A cover plate, a display module, and a method for manufacturing the same.

Abstract

This application discloses a cover plate, a display module, and a manufacturing method. The cover plate includes: a cover plate body, the cover plate body including a first surface corresponding to the panel layer, and a side surface connected to the first surface and angled to the first surface, the first surface including a light-transmitting area and a light-shielding area surrounding the light-transmitting area; and an ink layer covering the side surface and the light-shielding area. By providing an ink layer on the side surface and the light-shielding area of ​​the cover plate, the above-described cover plate prevents light passing through the light-transmitting area from escaping from the side surface or the light-shielding area within the cover plate body due to reflection or other phenomena, thereby avoiding the problem of light leakage defects in the cover plate.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a cover plate, a display module, and a method for manufacturing it. Background Technology

[0002] In related technologies, organic light-emitting diode (OLED) display modules often suffer from halo phenomena, which means that OLED display modules have light leakage at the edges of the cover glass (CG), affecting the display effect of the OLED display module.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] This application aims to at least partially solve the technical problem of edge light leakage in OLED display modules, which affects the display effect of OLED display modules. To this end, this application provides a cover plate, a display module, and a manufacturing method.

[0005] This application provides a cover plate, the cover plate comprising: The cover plate body includes a first surface corresponding to the panel layer, and a side surface connected to the first surface and set at an angle to the first surface. The first surface includes a light-transmitting area and a light-shielding area surrounding the light-transmitting area. An ink layer covering the side surface and the light-shielding area.

[0006] In some embodiments, the light-shielding area is curved relative to the light-transmitting area toward the panel layer, and the light-shielding area includes a flat portion, a curved portion, and an end portion connected in sequence, with the curved portion and the side portion located on opposite sides of the cover plate body, respectively.

[0007] In some embodiments, the side surface where it connects to the light-shielding area is provided with a chamfer or radius, and the ink layer covers the chamfer or radius.

[0008] In some embodiments, the ink layer includes a first ink region covering the side surface, the thickness of the first ink region being 10 μm to 22.5 μm.

[0009] In some embodiments, the first ink area is formed on the side surface using a spraying process and a pad printing process.

[0010] In some embodiments, the orthographic projection height of the first ink area on the side surface is 0.476 mm to 0.552 mm.

[0011] This application also provides a method for preparing the above-mentioned cover plate, the method comprising the following steps: Provide the cover plate body; Ink is sprayed onto the sides and light-shielding areas of the cover plate body; Ink is transferred onto the side of the cover plate body; The cover plate body is baked under baking conditions.

[0012] In some embodiments, before or after the ink spraying step on the sides and light-shielding areas of the cover plate body, the preparation method further includes the following steps: Ink is sprayed onto the light-shielding area of ​​the cover plate body.

[0013] This application also provides a display module, characterized in that the display module includes a panel layer and a polarizing layer, an optical adhesive layer and the aforementioned cover plate sequentially disposed on the display side of the panel layer.

[0014] In some embodiments, the orthographic projection of the light-shielding area onto the panel layer covers the edge of the panel layer.

[0015] The embodiments of this application have at least the following beneficial effects: The cover plate provided in this application embodiment, by providing an ink layer on the side and light-shielding area of ​​the cover plate, isolates light passing through the light-transmitting area from being emitted from the side or light-shielding area of ​​the cover plate after reflection and other phenomena within the cover plate body, thereby avoiding the problem of light leakage defects in the cover plate. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of a display module in the related technology is shown; Figure 2 It shows Figure 1 A schematic diagram of the edge light leakage path of the display module in the diagram; Figure 3 It shows Figure 1 A schematic diagram illustrating the process specifications for the distance between the ink layer of the display module and the edge of the cover plate body; Figure 4 This diagram illustrates the position of the ink printing screen in the relevant technology; Figure 5 A schematic diagram of the cover plate in an embodiment of this application is shown; Figure 6 It shows Figure 5 Schematic diagram of the structure of the central shading area; Figure 7 A schematic diagram of the cover plate in another embodiment of this application is shown; Figure 8 A schematic diagram of the display module structure in an embodiment of this application is shown; Figure 9 A photograph showing the height of the first ink zone formed by a two-coating process on the side of the cover plate; Figure 10 It shows Figure 9 A thickness slice photograph of the first ink zone in the image; Figure 11 A photograph showing the height of the first ink zone formed on the side of the cover plate using a two-stage pad printing process is shown. Figure 12 It shows Figure 11 A thickness slice photograph of the first ink zone in the image; Figure 13 A photograph showing the height of the first ink zone formed on the side of the cover plate using spraying and pad printing processes; Figure 14 It shows Figure 13 A thickness slice photograph of the first ink zone in the image.

[0018] Figure label: 100. Cover plate body; 110. First surface; 111. Light-transmitting area; 112. Light-shielding area; 1121. Flat surface; 1122. Curved surface; 1123. End surface; 120. Side surface; 130. Chamfer or R-angle; 200. Ink layer; 210. First ink area; 220. Second ink area; 300. Optical adhesive layer; 400. Polarizing layer; 500. Panel layer; 600. Heat dissipation layer; 20. Light-shielding ink; 1000. Ink printing screen. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0020] Furthermore, reference numerals and / or reference letters may be repeated in different examples in this application. Such repetition is for simplification and clarity purposes and does not in itself indicate a relationship between the various embodiments and / or settings discussed. In addition, this application provides examples of various specific processes and materials; however, those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0021] This application is described below with reference to the accompanying drawings and specific embodiments: This application provides a cover plate, such as... Figures 5 to 7 As shown, the cover plate includes: The cover body 100 includes a first surface 110 corresponding to the panel layer 500, and a side surface 120 connected to the first surface 110 and set at an angle to the first surface 110. The first surface 110 includes a light-transmitting area 111 and a light-shielding area 112 surrounding the light-transmitting area 111. Ink layer 200 covers the side 120 and the light-shielding area 112.

[0022] The cover plate provided in this application embodiment, by providing an ink layer 200 on the side 120 and the light-shielding area 112 of the cover plate, isolates the light passing through the light-transmitting area 111 from being emitted from the side 120 or the light-shielding area 112 of the cover plate after reflection and other phenomena within the cover plate body 100, thereby avoiding the problem of light leakage defects in the cover plate.

[0023] In the field of Organic Light-Emitting Diode (OLED) displays, as the demand for OLED display modules increases, the performance requirements also become more stringent. With the pursuit of ever-larger screen-to-body ratios, the bezels of OLED modules have been continuously compressed. The distance from the light-emitting area to the edge of the cover plate has been reduced to its limit, leaving only enough space for the adhesive application during assembly. This compression of the distance between the light-emitting area and the edge of the cover plate leads to edge light leakage issues.

[0024] like Figure 1 and Figure 2 As shown, light-shielding ink 20 is provided around the light-emitting area of ​​the cover plate. Light from the light-emitting area passes through the cover plate, and the beam undergoes a series of diffuse reflections inside the cover plate. The light exits from the side wall and chamfer of the cover plate, forming a light leakage path. After the OLED module is assembled, the beam exits through the gap between the OLED module and the middle frame. In a darker environment, light leakage at the edge of the module forms a halo, affecting the display effect and user experience. Research has found that light leakage occurs in cover plates of various shapes. The halo phenomenon appears in 2D, 2.5D, 3D, and cutout / bridge-type cover plate structures, indicating that the halo phenomenon is not related to the CG structure itself.

[0025] To address the aforementioned halo phenomenon, this application provides a cover plate. By providing an ink layer 200 on the side 120 of the cover plate body 100, the ink layer 200 completely covers the side 120 of the cover plate edge and the light-shielding area 112, effectively isolating the light beam at the edge of the cover plate. This absorbs or reflects the diffuse light inside the cover plate back, preventing light from passing through the edge of the cover plate and thus avoiding the halo phenomenon.

[0026] In this application, as Figures 5 to 7 As shown, the surface of the cover plate body 100 corresponding to the panel layer 500 is defined as the first surface 110. The first surface 110 includes a light-transmitting area 111 and a light-shielding area 112 surrounding the light-transmitting area 111. The light-transmitting area 111 transmits light, allowing light from the display side of the panel layer 500 to pass through it. The light-shielding area 112 is provided with an ink layer 200 to shield light from the edges of the panel layer 500, preventing light leakage from the edges of the display module. The side surface 120 of the cover plate body 100 is connected to the first surface 110 and is angled to it. By providing the ink layer 200 on the side surface 120, the ink layer 200 can continuously cover the side surface 120 and the light-shielding area 112 of the cover plate body 100, completely covering and blocking the edges of the cover plate body 100 to prevent light leakage from the edges of the cover plate body 100, effectively solving the problem of light leakage from the edges of the module.

[0027] In this application, the ink layer 200 has a certain thickness, that is, the ink layer 200 can also play a certain buffering role on the side 120 of the cover plate body 100, reducing the risk of scratches on the cover plate during the manufacturing process and improving the strength of the cover plate.

[0028] In this application, the ink layer 200 is disposed on the side 120 of the cover plate body 100, which can also increase the dyne value of the side 120 of the cover plate body 100, which can increase the dyne value of the side 120 of the cover plate body 100 from 30A to 34A, thereby increasing the airtightness between the cover plate body 100 and the middle frame, and thus improving the airtightness performance of the whole machine.

[0029] In such Figure 5 and Figure 6 In the embodiment shown, the edge of the cover plate body 100 is curved, and the edge of the second surface of the cover plate body 100 opposite to the first surface 110 is curved, that is, the edge of the second surface is curved to form the cover plate side surface 120. The side surface 120 is set at an angle to the first surface 110, and there is a risk that light will be emitted from the side surface 120. Therefore, an ink layer 200 is provided on the side surface 120 to block the light.

[0030] In such Figure 7In the embodiment shown, the end face of the cover plate body 100 connected to the first surface 110 is set at an angle to the first surface 110. Since this end face, as the side surface 120 of the cover plate body 100, is at risk of light escaping, an ink layer 200 is provided on this side surface 120 to block light.

[0031] As an alternative implementation method, such as Figure 5 and Figure 6 As shown, the light-shielding area 112 is curved relative to the light-transmitting area 111 toward the panel layer 500. The light-shielding area 112 includes a flat portion 1121, a curved portion 1122, and an end portion 1123 connected in sequence. The curved portion 1122 and the side portion 120 are located on opposite sides of the cover plate body 100, respectively.

[0032] In this embodiment, as Figure 5 and Figure 6 As shown, the light-shielding area 112 is curved relative to the light-transmitting area 111 toward the panel layer 500, that is, the edge of the cover plate body 100 is curved toward the panel layer 500, in order to satisfy the display effect of the display module or to accommodate the relevant structure of the panel layer 500 inside the edge of the cover plate body 100. At the same time, due to the curvature of the edge of the cover plate body 100, the structure of the light-shielding area 112 surrounding the light-transmitting area 111 changes accordingly. The light-shielding area 112 can be divided into a flat part 1121, a curved part 1122, and an end part 1123 according to different structures.

[0033] As an alternative implementation method, such as Figure 5 and Figure 6 As shown, a chamfer or R-angle 130 is provided at the connection between the side 120 and the light-shielding area 112, and the ink layer 200 covers the chamfer or R-angle 130.

[0034] In this embodiment, to facilitate the installation of the cover plate or to prevent damage to the side of the cover plate from bumps, the connection between the side 120 of the cover plate body 100 and the light-shielding area 112 is designed as a chamfered structure or a rounded corner structure. At the same time, to prevent light leakage at the chamfered or rounded corner 130, an ink layer 200 is applied to the chamfered or rounded corner 130 to block the leakage of light.

[0035] As an alternative implementation, the ink layer 200 includes a first ink region 210 covering the side surface 120, the thickness of the first ink region 210 being 10 μm to 22.5 μm.

[0036] In this embodiment, the side surface 120 of the cover plate body 100 is used to assemble with the mid-frame of the display module. To increase the airtightness of the assembly between the cover plate body 100 and the mid-frame, and also to protect the side surface 120 of the cover plate body 100, the first ink area 210 covering the side surface 120 needs to have a certain thickness to provide a buffering effect and improve the dyne value. Through continuous verification and optimization, this application has found that a thickness of 10 μm to 22.5 μm in the first ink area 210 can achieve a good buffering protection effect and improve the dyne value.

[0037] As an alternative implementation, the first ink zone 210 is formed on the side 120 using a spray coating process and a pad printing process.

[0038] In this embodiment, the first ink area 210 is formed on the side surface 120 using a spraying process and a pad printing process. That is, the first ink area 210 formed by the spraying process and the pad printing process can meet the requirements for the thickness of the first ink area 210. At the same time, the combination of the spraying process and the pad printing process can also ensure the structural integrity of the first ink area 210 formed on the side surface 120, and avoid the exposure of the side surface 120 of the cover plate body 100 due to unevenness or incompleteness of the first ink area 210, that is, avoid the problem of light leakage caused by the exposure of the side surface 120.

[0039] In related technologies, such as Figure 3 As shown, in the standard mass-produced cover plates, the distance d from the light-shielding ink 20 in the light-shielding area 112 to the edge of the cover plate is required to be ≤0.06 mm. 32 cover plate samples were selected for actual measurement, and the test data are shown in Table 1.

[0040] Table 1. Test results of the distance between the light-blocking ink 20 and the edge of the cover plate.

[0041] As can be seen from the test results in Table 1, the light-shielding ink 20 is formed in the light-shielding area 112 by screen printing with ink printing screen 1000. The average distance between the light-shielding ink 20 and the edge of the cover plate is about 0.03 mm, which meets the requirement that the light-shielding ink 20 of the internal ink printing screen 1000 is 0.03 mm smaller in shape.

[0042] The edge structure of the cover plate body 100 is relatively complex, such as Figure 4As shown, when the cover plate has a chamfer or R-angle 130 on its edge, because the chamfer or R-angle 130 is not on the same horizontal line as the ink surface of the ink printing screen 1000, when the ink printing screen 1000 is pressed down, the chamfer or R-angle 130 is in an open state, and the ink cannot 100% cover the chamfer or R-angle 130. Light will be projected out from the chamfer or R-angle 130, that is, light leakage will occur at the chamfer or R-angle 130. If the ink printing screen 1000 is enlarged to a 1:1 size with the cover plate body 100, the chamfer or R-angle 130 and the ink surface of the ink printing screen 1000 are still not on the same horizontal line. That is, it is impossible to ensure that the ink covers the chamfer or R-angle 130 100%, and edge overflow will occur, that is, the ink overflows to the side 120 of the cover plate body 100, or the ink edge is serrated, which will cause the product to be scraped and reworked or the ink to be removed and re-screen printed, making mass production impossible. Through actual testing of cover plates of various shapes, it was found that the inability of the light-blocking ink 20 to cover the sides 120, chamfers, or R-angles 130 of the cover plate is the main reason for light leakage from the cover plate.

[0043] In this embodiment, to ensure that the side surface 120 of the cover plate body 100 and the chamfer or R-angle 130 at the junction of the side surface 120 and the light-shielding area 112 completely cover the ink layer 200, a combination of spraying and pad printing processes is used. The spraying process ensures that the ink layer 200 completely covers the side surface 120 and the chamfer or R-angle 130 of the cover plate body 100, while also ensuring the thickness of the ink layer 200. Simultaneously, the pad printing process ensures the accuracy of the coverage area of ​​the ink layer 200, so that the formed ink layer 200 meets the requirements of complete coverage, appropriate coverage thickness, and dimensional and positional accuracy.

[0044] As an alternative implementation, the orthographic projection height of the first ink area 210 on the side 120 is 0.476 mm to 0.552 mm.

[0045] In this embodiment, the height of the first ink area 210 projected onto the side 120 is 0.476 mm to 0.552 mm. The first ink area 210 within this height range can better shield the side 120 of the cover plate body 100 and prevent light leakage from the side 120. At the same time, it can also match the mid-frame structure of the display module to ensure that the first ink area 210 of the side 120 is shielded by the mid-frame after assembly, thus preventing the first ink area 210 from being exposed and affecting the appearance of the display module.

[0046] Based on the same inventive concept, this application also provides a method for preparing the above-mentioned cover plate, the method comprising the following steps: Provide cover body 100; Ink is sprayed onto the side 120 and the light-shielding area 112 of the cover plate body 100; Pad printing ink is applied to the side 120 of the cover plate body 100; The cover plate body 100 is baked under baking conditions.

[0047] In the preparation method of this embodiment, the spraying process can ensure that the ink layer 200 completely covers the side 120 of the cover plate body 100, and at the same time, it can also ensure the thickness of the ink layer 200. Meanwhile, the pad printing process can ensure the accuracy of the coverage area of ​​the ink layer 200, so that the formed ink layer 200 can not only meet the requirements of complete coverage and appropriate coverage thickness, but also meet the requirements of ink layer 200 size and position accuracy.

[0048] As a further optional embodiment, the preparation method further includes the following steps before or after the ink spraying step on the side surface 120 and light-shielding area 112 of the cover plate body 100: Ink is sprayed onto the light-shielding area 112 of the cover plate body 100.

[0049] A traditional cover plate manufacturing process includes the following steps: applying a front protective film, pad printing a viewing window, cleaning the finished product, applying a concave film, applying a first ink spraying, applying a second ink spraying, pad printing a code, applying a surface oil, and final baking. The steps of applying the front protective film, pad printing a viewing window, cleaning the finished product, applying the concave film, applying the first ink spraying, applying the second ink spraying, pad printing a code, applying a surface oil, and final baking can each be implemented using methods already disclosed in the art, and will not be described in detail here.

[0050] In this field, two common methods for preparing the ink layer 200 are spraying and pad printing. In the cover plate of this application, since a first ink area 210 is provided on the side 120 of the cover plate, the first ink area 210 can be formed on the side 120 of the cover plate body 100 by means of spraying, pad printing, or a combination of spraying and pad printing. This application conducts experimental tests and analyses on the formation methods of the first ink area 210.

[0051] Example 1 The cover plate manufacturing process includes: front protective film step, pad printing window step, finished product cleaning step, concave film application step, first ink spraying step, second ink spraying step, pad printing code step, surface oil application step, and final baking step. Specifically, the first ink spraying step involves applying ink to the side surface 120 and light-shielding area 112 of the cover plate body 100; the second ink spraying step involves applying ink to the side surface 120 and light-shielding area 112 of the cover plate body 100.

[0052] The projected height and thickness of the first ink zone 210 of the prepared cover plate were measured, and the results are as follows: Figure 9 , Figure 10 As shown in Tables 2 and 3.

[0053] Table 2. Test results of the height of the first ink zone formed by the secondary ink spraying method.

[0054] Table 3. Thickness test results of the first ink zone formed by the secondary ink spraying method.

[0055] Example 2 The cover plate manufacturing process includes: front protective film step, pad printing window step, finished product cleaning step, concave film application step, first ink spraying step, second ink spraying step, pad printing code step, surface oil application step, first pad printing step, second pad printing step, and final baking step. Specifically, the first ink spraying step involves applying ink to the light-shielding area 112 of the cover plate body 100; the second ink spraying step involves applying ink to the light-shielding area 112 of the cover plate body 100; the first pad printing step involves applying ink to the side surface 120 of the cover plate body 100; and the second pad printing step involves applying ink to the side surface 120 of the cover plate body 100.

[0056] The projected height and thickness of the first ink zone 210 of the prepared cover plate were measured, and the results are as follows: Figure 11 , Figure 12 And as shown in Table 4.

[0057] Table 4. Test results of the height of the first ink zone formed by the two-stage ink pad printing method.

[0058] Example 3 The cover plate manufacturing process includes: front protective film step, pad printing window step, finished product cleaning step, concave film application step, first ink spraying step, second ink spraying step, first pad printing step, pad printing code step, surface oil application step, and final baking step. Specifically, the first ink spraying step involves applying ink to the light-shielding area 112 of the cover plate body 100; the second ink spraying step involves applying ink to the light-shielding area 112 of the cover plate body 100 and to the side surface 120 of the cover plate body 100; the first pad printing step involves applying ink to the side surface 120 of the cover plate body 100.

[0059] The projected height and thickness of the first ink zone 210 of the prepared cover plate were measured, and the results are as follows: Figure 13 , Figure 14As shown in Tables 5 and 6.

[0060] Table 5. Thickness test results of the first ink zone formed by the combination of ink spraying and ink pad printing.

[0061] Table 6. Thickness test results of the first ink zone formed by the combination of ink spraying and ink pad printing.

[0062] Analysis of the test results of Embodiments 1, 2, and 3 reveals that all three methods for forming the first ink area 210 can cover the side surface 120 and chamfer or R-angle 130 of the cover plate body 100, meeting the design requirements. In Embodiment 1, where the first ink area 210 is formed by two ink spraying processes, the ink thickness of the first ink area 210 fluctuates significantly and is quite thick, with a single-sided thickness exceeding 15 μm, failing to meet the thickness requirements for the first ink area 210. In Embodiment 2, where the first ink area 210 is formed by two ink transfer printing processes, the thickness of the first ink area 210 is insufficient, and neither of the two ink transfer printing processes effectively covers the side surface 120 of the cover plate body 100, failing to achieve a good effect of blocking light transmission.

[0063] In the scheme of forming the first ink area 210 by combining ink spraying and ink pad printing in Example 3, although ink spraying has the defect of large tolerance and ink pad printing has the defect of thin thickness, the combination of ink spraying and ink pad printing allows the first ink area 210 to experience the advantages of each. Ink spraying makes the thickness of the first ink area 210 meet the design requirements, and ink pad printing makes the precision of the first ink area 210 meet the precision requirements. Thus, the first ink area 210 can simultaneously achieve the triple effect of blocking light transmission, buffering and protecting the cover plate body 100, and improving airtightness.

[0064] This application also proposes a display module, such as... Figure 7 and Figure 8 As shown, the display module includes a panel layer 500 and a polarizing layer 400, an optical adhesive layer 300, and a cover plate sequentially disposed on the display side of the panel layer 500.

[0065] Since the display module provided by the present invention includes the cover plate of the above-mentioned technical solution, the display module provided by the present invention has all the beneficial effects of the above-mentioned cover plate, which will not be elaborated here.

[0066] As an alternative implementation method, such as Figure 7 and Figure 8 As shown, the orthographic projection of the light-shielding area 112 onto the panel layer 500 covers the edge of the panel layer 500.

[0067] In this embodiment, by making the light-shielding area 112 and the orthographic projection on the panel layer 500 cover the edge of the panel layer 500, the second ink area 220 of the light-shielding area 112 can block related structures at the edge of the panel layer 500, such as ICs (integrated circuits) located at the edge of the panel layer 500.

[0068] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0069] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0070] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0071] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0072] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0073] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A cover plate, characterized in that, The cover plate includes: The cover plate body includes a first surface corresponding to the panel layer, and a side surface connected to the first surface and set at an angle to the first surface. The first surface includes a light-transmitting area and a light-shielding area surrounding the light-transmitting area. An ink layer covering the side surface and the light-shielding area; Wherein, the edge of the cover plate body is curved, the edge of the second surface of the cover plate body opposite to the first surface is curved, and the curved part of the edge of the second surface forms the side surface; or, the end surface of the cover plate body connected to the first surface is set at an angle to the first surface, and the end surface forms the side surface. The ink layer includes a first ink area covering the side surface, the thickness of the first ink area being 10 μm to 22.5 μm; the orthographic projection height of the first ink area on the side surface being 0.476 mm to 0.552 mm; the first ink area is used to adhere to the middle frame.

2. The cover plate as described in claim 1, characterized in that, The light-shielding area is curved toward the panel layer relative to the light-transmitting area. The light-shielding area includes a flat part, a curved part, and an end part connected in sequence. The curved part and the side part are located on opposite sides of the cover plate body, respectively.

3. The cover plate as described in claim 1, characterized in that, The side surface where it connects to the light-shielding area is provided with a chamfer or rounded corner, and the ink layer covers the chamfer or rounded corner.

4. The cover plate as described in claim 1, characterized in that, The first ink area is formed on the side surface using a spray coating process and a pad printing process.

5. A method for preparing a cover plate as described in any one of claims 1 to 4, characterized in that, The preparation method includes the following steps: Provide the cover plate body; Ink is sprayed onto the sides and light-shielding areas of the cover plate body; Ink is applied to the side of the cover plate body; The cover plate body is baked under baking conditions.

6. The preparation method according to claim 5, characterized in that, Before or after the ink spraying step on the sides and light-shielding areas of the cover plate body, the preparation method further includes the following steps: Ink is sprayed onto the light-shielding area of ​​the cover plate body.

7. A display module, characterized in that, The display module includes a panel layer and a polarizing layer, an optical adhesive layer, and a cover plate as described in any one of claims 1 to 4, which are sequentially disposed on the display side of the panel layer.

8. The display module as described in claim 7, characterized in that, The orthographic projection of the light-shielding area onto the panel layer covers the edge of the panel layer.

Images