A method for manufacturing an infinite-length FPC collection plate

Abstract

The present application relates to the technical field of flexible circuit board preparation and processing, in particular to a method for manufacturing an unlimited length FPC acquisition board, comprising the following steps: preparing an unlimited length flat cable with a consistent pattern, preparing a fuse plate, and connecting and combining, wherein the unlimited length FPC and the fuse FPC connector are connected to achieve unlimited length electrical performance connection to obtain an unlimited length FPC acquisition board. The present application has the beneficial effect that the process scheme breaks the traditional production process technology idea, and a kind of unlimited length FPC acquisition board is manufactured by design scheme and using existing equipment to replace the scheme of harness of large vehicle, automatic assembly is realized, wiring errors are avoided, and the use space is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board fabrication and processing technology, specifically a method for fabricating an infinitely long FPC acquisition board. Background Technology

[0002] Flexible printed circuit boards (FPCs) have a wide range of applications, such as in the manufacture of LED light strips, LED melamine lamps, antenna circuits, and neon lights. Traditionally, production involves cutting substrates into 515mm pieces, applying dry film (developing film), and then exposing them. This process is costly, involves numerous steps, and is slow. Furthermore, after the circuit boards are delivered to the mounting customer, they still need to be soldered together piece by piece to the required length using solder paste. This poses obstacles to the environment, cost, and production delivery time, resulting in slow adoption of LED lighting products due to cost and production volume constraints. This aligns with the global vision of promoting energy conservation and environmental protection and vigorously developing LED products.

[0003] Currently, the technology and equipment can only manufacture products up to 2 meters in length, and it is impossible to infinitely replicate different patterns. Existing processes for producing power battery data acquisition boards have inconsistent fuse designs and wiring directions, preventing the production of infinitely long patterns and resulting in significant product limitations. Furthermore, current data acquisition boards for new energy power batteries in large vehicles such as buses use wire harnesses, which presents assembly difficulties, are prone to errors, and occupy a large amount of space. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the design of each fuse in the power battery acquisition board manufactured by the existing process is inconsistent in the different positions and routing directions, which makes it impossible to produce infinitely long graphics.

[0005] To solve the above problems, the technical solution adopted by the present invention is: a method for manufacturing an infinitely long FPC acquisition board, comprising the following steps:

[0006] Step 1: Preparation of infinitely long, uniform patterned ribbon cables.

[0007] S1, apply dry film;

[0008] S2, Exposure: The pattern of a consistent line with a fixed wire harness length is obtained by seamlessly cyclically exposing the fixed-length wire harness using a roll-to-roll exposure machine based on the principle of CCD edge tracking to obtain a pattern with no wire harness length.

[0009] S3, Etching, uses a subtractive etching process to transfer the pattern to the circuit roll material;

[0010] S4, false coating, is a protective film applied to the graphic circuit roll to prevent circuit corrosion and achieve insulation;

[0011] S5, pressing and baking, sequentially pressing and baking the surface of the graphic circuit roll material with rollers and high temperature;

[0012] S6, laser windowing, uses ultraviolet picosecond laser machine-controlled depth to open the protective film at the connector to be attached, removing the protective film layer to expose the copper layer of the circuit;

[0013] S7, OSP, uses roll OSP equipment to protect the copper surface of the window with OSP, i.e. organic solder mask process;

[0014] S8, SMT, uses SMT equipment to attach connectors to the circuit layer at the window position through surface mount technology. The connector pins are electrically connected to the circuit layer to realize the production of infinitely long FPCs.

[0015] Step 2: Fuse board preparation.

[0016] Each wire of the FPC fuse line is designed with a set of fuses for unlimited length flat cables and is manufactured using normal FPC production processes;

[0017] Step 3: Connect and combine the wireless long FPC with the fuse FPC connector to achieve an infinitely long electrical connection and obtain an infinitely long FPC acquisition board.

[0018] The beneficial effects of this invention are as follows: This process solution breaks away from the traditional production process technology thinking. By designing a solution and using existing equipment to manufacture an infinitely long FPC acquisition board to replace the wiring harness of large vehicles, it achieves automated assembly, avoids wiring errors, and greatly improves the usable space.

[0019] As a further improvement of the present invention, the technical problem to be solved is: how to efficiently process an infinitely long FPC within the standard dimensions of existing processing equipment.

[0020] To solve the above technical problems, the technical solution adopted by the present invention is as follows: in step 1, the length of the wire harness is fixed and the fixed length is 500mm.

[0021] The beneficial effects of the above improvements are: optimizing the length of the fixed wire harness and fixing the length to 500mm.

[0022] As a further improvement of the present invention, the technical problem to be solved is: how to specifically implement the dry film application step.

[0023] To solve the above technical problems, the technical solution adopted by the present invention is as follows: the specific operation of applying dry film in step 1 is to first peel off the polyethylene protective film from the dry film, and then apply the dry film resist to the copper clad laminate under heating and pressure; the resist layer in the dry film softens and increases fluidity after being heated, and the film application is completed with the help of the pressure of the hot press roller and the action of the adhesive in the resist.

[0024] The beneficial effect of the above improvements is that the ribbon cable rolls are specifically coated with dry film.

[0025] As a further improvement of the present invention, the technical problem to be solved is: how to specifically implement SMT processing.

[0026] To solve the above-mentioned technical problems, the present invention further improves the technical solution by adopting the following: the SMT equipment in step 1 includes a feeder, a solder paste printer, a dispensing machine, a pick and place machine, and a reflow soldering machine.

[0027] The beneficial effect of the above improvements is that they fully disclose SMT-related processing equipment for infinitely long FPCs.

[0028] As a further improvement of the present invention, the technical problem to be solved is: how to specifically implement the existing FPC production process.

[0029] To solve the above technical problems, the technical solution adopted by the present invention is as follows: the normal FPC production process in step 2 includes material cutting, dry film lamination, exposure, etching, bonding, pressing, baking, OSP, outline and SMT.

[0030] The beneficial effect of the above improvements is that they fully disclose how existing FPC processing methods are used to manufacture fuse boards.

[0031] As a further improvement of the present invention, the technical problem to be solved is: how the protective film can specifically achieve corrosion prevention and insulation.

[0032] To solve the above technical problems, the present invention further improves the technical solution by adopting the following: the protective film in step 1 is a polyethylene protective film.

[0033] The beneficial effects of the above improvements are: the polyethylene protective film can achieve the anti-corrosion and insulation effects during the preparation of FPC acquisition boards. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of the present invention in any way.

[0035] Example 1:

[0036] A method for manufacturing an infinitely long FPC acquisition board, characterized by comprising the following steps:

[0037] Step 1: Preparation of infinitely long, uniform patterned ribbon cables.

[0038] S1, apply dry film;

[0039] S2, Exposure: The required 500mm consistent line pattern is seamlessly cyclically exposed to the 500mm line using a roll-to-roll exposure machine based on the CCD edge tracking principle to obtain an infinitely long pattern.

[0040] S3, Etching, uses a subtractive etching process to transfer the pattern to the circuit roll material;

[0041] S4, false adhesive, is a polyethylene protective film covering the graphic circuit roll to prevent circuit corrosion and achieve insulation;

[0042] S5, Pressing and Baking: The surface of the graphic circuit roll material is pressed by a roller press and baked at high temperature in sequence. The roller pressing pressure is 100kg, the pressing time is 60s, the baking temperature is 100℃, and the baking time is 10min.

[0043] S6, laser windowing, uses ultraviolet picosecond laser machine-controlled depth to open the protective film at the connector to be attached, removing the protective film layer to expose the copper layer of the circuit;

[0044] S7, OSP, uses roll OSP equipment to protect the copper surface of the window with OSP, i.e. organic solder mask process;

[0045] S8, SMT, uses SMT equipment to attach connectors to the circuit layer at the window position through surface mount technology. The connector pins are electrically connected to the circuit layer to realize the production of infinitely long FPCs.

[0046] Step 2: Fuse board preparation.

[0047] Each wire of the FPC fuse line is designed with a set of fuses for unlimited length flat cables and is manufactured using normal FPC production processes;

[0048] Step 3: Connect and combine the wireless long FPC with the fuse FPC connector to achieve an infinitely long electrical connection and obtain an infinitely long FPC acquisition board.

[0049] Example 2:

[0050] A method for manufacturing an infinitely long FPC acquisition board, characterized by comprising the following steps:

[0051] Step 1: Preparation of infinitely long, uniform patterned ribbon cables.

[0052] S1, apply dry film;

[0053] S2, Exposure: The required 500mm consistent line pattern is seamlessly cyclically exposed to the 500mm line using a roll-to-roll exposure machine based on the CCD edge tracking principle to obtain an infinitely long pattern.

[0054] S3, Etching, uses a subtractive etching process to transfer the pattern to the circuit roll material;

[0055] S4, false adhesive, is a polyethylene protective film covering the graphic circuit roll to prevent circuit corrosion and achieve insulation;

[0056] S5, Pressing and Baking: The surface of the graphic circuit roll material is pressed by a roller press and baked at high temperature in sequence. The roller pressing pressure is 100kg, the pressing time is 60s, the baking temperature is 100℃, and the baking time is 10min.

[0057] S6, laser windowing, uses ultraviolet picosecond laser machine-controlled depth to open the protective film at the connector to be attached, removing the protective film layer to expose the copper layer of the circuit;

[0058] S7, OSP, uses roll OSP equipment to protect the copper surface of the window with OSP, i.e. organic solder mask process;

[0059] S8, SMT, uses SMT equipment to attach connectors to the circuit layer at the window position through surface mount technology. The connector pins are electrically connected to the circuit layer to realize the production of infinitely long FPCs. SMT equipment includes a feeder, solder paste printer, dispensing machine, pick and place machine, and reflow soldering machine.

[0060] Step 2: Fuse board preparation.

[0061] Each wire of the FPC fuse line is designed with a set of fuses for unlimited length flat cables and is manufactured using normal FPC production processes;

[0062] Step 3: Connect and combine the wireless long FPC with the fuse FPC connector to achieve an infinitely long electrical connection and obtain an infinitely long FPC acquisition board.

[0063] Example 3:

[0064] A method for manufacturing an infinitely long FPC acquisition board, characterized by comprising the following steps:

[0065] Step 1: Preparation of infinitely long, uniform patterned ribbon cables.

[0066] S1, Dry film application: First, peel off the polyethylene protective film from the dry film, and then, under heating and pressure, apply the dry film resist to the copper clad laminate. The resist layer in the dry film softens and increases its fluidity when heated, and the film application is completed with the help of the pressure of the hot press roller and the action of the adhesive in the resist.

[0067] S2, Exposure: The required 500mm consistent line pattern is seamlessly cyclically exposed to the 500mm line using a roll-to-roll exposure machine based on the CCD edge tracking principle to obtain an infinitely long pattern.

[0068] S3, Etching, uses a subtractive etching process to transfer the pattern to the circuit roll material;

[0069] S4, false adhesive, is a polyethylene protective film covering the graphic circuit roll to prevent circuit corrosion and achieve insulation;

[0070] S5, Pressing and Baking: The surface of the graphic circuit roll material is pressed by a roller press and baked at high temperature in sequence. The roller pressing pressure is 100kg, the pressing time is 60s, the baking temperature is 100℃, and the baking time is 10min.

[0071] S6, laser windowing, uses ultraviolet picosecond laser machine-controlled depth to open the protective film at the connector to be attached, removing the protective film layer to expose the copper layer of the circuit;

[0072] S7, OSP, uses roll OSP equipment to protect the copper surface of the window with OSP, i.e. organic solder mask process;

[0073] S8, SMT, uses SMT equipment to attach connectors to the circuit layer at the window position through surface mount technology. The connector pins are electrically connected to the circuit layer to realize the production of infinitely long FPCs. SMT equipment includes a feeder, solder paste printer, dispensing machine, pick and place machine, and reflow soldering machine.

[0074] Step 2: Fuse board preparation.

[0075] Each wire of the FPC with fuse line is designed with a set of fuses for unlimited length flat cables and is manufactured using normal FPC production processes. Normal FPC production processes include material cutting, dry film lamination, exposure, etching, bonding, pressing, baking, OSP, outline and SMT.

[0076] Step 3: Connect and combine the wireless long FPC with the fuse FPC connector to achieve an infinitely long electrical connection and obtain an infinitely long FPC acquisition board.

[0077] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0078] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, there are objectively infinite specific structures. For those skilled in the art, several improvements, modifications, or changes can be made without departing from the principles of the present invention, and the above technical features can also be combined in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A method for manufacturing an infinitely long FPC acquisition board, characterized in that, Includes the following steps: Step 1: Preparation of infinitely long, uniform patterned ribbon cables. S1, apply dry film; S2, Exposure: The pattern of a consistent line with a fixed wire harness length is seamlessly and cyclically exposed to the fixed length of the wire harness using the CCD edge tracking principle through a roll-to-roll exposure machine to obtain an infinitely long pattern. S3, Etching, uses a subtractive etching process to transfer the pattern to the circuit roll material; S4, false coating, is a protective film applied to the graphic circuit roll to prevent circuit corrosion and achieve insulation; S5, pressing and baking, sequentially pressing and baking the surface of the graphic circuit roll material with rollers and high temperature; S6, laser windowing, uses ultraviolet picosecond laser machine-controlled depth to open the protective film at the connector to be attached, removing the protective film layer to expose the copper layer of the circuit; S7, OSP, uses roll OSP equipment to protect the copper surface of the window with OSP, i.e. organic solder mask process; S8, SMT, uses SMT equipment to attach connectors to the circuit layer at the window position through surface mount technology. The connector pins are electrically connected to the circuit layer to realize the production of infinitely long FPCs. Step 2: Fuse board preparation. Each wire of the FPC with fuse line is designed with a set of fuses for unlimited length flat cables and is manufactured using normal FPC production processes, which include material cutting, dry film lamination, exposure, etching, bonding, pressing, baking, OSP, outline and SMT. Step 3: Connect and combine. Attach the infinitely long FPC to the fuse FPC connector to achieve an infinitely long electrical connection, thus obtaining an infinitely long FPC acquisition board.

2. The method for manufacturing an infinitely long FPC acquisition board according to claim 1, characterized in that: In step 1, the wire harness length is fixed at 500mm.

3. The method for manufacturing an infinitely long FPC acquisition board according to claim 1, characterized in that: The specific operation of applying the dry film in step 1 is as follows: first, peel off the polyethylene protective film from the dry film, and then, under heating and pressure, adhere the dry film resist to the copper-clad laminate; the resist layer in the dry film softens and increases its fluidity when heated, and the film application is completed with the help of the pressure of the hot press roller and the action of the adhesive in the resist.

4. The method for manufacturing an infinitely long FPC acquisition board according to claim 1, characterized in that: In step 1, the SMT equipment includes a feeder, solder paste printer, dispensing machine, pick and place machine, and reflow soldering machine.

5. The method for manufacturing an infinitely long FPC acquisition board according to claim 1, characterized in that: The protective film in step 1 is a polyethylene protective film.