A PCB board positioning hole adhesive removal device and method thereof

Abstract

This invention discloses a PCB board positioning hole adhesive removal device and method, belonging to the field of PCB board manufacturing technology. It includes a base plate, on which a translation component is mounted to move the PCB board below an adhesive removal component; a lifting component is mounted on the base plate to block and lift the PCB board after it has moved below the adhesive removal component; a first support frame is provided on the outer side of the base plate; the adhesive removal component includes a lifting component, a rotating adhesive removal component, and a mounting component; a positioning and suction component is also mounted on the first support frame. Through the above method, this invention uses the positioning and suction component to accurately horizontally position the PCB board, ensuring that the lifting component can move the rotating adhesive removal component to contact the positioning hole of the PCB board. The structure is simpler and the cost is lower. After the adhesive removal operation, the positioning and suction component evacuates air from the positioning hole of the PCB board to suck out the removed adhesive, allowing for timely removal of the removed adhesive.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, specifically to a PCB positioning hole adhesive removal device and method. Background Technology

[0002] During PCB manufacturing, it is necessary to remove adhesive from the positioning holes. Existing processes have the following problems: First, they require complex systems such as vision systems for PCB positioning, which is costly; second, it is difficult to promptly remove the removed adhesive after the process.

[0003] Based on this, the present invention designs a PCB board positioning hole adhesive removal device and adhesive removal method to solve the above problems. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a PCB board positioning hole adhesive removal device and adhesive removal method.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A PCB board positioning hole adhesive removal device includes a base plate, on which a translation component is installed to move the PCB board to a position below the adhesive removal component.

[0007] The base plate is equipped with a lifting component for blocking and lifting the PCB board that has moved below the adhesive removal component.

[0008] The outer side of the base plate is provided with a first support frame for installing the positioning vacuum assembly and the adhesive removal assembly.

[0009] The adhesive removal assembly includes a lifting assembly, a rotating adhesive removal assembly, and a mounting component; the mounting component is fixedly installed on the top of the first support frame, the lifting assembly is installed on the mounting component, the rotating adhesive removal assembly is installed on the movable end of the lifting assembly, and the rotating adhesive removal assembly contacts the positioning hole of the PCB board.

[0010] The first support frame is also equipped with a positioning and air extraction component for horizontally limiting the PCB board and extracting air from the positioning holes of the PCB board.

[0011] Furthermore, the mounting component includes a third support frame, the bottom of the left and right ends of the third support frame being fixedly mounted on the top of the left and right ends of the first support frame, respectively.

[0012] Furthermore, the lifting assembly includes a second cylinder, a horizontal support plate, and a mounting frame; the second cylinder is fixedly mounted on a third support frame, the output end of the second cylinder is fixedly connected to the horizontal support plate, and the lower end of the horizontal support plate is fixedly connected to the mounting frame; a rotating adhesive removal assembly is mounted on the mounting frame.

[0013] Furthermore, the rotating adhesive removal assembly includes a mounting frame, a second drive motor, a drive wheel, a connecting wheel, a straight connecting shaft, an adhesive removal wheel, a first guide wheel, and a second guide wheel. A mounting frame is fixedly connected to the mounting frame, and a second drive motor is fixedly mounted on the mounting frame. The output end of the second drive motor is fixedly connected to the drive wheel. Connecting wheels are rotatably mounted at the four corners of the mounting frame via the straight connecting shaft. A first guide wheel and a second guide wheel are also rotatably mounted on the mounting frame, located on opposite sides of the drive wheel. The drive wheel, connecting wheel, first guide wheel, and second guide wheel are connected by a belt drive. Adhesive removal wheels are fixedly mounted at the bottom of the straight connecting shaft, and these wheels are located below the mounting frame.

[0014] Furthermore, the positioning and suction assembly includes a symmetrical linear module slide, a negative pressure cover, a guide rail, a suction pipe, a slider, and a sealing plate. The symmetrical linear module slide is fixedly installed on the top right end of the first support frame. Negative pressure covers are fixedly connected to the two movable ends of the symmetrical linear module slide. Sliders are fixedly connected to the left and right ends of the two sets of negative pressure covers. The sliders are slidably connected to the guide rails. The guide rails are fixedly connected to the inner sidewalls of the left and right ends of the first support frame. A suction pipe is fixedly connected to one end of the negative pressure cover, and the other end of the suction pipe is connected to an external suction device. Four straight holes are opened on the upper part of the left and right ends of the negative pressure cover to facilitate the insertion of each set of glue-removing wheels into the positioning holes of the PCB board. A sealing plate is fixedly connected to the adjacent ends of the two sets of negative pressure covers.

[0015] Furthermore, there is a gap between the sealing plate and the top wall of the negative pressure cover for inserting a PCB board, and the height of the gap is the same as the thickness of the PCB board.

[0016] Furthermore, the translation component includes a second support frame, a synchronous belt, a first drive motor, a horizontal shaft, synchronous pulleys, and a pressure plate; the second support frame is fixedly mounted on the base plate, and horizontal shafts are rotatably mounted on both ends of the second support frame. Synchronous pulleys are fixedly mounted on the front and rear ends of the horizontal shafts, and the two sets of synchronous pulleys on the rear side are connected by a synchronous belt, and the two sets of synchronous pulleys on the front side are connected by a synchronous belt. The first drive motor is fixedly mounted on the side wall of the second support frame, and the output end of the first drive motor is fixedly connected to one of the sets of horizontal shafts. Pressure plates are fixedly connected to the front and rear ends of the top of the second support frame.

[0017] Furthermore, the lifting assembly includes a cylinder, a support plate, a baffle, and a limiting plate. The bottom of the cylinder is fixedly connected to the base plate, and the output end of the cylinder is fixedly connected to the support plate. The support plate is located between two sets of synchronous belts. Straight grooves that cooperate with the up-and-down movement of the support plate are respectively opened on the two sets of pressure plates. Baffles and limiting plates are fixedly connected to the left and right ends of the support plate, respectively. An inclined guide groove is opened on the top of the limiting plate, and the inclined surface of the inclined guide groove is set towards the side close to the baffle. The top height of the baffle is greater than the top height of the limiting plate. The PCB board is located between the baffle and the limiting plate, and the PCB board is in close contact with the baffle and the limiting plate.

[0018] The present invention also provides a method for removing adhesive from the PCB board positioning hole adhesive removal device, comprising the following steps:

[0019] Step 1: Place the PCB board to be de-adhesiveed on two sets of synchronous belts. The first drive motor drives the horizontal shaft to rotate, which in turn drives the synchronous wheel to rotate. The synchronous wheel then drives the synchronous belt to rotate, and the synchronous belt moves the PCB board to be printed horizontally to the bottom of the de-adhesive removal assembly. The top of the PCB board is in contact with the bottom of the pressure plate, and the front and rear walls of the PCB board are in contact with the front and rear inner walls of the second support frame, respectively. The pressure plate limits the vertical movement of the PCB board, and the second support frame limits its front and rear movement, ensuring that the PCB board moves in a certain shape to the bottom of the de-adhesive removal assembly.

[0020] Step 2: When the PCB board moves to the bottom of the adhesive removal component, the baffle blocks the PCB board, and the PCB board no longer moves with the timing belt. Then, the cylinder is activated, and the cylinder drives the support plate to move upward. After the support plate contacts the PCB board, it drives the PCB board above it to move upward until it is flush with the gap on the negative pressure cover.

[0021] Step 3: Then, start the symmetrical linear module slide to move the two sets of negative pressure covers towards each other. Under the limiting action of the slider and guide rail, the two ends of the two sets of negative pressure covers move horizontally inward until the two ends of the PCB board pass through the gaps on the negative pressure covers and move until the positioning holes on the PCB board correspond vertically to the straight holes on the negative pressure covers. Then, start the second cylinder to drive the horizontal support plate to move downward. The horizontal support plate drives the mounting frame to move downward. The mounting frame drives the rotating adhesive removal component to move downward, so that each set of adhesive removal wheels passes through the straight holes and inserts into the positioning holes of the PCB board. Then, start the second drive motor to drive the drive wheel to rotate. The drive wheel drives the connecting wheel, the first guide wheel and the second guide wheel to rotate through the belt drive. The connecting wheel drives the straight connecting shaft to rotate. The straight connecting shaft drives the adhesive removal wheel to rotate. The adhesive removal wheel contacts the positioning holes of the PCB board and rotates to remove adhesive from the positioning holes of the PCB board.

[0022] Step 4: Then, by activating the external air extraction device, air is extracted from the negative pressure chamber through the air extraction pipe to suck out the adhesive removed from the negative pressure chamber.

[0023] Beneficial effects

[0024] This invention uses a translation component to move the PCB board below the adhesive removal component. A lifting component then blocks the PCB board as it moves below the adhesive removal component and lifts it. A positioning and vacuuming component is activated to horizontally limit the PCB board. Then, a lifting component is activated to move the rotating adhesive removal component to contact the positioning hole of the PCB board. The rotating adhesive removal component is activated to remove adhesive from the positioning hole of the PCB board, while the positioning and vacuuming component is activated to vacuum the positioning hole of the PCB board, sucking out the removed adhesive.

[0025] This invention uses a positioning and suction component to precisely position the PCB board horizontally, ensuring that the lifting component can move the rotating adhesive removal component to contact the positioning hole of the PCB board. The structure is simpler and the cost is lower. After the adhesive removal operation, the positioning and suction component uses the positioning and suction component to extract air from the positioning hole of the PCB board to suck out the removed adhesive, which can remove the adhesive in a timely manner. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0027] Figure 1 The main structure of the PCB board positioning hole adhesive removal device of the present invention is three-dimensional. Figure 1 ;

[0028] Figure 2 This is a front view of the PCB board positioning hole adhesive removal device according to the present invention;

[0029] Figure 3 This is a left view of the structure of a PCB board positioning hole adhesive removal device according to the present invention;

[0030] Figure 4 The main structure of the PCB board positioning hole adhesive removal device of the present invention is three-dimensional. Figure 2 ;

[0031] Figure 5 The main structure of the PCB board positioning hole adhesive removal device of the present invention is three-dimensional. Figure 3 ;

[0032] Figure 6 For along Figure 2 A sectional view along the AA direction;

[0033] Figure 7 For along Figure 3 BB direction sectional view.

[0034] The labels in the diagram represent:

[0035] 1. Base plate 2. First support frame 3. Lifting assembly 31. Cylinder 32. Support plate 33. Straight groove 34. Baffle 35. Limiting plate 4. Positioning and suction assembly 41. Symmetrical linear module slide 42. Negative pressure cover 43. Guide rail 44. Suction pipe 45. Slider 46. Sealing plate 5. Translation assembly 51. Second support frame 52. Synchronous belt 53. First drive motor 54. Horizontal shaft 55. Synchronous wheel 56. Pressure plate 6. Adhesive removal assembly 61. Third support frame 62. Second cylinder 63. Mounting bracket 64. Second drive motor 65. Drive wheel 66. Connecting wheel 67. Straight connecting shaft 68. Adhesive removal wheel 69. Straight hole 610. Horizontal support plate 611. First guide wheel 612. Mounting frame 613. Second guide wheel. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0037] The present invention will be further described below with reference to embodiments.

[0038] Example 1

[0039] Please refer to the instruction manual appendix. Figure 1-7 A PCB board positioning hole adhesive removal device includes a base plate 1, on which a translation component 5 is installed to move the PCB board to below the adhesive removal component 6.

[0040] A lifting assembly 3 is installed on the base plate 1 to block the PCB board that moves below the adhesive removal assembly 6 and then lift it up;

[0041] The outer side of the base plate 1 is provided with a first support frame 2 for installing the positioning vacuum assembly 4 and the adhesive removal assembly 6;

[0042] The adhesive removal assembly 6 includes a lifting assembly, a rotating adhesive removal assembly, and a mounting component; the mounting component is fixedly installed on the top of the first support frame 2, the lifting assembly is installed on the mounting component, and the rotating adhesive removal assembly is installed on the movable end of the lifting assembly. During adhesive removal, the rotating adhesive removal assembly can contact the positioning hole of the PCB board.

[0043] The first support frame 2 is also equipped with a positioning and air extraction component 4 for horizontally limiting the PCB board and extracting air from the positioning holes of the PCB board.

[0044] In this invention, the translation component 5 moves the PCB board to below the adhesive removal component 6. The lifting component 3 blocks the PCB board that has moved to below the adhesive removal component 6 and then lifts it. The positioning and air extraction component 4 is activated to limit the horizontal movement of the PCB board. Then, the lifting component is activated to move the rotating adhesive removal component to contact the positioning hole of the PCB board. The rotating adhesive removal component is activated to remove the adhesive from the positioning hole of the PCB board. At the same time, the positioning and air extraction component 4 is activated to extract air from the positioning hole of the PCB board and suck out the removed adhesive.

[0045] This invention uses the positioning and suction component 4 to precisely position the PCB board horizontally, ensuring that the lifting component can move the rotating adhesive removal component to contact the positioning hole of the PCB board. The structure is simpler and the cost is lower. After the adhesive removal operation, the positioning and suction component 4 is used to suction air from the positioning hole of the PCB board to remove the removed adhesive, which can remove the adhesive in a timely manner.

[0046] Example 2

[0047] Based on Example 1, please refer to the appendix of the instruction manual. Figure 1-7 The mounting components include a third support frame 61, with the bottom of the left and right ends of the third support frame 61 being fixedly installed on the top of the left and right ends of the first support frame 2, respectively.

[0048] The lifting assembly includes a second cylinder 62, a horizontal support plate 610, and a mounting frame 612; the second cylinder 62 is fixedly mounted on the third support frame 61, the output end of the second cylinder 62 is fixedly connected to the horizontal support plate 610, and the lower end of the horizontal support plate 610 is fixedly connected to the mounting frame 612; a rotating adhesive removal assembly is mounted on the mounting frame 612.

[0049] The second cylinder 62 drives the horizontal support plate 610 to move up and down, the horizontal support plate 610 drives the mounting frame 612 to move up and down, and the mounting frame 612 drives the rotating adhesive removal component to move up and down.

[0050] The rotating adhesive removal assembly includes a mounting frame 63, a second drive motor 64, a drive wheel 65, a connecting wheel 66, a straight connecting shaft 67, an adhesive removal wheel 68, a first guide wheel 611, and a second guide wheel 613. The mounting frame 63 is fixedly connected to the mounting frame 612, and the second drive motor 64 is fixedly mounted on the mounting frame 63. The output end of the second drive motor 64 is fixedly connected to the drive wheel 65. The connecting wheel 66 is rotatably mounted at the four corners of the mounting frame 612 via the straight connecting shaft 67. The first guide wheel 611 and the second guide wheel 613 are also rotatably mounted on the mounting frame 612. The first guide wheel 611 and the second guide wheel 613 are located on both sides of the drive wheel 65. The drive wheel 65, the connecting wheel 66, the first guide wheel 611, and the second guide wheel 613 are connected by a belt drive. The adhesive removal wheel 68 is fixedly mounted at the bottom of the four sets of straight connecting shafts 67. The adhesive removal wheel 68 is located below the mounting frame 612.

[0051] The second drive motor 64 drives the drive wheel 65 to rotate. The drive wheel 65 drives the connecting wheel 66, the first guide wheel 611 and the second guide wheel 613 to rotate via belt transmission. The connecting wheel 66 drives the straight connecting shaft 67 to rotate. The straight connecting shaft 67 drives the glue removal wheel 68 to rotate. The glue removal wheel 68 contacts the positioning hole of the PCB board and rotates the positioning hole of the PCB board to remove glue.

[0052] The positioning and suction assembly 4 includes a symmetrical linear module slide 41, a negative pressure cover 42, a guide rail 43, a suction pipe 44, a slider 45, and a sealing plate 46. The symmetrical linear module slide 41 is fixedly installed on the top right end of the first support frame 2. The two movable ends of the symmetrical linear module slide 41 are respectively fixedly connected to the negative pressure cover 42. The left and right ends of the two sets of negative pressure covers 42 are fixedly connected to the slider 45. The slider 45 is slidably connected to the guide rail 43. The guide rail 43 is respectively fixedly connected to the inner sidewalls of the left and right ends of the first support frame 2. One end of the negative pressure cover 42 is fixedly connected to the suction pipe 44. The other end of the suction pipe 44 is connected to an external suction device. The upper part of the left and right ends of the negative pressure cover 42 is provided with four sets of straight holes 69 to facilitate the insertion of each set of glue removal wheels 68 into the positioning holes of the PCB board. The lower wall of the two sets of negative pressure covers 42 that are close to each other is fixedly connected to the sealing plate 46.

[0053] There is a gap between the top wall of the sealing plate 46 and the negative pressure cover 42 for inserting the PCB board, and the height of the gap is the same as the thickness of the PCB board.

[0054] The height of the vent pipe 44 is lower than the height of the sealing plate 46;

[0055] The lifting assembly 3 moves the PCB board upward until it is flush with the gap on the negative pressure cover 42. Then, the symmetrical linear module slide 41 is activated to move the two sets of negative pressure covers 42 towards each other. The two ends of the two sets of negative pressure covers 42 move horizontally inward under the limiting action of the slider 45 and the guide rail 43 until the two ends of the PCB board pass through the gap on the negative pressure cover 42. The PCB board moves until the positioning hole on the PCB board corresponds vertically to the straight hole 69 on the negative pressure cover 42. At this time, the side wall of the PCB board and the inner side wall of the negative pressure cover 42 are in close contact, thus achieving precise positioning of the PCB board. Then, the second cylinder 62 is activated, which moves the horizontal support plate 610 downward. 10 drives the mounting frame 612 to move downwards, and the mounting frame 612 drives the rotating adhesive removal assembly to move downwards, so that each set of adhesive removal wheels 68 passes through the straight hole 69 and inserts into the positioning hole of the PCB board; then the second drive motor 64 is started, which drives the drive wheel 65 to rotate, and the drive wheel 65 drives the connecting wheel 66, the first guide wheel 611 and the second guide wheel 613 to rotate through belt transmission, the connecting wheel 66 drives the straight connecting shaft 67 to rotate, and the straight connecting shaft 67 drives the adhesive removal wheel 68 to rotate, and the adhesive removal wheel 68 contacts the positioning hole of the PCB board and rotates to remove adhesive from the positioning hole of the PCB board; the present invention can realize the synchronous adhesive removal of multiple positioning holes of the PCB board, with high working efficiency;

[0056] The translation component 5 includes a second support frame 51, a synchronous belt 52, a first drive motor 53, a horizontal shaft 54, synchronous pulleys 55, and a pressure plate 56. The second support frame 51 is fixedly installed on the base plate 1. Horizontal shafts 54 are rotatably installed at both ends of the second support frame 51. Synchronous pulleys 55 are fixedly installed at the front and rear ends of the horizontal shafts 54. The two sets of synchronous pulleys 55 on the rear side are connected by a synchronous belt 52, and the two sets of synchronous pulleys 55 on the front side are connected by a synchronous belt 52. The first drive motor 53 is fixedly installed on the side wall of the second support frame 51. The output end of the first drive motor 53 is fixedly connected to one of the sets of horizontal shafts 54. The pressure plate 56 is fixedly connected to the front and rear ends of the top of the second support frame 51.

[0057] The PCB board to be de-adhesive is placed on two sets of synchronous belts 52. The first drive motor 53 drives the horizontal shaft 54 ​​to rotate, the horizontal shaft 54 ​​drives the synchronous wheel 55 to rotate, the synchronous wheel 55 drives the synchronous belt 52 to rotate, and the synchronous belt 52 moves the PCB board to be printed horizontally to the bottom of the de-adhesive removal component 6. The top of the PCB board is in contact with the bottom of the pressure plate 56, and the front and rear walls of the PCB board are in contact with the front and rear inner walls of the second support frame 51, respectively. The pressure plate 56 limits the vertical movement of the PCB board, and the second support frame 51 limits the front and rear movement of the PCB board, ensuring that the PCB board moves to the bottom of the de-adhesive removal component 6 in a certain shape.

[0058] The lifting assembly 3 includes a cylinder 31, a support plate 32, a baffle 34, and a limiting plate 35. The bottom of the cylinder 31 is fixedly connected to the base plate 1, and the output end of the cylinder 31 is fixedly connected to the support plate 32. The support plate 32 is located between two sets of synchronous belts 52. The two sets of pressure plates 56 are respectively provided with straight grooves 33 that cooperate with the up and down movement of the support plate 32. The left and right ends of the support plate 32 are respectively fixedly connected to the baffle 34 and the limiting plate 35. The top of the limiting plate 35 is provided with an inclined guide groove, and the inclined surface of the inclined guide groove is set towards the side close to the baffle 34. The top height of the baffle 34 is greater than the top height of the limiting plate 35. The PCB board is located between the baffle 34 and the limiting plate 35, and the PCB board is in close contact with the baffle 34 and the limiting plate 35.

[0059] Initially, the height of the limiting plate 35 is lower than the height of the PCB board, and the height of the baffle 34 is higher than the height of the PCB board. When the PCB board moves below the adhesive removal component 6, the baffle 34 blocks the PCB board, and the PCB board no longer moves with the synchronous belt 52. Then, the cylinder 31 is activated, and the cylinder 31 drives the support plate 32 to move upward. After the support plate 32 contacts the PCB board, it drives the PCB board above it to move upward until it is flush with the gap on the negative pressure cover 42. By setting the baffle 34 and the limiting plate 35, it can be ensured that the PCB board is always between the baffle 34 and the limiting plate 35, which ensures the limiting effect on the PCB board and ensures the stability of printing.

[0060] Example 3

[0061] Based on Example 2, please refer to the appendix of the instruction manual. Figure 1-7 A method for removing adhesive from PCB board positioning holes includes the following steps:

[0062] Step 1: Place the PCB board to be de-adhesive-removed on two sets of synchronous belts 52. The first drive motor 53 drives the horizontal shaft 54 ​​to rotate, which in turn drives the synchronous wheel 55 to rotate. The synchronous wheel 55 then drives the synchronous belt 52 to rotate, and the synchronous belt 52 moves the PCB board to be printed horizontally to the bottom of the de-adhesive removal component 6. The top of the PCB board is in contact with the bottom of the pressure plate 56, and the front and rear walls of the PCB board are in contact with the front and rear inner walls of the second support frame 51, respectively. The pressure plate 56 limits the vertical movement of the PCB board, and the second support frame 51 limits the front and rear movement of the PCB board, ensuring that the PCB board moves to the bottom of the de-adhesive removal component 6 in a certain shape.

[0063] Step 2: When the PCB board moves to the bottom of the adhesive removal component 6, the PCB board is blocked by the baffle 34 and no longer moves with the synchronous belt 52. Then the cylinder 31 is activated, and the cylinder 31 drives the support plate 32 to move upward. After the support plate 32 contacts the PCB board, it drives the PCB board above it to move upward until it is flush with the gap on the negative pressure cover 42.

[0064] Step 3: Then, activate the symmetrical linear module slide 41 to move the two sets of negative pressure covers 42 towards each other. The two ends of the two sets of negative pressure covers 42 move horizontally inward under the limiting action of the slider 45 and guide rail 43, until the two ends of the PCB board pass through the gaps on the negative pressure covers 42, and move until the positioning holes on the PCB board correspond vertically to the straight holes 69 on the negative pressure covers 42. Then, activate the second cylinder 62, which drives the horizontal support plate 610 downward. The horizontal support plate 610 drives the mounting frame 612 downward. 12 drives the rotating adhesive removal assembly to move downwards, so that each set of adhesive removal wheels 68 passes through the straight hole 69 and is inserted into the positioning hole of the PCB board; then the second drive motor 64 is started, which drives the drive wheel 65 to rotate. The drive wheel 65 drives the connecting wheel 66, the first guide wheel 611 and the second guide wheel 613 to rotate through the belt drive. The connecting wheel 66 drives the straight connecting shaft 67 to rotate. The straight connecting shaft 67 drives the adhesive removal wheel 68 to rotate. The adhesive removal wheel 68 contacts the positioning hole of the PCB board and rotates to remove adhesive from the positioning hole of the PCB board.

[0065] Step 4: Then, by activating the external air extraction device, air is extracted from the negative pressure hood 42 through the air extraction pipe 44 to suck out the adhesive removed from the negative pressure hood 42.

[0066] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A PCB board positioning hole adhesive removal device, comprising a base plate (1), characterized in that: The base plate (1) is equipped with a translation component (5) for moving the PCB board to the underside of the adhesive removal component (6). The base plate (1) is equipped with a lifting component (3) for blocking the PCB board that moves to the bottom of the adhesive removal component (6) and then lifting it. The outer side of the base plate (1) is provided with a first support frame (2) for installing the positioning vacuum assembly (4) and the adhesive removal assembly (6). The adhesive removal component (6) includes a lifting component, a rotating adhesive removal component, and a mounting component; the mounting component is fixedly installed on the top of the first support frame (2), the lifting component is installed on the mounting component, the rotating adhesive removal component is installed on the movable end of the lifting component, and the rotating adhesive removal component is in contact with the positioning hole of the PCB board; The first support frame (2) is also equipped with a positioning and air extraction component (4) for horizontally limiting the PCB board and extracting air from the positioning holes of the PCB board. The lifting assembly includes a mounting frame (612); The rotating adhesive removal assembly includes a mounting frame (63), a second drive motor (64), a drive wheel (65), a connecting wheel (66), a straight connecting shaft (67), an adhesive removal wheel (68), a first guide wheel (611), and a second guide wheel (613). The mounting frame (63) is fixedly connected to the mounting frame (612), and the second drive motor (64) is fixedly mounted on the mounting frame (63). The output end of the second drive motor (64) is fixedly connected to the drive wheel (65). The four corners of the mounting frame (612) are respectively connected by a straight connecting shaft. (67) A connecting wheel (66) is rotatably mounted. A first guide wheel (611) and a second guide wheel (613) are also rotatably mounted on the mounting frame (612). The first guide wheel (611) and the second guide wheel (613) are located on both sides of the drive wheel (65). The drive wheel (65), the connecting wheel (66), the first guide wheel (611) and the second guide wheel (613) are connected by a belt drive. A glue-removing wheel (68) is fixedly mounted at the bottom of the straight connecting shaft (67). The glue-removing wheel (68) is located below the mounting frame (612). The positioning and suction assembly (4) includes a symmetrical linear module slide (41), a negative pressure hood (42), a guide rail (43), a suction pipe (44), a slider (45), and a sealing plate (46). The symmetrical linear module slide (41) is fixedly installed on the top right end of the first support frame (2). The two movable ends of the symmetrical linear module slide (41) are respectively fixedly connected to the negative pressure hood (42). The left and right ends of the two sets of negative pressure hoods (42) are fixedly connected to sliders (45). The sliders (45) slide and connect respectively. The guide rail (43) is fixedly connected to the inner sidewalls of the left and right ends of the first support frame (2). One end of the negative pressure cover (42) is fixedly connected to the air extraction pipe (44), and the other end of the air extraction pipe (44) is connected to the external air extraction equipment. The upper part of the left and right ends of the negative pressure cover (42) is provided with four sets of straight holes (69) to facilitate the insertion of each set of glue removal wheels (68) into the positioning holes of the PCB board. The two sets of negative pressure covers (42) are fixedly connected to the end of each set of negative pressure covers (42) that are close to each other.

2. The PCB board positioning hole adhesive removal device according to claim 1, characterized in that, The mounting component includes a third support frame (61), the bottom of the left and right ends of the third support frame (61) being fixedly installed on the top of the left and right ends of the first support frame (2), respectively.

3. The PCB board positioning hole adhesive removal device according to claim 2, characterized in that, The lifting assembly includes a second cylinder (62) and a horizontal support plate (610); the second cylinder (62) is fixedly installed on the third support frame (61), the output end of the second cylinder (62) is fixedly connected to the horizontal support plate (610), and the lower end of the horizontal support plate (610) is fixedly connected to the mounting frame (612); a rotating adhesive removal assembly is installed on the mounting frame (612).

4. The PCB board positioning hole adhesive removal device according to claim 3, characterized in that, There is a gap between the top wall of the sealing plate (46) and the negative pressure cover (42) for inserting the PCB board, and the height of the gap is the same as the thickness of the PCB board.

5. The PCB board positioning hole adhesive removal device according to claim 4, characterized in that, The translation component (5) includes a second support frame (51), a synchronous belt (52), a first drive motor (53), a horizontal shaft (54), a synchronous pulley (55), and a pressure plate (56). The second support frame (51) is fixedly installed on the base plate (1). The horizontal shaft (54) is rotatably installed at both ends of the second support frame (51). The front and rear ends of the horizontal shaft (54) are fixedly installed with synchronous pulleys (55). The two sets of synchronous pulleys (55) on the rear side are connected by a synchronous belt (52), and the two sets of synchronous pulleys (55) on the front side are connected by a synchronous belt (52). The first drive motor (53) is fixedly installed on the side wall of the second support frame (51). The output end of the first drive motor (53) is fixedly connected to one of the sets of horizontal shafts (54). The front and rear ends of the top of the second support frame (51) are fixedly connected with pressure plates (56).

6. The PCB board positioning hole adhesive removal device according to claim 5, characterized in that, The lifting assembly (3) includes a first cylinder (31), a support plate (32), a baffle (34), and a limiting plate (35). The bottom of the first cylinder (31) is fixedly connected to the base plate (1), and the output end of the first cylinder (31) is fixedly connected to the support plate (32). The support plate (32) is located between the front and rear synchronous belts (52). The two sets of pressure plates (56) are respectively provided with straight grooves (33) that cooperate with the support plate (32) to move up and down. The left and right ends of the support plate (32) are respectively fixedly connected to the baffle (34) and the limiting plate (35). The top of the limiting plate (35) is provided with an inclined guide groove, and the inclined surface of the inclined guide groove is set towards the side close to the baffle (34). The top height of the baffle (34) is greater than the top height of the limiting plate (35). The PCB board is located between the baffle (34) and the limiting plate (35), and the PCB board is in close contact with the baffle (34) and the limiting plate (35).

7. A method for removing adhesive from the PCB board positioning hole adhesive removal device according to claim 6, characterized in that, Includes the following steps: Step 1: Place the PCB board to be de-adhesiveed on two sets of synchronous belts (52). Drive the horizontal shaft (54) to rotate through the first drive motor (53). Drive the horizontal shaft (54) to rotate the synchronous wheel (55). Drive the synchronous wheel (55) to rotate the synchronous belt (52). Drive the synchronous belt (52) to move the PCB board horizontally to the bottom of the de-adhesive removal assembly (6). The top of the PCB board is in contact with the bottom of the pressure plate (56). The front and rear walls of the PCB board are in contact with the front and rear inner walls of the second support frame (51), respectively. The pressure plate (56) limits the vertical movement of the PCB board. The second support frame (51) limits the front and rear movement of the PCB board, ensuring that the PCB board moves to the bottom of the de-adhesive removal assembly (6) in a certain shape. Step 2: When the PCB board moves to the bottom of the adhesive removal component (6), the PCB board is blocked by the baffle (34) and the PCB board no longer moves with the timing belt (52). Then the first cylinder (31) is started. The first cylinder (31) drives the support plate (32) to move upward. After the support plate (32) contacts the PCB board, it drives the PCB board above it to move upward until it is flush with the gap on the negative pressure cover (42). Step 3: Then, start the symmetrical linear module slide (41) to drive the two sets of negative pressure covers (42) to move towards each other. Under the limiting action of the slider (45) and the guide rail (43), the two ends of the two sets of negative pressure covers (42) move horizontally inward until the two ends of the PCB board pass through the gaps on the negative pressure covers (42) and move to the positioning holes on the PCB board and the straight holes (69) on the negative pressure covers (42) correspond vertically. Then, start the second cylinder (62) to drive the horizontal support plate (610) to move downward. The horizontal support plate (610) drives the mounting frame (612) to move downward. The mounting frame (612) moves downward. 2) Drive the rotating adhesive removal assembly downwards so that each set of adhesive removal wheels (68) passes through the straight hole (69) and inserts into the positioning hole of the PCB board; then start the second drive motor (64), drive the drive wheel (65) to rotate through the second drive motor (64), drive the drive wheel (65) to rotate through the transmission belt drive the connecting wheel (66), the first guide wheel (611) and the second guide wheel (613) to rotate, the connecting wheel (66) drives the straight connecting shaft (67) to rotate, the straight connecting shaft (67) drives the adhesive removal wheel (68) to rotate, the adhesive removal wheel (68) contacts the positioning hole of the PCB board and rotates to remove adhesive from the positioning hole of the PCB board; Step 4: Then, by starting the external air extraction device, air is extracted from the negative pressure hood (42) through the air extraction pipe (44) to suck out the glue removed from the negative pressure hood (42).

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