一种微结构及其制备方法与应用
By employing a combination of thermoplastic materials and molds in the fabrication of microstructures for flexible pressure sensors, the problems of low microstructure molding efficiency and high cost have been solved, achieving efficient and low-cost microstructure fabrication suitable for flexible pressure sensor applications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGCHUN INSTITUTE OF APPLIED CHEMISTRY CHINESE ACADEMY OF SCIENCES
- Filing Date
- 2023-03-29
- Publication Date
- 2026-07-17
AI Technical Summary
Existing flexible pressure sensors based on microstructure principles suffer from low microstructure molding efficiency and high process costs.
A microstructure preparation method is adopted, which includes spreading an adhesive on the bottom of the lower mold and heating it to level it, adding powder and heating it under pressure, removing the powder layer after cooling, and forming a uniform microstructure by combining thermoplastic material and mold.
It improves the molding process efficiency of microstructures, reduces costs, and ensures the uniformity and durability of microstructures, making it suitable for linearity control of the mechanical and electrical parameters of flexible pressure sensors.
Smart Images

Figure CN116281845B_ABST