A plating device for wire or film material

Abstract

This invention provides an electroplating apparatus for wire or film materials, comprising an electroplating tank, a conveying device, an internal circulation device, an external circulation suction device, an external conveying device, and an electrolyte spraying device. The material to be electroplated is driven onto the conveying device. The internal circulation device includes a jet pump and an internal circulation suction device, while the external conveying device includes a suction pump and an external conveying pipe. The electrolyte is sprayed onto the material to be electroplated through the internal circulation suction device and the jet pump, forming an internal circulation. Under the action of the suction pump, the electrolyte is sequentially sprayed onto the material to be electroplated through the external circulation suction device, the external conveying pipe, and the electrolyte spraying device, forming an external circulation. This invention, through the external conveying device and the internal circulation device, forms a dual-circulation method of flow plating and jet plating, which can uniformly deposit a metal coating on the surface of wire or film materials, effectively improving the deposition efficiency of wire and film materials in the electroplating production process. It can be applied to industrial production lines for wire and film materials.

Description

Technical fields:

[0001] This invention belongs to the field of electroplating technology, specifically relating to an electroplating apparatus for wire or thin film materials. Background technology:

[0002] Electroplating is a relatively low-cost technology that uses an external electric field to cause metal cations in an electrolyte to move, gain electrons at the cathode surface, and thus be reduced to elemental metal to form a metal coating. Electroplating is an electrochemical method of metal preparation and one of the oldest methods for preparing nanostructured materials, characterized by low cost, low power consumption, and mature technology. The earliest record of electrochemical deposition dates back to 1800 when Italian scientists invented the voltaic pile, subsequently enabling the preparation of metal coatings through electroplating. With advancements in technology, electrochemical deposition has made significant progress, enabling the preparation of metals and composite materials with complex compositions and unique structures.

[0003] Currently, the most widespread application of electroplating technology is in the field of metal coating preparation. Due to its simple operation, low cost, high coating aesthetics, and excellent coating microstructure, it is widely used for surface protection and aesthetic enhancement of parts. At the same time, after a long period of development, electroplating technology has gradually evolved from preparing protective and decorative coatings to various functional coatings, and now plays an important role in emerging technology fields such as semiconductors, energy storage batteries, and microelectromechanical systems.

[0004] In emerging technology fields such as semiconductors and electromechanical systems, specialty wires and thin films serve as crucial raw materials with irreplaceable applications. However, current electroplating processes for wires and thin films are complex, inefficient, and produce suboptimal quality. Therefore, this invention provides a device that significantly improves the electroplating efficiency of wires and thin films, applicable to industrial production lines that functionalize and protect the surfaces of these materials. Summary of the Invention:

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing an electroplating apparatus for wire or film materials. Through an internal and external dual circulation system of flow plating and spray plating, a metal coating is efficiently deposited on the surface of wire or film materials, thereby achieving the functionalization of wire or film.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An electroplating apparatus for wire or film materials includes an electroplating tank, a conveying device, an external conveying device, and an electrolyte spraying device. The conveying device carries a material to be electroplated, which serves as the cathode electrode and moves within the electroplating tank. An electrolyte is contained within the electroplating tank. The external conveying device is installed outside the electroplating tank, with its inlet connected to the outlet of the tank and its outlet connected to the electrolyte spraying device. The electrolyte spraying device is positioned above the material to be electroplated, with its spray nozzle inserted below the electrolyte surface. An anode electrode is located within the electrolyte spraying device. The electrolyte in the electroplating tank is conveyed to the electrolyte spraying device via the external conveying device and sprayed onto the material to be electroplated, depositing a metal coating on its surface as the material moves.

[0008] Furthermore, the electroplating tank is also equipped with an internal circulation device; the internal circulation device includes a jet pump and an internal circulation suction device; the jet pump is located above the material to be electroplated, and the jet pump's spray direction is opposite to the moving direction of the material to be electroplated; the suction port of the internal circulation suction device is located below the material to be electroplated, and the outlet is connected to the jet pump; the electrolyte below the material to be electroplated is sprayed onto the material to be electroplated through the internal circulation suction device and the jet pump, forming an internal circulation of the electrolyte.

[0009] Furthermore, the external conveying device includes a suction pump and an external conveying pipe; an external circulation suction device is installed inside the electroplating tank, located below the material to be electroplated, with the suction direction consistent with the movement direction of the material to be electroplated, and the output end of the external circulation suction device is connected to the outlet of the electroplating tank; one end of the external conveying pipe is connected to the outlet of the electroplating tank, and the other end is connected to the electrolyte spraying device; under the action of the suction pump, the electrolyte below the material to be electroplated is sequentially sprayed through the external circulation suction device, the external conveying pipe, and the electrolyte spraying device to the top of the material to be electroplated, forming an external circulation of the electrolyte.

[0010] Furthermore, the electrolyte spraying device is inclined, and its inclination direction is opposite to the movement direction of the material to be electroplated.

[0011] Furthermore, one or more electrolyte spraying devices are provided; when multiple electrolyte spraying devices are provided, each electrolyte spraying device is uniformly arranged along the moving direction of the material to be electroplated.

[0012] Furthermore, both the internal circulation suction device and the external circulation suction device are hollow tubes or hollow plates, and the hollow tubes or hollow plates are provided with a number of through holes.

[0013] Furthermore, the external circulation suction device is horizontally distributed below the material to be electroplated; the suction port of the internal circulation suction device is connected to the external circulation suction device.

[0014] Furthermore, the conveying device includes a first input roller, a second input roller, a first output roller, and a second output roller; the first input roller and the first output roller are located at opposite ends of the electroplating tank, below the electrolyte surface; the second input roller and the second output roller are located above the electroplating tank, on opposite sides of the electroplating tank.

[0015] Furthermore, the material to be electroplated is a flexible material such as a wire or a film, specifically a metal wire, a cotton thread that has been treated to conduct electricity, or a functional film.

[0016] Furthermore, the material to be electroplated is horizontally distributed.

[0017] The beneficial effects of this invention are:

[0018] (1) The present invention enables the material to be electroplated to move at a certain speed in the electroplating tank by setting a conveying device, while realizing the external circulation of electrolyte by an external conveying device, and spraying electrolyte onto the material to be electroplated by one or more sets of electrolyte spraying devices, thereby achieving efficient and continuous electroplating of wire or film materials.

[0019] (2) The present invention also provides an internal circulation device, which forms a double circulation method of flow plating and spray plating with the external conveying device. It can uniformly deposit a metal coating on the surface of wire or film material, realize the functionalization of wire or film, and achieve high-efficiency electroplating while ensuring electroplating quality.

[0020] (3) The device of the present invention is reasonably designed, simple in structure and easy to operate. It effectively improves the deposition efficiency of wire and film materials in the electroplating production process and can be applied to the industrial production line of wire and film. It is highly practical. Attached image description:

[0021] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;

[0022] The labels in the attached diagram are:

[0023] 1. Conveying device; 1-1. First input roller; 1-2. Second input roller; 1-3. First output roller; 1-4. Second output roller; 2. Material to be electroplated; 3. Electroplating tank; 4. Jet pump; 5. Electrolyte circulation trajectory in the electroplating tank; 6. External circulation suction device; 7. Suction pump; 8. External conveying device; 9. Electrolyte spraying device; 10. Anode electrode; 11. Internal circulation suction device; 12. External conveying pipe. Detailed implementation method:

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Example 1

[0026] Reference Figure 1 This invention provides an electroplating apparatus for wire or film materials, including an electroplating tank 3, a conveying device 1, an external conveying device 8, and an electrolyte spraying device 9. A material to be electroplated 2 is driven onto the conveying device 1 and is horizontally distributed. The material to be electroplated 2 serves as a cathode electrode and moves within the electroplating tank 3 via the conveying device 1. The electroplating tank 3 contains an electrolyte. The external conveying device 8 is installed outside the electroplating tank 3, with its inlet end connected to the outlet of the electroplating tank 3 and its outlet end connected to the electrolyte spraying device 9. The electrolyte spraying device 9 is positioned above the material to be electroplated 2, with its spray head inserted below the electrolyte surface. An anode electrode 10 is disposed within the electrolyte spraying device 9 and connected to an external circuit and power supply. The electrolyte in the electroplating tank 3 is conveyed to the electrolyte spraying device 9 via the external conveying device 8 and sprayed onto the material to be electroplated 2. As the material to be electroplated 2 moves, a metal coating is deposited on its surface.

[0027] In this embodiment, three electrolyte spraying devices 9 are provided, and the three electrolyte spraying devices 9 are evenly arranged along the moving direction of the material to be electroplated 2. The electrolyte spraying devices 9 are inclined, and their inclination direction is opposite to the moving direction of the material to be electroplated 2. The external circulating electrolyte is sprayed onto the surface of the wire or film at a certain angle through the electrolyte spraying devices 9, and the spraying direction is opposite to the conveying direction of the wire or film.

[0028] Example 2

[0029] The main structure of Example 2 is roughly the same as that of Example 1, except that: in this example, an internal circulation device is also provided in the electroplating tank 3.

[0030] Specifically, refer to Figure 1In this embodiment, an internal circulation device is also provided in the electroplating tank 3; the internal circulation device includes a jet pump 4 and an internal circulation suction device 11; the jet pump 4 is located above the material to be electroplated 2, and the jet direction of the jet pump 4 is opposite to the moving direction of the material to be electroplated 2; the suction port of the internal circulation suction device 11 is located below the material to be electroplated 2, and the outlet is connected to the jet pump 4; the electrolyte below the material to be electroplated 2 is sprayed onto the material to be electroplated 2 through the internal circulation suction device 11 and the jet pump 4, forming an internal circulation of the electrolyte.

[0031] Example 3

[0032] The main structure of Embodiment 3 is roughly the same as that of Embodiment 2, except that the structure of the external conveying device 8 is limited in this embodiment.

[0033] Specifically, refer to Figure 1 In this embodiment, the external conveying device 8 includes a suction pump 7 and an external conveying pipe 12; an external circulation suction device 6 is provided in the electroplating tank 3, the external circulation suction device 6 is located below the material to be electroplated 2, the suction direction is consistent with the moving direction of the material to be electroplated 2, and the output end of the external circulation suction device 6 is connected to the outlet of the electroplating tank 3; one end of the external conveying pipe 12 is connected to the outlet of the electroplating tank 3, and the other end is connected to the electrolyte spraying device 9; under the action of the suction pump 7, the electrolyte below the material to be electroplated 2 is sequentially sprayed through the external circulation suction device 6, the external conveying pipe 12 and the electrolyte spraying device 9 to the top of the material to be electroplated 2, forming an external circulation of the electrolyte.

[0034] Example 4

[0035] The main structure of Embodiment 4 is roughly the same as that of Embodiment 3, except that the structure of the internal circulation suction device 11, the external circulation suction device 6, and the conveying device 1 is defined in this embodiment.

[0036] Specifically, refer to Figure 1 In this embodiment, both the internal circulation suction device 11 and the external circulation suction device 6 are hollow tubes with several through holes for drawing electrolyte. In this embodiment, the external circulation suction device 6 is horizontally distributed below the material to be electroplated 2, and the suction port of the internal circulation suction device 11 is connected to the external circulation suction device 6. The internal circulation suction device 11 and the external circulation suction device 6 are integrated into one unit. After the electroplating liquid below the material to be electroplated 2 enters the external circulation suction device 6, part of it enters the external delivery pipe 12 for external circulation, and the other part is internally circulated through the internal circulation suction device 11 and the jet pump 4.

[0037] In this embodiment, the conveying device 1 includes a first input roller 1-1, a second input roller 1-2, a first output roller 1-3, and a second output roller 1-4; the first input roller 1-1 and the first output roller 1-3 are located at opposite ends of the electroplating tank 3, below the electrolyte surface; the second input roller 1-2 and the second output roller 1-4 are located above the electroplating tank 3, on opposite sides of the electroplating tank 3.

[0038] Example 5

[0039] The electroplating apparatus described in Example 4 is applied to the electroplating of copper wires or organic thin films. Both the copper wires and organic thin films require pretreatment before electroplating. The pretreatment of the copper wires includes impurity removal, contamination removal, and cleaning. The pretreatment of the organic thin films involves surface conductivity enhancement using magnetron sputtering equipment, followed by impurity removal, contamination removal, and cleaning before entering the electroplating bath.

[0040] The specific process flow is as follows:

[0041] 1) The copper wire or organic film is immersed into the electroplating tank 3 through the conveying device 1, and the electrolyte in the electroplating tank 3 is prepared according to the production requirements.

[0042] 2) Set the flow rate of the jet pump 4 and the temperature of the electroplating tank 3;

[0043] 3) Set the tilt angle, nozzle flow rate, and anode electrical parameters of the electrolyte spraying device 9;

[0044] 4) The copper wire or organic film is conveyed at a certain speed by the conveying device 1. The conveying speed can be adjusted appropriately according to the combined effect of flow plating and electro-spray plating, so as to achieve efficient electroplating on the surface of copper wire or organic film.

[0045] This invention achieves internal and external circulation of the electrolyte by setting up an external conveying device and an internal circulation device, forming a dual circulation method of flow plating and spray plating. The electrolyte spraying device creates a certain current field below the nozzle, which can improve the electroplating efficiency within the current field and uniformly deposit a metal coating on the surface of wire or film materials, realizing the functionalization of wires or films. The device of this invention has a reasonable design, simple structure, and convenient operation, effectively improving the deposition efficiency of wires and films in the electroplating production process. It can be applied to industrial assembly line production of wires and films and has strong practicality.

[0046] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions that fall within the scope of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of the present invention should be considered within the scope of protection of the present invention.

Claims

1. An electroplating apparatus for wire or film materials, characterized in that, It includes an electroplating tank (3), a conveying device (1), an external conveying device (8), and an electrolyte spraying device (9). The conveying device (1) is equipped with a material to be electroplated (2), which serves as a cathode electrode and moves within the electroplating tank (3) via the conveying device (1). The electroplating tank (3) is equipped with an electrolyte. The external conveying device (8) is installed outside the electroplating tank (3), with its inlet end connected to the outlet of the electroplating tank (3) and its outlet end connected to the electrolyte spraying device (9); the electrolyte spraying device (9) is distributed above the material to be electroplated (2), with its spray head inserted below the electrolyte surface, and an anode electrode (10) is provided inside the electrolyte spraying device (9). The electrolyte in the electroplating tank (3) is transported to the electrolyte spraying device (9) through the external conveying device (8) and sprayed onto the material to be electroplated (2). As the material to be electroplated (2) moves, a metal coating is deposited on its surface. The electroplating tank (3) is also equipped with an internal circulation device; the internal circulation device includes a jet pump (4) and an internal circulation suction device (11); the jet pump (4) is located above the material to be electroplated (2), and the jet direction of the jet pump (4) is opposite to the moving direction of the material to be electroplated (2); the suction port of the internal circulation suction device (11) is located below the material to be electroplated (2), and the outlet is connected to the jet pump (4); the electrolyte below the material to be electroplated (2) is sprayed onto the material to be electroplated (2) through the internal circulation suction device (11) and the jet pump (4) to form an internal circulation of the electrolyte.

2. The electroplating apparatus for wire or film materials according to claim 1, characterized in that, The external conveying device (8) includes a suction pump (7) and an external conveying pipe (12); An external circulation suction device (6) is installed inside the electroplating tank (3). The external circulation suction device (6) is located below the material to be electroplated (2). The suction direction is consistent with the moving direction of the material to be electroplated (2). The output end of the external circulation suction device (6) is connected to the outlet of the electroplating tank (3). One end of the external delivery pipe (12) is connected to the outlet of the electroplating tank (3), and the other end is connected to the electrolyte spraying device (9). Under the action of the suction pump (7), the electrolyte below the material to be electroplated (2) passes through the external circulation suction device (6), the external delivery pipe (12), and the electrolyte spraying device (9) in sequence and is sprayed to the top of the material to be electroplated (2) to form an external circulation of electrolyte.

3. The electroplating apparatus for wire or thin film materials according to claim 1, characterized in that, The electrolyte spraying device (9) is tilted, and its tilting direction is opposite to the moving direction of the material to be electroplated (2).

4. The electroplating apparatus for wire or film materials according to claim 1, characterized in that, One or more electrolyte injection devices (9) are provided; When multiple electrolyte spraying devices (9) are set, each electrolyte spraying device (9) is evenly set along the moving direction of the material to be electroplated (2).

5. The electroplating apparatus for wire or film materials according to claim 2, characterized in that, Both the internal circulation suction device (11) and the external circulation suction device (6) are hollow tubes or hollow plates, and the hollow tubes or hollow plates are provided with several through holes.

6. The electroplating apparatus for wire or film materials according to claim 5, characterized in that, The external circulation suction device (6) is horizontally distributed below the material to be electroplated (2); The suction port of the internal circulation suction device (11) is connected to the external circulation suction device (6).

7. The electroplating apparatus for wire or film materials according to claim 1, characterized in that, The conveying device (1) includes a first input roller (1-1), a second input roller (1-2), a first output roller (1-3), and a second output roller (1-4). The first input roller (1-1) and the first output roller (1-3) are located at opposite ends of the electroplating tank (3) and below the electrolyte surface; the second input roller (1-2) and the second output roller (1-4) are located above the electroplating tank (3) and are located on opposite sides of the electroplating tank (3).

8. The electroplating apparatus for wire or film materials according to claim 1, characterized in that, The material to be electroplated (2) is a wire or film material, specifically a metal wire, a cotton wire that has been treated to conduct electricity, or a functional film.

9. The electroplating apparatus for wire or film materials according to claim 1, characterized in that, The material to be electroplated (2) is horizontally distributed.

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