一种像素发声单元及其制造方法、数字发声芯片
By optimizing the structural design of the MEMS speaker, including the spacing between the electrode plate and the diaphragm plate and the width of the cantilever slit, the problem of back cavity pressure leakage was solved, resulting in better sound production and sound quality, which is suitable for digital sound chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- EARTHMOUNTAIN (SUZHOU) MICROELECTRONICS LTD
- Filing Date
- 2023-03-10
- Publication Date
- 2026-07-17
AI Technical Summary
In existing MEMS loudspeakers, the air cavity between the electrode plate and the substrate is prone to pressure leakage, which affects the sound output.
The pixel-based sound unit structure includes a substrate, an electrode plate, a dielectric layer, and a vibrating plate stacked in sequence. There is a gap between the electrode plate and the vibrating plate, and through holes are provided on the electrode plate. The vibrating plate consists of a fixing part, a cantilever, and a diaphragm. The spacing between the electrode plate and the diaphragm and the thickness ratio of the cantilever are optimized. Combined with the concave structure and the cantilever slot design, back cavity pressure leakage is avoided.
It improves the speaker's sound output, avoids back cavity pressure leakage, enhances sound quality and sound pressure level, and is suitable for micro devices.
Smart Images
Figure CN116320941B_ABST