Electrical connector

Abstract

The present application provides an electric connector capable of well ensuring stable electric conduction state of ground members to each other. A signal transmission path row composed of a plurality of signal transmission paths (52) arranged in a direction along a plate surface of a holding member (51) is held together with a first ground member (54) and a second ground member (55), a through portion (51B) penetrating in a plate thickness direction of the holding member (51) is provided at a position between adjacent signal transmission paths, the electric connector (3) has a short-circuit member (56) made of conductive resin provided in a state of being integrally formed with the first ground member and the second ground member, the short-circuit member has a first base portion (56A) located on the first ground member side and contacting the first ground member, a second base portion (56B) located on the second ground member side and contacting the second ground member, and a linking portion (56C) located in the through portion (51B) and linking the first base portion (56A) and the second base portion (56B).

Description

Technical Field

[0001] This invention relates to electrical connectors. Background Technology

[0002] In known electrical connectors with multiple signal terminals, grounding components are arranged along the signal terminals to prevent crosstalk between adjacent signal terminals. For example, Patent Document 1 discloses an electrical connector having multiple plates with signal terminals and grounding terminals arranged therein, where grounding plates are provided on both sides of each plate. Specifically, in the terminal rows of each plate, a grounding terminal is arranged between each terminal pair (paired signal terminals) consisting of two adjacent signal terminals, and the grounding plates arranged on both sides of the plate bend along the thickness direction at the positions corresponding to the grounding terminals to contact the grounding terminals. According to this structure, each pair of signal terminals, when viewed along the long side of the signal terminal, is surrounded and shielded by the grounding plates and grounding terminals (see Patent Document 1). Figure 5 (A)), as a result, prevents crosstalk between paired signal terminals, etc.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2017-224389

[0004] In Patent Document 1, to reliably prevent crosstalk using the ground plane and grounding terminal, it is preferable that the ground plane and grounding terminal have a gapless ground contact to ensure stable electrical conduction, thereby effectively ensuring the balance of electrical coupling between the paired signal terminals and the ground plane and grounding terminal. However, in structures like Patent Document 1 where the surface of the ground plane and the surface of the grounding terminal are in surface contact, the shape of these surfaces can easily affect the stability of electrical conduction. For example, if these surfaces are slightly deformed due to manufacturing errors, resulting in a gap between them, it may be difficult to ensure a stable electrical conduction state between the ground plane and the grounding terminal. There is room for improvement in this regard. Summary of the Invention

[0005] In view of this situation, the present invention aims to provide an electrical connector that can reliably ensure a stable electrical conduction state between grounding components.

[0006] The electrical connector of the present invention comprises: a plurality of metal signal transmission paths; a plate-shaped retaining member of an electrically insulating body that retains the plurality of signal transmission paths; and a first metal grounding member disposed on one side of the retaining member in the thickness direction of the retaining member and a second metal grounding member disposed on the other side.

[0007] In this electrical connector, as described in the present invention, the retaining member holds the signal transmission path array, which is composed of the plurality of signal transmission paths arranged in the direction along the plate surface of the retaining member, together with the first grounding member and the second grounding member. A through portion extending along the plate thickness direction is provided between adjacent signal transmission paths. The electrical connector has a short-circuit member made of conductive resin, integrally formed with the first grounding member and the second grounding member. The short-circuit member has: a first base located on the side of the first grounding member and in contact with the first grounding member; a second base located on the side of the second grounding member and in contact with the second grounding member; and a connecting portion located within the through portion, connecting the first base and the second base.

[0008] In this invention, the first grounding component and the second grounding component are short-circuited via a short-circuit component, thereby achieving electrical conductivity. This short-circuit component is formed integrally with the first and second grounding components (embedded molding). Therefore, during connector manufacturing, by simply injecting molten conductive resin material into a mold for integral molding and allowing it to solidify, a structure can be easily obtained where the first base, which is in close contact with the first grounding component, and the second base, which is in close contact with the second grounding component, are formed as a single component via a connecting portion. The first base, the second base, and the connecting portion of the short-circuit component, thus formed as a single component, are continuously integrated. Therefore, a stable electrical conductivity state between the first and second grounding components short-circuited via the short-circuit component can be ensured.

[0009] In this invention, the short-circuit component may have the first base, the second base, and the connecting portion at multiple positions in the arrangement direction of the signal transmission path, and may also have a connecting portion that extends along the first grounding component and the second grounding component in the arrangement direction and connects the first base and the second base at the multiple positions to each other.

[0010] By connecting multiple first bases and second bases to each other via connecting portions on both sides of the retaining component, these first bases and second bases become one unit via the connecting portions, thus making the electrical conduction state of the first grounding component and the second grounding component via the short-circuit component more stable.

[0011] In this invention, the connecting portion may also be in surface contact with both the first grounding component and the second grounding component. By making the connecting portion in surface contact with the respective plate surfaces of the first and second grounding components, the contact area between the connecting portion and the first and second grounding components is increased, thus making the electrical conduction state between the first and second grounding components via the short-circuit component more stable.

[0012] In this invention, the short-circuit component made of conductive resin is integrally formed with the first grounding component and the second grounding component, making it easy to obtain a structure in which the first base, which is in close contact with the first grounding component, and the second base, which is in close contact with the second grounding component, become a single component via a connecting portion. As a result, a stable electrical conduction state can be ensured between the first grounding component and the second grounding component when short-circuited by the short-circuit component. Attached Figure Description

[0013] Figure 1 This is a perspective view showing the circuit board electrical connector and relay connector of the embodiment of the present invention together, representing the state before mating.

[0014] Figure 2 (A) is represented by a monomer. Figure 1 A three-dimensional view of the relay circuit board of the relay connector. Figure 2 (B) only indicates Figure 2 A front view of the paired conductive patterns of the relay circuit substrate of ((A)).

[0015] Figure 3 (A) is to Figure 1 A perspective view showing a portion of the terminal holder and fixing component in an electrical connector for a circuit board. Figure 3 (B) is represented by a monomer. Figure 3 A perspective view of the terminal holder of (A).

[0016] Figure 4 (A) is an abbreviation Figure 3 A perspective view of the terminal holding body representing the short-circuit component (B). Figure 4 (B) only indicates Figure 3 A perspective view of the short-circuit component of the terminal holder of (B).

[0017] Figure 5 Will Figure 4 A perspective view showing the individual components of the terminal holder of (A) separated.

[0018] Figure 6 (A) is an enlarged representation Figure 3 A sectional view of a portion of the VIA-VIA section of the terminal retainer of (B). Figure 6 (B) is Figure 3 (B) VIB-VIB sectional view of the terminal holder.

[0019] Explanation of reference numerals in the attached figures

[0020] 2… Substrate connector (electrical connector); 3… Substrate connector (electrical connector); 51… Retaining member; 51B… Retaining hole (through part); 52… Paired signal terminals (signal transmission path); 54… First grounding member; 55… Second grounding member; 56… Short-circuit member; 56A… First base; 56B… Second base; 56C… Connecting part; 56D… Connecting part. Detailed Implementation

[0021] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0022] Figure 1 This is a perspective view showing the circuit board connectors 2 and 3 (hereinafter referred to as "board connector 2" and "board connector 3") and relay connector 1 (hereinafter referred to as "relay connector 1") according to an embodiment of the present invention, representing the state before mating. In this embodiment, relay connector 1 and board connectors 2 and 3 constitute an electrical connector assembly for transmitting high-speed differential signals. Board connectors 2 and 3 are respectively disposed on different circuit boards (see reference 1). Figure 3 The circuit board on (A) uses an electrical connector, which engages with the relay connector 1 at a right angle to the vertical direction, or in other words, the height direction (Z-axis direction) of the connector. Specifically, the board connector 2 engages with the relay connector 1 from above (Z1 side), and the board connector 3 engages with the relay connector 1 from below (Z2 side), thereby electrically connecting the board connectors 2 and 3 to each other via the relay connector 1. In this embodiment, the board connectors 2 and 3 are configured as electrical connectors with identical shapes.

[0023] like Figure 1 As shown, the relay connector 1 has: a plurality of relay circuit boards 20 (see also...) Figure 2 (A)), a housing 10 made of resin or other electrically insulating material supporting multiple relay circuit boards 20 arranged at predetermined intervals in their thickness direction (X-axis direction), and two connecting parts 30 made of metal plates, which will be described later.

[0024] The housing 10 has a generally cuboid shape with the arrangement direction of the relay circuit board 20 (X-axis direction) as its long side direction (hereinafter referred to as the "connector length direction"). The housing 10 has an upper housing 11 that supports the upper part of the relay circuit board 20 and a lower housing 12 that supports the lower part of the relay circuit board 20. The upper housing 11 and the lower housing 12 are connected via a connecting member 30.

[0025] The upper housing 11 has: a peripheral wall 11A, which is quadrilateral frame-shaped when viewed from above, surrounding a plurality of relay circuit boards 20; and a plurality of intermediate walls (not shown) for arranging the plurality of relay circuit boards 20 at predetermined intervals in the connector length direction (X-axis direction). The peripheral wall 11A has: two side walls 11B extending in the connector length direction (X-axis direction); and two end walls 11C extending in the connector width direction (Y-axis direction) perpendicular to the connector length direction, connecting the ends of the two side walls 11B to each other. The intermediate walls, within the space surrounded by the peripheral wall 11A, are plate-shaped with plate surfaces perpendicular to the connector length direction, connecting the inner wall surfaces of the two side walls 11B to each other, and are arranged at predetermined intervals in the connector length direction.

[0026] A slit-like space is formed between adjacent intermediate walls or between an intermediate wall and an end wall 11C, extending vertically, to form a substrate storage space (not shown) for accommodating the upper portion of the relay circuit substrate 20. Additionally, on the inner surface of the side wall 11B, a plurality of upper locking steps (not shown) are formed at predetermined intervals along the connector length direction (X-axis direction). These upper locking steps (not shown) are steps capable of engaging with the upper locking piece (not shown) of the connecting member 30, which will be described later.

[0027] The peripheral wall 11A extends upward relative to the upper end of the intermediate wall. The space surrounded by this upwardly extending portion, that is, the space that opens upward and communicates with the aforementioned substrate storage space, is formed as an upper receiving portion 11D for receiving the substrate connector 2 from above. When the relay circuit substrate 20 is housed within the substrate storage space, as... Figure 1 As shown, the upper part of the relay circuit board 20 protrudes from the upper opening of the board storage space and is located inside the upper receiving part 11D.

[0028] The lower housing 12 has the same shape as the upper housing 11 described above, and is arranged in a vertically symmetrical manner with the upper housing 11. The lower part of the relay circuit board 20 is housed in a slit-shaped substrate storage space (not shown). For the parts of the lower housing 12 that correspond to the parts of the upper housing 11, reference numerals with "1" added to the reference numerals in the upper housing 11 are used. In addition, regarding the names of the parts of the lower housing 12, the description of the lower housing 12 is omitted by replacing "upper" in the names of the parts of the upper housing 11 with "lower".

[0029] The connecting member 30 is manufactured by punching and partially bending a metal plate component. The connecting member 30 extends within the arrangement range of the relay circuit board 20 with the connector length direction (X-axis direction) as its long side, and is positioned so that its thickness direction coincides with the connector width direction (Y-axis direction). One connecting member 30 is provided on each side of the relay circuit board 20 in the connector width direction. At the upper end of the connecting member 30, at a position corresponding to the upper locking step (not shown) of the upper housing 11 in the connector length direction, a portion of the connecting member 30 is cut to form an upper locking piece (not shown) that locks with the upper locking step in the vertical direction (Z-axis direction). Similarly, a lower locking piece (not shown) that locks with the lower locking step (not shown) of the lower housing 12 in the vertical direction (Z-axis direction) is provided at the lower end of the connecting member 30.

[0030] Figure 2 (A) is a perspective view of the relay circuit board 20 represented by a single unit. Figure 2 (B) only indicates Figure 2 A front view of the paired conductive patterns on the relay circuit substrate of (A). Figure 2 As shown in (A), the relay circuit board 20 has: a substrate 21 made of an electrically insulating material such as resin; conductive patterns (paired conductive patterns 22, 24 described later) formed on the substrate 21 to form a pair of transmission paths as signal transmission paths; a plurality of grounding vias (not shown) located between the paired conductive patterns 22, 24; and grounding layers 27, 28 (first grounding layer 27 and second grounding layer 28 described later) formed to cover two surfaces of the substrate 21 (surfaces perpendicular to the thickness direction (X-axis direction)).

[0031] like Figure 2 As shown in (A), two supported protrusions 21A are formed on the substrate 21 at a central position on both end edges extending in the vertical direction, and are supported on the housing 10 by these supported protrusions 21A. Additionally, multiple conductive patterns (see reference) are arranged in a strip-like pattern extending in the vertical direction along the connector width direction (Y-axis direction) on the substrate 21. Figure 2 (B)). Multiple conductive patterns have paired conductive patterns 22, 24 that serve as paired transmission paths. The paired conductive patterns 22, 24 have two types of pairs: straight pairs 22 and intersecting pairs 24. In this embodiment, as... Figure 2 As shown in (B), the straight pair 22 and the cross pair 24 are alternately arranged in the connector width direction (Y-axis direction).

[0032] The straight line pair 22 has a pair of straight line patterns 23 that extend at intervals from one end to the other in the vertical direction over the entire range. The pair of straight line patterns 23 are in the thickness direction of the substrate 21 (in... Figure 2 When viewed along the X-axis (perpendicular to the paper surface) in (B), the linear pattern 23 forms a shape that is symmetrical both horizontally and vertically. The linear pattern 23 has: a signal connection portion 23A for connection with the substrate connectors 2 and 3; a plurality of thin strip portions 23B extending in the vertical direction; and a plurality of signal through holes (not shown) extending in the thickness direction (X-axis direction) within the thickness of the substrate 21.

[0033] like Figure 2 As shown in (B), the signal connection part 23A is located at both ends of the linear pattern 23 in the vertical direction, as... Figure 2 As shown in (A), the signal connection portion 23A protrudes from the X2 side of the substrate 21. In this embodiment, the thin strip portion 23B is formed as two layers within the thickness of the substrate 21. Specifically, as... Figure 2 As shown in (B), the thin strip 23B is divided into three parts in the vertical direction, having a long thin strip 23B-1 located in the upper and lower regions respectively, and a short thin strip 23B-2 located in the middle region.

[0034] In this embodiment, two elongated strips 23B-1 are formed in the thickness direction of the substrate 21 (in Figure 2 (B) On the X-axis direction perpendicular to the paper, located on the X2 side (in Figure 2 In layer (B) near the anterior side, the short, thin strip 23B-2 is formed on the X1 side (in Figure 2 (B) is the inner layer.

[0035] Signal through-holes (not shown) extend cylindrically along the thickness direction (X-axis direction) of the substrate 21 at the two ends of each of the three portions of the thin strip 23B in the vertical direction. The signal through-holes connect the three portions of the thin strip 23B to each other and electrically connect the upper and lower ends of the thin strip 23B to the signal connection portion 23A. As a result, a straight line pattern 23 is formed by the signal connection portion 23A, the thin strip 23B, and the signal through-holes.

[0036] In this embodiment, as described above, by including the signal vias extending across two layers in the straight pattern 23, the length of the signal transmission path in the straight pattern 23 is adjusted to be approximately the same as the length of the signal transmission path in the cross pattern 25 of the cross pair 24, which will be described later.

[0037] Cross pair 24 has a pair of cross patterns 25. For example... Figure 2 As shown in (B), a pair of intersecting patterns 25 are positioned at the midpoint in the vertical direction, intersecting without touching each other when viewed along the thickness direction (X-axis direction) of the substrate 21. The pair of intersecting patterns 25 are positioned at the midpoint in the vertical direction, intersecting without touching each other when viewed along the thickness direction (X-axis direction) of the substrate 21. Figure 2 When viewed from the X-axis direction (perpendicular to the paper surface) in (B), it exhibits a shape that is asymmetrical both horizontally and vertically. The cross pattern 25 also has, like the straight pattern 23, a signal connection portion 25A for connection with the substrate connectors 2 and 3; a plurality of thin strip portions 25B extending in the vertical direction; and a plurality of signal through holes (not shown) extending in the thickness direction (X-axis direction) within the thickness of the substrate 21.

[0038] In the cross pattern 25, except for the thin strip 25B, the structure is the same as that of the previously described straight line pattern 23. Therefore, for this common part, the reference numerals corresponding to the part in the straight line pattern 23 are marked with "2" and the description is omitted. The thin strip 25B of the cross pattern 25 has two long thin strips 25B-1 and one short thin strip 25B-2 connected by signal through holes.

[0039] like Figure 2 As shown in (B), the elongated strip 25B-1 in the pair of intersecting patterns 25 constituting the intersecting pair 24, that is, one of the four elongated strips 25B-1 located on the Y1 side and the upper (Z1) side, is formed to be slightly longer than the other three elongated strips 25B-1. Specifically, the aforementioned elongated strip 25B-1 forms an inclined portion 25B-1A extending at its lower end in a manner inclined towards the Y2 side, and is longer than the other elongated strips 25B-1 by an amount corresponding to this inclined portion 25B-1A.

[0040] All the elongated thin strips 25B-1 of a pair of intersecting patterns 25 are formed in the thickness direction of the substrate 21 (in Figure 2 (B) On the X-axis direction perpendicular to the paper, located on the X2 side (in Figure 2 (B) is the layer near the front side. On the other hand, the short, thin strip 25B-2 is formed on the X1 side (in Figure 2 (B) is the inner layer.

[0041] In this embodiment, such as Figure 2 As shown in (B), a short, thin strip 25B-2 connected to the previously described inclined portion 25B-1A extends vertically without inclination and is formed to be shorter than the other short, thin strip 25B-2 described later. On the other hand, the other short, thin strip 25B-2, when viewed along the thickness direction (X-axis direction) of the substrate 21, extends inclined towards the Y1 side as it faces downwards and intersects with the inclined portion 25B-1A. The aforementioned other short, thin strip 25B-2 is formed to be slightly longer than the inclined portion 25B-1A.

[0042] In a pair of intersecting patterns 25, the inclined portion 25B-1A of the long thin strip 25B-1 intersects with the aforementioned short thin strip 25B-2, thereby preventing them from contacting each other. Furthermore, by [doing something] on the X1 side (in... Figure 2 The layer (B) on the inside forms a short strip 25B-2, thereby increasing the number of signal vias. As a result, the signal transmission paths of the two cross patterns 25 constituting the cross pair 24 are approximately the same length.

[0043] Between the straight pair 22 and the cross pair 24 in the connector width direction (Y-axis direction), a plurality of grounding through holes (not shown) are arranged in the vertical direction. The grounding through holes are cylindrical in shape, extending along the thickness direction (X-axis direction) within the thickness of the substrate 21, and connect the first grounding layer 27 and the second grounding layer 28, which will be described later.

[0044] Grounding layers 27 and 28 are metallic layers, with the first grounding layer 27 covering the X2 side of the substrate 21 and the second grounding layer 28 covering the X1 side of the substrate 21. The grounding layers 27 and 28 are formed over a length from the upper end to the lower end of the substrate 21, but in the first grounding layer 27, as... Figure 2 As shown in (A), at the upper and lower ends, portions corresponding to the signal connection portions 23A and 25A of the paired conductive patterns 22 and 24 in the connector width direction are cut off, resulting in the exposure of the signal connection portions 23A and 25A. The portions of the first ground layer 27 that are not cut off at the upper and lower ends form first ground layer connection portions 27A for connection to the first grounding member 54 (described later) of the substrate connectors 2 and 3. On the other hand, no portions of the upper and lower ends of the second ground layer 28 are cut off, forming second ground layer connection portions 28A for connection to the second grounding member 55 (described later) of the substrate connectors 2 and 3.

[0045] Next, the structure of substrate connectors 2 and 3 will be described. Figure 1 As shown, substrate connectors 2 and 3 have identical structures. Therefore, the following description focuses on the structure of substrate connector 3. For the description of substrate connector 2, the same reference numerals as those for substrate connector 3 will be omitted. Figure 1 As shown, the baseboard connector 3 has: a housing 40 formed in a cubic shape suitable for the lower receiving portion (not shown) of the lower housing 12 of the relay connector 1; a plurality of terminal holders 50 arranged and held in the housing 40; and two metal plate fixing members 60 described later.

[0046] The housing 40 is made of an electrically insulating material such as resin, for example... Figure 1As shown, the housing 40 has a generally cuboid shape with the arrangement direction (X-axis direction) of the terminal holders 50 as the long side direction (connector length direction). The housing 40 has an upper housing 41 and a lower housing 42 formed in a vertically divided manner. The upper housing 41 and the lower housing 42 are connected via a fixing member 60. The housing 40 houses and holds a plurality of terminal holders 50 arranged along the connector length direction.

[0047] The upper housing 41 has: a peripheral wall 41A that is quadrilateral in shape when viewed vertically; and a plurality of intermediate walls 41D extending along the connector width direction (Y-axis direction) in the space enclosed by the peripheral wall 41A. The peripheral wall 41A has: two side walls 41B extending along the connector length direction (X-axis direction); and two end walls 41C extending along the shorter side direction perpendicular to the connector length direction, i.e., the connector width direction, connecting the ends of the two side walls 41B to each other. The plurality of intermediate walls 41D extend along the connector width direction and connect the inner wall surfaces of the two side walls 41B to each other. On the side walls 41B, upper connecting grooves (not shown) extending vertically through a plurality of positions at predetermined intervals along the connector length direction are formed.

[0048] The lower housing 42 holds a plurality of terminal holders 50 that are arranged at equal intervals along the connector length direction (X-axis direction). On the two side walls 42A of the lower housing 42, at the same position as the upper connecting groove of the upper housing 41 in the connector length direction, a groove-shaped lower connecting groove (not shown) is formed that extends in the vertical direction and communicates with the upper connecting groove.

[0049] Figure 3 (A) is to Figure 1 A perspective view showing a portion of the terminal holder 50 and the fixing member 60 in the substrate connector 3, representing their configuration on the circuit board P. Figure 3 (B) is represented by a monomer. Figure 3 A perspective view of the terminal holder 50 of (A). Figure 3 As shown in (A), the fixing member 60 is made by punching and bending a metal plate member that extends along the length direction (X-axis direction) of the connector. The fixing member 60 extends over the entire area of ​​the terminal retainer 50 in the length direction of the connector and is disposed at both ends of the substrate connector 3 in the width direction (Y-axis direction).

[0050] The fixing member 60 includes: a side plate portion 61 having a plate surface perpendicular to the connector width direction; a long pressing portion 62 and a short pressing portion 63 extending upward from the upper edge of the side plate portion 61 at multiple locations in the connector length direction; and a fixing portion 64 extending outward in the connector width direction from the lower edge of the side plate portion 61 at multiple locations in the connector length direction, bending in the plate thickness direction.

[0051] A long press-in portion 62 is provided at a position corresponding to the terminal retainer 50 in the connector length direction, and a short press-in portion 63 is provided at a position corresponding to the terminal retainer 50 in the connector length direction. That is, the long press-in portion 62 and the short press-in portion 63 are alternately provided in the connector length direction. The short press-in portion 63 is formed to be shorter than the long press-in portion 62 in the vertical direction, and its upper end is located at a position lower than the upper end of the long press-in portion 62. The fixing member 60 is held in the housing 40 by pressing the long press-in portion 62 and the short press-in portion 63 into both the upper and lower connecting grooves of the housing 40 from below. In addition, the fixing member 60 is fixed to the circuit board P by welding the fixing portion 64 to the corresponding portion of the mounting surface of the circuit board P.

[0052] like Figure 3 As shown in (B), the terminal retainer 50 includes: a retaining member 51 made of an electrically insulating material such as resin; a pair of signal terminals 52 arranged in the connector width direction (Y-axis direction) to form a pair of transmission paths made of multiple metal plates held by the retaining member 51 as signal transmission paths; a first grounding member 54 and a second grounding member 55 (hereinafter, they are collectively referred to as "grounding members 54 and 55" unless otherwise distinguished) made of metal plates mounted on the plate surface (the surface extending in the YZ direction) of the retaining member 51; and a short-circuit member 56 made of conductive resin integrally mounted with the grounding members 54 and 55.

[0053] Figure 4 (A) is an abbreviation Figure 3 A perspective view of the terminal holding body 50, representing the short-circuit component 56 of (B). Figure 4 (B) only indicates Figure 3 A perspective view of the short-circuit component 56 of the terminal holder 50 of (B). Figure 5 It is Figure 4 A perspective view showing the individual components of the terminal holder 50 of (A) separated. Additionally, Figure 6 (A) is an enlarged representation Figure 3 (B) is a cross-sectional view of a portion of the VIA-VIA section of the terminal holder 50 (the portion on the Y1 side in the connector width direction (Y-axis direction)). Figure 6 (B) is Figure 3 (B) shows a VIB-VIB sectional view of the terminal holder 50.

[0054] like Figure 5 As shown, the retaining member 51 is plate-shaped, extending within the terminal arrangement range in the connector width direction (Y-axis direction), as... Figure 4 As shown in (A), a column (signal transmission path column) consisting of multiple pairs of signal terminals 52 arranged along the plate surface of the retaining member 51 in the connector width direction (Y-axis direction) is held together with the grounding members 54 and 55. Figure 5 As shown, the retaining member 51 has a retaining protrusion 51A for retaining the grounding members 54 and 55 and a retaining hole 51B as a through portion.

[0055] The retaining protrusion 51A is positioned in the connector width direction at the same location as the retaining hole 54A-1 of the first grounding member 54 (described later), and is formed protruding from the plate surface on the X2 side of the retaining member 51 to retain the first grounding member 54. Figure 5 As shown, the retaining protrusion 51A is formed into a generally quadrangular prism shape, and when viewed along the thickness direction (X-axis direction) of the retaining member 51, it has a quadrilateral shape with the connector width direction (Y-axis direction) as the long side direction.

[0056] The retaining hole 51B is formed by passing through the retaining member 51 in the thickness direction (X-axis direction) at a position different from that of the paired signal terminals 52 in the connector width direction, that is, the position between adjacent paired signal terminals 52 and the position further outward than the paired signal terminals 52 located at both ends in the connector width direction. When viewed along the thickness direction (X-axis direction) of the retaining member 51, the retaining hole 51B is formed into a quadrilateral shape with the vertical direction (Z-axis direction) as the long side. In addition, the through portion does not necessarily have to be a hole portion; for example, it can also be formed as a cut portion that passes through the retaining member 51 in the thickness direction of the retaining member 51 and has a portion of its periphery open.

[0057] Multiple pairs of signal terminals 52 correspond to pairs of conductive patterns 22 and 24 disposed on the relay circuit board 20 of the relay connector 1, and are arranged at predetermined intervals with the connector width direction (Y-axis direction) as the arrangement direction. Figure 5 As shown, each pair of signal terminals 52 has a pair of straight terminals 53 that extend at intervals from one end to the other in the vertical direction. The straight terminal 53 has: a straight holding portion 53A that is integrally formed (embedded) and held in the holding member 51; a signal elastic arm portion 53B that extends upward from the holding portion 53A; and a signal connection portion 53C that extends downward from the holding portion 53A.

[0058] like Figure 5As shown, the signal elastic arm 53B is formed with a terminal width dimension (width dimension in the Y-axis direction) that is wider than the held portion 53A, allowing it to elastically displace in its plate thickness direction (X-axis direction). In this embodiment, the signal elastic arm 53B has a slit 53B-2 extending in the vertical direction formed at the middle position of its terminal width direction, and has two thin arm portions arranged to clamp the slit 53B-2, thereby facilitating elastic displacement. At the upper end of the signal elastic arm 53B, a signal contact portion 53B-1 is formed by bending protruding towards the X1 side for contacting the signal connection portions 23A of the paired conductive patterns 22, 24 provided on the repeater connector 1. Figure 5 As shown, the signal connection portion 53C is formed in a straight line with a terminal width slightly smaller than that of the held portion 53A. A solder ball B (see reference) is mounted on the signal connection portion 53C. Figure 3 (A), (B) and Figure 4 (A)). The signal connection part 53C is soldered to the circuit board P (refer to) via the solder ball B. Figure 3 The signal circuit section (not shown) of (A).

[0059] The first grounding member 54 is mounted on the plate surface of the retaining member 51 on the X2 side, and has: a first grounding plate portion 54A extending along the plate surface; a first grounding elastic arm portion 54B extending upward from the first grounding plate portion 54A at multiple locations in the connector width direction (Y-axis direction); and a first grounding connection portion 54C extending downward from the first grounding plate portion 54A at multiple locations in the connector width direction.

[0060] like Figure 5 As shown, the retaining hole portion 54A-1 and the retaining protrusion portion 54A-2 are alternately formed on the first ground plane portion 54A at a predetermined interval in the connector width direction. The retaining hole portion 54A-1 is a hole portion with a generally quadrilateral shape that extends through the first ground plane portion 54A with the connector width direction as the long side direction, and is formed at a position corresponding to the first grounding elastic arm portion 54B adjacent in the connector width direction.

[0061] The retained protrusions 54A-2 protrude towards the X1 side on both sides of the retained hole 54A-1, at positions corresponding to the first grounding elastic arm 54B in the connector width direction; in other words, at positions different from the paired signal terminals 52. That is, as... Figure 5As shown, the retained protrusion 54A-2 is disposed corresponding to the retaining hole 51B of the retaining member 51. When viewed along the thickness direction (X-axis direction) of the retaining member 51, the retained protrusion 54A-2 has a shape suitable for the retaining hole 51B, that is, a quadrilateral shape with the vertical direction as the long side. The retained hole 54A-1 and the retained protrusion 54A-2 are retained by integral forming (embedding forming) with the retaining member 51 while engaged with the retaining protrusion 51A and the retaining hole 51B of the retaining member 51, respectively.

[0062] In addition, such as Figure 5 As shown, on the first grounding plate portion 54A, at a position corresponding to the held protrusion 54A-2, there is a first grounding through hole portion 54A-3 that penetrates the first grounding plate portion 54A in the plate thickness direction (X-axis direction). The first grounding through hole portion 54A-3 is a quadrilateral hole with the vertical direction as the long side when viewed in the plate thickness direction of the first grounding plate portion 54A. Figure 5 As shown, the first grounding through hole 54A-3 is a hole that passes through the portion of the retained protrusion 54A-2 (the portion on the X1 side) and is smaller than the other portions (the portion on the X2 side).

[0063] like Figure 5 As shown, the first grounding elastic arm 54B extends upward from the upper edge of the first grounding plate portion 54A, forming the same length as the signal elastic arm 53B of the straight terminal 53. Two adjacent first grounding elastic arms 54B are located on either side of a pair of signal elastic arms 53B in the connector width direction. The first grounding elastic arms 54B are capable of elastic displacement in their thickness direction (X-axis direction). At the upper end of the first grounding elastic arm 54B, two first grounding contacts 54B-1 are formed by bending protruding towards the X1 side for contacting the first ground layer 27 of the relay circuit board 20 of the relay connector 1. Figure 3 (B) Figure 4 (A) and Figure 6 As shown in (B), the first grounding contact 54B-1 and the signal contact 53B-1 of a pair of linear terminals 53 are arranged in the same row in the connector width direction.

[0064] like Figure 5 As shown, the first grounding connection portion 54C extends downward from the lower edge of the first grounding plate portion 54A at the same position as the first grounding elastic arm portion 54B in the connector width direction. Furthermore, the first grounding connection portion 54C is located on both sides of the two signal connection portions 53C of the paired signal terminals 52 in the connector width direction. Solder balls B (see reference) are mounted on the first grounding connection portion 54C. Figure 3 (A), (B) and Figure 4 (A) and Figure 6(B)). The first grounding connection 54C is soldered to the circuit board P (refer to) via the solder ball B. Figure 3 The grounding circuit section (not shown) of (A).

[0065] The second grounding member 55 is in contact with the plate surface on the X1 side of the retaining member 51, and has: a second grounding plate portion 55A extending along the plate surface; two second grounding elastic arms 55B extending upward from the second grounding plate portion 55A at multiple locations in the connector width direction (Y-axis direction); and a second grounding connection portion 55C extending downward from the second grounding plate portion 55A at multiple locations in the connector width direction.

[0066] like Figure 5 As shown, in the second ground plane portion 55A, retaining protrusions 55A-1 are formed at predetermined intervals in the connector width direction. The retaining protrusions 55A-1 have the same shape as the retaining protrusions 54A-2 of the first grounding member 54, and protrude towards the X2 side at a position different from the second grounding elastic arm portion 55B in the connector width direction, in other words, at a position different from the paired signal terminals 52. That is, as... Figure 5 As shown, the retained protrusion 55A-1 is disposed corresponding to the retaining hole 51B of the retaining member 51. The retained protrusion 55A-1 is retained by integral forming (embedding forming) with the short-circuit member 56 when it is engaged with the retaining hole 51B of the retaining member 51.

[0067] In addition, similar to the first grounding plate portion 54A, such as Figure 5 As shown, the second grounding plate portion 55A has a second grounding through hole portion 55A-2 at a position corresponding to the held protrusion portion 55A-1, which penetrates the second grounding plate portion 55A in the plate thickness direction (X-axis direction). The second grounding through hole portion 55A-2 has the same shape as the first grounding through hole portion 54A-3 of the first grounding plate portion 54A.

[0068] like Figure 5As shown, the second grounding elastic arm 55B extends upward from the upper edge of the second grounding plate portion 55A. The upper ends of two adjacent second grounding elastic arms 55B are arranged close to each other compared to their lower ends, and are connected at a midpoint in the vertical direction by a transverse portion 55D extending along the connector width direction. The second grounding elastic arms 55B are elastically displaceable in their thickness direction (X-axis direction). At the upper end of the second grounding elastic arm 55B, two second grounding contacts 55B-1 are formed by bending protruding towards the X2 side for contacting the second grounding layer 28 of the relay circuit board 20 of the relay connector 1. These two second grounding contacts 55B-1 are located at the same position in the connector width direction and vertical direction as the signal contacts 53B-1 of a pair of signal elastic arms 53B, as shown. Figure 3 (B) and Figure 4 As shown in (A), it is opposite to the two signal contact parts 53B-1.

[0069] like Figure 5 As shown, the second grounding connection portion 55C extends downward from the lower edge of the second grounding plate portion 55A at a position corresponding to both sides of the pair of second grounding elastic arms 55B in the connector width direction. The second grounding connection portion 55C is located on both sides of the two signal connection portions 53C of the paired signal terminals 52 in the connector width direction, and is located at the same position as the first grounding connection portion 54C of the first grounding member 54. Solder balls B (see reference) are mounted on the second grounding connection portion 55C. Figure 6 (B)). The second grounding connection 55C is soldered to the circuit board P (refer to) via the solder ball B. Figure 3 The grounding circuit section (not shown) of (A).

[0070] like Figure 3 As shown in (B), the short-circuit component 56 is provided in a state where it is integrally formed (embedded) with the first grounding plate portion 54A of the first grounding component 54 and the second grounding plate portion 55A of the second grounding component 55. Figure 4 As shown in (B), the short-circuit component 56 has: a first base 56A, a second base 56B and a connecting portion 56C disposed at multiple positions in the connector width direction; and a connecting portion 56D that connects the multiple first bases 56A extending in the connector width direction to each other and the multiple second bases 56B to each other.

[0071] like Figure 3 (B) and Figure 6 (A) Figure 6 As shown in (B), the first base portion 56A is formed in a shape suitable for the first grounding through hole portion 54A-3 of the first grounding plate portion 54A, located inside the first grounding through hole portion 54A-3, and in contact with the inner wall surface of the first grounding through hole portion 54A-3. Specifically, as Figure 6 (A) Figure 6 As shown in (B), the first base 56A has a first small base 56A-1 located on the X1 side and a first large base 56A-2 located on the X2 side. The first small base 56A-1 is formed to be slightly smaller than the first large base 56A-2 in the connector width direction (Y-axis direction) and vertical direction (Z-axis direction), resulting in a stepped boundary between the first small base 56A-1 and the first large base 56A-2.

[0072] like Figure 6 (A) Figure 6 As shown in (B), the second base 56B has the same shape as the first base 56A, and is shaped to fit the second grounding through hole 55A-2 of the second grounding plate portion 55A. The second base 56B is located inside the second grounding through hole 55A-2 and contacts the inner wall surface of the second grounding through hole 55A-2. Specifically, as Figure 6 (A) Figure 6 As shown in (B), the second base 56B has a second small base 56B-1 located on the X2 side and a second large base 56B-2 located on the X1 side. The second small base 56B-1 is formed to be slightly smaller than the second large base 56B-2 in both the connector width direction (Y-axis direction) and the vertical direction (Z-axis direction), resulting in a stepped boundary between the second small base 56B-1 and the second large base 56B-2.

[0073] The connecting part 56C is located inside the retaining hole 51B of the retaining member 51. In detail, as shown in the figure... Figure 6 As shown in (A) and (B), the first base 56A and the second base 56B connect the first small base 56A-1 of the first base 56A and the second small base 56B-1 of the second base 56B. The connecting portion 56C is in close contact with the inner surface of the retaining hole portion 51B. In this embodiment, as... Figure 6 (A) Figure 6 As shown in (B), the connecting portion 56C is formed to be slightly larger than the first small base portion 56A-2 and the second small base portion 56B-2 in the connector width direction and vertical direction, and is engaged with the retained protrusions 54A-2 and 55A-1.

[0074] like Figure 4 As shown in (B), two connecting portions 56D are provided in the short-circuit component 56, and these connecting portions 56D extend parallel to each other along the connector width direction (Y-axis direction). Figure 3 (B) and Figure 4 (A) Figure 4 As shown in (B), the connecting portion 56D is plate-shaped with the connector width direction as its long side, extending along the respective plate surfaces of the first ground plate portion 54A and the second ground plate portion 55A. Figure 3 As shown in (B), each connecting portion 56D is formed to be slightly smaller than the plate surface of the retaining member 51 in both the width and vertical directions of the connector, that is, one ring smaller than the plate surface of the retaining member 51.

[0075] The connecting portion 56D on the X1 side connects all the second base portions 56B to each other, specifically the second large base portions 56B-2 of the second base portions 56B to each other. This connecting portion 56D contacts and adheres tightly to the surface of the second grounding plate portion 55A on the X1 side. The connecting portion 56D on the X2 side also has the same shape as the connecting portion 56D on the X1 side, connecting all the first base portions 56A to each other, specifically the first large base portions 56A-2 of the first base portions 56A to each other. This connecting portion 56D contacts and adheres tightly to the surface of the first grounding plate portion 54A on the X2 side. Furthermore, in this embodiment, as... Figure 4 As shown in (B), a plurality of holes 56D-1 are formed in the connecting portion 56D located on the X2 side. The holes 56D-1 are formed in the retaining hole 54A-1 of the first grounding member 54 (see reference). Figure 5 The corresponding position is connected to the retained hole 54A-1.

[0076] The substrate connector 3 is manufactured according to the following procedure. First, with a plurality of paired signal terminals 52 and a first grounding member 54 arranged in a mold (not shown) for one-time molding, molten electrical insulating material is injected into the mold and solidified (one-time embedding molding). By solidifying the electrical insulating material, a retaining member 51 is formed, thereby completing a one-time retainer body that uses the retaining member 51 to hold the paired signal terminals 52 and the first grounding member 54.

[0077] Next, with the primary retainer and second grounding member 55 positioned in a mold (not shown) for secondary molding, molten conductive resin material is injected into the mold and allowed to solidify (secondary embedding molding). At this time, by filling the grounding through-holes 54A-3 and 55A-2 of the grounding members 54 and 55 and the retaining hole 51B of the retaining member 51 with conductive resin material and allowing it to solidify, base portions 56A and 56B and connecting portion 56C are formed. By solidifying the conductive resin material in the mold in this way, a short-circuit member 56 is formed, and the primary retainer and second grounding member 55 are held by the short-circuit member 56, thereby completing the terminal retainer 50.

[0078] Next, the terminal retainers 50 are pressed from above into the grooves between adjacent intermediate walls 41D in the lower housing 42, so that the multiple terminal retainers 50 are held in the lower housing 42 in a state of arrangement along the connector length direction (X-axis direction). Additionally, the long pressing portion 62 and the short pressing portion 63 of the two metal plate fixing members 60 are inserted from below into the lower connecting groove of the lower housing 42. At this time, the short pressing portion 63 is pressed in and held in the lower connecting groove. Furthermore, the upper housing 41 is mounted from above onto the lower housing 42, and simultaneously, the long pressing portion 62 of the fixing member 60 is pressed from below into the upper connecting groove of the upper housing 41. By mounting the upper housing 41 in this way, the substrate connector 3 is completed. The substrate connector 2 is also manufactured according to the same procedure as the substrate connector 3.

[0079] Next, the connector mating operation between relay connector 1 and substrate connectors 2 and 3 will be explained. First, substrate connectors 2 and 3 are soldered and mounted onto different circuit boards. Next, as... Figure 1 As shown, the relay connector 1 is positioned above the baseboard connector 3.

[0080] Next, move repeater connector 1 downwards (refer to...) Figure 1 (The arrows indicate that each relay circuit board 20 is inserted from above and connected to the terminal holding body 50 of the corresponding board connector 3.) When the engagement between the relay connector 1 and the board connector 3 is completed, the signal contact portion 53B-1 of the paired signal terminals 52 of the board connector 3 contacts the signal connection portions 23A and 25A of the paired conductive patterns 22 and 24 of the relay circuit board 20 with contact pressure to achieve electrical conduction. At the same time, the first ground contact portion 54B-1 of the first grounding member 54 of the board connector 3 contacts the first grounding layer connection portion 27A of the first grounding layer 27 of the relay circuit board 20 with contact pressure to achieve electrical conduction. In addition, the second ground contact portion 55B-1 of the second grounding member 55 of the board connector 3 contacts the second grounding layer connection portion 28A of the second grounding layer 28 of the relay circuit board 20 with contact pressure to achieve electrical conduction. At this time, the signal contact 53B-1 and ground contact 54B-1, 55B-1 of the substrate connector 3 are subjected to pressing pressure from the relay circuit substrate 20 and elastically displaced in the thickness direction (X-axis direction).

[0081] Next, the substrate connector 2 is rotated vertically relative to the substrate connector 3. Figure 1 The shown posture) is engaged with the repeater connector 1 from above (refer to...). Figure 1 (The arrow). The fitting connection method of substrate connector 2 is the same as that described for substrate connector 3.

[0082] Thus, by fitting and connecting the substrate connector 2 and substrate connector 3 with the relay connector 1, the substrate connector 2 and substrate connector 3 are electrically connected via the relay connector 1.

[0083] In this embodiment, such as Figure 6 (A) Figure 6 As shown in (B), the short-circuit component 56 is formed of conductive resin as described above, and has a structure in which a first base 56A located in the first grounding through hole 54A-3 and in contact with the first grounding plate 54A, and a second base 56B located in the second grounding through hole 55A-2 and in contact with the second grounding plate 55A, are connected by a connecting portion 56C located in the retaining hole 51B. That is, the first grounding component 54 and the second grounding component 55 are short-circuited via the short-circuit component 56, thereby achieving electrical conductivity.

[0084] In this embodiment, the short-circuit component 56 is formed by integral molding (embedding molding) with the first ground plane portion 54A and the second ground plane portion 55A. Specifically, in the secondary molding process during the manufacturing of the substrate connectors 2 and 3, it is formed by injecting and solidifying molten conductive resin material into a mold for secondary molding. At this time, the molten conductive resin material fills the first grounding through hole portion 54A-3, the second grounding through hole portion 55A-2, and the retaining hole portion 51B of the retaining member 51 without gaps. Thus, in this embodiment, by integral molding based on conductive resin, a structure can be easily obtained in which the first base portion 56A, which is in close contact with the first ground plane portion 54A, and the second base portion 56B, which is in close contact with the second ground plane portion 55A, are formed into a single component via the connecting portion 56C.

[0085] The first base 56A, the second base 56B, and the connecting portion 56C of the short-circuit component 56, formed as a single component, are continuously integrated. Therefore, the first grounding component 54 and the second grounding component 55 can be reliably short-circuited, easily ensuring a stable electrical conduction state. As a result, the balance of electrical coupling between the paired signal terminals 52 and the grounding components 54 and 55 is well ensured. Furthermore, as described above, the first grounding component 54 and the second grounding component 55 are short-circuited through the short-circuit component 56; however, it is permissible for the retained protrusion 54A-2 of the first grounding component 54 and the retained protrusion 55A-1 of the second grounding component 55 to directly contact each other with their protruding top surfaces (surface contact), thus achieving electrical conduction.

[0086] Furthermore, in this embodiment, the connecting portion 56D connects multiple first base portions 56A to each other on the X2 side, and connects second base portions 56B to each other on the X1 side, thereby forming a structure in which these first base portions 56A and second base portions 56B are integrated with each other via their respective connecting portions 56D. Therefore, the electrical conduction state of the first grounding member 54 and the second grounding member 55 via the short-circuit member 56 is more stable.

[0087] Furthermore, in this embodiment, by making the connecting portion 56D contact the respective surface surfaces of the grounding portions 54A and 55A, the contact area between the short-circuit member 56 and the first grounding member 54 and the second grounding member 55 is increased, thus making the electrical conduction state of the first grounding member 54 and the second grounding member 55 via the short-circuit member 56 more stable. Additionally, since the respective surface surfaces of the grounding portions 54A and 55A are supported by the connecting portion 56D in a tightly fitted state, the grounding portions 54A and 55A can be stably held in place.

[0088] In this embodiment, in the substrate connectors 2 and 3, no grounding terminal is provided between adjacent pairs of signal terminals 52. Instead, a first base 56A, a second base 56B, and a connecting portion 56C, which are short-circuit members 56, are provided between the pairs of signal terminals 52. Therefore, by utilizing the range between the pairs of signal terminals 52, solid first bases 56A, second bases 56B, and connecting portions 56C with sufficiently large dimensions in both the width and vertical directions of the connector can be formed. Consequently, the first bases 56A, second bases 56B, and connecting portions 56C can be formed with simple shapes, while ensuring sufficient strength.

[0089] Furthermore, as long as a stable electrical conduction state between the first grounding component 54 and the second grounding component 55 is sufficiently ensured, it is not necessary to connect the multiple first bases 56A to each other and the second bases 56B to each other using the connecting portion 56D. For example, the connecting portion 56D can be omitted to form the short-circuit component 56. In this case, the short-circuit component 56 having the first base 56A, the second base 56B, and the connecting portion 56C adopts a structure in which multiple positions are arranged in the connector width direction.

[0090] In this embodiment, grounding through holes 54A-3 and 55A-2 are formed in the grounding plate portions 54A and 55A, but forming such holes is not mandatory. For example, instead of holes, a cutout portion that penetrates the grounding plate portion in the plate thickness direction and has a partial opening at its periphery can be formed. In this case, the first base and the second base of the short-circuit member are located within the cutout portion and contact the grounding plate portion. Alternatively, it is also possible not to form holes or cutout portions in the short-circuit member 56, and instead allow the first base and the second base of the short-circuit member to contact any part of each grounding member.

[0091] In addition, in this embodiment, the signal transmission path is composed of paired conductive patterns 22 and 24 in the relay connector 1 and paired signal terminals 52 in the substrate connectors 2 and 3. However, pairing is not necessary, and the signal transmission path can also be composed of a single conductive pattern and a single signal terminal.

Claims

1. An electrical connector, comprising: Multiple signal transmission paths made of metal; A plate-shaped retaining member with an electrically insulating structure, which retains the plurality of signal transmission paths; and A first grounding component and a second grounding component are made of metal, the first grounding component being disposed on one side of the retaining component in the plate thickness direction, and the second grounding component being disposed on the other side. The electrical connector is characterized in that... The holding member holds the signal transmission path array, which consists of a plurality of signal transmission paths arranged in a direction along the plate surface of the holding member, together with the first grounding member and the second grounding member, and has a through portion extending along the plate thickness direction at a position between adjacent signal transmission paths. The electrical connector has a short-circuit component made of conductive resin, which is integrally formed with the first grounding component and the second grounding component. The short-circuit component has: a first base located on the side of the first grounding component and in contact with the first grounding component; a second base located on the side of the second grounding component and in contact with the second grounding component; and a connecting portion located within the through portion to connect the first base and the second base.

2. The electrical connector according to claim 1, characterized in that, The short-circuit component has a first base, a second base, and a connecting portion at multiple locations in the arrangement direction of the signal transmission path, and has a connecting portion extending along the arrangement direction of the first grounding component and the second grounding component and connecting the first base at the multiple locations to each other and the second base to each other.

3. The electrical connector according to claim 2, characterized in that, The connecting part is in surface contact with the first grounding component and the second grounding component, respectively.

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