一种光通讯器件的封装管壳及其加工方法和光通讯器件
By using a ceramic substrate and Ag72Cu28 solder for sintering in optical communication devices, the problem of low thermal conductivity of the package casing was solved, resulting in better heat dissipation performance and mechanical reliability. The structure was simplified, and the stability and integration of the chip were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 深圳市宏钢光电封装技术股份有限公司
- Filing Date
- 2023-04-04
- Publication Date
- 2026-07-17
AI Technical Summary
Existing optical communication devices have small thermally conductive cross-sectional areas in their packaging shells, numerous interfaces with high thermal resistance, low thermal conductivity, and complex structures that are prone to voids, affecting the stability and reliability of the chips.
By replacing traditional gold-plated ceramics with ceramic substrates, chips are directly mounted on the ceramic substrates. By increasing the thermal conductivity cross-sectional area and reducing the number of interfaces, combined with the brazing and sintering of Ag72Cu28 solder and metallization treatment, the thermal conductivity and mechanical properties are improved.
It improves the heat dissipation performance and mechanical reliability of the package, reduces interface thermal resistance, enhances chip stability and integration, and simplifies the structure.
Smart Images
Figure CN116314352B_ABST