Wafer arrangement method and wafer arrangement device

Abstract

The application discloses a wafer arrangement method and a wafer arrangement device, which comprises a wafer disc on which wafers are placed, and the wafer disc is fixed on a first carrier; wherein a thimble mechanism is arranged below the first carrier; a second carrier is arranged above the first carrier, and the lower end surface of the second carrier is provided with a glass carrier plate; the first carrier is driven to move to a preset position, so that the thimble mechanism is opposite to the lower side of the wafer to be arranged; the thimble mechanism is lifted to lift the wafer at the position from the wafer disc and to the glass carrier plate; and the first carrier is driven to move along a preset track, and a plurality of wafers are sequentially lifted to the glass carrier plate in a preset arrangement mode. The wafer arrangement method can arrange wafers by cooperating the first carrier with the second carrier, and the wafer arrangement is relatively compact, so that the single moving stroke is small, the working time is saved, and the working efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of wafer fabrication technology, and in particular to a wafer arrangement method and wafer arrangement apparatus. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. After initial processing, wafers are typically mounted on carriers. The wafers are usually arranged randomly on the carriers, so they need to be rearranged to accommodate subsequent processes.

[0003] The existing wafer arrangement method involves using a micro-nozzle to pick up the corresponding wafer, with each wafer having a corresponding number. The nozzle moves the wafer to a preset position for rearrangement. The disadvantage of this method is that, in order to ensure accuracy, the nozzle has a large travel distance when picking up a wafer and moving it from one glass substrate to another at a time. This results in long processing time and low work efficiency when arranging a large number of wafers.

[0004] Therefore, it is necessary to improve the existing wafer placement equipment to solve the technical problem of low wafer placement efficiency. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer arrangement method and a wafer arrangement apparatus to solve the above-mentioned technical problems.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A wafer arrangement method, comprising:

[0008] A wafer disk containing several wafers is picked up and fixed on a preset first stage; wherein, a pin mechanism is provided below the first stage;

[0009] A second platform is set directly above the first platform, and a glass plate is provided on the lower end surface of the second platform;

[0010] The first stage is driven to move along a preset trajectory, and the ejector mechanism lifts several wafers onto the glass carrier plate in a preset arrangement.

[0011] Optionally, the step of taking a wafer disk containing the wafer and fixing the wafer disk onto a preset first stage; then further includes:

[0012] Visual recognition is performed on the wafers on the wafer disk to obtain wafer information;

[0013] A preset layout pattern is formulated based on the wafer information; wherein the movement trajectory of the first stage corresponds to the layout pattern.

[0014] Optionally, the wafer information includes wafer location information and number information.

[0015] Optionally, the preset arrangement method is an array arrangement.

[0016] The present invention also provides a wafer arrangement apparatus, applied to the wafer arrangement method described above, comprising:

[0017] The first stage is used to hold the wafer disk;

[0018] A driving mechanism, wherein the driving end of the driving mechanism is connected to the first platform and is used to drive the first platform to move along a preset trajectory;

[0019] The ejector mechanism is located below the first stage and is used to eject the wafer from the wafer disk;

[0020] A second stage is positioned above the first stage, and a glass carrier plate for supporting the wafer is provided on the lower end surface of the second stage.

[0021] Optionally, the wafer arrangement apparatus further includes:

[0022] A visual recognition mechanism is located at a preset position above the first stage and is used to perform visual recognition on the wafer disk.

[0023] Optionally, the wafer arrangement apparatus further includes:

[0024] A height detection mechanism is located below the second platform. The height detection mechanism includes a contact sensor that is used to abut against the second platform to detect the height of the second platform.

[0025] Optionally, the ejector mechanism includes an ejector body and a lifting module for driving the ejector body to move up and down; wherein, the upper end of the ejector body is provided with an ejector cap.

[0026] Optionally, the upper surface of the pin cap is provided with a plurality of ventilation holes, wherein the ventilation holes are micro ventilation holes.

[0027] Optionally, the second stage includes:

[0028] The second stage body is provided with a mounting groove for mounting the glass carrier plate;

[0029] The first linear module has its drive end connected to the second platform body, and is used to drive the platform body to move.

[0030] The second linear module has its driving end connected to the first linear module and is used to drive the first linear module to move.

[0031] Compared with existing technologies, the present invention has the following advantages: During processing, a wafer disk containing wafers is taken and fixed on a preset first stage. The first stage is driven to move to a preset position, so that the ejector mechanism is directly below the wafer to be arranged. The ejector mechanism rises to eject the wafer at that position from the wafer disk and lift it onto a glass substrate. The first stage is driven to move along a preset trajectory, sequentially lifting several wafers onto the glass substrate according to a preset arrangement. This wafer arrangement method can use a second stage to cooperate with the first stage for wafer arrangement. Because the wafer arrangement is relatively close, the single movement stroke is small, saving working time and improving work efficiency. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0034] Figure 1 This is a schematic diagram of the overall structure of the wafer layout device.

[0035] Figure 2 This is a schematic diagram of the main structure of the wafer layout device.

[0036] Figure 3 This is a cross-sectional schematic diagram of the ejector pin mechanism of this wafer placement device.

[0037] Figure 4 This is a schematic diagram of the ejector pin mechanism of the wafer placement device.

[0038] Illustration: First platform 1, ejector pin mechanism 2, second platform 3, glass carrier plate 4, visual recognition mechanism 6, height detection mechanism 5, ejector pin body 21, lifting module 22, base 23, ejector pin cap 24, second platform body 31, first linear module 32, second linear module 33. Detailed Implementation

[0039] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0040] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0041] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0042] Example 1:

[0043] This invention provides a wafer arrangement method, including:

[0044] A wafer disk containing several wafers is taken and fixed on a preset first stage 1; wherein, a pin mechanism 2 is provided below the first stage 1;

[0045] A second platform 3 is disposed directly above the first platform 1, and a glass plate 4 is disposed on the lower end surface of the second platform 3;

[0046] The first stage 1 is driven to move along a preset trajectory, and several wafers are sequentially lifted onto the glass carrier plate in a preset arrangement.

[0047] The working principle of this invention is as follows: During processing, a wafer disk containing wafers is taken and fixed on a preset first stage 1. The second stage 3 is moved to a preset height directly above the first stage 1, and then the first stage 1 is driven to move to a preset position, so that the ejector mechanism 2 is directly below the wafer to be arranged. The ejector mechanism 2 rises to eject the wafer at that position from the wafer disk and lift it onto the glass carrier plate 4. The first stage 1 is driven to move along a preset trajectory to sequentially lift several wafers onto the glass carrier plate according to a preset arrangement. Compared with the wafer arrangement method in the prior art, this wafer arrangement method can arrange wafers by setting the second stage 3 to cooperate with the first stage 1. Since the wafer arrangement is relatively close, the single movement stroke of the ejector mechanism 2 is small, saving working time and improving work efficiency.

[0048] In this embodiment, the step of taking a wafer disk containing a wafer and fixing the wafer disk onto a preset first stage 1; then it further includes:

[0049] Visual recognition is performed on the wafers on the wafer disk to obtain wafer information;

[0050] A preset layout pattern is formulated based on the wafer information; wherein, the preset trajectory movement of the first stage 1 corresponds to the layout pattern.

[0051] It should be noted that the wafer arrangement rules in this solution are pre-set. After visual recognition of the wafers, each wafer is planned according to the arrangement rules to formulate a corresponding arrangement pattern. After receiving the arrangement pattern, the control system controls the movement of the first platform 1 and the lifting mechanism 2.

[0052] In this embodiment, the wafer information includes wafer location information and wafer number information. It should be noted that when performing visual recognition on the wafer, the wafer number information and location information need to be recognized separately, and the movement trajectory of the ejector mechanism 2 is specified according to the spatial arrangement of several wafers.

[0053] In this embodiment, the preset arrangement is an array arrangement. That is, the array arrangement is relatively neat and simple, and the arrangement can also be adjusted according to the needs of subsequent processes.

[0054] Example 2:

[0055] The present invention also provides a wafer arrangement apparatus, applied to the wafer arrangement method as described in Embodiment 1, comprising:

[0056] The first stage 1 is used to fix and place the wafer disk on which the wafer is placed;

[0057] A driving mechanism is provided, the driving end of which is connected to the first stage and is used to drive the first stage to move along a preset trajectory. The driving mechanism includes two planar linear modules for moving the first stage 1 in planar space. In addition, the first stage 1 is also provided with an angle adjustment mechanism for driving the wafer disk to rotate, thereby adjusting the angle of the wafer.

[0058] The ejector mechanism 2 is located below the first stage 1 and is used to eject the wafer from the wafer disk.

[0059] The second stage 3 is located above the first stage 1, and the lower end surface of the second stage 3 is provided with a glass carrier plate 4 for supporting the wafer.

[0060] In this embodiment, the wafer arrangement device further includes a visual recognition mechanism 6, which is located at a preset position above the first stage 1, for visual recognition of the wafer disks on the wafer.

[0061] In this embodiment, the wafer arrangement device further includes a height detection mechanism 5, which is located below the second stage 3. The height detection mechanism 5 includes a contact sensor, which is used to abut against the second stage 3 to detect the height of the second stage 3.

[0062] In this embodiment, the ejector mechanism 2 includes an ejector body 21, a lifting module 22 and a base 23 for driving the ejector body 21 to move up and down; the upper end of the ejector body 21 is provided with an ejector cap 24.

[0063] In this embodiment, the upper surface of the pin cap 24 is provided with a plurality of ventilation holes, wherein the ventilation holes are micro ventilation holes.

[0064] In this embodiment, the second platform 3 includes:

[0065] The second stage body 31 is provided with a mounting groove for mounting the glass carrier plate 4.

[0066] The first linear module 32 has its driving end connected to the second platform body 31 and is used to drive the platform body to move.

[0067] The second linear module 33 has its driving end connected to the first linear module 32 and is used to drive the first linear module 32 to move.

[0068] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer arrangement method, characterized in that, include: A wafer disk containing several wafers is picked up and fixed on a preset first stage; wherein, a pin mechanism is provided below the first stage; A second platform is set directly above the first platform, and a glass plate is provided on the lower end surface of the second platform; The first stage is driven to move along a preset trajectory, and the ejector mechanism lifts several wafers onto the glass carrier plate in a preset arrangement. The steps include: taking a wafer disk containing the wafer and fixing the wafer disk onto a preset first stage; and then including: Visual recognition is performed on the wafers on the wafer disk to obtain wafer information; A preset layout pattern is formulated based on the wafer information; wherein the movement trajectory of the first stage corresponds to the layout pattern; The wafer information includes wafer location information and number information; The wafer placement method is applied to the wafer placement apparatus described below, which includes a first stage for fixing wafer disks; A driving mechanism, wherein the driving end of the driving mechanism is connected to the first platform and is used to drive the first platform to move along a preset trajectory; The ejector mechanism is located below the first stage and is used to eject the wafer from the wafer disk; The second stage is located above the first stage, and the lower end surface of the second stage is provided with a glass carrier plate for supporting the wafer. A height detection mechanism is located below the second platform. The height detection mechanism includes a contact sensor that is used to abut against the second platform to detect the height of the second platform.

2. The wafer arrangement method according to claim 1, characterized in that, The preset arrangement method is an array arrangement.

3. The wafer arrangement apparatus according to claim 1, characterized in that, Also includes: A visual recognition mechanism is located at a preset position above the first stage and is used to perform visual recognition on the wafer disk.

4. The wafer arrangement apparatus according to claim 1, characterized in that, The ejector mechanism includes an ejector body and a lifting module for driving the ejector body to move up and down; wherein, the upper end of the ejector body is provided with an ejector cap.

5. The wafer arrangement apparatus according to claim 4, characterized in that, The upper surface of the pin cap has several ventilation holes, wherein the ventilation holes are micro ventilation holes.

6. The wafer layout apparatus according to claim 1, characterized in that, The second stage includes: The second stage body is provided with a mounting groove for mounting the glass carrier plate; The first linear module has its drive end connected to the second platform body, and is used to drive the platform body to move. The second linear module has its driving end connected to the first linear module and is used to drive the first linear module to move.

Images