Display panel, manufacturing method thereof and display device

Abstract

The application discloses a display panel and a manufacturing method thereof, and a display device. The display panel comprises a display area, a first non-display area adjacent to the display area, and a containing hole. The display panel comprises a substrate, an array layer on one side of the substrate, and a light-emitting unit on the side of the array layer away from the substrate. The light-emitting unit comprises an anode, an organic light-emitting layer, and a cathode arranged in sequence in the direction away from the substrate. The array layer comprises metal wires, the metal wires are located in different metal layers, the metal wires in different metal layers are partially overlapped in the direction perpendicular to the plane where the substrate is located, and the orthographic projection of the metal wires on the plane where the substrate is located overlaps with the edge of the cathode. The application can reduce the width of the first non-display area, thereby increasing the area of the display area.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) displays have many advantages over current mainstream liquid crystal displays, such as self-illumination, low driving voltage, high luminous efficiency, short response time, high clarity and contrast, and wide operating temperature range, and are considered to be display devices with great potential.

[0003] OLED display devices typically include: a substrate, an anode disposed on the substrate, an organic light-emitting layer disposed on the anode, and a cathode disposed on the organic light-emitting layer. The organic light-emitting layer is formed by vapor deposition. To prevent water and oxygen from entering the display area and compromising the stability of the OLED display device, thin-film encapsulation is required. This thin-film encapsulation employs a structure of alternating inorganic and organic layers.

[0004] As people's demands for the visual experience of electronic products continue to increase, full-screen technology has been continuously developed. More and more manufacturers are directly opening holes in the display panel to place physical devices such as cameras. However, in related technologies, OLED display devices will reduce the display area after setting holes, which is not conducive to realizing a full screen. Summary of the Invention

[0005] In view of this, the present invention provides a display panel and a method for manufacturing the same, as well as a display device, for increasing the area of ​​the display area after providing a receiving hole.

[0006] On one hand, the present invention provides a display panel, characterized in that it includes a display area and a first non-display area adjacent to the display area and a receiving hole;

[0007] The display panel includes: a substrate, an array layer located on one side of the substrate, and a light-emitting unit located on the side of the array layer away from the substrate. The light-emitting unit includes an anode, an organic light-emitting layer, and a cathode arranged sequentially in a direction away from the substrate.

[0008] The array layer includes metal lines located in different metal layers. In a direction perpendicular to the plane of the substrate, the metal lines located in different metal layers at least partially overlap, and the orthographic projection of the metal lines in the direction of the plane of the substrate overlaps with the edge of the cathode.

[0009] On the other hand, the present invention also provides a method for manufacturing a display panel, the display panel including a display area and a first non-display area adjacent to the display area and a receiving hole.

[0010] The manufacturing method includes the following steps:

[0011] Provide substrates;

[0012] An array layer is formed on the substrate. In the first non-display area, the array layer includes metal lines. The metal lines are located in different metal layers. In a direction perpendicular to the plane of the substrate, the metal lines located in different metal layers partially overlap. The orthographic projection of the metal lines in the direction of the plane of the substrate covers the first non-display area.

[0013] An anode is formed on the side of the array layer away from the substrate and at a position corresponding to a sub-pixel;

[0014] An organic light-emitting layer is deposited on the side of the anode away from the substrate, the organic light-emitting layer comprising a first organic light-emitting layer for a display area and a second organic light-emitting layer for a first non-display area;

[0015] A cathode is formed on the side of the organic light-emitting layer away from the substrate, and the cathode covers the display area and the first non-display area;

[0016] The laser irradiates the area of ​​the first non-display area from the side of the cathode away from the substrate. After passing through the cathode of the first non-display area, the laser is reflected on the surface of the metal line, removing the second organic light-emitting layer in the first non-display area.

[0017] On the other hand, the present invention also provides a display device including the above-described display panel.

[0018] Compared with the prior art, the display panel, its manufacturing method, and the display device provided by the present invention achieve at least the following beneficial effects:

[0019] The display panel of this invention is an organic self-emissive display panel, including a display area, a first non-display area adjacent to the display area, and a receiving hole. The array layer of the display panel includes metal lines. The orthographic projection of the metal lines in the plane of the substrate overlaps with the edge of the cathode. The metal lines are located in different metal layers. In the direction perpendicular to the plane of the substrate, the metal lines located in different metal layers at least partially overlap. At the position corresponding to the edge of the cathode, the first non-display area will be covered during the deposition of the organic light-emitting layer. However, corresponding to the first non-display area, the first non-display area is irradiated by a laser from the side of the organic light-emitting layer away from the substrate. The laser first penetrates the organic light-emitting layer. Under the energy of the laser, the laser partially evaporates during the first penetration of the organic light-emitting layer. The laser then reaches the surface of the metal wire. Since the metal wires are located in different layers and partially overlap in the direction perpendicular to the plane of the substrate, the laser will be reflected on the surface of the metal wire. After the laser reflection, the organic light-emitting layer is irradiated a second time, and the remaining organic light-emitting layer evaporates. This ensures that there is no organic light-emitting layer residue in the first non-display area. On the one hand, this prevents water and oxygen from entering the display area from the first non-display area, improving the reliability of the display panel. On the other hand, since the organic light-emitting layer in the first non-display area can be removed without setting a dam, the space required for setting a dam in the first non-display area can be reduced, thereby increasing the area of ​​the display area and improving the screen-to-body ratio of the display panel.

[0020] Of course, any product implementing this invention does not necessarily need to achieve all of the technical effects described above at the same time.

[0021] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0023] Figure 1 This is a schematic diagram of a planar structure of a display panel provided by the present invention;

[0024] Figure 2 This is a cross-sectional view along the A-A' direction in section 1;

[0025] Figure 3 yes Figure 1 A cross-sectional view along the B-B' direction;

[0026] Figure 4 yes Figure 1 Another cross-sectional view along the A-A' direction;

[0027] Figure 5 yes Figure 1 Another cross-sectional view along the B-B' direction;

[0028] Figure 6 yes Figure 1 A cross-sectional view along line A-A' in the middle;

[0029] Figure 7 yes Figure 1 Another cross-sectional view along the B-B' direction;

[0030] Figure 8 yes Figure 1 Another cross-sectional view along the A-A' direction;

[0031] Figure 9 yes Figure 1 Another cross-sectional view along the A-A' direction;

[0032] Figure 10 yes Figure 1 Another cross-sectional view along the B-B' direction;

[0033] Figure 11 yes Figure 1 Another cross-sectional view along the A-A' direction;

[0034] Figure 12 yes Figure 1 Another cross-sectional view along the B-B' direction;

[0035] Figure 13 yes Figure 1 Another cross-sectional view along the A-A' direction;

[0036] Figure 14 yes Figure 1 Another cross-sectional view along the B-B' direction;

[0037] Figure 15 yes Figure 1 Another cross-sectional view along the A-A' direction;

[0038] Figure 16 This is a schematic diagram of a planar structure of another display panel provided by the present invention;

[0039] Figure 17 This is a schematic diagram of a planar structure of another display panel provided by the present invention;

[0040] Figure 18 yes Figure 2 A magnified view of a portion of region M in the middle;

[0041] Figure 19 yes Figure 1 Another cross-sectional view along the A-A' direction;

[0042] Figure 20 This is a flowchart of a method for manufacturing a display panel provided by the present invention;

[0043] Figure 21 This is a cross-sectional view corresponding to the manufacturing method of the display panel of the present invention;

[0044] Figure 22 This is a flowchart of another display panel manufacturing method provided by the present invention;

[0045] Figure 23 This is a schematic diagram of the planar structure of a display device provided by the present invention. Detailed Implementation

[0046] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0047] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0048] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0049] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0050] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0051] Given that the presence of openings in OLED display devices reduces the display area, the inventors researched related technologies. Typically, OLED display devices have apertures to house electronic components such as cameras. These openings are generally formed using laser cutting. After cutting, the cross-section of the organic light-emitting layer (OLED) in the opening area is exposed to air. The OLED material is highly susceptible to damage from water and oxygen. Water and oxygen in the air can penetrate the OLED material layer along the cross-section and rapidly expand from the opening into the display area, causing display device failure. To prevent the OLED layer from being exposed to air after cutting, related technologies use multiple continuous undulating baffles near the first non-display area close to the aperture. During the formation of the OLED layer, the light-emitting material breaks at the baffle locations, thus preventing water and oxygen from entering the display area. However, these baffles occupy space in the first non-display area, thereby reducing the display area and hindering the achievement of a full-screen display.

[0052] In view of this, the present invention provides a display panel and a method for manufacturing the same, as well as a display device, to increase the area of ​​the display area after the accommodating hole is provided. Specific embodiments of the display panel will be described in detail below.

[0053] Reference Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of a planar structure of a display panel provided by the present invention. Figure 2 This is a cross-sectional view along line A-A' in diagram 1. Figure 3 yes Figure 1 A cross-sectional view along the B-B' direction is shown. In this embodiment, the display panel 100 includes a display area AA, a first non-display area NA adjacent to the display area AA, and a receiving hole 1. The display panel 100 includes: a substrate 101, an array layer 102 located on one side of the substrate 101, and a light-emitting unit 103 located on the side of the array layer 102 away from the substrate 101. The light-emitting unit 103 includes an anode 1031, an organic light-emitting layer 1032, and a cathode 1033 arranged sequentially along the direction away from the substrate 101. The array layer 102 includes metal lines 2 located in different metal layers. In the direction Z perpendicular to the plane of the substrate 101, the metal lines 2 located in different metal layers partially overlap. The orthographic projection of the metal lines 2 in the direction of the plane of the substrate 101 overlaps with the edge 1033K of the cathode 1033.

[0054] Specifically, the display panel 100 of the present invention is an organic self-emissive display panel 100. The display panel 100 has a display area AA, a first non-display area NA adjacent to the display area AA, and a receiving hole 1. Optionally, at least one device selected from a camera, an earpiece, a speaker, and an infrared sensor is disposed in the receiving hole 1. No specific limitation is made here regarding the device disposed in the receiving hole 1. The first non-display area NA adjacent to the display area AA can be a first non-display area NA surrounding the receiving hole 1, or it can be a non-display area BB surrounding the display area AA (i.e., the border area, such as...). Figure 1 The left border BB1 and the right border BB2 in the present invention. It should be noted that the technical solution of the present invention can not only solve the problem of widening the first non-display area NA around the accommodating hole 1 and reducing the display area AA, but also solve the problem of the wide border and reduced display area AA, which will be described in detail below.

[0055] The display panel 100 includes: a substrate 101, an array layer 102 located on one side of the substrate 101, and a light-emitting unit 103 located on the side of the array layer 102 away from the substrate 101. The light-emitting unit 103 includes an anode 1031, an organic light-emitting layer 1032, and a cathode 1033 arranged sequentially along the direction away from the substrate 101.

[0056] The substrate 101 can be a flexible substrate or a non-flexible substrate. When it is a flexible substrate, it can be formed from any suitable insulating material with flexibility. For example, the flexible substrate can be formed from polymeric materials such as polyimide, polycarbonate, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, polyaryl compounds, or glass fiber reinforced plastics. The flexible substrate can be transparent, translucent, or opaque.

[0057] A driving circuit is provided in the array layer 102 to drive the light-emitting unit 103 to emit light. For example, a 7T1C or 8T1C driving circuit can be provided, where T refers to a transistor and C refers to a storage capacitor. The electronic components in the driving circuit are not specifically limited here. The transistor 30 includes a gate, a semiconductor active layer, a source, and a drain. Of course, the array layer 102 also includes signal lines (not shown in the figure), such as scan lines extending along the row direction X and arranged in the column direction Y, or data lines extending along the column direction Y and arranged in the row direction X, as well as voltage signal lines extending along the column direction Y. The source of the transistor 30 is electrically connected to the data line, and the drain of the transistor 30 is electrically connected to the light-emitting unit 103. Figure 2 and Figure 3 The film structure of the middle array layer 102 is for illustrative purposes only. Figure 2 and Figure 3The intermediate array layer 102 has a buffer layer located on the substrate 101, and the transistor 30 is located on the side of the buffer layer away from the substrate 101. The buffer layer covers the entire upper surface of the substrate 101. The buffer layer may include an inorganic layer or an organic layer. For example, the buffer layer may be formed from an inorganic material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, or aluminum oxide, or from an organic material such as acrylic, polyimide, or polyester. The buffer layer may include a single layer or multiple layers. The buffer layer blocks oxygen and moisture, prevents moisture or impurities from diffusing through the substrate 101, and provides a flat surface on the upper surface of the substrate 101. The transistor 30 is located on the buffer layer and includes a semiconductor active layer located on the buffer layer. The semiconductor active layer includes a source region and a drain region formed by doping with N-type or P-type impurity ions, and the region between the source region and the drain region is a channel region in which no impurities are doped. Of course, the array layer 102 also includes a first gate metal layer M0, a second gate metal layer M1, a source / drain metal layer M2, and a data line metal layer M3. An insulating layer is present between each of the first gate metal layer M0, the second gate metal layer M1, the source / drain metal layer M2, and the data line metal layer M3. Figure 2 and Figure 3 The schematic diagram of the metal line 2 shows that it is on the same layer as the first gate metal layer M0 and the second gate metal layer M1, that is, the metal line 2 is distributed on the two metal layers. Of course, the metal line 2 can also be located on other metal layers, which is not specifically limited here.

[0058] A light-emitting unit 103 is formed on the side of the array layer 102 away from the substrate 101. The light-emitting unit 103 includes an anode 1031, an organic light-emitting layer 1032, and a cathode 1033. To form an organic light-emitting device (OLED), the anode 1031 is electrically connected (or bonded) to the source electrode through a contact hole. The light-emitting unit 103 is located within an opening in the pixel definition layer 105. Figure 2 Only one light-emitting unit 103 is shown in the first display area AA1, and another light-emitting unit 103 is shown in the second display area AA2. Figure 3 Only one light-emitting unit 103 is shown in the image.

[0059] The anode 1031 can be made of various conductive materials. For example, the anode 1031 can be formed as a transparent electrode depending on its application. When the anode 1031 is formed as a transparent electrode, it can include indium tin oxide, indium zinc oxide, zinc oxide, or indium oxide, etc.

[0060] The pixel definition layer 105 covers the edge of the anode 1031. The pixel definition layer 105 may be formed of an organic material such as polyimide, polyamide, benzocyclobutene, acrylic resin or phenolic resin.

[0061] The organic light-emitting layer 1032 is located on the anode 1031, and the portion of the anode 1031 on which the organic light-emitting layer 1032 is disposed is not covered and exposed by the pixel definition layer 105. The organic light-emitting layer 1032 can be formed by a vapor deposition process, and the organic light-emitting layer 1032 is patterned to correspond to each sub-pixel, and thus to the patterned anode 1031. The organic light-emitting layer 1032 can be formed from low molecular weight organic materials or high molecular weight organic materials.

[0062] The cathode 1033 is located on the organic light-emitting layer 1032. Similar to the anode 1031, the cathode 1033 can be formed as a transparent electrode, and of course, the cathode 1033 can be disposed on the entire surface. The cathode 1033 may include indium tin oxide, indium zinc oxide, zinc oxide, or indium oxide, etc.

[0063] The organic light-emitting layer 1032 may optionally include a hole injection layer, a hole transport layer on the hole injection layer, a light-emitting layer on the hole transport layer, an electron transport layer on the light-emitting layer, and an electron injection layer on the electron transport layer, etc., which can be formed by vapor deposition. The light-emitting principle of the light-emitting unit 103 is that the organic light-emitting material emits light through carrier injection and recombination under the drive of an electric field. Specifically, the light-emitting unit 103 includes an anode 1031 and a cathode 1033. Under a certain voltage drive, electrons and holes are injected from the cathode 1033 and the anode 1031 into the electron transport layer and the hole transport layer, respectively. The electrons and holes migrate through the electron transport layer and the hole transport layer to the organic light-emitting layer 1032, where they meet to form excitons and excite the light-emitting molecules, which then emit visible light after radiative relaxation.

[0064] Figure 2 and Figure 3 The diagram also shows an encapsulation layer 104, located on the side of the cathode 1033 away from the substrate 101. Optionally, the encapsulation layer 104 can be a stacked structure of inorganic encapsulation layers, organic encapsulation layers, and inorganic encapsulation layers. Of course, the specific structure of the encapsulation layer 104 is not limited in this invention; the encapsulation layer 104 can have multiple inorganic encapsulation layers and multiple organic encapsulation layers, as long as it can provide good protection for the devices within the display area AA. In this embodiment, the encapsulation layer 104 covers the edge of the cathode 1033. Figure 2 and Figure 3 The image only roughly shows the location of the encapsulation layer 104 and does not represent the actual product film structure of the encapsulation layer 104.

[0065] It should be noted that array layer 102 includes metal lines 2, which are located in different metal layers. Figure 2In this embodiment, the example of metal lines 2 located on two metal layers is used for illustrative purposes only; the number of metal layers is not specifically limited here. In the direction Z perpendicular to the plane of the substrate 101, the metal lines 2 located on different metal layers at least partially overlap. Figure 2 In the direction Z perpendicular to the plane of the substrate 101, the metal lines 2 of different metal layers only partially overlap. In this invention, the edge 1033K of the cathode 1033 falls on the side of the metal line 2 away from the substrate 101. It should be noted that since the edge 1033K of the cathode 1033 falls in the area where the metal line is located, the film stress at that location is improved by utilizing the cathode contour edge, without needing to change the contour shape of the corresponding metal line, thereby avoiding affecting the conductivity of the trace.

[0066] It should be noted that for the first non-display area NA, the metal line 2 can be used to transmit scanning signals or data signals. It is understood that both the first display area AA1 near the left frame BB1 ​​of the receiving hole 1 and the second display area AA2 near the right frame BB2 of the receiving hole 1 need to transmit signals. When the signal line passes through the receiving hole 1, it needs to be wound in the first non-display area NA to transmit from the first display area AA1 to the second display area AA2. The metal line 2 in this invention can reuse the existing signal lines in the display panel 100, so there is no need to set an additional metal line 2 in the first non-display area NA.

[0067] Of course, the structure of the border area can be referenced to the first non-display area NA. Figure 3 It is understandable that during the cutting process, the cross-section of the organic light-emitting layer 1032 at the bezel of the display panel will be exposed to the air. As mentioned above, the material of the organic light-emitting layer 1032 is easily damaged by water and oxygen. Related technologies also require a barrier to be set on the side of the bezel away from the display area AA to prevent water and oxygen from entering the display area AA from the bezel. This increases the width of the non-display area BB, thereby reducing the area of ​​the display area AA. In this embodiment, metal lines 2 can be set in the array layer 102 at the bezel location. The metal lines 2 are located in different metal layers, and the metal lines 2 in different metal layers at least partially overlap. Of course, the metal lines 2 here can be used for signal transmission or not; no specific limitation is made here.

[0068] In this embodiment, the first non-display area NA will be covered when the organic light-emitting layer 1032 is deposited and the cathode 1033 is formed, corresponding to the edge 1033K of the cathode 1033. The first non-display area NA can be either the first non-display area NA surrounding the receiving hole 1 or the border surrounding the display area AA.

[0069] By irradiating the first non-display area NA with a laser from the side of the organic light-emitting layer 1032 away from the substrate 101, i.e., by laser irradiation from the light-emitting surface (front) side of the display module, the laser can be prevented from affecting the driving period of the transistor. Furthermore, this invention can improve the cathode patterning effect by utilizing the metal lines 2 in the array layer 102 to reflect the laser. On the other hand, in related technologies, the metal lines of the array layer are generally located above the film layer containing the channel region during the driving period of the transistor. Laser irradiation from the front side can block the laser from damaging the semiconductor active layer of the transistor 30 without adding an additional light-shielding layer.

[0070] Corresponding to the first non-display area NA, a laser is used to irradiate the first non-display area NA from the side of the organic light-emitting layer 1032 away from the substrate 101. Lasers L1 and L2 first penetrate the organic light-emitting layer 1032. During this first penetration, the laser energy causes partial evaporation. After penetrating the organic light-emitting layer 1032, the laser reaches the surface of the metal lines 2. Since the metal lines 2 are located in different layers and partially overlap in the Z direction perpendicular to the plane of the substrate 101, it can be ensured that the laser light is reflected from the surface of the metal lines 2. Figure 2 and Figure 3 As shown, laser L1 is reflected from the surface of the first metal wire 201, and laser L2 is reflected from the surface of the second metal wire 202. Figure 2 and Figure 3 The dashed line represents the reflected laser. After the laser is reflected, it irradiates the organic light-emitting layer 1032 a second time, and the remaining organic light-emitting layer 1032 evaporates. This ensures that there is no organic light-emitting layer 1032 residue in the first non-display area NA. On the one hand, this prevents water and oxygen from corroding the organic light-emitting layer 1032 in the first non-display area NA and allowing water and oxygen to enter the display area AA from the first non-display area NA, thus improving the reliability of the display panel. On the other hand, since the organic light-emitting layer 1032 in the first non-display area NA can be removed without setting up a dam, the space required for setting up a dam in the first non-display area NA can be reduced, thereby increasing the area of ​​the first non-display area NA and increasing the area of ​​the display area AA, thus increasing the screen-to-body ratio of the display panel 100.

[0071] In some alternative embodiments, refer to Figure 4 and Figure 5 , Figure 4 yes Figure 1 Another cross-sectional view along the A-A' direction. Figure 5 yes Figure 1 Another cross-sectional view along the B-B' direction, showing that the number of metal lines 2 in different metal layers is equal.

[0072] Figure 4 and Figure 5 The figure only schematically shows that the number of metal lines 2 located in the first gate metal layer M0 and the second gate metal layer M1 are equal. Of course, the metal lines 2 can also be distributed in three metal layers, with the number of metal lines 2 in each metal layer being equal, but this is not shown in the figure.

[0073] Given a fixed total number of metal lines 2 and the same spacing between metal lines 2, if the number of metal lines 2 in each metal layer is set to be equal, then in the direction from the display area AA to the first non-display area NA, the space occupied by all metal lines 2 is minimized, which can further compress the width of the first non-display area in the first direction U, thereby further increasing the area of ​​the display area AA.

[0074] In some alternative embodiments, reference continues to be made to... Figures 2 to 5 In the display area AA, the array layer 102 includes a first gate metal layer M0, a second gate metal layer M1, a source / drain metal layer M2, and a data line metal layer M3 arranged sequentially along a direction away from the substrate 101, and the metal line 2 is arranged in the same layer as at least two of the metal layers.

[0075] Figures 2 to 5 The diagram shows that the array layer 102 in the display area AA includes a first gate metal layer M0, a second gate metal layer M1, a source-drain metal layer M2, and a data line metal layer M3. The data lines of the data line metal layer M3 are electrically connected to the anode 1031 of the light-emitting unit 103 to drive the light-emitting unit 103.

[0076] Metal lines 2 are set in the same layer as at least two of the metal layers. For array layer 102, they are made in the same layer and with the same process as the existing metal layers. This not only prevents water and oxygen from entering the display area AA from the first non-display area NA and reduces the width of the first non-display area NA, but also simplifies the manufacturing process, eliminating the need to add a mask to set the metal lines 2 separately.

[0077] Optional, Figures 2 to 5 The diagram shows that the metal line 2 is on the same layer as two of the metal layers. Of course, the metal line 2 can also be on the same layer as three or four of the metal layers. The metal line 2 is on the same layer as at least two of the existing metal layers in the array layer 102, which will not increase the thickness of the display panel 100.

[0078] Figure 5The diagram also shows a dam 108 disposed in the non-display area BB. The height of the dam 108 in the direction perpendicular to the substrate 101 is greater than the thickness of the cathode 1033. The encapsulation layer 104 includes a first inorganic encapsulation layer 1041, an organic encapsulation layer 1042, and a second inorganic encapsulation layer 1043 sequentially deposited on the side of the cathode 1033 away from the substrate 101. The dam 108 is used to block the organic encapsulation layer 1042 during evaporation. The first inorganic encapsulation layer 1041 covers the dam 108, and the second inorganic encapsulation layer 1043 covers the first inorganic encapsulation layer. This dam 108 can also be disposed in the first non-display area NA. The structure of the encapsulation layer 104 can be referred to [reference needed]. Figure 5 This will not be elaborated further here. Of course, in some other alternative embodiments of this application, the inorganic encapsulation layer may also be stopped at the side of the barrier facing the display area.

[0079] In some alternative embodiments, reference continues to be made to... Figures 2 to 5 The metal line 2 includes at least one metal line 2 that is in the same layer as the first gate metal layer M0 or the second gate metal layer M1.

[0080] Figures 2 to 5 The illustration uses the example of metal line 2 being on the same layer as the first gate metal layer M0 and the second gate metal layer M1 as an example. Metal line 2 includes a first metal line 201 and a second metal line 202. The first metal line 201 is on the same layer as the first gate metal layer M0, and the second metal line 202 is on the same layer as the second gate metal layer M1. Alternatively, the first metal line 201 can be on the same layer as the first gate metal layer M0, and the second metal line 202 can be on the same layer as the source / drain metal layer M2, or the second metal line 202 can be on the same layer as the data line metal layer M3; or the first metal line 201 can be on the same layer as the second gate metal layer M1, and the second metal line 202 can be on the same layer as the source / drain metal layer M2, or the second metal line 202 can be on the same layer as the data line metal layer M3. Of course, metal line 2 can also be on the same layer as three metal layers in array layer 102, or as the fourth metal layer in array layer 102, which is not shown in the figure. Optionally, the number of metal lines 2 in each metal layer can be the same; preferably, the spacing between the metal lines 2 in each metal layer is equal.

[0081] Understandably, the materials of the first gate metal layer M0 and the second gate metal layer M1 typically include molybdenum. Molybdenum has a relatively high reflectivity. After the laser penetrates the cathode 1033 and the organic light-emitting material in the first non-display area NA, it is more likely to be reflected back to one side of the encapsulation layer 104 when it irradiates the molybdenum. This reflected laser then irradiates the organic light-emitting material again, causing it to be removed. Therefore, having the metal line 2 in the same layer as the first gate metal layer M0 or the second gate metal layer M1 can improve the reflectivity of the laser reflection, ensuring that the laser reaches the organic light-emitting material in the first non-display area NA, and further preventing water and oxygen from corroding the organic light-emitting material and causing the display panel to fail.

[0082] In some alternative embodiments, refer to Figure 6 and Figure 7 , Figure 6 yes Figure 1 A cross-sectional view along line A-A'. Figure 7 yes Figure 1 Another cross-sectional view along the B-B' direction shows that the metal line 2 includes a first metal line 201 and a second metal line 202. The first metal line 201 is on the same layer as the first gate metal layer M0, and the second metal line 202 is on the same layer as the source and drain metal layers M2, or the second metal line 202 is on the same layer as the data line metal layer M3.

[0083] Optionally, in this embodiment, the metal line 2 is distributed in two metal layers. The metal line 2 includes a first metal line 201 and a second metal line 202. The first metal line 201 is in the same layer as the first gate metal layer M0, as shown in the reference. Figure 6 The second metal line 202 is in the same layer as the source / drain metal layer M2. Figure 7 The second metal line 202 is in the same layer as the data line metal layer M3.

[0084] It is understood that the first metal line 201 and the second metal line 202 can be signal lines in the first non-display area NA, used for signal transmission. Therefore, voltage exists between the first metal line 201 and the second metal line 202. To ensure that the laser can undergo secondary reflection, the first metal line 201 and the second metal line 202 at least partially overlap in the direction Z perpendicular to the plane of the substrate 101. However, when signals are transmitted through the first metal line 201 and the second metal line 202, parasitic capacitance is generated in the overlapping portion. In this embodiment, the distance between the first metal line 201 and the second metal line 202 in the direction Z perpendicular to the plane of the substrate 101 is as large as possible. The first metal line 201 is on the same layer as the first gate metal layer M0, while the second metal line 202 is on the same layer as the source / drain metal layer M2 or the data line metal layer M3. This reduces the parasitic capacitance generated in the overlapping portion of the first metal line 201 and the second metal line 202, improving the display uniformity of the display panel 100.

[0085] In some alternative embodiments, reference continues to be made to... Figure 2 , Figure 3 , Figure 4 and Figure 5 The metal line 2 includes a first metal line 201 and a second metal line 202. The first metal line 201 is on the same layer as the first gate metal layer M0, and the second metal line 202 is on the same layer as the second gate metal layer M1. The first metal line 201 or the second metal line 202 is floating, grounded, or connected to a fixed potential.

[0086] Optionally, the first metal line 201 is co-layered with the first gate metal layer M0, and the second metal line 202 is co-layered with the second gate metal layer M1. Since the materials of the first gate metal layer M0 and the second gate metal layer M1 include molybdenum, and molybdenum metal has a relatively high reflectivity, after the laser penetrates the cathode 1033 and the organic light-emitting material in the first non-display area NA, it is more likely to be reflected back to one side of the encapsulation layer 104 when it irradiates the molybdenum metal. In this way, the reflected laser will irradiate the organic light-emitting material again, causing the organic light-emitting material to be removed. Therefore, having the metal line 2 co-layered with the first gate metal layer M0 or the second gate metal layer M1 can improve the reflectivity of the laser reflection, ensuring that the organic light-emitting material in the first non-display area NA can be reached, and further preventing water and oxygen from corroding the organic light-emitting material and causing the display panel 100 to fail.

[0087] On the other hand, in the direction Z perpendicular to the plane of the substrate 101, since the first gate metal layer M0 and the second gate metal layer M1 are close together, parasitic capacitance is easily generated in the overlapping part of the first metal line 201 and the second metal line 202. At this time, the first metal line 201 or the second metal line 202 is floated, grounded or connected to a fixed potential. When the first metal line 201 and the second metal line 202 are in the same layer as the first gate metal layer M0 and the second gate metal layer M1, the parasitic capacitance is minimized to the greatest extent, thereby improving the display uniformity of the display panel 100.

[0088] In some alternative embodiments, refer to Figure 8 , Figure 8 yes Figure 1 Another cross-sectional view along the A-A' direction shows that the width of the first metal line in the first direction U is not equal to the width of the second metal line 202 in the first direction U. The first direction U is the direction from the first non-display area NA to the display area AA.

[0089] Figure 8 The diagram exemplarily shows a first metal line 201 co-layered with the first gate metal layer M0, and a second metal line 202 co-layered with the source / drain metal layer M2. In the first direction U, the width of the second metal line 202 is 'a', and the width of the first metal line 201 is 'b', where 'a' > 'b'. Alternatively, in the first direction U, the width 'a' of the second metal line 202 can be less than the width 'b' of the first metal line 201, but this is not shown in the diagram. The function of the first metal line 201 is to fill the gaps between the second metal lines 202, ensuring that the laser light, after passing through the cathode 1033 and the organic light-emitting layer 1032, undergoes secondary reflection entirely on the surface of the metal line 2. In the first direction U, the widths of the first metal line 201 and the second metal line 202 are unequal. The narrower metal line 2 is only used to fill the gaps between the wider metal lines 2. Thus, in the first direction U, the overall space occupied by the metal line 2 is smaller, which helps to reduce the width of the first non-display area NA and increase the area of ​​the display area AA.

[0090] In some alternative embodiments, refer to Figure 9 and Figure 10 , Figure 9 yes Figure 1 Another cross-sectional view along the A-A' direction. Figure 10 yes Figure 1 Another cross-sectional view along the B-B' direction shows that the metal line 2 includes a first metal line 201 and a second metal line 202. The first metal line 201 is on the same layer as the second gate metal layer M1, and the second metal line 202 is on the same layer as the data line metal layer M3.

[0091] Figure 9 and Figure 10 In this configuration, the first metal line 201 is on the same layer as the second gate metal layer M1, and the second metal line 202 is on the same layer as the data line metal layer M3. Since the distance between the second gate metal layer M1 and the data line metal layer M3 is relatively large in the direction Z perpendicular to the plane of the substrate 101, and there are multiple insulating layers and source / drain metal layers M2 in between, even if the signal transmitted on the first metal line 201 and the second metal line 202 has voltage, the parasitic capacitance generated in the overlapping part of the first metal line 201 and the second metal line 202 can be reduced.

[0092] In some alternative embodiments, refer to Figure 11 and Figure 12 , Figure 11 yes Figure 1 Another cross-sectional view along the A-A' direction. Figure 12 yes Figure 1 Another cross-sectional view along the B-B' direction. Along the first direction U, the metal line 2 includes a first metal line 201, a second metal line 202, and a third metal line arranged in sequence. The first metal line 201 is on the same layer as the first gate metal layer M0 or the second gate metal layer M1. The second metal line 202 is on the same layer as the source and drain metal layers M2. The third metal line 203 is on the same layer as the data line metal layer M3. In the direction Z perpendicular to the plane of the substrate 101, the second metal line 202 partially overlaps with the first metal line 201, and the second metal line 202 partially overlaps with the third metal line 203.

[0093] Optional, Figure 11 In the middle, the first metal line 201 is on the same layer as the first gate metal layer M0. Figure 12 The first metal line 201 is on the same layer as the second gate metal layer M1. Figure 11 and Figure 12The second metal line 202 is co-layered with the source / drain metal layer M2, and the third metal line 203 is co-layered with the data line metal layer M3. In the direction Z perpendicular to the plane of the substrate 101, the second metal line 202 partially overlaps with the first metal line 201 and the third metal line 203. Laser L1 undergoes secondary reflection on the surface of the third metal line 203, laser L2 undergoes secondary reflection on the surface of the second metal line 202, and laser L3 undergoes reflection on the surface of the first metal line 201. This ensures that the lasers undergo secondary reflection on the surfaces of the metal lines 2 to remove the organic light-emitting layer 1032 in the first non-display area NA. It is understood that in this embodiment, the metal lines 2 are distributed across three metal layers, thus reducing the number of metal lines 2 in each metal layer. Consequently, the space occupied by the metal lines 2 in the first direction U is reduced, further reducing the width of the first non-display area NA and thereby increasing the area of ​​the display area AA.

[0094] In some alternative embodiments, refer to Figure 13 and Figure 14 , Figure 13 yes Figure 1 Another cross-sectional view along the A-A' direction. Figure 14 yes Figure 1 Another cross-sectional view along the B-B' direction, along the first direction U, the metal line 2 includes a first metal line 201, a second metal line 202, a third metal line and a fourth metal line 204 arranged in sequence. The first metal line 201 is on the same layer as the first gate metal layer M0, the second metal line 202 is on the same layer as the second gate metal layer M1, the third metal line 203 is on the same layer as the source and drain metal layer M2, and the fourth metal line 204 is on the same layer as the data line metal layer M3.

[0095] In the direction Z perpendicular to the plane of the substrate 101, the second metal line 202 partially overlaps with the first metal line 201, the second metal line 202 partially overlaps with the third metal line 203, and the third metal line 203 partially overlaps with the fourth metal line 204.

[0096] Figure 13 and Figure 14The first metal line 201 is on the same layer as the first gate metal layer M0, the second metal line 202 is on the same layer as the second gate metal layer M1, the third metal line 203 is on the same layer as the source / drain metal layer M2, and the fourth metal line 204 is on the same layer as the data line metal layer M3. The second metal line 202 partially overlaps with the first metal line 201 and the third metal line 203, and the third metal line 203 partially overlaps with the second metal line 202 and the fourth metal line 204. Laser L1 undergoes secondary reflection on the surface of the fourth metal line 204, laser L2 undergoes secondary reflection on the surface of the third metal line 203, laser L3 undergoes reflection on the surface of the second metal line 202, and laser L4 undergoes reflection on the surface of the first metal line 201. This ensures that the lasers can undergo secondary reflection on the surfaces of the metal lines 2 to remove the organic light-emitting layer 1032 in the first non-display area NA.

[0097] It is understood that in this embodiment, the metal lines 2 are distributed in four metal layers. Therefore, the number of metal lines 2 in each metal layer can be reduced. In the first direction U, the space occupied by the metal lines 2 will be reduced, which can further reduce the width of the first non-display area NA, thereby increasing the area of ​​the display area AA.

[0098] In some alternative embodiments, reference continues to be made to... Figure 13 and Figure 14 The second metal wire 202 or the third metal wire 203 is floated, grounded, or connected to a fixed potential.

[0099] like Figure 13 and Figure 14 As shown, in the direction Z perpendicular to the plane of the substrate 101, the second metal line 202 partially overlaps with the first metal line 201, the second metal line 202 partially overlaps with the third metal line 203, and the third metal line 203 partially overlaps with the fourth metal line 204. Therefore, parasitic capacitance is generated in the overlapping portion of the second metal line 202 and the first metal line 201. Similarly, parasitic capacitance is also generated in the overlapping portion of the second metal line 202 and the third metal line 203, and in the overlapping portion of the third metal line 203 and the fourth metal line 204. In this embodiment, the second metal line 202... If the second metal wire 202 or the third metal wire 203 is floated, grounded, or connected to a fixed potential, then the second metal wire 202 being floated, grounded, or connected to a fixed potential can reduce the parasitic capacitance generated when the second metal wire 202 overlaps with the first metal wire 201. Alternatively, the second metal wire 202 or the third metal wire 203 being floated, grounded, or connected to a fixed potential can reduce the parasitic capacitance generated when the second metal wire 202 overlaps with the third metal wire 203. Alternatively, the third metal wire 203 being floated, grounded, or connected to a fixed potential can reduce the parasitic capacitance generated when the third metal wire 203 overlaps with the fourth metal wire 204.

[0100] In some alternative embodiments, reference continues to be made to... Figures 2 to 10 The metal line 2 includes a first metal line 201 and a second metal line 202 located in different layers. In the direction Z perpendicular to the plane of the substrate 101, the first metal line 201 covers the gap between two adjacent second metal lines 202.

[0101] Figure 2 , Figure 3 , Figure 4 and Figure 5 In the first gate metal layer M0, the first metal line 201 is located in the first gate metal layer M0, and the second metal line 202 is located in the second gate metal layer M1. Figure 6 and Figure 8 The first metal line 201 is located in the first gate metal layer M0, and the second metal line 202 is located in the source and drain metal layers M2. Figure 7 The first metal line 201 is located in the first gate metal layer M0, and the second metal line 202 is located in the data line metal layer M3. Figure 9 and Figure 10 The first metal line 201 is located in the second gate metal layer M1, and the second metal line 202 is located in the data line metal layer M3. In the direction Z perpendicular to the plane of the substrate 101, the first metal line 201 covers the gap between two adjacent second metal lines 202. At this time, no laser will pass through the gap between the first metal line 201 and the second metal line 202 to reach the side of the substrate 101. This ensures that the laser can undergo secondary reflection on the surface of the metal lines 2 to remove the organic light-emitting layer 1032 in the first non-display area NA.

[0102] In some alternative embodiments, reference continues to be made to... Figures 2 to 10 In the direction from the display area AA to the first non-display area NA, the first metal line 201 and the second metal line 202 are alternately arranged.

[0103] It is understandable that along the first direction U, the first metal line 201 and the second metal line 202 are alternately arranged. The first metal line 201 in the same metal layer is arranged at intervals, and the second metal line 202 in the same metal layer is arranged at intervals. The first metal line 201 and the second metal line 202 are arranged in a regular alternation. During manufacturing, the metal lines 2 in the same layer are spaced relatively far apart, which can make full use of the space of the first non-display area NA. Moreover, the spacing between the metal lines 2 in the same layer can be increased, reducing crosstalk between the metal lines 2 in the same layer.

[0104] In some alternative embodiments, refer to Figure 15 , Figure 15 yes Figure 1 Another cross-sectional view along the A-A' direction shows that the width of the metal line 2 on the side closer to the substrate 101 is greater than the width of the metal line 2 on the side farther from the substrate 101.

[0105] Figure 15 In this design, the first metal line 201 is located on the side of the second metal line 202 closest to the substrate 101. In the first direction U, the width of the first metal line 201 is c, and the width of the second metal line 202 is d, where c > d. The function of the second metal line 202 is to fill the gaps between the first metal lines 201, ensuring that the laser light, after passing through the cathode 1033 and the organic light-emitting layer 1032, undergoes secondary reflection on the surface of the metal line 2. The width of the metal line 2 closer to the substrate 101 is greater than the width of the metal line 2 farther from the substrate 101; that is, the width of the first metal line 201 in the first direction U is greater than the width of the second metal line 202. The narrower metal line 2 is only used to fill the gaps between the wider metal lines 2. Thus, in the first direction U, the metal lines 2 occupy less space overall, which helps to reduce the width of the first non-display area NA and increase the area of ​​the display area AA.

[0106] In addition, the width of the metal line 2 on the side closer to the substrate 101 is greater than the width of the metal line 2 on the side farther away from the substrate 101, which can also improve the display performance.

[0107] In some alternative embodiments, reference continues to be made to... Figure 8 The width of the metal line 2 on the side away from the substrate 101 is greater than the width of the metal line 2 on the side closer to the substrate 101.

[0108] Figure 8 The example illustrates a first metal line 201 co-layered with the first gate metal layer M0, and a second metal line 202 co-layered with the source / drain metal layer M2. The first metal line 201 is located on the side of the second metal line 202 closer to the substrate 101. In the first direction U, the width of the second metal line 202 is 'a', and the width of the first metal line 201 is 'b', where 'a' > 'b'. That is, the width of the metal line 202 on the side farther from the substrate 101 is greater than the width of the metal line 202 on the side closer to the substrate 101. The function of the first metal line 201 is to fill the gap between the second metal lines 202, ensuring that the laser light, after passing through the cathode 1033 and the organic light-emitting layer 1032, undergoes secondary reflection entirely on the surface of the metal line 2. The width of the metal line 2 on the side away from the substrate 101 is greater than the width of the metal line 2 on the side closer to the substrate 101. The narrower metal line 2 is only used to fill the gap between the wider metal lines 2. In this way, the metal line 2 occupies less space overall in the first direction U, which is beneficial to reduce the width of the first non-display area NA and increase the area of ​​the display area AA.

[0109] In addition, the width of the metal line 2 on the side away from the substrate 101 is greater than the width of the metal line 2 on the side closer to the substrate 101, which can also improve the display performance.

[0110] In some alternative embodiments, refer to Figure 16 and Figure 17 and combined Figure 2 and Figure 3 , Figure 16 This is a schematic diagram of a planar structure of another display panel provided by the present invention. Figure 17 This is a schematic diagram of a planar structure of another display panel provided by the present invention. Figure 16 and Figure 17 The cathode 1033 is shown. The orthographic projection of the edge 1033K of the cathode 1033 onto the plane of the substrate 101 includes an arc or a wavy line. The orthographic projection of a portion of the wavy line onto the plane of the substrate 101 at least partially overlaps with the orthographic projection of the metal line 2 onto the plane of the substrate 101.

[0111] like Figure 16 As shown, the orthographic projection of the edge 1033K of the cathode 1033 onto the plane of the substrate 101 includes a wavy line or an arc. Figure 16 The edge 1033a of the cathode 1033 corresponding to the first non-display area NA includes an arc, and the edge 1033b of the cathode 1033 corresponding to the non-display area BB includes a wavy line. The shape and position of the edge of the cathode 1033 are not specifically defined here. Figure 17 The edges 1033a and 1033b of the intermediate cathode 1033 are fish-scale-shaped wavy lines, but this is only for illustrative purposes.

[0112] Understandably, for a straight segment, the perimeter of the edge 1033K of the cathode 1033 is longer. When the display panel 100 is subjected to compressive stress, the force per unit area of ​​the edge 1033K of the cathode 1033 is smaller. Therefore, the cathode 1033 is less likely to develop microcracks when subjected to compressive stress, which can improve the reliability of the display panel.

[0113] In some alternative embodiments, refer to Figure 18 , Figure 18 yes Figure 2 A magnified view of the M region shows that the width of metal line 2 in the first direction U is m1, and the width of the overlapping part of metal lines 2 in different metal layers in the first direction U is m2, where m2≤1 / 3m1.

[0114] It is understandable that the greater the width of the overlapping portion of the metal lines 2 of different metal layers in the first direction U, the greater the parasitic capacitance generated between the metal lines 2 of different metal layers. In this embodiment, the width of the metal line 2 in the first direction U is m1, and the width of the overlapping portion in the first direction U is m2 less than or equal to 1 / 3m1. This can reduce the parasitic capacitance. In addition, the greater the width of the overlapping portion of the metal lines 2 of different metal layers in the first direction U, the greater the width of the metal line 2. The space occupied by the metal line 2 in the first direction U will also increase accordingly. In this embodiment, the width of the overlapping portion in the first direction U is m2 less than or equal to 1 / 3m1. This can compress the space occupied by the metal line 2 in the first direction U as much as possible and increase the area of ​​the display area AA.

[0115] In some alternative embodiments, refer to Figure 19 , Figure 19 yes Figure 1 Another cross-sectional view along the A-A' direction shows that in the first non-display area NA, the metal line 2 on the side away from the substrate 101 also includes a barrier wall BK. The barrier wall BK protrudes on the side away from the substrate 101, and there is a gap between adjacent barrier walls BK.

[0116] like Figure 19 As shown, the pixel definition layer 105 includes a barrier wall BK on the side away from the substrate 101. The barrier walls BK are spaced apart and protrude from the side away from the substrate 101. Alternatively, the barrier walls BK can be disposed on any inorganic insulating layer between the metal line 2 and the edge of the cathode 1033. The optional array layer 102 also includes an inorganic insulating layer, with the barrier walls BK on the same layer as the inorganic insulating layer, which is not shown in the figure.

[0117] It is understandable that after setting the barrier BK, the organic light-emitting material will break at the position of the barrier BK during the evaporation of the organic light-emitting material. This prevents water and oxygen from entering the display area AA from the first non-display area NA, thereby improving the reliability of the display panel. In addition, since the barrier BK protrudes to the side away from the substrate 101, it is equivalent to extending the path for water and oxygen to enter the display area AA, which can also improve the reliability of the display panel.

[0118] In some alternative embodiments, reference continues to be made to... Figure 19 , Figure 19 The orthographic projection of the middle retaining wall BK onto the plane of the substrate 101 overlaps with the orthographic projection of the metal line 2 onto the plane of the substrate 101.

[0119] As described above, after setting the barrier BK, during the evaporation of the organic light-emitting material, the organic light-emitting material will first break at the location of the barrier BK, thereby preventing water and oxygen from entering the display area AA from the first non-display area NA, improving the reliability of the display panel. In addition, since the barrier BK protrudes away from the substrate 101, it effectively lengthens the path for water and oxygen to enter the display area AA, which also improves the reliability of the display panel. Furthermore, the orthographic projection of the barrier BK onto the plane of the substrate 101 overlaps with the orthographic projection of the metal line 2 onto the plane of the substrate 101. After being irradiated twice by laser, the organic light-emitting layer 1032 can evaporate under the action of laser energy, thereby further ensuring that water and oxygen do not enter the display area AA from the first non-display area NA, further ensuring the reliability of the display panel.

[0120] It should be noted that in the related technologies, in the technical solution of preventing water and oxygen from entering the display area AA by setting up a dam, the dam and the metal line 2 do not overlap. In this way, the width of the first non-display area NA is larger, which reduces the area of ​​the display area AA. In this embodiment, the orthographic projection of the dam BK on the plane of the substrate 101 overlaps with the orthographic projection of the metal line 2 on the plane of the substrate 101. This can reduce the width of the first non-display area NA, increase the area of ​​the display area AA, and make it easier to achieve a full screen.

[0121] Based on the same inventive concept, this invention also provides a method for manufacturing a display panel, the structure of which can be referred to the above. Figures 1 to 19 Any of the aforementioned display panels includes a display area AA, a first non-display area NA adjacent to the display area AA, and a receiving hole 1; refer to Figure 20 , Figure 20 This is a flowchart of a method for manufacturing a display panel provided by the present invention, combined with... Figure 21 , Figure 21 This is a cross-sectional view corresponding to the manufacturing method of the display panel of the present invention. Figure 21 The cross-sectional view in the diagram is only used to illustrate the position of the corresponding receiving hole 1. The structure of the border area is similar.

[0122] Figure 20 The production method includes the following steps:

[0123] S1, providing a substrate 101;

[0124] S2, an array layer 102 is formed on the substrate 101. In the first non-display area NA, the array layer 102 includes metal lines 2. The metal lines 2 are located in different metal layers. In the direction perpendicular to the plane of the substrate 101, the metal lines 2 located in different metal layers partially overlap. The orthographic projection of the metal lines 2 in the direction of the plane of the substrate 101 covers the first non-display area NA.

[0125] S3, an anode 1031 is formed on the side of the array layer 102 away from the substrate 101 and at the position corresponding to the sub-pixel, and an organic light-emitting layer 1032 is deposited on the side of the anode 1031 away from the substrate 101.

[0126] S4, the first non-display area NA is irradiated by laser from the side of the organic light-emitting layer 1032 away from the substrate 101. After the laser passes through the organic light-emitting layer 1032 of the first non-display area NA, it is reflected on the surface of the metal line 2 and passes through the organic light-emitting layer 1032 of the first non-display area NA again, thus removing the organic light-emitting layer 1032 in the first non-display area NA.

[0127] S5, a cathode 1033 is formed on the side of the organic light-emitting layer 1032 away from the substrate 101, and the orthographic projection of the metal line 2 in the plane direction of the substrate 101 overlaps with the edge 1033K of the cathode 1033.

[0128] S6, along the thickness direction of the display panel 100, a receiving hole 1 is formed in the laser-cut hole area.

[0129] In step S3, the first non-display area NA is irradiated by laser from the side of the organic light-emitting layer 1032 away from the substrate 101, i.e., laser irradiation is performed from the light-emitting surface (front) side of the display module. This avoids the laser affecting the driving period of the transistor. Moreover, this invention can improve the cathode patterning effect by using the metal lines in the array layer to reflect the laser. On the other hand, in related technologies, the metal lines of the array layer are generally located on the film layer where the channel region of the transistor is located during driving. Laser irradiation from the front can block the laser and prevent the laser from damaging the semiconductor active layer of the transistor without adding an additional light-shielding layer.

[0130] Corresponding to the first non-display area NA, a laser is used to irradiate the first non-display area NA from the side of the organic light-emitting layer 1032 away from the substrate 101. The laser first penetrates the organic light-emitting layer 1032. During this first penetration, the laser energy causes partial evaporation. After penetrating the organic light-emitting layer 1032, the laser reaches the surface of the metal line 2. Since the metal lines 2 are located in different layers and partially overlap in the Z direction perpendicular to the plane of the substrate 101, it can be ensured that the laser light is reflected from the surface of the metal lines 2. Figure 21As shown, the laser is reflected from the surfaces of the first metal line 201 and the second metal line 202. After reflection, the laser irradiates the organic light-emitting layer 1032 a second time, causing the remaining organic light-emitting layer 1032 to evaporate. This ensures that no organic light-emitting layer 1032 remains in the first non-display area NA. On the one hand, this prevents water and oxygen from corroding the organic light-emitting layer 1032 in the first non-display area NA, thus preventing water and oxygen from entering the display area AA and improving the reliability of the display panel. On the other hand, since the organic light-emitting layer 1032 in the first non-display area NA can be removed without the need for a dam, the area of ​​the first non-display area NA can be reduced, increasing the area of ​​the display area AA and improving the screen-to-body ratio of the display panel 100.

[0131] In some alternative embodiments, combined with Figure 22 , Figure 22 This is a flowchart illustrating another method for manufacturing a display panel 100 provided by the present invention. Figure 22 In the formation of array layer 102, a barrier wall BK is also formed on the side of metal line 2 away from substrate 101. The barrier wall BK protrudes to the side away from substrate 101, and there is a gap between adjacent barrier walls BK.

[0132] As described above, after a barrier wall BK is formed on the side of the metal line 2 away from the substrate 101, during the evaporation of the organic light-emitting material in step S3, the organic light-emitting material will first break at the location of the barrier wall BK. This prevents water and oxygen from entering the display area AA from the first non-display area NA, improving the reliability of the display panel. In addition, since the barrier wall BK protrudes towards the side away from the substrate 101, it effectively extends the path for water and oxygen to enter the display area AA, further improving the reliability of the display panel. Furthermore, the orthographic projection of the barrier wall BK onto the plane of the substrate 101 overlaps with the orthographic projection of the metal line 2 onto the plane of the substrate 101. After being irradiated twice by laser, the organic light-emitting layer 1032 can evaporate under the action of laser energy, thereby further ensuring that water and oxygen do not enter the display area AA from the first non-display area NA, further ensuring the reliability of the display panel. In the technical solution of preventing water and oxygen from entering the display area AA by setting up a dam, the dam and the metal line 2 do not overlap. This makes the width of the first non-display area NA larger, reducing the area of ​​the display area AA. The orthographic projection of the dam BK on the plane of the substrate 101 overlaps with the orthographic projection of the metal line 2 on the plane of the substrate 101. This can reduce the width of the first non-display area NA, increase the area of ​​the display area AA, and make it easier to achieve a full screen.

[0133] Based on the same inventive concept, the present invention also provides a display device, including the display panel of any of the above embodiments.

[0134] refer to Figure 23 , Figure 23 This is a schematic diagram of the planar structure of a display device provided by the present invention. Figure 23 The provided display device 200 includes the display panel 100 provided in any of the above embodiments of the present invention. Figure 23 The embodiments are described using a mobile phone as the display device only. It is understood that the display provided in the embodiments of the present invention can be any other display device with display function, such as a computer, television, tablet computer, e-reader, or in-vehicle display device. The present invention does not impose specific limitations on this. The display device provided in the embodiments of the present invention has the beneficial effects of the display panel provided in the embodiments of the present invention. For details, please refer to the specific descriptions of the display panel in the above embodiments. These descriptions will not be repeated here.

[0135] In some alternative embodiments, reference continues to be made to... Figure 23 The display panel 100 has at least one of the following devices (not shown in the figure): a camera, an earpiece, a speaker, and an infrared sensor, housed within its accommodating hole.

[0136] As can be seen from the above embodiments, the display panel, its manufacturing method, and the display device provided by the present invention achieve at least the following beneficial effects:

[0137] The display panel of this invention is an organic self-emissive display panel, including a display area, a first non-display area adjacent to the display area, and a receiving hole. The array layer of the display panel includes metal lines. The orthographic projection of the metal lines in the plane of the substrate overlaps with the edge of the cathode. The metal lines are located in different metal layers. In the direction perpendicular to the plane of the substrate, the metal lines located in different metal layers at least partially overlap. At the position corresponding to the edge of the cathode, the first non-display area will be covered during the deposition of the organic light-emitting layer. However, corresponding to the first non-display area, the first non-display area is irradiated by a laser from the side of the organic light-emitting layer away from the substrate. The laser first penetrates the organic light-emitting layer. Under the energy of the laser, the laser partially evaporates during the first penetration of the organic light-emitting layer. The laser then reaches the surface of the metal wire. Since the metal wires are located in different layers and partially overlap in the direction perpendicular to the plane of the substrate, the laser will be reflected on the surface of the metal wire. After the laser reflection, the organic light-emitting layer is irradiated a second time, and the remaining organic light-emitting layer evaporates. This ensures that there is no organic light-emitting layer residue in the first non-display area. On the one hand, this prevents water and oxygen from entering the display area from the first non-display area, improving the reliability of the display panel. On the other hand, since the organic light-emitting layer in the first non-display area can be removed without setting a dam, the space required for setting a dam in the first non-display area can be reduced, thereby increasing the area of ​​the display area and improving the screen-to-body ratio of the display panel.

[0138] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A display panel, characterized in that, Includes a display area and a first non-display area adjacent to the display area and a receiving hole; The display panel includes: a substrate, an array layer located on one side of the substrate, and a light-emitting unit located on the side of the array layer away from the substrate. The light-emitting unit includes an anode, an organic light-emitting layer, and a cathode arranged sequentially in a direction away from the substrate. The array layer includes metal lines located in different metal layers. In a direction perpendicular to the plane of the substrate, the metal lines located in different metal layers at least partially overlap. The orthographic projection of the metal lines in the direction of the plane of the substrate overlaps with the edge of the cathode. The method for manufacturing the display panel includes the following steps: Provide substrates; An array layer is formed on the substrate. In the first non-display area, the array layer includes metal lines. The metal lines are located in different metal layers. In a direction perpendicular to the plane of the substrate, the metal lines located in different metal layers partially overlap. The orthographic projection of the metal lines in the direction of the plane of the substrate covers the first non-display area. An anode is formed on the side of the array layer away from the substrate and at a position corresponding to a sub-pixel; An organic light-emitting layer is deposited on the side of the anode away from the substrate. A laser is used to irradiate the area of ​​the first non-display area from the side of the organic light-emitting layer away from the substrate. After the laser penetrates the organic light-emitting layer of the first non-display area, it is reflected on the surface of the metal line and penetrates the organic light-emitting layer of the first non-display area again, thereby removing the organic light-emitting layer in the first non-display area. A cathode is formed on the side of the organic light-emitting layer away from the substrate, and the orthographic projection of the metal line in the plane of the substrate overlaps with the edge of the cathode; The receiving hole is formed by laser cutting along the thickness direction of the display panel.

2. The display panel according to claim 1, characterized in that, The number of metal lines located in different metal layers is equal.

3. The display panel according to claim 1, characterized in that, In the display area, the array layer includes a first gate metal layer, a second gate metal layer, a source / drain metal layer, and a data line metal layer sequentially disposed along a direction away from the substrate, wherein the metal line is disposed in the same layer as at least two of the metal layers.

4. The display panel according to claim 3, characterized in that, The metal lines include at least the metal lines that are in the same layer as the first gate metal layer or the second gate metal layer.

5. The display panel according to claim 3, characterized in that, The metal lines include a first metal line and a second metal line. The first metal line is on the same layer as the first gate metal layer, and the second metal line is on the same layer as the source and drain metal layers, or the second metal line is on the same layer as the data line metal layer.

6. The display panel according to claim 3, characterized in that, The metal wires include a first metal wire and a second metal wire. The first metal wire is on the same layer as the first gate metal layer, and the second metal wire is on the same layer as the second gate metal layer. The first metal wire or the second metal wire is floating, grounded, or connected to a fixed potential.

7. The display panel according to claim 3, characterized in that, The metal lines include a first metal line and a second metal line. The width of the first metal line in a first direction is not equal to the width of the second metal line in the first direction. The first direction is the direction from the first non-display area to the display area.

8. The display panel according to claim 3, characterized in that, The metal lines include a first metal line and a second metal line, wherein the first metal line is in the same layer as the second gate metal layer, and the second metal line is in the same layer as the data line metal layer.

9. The display panel according to claim 3, characterized in that, Along a first direction, the metal lines include a first metal line, a second metal line, and a third metal line arranged in sequence. The first metal line is on the same layer as the first gate metal layer or the second gate metal layer. The second metal line is on the same layer as the source and drain metal layers. The third metal line is on the same layer as the data line metal layer. In a direction perpendicular to the plane of the substrate, the second metal line partially overlaps with the first metal line and the second metal line partially overlaps with the third metal line.

10. The display panel according to claim 3, characterized in that, Along the first direction, the metal line includes a first metal line, a second metal line, a third metal line and a fourth metal line arranged in sequence. The first metal line is on the same layer as the first gate metal layer, the second metal line is on the same layer as the second gate metal layer, the third metal line is on the same layer as the source and drain metal layers, and the fourth metal line is on the same layer as the data line metal layer. In a direction perpendicular to the plane of the substrate, the second metal line partially overlaps with the first metal line, the second metal line partially overlaps with the third metal line, and the third metal line partially overlaps with the fourth metal line.

11. The display panel according to claim 10, characterized in that, The second metal wire or the third metal wire is floated, grounded, or connected to a fixed potential.

12. The display panel according to claim 1, characterized in that, The metal lines include first metal lines and second metal lines located in different layers. In a direction perpendicular to the plane of the substrate, the first metal line covers the gap between two adjacent second metal lines.

13. The display panel according to claim 12, characterized in that, In the direction from the display area to the first non-display area, the first metal line and the second metal line are alternately arranged.

14. The display panel according to claim 1, characterized in that, The width of the metal line closer to the substrate is greater than the width of the metal line farther from the substrate.

15. The display panel according to claim 1, characterized in that, The width of the metal line on the side away from the substrate is greater than the width of the metal line on the side closer to the substrate.

16. The display panel according to claim 1, characterized in that, The orthographic projection of the edge of the cathode onto the plane of the substrate includes an arc or a wavy line, and the orthographic projection of a portion of the wavy line onto the plane of the substrate at least partially overlaps with the orthographic projection of the metal line onto the plane of the substrate.

17. The display panel according to claim 1, characterized in that, The width of the metal wire in the first direction is m1, and the width of the overlapping portion of the metal wires of different metal layers in the first direction is m2, where m2 ≤ 1 / 3m1.

18. The display panel according to claim 1, characterized in that, In the first non-display area, the side of the metal line away from the substrate also includes a barrier wall, the barrier wall protruding towards the side away from the substrate, and there is a gap between adjacent barrier walls; When forming the array layer, a barrier is also formed on the side of the metal line away from the substrate.

19. The display panel according to claim 18, characterized in that, The array layer also includes an inorganic insulating layer, and the barrier is in the same layer as the inorganic insulating layer.

20. The display panel according to claim 19, characterized in that, The orthographic projection of the barrier wall onto the plane of the substrate overlaps with the orthographic projection of the metal wire onto the plane of the substrate.

21. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 20.

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