic block diagram of a portion of the circuitry of the electronic device in some embodiments;

[0074] Figure 20 yes Figure 17 The second NM card shown is a dimension diagram in some embodiments;

[0075] Figure 21A yes Figure 16 The diagram shows the dimensions of the second NM card in some other embodiments;

[0076] Figure 21B yes Figure 21A Another dimension diagram of the second NM card is shown;

[0077] Figure 22 yes Figure 16 The diagram shows the dimensions of the second NM card in some other embodiments;

[0078] Figure 23 yes Figure 16 The diagram shows the dimensions of the second NM card in some other embodiments;

[0079] Figure 24 yes Figure 17 The diagram shown is a schematic representation of the second NM card in some embodiments;

[0080] Figure 25 yes Figure 1 The diagram shows a partial circuit of the electronic device in some embodiments;

[0081] Figure 26 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0082] Figure 27 yes Figure 17 The diagram shown is a schematic representation of the second NM card in some other embodiments;

[0083] Figure 28 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0084] Figure 29 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0085] Figure 30 yes Figure 17 The diagram shown is a schematic representation of the second NM card in some other embodiments;

[0086] Figure 31 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0087] Figure 32 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0088] Figure 33 yes Figure 17 The diagram shown is a schematic representation of the second NM card in some other embodiments;

[0089] Figure 34 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0090] Figure 35 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0091] Figure 36 yes Figure 17 The diagram shown is a schematic representation of the second NM card in some other embodiments;

[0092] Figure 37 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0093] Figure 38 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0094] Figure 39 yes Figure 17 The diagram shown is a schematic representation of the second NM card in some other embodiments;

[0095] Figure 40 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0096] Figure 41 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0097] Figure 42 yes Figure 17The diagram shown is a schematic representation of the second NM card in some other embodiments;

[0098] Figure 43 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0099] Figure 44 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0100] Figure 45 This is a schematic diagram of the structure of the second NM card provided in this application embodiment in another embodiment;

[0101] Figure 46 This is a schematic diagram of a portion of the circuitry of the electronic device provided in some embodiments of this application;

[0102] Figure 47 This is a schematic diagram of a portion of the circuitry of the electronic device provided in some embodiments of this application;

[0103] Figure 48 yes Figure 45 The second NM card shown is Figure 5 The diagram shows the connection structure of the card connector.

[0104] Figure 49 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device shown in some other embodiments;

[0105] Figure 50 yes Figure 1 The diagram shows a portion of the circuitry of the electronic device in some other embodiments. Detailed Implementation

[0106] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; "and / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist, for example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone; "at least part" in the text includes both "part" and "all"; "multiple" in the text refers to two or more than two, and "multiple sheets" refers to two or more sheets.

[0107] In the following text, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0108] The directional terms mentioned in the embodiments of this application, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top", and "bottom", are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0109] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection", "linking", and "set on" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0110] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of this application. The electronic device 100 can be an electronic product such as a mobile phone, tablet, or smart wearable device; this embodiment uses a mobile phone as an example for illustration.

[0111] In some embodiments, the electronic device 100 may include a card slot assembly 10, a processor 20, a housing 30, a display screen 40, and a circuit board 50. The display screen 40 may be mounted on the housing 30 and is used to display images, videos, etc. The circuit board 50 is mounted inside the housing 30, and the processor 20 may be fixed to and electrically connected to the circuit board 50. The card slot assembly 10 includes a card slot 1 and a card holder 2. The card slot 1 may be mounted inside the housing 30 and may also be fixedly connected to and electrically connected to the circuit board 50. The processor 20 can be electrically connected to the card slot 1 through the circuit board 50. The card holder 2 is detachably inserted into the card slot 1. The card holder 2 is used to hold one or more information cards. The card holder 2 can carry the information cards and insert them into the card slot 1, so that the information cards are inserted into the card slot assembly 10, and the information cards communicate with the electronic device 100.

[0112] For example, the information card can be a Nano SIM (subscriber identification module) card, a Nano memory card, or a Nano 2-in-1 card. A Nano SIM card, also known as a 4FF card, is a SIM card conforming to the ETSI TS 102221V11.0.0 standard, with dimensions of 12.30mm in length, 8.80mm in width, and 0.67mm in thickness. Users can insert a Nano SIM card into the card slot assembly 10. The Nano SIM card communicates with the processor 20, and the electronic device 100 interacts with the network through the Nano SIM card to achieve functions such as calls and data communication. A Nano memory card can also be simply referred to as an NM (nanomemory) card. Users can also insert an NM card into the card slot assembly 10. The NM card communicates with the processor 20 to achieve data storage functions. For example, music, video, and other files can be saved on the NM card. A Nano 2-in-1 card can include a SIM card circuit and a memory card circuit. The SIM card circuit supports functions such as calls and data communication, while the memory card circuit supports data storage functions. Users can also insert a Nano 2-in-1 card into the card slot component 10. The Nano 2-in-1 card communicates with the processor 20 to realize functions such as calling, data communication and data storage.

[0113] In some embodiments, the electronic device 100 may further include one or more of the following: internal memory, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, a headphone jack, a sensor module, buttons, a motor, an indicator, and a camera. In other embodiments, the electronic device 100 may have more or fewer components than described above, may combine two or more components, or may have different component configurations. The various components described above may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits.

[0114] In some embodiments, the processor 20 may include one or more processing units, such as an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a memory, a video codec, a digital signal processor (DSP), a baseband processor, a neural network processing unit (NPU), etc. This application embodiment does not impose strict limitations on this. Different processing units may be independent devices or integrated into one or more processors 20. The processor 20 may also include one or more interfaces, through which it can communicate with other components of the electronic device 100.

[0115] Please refer to the following: Figures 2 to 4 , Figure 2 yes Figure 1 The diagram shown illustrates the structure of the card slot assembly 10 in some usage states. Figure 3 yes Figure 2 The exploded view of the card holder 1 shown is shown. Figure 4 yes Figure 2 The diagram shows the structure of the cassette 2 at another angle.

[0116] In some embodiments, the card holder 1 may include a base 12, a first card connector 13, a second card connector 14, an ejection assembly 15, and an insertion detection spring 16. The base 12 is generally shaped like a cover and includes a top plate 121 and multiple side plates 122 connected to the top plate 121. The top plate 121 and the multiple side plates 122 together enclose an inner space 123 of the base 12. The first card connector 13 is located in the inner space 123 of the base 12 and is fixedly connected to the base 12. The first card connector 13 is disposed opposite to the top plate 121. The structure of the second card connector 14 may be the same as or different from that of the first card connector 13. The second card connector 14 is located in the inner space 123 of the base 12, on the side of the first card connector 13 facing away from the top plate 121. The second card connector 14 is disposed opposite to the first card connector 13, and a gap is formed between the second card connector 14 and the first card connector 13. The first card connector 13, the second card connector 14, and the side plate 122 of the base 12 together form the card slot 17 of the card holder 1. One end of the card slot 17 is open, forming an opening, and the other end of the card slot 17 forms the bottom of the card slot 17.

[0117] When the card holder 1 is installed in the electronic device 100, the ends of the multiple side plates 122 that are away from the top plate 121 are fixed to the circuit board 50 of the electronic device 100. Multiple solder pins of the first card connector 13 are fixedly connected to and electrically connected to the circuit board 50, enabling the first card connector 13 to be electrically connected to the processor 20 of the electronic device 100. The second card connector 14 can be fixedly connected to the circuit board 50 to fix the base 12 via the circuit board 50. Alternatively, the second card connector 14 can also be directly fixedly connected to the base 12. Multiple solder pins of the second card connector 14 are fixedly connected to and electrically connected to the circuit board 50, enabling the second card connector 14 to be electrically connected to the processor 20 of the electronic device 100.

[0118] The card tray 2 may have a first mounting groove 21 and a second mounting groove 22 arranged opposite to each other, with the openings of the first mounting groove 21 and the second mounting groove 22 located on opposite sides of the card tray 2. Both the first mounting groove 21 and the second mounting groove 22 are used to install information cards. For example... Figure 2 and Figure 4 In this embodiment, two information cards can be installed in the first mounting slot 21 and the second mounting slot 22, respectively. The opening dimensions of the first mounting slot 21 and the second mounting slot 22 can be the same or similar, and the card bodies of the two information cards installed in the first mounting slot 21 and the second mounting slot 22 can be the same size. In some other embodiments, the opening dimensions of the first mounting slot 21 and the second mounting slot 22 can also be different, and the card bodies of the two information cards installed in the first mounting slot 21 and the second mounting slot 22 can be different sizes.

[0119] The opening dimensions of the first mounting slot 21 and the second mounting slot 22 are adapted to the dimensions of the corresponding information card body. For example, the opening dimensions of the first mounting slot 21 and the second mounting slot 22 can be slightly larger than the dimensions of the corresponding information card body, but the difference in dimensions is not significant, so that the information card can be smoothly installed into the first mounting slot 21 and the second mounting slot 22, and the installation position is relatively stable.

[0120] The card tray 2, either alone or carrying an information card, is inserted into the card slot 17 through the opening. The direction in which the card tray 2 and / or the information card are inserted into the card slot 17 (i.e., the insertion direction) is from the opening of the card slot 17 towards the bottom of the card slot 17. The size of the card slot 17 is adapted to the size of the card tray 2; for example, the size of the card slot 17 can be slightly larger than the size of the card tray 2, but the difference is not significant. There is a certain fitting gap between the card tray 2 and the wall of the card slot 17, allowing the card tray 2 to be smoothly inserted into the card slot 17 and stably installed within it. When the card tray 2 carrying the information card is inserted into the card slot 17, the information card installed in the card tray 2 is electrically connected to the first card connector 13 or the second card connector 14, thereby electrically connecting to the electronic device 100.

[0121] The ejector assembly 15 can be mounted on the base 12 and / or the first card connector 13. When the card tray 2 is inserted into the card slot 17, the user can control the ejector assembly 15 to partially eject the card tray 2 from the card slot 17, so that the user can remove the card tray 2. For example, the insertion detection spring 16 can be mounted on the first card connector 13 and electrically connected to the circuit board 50. The insertion detection spring 16 can be at least partially located at the bottom of the card slot 17. The insertion detection spring 16 can be used to detect whether the card tray 2 is inserted into the card slot 17.

[0122] In some other embodiments, the card holder 1 may also be provided with one card connector, and the card holder assembly 10 is used to install one information card, with the structure of the card tray 2 adjusted accordingly. In some other embodiments, the card holder 1 may also be provided with three or more card connectors, so that the card holder assembly 10 can be used to install more than three information cards, with the structure of the card tray 2 adjusted accordingly. This application does not strictly limit the number and position of the card connectors in the card holder 1, or the specific structure of the card tray 2.

[0123] In some other embodiments, the card holder 1 may also be provided with an ejection assembly 15 and / or an insertion detection spring 16 that differ from the structure shown in the figure. In some other embodiments, the card holder assembly 10 may include more or fewer components than those in the above embodiments, and this application does not impose strict limitations on this.

[0124] Please refer to the following: Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of the structure of a card connector 11 provided in an embodiment of this application. Figure 6 yes Figure 5 The diagram shows the structure of the card connector 11 from another angle. Figure 1 For example, Figure 5 The card connector 11 shown can be applied to Figure 3 The card holder 1 shown is used as a first card connector 13 and / or a second card connector 14.

[0125] This application provides a card connector 11, which can be applied to the card slot 1 of an electronic device 100. The card connector 11 is used to connect an information card. The card connector 11 includes multiple spring contacts, which hold the information card when the card connector 11 is connected.

[0126] In some embodiments, the card connector 11 includes ten spring contacts arranged in an array, spaced apart from each other. The ten spring contacts can be arranged in a roughly 2×5 array structure. For example, the ten spring contacts are arranged in a first row to a fifth row along a first direction, and in a first column and a second column along a second direction. The first column of spring contacts includes a first spring contact 11a, a third spring contact 11c, a fifth spring contact 11e, a seventh spring contact 11g, and a ninth spring contact 11i arranged along the first direction, and the second column of spring contacts includes a second spring contact 11b, a fourth spring contact 11d, a sixth spring contact 11f, an eighth spring contact 11h, and a tenth spring contact 11j arranged along the first direction. The first and second shrapnel 11a and 11b are located in the first row of shrapnel, the third shrapnel 11c and the fourth shrapnel 11d are located in the second row of shrapnel, the fifth shrapnel 11e and the sixth shrapnel 11f are located in the third row of shrapnel, the seventh shrapnel 11g and the eighth shrapnel 11h are located in the fourth row of shrapnel, and the ninth shrapnel 11i and the tenth shrapnel 11j are located in the fifth row of shrapnel.

[0127] When multiple spring clips are arranged in a row along a first direction, the center points of the spring clips in the same row (i.e., the center points of the portions of the spring clips used to hold the information card) can be aligned in the first direction or not aligned and slightly offset. This embodiment of the application does not strictly limit this arrangement. When multiple spring clips are arranged in a row along a second direction, the center points of two spring clips in the same row (i.e., the center points of the portions of the spring clips used to hold the information card) can be aligned in the second direction or not aligned and slightly offset. This embodiment of the application does not strictly limit this arrangement.

[0128] Among them, in conjunction with reference Figure 2 , Figure 3 , Figure 5 as well as Figure 6 When the card connector 11 is applied to the card holder assembly 10, the insertion direction of the information card into the card slot 17 of the card holder assembly 10 is parallel to the second direction, that is, the insertion direction of the information card when connecting to the card connector 11 is parallel to the second direction. During the insertion process of the information card, the information card first contacts the front structure of the card connector 11, and then contacts the rear structure of the card connector 11. When the card connector 11 is installed in the card holder 1, the front structure of the card connector 11 is close to the opening of the card slot 17, and the rear structure of the card connector 11 is far away from the opening of the card slot 17. For example, the second row of spring contacts of the card connector 11 can be located behind the first row of spring contacts, and the second row of spring contacts is far away from the opening of the card slot 17 of the card holder assembly 10 relative to the first row of spring contacts. In some other embodiments, the second row of spring contacts of the card connector 11 can also be close to the opening of the card slot 17 of the card holder assembly 10 relative to the first row of spring contacts. This embodiment of the application will not elaborate on this solution.

[0129] Please refer to the following: Figure 6 and Figure 7 , Figure 7 yes Figure 6 The diagram shows the structure of the conductor 113 of the card connector 11.

[0130] In some embodiments, the card connector 11 includes an insulating body 112 and a conductor 113. The insulating body 112 may be generally plate-shaped and further includes multiple spaced-apart cutout areas. For example, the insulating body 112 may include six first cutout areas 1121, multiple second cutout areas 1122, and multiple third cutout areas 1123. The six first cutout areas 1121 may be arranged in two columns and three rows, including a first column of first cutout areas 1121 and a second column of first cutout areas 1121 located behind the first column of first cutout areas 1121. The second cutout areas 1122 may be arranged in two columns, with each column of second cutout areas 1122 located behind the two columns of first cutout areas 1121. The third cutout areas 1123 may be arranged in one row and located behind the second column of first cutout areas 1121.

[0131] For example, a conductor 113 is embedded in an insulating body 112. The conductor 113 can be formed by stamping from a single metal plate. The conductor 113 includes ten spring contacts and ten fixing members 1131. The ten spring contacts may include the first spring contact 11a to the tenth spring contact 11j mentioned above. The ten fixing members 1131 are connected to the ten spring contacts in a one-to-one correspondence. Both the fixing members 1131 and the spring contacts are made of conductive material. The conductor 113 includes ten conductive blocks, with one fixing member 1131 and one spring contact located on the same conductive block. The ten conductive blocks are spaced apart from each other. The ten fixing members 1131 are embedded in the insulating body 112 for fixed connection to the insulating body 112, and the ten spring contacts are fixedly connected to the insulating body 112 through the ten fixing members 1131 respectively.

[0132] For example, each spring (for simplicity, one spring (e.g., 11j) is designated in the accompanying drawings) includes a fixed end 111a, an abutting end 111b, and a movable end 111c. The fixed end 111a, abutting end 111b, and movable end 111c are arranged sequentially along the extension direction of the spring, which is perpendicular to the first direction and parallel to the second direction. The fixed end 111a is connected to a fixing member 1131 and is fixed to the insulating body 112 by the fixing member 1131. The abutting end 111b protrudes from one side of the insulating body 112 to elastically hold the information card when the card connector 11 is connected to the information card. The movable end 111c is movably mounted on the insulating body 112 and is capable of moving relative to the insulating body 112 in the second direction.

[0133] In this embodiment, when the card connector 11 is connected to the information card, the abutting end 111b abuts against the information card and moves towards the insulating body 112. The movable end 111c is displaced relative to the insulating body 112, and the spring clip deforms smoothly. The elastic force of the spring clip abutting against the information card is moderate, so that the information card can be smoothly connected to the card connector 11, and the risk of damaging the information card due to excessive elastic force of the spring clip can be reduced, thereby improving reliability.

[0134] The spring contact also includes a first connecting segment 111d and a second connecting segment 111e. The first connecting segment 111d connects the fixed end 111a and the abutting end 111b, and the second connecting segment 111e connects the abutting end 111b and the movable end 111c. The abutting end 111b protrudes relative to the first connecting segment 111d and the second connecting segment 111e. That is, in the thickness direction of the card connector 11 (perpendicular to the first and second directions), the abutting end 111b is at the highest point, followed by the first connecting segment 111d and the second connecting segment 111e, and the fixed end 111a and the movable end 111c are at the lowest point. When the spring contact is connected to the information card, the spring contact is held and electrically connected to the information card by the abutting end 111b. The first connecting segment 111d, the fixed end 111a, the second connecting segment 111e, and the movable end 111c do not contact the information card and form a gap with the information card.

[0135] The abutment end 111b may include a raised abutment contact point 111f, which has a certain contact area. When the card connector 11 is connected to the information card, the abutment contact point 111f abuts against the gold fingers of the information card, so that the card connector 11 is electrically connected to the information card.

[0136] For example, the third spring piece 11c to the eighth spring piece 11h can be located in the six first hollow areas 1121 respectively. The first spring piece 11a can be located in the same first hollow area 1121 as the third spring piece 11c, the second spring piece 11b can be located in the same first hollow area 1121 as the fourth spring piece 11d, the seventh spring piece 11g can be located in the same first hollow area 1121 as the ninth spring piece 11i, and the eighth spring piece 11h can be located in the same first hollow area 1121 as the tenth spring piece 11j.

[0137] Each fastener 1131 surrounds or partially surrounds its corresponding spring piece. Specifically, a spring piece located alone in a first hollow area 1121 has its corresponding fastener 1131 completely surrounding it. For example, a fifth spring piece 11e is located alone in one of the first hollow areas 1121, and the fastener 1131 connecting to the fifth spring piece 11e completely surrounds it. Similarly, a sixth spring piece 11f is located alone in one of the first hollow areas 1121, and the fastener 1131 connecting to the sixth spring piece 11f completely surrounds it.

[0138] In this design, two spring pieces sharing the same first hollow area 1121 have two corresponding fasteners 1131 that form an enclosing pattern, together encompassing the two spring pieces and partially surrounding them. For example, if the first spring piece 11a and the third spring piece 11c are located in the same first hollow area 1121, the fasteners 1131 connecting the first spring piece 11a and the third spring piece 11c together surround the first spring piece 11a and the third spring piece 11c. The fastener 1131 connecting the first spring piece 11a partially surrounds the first spring piece 11a, and the fastener 1131 connecting the third spring piece 11c partially surrounds the third spring piece 11c. The seventh spring 11g and the ninth spring 11i are located in the same first hollow area 1121. The fasteners 1131 connecting the seventh spring 11g and the ninth spring 11i together surround the seventh spring 11g and the ninth spring 11i. The fasteners 1131 connecting the seventh spring 11g partially surround the seventh spring 11g, and the fasteners 1131 connecting the ninth spring 11i partially surround the ninth spring 11i. The relationship between the second spring 11b and the fourth spring 11d and their corresponding fasteners 1131, and the relationship between the eighth spring 11h and the tenth spring 11j and their corresponding fasteners 1131 are as described above and will not be repeated here.

[0139] Please refer to the following: Figure 6 and Figure 8 , Figure 8 yes Figure 6 The diagram shows the internal structure of the card connector 11 at point A. Figure 8 The diagram illustrates the connection structure between the movable end 111c of the spring and the insulating body 112. Figure 6 The tenth fragment, 11j, is used as an example for labeling.

[0140] In some embodiments, the insulating body 112 further includes a connecting hole 1124, which connects adjacent first hollow areas 1121 and second hollow areas 1122. The movable end 111c of the spring is inserted into the connecting hole 1124, and the end of the movable end 111c includes a stop block 1111, which cooperates with the insulating body 112 to form an anti-disengagement structure. In this embodiment, the anti-disengagement structure effectively prevents the movable end 111c of the spring from disengaging from the insulating body 112, improving the connection reliability between the spring and the insulating body 112, and making the card connector 11 highly reliable.

[0141] For example, the fixed end 111a and the abutting end 111b of the spring are located in the first hollow area 1121, and the movable end 111c of the spring is inserted into the connecting hole 1124 and extends through the connecting hole 1124 to the second hollow area 1122. The stop block 1111 is at least partially located in the second hollow area 1122. The width of the connecting hole 1124 in the locking direction is smaller than the width of the stop block 1111 in the locking direction. The locking direction can be any direction. The size of the connecting hole 1124 in a certain direction is smaller than the size of the stop block 1111 in the same direction, which allows the stop block 1111 to cooperate with the insulating body 112 to form an anti-detachment structure, preventing the stop block 1111 from passing through the connecting hole 1124 and causing the movable end 111c of the spring to detach from the insulating body 112. For example, in the direction perpendicular to the extension direction of the spring, that is, in the first direction, the width of the stop block 1111 is greater than the width of the connecting hole 1124. It is understood that the embodiments of this application do not strictly limit the shape and size of the connecting hole 1124 and the shape and size of the stop block 1111.

[0142] Please refer to it again. Figure 6 and Figure 7 In some embodiments, each conductive block of conductor 113 further includes solder feet 1132 (some solder feet 1132 are labeled for simplicity in the accompanying drawings). Solder feet 1132 are fixedly connected to fasteners 1131 and are used for soldering to circuit board 50 (see reference). Figure 1 The card connector 11 is fixedly connected to the circuit board 50, and the spring contacts are electrically connected to the circuit board 50. Each conductive block has at least one solder pad 1132.

[0143] For example, at least one solder foot 1132 of each conductive block includes a first solder foot 1133, which is located near the fixing end 111a of the spring. That is, the first solder foot 1133 is connected to the end of the fixing member 1131 near the fixing end 111a of the spring. During the insertion of the information card, friction is generated between the information card and the contact end 111b of the spring. This friction causes the spring to tend to move in the insertion direction (i.e., the second direction), and the fixing end 111a of the spring is subjected to tension. By setting the first solder foot 1133 near the fixing end 111a of the spring, and welding the first solder foot 1133 to the circuit board 50, the force on the spring is transmitted to the circuit board 50 through the first solder foot 1133. The fixing member 1131 of the conductive block is less prone to deformation, and the connection between the fixing member 1131 and the insulating body 112 is stable, which helps to improve the reliability of the card connector 11 and the card holder assembly 10. Understandably, during the card removal process, the first solder pin 1133 can also transmit stress.

[0144] In this embodiment, at least one solder foot 1132 of the conductive block may further include a second solder foot 1134, which is located near the movable end 111c of the spring. That is, the second solder foot 1134 is connected to the end of the fixing member 1131 near the movable end 111c of the spring. During the card removal process, friction is generated between the card and the contact end 111b of the spring. This friction causes the spring to tend to move in the card removal direction (i.e., the opposite direction of the second direction). The movable end 111c of the spring exerts a pulling force on the insulating body 112 through the anti-disengagement structure. By setting the second solder foot 1134 near the movable end 111c of the spring, and welding the second solder foot 1134 to the circuit board 50, the force on the insulating body 112 is transmitted to the circuit board 50 through the second solder foot 1134. The fixing member 1131 of the conductive block is not easily deformed, and the connection between the fixing member 1131 and the insulating body 112 is stable, which is beneficial to improving the reliability of the card connector 11 and the card holder assembly 10. Understandably, during the card removal process, the first solder pin 1133 can also transmit stress. During the card insertion process, both the first solder pin 1133 and the second solder pin 1134 can transmit stress.

[0145] In some other embodiments, the solder feet 1132 on the conductive block may also be connected to other positions of the fastener 1131, such as the middle of the fastener 1131. This application does not strictly limit this.

[0146] For example, some of the solder pads 1132 of the conductor 113 can be located in the first cutout area 1121, and some of the solder pads 1132 can be located in the third cutout area 1123. The arrangement positions can be referred to Figure 6 In some other embodiments, the multiple solder feet 1132 of the conductor 113 may also be arranged in other ways. For example, if the multiple solder feet 1132 of the conductor 113 are all located in the first hollow area 1121, then the insulating body 112 may not be provided with a third hollow area 1123. This application does not strictly limit this.

[0147] Please see Figure 9 , Figure 9 yes Figure 5 The diagram shows the structure of the card connector 11 at another angle. Figure 2 .

[0148] In some embodiments, the center-to-center distance S2 between the second row of springs (11c, 11d) and the third row of springs (11e, 11f) is greater than the center-to-center distance S1 between the first row of springs (11a, 11b) and the second row of springs (11c, 11d), and greater than the center-to-center distance S4 between the fourth row of springs (11g, 11h) and the fifth row of springs (11i, 11j). The center-to-center distance S3 between the third row of springs (11e, 11f) and the fourth row of springs (11g, 11h) is greater than the center-to-center distance S1 between the first row of springs (11a, 11b) and the second row of springs (11c, 11d), and greater than the center-to-center distance S4 between the fourth row of springs (11g, 11h) and the fifth row of springs (11i, 11j).

[0149] That is, the center-to-center distance S2 between the second row of shrapnel (11c, 11d) and the third row of shrapnel (11e, 11f), and the center-to-center distance S3 between the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11h) are relatively large, while the center-to-center distance S1 between the first row of shrapnel (11a, 11b) and the second row of shrapnel (11c, 11d), and the center-to-center distance S4 between the fourth row of shrapnel (11g, 11h) and the fifth row of shrapnel (11i, 11j) are relatively small.

[0150] Specifically, when two spring clips in the same row are aligned, the center-to-center distance between the two rows of spring clips is the same as the center-to-center distance between two spring clips in the same column. The center-to-center distance between two spring clips refers to the distance between the center points of the parts of the two spring clips that hold the information card (e.g., contact point 111f) in the first direction. When two spring clips in the same row are slightly misaligned in the second direction, the center-to-center distance between the two rows of spring clips is the average of the center-to-center distance between the two spring clips in the first column and the center-to-center distance between the two spring clips in the second column.

[0151] like Figure 9 As shown, the center-to-center distance between the third spring 11c and the fifth spring 11e is greater than the center-to-center distance between the first spring 11a and the third spring 11c, and the center-to-center distance between the seventh spring 11g and the ninth spring 11i; the center-to-center distance between the fifth spring 11e and the seventh spring 11g is greater than the center-to-center distance between the first spring 11a and the third spring 11c, and the center-to-center distance between the seventh spring 11g and the ninth spring 11i; the center-to-center distance between the fourth spring 11d and the sixth spring 11f is greater than the center-to-center distance between the second spring 11b and the fourth spring 11d, and the center-to-center distance between the eighth spring 11h and the tenth spring 11j; the center-to-center distance between the sixth spring 11f and the eighth spring 11h is greater than the center-to-center distance between the second spring 11b and the fourth spring 11d, and the center-to-center distance between the eighth spring 11h and the tenth spring 11j.

[0152] For example, the center distance S2 between the second row of spring clips (11c, 11d) and the third row of spring clips (11e, 11f) can be in the range of 1.0mm to 3.0mm, for example, in the range of 1.5mm to 2.8mm, for example, 2.48mm, 2.54mm, 2.59mm, 2.63mm, etc.; and / or, the center distance S3 between the third row of spring clips (11e, 11f) and the fourth row of spring clips (11g, 11h) can be in the range of 1.0mm to 3.0mm, for example, in the range of 1.5mm to 2.8mm, for example, 2.48mm, 2.54mm, 2.59mm, 2.63mm, etc. 2.48mm, 2.54mm, 2.59mm, 2.63mm, etc.; and / or, the center distance S1 between the first row of spring clips (11a, 11b) and the second row of spring clips (11c, 11d) can be in the range of 1.0mm to 1.7mm, for example, 1.03mm, 1.07mm, 1.12mm, etc.; and / or, the center distance S4 between the fourth row of spring clips (11g, 11h) and the fifth row of spring clips (11i, 11j) can be in the range of 1.0mm to 1.7mm, for example, 1.32mm, 1.37mm, 1.41mm, etc.

[0153] The center-to-center distance S2 between the second row of spring clips (11c, 11d) and the third row of spring clips (11e, 11f), and the center-to-center distance S3 between the third row of spring clips (11e, 11f) and the fourth row of spring clips (11g, 11h) can be equal or unequal; this embodiment does not strictly limit this. The center-to-center distance between corresponding groups of spring clips in adjacent rows can be equal or unequal; this embodiment does not strictly limit this. For example, in the first row of spring clips (11a, 11b) and the second row of spring clips (11c, 11d), the center-to-center distance between the first spring clip 11a and the third spring clip 11c, and the center-to-center distance between the second spring clip 11b and the fourth spring clip 11d, can be equal or unequal.

[0154] In this embodiment, by setting the arrangement and center spacing of multiple spring contacts, the multiple spring contacts can form various combinations. The number and position of the spring contacts in these combinations can be adapted to the number and position of the gold fingers of various types of information cards, enabling the card connector 11 to communicate with different types of information cards, achieving multi-card compatibility and good scalability. Therefore, when the card connector 11 is applied to the card slot assembly 10 of the electronic device 100, the electronic device 100 can adapt to multiple types of information cards through the same card slot assembly 10, thereby reducing the number of card slot assemblies 10, reducing the space occupied by the electronic device 100, and contributing to the thinner and lighter design of the electronic device 100.

[0155] In some embodiments, the card connector 11 can communicate with a Nano SIM card having six gold fingers (also referred to as terminals, ports, metal contacts, etc.), and can also communicate with a second NM card having ten gold fingers, eight gold fingers, or other numbers of gold fingers, to be compatible with both Nano SIM cards and second NM cards. The size of the second NM card body is the same as that of the Nano SIM card body. In this application, the same size of the two information cards body can mean that the two information cards body sizes are identical, or that the two information cards body sizes are very similar and can both be stably placed in the same mounting slot of the card tray 2 of the card holder assembly 10.

[0156] In other embodiments, the card connector 11 can communicate with a Nano SIM card having six gold fingers, a second NM card having ten gold fingers, eight gold fingers, or other numbers of gold fingers, and a first NM card having eight gold fingers, to achieve compatibility with Nano SIM cards, second NM cards, and first NM cards. The first NM card is a first-generation NM card, the second NM card is a second-generation NM card, and the transmission rate of the second NM card is greater than that of the first NM card. The size of the first NM card body can be the same as that of the Nano SIM card body.

[0157] In other embodiments, the card connector 11 can communicate with a Nano SIM card with six gold fingers, or with a dual-function card with at least ten gold fingers, to ensure compatibility with both Nano SIM cards and dual-function cards. The dual-function card has the same dimensions as the Nano SIM card.

[0158] In other embodiments, the card connector 11 may also be compatible with a first NM card and / or a second NM card while being compatible with Nano SIM cards and dual-purpose cards. This application does not impose strict limitations on this aspect.

[0159] This application provides a Nano SIM card that is compatible with the card connector 11 described above. The structure of the Nano SIM card and the connection structure between the Nano SIM card and the card connector 11 are illustrated below.

[0160] Please refer to the following: Figures 10 to 12 , Figure 10 This is a schematic block diagram of a Nano SIM card 3 provided in an embodiment of this application. Figure 11 yes Figure 10 The diagram shown is a structural schematic of the Nano SIM card 3 in some embodiments. Figure 12 yes Figure 11 The Nano SIM card shown is 3 and Figure 5The diagram shows the structure of the card connector 11 when connected.

[0161] In some embodiments, such as Figure 10 and Figure 11 As shown, the Nano SIM card 3 may include a card body 31 and a card interface 32. The card body 31 includes a package 311 and a control circuit 312 and a SIM circuit 313 disposed within the package 311. The card interface 32 is fixed to the card body 31 and protrudes relative to the card body 31, and the card interface 32 is electrically connected to the control circuit 312. The package 311 is used to encapsulate the control circuit 312, the SIM circuit 313, and the electrical connection lines between the control circuit 312, the SIM circuit 313, and the card interface 32 for protection. The package 311 uses a dielectric material, including but not limited to ethylene-vinylacetate (EVA), polyvinyl butyral (PVB), ionomers, polyolefins (PO), silicone, thermoplastic polyurethane, etc.

[0162] The Nano SIM card 3 has two perpendicular length directions, width directions, and thickness directions. The maximum dimension of the card body 31 in the length direction is its length, the maximum dimension in the width direction is its width, and the maximum dimension in the thickness direction is its thickness. The dimensions of the card body 31 of the Nano SIM card 3 can be 12.30 mm in length, 8.80 mm in width, and 0.67 mm in thickness. In this embodiment, the dimensions of the card body are the same as the dimensions of the outer contour of the card body's packaging.

[0163] in, Figure 11 The Nano SIM card 3 has its card interface 32 facing upwards; Figure 12 The Nano SIM card 3 is positioned at a relatively [specific] angle. Figure 11 The viewpoint of the Nano SIM card 3 in the image is flipped vertically. Figure 12 The Nano SIM card 3 has its card interface 32 facing downwards, and the card connector 11 is located below the Nano SIM card 3.

[0164] In some embodiments, the Nano SIM card 3's body 31 includes a first side 3111, a second side 3112, a third side 3113, and a fourth side 3114. The first side 3111 and the third side 3113 are positioned opposite each other and extend along the length direction of the Nano SIM card 3, while the second side 3112 and the fourth side 3114 are positioned opposite each other and extend along the width direction of the Nano SIM card 3. The distance between the second side 3112 and the fourth side 3114 is greater than the distance between the first side 3111 and the third side 3113. In other words, the first side 3111 and the third side 3113 are the longer sides, and the second side 3112 and the fourth side 3114 are the shorter sides. The first side 3111 and the third side 3113 can be arranged parallel or approximately parallel, and the second side 3112 and the fourth side 3114 can be arranged parallel or approximately parallel.

[0165] In this design, one corner of the Nano SIM card 3's body 31 is a chamfered corner, located between the first side 3111 and the second side 3112. This chamfer forms a chamfered edge 3115, which forms an obtuse angle with both the first and second sides 3111 and 3112. The adjacent sides of the Nano SIM card 3's body 31 (including the first side 3111, the second side 3112, the third side 3113, the fourth side 3114, and the chamfered edge 3115) may have rounded or chamfered transition structures. In some other embodiments, the Nano SIM card 3's body 31 may not have the aforementioned chamfered corner; this application does not impose strict limitations on this.

[0166] For example, the card interface 32 of the Nano SIM card 3 includes at least six gold fingers, such as a first gold finger 321, a second gold finger 322, a third gold finger 323, a fourth gold finger 324, a fifth gold finger 325, and a sixth gold finger 326 arranged in an array. The first gold finger 321 is closer to the chamfered edge 3115 of the card body 31 of the Nano SIM card 3 than the other gold fingers.

[0167] When a Nano SIM card 3 is installed in the card tray 2, inserted into the card slot assembly 10, and connected to the card connector 11, all ten contacts of the card connector 11 abut against the Nano SIM card 3. Specifically, the third to eighth contacts 11c (i.e., the second to fourth rows of contacts) of the card connector 11 abut against and electrically connect to the first to sixth contacts 326 of the Nano SIM card 3, thus electrically connecting the Nano SIM card 3. In this embodiment, when the contacts of the card connector 11 abut against the contacts of the information card, they can achieve electrical connection.

[0168] In this embodiment, the card connector 11 arranges the third spring 11c to the eighth spring 11h in two columns and three rows. The third spring 11c to the eighth spring 11h can correspond one-to-one with the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. The card connector 11 can be electrically connected to the Nano SIM card 3 to realize communication.

[0169] Among them, in conjunction with reference Figure 9 and Figure 12 The center-to-center distance between the second row of spring contacts (11c, 11d) and the third row of spring contacts (11e, 11f), and the center-to-center distance between the third row of spring contacts (11e, 11f) and the fourth row of spring contacts (11g, 11h) are set within the range of 1.5mm to 2.8mm. This allows the electronic device 100 to communicate with the first gold fingers 321 to the sixth gold fingers 326 of the Nano SIM card 3 through the third spring contacts 11c to the eighth spring contacts 11h. It also effectively reduces the risk of short circuits between the gold fingers of the Nano SIM card 3, making the electrical connection between the card connector 11 and the Nano SIM card 3 reliable.

[0170] It is understandable that the shape and size of the gold fingers on Nano SIM cards from different countries / operators may vary, resulting in different gold finger arrangements. For example, Figure 11 The Nano SIM card 3 shown is one of the gold finger arrangements defined in the specification. In this embodiment, the card connector 11 and card holder assembly 10 are compatible with Nano SIM cards 3 from different countries / operators.

[0171] When the Nano SIM card 3 is connected to the card connector 11, the first row of spring contacts (11a, 11b) and the fifth row of spring contacts (11i, 11j) of the card connector 11 abut against the Nano SIM card 3. In some embodiments, such as... Figure 11 and Figure 12 As shown, when the Nano SIM card 3 is connected to the card connector 11, the first spring 11a and the third spring 11c can abut against and electrically connect to the first gold finger 321 of the Nano SIM card 3; the second spring 11b and the fourth spring 11d can abut against and electrically connect to the second gold finger 322 of the Nano SIM card 3; the seventh spring 11g and the ninth spring 11i can abut against and electrically connect to the fifth gold finger 325 of the Nano SIM card 3; and the eighth spring 11h and the tenth spring 11j can abut against and electrically connect to the sixth gold finger 326 of the Nano SIM card 3. Two springs abutting the same gold finger can communicate via the gold finger guide.

[0172] In some other embodiments, the multiple gold fingers of the card interface 32 of the Nano SIM card 3 may also have different... Figure 11The arrangement structure allows for the following: when the Nano SIM card 3 is connected to the card connector 11, the first row of spring contacts (11a, 11b) and the fifth row of spring contacts (11i, 11j) of the card connector 11 abut against the card body 31 of the Nano SIM card 3; or, the first spring contact 11a and the third spring contact 11c of the card connector 11 can abut against and electrically connect to the first gold finger 321 of the Nano SIM card 3, the second spring contact 11b and the fourth spring contact 11d can abut against and electrically connect to the second gold finger 322 of the Nano SIM card 3, and the fifth row of spring contacts (11i, 11j) of the card connector 11 abut against the card body 31 of the Nano SIM card 3; or, the seventh spring contact 11g and the ninth spring contact 11i can abut against and electrically connect to the fifth gold finger 325 of the Nano SIM card 3, and the eighth spring contact 11h and the tenth spring contact 11j can abut against and electrically connect to the Nano SIM card 3. The sixth gold finger 326 of the SIM card 3 and the first row of spring contacts (11a, 11b) of the card connector 11 abut against the card body 31 of the Nano SIM card 3. When the first row of spring contacts (11a, 11b) and / or the fifth row of spring contacts (11i, 11j) of the card connector 11 abut against the card body 31 of the Nano SIM card 3, the first row of spring contacts (11a, 11b) and / or the fifth row of spring contacts (11i, 11j) do not contact the gold finger of the Nano SIM card 3, and there is no electrical connection between them. This embodiment does not strictly limit the specific connection structure between the first row of spring contacts (11a, 11b) and the fifth row of spring contacts (11i, 11j) of the card connector 11 and the Nano SIM card 3.

[0173] For example, the six gold fingers of the Nano SIM card 3 can be used to transmit data signals (DATA), clock signals (CLK), programming voltage / input signals (VPP), reset signals (RST), ground signals (GND), and power signals (VCC), respectively. The data signals (DATA), also known as I / O signals, are used for data transmission communication; the programming voltage / input signals (VPP) are used to program the Nano SIM card 3, and can also be used for communication on cards that support near field communication (NFC).

[0174] As shown in Table 1 below, Table 1 is a table showing the correspondence between the multiple spring contacts of the card connector 11 and the multiple gold fingers of the Nano SIM card 3 and their transmission signals. For example, the third spring 11c of the card connector 11 is electrically connected to the first gold finger 321 of the Nano SIM card 3, and the first gold finger 321 is used to transmit data signals (DATA); the fourth spring 11d is electrically connected to the second gold finger 322 of the Nano SIM card 3, and the second gold finger 322 is used to transmit clock signals (CLK); the fifth spring 11e is electrically connected to the third gold finger 323 of the Nano SIM card 3, and the third gold finger 323 is used to transmit programming voltage / input signals (VPP); the sixth spring 11f is electrically connected to the fourth gold finger 324 of the Nano SIM card 3, and the fourth gold finger 324 is used to transmit reset signals (RST); the seventh spring 11g is electrically connected to the fifth gold finger 325 of the Nano SIM card 3, and the fifth gold finger 325 is used to transmit ground signals (GND); and the eighth spring 11h is electrically connected to the sixth gold finger 326 of the Nano SIM card 3, and the sixth gold finger 326 is used to transmit power signals (VCC).

[0175] Table 1

[0176]

[0177] In other embodiments, the six gold fingers of the Nano SIM card 3 may have other correspondences with the aforementioned six signals. The six gold fingers of the Nano SIM card 3 may also be used to transmit other combinations of signals. For example, the Nano SIM card 3 may not transmit the programming voltage / input signal (VPP), and the third gold finger 323 may be left floating. Correspondingly, the fifth spring 11e corresponding to the third gold finger 323 may also not provide the programming voltage / input signal (VPP). This application embodiment does not strictly limit this. In this application embodiment, leaving the gold finger floating means that the gold finger is not used to transmit signals and is not used to provide a signal port for the information card.

[0178] This application provides a first NM card that is compatible with the card connector 11 described above. The structure of the first NM card and the connection structure between the first NM card and the card connector 11 are illustrated below.

[0179] Please refer to the following: Figure 13 , Figure 14 as well as Figure 15 , Figure 13 This is a schematic block diagram of a first NM card 4 provided in an embodiment of this application. Figure 14 yes Figure 13 The diagram shown is a structural schematic of the first NM card 4 in some embodiments. Figure 15 yes Figure 14 The first NM card 4 shown is Figure 5The diagram shows the structure of the card connector 11 when connected.

[0180] In some embodiments, such as Figure 13 and Figure 14 As shown, the first NM card 4 includes a card body 41 and a card interface 42. The card body 41 includes a package 411 and a control circuit 412 and a storage circuit 413 disposed within the package 411. The card interface 42 is fixed to the card body 41 and exposed relative to the card body 41, and the card interface 42 is electrically connected to the control circuit 412. The package 411 is used to encapsulate the control circuit 412, the storage circuit 413, and the electrical connection lines between the control circuit 412, the storage circuit 413, and the card interface 42 for protection. The package 411 uses a dielectric material, including but not limited to ethylene-vinylacetate (EVA), polyvinyl butyral (PVB), ionomers, polyolefins (PO), silicone, thermoplastic polyurethane, etc.

[0181] The size of the card body 41 of the first NM card 4 can be the same as the size of the card body 31 of the Nano SIM card 3. The first NM card 4 has two perpendicular length directions, width directions, and thickness directions. The maximum dimension of the card body 41 of the first NM card 4 in the length direction is its length, the maximum dimension in the width direction is its width, and the maximum dimension in the thickness direction is its thickness. For example, the dimensions of the card body 41 of the first NM card 4 can be a length of 12.30 mm, a width of 8.80 mm, and a thickness of 0.67 mm.

[0182] in, Figure 14 The card interface 42 of the first NM card 4 is positioned facing upwards; Figure 15 The first NM card 4 in the game is located at a relatively... Figure 14 The viewpoint of the first NM card 4 in the video is flipped vertically. Figure 15 The card interface 42 of the first NM card 4 is positioned downwards, and the card connector 11 is located below the first NM card 4.

[0183] In some embodiments, the card body 41 of the first NM card 4 includes a first side 4111, a second side 4112, a third side 4113, and a fourth side 4114. The first side 4111 and the third side 4113 are arranged opposite each other and extend along the length direction of the first NM card 4, while the second side 4112 and the fourth side 4114 are arranged opposite each other and extend along the width direction of the first NM card 4. The distance between the second side 4112 and the fourth side 4114 is greater than the distance between the first side 4111 and the third side 4113. In other words, the first side 4111 and the third side 4113 are the longer sides, and the second side 4112 and the fourth side 4114 are the shorter sides. The first side 4111 and the third side 4113 can be arranged parallel or approximately parallel, and the second side 4112 and the fourth side 4114 can be arranged parallel or approximately parallel.

[0184] In this embodiment, one corner of the card body 41 of the first NM card 4 is a chamfered corner, located between the first side 4111 and the second side 4112. This chamfer forms a chamfered edge 4115, which forms an obtuse angle with both the first and second sides 4111 and 4112. The adjacent sides of the card body 41 of the first NM card 4 (including the first side 4111, the second side 4112, the third side 4113, the fourth side 4114, and the chamfered edge 4115) may have a rounded transition structure or a chamfered transition structure. In some other embodiments, the card body 41 of the first NM card 4 may not have the aforementioned chamfered corner, and this application does not strictly limit this. The size of the chamfered corner of the card body 41 of the first NM card 4 may be the same as or different from the size of the chamfered corner of the card body 31 of the Nano SIM card 3. If they are different, it is also considered that the size of the card body 41 of the first NM card 4 is the same as the size of the card body 31 of the Nano SIM card 3.

[0185] For example, the card interface 42 of the first NM card 4 includes at least eight gold fingers, such as a first gold finger 421, a second gold finger 422, a third gold finger 423, a fourth gold finger 424, a fifth gold finger 425, a sixth gold finger 426, a seventh gold finger 427 and an eighth gold finger 428 arranged in an array. The first gold finger 421 is closer to the cut edge 4115 of the card body 41 than the other gold fingers.

[0186] When the card tray 2 is equipped with the first NM card 4, the first NM card 4 is inserted into the card slot assembly 10, and the first NM card 4 is connected to the card connector 11, all ten spring contacts of the card connector 11 abut against the first NM card 4. Among them, the third spring contact 11c to the tenth spring contact 11j (that is, the second row of spring contact to the fourth row of spring contact) of the card connector 11 abut against the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a corresponding manner to electrically connect the first NM card 4.

[0187] In this embodiment, the card connector 11 arranges the third spring contacts 11c to the tenth spring contacts 11j in four rows and two columns. The center distance between the fourth row of spring contacts (11g, 11h) and the fifth row of spring contacts (11i, 11j) is smaller than the center distance between the second row of spring contacts (11c, 11d) and the third row of spring contacts (11e, 11f), and the center distance between the third row of spring contacts (11e, 11f) and the fourth row of spring contacts (11g, 11h). This allows the third spring contacts 11c to the eighth spring contacts 11h of the card connector 11 to be electrically connected to the six gold fingers of the Nano SIM card 3 one by one, and the third spring contacts 11c to the tenth spring contacts 11j can also be electrically connected to the eight gold fingers of the first NM card 4 one by one. Therefore, the card connector 11 is compatible with both the Nano SIM card 3 and the first NM card 4.

[0188] Among them, in conjunction with reference Figure 9 , Figure 12 and Figure 15 Because the Nano SIM card 3 and the first NM card 4 have different numbers, shapes, sizes, arrangements, and spacing of gold fingers, the card connector 11 effectively reduces the frequency of communication issues when the Nano SIM card 3 and the first NM card 4 have different numbers of gold fingers, shapes, sizes, arrangements, and spacing. This is achieved by setting the center distance between the second row of spring contacts (11c, 11d) and the third row of spring contacts (11e, 11f), and the center distance between the third row of spring contacts (11e, 11f) and the fourth row of spring contacts (11g, 11h) to be between 1.5mm and 2.8mm, and the center distance between the fourth row of spring contacts (11g, 11h) and the fifth row of spring contacts (11i, 11j) to be between 1.0mm and 1.7mm. This allows the third spring contacts 11c to 11h to communicate with the six gold fingers of the Nano SIM card 3, and the third spring contacts 11c to 11j to communicate with the eight gold fingers of the first NM card 4. The card connector 11 can effectively reduce the frequency of communication issues when the Nano SIM card 3 and the first NM card 4 are compatible. When SIM card 3 is installed in card connector 11, there is a risk of short circuit between the gold fingers of Nano SIM card 3 and the spring contacts of card connector 11, and when the first NM card 4 is installed in card connector 11, there is a risk of short circuit between the gold fingers of the first NM card 4 and the spring contacts of card connector 11. This ensures that the electrical connection between card connector 11 and Nano SIM card 3 and the first NM card 4 is reliable, enabling Nano SIM card 3 and the first NM card 4 to share the same card connector 11 in a time-sharing manner.

[0189] Among them, such as Figure 15As shown, although the seventh gold finger 427 and the eighth gold finger 428 of the first NM card 4 are L-shaped, the spring of the card connector 11 abuts against the gold finger of the information card through its contact point. The rest of the spring and the gold finger are separated by gaps. Therefore, the ninth spring 11i is electrically connected to the seventh gold finger 427, the seventh spring 11g and the seventh gold finger 427 are not in contact and have no electrical connection, the tenth spring 11j is electrically connected to the eighth gold finger 428, and the eighth spring 11h and the eighth gold finger 428 are not in contact and have no electrical connection.

[0190] When the first NM card 4 is connected to the card connector 11, the first row of spring contacts (11a, 11b) of the card connector 11 abuts against the first NM card 4. In some embodiments, the first spring contact 11a and the third spring contact 11c abut against and are electrically connected to the first gold finger 421 of the first NM card 4, and the second spring contact 11b and the fourth spring contact 11d abut against and are electrically connected to the second gold finger 422 of the first NM card 4; in other embodiments, the first row of spring contacts (11a, 11b) abuts against the card body 41 of the first NM card 4, in which case there is no electrical connection between the first row of spring contacts (11a, 11b) and the first NM card 4. The specific connection structure between the first row of spring contacts (11a, 11b) of the card connector 11 and the first NM card 4 is not strictly limited in the embodiments of this application.

[0191] For example, the first NM card 4 can employ an embedded multi-media card (EMMC) interface protocol. Of the eight gold fingers on the first NM card 4, four are used for transmitting data signals (DATA0, DATA1, DATA2, DATA3), one for transmitting a clock signal (CLK), one for transmitting a command and response signal (CMD), one for transmitting a ground signal (GND), and one for transmitting a power signal (VCC). The data signals (DATA0, DATA1, DATA2, DATA3) are used for data transmission and communication. The command and response signal (CMD) allows commands to be sent from an external device to the memory card, or allows the memory card to respond to commands from an external device.

[0192] As shown in Table 2 below, Table 2 is a table showing the correspondence between the multiple spring contacts of the card connector 11 and the multiple gold fingers of the Nano SIM card 3 and the first NM card 4, and their transmission signals. When the first NM card 4 is connected to the card connector 11, the third spring contact 11c to the tenth spring contact 11j of the card connector 11 abut against and electrically connect to the first gold fingers 421 to the eighth gold fingers 428 of the first NM card 4. In this application, if two gold fingers on two information cards abut against and are electrically connected to the same spring contact when connected to the card connector 11 of the electronic device 100, then the positions of these two gold fingers are considered to correspond. For example, the first gold fingers 421 to the sixth gold fingers 426 of the first NM card 4 correspond one-to-one with the positions of the first gold fingers 321 to the sixth gold fingers 326 of the Nano SIM card 3. When the positions of the two gold fingers of the two information cards correspond, the shape, size, and specific position of the two gold fingers on the card body can be the same or different; this application embodiment does not strictly limit this.

[0193] For example, the first gold finger 421, fourth gold finger 424, seventh gold finger 427, and eighth gold finger 428 of the first NM card 4 can be used to transmit data signals; for example, the first gold finger 421 is used to transmit data signal (DATA1), the fourth gold finger 424 is used to transmit data signal (DATA0), the seventh gold finger 427 is used to transmit data signal (DATA3), and the eighth gold finger 428 is used to transmit data signal (DATA2). The signals transmitted in the first gold finger 421, fourth gold finger 424, seventh gold finger 427, and eighth gold finger 428 can be interchanged in some other embodiments, which will not be elaborated here. The second gold finger 422 of the first NM card 4 is used to transmit clock signal (CLK), the third gold finger 423 is used to transmit command and response signal (CMD), the fifth gold finger 425 is used to transmit ground signal (GND), and the sixth gold finger 426 is used to transmit power signal (VCC).

[0194] Table 2

[0195]

[0196] In some other embodiments, the eight gold fingers of the first NM card 4 may have other correspondences with the above-mentioned eight signals, and the eight gold fingers of the first NM card 4 may also be used to transmit other combinations of signals. This application does not strictly limit this.

[0197] For example, the first gold finger 421, the fourth gold finger 424, and the eighth gold finger 428 of the first NM card 4 can all be electrically connected to a high-voltage resistant circuit or a protection switch to prevent the circuitry of the first NM card 4 from being burned out when the third spring 11c to the fifth spring 11e and the eighth spring 11h provide high voltage. The high-voltage resistant circuit or protection switch is located within the package 411 of the first NM card 4. In other embodiments, this can also be achieved by providing a high-impedance protection circuit within the electronic device, for example, by adding a protection circuit within the interface controller.

[0198] This application also provides a second NM card, which is a memory card. By appropriately tailoring and adapting high-speed protocols and modifying the card interface structure, the high-speed protocols can be applied to the second NM card, thereby improving its transmission rate to be higher than that of the first NM card. By increasing the transmission rate of the second NM card, the electronic device 100 that accepts the second NM card can better support usage scenarios and needs such as 5G, Wi-Fi 6, 8K high-definition video, and gaming, thus improving the user experience.

[0199] For example, the transfer rate of the first NM card is typically below 100MB / s. For instance, the first NM card 4 described above can use the eMMC interface protocol, with card interface 42 having eight gold fingers, and the transfer rate of the first NM card 4 can reach 90MB / s. The second NM card can use different interface protocols, with card interfaces having ten, eight, or other numbers of gold fingers, making the transfer rate typically higher than 100MB / s, and even reaching 1GB / s. For example, the second NM card can use Universal Flash Storage (UFS) interface protocol, Peripheral Component Interconnect Express (PCIe) interface protocol, Secure Digital (SD) interface protocol, Non-Volatile Memory Epress (NVMe) interface protocol, etc., and the transfer rate of the second NM card is generally in the range of 200MB / s to 800MB / s. In some embodiments, the second NM card can also use the eMMC interface protocol, using frequency conversion to increase the transfer rate.

[0200] Please refer to the following: Figure 16 , Figure 17 and Figure 18 , Figure 16 This is a schematic block diagram of a second NM card 5 provided in an embodiment of this application. Figure 17 yes Figure 16 The diagram shown is a structural schematic of the second NM card 5 in some embodiments. Figure 18 yes Figure 17 The second NM card 5 shown is Figure 5 The diagram shows the structure of the card connector 11 when connected.

[0201] In some embodiments, such as Figure 16 and Figure 17 As shown, the second NM card 5 includes a card body 51 and a card interface 52. The card body 51 includes a package 511 and a control circuit 512 and a storage circuit 513 disposed within the package 511. The card interface 52 is fixed to the card body 51 and is exposed on one side of the card body 51. The card interface 52 is electrically connected to the control circuit 512. The package 511 is used to encapsulate the control circuit 512, the storage circuit 513, and the electrical connection lines between the control circuit 512, the storage circuit 513, and the card interface 52 for protection. The package 511 uses a dielectric material, including but not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), ionomers, polyolefins (PO), silicone, thermoplastic polyurethane, etc.

[0202] The size of the card body 51 of the second NM card 5 can be the same as the size of the card body 31 of the Nano SIM card 3. The second NM card 5 has two perpendicular length directions, width directions, and thickness directions. The maximum dimension of the card body 51 in the length direction is its length, the maximum dimension in the width direction is its width, and the maximum dimension in the thickness direction is its thickness. For example, the dimensions of the card body 51 of the second NM card 5 can be a length of 12.30 mm, a width of 8.80 mm, and a thickness of 0.67 mm.

[0203] in, Figure 17 The card interface 52 of the second NM card 5 is positioned facing upwards; Figure 18 The second NM card 5 is located in a relatively... Figure 17 The viewpoint of the second NM card 5 in the image is flipped vertically. Figure 18 The card interface 52 of the second NM card 5 is positioned downwards, and the card connector 11 is located below the second NM card 5.

[0204] In some embodiments, the card body 51 of the second NM card 5 includes a first side 5111, a second side 5112, a third side 5113, and a fourth side 5114. The first side 5111 and the third side 5113 are arranged opposite each other and extend along the length direction of the second NM card 5, while the second side 5112 and the fourth side 5114 are arranged opposite each other and extend along the width direction of the second NM card 5. The distance between the second side 5112 and the fourth side 5114 is greater than the distance between the first side 5111 and the third side 5113. In other words, the first side 5111 and the third side 5113 are the longer sides, and the second side 5112 and the fourth side 5114 are the shorter sides. The first side 5111 and the third side 5113 can be arranged parallel or approximately parallel, and the second side 5112 and the fourth side 5114 can be arranged parallel or approximately parallel.

[0205] In this embodiment, one corner of the card body 51 of the second NM card 5 is a chamfered corner, located between the first side 5111 and the second side 5112. This chamfer forms a chamfered edge 5115, which forms an obtuse angle with both the first and second sides 5111 and 5112. The adjacent sides of the card body 51 (including the first side 5111, the second side 5112, the third side 5113, the fourth side 5114, and the chamfered edge 5115) may have a rounded transition structure or a chamfered transition structure. In some other embodiments, the card body 51 of the second NM card 5 may not have the aforementioned chamfered corner, and this application does not strictly limit this. The size of the chamfered corner of the card body 51 of the second NM card 5 may be the same as or different from the size of the chamfered corner of the card body 31 of the Nano SIM card 3. If they are different, it is also considered that the size of the card body 51 of the second NM card 5 is the same as the size of the card body 31 of the Nano SIM card 3.

[0206] For example, the card interface 52 of the second NM card 5 includes a plurality of gold fingers, which are exposed on the same side of the card body 51. The second NM card 5 has at least ten gold fingers, which may include, for example, a first gold finger 521, a second gold finger 522, a third gold finger 523, a fourth gold finger 524, a fifth gold finger 525, a sixth gold finger 526, a seventh gold finger 527, an eighth gold finger 528, a ninth gold finger 529, and a tenth gold finger 5210. The first gold finger 521, the third gold finger 523, the fifth gold finger 525, the seventh gold finger 527, and the ninth gold finger 529 of the second NM card 5 are arranged in the first column along the width direction of the second NM card 5. The second gold finger 522, the fourth gold finger 524, the sixth gold finger 526, the eighth gold finger 528, and the tenth gold finger 5210 are arranged in the second column along the width direction of the second NM card 5. The first column of gold fingers and the second column of gold fingers are arranged along the length direction of the second NM card 5. The first column of gold fingers (521, 522, 523, 525, 527, and 529) are arranged in the first column along the width direction of the second NM card 5. The five gold fingers (521, 522) in the first row correspond one-to-one with the five gold fingers in the second row (522, 524, 526, 528, 5210), arranged in pairs. That is, the ten gold fingers are arranged along the width of the second NM card 5 as the first row of gold fingers (521, 522), the second row of gold fingers (523, 524), the third row of gold fingers (525, 526), ​​the fourth row of gold fingers (527, 528), and the fifth row of gold fingers (529, 5210). At this time, the first gold finger 321 to the tenth gold finger 5210 are arranged in two columns of five rows.

[0207] The first column of gold fingers (521, 523, 525, 527, 529) is located between the second side 5112 and the second column of gold fingers (522, 524, 526, 528, 5210). That is, the first column of gold fingers (521, 523, 525, 527, 529) is arranged close to the second side 5112, and the second column of gold fingers (522, 524, 526, 528, 5210) is arranged close to the fourth side 5114.

[0208] Among them, the first gold finger 521 is located between the first side 5111 and the third gold finger 523, and the second gold finger 522 is located between the first side 5111 and the fourth gold finger 514. That is, the first row of gold fingers (521, 522) is arranged close to the first side 5111, and the fifth row of gold fingers (529, 5210) is arranged close to the third side 5113.

[0209] The first gold finger 521 may have a hypotenuse to form a right trapezoid. The hypotenuse of the first gold finger 521 faces the cut edge 5115 of the card body 51, and the distance between the two is greater than or equal to 0.1 mm, for example, 0.2 mm. The second gold finger 522 to the tenth gold finger 5210 may be rectangular. In some other embodiments, the first gold finger 521 may also be rectangular.

[0210] The center-to-center distance between the second row of gold fingers (523, 524) and the third row of gold fingers (525, 526) is greater than the center-to-center distance between the first row of gold fingers (521, 522) and the second row of gold fingers (523, 524), and also greater than the center-to-center distance between the fourth row of gold fingers (527, 528) and the fifth row of gold fingers (529, 5210).

[0211] When the second NM card 5 is connected to the card connector 11, the width direction of the second NM card 5 is parallel to the first direction of the card connector 11, and the length direction is parallel to the second direction of the card connector 11. All ten spring contacts of the card connector 11 abut against the second NM card 5. Specifically, when the card tray 2 is equipped with the second NM card 5, the second NM card 5 is inserted into the card slot assembly 10, and the second NM card 5 is connected to the card connector 11, the ten spring contacts of the card connector 11 abut against the ten gold fingers of the second NM card 5 one by one, and the first spring contact 11a to the tenth spring contact 11j abut against the first gold finger 521 to the tenth gold finger 5210 of the second NM card 5 one by one.

[0212] In this embodiment, the first to tenth spring contacts 11a to 11j of the card connector 11 are arranged in two rows of five. The center-to-center distance between the second row of spring contacts (11c, 11d) and the third row of spring contacts (11e, 11f), and the center-to-center distance between the third row of spring contacts (11e, 11f) and the fourth row of spring contacts (11g, 11h) are both greater than the center-to-center distance between the first row of spring contacts (11a, 11b) and the second row of spring contacts (11c, 11d), and the center-to-center distance between the fourth row of spring contacts (11g, 11h) and the fifth row of spring contacts (11i, 11j). This ensures that the third to eighth spring contacts 11h of the card connector 11 can correspond one-to-one with and electrically connect to the Nano. The first gold fingers 321 to 326 of the SIM card 3 and the third spring contacts 11c to 11j of the card connector 11 can correspondingly abut and electrically connect to the first gold fingers 421 to 428 of the first NM card 4. Similarly, the first spring contacts 11a to 11j of the card connector 11 can correspondingly abut and electrically connect to the first gold fingers 521 to 5210 of the second NM card 5. Therefore, the card connector 11 is compatible with the Nano SIM card 3, the first NM card 4, and the second NM card 5. In some other embodiments, the card connector 11 can also be designed to be compatible with the Nano SIM card 3 and the second NM card 5.

[0213] For example, see reference Figure 9 , Figure 12 , Figure 15 as well as Figure 18 The center-to-center distance between the second row of spring contacts (11c, 11d) and the third row of spring contacts (11e, 11f) of the card connector 11, and the center-to-center distance between the third row of spring contacts (11e, 11f) and the fourth row of spring contacts (11g, 11h) are set within the range of 1.5mm to 2.8mm. The center-to-center distance between the first row of spring contacts (11a, 11b) and the second row of spring contacts (11c, 11d) is set within the range of 1.0mm to 1.7mm. The center-to-center distance between the fourth row of spring contacts (11g, 11h) and the fifth row of spring contacts (11i, 11j) is set within the range of 1.0mm to 1.7mm. This allows the third spring contacts 11c to 11h to communicate with the six gold fingers of the Nano SIM card 3, the third spring contacts 11c to 11j to 11j to 11j to 11a to 11j ... to 11j to 11 to 11j to

[0214] Because the Nano SIM card 3, the first NM card 4, and the second NM card 5 have different numbers of gold fingers, different shapes of gold fingers, different arrangement positions of gold fingers, and different spacing distances of gold fingers, the unique design of the spacing between the first spring piece 11a to the tenth spring piece 11j ensures that the card connector 11 can be compatible with Nano SIM card 3, the first NM card 4, and the second NM card 5. This effectively reduces the risk of short circuits between the gold fingers of the Nano SIM card 3 and the spring pieces of the card connector 11 when the Nano SIM card 3 is placed on the card connector 11, the risk of short circuits between the gold fingers of the first NM card 4 and the spring pieces of the card connector 11 when the first NM card 4 is placed on the card connector 11, and the risk of short circuits between the gold fingers of the second NM card 5 and the spring pieces of the card connector 11 when the second NM card 5 is placed on the card connector 11. This ensures a reliable electrical connection between the card connector 11 and the Nano SIM card 3, the first NM card 4, and the second NM card 5, achieving Nano SIM card compatibility. SIM card 3, first NM card 4, and second NM card 5 can share the same card connector 11 in a time-sharing manner. It is understood that in some other embodiments, the card connector 11 may also be designed to be compatible with Nano SIM card 3 and second NM card 5.

[0215] Please see Figure 19 , Figure 19 yes Figure 1 The schematic block diagram of a portion of the circuitry of the electronic device 100 shown in some embodiments.

[0216] In some embodiments, the processor 20 of the electronic device 100 includes an interface controller 201, one or more memory card controllers 202, and a SIM card controller 203. The interface controller 201 is electrically connected to one or more memory card controllers 202 and SIM card controllers 203, and is also electrically connected to multiple contacts of the card connector 11. The memory card controllers 202 control the operation of the memory cards, and the SIM card controllers 203 control the operation of the Nano SIM cards 3. When different information cards are inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 can control the memory card controllers 202 or SIM card controllers 203 to communicate with the information cards via the card connector 11. For example, when a Nano SIM card 3 is installed in the card tray 2 and inserted into the card slot assembly 10, the interface controller 201 controls the SIM card controller 203 to communicate with the Nano SIM card 3 via the card connector 11; when a second NM card 5 is installed in the card tray 2 and inserted into the card slot assembly 10, the interface controller 201 controls the memory card controller 202 to communicate with the second NM card 5 via the card connector 11.

[0217] In this embodiment, the electronic device 100 can automatically identify the information card type through the processor 20 and control the controller corresponding to the information card to connect with the card connector 11, so that the information card can automatically match with the electronic device 100 and communicate, thereby improving the user experience.

[0218] The processor 20 may contain multiple controllers that are independent components, integrated components, or a single controller that is distributed across multiple components. This embodiment does not impose strict limitations on these limitations. The interface controller 201 may include multiple switches and wires. These switches may be arranged separately or centrally. This embodiment does not impose strict limitations on these arrangements.

[0219] For example, the processor 20 can identify the type of information card connected to the card connector 11 in various ways. For instance, the processor 20 can sequentially connect multiple controllers to the card connector 11, and identify the type of information card based on the matching status between the controllers and the information card. Alternatively, the processor 20 can also be equipped with a detection circuit for detecting the type of information card, and the processor 20 can identify the type of information card based on the detection result of the detection circuit. This application embodiment does not strictly limit the specific method by which the processor 20 identifies the type of information card.

[0220] In some embodiments, when the card slot assembly 10 of the electronic device 100 is compatible with the first NM card 4 and the second NM card 5, the memory card controller 202 may include a first memory card controller and a second memory card controller. The first memory card controller is used to control the operation of the first NM card 4, and the second memory card controller is used to control the operation of the second NM card 5. When the card tray 2 is equipped with the first NM card 4 and the first NM card 4 is inserted into the card slot assembly 10, the interface controller 201 controls the first memory card controller to communicate with the first NM card 4 via the card connector 11. When the card tray 2 is equipped with the second NM card 5 and the second NM card 5 is inserted into the card slot assembly 10, the interface controller 201 controls the second memory card controller to communicate with the second NM card 5 via the card connector 11.

[0221] In this application, the card interface of the second NM card 5 can be implemented in various ways. Examples are given below. In the following embodiments, the second NM card 5 can be connected to... Figure 5 Connector 11 is shown.

[0222] For example, the ten gold fingers of the second NM card 5 are arranged in two columns and five rows. The ten gold fingers of the second NM card 5 are arranged in the width direction as the first row of gold fingers (521, 522) to the fifth row of gold fingers (529, 5210). The ten gold fingers of the second NM card 5 are arranged in the length direction as the first column of gold fingers (521, 523, 525, 527, 529) and the second column of gold fingers (522, 524, 526, 528, 5210).

[0223] In the width direction, the center distance between the second row of gold fingers (523, 524) and the third row of gold fingers (525, 526) and the center distance between the third row of gold fingers (525, 526) and the fourth row of gold fingers (527, 528) are greater than the center distance between the first row of gold fingers (521, 522) and the second row of gold fingers (523, 524), and are also greater than the center distance between the fourth row of gold fingers (527, 528) and the fifth row of gold fingers (529, 5210).

[0224] For example, the center-to-center distance between the second row of gold fingers (523, 524) and the third row of gold fingers (525, 526) can be in the range of 1.5mm to 2.8mm; the center-to-center distance between the third row of gold fingers (525, 526) and the fourth row of gold fingers (527, 528) can be in the range of 1.5mm to 2.8mm; the center-to-center distance between the first row of gold fingers (521, 522) and the second row of gold fingers (523, 524) can be in the range of 1.0mm to 1.7mm; and the center-to-center distance between the fourth row of gold fingers (527, 528) and the fifth row of gold fingers (529, 5210) can be in the range of 1.0mm to 1.7mm.

[0225] Please see Figure 20 , Figure 20 yes Figure 17 The second NM card 5 is shown in a dimension diagram in some embodiments.

[0226] In some embodiments, the ten gold fingers of the second NM card 5 are arranged in two columns and five rows. The first column of gold fingers (521, 523, 525, 527, 529) is arranged near the second side 5112, and the second column of gold fingers (522, 524, 526, 528, 5210) is arranged near the fourth side 5114. Each column of gold fingers is aligned in the width direction. The first row of gold fingers (521, 522) is arranged near the first side 5111, and the fifth row of gold fingers (529, 5210) is arranged near the third side 5113. Each row of gold fingers is aligned in the length direction. The first gold finger 521 may have a bevel, forming a right trapezoid. The bevel of the first gold finger 521 faces the cut edge 5115 of the card body 51, and the distance between the two can be 0.2mm. The second to tenth gold fingers 5210 can be rectangular.

[0227] For example, in the width direction, the distance between the center of the second row of gold fingers (523, 524) and the first side 5111 can be 1.95mm, the distance between the center of the third row of gold fingers (525, 526) and the first side 5111 can be 4.25mm, the distance between the center of the third row of gold fingers (525, 526) and the third side 5113 can be 4.55mm, and the distance between the center of the fourth row of gold fingers (527, 528) and the third side 5113 can be 1.95mm. In the width direction, the distance between the first row of gold fingers (521, 522) and the second row of gold fingers (523, 524) can be 0.25mm, and the distance between the first row of gold fingers (521, 522) and the first side 5111 can be 0.2mm. Specifically, in the width direction, the distance between the fourth row of gold fingers (527, 528) and the fifth row of gold fingers (529, 5210) can be 0.25mm, and the distance between the fifth row of gold fingers (529, 5210) and the third side 5113 can be 0.2mm. In the length direction, the distance between the first column of gold fingers (521, 523, 525, 527, 529) and the second side 5112 can be 1.1mm, and the distance between the second column of gold fingers (522, 524, 526, 528, 5210) and the fourth side 5114 can be 1.1mm.

[0228] Each gold finger can be 3.2mm long and 1.0mm wide. The length of the first gold finger 521 is the dimension of its bottom edge, and the width of the first gold finger 521 is the dimension of its height.

[0229] The tolerances for the aforementioned shape dimensions and spacing dimensions are ±0.1 mm.

[0230] Please refer to the following: Figure 21A and Figure 21B , Figure 21A yes Figure 16 The diagram shows the dimensions of the second NM card 5 in some other embodiments. Figure 21B yes Figure 21A Another dimension diagram of the second NM card 5 is shown.

[0231] In some embodiments, the ten gold fingers of the second NM card 5 are arranged in two columns. The first column of gold fingers (521, 523, 525, 527, 529) is arranged near the second side 5112, and the second column of gold fingers (522, 524, 526, 528, 5210) is arranged near the fourth side 5114. Specifically, the first gold fingers 521 to the sixth gold fingers 526 are arranged in two columns and three rows, with each column aligned in the width direction. The first row of gold fingers (521, 522) is arranged near the first side 5111, with each row aligned in the length direction. The fourth row of gold fingers (527, 528) is aligned in the length direction. The first gold finger 521 may have a bevel, forming a right trapezoid, with the bevel facing the cut edge 5115 of the card body 51, and the distance between them can be 0.2mm. The second gold fingers 522 to the eighth gold fingers 528 can be rectangular. The ninth and tenth gold fingers 529 and 5210 can be L-shaped. The ninth gold finger 529 partially surrounds the seventh gold finger 527. The ninth gold finger 529 includes a first portion 5291 and a second portion, the first portion 5291 extending along the length direction and the second portion 5292 extending along the width direction. The first portion 5291 of the ninth gold finger 529 is located between the seventh gold finger 527 and the third side 5113, and the second portion 5292 of the ninth gold finger 529 connects to the first portion 5291 and is located between the seventh gold finger 527 and the second side 5112. The tenth gold finger 5210 includes a first portion 52101 and a second portion 52102, the first portion 52101 extending along the length direction and the second portion 52102 extending along the width direction. The first part 52101 of the tenth golden finger 5210 is located between the eighth golden finger 528 and the third side 5113. The second part 52102 of the tenth golden finger 5210 connects to the first part 5291 and is located between the eighth golden finger 528 and the second side 5112. As described above, the ninth golden finger 529 and the tenth golden finger 5210 can be understood as the fifth row of golden fingers (529, 5210).

[0232] For example, in the width direction, the distance between the center of the second row of gold fingers (523, 524) and the first side 5111 can be 1.95mm, the distance between the center of the third row of gold fingers (525, 526) and the first side 5111 can be 4.25mm, the distance between the center of the third row of gold fingers (525, 526) and the third side 5113 can be 4.55mm, and the distance between the center of the fourth row of gold fingers (527, 528) and the third side 5113 can be 1.95mm. In the width direction, the distance between the first row of gold fingers (521, 522) and the second row of gold fingers (523, 524) can be 0.25mm, and the distance between the first row of gold fingers (521, 522) and the first side 5111 can be 0.2mm. Specifically, in the width direction, the distance between the fourth row of gold fingers (527, 528) and the fifth row of gold fingers (529, 5210) can be 0.25mm, and the distance between the fifth row of gold fingers (529, 5210) and the third side 5113 can be 0.2mm. That is, in the width direction, the distance between the ninth gold finger 529 and the third side 5113 can be 0.2mm, and the distance between the first part 5291 of the ninth gold finger 529 and the seventh gold finger 527 can be 0.25mm; the distance between the tenth gold finger 5210 and the third side 5113 can be 0.2mm, and the distance between the first part 52101 of the tenth gold finger 5210 and the eighth gold finger 528 can be 0.25mm. Specifically, the top edge of the second portion 5292 of the ninth gold finger 529, near the first side 5111, can be flush with the top edge of the seventh gold finger 527, near the first side 5111; the top edge of the second portion 52102 of the tenth gold finger 5210, near the first side 5111, can be flush with the top edge of the eighth gold finger 528, near the first side 5111. In the width direction, the width of the first gold fingers 521 to the eighth gold finger 528, the first portion 5291 of the ninth gold finger 529, and the first portion 52101 of the tenth gold finger 5210 can all be 1.0 mm.

[0233] For example, in the length direction, the distance between the first gold finger 521, the third gold finger 523, and the fifth gold finger 525 and the second side 5112 can be 1.1 mm, and the distance between the second gold finger 522, the fourth gold finger 524, and the sixth gold finger 526 and the fourth side 5114 can be 1.1 mm. Specifically, in the length direction, the side of the seventh gold finger 527 near the fourth side 5114 and the side of the first portion 5291 of the ninth gold finger 529 near the fourth side 5114 can both be flush with the side of the fifth gold finger 525 near the fourth side 5114; the distance between the seventh gold finger 527 and the second portion 5292 of the ninth gold finger 529 can be 0.2 mm, and the distance between the ninth gold finger 529 and the second side 5112 can be 0.5 mm; the width of the second portion 5292 of the ninth gold finger 529 can be 0.9 mm. In the length direction, the side of the eighth gold finger 528 near the second side 5112 and the side of the first part 52101 of the tenth gold finger 5210 near the second side 5112 can both be flush with the side of the sixth gold finger 526 near the second side 5112; the distance between the eighth gold finger 528 and the second part 52102 of the tenth gold finger 5210 can be 0.2mm, the distance between the tenth gold finger 5210 and the fourth side 5114 can be 0.5mm; the width of the second part 52102 of the tenth gold finger 5210 can be 0.9mm.

[0234] The tolerances for the aforementioned shape dimensions and spacing dimensions are ±0.1 mm.

[0235] Please see Figure 22 , Figure 22 yes Figure 16 The second NM card 5 shown is a dimension diagram in some other embodiments.

[0236] In some embodiments, the first gold fingers 521 to the tenth gold fingers 5210 of the second NM card 5 are arranged in two columns and five rows. The first column of gold fingers (521, 523, 525, 527, 529) is arranged near the second side 5112, and the second column of gold fingers (522, 524, 526, 528, 5210) is arranged near the fourth side 5114. The first row of gold fingers (521, 522) is arranged near the first side 5111, and the fifth row of gold fingers (529, 5210) is arranged near the third side 5113. Each row of gold fingers is aligned in the length direction. The second NM card 5 also includes an eleventh gold finger 5220 and a twelfth gold finger 5230. The eleventh gold finger 5220 and the twelfth gold finger 5230 are arranged in the fourth row of gold fingers (527, 528, 5220, 5230). The eleventh gold finger 5220 is located between the second side 5112 and the seventh gold finger 527, and the twelfth gold finger 5230 is located between the fourth side 5114 and the eighth gold finger 528. Among them, the first gold finger 521 may have a hypotenuse to form a right trapezoid. The hypotenuse of the first gold finger 521 faces the cut edge 5115 of the card body 51, and the distance between the two can be 0.2mm. The second gold fingers 522 to the twelfth gold fingers 5230 can be rectangles.

[0237] For example, in the width direction, the distance between the center of the second row of gold fingers (523, 524) and the first side 5111 can be 1.95mm, the distance between the center of the third row of gold fingers (525, 526) and the first side 5111 can be 4.25mm, the distance between the center of the third row of gold fingers (525, 526) and the third side 5113 can be 4.55mm, and the distance between the center of the fourth row of gold fingers (527, 528, 5220, 5230) and the third side 5113 can be 1.95mm. In the width direction, the distance between the first row of gold fingers (521, 522) and the second row of gold fingers (523, 524) can be 0.25mm, and the distance between the first row of gold fingers (521, 522) and the first side 5111 can be 0.2mm. Specifically, in the width direction, the distance between the fourth row of gold fingers (527, 528, 5220, 5230) and the fifth row of gold fingers (529, 5210) can be 0.25mm, and the distance between the fifth row of gold fingers (529, 5210) and the third side 5113 can be 0.2mm. Furthermore, in the width direction, the width of each of the first gold fingers 521 to the twelfth gold fingers 5230 can be 1.0mm.

[0238] For example, in the length direction, the distance between the first gold finger 521, the third gold finger 523, and the fifth gold finger 525 and the second side 5112 can be 1.1 mm, and the distance between the second gold finger 522, the fourth gold finger 524, and the sixth gold finger 526 and the fourth side 5114 can be 1.1 mm. Specifically, in the length direction, the side of the seventh gold finger 527 near the fourth side 5114 and the side of the ninth gold finger 529 near the fourth side 5114 can both be flush with the side of the fifth gold finger 525 near the fourth side 5114; the side of the eleventh gold finger 5220 near the second side 5112 is flush with the side of the ninth gold finger 529 near the second side 5112; the distance between the seventh gold finger 527 and the eleventh gold finger 5220 can be 0.2 mm, the distance between the eleventh gold finger 5220 and the second side 5112 can be 0.5 mm, and the length of the eleventh gold finger 5220 can be 0.9 mm. Specifically, in the length direction, the side of the eighth gold finger 528 near the second side 5112 and the side of the tenth gold finger 5210 near the second side 5112 can both be flush with the side of the sixth gold finger 526 near the second side 5112; the side of the twelfth gold finger 5230 near the fourth side 5114 is flush with the side of the tenth gold finger 5210 near the fourth side 5114; the distance between the eighth gold finger 528 and the twelfth gold finger 5230 can be 0.2mm, the distance between the twelfth gold finger 5230 and the fourth side 5114 can be 0.5mm, and the length of the twelfth gold finger 5230 can be 0.9mm.

[0239] The tolerances for the aforementioned shape dimensions and spacing dimensions are ±0.1 mm.

[0240] Please see Figure 23 , Figure 23 yes Figure 16 The second NM card 5 shown is a dimension diagram in some other embodiments.

[0241] In some embodiments, the first to tenth gold fingers 5210 of the second NM card 5 are arranged in two columns and five rows. The first column of gold fingers (521, 523, 525, 527, 529) is arranged near the second side 5112, and the second column of gold fingers (522, 524, 526, 528, 5210) is arranged near the fourth side 5114. Each column of gold fingers is aligned in the width direction. The first row of gold fingers (521, 522) is arranged near the first side 5111, and the fifth row of gold fingers (529, 5210) is arranged near the third side 5113. Each row of gold fingers is aligned in the length direction. The first to tenth gold fingers 5210 can all be rectangular. The first gold finger 521 may be closer to the cut edge 5115 of the card body 51 than the other gold fingers.

[0242] For example, in the width direction, the distance between the center of the second row of gold fingers (523, 524) and the first side 5111 can be 1.86mm, the distance between the center of the third row of gold fingers (525, 526) and the first side 5111 can be 4.4mm, the distance between the center of the third row of gold fingers (525, 526) and the third side 5113 can be 4.4mm, and the distance between the center of the fourth row of gold fingers (527, 528) and the third side 5113 can be 1.86mm. The distance between the first row of gold fingers (521, 522) and the first side 5111 can be 0.2mm, and the distance between the fifth row of gold fingers (529, 5210) and the third side 5113 can be 0.2mm.

[0243] For example, in the length direction, the distance between the center of the first row of gold fingers (521, 523, 525, 527, 529) and the second side 5112 can be 2.68 mm, and the distance between the center of the second row of gold fingers (522, 524, 526, 528, 5210) and the fourth side 5114 can be 2.0 mm. The length of the card body 51 of the second NM card 5 can be 12.3 mm.

[0244] The tolerances for the aforementioned shape dimensions and spacing dimensions are ±0.1 mm.

[0245] Understandable Figures 20 to 23 The structural dimensions of the second NM card 5 shown are a partial example of the second NM card 5. The card interface 52 of the second NM card 5 can also have more gold finger arrangements and sizes. The card interface 52 of the second NM card 5 can include at least the first gold finger 521 to the tenth gold finger 5210. This application embodiment does not strictly limit this.

[0246] The following examples illustrate the UFS, PCIe, and SD interface protocols used in the second NM card, and also provide examples of circuitry in electronic devices compatible with Nano SIM cards and second NM cards. The UFS, PCIe, and SD interface protocols can all be applied to second NM cards with first to tenth gold fingers, for example... Figure 17 , Figures 20 to 23 The second NM card 5 shown below, and the second NM card with other card interface structures, are illustrated in the following embodiments. The second NM card 5 has... Figure 17 The card interface 52 shown is used as an example for illustration.

[0247] In some embodiments, the second NM card 5 employs the UFS interface protocol. The UFS protocol is a standard developed by the Joint Electron Device Engineering Council (JEDEC) to define the electrical interface for UFS universal flash memory and UFS storage devices. UFS defines a complete protocol stack, consisting of the application layer, transport layer, and interconnect layer from top to bottom. UFS defines a unique set of features, incorporating a subset of the eMMC standard's feature set. It uses the MIPI (Mobile Industry Processor Interface) alliance's UniPro interface as the data link layer and MIPI's M-PHY (serial interface) as the physical layer; together, these are called the UFS Interconnect Layer. The UFS protocol was first released as version 1.0 in 2011, followed by versions 1.1, 2.0, 2.1, and 3.0 in 2012, 2013, 2016, and 2018, respectively, with each update accompanied by speed improvements. The UFS protocol bridges the gap between eMMC and version 4.5. The main improvement of UFS lies in the transport layer. For data signal transmission, UFS uses differential serial transmission, supporting simultaneous read and write operations. Furthermore, differential signals offer strong anti-interference capabilities and provide wider bandwidth, while eMMC uses parallel data transmission. Therefore, compared to its predecessor, eMMC, UFS is characterized by higher speed and lower power consumption. Consequently, UFS's high speed and low power consumption make it suitable for electronic devices such as mobile phones.

[0248] For example, the second NM card 5 includes at least ten gold fingers, such as first gold fingers 521 to tenth gold fingers 5210. Among the first gold fingers 521 to tenth gold fingers 5210, four gold fingers are used to transmit data signals (RX+, RX-, TX+, TX-), one gold finger is used to transmit a reference clock signal (RCLK, which can also be named REF_CLK), one gold finger is used to transmit a first power signal (VCC), one gold finger is used to transmit a ground signal (VSS), and one gold finger is used to transmit a second power signal (VCCQ). In this case, the second NM card 5 can support the UFS protocol and achieve the basic performance of a high-speed card.

[0249] In this configuration, data signals (RX+) and (RX-) are input differential signals; data signals (TX+) and (TX-) are output differential signals; the first power signal (VCC) powers the flash memory chip (i.e., storage circuit 513) of the second NM card 5; and the second power signal (VCCQ) powers the control circuit 512 of the second NM card 5. In some embodiments, the second power signal (VCCQ) may also power the M-PHY interface, flash memory input / output, and other internal low-voltage circuits of the second NM card 5. The voltage of the first power signal (VCC) can be in the range of 1.7V to 1.95V, or in the range of 2.7V to 3.6V. The voltage of the second power signal (VCCQ) can be in the range of 1.1V to 1.3V.

[0250] In this configuration, among the first to tenth gold fingers 5210, the remaining two gold fingers can be both suspended; or, one of the remaining two gold fingers can be suspended while the other is used to transmit a detection signal (C / D); or, one of the remaining two gold fingers can be used to transmit a detection signal (C / D) while the other is used to transmit other signals; or, both of the remaining two gold fingers can be used to transmit detection signals (C / D). The detection signal (C / D) can be a special data signal. When the information card is electrically connected to the card connector and communicating with the electronic device, the electronic device can use the detection signal (C / D) to identify whether the inserted information card is the second NM card 5. In some embodiments, the electronic device can also use the detection signal (C / D) to identify the version of the inserted second NM card 5 or the interface protocol of the inserted second NM card 5. The fact that the second NM card 5 transmits the detection signal (C / D) through at least one of its gold fingers reduces the difficulty for the electronic device to identify the second NM card 5. In some other embodiments, one or both of the remaining two gold fingers in the first gold finger 521 to the tenth gold finger 5210 may also be used to transmit other signals.

[0251] The following example illustrates the first signal arrangement method of the second NM card 5 using the UFS interface protocol.

[0252] Please see Figure 24 , Figure 24 yes Figure 17 The diagram shown is a schematic representation of the second NM card 5 in some embodiments.

[0253] For example, the first gold finger 521, the third gold finger 523, the ninth gold finger 529, and the tenth gold finger 5210 of the second NM card 5 are used to transmit data signals (RX+, RX-, TX+, TX-). The following embodiment uses the first gold finger 521 for transmitting data signal (RX+), the third gold finger 523 for transmitting data signal (RX-), the ninth gold finger 529 for transmitting data signal (TX+), and the tenth gold finger 5210 for transmitting data signal (TX-) as examples. In other embodiments, the data signals transmitted by the first gold finger 521, the third gold finger 523, the ninth gold finger 529, and the tenth gold finger 5210 can be interchanged. For example, the data signals transmitted by the first gold finger 521 and the third gold finger 523 can be interchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged. Other embodiments will not be described further here.

[0254] The second gold finger 522 is used to transmit the second power signal (VCCQ); the fourth gold finger 524 is used to transmit the reference clock signal (RCLK); the seventh gold finger 527 is used to transmit the ground signal (VSS); and the eighth gold finger 528 is used to transmit the first power signal (VCC). The fifth gold finger 525 can be used to transmit a detection signal (C / D). The sixth gold finger 526 is left floating.

[0255] As shown in Table 3 below, Table 3 shows the correspondence between the multiple spring contacts of the card connector 11 and the multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the second NM card 5, and their transmission signals. When the second NM card 5 is connected to the card connector 11, the first spring contacts 11a to 11j of the card connector 11 abut against and electrically connect to the first gold fingers 521 to 5210 of the second NM card 5, and the third gold fingers 523 to 528 of the second NM card 5 correspond to the positions of the first gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold fingers 523 to 5210 of the second NM card 5 correspond to the positions of the first gold fingers 421 to 428 of the first NM card 4.

[0256] Table 3

[0257]

[0258] In this embodiment, the second NM card 5 arranges the second power signal (VCCQ) required by the UFS protocol on the second gold finger 522. Since the second gold finger 522 of the second NM card 5 has no positional correspondence with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the second gold finger 522 of the second NM card 5 does not need to share the same spring contact with the multiplexer connector 11 of the Nano SIM card 3 and the first NM card 4. This avoids the second power signal (VCCQ) sharing the same spring contact with the data signals of the Nano SIM card 3 and the first NM card 4, thereby reducing the risk of the Nano SIM card 3 and the first NM card 4 being burned out by the second power signal (VCCQ) when inserted into the electronic device 100 and the card connector 11. The electronic device 100 has high reliability in compatibility with the Nano SIM card 3, the first NM card 4, and the second NM card 5. In addition, the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design to prevent the circuit from being burned out by the second power signal (VCCQ), which can reduce costs.

[0259] The second NM card 5 arranges one of its high-speed data signals (e.g., RX+) on the first gold finger 521. Since the first gold finger 521 of the second NM card 5 has no positional correspondence with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the first spring 11a connects to the high-speed data interface of the processor 20 of the electronic device 100 without needing to connect to the low-speed data interface. Regardless of whether the information card inserted in the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the first spring 11a. This reduces the difficulty of switching between the high-speed data interface and the low-speed data interface, simplifies the circuit of the processor 20, and reduces the design difficulty and cost.

[0260] Furthermore, since the seventh gold finger 527 of the second NM card 5 corresponds to the fifth gold finger 325 of the Nano SIM card 3 and the fifth gold finger 425 of the first NM card 4, when inserted into the electronic device 100, they all abut against and are electrically connected to the seventh spring 11g of the card connector 11. The seventh gold finger 527 of the second NM card 5, the fifth gold finger 325 of the Nano SIM card 3, and the fifth gold finger 425 of the first NM card 4 are all used to transmit ground signals (VSS / GND / GND respectively). Therefore, the processor 20 of the electronic device 100 can be electrically connected to the seventh spring 11g of the card connector 11 through the same ground interface. Regardless of whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the seventh spring 11g, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0261] The eighth gold finger 528 of the second NM card 5 corresponds to the sixth gold finger 326 of the Nano SIM card 3 and the sixth gold finger 426 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the eighth spring 11h of the card connector 11. The eighth gold finger 528 of the second NM card 5, the sixth gold finger 326 of the Nano SIM card 3, and the sixth gold finger 426 of the first NM card 4 are all used to transmit power signals (VCC / VCC / VCC respectively). Therefore, the processor 20 of the electronic device 100 can be electrically connected to the eighth spring 11h of the card connector 11 through the same power interface. Regardless of whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the eighth spring 11h, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0262] The fourth gold finger 524 of the second NM card 5 corresponds to the second gold finger 322 of the Nano SIM card 3 and the second gold finger 422 of the first NM card 4. When inserted into the electronic device 100, it abuts against and is electrically connected to the fourth spring 11d of the card connector 11. The fourth gold finger 524 of the second NM card 5 is used to transmit the reference clock signal (RCLK), the second gold finger 322 of the Nano SIM card 3 is used to transmit the clock signal (CLK), and the second gold finger 422 of the first NM card 4 is used to transmit the clock signal (CLK). The second NM card 5, Nano SIM card 3, and first NM card 4 can time-division multiplex the fourth spring 11d. The processor 20 can provide clock signals of different frequencies through the fourth spring 11d without switching data interface signals, thereby simplifying the circuit of the processor 20 and reducing design complexity and cost. In some scenarios, if the first NM card 4, the second NM card 5, and the Nano SIM card 3 have clock signals of the same frequency, the processor 20 can provide the same clock signal for the three cards without switching, which simplifies the design of the processor 20. For example, a unified clock frequency of 20MHz can be used.

[0263] The third gold finger 523 of the second NM card 5 corresponds to the position of the first gold finger 321 of the Nano SIM card 3 and the position of the first gold finger 421 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the third spring 11c of the card connector 11. The third gold finger 523 of the second NM card 5 is used to transmit data signals (e.g., RX-), the first gold finger 321 of the Nano SIM card 3 is used to transmit data signals (DATA), and the first gold finger 421 of the first NM card 4 is used to transmit data signals (e.g., DATA1). The second NM card 5, the Nano SIM card 3, and the first NM card can time-division multiplex the third spring 11c.

[0264] The fifth gold finger 525 of the second NM card 5 corresponds to the third gold finger 323 of the Nano SIM card 3 and the third gold finger 423 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the fifth spring 11e of the card connector 11. The fifth gold finger 525 of the second NM card 5 is used to transmit detection signals (C / D), the third gold finger 323 of the Nano SIM card 3 is used to transmit programming voltage / input signals (VPP), and the third gold finger 423 of the first NM card 4 is used to transmit command and response signals (CMD). The fifth spring 11e of the second NM card 5, Nano SIM card 3, and first NM card 4 can be time-division multiplexed. Optionally, the programming voltage / input signal (VPP) of the Nano SIM card 3 may not be supported to reduce the design complexity of the processor 20.

[0265] The ninth gold finger 529 of the second NM card 5 corresponds to the seventh gold finger 427 of the first NM card 4. When inserted into the electronic device 100, both abut against and are electrically connected to the ninth spring 11i of the card connector 11. The ninth gold finger 529 of the second NM card 5 is used to transmit data signals (e.g., TX+), and the seventh gold finger 427 of the first NM card 4 is used to transmit data signals (e.g., DATA3). The second NM card 5 and the first NM card 4 can time-division multiplex the ninth spring 11i.

[0266] The tenth gold finger 5210 of the second NM card 5 corresponds to the eighth gold finger 428 of the first NM card 4. When inserted into the electronic device 100, both abut against and are electrically connected to the tenth spring 11j of the card connector 11. The tenth gold finger 5210 of the second NM card 5 is used to transmit data signals (e.g., TX-), and the eighth gold finger 428 of the first NM card 4 is used to transmit data signals (e.g., DATA2). The second NM card 5 and the first NM card 4 can time-division multiplex the tenth spring 11j.

[0267] When the electronic device 100 is compatible with Nano SIM card 3 and second NM card 5, but not compatible with first NM card 4, the ninth spring 11i and tenth spring 11j of the card connector 11 can also be unique springs of the second NM card 5. Both the ninth spring 11i and the tenth spring 11j are connected to the high-speed data interface. Regardless of whether the information card inserted in the electronic device 100 is the second NM card 5 or the Nano SIM card 3, the processor 20 does not need to switch the interface electrically connected to the ninth spring 11i and the tenth spring 11j, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0268] For example, the fourth gold finger 524 and the tenth gold finger 5210 of the second NM card 5 can both be electrically connected to a high-voltage resistant circuit or a protection switch to prevent the circuit from burning out when the card interface 52 of the second NM card 5 is short-circuited. The high-voltage resistant circuit or protection switch is located within the package 511 of the second NM card 5. In some other embodiments, the circuitry of the second NM card 5 can also be prevented from burning out by providing a high-impedance protection circuit within the electronic device, for example, by adding a protection circuit within the interface controller of the electronic device.

[0269] The time-division multiplexing of a certain spring in the embodiments of this application may include providing different signals when different information cards are inserted. For example, when a first NM card 4 is inserted, a certain spring provides the signal corresponding to the gold fingers of the first NM card 4. When a second NM card 5 is inserted, the spring provides the signal corresponding to the gold fingers of the second NM card 5. This is an example scenario of time-division multiplexing.

[0270] In some other embodiments, the fifth gold finger 525 may be suspended, and the sixth gold finger 526 may be used to transmit C / D signals; or, both the fifth gold finger 525 and the sixth gold finger 526 may be suspended.

[0271] Please see Figure 25 , Figure 25 yes Figure 1 The diagram shows a portion of the circuitry of the electronic device 100 in some embodiments.

[0272] In some embodiments, the card slot assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as follows: Figure 24 As shown. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203 and a second memory card controller 2022. The interface controller 201 is electrically connected to the SIM card controller 203 and the second memory card controller 2022. The interface controller 201 is also electrically connected to the first spring 11a to the tenth spring 11j of the card connector 11 of the card socket assembly 10.

[0273] The SIM card controller 203 includes a data interface, a clock interface, a programming voltage / input interface, and a reset interface. The data interface is used to transmit data signals (DATA), the clock interface is used to transmit clock signals (CLK), the programming voltage / input interface is used to transmit programming voltage / input signals (VPP), and the reset interface is used to transmit reset signals (RST). Optionally, the programming voltage / input interface may not be supported, reducing the design complexity of the processor 20. Figure 25 In the accompanying drawings and related descriptions, the multiple interfaces of the SIM card controller 203 are illustrated by the signals they transmit.

[0274] The second memory card controller 2022 supports the UFS protocol. The second memory card controller 2022 includes four data interfaces, a reference clock interface, a second power interface, and a detection interface. The four data interfaces are used to transmit data signals (RX+, RX-, TX+, TX-), the reference clock interface is used to transmit a reference clock signal (RCLK), the second power interface is used to transmit a second power signal (VCCQ), and the detection interface is used to transmit detection signals (C / D). Figure 25 In the accompanying drawings and related descriptions, the multiple interfaces of the second memory card controller 2022 are schematically identified by the signals they transmit. In some other embodiments, the second power interface may also be independent of the second memory card controller 2022; this application does not strictly limit this.

[0275] The processor 20 also includes a power interface and a ground interface. The power interface is used to transmit a power signal (VCC) or a first power signal (VCC), and the ground interface is used to transmit a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface can be independently located outside the SIM card controller 203 and the second memory card controller 2022, or they can be separated and integrated into the SIM card controller 203 and the second memory card controller 2022. This application embodiment does not strictly limit this. Figure 25 In the accompanying drawings, the power interface and ground interface are shown as independent of the SIM card controller 203 and the second memory card controller 2022, and are respectively labeled as power and ground.

[0276] For example, interface controller 201 is used to connect SIM card controller 203 to card connector 11, or to connect second memory card controller 2022 to card connector 11. Interface controller 201 may include multiple switches and wires.

[0277] In some embodiments, the interface controller 201 includes a first switch 2011, a second switch 2012, and a third switch 2013.

[0278] The first switch 2011 connects a data interface (e.g., RX-) of the second memory card controller 2022 and a data interface (DATA) of the SIM card controller 203. The first switch 2011 is also connected to the third spring 11c of the card connector 11. The first switch 2011 is used to connect the third spring 11c to the data interface (e.g., RX-) of the second memory card controller 2022, or to connect the third spring 11c to the data interface (DATA) of the SIM card controller 203.

[0279] The second switch 2012 connects the reference clock interface (RCLK) of the second memory card controller 2022 and the clock interface (CLK) of the SIM card controller 203. The second switch 2012 is also connected to the fourth spring 11d of the card connector 11. The second switch 2012 is used to connect the fourth spring 11d to the reference clock interface (RCLK) of the second memory card controller 2022, or to connect the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

[0280] The third switch 2013 connects the detection interface (C / D) of the second memory card controller 2022 and the programming voltage / input interface (VPP) of the SIM card controller 203. The third switch 2013 also connects the fifth spring 11e of the card connector 11. The third switch 2013 is used to connect the fifth spring 11e to the detection interface (C / D) of the second memory card controller 2022, or to connect the fifth spring 11e to the programming voltage / input interface (VPP) of the SIM card controller 203.

[0281] Another data interface (e.g., RX+) of the second memory card controller 2022 is connected to the first spring 11a of the interface controller 201 electrical connection card connector 11. The second power interface (VCCQ) of the second memory card controller 2022 is connected to the second spring 11b of the interface controller 201 electrical connection card connector 11. Another data interface (e.g., TX+) of the second memory card controller 2022 is connected to the ninth spring 11i of the interface controller 201 electrical connection card connector 11. Another data interface (e.g., TX-) of the second memory card controller 2022 is connected to the tenth spring 11j of the interface controller 201 electrical connection card connector 11. The power interface of the processor 20 is connected to the eighth spring 11h of the interface controller 201 electrical connection card connector 11. The ground interface of the processor 20 is connected to the seventh spring 11g of the interface controller 201 electrical connection card connector 11. The reset interface (RST) of the SIM card controller 203 is connected to the sixth spring 11f of the interface controller 201 electrical connection card connector 11.

[0282] Specifically, the interface controller 201 can be connected by wires to maintain a conductive state between the data interface (e.g., RX+) of the second memory card controller 2022 and the first spring 11a, between the second power interface (VCCQ) of the second memory card controller 2022 and the second spring 11b, between the data interface (e.g., TX+) of the second memory card controller 2022 and the ninth spring 11i, between the data interface (e.g., TX-) of the second memory card controller 2022 and the tenth spring 11j, between the power interface of the processor 20 and the eighth spring 11h, and between the ground interface and the seventh spring 11g. The interface controller 201 can also be connected in series with a switch to switch between the conductive and disconnected states. This embodiment of the application does not strictly limit this.

[0283] In this embodiment, when the Nano SIM card 3 is inserted into the card slot assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 connects the SIM card controller 203 and the card connector 11. The SIM card controller 203 transmits data signals (DATA), clock signals (CLK), transmission programming voltage / input signals (VPP), and reset signals (RST) with the Nano SIM card 3 through the third spring 11c to the sixth spring 11f of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the Nano SIM card 3 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The Nano SIM card 3 communicates with the electronic device 100.

[0284] When the second NM card 5 is inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 to the card connector 11. The second memory card controller 2022 transmits data signals (RX+, RX-, TX+, TX-), reference clock signals (RCLK), second power signals (VCCQ), and detection signals (C / D) with the second NM card 5 via the first spring 11a to the fifth spring 11e, the ninth spring 11i, and the tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits the first power signal (VCC) and ground signal (VSS) with the second NM card 5 via the eighth spring 11h and the seventh spring 11g of the card connector 11. Thus, the second NM card 5 communicates with the electronic device 100. Therefore, the electronic device 100 is compatible with both the Nano SIM card 3 and the second NM card 5.

[0285] In some other embodiments, the programming voltage / input signal (VPP) may not be supported to reduce the design complexity of the processor 20. In this case, the SIM card controller 203 may not include the programming voltage / input interface (VPP), the interface controller 201 may not include the third switch 2013, and the detection interface (C / D) of the second memory card controller 2022 is electrically connected to the fifth spring 11e of the card connector 11 through the interface controller 201. Other solutions are described in the above embodiments and will not be repeated here.

[0286] Understandably, when the fifth gold finger 525 of the second NM card 5 is left floating and the sixth gold finger 526 is used to transmit detection signals (C / D), the interface controller 201 makes adaptive adjustments. For example, the interface controller 201 includes a fourth switch 2014, which can omit the third switch 2013. The detection interface (C / D) of the second memory card controller 2022 is connected to the fourth switch 2014. The interface controller 201 is also used to connect the detection interface (C / D) of the second memory card controller 2022 to the sixth spring 11f when the second NM card 5 is inserted into the electronic device 100. When both the fifth gold finger 525 and the sixth gold finger 526 of the second NM card 5 are left floating, the second memory card controller 2022 does not need to have a detection interface, and the interface controller 201 makes adaptive adjustments. For example, the fourth switch 2014 may also be omitted.

[0287] Please see Figure 26 , Figure 26 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device 100 shown in some other embodiments.

[0288] In some embodiments, the card slot assembly 10 of the electronic device 100 is compatible with Nano SIM card 3, first NM card 4, and second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as follows: Figure 24 As shown. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021, and a second memory card controller 2022. The SIM card controller 203, the first memory card controller 2021, and the second memory card controller 2022 are electrically connected to the interface controller 201. The interface controller 201 is electrically connected to the first spring 11a to the tenth spring 11j of the card connector 11 of the card socket assembly 10.

[0289] The SIM card controller 203 and the second memory card controller 2022 can be found in [reference]. Figure 25The relevant descriptions of the corresponding embodiments will not be repeated here. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexed interface. The four data interfaces are used to transmit data signals (DATA0, DATA1, DATA2, DATA3), the clock interface is used to transmit clock signals (CLK), and the command and response multiplexed interface is used to transmit command and response signals (CMD). Figure 26 In the accompanying drawings and related descriptions, the multiple interfaces of the first memory card controller 2021 are schematically identified by the signals they transmit. The power interface and ground interface can also be integrated into the first memory card controller 2021 after being separated.

[0290] For example, the interface controller 201 is used to connect the SIM card controller 203 to the card connector 11, or to connect the first memory card controller 2021 to the card connector 11, or to connect the second memory card controller 2022 to the card connector 11. The interface controller 201 may include multiple switches and wires.

[0291] In some embodiments, the interface controller 201 includes a first switch 2011, a second switch 2012, a third switch 2013, a fourth switch 2014, a fifth switch 2015, and a sixth switch 2016.

[0292] The first switch 2011 is connected to a data interface (e.g., RX-) of the second memory card controller 2022, a data interface (e.g., DATA1) of the first memory card controller 2021, and a data interface (DATA) of the SIM card controller 203. The first switch 2011 is also connected to the third spring 11c of the card connector 11. The first switch 2011 is used to connect the third spring 11c to the data interface (e.g., RX-) of the second memory card controller 2022, or to the data interface (e.g., DATA1) of the first memory card controller 2021, or to the data interface (DATA) of the SIM card controller 203.

[0293] The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022, the clock interface (CLK) of the first memory card controller 2021, and the clock interface (CLK) of the SIM card controller 203. The second switch 2012 is also connected to the fourth spring 11d of the card connector 11. The second switch 2012 is used to connect the fourth spring 11d to the reference clock interface (RCLK) of the second memory card controller 2022, or to connect the third spring 11c to the clock interface (CLK) of the first memory card controller 2021, or to connect the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

[0294] The third switch 2013 connects to the detection interface (C / D) of the second memory card controller 2022, the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the programming voltage / input interface (VPP) of the SIM card controller 203. The third switch 2013 also connects to the fifth contact spring 11e of the card connector 11. The third switch 2013 is used to connect the fifth contact spring 11e to the detection interface (C / D) of the second memory card controller 2022, or to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or to the programming voltage / input interface (VPP) of the SIM card controller 203. Optionally, the detection interface (C / D) or the programming voltage / input interface (VPP) may or may not be supported to reduce the design complexity of the processor 20.

[0295] The fourth switch 2014 is connected to another data interface (e.g., DATA0) of the first memory card controller 2021 and the reset interface (RST) of the SIM card controller 203. The fourth switch 2014 is also connected to the sixth spring 11f of the card connector 11. The fourth switch 2014 is used to connect the sixth spring 11f to the data interface (e.g., DATA0) of the first memory card controller 2021, or to connect the sixth spring 11f to the reset interface (RST) of the SIM card controller 203.

[0296] The fifth switch 2015 connects another data interface (e.g., TX+) of the second memory card controller 2022 and another data interface (e.g., DATA3) of the first memory card controller 2021. The fifth switch 2015 also connects to the ninth spring 11i of the card connector 11. The fifth switch 2015 is used to connect the ninth spring 11i to the data interface (e.g., TX+) of the second memory card controller 2022, or to connect the ninth spring 11i to the data interface (e.g., DATA3) of the first memory card controller 2021.

[0297] The sixth switch 2016 connects to another data interface (e.g., TX-) of the second memory card controller 2022 and another data interface (e.g., DATA2) of the first memory card controller 2021. The sixth switch 2016 also connects to the tenth spring 11j of the card connector 11. The sixth switch 2016 is used to connect the tenth spring 11j to the data interface (e.g., TX-) of the second memory card controller 2022, or to connect the tenth spring 11j to the data interface (e.g., DATA2) of the first memory card controller 2021.

[0298] Another data interface (e.g., RX+) of the second memory card controller 2022 is electrically connected to the first spring 11a of the interface controller 201 via the interface controller 201. The second power interface (VCCQ) of the second memory card controller 2022 is electrically connected to the second spring 11b of the interface controller 201 via the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth spring 11h of the interface controller 201 via the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh spring 11g of the interface controller 201. The interface controller 201 can maintain a conductive state by connecting wires between the data interface (e.g., RX+) of the second memory card controller 2022 and the first spring 11a, between the second power interface (VCCQ) and the second spring 11b, between the power interface of the processor 20 and the eighth spring 11h, and between the ground interface and the seventh spring 11g. Alternatively, the interface controller 201 can be connected in series with a switch to switch between the conductive and deactivated states. This embodiment does not strictly limit this approach.

[0299] In this embodiment, when the Nano SIM card 3 is inserted into the card slot assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 connects the SIM card controller 203 and the card connector 11. The SIM card controller 203 transmits data signals (DATA), clock signals (CLK), transmission programming voltage / input signals (VPP), and reset signals (RST) with the Nano SIM card 3 through the third spring 11c to the sixth spring 11f of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the Nano SIM card 3 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The Nano SIM card 3 communicates with the electronic device 100.

[0300] When the first NM card 4 is inserted into the card slot assembly 10 of the electronic device 100 and the first NM card 4 is electrically connected to the card connector 11, the interface controller 201 connects the first memory card controller 2021 to the card connector 11. The first memory card controller 2021 transmits data signals (DATA0, DATA1, DATA2, DATA3), clock signals (CLK), and command and response signals (CMD) with the first NM card 4 through the third spring 11c to the sixth spring 11f, the ninth spring 11i, and the tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the first NM card 4 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The first NM card 4 communicates with the electronic device 100.

[0301] When the second NM card 5 is inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 to the card connector 11. The second memory card controller 2022 transmits data signals (RX+, RX-, TX+, TX-), reference clock signals (RCLK), second power signals (VCCQ), and detection signals (C / D) with the second NM card 5 via the first spring 11a to the fifth spring 11e, the ninth spring 11i, and the tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits the first power signal (VCC) and ground signal (VSS) with the second NM card 5 via the eighth spring 11h and the seventh spring 11g of the card connector 11. The second NM card 5 communicates with the electronic device 100. Therefore, the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4, and the second NM card 5.

[0302] In some other embodiments, the programming voltage / input signal (VPP) may not be supported to reduce the design complexity of the processor 20. In this case, the SIM card controller 203 may not include the programming voltage / input interface (VPP). The third switch 2013 is connected to the detection interface (C / D) of the second memory card controller 2022 and the command and response multiplexing interface (CMD) of the first memory card controller 2021. The third switch 2013 is also connected to the fifth spring 11e of the card connector 11. Other solutions are described in the above embodiments and will not be repeated here.

[0303] Understandably, when the fifth gold finger 525 of the second NM card 5 is left floating and the sixth gold finger 526 is used to transmit detection signals (C / D), the interface controller 201 makes adaptive adjustments. For example, the detection interface (C / D) of the second memory card controller 2022 is connected to the fourth switch 2014. The interface controller 201 is also used to connect the detection interface (C / D) of the second memory card controller 2022 to the sixth spring 11f when the second NM card 5 is inserted into the electronic device 100. When both the fifth gold finger 525 and the sixth gold finger 526 of the second NM card 5 are left floating, the second memory card controller 2022 does not need to set a detection interface, and the interface controller 201 makes adaptive adjustments.

[0304] The following example illustrates the second signal arrangement method of the second NM card 5 using the UFS interface protocol.

[0305] Please see Figure 27 , Figure 27 yes Figure 17 The diagram shown is a schematic representation of the second NM card 5 in some other embodiments.

[0306] For example, the first gold finger 521, the fifth gold finger 525, the ninth gold finger 529, and the tenth gold finger 5210 of the second NM card 5 are used to transmit data signals. The following embodiment uses the first gold finger 521 for transmitting data signals (RX+), the fifth gold finger 525 for transmitting data signals (RX-), the ninth gold finger 529 for transmitting data signals (TX+), and the tenth gold finger 5210 for transmitting data signals (TX-) as examples. In other embodiments, the data signals transmitted by the first gold finger 521, the fifth gold finger 525, the ninth gold finger 529, and the tenth gold finger 5210 can be interchanged. For example, the data signals transmitted by the first gold finger 521 and the fifth gold finger 525 can be interchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged. Other embodiments will not be described further here.

[0307] The second gold finger 522 is used to transmit the second power signal (VCCQ); the fourth gold finger 524 is used to transmit the reference clock signal (RCLK); the seventh gold finger 527 is used to transmit the ground signal (VSS); and the eighth gold finger 528 is used to transmit the first power signal (VCC). The third gold finger 523 and the sixth gold finger 526 are left floating.

[0308] As shown in Table 4 below, Table 4 shows the correspondence between the multiple spring contacts of the card connector 11 and the multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the second NM card 5, and their transmission signals. When the second NM card 5 is connected to the card connector 11, the first spring contacts 11a to 11j of the card connector 11 abut against and electrically connect to the first gold fingers 521 to 5210 of the second NM card 5, and the third gold fingers 523 to 528 of the second NM card 5 correspond to the positions of the first gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold fingers 523 to 5210 of the second NM card 5 correspond to the positions of the first gold fingers 421 to 428 of the first NM card 4.

[0309] Table 4

[0310]

[0311] In this embodiment, the second NM card 5 arranges the second power signal (VCCQ) required by the UFS protocol on the second gold finger 522. Since the second gold finger 522 of the second NM card 5 has no positional correspondence with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the second gold finger 522 of the second NM card 5 does not need to share the same spring contact with the multiplexer connector 11 of the Nano SIM card 3 and the first NM card 4. This avoids the second power signal (VCCQ) sharing the same spring contact with the data signals of the Nano SIM card 3 and the first NM card 4, thereby reducing the risk of the Nano SIM card 3 and the first NM card 4 being burned out by the second power signal (VCCQ) when inserted into the electronic device 100 and the card connector 11. The electronic device 100 has high reliability in compatibility with the Nano SIM card 3, the first NM card 4, and the second NM card 5. In addition, the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design to prevent the circuit from being burned out by the second power signal (VCCQ), which can reduce costs.

[0312] The second NM card 5 arranges one of its high-speed data signals (e.g., RX+) on the first gold finger 521. Since the first gold finger 521 of the second NM card 5 has no positional correspondence with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the first spring 11a connects to the high-speed data interface of the processor 20 of the electronic device 100 without needing to connect to the low-speed data interface. Regardless of whether the information card inserted in the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the first spring 11a. This reduces the difficulty of switching between the high-speed data interface and the low-speed data interface, simplifies the circuit of the processor 20, and reduces the design difficulty and cost.

[0313] Furthermore, since the seventh gold finger 527 of the second NM card 5 corresponds to the fifth gold finger 325 of the Nano SIM card 3 and the fifth gold finger 425 of the first NM card 4, when inserted into the electronic device 100, they all abut against and are electrically connected to the seventh spring 11g of the card connector 11. The seventh gold finger 527 of the second NM card 5, the fifth gold finger 325 of the Nano SIM card 3, and the fifth gold finger 425 of the first NM card 4 are all used to transmit ground signals (VSS / GND / GND respectively). Therefore, the processor 20 of the electronic device 100 can be electrically connected to the seventh spring 11g of the card connector 11 through the same ground interface. Regardless of whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the seventh spring 11g, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0314] The eighth gold finger 528 of the second NM card 5 corresponds to the sixth gold finger 326 of the Nano SIM card 3 and the sixth gold finger 426 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the eighth spring 11h of the card connector 11. The eighth gold finger 528 of the second NM card 5, the sixth gold finger 326 of the Nano SIM card 3, and the sixth gold finger 426 of the first NM card 4 are all used to transmit power signals (VCC / VCC / VCC respectively). Therefore, the processor 20 of the electronic device 100 can be electrically connected to the eighth spring 11h of the card connector 11 through the same power interface. Regardless of whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the eighth spring 11h, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0315] The fourth gold finger 524 of the second NM card 5 corresponds to the second gold finger 322 of the Nano SIM card 3 and the second gold finger 422 of the first NM card 4. When inserted into the electronic device 100, it abuts against and is electrically connected to the fourth spring 11d of the card connector 11. The fourth gold finger 524 of the second NM card 5 is used to transmit the reference clock signal (RCLK), the second gold finger 322 of the Nano SIM card 3 is used to transmit the clock signal (CLK), and the second gold finger 422 of the first NM card 4 is used to transmit the clock signal (CLK). The second NM card 5, Nano SIM card 3, and first NM card 4 can time-division multiplex the fourth spring 11d. The processor 20 can provide clock signals of different frequencies through the fourth spring 11d without switching data interface signals, thereby simplifying the circuit of the processor 20 and reducing design complexity and cost. In some scenarios, if the first NM card 4, the second NM card 5, and the Nano SIM card 3 have clock signals of the same frequency, the processor 20 can provide the same clock signal for the three cards without switching, which simplifies the design of the processor 20. For example, a unified clock frequency of 20MHz can be used.

[0316] The fifth gold finger 525 of the second NM card 5 corresponds to the third gold finger 323 of the Nano SIM card 3 and the third gold finger 423 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the fifth spring 11e of the card connector 11. The fifth gold finger 525 of the second NM card 5 is used to transmit data signals (e.g., RX-), the third gold finger 323 of the Nano SIM card 3 is used to transmit programming voltage / input signals (VPP), and the third gold finger 423 of the first NM card 4 is used to transmit command and response signals (CMD). The fifth spring 11e of the second NM card 5, the Nano SIM card 3, and the first NM card 4 can be time-division multiplexed. In this design, the high-speed data signal of the fifth gold finger 525 of the second NM card 5 is multiplexed with the command and response signal (CMD) of the third gold finger 423 of the first NM card 4 using the same spring, but not with the low-speed data signal of the first NM card 4 using the same spring. Compared with the scheme that multiplexes the high-speed and low-speed data signals using the same spring and performs interface switching, this scheme is less difficult to design. Optionally, the programming voltage / input signal (VPP) may not be supported to reduce the design difficulty of the processor 20.

[0317] The ninth gold finger 529 of the second NM card 5 corresponds to the seventh gold finger 427 of the first NM card 4. When inserted into the electronic device 100, both abut against and are electrically connected to the ninth spring 11i of the card connector 11. The ninth gold finger 529 of the second NM card 5 is used to transmit data signals (e.g., TX+), and the seventh gold finger 427 of the first NM card 4 is used to transmit data signals (e.g., DATA3). The second NM card 5 and the first NM card 4 can time-division multiplex the ninth spring 11i.

[0318] The tenth gold finger 5210 of the second NM card 5 corresponds to the eighth gold finger 428 of the first NM card 4. When inserted into the electronic device 100, both abut against and are electrically connected to the tenth spring 11j of the card connector 11. The tenth gold finger 5210 of the second NM card 5 is used to transmit data signals (e.g., TX-), and the eighth gold finger 428 of the first NM card 4 is used to transmit data signals (e.g., DATA2). The second NM card 5 and the first NM card 4 can time-division multiplex the tenth spring 11j.

[0319] When the electronic device 100 is compatible with Nano SIM card 3 and second NM card 5, but not compatible with first NM card 4, the ninth spring 11i and tenth spring 11j of the card connector 11 can also be unique springs of the second NM card 5. Both the ninth spring 11i and the tenth spring 11j are connected to the high-speed data interface. Regardless of whether the information card inserted in the electronic device 100 is the second NM card 5 or the Nano SIM card 3, the processor 20 does not need to switch the interface electrically connected to the ninth spring 11i and the tenth spring 11j, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0320] For example, the fourth gold finger 524 and the tenth gold finger 5210 of the second NM card 5 can both be electrically connected to a high-voltage resistant circuit or a protection switch to prevent the circuit from burning out when the card interface 52 of the second NM card 5 is short-circuited. The high-voltage resistant circuit or protection switch is located within the package 511 of the second NM card 5. In some other embodiments, the circuitry of the second NM card 5 can also be prevented from burning out by providing a high-impedance protection circuit within the electronic device, for example, by adding a protection circuit within the interface controller of the electronic device.

[0321] In some other embodiments, one of the third gold finger 523 and the sixth gold finger 526 can be used to transmit a detection signal (C / D), while the other can be left floating or used to transmit other signals; or, both the third gold finger 523 and the sixth gold finger 526 can be used to transmit a detection signal (C / D). The second NM card 5 transmits the detection signal (C / D) through at least one gold finger, which reduces the difficulty for the electronic device 100 to identify the second NM card 5. Specifically, when the third gold finger 523 or the sixth gold finger 526 is used to transmit the detection signal (C / D), the second NM card 5, the Nano SIM card 3, and the first NM card 4 can correspondingly time-division multiplex the third spring 11c or the sixth spring 11f.

[0322] Please see Figure 28 , Figure 28 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device 100 shown in some other embodiments.

[0323] In some embodiments, the card slot assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as follows: Figure 27 As shown. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203 and a second memory card controller 2022. The SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201. The interface controller 201 is electrically connected to the first spring 11a to the tenth spring 11j of the card connector 11 of the card socket assembly 10.

[0324] The SIM card controller 203 includes a data interface, a clock interface, a programming voltage / input interface, and a reset interface. The data interface is used to transmit data signals (DATA), the clock interface is used to transmit clock signals (CLK), the programming voltage / input interface is used to transmit programming voltage / input signals (VPP), and the reset interface is used to transmit reset signals (RST). Figure 28 In the accompanying drawings and related descriptions, the multiple interfaces of the SIM card controller 203 are illustrated by the signals they transmit.

[0325] The second memory card controller 2022 includes four data interfaces, a reference clock interface, and a second power interface. The four data interfaces are used to transmit data signals (RX+, RX-, TX+, TX-), the reference clock interface is used to transmit a reference clock signal (RCLK), and the second power interface is used to transmit a second power signal (VCCQ). Figure 28 In the accompanying drawings and related descriptions, the multiple interfaces of the second memory card controller 2022 are schematically identified by the signals they transmit. In some other embodiments, the second power interface may also be independent of the second memory card controller 2022; this application does not strictly limit this.

[0326] The processor 20 also includes a power interface and a ground interface. The power interface is used to transmit a power signal (VCC) or a first power signal (VCC), and the ground interface is used to transmit a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface can be independently located outside the SIM card controller 203 and the second memory card controller 2022, or they can be separated and integrated into the SIM card controller 203 and the second memory card controller 2022. This application embodiment does not strictly limit this. Figure 28 In the accompanying drawings, the power interface and ground interface are shown as independent of the SIM card controller 203 and the second memory card controller 2022, and are respectively labeled as power and ground.

[0327] For example, interface controller 201 is used to connect SIM card controller 203 to card connector 11, or to connect second memory card controller 2022 to card connector 11. Interface controller 201 may include multiple switches and wires.

[0328] In some embodiments, the interface controller 201 includes a first switch 2011 and a second switch 2012.

[0329] The first switch 2011 connects the reference clock interface (RCLK) of the second memory card controller 2022 and the clock interface (CLK) of the SIM card controller 203. The first switch 2011 is also connected to the fourth spring 11d of the card connector 11. The first switch 2011 is used to connect the fourth spring 11d to the reference clock interface (RCLK) of the second memory card controller 2022, or to connect the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

[0330] The second switch 2012 connects a data interface (e.g., RX-) of the second memory card controller 2022 and the programming voltage / input interface (VPP) of the SIM card controller 203. The second switch 2012 also connects to the fifth contact spring 11e of the card connector 11. The second switch 2012 is used to connect the fifth contact spring 11e to the data interface (e.g., RX-) of the second memory card controller 2022, or to the programming voltage / input interface (VPP) of the SIM card controller 203. Optionally, the programming voltage / input interface (VPP) may or may not be supported to reduce the design complexity of the processor 20.

[0331] Another data interface (e.g., RX+) of the second memory card controller 2022 is connected to the first spring 11a of the interface controller 201 electrical connection card connector 11. The second power interface (VCCQ) of the second memory card controller 2022 is connected to the second spring 11b of the interface controller 201 electrical connection card connector 11. Another data interface (e.g., TX+) of the second memory card controller 2022 is connected to the ninth spring 11i of the interface controller 201 electrical connection card connector 11. Another data interface (e.g., TX-) of the second memory card controller 2022 is connected to the tenth spring 11j of the interface controller 201 electrical connection card connector 11. The data interface (DATA) of the SIM card controller 203 is connected to the third spring 11c of the interface controller 201 electrical connection card connector 11. The power interface of the processor 20 is connected to the eighth spring 11h of the interface controller 201 electrical connection card connector 11. The ground interface of the processor 20 is connected to the seventh spring 11g of the interface controller 201 electrical connection card connector 11. The reset interface (RST) of the SIM card controller 203 is electrically connected to the sixth spring 11f of the card connector 11 via the interface controller 201.

[0332] Specifically, the interface controller 201 can be connected by wires to maintain a conductive state between the data interface (e.g., RX+) of the second memory card controller 2022 and the first spring 11a, between the second power interface (VCCQ) of the second memory card controller 2022 and the second spring 11b, between the data interface (e.g., TX+) of the second memory card controller 2022 and the ninth spring 11i, between the data interface (e.g., TX-) of the second memory card controller 2022 and the tenth spring 11j, between the data interface (DATA) of the SIM card controller 203 and the third spring 11c, between the power interface of the processor 20 and the eighth spring 11h, and between the ground interface and the seventh spring 11g. The interface controller 201 can also be connected in series with a switch to switch between the conductive and disconnected states. This embodiment of the application does not strictly limit this.

[0333] In this embodiment, when the Nano SIM card 3 is inserted into the card slot assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 connects the SIM card controller 203 and the card connector 11. The SIM card controller 203 transmits data signals (DATA), clock signals (CLK), transmission programming voltage / input signals (VPP), and reset signals (RST) with the Nano SIM card 3 through the third spring 11c to the sixth spring 11f of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the Nano SIM card 3 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The Nano SIM card 3 communicates with the electronic device 100.

[0334] When the second NM card 5 is inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 to the card connector 11. The second memory card controller 2022 transmits data signals (RX+, RX-, TX+, TX-), a reference clock signal (RCLK), and a second power signal (VCCQ) with the second NM card 5 via the first spring 11a, second spring 11b, fourth spring 11d, fifth spring 11e, ninth spring 11i, and tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits a first power signal (VCC) and a ground signal (VSS) with the second NM card 5 via the eighth spring 11h and seventh spring 11g of the card connector 11. Thus, the second NM card 5 communicates with the electronic device 100. Therefore, the electronic device 100 is compatible with both the Nano SIM card 3 and the second NM card 5.

[0335] In some other embodiments, the programming voltage / input signal (VPP) may not be supported to reduce the design complexity of the processor 20. In this case, the SIM card controller 203 may not include the programming voltage / input interface (VPP), the interface controller 201 may not include the second switch 2012, and a data interface (e.g., RX-) of the second memory card controller 2022 is electrically connected to the fifth spring 11e of the card connector 11 through the interface controller 201. Other solutions are described in the above embodiments and will not be repeated here.

[0336] Please see Figure 29 , Figure 29 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device 100 shown in some other embodiments.

[0337] In some embodiments, the card slot assembly 10 of the electronic device 100 is compatible with Nano SIM card 3, first NM card 4, and second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as follows: Figure 27 As shown. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021, and a second memory card controller 2022. The SIM card controller 203, the first memory card controller 2021, and the second memory card controller 2022 are electrically connected to the interface controller 201. The interface controller 201 is electrically connected to the first spring 11a to the tenth spring 11j of the card connector 11 of the card socket assembly 10.

[0338] The SIM card controller 203 and the second memory card controller 2022 can be found in [reference]. Figure 28 The relevant descriptions of the corresponding embodiments will not be repeated here. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexed interface. The four data interfaces are used to transmit data signals (DATA0, DATA1, DATA2, DATA3), the clock interface is used to transmit clock signals (CLK), and the command and response multiplexed interface is used to transmit command and response signals (CMD). Figure 29 In the accompanying drawings and related descriptions, the multiple interfaces of the first memory card controller 2021 are schematically identified by the signals they transmit. The power interface and ground interface can also be integrated into the first memory card controller 2021 after being separated.

[0339] For example, the interface controller 201 is used to connect the SIM card controller 203 to the card connector 11, or to connect the first memory card controller 2021 to the card connector 11, or to connect the second memory card controller 2022 to the card connector 11. The interface controller 201 may include multiple switches and wires.

[0340] In some embodiments, the interface controller 201 includes a first switch 2011, a second switch 2012, a third switch 2013, a fourth switch 2014, a fifth switch 2015, and a sixth switch 2016.

[0341] The first switch 2011 is connected to the reference clock interface (RCLK) of the second memory card controller 2022, the clock interface (CLK) of the first memory card controller 2021, and the clock interface (CLK) of the SIM card controller 203. The first switch 2011 is also connected to the fourth spring 11d of the card connector 11. The first switch 2011 is used to connect the fourth spring 11d to the reference clock interface (RCLK) of the second memory card controller 2022, or to connect the third spring 11c to the clock interface (CLK) of the first memory card controller 2021, or to connect the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

[0342] The second switch 2012 is connected to a data interface (e.g., RX-) of the second memory card controller 2022, the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the programming voltage / input interface (VPP) of the SIM card controller 203. The second switch 2012 is also connected to the fifth spring 11e of the card connector 11. The second switch 2012 is used to connect the fifth spring 11e to the data interface (e.g., RX-) of the second memory card controller 2022, or to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or to the programming voltage / input interface (VPP) of the SIM card controller 203.

[0343] The third switch 2013 is connected to a data interface (e.g., DATA1) of the first memory card controller 2021 and a data interface (DATA) of the SIM card controller 203. The third switch 2013 is also connected to the third spring 11c of the card connector 11. The third switch 2013 is used to connect the third spring 11c to the data interface (e.g., DATA1) of the first memory card controller 2021, or to connect the third spring 11c to the data interface (DATA) of the SIM card controller 203.

[0344] The fourth switch 2014 is connected to another data interface (e.g., DATA0) of the first memory card controller 2021 and the reset interface (RST) of the SIM card controller 203. The fourth switch 2014 is also connected to the sixth spring 11f of the card connector 11. The fourth switch 2014 is used to connect the sixth spring 11f to the data interface (e.g., DATA0) of the first memory card controller 2021, or to connect the sixth spring 11f to the reset interface (RST) of the SIM card controller 203.

[0345] The fifth switch 2015 connects another data interface (e.g., TX+) of the second memory card controller 2022 and another data interface (e.g., DATA3) of the first memory card controller 2021. The fifth switch 2015 also connects to the ninth spring 11i of the card connector 11. The fifth switch 2015 is used to connect the ninth spring 11i to the data interface (e.g., TX+) of the second memory card controller 2022, or to connect the ninth spring 11i to the data interface (e.g., DATA3) of the first memory card controller 2021.

[0346] The sixth switch 2016 connects to another data interface (e.g., TX-) of the second memory card controller 2022 and another data interface (e.g., DATA2) of the first memory card controller 2021. The sixth switch 2016 also connects to the tenth spring 11j of the card connector 11. The sixth switch 2016 is used to connect the tenth spring 11j to the data interface (e.g., TX-) of the second memory card controller 2022, or to connect the tenth spring 11j to the data interface (e.g., DATA2) of the first memory card controller 2021.

[0347] Another data interface (e.g., RX+) of the second memory card controller 2022 is electrically connected to the first spring 11a of the interface controller 201 via the interface controller 201. The second power interface (VCCQ) of the second memory card controller 2022 is electrically connected to the second spring 11b of the interface controller 201 via the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth spring 11h of the interface controller 201 via the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh spring 11g of the interface controller 201. The interface controller 201 can maintain a conductive state by connecting wires between the data interface (e.g., RX+) of the second memory card controller 2022 and the first spring 11a, between the second power interface (VCCQ) and the second spring 11b, between the power interface of the processor 20 and the eighth spring 11h, and between the ground interface and the seventh spring 11g. Alternatively, the interface controller 201 can be connected in series with a switch to switch between the conductive and deactivated states. This embodiment does not strictly limit this approach.

[0348] In this embodiment, when the Nano SIM card 3 is inserted into the card slot assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 connects the SIM card controller 203 and the card connector 11. The SIM card controller 203 transmits data signals (DATA), clock signals (CLK), transmission programming voltage / input signals (VPP), and reset signals (RST) with the Nano SIM card 3 through the third spring 11c to the sixth spring 11f of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the Nano SIM card 3 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The Nano SIM card 3 communicates with the electronic device 100.

[0349] When the first NM card 4 is inserted into the card slot assembly 10 of the electronic device 100 and the first NM card 4 is electrically connected to the card connector 11, the interface controller 201 connects the first memory card controller 2021 to the card connector 11. The first memory card controller 2021 transmits data signals (DATA0, DATA1, DATA2, DATA3), clock signals (CLK), and command and response signals (CMD) with the first NM card 4 through the third spring 11c to the sixth spring 11f, the ninth spring 11i, and the tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the first NM card 4 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The first NM card 4 communicates with the electronic device 100.

[0350] When the second NM card 5 is inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 to the card connector 11. The second memory card controller 2022 transmits data signals (RX+, RX-, TX+, TX-), a reference clock signal (RCLK), and a second power signal (VCCQ) with the second NM card 5 via the first spring 11a, second spring 11b, fourth spring 11d, fifth spring 11e, ninth spring 11i, and tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits a first power signal (VCC) and a ground signal (VSS) with the second NM card 5 via the eighth spring 11h and seventh spring 11g of the card connector 11. Thus, the second NM card 5 communicates with the electronic device 100. Therefore, the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4, and the second NM card 5.

[0351] In some other embodiments, the programming voltage / input signal (VPP) may not be supported to reduce the design complexity of the processor 20. In this case, the SIM card controller 203 may not include the programming voltage / input interface (VPP). The second switch 2012 connects a data interface (e.g., RX-) of the second memory card controller 2022 and the command and response multiplexing interface (CMD) of the first memory card controller 2021. The second switch 2012 is also connected to the fifth spring 11e of the card connector 11. Other solutions are described in the above embodiments and will not be repeated here.

[0352] Understandably, when the third gold finger 523 or the sixth gold finger 526 of the second NM card 5 is used to transmit detection signals (C / D), in the electronic device 100 compatible with the second NM card 5, the second memory card controller 2022 also includes a detection interface for transmitting detection signals (C / D). The interface controller 201 is also used to connect the detection interface to the corresponding third spring 11c or sixth spring 11f when the second NM card 5 is inserted into the electronic device 100. The interface controller 201 is connected to the third spring 11c or the sixth spring 11f via a switch, and this switch is also connected to the detection interface of the second memory card controller 2022.

[0353] The following example illustrates the third signal arrangement method of the second NM card 5, which uses the UFS interface protocol.

[0354] Please see Figure 30 , Figure 30 yes Figure 17 The diagram shown is a schematic representation of the second NM card 5 in some other embodiments.

[0355] For example, the first gold finger 521, the fifth gold finger 525, the ninth gold finger 529, and the tenth gold finger 5210 of the second NM card 5 are used to transmit data signals. The following embodiment uses the first gold finger 521 for transmitting data signals (RX+), the fifth gold finger 525 for transmitting data signals (RX-), the ninth gold finger 529 for transmitting data signals (TX+), and the tenth gold finger 5210 for transmitting data signals (TX-) as examples. In other embodiments, the data signals transmitted by the first gold finger 521, the fifth gold finger 525, the ninth gold finger 529, and the tenth gold finger 5210 can be interchanged. For example, the data signals transmitted by the first gold finger 521 and the fifth gold finger 525 can be interchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged. Other embodiments will not be described further here.

[0356] The second gold finger 522 is used to transmit the second power signal (VCCQ); the sixth gold finger 526 is used to transmit the reference clock signal (RCLK); the seventh gold finger 527 is used to transmit the ground signal (VSS); and the eighth gold finger 528 is used to transmit the first power signal (VCC). The third gold finger 523 and the fourth gold finger 524 are left floating.

[0357] As shown in Table 5 below, Table 5 shows the correspondence between the multiple spring contacts of the card connector 11 and the multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the second NM card 5, and their transmission signals. When the second NM card 5 is connected to the card connector 11, the first spring contacts 11a to 11j of the card connector 11 abut against and electrically connect to the first gold fingers 521 to 5210 of the second NM card 5, and the third gold fingers 523 to 528 of the second NM card 5 correspond to the positions of the first gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold fingers 523 to 5210 of the second NM card 5 correspond to the positions of the first gold fingers 421 to 428 of the first NM card 4.

[0358] Table 5

[0359]

[0360]

[0361] In this embodiment, the second NM card 5 arranges the second power signal (VCCQ) required by the UFS protocol on the second gold finger 522. Since the second gold finger 522 of the second NM card 5 has no positional correspondence with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the second gold finger 522 of the second NM card 5 does not need to share the same spring contact with the multiplexer connector 11 of the Nano SIM card 3 and the first NM card 4. This avoids the second power signal (VCCQ) sharing the same spring contact with the data signals of the Nano SIM card 3 and the first NM card 4, thereby reducing the risk of the Nano SIM card 3 and the first NM card 4 being burned out by the second power signal (VCCQ) when inserted into the electronic device 100 and the card connector 11. The electronic device 100 has high reliability in compatibility with the Nano SIM card 3, the first NM card 4, and the second NM card 5. In addition, the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design to prevent the circuit from being burned out by the second power signal (VCCQ), which can reduce costs.

[0362] The second NM card 5 arranges one of its high-speed data signals (e.g., RX+) on the first gold finger 521. Since the first gold finger 521 of the second NM card 5 has no positional correspondence with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the first spring 11a connects to the high-speed data interface of the processor 20 of the electronic device 100 without needing to connect to the low-speed data interface. Regardless of whether the information card inserted in the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the first spring 11a. This reduces the difficulty of switching between the high-speed data interface and the low-speed data interface, simplifies the circuit of the processor 20, and reduces the design difficulty and cost.

[0363] Furthermore, since the seventh gold finger 527 of the second NM card 5 corresponds to the fifth gold finger 325 of the Nano SIM card 3 and the fifth gold finger 425 of the first NM card 4, when inserted into the electronic device 100, they all abut against and are electrically connected to the seventh spring 11g of the card connector 11. The seventh gold finger 527 of the second NM card 5, the fifth gold finger 325 of the Nano SIM card 3, and the fifth gold finger 425 of the first NM card 4 are all used to transmit ground signals (VSS / GND / GND respectively). Therefore, the processor 20 of the electronic device 100 can be electrically connected to the seventh spring 11g of the card connector 11 through the same ground interface. Regardless of whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the seventh spring 11g, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0364] The eighth gold finger 528 of the second NM card 5 corresponds to the sixth gold finger 326 of the Nano SIM card 3 and the sixth gold finger 426 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the eighth spring 11h of the card connector 11. The eighth gold finger 528 of the second NM card 5, the sixth gold finger 326 of the Nano SIM card 3, and the sixth gold finger 426 of the first NM card 4 are all used to transmit power signals (VCC / VCC / VCC respectively). Therefore, the processor 20 of the electronic device 100 can be electrically connected to the eighth spring 11h of the card connector 11 through the same power interface. Regardless of whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the eighth spring 11h, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0365] The fifth gold finger 525 of the second NM card 5 corresponds to the third gold finger 323 of the Nano SIM card 3 and the third gold finger 423 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the fifth spring 11e of the card connector 11. The fifth gold finger 525 of the second NM card 5 is used to transmit data signals (e.g., RX-), the third gold finger 323 of the Nano SIM card 3 is used to transmit programming voltage / input signals (VPP), and the first gold finger 421 of the first NM card 4 is used to transmit command and response signals (CMD). The fifth spring 11e of the second NM card 5, the Nano SIM card 3, and the first NM card 4 can be time-division multiplexed.

[0366] The sixth gold finger 526 of the second NM card 5 corresponds to the fourth gold finger 324 of the Nano SIM card 3 and the fourth gold finger 424 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the sixth spring 11f of the card connector 11. The sixth gold finger 526 of the second NM card 5 is used to transmit the reference clock signal (RCLK), the fourth gold finger 324 of the Nano SIM card 3 is used to transmit the reset signal (RST), and the fourth gold finger 424 of the first NM card 4 is used to transmit the data signal (e.g., DATA0). The sixth spring 11f can be time-division multiplexed by the second NM card 5, the Nano SIM card 3, and the first NM card 4.

[0367] The ninth gold finger 529 of the second NM card 5 corresponds to the seventh gold finger 427 of the first NM card 4. When inserted into the electronic device 100, both abut against and are electrically connected to the ninth spring 11i of the card connector 11. The ninth gold finger 529 of the second NM card 5 is used to transmit data signals (e.g., TX+), and the seventh gold finger 427 of the first NM card 4 is used to transmit data signals (e.g., DATA3). The second NM card 5 and the first NM card 4 can time-division multiplex the ninth spring 11i.

[0368] The tenth gold finger 5210 of the second NM card 5 corresponds to the eighth gold finger 428 of the first NM card 4. When inserted into the electronic device 100, both abut against and are electrically connected to the tenth spring 11j of the card connector 11. The tenth gold finger 5210 of the second NM card 5 is used to transmit data signals (e.g., TX-), and the eighth gold finger 428 of the first NM card 4 is used to transmit data signals (e.g., DATA2). The second NM card 5 and the first NM card 4 can time-division multiplex the tenth spring 11j.

[0369] When the electronic device 100 is compatible with Nano SIM card 3 and second NM card 5, but not compatible with first NM card 4, the ninth spring 11i and tenth spring 11j of the card connector 11 can also be unique springs of the second NM card 5. Both the ninth spring 11i and the tenth spring 11j are connected to the high-speed data interface. Regardless of whether the information card inserted in the electronic device 100 is the second NM card 5 or the Nano SIM card 3, the processor 20 does not need to switch the interface electrically connected to the ninth spring 11i and the tenth spring 11j, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0370] For example, the fourth gold finger 524 and the tenth gold finger 5210 of the second NM card 5 can both be electrically connected to a high-voltage resistant circuit or a protection switch to prevent the circuit from burning out when the card interface 52 of the second NM card 5 is short-circuited. The high-voltage resistant circuit or protection switch is located within the package 511 of the second NM card 5. When the fourth gold finger 524 is suspended and does not form an interface for the second NM card 5, the fourth gold finger 524 may not be electrically connected to the high-voltage resistant circuit or protection switch. In some other embodiments, the circuit of the second NM card 5 can also be prevented from burning out by providing a high-impedance protection circuit within the electronic device, for example, by adding a protection circuit within the interface controller of the electronic device.

[0371] In this embodiment, when the third gold finger 523 and the fourth gold finger 524 of the second NM card 5 are suspended, the interface connection circuits corresponding to the third spring 11c and the fourth spring 11d of the electrical connector are simplified, making the electronic device 100 more compatible with the Nano SIM card 3 and the second NM card 5. In some other embodiments, one of the third gold finger 523 and the fourth gold finger 524 can be used to transmit a detection signal (C / D), while the other can be suspended or used to transmit other signals; or, both the third gold finger 523 and the fourth gold finger 524 can be used to transmit a detection signal (C / D). The second NM card 5 transmits a detection signal (C / D) through at least one gold finger, which can reduce the difficulty for the electronic device 100 to identify the second NM card 5. Among them, when the third gold finger 523 or the fourth gold finger 524 is used to transmit a detection signal (C / D), the second NM card 5, the Nano SIM card 3, and the first NM card 4 can respectively time-division multiplex the third spring 11c or the fourth spring 11d.

[0372] Please see Figure 31 , Figure 31 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device 100 shown in some other embodiments.

[0373] In some embodiments, the card slot assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as follows: Figure 30 As shown. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203 and a second memory card controller 2022. The SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201. The interface controller 201 is electrically connected to the first spring 11a to the tenth spring 11j of the card connector 11 of the card socket assembly 10.

[0374] The SIM card controller 203 includes a data interface, a clock interface, a programming voltage / input interface, and a reset interface. The data interface is used to transmit data signals (DATA), the clock interface is used to transmit clock signals (CLK), the programming voltage / input interface is used to transmit programming voltage / input signals (VPP), and the reset interface is used to transmit reset signals (RST). Figure 31 In the accompanying drawings and related descriptions, the multiple interfaces of the SIM card controller 203 are illustrated by the signals they transmit.

[0375] The second memory card controller 2022 includes four data interfaces, a reference clock interface, and a second power interface. The four data interfaces are used to transmit data signals (RX+, RX-, TX+, TX-), the reference clock interface is used to transmit a reference clock signal (RCLK), and the second power interface is used to transmit a second power signal (VCCQ). Figure 31 In the accompanying drawings and related descriptions, the multiple interfaces of the second memory card controller 2022 are schematically identified by the signals they transmit. In some other embodiments, the second power interface may also be independent of the second memory card controller 2022; this application does not strictly limit this.

[0376] The processor 20 also includes a power interface and a ground interface. The power interface is used to transmit a power signal (VCC) or a first power signal (VCC), and the ground interface is used to transmit a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface can be independently located outside the SIM card controller 203 and the second memory card controller 2022, or they can be separated and integrated into the SIM card controller 203 and the second memory card controller 2022. This application embodiment does not strictly limit this. Figure 31 In the accompanying drawings, the power interface and ground interface are shown as independent of the SIM card controller 203 and the second memory card controller 2022, and are respectively labeled as power and ground.

[0377] For example, interface controller 201 is used to connect SIM card controller 203 to card connector 11, or to connect second memory card controller 2022 to card connector 11. Interface controller 201 may include multiple switches and wires.

[0378] In some embodiments, the interface controller 201 includes a first switch 2011 and a second switch 2012.

[0379] The first switch 2011 connects a data interface (e.g., RX-) of the second memory card controller 2022 and the programming voltage / input interface (VPP) of the SIM card controller 203. The first switch 2011 also connects to the fifth spring 11e of the card connector 11. The first switch 2011 is used to connect the fifth spring 11e to the data interface (e.g., RX-) of the second memory card controller 2022, or to connect the fifth spring 11e to the programming voltage / input interface (VPP) of the SIM card controller 203.

[0380] The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022 and the reset interface (RST) of the SIM card controller 203. The second switch 2012 is also connected to the sixth spring 11f of the card connector 11. The second switch 2012 is used to connect the sixth spring 11f to the reference clock interface (RCLK) of the second memory card controller 2022, or to connect the sixth spring 11f to the reset interface (RST) of the SIM card controller 203.

[0381] Another data interface (e.g., RX+) of the second memory card controller 2022 is connected to the first spring 11a of the interface controller 201 electrical connection card connector 11. The second power interface (VCCQ) of the second memory card controller 2022 is connected to the second spring 11b of the interface controller 201 electrical connection card connector 11. Another data interface (e.g., TX+) of the second memory card controller 2022 is connected to the ninth spring 11i of the interface controller 201 electrical connection card connector 11. Another data interface (e.g., TX-) of the second memory card controller 2022 is connected to the tenth spring 11j of the interface controller 201 electrical connection card connector 11. The data interface (DATA) of the SIM card controller 203 is connected to the third spring 11c of the interface controller 201 electrical connection card connector 11. The clock interface (CLK) of the SIM card controller 203 is connected to the fourth spring 11d of the interface controller 201 electrical connection card connector 11. The power interface of the processor 20 is connected to the eighth spring 11h of the interface controller 201 electrical connection card connector 11. The ground interface of processor 20 is electrically connected to the seventh spring 11g of connector 11 of interface controller 201.

[0382] Specifically, the interface controller 201 can be connected by wires to maintain a conductive state between the data interface (e.g., RX+) of the second memory card controller 2022 and the first spring 11a, between the second power interface (VCCQ) of the second memory card controller 2022 and the second spring 11b, between the data interface (e.g., TX+) of the second memory card controller 2022 and the ninth spring 11i, between the data interface (e.g., TX-) of the second memory card controller 2022 and the tenth spring 11j, between the data interface (DATA) of the SIM card controller 203 and the third spring 11c, between the clock interface (CLK) of the SIM card controller 203 and the fourth spring 11d, between the power interface of the processor 20 and the eighth spring 11h, and between the ground interface and the seventh spring 11g. The interface controller 201 can also be connected in series with a switch to switch between the conductive and disconnected states. This embodiment of the application does not strictly limit this.

[0383] In this embodiment, when the Nano SIM card 3 is inserted into the card slot assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 connects the SIM card controller 203 and the card connector 11. The SIM card controller 203 transmits data signals (DATA), clock signals (CLK), transmission programming voltage / input signals (VPP), and reset signals (RST) with the Nano SIM card 3 through the third spring 11c to the sixth spring 11f of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the Nano SIM card 3 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The Nano SIM card 3 communicates with the electronic device 100.

[0384] When the second NM card 5 is inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 to the card connector 11. The second memory card controller 2022 transmits data signals (RX+, RX-, TX+, TX-), a reference clock signal (RCLK), and a second power signal (VCCQ) with the second NM card 5 via the first spring 11a, second spring 11b, fifth spring 11e, sixth spring 11f, ninth spring 11i, and tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits a first power signal (VCC) and a ground signal (VSS) with the second NM card 5 via the eighth spring 11h and seventh spring 11g of the card connector 11. Thus, the second NM card 5 communicates with the electronic device 100. Therefore, the electronic device 100 is compatible with both the Nano SIM card 3 and the second NM card 5.

[0385] In some other embodiments, the programming voltage / input signal (VPP) may not be supported to reduce the design complexity of the processor 20. In this case, the SIM card controller 203 may not include the programming voltage / input interface (VPP), the interface controller 201 may not include the first switch 2011, and a data interface (e.g., RX-) of the second memory card controller 2022 is connected to the fifth spring 11e of the card connector 11 through the interface controller 201. Other solutions are described in the above embodiments and will not be repeated here.

[0386] Please see Figure 32 , Figure 32 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device 100 shown in some other embodiments.

[0387] In some embodiments, the card slot assembly 10 of the electronic device 100 is compatible with Nano SIM card 3, first NM card 4, and second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as follows: Figure 30 As shown. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021, and a second memory card controller 2022. The SIM card controller 203, the first memory card controller 2021, and the second memory card controller 2022 are electrically connected to the interface controller 201. The interface controller 201 is electrically connected to the first spring 11a to the tenth spring 11j of the card connector 11 of the card socket assembly 10.

[0388] The SIM card controller 203 and the second memory card controller 2022 can be found in [reference]. Figure 31 The relevant descriptions of the corresponding embodiments will not be repeated here. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexed interface. The four data interfaces are used to transmit data signals (DATA0, DATA1, DATA2, DATA3), the clock interface is used to transmit clock signals (CLK), and the command and response multiplexed interface is used to transmit command and response signals (CMD). Figure 31 In the accompanying drawings and related descriptions, the multiple interfaces of the first memory card controller 2021 are schematically identified by the signals they transmit. The power interface and ground interface can also be integrated into the first memory card controller 2021 after being separated.

[0389] For example, the interface controller 201 is used to connect the SIM card controller 203 to the card connector 11, or to connect the first memory card controller 2021 to the card connector 11, or to connect the second memory card controller 2022 to the card connector 11. The interface controller 201 may include multiple switches and wires.

[0390] In some embodiments, the interface controller 201 includes a first switch 2011, a second switch 2012, a third switch 2013, a fourth switch 2014, a fifth switch 2015, and a sixth switch 2016.

[0391] The first switch 2011 is connected to a data interface (e.g., RX-) of the second memory card controller 2022, the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the programming voltage / input interface (VPP) of the SIM card controller 203. The first switch 2011 is also connected to the fifth spring 11e of the card connector 11. The first switch 2011 is used to connect the fifth spring 11e to the data interface (e.g., RX-) of the second memory card controller 2022, or to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or to the programming voltage / input interface (VPP) of the SIM card controller 203.

[0392] The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022, a data interface (e.g., DATA0) of the first memory card controller 2021, and the reset interface (RST) of the SIM card controller 203. The second switch 2012 is also connected to the sixth spring 11f of the card connector 11. The second switch 2012 is used to connect the sixth spring 11f to the reference clock interface (RCLK) of the second memory card controller 2022, or to the data interface (e.g., DATA0) of the first memory card controller 2021, or to the reset interface (RST) of the SIM card controller 203.

[0393] The third switch 2013 is connected to another data interface (e.g., DATA1) of the first memory card controller 2021 and the data interface (DATA) of the SIM card controller 203. The third switch 2013 is also connected to the third spring 11c of the card connector 11. The third switch 2013 is used to connect the third spring 11c to the data interface (e.g., DATA1) of the first memory card controller 2021, or to connect the third spring 11c to the data interface (DATA) of the SIM card controller 203.

[0394] The fourth switch 2014 is connected to the clock interface (CLK) of the first memory card controller 2021 and the clock interface (CLK) of the SIM card controller 203. The fourth switch 2014 is also connected to the fourth spring 11d of the card connector 11. The fourth switch 2014 is used to connect the fourth spring 11d to the clock interface (CLK) of the first memory card controller 2021, or to connect the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

[0395] The fifth switch 2015 connects another data interface (e.g., TX+) of the second memory card controller 2022 and another data interface (e.g., DATA3) of the first memory card controller 2021. The fifth switch 2015 also connects to the ninth spring 11i of the card connector 11. The fifth switch 2015 is used to connect the ninth spring 11i to the data interface (e.g., TX+) of the second memory card controller 2022, or to connect the ninth spring 11i to the data interface (e.g., DATA3) of the first memory card controller 2021.

[0396] The sixth switch 2016 connects to another data interface (e.g., TX-) of the second memory card controller 2022 and another data interface (e.g., DATA2) of the first memory card controller 2021. The sixth switch 2016 also connects to the tenth spring 11j of the card connector 11. The sixth switch 2016 is used to connect the tenth spring 11j to the data interface (e.g., TX-) of the second memory card controller 2022, or to connect the tenth spring 11j to the data interface (e.g., DATA2) of the first memory card controller 2021.

[0397] Another data interface (e.g., RX+) of the second memory card controller 2022 is electrically connected to the first spring 11a of the interface controller 201 via the interface controller 201. The second power interface (VCCQ) of the second memory card controller 2022 is electrically connected to the second spring 11b of the interface controller 201 via the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth spring 11h of the interface controller 201 via the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh spring 11g of the interface controller 201. The interface controller 201 can maintain a conductive state by connecting wires between the data interface (e.g., RX+) of the second memory card controller 2022 and the first spring 11a, between the second power interface (VCCQ) and the second spring 11b, between the power interface of the processor 20 and the eighth spring 11h, and between the ground interface and the seventh spring 11g. Alternatively, the interface controller 201 can be connected in series with a switch to switch between the conductive and deactivated states. This embodiment does not strictly limit this approach.

[0398] In this embodiment, when the Nano SIM card 3 is inserted into the card slot assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 connects the SIM card controller 203 and the card connector 11. The SIM card controller 203 transmits data signals (DATA), clock signals (CLK), transmission programming voltage / input signals (VPP), and reset signals (RST) with the Nano SIM card 3 through the third spring 11c to the sixth spring 11f of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the Nano SIM card 3 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The Nano SIM card 3 communicates with the electronic device 100.

[0399] When the first NM card 4 is inserted into the card slot assembly 10 of the electronic device 100 and the first NM card 4 is electrically connected to the card connector 11, the interface controller 201 connects the first memory card controller 2021 to the card connector 11. The first memory card controller 2021 transmits data signals (DATA0, DATA1, DATA2, DATA3), clock signals (CLK), and command and response signals (CMD) with the first NM card 4 through the third spring 11c to the sixth spring 11f, the ninth spring 11i, and the tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the first NM card 4 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The first NM card 4 communicates with the electronic device 100.

[0400] When the second NM card 5 is inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 to the card connector 11. The second memory card controller 2022 transmits data signals (RX+, RX-, TX+, TX-), a reference clock signal (RCLK), and a second power signal (VCCQ) with the second NM card 5 via the first spring 11a, second spring 11b, fifth spring 11e, sixth spring 11f, ninth spring 11i, and tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits the first power signal (VCC) and a ground signal (VSS) with the second NM card 5 via the eighth spring 11h and seventh spring 11g of the card connector 11. Thus, the second NM card 5 communicates with the electronic device 100. Therefore, the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4, and the second NM card 5.

[0401] In some other embodiments, the programming voltage / input signal (VPP) may not be supported to reduce the design complexity of the processor 20. In this case, the SIM card controller 203 may not include the programming voltage / input interface (VPP). The first switch 2011 connects a data interface (e.g., RX-) of the second memory card controller 2022 and the command and response multiplexing interface (CMD) of the first memory card controller 2021. The first switch 2011 is also connected to the fifth spring 11e of the card connector 11. Other solutions are described in the above embodiments and will not be repeated here.

[0402] Understandably, when the third gold finger 523 or the fourth gold finger 524 of the second NM card 5 is used to transmit detection signals (C / D), in the electronic device 100 compatible with the second NM card 5, the second memory card controller 2022 also includes a detection interface. This detection interface is used to transmit detection signals (C / D), and the interface controller 201 is also used to connect the detection interface to the corresponding third spring 11c or sixth spring 11f when the second NM card 5 is inserted into the electronic device 100. The interface controller 201 is connected to the third spring 11c or the fourth spring 11d via a switch, which is also connected to the detection interface of the second memory card controller 2022.

[0403] In some embodiments, the second NM card uses the PCIe interface protocol. PCIe, also known as PCI Express, is a layered protocol consisting of a transaction layer, a data link layer, and a physical layer. Its main advantages are high data transfer rates, strong anti-interference capabilities, long transmission distances, and low power consumption. PCI Express changes the transmission method from parallel (PCI) to serial (PCI) by using differential signal transmission. This transmission method transmits the same content in a mirrored manner to improve the efficiency of interference detection and correction. Furthermore, PCI Express can operate in full-duplex mode, thus significantly improving transmission efficiency compared to PCI. Since 2001, PCI Express has been updated from version 1.0 to version 5.0 over 20 years, and will be officially updated to version 6.0 in 2021. Undoubtedly, PCI Express is a popular transmission bus standard. PCIe 1.0 has nearly twice the bandwidth of PCI, while the PCI Express 6.0, planned for release in 2021, will have a maximum bandwidth of 256GB / s. In 2018, the SD Association officially announced that SD (Secure Digital) cards are compatible with the PCI Express channel, making PCI Express compatible with mobile storage cards a reality. For NM cards, PCI Express has the advantage of providing high bandwidth.

[0404] For example, the second NM card 5 includes at least ten gold fingers, such as first gold fingers 521 to tenth gold fingers 5210. Of the first gold fingers 521 to tenth gold fingers 5210, four gold fingers are used to transmit data signals (RX+, RX-, TX+, TX-), two gold fingers are used to transmit clock signals (CLK+, CLK-), one gold finger is used to transmit a first power signal (VDD1), one gold finger is used to transmit a ground signal (VSS), and one gold finger is used to transmit a second power signal (VDD2). Notably, one of the first gold fingers 521 to tenth gold fingers 5210 can be left floating. In this case, the second NM card 5 can support the PCIe interface protocol and achieve the basic performance of a high-speed card.

[0405] In this circuit, data signals (RX+) and (RX-) are input differential signals; data signals (TX+) and (TX-) are output differential signals; and clock signals (CLK+) and (CLK-) are differential low-voltage clock signals. The first power signal (VDD1) powers the storage circuit 513 of the second NM card 5; the second power signal (VDD2) powers the control circuit 512 of the second NM card 5. The voltage of the first power signal (VDD1) is higher than the voltage of the second power signal (VDD2). For example, the voltage of the first power signal (VDD1) can be in the range of 2.7V to 3.6V, and the voltage of the second power signal (VDD2) can be in the range of 1.70V to 1.95V.

[0406] In some other embodiments, among the first to tenth gold fingers 5210, one gold finger is not suspended and is used to transmit a detection signal (C / D). The detection signal (C / D) can be a special data signal. When the information card is electrically connected to the card connector 11 and communicating with the electronic device 100, the electronic device 100 can use the detection signal (C / D) to identify whether the inserted information card is the second NM card 5. In some embodiments, the electronic device 100 can also use the detection signal (C / D) to identify the version of the inserted second NM card 5 or the interface protocol of the inserted second NM card 5. The fact that the second NM card 5 transmits the detection signal (C / D) through one of the gold fingers reduces the difficulty for the electronic device 100 to identify the second NM card 5.

[0407] The following example illustrates the first signal arrangement method of the second NM card 5 using the PCIe interface protocol.

[0408] Please see Figure 33 , Figure 33 yes Figure 17 The diagram shown is a schematic representation of the second NM card 5 in some other embodiments.

[0409] For example, the third gold finger 523, sixth gold finger 526, ninth gold finger 529, and tenth gold finger 5210 of the second NM card 5 are used to transmit data signals. The following embodiment uses the third gold finger 523 for transmitting data signals (RX-), the sixth gold finger 526 for transmitting data signals (RX+), the ninth gold finger 529 for transmitting data signals (TX+), and the tenth gold finger 5210 for transmitting data signals (TX-) as examples. In some other embodiments, the data signals transmitted by the third gold finger 523, sixth gold finger 526, ninth gold finger 529, and tenth gold finger 5210 can be interchanged. For example, the data signals transmitted by the third gold finger 523 and the sixth gold finger 526 can be interchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged. Other embodiments will not be described further here.

[0410] The second gold finger 522 and the fifth gold finger 525 are used to transmit clock signals. The following embodiment uses the second gold finger 522 to transmit the clock signal (CLK-) and the fifth gold finger 525 to transmit the clock signal (CLK+) as an example. In some other embodiments, the clock signals transmitted by the second gold finger 522 and the fifth gold finger 525 can be interchanged.

[0411] The first gold finger 521 is used to transmit the second power signal (VDD2); the seventh gold finger 527 is used to transmit the ground signal (VSS); and the eighth gold finger 528 is used to transmit the first power signal (VDD1). The fourth gold finger 524 is left floating.

[0412] As shown in Table 6 below, Table 6 shows the correspondence between the multiple spring contacts of the card connector 11 and the multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the second NM card 5, and their transmission signals. When the second NM card 5 is connected to the card connector 11, the first spring contacts 11a to 11j of the card connector 11 abut against and electrically connect to the first gold fingers 521 to 5210 of the second NM card 5, and the third gold fingers 523 to 528 of the second NM card 5 correspond to the positions of the first gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold fingers 523 to 5210 of the second NM card 5 correspond to the positions of the first gold fingers 421 to 428 of the first NM card 4.

[0413] Table 6

[0414]

[0415]

[0416] In this embodiment, the second NM card 5 arranges the second power signal (VDD2) required by the PCIe protocol on the first gold finger 521. Since the first gold finger 521 of the second NM card 5 has no positional correspondence with any of the gold fingers of the Nano SIM card 3 and the first NM card 4, the first gold finger 521 of the second NM card 5 does not need to share the same spring contact with the multiplexer connector 11 of the Nano SIM card 3 and the first NM card 4. This avoids the second power signal (VDD2) sharing the same spring contact with the data signals of the Nano SIM card 3 and the first NM card 4, thereby reducing the risk of the Nano SIM card 3 and the first NM card 4 being burned by the second power signal (VDD2) when inserted into the electronic device 100 and the card connector 11. The electronic device 100 has high reliability in compatibility with the Nano SIM card 3, the first NM card 4, and the second NM card 5. In addition, the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design to prevent the circuit from being burned by the second power signal (VDD2), which can reduce costs.

[0417] The second NM card 5 arranges one of the clock signals (e.g., CLK-) on the second gold finger 522. Since the second gold finger 522 of the second NM card 5 has no positional correspondence with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the first spring 11a, regardless of whether the information card inserted in the electronic device 100 is the second NM card 5, the Nano SIM card 3 or the first NM card 4. This simplifies the circuit of the processor 20 and reduces the design difficulty and cost.

[0418] Furthermore, since the seventh gold finger 527 of the second NM card 5 corresponds to the fifth gold finger 325 of the Nano SIM card 3 and the fifth gold finger 425 of the first NM card 4, when inserted into the electronic device 100, they all abut against and are electrically connected to the seventh spring 11g of the card connector 11. The seventh gold finger 527 of the second NM card 5, the fifth gold finger 325 of the Nano SIM card 3, and the fifth gold finger 425 of the first NM card 4 are all used to transmit ground signals (VSS / GND / GND respectively). Therefore, the processor 20 of the electronic device 100 can be electrically connected to the seventh spring 11g of the card connector 11 through the same ground interface. Regardless of whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the seventh spring 11g, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0419] The eighth gold finger 528 of the second NM card 5 corresponds to the sixth gold finger 326 of the Nano SIM card 3 and the sixth gold finger 426 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the eighth spring 11h of the card connector 11. The eighth gold finger 528 of the second NM card 5, the sixth gold finger 326 of the Nano SIM card 3, and the sixth gold finger 426 of the first NM card 4 are all used to transmit power signals (VDD1 / VCC / VCC, respectively). Therefore, the processor 20 of the electronic device 100 can be electrically connected to the eighth spring 11h of the card connector 11 through the same power interface. Regardless of whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the eighth spring 11h, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0420] The third gold finger 523 of the second NM card 5 corresponds to the position of the first gold finger 321 of the Nano SIM card 3 and the position of the first gold finger 421 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the third spring 11c of the card connector 11. The third gold finger 523 of the second NM card 5 is used to transmit data signals (e.g., RX-), the first gold finger 321 of the Nano SIM card 3 is used to transmit data signals (DATA), and the first gold finger 421 of the first NM card 4 is used to transmit data signals (e.g., DATA1). The second NM card 5, the Nano SIM card 3, and the first NM card 4 can time-division multiplex the third spring 11c.

[0421] The fifth gold finger 525 of the second NM card 5 corresponds to the position of the third gold finger 323 of the Nano SIM card 3 and the position of the third gold finger 423 of the first NM card 4. When inserted into the electronic device 100, they all abut against and are electrically connected to the fifth spring 11e of the card connector 11. The fifth gold finger 525 of the second NM card 5 is used to transmit another clock signal (e.g., CLK+). The third gold finger 323 of the Nano SIM card 3 is used to transmit the programming voltage / input signal (VPP). The first gold finger 421 of the first NM card 4 is used to transmit the command and response signal (CMD). The fifth spring 11e of the second NM card 5, the Nano SIM card 3 and the first NM card 4 can be time-division multiplexed.

[0422] The sixth gold finger 526 of the second NM card 5 corresponds to the fourth gold finger 324 of the Nano SIM card 3 and the fourth gold finger 424 of the first NM card 4. When inserted into the electronic device 100, it abuts against and is electrically connected to the sixth spring 11f of the card connector 11. The sixth gold finger 526 of the second NM card 5 is used to transmit another data signal (e.g., RX+), the fourth gold finger 324 of the Nano SIM card 3 is used to transmit a reset signal (RST), and the fourth gold finger 424 of the first NM card 4 is used to transmit a data signal (e.g., DATA0). The second NM card 5, the Nano SIM card 3, and the first NM card 4 can time-division multiplex the sixth spring 11f.

[0423] The ninth gold finger 529 of the second NM card 5 corresponds to the seventh gold finger 427 of the first NM card 4. When inserted into the electronic device 100, both abut against and are electrically connected to the ninth spring 11i of the card connector 11. The ninth gold finger 529 of the second NM card 5 is used to transmit data signals (e.g., TX+), and the seventh gold finger 427 of the first NM card 4 is used to transmit data signals (e.g., DATA3). The second NM card 5 and the first NM card 4 can time-division multiplex the ninth spring 11i.

[0424] The tenth gold finger 5210 of the second NM card 5 corresponds to the eighth gold finger 428 of the first NM card 4. When inserted into the electronic device 100, both abut against and are electrically connected to the tenth spring 11j of the card connector 11. The tenth gold finger 5210 of the second NM card 5 is used to transmit data signals (e.g., TX-), and the eighth gold finger 428 of the first NM card 4 is used to transmit data signals (e.g., DATA2). The second NM card 5 and the first NM card 4 can time-division multiplex the tenth spring 11j.

[0425] When the electronic device 100 is compatible with Nano SIM card 3 and second NM card 5, but not compatible with first NM card 4, the ninth spring 11i and tenth spring 11j of the card connector 11 can also be unique springs of the second NM card 5. Both the ninth spring 11i and the tenth spring 11j are connected to the high-speed data interface. Regardless of whether the information card inserted in the electronic device 100 is the second NM card 5 or the Nano SIM card 3, the processor 20 does not need to switch the interface electrically connected to the ninth spring 11i and the tenth spring 11j, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

[0426] For example, the third gold finger 523 and the tenth gold finger 5210 of the second NM card 5 can be electrically connected to a high-voltage resistant circuit or a protection switch to prevent the circuit from burning out when the card interface 52 of the second NM card 5 is short-circuited. The high-voltage resistant circuit or protection switch is located within the package 511 of the second NM card 5. In some other embodiments, the circuit of the second NM card 5 can also be prevented from burning out by providing a high-impedance protection circuit within the electronic device, for example, by adding a protection circuit within the interface controller of the electronic device.

[0427] In some other embodiments, the fourth gold finger 524 may also be configured not to be suspended, and may be used to transmit detection signals (C / D).

[0428] In some other embodiments, the second gold finger 522 of the second NM card 5 is either left floating or used to transmit a detection signal (C / D), and the fourth gold finger 524 is used to transmit a clock signal (e.g., CLK-). The clock signals transmitted by the fourth gold finger 524 and the fifth gold finger 525 can be interchanged.

[0429] Please see Figure 34 , Figure 34 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device 100 shown in some other embodiments.

[0430] In some embodiments, the card slot assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as follows: Figure 33 As shown. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203 and a second memory card controller 2022. The SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201. The interface controller 201 is electrically connected to the first spring 11a to the tenth spring 11j of the card connector 11 of the card socket assembly 10.

[0431] The SIM card controller 203 includes a data interface, a clock interface, a programming voltage / input interface, and a reset interface. The data interface is used to transmit data signals (DATA), the clock interface is used to transmit clock signals (CLK), the programming voltage / input interface is used to transmit programming voltage / input signals (VPP), and the reset interface is used to transmit reset signals (RST). Figure 34 In the accompanying drawings and related descriptions, the multiple interfaces of the SIM card controller 203 are illustrated by the signals they transmit.

[0432] The second memory card controller 2022 includes four data interfaces, two clock interfaces, and a second power interface. The four data interfaces are used to transmit data signals (RX+, RX-, TX+, TX-), the two clock interfaces are used to transmit clock signals (CLK+, CLK-), and the second power interface is used to transmit a second power signal (VDD2). Figure 34 In the accompanying drawings and related descriptions, the multiple interfaces of the second memory card controller 2022 are schematically identified by the signals they transmit. In some other embodiments, the second power interface may also be independent of the second memory card controller 2022; this application does not strictly limit this.

[0433] The processor 20 also includes a power interface and a ground interface. The power interface is used to transmit a power signal (VCC) or a first power signal (VDD1), and the ground interface is used to transmit a ground signal (GND) or a ground signal (VSS). The power interface and ground interface can be located independently of the SIM card controller 203 and the second memory card controller 2022, or they can be separated and integrated into the SIM card controller 203 and the second memory card controller 2022. This embodiment does not strictly limit the specific implementation. Figure 34 In the accompanying drawings, the power interface and ground interface are shown as independent of the SIM card controller 203 and the second memory card controller 2022, and are respectively labeled as power and ground.

[0434] For example, interface controller 201 is used to connect SIM card controller 203 to card connector 11, or to connect second memory card controller 2022 to card connector 11. Interface controller 201 may include multiple switches and wires.

[0435] In some embodiments, the interface controller 201 includes a first switch 2011, a second switch 2012, and a third switch 2013.

[0436] The first switch 2011 connects a data interface (e.g., RX-) of the second memory card controller 2022 and a data interface (DATA) of the SIM card controller 203. The first switch 2011 is also connected to the third spring 11c of the card connector 11. The first switch 2011 is used to connect the third spring 11c to the data interface (e.g., RX-) of the second memory card controller 2022, or to connect the third spring 11c to the data interface (DATA) of the SIM card controller 203.

[0437] The second switch 2012 connects one of the clock interfaces (e.g., CLK+) of the second memory card controller 2022 and the programming voltage / input interface (VPP) of the SIM card controller 203. The second switch 2012 is also connected to the fifth spring 11e of the card connector 11. The second switch 2012 is used to connect the fifth spring 11e to the clock interface (e.g., CLK+) of the second memory card controller 2022, or to connect the fifth spring 11e to the programming voltage / input interface (VPP) of the SIM card controller 203.

[0438] The third switch 2013 connects to another data interface (e.g., RX+) of the second memory card controller 2022 and the reset interface (RST) of the SIM card controller 203. The third switch 2013 is also connected to the sixth spring 11f of the card connector 11. The third switch 2013 is used to connect the sixth spring 11f to the data interface (e.g., RX+) of the second memory card controller 2022, or to connect the sixth spring 11f to the reset interface (RST) of the SIM card controller 203.

[0439] The second power interface (VDD2) of the second memory card controller 2022 is connected to the first spring 11a of the interface controller 201 electrical connection card connector 11. Another clock interface (e.g., CLK-) of the second memory card controller 2022 is connected to the second spring 11b of the interface controller 201 electrical connection card connector 11. Another data interface (e.g., TX+) of the second memory card controller 2022 is connected to the ninth spring 11i of the interface controller 201 electrical connection card connector 11. Another data interface (e.g., TX-) of the second memory card controller 2022 is connected to the tenth spring 11j of the interface controller 201 electrical connection card connector 11. The power interface of the processor 20 is connected to the eighth spring 11h of the interface controller 201 electrical connection card connector 11. The ground interface of the processor 20 is connected to the seventh spring 11g of the interface controller 201 electrical connection card connector 11. The clock interface (CLK) of the SIM card controller 203 is connected to the fourth spring 11d of the interface controller 201 electrical connection card connector 11.

[0440] Specifically, the interface controller 201 can be connected by wires to maintain a conductive state between the second power interface (VDD2) of the second memory card controller 2022 and the first spring 11a, between the clock interface (e.g., CLK-) of the second memory card controller 2022 and the second spring 11b, between the clock interface (CLK) of the SIM card controller 203 and the fourth spring 11d, between the data interface (e.g., TX+) of the second memory card controller 2022 and the ninth spring 11i, between the data interface (e.g., TX-) of the second memory card controller 2022 and the tenth spring 11j, between the power interface of the processor 20 and the eighth spring 11h, and between the ground interface and the seventh spring 11g. The interface controller 201 can also be connected in series with a switch to switch between the conductive and disconnected states. This embodiment of the application does not strictly limit this.

[0441] In this embodiment, when the Nano SIM card 3 is inserted into the card slot assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 connects the SIM card controller 203 and the card connector 11. The SIM card controller 203 transmits data signals (DATA), clock signals (CLK), transmission programming voltage / input signals (VPP), and reset signals (RST) with the Nano SIM card 3 through the third spring 11c to the sixth spring 11f of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the Nano SIM card 3 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The Nano SIM card 3 communicates with the electronic device 100.

[0442] When the second NM card 5 is inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 to the card connector 11. The second memory card controller 2022 transmits data signals (RX+, RX-, TX+, TX-), clock signals (CLK+, CLK-), and a second power signal (VDD2) with the second NM card 5 via the first spring 11a to the third spring 11c, the fifth spring 11e, the sixth spring 11f, the ninth spring 11i, and the tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits a first power signal (VDD1) and a ground signal (VSS) with the second NM card 5 via the eighth spring 11h and the seventh spring 11g of the card connector 11. Thus, the second NM card 5 communicates with the electronic device 100. Therefore, the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5.

[0443] For example, the third gold finger 523 and the tenth gold finger 5210 of the second NM card 5 can be electrically connected to a high-voltage resistant circuit or a protection switch to prevent the circuit from burning out when the card interface 52 of the second NM card 5 is short-circuited. The high-voltage resistant circuit or protection switch is located within the package 511 of the second NM card 5. In some other embodiments, the circuit of the second NM card 5 can also be prevented from burning out by providing a high-impedance protection circuit within the electronic device, for example, by adding a protection circuit within the interface controller of the electronic device.

[0444] Understandably, when the fourth gold finger 524 of the second NM card 5 is used to transmit detection signals (C / D), the interface controller 201 makes adaptive adjustments. The interface controller 201 is also used to connect the detection interface (C / D) of the second memory card controller 2022 with the fourth spring 11d when the second NM card 5 is inserted into the electronic device 100.

[0445] In some other embodiments, when the second gold finger 522 of the second NM card 5 is suspended and the fourth gold finger 524 is used to transmit clock signals (e.g., CLK-), the interface controller 201 makes adaptive adjustments. The interface controller 201 is also used to connect the clock interface (e.g., CLK-) of the second memory card controller 2022 with the fourth spring 11d when the second NM card 5 is inserted into the electronic device 100.

[0446] In some other embodiments, the programming voltage / input signal (VPP) may not be supported to reduce the design complexity of the processor 20. In this case, the SIM card controller 203 may not include the programming voltage / input interface (VPP), the interface controller 201 may not include the second switch 2012, and a clock interface (e.g., CLK+) of the second memory card controller 2022 is electrically connected to the fifth spring 11e of the card connector 11 through the interface controller 201. Other solutions are described in the above embodiments and will not be repeated here.

[0447] Please see Figure 35 , Figure 35 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device 100 shown in some other embodiments.

[0448] In some embodiments, the card slot assembly 10 of the electronic device 100 is compatible with Nano SIM card 3, first NM card 4, and second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as follows: Figure 33As shown. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021, and a second memory card controller 2022. The SIM card controller 203, the first memory card controller 2021, and the second memory card controller 2022 are electrically connected to the interface controller 201. The interface controller 201 is electrically connected to the first spring 11a to the tenth spring 11j of the card connector 11 of the card socket assembly 10.

[0449] The SIM card controller 203 and the second memory card controller 2022 can be found in [reference]. Figure 34 The relevant descriptions of the corresponding embodiments will not be repeated here. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexed interface. The four data interfaces are used to transmit data signals (DATA0, DATA1, DATA2, DATA3), the clock interface is used to transmit clock signals (CLK), and the command and response multiplexed interface is used to transmit command and response signals (CMD). Figure 35 In the accompanying drawings and related descriptions, the multiple interfaces of the first memory card controller 2021 are schematically identified by the signals they transmit. The power interface and ground interface can also be integrated into the first memory card controller 2021 after being separated.

[0450] For example, the interface controller 201 is used to connect the SIM card controller 203 to the card connector 11, or to connect the first memory card controller 2021 to the card connector 11, or to connect the second memory card controller 2022 to the card connector 11. The interface controller 201 may include multiple switches and wires.

[0451] In some embodiments, the interface controller 201 includes a first switch 2011, a second switch 2012, a third switch 2013, a fourth switch 2014, a fifth switch 2015, and a sixth switch 2016.

[0452] The first switch 2011 is connected to a data interface (e.g., RX-) of the second memory card controller 2022, a data interface (e.g., DATA1) of the first memory card controller 2021, and a data interface (DATA) of the SIM card controller 203. The first switch 2011 is also connected to the third spring 11c of the card connector 11. The first switch 2011 is used to connect the third spring 11c to the data interface (e.g., RX-) of the second memory card controller 2022, or to the data interface (e.g., DATA1) of the first memory card controller 2021, or to the data interface (DATA) of the SIM card controller 203.

[0453] The second switch 2012 is connected to one of the clock interfaces (CLK+) of the second memory card controller 2022, the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the programming voltage / input interface (VPP) of the SIM card controller 203. The second switch 2012 is also connected to the fifth spring 11e of the card connector 11. The second switch 2012 is used to connect the fifth spring 11e to the clock interface (CLK+) of the second memory card controller 2022, or to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or to the programming voltage / input interface (VPP) of the SIM card controller 203.

[0454] The third switch 2013 is connected to another data interface (e.g., RX+) of the second memory card controller 2022, another data interface (e.g., DATA0) of the first memory card controller 2021, and the reset interface (RST) of the SIM card controller 203. The third switch 2013 is also connected to the sixth spring 11f of the card connector 11. The third switch 2013 is used to connect the sixth spring 11f to the data interface (e.g., RX+) of the second memory card controller 2022, or to the data interface (e.g., DATA0) of the first memory card controller 2021, or to the reset interface (RST) of the SIM card controller 203.

[0455] The fourth switch 2014 is connected to the clock interface (CLK) of the first memory card controller 2021 and the clock interface (CLK) of the SIM card controller 203. The fourth switch 2014 is also connected to the fourth spring 11d of the card connector 11. The fourth switch 2014 is used to connect the third spring 11c to the clock interface (CLK) of the first memory card controller 2021, or to connect the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

[0456] The fifth switch 2015 connects another data interface (e.g., TX+) of the second memory card controller 2022 and another data interface (e.g., DATA3) of the first memory card controller 2021. The fifth switch 2015 also connects to the ninth spring 11i of the card connector 11. The fifth switch 2015 is used to connect the ninth spring 11i to the data interface (e.g., TX+) of the second memory card controller 2022, or to connect the ninth spring 11i to the data interface (e.g., DATA3) of the first memory card controller 2021.

[0457] The sixth switch 2016 connects to another data interface (e.g., TX-) of the second memory card controller 2022 and another data interface (e.g., DATA2) of the first memory card controller 2021. The sixth switch 2016 also connects to the tenth spring 11j of the card connector 11. The sixth switch 2016 is used to connect the tenth spring 11j to the data interface (e.g., TX-) of the second memory card controller 2022, or to connect the tenth spring 11j to the data interface (e.g., DATA2) of the first memory card controller 2021.

[0458] The second power interface (VDD2) of the second memory card controller 2022 is connected to the first spring 11a of the interface controller 201 electrical connection card connector 11. Another clock interface (e.g., CLK-) of the second memory card controller 2022 is connected to the second spring 11b of the interface controller 201 electrical connection card connector 11. The power interface of the processor 20 is connected to the eighth spring 11h of the interface controller 201 electrical connection card connector 11. The ground interface of the processor 20 is connected to the seventh spring 11g of the interface controller 201 electrical connection card connector 11. Specifically, the interface controller 201 can be connected by wires between the second power interface (VDD2) of the second memory card controller 2022 and the first spring 11a, between the clock interface (e.g., CLK-) of the second memory card controller 2022 and the second spring 11b, between the power interface of the processor 20 and the eighth spring 11h, and between the ground interface and the seventh spring 11g, to maintain the conduction state. The interface controller 201 can also be connected in series with a switch to switch between the conduction state and the cut-off state. This application embodiment does not strictly limit this.

[0459] In this embodiment, when the Nano SIM card 3 is inserted into the card slot assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 connects the SIM card controller 203 and the card connector 11. The SIM card controller 203 transmits data signals (DATA), clock signals (CLK), transmission programming voltage / input signals (VPP), and reset signals (RST) with the Nano SIM card 3 through the third spring 11c to the sixth spring 11f of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the Nano SIM card 3 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The Nano SIM card 3 communicates with the electronic device 100.

[0460] When the first NM card 4 is inserted into the card slot assembly 10 of the electronic device 100 and the first NM card 4 is electrically connected to the card connector 11, the interface controller 201 connects the first memory card controller 2021 to the card connector 11. The first memory card controller 2021 transmits data signals (DATA0, DATA1, DATA2, DATA3), clock signals (CLK), and command and response signals (CMD) with the first NM card 4 through the third spring 11c to the sixth spring 11f, the ninth spring 11i, and the tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits power signals (VCC) and ground signals (GND) with the first NM card 4 through the eighth spring 11h and the seventh spring 11g of the card connector 11. The first NM card 4 communicates with the electronic device 100.

[0461] When the second NM card 5 is inserted into the card slot assembly 10 of the electronic device 100 and electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 to the card connector 11. The second memory card controller 2022 transmits data signals (RX+, RX-, TX+, TX-), clock signals (CLK+, CLK-), and a second power signal (VDD2) with the second NM card 5 via the first spring 11a to the third spring 11c, the fifth spring 11e, the sixth spring 11f, the ninth spring 11i, and the tenth spring 11j of the card connector 11. The processor 20 of the electronic device 100 transmits a first power signal (VDD1) and a ground signal (VSS) with the second NM card 5 via the eighth spring 11h and the seventh spring 11g of the card connector 11. Thus, the second NM card 5 communicates with the electronic device 100. Therefore, the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5.

[0462] Understandably, when the fourth gold finger 524 of the second NM card 5 is used to transmit detection signals (C / D), the interface controller 201 makes adaptive adjustments. The interface controller 201 is also used to connect the detection interface (C / D) of the second memory card controller 2022 with the fourth spring 11d when the second NM card 5 is inserted into the electronic device 100.

[0463] In some other embodiments, when the second gold finger 522 of the second NM card 5 is suspended and the fourth gold finger 524 is used to transmit clock signals (e.g., CLK-), the interface controller 201 makes adaptive adjustments. The interface controller 201 is also used to connect the clock interface (e.g., CLK-) of the second memory card controller 2022 with the fourth spring 11d when the second NM card 5 is inserted into the electronic device 100.

[0464] In some other embodiments, the programming voltage / input signal (VPP) may not be supported to reduce the design complexity of the processor 20. In this case, the SIM card controller 203 may not include the programming voltage / input interface (VPP). The second switch 2012 is connected to one of the clock interfaces (CLK+) of the second memory card controller 2022 and the command and response multiplexing interface (CMD) of the first memory card controller 2021. The second switch 2012 is also connected to the fifth spring 11e of the card connector 11. Other solutions are described in the above embodiments and will not be repeated here.

[0465] The following example illustrates the second signal arrangement method of the second NM card 5 using the PCIe interface protocol.

[0466] Please refer to the following: Figures 36 to 38 , Figure 36 yes Figure 17 The diagram shown is a schematic representation of the second NM card 5 in some other embodiments. Figure 37 yes Figure 1 The schematic diagram shows a portion of the circuitry of the electronic device 100 in some other embodiments. Figure 38 yes Figure 1 A schematic diagram of a portion of the circuitry of the electronic device 100 shown in some other embodiments.

[0467] Figure 36 The second NM card 5 shown is Figure 33 The main difference of the second NM card 5 shown is that the first gold finger 521 of the second NM card 5 is used to transmit clock signals (e.g., CLK-), and the second gold finger 522 is used to transmit the second power signal (VDD2). That is, Figure 36 The second NM card 5 shown is Figure 33 The signals transmitted by the first gold finger 521 and the second gold finger 522 of the second NM card 5 shown are interchanged. Specifically, the clock signals transmitted by the first gold finger 521 and the fifth gold finger 525 are interchangeable. Figure 36 Other solutions for the second NM card 5 shown can be found by referring to [the relevant documentation / reference]. Figure 33 The relevant description of the second NM card 5 shown will not be repeated here.

[0468] Among them, Figure 36In the second NM card 5 shown, when the fourth gold finger 524 adjacent to the second gold finger 522 is left floating, since the fourth gold finger 524 does not transmit signals, the circuit of the second NM card 5 will not be burned out due to a short circuit between the fourth gold finger 524 and the second gold finger 522, thus improving the reliability of the second NM card 5. Furthermore, the fourth gold finger 524 of the second NM card 5 does not require a high-voltage circuit or protection switch for electrical connection, resulting in a lower cost for the second NM card 5. In some other embodiments, the first gold finger 521 can also be left floating, and the fourth gold finger 524 can be used to transmit clock signals (e.g., CLK-).

[0469] Figure 37 The electronic device 100 shown is Figure 34 The main difference of the electronic device 100 shown is that the second power interface (VDD2) of the second memory card controller 2022 is connected to the first spring 11a of the electrical connector 11, and the second spring 11b of the electrical connector 11 is connected to the clock interface (e.g., CLK-). Figure 37 Other solutions for the electronic device 100 shown can be found by referring to... Figure 34 The relevant description of the electronic device 100 shown will not be repeated here.

[0470] Figure 38 The electronic device 100 shown is Figure 35 The main difference of the electronic device 100 shown is that the second power interface (VDD2) of the second memory card controller 2022 is connected to the first spring 11a of the electrical connector 11, and the second spring 11b of the electrical connector 11 is connected to the clock interface (e.g., CLK-). Figure 38 Other solutions for the electronic device 100 shown can be found by referring to... Figure 35 The relevant description of the electronic device 100 shown will not be repeated here.

[0471] The following example illustrates the third signal arrangement method of the second NM card 5, which uses the PCIe interface protocol.

[0472] Please see Figure 39 , Figure 39 yes Figure 17 The diagram shown is a schematic representation of the second NM card 5 in some other embodiments.

[0473] For example, the second gold finger 522, the sixth gold finger 526, the ninth gold finger 529, and the tenth gold finger 5210 of the second NM card 5 are used to transmit data signals. The following embodiment uses the second gold finger 522 for transmitting data signals (RX-), the sixth gold finger 526 for transmitting data signals (RX+), the ninth gold finger 529 for transmitting data signals (TX+), and the tenth gold finger 5210 for transmitting data signals (TX-) as examples. In other embodiments, the data signals transmitted by the second gold finger 522, the sixth gold finger 526, the ninth gold finger 529, and the tenth gold finger 5210 can be interchanged. For example, the data signals transmitted by the second gold finger 522 and the sixth gold finger 526 can be interchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged. Other embodiments will not be described further here.

[0474] The fourth gold finger 524 and the fifth gold finger 525 are used to transmit clock signals. The following embodiment uses the fourth gold finger 524 to transmit the clock signal (CLK-) and the fifth gold finger 525 to transmit the clock signal (CLK+) as an example. In some other embodiments, the clock signals transmitted by the fourth gold finger 524 and the fifth gold finger 525 can be interchanged.

[0475] The first gold finger 521 is used to transmit the second power signal (VDD2); the seventh gold finger 527 is used to transmit the ground signal (VSS); and the eighth gold finger 528 is used to transmit the first power signal (VDD1). The third gold finger 523 is left floating.

[0476] As shown in Table 7 below, Table 7 shows the correspondence between the multiple spring contacts of the card connector 11 and the multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the second NM card 5, and their transmission signals. When the second NM card 5 is connected to the card connector 11, the first spring contacts 11a to 11j of the card connector 11 abut against and electrically connect to the first gold fingers 521 to 5210 of the second NM card 5, and the third gold fingers 523 to 528 of the second NM card 5 correspond to the positions of the first gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold fingers 523 to 5210 of the second NM card 5 correspond to the positions of the first gold fingers 421 to 428 of the first NM card 4.

[0477] Table 7

[0478]

[0479]

[0480] In this embodiment, the second NM card 5 arranges the second power signal (VDD2) required by the PCIe protocol on the first gold finger 521. Since the first gold finger 521 of the second NM card 5 has no positional correspondence with any of the gold fingers of the Nano SIM card 3 and the first NM card 4, the first gold finger 521 of the second NM card 5 does not need to share the same spring contact with the multiplexer connector 11 of the Nano SIM card 3 and the first NM card 4. This avoids the second power signal (VDD2) sharing the same spring contact with the data signals of the Nano SIM card 3 and the first NM card 4, thereby reducing the risk of the Nano SIM card 3 and the first NM card 4 being burned by the second power signal (VDD2) when inserted into the electronic device 100 and the card connector 11. The electronic device 100 has high reliability in compatibility with the Nano SIM card 3, the first NM card 4, and the second NM card 5. In addition, the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design to prevent the circuit from being burned by the second power signal (VDD2), which can reduce costs.

[0481] The second NM card 5 arranges one of its high-speed data signals (e.g., RX-) on the second gold finger 522. Since the second gold finger 522 of the second NM card 5 has no positional correspondence with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the second spring 11b connects to the high-speed data interface of the processor 20 of the electronic device 100 without needing to connect to the low-speed data interface. Regardless of whether the information card inserted in the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the second spring 11b. This reduces the difficulty of switching between the high-speed data interface and the low-speed data interface, simplifies the circuit of the processor 20, and reduces the design difficulty and cost.

[0482] Furthermore, since the seventh gold finger 527 of the second NM card 5 corres...

Claims

1. An electronic device (100), characterized in that, Includes a card holder (1) and a card tray (2), wherein the card tray (2) is detachably inserted into the card holder (1); The card holder (1) includes ten spring pieces arranged in an array. The ten spring pieces are arranged along a first direction to form a first row of spring pieces (11a, 11b) to a fifth row of spring pieces (11i, 11j). The center distance between the second row of spring pieces (11c, 11d) and the third row of spring pieces (11e, 11f) is greater than the center distance between the first row of spring pieces (11a, 11b) and the second row of spring pieces (11c, 11d), and is greater than the center distance between the fourth row of spring pieces (11g, 11h) and the fifth row of spring pieces (11i, 11j). The center distance between the third row of spring pieces (11e, 11f) and the fourth row of spring pieces (11g, 11h) is greater than the center distance between the first row of spring pieces (11a, 11b) and the second row of spring pieces (11c, 11d), and is greater than the center distance between the fourth row of spring pieces (11g, 11h) and the fifth row of spring pieces (11i, 11j). When the card tray (2) is fitted with a Nano SIM card (3), the second row of spring contacts (11c, 11d) to the fourth row of spring contacts (11g, 11h) are electrically connected to the six gold fingers of the Nano SIM card (3) in a one-to-one correspondence, and the first row of spring contacts (11a, 11b) and the fifth row of spring contacts (11i, 11j) abut against the Nano SIM card (3). When the card tray (2) is equipped with the second NM card (5), the ten spring contacts are electrically connected to the ten gold fingers of the second NM card (5) in a one-to-one correspondence. The size of the card body (51) of the second NM card (5) is the same as the size of the card body (31) of the Nano SIM card (3). Each of the spring pieces includes a fixed end (111a), an abutting end (111b), and a movable end (111c). The fixed end (111a), the abutting end (111b), and the movable end (111c) are arranged sequentially along the extension direction of the spring piece, and the extension direction of the spring piece is perpendicular to the first direction. The card holder (1) also includes an insulating body (112), the fixed end (111a) is fixed to the insulating body (112), the abutting end (111b) protrudes from one side surface of the insulating body (112), and the movable end (111c) is movably installed on the insulating body (112).

2. The electronic device (100) according to claim 1, characterized in that, The center-to-center distance between the first row of spring clips (11a, 11b) and the second row of spring clips (11c, 11d) is in the range of 1.0 mm to 1.7 mm; The center-to-center distance between the second row of spring clips (11c, 11d) and the third row of spring clips (11e, 11f) is in the range of 1.5mm to 2.8mm; The center-to-center distance between the third row of spring clips (11e, 11f) and the fourth row of spring clips (11g, 11h) is in the range of 1.5mm to 2.8mm; The center-to-center distance between the fourth row of spring clips (11g, 11h) and the fifth row of spring clips (11i, 11j) is in the range of 1.0mm to 1.7mm.

3. The electronic device (100) according to claim 1 or 2, characterized in that, The ten said spring pieces are arranged in a first column of spring pieces and a second column of spring pieces along a second direction, the second direction being perpendicular to the first direction; The first column of shrapnel includes a first shrapnel (11a), a third shrapnel (11c), a fifth shrapnel (11e), a seventh shrapnel (11g), and a ninth shrapnel (11i) arranged along the first direction. The second column of shrapnel includes a second shrapnel (11b), a fourth shrapnel (11d), a sixth shrapnel (11f), an eighth shrapnel (11h), and a tenth shrapnel (11j) arranged along the first direction. When the card tray (2) is fitted with a Nano SIM card (3), the first spring (11a) and the third spring (11c) are electrically connected to the same gold finger of the Nano SIM card (3), and the second spring (11b) and the fourth spring (11d) are electrically connected to the same gold finger of the Nano SIM card (3); or, the first row of springs (11a, 11b) abuts against the card body (31) of the Nano SIM card (3). And / or, when the card tray (2) is fitted with a Nano SIM card (3), the ninth spring (11i) and the seventh spring (11g) are electrically connected to the same gold finger of the Nano SIM card (3), and the tenth spring (11j) and the eighth spring (11h) are electrically connected to the same gold finger of the Nano SIM card (3); or, the fifth row of springs (11i, 11j) abuts against the card body (31) of the Nano SIM card (3).

4. The electronic device (100) according to claim 1 or 2, characterized in that, The electronic device (100) further includes a processor (20), which includes an interface controller (201), a memory card controller (202), and a SIM card controller (203). The interface controller (201) is electrically connected to the memory card controller (202) and the SIM card controller (203), and is also electrically connected to ten of the spring contacts. When a Nano SIM card (3) is installed in the card tray (2), the interface controller (201) controls the SIM card controller (203) to communicate with the Nano SIM card (3); When the card tray (2) is equipped with a second NM card (5), the interface controller (201) controls the memory card controller (202) to communicate with the second NM card (5).

5. The electronic device (100) according to claim 1 or 2, characterized in that, When the card tray (2) is fitted with the first NM card, the second row of spring contacts (11c, 11d) to the fifth row of spring contacts (11i, 11j) are electrically connected to the eight gold fingers of the first NM card in a one-to-one correspondence. The first row of spring contacts (11a, 11b) abuts against the first NM card. The size of the card body (51) of the first NM card is the same as the size of the card body (31) of the Nano SIM card (3).

6. The electronic device (100) according to claim 5, characterized in that, The ten said spring pieces are arranged in a first column of spring pieces and a second column of spring pieces along a second direction, the second direction being perpendicular to the first direction; The first column of shrapnel includes a first shrapnel (11a), a third shrapnel (11c), a fifth shrapnel (11e), a seventh shrapnel (11g), and a ninth shrapnel (11i) arranged along the first direction. The second column of shrapnel includes a second shrapnel (11b), a fourth shrapnel (11d), a sixth shrapnel (11f), an eighth shrapnel (11h), and a tenth shrapnel (11j) arranged along the first direction. When the card tray (2) is fitted with a first NM card, the first spring (11a) and the third spring (11c) are electrically connected to the same gold finger of the first NM card, and the second spring (11b) and the fourth spring (11d) are electrically connected to the same gold finger of the first NM card; or, the first row of springs (11a, 11b) abuts against the card body (31) of the Nano SIM card (3).

7. The electronic device (100) according to claim 6, characterized in that, The electronic device (100) further includes a processor (20), which includes an interface controller (201), a SIM card controller (203), a first memory card controller (2021), and a second memory card controller (2022). The interface controller (201) is electrically connected to the SIM card controller (203), the first memory card controller (2021), and the second memory card controller (2022), and is also electrically connected to ten of the spring contacts. When a Nano SIM card (3) is installed in the card tray (2), the interface controller (201) controls the SIM card controller (203) to communicate with the Nano SIM card (3); When the card tray (2) is equipped with the first NM card, the interface controller (201) controls the first memory card controller (2021) to communicate with the first NM card; When the card tray (2) is equipped with the second NM card (5), the interface controller (201) controls the second memory card controller (2022) to communicate with the second NM card (5).

8. The electronic device (100) according to claim 1, characterized in that, The insulating body (112) is provided with a connecting hole (1124), and the movable end (111c) is movably inserted into the connecting hole (1124). The end of the movable end (111c) includes a stop block (1111), and the stop block (1111) cooperates with the insulating body (112) to form an anti-detachment structure.

9. A card connector (11), characterized in that, The device comprises ten spring pieces arranged in an array, the ten spring pieces being arranged along a first direction to form a first row of spring pieces (11a, 11b) to a fifth row of spring pieces (11i, 11j); the center-to-center distance between the second row of spring pieces (11c, 11d) and the third row of spring pieces (11e, 11f) is greater than the center-to-center distance between the first row of spring pieces (11a, 11b) and the second row of spring pieces (11c, 11d), and is greater than the center-to-center distance between the fourth row of spring pieces (11g, 11h) and the fifth row of spring pieces (11i, 11j); the center-to-center distance between the third row of spring pieces (11e, 11f) and the fourth row of spring pieces (11g, 11h) is greater than the center-to-center distance between the first row of spring pieces (11a, 11b) and the second row of spring pieces (11c, 11d), and is greater than the center-to-center distance between the fourth row of spring pieces (11g, 11h) and the fifth row of spring pieces (11i, 11j); When the card connector (11) is connected to the Nano SIM card (3), the second row of spring contacts (11c, 11d) to the fourth row of spring contacts (11g, 11h) are electrically connected to the six gold fingers of the Nano SIM card (3) in a one-to-one correspondence, and the first row of spring contacts (11a, 11b) and the fifth row of spring contacts (11i, 11j) abut against the Nano SIM card (3). When the card connector (11) is connected to the second NM card (5), the ten spring contacts are electrically connected to the ten gold fingers of the second NM card (5) in a one-to-one correspondence. The size of the card body (51) of the second NM card (5) is the same as the size of the card body (31) of the Nano SIM card (3). Each of the spring pieces includes a fixed end (111a), an abutting end (111b), and a movable end (111c). The fixed end (111a), the abutting end (111b), and the movable end (111c) are arranged sequentially along the extension direction of the spring piece, and the extension direction of the spring piece is perpendicular to the first direction. The card connector (11) also includes an insulating body (112), the fixed end (111a) is fixed to the insulating body (112), the abutting end (111b) protrudes from one side surface of the insulating body (112), and the movable end (111c) is movably mounted on the insulating body (112).

10. The card connector (11) according to claim 9, characterized in that, The center-to-center distance between the first row of spring clips (11a, 11b) and the second row of spring clips (11c, 11d) is in the range of 1.0 mm to 1.7 mm; The center-to-center distance between the second row of spring clips (11c, 11d) and the third row of spring clips (11e, 11f) is in the range of 1.5mm to 2.8mm; The center-to-center distance between the third row of spring clips (11e, 11f) and the fourth row of spring clips (11g, 11h) is in the range of 1.5mm to 2.8mm; The center-to-center distance between the fourth row of spring clips (11g, 11h) and the fifth row of spring clips (11i, 11j) is in the range of 1.0mm to 1.7mm.

11. The card connector (11) according to claim 9 or 10, characterized in that, The ten said spring pieces are arranged in a first column of spring pieces and a second column of spring pieces along a second direction, the second direction being perpendicular to the first direction; The first column of shrapnel includes a first shrapnel (11a), a third shrapnel (11c), a fifth shrapnel (11e), a seventh shrapnel (11g), and a ninth shrapnel (11i) arranged along the first direction. The second column of shrapnel includes a second shrapnel (11b), a fourth shrapnel (11d), a sixth shrapnel (11f), an eighth shrapnel (11h), and a tenth shrapnel (11j) arranged along the first direction. When the card connector (11) is connected to the Nano SIM card (3), the first spring (11a) and the third spring (11c) are electrically connected to the same gold finger of the Nano SIM card (3), and the second spring (11b) and the fourth spring (11d) are electrically connected to the same gold finger of the Nano SIM card (3); or, the first row of springs (11a, 11b) abuts against the card body (31) of the Nano SIM card (3). And / or, when the card connector (11) is connected to the Nano SIM card (3), the ninth spring (11i) and the seventh spring (11g) are electrically connected to the same gold finger of the Nano SIM card (3), and the tenth spring (11j) and the eighth spring (11h) are electrically connected to the same gold finger of the Nano SIM card (3); or, the fifth row of springs (11i, 11j) abuts against the card body (31) of the Nano SIM card (3).

12. The card connector (11) according to claim 9 or 10, characterized in that, When the card connector (11) is connected to the first NM card, the second row of spring contacts (11c, 11d) to the fifth row of spring contacts (11i, 11j) are electrically connected to the eight gold fingers of the first NM card in a one-to-one correspondence. The first row of spring contacts (11a, 11b) abuts against the first NM card. The size of the card body (51) of the first NM card is the same as the size of the card body (31) of the Nano SIM card (3).

13. The card connector (11) according to claim 12, characterized in that, The ten said spring pieces are arranged in a first column of spring pieces and a second column of spring pieces along a second direction, the second direction being perpendicular to the first direction; The first column of shrapnel includes a first shrapnel (11a), a third shrapnel (11c), a fifth shrapnel (11e), a seventh shrapnel (11g), and a ninth shrapnel (11i) arranged along the first direction. The second column of shrapnel includes a second shrapnel (11b), a fourth shrapnel (11d), a sixth shrapnel (11f), an eighth shrapnel (11h), and a tenth shrapnel (11j) arranged along the first direction. When the card connector (11) is connected to the first NM card, the first spring (11a) and the third spring (11c) are electrically connected to the same gold finger of the first NM card, and the second spring (11b) and the fourth spring (11d) are electrically connected to the same gold finger of the first NM card; or, the first row of springs (11a, 11b) abuts against the card body (31) of the Nano SIM card (3).

14. The card connector (11) according to claim 9, characterized in that, The insulating body (112) is provided with a connecting hole (1124), and the movable end (111c) is movably inserted into the connecting hole (1124). The end of the movable end (111c) includes a stop block (1111), and the stop block (1111) cooperates with the insulating body (112) to form an anti-detachment structure.

15. A card holder (1), characterized in that, It includes a base (12) and a card connector (11) according to any one of claims 9 to 14, wherein the card connector (11) is fixedly connected to the base (12).

16. A card holder assembly (10), characterized in that, Includes a card tray (2) and a card holder (1) as described in claim 15, wherein the card tray (2) is detachably inserted into the card holder (1).

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