Current detection method, device and equipment of circuit board, power system and medium

Abstract

The application relates to current detection circuit technology and discloses a current detection method for a circuit board, which comprises the following steps: detecting a voltage value at a preset copper foil in the circuit board, and obtaining a copper foil temperature value of the preset copper foil, wherein the preset copper foil is arranged at a current detection point of the circuit board; determining a resistivity of the preset copper foil according to the copper foil temperature value, and calculating a resistance value of the preset copper foil according to a length, a cross-sectional area and the resistivity of the preset copper foil; and calculating a current value of the current detection point according to the voltage value and the resistance value. The application further discloses a current detection device for a circuit board, an electronic device, a power system and a computer readable storage medium. The application realizes low-cost detection of the current value of the current detection point in the circuit board, and solves the problem that the current value detection precision is easily affected by the circuit temperature.

Description

Technical Field

[0001] This application relates to the field of current detection circuit technology, and in particular to a current detection method for a circuit board, a current detection device for a circuit board, an electronic device, a power system, and a computer-readable storage medium. Background Technology

[0002] In the circuit testing of some electronic devices, Hall effect detection or shunt meter detection methods are used to detect the circuit current. However, this requires setting up corresponding detection sensors on the circuit board, which not only occupies the layout space of the circuit board, but also increases the manufacturing cost of the circuit board. In particular, the Hall effect detection method can also have the problem of affecting the current detection accuracy due to excessive circuit temperature. Summary of the Invention

[0003] The main objective of this application is to provide a current detection method for a circuit board, a current detection device for a circuit board, an electronic device, a power system, and a computer-readable storage medium, aiming to achieve low-cost detection of the current value at the current detection point in the circuit board and to solve the problem that the accuracy of current value detection is easily affected by circuit temperature.

[0004] To achieve the above objectives, this application provides a current detection method for a circuit board, comprising the following steps: The voltage value at a preset copper foil in the circuit board is detected, and the copper foil temperature value of the preset copper foil is obtained, wherein the preset copper foil is set at the current detection point of the circuit board; The resistivity of the preset copper foil is determined based on the copper foil temperature value, and the resistance value of the preset copper foil is calculated based on the length, cross-sectional area, and resistivity of the preset copper foil. The current value at the current detection point is calculated based on the voltage value and the resistance value.

[0005] Optionally, a thermally conductive mud block is provided between the preset copper foil and the target device, the target device and the circuit board are disposed in the same device, and the target device is a heat sink or sheet metal of the device.

[0006] Optionally, the step of obtaining the copper foil temperature value of the preset copper foil includes: A first temperature value is obtained, wherein the distance between the detection point of the first temperature value and the center point of the preset copper foil is greater than or equal to a preset distance; The copper foil temperature value is determined based on the first temperature value.

[0007] Optionally, the step of determining the copper foil temperature value based on the first temperature value includes: Calculate the average value between the first temperature value and the second temperature value, and use it as the copper foil temperature value; The second temperature value is the temperature value of the center point.

[0008] Optionally, the current detection method for the circuit board further includes: Obtain the temperature value of the center point of the preset copper foil as the second temperature value; Detect whether the second temperature value is greater than the preset temperature value; If so, proceed with the step of obtaining the first temperature value; If not, the second temperature value shall be used as the copper foil temperature value.

[0009] To achieve the above objectives, this application also provides a current detection device for a circuit board, comprising: The detection module is used to detect the voltage value at a preset copper foil in the circuit board and obtain the copper foil temperature value of the preset copper foil, wherein the preset copper foil is set at the current detection point of the circuit board; The processing module is used to determine the resistivity of the preset copper foil based on the copper foil temperature value, and to calculate the resistance value of the preset copper foil based on the length, cross-sectional area and resistivity of the preset copper foil. The calculation module is used to calculate the current value at the current detection point based on the voltage value and the resistance value.

[0010] To achieve the above objectives, this application also provides an electronic device, the electronic device comprising: a memory, a processor, and a current detection program for a circuit board stored in the memory and executable on the processor, wherein when the current detection program for the circuit board is executed by the processor, it implements the steps of the current detection method for the circuit board as described above.

[0011] To achieve the above objectives, this application also provides a power system including the electronic equipment described above.

[0012] To achieve the above objectives, this application also provides a computer-readable storage medium storing a current detection program for a circuit board, wherein the current detection program for the circuit board, when executed by a processor, implements the steps of the current detection method for the circuit board as described above.

[0013] The circuit board current detection method, circuit board current detection device, electronic device, power system, and computer-readable storage medium provided in this application achieve low-cost detection of the current value at the current detection point on the circuit board by setting copper foil at the current detection point on the circuit board and utilizing the real-time voltage, temperature, and other related resistance parameters of the copper foil, and solve the problem that the accuracy of current value detection is easily affected by circuit temperature. Attached Figure Description

[0014] Figure 1This is a schematic diagram of the current detection method steps for a circuit board in one embodiment of this application; Figure 2 This is a schematic diagram of a current detection device on a circuit board in one embodiment of this application; Figure 3 This is a schematic block diagram of the internal structure of an electronic device according to an embodiment of this application.

[0015] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0016] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0017] Reference Figure 1 In one embodiment, the current detection method for the circuit board includes: Step S10: Detect the voltage value at a preset copper foil in the circuit board and obtain the copper foil temperature value of the preset copper foil, wherein the preset copper foil is set at the current detection point of the circuit board; Step S20: Determine the resistivity of the preset copper foil based on the copper foil temperature value, and calculate the resistance value of the preset copper foil based on the length, cross-sectional area and resistivity of the preset copper foil; Step S30: Calculate the current value at the current detection point based on the voltage value and the resistance value.

[0018] In this embodiment, the execution terminal can be the electronic device to which the circuit board to be tested belongs, or it can be other control devices or apparatuses that control the electronic device (such as a current detection device for the circuit board). The following description uses an electronic device as the terminal in this embodiment.

[0019] The circuit board can be a printed circuit board (PCB).

[0020] Optionally, for circuit boards in electronic devices that require current detection, engineers can pre-set a section of copper foil at the current detection point on the circuit board as a preset copper foil (i.e., a preset copper foil is connected in series between the current input and output at the current detection point).

[0021] In this embodiment, engineers can select copper foil with suitable length and cross-sectional area as the preset copper foil according to actual needs. Therefore, this embodiment does not limit the specific values ​​of the length and cross-sectional area of ​​the preset copper foil, as long as the selected preset copper foil is sufficient to achieve the solution of this embodiment.

[0022] It should be noted that the same circuit board may include one or more current detection points, and each current detection point may correspond to a pre-set copper foil.

[0023] Optionally, when the electronic device needs to obtain the current value at the current detection point, it can first detect the voltage value at the preset copper foil input / output terminal at the current detection point, and obtain the copper foil temperature value of the preset copper foil. A thermistor can be installed on the circuit board, and the copper foil temperature value can be acquired through the thermistor.

[0024] Optionally, based on the real-time copper foil temperature value and the preset table of copper foil temperature values ​​and resistivity, the resistivity corresponding to the current copper foil temperature value can be obtained, thus obtaining the current resistivity of the preset copper foil. Then, the resistance value R corresponding to the preset copper foil reaching the current copper foil temperature value can be calculated using the following formula: R = ρL / S; Where ρ is the resistivity, L is the length of the preset copper foil, and S is the cross-sectional area of ​​the preset copper foil. It should be understood that since the preset copper foil is pre-set, its actual length and cross-sectional area can be stored in the terminal's memory, and the terminal can directly retrieve the data.

[0025] Optionally, after calculating the resistance value R corresponding to the preset copper foil, the current value I at the preset copper foil can be calculated using the following formula, combined with the voltage value U corresponding to the preset copper foil: I=U / R; The calculated current value of the preset copper foil can be used as the current value at the current detection point.

[0026] In one embodiment, by setting copper foil at the current detection point on the circuit board and using the real-time voltage, temperature and other relevant resistance parameters of the copper foil, the current value at the current detection point can be calculated. Compared with setting a current detection sensor at the current detection point, this method is not only cheaper, but also requires less circuit board space due to the small size of the copper foil (which can effectively save materials for circuit board fabrication and reduce the cost of circuit board fabrication). Furthermore, by detecting the temperature value of the copper foil in real time and adjusting the resistance value of the copper foil accordingly, the inaccuracy of current detection due to changes in circuit board temperature can be avoided (while if a current detection sensor is used, the current detection accuracy may be affected by the excessively high temperature of the circuit board).

[0027] In one embodiment, based on the above embodiments, a thermally conductive mud block is provided between the preset copper foil and the target device, the target device and the circuit board are disposed in the same device, and the target device is a heat sink or sheet metal of the device.

[0028] In this embodiment, when the electronic device to which the circuit board belongs is also equipped with a target device, the relevant engineer can also set a thermally conductive mud block between the preset copper foil on the circuit board and the target device. That is, thermally conductive mud with ultra-low thermal resistance, high thermal conductivity, good insulation performance and good conformability can be used to fill the space between the preset copper foil and the target device, so that they are in close contact and form a thermally conductive mud block.

[0029] The target device may be a device that helps dissipate heat from the preset copper foil, such as a heat sink or sheet metal of an equipment (such as the sheet metal housing of an electronic device).

[0030] This helps the copper foil dissipate heat quickly, reduces the thermal resistance of the copper foil, and prevents the copper foil from accumulating heat around it when the temperature is too high. This would cause the temperature value of the copper foil detected by the thermistor to be higher than the actual temperature value of the copper foil, thus affecting the accuracy of the current value calculation.

[0031] Especially for some high-power electronic devices, it is often necessary to equip them with high-power preset copper foil. However, the temperature of high-power preset copper foil is relatively high when powered on. Therefore, it is even more necessary to place thermal conductive mud between the high-power preset copper foil and the target device (which can effectively reduce the temperature of the copper foil by 10℃-15℃). This can not only quickly dissipate heat from the high-power preset copper foil to avoid affecting the accuracy of the calculation of related current values, but also prevent the circuit board from softening due to the high temperature of the high-power preset copper foil over a long period of time.

[0032] In one embodiment, based on the above embodiment, the step of obtaining the copper foil temperature value of the preset copper foil includes: A first temperature value is obtained, wherein the distance between the detection point of the first temperature value and the center point of the preset copper foil is greater than or equal to a preset distance; The copper foil temperature value is determined based on the first temperature value.

[0033] In this embodiment, considering the compact space of the circuit board, the preset copper foil heats up during circuit board operation. If heat dissipation is not timely, some hot air may accumulate around the preset copper foil. In this case, if the thermistor's detection point is close to the preset copper foil, the detected copper foil temperature value will be higher than the actual temperature value of the preset copper foil. Therefore, in this embodiment, a temperature detection point can be determined near the preset copper foil, and the copper foil temperature value can be determined based on the first temperature value detected by the thermistor's detection point at that temperature detection point.

[0034] Optionally, the distance between the temperature detection point and the center point of the preset copper foil is greater than or equal to the preset distance (i.e., there is a certain distance between the temperature detection point and the preset copper foil). The specific value of the preset distance can be set according to actual needs, and the value range can be selected as 0.1cm-1cm.

[0035] Optionally, after the terminal obtains the first temperature value, it can directly use the first temperature value as the copper foil temperature value.

[0036] Alternatively, multiple temperature detection points can be used for the same preset copper foil, one of which is the center point of the preset copper foil, and another detection point is at a distance greater than or equal to the center point (i.e., this detection point is used to detect the first temperature value); wherein, the temperature value detected at the center point of the preset copper foil is marked as the second temperature value.

[0037] Optionally, after the terminal obtains the first temperature value and the second temperature value, the average value between the first temperature value and the second temperature value can be calculated as the copper foil temperature value.

[0038] In this way, by detecting the temperature near the preset copper foil as the copper foil temperature value or by making appropriate adjustments to the copper foil temperature value, the obtained copper foil temperature value is closer to the true value, thereby ensuring the accuracy of the current value calculated step by step using the detected copper foil temperature value.

[0039] In one embodiment, based on the above embodiments, the current detection method for the circuit board further includes: Obtain the temperature value of the center point of the preset copper foil as the second temperature value; Detect whether the second temperature value is greater than the preset temperature value; If so, proceed with the step of obtaining the first temperature value; If not, the second temperature value shall be used as the copper foil temperature value.

[0040] In this embodiment, a temperature detection point can be set at the center point of a preset copper foil, and the temperature value detected at this detection point can be marked as a second temperature value.

[0041] Optionally, after the terminal obtains the second temperature value, it can first check whether the second temperature value is greater than the preset temperature value. The preset temperature value is used to measure the temperature of the preset copper foil (if the second temperature value is greater than the preset temperature value, it is determined that the temperature of the preset copper foil is too high). Its specific value range can be set according to actual needs, such as 60℃-90℃.

[0042] Optionally, if the detected second temperature value is greater than the preset temperature value, it indicates that the preset copper foil temperature is too high. It is very likely that heat will accumulate around the preset copper foil due to insufficient heat dissipation. In this case, if the detection point of the thermistor is close to the preset copper foil to detect the temperature, the detected copper foil temperature value (i.e., if the detected second temperature value is directly used as the copper foil temperature value) will be higher than the actual preset copper foil temperature value. Therefore, by performing the step of obtaining the first temperature value in the above embodiment, the first temperature value can be used as the copper foil temperature value, or the average value between the first temperature value and the second temperature value can be calculated as the copper foil temperature value. This makes the obtained copper foil temperature value closer to the true value, thereby ensuring the accuracy of the current value calculated step by step using the copper foil temperature value.

[0043] Optionally, if the detected second temperature value is less than or equal to the preset temperature value, it indicates that the preset copper foil temperature is not too high. In this case, the probability of heat accumulating around the preset copper foil due to insufficient heat dissipation is small (or the heat around the preset copper foil has little impact on its actual temperature value). Therefore, the second temperature value detected at the center point of the preset copper foil can be directly used as the copper foil temperature value (that is, the temperature value detected at the center point of the preset copper foil is closer to or equal to the actual temperature value of the preset copper foil), thereby ensuring the accuracy of the current value calculated step by step using the copper foil temperature value.

[0044] Reference Figure 2 This application embodiment also provides a current detection device Z10 for a circuit board, comprising: The detection module Z11 is used to detect the voltage value at a preset copper foil in the circuit board and obtain the copper foil temperature value of the preset copper foil, wherein the preset copper foil is set at the current detection point of the circuit board; Processing module Z12 is used to determine the resistivity of the preset copper foil based on the copper foil temperature value, and to calculate the resistance value of the preset copper foil based on the length, cross-sectional area and resistivity of the preset copper foil. The calculation module Z13 is used to calculate the current value of the current detection point based on the voltage value and the resistance value.

[0045] Reference Figure 3 This application also provides an electronic device whose internal structure can be as follows: Figure 3As shown, the electronic device includes a processor, memory, communication interface, and database connected via a system bus. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database stores a current detection program for the circuit board. The communication interface is used for data communication with an external terminal. The input device receives signals from external devices. When the computer program is executed by the processor, it implements a current detection method for a circuit board as described in the above embodiment.

[0046] Those skilled in the art will understand that Figure 3 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the electronic device to which the present application is applied.

[0047] In addition, this application also proposes a power system that includes the electronic equipment described in the above embodiments.

[0048] Optionally, the power system may be an integrated photovoltaic-storage-charging system, and the electronic devices described in the above embodiments may be any electronic devices that make up the integrated photovoltaic-storage-charging system.

[0049] Furthermore, this application also proposes a computer-readable storage medium comprising a current detection program for a circuit board. When executed by a processor, the current detection program for the circuit board implements the steps of the current detection method for the circuit board as described in the above embodiments. It is understood that the computer-readable storage medium in this embodiment can be a volatile readable storage medium or a non-volatile readable storage medium.

[0050] In summary, the circuit board current detection method, circuit board current detection device, electronic device, and computer-readable storage medium provided in the embodiments of this application achieve low-cost detection of the current value at the current detection point in the circuit board by setting copper foil at the current detection point of the circuit board and utilizing the real-time voltage, temperature, and other related resistance parameters of the copper foil, and solve the problem that the accuracy of current value detection is easily affected by circuit temperature.

[0051] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in this application and in the embodiments can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual-speed SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0052] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, article, or method. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, article, or method that includes that element.

[0053] The above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method for detecting current on a circuit board, characterized in that, include: The voltage value at a preset copper foil on the circuit board is detected, and the temperature value of the preset copper foil is obtained. The preset copper foil is located at the current detection point of the circuit board. A thermistor is provided on the circuit board to collect the copper foil temperature value. A thermally conductive block is provided between the preset copper foil and the target device to reduce the thermal resistance of the preset copper foil. The target device and the circuit board are located in the same device, and the target device is a heat sink or sheet metal of the device. The resistivity of the preset copper foil is determined based on the copper foil temperature value, and the resistance value of the preset copper foil is calculated based on the length, cross-sectional area, and resistivity of the preset copper foil. Calculate the current value at the current detection point based on the voltage value and the resistance value; The step of obtaining the copper foil temperature value of the preset copper foil includes: Obtain the temperature value of the center point of the preset copper foil as the second temperature value; Detect whether the second temperature value is greater than the preset temperature value; If so, obtain a first temperature value, wherein the distance between the detection point of the first temperature value and the center point of the preset copper foil is greater than or equal to a preset distance; calculate the average value between the first temperature value and the second temperature value as the copper foil temperature value; wherein the second temperature value is the temperature value of the center point; If not, the second temperature value shall be used as the copper foil temperature value.

2. A current detection device for a circuit board, characterized in that, include: A detection module is used to detect the voltage value at a preset copper foil on a circuit board and obtain the copper foil temperature value. The preset copper foil is located at a current detection point on the circuit board. A thermistor is provided on the circuit board to collect the copper foil temperature value. A thermally conductive block is provided between the preset copper foil and the target device to reduce the thermal resistance of the preset copper foil. The target device and the circuit board are located in the same device, and the target device is a heat sink or sheet metal of the device. The processing module is used to determine the resistivity of the preset copper foil based on the copper foil temperature value, and to calculate the resistance value of the preset copper foil based on the length, cross-sectional area and resistivity of the preset copper foil. The calculation module is used to calculate the current value at the current detection point based on the voltage value and the resistance value; The step of the detection module obtaining the copper foil temperature value of the preset copper foil includes: Obtain the temperature value of the center point of the preset copper foil as the second temperature value; Detect whether the second temperature value is greater than the preset temperature value; If so, obtain a first temperature value, wherein the distance between the detection point of the first temperature value and the center point of the preset copper foil is greater than or equal to a preset distance; calculate the average value between the first temperature value and the second temperature value as the copper foil temperature value; wherein the second temperature value is the temperature value of the center point; If not, the second temperature value shall be used as the copper foil temperature value.

3. An electronic device, characterized in that, The circuit board in the electronic device has a preset copper foil at the current detection point; the electronic device includes a memory, a processor, and a circuit board current detection program stored in the memory and executable on the processor. When the circuit board current detection program is executed by the processor, it implements the steps of the circuit board current detection method as described in claim 1.

4. A power system, characterized in that, The power system includes the electronic equipment as described in claim 3.

5. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a current detection program for a circuit board, which, when executed by a processor, implements the steps of the current detection method for a circuit board as described in claim 1.

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