A diffusion furnace purification table cooling system

Abstract

The application relates to the technical field of semiconductor manufacturing, and discloses a diffusion furnace purification table cooling system, which comprises a shell, a cooling device, a refrigeration device, a temperature measuring device and a control device, the shell is used for placing products to be cooled, the cooling device comprises an air cooling assembly and a water cooling assembly, the cooling device is used for cooling the products to be cooled, the refrigeration device is connected to the water cooling assembly, the refrigeration device is used for reducing the temperature of cooling water, the temperature measuring device is arranged in the shell, the temperature measuring device is used for collecting the temperature of the products to be cooled in real time, the control device comprises a processing module and a control module, the processing module is used for setting the rotating speed of the air cooling assembly and the refrigeration temperature of the refrigeration device according to the temperature of the products to be cooled, and the control module is used for controlling the air cooling assembly and the refrigeration device according to the rotating speed of the air cooling assembly and the refrigeration temperature of the refrigeration device. The application can effectively cool the products to be cooled, accelerate the cooling speed of the products to be cooled, and improve the production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a diffusion furnace cleanroom cooling system. Background Technology

[0002] Diffusion furnaces, as crucial equipment in semiconductor device manufacturing processes, are widely used in industries such as integrated circuits, power electronics, and solar cell production. In the photovoltaic industry, high-temperature diffusion furnaces are primarily used to dope monocrystalline and polycrystalline silicon wafers to form PN junctions. With the development of the photovoltaic industry, there is a continuous pursuit of increased production capacity. The manufacturing process involves numerous heat treatment steps, such as thermal oxidation, chemical vapor deposition (CVD), thermal diffusion, metal alloying, impurity activation, and dielectric film densification. These heat treatment processes are highly temperature-sensitive, especially in semiconductor device fabrication, where temperature is a key parameter affecting the uniformity and growth rate of silicon wafer film formation.

[0003] Typically, silicon wafers are loaded into a quartz crystal and fed into the furnace tube via a transfer mechanism. After the reaction, they are removed from the furnace tube. During the thermal processing of semiconductor devices, the transfer mechanism generates a significant amount of heat when moving the silicon wafers in and out. In addition to the cooling devices inside the furnace, a complete cooling system is also required outside the furnace to support the entire process. Traditional heat dissipation methods only use system exhaust vents for heat removal. While some heat is expelled through these vents, the majority remains trapped inside the system. This not only affects production efficiency but can also damage the equipment itself, impacting its performance and lifespan.

[0004] Therefore, how to improve the internal heat dissipation effect, ensure that the equipment can work stably for a long time, and meet the needs of rapid cooling processes, and develop a cost-effective external cooling system for the furnace body are urgent technical problems to be solved. Summary of the Invention

[0005] This invention provides a diffusion furnace purification cooling system to solve the technical problem in the prior art that the product to be cooled cannot be accurately cooled, resulting in poor internal cooling effect of the product.

[0006] To achieve the above objectives, the present invention provides a diffusion furnace purification bench cooling system, comprising:

[0007] The housing is used to hold the product to be cooled.

[0008] The cooling device includes an air-cooled component and a water-cooled component, and the cooling device is used to cool the product to be cooled.

[0009] A refrigeration device, connected to the water-cooling assembly, is used to reduce the temperature of the cooling water;

[0010] A temperature measuring device is installed inside the housing, and the temperature measuring device is used to collect the temperature of the product to be cooled in real time.

[0011] The control device includes a processing module and a control module. The processing module is used to set the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device according to the temperature of the product to be cooled. The control module is used to control the air-cooled component and the refrigeration device according to the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device.

[0012] In one embodiment, the water-cooling assembly includes:

[0013] The water inlet pipe has a water curtain wall inlet, a top water cooling inlet, and a buffer water cooling inlet. The water inlet pipe is used to introduce cooling water into the housing.

[0014] The return water pipe has a water curtain wall return water inlet, a top water-cooled return water inlet, and a buffer water-cooled return water inlet. The return water pipe is used to discharge cooling water out of the housing.

[0015] In one embodiment, it further includes:

[0016] Several water-cooled pipes are provided, which are respectively connected to the water inlet of the water curtain wall, the top water-cooled inlet, the buffer water-cooled inlet, the water curtain wall return inlet, the top water-cooled return inlet and the buffer water-cooled return inlet. The water-cooled pipes are used to transport cooling water.

[0017] In one embodiment, the inlet pipe and the return pipe form a closed loop through the water-cooled pipe.

[0018] In one embodiment, it further includes:

[0019] A water inlet direct connector is installed on the water inlet pipe, and the water inlet direct connector is used to control the flow rate of cooling water in the water inlet pipe;

[0020] A return water direct connector is installed on the return water pipe, and the return water direct connector is used to control the flow rate of cooling water in the return water pipe.

[0021] In one embodiment, it further includes:

[0022] A flow detection device is installed inside the water-cooling assembly, and the flow detection device is used to detect the flow rate of cooling water in real time.

[0023] In one embodiment, in the processing module,

[0024] The processing module is used to preset the temperature matrix B of the product to be cooled, and set B(B1, B2, B3, B4), where B1 is the first preset temperature of the product to be cooled, B2 is the second preset temperature of the product to be cooled, B3 is the third preset temperature of the product to be cooled, B4 is the fourth preset temperature of the product to be cooled, and B1 < B2 < B3 < B4.

[0025] The processing module is used to preset the rotation speed matrix C of the air-cooled component, and set C(C1, C2, C3, C4, C5), where C1 is the first preset rotation speed, C2 is the second preset rotation speed, C3 is the third preset rotation speed, C4 is the fourth preset rotation speed, C5 is the fifth preset rotation speed, and C1 < C2 < C3 < C4 < C5.

[0026] The processing module is used to preset the refrigeration temperature matrix D of the refrigeration device, setting D(D1, D2, D3, D4, D5), where D1 is the first preset refrigeration temperature, D2 is the second preset refrigeration temperature, D3 is the third preset refrigeration temperature, D4 ​​is the fourth preset refrigeration temperature, and D5 is the fifth preset refrigeration temperature, and D1 < D2 < D3 < D4 < D5.

[0027] The processing module is also used to set the rotation speed of the air-cooling component and the cooling temperature of the refrigeration device according to the relationship between the temperature A of the product to be cooled and the temperatures of each preset product to be cooled:

[0028] When A < B1, the first preset rotation speed C1 is selected as the rotation speed of the air-cooled component, and the first preset cooling temperature D1 is selected as the cooling temperature of the cooling device.

[0029] When B1-A < B2, the second preset rotation speed C2 is selected as the rotation speed of the air-cooled component, and the second preset cooling temperature D2 is selected as the cooling temperature of the cooling device.

[0030] When B2≤A<B3, the third preset rotation speed C3 is selected as the rotation speed of the air-cooled component, and the third preset cooling temperature D3 is selected as the cooling temperature of the cooling device.

[0031] When B3≤A<B4, the fourth preset rotation speed C4 is selected as the rotation speed of the air-cooled component, and the fourth preset cooling temperature D4 is selected as the cooling temperature of the cooling device.

[0032] When B4≤A, the fifth preset rotation speed C5 is selected as the rotation speed of the air-cooled component, and the fifth preset cooling temperature D5 is selected as the cooling temperature of the cooling device.

[0033] In one embodiment, when the processing module sets the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device to the i-th preset rotation speed Ci and the i-th preset cooling temperature Di, respectively, i = 1, 2, 3, 4, 5;

[0034] After the control unit controls the air-cooling component and the refrigeration device according to the i-th preset rotation speed Ci and the i-th preset cooling temperature Di, the temperature measuring device collects the adjustment temperature E of the product to be cooled. The processing module determines whether the product to be cooled needs further cooling based on the relationship between the adjustment temperature E of the product to be cooled and the preset temperature α.

[0035] If the adjusted temperature E of the product to be cooled is greater than the preset temperature α, the processing module determines that the product to be cooled needs to continue cooling.

[0036] If the second power generation K is less than or equal to the preset power generation α, the processing module determines that the product to be cooled does not need to be cooled further.

[0037] In one embodiment, when the processing module determines that the product to be cooled needs to continue cooling, the processing module corrects the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device based on the temperature difference E-α between the adjusted temperature E of the product to be cooled and the preset temperature α.

[0038] In one embodiment, in the processing module,

[0039] The processing module is used to preset the temperature difference matrix G, and set G(G1, G2, G3, G4), where G1 is the first preset temperature difference, G2 is the second preset temperature difference, G3 is the third preset temperature difference, G4 is the fourth preset temperature difference, and G1 < G2 < G3 < G4.

[0040] The processing module is used to preset the rotation speed correction coefficient matrix h of the air-cooled component, setting h(h1, h2, h3, h4, h5), where h1 is the first preset rotation speed correction coefficient, h2 is the second preset rotation speed correction coefficient, h3 is the third preset rotation speed correction coefficient, h4 is the fourth preset rotation speed correction coefficient, h5 is the fifth preset rotation speed correction coefficient, and 0.8 < h1 < h2 < h3 < h4 < h5 < 1.2;

[0041] The processing module is used to preset the cooling temperature correction coefficient matrix y of the refrigeration device, and set y(y1, y2, y3, y4, y5), where y1 is the first preset cooling temperature correction coefficient, y2 is the second preset cooling temperature correction coefficient, y3 is the third preset cooling temperature correction coefficient, y4 is the fourth preset cooling temperature correction coefficient, y5 is the fifth preset cooling temperature correction coefficient, and 0.8 < y1 < y2 < y3 < y4 < y5 < 1.2;

[0042] The processing module is also used to correct the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device based on the relationship between the temperature difference E-α and each preset temperature difference:

[0043] When E-α < G1, the first preset rotation speed correction coefficient h1 is selected to correct the i-th preset rotation speed Ci, and the rotation speed of the air-cooled component after correction is Ci*h1. The first preset cooling temperature correction coefficient y1 is selected to correct the i-th preset cooling temperature Di, and the cooling temperature of the cooling device after correction is Di*y1.

[0044] When G1≤E-α<G2, the second preset rotation speed correction coefficient h2 is selected to correct the i-th preset rotation speed Ci. The corrected rotation speed of the air-cooled component is Ci*h2. The second preset cooling temperature correction coefficient y2 is selected to correct the i-th preset cooling temperature Di. The corrected cooling temperature of the cooling device is Di*y2.

[0045] When G2≤E-α<G3, the third preset rotation speed correction coefficient h3 is selected to correct the i-th preset rotation speed Ci. The corrected rotation speed of the air-cooled component is Ci*h3. The third preset cooling temperature correction coefficient y3 is selected to correct the i-th preset cooling temperature Di. The corrected cooling temperature of the cooling device is Di*y3.

[0046] When G3≤E-α<G4, the fourth preset rotation speed correction coefficient h4 is selected to correct the i-th preset rotation speed Ci. The corrected rotation speed of the air-cooled component is Ci*h4. The fourth preset cooling temperature correction coefficient y4 is selected to correct the i-th preset cooling temperature Di. The corrected cooling temperature of the cooling device is Di*y4.

[0047] When G4≤E-α, the fifth preset rotation speed correction coefficient h5 is selected to correct the i-th preset rotation speed Ci. The corrected rotation speed of the air-cooled component is Ci*h5. The fifth preset cooling temperature correction coefficient y5 is selected to correct the i-th preset cooling temperature Di. The corrected cooling temperature of the cooling device is Di*y5.

[0048] This invention provides a diffusion furnace purification bench cooling system, which has the following advantages compared to the prior art:

[0049] This invention combines air-cooled and water-cooled components to improve the cooling effect of the product to be cooled. At the same time, the control device in this invention can control and adjust the air-cooled and water-cooled components according to the real-time temperature of the product to be cooled, thereby effectively cooling the product, accelerating the cooling speed, improving production efficiency, ensuring the cooling effect of the product to be cooled, and avoiding energy waste. Attached Figure Description

[0050] Figure 1 A schematic diagram of the structure of the water-cooling component in an embodiment of the present invention is shown;

[0051] Figure 2 A schematic diagram of the structure of the air-cooled component in an embodiment of the present invention is shown;

[0052] Figure 3 A functional block diagram of the control device in an embodiment of the present invention is shown.

[0053] In the diagram: 1. Air-cooled component; 2. Water inlet pipe; 3. Water curtain wall inlet; 4. Top water-cooled inlet; 5. Buffer water-cooled inlet; 6. Return pipe; 7. Water curtain wall return inlet; 8. Top water-cooled return inlet; 9. Buffer water-cooled return inlet; 10. Inlet straight-through pipe; 11. Return straight-through pipe; 12. Clamp; 13. Y-type filter; 14. Moisturizing cotton ball; 15. Mounting bracket. Detailed Implementation

[0054] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0055] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0056] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0057] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0058] The following is a description of preferred embodiments of the present invention in conjunction with the accompanying drawings.

[0059] like Figure 1-3 As shown, an embodiment of the present invention discloses a diffusion furnace purification bench cooling system, including: a shell, a cooling device, a refrigeration device, a temperature measuring device, and a control device.

[0060] It should be understood that the housing is used to hold the product to be cooled, the cooling device includes an air-cooled component 1 and a water-cooled component, the cooling device is used to cool the product to be cooled, the refrigeration device is connected to the water-cooled component, the refrigeration device is used to reduce the temperature of the cooling water, and the temperature measuring device is set inside the housing, the temperature measuring device is used to collect the temperature of the product to be cooled in real time.

[0061] In this embodiment, the water-cooling component is installed on the shell. The specific arrangement can be made according to the actual situation and is not specifically limited here. The refrigeration device can be a refrigerator or a condenser, etc., and is not specifically limited here. This invention combines the two cooling methods of air-cooling component 1 and water-cooling component to improve the cooling effect of the product to be cooled.

[0062] It should be understood that the control device includes a processing module and a control module. The processing module is used to set the rotation speed of the air-cooling component 1 and the cooling temperature of the refrigeration device according to the temperature of the product to be cooled. The control module is used to control the air-cooling component and the refrigeration device according to the rotation speed of the air-cooling component 1 and the cooling temperature of the refrigeration device.

[0063] It should be noted that the control device is electrically connected to the air-cooling component 1, the refrigeration device and the temperature measuring device. The control device is used to control the air-cooling component, the refrigeration device and the temperature measuring device. The air-cooling component is used to introduce fresh air into the housing and the water-cooling component is used to circulate cooling water.

[0064] In this embodiment, the control device can adjust the air-cooled component and the water-cooled component according to the real-time temperature of the product to be cooled, thereby effectively cooling the product, accelerating the cooling speed of the product to be cooled, and improving production efficiency. This invention can both ensure the cooling effect of the product to be cooled and avoid energy waste.

[0065] In some embodiments of this application, the water-cooling assembly includes: an inlet pipe 2 and a return pipe 5.

[0066] It should be understood that the water inlet pipe 2 has a water curtain wall water inlet 3, a top water cooling water inlet 4, and a buffer water cooling water inlet 5. The water inlet pipe 2 is used to introduce cooling water into the shell. The water return pipe 6 has a water curtain wall water return inlet 7, a top water cooling water return inlet 8, and a buffer water cooling water return inlet 9. The water return pipe 6 is used to discharge cooling water out of the shell.

[0067] In some embodiments of this application, a water-cooled pipe is also included.

[0068] It should be understood that there are several water-cooled pipes, which are respectively connected to the water curtain wall inlet 3, the top water-cooled inlet 4, the buffer water-cooled inlet 5, the water curtain wall return inlet 6, the top water-cooled return inlet 7 and the buffer water-cooled return inlet 8. The water-cooled pipes are used to transport cooling water.

[0069] In this embodiment, each water-cooled pipe can be arranged around the product to be cooled according to actual needs. One end of each water-cooled pipe is connected to the water curtain inlet 3, the top water-cooled inlet 4, and the buffer water-cooled inlet 5 opened on the water inlet pipe 2, and the other end is connected to the water curtain return inlet 7, the top water-cooled return inlet 8, and the buffer water-cooled return inlet 9 opened on the return pipe 6. The present invention can realize the transportation of cooling water through the water-cooled pipe. The water-cooled pipe transports the cooling water in the water inlet pipe 2 to the inside of the shell. The cooling water carries away the heat of the product to be cooled and transports the cooled water after heat exchange to the return pipe 6. In this application, the cooled water after heat exchange can be used in other directions, such as equipment rinsing. The present invention can effectively ensure the cooling effect of the product to be cooled and avoid the waste of water resources.

[0070] In some embodiments of this application, the inlet pipe 2 and the return pipe 6 form a closed loop through the water-cooling pipe. Connecting the inlet pipe 2 and the return pipe 6 through the water-cooling pipe to form a closed loop ensures that the cooling water can promptly remove the heat from the product to be cooled.

[0071] In some embodiments of this application, it also includes: an inlet straight passage 10 and an outlet straight passage 11.

[0072] It should be understood that the inlet water straight-through 10 is installed on the inlet water pipe 2, and the inlet water straight-through 10 is used to control the flow rate of cooling water in the inlet water pipe 2. The return water straight-through 11 is installed on the return water pipe 6, and the return water straight-through 11 is used to control the flow rate of cooling water in the return water pipe 6.

[0073] In this embodiment, in order to control the cooling water flow rate in the inlet pipe 2 and the return pipe 6, an inlet straight-through 10 is provided on the inlet pipe 2 and a return straight-through 11 is provided on the return pipe 6. The cooling water flow rate in the inlet pipe 2 and the return straight-through 11 is controlled through the inlet straight-through 10 and the return straight-through 11, so as to ensure that the cooling water can perform sufficient heat exchange, avoid the phenomenon of excessive cooling water flow causing water waste, or avoid the phenomenon of insufficient cooling effect due to excessive cooling water flow.

[0074] In some embodiments of this application, it also includes:

[0075] A flow detection device is installed inside the water-cooling assembly. The flow detection device is used to detect the flow rate of cooling water in real time. By installing a flow detection device inside the water-cooling assembly, the real-time detection of cooling water flow rate is realized, providing data support for the control of cooling water flow rate.

[0076] In some embodiments of this application, clamps 12 are also included, with several clamps 12 disposed on the inlet pipe 2 and the return pipe 6. The clamps 12 are used to fix the inlet pipe 2 and the return pipe 6, ensuring the stability of the cooling assembly. A Y-type filter 13 and a mothball 14 are also included, disposed on the inlet pipe 2, which can make the cooling water purer. A mounting bracket 15 is also included, used to fix the position of the inlet pipe 2 and the return pipe 6.

[0077] In some embodiments of this application, in the processing module,

[0078] The processing module is used to preset the temperature matrix B of the product to be cooled, and set B(B1, B2, B3, B4), where B1 is the first preset temperature of the product to be cooled, B2 is the second preset temperature of the product to be cooled, B3 is the third preset temperature of the product to be cooled, B4 is the fourth preset temperature of the product to be cooled, and B1 < B2 < B3 < B4.

[0079] The processing module is used to preset the rotation speed matrix C of the air-cooled component 1, and set C(C1, C2, C3, C4, C5), where C1 is the first preset rotation speed, C2 is the second preset rotation speed, C3 is the third preset rotation speed, C4 is the fourth preset rotation speed, C5 is the fifth preset rotation speed, and C1 < C2 < C3 < C4 < C5.

[0080] The processing module is used to preset the refrigeration temperature matrix D of the refrigeration device, setting D(D1, D2, D3, D4, D5), where D1 is the first preset refrigeration temperature, D2 is the second preset refrigeration temperature, D3 is the third preset refrigeration temperature, D4 ​​is the fourth preset refrigeration temperature, and D5 is the fifth preset refrigeration temperature, and D1 < D2 < D3 < D4 < D5.

[0081] The processing module is also used to set the rotation speed of the air-cooling component 1 and the cooling temperature of the refrigeration device according to the relationship between the temperature A of the product to be cooled and the temperatures of each preset product to be cooled:

[0082] When A < B1, the first preset rotation speed C1 is selected as the rotation speed of the air-cooled component 1, and the first preset cooling temperature D1 is selected as the cooling temperature of the cooling device.

[0083] When B1-A < B2, the second preset rotation speed C2 is selected as the rotation speed of the air-cooled component 1, and the second preset cooling temperature D2 is selected as the cooling temperature of the cooling device.

[0084] When B2≤A<B3, the third preset rotation speed C3 is selected as the rotation speed of the air-cooled component 1, and the third preset cooling temperature D3 is selected as the cooling temperature of the cooling device.

[0085] When B3≤A<B4, the fourth preset rotation speed C4 is selected as the rotation speed of the air-cooled component 1, and the fourth preset cooling temperature D4 is selected as the cooling temperature of the cooling device.

[0086] When B4≤A, the fifth preset rotation speed C5 is selected as the rotation speed of the air-cooled component, and the fifth preset cooling temperature D5 is selected as the cooling temperature of the cooling device.

[0087] In this embodiment, the processing module is also used to set the rotation speed of the air-cooling component 1 and the cooling temperature of the refrigeration device according to the relationship between the temperature A of the product to be cooled and the temperatures of each preset product to be cooled. By setting the rotation speed of the air-cooling component 1 and the cooling temperature of the refrigeration device, the present invention can achieve accurate cooling of the product to be cooled, ensure the cooling effect of the product to be cooled, and at the same time reduce the cooling cost.

[0088] In some embodiments of this application, when the processing module sets the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device to the i-th preset rotation speed Ci and the i-th preset cooling temperature Di, respectively, i = 1, 2, 3, 4, 5;

[0089] After the control unit controls the air-cooling component and the refrigeration device according to the i-th preset rotation speed Ci and the i-th preset cooling temperature Di, the temperature measuring device collects the adjustment temperature E of the product to be cooled. The processing module determines whether the product to be cooled needs further cooling based on the relationship between the adjustment temperature E of the product to be cooled and the preset temperature α.

[0090] If the adjusted temperature E of the product to be cooled is greater than the preset temperature α, the processing module determines that the product to be cooled needs to continue cooling.

[0091] If the second power generation K is less than or equal to the preset power generation α, the processing module determines that the product to be cooled does not need to be cooled further.

[0092] In this embodiment, by determining whether the product to be cooled needs to continue cooling, the phenomenon that the product to be cooled still has a high temperature can be avoided.

[0093] In some embodiments of this application, when the processing module determines that the product to be cooled needs to continue cooling, the processing module corrects the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device based on the temperature difference E-α between the adjusted temperature E of the product to be cooled and the preset temperature α.

[0094] In this embodiment, after the control unit controls the air-cooled component 1 and the refrigeration device according to the i-th preset rotation speed Ci and the i-th preset cooling temperature Di respectively, the temperature of the product to be cooled may not have reached the preset temperature. At this time, it is necessary to continue to cool down the product. The present invention can further ensure the cooling effect of the product to be cooled.

[0095] In some embodiments of this application, in the processing module,

[0096] The processing module is used to preset the temperature difference matrix G, and set G(G1, G2, G3, G4), where G1 is the first preset temperature difference, G2 is the second preset temperature difference, G3 is the third preset temperature difference, G4 is the fourth preset temperature difference, and G1 < G2 < G3 < G4.

[0097] The processing module is used to preset the rotation speed correction coefficient matrix h of the air-cooled component, setting h(h1, h2, h3, h4, h5), where h1 is the first preset rotation speed correction coefficient, h2 is the second preset rotation speed correction coefficient, h3 is the third preset rotation speed correction coefficient, h4 is the fourth preset rotation speed correction coefficient, h5 is the fifth preset rotation speed correction coefficient, and 0.8 < h1 < h2 < h3 < h4 < h5 < 1.2;

[0098] The processing module is used to preset the cooling temperature correction coefficient matrix y of the refrigeration device, and set y(y1, y2, y3, y4, y5), where y1 is the first preset cooling temperature correction coefficient, y2 is the second preset cooling temperature correction coefficient, y3 is the third preset cooling temperature correction coefficient, y4 is the fourth preset cooling temperature correction coefficient, y5 is the fifth preset cooling temperature correction coefficient, and 0.8 < y1 < y2 < y3 < y4 < y5 < 1.2;

[0099] The processing module is also used to correct the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device based on the relationship between the temperature difference E-α and each preset temperature difference:

[0100] When E-α < G1, the first preset rotation speed correction coefficient h1 is selected to correct the i-th preset rotation speed Ci, and the rotation speed of the air-cooled component after correction is Ci*h1. The first preset cooling temperature correction coefficient y1 is selected to correct the i-th preset cooling temperature Di, and the cooling temperature of the cooling device after correction is Di*y1.

[0101] When G1≤E-α<G2, the second preset rotation speed correction coefficient h2 is selected to correct the i-th preset rotation speed Ci. The corrected rotation speed of the air-cooled component is Ci*h2. The second preset cooling temperature correction coefficient y2 is selected to correct the i-th preset cooling temperature Di. The corrected cooling temperature of the cooling device is Di*y2.

[0102] When G2≤E-α<G3, the third preset rotation speed correction coefficient h3 is selected to correct the i-th preset rotation speed Ci. The corrected rotation speed of the air-cooled component is Ci*h3. The third preset cooling temperature correction coefficient y3 is selected to correct the i-th preset cooling temperature Di. The corrected cooling temperature of the cooling device is Di*y3.

[0103] When G3≤E-α<G4, the fourth preset rotation speed correction coefficient h4 is selected to correct the i-th preset rotation speed Ci. The corrected rotation speed of the air-cooled component is Ci*h4. The fourth preset cooling temperature correction coefficient y4 is selected to correct the i-th preset cooling temperature Di. The corrected cooling temperature of the cooling device is Di*y4.

[0104] When G4≤E-α, the fifth preset rotation speed correction coefficient h5 is selected to correct the i-th preset rotation speed Ci. The corrected rotation speed of the air-cooled component is Ci*h5. The fifth preset cooling temperature correction coefficient y5 is selected to correct the i-th preset cooling temperature Di. The corrected cooling temperature of the cooling device is Di*y5.

[0105] In this embodiment, the processing module is also used to correct the rotation speed of the air-cooled component 1 and the cooling temperature of the refrigeration device according to the relationship between the temperature difference E-α and each preset temperature difference. By correcting the rotation speed of the air-cooled component 1 and the cooling temperature of the refrigeration device, the present invention can increase or decrease the rotation speed of the air-cooled component 1 and increase or decrease the cooling temperature of the refrigeration device. The present invention can further avoid energy waste and also improve the overall cooling speed and improve the internal heat dissipation effect.

[0106] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0107] Although the invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, features in the embodiments disclosed herein can be combined with each other in any manner, provided there is no structural conflict. The omission of all such combinations in this specification is merely for brevity and resource conservation. Therefore, the invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0108] It will be understood by those skilled in the art that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A diffusion furnace purification table cooling system, characterized in that, include: The housing is used to hold the product to be cooled. The cooling device includes an air-cooled component and a water-cooled component, and the cooling device is used to cool the product to be cooled. A refrigeration device, connected to the water-cooling assembly, is used to reduce the temperature of the cooling water; A temperature measuring device is installed inside the housing, and the temperature measuring device is used to collect the temperature of the product to be cooled in real time. The control device includes a processing module and a control module. The processing module is used to set the rotation speed of the air-cooling component and the cooling temperature of the refrigeration device according to the temperature of the product to be cooled. The control module is used to control the air-cooling component and the refrigeration device according to the rotation speed of the air-cooling component and the cooling temperature of the refrigeration device. When the processing module determines that the product to be cooled needs to continue cooling, the processing module corrects the rotation speed of the air-cooling component and the cooling temperature of the refrigeration device based on the temperature difference E-α between the adjusted temperature E of the product to be cooled and the preset temperature α. A preset temperature difference matrix G is defined as G(G1, G2, G3, G4), where G1 is the first preset temperature difference, G2 is the second preset temperature difference, G3 is the third preset temperature difference, and G4 is the fourth preset temperature difference, and G1 < G2 < G3 < G4. The rotational speed correction coefficient matrix h of the preset air-cooled component is set as h(h1, h2, h3, h4, h5), where h1 is the first preset rotational speed correction coefficient, h2 is the second preset rotational speed correction coefficient, h3 is the third preset rotational speed correction coefficient, h4 is the fourth preset rotational speed correction coefficient, and h5 is the fifth preset rotational speed correction coefficient, and 0.8 < h1 < h2 < h3 < h4 < h5 < 1.2; The cooling temperature correction coefficient matrix y of the preset cooling device is set as y(y1, y2, y3, y4, y5), where y1 is the first preset cooling temperature correction coefficient, y2 is the second preset cooling temperature correction coefficient, y3 is the third preset cooling temperature correction coefficient, y4 is the fourth preset cooling temperature correction coefficient, and y5 is the fifth preset cooling temperature correction coefficient, and 0.8 < y1 < y2 < y3 < y4 < y5 < 1.2; The rotation speed of the air-cooled component and the cooling temperature of the refrigeration device are corrected based on the relationship between the temperature difference E-α and the preset temperature differences: When E-α < G1, the first preset rotational speed correction coefficient h1 is selected to correct the i-th preset rotational speed Ci, and the corrected rotational speed of the air-cooled component is Ci. h1, select the first preset cooling temperature correction coefficient y1 to correct the i-th preset cooling temperature Di, and the corrected cooling temperature of the refrigeration device is Di. y1; When G1≤E-α<G2, the second preset rotation speed correction coefficient h2 is selected to correct the i-th preset rotation speed Ci, and the corrected rotation speed of the air-cooled component is Ci. h2, select the second preset cooling temperature correction coefficient y2 to correct the i-th preset cooling temperature Di, and the corrected cooling temperature of the refrigeration device is Di. y2; When G2≤E-α<G3, the third preset rotation speed correction coefficient h3 is selected to correct the i-th preset rotation speed Ci, and the corrected rotation speed of the air-cooled component is Ci. h3, select the third preset cooling temperature correction coefficient y3 to correct the i-th preset cooling temperature Di, and the corrected cooling temperature of the refrigeration device is Di. y3; When G3≤E-α<G4, the fourth preset rotational speed correction coefficient h4 is selected to correct the i-th preset rotational speed Ci, and the corrected rotational speed of the air-cooled component is Ci. h4, select the fourth preset cooling temperature correction coefficient y4 to correct the i-th preset cooling temperature Di, and the corrected cooling temperature of the refrigeration device is Di. y4; When G4≤E-α, the fifth preset rotational speed correction coefficient h5 is selected to correct the i-th preset rotational speed Ci, and the corrected rotational speed of the air-cooled component is Ci. h5, select the fifth preset cooling temperature correction coefficient y5 to correct the i-th preset cooling temperature Di, and the corrected cooling temperature of the refrigeration device is Di. y5.

2. The diffusion furnace purification table cooling system according to claim 1, characterized in that, The water-cooling assembly includes: The water inlet pipe has a water curtain wall inlet, a top water cooling inlet, and a buffer water cooling inlet. The water inlet pipe is used to introduce cooling water into the housing. The return water pipe has a water curtain wall return water inlet, a top water-cooled return water inlet, and a buffer water-cooled return water inlet. The return water pipe is used to discharge cooling water out of the housing.

3. The diffusion furnace purification table cooling system according to claim 2, characterized in that, Also includes: Several water-cooled pipes are provided, which are respectively connected to the water inlet of the water curtain wall, the top water-cooled inlet, the buffer water-cooled inlet, the water curtain wall return inlet, the top water-cooled return inlet and the buffer water-cooled return inlet. The water-cooled pipes are used to transport cooling water.

4. The diffusion furnace purification table cooling system according to claim 3, characterized in that, The inlet pipe and the return pipe form a closed loop through the water-cooling pipe.

5. The diffusion furnace purification table cooling system according to claim 2, characterized in that, Also includes: A water inlet direct connector is installed on the water inlet pipe, and the water inlet direct connector is used to control the flow rate of cooling water in the water inlet pipe; A return water direct connector is installed on the return water pipe, and the return water direct connector is used to control the flow rate of cooling water in the return water pipe.

6. The diffusion furnace purification table cooling system according to claim 1, characterized in that, Also includes: A flow detection device is installed inside the water-cooling assembly, and the flow detection device is used to detect the flow rate of cooling water in real time.

7. The diffusion furnace purification table cooling system according to claim 1, characterized in that, In the processing module, The processing module is used to preset the temperature matrix B of the product to be cooled, and set B (B1, B2, B3, B4), where B1 is the first preset temperature of the product to be cooled, B2 is the second preset temperature of the product to be cooled, B3 is the third preset temperature of the product to be cooled, B4 is the fourth preset temperature of the product to be cooled, and B1 < B2 < B3 < B4. The processing module is used to preset the rotation speed matrix C of the air-cooled component, and set C (C1, C2, C3, C4, C5), where C1 is the first preset rotation speed, C2 is the second preset rotation speed, C3 is the third preset rotation speed, C4 is the fourth preset rotation speed, C5 is the fifth preset rotation speed, and C1 < C2 < C3 < C4 < C5. The processing module is used to preset the refrigeration temperature matrix D of the refrigeration device, setting D (D1, D2, D3, D4, D5), where D1 is the first preset refrigeration temperature, D2 is the second preset refrigeration temperature, D3 is the third preset refrigeration temperature, D4 ​​is the fourth preset refrigeration temperature, D5 is the fifth preset refrigeration temperature, and D1 < D2 < D3 < D4 < D5. The processing module is also used to set the rotation speed of the air-cooling component and the cooling temperature of the refrigeration device according to the relationship between the temperature A of the product to be cooled and the temperatures of each preset product to be cooled: When A < B1, the first preset rotation speed C1 is selected as the rotation speed of the air-cooled component, and the first preset cooling temperature D1 is selected as the cooling temperature of the cooling device. When B1-A < B2, the second preset rotation speed C2 is selected as the rotation speed of the air-cooled component, and the second preset cooling temperature D2 is selected as the cooling temperature of the cooling device. When B2≤A<B3, the third preset rotation speed C3 is selected as the rotation speed of the air-cooled component, and the third preset cooling temperature D3 is selected as the cooling temperature of the cooling device. When B3≤A<B4, the fourth preset rotation speed C4 is selected as the rotation speed of the air-cooled component, and the fourth preset cooling temperature D4 is selected as the cooling temperature of the cooling device. When B4≤A, the fifth preset rotation speed C5 is selected as the rotation speed of the air-cooled component, and the fifth preset cooling temperature D5 is selected as the cooling temperature of the cooling device.

8. The diffusion furnace purification table cooling system according to claim 7, characterized in that, When the processing module sets the rotation speed of the air-cooled component and the cooling temperature of the refrigeration device to the i-th preset rotation speed Ci and the i-th preset cooling temperature Di, respectively, i = 1, 2, 3, 4, 5; After the control unit controls the air-cooling component and the refrigeration device according to the i-th preset rotation speed Ci and the i-th preset cooling temperature Di, the temperature measuring device collects the adjustment temperature E of the product to be cooled. The processing module determines whether the product to be cooled needs further cooling based on the relationship between the adjustment temperature E of the product to be cooled and the preset temperature α. If the adjusted temperature E of the product to be cooled is greater than the preset temperature α, the processing module determines that the product to be cooled needs to continue cooling. If the second power generation K is less than or equal to the preset power generation α, the processing module determines that the product to be cooled does not need to be cooled further.

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