基于偏大废料的手持终端设备硅胶壳体的制备方法
By measuring and calculating the baking time and utilizing the shrinkage characteristics of silicone at high temperatures, the problem of recycling waste materials from excessively large silicone shells for handheld terminal devices was solved, improving yield and saving resources.
CN116277650BActive Publication Date: 2026-07-17SHENZHEN ES ELECTRONIC CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN ES ELECTRONIC CO LTD
- Filing Date
- 2023-04-17
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In the existing technology, the silicone shell of handheld terminal devices is too large due to fluctuations in injection molding pressure, resulting in resource waste and incompatibility that affects aesthetics and waterproof performance.
Method used
By measuring the size difference of the oversized waste material, the baking time is calculated. Taking advantage of the shrinkage property of silicone at high temperature, the oversized waste material is baked at a preset temperature to prepare a qualified silicone shell. The baking time t is calculated using the formula v=CT*w*t*k/h.
Benefits of technology
This improved the yield of silicone shells, saved resources, produced finished products that met standards, and avoided waste.
✦ Generated by Eureka AI based on patent content.
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Figure CN116277650B_ABST
Abstract
本发明公开了一种基于偏大废料的手持终端设备硅胶壳体的制备方法，包括：测量步骤：测量偏大的手持终端设备硅胶壳体废料的宽度w和厚度h，计算偏大废料与标准宽度的差值v；计算步骤：计算烘烤时间t；烘烤步骤：将偏大的手持终端设备硅胶壳体废料送入烤箱，置于预设温度下烘烤t小时，再冷却得到手持终端设备硅胶壳体的成品。本发明利用硅胶在高温环境下会发生收缩的特点，回收偏大废料，利用偏大废料制备得到合格的成品，避免了浪费，节省了资源。
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