Sound box and electronic system

Abstract

The application discloses a kind of sound box and electronic system, sound box includes shell, loudspeaker, mainboard component and flow guide piece.The shell is equipped with front sound cavity and rear sound cavity, the shell is also equipped with the mounting hole of the front sound cavity and the rear sound cavity, and the sound hole of the front sound cavity is communicated;The loudspeaker is set in the mounting hole, and partially extends into the rear sound cavity;The mainboard component is set in the front sound cavity, and is electrically connected to the loudspeaker;The flow guide piece is set in the front sound cavity, and can guide the airflow in the front sound cavity to flow towards the mainboard component when the loudspeaker vibrates and sounds.The technical scheme of the application can improve the heat dissipation performance of the sound box, so that the normal and stable use of the sound box.

Description

Technical Field

[0001] This invention relates to the field of speaker technology, and in particular to a speaker and an electronic system using the speaker. Background Technology

[0002] Currently, with the development of Bluetooth technology, smart home speakers are becoming increasingly widely used. However, during prolonged use, speakers can generate significant heat, which can affect their normal operation. Summary of the Invention

[0003] The main objective of this invention is to provide a speaker that improves heat dissipation performance to ensure stable and normal operation.

[0004] To achieve the above objectives, the speaker proposed in this invention includes:

[0005] The housing has a front sound cavity and a rear sound cavity inside, and the housing also has a mounting hole connecting the front sound cavity and the rear sound cavity, and a sound outlet hole connecting the front sound cavity;

[0006] The speaker is disposed in the mounting hole and partially extends into the rear sound cavity;

[0007] A motherboard assembly, wherein the motherboard assembly is disposed within the front sound cavity and electrically connected to the speaker; and

[0008] A flow guide is disposed within the front acoustic cavity and can guide the airflow within the front acoustic cavity toward the mainboard assembly when the speaker vibrates and produces sound.

[0009] In one embodiment, the motherboard assembly includes a motherboard and a chip, the chip being disposed on the side of the motherboard closer to the speaker;

[0010] The flow guide includes a flow guide tube, with an opening at one end corresponding to the speaker and an opening at the other end corresponding to the chip.

[0011] In one embodiment, the cross-sectional area of ​​the flow guide tube is reduced in the direction from the end of the flow guide tube near the speaker to the end near the chip.

[0012] In one embodiment, the end of the horn near the guide tube includes a diaphragm, the diaphragm including a central portion, a folded portion and an edge portion connected in sequence;

[0013] On a projection plane perpendicular to the axis of the horn, the projection of the guide tube covers at least the folded ring portion.

[0014] In one embodiment, the cavity wall of the front acoustic cavity with the mounting hole is defined as an open cavity wall, and one end of the speaker with the diaphragm is located within the space enclosed by the guide tube and the open cavity wall.

[0015] In one embodiment, the flow guide is a heat-conducting component, and the flow guide further includes an abutment plate, which covers the opening at one end of the flow guide tube near the chip and abuts against the side of the chip away from the motherboard;

[0016] An air passage is provided at the connection between the guide tube and the abutment plate, and the air passage connects the inner and outer sides of the guide tube.

[0017] In one embodiment, the abutment plate and the chip are fixed together by a thermal adhesive;

[0018] And / or, the projected area of ​​the abutment plate on the motherboard is greater than the projected area of ​​the chip on the motherboard;

[0019] And / or, the number of air passages is at least two, and at least two air passages are arranged along the circumference of the guide tube.

[0020] In one embodiment, the flow guide further includes a connecting pin, one end of which is connected to the abutment plate and / or the flow guide tube, and the other end is connected to the main board.

[0021] In one embodiment, the connecting pin is bonded and fixed to the motherboard;

[0022] And / or, the connecting pin is provided corresponding to the vent hole, and the end of the connecting pin away from the motherboard is connected to the portion of the abutment plate that forms the vent hole wall;

[0023] And / or, the connecting foot, the abutment plate, and the guide tube are integrally formed.

[0024] In one embodiment, the motherboard assembly and the speaker are arranged opposite to each other;

[0025] And / or, the housing includes a lower shell and an upper shell, the lower shell having the rear sound cavity and the mounting hole; the upper shell covers the end of the lower shell having the mounting hole, and together with the lower shell, forms the front sound cavity, and the upper shell and / or the lower shell having the sound outlet hole.

[0026] The present invention also proposes an electronic system including the speaker in any of the above embodiments.

[0027] The speaker of this invention features a guide vane within its front acoustic cavity. As the speaker vibrates and generates sound, causing airflow within the cavity to exit through the sound outlet, the guide vane directs this airflow towards the motherboard assembly, effectively removing heat generated during operation. Therefore, the guide vane in this solution improves the speaker's heat dissipation performance, promptly eliminating heat generated during operation and ensuring stable, normal use. Furthermore, the airflow is directly driven by the speaker's vibration. This means the speaker utilizes the airflow generated by the speaker's vibration for heat dissipation, eliminating the need for an additional drive structure. This improves heat dissipation without compromising structural complexity, enhancing manufacturing convenience and energy efficiency. Simultaneously, the heat dissipation process follows the speaker's vibration, providing targeted cooling during the speaker's operating time, further enhancing the speaker's overall heat dissipation capacity. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of a speaker according to an embodiment of the present invention;

[0030] Figure 2 for Figure 1 A schematic diagram of the exploded structure of a mid-range speaker;

[0031] Figure 3 for Figure 2 A schematic diagram of the airflow guide of the midrange speaker;

[0032] Figure 4 for Figure 1 A cross-sectional view of the mid-range speaker enclosure;

[0033] Figure 5 for Figure 4 A schematic diagram showing the state of the speaker in the mid-range enclosure vibrating and causing airflow to flow out of the enclosure;

[0034] Figure 6 for Figure 4 A schematic diagram showing the state in which the speaker in the mid-range enclosure vibrates, causing airflow from the outside to enter the enclosure.

[0035] Explanation of icon numbers:

[0036]

[0037]

[0038] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0040] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0043] A speaker is a device that converts audio signals into sound; it's a sound-producing device. Currently, speakers are used in homes, offices, and outdoor locations. Especially with the development of Bluetooth technology, smart home speakers are becoming increasingly widespread. A speaker typically consists of a casing and a speaker and mainboard assembly housed within it. During prolonged use, the mainboard assembly generates heat, which can cause the speaker to overheat and affect its normal operation.

[0044] Based on the above considerations, in order to achieve heat dissipation for the speaker, this application proposes a novel speaker. By setting a guide component in the front acoustic cavity of the speaker, the airflow in the front acoustic cavity is guided to flow towards the motherboard assembly when the speaker vibrates and produces sound, so as to carry away the heat generated by the motherboard assembly in time, thereby improving the heat dissipation performance of the speaker and ensuring the normal and stable use of the speaker.

[0045] The structure of the speaker proposed in this invention will be explained and described below with specific embodiments. In one embodiment of this invention, please refer to the reference. Figures 1 to 4 The speaker 100 proposed in this invention includes a housing 10, a speaker 30, a mainboard assembly 50, and a flow guide 70. The housing 10 has a front sound cavity 11 and a rear sound cavity 12. The housing 10 also has a mounting hole 13 connecting the front sound cavity 11 and the rear sound cavity 12, and a sound outlet 14 connecting the front sound cavity 11. The speaker 30 is disposed in the mounting hole 13 and partially extends into the rear sound cavity 12. The mainboard assembly 50 is disposed in the front sound cavity 11 and is electrically connected to the speaker 30. The flow guide 70 is disposed in the front sound cavity 11 and can guide the airflow in the front sound cavity 11 to flow toward the mainboard assembly 50 when the speaker 30 vibrates and produces sound.

[0046] The housing 10 encloses the front acoustic cavity 11 and the rear acoustic cavity 12, providing mounting positions for the speaker 30, mainboard assembly 50, and airflow guide 70, allowing the various components in the speaker enclosure 100 to be assembled into a single unit. The front acoustic cavity 11 is located in front of the vibrating sound-producing end of the speaker 30 (i.e., the end of the speaker 30 including the diaphragm 351), while the rear acoustic cavity 12 is located in front of the vibrating sound-producing end of the speaker 30. The rear acoustic cavity enhances the sound intensity, while the front acoustic cavity 11 amplifies the sound. The shapes of the front acoustic cavity 11 and the rear acoustic cavity 12 can be adapted to the shape of the housing 10. For example, when the housing 10 is a cylindrical structure, both the front acoustic cavity 11 and the rear acoustic cavity 12 can be cylindrical; when the housing 10 is a square columnar structure, both the front acoustic cavity 11 and the rear acoustic cavity 12 can be square columnar. Furthermore, this application does not specifically limit the shape of the housing 10.

[0047] A speaker 30, used for vibrating sound, typically includes a frame 31, a magnetic circuit system 33 mounted on the frame 31, and a vibration system 35. The vibration system 35 includes a diaphragm 351 and a voice coil 359 connected to the diaphragm 351. The end of the voice coil 359 away from the diaphragm 351 is inserted into a magnetic gap in the vibration system 35. For specific examples, refer to existing speaker 30s. During the vibration sound-generating process of the speaker 30, when the diaphragm 351 moves along a first direction (this first direction can be upward, downward, left, or right; this application does not specifically limit this), the volume of the front acoustic cavity 11 decreases, thereby increasing the pressure within the front acoustic cavity 11. At this time, with a greater pressure in the front acoustic cavity 11 compared to the outside, the pressure difference drives the airflow within the front acoustic cavity 11 to flow out through the sound outlet 14. Figure 5 As shown ( Figure 5 (The middle arrow represents the airflow path). When the diaphragm 351 in the speaker 30 moves in a second direction opposite to the first direction, the volume of the front sound cavity 11 increases, thereby reducing the pressure inside the front sound cavity 11. At this time, with the front sound cavity 11 having a lower pressure than the outside, the pressure difference drives the outside airflow to enter the front sound cavity 11 through the sound outlet 14, such as... Figure 6 As shown ( Figure 6 The middle arrow represents the airflow path. That is, during the vibration and sound production process of the speaker 30, the speaker box 100 simultaneously undergoes a cycle of gas exhaust and intake.

[0048] The motherboard assembly 50 can be used to electrically connect to the speaker 30 to control the startup and operation of the speaker 30. Of course, when the speaker 100 includes other electrical components, the motherboard assembly 50 can also further control these other electrical components. That is, the motherboard assembly 50 is equivalent to the "controller section" of the speaker 100.

[0049] The air guide 70 can be used to guide and converge airflow. That is, during the gas exhaust process of the speaker 100, the airflow in the front acoustic cavity 11 can be guided by the air guide 70 to flow towards the mainboard assembly 50 before exhaust (e.g., Figure 5 As shown), the airflow gathered in this section dissipates heat from the motherboard assembly 50 before being expelled through the sound outlet 14. Then, during the air intake process of the speaker 100, new airflow from the outside can be introduced into the front sound cavity 11 (as shown). Figure 6As shown in the diagram, the airflow guide 70 guides the airflow again during the subsequent gas exhaust process of the speaker 100, thereby achieving further heat dissipation for the motherboard component 50. That is, during the gas exhaust and intake cycle of the speaker 100, the airflow guide 70 continuously dissipates heat from the motherboard component 50 during each gas exhaust process. It should be noted that since the speaker 100 proposed in this application only utilizes the airflow guide 70 to guide and converge the airflow driven within the front acoustic cavity 11, and the airflow ultimately exits uniformly from the sound outlet 14, the placement of the airflow guide 70 does not affect the sound output of the speaker 100. Therefore, the design in this application, which uses the airflow guide 70 to guide the airflow driven by the speaker 30 to dissipate heat from the motherboard component 50, does not increase the workload of the speaker 30. In other words, the speaker 100 in this application does not require additional power from the speaker 30 to ensure sound quality when a heat dissipation function is provided, allowing the speaker 30 to operate at a relatively low power. Furthermore, the power of the speaker 30 is significantly lower than that of the motherboard component 50, resulting in significantly less heat generated by the speaker 30 compared to the motherboard component 50. Even if the airflow guided by the guide 70 carries some heat generated by the speaker 30, the temperature of this airflow is still significantly lower than that of the motherboard component 50. Therefore, the airflow guided by the guide 70 towards the motherboard component 50 remains a "low-temperature airflow" relative to the motherboard component 50, thus effectively dissipating heat from the motherboard component 50. Additionally, it should be noted that the airflow guide 70 can be a ring structure as described below, or it can be a single plate with a guide surface for guiding airflow, or multiple spaced-apart enclosures forming a channel for guiding airflow. This application does not limit the specific structure of the airflow guide 70, as long as it ensures that when the speaker 30 vibrates and produces sound, the airflow guide 70 can guide the airflow within the front sound cavity 11 towards the mainboard assembly 50. Furthermore, the airflow guide 70 can be a heat-conducting component, such as a metal component with good thermal conductivity, to further increase the heat exchange area with the airflow and improve heat dissipation. Of course, the material of the airflow guide 70 can also be plastic; this application does not limit the specific material of the airflow guide 70. Additionally, the airflow guide 70 can be fixed to the mainboard assembly 50, or it can be fixed to the housing 10; this application does not limit this either.

[0050] The speaker 100 of this invention has a guide member 70 installed in the front sound cavity 11. This guide member 70 directs the airflow from the front sound cavity 11 towards the motherboard assembly 50 as the speaker 30 vibrates and produces sound, thus carrying away the heat generated by the motherboard assembly 50 during operation. Therefore, the speaker 100 in this invention improves its heat dissipation performance by using the guide member 70, effectively removing the heat generated during operation and ensuring stable and normal use. Furthermore, the airflow is directly driven by the vibration of the speaker 30. In other words, the speaker 100 in this solution directly utilizes the airflow generated by the vibration of the speaker 30 during heat dissipation. This eliminates the need for an additional drive structure to propel the airflow, thus improving the heat dissipation performance of the speaker 100 without compromising its structural complexity, thereby enhancing manufacturing convenience and energy efficiency. Furthermore, the heat dissipation process follows the vibration of the speaker 30, ensuring targeted cooling during the speaker 30's operating time and further enhancing the speaker 100's heat dissipation capacity.

[0051] Please refer to Figure 4 In one embodiment of the present invention, the motherboard assembly 50 includes a motherboard 51 and a chip 53, the chip 53 being disposed on the side of the motherboard 51 near the speaker 30; the flow guide 70 includes a flow guide tube 71, the opening at one end of the flow guide tube 71 being disposed corresponding to the speaker 30, and the opening at the other end being disposed corresponding to the chip 53.

[0052] The motherboard 51 can provide mounting positions for the chip 53. Corresponding circuits can be installed on the motherboard 51 to house the chip 53 and the speaker 30 or other electrical components. The motherboard 51 can be a cuboid or cylindrical structure to simplify its structure and improve manufacturing convenience. However, this application is not limited to this; in other embodiments, the motherboard 51 can also be a triangular prism or other shapes. The chip 53 can store corresponding control programs to control the operation of the speaker 30 or other electrical components. When the motherboard assembly 50 is operating, the chip 53 in the motherboard 51 generates significant heat. The airflow guide 71 guides airflow to the chip 53 for heat exchange and cooling. The airflow guide 71 can be a horn-shaped structure with a decreasing cross-sectional area along one direction, as described below, or it can be a straight cylindrical structure with equal cross-sectional areas at all points. In addition, the flow guide tube 71 can be extended in a straight line or in a zigzag line. The specific arrangement can be adapted according to the positional correspondence between the speaker 30 and the mainboard component 50.

[0053] In this embodiment, the airflow guide 70 includes an annular airflow guide tube 71, which allows a relatively enclosed space to be formed inside the airflow guide tube 71, thereby guiding the airflow in the circumferential direction and improving the airflow guiding effect of the airflow guide 70. By corresponding the two openings of the airflow guide 70 to the speaker 30 and the chip 53 respectively, the airflow driven by the vibrating speaker 30 can be better guided to flow specifically to the chip 53, thereby achieving better and more effective heat dissipation for the chip 53, which mainly generates heat, and further improving the heat dissipation capacity of the speaker 100.

[0054] Please refer to the reference. Figure 3 and Figure 4 In one embodiment of the present invention, the cross-sectional area of ​​the channel of the guide tube 71 is reduced in the direction from the end of the guide tube 71 near the speaker 30 to the end near the chip 53.

[0055] The channel cross-sectional area is set to decrease, that is, the guide tube 71 can be set in a horn-shaped structure. Of course, it can also be set so that only the two sides of the guide tube 71 are close to each other in the direction from the end of the guide tube 71 near the horn 30 to the end near the chip 53, so as to ensure that the channel cross-sectional area of ​​the end of the guide tube 71 near the horn 30 is greater than the channel cross-sectional area of ​​the end near the chip 53.

[0056] In this embodiment, the cross-sectional area of ​​the airflow guide tube 71 is gradually reduced from the end near the speaker 30 to the end near the chip 53, resulting in a larger opening at the speaker 30. This allows more airflow to enter the airflow guide tube 71 when the speaker 30 vibrates. Simultaneously, the opening at the chip 53 end of the airflow guide tube 71 is smaller, allowing the airflow entering the airflow guide tube 71 to converge at the chip 53. In other words, the airflow guide tube 71, in this configuration, guides more airflow towards the chip 53 and converges the airflow, thereby improving the heat dissipation effect on the chip 53 and further enhancing the heat dissipation performance of the speaker 100.

[0057] Please refer to Figure 4 In one embodiment of the present invention, the diaphragm 351 of the horn 30 near the end of the guide tube 71 includes a central portion 353, a folded ring portion 355 and an edge portion 357 connected in sequence; on the projection plane perpendicular to the axis of the horn 30, the projection of the guide tube 71 covers at least the folded ring portion 355.

[0058] The central portion 353 of the diaphragm 351, which is the main body part located in the middle of the diaphragm 351, is where the voice coil 359 of the speaker 30 is connected. The surround portion 355 of the diaphragm 351 is the portion of the diaphragm 351 located on the outer periphery of the central portion 353 and protruding towards the front sound cavity 11 or the rear sound cavity 12. The edge portion 357 of the diaphragm 351 is the portion of the diaphragm 351 located on the outer periphery of the surround portion 355, so that the diaphragm 351 can be mounted in the frame 31 of the speaker 30. The shape and structure of the diaphragm 351 can refer to the diaphragm 351 in the prior art. The projection of the guide tube 71 at least covers the surround portion 355, that is, the area of ​​the opening of the guide tube 71 near the end of the speaker 30 can be approximately the same as or larger than the area of ​​the surround in the diaphragm 351, so as to further cover the edge portion 357 of the diaphragm 351.

[0059] In this embodiment, the projection of the air guide tube 71 covers at least the folded ring portion 355, and the diaphragm 351 mainly vibrates through its central portion 353. Therefore, the airflow corresponding to the central portion 353 of the diaphragm 351, driven by the diaphragm 351 during vibration, can better enter the air guide tube 71 with a larger opening, thereby further improving the air guiding capacity of the air guide tube 71 and improving the heat dissipation performance of the speaker 100. Furthermore, it should be noted that, in order to reduce the influence of the air guide 70 on the vibration operation of the diaphragm 351, the air guide tube 71 and the folded ring portion 355 in the diaphragm 351 can be spaced apart. Of course, it should be noted that this application is not limited to this; in other embodiments, the area of ​​the opening at the end of the air guide tube 71 near the speaker 30 can also be smaller than the area of ​​the folded portion in the diaphragm 351.

[0060] In one embodiment of the present invention, the cavity wall of the front sound cavity 11 with the mounting hole 13 is defined as the perforated cavity wall 111, and the end of the speaker 30 with the diaphragm 351 is located in the space enclosed by the guide tube 71 and the perforated cavity wall 111.

[0061] In this embodiment, the end of the air guide tube 71 near the speaker 30 is placed against the wall 111 of the opening cavity, so that the end of the air guide tube 71 near the speaker 30 and the wall 111 of the opening cavity 13 in the front sound cavity 11 form a closed space, so that the airflow driven by the speaker 30 when vibrating can only enter the air guide tube 71. At this time, the air guide tube 71 can further improve its ability to converge airflow, so as to improve the heat dissipation performance of the speaker box 100.

[0062] Please refer to the reference. Figure 3 and Figure 4 In one embodiment of the present invention, the flow guide 70 is a heat-conducting component. The flow guide 70 also includes an abutment plate 73, which covers the opening of the flow guide tube 71 near the chip 53 and abuts against the side of the chip 53 away from the motherboard 51. An air vent 711 is provided at the connection between the flow guide tube 71 and the abutment plate 73, and the air vent 711 connects the inner and outer sides of the flow guide tube 71.

[0063] The air guide 70 is a heat-conducting component, meaning it can be made of materials with good thermal conductivity, such as copper and aluminum. The vent 711 allows airflow. Specifically, when the diaphragm 351 in the speaker 30 moves in the first direction, it drives the airflow inside the air guide 71 towards one end of the abutment plate 73. After heat exchange, the airflow exits through the vent 711 to the outside of the air guide 71, and then flows out through the sound outlet 14. Conversely, when the diaphragm 351 in the speaker 30 moves in the opposite second direction, it drives external airflow through the sound outlet 14 into the front sound cavity 11, and then through the vent 711 into the air guide 71. The vent 711 can be located solely on the air guide 71, or it can be partially located on the air guide 71 and partially on the abutment plate 73.

[0064] In this embodiment, the airflow guide 70 is configured as a heat-conducting component, and it also includes an abutment plate 73. This increases the heat exchange area with the airflow, thereby further improving the heat dissipation effect on the chip 53 and enhancing its heat dissipation capacity. It should be noted that in other embodiments, when the airflow guide 70 only includes a guide tube 71, the end of the guide tube 71 near the chip 53 can be indirectly positioned to allow airflow to pass through. Alternatively, the end of the guide tube 71 near the chip 53 may abut against the motherboard 51 and surround the outside of the chip 53. In this case, an air vent 711 can still be provided on the end of the guide tube 71 near the chip 53.

[0065] In one embodiment of the present invention, the abutment plate 73 and the chip 53 are fixed by a thermal adhesive.

[0066] In this embodiment, thermal adhesive is filled between the abutment plate 73 and the chip 53, ensuring that the chip 53 does not have limited contact with the abutment plate 73 due to local protrusions or depressions. This allows for a smoother contact between the abutment plate 73 and the chip 53, resulting in a larger contact area and thus increasing the heat conduction area between them, further enhancing the heat dissipation capacity of the chip 53. Furthermore, this arrangement also establishes a connection between the abutment plate 73 and the chip 53, improving the stability of the flow guide tube 71 connection and ensuring its stable flow guiding function.

[0067] Please refer to Figure 4 In one embodiment of the present invention, the projected area of ​​the abutment plate 73 on the motherboard 51 is greater than the projected area of ​​the chip 53 on the motherboard 51.

[0068] In this embodiment, the area of ​​the contact surface is set to be larger than the area of ​​the chip 53, so that it can completely cover and contact the chip 53, thereby increasing the heat conduction area.

[0069] Please refer to the reference. Figure 3 and Figure 4 In one embodiment of the present invention, the number of air passages 711 is at least two, and the at least two air passages 711 are arranged along the circumference of the guide tube 71.

[0070] In this embodiment, at least two air vents 711 are provided circumferentially on the guide tube 71, allowing airflow to move in all directions circumferentially. This improves the airflow capacity and further enhances the heat dissipation effect on the chip 53, thereby improving the heat dissipation performance of the speaker 100. The number of air vents 711 can be two, three, four, or more.

[0071] Please refer to the reference. Figure 3 and Figure 4In one embodiment of the present invention, the flow guide 70 further includes a connecting foot 75, one end of which is connected to the abutment plate 73 and / or the flow guide tube 71, and the other end is connected to the main board 51.

[0072] One end of the connecting foot 75 is connected to the abutment plate 73 and / or the guide tube 71. That is, one end of the connecting foot 75 can be connected only to the abutment plate 73, or only to the guide tube 71, or simultaneously to both the abutment plate 73 and the guide tube 71.

[0073] In this embodiment, the flow guide 70 is further provided with connecting pins 75, so that the flow guide 70 can be further fixed to the motherboard 51 through the connecting pins 75, thereby improving the installation stability of the flow guide 70 and enabling normal and stable flow guidance. The number of connecting pins 75 can be one, two, three, or more, to surround the flow guide 70 and further improve the connection stability.

[0074] In one embodiment of the present invention, the connecting pin 75 and the main board 51 are bonded and fixed.

[0075] Adhesive bonding means that glue can be applied between the connecting pin 75 and the motherboard 51, and after it solidifies, the connecting pin 75 and the motherboard 51 can be fixed together.

[0076] In this embodiment, the connecting pin 75 and the motherboard 51 are fixed by adhesive bonding, eliminating the need for drilling holes in the connecting pin 75 and the motherboard 51, thus helping to prevent damage to the structure of the motherboard 51 itself. At the same time, adhesive bonding is relatively simple, which also improves the convenience of connecting the connecting pin 75 and the motherboard 51. Of course, it should be noted that this application is not limited to this; in other embodiments, the connecting pin 75 can be fixed by screws or by snap-fit ​​connections.

[0077] Please refer to Figure 3 In one embodiment of the present invention, the connecting pin 75 is provided corresponding to the vent 711, and the end of the connecting pin 75 away from the main board 51 is connected to the portion of the abutment plate 73 that forms the wall of the vent 711.

[0078] In this embodiment, the vent 711 is partially formed on the abutment plate 73, and one end of the connecting pin 75 is connected to the abutment plate 73. This ensures that the connecting pin 75 does not affect the airflow through the vent 711, thus guaranteeing smooth airflow at the vent 711. Simultaneously, this arrangement also brings the connecting pin 75 closer to the main board 51, thereby improving the compactness of this part of the structure.

[0079] In one embodiment of the present invention, the connecting foot 75, the abutment plate 73, and the guide tube 71 are integrally formed.

[0080] The integrated structure means that the flow guide 70 can be manufactured by injection molding, stamping, or casting, making it an inseparable whole structure.

[0081] In this embodiment, the connecting foot 75, the abutment plate 73, and the guide tube 71 in the flow guide 70 are integrated as one piece. On the one hand, this can enhance the strength of the components at the connection point, thereby improving the overall strength of the flow guide 70 and extending its service life. On the other hand, it also allows the flow guide 70 to be manufactured by integral molding, which simplifies the manufacturing process and improves the convenience of processing and forming.

[0082] Please refer to Figure 4 In one embodiment of the present invention, the motherboard assembly 50 and the speaker 30 are arranged opposite to each other.

[0083] In this embodiment, the motherboard assembly 50 and the speaker 30 are arranged opposite each other, meaning the motherboard assembly 50 can be positioned above the speaker 30. At this time, the abutment plate 73 corresponding to the chip 53 is also arranged opposite to the speaker 30. This arrangement simplifies the shape and structure of the airflow guide 70 and shortens the airflow path within the guide 70, allowing airflow to effectively reach the chip 53 for heat dissipation. Furthermore, it allows the speaker 30 and the motherboard assembly 50 to be more compactly distributed within the housing 10, thereby reducing the overall size of the speaker 100 and improving portability.

[0084] Please refer to the reference. Figure 1 , Figure 2 as well as Figure 4 In one embodiment of the present invention, the housing 10 includes a lower housing 15 and an upper housing 16. The lower housing 15 is provided with a rear sound cavity 12 and a mounting hole 13. The upper housing 16 covers the end of the lower housing 15 where the mounting hole 13 is formed, and together with the lower housing 15, forms a front sound cavity 11. The upper housing 16 and / or the lower housing 15 are provided with a sound outlet hole 14.

[0085] In this embodiment, the housing 10 is configured to include a lower housing 15 and a lower housing 15 that covers the upper housing 16, allowing the two to be manufactured separately and then assembled together to form the housing 10. The structures of the separate lower housing 15 and upper housing 16 are relatively simple, thus improving the ease of processing and shaping the housing 10. Simultaneously, this configuration also facilitates the mounting of the speaker 30 onto the lower housing 15 through the mounting hole 13, and the mounting of the mainboard assembly 50 and the air guide 70 onto the upper housing 16, thereby improving the assembly efficiency of the speaker 100. Furthermore, the upper housing 16 and lower housing 15 can be fixed by adhesive bonding. Of course, to improve the convenience of repairing and replacing the mainboard assembly 50 and speaker 30 located within the housing 10, the upper housing 16 and lower housing 15 can also be detachably connected, for example, by snap-fit ​​connection or screw connection. In addition, the upper shell 16 and / or the lower shell 15 are provided with sound outlet holes 14, which means that the sound outlet holes 14 can be provided on the upper shell 16, or on the lower shell 15, or both the upper shell 16 and the lower shell 15 are provided with them.

[0086] This invention also proposes an electronic system including a speaker 100. The specific structure of the speaker 100 is as described in the above embodiments. Since this electronic system adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here. The electronic system may also include a television set electrically connected to the speaker 100; or, the electronic system may also include smart home devices (such as audio-visual equipment, lighting systems, curtain controls, air conditioning controls, security systems, digital cinema systems, etc.), with the smart home devices electrically connected to the speaker 100.

[0087] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A speaker, characterized in that, include: The housing has a front sound cavity and a rear sound cavity inside, and the housing also has a mounting hole connecting the front sound cavity and the rear sound cavity, and a sound outlet hole connecting the front sound cavity; The speaker is disposed in the mounting hole and partially extends into the rear sound cavity; A motherboard assembly, wherein the motherboard assembly is disposed within the front sound cavity and electrically connected to the speaker, the motherboard assembly includes a motherboard and a chip, the chip being disposed on the side of the motherboard closer to the speaker; as well as A flow guide is disposed within the front sound cavity. The flow guide includes a flow guide tube, with an opening at one end corresponding to the speaker and an opening at the other end corresponding to the chip. An air vent is provided on the flow guide tube. The flow guide tube can guide the airflow within the front sound cavity to flow towards the motherboard assembly when the speaker vibrates and produces sound, and then flow through the air vent to the sound outlet. The flow guide tube can also guide external airflow to flow towards the motherboard assembly when the speaker vibrates and produces sound, and then flow into the front sound cavity through the air vent. The cross-sectional area of ​​the flow guide tube decreases from the end near the speaker to the end near the chip. The flow guide also includes an abutment plate, which covers the opening at one end of the flow guide tube near the chip and abuts against the side of the chip away from the motherboard; the connection between the flow guide tube and the abutment plate is provided with the vent hole, which connects the inner and outer sides of the flow guide tube.

2. The speaker as described in claim 1, characterized in that, The horn includes a diaphragm at the end near the guide tube, and the diaphragm includes a central portion, a folded portion, and an edge portion connected in sequence. On a projection plane perpendicular to the axis of the horn, the projection of the guide tube covers at least the folded ring portion.

3. The speaker as described in claim 2, characterized in that, The cavity wall with the mounting hole in the front acoustic cavity is defined as the perforated cavity wall, and the end of the speaker with the diaphragm is located within the space enclosed by the guide tube and the perforated cavity wall.

4. The speaker as described in claim 1, characterized in that, The flow guide is a heat-conducting component.

5. The speaker as described in claim 4, characterized in that, The abutment plate and the chip are fixed together by a thermal adhesive. And / or, the projected area of ​​the abutment plate on the motherboard is greater than the projected area of ​​the chip on the motherboard; And / or, the number of air passages is at least two, and at least two air passages are arranged along the circumference of the guide tube.

6. The speaker as described in claim 4, characterized in that, The flow guide also includes a connecting foot, one end of which is connected to the abutment plate and / or the flow guide cylinder, and the other end is connected to the main board.

7. The speaker as described in claim 6, characterized in that, The connecting pins are bonded and fixed to the motherboard; And / or, the connecting pin is provided corresponding to the vent hole, and the end of the connecting pin away from the motherboard is connected to the portion of the abutment plate that forms the vent hole wall; And / or, the connecting foot, the abutment plate, and the guide tube are integrally formed.

8. The speaker as described in any one of claims 1 to 7, characterized in that, The motherboard assembly and the speaker are arranged opposite to each other; And / or, the housing includes a lower shell and an upper shell, the lower shell having the rear sound cavity and the mounting hole; the upper shell covers the end of the lower shell having the mounting hole, and together with the lower shell, forms the front sound cavity, and the upper shell and / or the lower shell having the sound outlet hole.

9. An electronic system, characterized in that, Includes the speaker as described in any one of claims 1 to 8.

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