Forming method of mobile phone back cover and mobile phone back cover

Abstract

This invention relates to the field of mobile phone accessory molding technology, and discloses a molding method for a mobile phone back cover and the mobile phone back cover itself. The molding method for the mobile phone back cover includes the following steps: impregnating polyethylene fiber cloth and glass fiber cloth to obtain thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth, then combining the two to form a thermoplastic glass fiber composite board; combining the thermoplastic glass fiber composite board, thermoplastic polyethylene fiber cloth, and thermoplastic glass fiber composite board to form a thermoplastic composite glass fiber sheet; sequentially performing screen printing, optical coating, and transfer protective layer on the thermoplastic composite glass fiber sheet to obtain a mobile phone back cover substrate; cutting the mobile phone back cover substrate into a preset shape, and then hot-bending it to obtain the mobile phone back cover. Using thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth as the substrate provides good thermoplasticity and toughness, facilitating hot bending and improving production efficiency; the hot-bent mobile phone back cover has high puncture resistance and strong battery protection.

Description

[0001] This invention relates to the field of mobile phone accessory molding technology, and in particular to a molding method for a mobile phone back cover and a mobile phone back cover. Background Technology

[0002] As smartphones and tablets demand longer battery life, more advanced features, and larger battery capacities, the requirements for their safety and protection are also increasing. The back cover, in particular, directly protects the battery, thus requiring puncture resistance.

[0003] In the current technology, the materials for mobile phone back covers are mostly PC (Polycarbonate) composite boards, glass, or aluminum alloys. PC composite boards have low strength, poor protection, and are relatively soft, offering little to no puncture resistance; aluminum alloys shield signals but are expensive; glass is brittle and fragile, heavy, and provides poor protection.

[0004] Therefore, there is an urgent need to provide a method for molding a mobile phone back cover and a mobile phone back cover in order to solve the above problems. Summary of the Invention

[0005] Based on the above, one objective of the present invention is to provide a method for molding a mobile phone back cover, so as to solve the problems of weak puncture resistance and weak protection of existing mobile phone back cover materials.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A method for molding a mobile phone back cover includes the following steps: Thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth are obtained by impregnation of polyethylene fiber cloth and glass fiber cloth. Thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth are combined to form thermoplastic glass fiber composite board; Thermoplastic composite glass fiber board is formed by combining thermoplastic glass fiber composite board, thermoplastic polyethylene fiber cloth and thermoplastic glass fiber composite board; A screen printing pattern, optical coating, and transfer protective layer are sequentially applied to a thermoplastic composite glass fiber sheet to obtain a mobile phone back cover substrate. The mobile phone back cover substrate is cut into a preset shape, and then the mobile phone back cover substrate cut into the preset shape is hot-bent to obtain the mobile phone back cover.

[0007] Furthermore, the process of obtaining thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth by impregnation of polyethylene fiber cloth and glass fiber cloth specifically includes the following steps: UPE is drawn into fibers and then woven into polyethylene fiber cloth; Pretreatment of polyethylene fiber cloth with coupling agent; Pretreated polyethylene fiber cloth and glass fiber cloth were impregnated with an impregnation solution to obtain thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth, respectively.

[0008] Furthermore, by weight, the ratio of the pretreated polyethylene fiber cloth to the impregnating liquid is 3:2.

[0009] Furthermore, the impregnation solution is a modified thermoplastic epoxy resin.

[0010] Furthermore, the process of combining thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth to form a thermoplastic glass fiber composite board specifically includes the following steps: The press presses thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth together; The thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth are heated and cured to form a thermoplastic glass fiber composite board.

[0011] Furthermore, the process of sequentially screen printing patterns, optical coating, and transfer protective layer onto the thermoplastic composite glass fiber sheet to obtain the mobile phone back cover substrate includes the following steps: A pre-set pattern is screen-printed onto a thermoplastic composite fiberglass board using thermoplastic UV ink to form a screen-printed layer; An optical coating is applied to the screen printing layer to form a coating layer. A protective layer is transferred onto the coating layer to obtain the mobile phone back cover substrate.

[0012] Furthermore, the thermoplastic UV ink is obtained by modifying epoxy polyacrylate or polyurethane-modified epoxy resin.

[0013] Based on the above, another objective of the present invention is to provide a mobile phone back cover that solves the problems of insufficient puncture resistance and weak protection of existing mobile phone back cover materials.

[0014] To achieve the above objectives, the present invention adopts the following technical solution: A mobile phone back cover, wherein the mobile phone back cover is formed according to the forming method of the mobile phone back cover described in any of the above embodiments.

[0015] Furthermore, the puncture resistance of the 4mm thick back cover of the mobile phone is greater than 120N.

[0016] Furthermore, the thickness of the phone back cover is 0.25mm-0.35mm.

[0017] The beneficial effects of this invention are as follows: The mobile phone back cover molding method provided by this invention includes the following steps: impregnating polyethylene fiber cloth and glass fiber cloth to obtain thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth; compositing the thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth to form a thermoplastic glass fiber composite board; compositing the thermoplastic glass fiber composite board, thermoplastic polyethylene fiber cloth, and thermoplastic glass fiber composite board to form a thermoplastic composite glass fiber sheet; sequentially screen printing patterns, optical coating, and transfer protective layers on the thermoplastic composite glass fiber sheet to obtain a mobile phone back cover substrate; cutting the mobile phone back cover substrate into a preset shape, and hot bending the cut mobile phone back cover substrate into the preset shape to obtain a mobile phone back cover. Using thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth as substrates provides good thermoplasticity and toughness, facilitating hot bending molding; the hot-bent mobile phone back cover improves production efficiency and yield, and has high puncture resistance and strong battery protection. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the structure of the mobile phone back cover substrate provided in a specific embodiment of the present invention.

[0019] In the picture: 1-Thermoplastic fiberglass composite board; 2-Thermoplastic fiberglass cloth; 3-Silk screen printing layer; 4-Coating layer; 5-Protective layer. Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present invention are shown in the drawings, not the entire structure.

[0021] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] This embodiment provides a method for molding a mobile phone back cover, which includes the following steps: Thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2 are obtained by impregnation of polyethylene fiber cloth and glass fiber cloth; Thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2 are combined to form thermoplastic glass fiber composite board 1; Thermoplastic glass fiber composite board 1, thermoplastic polyethylene fiber cloth 2 and thermoplastic glass fiber composite board 1 are combined to form thermoplastic composite glass fiber board; A screen printing pattern, optical coating, and transfer protective layer 5 are sequentially applied to a thermoplastic composite glass fiber sheet to obtain a mobile phone back cover substrate. The mobile phone back cover substrate is cut into a preset shape, and then the mobile phone back cover substrate cut into the preset shape is hot-bent to obtain the mobile phone back cover.

[0025] Using thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2 as the base material, it has good thermoplasticity and toughness, and is easy to bend into shape; the hot-bent mobile phone back cover improves production efficiency and yield, and has high puncture resistance and strong battery protection.

[0026] Specifically, the mobile phone back cover is formed by hot bending, which can achieve a production efficiency of over 95% and a yield rate of over 90%.

[0027] Further, the process of obtaining thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2 by impregnation of polyethylene fiber cloth and glass fiber cloth specifically includes the following steps: UPE (Ultra-high molecular weight polyethylene) is drawn into fibers and then woven into polyethylene fiber cloth. Pretreatment of polyethylene fiber cloth with coupling agent; The pretreated polyethylene fiber cloth and glass fiber cloth were impregnated with impregnation solution to obtain thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2, respectively.

[0028] Because polyethylene fiber cloth has low surface energy and relatively poor adhesion, it is difficult to adhere to resin (the impregnation liquid is resin), which is not convenient for subsequent impregnation. Therefore, pretreatment of polyethylene fiber cloth is required.

[0029] Specifically, the coupling agent can be a silane coupling agent, which changes the surface properties of the polyethylene fiber cloth, improves adhesion, and facilitates resin adhesion, thereby facilitating impregnation.

[0030] Furthermore, impregnation of pretreated polyethylene fiber cloth and glass fiber cloth can change the degree of crosslinking, making the polyethylene fiber cloth and glass fiber cloth thermoplastic.

[0031] Specifically, polyethylene fibers are woven into polyethylene fiber cloth using a weaving machine.

[0032] Furthermore, by weight, the ratio of the pretreated polyethylene fiber cloth to the impregnating liquid is 3:2.

[0033] Furthermore, the impregnation solution is a modified thermoplastic epoxy resin.

[0034] Specifically, the concentration of the impregnation solution is adjustable and can be formulated according to production requirements.

[0035] Furthermore, the process of combining thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2 to form thermoplastic glass fiber composite board 1 specifically includes the following steps: The press presses thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2 together; The thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2 are heated and cured to form a thermoplastic glass fiber composite board.

[0036] Specifically, the pressing parameters of the press are: pressure 15-20 kgf / cm². 2 .

[0037] Specifically, the temperature for heat curing is 150℃-200℃.

[0038] Specifically, the composite time of thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth 2 is 2 hours.

[0039] Specifically, in the process of laminating thermoplastic fiberglass composite panels, the number of composite layers is determined according to the thickness of the product design.

[0040] Furthermore, thermoplastic glass fiber composite board 1, thermoplastic polyethylene fiber cloth 2 and thermoplastic glass fiber composite board 1 are combined to form thermoplastic composite glass fiber board. In this process, pressure bonding is carried out, with a pressure of 15-25 MPa, a bonding temperature of 150℃-250℃ and a bonding time of 2 hours.

[0041] During the composite process, the composite can be performed under vacuum or not under vacuum; this embodiment does not limit this.

[0042] Furthermore, the process of sequentially screen printing patterns, optical coating, and transfer protective layer onto the thermoplastic composite glass fiber sheet to obtain the mobile phone back cover substrate includes the following steps: A pre-set pattern is screen-printed onto a thermoplastic composite fiberglass sheet using thermoplastic UV ink, forming a screen-printed layer 3 (e.g., ...). Figure 1 (as shown) An optical coating is applied to the screen printing layer to form coating layer 4 (e.g., ...). Figure 1 (as shown) Transfer a protective layer 5 (such as) onto the coating layer. Figure 1 As shown in the figure, the mobile phone back cover substrate is obtained.

[0043] Specifically, during the screen printing process, the screen density is 80-150 mesh, the UV equivalent is 1000mj-1500mj, and the irradiation time is 10s-20s.

[0044] Furthermore, thermoplastic UV inks are obtained by modifying epoxy resins with epoxy polyacrylate or polyurethane. Thermoplastic UV inks have good thermoplasticity, allowing for color matching and texture overlay, facilitating subsequent hot bending molding, and do not affect the screen-printed pattern.

[0045] Specifically, during the optical coating process, the electron gun power is 100KW-380KW, the time is 40min-60min, and the temperature is 50℃-100℃.

[0046] Specifically, protective layer 5 is a high-gloss protective layer, which is a transparent UV-curable resin.

[0047] Specifically, during the transfer of protective layer 5, the equivalent of the electrodeless lamp light is 300mJ-500mJ, and the irradiation time is 8s-15s.

[0048] Furthermore, the cutting of the mobile phone back cover substrate into a preset shape is achieved using a CNC machine tool.

[0049] Furthermore, the mobile phone back cover is obtained by hot bending the mobile phone back cover substrate cut into a preset shape. This is achieved by using a hot bending machine.

[0050] Specifically, during the hot bending process, the hot bending temperature is 150℃-200℃, preferably 180℃, and the hot bending time is 35s-60s.

[0051] In this embodiment, a mobile phone back cover is also provided, which is formed according to the above-described mobile phone back cover forming method.

[0052] Furthermore, the 4mm thick phone back cover has a puncture resistance of more than 120N, exceeding the current industry requirement (the puncture resistance of a 4mm thick phone back cover is 100N), thus providing good protection for the battery.

[0053] Furthermore, the thickness of the phone's back cover is 0.25mm-0.35mm. Compared to the existing phone back cover thickness of 0.8mm, the thinner back cover provides a better user experience.

[0054] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for molding a mobile phone back cover, characterized in that, Includes the following steps: Thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth are obtained by impregnation of polyethylene fiber cloth and glass fiber cloth. Thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth are combined to form thermoplastic glass fiber composite board; Thermoplastic composite glass fiber board is formed by combining thermoplastic glass fiber composite board, thermoplastic polyethylene fiber cloth and thermoplastic glass fiber composite board; A screen printing pattern, optical coating, and transfer protective layer are sequentially applied to a thermoplastic composite glass fiber sheet to obtain a mobile phone back cover substrate. The mobile phone back cover substrate is cut into a preset shape, and then the mobile phone back cover substrate cut into the preset shape is hot-bent to obtain the mobile phone back cover.

2. The method for forming a mobile phone back cover according to claim 1, characterized in that, The process of obtaining thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth by impregnation specifically includes the following steps: UPE is drawn into fibers and then woven into polyethylene fiber cloth; Pretreatment of polyethylene fiber cloth with coupling agent; Pretreated polyethylene fiber cloth and glass fiber cloth were impregnated with an impregnation solution to obtain thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth, respectively.

3. The method for forming a mobile phone back cover according to claim 2, characterized in that, By mass, the ratio of pretreated polyethylene fiber cloth to impregnating liquid is 3:

2.

4. The method for forming a mobile phone back cover according to claim 2, characterized in that, The impregnation solution is a modified thermoplastic epoxy resin.

5. The method for forming a mobile phone back cover according to claim 1, characterized in that, The process of combining thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth to form a thermoplastic glass fiber composite board includes the following steps: The press presses thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth together; The thermoplastic polyethylene fiber cloth and thermoplastic glass fiber cloth are heated and cured to form a thermoplastic glass fiber composite board.

6. The method for forming a mobile phone back cover according to claim 1, characterized in that, The process of sequentially screen printing patterns, optical coating, and transfer protective layers onto thermoplastic composite fiberglass sheets to obtain the mobile phone back cover substrate includes the following steps: A pre-set pattern is screen-printed onto a thermoplastic composite fiberglass board using thermoplastic UV ink to form a screen-printed layer; An optical coating is applied to the screen printing layer to form a coating layer. A protective layer is transferred onto the coating layer to obtain the mobile phone back cover substrate.

7. The method for forming a mobile phone back cover according to claim 6, characterized in that, Thermoplastic UV inks are obtained by modifying epoxy resins with epoxy polyacrylate or polyurethane.

8. A mobile phone back cover, characterized in that, The mobile phone back cover is formed by the molding method of the mobile phone back cover according to any one of claims 1-7.

9. The mobile phone back cover according to claim 8, characterized in that, The puncture resistance of the mobile phone back cover, which is 0.4mm thick, is greater than 120N.

10. The mobile phone back cover according to claim 8, characterized in that, The thickness of the phone's back cover is 0.25mm-0.35mm.

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