Mounting device, method for adjusting a lighting system, and method for manufacturing a semiconductor device

Abstract

The present application provides a mounting device capable of improving the recognition accuracy of a workpiece, a method for adjusting an illumination system, and a method for manufacturing a semiconductor device. The mounting device includes an illumination system that emits a light amount based on an illumination value; a camera that captures a workpiece to which the illumination system has applied light; and a control unit that controls the output of the illumination system and the image processing of an image captured by the camera. The control unit is configured to, in the event of a recognition error of the workpiece, set the illumination value to a predetermined value, capture the workpiece to which the illumination system has applied light by the camera to obtain an acquired image, search the acquired image to obtain a pattern image that is most similar to a template image, calculate a matching coincidence rate of the most similar pattern image and the template image, change the predetermined value, and find the illumination value with the highest matching coincidence rate.

Description

Technical Field

[0001] This invention relates to mounting apparatus, such as a chip mounter applicable to a camera equipped with a bare chip and substrate. Background Technology

[0002] A portion of the semiconductor device manufacturing process includes a process of assembling and packaging semiconductor chips (hereinafter referred to as bare chips) by mounting them on a wiring substrate or lead frame (hereinafter referred to as a substrate). A portion of this assembly and packaging process includes a process of dicing the bare chips from a semiconductor wafer (hereinafter referred to as a wafer) (dicing process) and a mounting process of mounting the diced bare chips onto the substrate. The semiconductor manufacturing equipment used in the mounting process is a chip mounter or similar mounting equipment.

[0003] Typically, the positioning of bare chips and substrates (hereinafter referred to as workpieces) in a chip mounting machine is achieved by illuminating the workpieces with light using an illumination system (illumination device) and processing images captured by a camera. Therefore, the accuracy of workpiece recognition is greatly affected by the amount of light (illumination output) from the illumination system.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-147258 Summary of the Invention

[0007] The objective of this invention is to provide a technique that can improve the accuracy of workpiece recognition. Other objectives and novel features will become apparent from the description and accompanying drawings.

[0008] A brief summary of a representative solution in this invention is as follows.

[0009] That is, the installation device includes: an illumination system that emits light based on an illumination value; an imaging device that captures images of a workpiece illuminated by the illumination system; and a control unit that controls the output of the illumination system and processes the images captured by the imaging device. The control unit is configured to, in the event of a workpiece recognition error, set the illumination value to a predetermined value, capture images of the workpiece illuminated by the illumination system using the imaging device to obtain an image, search the acquired image to obtain a pattern image most similar to a template image, calculate the matching rate between the most similar pattern image and the template image, change the predetermined value, and determine the illumination value with the highest matching rate.

[0010] Invention Effects

[0011] According to the present invention, the recognition accuracy of workpieces can be improved. Attached Figure Description

[0012] Figure 1 This is a schematic top view showing an example of the structure of the chip mounting machine in the embodiment.

[0013] Figure 2 This means that in Figure 1 A diagram showing the approximate structure when viewed from the direction of arrow A.

[0014] Figure 3 It means Figure 1 The diagram shows a schematic structure of the control system of the chip mounting machine.

[0015] Figure 4 It means Figure 1 The diagram shows the optical system of the wafer supply section in a chip mounting machine.

[0016] Figure 5 This is a diagram showing an example of a unique part (selected area).

[0017] Figure 6 This is a diagram representing examples of entered images and similar images.

[0018] Figure 7 This is a conceptual diagram illustrating the transfer of formula data.

[0019] Figure 8 It is a diagram representing the image of the bare chip and the template image.

[0020] Figure 9 It is a diagram illustrating the difference in distance and angle between patterns.

[0021] Figure 10 This is a graph showing the relationship between illumination values ​​and consistency in the implementation method.

[0022] Figure 11 This is a flowchart illustrating the automatic adjustment of lighting values ​​in the implementation method.

[0023] Figure 12 This is a flowchart illustrating the automatic adjustment of lighting values ​​in the implementation method.

[0024] Figure 13 This is a flowchart illustrating the automatic adjustment of lighting values ​​in the implementation method.

[0025] Figure 14 This is a graph showing the relationship between illumination values ​​and uniformity in the first and second variations.

[0026] Figure 15 This is a graph showing the relationship between illumination values ​​and uniformity in the third variation.

[0027] Explanation of reference numerals in the attached figures

[0028] 8. Control Department

[0029] 24. Chip recognition camera (image capture device)

[0030] C··· Pattern Image

[0031] D... Bare chip (workpiece)

[0032] PT Template Images Detailed Implementation

[0033] Hereinafter, embodiments and variations will be described using the accompanying drawings. However, in the following description, the same structural elements may be labeled with the same reference numerals and repeated descriptions may be omitted. Furthermore, to make the description clearer, the drawings may schematically show the width, thickness, shape, etc. of each part compared to the actual form, but these are merely examples and do not limit the interpretation of the present invention.

[0034] use Figure 1 and Figure 2 Let's illustrate the structure of a chip mounting machine as an example of an mounting device.

[0035] The chip placement machine 10 generally includes a bare chip supply unit 1, a pick-up unit 2, an intermediate stage unit 3, a placement unit 4, a transport unit 5, a substrate supply unit 6, a substrate removal unit 7, and a control unit 8 that monitors and controls the operation of each part. The Y-axis direction is the front-to-back direction of the chip placement machine 10, and the X-axis direction is the left-to-right direction. The bare chip supply unit 1 is located near the front of the chip placement machine 10, and the placement unit 4 is located on the inner side. Here, one or more product areas (hereinafter referred to as package areas P) that will ultimately become a package are printed on the substrate S.

[0036] The bare die supply unit 1 includes a wafer holding stage 12 for holding wafers 11 and a push-up unit 13 (shown in dashed lines) for pushing bare dies D from wafers 11. The wafer holding stage 12 moves in the XY direction via a drive mechanism (not shown) to move the bare die D to be picked up to the position of the push-up unit 13. The push-up unit 13 moves in the vertical direction via a drive mechanism (not shown). The wafer 11 is bonded to a dicing tape 16 and divided into multiple bare dies D. The wafer 11 is held on a wafer ring (not shown). In addition, a film-like adhesive material called die bond film (DAF) is bonded between the wafer 11 and the dicing tape 16.

[0037] The pickup unit 2 includes: a pickup head 21 for picking up a bare die D; a Y-drive unit 23 for moving the pickup head 21 in the Y direction; various drive units (not shown) for raising, lowering, rotating, and moving the collet 22 in the X direction; and a die recognition camera 24 for recognizing the posture of the bare die D on the die 11. The pickup head 21 has a collet 22 that holds the pushed-up bare die D at its front end, picks up the bare die D from the bare die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has various drive units (not shown) for raising, lowering, rotating, and moving the collet 22 in the X direction.

[0038] The intermediate stage 3 has an intermediate stage 31 for temporarily mounting the bare chip D, and a stage recognition camera 32 for recognizing the bare chip D on the intermediate stage 31.

[0039] The placement unit 4 includes a placement head 41, a Y-drive unit 43, and a substrate recognition camera 44. The placement head 41, like the pick-up head 21, includes a collet 42 that holds the bare die D at its front end. The Y-drive unit 43 moves the placement head 41 in the Y-axis direction. The substrate recognition camera 44 captures images of the position recognition marks (not shown) on the packaging area P of the substrate S to identify the placement position. The placement unit 4 picks up the bare die D from the intermediate stage 31 and places it either onto the packaging area P of the transported substrate S or stacks it on top of a bare die already placed on the packaging area P of the substrate S. With this structure, the placement head 41 corrects its pick-up position and posture based on the image data captured by the stage recognition camera 32, picking up the bare die D from the intermediate stage 31. Furthermore, the mounting head 41 mounts the bare chip D based on the data captured by the substrate recognition camera 44, either by stacking it onto the packaging area P of the substrate or by stacking it onto the bare chip that has already been mounted on the packaging area P of the substrate S.

[0040] The transport section 5 has a substrate transport claw 51 for gripping and transporting the substrate S, and a transport channel 52 for moving the substrate S. The substrate S is moved by driving a nut (not shown) on the substrate transport claw 51 provided on the transport channel 52 using a ball screw (not shown) provided along the transport channel 52. With this structure, the substrate S moves from the substrate supply section 6 along the transport channel 52 to the mounting position, and after mounting, moves to the substrate delivery section 7, where the substrate S is delivered.

[0041] Next, use Figure 3 Explanation of Control Section 8.

[0042] The control system 80 includes a control unit (control device) 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 mainly includes a control and arithmetic unit 81 composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus 84, and a power supply unit 85. The storage device 82 includes a main storage device 82a composed of RAM (Random Access Memory) for storing processing programs, and an auxiliary storage device 82b composed of HDD (Hard Disk Drive), SSD (Solid State Drive), etc., for storing control data and image data required for control.

[0043] The input / output device 83 includes: a monitor 83a displaying device status and information; a touch panel 83b for inputting operator instructions; a mouse 83c for operating the monitor; and an image acquisition device 83d for acquiring image data from the optical system 88. Additionally, the input / output device 83 includes: a motor control device 83e that controls the drive units 86 of the XY stage (not shown) of the bare die supply unit 1 and the ZY drive shaft of the placement head stage; and an I / O signal control device 83f that receives signals from or controls signals from a signal unit 87 including various sensors, switches, and potentiometers that control the brightness of the illumination device 26 (described later). The optical system 88 includes a wafer recognition camera 24, a stage recognition camera 32, and a substrate recognition camera 44. The control and calculation unit 81 receives the required data via the bus 84, performs calculations, thereby controlling the pickup head 21 and sending information to the monitor 83a.

[0044] The control unit 8 stores the image data captured by the wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 in the storage device 82 via the image acquisition device 83d. Using software programmed based on the stored image data, the control and computing unit 81 performs positioning of the bare die D and the packaging area P of the substrate S, as well as surface inspection of the bare die D and the substrate S. Based on the position of the bare die D and the packaging area P of the substrate S calculated by the control and computing unit 81, the drive unit 86 is operated by the motor control device 83e via software. This process positions the bare die on the wafer, and the bare die D is mounted onto the packaging area P of the substrate S by the operation of the pick-up unit 2 and the drive unit of the mounting unit 4. The wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 quantify light intensity and color. The wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 are also referred to as imaging devices.

[0045] Next, we will explain the chip mounting process, which is a step in the manufacturing method of semiconductor devices.

[0046] In the chip mounting process of this embodiment, firstly, a wafer ring with the assembled wafer is prepared and transported into the chip mounter 10 (P1 process). The control unit 8 places the wafer ring onto the wafer holding stage 12 and transports the wafer holding stage 12 to the reference position where the bare chip D is to be picked up (P2 process). Then, the substrate S is prepared and transported into the chip mounter 10 (P3 process). The control unit 8 places the substrate S into the transport channel 52 via the substrate supply unit 6. The control unit 8 moves the substrate transport claw 51 that grips and transports the substrate S to the mounting position (P4 process).

[0047] Next, in process P2, the control unit 8 moves the wafer holding stage 12, on which the wafer 11 is placed, at a predetermined interval and holds it horizontally, thereby positioning the first bare chip D to be picked up at the picking position (process P5).

[0048] Next, in step P5, the control unit 8 takes an image of the main surface (top surface) of the bare chip D to be picked up using the wafer recognition camera 24, and calculates the positional offset of the bare chip D from the aforementioned pickup position from the acquired image. Based on this positional offset, the control unit 8 moves the wafer holding stage 12, which holds the wafer 11, to accurately position the bare chip D to the pickup position (step P6). Then, the control unit 8 takes an image of the main surface (top surface) of the bare chip D using the wafer recognition camera 24, and performs surface inspection of the bare chip D from the acquired image (step P7).

[0049] Next, in step P4, the control unit 8 takes an image of the substrate S using the substrate recognition camera 44 and positions the substrate S based on the captured image (step P8). Then, the control unit 8 takes an image of the substrate S using the substrate recognition camera 44 and performs a surface inspection of the packaging area P of the substrate S from the acquired image (step P9).

[0050] Next, in process P8, the control unit 8 picks up the bare die D from the dicing tape 16 using the pick-up head 21, which includes the collet 22, and places it onto the intermediate stage 31 (process P10). The same steps are then followed to peel the bare dies D one by one from the dicing tape 16. Once all bare dies D except for defective ones have been picked up, the dicing tape 16 and wafer ring, which held the bare dies D in the shape of the wafer 11, are removed.

[0051] Next, in step P10, the control unit 8 uses the stage recognition camera 32 to capture images to detect the posture deviation of the bare chip placed on the intermediate stage 31. If posture deviation exists, the control unit 8 corrects it by driving the intermediate stage 31 on a surface parallel to the mounting surface with the mounting position using a drive device (not shown) provided on the intermediate stage 31 (step P11). Then, the control unit 8 captures images of the bare chip placed on the intermediate stage 31 using the stage recognition camera 32, and performs surface inspection of the bare chip D from the acquired images (step P12).

[0052] Next, in process P12, the control unit 8 picks up the bare chip D from the intermediate stage 31 through the mounting head 41, which includes the collet 42, and mounts it onto the packaging area P of the substrate S or onto the bare chip that has already been mounted in the packaging area P of the substrate S (process P13).

[0053] Following step P13, after mounting the bare chip D, the control unit 8 uses the substrate recognition camera 44 to photograph the bare chip D and the substrate S to check the accuracy of their mounting positions (step P14). At this time, the center of the bare chip and the center of the solder pad are determined, and their relative positions are checked to ensure they are correct. Then, the control unit 8 uses the substrate recognition camera 44 to photograph the bare chip D and the substrate S, and performs surface inspection of the bare chip D and the substrate S based on the acquired images (step P15).

[0054] Subsequently, following the same steps, bare chips D are mounted one by one onto the packaging area P of substrate S. Once the mounting of one substrate is complete, substrate S is moved to substrate removal section 7 by substrate transport claw 51 and delivered to substrate removal section 7 (P16 process). Then, substrate S is removed from chip mounter 10 (P17 process).

[0055] As described above, bare dies D are mounted onto substrate S via a die bonding film and removed from the die mounter. Then, in the wire bonding process, they are electrically connected to the electrodes of substrate S via Au wires. In the case of manufacturing a stacked package, substrate S with the bare dies D mounted is then placed into the die mounter and a second bare die D is stacked onto the bare die D mounted on substrate S via a die bonding film. Then, after being removed from the die mounter, it is electrically connected to the electrodes of substrate S via Au wires through a wire bonding process. After the second bare die is peeled from the dicing tape 16 using the above method, subsequent bare dies D are transported to the mounting position and stacked onto the bare die D. After repeating the above process a predetermined number of times, substrate S is transported to the injection molding process, where multiple bare dies D and Au wires are sealed with injection molding resin (not shown), thereby completing the stacked package.

[0056] Next, use Figure 4 Explain the optical system of pickup unit 2.

[0057] An objective lens 25 is mounted on the chip recognition camera 24, forming a structure for capturing an image of the main surface of the bare chip D through the objective lens 25. Between the objective lens 25 and the bare chip D, an illumination device 26 is disposed, which internally includes a surface-emitting illumination (light source) 261 and a semi-transparent mirror (semi-transparent lens) 262. Irradiation light from the surface-emitting illumination 261 is reflected through the semi-transparent mirror 262 onto the bare chip D along the same optical axis as the chip recognition camera 24. This light, irradiated onto the bare chip D along the same optical axis as the chip recognition camera 24, is reflected on the bare chip D, and the positively reflected light passes through the semi-transparent mirror 262 and reaches the chip recognition camera 24, forming an image of the bare chip D. That is, the illumination device 26 has the function of coaxial incident illumination (coaxial illumination). The illumination device 26 is connected to an output controller 27, which serves as a dimming device. The output controller 27 controls the illumination output (light intensity) of the illumination device 26 based on the illumination value (LV) from the control unit 8. The lighting device 26 and the output controller 27 constitute the lighting system.

[0058] The optical system (stage recognition camera 32 and its illumination device) of the intermediate stage section 3 and the optical system (substrate recognition camera 44 and its illumination device) of the mounting section 4 have the same structure as the optical system (chip recognition camera 24 and illumination device 26) of the pickup section 2.

[0059] Next, use Figure 5 and Figure 6 Explain the method for locating bare chips.

[0060] The bare chip localization algorithm primarily uses template matching and is based on commonly known normalized correlation formulas. The result is set as the matching consistency rate (matching score). Template matching incorporates both reference-learning imitation actions and continuous operation actions.

[0061] First, use Figure 5 and Figure 6 The control unit 8 moves the reference sample to the pickup position. The control unit 8 acquires an image PCr of the reference sample via the chip recognition camera 24. For example, the operator of the chip placement machine selects at least one from the image via a human-machine interface (touch panel 83b or mouse 83c). Figure 5 The unique portion UA ​​shown is used. Preferably, multiple unique portions UA are selected. The control unit 8 saves the positional relationship (coordinates) between at least one selected unique portion (selection area) UA and the reference sample to the storage device 82. Figure 5 The image of the selected region UA ​​shown is used as Figure 6 The template image PT shown is saved to storage device 82. Preferably, multiple template images PT are saved. The workpiece image and its coordinates, which will serve as a reference, are saved to the storage device.

[0062] Next, use Figure 6 This describes a continuous operation. The control unit 8 moves the product wafer, which is a component, to the pick-up position for production purposes. The control unit 8 uses a wafer recognition camera 24 to photograph the product wafer and acquire an image PCn of the bare chip. (Example...) Figure 6 As shown, the control unit 8 compares the template image PT saved by imitating the action with the acquired image PCn of the bare chip for the product, retrieves the image PTn of the most similar part, and calculates the coordinates of the retrieved image PTn. These coordinates are then compared with the coordinates measured in the reference sample to calculate the position of the bare chip for the product (the offset between image PTn and template image PT).

[0063] Furthermore, multiple identical manufacturing units are installed on the production line. Conditions are pre-set for each product type in one unit, and formula data is created accordingly. This formula data is then transferred to other units, allowing for processing under the same conditions. This method enables processing under identical conditions across multiple units while minimizing the time required for production start-up.

[0064] Next, use Figure 7 This describes a method for pre-setting conditions in one device (the first device) in a production line and then transferring the created formula data to other devices (the second device).

[0065] The first chip mounter 10-1, serving as the first device, and the second chip mounter 10-2, serving as the second device, have the same structure as the chip mounter 10. The chip mounters 10-1 and 10-2 are equipped with a chip recognition camera 24 and an illumination device 26.

[0066] The images, image-related parameters, coordinates, illumination values ​​(LV), etc., used in the positioning of the bare chip as described above are maintained as a set of recipe data for each product type when starting production. This set of data is called recipe data (RCP).

[0067] Methods for transferring recipe data (RCP) between devices include methods using external storage media such as USB memory and CD-ROM, methods connecting devices via communication means such as wired LAN or wireless LAN, and methods connecting the first chip mounter 10-1 and the second chip mounter 10-2 via a host via wired LAN or wireless LAN.

[0068] In the first chip mounter 10-1, the control unit 8 creates recipe data (RCP), and the created recipe data (RCP) is transferred to the second chip mounter 10-2. The transferred recipe data (RCP) includes the template image PT, coordinate data, illumination value (LV), etc., obtained through the above-described imitation action for use in template matching.

[0069] The control unit 8 of the second chip mounter 10-2 illuminates the product using an illumination device 26 or the like based on the illumination value (LV) of the recipe data (RCP) received from the first chip mounter 10-1, and takes a picture of the product to which the transplanted recipe data (RCP) is applied using a chip recognition camera 24 or the like of the second chip mounter 10-2. At this time, if the illumination value (LV) of the recipe data (RCP) is not the optimal illumination value, there is a possibility that the same image as that of the first chip mounter 10-1 cannot be obtained in the second chip mounter 10-2. Furthermore, even if the illumination value (LV) of the recipe data (RCP) is the optimal illumination value (LV), there is a possibility that the same image as that of the first chip mounter 10-1 cannot be obtained in the second chip mounter 10-2 due to mechanical errors in the illumination systems, cameras, and lenses of the first and second chip mounters 10-1 and 10-2. For example, there are cases where... Figure 7 The varying shades of the images on the left and right bare chip D are due to the influence of mechanical errors in the lighting system on the lighting output, resulting in different illumination methods for the products and thus causing recognition errors (because the images are not clear, accurate recognition is not possible).

[0070] In other words, when template matching is performed using the transplanted formula data through the control unit 8 of the second chip mounter 10-2, even identical products may experience the following issues: due to their mechanical errors, the matching accuracy decreases, reducing the durability (robustness) of the production process against unforeseen changes, and preventing the proper processing of image algorithms such as bare chip positioning. A matching accuracy below a specified value is considered a recognition error. This specified value is, for example, 70-80%.

[0071] Furthermore, the control unit 8 of the first chip placement machine 10-1 illuminates the product using an illumination device 26 or similar device based on the illumination value (LV) of the recipe data (RCP), and repeatedly photographs the same product using a chip recognition camera 24 or similar device. If the number of repetitions increases, there may be situations where the illumination device 26 or similar device in the first chip placement machine 10-1 deteriorates over time, resulting in an image that is no longer identical to the previous one. For example, changes in illumination output may alter the way the product is photographed, leading to recognition errors. In other words, when template matching is performed in the first chip placement machine 10-1 using the recipe data (RCP), even for the same product, changes in illumination output, etc., may reduce the matching accuracy, resulting in recognition errors.

[0072] use Figure 8 and Figure 9 This outlines a method for determining the optimal illumination value in order to address the problems of optical systems that include illumination systems (illumination devices).

[0073] In the second chip mounter 10-2 that has transferred formula data (RCP) or the first chip mounter 10-1 that has undergone time-related changes (hereinafter referred to as the adjustment device), when the control unit 8 performs the aforementioned continuous operation, the following processing is performed when a bare chip identification error occurs. Additionally, if the lighting device 26 or the like in the second chip mounter 10-2, which has undergone the following processing, undergoes time-related changes and a bare chip identification error occurs, the following processing is also performed. This can also be performed even when no identification error occurs (before an identification error occurs).

[0074] like Figure 8 As shown, the two images of the template image PT contained in the formula data (RCP) are referred to as template images A1 and A2. Additionally, the product image captured by the chip recognition camera 24 in the adjustment device is referred to as acquisition image B. The two images in acquisition image B that are most similar to template images A1 and A2 are referred to as pattern images C1 and C2, respectively. Pattern images C1 and C2 are collectively referred to as pattern image C.

[0075] The matching accuracy (hereinafter referred to as the accuracy (MR)) of the pattern image C and the template image PT is, for example, the average of the accuracy (MR1) of the first pattern image C1 and the first template image A1 and the accuracy (MR2) of the second pattern image C2 and the second template image A2.

[0076] The control unit 8 of the adjustment device identifies the bare chip while changing the illumination value (LV), searching for the illumination value (LVm) with the highest consistency. If multiple illumination values ​​(LVm) have the highest consistency, the one with the smallest inter-pattern distance difference (PD) is selected. Here, as... Figure 9 As shown, the inter-pattern distance difference (PD) is the difference between the distance (dA) between the first template image A1 and the second template image A2, and the distance (dC) between the first pattern image C1 and the second pattern image C2. When multiple illumination values ​​(LVm) with the highest consistency are present, and the inter-pattern distance difference (PD) is also the same, the one with the smaller inter-pattern angle difference (PA) is used. Here, as... Figure 9 As shown, the angle difference (PA) between patterns is the difference between the angle (θA) of the straight line connecting the first template image A1 and the second template image A2 and the angle (θC) of the straight line connecting the first pattern image C1 and the second pattern image C2.

[0077] Then, the control unit 8 sets the lighting value (LVm) with the highest consistency obtained as the optimal lighting value, and sets the optimal lighting value as the lighting value (LV) of the recipe data.

[0078] use Figures 10 to 13 Details of the method for automatically adjusting lighting values.

[0079] like Figure 10 As shown, the control unit 8 identifies the pattern image C and the template image PT by adding a predetermined check interval (CI) to the illumination value (LV) within a predetermined range (SR) each time. Here, the predetermined range (SR) is from the minimum illumination value (LVmin) to the maximum illumination value (LVmax). The illumination value (LV) is, for example, a 256-level grayscale from 0 to 255 (LVmin = 0, LVmax = 255). In addition, CI = 1. The consistency at the illumination value (LVm) with the highest consistency is called MRm. Furthermore, the control unit 8 may also identify the pattern image C and the template image PT by decreasing the illumination value (LV) from the maximum illumination value (LVmax) each time until the minimum illumination value (LVmin) is reached. In addition, the predetermined range (SR) may not be between the minimum illumination value (LVmin) and the maximum illumination value (LVmax), but between an illumination value greater than the minimum illumination value (LVmin) and an illumination value smaller than the maximum illumination value (LVmax).

[0080] like Figure 11As shown, the control unit 8 begins automatic adjustment of the illumination value in the bare chip identification process (start). First, the control unit 8 changes the illumination value (LV) to the check illumination value (CLV) (step S21). The check illumination value (CLV) is a variable used to store the currently checked illumination value (LV). Here, the initial value of the check illumination value (CLV) is 0.

[0081] Next, the control unit 8 presets (sets) the shooting conditions of the chip recognition camera 24 (step S22).

[0082] Next, the control unit 8 takes a picture of the bare chip through the chip recognition camera 24 and acquires the captured image (acquire image B) (step S23).

[0083] Next, the control unit 8 identifies the bare chip from the acquired image B (step S24). That is, the control unit 8 retrieves the pattern image C most similar to the template image PT and calculates the similarity (MR) between the pattern image C and the template image PT. The control unit 8 further calculates the inter-pattern distance difference (PD) and the inter-pattern angle difference (PA). Here, the inter-pattern distance difference (PD) is referred to as the measured value of reasonable distance (RD), and the inter-pattern angle difference (PA) is referred to as the measured value of reasonable angle (RA). In this step, it is assumed that even if the similarity (MR) is low, no recognition error will occur.

[0084] Next, the control unit 8 acquires the identification result of the bare chip (step S25). That is, the control unit 8 saves the consistency (MR), inter-pattern distance difference (PD), and inter-pattern angle difference (PA) to the storage device 82. Then, it transfers the data to... Figure 12 Step S26 is shown.

[0085] like Figure 12 As shown, the control unit 8 determines whether there is a problem with the identification result of the bare chip (step S26). Here, the identification result being without problems is referred to as identification result OK. That is, the control unit 8 determines whether the consistency (MR) is above the specified value (MRt).

[0086] If the judgment condition in step S26 is met (Yes), the control unit 8 determines whether the consistency (MR) is higher than the consistency (MRh) stored in the high-resolution structure (HS) (step S27). Here, the high-resolution structure (HS) is a structure used to store the data of the lighting value (LVm) with the highest consistency, and the content of the structure includes the lighting value (LVh), consistency (MRh), the measured value of the reasonable distance (RDh), and the measured value of the reasonable angle (RAh). The initial value of the consistency (MRh) is 0.

[0087] If the judgment condition in step S27 is met (Yes), the control unit 8 saves the data to the high-resolution structure (HS) (step S28). The control unit 8 saves the MR, RD, and RA calculated in step S24 as MRh, RDh, and RAh. The control unit 8 saves the LV set in step S21 as LVh. Then, the control unit 8 moves to... Figure 13 Step S35 is shown.

[0088] If the judgment condition in step S27 is not met (No), the control unit 8 determines whether the consistency degree (MR) is the same as the consistency degree (MRh) stored in the high-resolution structure (HS) (step S29).

[0089] If the judgment condition in step S29 is met (yes), the control unit 8 determines whether the measured value (RD) of the reasonable distance calculated in step S24 is smaller than the measured value (RDh) of the reasonable distance stored in the high-resolution structure (HS) (step S30).

[0090] If the judgment condition in step S30 is met (Yes), the control unit 8 saves the data to the high-resolution structure (step S31). The control unit 8 saves the MR, RD, and RA calculated in step S24 as MRh, RDh, and RAh. Then, the control unit 8 transfers to... Figure 13 Step S35 is shown.

[0091] If the judgment condition in step S30 is not met (No), the control unit 8 determines whether the measured value (RD) of the reasonable distance calculated in step S24 is the same as the measured value (RDh) of the reasonable distance stored in the high-resolution structure (HS) (step S32).

[0092] If the judgment condition in step S32 is met (yes), the control unit 8 determines whether the measured value (RA) of the rationality angle calculated in step S24 is below the measured value (RAh) of the rationality angle stored in the high-resolution structure (HS) (step S33).

[0093] If the judgment condition in step S33 is met (Yes), the control unit 8 saves the data to the high-resolution structure (step S34). The control unit 8 saves the MR, RD, and RA calculated in step S24 as MRh, RDh, and RAh. Then, the control unit 8 transfers to... Figure 13 Step S35 is shown.

[0094] If the judgment condition in step S26 is not met (No), the judgment condition in step S29 is not met (No), the judgment condition in step S32 is not met (No), and the judgment condition in step S33 is not met (No), the control unit 8 transfers to... Figure 13 Step S35 is shown.

[0095] like Figure 13 As shown, the control unit 8 determines whether the light value (CLV) is greater than or equal to the maximum light value (LVmax) (step S35). Here, LVmax = 255.

[0096] If the judgment condition in step S35 is not met (No), the control unit 8 adds the inspection interval (CI) to the inspection illumination value (CLV) (CLV←CLV+CI) (step S36).

[0097] Next, the control unit 8 determines whether the light value (CLV) is greater than the maximum light value (LVmax) (step S37).

[0098] If the judgment condition in step S37 is met (Yes), the control unit 8 sets the check illumination value (CLV) to the maximum illumination value (LVmax) (step S38). Then, the control unit 8 returns to... Figure 11 Step S21 is shown.

[0099] If the judgment condition in step S37 is not met (No), the control unit 8 returns to Figure 11 Step S21 is shown.

[0100] If the judgment condition in step S35 is met (yes), the control unit 8 performs a judgment (JDG) on whether there is more than one OK recognition result (step S39).

[0101] If the judgment condition in step S39 is met (Yes), the control unit 8 sets the automatic adjustment result to successful (Automatic adjustment result OK) (Step S40). The control unit 8 may also display the automatic adjustment result OK on the monitor 83a. Then, the automatic adjustment of the illumination value in the bare chip identification ends (End).

[0102] If the judgment condition in step S39 is not met (No), the control unit 8 sets the automatic adjustment result to fail (automatic adjustment result NG) (step S41). The control unit 8 may also display the automatic adjustment result NG on the monitor 83a. Then, the automatic adjustment of the illumination value in the bare chip identification ends (end).

[0103] According to the implementation method, one or more of the following effects can be obtained.

[0104] (1) Even in the event of an identification error due to lighting value issues, the lighting value can be automatically adjusted by the control unit, eliminating the need for manual bare chip identification adjustments. This eliminates the need for measuring luminous intensity using an illuminance meter mounted on the workpiece and adjusting the lighting output by photographing the reflected light from a reflective fixture mounted on the workpiece. Consequently, downtime in production equipment (such as chip mounters) is reduced, thus increasing productivity within the production unit.

[0105] (2) Since physical components (workpieces) and devices (lighting systems, cameras, and lenses, etc.) are used to find lighting values ​​with high consistency, the optimal lighting value for that component and device can be determined. As a result, production can be carried out with optimal brightness, thus improving the quality and reliability of the production equipment.

[0106] (3) Since no manual adjustment is required, there are no differences based on operator input, and deviations caused by human error can be eliminated, thus enabling the setting of optimal lighting values.

[0107] (4) Since the recipe can automatically generate lighting values, it is possible to change the lighting values ​​of the recipe data created in other production units to the optimal lighting values ​​for each production unit.

[0108] (5) Because the formula can automatically generate lighting values, it can reduce the deviation between production units.

[0109] <Variation Example>

[0110] Hereinafter, several representative modifications of the embodiments are illustrated. In the following description of the modifications, it is assumed that parts having the same structure and function as those described in the above embodiments can use the same reference numerals as those in the above embodiments. Furthermore, it is assumed that the descriptions of these parts can be appropriately referenced from the descriptions in the above embodiments to the extent that no technical contradiction occurs. In addition, a part of the above embodiments and all or part of the multiple modifications can be appropriately combined to the extent that no technical contradiction occurs.

[0111] (First variation)

[0112] use Figure 14 The method for automatically adjusting the lighting value in the first variation is explained. Figure 14 The black dot “●” indicates the location to search.

[0113] In this embodiment, an example is described where the control unit 8 identifies the template image PT and the pattern image C by incrementing the illumination value (LV) by 1 each time within a predetermined range (SR). In the first variation, the control unit 8 is configured to, as follows: Figure 14 As shown in the upper graph, the illumination value (LV) is separated within a specified range (SR) by a check interval (CI) from the minimum illumination value (LVmin) to the maximum illumination value (LVmax). In other words, the search is performed by increasing the illumination value (LV) from the minimum illumination value (LVmin) by a check interval (CI) equal to a specified value each time until the maximum illumination value (LVmax) is reached. The check interval (CI) can be set. The first variation has a faster search speed than the embodiment. Furthermore, the search can also be performed by separating the illumination value (LV) from the maximum illumination value (LVmax) to the minimum illumination value (LVmin) by a specified interval. Alternatively, the search can be performed between illumination values ​​larger than the minimum illumination value (LVmin) and illumination values ​​smaller than the maximum illumination value (LVmax), instead of between the minimum illumination value (LVmin) and the maximum illumination value (LVmax).

[0114] (Second variation)

[0115] use Figure 14 The method for automatically adjusting the lighting value in the second variation is explained.

[0116] In the second variation, the control unit 8 is as follows: Figure 14 As shown in the upper curve, similar to the first variation, the illumination value (LV) is separated by a predetermined check interval (CI) while searching from the minimum illumination value (LVmin) to the maximum illumination value (LVmax). Furthermore, the illumination value (LVm) with the highest consistency is obtained. Then, the control unit 8... Figure 14 The curve on the upper side shows the illumination value (LVm) with the highest consistency, within the specified range (LVs to LVE) including LVm, such as... Figure 14 As shown in the lower graph, the lookup is performed while incrementing the illumination value (LV) by 1 each time. Here, LVs = LVm - CI, LVE = LVm + CI, and LVm and CI are as follows: Figure 14 The curve on the upper side is shown. Control unit 8 sets the initial value of the illumination value (LV) to LVs and the maximum illumination value (LVmax) to LVE, through... Figures 11 to 13 The process shown is executed. The second variation is faster than the implementation method and achieves the same level of accuracy. Furthermore, the search can be performed while decreasing the illumination value (LV) by 1 each time within a specified range (LVs~LVe).

[0117] (Third variation)

[0118] use Figure 15 Explain the method for automatically adjusting the lighting value in the third variation. Figure 15 The black dot “●” indicates the location to search.

[0119] In the third variation, the control unit 8 is as follows: Figure 15 The upper curve shows the current highest consistency lighting value (LVr). Here, the current highest consistency lighting value (LVr) is, for example, the lighting value contained in the transplanted recipe data RCP, or the lighting value set before the recognition error occurred. Then, the control unit 8, similarly to the second modification, in... Figure 15 The curve on the upper side shows the illumination value (LVr) with the highest consistency, within the specified range (LVs to LVE) including LVr, such as... Figure 15 The curve on the lower side shows the process of incrementing the illumination value (LV) by 1 each time while searching. Here, LVs = LVr - SI, LVE = LVr + SI, where SI can be equal to or equal to the value of LVr. Figure 14 The same range of CI shown can also be compared to Figure 14 The CI shown is a large range. The third variation is faster than the implementation method and achieves the same level of accuracy. Furthermore, the search can be performed while decreasing the illumination value (LV) by 1 each time within a specified range (LVs~LVe).

[0120] The invention made by the inventor has been specifically described above based on the embodiments and modifications, but the invention is not limited to the above embodiments and modifications, and various changes can be made.

[0121] For example, the implementation describes an example of using two template images A1 and A2 and two pattern images C1 and C2, but the template images and pattern images can each be one or more.

[0122] Furthermore, while the identification of bare chips in the bare chip supply section was described as an example in this embodiment, it can also be applied to the identification of bare chips in the intermediate stage section, the identification of substrates before mounting, the identification of bare chips and substrates after mounting, and the identification of bare chips or clips based on a downward-viewing camera. In addition, the illumination value for the identification of bare chips and substrates after mounting is optimized based on the bare chip.

[0123] Furthermore, while coaxial lighting has been described as an example in the embodiments, it can also be a lighting device consisting of oblique ring lighting, oblique bar lighting, or a combination of coaxial lighting and these.

[0124] In addition, in one implementation, the bare chip appearance inspection and identification are performed after the bare chip location is identified, but the bare chip location identification can also be performed after the bare chip appearance inspection and identification.

[0125] In addition, in the embodiment, a DAF is attached to the back of the chip, but it is also possible to have no DAF.

[0126] Furthermore, the embodiment includes one pick-up head and one placement head, but it may also have two or more. Additionally, the embodiment includes an intermediate platform, but it may not be present. In this case, the pick-up head and the placement head can be used interchangeably.

[0127] Alternatively, in the embodiment, the bare die is mounted with its surface facing up. However, it is also possible to flip the bare die after picking it up so that its back side faces up before mounting. In this case, an intermediate stage is not required. This device is called a flip chip mounter.

[0128] Furthermore, while a semiconductor manufacturing apparatus has been described in the embodiments, it can also be applied to mounting apparatuses for mounting electronic components onto printed circuit boards.

Claims

1. An installation device comprising: A lighting system that emits light based on illumination values; A photographing device for photographing a workpiece illuminated by the lighting system; and The control unit is configured to perform output control of the lighting system based on the lighting values ​​and image processing of images captured by the imaging device. The installation device is characterized in that, The control unit is configured such that, The illumination value is set to a first predetermined value, and the image is obtained by taking a picture of the workpiece illuminated by the illumination system using the imaging device. The acquired image is searched to obtain the pattern image most similar to the template image. The matching accuracy between the most similar pattern image and the template image is calculated. By changing the first specified value within the specified range, the lighting value with the highest matching consistency rate is determined. The template image has a first template image and a second template image. The pattern image has a first pattern image and a second pattern image. The control unit is configured such that, The difference between the distance between the first template image and the second template image (i.e., the first distance) and the distance between the first pattern image and the second pattern image (i.e., the second distance) is calculated; this is the distance difference between the patterns. In the case of multiple illumination values ​​with the highest matching consistency, the illumination value with the smaller distance difference between the patterns is adopted.

2. The installation device as described in claim 1, characterized in that, The matching consistency rate is the average of the matching rates of the first template image and the first pattern image, and the matching rates of the second template image and the second pattern image.

3. The installation device as described in claim 1, characterized in that, The control unit is configured such that, The angle between the line connecting the first template image and the second template image (i.e., the first angle) and the angle between the line connecting the first pattern image and the second pattern image (i.e., the second angle) is calculated; this is the angle difference between the patterns. When the distance difference between the patterns is the same, the illumination value of the pattern with the smaller angle difference between the patterns is adopted.

4. The installation device as described in claim 3, characterized in that, The control unit is configured to increase the first predetermined value by a second predetermined value each time, or decrease the second predetermined value each time, to determine the lighting value with the highest matching consistency rate.

5. The installation device as described in claim 4, characterized in that, The specified range is from the minimum to the maximum value of the illumination value, and the second specified value is one inspection interval.

6. The installation device as described in claim 4, characterized in that, The specified range is from the minimum to the maximum value of the illumination value, and the second specified value is more than two inspection intervals.

7. The installation device as described in claim 6, characterized in that, The first predetermined value is increased by the second predetermined value each time, or the second predetermined value is decreased each time, and the lighting value with the highest matching consistency rate is set as the predetermined lighting value. The lighting value obtained by subtracting the second specified value from the specified lighting value and the lighting value obtained by adding the second specified value to the specified lighting value are defined as a second specified range. The control unit is configured to increase or decrease the first specified value by one inspection interval each time within the second specified range, thereby determining the lighting value with the highest matching consistency rate.

8. The installation device as described in claim 4, characterized in that, Set the lighting values ​​included in the transplanted formula or used during production as the specified lighting values. The lighting value obtained by subtracting the second specified value from the specified lighting value and the lighting value obtained by adding the second specified value to the specified lighting value are defined as a second specified range. The control unit is configured to calculate the lighting value with the highest matching consistency by adding one inspection interval or subtracting one inspection interval each time within a second specified range that includes the specified lighting value.

9. The installation device as described in claim 1, characterized in that, The control unit is configured such that, Recipe data containing the template image and its coordinate data. The lighting value with the highest matching rate can be used as the optimal lighting value and kept in the recipe data.

10. A method for adjusting an illumination system, comprising an illumination system emitting light intensity based on an illumination value and an imaging device for photographing a workpiece illuminated by the illumination system, characterized in that, include: The process of moving the workpiece in; and The identification process involves using the imaging device to identify the workpiece. During the identification process: The illumination value is set to a specified value, and the image is obtained by taking a picture of the workpiece illuminated by the illumination system using the imaging device. The acquired image is searched to obtain the pattern image most similar to the template image. The matching accuracy between the most similar pattern image and the template image is calculated. By changing the specified value, the lighting value with the highest matching consistency rate is determined. The template image has a first template image and a second template image. The pattern image has a first pattern image and a second pattern image. During the identification process: The difference between the distance between the first template image and the second template image (i.e., the first distance) and the distance between the first pattern image and the second pattern image (i.e., the second distance) is calculated; this is the distance difference between the patterns. In the case of multiple illumination values ​​with the highest matching consistency, the illumination value with the smaller distance difference between the patterns is adopted.

11. A method for manufacturing a semiconductor device, characterized in that, include: A loading process for loading a workpiece into a semiconductor manufacturing apparatus, wherein the semiconductor manufacturing apparatus includes an illumination system that emits light based on an illumination value and an imaging device that takes a picture of the workpiece that has been illuminated by the illumination system. as well as The identification process involves using the imaging device to identify the workpiece. During the identification process: The illumination value is set to a specified value, and the image is obtained by taking a picture of the workpiece illuminated by the illumination system using the imaging device. The acquired image is searched to obtain the pattern image most similar to the template image. The matching accuracy between the most similar pattern image and the template image is calculated. By changing the specified value, the lighting value with the highest matching consistency rate is determined. The template image has a first template image and a second template image. The pattern image has a first pattern image and a second pattern image. During the identification process: The difference between the distance between the first template image and the second template image (i.e., the first distance) and the distance between the first pattern image and the second pattern image (i.e., the second distance) is calculated; this is the distance difference between the patterns. In the case of multiple illumination values ​​with the highest matching consistency, the illumination value with the smaller distance difference between the patterns is adopted.

Images