Head chip, liquid ejection head, and liquid ejection recording apparatus

Abstract

Provided are a head chip, a liquid ejection head, and a liquid ejection recording apparatus capable of increasing pressure generation on the basis of power saving. A head chip according to one aspect of the present disclosure includes a flow path member, an actuator plate, and a drive electrode. The drive electrode includes a first electrode disposed so as to coincide with a pressure chamber or a partition wall with respect to the first electrode in a first surface of the actuator plate as viewed in a first direction, a second electrode disposed adjacent to the first electrode in the first surface of the actuator plate so as to generate a potential difference between the first electrode and the second electrode, and a first counter electrode disposed at a position facing the first electrode in a second surface of the actuator plate so as to generate a potential difference between the first electrode and the first counter electrode.

Description

Technical Field

[0001] This disclosure relates to a head chip, a liquid jet head, and a liquid jet recording device. Background Technology

[0002] The printhead chip in an inkjet printer ejects ink contained in a pressure chamber through nozzles, thereby recording printed information such as text or images onto the recording medium. In the printhead chip, to eject the ink, an electric field is first generated on an actuator plate made of piezoelectric material, causing the actuator plate to deform. This deformation of the actuator plate increases the pressure within the pressure chamber, causing the ink to be ejected through the nozzles.

[0003] Here, as a deformation mode of the actuator plate, there exists a so-called shear mode, in which the actuator plate undergoes shear deformation (thickness slip deformation) by means of an electric field generated in the actuator plate. Shear modes include so-called wall bending type or top-firing type.

[0004] The wall-bend type head chip has a pressure chamber formed in the actuator plate itself. In the wall-bend type head chip, the partition walls that sandwich the pressure chamber and face each other deform in a direction that is close to or spaced apart from each other, thereby changing the volume of the pressure chamber.

[0005] On the other hand, the top-firing head chip is configured such that the actuator plate is arranged facing the pressure chamber formed on the flow path component (for example, see Patent Document 1 below). In the top-firing head chip, the actuator plate deforms along the thickness direction, thereby changing the volume of the pressure chamber.

[0006] Prior art literature Patent documents Patent Document 1: U.S. Patent No. 4,584,590. Summary of the Invention

[0007] The problem that the invention aims to solve Unlike wall-bend head chips, top-firing head chips have pressure chambers formed in components (flow path components) that are different from the actuator board, thus enabling improvements in manufacturing efficiency or durability.

[0008] On the other hand, in top-firing head chips, the actuator board only faces the pressure chamber, making it more difficult to ensure pressure generation within the pressure chamber compared to wall-bending head chips. In top-firing head chips, increasing the drive voltage is necessary to ensure pressure generation.

[0009] This disclosure provides a head chip, a liquid ejection head, and a liquid ejection recording device that can increase the pressure generated in the pressure chamber during ink ejection while seeking to save power.

[0010] Methods for solving problems To address the aforementioned issues, the present disclosure adopts the following solution.

[0011] (1) One aspect of the present disclosure includes a head chip comprising: a flow path component in which a plurality of pressure chambers containing liquid are arranged in a state separated by partition walls; an actuator plate stacked on the flow path component in a state facing the aforementioned pressure chambers along a first direction, and with the aforementioned first direction as the polarization direction; and driving electrodes formed on a first surface of the aforementioned actuator plate facing a first side of the aforementioned first direction and a second surface facing a second side that is opposite to the aforementioned first side, and the aforementioned actuator plate is directed along the aforementioned first direction. The drive electrode comprises: a first electrode disposed on the first surface of the actuator plate, which, when viewed from the first direction, coincides with the pressure chamber or the partition wall; a second electrode disposed on the first surface of the actuator plate adjacent to the first electrode, generating a potential difference between the second electrode and the first electrode; and a first opposing electrode disposed on the second surface of the actuator plate, which is opposite to the first electrode, generating a potential difference between the second electrode and the first electrode.

[0012] According to this scheme, by generating a potential difference between the first and second electrodes, an electric field can be generated in a direction intersecting the polarization direction of the actuator plate. Therefore, by deforming the actuator plate in a shear mode (top-jet type) along the first direction, the volume of the pressure chamber can be changed.

[0013] Furthermore, in this design, an electric field can be generated along the polarization direction of the actuator plate by creating a potential difference between the first electrode and the first counter electrode. Therefore, by deforming the actuator plate in a bending mode (dual piezoelectric crystal type) along the first direction, the volume of the pressure chamber can be changed.

[0014] In this way, by utilizing both shear and bending modes to deform the actuator plate along the first direction, the pressure generated in the pressure chamber can be increased, thereby saving power.

[0015] Specifically, in this design, the first opposing electrode is provided correspondingly to the first electrode, and thus the first opposing electrode is provided at a distance from each other on the second surface. Therefore, compared to the case where the first opposing electrode is formed over the entire area of ​​the second surface, for example, the electrostatic capacitance of the actuator plate can be reduced. As a result, the responsiveness of the actuator plate can be improved, and heat generation on the actuator plate can also be suppressed.

[0016] (2) In the head chip involved in the above (1) solution, the aforementioned driving electrode may also have a second counter electrode disposed on the aforementioned second surface facing the aforementioned second electrode and adjacent to the aforementioned first counter electrode. The aforementioned second counter electrode generates a potential difference with the aforementioned second electrode along the aforementioned first direction, and generates a potential difference with the aforementioned first counter electrode along a direction intersecting the aforementioned first direction.

[0017] According to this scheme, on the second side, the first and second opposing electrodes are arranged adjacent to each other, so that the actuator plate can be deformed by shearing mode by utilizing the potential difference generated between the first and second opposing electrodes.

[0018] Furthermore, the actuator plate can be deformed through a bending mode by utilizing the potential difference generated between the second electrode and the second counter electrode. As a result, it is possible to further increase the generated pressure and reduce power consumption.

[0019] (3) In the head chip involved in the above (2) scheme, the first surface of the aforementioned actuator plate may be arranged facing the aforementioned flow path component in the aforementioned first direction, and the entire second electrode may be arranged at a position overlapping with the aforementioned partition wall when viewed from the aforementioned first direction.

[0020] According to this design, the second electrode is not formed on the portion of the first surface of the actuator plate facing the pressure chamber, thus easily ensuring the area of ​​the electrode (first electrode) formed on the portion of the first surface facing the pressure chamber. As a result, it is easy to ensure that the electric field generated on the actuator plate due to the first electrode easily increases the pressure generated in the pressure chamber.

[0021] Furthermore, the second electrode is not formed on the portion of the actuator plate facing the pressure chamber on the first surface. Therefore, when the portion of the actuator plate facing the pressure chamber deforms, the deformation of the actuator plate can be prevented from being hindered by the second electrode. That is, the starting point of the deformation of the actuator plate can be extended to the boundary between the actuator plate and the partition wall, thereby ensuring the amount of deformation of the actuator plate and increasing the generated pressure.

[0022] (4) In the head chip involved in the above scheme (2) or (3), it is also possible that in the above second opposing electrode, a part of it is arranged opposite to the above second electrode at a position that coincides with the above partition wall when viewed from the above first direction, and the remaining part is arranged at a position that coincides with the above pressure chamber when viewed from the above first direction.

[0023] According to this design, in the second opposing electrode, with a portion facing the second electrode, the remaining portion extends until it faces the pressure chamber. Therefore, when the actuator plate deforms in a bending mode, the portion of the actuator plate facing the pressure chamber can effectively generate an electric field in the actuator plate caused by the potential difference between the second opposing electrode and the second electrode. Furthermore, by bringing the first and second opposing electrodes close together, when the actuator plate deforms in a shearing mode, the portion of the actuator plate facing the pressure chamber can effectively generate an electric field in the actuator plate caused by the potential difference between the first and second opposing electrodes.

[0024] As a result, the actuator plate can be deformed efficiently.

[0025] (5) In the head chip involved in any of the above (1) to (4), the first electrode and the first opposing electrode are disposed together in a position facing the pressure chamber in the first direction.

[0026] According to this design, the first opposing electrode and the first electrode as a whole are positioned facing the pressure chamber. Therefore, when the actuator plate deforms in a bending mode, the portion of the actuator plate facing the pressure chamber can effectively generate an electric field in the actuator plate caused by the potential difference between the first opposing electrode and the first electrode. Thus, the actuator plate can be deformed efficiently.

[0027] (6) The head chip involved in any of the above (1) to (5) may also have a limiting member stacked on the side opposite to the flow path component in the first direction, on the side that clamps the actuator plate. This limiting member restricts the displacement of the actuator plate in the first direction to the side opposite to the flow path component.

[0028] According to this solution, the displacement of the actuator plate in the first direction opposite to the flow path component can be limited by the limiting component due to the resistance (compliance) of the liquid acting on the actuator plate, such as the pressure of the liquid in the pressure chamber. This allows the deformation of the actuator plate to be effectively transmitted towards the pressure chamber. As a result, the pressure generated in the pressure chamber during actuator plate deformation can be increased, thereby saving power.

[0029] (7) The liquid injection head of one embodiment of the present disclosure has the head chip of any one of the embodiments (1) to (6) above.

[0030] This solution provides a power-saving and high-performance liquid injection head.

[0031] (8) One embodiment of the present disclosure has a liquid jet recording device that includes the liquid jet head of the embodiment described in (7) above.

[0032] This solution provides a power-saving and high-performance liquid jet recording device.

[0033] The effects of the invention According to one of the solutions disclosed herein, it is possible to increase the pressure generated while seeking to save electricity. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the inkjet printer according to the first embodiment.

[0035] Figure 2 This is a schematic diagram of the inkjet head and ink circulation mechanism according to the first embodiment.

[0036] Figure 3 This is an exploded perspective view of the head chip according to the first embodiment.

[0037] Figure 4 Is with Figure 3 A cross-sectional view of the chip corresponding to the IV-IV line.

[0038] Figure 5 Is with Figure 4 The cross-sectional view of the chip corresponding to the VV line.

[0039] Figure 6 This is a bottom view of the actuator plate according to the first embodiment.

[0040] Figure 7 This is a top view of the actuator plate according to the first embodiment.

[0041] Figure 8 This is an explanatory diagram illustrating the deformation behavior of the head chip according to the first embodiment when it spits out ink.

[0042] Figure 9 This is a flowchart illustrating the manufacturing method of the head chip according to the first embodiment.

[0043] Figure 10 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0044] Figure 11 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0045] Figure 12 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0046] Figure 13 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0047] Figure 14 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0048] Figure 15 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0049] Figure 16 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0050] Figure 17 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0051] Figure 18 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0052] Figure 19 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0053] Figure 20 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 4 The corresponding cross-sectional view.

[0054] Figure 21 This is a bottom view of the actuator plate according to the second embodiment.

[0055] Figure 22 This is a top view of the actuator plate according to the second embodiment.

[0056] Figure 23 This is a cross-sectional view of the head chip according to the third embodiment.

[0057] Figure 24 This is a cross-sectional view of the head chip according to the fourth embodiment.

[0058] Figure 25 This is a cross-sectional view of the head chip involved in the modified example.

[0059] Figure 26 This is a cross-sectional view of the head chip involved in the modified example.

[0060] Figure 27 This is a cross-sectional view of the head chip involved in the modified example. Detailed Implementation

[0061] Hereinafter, embodiments relating to this disclosure will be described with reference to the accompanying drawings. In the embodiments or variations described below, sometimes the same reference numerals are used for corresponding configurations and descriptions are omitted. In the following description, expressions such as "parallel" or "orthogonal," "center," "coaxial," etc., indicating relative or absolute configurations, not only refer to such configurations strictly, but also to states of relative displacement by an angle or distance with tolerance or to the extent that the same function can be obtained. In the following embodiments, an inkjet printer (hereinafter simply referred to as a printer) that uses ink (liquid) to record on a recording medium is illustrated by example. In the accompanying drawings used in the following description, the scale of each component is appropriately altered to make each component a recognizable size.

[0062] (First Embodiment) [Printer 1] Figure 1 This is a schematic diagram of printer 1.

[0063] Figure 1 The printer (liquid jet recording device) 1 shown in the figure includes a pair of transport mechanisms 2 and 3, an ink tank 4, an inkjet head (liquid jet head) 5, an ink circulation mechanism 6, and a scanning mechanism 7.

[0064] In the following description, an orthogonal coordinate system of X, Y, and Z is used as needed. In this case, the X direction is aligned with the transport direction (sub-scanning direction) of the recorded medium P (e.g., paper, etc.). The Y direction is aligned with the scanning direction (main scanning direction) of the scanning mechanism 7. The Z direction shows the height direction (gravity direction) orthogonal to the X and Y directions. In the following description, the X, Y, and Z directions are described with the side of the arrow in the figure as the positive (+) side and the side opposite to the arrow as the negative (-) side. In this specification, the +Z side corresponds to the upper part of the gravity direction, and the -Z side corresponds to the lower part of the gravity direction.

[0065] The conveying mechanisms 2 and 3 convey the recording medium P to the +X side. The conveying mechanisms 2 and 3 include, for example, a pair of rollers 11 and 12 extending along the Y direction.

[0066] The ink tank 4 contains, for example, four colors of ink: yellow, magenta, cyan, and black. Each inkjet head 5 is configured to eject one of the four colors of ink—yellow, magenta, cyan, and black—depending on the ink tank 4 it is connected to.

[0067] Figure 2 This is a schematic diagram of the inkjet head 5 and the ink circulation mechanism 6.

[0068] like Figure 1 , Figure 2 As shown, the ink circulation mechanism 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes: a circulation path 23 having an ink supply pipe 21 and an ink discharge pipe 22; a pressure pump 24 connected to the ink supply pipe 21; and a suction pump 25 connected to the ink discharge pipe 22.

[0069] The pressure pump 24 pressurizes the ink supply tube 21 and delivers ink to the inkjet head 5 through the ink supply tube 21. As a result, the ink supply tube 21 is under positive pressure relative to the inkjet head 5.

[0070] The suction pump 25 depressurizes the ink discharge tube 22, drawing ink from the inkjet head 5 through it. This creates a negative pressure on the ink discharge tube 22 side relative to the inkjet head 5. The ink can then circulate between the inkjet head 5 and the ink tank 4 via the circulation path 23, driven by the pressure pump 24 and the suction pump 25.

[0071] like Figure 1 As shown, the scanning mechanism 7 causes the inkjet head 5 to reciprocate scanning along the Y direction. The scanning mechanism 7 includes a guide rail 28 extending along the Y direction and a carriage 29 that is movably supported by the guide rail 28.

[0072] <Inkjet Head 5> The inkjet head 5 is mounted on the carriage 29. In the illustrated example, multiple inkjet heads 5 are mounted side-by-side on a carriage 29 along the Y direction. The inkjet head 5 includes: a head chip 50 (see reference). Figure 3 The ink supply unit (not shown) connects the ink circulation mechanism 6 and the head chip 50; and the control unit (not shown) applies a driving voltage to the head chip 50.

[0073] <Head Chip 50> Figure 3 This is an exploded 3D view of chip 50. Figure 4 Is with Figure 3 The cross-sectional view of the head chip 50 corresponding to the IV-IV line. Figure 5 Is with Figure 4 The cross-sectional view of the head chip 50 corresponding to the VV line.

[0074] Figures 3 to 5The head chip 50 shown is a so-called circulating side-ejection type head chip 50 that circulates ink between itself and the ink tank 4 and ejects ink from the center of the pressure chamber 61 in the extension direction (Y direction), as described later. The head chip 50 includes a nozzle plate 51, a flow path component 52, a first membrane 53, an actuator plate 54, a second membrane 55, and a cover plate 56. In the following description, the direction from the nozzle plate 51 toward the cover plate 56 in the Z direction (+Z side) is sometimes referred to as the upper side, and the direction from the cover plate 56 toward the nozzle plate 51 (-Z side) is referred to as the lower side.

[0075] The flow path component 52 is plate-shaped with its thickness along the Z direction. The flow path component 52 is formed of a material with ink resistance. Such a material can be, for example, metal or metal oxide, glass, resin, ceramic, etc. Multiple pressure chambers 61 are formed in the flow path component 52. Ink is contained in each pressure chamber 61. The pressure chambers 61 are spaced apart and arranged side-by-side along the X direction. Therefore, the portion of the flow path component 52 located between adjacent pressure chambers 61 constitutes a partition wall 62 that separates adjacent pressure chambers 61 along the X direction.

[0076] Each pressure chamber 61 is formed as a groove extending linearly along the Y direction. At least a portion of each pressure chamber 61 in the Y direction (in the first embodiment, the central portion in the Y direction) passes through the flow path member 52. Furthermore, in the first embodiment, a configuration in which the channel extension direction is aligned with the Y direction is described, but the channel extension direction may also intersect the Y direction. In addition, the top view shape of the pressure chamber 61 is not limited to a rectangular shape (a shape with either the X or Y direction as the long side and the other as the short side). The top view shape of the pressure chamber 61 may also be a polygonal shape such as a square or triangle, a circle, an ellipse, etc.

[0077] The nozzle plate 51 is fixed to the lower surface of the flow path component 52 by bonding or the like. The nozzle plate 51 has the same top-view shape as the flow path component 52. Therefore, the nozzle plate 51 closes the lower opening of the pressure chamber 61. In the first embodiment, the nozzle plate 51 is formed from a resin material such as polyimide with a thickness of approximately tens to hundreds of μm. However, in addition to resin materials, the nozzle plate 51 can also be a single-layer or multi-layer structure based on a metal material (SUS or Ni-Pd, etc.), glass, silicon, etc.

[0078] A plurality of nozzle holes 71 are formed in the nozzle plate 51, extending through the nozzle plate 51 in the Z direction. Each nozzle hole 71 is spaced apart in the X direction. Each nozzle hole 71 communicates with the central portion of its corresponding pressure chamber 61 in both the X and Y directions. In the first embodiment, each nozzle hole 71 is formed, for example, in a tapered shape where its inner diameter gradually decreases from top to bottom. In the first embodiment, a configuration in which the plurality of pressure chambers 61 and the plurality of nozzle holes 71 are arranged side-by-side in the X direction has been described, but this configuration is not limited to. If the plurality of pressure chambers 61 and the plurality of nozzle holes 71 arranged side-by-side in the X direction constitute a nozzle column, then multiple columns of nozzle columns may also be provided, spaced apart in the Y direction. In this case, if the number of nozzle columns is n, then the arrangement spacing of the nozzle holes 71 (pressure chambers 61) in the Y direction of a nozzle column is preferably offset by 1 / n spacing relative to the arrangement spacing of the nozzle holes 71 of other nozzle columns adjacent to a nozzle column.

[0079] The first membrane 53 is fixed to the upper surface of the flow path component 52 by bonding or the like. The first membrane 53 is disposed over the entire area of ​​the upper surface of the flow path component 52. Thus, the first membrane 53 closes the upper openings of each pressure chamber 61. The first membrane 53 is formed of a material that is insulating, ink-resistant, and elastically deformable. Such a material is, for example, a resin material (polyimide, epoxy resin, polypropylene, etc.). In the first embodiment, "elastically deformable" means a component whose compressive modulus is smaller than that of adjacent components in the Z direction when multiple components are stacked. That is, with respect to the first membrane 53, its compressive modulus is smaller than that of the flow path component 52 and the actuator plate 54.

[0080] The actuator plate 54 is fixed to the upper surface of the first membrane 53 by bonding or the like, with the Z-direction as its thickness direction. The top view of the actuator plate 54 is larger than that of the flow path component 52. Therefore, the actuator plate 54 sandwiches the first membrane 53 and faces each pressure chamber 61 in the Z-direction. Furthermore, the actuator plate 54 is not limited to a configuration that covers all pressure chambers 61 together; it can also be provided individually for each pressure chamber 61.

[0081] The actuator plate 54 is formed of a piezoelectric material such as PZT (lead zirconate titanate). The actuator plate 54 is positioned with its polarization direction facing the -Z side. Drive wiring 64 is formed on both sides of the actuator plate 54. The actuator plate 54 is configured to deform along the Z-direction by generating an electric field using a voltage applied by the drive wiring 64. The deformation of the actuator plate 54 in the Z-direction expands or contracts the volume within the pressure chamber 61, thereby ejecting ink from the pressure chamber 61. The configuration of the drive wiring 64 will be described later.

[0082] The second membrane 55 is fixed to the upper surface of the actuator plate 54 by bonding or the like. In the first embodiment, the second membrane 55 covers the entire area of ​​the upper surface of the actuator plate 54. The second membrane 55 is formed of a material that is insulating and elastically deformable. The same material as the first membrane 53 can be used. That is, the compressive modulus of the second membrane 55 is smaller than that of the flow path component 52 and the actuator plate 54.

[0083] The cover plate 56 is fixed to the upper surface of the second membrane 55 by bonding or the like, with its thickness along the Z-direction. The thickness of the cover plate 56 in the Z-direction is greater than that of the actuator plate 54 or the flow path component 52, and each membrane 53, 55. In the first embodiment, the cover plate 56, like the flow path component 52, is formed of metal or metal oxide, glass, resin, ceramic, etc. Regarding the cover plate 56, its compressive modulus is at least greater than that of the second membrane 55. Figure 5 As shown, the portions of the cover plate 56, the second membrane 55, and the actuator plate 54 that protrude toward the +Y side relative to the flow path component 52 constitute the tail 65.

[0084] An inlet common ink chamber 66 and an outlet common ink chamber 67 are formed in the cover plate 56.

[0085] The inlet common ink chamber 66 is formed, for example, at a position that overlaps with the +Y side end of the pressure chamber 61 when viewed from the Z direction. The inlet common ink chamber 66 extends along the X direction, for example, across the length of each pressure chamber 61, and has an opening on the upper surface of the cover plate 56.

[0086] The common ink outlet chamber 67 is formed, for example, at a position that overlaps with the -Y side end of the pressure chamber 61 when viewed from the Z direction. The common ink outlet chamber 67 extends along the X direction, for example, across the length of each pressure chamber 61, and has an opening on the upper surface of the cover plate 56.

[0087] An entrance slit 68 is formed in the entrance common ink chamber 66 at a position that coincides with the pressure chamber 61 when viewed from the Z direction. The entrance slit 68 extends through the cover plate 56, the second membrane 55, the actuator plate 54, and the first membrane 53 along the Z direction. The entrance slit 68 connects each pressure chamber 61 with the entrance common ink chamber 66.

[0088] In the exit common ink chamber 67, an exit slit 69 is formed at a position that coincides with the pressure chamber 61 when viewed from the Z direction. The exit slit 69 extends through the cover plate 56, the second membrane 55, the actuator plate 54, and the first membrane 53 along the Z direction. The exit slit 69 connects each pressure chamber 61 with the exit common ink chamber 67.

[0089] Next, the construction of the drive wiring 64 will be explained. Figure 6 This is a bottom view of actuator plate 54. Figure 7This is a top view of the actuator plate 54. Drive wiring 64 is provided corresponding to each pressure chamber 61. The drive wiring 64 corresponding to adjacent pressure chambers 61 is formed linearly symmetrically with respect to the axis of symmetry T along the Y direction. In the following description, the drive wiring 64A corresponding to one of the multiple pressure chambers 61 is used as an example; descriptions of the drive wiring 64 corresponding to other pressure chambers 61 are omitted as appropriate.

[0090] like Figure 6 , Figure 7 As shown, the drive wiring 64A has a common wiring 81 and a separate wiring 82.

[0091] The common wiring 81 includes a first common electrode 81a, a second common electrode 81b, a lower surface detour wiring 81c, an upper surface detour wiring 81d, a through wiring 81e, a common connection wiring 81f, and a common pad 81g. Furthermore, it is preferable that an insulator (e.g., SiO2, etc.) is provided between the portion of the common wiring 81 other than the common electrodes 81a and 81b (lower surface detour wiring 81c, upper surface detour wiring 81d, through wiring 81e, common connection wiring 81f, and common pad 81g) and the actuator board 54.

[0092] like Figure 4 , Figure 6 As shown, the first common electrode 81a extends linearly in the Y direction from the lower surface of the actuator plate 54, facing the corresponding pressure chamber 61 in the Z direction. In the illustrated example, the first common electrode 81a is formed at the central position in the X direction, including the pressure chamber 61. However, as long as the first common electrode 81a is formed at the position facing the pressure chamber 61, its width or position in the X direction can be appropriately changed.

[0093] like Figure 4 , Figure 7 As shown, the second common electrode 81b extends linearly along the Y direction on the upper surface of the actuator plate 54, at a position that does not coincide with the first common electrode 81a of the corresponding pressure chamber 61 when viewed from the Z direction. In the first embodiment, the second common electrode 81b is formed on both sides of the first common electrode 81a in the X direction. Each second common electrode 81b is formed at a position symmetrical to the center of the pressure chamber 61 in the X direction.

[0094] A portion of the second common electrode 81b located on the +X side (hereinafter referred to as the +X side common electrode 81b1) coincides with the partition wall 62 located on the +X side of the partition wall 62 dividing the corresponding pressure chamber 61 when viewed from the Z direction. A remaining portion of the +X side common electrode 81b1 extends towards the -X side relative to the partition wall 62a. That is, a remaining portion of the +X side common electrode 81b1 coincides with a portion of the pressure chamber 61 when viewed from the Z direction.

[0095] A portion of the second common electrode 81b located on the -X side (hereinafter referred to as the -X side common electrode 81b2) of each of the second common electrodes 81b, when viewed from the Z direction, coincides with the partition wall 62 located on the -X side of the partition wall 62 dividing the corresponding pressure chamber 61 (hereinafter referred to as partition wall 62b). Furthermore, between adjacent pressure chambers 61, the +X side common electrode 81b1 of one pressure chamber 61 and the -X side common electrode 81b2 of the other pressure chambers 61 are spaced apart along the X direction on the partition wall 62.

[0096] The remaining portion of the -X side common electrode 81b2 extends toward the +X side relative to the partition wall 62b. That is, the remaining portion of the -X side common electrode 81b2 coincides with a portion of the pressure chamber 61 when viewed from the Z direction. Furthermore, the width D1 of the first common electrode 81a in the Y direction is preferably wider than the width D2 of the portion of each second common electrode 81b that coincides with the pressure chamber 61 in the Y direction.

[0097] like Figure 6 As shown, the lower surface meandering wiring 81c is connected to the first common electrode 81a on the lower surface of the actuator plate 54. The lower surface meandering wiring 81c extends from the -Y side end of the first common electrode 81a toward the +X side. The +X side end of the lower surface meandering wiring 81c extends until it coincides with the central portion of the partition wall 62a in the X direction when viewed from the Z direction.

[0098] like Figure 7 As shown, the upper surface meandering wiring 81d is connected to each of the second common electrodes 81b on the upper surface of the actuator plate 54. The upper surface meandering wiring 81d extends in the X direction with its -Y side end connected to each of the second common electrodes 81b. The +X side end of the upper surface meandering wiring 81d extends until it coincides with the center of the partition wall 62a in the X direction when viewed from the Z direction.

[0099] like Figure 4 , Figure 6 , Figure 7As shown, the through wiring 81e connects the lower surface detour wiring 81c and the upper surface detour wiring 81d. The through wiring 81e is provided to pass through the actuator plate 54 in the Z direction. Specifically, a wiring through hole 91 is formed in the portion of the actuator plate 54 located on the +X side relative to the +X side common electrode 81b1. In the first embodiment, the wiring through hole 91 is formed in the portion of the actuator plate 54 that coincides with the central portion of the partition wall 62a in the X direction when viewed from the Z direction. The wiring through hole 91 extends along the +X side common electrode 81b1 in the Y direction. In the illustrated example, the length of the wiring through hole 91 in the Y direction is slightly longer than the +X side common electrode 81b1 and shorter than the pressure chamber 61. However, the length of the wiring through hole 91 in the Y direction can be appropriately varied.

[0100] A through-hole 81e is formed on the inner surface of the through-hole 91. The through-hole 81e is formed over at least the entire area in the Z direction on the inner surface of the through-hole 91. The through-hole 81e connects to the lower surface meandering wire 81c at the lower opening edge of the through-hole 91, and connects to the upper surface meandering wire 81d at the upper opening edge of the through-hole 91. Alternatively, the through-hole 81e may be formed over the entire circumference of the inner surface of the through-hole 91.

[0101] like Figure 6 As shown, the common connection wiring 81f connects the through wiring 81e and the common pad 81g on the lower surface of the actuator board 54. Specifically, the common connection wiring 81f extends along the Y direction further on the +Y side than the through wiring 81e. The -Y side end of the common connection wiring 81f connects to the through wiring 81e at the lower opening edge of the wiring through hole 91. The +Y side end of the common connection wiring 81f terminates at the tail 65.

[0102] The common pad 81g is connected to the common connection wiring 81f on the lower surface of the tail 65. The common pad 81g extends along the X direction on the lower surface of the tail 65.

[0103] like Figure 6 , Figure 7 As shown, the individual wiring 82 includes a first individual electrode 82a, a second individual electrode 82b, a lower surface detour wiring 82c, an upper surface detour wiring 82d, a through wiring 82e, an individual connection wiring 82f, an individual pad 82g, and an inner surface wiring 82h. Furthermore, it is preferable that an insulator (e.g., SiO2, etc.) is provided between the portion of the individual wiring 82 other than the individual electrodes 82a and 82b (lower surface detour wiring 82c, upper surface detour wiring 82d, through wiring 82e, individual connection wiring 82f, and individual pad 82g) and the actuator board 54.

[0104] like Figure 4 , Figure 6 As shown, the first individual electrodes 82a are formed on the lower surface of the actuator plate 54 on portions located on both sides of the first common electrode 81a in the X direction. Each of the first individual electrodes 82a extends in the Y direction, spaced apart from the first common electrode 81a in the X direction. A potential difference is generated between the first individual electrode 82a and the first common electrode 81a. The width D3 of the first individual electrode 82a in the X direction is narrower than the width D1 of the first common electrode 81a in the X direction.

[0105] The first individual electrode 82a located on the +X side (hereinafter, +X side individual electrode 82a1) of each of the first individual electrodes 82a coincides with the partition wall 62a when viewed from the Z direction. The +X side individual electrode 82a1 faces a portion of the +X side common electrode 81b1 on the partition wall 62a in the Z direction. On the other hand, the first individual electrode 82a located on the -X side (hereinafter, -X side individual electrode 82a2) of each of the first individual electrodes 82a coincides with the partition wall 62b when viewed from the Z direction. The -X side individual electrode 82a2 faces a portion of the -X side common electrode 81b2 on the partition wall 62b in the Z direction. Each of the first individual electrodes 82a generates a potential difference with the second common electrode 81b facing it in the Z direction.

[0106] like Figure 4 , Figure 7 As shown, the second individual electrode 82b is formed on the upper surface of the actuator plate 54 in the portion located between the respective second common electrodes 81b. The second individual electrode 82b extends in the Y direction, spaced apart from the first common electrode 81a in the X direction. Therefore, the entire second individual electrode 82b coincides with the corresponding pressure chamber 61 when viewed from the Z direction. A potential difference is generated between the second individual electrode 82b and the second common electrode 81b. At least a portion of the second individual electrode 82b coincides with the first common electrode 81a when viewed from the Z direction. Therefore, a potential difference is generated between the second individual electrode 82b and the first common electrode 81a. Furthermore, the width of the second individual electrode 82b in the Y direction is wider than the width of the second common electrode 81b in the Y direction.

[0107] like Figure 6 As shown, the lower surface meandering wiring 82c is connected to each of the first individual electrodes 82a on the lower surface of the actuator plate 54. The lower surface meandering wiring 82c extends in the X direction while connected to the +Y side end of each of the first individual electrodes 82a. The -X side end of the lower surface meandering wiring 82c extends until it coincides with the center of the partition wall 62b in the X direction when viewed from the Z direction.

[0108] like Figure 7 As shown, the upper surface meandering wiring 82d connects to the second individual electrode 82b on the upper surface of the actuator plate 54. The upper surface meandering wiring 82d extends from the +Y side end of the second individual electrode 82b toward the -X side. The -X side end of the upper surface meandering wiring 82d extends until it coincides with the central portion of the partition wall 62b in the X direction when viewed from the Z direction.

[0109] like Figure 4 , Figure 6 , Figure 7 As shown, the through wiring 82e connects the lower surface detour wiring 82c and the upper surface detour wiring 82d. The through wiring 82e is provided to pass through the actuator plate 54 in the Z direction. Specifically, a wiring through hole 92 is formed in the portion of the actuator plate 54 located on the -X side relative to the -X side individual electrode 82a2. In the first embodiment, the wiring through hole 92 is formed in the portion of the actuator plate 54 that coincides with the central portion of the partition wall 62b in the X direction when viewed from the Z direction. In the illustrated example, the length of the wiring through hole 92 in the Y direction is slightly longer than the -X side individual electrode 82a2 and shorter than the pressure chamber 61. However, the length of the wiring through hole 92 in the Y direction can be appropriately varied.

[0110] On the inner surface of the through-hole 92 for wiring, the through-wires 82e of adjacent pressure chambers 61 are formed in a separated state. In the following description, the through-wires 82e related to the drive wiring 64A will be explained. The through-wires 82e are formed on the inner surface of the through-hole 92, covering at least the entire area in the Z direction. The through-wires 82e are connected to the lower surface meandering wiring 82c at the lower opening edge of the through-hole 92, and to the upper surface meandering wiring 82d at the upper opening edge of the through-hole 92. In the illustrated example, the through-wires 82e corresponding to adjacent pressure chambers 61 are formed on opposite faces in the X direction on the inner surface of the through-hole 92. Therefore, the through-wires 82e corresponding to adjacent pressure chambers 61 are separated at their two ends in the Y direction within the through-hole 92.

[0111] like Figure 6 As shown, a separate connection wire 82f connects the through wire 82e and the individual pad 82g on the lower surface of the actuator board 54. Specifically, the separate connection wire 82f extends from the through wire 82e toward the +Y side. The -Y side end of the separate connection wire 82f connects to the through wire 82e at the lower opening edge of the wiring through hole 92. The +Y side end of the separate connection wire 82f terminates at a portion on the tail 65 located further toward the +Y side than the common pad 81g.

[0112] Individual connecting wires 82f of adjacent pressure chambers 61 are adjacent to each other in the X direction on the tail 65. Individual separation grooves 93 are formed in the portion of the tail 65 between the individual connecting wires 82f of adjacent pressure chambers 61. The individual separation grooves 93 extend through the tail 65 in the Z direction and open on the +Y side end face of the tail 65.

[0113] Individual pads 82g are formed on the lower surface of actuator board 54 in a portion located further to the +Y side than the common pad 81g. Individual pads 82g extend along the X direction on the lower surface of tail section 65. In tail section 65, a common separation groove 94 is formed in the portion located between the common pad 81g and the individual pad 82g. The common separation groove 94 extends along the X direction in tail section 65, for example, spanning the length of each pressure chamber 61.

[0114] Inner surface wiring 82h is formed on the inner surface of the individual separation groove 93. The inner surface wiring 82h of adjacent pressure chambers 61 are separated from each other within the individual separation groove 93. The Z-direction dimension of the inner surface wiring 82h is greater than the depth of the common separation groove 94. Therefore, the inner surface wiring 82h is continuous in the Y-direction across the common separation groove 94 on the inner surface of the individual separation groove 93. The portion of the inner surface wiring 82h located on the -Y side relative to the common separation groove 94 connects to the individual connection wiring 82f at the opening edge of the individual separation groove 93. The portion of the inner surface wiring 82h located on the +Y side relative to the common separation groove 94 connects to the individual connection wiring 82f (or individual pad 82g) at the opening edge of the individual separation groove 93.

[0115] The portion of each drive wiring 64 facing the flow path component 52 is covered by the first film 53. Specifically, a portion of the first common electrode 81a, the first individual electrode 82a, the lower surface meandering wirings 81c, 82c, the through wirings 81e, 82e, and the connecting wirings 81f, 82f in each drive wiring 64 is covered by the first film 53. On the other hand, the portions of the drive wiring 64 located on the lower surface of the tail 65 (common connecting wiring 81f, individual connecting wiring 82f, common pad 81g, and individual pad 82g) are exposed to the outside.

[0116] The portion of the drive wiring 64 formed on the upper surface of the actuator plate 54 is covered by the second film 55. Specifically, the second common electrode 81b, the second individual electrode 82b, the upper surface meandering wirings 81d, 82d, and the through wirings 81e, 82e in the drive wiring 64 are covered by the second film 55.

[0117] A flexible printed circuit board 95 is press-fitted onto the lower surface of the tail section 65. The flexible printed circuit board 95 is connected to a common pad 81g and an individual pad 82g on the lower surface of the tail section 65. The flexible printed circuit board 95 is led upward through the outside of the actuator plate 54. In addition, the common wiring 81 corresponding to the plurality of pressure chambers 61 is common on the flexible printed circuit board 95.

[0118] [Printer 1's Action Method] Next, the following will describe the case of using a printer 1 configured as described above to record text or graphics on a recording medium P.

[0119] Furthermore, as the initial state, in Figure 1 The four ink tanks 4 shown are each fully filled with ink of a different color. Furthermore, the ink in the ink tanks 4 is then filled into the inkjet head 5 via the ink circulation mechanism 6.

[0120] In this initial state, if printer 1 is activated, the recording medium P is clamped by rollers 11 and 12 of conveying mechanisms 2 and 3 and simultaneously conveyed to the +X side. Meanwhile, carriage 29 moves along the Y direction, causing the inkjet head 5 mounted on carriage 29 to reciprocate along the Y direction.

[0121] During the reciprocating movement of the inkjet head 5, ink is appropriately ejected from each inkjet head 5 to the recording medium P. This enables the recording of text or images on the recording medium P.

[0122] Hereinafter, the activities of each inkjet head 5 will be described in detail.

[0123] In the circulating side-ejection inkjet head 5 as in the first embodiment, firstly, make... Figure 2 The pressurizing pump 24 and suction pump 25 shown operate, thereby allowing ink to flow within the circulation path 23. In this case, the ink flowing through the ink supply pipe 21 is supplied to each pressure chamber 61 through the inlet common ink chamber 66 and the inlet slit 68. The ink supplied to each pressure chamber 61 flows through each pressure chamber 61 in the Y direction. Thereafter, after being discharged through the outlet slit 69 to the outlet common ink chamber 67, the ink returns to the ink tank 4 through the ink discharge pipe 22. Thus, the ink can be circulated between the inkjet head 5 and the ink tank 4.

[0124] Then, if via carriage 29 (refer to) Figure 1 The reciprocating movement of the inkjet head 5 is initiated by the movement of the inkjet head 5. A driving voltage is applied between the common electrodes 81a and 81b and the individual electrodes 82a and 82b via the flexible printed circuit board 95. At this time, the driving voltage is applied with the common electrodes 81a and 81b set to the reference potential GND and the individual electrodes 82a and 82b set to the driving potential Vdd.

[0125] Figure 8 This is an explanatory diagram used to illustrate the deformation behavior of the head chip 50 when it spits out ink.

[0126] like Figure 8 As shown, by applying a driving voltage, a potential difference is generated in the X direction between the first common electrode 81a and the first individual electrode 82a, and between the second common electrode 81b and the second individual electrode 82b. This potential difference in the X direction generates an electric field in the actuator plate 54 in a direction orthogonal to the polarization direction (Z direction). As a result, the actuator plate 54 undergoes thickness slip deformation in the Z direction through a shearing pattern. Specifically, on the lower surface of the actuator plate 54, between the first common electrode 81a and the first individual electrode 82a, an electric field is generated in a direction that approaches each other in the X direction (refer to arrow E1). On the upper surface of the actuator plate 54, between the second common electrode 81b and the second individual electrode 82b, an electric field is generated in a direction that separates each other in the X direction (refer to arrow E2). As a result, the portions of the actuator plate 54 corresponding to each pressure chamber 61 undergo shear deformation upwards from both ends in the X direction towards the center. On the other hand, a potential difference is generated in the Z direction between the first common electrode 81a and the second individual electrode 82b, and between the first individual electrode 82a and the second common electrode 81b. This potential difference along the Z direction generates an electric field in the actuator plate 54 in a direction parallel to the polarization direction (Z direction) (refer to arrow E0). As a result, the actuator plate 54 undergoes stretching deformation along the Z direction in a bending mode. That is, in the head chip 50 of the first embodiment, both the shearing and bending deformations of the actuator plate 54 affect the Z direction. Specifically, by applying a driving voltage, the actuator plate 54 deforms in a direction spaced apart from the pressure chamber 61. This causes the volume within the pressure chamber 61 to expand. Afterward, if the driving voltage is reduced to zero, the actuator plate 54 returns to its original state, and the volume within the pressure chamber 61 returns to its original state. During the return of the actuator plate 54, the pressure within the pressure chamber 61 increases, and the ink within the pressure chamber 61 is ejected to the outside through the nozzle orifice 71. The ink ejected externally hits the recording medium P, thereby recording printing information on the recording medium P.

[0127] <Manufacturing Method of Head Chip 50> Next, the manufacturing method of the aforementioned head chip 50 will be described. Figure 9 This is a flowchart illustrating the manufacturing method of the header chip 50. Figures 10 to 20 This is a process diagram illustrating the manufacturing method of the head chip 50, and is related to... Figure 4 The corresponding cross-sectional view. In the following description, for convenience, the case of chip-level manufacturing head chip 50 will be used as an example.

[0128] like Figure 9 As shown, the manufacturing method of the head chip 50 includes an actuator first processing step S01, a cover processing step S02, a first bonding step S03, a film processing step S04, an actuator second processing step S05, a second bonding step S06, a flow path component first processing step S07, a third bonding step S08, a flow path component second processing step S09, and a fourth bonding step S10.

[0129] like Figure 10 As shown, in the first processing step S01 of the actuator, firstly, slit recesses 100 and 101, which become part of slits 68 and 69, are formed on the actuator plate 54 (slit recess forming step). Specifically, a mask pattern for the opening of the forming area of ​​slits 68 and 69 is formed on the upper surface of the actuator plate 54. Next, the upper surface of the actuator plate 54 is sandblasted or otherwise processed using the mask pattern. As a result, slit recesses 100 and 101 that are recessed relative to the upper surface are formed on the actuator plate 54. Furthermore, the recesses 100 and 101 can also be formed by dicing, precision drilling, etching, or other methods. In addition, wiring through holes 91 and 92 and separate separation grooves 93 can also be formed simultaneously with the slit recesses 100 and 101.

[0130] Next, in the first processing step S01 of the actuator, the portion of the drive wiring 64 located on the upper surface of the actuator plate 54 is formed (upper surface wiring forming step). In the upper surface wiring forming step, firstly, a mask pattern for the opening of the forming area of ​​the drive wiring 64 is formed on the upper surface of the actuator plate 54. Next, as... Figure 11 As shown, through-holes 91 and 92 for wiring and individual separation grooves 93 are formed on the actuator plate 54. The through-holes 91 and 92 for wiring and the individual separation grooves 93 are formed by a dicing machine entering the actuator plate 54, for example, from the upper surface side. Next, electrode material is deposited on the actuator plate 54, for example, by vapor deposition. The electrode material is deposited on the actuator plate 54 using a mask pattern. Thus, drive wiring 64 is formed on the upper surface of the actuator plate 54, the inner surfaces of the through-holes 91 and 92 for wiring, and the inner surface of the individual separation grooves 93.

[0131] like Figure 12As shown, in the cover processing step S02, recesses 105 and 106 for slits are formed on the cover plate 56 to form part of the common ink chambers 66 and 67 and the slits 68 and 69. Specifically, a mask pattern is formed on the upper surface of the actuator plate 54 to partially open the forming areas of the common ink chambers 66 and 67. On the other hand, a mask pattern is formed on the lower surface of the actuator plate 54 to open the forming areas of the slits 68 and 69. Next, both sides of the actuator plate 54 are sandblasted or otherwise processed using the mask pattern. As a result, the common ink chambers 66 and 67 and the recesses 105 and 106 for slits are formed on the actuator plate 54.

[0132] like Figure 13 As shown in the diagram, in the first joining process S03, the second film 55 is adhered to the lower surface of the cover plate 56 by means of an adhesive or the like.

[0133] In membrane processing step S04, slit recesses 107 and 108 are formed on the second membrane 55 to become part of slits 68 and 69. Slit recesses 107 and 108 can be formed by, for example, laser processing, on portions of the second membrane 55 that overlap with corresponding slit recesses 105 and 106 when viewed from the Z direction. Thus, slit recesses 105 and 107 are interconnected with each other, and slit recesses 106 and 108 are interconnected with each other.

[0134] like Figure 14 As shown in the diagram, in the second bonding process S06, the actuator plate 54 is bonded to the lower surface of the second membrane 55 using an adhesive or the like.

[0135] like Figure 15 As shown, in the second machining step S05 of the actuator, the lower surface of the actuator plate 54 is ground (grinding step). At this time, the lower surface of the actuator plate 54 is ground until the positions of the wiring through holes 91, 92 and the individual separation groove 93 are opened.

[0136] Next, in the second processing step S05 of the actuator, the portion of the drive wiring 64 located on the lower surface of the actuator plate 54 is formed (lower surface wiring formation step). In the lower surface wiring formation step, firstly, a mask pattern for the opening of the forming area of ​​the drive wiring 64 is formed on the lower surface of the actuator plate 54. Next, electrode material is deposited relative to the actuator plate 54, for example, by vapor deposition. The electrode material is deposited on the actuator plate 54 through the mask pattern. As a result, drive wiring 64 is formed on the upper surface of the actuator plate 54, the inner surface of the wiring through holes 91 and 92, and the inner surface of the individual separation groove 93.

[0137] like Figure 16As shown, in the second processing step S05 of the actuator, a common separation groove 94 is formed at the tail 65. The common separation groove 94 is formed by bringing the dicing machine into the actuator plate 54, for example, from the lower surface side.

[0138] like Figure 17 As shown in the diagram, in the second bonding process S06, the first membrane 53 is adhered to the lower surface of the actuator plate 54 by means of an adhesive or the like.

[0139] like Figure 18 As shown, in the first processing step S07 of the flow path component, a pressure chamber 61 is formed on the flow path component 52. Specifically, this is done by having a dicing machine enter the flow path component 52, for example, from its upper surface.

[0140] like Figure 19 As shown in the diagram, in the third bonding process S08, the flow path component 52 is bonded to the lower surface of the first membrane 53 by means of an adhesive or the like.

[0141] like Figure 20 As shown, in the second processing step S09 of the flow path component, grinding is performed on the lower surface of the flow path component 52 (grinding step). At this time, the flow path component 52 is ground on the lower surface until the pressure chamber 61 opens.

[0142] In the fourth joining process S10, the nozzle plate 51 is attached to the lower surface of the flow path component 52 while the nozzle orifice 71 is aligned with the pressure chamber 61.

[0143] Through the above, head chip 50 is completed.

[0144] In the first embodiment, the device comprises: a first common electrode (first electrode, drive electrode) 81a, which is disposed on the lower surface (first surface) of the actuator plate 54 and coincides with the pressure chamber 61 when viewed from the Z direction (first direction); a first individual electrode 82a (second electrode, drive electrode), which is disposed on the lower surface of the actuator plate 54 adjacent to the first common electrode 81a and generates a potential difference with the first common electrode 81a; and a second individual electrode 82b (first opposing electrode, drive electrode), which is disposed on the upper surface (second surface) of the actuator plate 54 at a position facing the first common electrode 81a and generates a potential difference with the first common electrode 81a.

[0145] Based on this configuration, by generating a potential difference between the first common electrode 81a and the first individual electrode 82a, an electric field can be generated in the direction (X direction) intersecting the polarization direction of the actuator plate 54. Therefore, by deforming the actuator plate 54 in a shear mode (top-jet type) along the Z direction, the volume of the pressure chamber 61 can be changed.

[0146] Furthermore, in the first embodiment, an electric field can also be generated along the polarization direction of the actuator plate 54 by generating a potential difference between the first common electrode 81a and the second individual electrode 82b. Therefore, by deforming the actuator plate 54 in a bending mode (dual piezoelectric wafer type) along the Z direction, the volume of the pressure chamber 61 can be changed.

[0147] Thus, by utilizing both shearing and bending drive modes to deform the actuator plate 54 along the Z direction, the pressure generated in the pressure chamber 61 can be increased, thereby saving power. Furthermore, in the first embodiment, by employing a top-firing head chip 50 in the shearing mode, unlike the wall-bending head chip, the pressure chamber 61 can be formed in a component (flow path component 52) ​​different from the actuator plate 54. Therefore, even if the adhesion between the first membrane 53 and the flow path component 52 is insufficient, the top-firing head chip 50 can suppress ink adhesion to the wirings 81, 82 within the pressure chamber 61. As a result, the top-firing head chip 50 exhibits improved durability compared to the wall-bending head chip.

[0148] Specifically, in the first embodiment, the second individual electrode 82b and the first common electrode 81a are respectively provided, and thus the second individual electrode 82b is provided spaced apart on the upper surface of the actuator plate 54. Therefore, compared to the case where the second individual electrode 82b is formed over the entire area of ​​the upper surface of the actuator plate 54, the electrostatic capacitance of the actuator plate can be reduced. As a result, the responsiveness of the actuator plate 54 can be improved, and heat generation on the actuator plate 54 can also be suppressed.

[0149] The head chip 50 of the first embodiment includes a second common electrode (second opposing electrode, driving electrode) 81b disposed on the upper surface of the actuator plate 54 facing the first individual electrode 82a and adjacent to the second individual electrode 82b. The second common electrode 81b is configured to generate a potential difference in the Z direction with the first individual electrode 82a and a potential difference in the X direction with the second individual electrode 82b.

[0150] According to this configuration, the second common electrode 81b and the second individual electrode 82b are arranged adjacent to each other on the upper surface of the actuator plate 54. Therefore, the actuator plate 54 can be deformed in a shearing mode by utilizing the potential difference generated between the second common electrode 81b and the second individual electrode 82b.

[0151] Furthermore, the actuator plate 54 can be deformed in a bending mode by utilizing the potential difference generated between the first individual electrode 82a and the second common electrode 81b. As a result, it is possible to further increase the pressure generated and reduce power consumption.

[0152] In the first embodiment, the first individual electrode 82a is configured to be disposed as a whole at a position that coincides with the partition wall 62 when viewed from the Z direction.

[0153] Based on this configuration, the first individual electrode 82a is not formed on the lower surface of the actuator plate 54 facing the pressure chamber 61, thus easily ensuring the area of ​​the electrode (first common electrode 81a) formed on the portion facing the pressure chamber 61. As a result, it is easy to ensure that the electric field generated in the actuator plate 54 due to the first common electrode 81a easily increases the pressure generated in the pressure chamber 61.

[0154] Furthermore, the first individual electrode 82a is not formed on the portion of the lower surface of the actuator plate 54 facing the pressure chamber 61. Therefore, when the portion of the actuator plate 54 facing the pressure chamber 61 deforms, the deformation of the actuator plate 54 can be prevented from being hindered by the first individual electrode 82a. That is, the starting point of the deformation of the actuator plate 54 can be extended to the boundary portion between the actuator plate 54 and the partition wall 62, thereby ensuring the amount of deformation of the actuator plate 54 and increasing the generated pressure.

[0155] In the first embodiment, the second common electrode 81b is configured such that a portion of it is positioned opposite the first individual electrode 82a at a position that coincides with the partition wall 62 when viewed from the Z direction, and the remaining portion is positioned opposite the pressure chamber 61.

[0156] According to this configuration, in the second common electrode 81b, with a portion facing the first individual electrode 82a, the remaining portion extends until it coincides with the pressure chamber 61. Therefore, when the actuator plate 54 deforms in a bending mode, the portion of the actuator plate 54 facing the pressure chamber 61 can effectively generate an electric field in the actuator plate 54 caused by the potential difference between the second common electrode 81b and the first individual electrode 82a. Furthermore, by bringing the second common electrode 81b and the second individual electrode 82b close to each other, when the actuator plate 54 deforms in a shearing mode, the portion of the actuator plate 54 facing the pressure chamber 61 can effectively generate an electric field in the actuator plate 54 caused by the potential difference between the second common electrode 81b and the second individual electrode 82b.

[0157] As a result, the actuator plate 54 can be deformed efficiently.

[0158] In the first embodiment, the first common electrode 81a and the second individual electrode 82b are configured to be positioned facing the pressure chamber 61 in the Z direction.

[0159] According to this configuration, when the actuator plate 54 deforms in a bending mode, the portion of the actuator plate 54 facing the pressure chamber 61 can effectively generate an electric field in the actuator plate 54 caused by the potential difference between the first common electrode 81a and the second individual electrode 82b. Therefore, the actuator plate 54 can be deformed efficiently.

[0160] In the first embodiment, the configuration is as follows: on the side that sandwiches the actuator plate 54 and is opposite to the flow path member 52, a cover plate 56 (restricting member) is stacked to restrict the displacement of the actuator plate 54 in the Z direction on the side opposite to the flow path member 52.

[0161] Based on this configuration, the cover plate 56 can limit the upward displacement of the actuator plate 54 by the resistance (flexibility) of the ink acting on the actuator plate 54 due to factors such as the pressure of the ink in the pressure chamber 61. Therefore, the deformation of the actuator plate 54 can be effectively transmitted towards the pressure chamber 61. As a result, the pressure generated in the pressure chamber 61 during the deformation of the actuator plate 54 can be increased, thereby achieving energy savings.

[0162] The inkjet head 5 and printer 1 according to the first embodiment are equipped with the above-described head chip 50, thus providing an energy-saving and high-performance inkjet head 5 and printer 1.

[0163] (Second Implementation) Figure 21 This is a bottom view of the actuator plate 54 according to the second embodiment. Figure 22 This is a top view of the actuator board 54 according to the second embodiment. In the second embodiment, the layout of the drive wiring 64 differs from that in the first embodiment described above.

[0164] exist Figure 21 In the head chip 50 shown, the common wiring 81 corresponding to each pressure chamber 61 is shared with each other on the actuator board 54. Specifically, the lower surface meandering wiring 81c corresponding to each pressure chamber 61 is interconnected on the -Y side of the first common electrode 81a. On the other hand, as Figure 22 As shown, the upper surface meandering wiring 81d corresponding to each pressure chamber 61 is interconnected on the -Y side of the second common electrode 81b.

[0165] Furthermore, in the first embodiment described above, the configuration in which a separate separation groove 93 or a common separation groove 94 is formed at the tail 65 has been explained, but this configuration is not limited to. As long as insulation between the common wiring 81 and the separate wiring 82 is sought, the separate separation groove 93 or the common separation groove 94 may not be provided. In this case, for example, the connecting wirings 81f and 82f may be separated by laser processing or the like after the lower surface wiring formation process.

[0166] (Third Implementation) Figure 23 This is a cross-sectional view of the head chip 50 according to the third embodiment. In the third embodiment, the point where the flexible printed circuit board 95 is led out from the upper surface of the tail portion 65 differs from the embodiments described above.

[0167] exist Figure 23 In the head chip 50 shown, the nozzle plate 51, flow path component 52, first membrane 53, and actuator plate 54 protrude towards the +Y side relative to the second membrane 55 and cover plate 56. The portions of the nozzle plate 51, flow path component 52, first membrane 53, and actuator plate 54 that protrude towards the +Y side relative to the cover plate 56 constitute the tail portion 65 of the third embodiment. Furthermore, the drive wiring 64 can be configured in the same way as in the first or second embodiment, except that the connection wiring 81f, 82f or pads 81g, 82g are formed on the upper surface of the actuator plate 54.

[0168] A flexible printed circuit board 95 is press-fitted onto the upper surface of the tail portion 65. The flexible printed circuit board 95 is connected to a common pad 81g and a separate pad 82g on the upper surface of the tail portion 65. The flexible printed circuit board 95 is extended upward from the upper surface of the tail portion 65.

[0169] In the third embodiment, the flexible printed circuit board 95 can be extended upwards towards the tail 65. Therefore, compared to the case where the flexible printed circuit board 95 is wound around to the side of the head chip 50 and then extended upwards, the spacing between adjacent head chips 50 (between the nozzle holes 71) can be narrowed when multiple head chips 50 are arranged side by side. As a result, miniaturization of the inkjet head 5 can be achieved.

[0170] (Fourth implementation) In the above embodiment, the following configuration is described: on the lower surface of the actuator plate 54, a first common electrode 81a is disposed facing the corresponding pressure chamber 61, and a first individual electrode 82a is disposed facing the partition wall 62.

[0171] In contrast, in the fourth embodiment, such as Figure 24 As shown, on the lower surface of the actuator plate 54, a first individual electrode 82a is disposed facing the corresponding pressure chamber 61, and a first common electrode 81a is disposed facing the partition wall 62. That is, on the lower surface of the actuator plate 54, the first individual electrode 82a and the first common electrode 81a are disposed adjacent to each other.

[0172] On the other hand, on the upper surface of the actuator plate 54, a second common electrode 81b is disposed facing the corresponding pressure chamber 61, and a second individual electrode 82b is disposed facing the partition wall 62. That is, on the upper surface of the actuator plate 54, the second individual electrode 82b and the second common electrode 81b are disposed adjacent to each other. In addition, the first individual electrode 82a and the second common electrode 81b face each other along the Z direction when they coincide with the pressure chamber 61 when viewed from the Z direction. The first common electrode 81a and the second individual electrode 82b face each other along the Z direction when they coincide with the partition wall 62 when viewed from the Z direction. Furthermore, in the fourth embodiment, the detour of the wiring between the electrodes 81a, 81b, 82a, 82b and the pads 81g, 82g can be achieved, for example, by appropriately modifying the configuration of the first embodiment described above.

[0173] (Other variations) Furthermore, the scope of this disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of this disclosure.

[0174] For example, in the above embodiments, an inkjet printer 1 is illustrated as an example of a liquid jet recording device, but it is not limited to a printer. For example, it could also be a fax machine or an on-demand printer.

[0175] In the above embodiments, a configuration in which the inkjet head moves relative to the recorded medium during printing (a so-called reciprocating machine) has been described as an example, but it is not limited to this configuration. The configuration involved in this disclosure can also be adopted in a configuration in which the recorded medium moves relative to the inkjet head while the inkjet head is fixed (a so-called fixed-head machine).

[0176] In the above embodiments, the case where the recording medium P is paper has been described, but the configuration is not limited to this. The recording medium P is not limited to paper, but may also be a metal material, a resin material, or even food, etc.

[0177] In the above embodiments, the configuration of the liquid jet head mounted on the liquid jet recording device has been described, but the configuration is not limited to this. That is, the liquid jetted from the liquid jet head is not limited to the liquid hitting the recording medium, but may also be, for example, a medicine liquid prepared in a dispensing solution, or a food additive such as seasonings or spices added to food, or a fragrance sprayed into the air.

[0178] In the above embodiments, a configuration in which the Z direction is aligned with the direction of gravity has been described, but it is not limited to this configuration; the Z direction may also be aligned with the horizontal direction.

[0179] In the above embodiment, a circulating side-ejection type head chip 50 has been described as an example, but the configuration is not limited to this. The head chip can also be a so-called side-ejection type that ejects ink from the end of the pressure chamber 61 in the extension direction (Y direction).

[0180] In the above embodiment, the case where a potential difference is generated between each electrode formed on one side of the actuator plate 54 and each electrode formed on the other side has been described, but the configuration is not limited to this. For example, it is also possible to... Figure 25 As shown in the diagram, the configuration is as follows: a first common electrode 81a and a first individual electrode 82a are formed on the lower surface (first surface) of the actuator plate 54; on the other hand, only a second individual electrode 82b is formed on the upper surface (second surface) of the actuator plate 54, facing the first common electrode 81a. Alternatively, it can be configured as follows... Figure 26 As shown in the diagram, the configuration is as follows: a second common electrode 81b and a second individual electrode 82b are formed on the upper surface (first surface) of the actuator plate 54, while on the lower surface (second surface) of the actuator plate 54, only the first common electrode 81a is formed at a position opposite to the second individual electrode 82b.

[0181] Furthermore, in the above-mentioned Figure 25 The configuration shown illustrates a arrangement where the common electrode and individual electrodes face each other, at least at a position coinciding with the pressure chamber 61 when viewed from the Z direction, but is not limited to this configuration. For example, it could also be as follows: Figure 27 As shown, the configuration is as follows: on the lower surface of the actuator plate 54, with the first common electrode 81a and the first individual electrode 82a side by side, the first individual electrode 82a and the second common electrode 81b face each other only at the position where they face each other through the partition wall 62.

[0182] In the above-described embodiment, ink is ejected by deforming the actuator plate 54 in the direction of expanding the volume of the pressure chamber 61 by applying a voltage, and then restoring the actuator plate 54 to its original state (so-called pull ejection), but this configuration is not limited to this one. The head chip involved in this disclosure can also be ejected by deforming the actuator plate 54 in the direction of decreasing the volume of the pressure chamber 61 by applying a voltage (so-called push ejection). In the case of push ejection, by applying a driving voltage, the actuator plate 54 is deformed in a manner that bulges outward toward the pressure chamber 61. As a result, the volume inside the pressure chamber 61 decreases, thereby increasing the pressure inside the pressure chamber 61, and the ink inside the pressure chamber 61 is ejected to the outside through the nozzle orifice 71. If the driving voltage is reduced to zero, the actuator plate 54 returns to its original state. As a result, the volume inside the pressure chamber 61 returns to its original state. Furthermore, the push ejection head chip can be implemented by setting either the polarization direction of the actuator plate 54 or the orientation of the electric field (the arrangement of the common electrode and individual electrodes) to be opposite to that of the pull ejection head chip.

[0183] In the above embodiment, the configuration in which the electrodes on both sides of the actuator plate 54 are connected to each other via through wirings 81e and 82e has been described, but the configuration is not limited to this. The connection between the electrodes on both sides of the actuator plate 54 can be appropriately modified. For example, the electrodes on both sides of the actuator plate 54 can also be connected to each other via the side surface of the actuator plate 54, etc.

[0184] Furthermore, without departing from the spirit of this disclosure, the constituent elements of the above-described embodiments can be appropriately replaced with well-known constituent elements, and the various modifications described above can also be appropriately combined.

[0185] Symbol Explanation 1: Printer (Liquid Jet Recording Device) 5: Inkjet head (liquid jet head) 50: Head chip 52: Flow path components 54: Actuator plate 56: Cover plate (restricting component) 61: Pressure Chamber 62: Partition wall 62a: partition wall 62b: Partition wall 81a: First common electrode (driving electrode, first electrode, second electrode) 81b: Second common electrode (driving electrode, second opposing electrode, first opposing electrode) 82a: First individual electrode (driving electrode, second electrode, first electrode) 82b: Second separate electrode (driving electrode, first opposing electrode, second opposing electrode).

Claims

1. A head chip, comprising: A flow path component in which multiple pressure chambers containing liquid are arranged in a state separated by partition walls; An actuator plate is stacked on the flow path component in a state of facing each other relative to the pressure chamber along a first direction, and the first direction is the polarization direction; as well as The driving electrodes are respectively formed on a first surface of the actuator plate facing a first direction and a second surface facing a second side opposite to the first direction, and the actuator plate is deformed along the first direction to change the volume of the pressure chamber. The driving electrode has: The first electrode is disposed in the first surface of the actuator plate, which is arranged relative to the pressure chamber or the partition wall when viewed from the first direction. The second electrode is disposed adjacent to the first electrode on the first surface of the actuator plate, and generates a potential difference between the second electrode and the first electrode. as well as The first opposing electrode is disposed on the second surface of the actuator plate at a position opposite to the first electrode, thereby generating a potential difference between the first electrode and the first electrode. The driving electrode includes a second counter electrode disposed on the second surface facing the second electrode and adjacent to the first counter electrode. The second counter electrode generates a potential difference with the first electrode along the first direction, and also generates a potential difference with the first counter electrode in a direction intersecting the first direction. The first surface of the actuator plate is arranged facing the flow path component in the first direction. The second electrode, viewed from the first direction, is positioned to coincide with the partition wall.

2. The head chip according to claim 1, wherein, In the second opposing electrode, a portion is positioned opposite to the second electrode at a location that coincides with the partition wall when viewed from the first direction, and the remaining portion is positioned at a location that coincides with the pressure chamber when viewed from the first direction.

3. The head chip according to claim 1, wherein, The first electrode and the first opposing electrode are disposed together in a position facing the pressure chamber in the first direction.

4. The head chip according to claim 1, wherein, In the first direction, on the side that clamps the actuator plate and is opposite to the flow path component, a limiting member is stacked to restrict the displacement of the actuator plate in the first direction opposite to the flow path component.

5. A liquid injection head, in, It has a head chip according to any one of claims 1 to 4.

6. A liquid jet recording device, wherein, It is equipped with the liquid injection head according to claim 5.

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