A digital loudspeaker system

Abstract

This invention discloses a digital loudspeaker system, comprising: N sound-generating assemblies, where N≥2; a mounting base having multiple mounting slots, each slot housing at most one sound-generating assembly; and a digital audio signal input PCB board for receiving audio source signals and converting them into digital signals capable of driving the sound-generating assemblies to produce sound. Each sound-generating assembly includes a bracket, a magnetic circuit system disposed within the bracket, a sound-generating diaphragm connected to the bracket, and a voice coil connected to the sound-generating diaphragm. The magnetic circuit system has a magnetic gap, a portion of the voice coil is inserted into the magnetic gap, and an inner cavity is formed between the sound-generating diaphragm and the magnetic circuit system. An airflow channel is formed between the inner surface of the bracket of each sound-generating assembly and the outer surface of the magnetic circuit system. The mounting base also has an airflow cavity, and each inner cavity is connected to the airflow cavity through a corresponding airflow channel. This invention's digital loudspeaker system enables purely digital input driving and enhances bass performance.

Description

[0001] This application is a divisional application of the invention patent application No. 2022115452773 filed on December 5, 2022. Technical Field

[0002] This invention relates to a digital loudspeaker system. Background Technology

[0003] Currently, traditional loudspeakers and loudspeaker systems still use analog signals for driving, and problems such as low efficiency, high power consumption, and unclear sound reproduction cannot be completely eliminated. In recent years, with the rapid development of digital technology and products, Class D digital amplifiers have been widely used. Although Class D digital amplifiers can meet the requirements of reducing power loss and heat dissipation, the output of Class D digital amplifiers still requires digital-to-analog conversion devices, meaning the loudspeaker structure still needs to be driven by analog signals. There is a need for a digital loudspeaker system that organically integrates integrated circuit technology with electroacoustic products through technological innovation, enabling electroacoustic products to evolve from traditional single-function systems to digital, modular, and integrated models. Summary of the Invention

[0004] The purpose of this invention is to provide a digital loudspeaker system.

[0005] One aspect of the present invention provides a digital loudspeaker system, comprising:

[0006] There are N sound-producing components, where N≥2;

[0007] The mounting base has a plurality of mounting slots, and at most one of the sound-generating assemblies is disposed in each mounting slot;

[0008] A digital audio signal input PCB board is used to receive audio source signals and convert them into digital signals that can drive the sound-producing assembly to produce sound. The digital audio signal input PCB board is disposed on the mounting base.

[0009] Each of the sound-generating components includes a bracket, a magnetic circuit system disposed in the bracket, a sound-generating diaphragm connected to the bracket, and a voice coil connected to the sound-generating diaphragm. The magnetic circuit system has a magnetic gap, a portion of the voice coil is inserted into the magnetic gap, and an inner cavity is formed between the sound-generating diaphragm and the magnetic circuit system.

[0010] An airflow channel is formed between the inner surface of the bracket of each of the sound-generating assemblies and the outer surface of the magnetic circuit system. The mounting base also has an airflow cavity, and each of the inner cavities is connected to the airflow cavity through the corresponding airflow channel.

[0011] Preferably, the airflow cavity is provided with sound-absorbing material. The sound-absorbing material is selected from porous materials, including but not limited to: sponge, synthetic fiber, etc. The size of the airflow cavity is adjusted by controlling the volume of the sound-absorbing material, thereby adjusting the product performance.

[0012] Preferably, each of the mounting slots has an airflow cavity below it, and the cavities are interconnected.

[0013] More preferably, each of the mounting slots has an annular bottom wall, on which the bracket is placed.

[0014] More preferably, the magnetic circuit system includes a U-shaped iron, a magnet disposed within the U-shaped iron, and a front plate; the bracket has a magnetic circuit groove open at both the upper and lower ends, the magnetic circuit groove has side walls extending vertically and vertically and an upper wall extending inward along the upper edge of the side walls, the upper surface of the U-shaped iron is connected to the upper wall, and the side surface of the U-shaped iron is connected to the side wall; the airflow channel is formed by airflow grooves formed on the side walls and the upper wall.

[0015] Furthermore, the airflow channel has an inlet and an outlet, the inlet being surrounded by the upper wall and the upper surface of the U-shaped iron, and the outlet being surrounded by the side wall and the side surface of the U-shaped iron.

[0016] Preferably, the mounting base, assembly bracket, diaphragm bracket, and sound-concentrating panel are all integrally molded from plastic.

[0017] Preferably, the sound-generating diaphragm or reinforcing support is made of lightweight, good damping elasticity and rigidity, high and low temperature resistance, and waterproof and mildew-proof materials. More preferably, it is made of materials such as cloth, silk or metal composites.

[0018] Preferably, the bracket is provided with a lead hole, through which the lead of the voice coil passes.

[0019] More preferably, the digital loudspeaker system further includes a connecting plate disposed in the bracket. The connecting plate has signal input terminals and N sets of signal output terminals. The signal input terminals are electrically connected to the output terminals of the digital audio signal input PCB board via wires. Each set of signal output terminals is electrically connected to a lead of the sound-generating assembly.

[0020] Furthermore, the mounting base has an upper surface and a connecting flange extending upward from the edge of the upper surface, the mounting groove extends downward from the upper surface, the connecting plate is placed on the upper surface and located in the connecting flange, the connecting plate is provided with N through holes, and the sound-generating assembly passes through the corresponding through holes.

[0021] Preferably, the digital loudspeaker system further includes a sound-focusing panel, the edge of which is fixedly connected to the connecting flange of the mounting base. The sound-focusing panel has N sound-focusing sections, one of which is covered above each of the sound-generating assemblies. The center of each sound-focusing section is arched upward, and one or more sound-transmitting holes are provided in the sound-focusing section.

[0022] Preferably, the bottom of the mounting base is provided with a groove, the digital audio signal input PCB board is disposed in the groove, and the digital speaker system further includes a cover plate for closing the groove, the cover plate being fixedly connected to the bottom of the mounting base.

[0023] Preferably, the support includes a diaphragm support and an assembly support. The magnetic circuit system is disposed in the assembly support. The diaphragm support is fixedly connected to the assembly support, and the diaphragm is connected to the diaphragm support. Each sound-generating component further includes a reinforcing tab, which is connected between the voice coil and the diaphragm support. The reinforcing tab controls the offset of the voice coil when it moves up and down in the U-shaped iron, improving the stability of the voice coil during its vertical movement. When using low power, the reinforcing tab can be omitted, reducing the height of the modular pure digital loudspeaker system.

[0024] More preferably, the upper part of the voice coil is provided with a vent hole, which is higher than the reinforcing support.

[0025] More preferably, the reinforcing branch includes a body layer and a fiber layer covering the body layer, wherein the body layer is made of rubber or silicone. This reinforcing branch has good strength and stiffness, improving the control over the voice coil offset amplitude. Further, the fiber layer is cut to the required size and then placed in an injection mold, where rubber or silicone is injected to form the reinforcing branch. The fiber layer is selected from cotton, silk, PC (polycarbonate), and Nomex.

[0026] Preferably, at a certain moment, M of the sound-generating components emit sound, where M is less than or equal to N; at a certain moment, one or more of the N sound-generating components emit sound, and at another moment, one or more of the N sound-generating components emit sound. The output signal of the digital audio signal input to the PCB board is a binary digital signal. For example, the digital audio signal input to the PCB board generates a binary digital sequence of "0101" to realize the switching function. The pure digital SOC encoding chip outputs the switching signal to multiple pure digital power amplifier chips. Each digital power amplifier chip transmits the amplified power signal to the voice coil of each sound-generating component, causing the voice coil to move up and down, driving the sound-generating diaphragm to emit sound. This realizes pure digital signal encoding, transmission, amplification, and digital-to-analog conversion, obtaining pure digital reproduced sound, thereby improving the clarity of the reproduced sound. When multiple sound-generating components emit sound together, a sound spatial superposition effect is generated to improve the overall sound loudness.

[0027] Preferably, the maximum outer diameter of the sound-generating assembly is less than or equal to 25 mm; the N sound-generating assemblies are arranged in a linear array, a rectangular array, or a ring array.

[0028] Preferably, the digital audio signal input PCB board includes an audio source access module, a digital signal processing module, a digital encoding module, N power amplifier groups, and a power supply module. The audio source access module specifically includes a Bluetooth module, a digital-to-analog converter module, and an A2B bus module for connecting to external audio sources. Specifically, the Bluetooth module can acquire the audio source via Bluetooth communication; the Bluetooth module connects via I... 2 The S-channel audio bus connects to the digital signal processing module, sending the acquired audio source to the digital signal processing module; it can also achieve wireless audio signal connection via Bluetooth pairing, enabling wireless signal transmission and a convenient mode for direct playback after receiving the audio signal. The digital-to-analog converter module is specifically a digital-to-analog converter chip, which can be connected to a conventional audio input host or headphones to obtain the audio source; the digital-to-analog converter module connects to the I-channel audio source via I-channel audio... 2 The S-channel audio bus connects to the digital signal processing module, sending the acquired audio source to the digital signal processing module. The A2B bus module, specifically an A2B bus chip, connects to the digital signal processing module via a TDM bus, sending the acquired audio source to the digital signal processing module. By using the A2B bus chip, the number and length of connection signal lines for each sound-generating assembly can be reduced, saving cable costs. The digital signal processing module, specifically a DSP chip, can run directional sound beaming algorithms to achieve directional sound projection through N sound-generating assemblies. The digital signal processing module and the digital encoding module are electrically connected, specifically via TDM or I... 2The S-bus is connected. The digital encoding module is specifically a pure digital SOC encoding chip, which is electrically connected to N power amplifier groups. Each power amplifier group includes one or more power amplifier chips used to drive the corresponding sound-generating components. The power supply module supplies power to all the above modules.

[0029] The present invention adopts the above solution, which has the following advantages compared with the prior art:

[0030] The digital loudspeaker system of this invention generates sound by vibrating the diaphragms when digital signals are input into N sound-generating assemblies, achieving pure digital input drive. This improves sound generation efficiency, reduces power consumption, increases clarity, and enhances the original sound reproduction quality. The entire system is compact and small in size. The internal cavities of each sound-generating assembly are connected to the airflow chamber in the mounting base via airflow channels. When the voice coil moves up and down, the airflow generated can be discharged into the airflow chamber. The internal cavities and the airflow chamber combine to form an airflow return cavity. By adjusting the internal volume of the airflow cavity, the loudspeaker performance can be optimized and the bass effect can be improved. The multiple sound-generating assemblies emit sound in the corresponding frequency band (high frequency, mid frequency, or low frequency) according to the corresponding digital signals. The sound waves of each sound-generating assembly are superimposed to form the desired sound field for reproduction. Attached Figure Description

[0031] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a partial cross-sectional view of a digital loudspeaker according to an embodiment of the present invention.

[0033] Figure 2 This is an exploded view of a digital loudspeaker according to an embodiment of the present invention.

[0034] Figure 3 This is a structural diagram of one of the sound-generating assemblies according to an embodiment of the present invention.

[0035] Figure 4 for Figure 3 An exploded view of the sound-generating assembly shown.

[0036] Figure 5 for Figure 4 The structural diagram of the assembly bracket in the middle.

[0037] Figure 6 A module diagram of a PCB board for inputting digital audio signals.

[0038] The attached figures are labeled as follows:

[0039] 1. Sound-generating assembly; 11. Assembly bracket; 110. Magnetic circuit groove; 110a. Side wall; 110b. Top wall; 110c. Airflow groove; 111. Lead wire hole; 12. Diaphragm bracket; 13. Magnetic circuit system; 130. Magnetic gap; 131. U-shaped iron; 132. Magnet; 133. Front plate; 14. Sound-generating diaphragm; 141. Dome; 142. Yoke ring; 15. Voice coil; 151. Lead wire; 16. Reinforcing support; 17. Inner cavity; 18. Airflow channel; 181. Inlet; 182. Outlet;

[0040] 2. Mounting base; 20. Mounting groove; 20a. Bottom wall; 21. Airflow cavity; 22. Connecting flange;

[0041] 3. Digital audio signal input PCB board; 30. Audio source input module; 301. Bluetooth module; 302. Digital-to-analog converter module; 303. A2B bus module; 31. Digital signal processing module; 32. Digital encoding module; 33. Power amplifier group; 34. Power supply module; 35. Wires;

[0042] 4. Connecting plate; 40. Through hole;

[0043] 5. Sound-focusing panel; 50. Sound-focusing section; 501. Sound-transmitting hole;

[0044] 6. Cover plate. Detailed Implementation

[0045] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0046] In this invention, "inner" and "outer" are defined with reference to the center line of the voice coil. The direction closer to the center line of the voice coil is considered "inner," and vice versa. The directional terms "upper," "lower," and "horizontal" are intended to help those skilled in the art understand the structure of the loudspeaker system and are not used to limit the state of the loudspeaker system after it is installed in the usage scenario.

[0047] This embodiment provides a digital speaker system capable of converting digital audio signals into sound. (Refer to...) Figure 1 and Figure 2 As shown, the digital loudspeaker system includes a sound-generating assembly 1, a mounting base 2, a digital audio signal input PCB board 3, a connecting board 4, a sound-focusing panel 5, and a cover plate 6. The number of sound-generating assemblies 1 is N, where N ≥ 2; for example, Figure 1 and Figure 2In the illustrated embodiment, the number of sound-generating assemblies 1 is three. The mounting base 2 has multiple mounting slots 20, each slot 20 housing at most one sound-generating assembly 1; preferably, the number of mounting slots 20 is the same as the number of sound-generating assemblies 1, i.e., N, with one sound-generating assembly 1 in each slot 20. A digital audio signal input PCB board 3 is used to receive audio source signals and convert them into digital signals capable of driving the sound-generating assemblies 1 to produce sound. The digital audio signal input PCB board 3 is mounted on the mounting base 2. At a certain moment, M sound-generating assemblies 1 produce sound, where M is less than or equal to N; at a certain moment, one or more of the N sound-generating assemblies 1 produce sound, and at another moment, one or more of the N sound-generating assemblies 1 produce sound. The N sound-generating assemblies 1 are arranged in a linear array, a rectangular array, or a circular array. In this embodiment, the sound-generating assemblies 1 are arranged in a three-element linear array.

[0048] Each sound-generating assembly 1 is cylindrical in shape, with a maximum outer diameter less than or equal to 25 mm. (Refer to...) Figures 3 to 5 As shown, each sound-generating assembly 1 includes a bracket, a magnetic circuit system 13 disposed within the bracket, a sound-generating diaphragm 14 connected to the bracket, and a voice coil 15 connected to the sound-generating diaphragm 14. Specifically, the bracket includes a diaphragm bracket 12 and an assembly bracket 11. The magnetic circuit system 13 is disposed within the assembly bracket 11; the diaphragm bracket 12 is fixedly connected to the assembly bracket 11, and the sound-generating diaphragm 14 is connected to the diaphragm bracket 12. Figure 1 As shown, the magnetic circuit system 13 has a magnetic gap 130, a portion of the voice coil 15 is inserted into the magnetic gap 130, and an inner cavity 17 is formed between the sound-generating diaphragm 14 and the magnetic circuit system 13. An airflow channel 18 is formed between the inner surface of the assembly bracket 11 of each sound-generating assembly 1 and the outer surface of the magnetic circuit system 13; the mounting base 2 also has an airflow cavity 21, and each inner cavity 17 is connected to the airflow cavity 21 through a corresponding airflow channel 18. Further, each mounting slot 20 has an airflow cavity 21 below it, and they are interconnected. The multiple airflow cavities 21 on the mounting base 2 can be independent of each other and not interconnected. Sound-absorbing material is provided in the airflow cavity 21. The sound-absorbing material is selected from porous materials, including but not limited to: sponge, chemical fiber, etc. The size of the airflow cavity 21 is adjusted by controlling the volume of the attracting material, thereby adjusting the product performance.

[0049] Each mounting slot 20 has an annular bottom wall 20a, on which the assembly bracket 11 rests. Further, the assembly bracket 11, the annular sidewall of the mounting slot 20, and the aforementioned bottom wall 20a are fixedly connected, for example, by tightly adhering with adhesive. The magnetic circuit system 13 includes a U-shaped iron 131, and magnets 132 and a front piece 133 disposed within the U-shaped iron 131. In this embodiment, two neodymium magnets 132 are used, one stacked on the upper side of the front piece 133 and the other stacked on the lower side of the front piece 133. The aforementioned magnetic gap 130 is formed between the U-shaped iron 131, the magnets 132, and the front piece 133. Figure 5 As shown, the assembly bracket 11 has a magnetic circuit groove 110 with open upper and lower ends. The magnetic circuit groove 110 has a side wall 110a extending vertically and an upper wall 110b extending inward from the upper edge of the side wall 110a. The inward extension distance of the upper wall 110b is less than the radius of the magnetic circuit groove 110. The voice coil 15 can pass through the upper wall 110b and be inserted into the magnetic gap 130 below. The upper surface of the U-shaped iron 131 is fixedly connected to the upper wall 110b (e.g., by adhesive), and the side surface of the U-shaped iron 131 is fixedly connected to the side wall 110a (e.g., by adhesive). The airflow channel 18 described above is formed by airflow grooves 110c formed on the side wall 110a and the upper wall 110b. The airflow channel 18 has an inlet 181 and an outlet 182. The inlet 181 is surrounded by the upper wall 110b and the upper surface of the U-shaped iron 131, and the outlet 182 is surrounded by the side wall 110a and the side surface of the U-shaped iron 131.

[0050] The sound-generating diaphragm 14 includes a central dome 141 and a yoke 142 extending outward from the outer edge of the dome 141. The outer edge of the yoke 142 is fixedly connected to the diaphragm support 12. The dome 141 is generally a hemispherical shape with an upward arch in the center, and the portion between the inner and outer edges of the yoke 142 gradually arches upward. Overall, the height of the yoke 142 is lower than the height of the dome 141. The upper end of the voice coil 15 is fixedly connected to the outer edge of the dome 141 and / or the inner edge of the yoke 142. Further, the sound-generating diaphragm 14 includes a body layer and a fiber layer covering the body layer. The body layer is made of rubber or silicone, and the fiber layer is selected from cloth, silk, PEI, and metal mesh. This sound-generating diaphragm 14 can better control the amplitude of movement, optimizing sound performance and sound quality. Specifically, the fiber layer (e.g., cotton or silk) is cut into the required fiber layer and then placed into an injection mold, where rubber or silicone is injected to form the sound-generating diaphragm 14.

[0051] Each sound-generating assembly 1 also includes a reinforcing support 16, which is connected between the voice coil 15 and the diaphragm support 12. Specifically, the reinforcing support 16 has a central hole through which the voice coil 15 passes, and the outer edge of the voice coil 15 is fixedly connected to the diaphragm support 12. A vent hole (not shown in the figure) is provided on the upper part of the voice coil 15 (specifically, the part higher than the reinforcing support 16), which is higher than the reinforcing support 16; thereby connecting the closed cavity between the diaphragm's yoke 142 and the positioning support with the cavity below the dome 141, thus forming the aforementioned inner cavity 17 of the sound-generating assembly 1. A lead wire hole 111 is provided on the assembly bracket 11, through which the lead wire 151 of the voice coil 15 passes.

[0052] Furthermore, the reinforcing support 16 includes a body layer and a fiber layer covering the body layer. The body layer is made of rubber or silicone, and the fiber layer is selected from cotton, silk, PC (polycarbonate), and Nomex. This reinforcing support 16 has good strength and stiffness, improving the control over the offset amplitude of the voice coil 15. Further, the fiber layer (e.g., cotton or silk) is cut into the desired first fiber layer, then placed in an injection mold, and rubber or silicone is injected to form the reinforcing support 16.

[0053] The connecting plate 4 is housed in the bracket. The connecting plate 4 has signal input terminals and N sets of signal output terminals. The signal input terminals are electrically connected to the output terminals of the digital audio signal input PCB board 3 via wires 35. Each set of signal output terminals is electrically connected to a lead 151 of a sound-generating assembly 1. Furthermore, the number of signal input terminals is also N sets, corresponding one-to-one with the N sets of signal output terminals. Each set of signal input terminals and its corresponding set of signal output terminals are electrically connected (e.g., through a conductive metal strip) to form a signal transmission channel. Each signal transmission channel corresponds to a sound-generating assembly 1 for transmitting audio signals to that assembly. Specifically, the mounting base 2 has an upper surface and a connecting flange 22 extending upwards from the edge of the upper surface. The mounting groove 20 extends downwards from the upper surface. The connecting plate 4 is placed on the upper surface and located within the connecting flange 22. The connecting plate 4 has N through holes 40, through which the sound-generating assembly 1 passes.

[0054] The edge of the sound-concentrating panel 5 is fixedly connected to the connecting flange 22 of the mounting base 2 and covers the top of the N sound-generating assemblies 1. The sound-concentrating panel 5 has N sound-concentrating sections 50, with one sound-concentrating section 50 covering the top of each sound-generating assembly 1. The center of the sound-concentrating section 50 arches upward, and the sound-concentrating section 50 has one or more sound-transmitting holes 501. Specifically, the sound-concentrating section 50 has multiple connecting ribs, and the aforementioned sound-transmitting holes 501 are formed between the connecting ribs, with the inner ends of the multiple connecting ribs connected. The connecting ribs are arc-shaped and extend from above the outer edge of the yoke ring 142 to above the dome 141.

[0055] The bottom of the mounting base 2 is provided with a groove (not shown in the figure), and the digital audio signal input PCB board 3 is placed in the groove. The cover plate 6 is used to close the groove and is fixedly connected to the bottom of the mounting base 2.

[0056] Reference Figure 6 As shown, the digital audio signal input PCB board 3 includes an audio source access module 30, a digital signal processing module 31, a digital encoding module 32, N power amplifier groups 33, and a power supply module 34. The audio source access module 30 specifically includes a Bluetooth module 301, a digital-to-analog converter module, and an A2B bus module, used for connecting to external audio sources. Specifically, the Bluetooth module 301 can acquire audio sources via Bluetooth communication; the Bluetooth module 301 connects to an external audio source via I... 2 The S-channel audio bus connects to the digital signal processing module 31, sending the acquired audio source to the digital signal processing module 31. The digital-to-analog converter module 302 is specifically a digital-to-analog converter chip, which can be connected to a conventional audio input host or headphones to obtain the audio source; the digital-to-analog converter module 302 connects to the I-channel audio bus via I-channel audio. 2 The S-channel audio bus connects to the digital signal processing module 31, sending the acquired sound source to the digital signal processing module 31. The A2B bus module 303 is specifically an A2B bus chip, connected to the digital signal processing module 31 via a TDM bus, sending the acquired sound source to the digital signal processing module 31. The digital signal processing module 31 is specifically a DSP chip, capable of running a directional sound beam algorithm to achieve directional sound projection through N sound-emitting components 1. The digital signal processing module and the digital encoding module 32 are electrically connected, specifically via TDM or I... 2 The S-bus is connected. The digital encoding module 32 is specifically a pure digital SOC encoding chip, which is electrically connected to N power amplifier groups 33. Each power amplifier group 33 includes one or more power amplifier chips for driving the corresponding sound-generating assembly 1. The power supply module 34 supplies power to the above modules. The directional beamforming algorithm and the algorithm for converting the external sound source into a digital signal to drive the N sound-generating assemblies 1 are not inventive points of this invention; known algorithms can be used, such as the method disclosed in the applicant's patent CN102404672B.

[0057] The inner wall of the assembly bracket 11 is provided with an airflow groove for venting. The airflow generated when the voice coil 15 moves up and down can be discharged from the bottom. After the sound-generating assembly 1 is installed in the mounting groove 20 of the mounting base 2, the inner cavity 17 of the sound-generating assembly 1 and the airflow cavity 21 of the mounting base 2 combine to form an airflow return cavity. By adjusting the internal volume of the airflow cavity 21 (specifically by adjusting the volume of the sound-absorbing material placed inside), the performance of the special structure speaker can be optimized and the bass effect can be improved. After connecting the positive and negative terminals of the lead wire 151 of the voice coil 15 of each special structure sound-generating assembly 1 to the connecting terminal, the power amplifier group 33 and the lead wire 151 of the voice coil 15 can be connected accordingly. When a digital audio signal is input to the pure digital SOC encoding chip in PCB board 3, the output of the pure digital switch signal "0101" is amplified by multiple pure digital power amplifier chips. Then, the pure digital power amplifier chips input the signal to the voice coil 15 of the sound-generating assembly 1 in the connection board 4, which drives the voice coil 15 to move up and down to make the sound-generating diaphragm 14 produce sound. The multiple sound-generating assemblies 1 emit sound of the corresponding frequency band (high frequency, mid frequency, or low frequency) according to the corresponding digital signal. The sound waves of each sound-generating assembly 1 are superimposed to form the desired sound field, realizing a pure digital signal input modular digital loudspeaker.

[0058] The sound-generating diaphragm 14 is a dome 141 with a folded ring shape, and is also provided with a reinforcing support 16 to increase the amount of movement of the sound-generating diaphragm 14, i.e., the vibration amplitude. The sound-generating diaphragm 14 is tightly connected to the diaphragm support 12 through the reinforcing support 16, and the horizontal offset of the voice coil 15 during its up-and-down movement can be controlled when the voice coil 15 moves up and down in the U-shaped iron 131.

[0059] Furthermore, by running a directional acoustic beamforming algorithm through a DSP chip, purely digital directional sound projection can be achieved. The configuration of airflow channel 18 and airflow cavity 21 facilitates the adjustment of low-frequency frequencies and optimizes low-frequency sound quality. This product's unique structural design and purely digital approach improve sound generation efficiency, reduce power consumption, increase clarity, and enhance the quality of original sound reproduction.

[0060] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0061] It can be further understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar.

[0062] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0063] The above embodiments are only for illustrating the technical concept and features of the present invention, and are preferred embodiments. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention.

Claims

1. A digital loudspeaker system, characterized in that, include: There are N sound-producing components, where N≥2; The mounting base has a plurality of mounting slots, and at most one of the sound-generating assemblies is disposed in each mounting slot; A digital audio signal input PCB board is used to receive audio source signals and convert them into digital signals that can drive the sound-producing assembly to produce sound. The digital audio signal input PCB board is disposed on the mounting base. Each of the sound-generating components includes a bracket, a magnetic circuit system disposed in the bracket, a sound-generating diaphragm connected to the bracket, and a voice coil connected to the sound-generating diaphragm. The magnetic circuit system has a magnetic gap, a portion of the voice coil is inserted into the magnetic gap, and an inner cavity is formed between the sound-generating diaphragm and the magnetic circuit system. The bracket includes an assembly bracket, and the magnetic circuit system is disposed within the assembly bracket. An airflow channel is formed between the inner surface of the assembly bracket and the outer surface of the magnetic circuit system for each sound-generating assembly. The mounting base also has an airflow cavity. Each inner cavity is connected to the airflow cavity through a corresponding airflow channel, and the inner cavity is located below the sound-generating diaphragm. Each mounting base has a bottom wall, and the assembly bracket is placed on the bottom wall, which is annular. The airflow cavity is located below the assembly bracket, and the outlet of the airflow channel is located at the bottom of the assembly bracket and is not covered by the bottom wall to connect to the airflow cavity.

2. The digital loudspeaker system according to claim 1, characterized in that, Below each of the mounting slots is an airflow cavity that is interconnected, and the airflow cavity is provided with sound-absorbing material.

3. The digital loudspeaker system according to claim 1, characterized in that, The magnetic circuit system includes a U-shaped iron, a magnet disposed within the U-shaped iron, and a front plate; the assembly bracket has a magnetic circuit groove open at both the upper and lower ends, the magnetic circuit groove has side walls extending vertically and vertically and an upper wall extending inward along the upper edge of the side walls, the upper surface of the U-shaped iron is connected to the upper wall, and the side surface of the U-shaped iron is connected to the side wall; the airflow channel is formed by airflow grooves formed on the side walls and the upper wall.

4. The digital loudspeaker system according to claim 3, characterized in that, The inlet of the airflow channel is formed by the upper wall and the upper surface of the U-shaped iron, and the outlet is formed by the side wall and the side surface of the U-shaped iron.

5. The digital loudspeaker system according to any one of claims 1 to 4, characterized in that, The bracket is provided with lead wire holes, through which the lead wires of the voice coil pass; the digital loudspeaker system also includes a connecting plate, which is disposed in the bracket, and the connecting plate has signal input terminals and N sets of signal output terminals. The signal input terminals are electrically connected to the output terminals of the digital audio signal input PCB board through wires, and each set of signal output terminals is electrically connected to a lead wire of the sound-generating assembly.

6. The digital loudspeaker system according to claim 5, characterized in that, The mounting base has an upper surface and a connecting flange extending upward from the edge of the upper surface. The mounting groove extends downward from the upper surface. The connecting plate is placed on the upper surface and located in the connecting flange. The connecting plate has N through holes through which the sound-generating assembly passes.

7. The digital loudspeaker system according to claim 6, characterized in that, The digital loudspeaker system also includes a sound-focusing panel, the edge of which is fixedly connected to the connecting flange of the mounting base. The sound-focusing panel has N sound-focusing sections, one of which is covered above each of the sound-generating assemblies. The center of each sound-focusing section is arched upwards, and one or more sound-transmitting holes are provided in each sound-focusing section.

8. The digital loudspeaker system according to any one of claims 1 to 4, characterized in that, The support also includes a diaphragm support, which is fixedly connected to the assembly support. The diaphragm is connected to the diaphragm support. Each sound-generating assembly also includes a reinforcing support, which is connected between the voice coil and the diaphragm support. A vent hole is provided on the upper part of the voice coil, and the vent hole is higher than the reinforcing support. The reinforcing support includes a body layer and a fiber layer covering the body layer. The material of the body layer is rubber or silicone.

9. The digital loudspeaker system according to any one of claims 1 to 4, characterized in that, At a certain moment, M of the sound-generating assemblies emit sound, where M is less than or equal to N; at a certain moment, one or more of the N sound-generating assemblies emit sound, and at another moment, another or more of the N sound-generating assemblies emit sound; the maximum outer diameter of the sound-generating assemblies is less than or equal to 25mm; the N sound-generating assemblies are arranged in a linear array, a rectangular array, or a circular array; the bottom of the mounting base is provided with a groove, the digital audio signal input PCB board is disposed in the groove, and the digital speaker system also includes a cover plate for closing the groove, the cover plate being fixedly connected to the bottom of the mounting base.

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