Main port and substrate processing apparatus using it

Abstract

This invention relates to a main port and a substrate processing apparatus utilizing the same. The invention provides a main port disposed in a substrate processing apparatus to temporarily support a nozzle for spraying process liquid onto a substrate, wherein the main port includes: a body having a space formed therein; a nozzle holder disposed on the upper part of the body and for supporting the nozzle; an inclined surface formed on the lower side of the nozzle holder in the space; a first supply pipe for spraying rinsing liquid from the head of the nozzle; a second supply pipe for injecting rinsing liquid into the interior of the body; a conductive wire electrically connecting the inclined surface and the first supply pipe; and a first switch disposed on the conductive wire.

Description

Technical Field

[0001] This invention relates to a main port and a substrate processing apparatus utilizing the same. Background Technology

[0002] The photolithography process, a part of semiconductor manufacturing, is the process of forming desired patterns on a wafer. The photolithography process is performed in a substrate processing apparatus that continuously performs coating, exposure, and development.

[0003] On the other hand, the substrate processing apparatus includes a main port. This main port may be configured to include a support for a nozzle that supports the spraying of coating or developing liquid onto the wafer during the coating or developing process, and a containment space for accommodating the periodically sprayed process liquid to prevent contamination from the process liquid (such as coating or developing liquid) when the nozzle is supported for an extended period. It may also include an exhaust port for discharging fumes generated by the process liquid sprayed from the nozzle, and a supply member for cleaning the sprayed process liquid.

[0004] The gaseous fumes generated by the process liquid ejected from the nozzle are electrostatically deposited on the nozzle, and there is a problem that the electrostatic deposits are difficult to remove. Summary of the Invention

[0005] The present invention is proposed to solve the problems of the prior art. The problem to be solved by the present invention is to provide a main port that can prevent smoke generated inside the main port from being deposited on the surface of the nozzle by electrostatic discharge, and a substrate processing device using the same.

[0006] As a solution to the aforementioned problem, the present invention provides a main port disposed in a substrate processing apparatus to temporarily support a nozzle for spraying process liquid onto a substrate, wherein the main port includes: a main body having a space formed therein; a nozzle holder disposed on the upper part of the main body and for supporting the nozzle; an inclined surface formed on the lower side of the nozzle holder in the space; a first supply pipe for spraying rinsing liquid from the head of the nozzle; a second supply pipe for injecting rinsing liquid into the interior of the main body; a conductive wire electrically connecting the inclined surface and the first supply pipe; and a first switch disposed on the conductive wire.

[0007] Preferably, the main port further includes a grounding wire that electrically connects the inclined surface and the grounding electrode to discharge conductive charge to the inclined surface, and a second switch disposed on the grounding wire.

[0008] Preferably, the first supply tube is formed by multiple vascular bundles.

[0009] Preferably, the first supply tube is subjected to ion implantation or plating treatment.

[0010] If the inclined surface is negatively charged due to the positively charged process liquid ejected from the nozzle, and the first supply pipe is positively charged due to the movement of charge through the conductive wire, the first supply pipe is kept charged by being electrically disconnected by a switch provided in the conductive wire. The positively charged rinsing liquid is ejected to the nozzle through the first supply pipe which is kept charged, and the surface of the nozzle is positively charged, thereby preventing the deposition of charged smoke.

[0011] Alternatively, the rinsing solution may use a thinner.

[0012] The present invention further provides a substrate processing apparatus, comprising: a housing having a processing space inside; a substrate support unit supporting a substrate within the housing; a liquid supply unit having a nozzle for supplying processing liquid to the substrate; a main port located outside the housing, for the nozzle to be in standby mode, and for discharging the processing liquid ejected from the nozzle to the outside, the main port comprising: a body having a space formed inside; a nozzle holder disposed on the upper part of the body and for supporting the nozzle; an inclined surface formed on the lower side of the nozzle holder in the space; a first supply pipe for ejecting rinsing liquid from the head of the nozzle; a second supply pipe for injecting rinsing liquid into the interior of the body; a conductive wire electrically connecting the inclined surface and the first supply pipe; and a first switch disposed on the conductive wire.

[0013] Preferably, the main port further includes a grounding wire that electrically connects the inclined surface and the grounding electrode to discharge conductive charge to the inclined surface, and a second switch disposed on the grounding wire.

[0014] Preferably, the first supply tube is formed by multiple vascular bundles.

[0015] Preferably, the first supply tube is subjected to ion implantation or plating treatment.

[0016] If the inclined surface is negatively charged due to the positively charged process liquid ejected from the nozzle, and the first supply pipe is positively charged due to the movement of charge through the conductive wire, the first supply pipe is kept charged by being electrically disconnected by a switch provided in the conductive wire. The positively charged rinsing liquid is ejected to the nozzle through the first supply pipe which is kept charged, and the surface of the nozzle is positively charged, thereby preventing the deposition of charged smoke.

[0017] This invention provides a main port disposed in a substrate processing apparatus to temporarily support a nozzle for spraying process liquid onto a substrate. The main port includes: a main body having a space formed therein; a nozzle holder disposed on the upper part of the main body and for supporting the nozzle; an inclined surface formed on the lower side of the nozzle holder in the space; a first supply pipe for spraying rinsing liquid from the nozzle head; a second supply pipe for injecting rinsing liquid into the main body; a conductive wire electrically connecting the inclined surface and the first supply pipe; a first switch disposed on the conductive wire; and a grounding wire electrically connecting the inclined surface and a grounding electrode. Conductive charge is discharged to the inclined surface; a second switch is provided on the grounding wire, and the first supply tube is formed into multiple vascular bundles that have been plated or ion implanted. If the inclined surface is negatively charged due to the process liquid sprayed from the nozzle and carrying a positive charge, then the first supply tube is positively charged due to the movement of charge through the conductive wire. The switch provided in the conductive wire is used to disconnect the first supply tube, and the first supply tube remains charged. The positively charged rinsing liquid is sprayed onto the nozzle through the first supply tube, which remains charged, and the surface of the nozzle is positively charged, thereby preventing the deposition of charged smoke.

[0018] According to the present invention, a substrate processing apparatus is provided that can prevent smoke generated inside the main port from passing through the main port electrostatically deposited on the surface of the nozzle and utilize the same. Attached Figure Description

[0019] Figure 1 , Figure 3 as well as Figure 5 This is a diagram illustrating the main port according to an embodiment of the present invention.

[0020] Figure 2 It is shown in Figure 1 A diagram showing an example of the first supply pipe.

[0021] Figure 4 It is shown in Figure 1 The diagram shows the state of the nozzle head being charged.

[0022] Figure 6 This is a diagram showing the substrate processing equipment viewed from above.

[0023] Figure 7 Observed in the AA direction Figure 6 A diagram of the equipment.

[0024] Figure 8 Observing from the BB direction Figure 6 A diagram of the equipment.

[0025] Figure 9 It shows the direction Figure 6A cross-sectional view of the substrate processing apparatus provided by the coating chamber.

[0026] Figure 10 It is shown Figure 9 A plan view of the substrate processing apparatus.

[0027] (Explanation of reference numerals in the attached diagram)

[0028] 900: Main port; 910: Main body

[0029] 920: Nozzle holder section; 930: Inclined surface

[0030] 940: First supply pipe; 950: Second supply pipe

[0031] 960: Conductive wire; 970: Grounding wire

[0032] 961: First switch; 971: Second switch Detailed Implementation

[0033] Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the main port of the present invention and a substrate processing apparatus thereunder will be described to provide specific details for implementing the present invention.

[0034] The present invention includes two forms: a main port and a substrate processing apparatus. First, the main port will be described, and then the substrate processing apparatus including the main port will be described.

[0035] First, the main port according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0036] Figure 1 , Figure 3 as well as Figure 5 This is a diagram illustrating the main port according to an embodiment of the present invention. Figure 2 It is shown in Figure 1 The diagram shows an example of the first supply pipe. Figure 4 It is shown in Figure 1 The diagram shows the state of the nozzle head being charged.

[0037] According to this embodiment, the main port 900, installed in the substrate processing apparatus described later, is used for temporary storage when the nozzles spraying process liquid onto the substrate are not in use. It is configured to include a main body 910, a nozzle holder 920, an inclined surface 930, a first supply pipe 940, a second supply pipe 950, a conductive wire 960, a first switch 961, a grounding wire 970, and a second switch 971. The term "process liquid" refers to a general term for liquids used in the process, such as developing solutions and coating solutions, used in the substrate processing apparatus.

[0038] like Figure 1As shown, the main body 910, with an internal arrangement space 911, has a discharge hole 912 at its lower part for periodically spraying process liquid from the nozzle N and for discharging rinsing liquid for cleaning the process liquid. A thinner can be used as the rinsing liquid.

[0039] The nozzle holder 920 is arranged on the upper part of the main body 910 and supports the nozzle N.

[0040] The inclined surface 930, which is the inclined surface below the nozzle holder 920 in the space 911 formed inside the main body 910, is the surface along which the sprayed process liquid flows when the nozzle N periodically sprays out process liquid that may be contaminated by contact with air.

[0041] The first supply pipe 940 serves as a pipe for spraying flushing fluid to the head T side of the nozzle N, and extends through the body 910 to contact the head T of the nozzle N.

[0042] The first supply tube 940 is made of a plated or ion-implanted tube to make it easier to carry an electric charge.

[0043] Alternatively, the first supply pipe 940 can be configured as multiple vascular bundles 941, as shown in the diagram. Figure 2 In the form shown in (a) or (b). Figure 2 (a) is a form in which multiple through holes are formed in a tube. Figure 2 (b) is a form of multiple tubes combined, but constituting multiple vascular bundles 941 means that both forms are included. Thus, it is possible that the first supply tube 940 is composed of multiple vascular bundles 941 in order to increase the contact area with the flushing fluid 3 supplied through the first supply tube 940, thereby making the flushing fluid 3 more easily charged.

[0044] The second supply pipe 950 serves as a pipe for injecting rinsing fluid 4 into the interior of the main body 910, and the first supply pipe 940 is also a pipe that penetrates the main body 910.

[0045] The conductive wire 960 is an electrical wire that connects the inclined surface 930 and the first supply pipe 940. The first switch 961 is disposed on the conductive wire 960 to electrically connect or disconnect the inclined surface 930 and the first supply pipe 940.

[0046] The grounding wire 970 is a wire that electrically connects the inclined surface 930 and the grounding electrode 980. The second switch 971 is provided on the grounding wire 970 to electrically connect or disconnect the inclined surface 930 and the grounding electrode 980.

[0047] The mechanism for preventing the deposition of smoke 2 at the nozzle head T using the aforementioned configuration will be explained below.

[0048] First, such as Figure 1 As shown, with the first switch 961 closed and the second switch 971 open, process liquid 1 is ejected from nozzle N. Process liquid 1 carries a positive charge (+) as shown, therefore electrons in the first supply tube 940 move along the conductive line 960 towards the inclined surface 930, and the interior of the inclined surface 930 carries a negative charge (-).

[0049] Therefore, the first supply tube 940 carries a positive charge (+). In this state, as... Figure 3 As shown, if the first switch 961 is disconnected (the second switch 971 remains open), electrons cannot move and remain charged. At this time, if the rinsing fluid 3 is supplied through the first supply tube 940, electrons in the rinsing fluid 3 move towards the first supply tube 940, thereby making the rinsing fluid 3 positively charged (+).

[0050] Thus, if a positively charged (+) flushing fluid 3 is ejected from the head T of nozzle N, the surface of head T will be as follows: Figure 4 As shown, it carries a positive charge (+).

[0051] like Figure 1 as well as Figure 3 As shown, the smoke 2 carries a positive charge (+), and the surface of the head T also carries a positive charge (+), thus preventing the smoke 2 from depositing on the surface of the head T by electrostatic repulsion.

[0052] On the other hand, when the interior of the main body 910 needs cleaning, such as... Figure 5 As shown, with the nozzle N detached from the main body 910, the flushing fluid 4 is injected into the interior of the main body 910 through the second supply pipe 950. At this time, with the first switch 961 open, the second switch 971 is closed, thereby neutralizing the inclined surface 930 and converting it to a non-charged state. Since the flushing fluid 4 is supplied while the nozzle N is detached from the main body, preventing the nozzle N from becoming negatively charged (-), it is also expected that the nozzle head T will not carry a negative charge.

[0053] The substrate processing apparatus of the present invention will now be described in a second form.

[0054] The apparatus of this embodiment can be used to perform photolithography processes on substrates such as semiconductor wafers or flat panel display panels. In particular, the apparatus of this embodiment can be connected to an exposure apparatus to perform coating and development processes on the substrate. The following example illustrates the use of a wafer as a substrate.

[0055] Figure 6 This is a diagram showing the substrate processing equipment viewed from above. Figure 7 Observed in the AA direction Figure 6 Diagram of the equipment, Figure 8 Observing from the BB direction Figure 6 A diagram of the equipment.

[0056] Reference Figures 6 to 8 The substrate processing apparatus 1 includes a loading port 100, a transposition module 200, a buffer module 300, a coating and developing module 400, and an interface module 700. The loading port 100, the transposition module 200, the buffer module 300, the coating and developing module 400, and the interface module 700 are arranged in a row in one direction.

[0057] Hereinafter, the direction in which the loading port 100, the indexing module 200, the buffer module 300, the coating and developing module 400 and the interface module 700 are configured is called the first direction 12. When viewed from above, the direction perpendicular to the first direction 12 is called the second direction 14, and the direction perpendicular to the first direction 12 and the second direction 14 is called the third direction 16.

[0058] The substrate W moves while being housed within the pod 20. At this time, the pod 20 has a structure capable of being sealed from the outside. For example, a front-opening unified pod (FOUP) with a door at the front can be used as the pod 20.

[0059] The following provides a detailed description of the loading port 100, the indexing module 200, the buffer module 300, the coating and developing module 400, and the interface module 700.

[0060] The loading port 100 has a mounting stage 120 that supports and houses the substrate W in a cell 20. Multiple mounting stages 120 are provided, and the mounting stages 120 are arranged in a row along a second direction 14. Figure 6 Four mounting stations (120) are provided.

[0061] The indexing module 200 transfers substrate W between the cassette 20 of the mounting stage 120 supporting the loading port 100 and the buffer module 300. The indexing module 200 has a frame 210, an indexing robot 220, and a guide rail 230. The frame 210 is generally provided as a hollow cuboid shape and is disposed between the loading port 100 and the buffer module 300. The frame 210 of the indexing module 200 can be provided at a height lower than the frame 310 of the buffer module 300 (described later). The indexing robot 220 and the guide rail 230 are disposed within the frame 210. The indexing robot 220 has a structure capable of 4-axis drive, allowing a hand 221 that directly manipulates the substrate W to move and rotate in a first direction 12, a second direction 14, and a third direction 16. The indexing robot 220 has a hand 221, an arm 222, a support stage 223, and a bracket 224. The hand 221 is fixedly mounted on the arm 222. Arm 222 is provided as a telescopic and rotatable structure. Support platform 223 is configured along a third direction 16 in its length direction. Arm 222 is coupled to support platform 223 to allow movement along support platform 223. Support platform 223 is fixedly coupled to bracket 224. Guide rail 230 is provided as a guide rail configured along a second direction 14 in its length direction. Bracket 224 is coupled to guide rail 230 to allow guide rail 230 to move in a straight line. Additionally, although not shown, a door opener for opening and closing the door of crystal cell 20 is provided in frame 210.

[0062] The buffer module 300 includes a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a buffer robot 360. The frame 310 is provided with an internally hollow cuboid shape and is disposed between the indexing module 200 and the coating and developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are arranged sequentially from below along a third direction 16. The first buffer 320 is located at a height corresponding to the coating module 401 of the coating and developing module 400 (described later), and the second buffer 330 and the cooling chamber 350 are located at heights corresponding to the developing module 402 of the coating and developing module 400 (described later). The buffer robot 360 is arranged at a distance from the second buffer 330, the cooling chamber 350, and the first buffer 320 in a second direction 14.

[0063] First buffer 320 and second buffer 330 temporarily store multiple substrates W, respectively. Second buffer 330 has a housing 331 and multiple support platforms 332. Support platforms 332 are disposed within housing 331 and spaced apart from each other along a third direction 16. Each support platform 332 supports one substrate W. Housing 331 has openings (not shown) in the directions provided by the indexing robot 220, the buffer robot 360, and the developing robot 482, allowing the indexing robot 220, the buffer robot 360, and the developing robot 482 of the developing module 402 (described later) to move substrates W into or out of the support platforms 332 within housing 331. First buffer 320 has a structure substantially similar to second buffer 330. However, housing 321 of first buffer 320 has openings in the directions provided by the buffer robot 360 and the coating robot 432 of the coating module 401 (described later). The number of support platforms 322 provided in the first buffer 320 and the number of support platforms 332 provided in the second buffer 330 may be the same or different. According to one example, the number of support platforms 332 provided in the second buffer 330 may be greater than the number of support platforms 322 provided in the first buffer 320.

[0064] A buffer robot 360 transfers a substrate W between a first buffer 320 and a second buffer 330. The buffer robot 360 has a hand 361, an arm 362, and a support platform 363. The hand 361 is fixedly mounted on the arm 362. The arm 362 is provided as a telescopic structure, allowing the hand 361 to move along a second direction 14. The arm 362 is coupled to the support platform 363 so that the support platform 363 can move linearly along a third direction 16. The support platform 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support platform 363 can be provided to be longer in the upward or downward direction. The buffer robot 360 can simply be provided such that the hand 361 only drives two axes along the second direction 14 and the third direction 16.

[0065] Cooling chamber 350 cools each substrate W. Cooling chamber 350 has a housing 351 and a cooling plate 352. Cooling plate 352 has a top surface supporting the substrate W and a cooling member 353 for cooling the substrate W. The cooling member 353 can be cooled by various methods such as cooling water or by using a thermoelectric element. Alternatively, a lifting pin assembly (not shown) for positioning the substrate W on the cooling plate 352 may be provided in cooling chamber 350. Housing 351 has openings (not shown) in the directions provided by the indexing robot 220 and the developing robot 482, allowing the indexing robot 220 and the developing robot 482 provided in the developing module 402 (described later) to move the substrate W into or out of the cooling plate 352. In addition, a door (not shown) for opening and closing the aforementioned openings may be provided in cooling chamber 350.

[0066] The coating and developing module 400 performs a process of coating photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The coating and developing module 400 is generally rectangular in shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The coating module 401 and the developing module 402 are configured to be divided into layers between each other. According to one example, the coating module 401 is located above the developing module 402.

[0067] The coating module 401 includes a process for coating a substrate W with a photosensitive liquid, such as photoresist, and a heat treatment process, such as heating and cooling the substrate W before and after the resist coating process. The coating module 401 has a resist coating chamber 410, a baking chamber 420, and a transport chamber 430. The resist coating chamber 410, baking chamber 420, and transport chamber 430 are arranged sequentially along a second direction 14. Therefore, the resist coating chamber 410 and the baking chamber 420 are spaced apart from each other in the second direction 14 via the transport chamber 430. Multiple resist coating chambers 410 are provided, with multiple chambers provided in both the first direction 12 and the third direction 16. Multiple baking chambers 420 are provided in both the first direction 12 and the third direction 16.

[0068] The transport chamber 430 and the first buffer 320 of the buffer module 300 are arranged parallel to each other in the first direction 12. The coating robot 432 and the guide rail 433 are arranged inside the transport chamber 430. The transport chamber 430 is generally rectangular in shape.

[0069] The coating robot 432 transfers substrate W between the baking chamber 420, the resist coating chamber 410, and the first buffer 320 of the buffer module 300. A guide rail 433 is configured such that its length direction is parallel to a first direction 12. The guide rail 433 guides the coating robot 432 to move linearly in the first direction 12. The coating robot 432 has a hand 434, an arm 435, a support platform 436, and a bracket 437. The hand 434 is fixedly mounted on the arm 435. The arm 435 is provided with a telescopic structure, allowing the hand 434 to move horizontally. The support platform 436 is provided such that its length direction is arranged along a third direction 16. The arm 435 is coupled to the support platform 436 to allow linear movement along the support platform 436 in the third direction 16. The support platform 436 is fixedly coupled to the bracket 437, and the bracket 437 is coupled to the guide rail 433 to allow movement along the guide rail 433.

[0070] The resist coating chambers 410 all have the same structure. However, the type of photoresist used in each resist coating chamber 410 can be different from each other. As an example, a chemical amplification resist can be used as the photoresist. The resist coating chambers 410 provide a substrate processing apparatus for coating photoresist on a substrate W. Figure 9 It shows the direction Figure 6 A cross-sectional view of the substrate processing apparatus provided by the coating chamber. Figure 10 It is shown Figure 9 A plan view of the substrate processing apparatus. (Refer to...) Figure 9 as well as Figure 10 The substrate processing apparatus 800 includes a housing 850, a substrate support unit 810, a lifting unit 880, a liquid supply unit 890, and a main port 900.

[0071] The housing 850 has an internal processing space for performing coating processes. The housing 850 is provided with a barrel shape that is open at its top. The housing 850 includes a recovery tank 860 and a guide wall 870. The recovery tank 860 is provided with an annular shape to enclose the substrate support unit 810. The guide wall 870 is provided with an annular shape inside the recovery tank 860 to enclose the substrate support unit 810. The space between the recovery tank 860 and the guide wall 870 provides a recovery space 865 for recovering the processing liquid. The bottom surface of the recovery tank 860 is connected to a recovery line 868. The recovery line 868 discharges the processing liquid flowing into the recovery tank 860 to the outside. The discharged processing liquid can be reused by a processing liquid regeneration system (not shown).

[0072] The recycling bin 860 includes a first inclined wall 862, a vertical wall 864, and a bottom wall 866. The first inclined wall 862 is provided to surround the substrate support unit 810. The first inclined wall 862 is provided to slope downwards in a direction extending away from the substrate support unit 810. The vertical wall 864 extends vertically to the ground in a downward direction from the lower end of the first inclined wall 862. The bottom wall 866 extends horizontally from the lower end of the vertical wall 864 in a direction toward the central axis of the substrate support unit 810.

[0073] A guide wall 870 is located between the first inclined wall 862 and the bottom wall 866. The guide wall 870 includes a second inclined wall 872 and a partition wall 874. The second inclined wall 872 is provided to surround the substrate support unit 810. The second inclined wall 872 is provided to slope downwards in a direction extending away from the substrate support unit 810. The upper ends of each of the second inclined wall 872 and the first inclined wall 862 are aligned vertically in the vertical direction. The partition wall 874 extends vertically downwards from the upper end of the second inclined wall 872. The partition wall 874 connects the second inclined wall 872 and the bottom wall 866.

[0074] The substrate support unit 810 supports and rotates the substrate within the housing 850. The substrate support unit 810 includes a support plate 820 and a drive component 830. The upper surface of the support plate 820 is engaged with pins 822 and 824 that support the substrate. Support pins 822 support the bottom surface of the substrate, and clamping pins 824 support the side surface of the substrate. The support plate 820 is rotatable via the drive component 830. The drive component 830 includes a drive shaft 832 and a driver 834.

[0075] The driver 834 engages with the bottom surface of the support plate 820. The driver 834 provides rotational force to the drive shaft 832. For example, the driver 834 may be a motor.

[0076] The lifting unit 880 raises and lowers the housing 850 in the vertical direction and adjusts the relative position between the housing 850 and the base plate support unit 810. The lifting unit 880 includes a bracket 882, a moving shaft 884, and a driver 886. The bracket 882 is fixedly mounted on the inclined wall of the housing 850. The moving shaft 884, which moves vertically via the driver 886, is fixedly engaged within the bracket 882.

[0077] Liquid supply unit 890 supplies processing liquid to a substrate W supported on a support plate 820. Liquid supply unit 890 includes nozzles 892 for supplying processing liquid to the substrate W and nozzle moving member 893. Multiple nozzles 892 are provided. Each nozzle 892 is connected to a processing liquid supply line. The multiple nozzles 892 are in standby mode at a main port 900. One of the multiple nozzles 892 can be moved by the nozzle moving member 893 to a process position and a standby position. Here, the process position is the position of the nozzle 892 relative to the substrate W supporting the support plate 820. The standby position is the position where the nozzle 892 is in standby mode at the main port 900. For example, the processing liquid can be an electrically conductive liquid. The processing liquid can be charged particles. The processing liquid can be a photosensitive liquid such as photoresist.

[0078] The nozzle moving component 893 includes a guide rail 894, an arm 896, and a driver (not shown). The guide rail 894 is located on one side of the housing 850. The guide rail 894 is oriented along a first direction 12 along its length. The arm 896 is disposed on the guide rail 894. The arm 896 is provided to have a rod shape. One end of the arm 896 is fixedly disposed on the guide rail 894, and the other end is provided for detachment of the nozzle 892. The driver can provide driving force to the guide rail 894 to move the arm 896 and the nozzle 892 back and forth in the first direction 12 or the opposite direction. The arm 896 and the nozzle 892 disposed thereon can be moved to a process position and a standby position via the guide rail 894 and the driver. For example, the driver may be a motor.

[0079] The main port 900 is configured to allow the nozzle 892 to standby or be stored when no coating process is performed. The main port 900 has been fully explained, so further explanation is omitted.

Claims

1. A main port provided in a substrate processing apparatus to temporarily support a nozzle for ejecting a process liquid toward a substrate when the nozzle is not in use, wherein, The main port includes: The main body has internal space; A nozzle holder is arranged on the upper part of the main body and is used to support the nozzle; An inclined surface is formed on the lower side of the nozzle holder portion in the space to provide for the flow of process liquid ejected from the nozzle supported on the nozzle holder portion; A first supply pipe, which extends through and is formed in the body, is used to spray flushing fluid into the head of the nozzle; A second supply pipe is formed through and in the main body, and a flushing fluid is injected into the interior of the main body; A conductive wire electrically connects the inclined surface and the first supply pipe; A first switch is disposed on the conductive line; and Control Department The control unit controls the process liquid to be ejected from the nozzle supported on the nozzle holder when the first switch is closed, and then, when the first switch is open, to eject rinsing liquid into the head of the nozzle through the first supply pipe.

2. The main port according to claim 1, wherein, The main port also includes a grounding wire that electrically connects the inclined surface and the grounding electrode to discharge conductive charge to the inclined surface, and a second switch disposed on the grounding wire.

3. The main port according to claim 1 or 2, wherein, The first supply tube is formed by multiple vascular bundles.

4. The main port according to claim 1 or 2, wherein, The first supply tube is subjected to ion implantation or coating treatment.

5. The main port according to claim 3, wherein, The first supply tube is subjected to ion implantation or coating treatment.

6. The main port according to claim 1 or 2, wherein, The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

7. The main port according to claim 3, wherein, The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

8. The main port according to claim 4, wherein, The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

9. The main port according to claim 5, wherein, The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

10. The main port according to claim 1 or 2, wherein, The rinsing solution is a diluent.

11. A substrate processing apparatus, comprising: The casing has internal processing space; A substrate support unit supports the substrate within the housing; The liquid supply unit has a nozzle for supplying processing liquid to the substrate; The main port, located outside the housing, serves as a standby port for the nozzles and discharges the treatment fluid ejected from the nozzles to the outside. The main port includes: The main body has internal space; A nozzle holder is arranged on the upper part of the main body and is used to support the nozzle; An inclined surface is formed on the lower side of the nozzle holder portion in the space to provide for the flow of process liquid ejected from the nozzle supported on the nozzle holder portion; A first supply pipe, which extends through and is formed in the body, is used to spray flushing fluid into the head of the nozzle; A second supply pipe is formed through and in the main body, and a flushing fluid is injected into the interior of the main body; A conductive wire electrically connects the inclined surface and the first supply pipe; A first switch is disposed on the conductive line; and Control Department The control unit controls the process liquid to be ejected from the nozzle supported on the nozzle holder when the first switch is closed, and then, when the first switch is open, to eject rinsing liquid into the head of the nozzle through the first supply pipe.

12. The substrate processing apparatus according to claim 11, wherein, The main port also includes a grounding wire that electrically connects the inclined surface and the grounding electrode to discharge conductive charge to the inclined surface, and a second switch disposed on the grounding wire.

13. The substrate processing apparatus according to claim 11 or 12, wherein, The first supply tube is formed by multiple vascular bundles.

14. The substrate processing apparatus according to claim 11 or 12, wherein, The first supply tube is subjected to ion implantation or coating treatment.

15. The substrate processing apparatus according to claim 13, wherein, The first supply tube is subjected to ion implantation or coating treatment.

16. The substrate processing apparatus according to claim 11 or 12, wherein, The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

17. The substrate processing apparatus according to claim 13, wherein, The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

18. The substrate processing apparatus according to claim 14, wherein, The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

19. The substrate processing apparatus according to claim 15, wherein, The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

20. A main port provided in a substrate processing apparatus to temporarily support a nozzle for ejecting a process liquid toward a substrate when the nozzle is not in use, wherein, The main port includes: The main body has internal space; A nozzle holder is arranged on the upper part of the main body and is used to support the nozzle; An inclined surface is formed on the lower side of the nozzle holder portion in the space to provide for the flow of process liquid ejected from the nozzle supported on the nozzle holder portion; A first supply pipe, which extends through and is formed in the body, is used to spray flushing fluid into the head of the nozzle; A second supply pipe is formed through and in the main body, and a flushing fluid is injected into the interior of the main body; A conductive wire electrically connects the inclined surface and the first supply pipe; A first switch is disposed on the conductive line; A grounding wire electrically connects the inclined surface and the grounding electrode to discharge conductive charge to the inclined surface; A second switch is installed on the grounding wire; and Control Department The first supply tube is formed from multiple vascular bundles that have been coated or ion-implanted. The control unit controls the process liquid to be ejected from the nozzle supported on the nozzle holder when the first switch is closed, and then, when the first switch is open, to eject rinsing liquid into the head of the nozzle through the first supply pipe. The process fluid ejected from the nozzle carries a positive charge. The inclined surface becomes negatively charged by the sprayed process liquid. When the first supply pipe is positively charged due to the movement of charge from the negatively charged inclined surface through the conductive line, the flushing liquid is sprayed out, thereby making the surface of the nozzle positively charged.

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