Display device

Abstract

A display device includes a display panel, a protective cover member disposed on the display panel, a first plate disposed below the display panel, a buffer plate disposed below the first plate, a connection path formed below the first plate, the connection path being spaced apart from the buffer plate by a predetermined distance to form a recess portion between the connection path and the buffer plate, and an anti-static member disposed on a rear surface of the cover member, the anti-static member extending on side surfaces of the display panel and the first plate and extending on side surfaces and a bottom of the connection path to the recess portion, the anti-static member being configured to transfer electrostatic charges from the cover member to the buffer plate.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0172547, filed on December 6, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to display devices. Background Technology

[0004] Display devices include televisions, monitors, smartphones, tablets, laptops, etc. Furthermore, liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs) are currently used as display devices. LCD devices include a display panel with liquid crystals to display images, while OLED devices include a display panel with self-emissive elements. Therefore, LCD devices require a backlight unit that emits light from a rear surface. However, the backlight unit increases the thickness of the LCD device and limits the types of display devices that can be used.

[0005] In contrast, OLED devices include self-emissive elements, allowing them to be made thinner than LCD devices. OLED devices can also be provided as flexible displays. Furthermore, the self-emissive elements of an OLED device are driven by applying voltage or current to a circuit that includes transistors, capacitors, and other components. Therefore, if external charges are introduced into the display panel, the OLED device may malfunction.

[0006] Furthermore, display devices typically include a protective cover member made of glass or plastic to protect the display panel from external impacts. However, for example, static charge often forms and accumulates on the cover member due to friction between the cover member and the user. Therefore, a strong electric field can be generated in response to the accumulated static charge. For example, static charge accumulates in the end or side regions of the display panel, generating a corresponding strong electric field on the sides of the display panel. However, the generated electric field can alter the threshold voltage of the driving thin-film transistors arranged on the sides of the display panel.

[0007] When the threshold voltage of the driving thin-film transistors is increased, the display panel emits light using a higher voltage, resulting in a brightening and greenish tint. Conversely, if the threshold voltage of the driving thin-film transistors located on the side regions of the display panel is decreased, the display panel emits light using a signal lower than the emission signal. Even without an emission signal, this lower signal causes light to be emitted from the edge or side regions of the display panel. Therefore, light is emitted from the edge or side regions when other areas are not emitting light. Summary of the Invention

[0008] Therefore, the purpose of this disclosure is to address the above and other issues.

[0009] Another objective of this disclosure is to provide a novel display device that reduces the phenomenon that the edges of the display panel are brighter than other areas of the display panel, and the phenomenon that the edges of the display panel are greener than other areas of the display panel.

[0010] To achieve at least one of these and other advantages, and in accordance with the purposes of the invention, as implemented and broadly described herein, this disclosure provides, in one aspect, a display device comprising: a display panel for displaying images; a cover member disposed on the display panel and protecting the display panel from external impacts; a buffer plate disposed below the display panel and including a buffer layer and a heat dissipation layer; and an antistatic member extending from the cover member toward the buffer plate. Furthermore, the buffer plate may include a recess thereon on which the antistatic member is provided and a connection path.

[0011] The display device may further include a first connecting member connecting the display panel and the cover member, and an anti-static member is sequentially disposed on the rear surface of the cover member, the side of the first connecting member, the side of the display panel, the side of the buffer plate, and the rear surface of the buffer plate.

[0012] According to one embodiment of the display device disclosed herein, an antistatic component extends from a cover component to a display panel and then to a recessed portion of a buffer plate. Charges or electric fields accumulated in the cover component and display panel can be distributed to the buffer plate, thereby reducing brightening or greening phenomena at the ends. Furthermore, by forming a recessed portion and connection path in the buffer plate, defects that occur when the antistatic component penetrates into other parts can be prevented.

[0013] The further scope of the applicability of the invention will become apparent from the detailed description given below. However, since various variations and modifications within the spirit and scope of the invention will be apparent to those skilled in the art based on the detailed description, the detailed description and specific examples indicating preferred embodiments of the invention are given by way of example only. Attached Figure Description

[0014] The invention will be more fully understood from the following detailed description and accompanying drawings, which are given by way of illustration only and are therefore not intended to limit the invention, and in the drawings:

[0015] Figure 1A This is a plan view showing the front surface of a display device according to an embodiment of the present disclosure.

[0016] Figure 1B This is a plan view showing the rear surface of a display device according to an embodiment of the present disclosure.

[0017] Figure 1C This is a plan view showing the rear surface of an antistatic component according to an embodiment of the present disclosure.

[0018] Figure 2 It is along Figure 1A The cross-sectional view taken from line I-I'.

[0019] Figure 3 It is along Figure 1C The cross-sectional view taken from line II-II'.

[0020] Figure 4 It is along Figure 1C The cross-sectional view taken from line III-III'.

[0021] Figure 5A yes Figure 1C An enlarged plan view of region "A".

[0022] Figure 5B This is an enlarged perspective view showing a connection path according to another embodiment of the present disclosure.

[0023] Figure 5C This is an enlarged perspective view showing a connection path according to another embodiment of the present disclosure.

[0024] Figure 5D It is along Figure 5C The cross-sectional view taken from line III-III'. Detailed Implementation

[0025] The details confirming this disclosure will become clearer from the following detailed description using the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, and may be implemented in a variety of different forms. These embodiments are provided so that this disclosure may be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art, and the claims are not limited to the embodiments of this disclosure.

[0026] This disclosure is not limited to the accompanying drawings, as the shapes, dimensions, scales, angles, counts, etc., presented in the drawings are examples describing embodiments. Similar reference numerals throughout the disclosure denote similar elements. Unless explicitly stated otherwise, components are to be interpreted as including a range of tolerances. In describing positions, for example, when using terms such as "in," "on," "below," "near," etc., to describe the positional relationship between two parts, one or more intermediate parts may be provided between the two parts, unless these terms are used with the terms "immediately adjacent" or "directly." When one element or layer is disposed on another element or layer, another element or layer may be disposed directly on or between that other element or layer.

[0027] Although terms such as "first" or "second" are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from other components. Therefore, a first component mentioned in the following description may be a second component in the technical concept of this disclosure.

[0028] Similar reference numerals denote similar elements throughout this disclosure. Dimensions and thicknesses in the accompanying drawings have been chosen for convenience in describing the specification. Therefore, this disclosure is not limited to the dimensions and thicknesses shown in the drawings.

[0029] The features of this disclosure can be connected or combined with each other in whole or in part, and can be technically interlocked and operated in various ways, as will be fully understood by those skilled in the art, and can be implemented independently or in conjunction with each other. The display device of this disclosure can be applied to organic light-emitting display devices, but is not limited thereto, and can also be applied to various display devices, such as LED display devices or quantum dot display devices.

[0030] In the following, a display device according to embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In particular, Figure 1A and Figure 1B This is a plan view showing the front and rear surfaces of the display device 10.

[0031] In particular, Figure 1A The front surface of the display device 10 is shown, which includes: a protective cover member 20; a display panel 100, which includes a front portion (FP); and an effective area (AA). Figure 1B The rear surface of the display device 10 is shown, which includes a buffer plate 300, a pad portion (PAD), a driver 160, and a flexible printed circuit board 500.

[0032] Furthermore, the display panel 100 is attached below the protective cover member 20 (in the -Z direction), and the buffer plate 300 is disposed below the front portion (FP) of the display panel 100. More specifically, the cover member 20 covers and protects the front surface of the display panel 100 from external impacts. The cover member 20 may be formed of cover glass, tempered glass, reinforced plastic, etc., but is not limited to these. The edges of the cover member 20 may also have curved surfaces that curve in the rearward direction (in the -Z direction) of the display device 10.

[0033] Furthermore, the cover member 20 can also be configured to cover and protect the side areas of the display panel 100 from external impacts. The cover member 20 can be formed of a transparent material to overlap with the area displaying the image. For example, the cover member 20 can be formed of transparent glass or transparent plastic that allows images to pass through.

[0034] Furthermore, the front portion (FP) of the display panel 100 includes: a pixel array unit having a plurality of light-emitting elements; a pixel having a driving thin-film transistor; and signal wiring for transmitting driving signals. For example... Figure 1A As shown, the front portion (FP) includes an effective area (AA) for displaying the image, and an ineffective area (NA) formed at the edge surrounding the effective area (AA). The cover member 20 also includes corresponding effective areas (AA) and ineffective areas (NA). For example, the ineffective area (NA) surrounding the effective area (AA) can be a border area.

[0035] Furthermore, in one embodiment, the display panel 100 may include a curved edge that curves from the side of the front portion (FP). For example... Figure 1B As shown, the display panel 100 may also include a flexible printed circuit board 500, a driver 160 for driving pixels, and a pad portion (PAD).

[0036] like Figure 1B As shown, the buffer plate includes a recess 340 and a connection path 350 formed in the buffer plate 300. More specifically, the recess 340 and the connection path 350 can be formed by removing portions of one or more layers forming the buffer plate 300. The connection path 350 can then advantageously be used to guide the subsequently curing antistatic solution to form an antistatic member 700 that prevents the antistatic solution from penetrating into other areas. Figure 1C The groove 340 also advantageously accommodates excess antistatic liquid, allowing the antistatic component 700 to be effectively formed.

[0037] In other words, if the antistatic solution forms in areas other than the edge region of the buffer plate 300, the resistance of the ground tape attached to the buffer plate 300 can increase, leading to a decrease in discharge function. Furthermore, the antistatic solution may be applied to the surface of the buffer plate 300, thereby reducing its appearance quality.

[0038] Next, Figure 1C This is a plan view showing the rear surface of a display device 10 having an antistatic component 700 according to an embodiment of the present disclosure. Specifically, Figure 1C and Figure 1B Similar, but further shown, is an antistatic component 700 disposed in the edge region of the rear surface of the cover member 20 and the buffer plate 300 (see also). Figure 3 ).

[0039] In one embodiment, the antistatic component 700 is formed on three sides of the display device (i.e., the upper side, the left side, and the right side). That is, the antistatic component 700 may be formed in the edge regions of the upper side, the left side, and the right side of the cover member 20 and the buffer plate 300, but the antistatic component 700 may be omitted in the lower end where the pad portion (PAD) is provided.

[0040] More specifically, during the initial cutting process of trimming or cutting the display panel 100, electrostatic charges are generated on the four sides of the display panel 100. The cover member 20 also generates electrostatic charges due to its inherent properties; the electrostatic charges from the cutting process combine with those from the cover member. These accumulated electrostatic charges cause a greening phenomenon at the edges of the display panel 100. However, since the driving thin-film transistors are not formed in the pad portion (PAD), the anti-static member 700 can be omitted from the lower portion of the display panel 100.

[0041] Furthermore, an antistatic solution can be applied to the ends of the buffer plate 300 or the first plate 210 using a dispenser to form an antistatic component 700. More specifically, the antistatic solution can be applied in a dotted manner by applying it at uniform intervals along the edges of the upper side, left side, and right side. However, as described above, the antistatic component 700 can be omitted on the underside where the pad portion (PAD) is provided. Additionally, the application of antistatic solution at the corners of the display device 10 can also be omitted. Alternatively, the applied antistatic solution can be allowed to air dry to form the antistatic component 700.

[0042] Furthermore, to control the flow of the antistatic solution, it is preferable to apply a sufficient amount of antistatic solution, and any excess antistatic solution should flow into the recess 340 through the connection path 350. Therefore, the antistatic member 700 can be effectively formed in the connection path 350 and the recess 340. Moreover, the antistatic member 700 disposed in the connection path 350 can electrically connect the cover member 20 to the heat dissipation layer 310. In other words, the antistatic member 700 is connected to the cover member 20 via the connection path 350.

[0043] Furthermore, if the amount of antistatic solution supplied is adequate or insufficient, no excess solution will flow into the groove 340. In this case, the antistatic component 700 will not be formed in the groove 340.

[0044] Furthermore, the electrostatic charge or electric field formed in the cover member 20 is transferred along the antistatic member 700 to the heat dissipation layer 310 of the buffer plate 300. Additionally, if the antistatic member 700 is connected to ground via a grounding path, the charge in the cover member 20 can be discharged to the outside through the ground.

[0045] Next, Figure 2 It is along Figure 1A The cross-sectional view taken from line I-I'. (Refer to...) Figure 2 The display panel 100 is disposed below the cover member 20, and the first connecting member 150 is disposed between the cover member 20 and the display panel 100 and couples the cover member 20 and the display panel 100. Furthermore, because the first connecting member 150 overlaps with the effective area (AA), the first connecting member 150 is made of a material that can transmit images. For example, the first connecting member 150 can be formed of optically transparent adhesive (OCA), optically transparent resin (OCR), pressure-sensitive adhesive (PSA), etc.

[0046] like Figure 2 As shown, light-blocking units 21 may also be disposed below the cover member 20 in the edge region including the inactive area (NA). Specifically, the light-blocking units 21 prevent various circuits, wiring, and structures disposed in the inactive area (NA) of the display panel 100 from being visible to the user. That is, the light-blocking units 21 are configured to at least correspond to the inactive area (NA) of the display panel 100 and include a light-absorbing material. Conductive materials (such as black matrix) or conductive black ink can also be used to form the light-blocking units 21.

[0047] also, Figure 2The display panel 100 includes a front portion (FP), a curved portion (BND), and a pad portion (PAD). As shown, the front portion (FP) of the display panel 100 is located below the first connecting member 150 and is the area for displaying images. Furthermore, the display panel 100 includes a display substrate 110, a pixel array unit 120, an encapsulation layer 130, and an optical plate 140.

[0048] Furthermore, the curved portion (BND) of the display panel 100 extends from the side of the front portion (FP) and bends in the bottom direction (-Z direction), and then bends again in the planar direction (Y direction). The display substrate 110 and signal wiring can also be arranged in the curved portion (BND).

[0049] Furthermore, the pad portion (PAD) of the display panel 100 extends from the curved portion (BND) and is positioned below the front portion (FP). For example... Figure 2 As shown, the display substrate 110, signal wiring, and pad electrodes connected to the signal wiring are disposed in the pad portion (PAD). The flexible printed circuit board 500 and the pixel driver 160 are also mounted in the pad portion (PAD).

[0050] Furthermore, the optical plate 140 is disposed in the front portion (FP). A functional optical layer may also be disposed between the first connecting member 150 and the optical plate 140 to improve display performance. The optical plate 140 can also improve outdoor visibility and display image contrast by preventing reflection of external light.

[0051] like Figure 2 As shown, the display substrate 110 is disposed at the bottom of the display panel 100. Specifically, as shown, the display substrate 110 is disposed on the front portion (FP), the bent portion (BND), and the pad portion (PAD). For example, the display substrate 110 is also formed of a flexible plastic material including polyimide or thin flexible glass material.

[0052] like Figure 2 As shown, the pixel array unit 120 is disposed in the effective region (AA) below the optical plate 140. Therefore, the region corresponding to the pixel array unit 120 can be the effective region (AA), and the remaining region other than the effective region (AA) can be the ineffective region (NA).

[0053] Furthermore, the pixel array unit 120 includes a light-emitting element, a driving thin-film transistor for driving the light-emitting element, gate lines and data lines, and signal wiring (such as power lines for driving the pixels). The pixel array unit 120 also includes pixels that display an image based on signals supplied to the signal wiring; each pixel includes a light-emitting element and a driving thin-film transistor. The light-emitting element also includes an anode electrode electrically connected to a corresponding driving thin-film transistor, an emitter layer formed in the anode electrode, and a cathode electrode supplying a common voltage.

[0054] Furthermore, the driving thin-film transistor includes a gate electrode, a semiconductor layer, a source electrode, a drain electrode, etc. The semiconductor layer of the driving thin-film transistor may include silicon (such as a-Si, poly-Si, low-temperature poly-Si, etc.) or oxides (such as indium gallium zinc oxide (IGZO), but is not limited to these).

[0055] Furthermore, an anode electrode is disposed in each pixel region corresponding to the opening region of the pixel pattern and is electrically connected to the corresponding driving thin-film transistor. The light-emitting element also includes an emitter layer formed between the anode electrode and the cathode electrode. In particular, the emitter layer is configured to emit light in the same color (such as white light for each pixel) or in different colors (such as red, green, or blue light for each pixel).

[0056] In addition, such as Figure 2 As shown, the encapsulation layer 130 covers the pixel array unit 120 to prevent oxygen, moisture, or other foreign matter from penetrating into the light-emitting element layer of the pixel array unit 120. The encapsulation layer 130 may also be a stacked structure, which includes alternating layers of organic and inorganic materials.

[0057] Furthermore, the front portion (FP) of the display panel 100 includes a display substrate 110, a pixel array unit 120, and an encapsulation layer 130, and is formed as a plane except for its edges. Therefore, the first plate 210 is connected or bonded to the front portion (FP) to maintain its planar state and improve rigidity. In addition, the curved portion (BND) of the display panel 100 includes areas where the pixel array unit 120, the encapsulation layer 130, and the first plate 210 are not disposed.

[0058] like Figure 2 As shown, the pad portion (PAD) includes an area where the pixel array unit 120 and encapsulation layer 130 are not disposed. The pad portion (PAD) is also connected or coupled to the second plate 220 to maintain a planar state and improve rigidity. In other words, before the display panel 100 is bent, the first plate 210 disposed below the front portion (FP) and the second plate 220 disposed at the lower portion of the pad portion (PAD) are coupled to the lower portion of the display substrate 110 to enhance the rigidity of the display substrate 110 and maintain the planar state of the front portion (FP).

[0059] Furthermore, the first plate 210 and the second plate 220 may also be formed to have a certain rigidity and thickness to enhance the rigidity of the display substrate 110, and are not formed in the area of ​​the bent portion (BND). Before the display panel 100 is bent, the first plate 210 and the second plate 220 are disposed below the display substrate 110 and spaced apart from each other.

[0060] Furthermore, after the display panel 100 is bent, and as... Figure 2 As shown, the first plate 210 is disposed below the front portion (FP), and the second plate 220 is disposed above the pad portion (PAD). Therefore, the first plate 210 and the second plate 220 are back plates disposed on the rear surface of the display substrate 110. The first plate 210 and the second plate 220 may also be formed of a rigid thin-film plastic. For example, the first plate 210 and the second plate 220 may be formed of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), etc. For example, the first plate 210 and the second plate 220 may also be formed of the same material having the same thickness.

[0061] In addition, such as Figure 2 As shown, a buffer plate 300 is disposed between a first plate 210 and a second plate 220. In particular, for example, the buffer plate 300 may be formed of multiple layers or a single layer having buffering and heat dissipation functions.

[0062] That is, the buffer plate 300 may include one or more of the following layers: a heat dissipation layer 310, a buffer layer 320, and an adhesive layer 330. For example, as Figure 2 As shown, the buffer plate 300 may include an adhesive layer 330, a buffer layer 320, and a heat dissipation layer 310 stacked sequentially from top to bottom in the -Z direction.

[0063] Furthermore, the heat dissipation layer 310 is configured to correspond to components that generate high temperatures and includes a material with high thermal conductivity. For example, heat generated in the driver 160 or display panel 100 can be dissipated by the heat dissipation layer 310. Additionally, the heat dissipation layer 310 may include, for example, a metal with high thermal conductivity (such as copper (Cu) and aluminum (Al)) or graphite. Furthermore, the heat dissipation layer 310 is conductive, thus allowing it to be grounded and protecting the rear surface of the display substrate 110 while dissipating heat.

[0064] In addition, an anti-lifting layer may be additionally provided between the heat dissipation layer 310 and the buffer layer 320. The anti-lifting layer may be formed of a flexible material (such as a polyimide film) and is configured to prevent the buffer plate 300 from being lifted when the side of the cover member 20 is bent.

[0065] In addition, such as Figure 2 As shown, for example, a buffer layer 320 is disposed on the heat dissipation layer 310 and may include a cushioning material (such as foam strips or foam pads). Therefore, the buffer layer 320 absorbs impacts applied to the various portions that come into contact with the buffer plate 300. The buffer layer 320, with its impact-absorbing function, also enhances the rigidity of the buffer plate 300.

[0066] Furthermore, as shown, the adhesive layer 330 is disposed on the buffer layer 320 and may include a non-uniform structure formed on its surface. Specifically, the non-uniform structure of the adhesive layer 330 prevents air bubbles from forming between the first plate 210 and the buffer plate 300, which may occur when the buffer plate 300 is attached to the first plate 210. Therefore, the process of removing air bubbles existing between the first plate 210 and the buffer plate 300 can be omitted. Furthermore, the adhesive layer 330 secures the buffer plate 300 to the first plate 210.

[0067] Furthermore, the second connecting member 400 and the second plate 220 are disposed between the buffer plate 300 and the pad portion (PAD), or between the buffer plate 300 and the second plate 220. Additionally, the second connecting member 400 secures the curved display panel 100 in a bent form because it is connected to the curved display substrate 110 via the second plate 220. The second connecting member 400 also has a certain thickness, thus maintaining the curvature of the bent portion (BND). Furthermore, the second connecting member 400 can be a double-sided adhesive tape securing the second plate 220 and the heat dissipation layer 310. For example, the second connecting member 400 may include an adhesive foam tape or an adhesive foam pad, thereby further improving its shock absorption function.

[0068] Furthermore, the second plate 220 is disposed below the second connecting member 400. In order to fix the second plate 220 below the second connecting member 400, the second plate 220 may be connected to or attached to the lower part of the pad portion (PAD) of the display panel 100, and by bending the bent portion (BND), the second plate 220 may be attached to or fixed to the bottom of the second connecting member 400.

[0069] When the second plate 220 is fixed to the second connecting member 400, the second plate 220 is disposed on the pad portion (PAD). In other words, the second connecting member 400 and the second plate 220 are disposed between the heat dissipation layer 310 of the buffer plate 300 and the pad portion (PAD).

[0070] Furthermore, when the second plate 220 is fixed to the second connecting member 400, the outer top surface of the bending member (BND) is exposed to the outside. Additionally, the rear inner surface of the bending member (BND) faces the side of the buffer plate 300 and the second connecting member 400.

[0071] like Figure 2 As shown, a reinforcing member 600 is disposed on the top outer surface of the curved portion (BND) of the display panel 100. In particular, the reinforcing member 600 covers the curved portion (BND) and extends to cover at least a portion of the front portion (FP) and the pad portion (PAD).

[0072] Furthermore, the reinforcing member 600 may include a resin (such as a UV-cured acrylic resin or a thermosetting resin). Various other materials may also be used as the reinforcing member 600. Additionally, the reinforcing member 600 may include a cured resin. For example, when using a UV-cured resin, the resin can be cured using UV light irradiation. For example, the reinforcing member 600 may also be a micro-coverage layer (MCL). Furthermore, the reinforcing member 600 also covers various signal wirings disposed between the encapsulation layer 130 and the pad portion (PAD), thereby preventing moisture penetration of the signal wirings and protecting them from external impacts.

[0073] like Figure 2 As shown, the bent portion (BND) includes a flexible display substrate 110 without any other components. Therefore, the reinforcing member 600 strengthens the rigidity of the bent portion (BND). Furthermore, the bent portion (BND) is disposed between the front portion (FP) and the pad portion (PAD) and is bent so that the front portion (FP) and the pad portion (PAD) are connected.

[0074] In addition, such as Figure 2 As shown, the pad portion (PAD) is located below the front portion (FP). Furthermore, since the second connecting member 400, the second plate 220, and the pad portion (PAD) are located at the lower portion of the display panel where the bent portion (BND) is provided, the anti-static member 700 can be omitted in this area. That is, it is preferable that the anti-static member 700 is provided continuously from the rear surface of the cover member 20 to the buffer plate. However, the bent portion (BND) blocks the direct path between the cover member 20 and the buffer plate 300, causing the anti-static member 700 to be interrupted and not provided continuously. Furthermore, the lower end of the display panel 100 including the pad portion (PAD) does not include the transistors of the display panel 100, therefore the application of the anti-static member 700 can be omitted.

[0075] Therefore, the antistatic component 700 is formed along the edges of the three sides of the cover component 20, but not at the lower end of the display panel 100 where the pad portion (PAD) is provided. Therefore, the connecting path 350 and the recessed portion 340 are provided along the edges of the three sides where the pad portion (PAD) is not provided. That is, the connecting path 350 and the recessed portion 340 are sequentially provided along the three sides of the buffer plate 300.

[0076] Furthermore, in one embodiment, the connection path 350 is not formed at the corner of the buffer plate 300. More specifically, the connection path 350 is formed by removing some areas of the adhesive layer 330, so the strength of the connection path 350 fixed to the first plate 210 may be weak. Therefore, by not forming the connection path 350 at the corner, the heat dissipation layer 310 is fixed to the first plate 210 by the adhesive layer 330.

[0077] Next, Figure 3 It is along Figure 1C A cross-sectional view taken from line II-II'. Specifically, Figure 3 The top, left, and right sides of the display device are shown. The display device includes a cover member 20, a display panel 100, and a buffer plate 300. As shown, a first connecting member 150 is disposed between the cover member 20 and the display panel 100, and a first plate 210 is disposed between the display panel 100 and the buffer plate 300.

[0078] Furthermore, as described above, the edge region of the buffer plate 300 corresponds to the inactive region (NA) of the display panel 100. Therefore, the recess 340 and the connecting path 350 can be advantageously configured to overlap with the inactive region (NA).

[0079] As shown, the recess 340 penetrates the buffer plate 300 in a vertical direction toward the display panel 100. As described above, the buffer plate 300 may include one or more layers, including a heat dissipation layer 310, a buffer layer 320, an adhesive layer 330, and an anti-lifting layer. Therefore, in one embodiment, the recess 340 may penetrate all the layers of the buffer plate 300, and in another embodiment, the recess 340 may penetrate two of the three layers of the buffer plate 300.

[0080] Furthermore, as shown, the connection path 350 is formed by stacking a heat dissipation layer 310 in the penetrating area. Furthermore, as... Figure 3 As shown, the recess 340 is the area where portions of the heat dissipation layer 310, the buffer layer 320, and the adhesive layer 330 are removed. Furthermore, the connection path 350 is positioned adjacent to the recess 340.

[0081] Furthermore, the recess 340 and the connection path 350 can be formed in various ways. For example, the recess 340 can be formed by removing some areas of the heat dissipation layer 310 and the buffer layer 320, or by removing some areas of the heat dissipation layer 310, the buffer layer 320, and the adhesive layer 330. The connection path 350 can be formed by removing some areas of the buffer layer 320, or some areas of the buffer layer 320 and the adhesive layer 330, and stacking or placing the heat dissipation layer 310 in the removed areas.

[0082] That is, Figure 3 One embodiment is shown in which all three layers of the buffer plate 300 are removed to form the recess 340 and the connection path 350. However, in another embodiment, only the heat dissipation layer 310 and the buffer layer 320 may be removed, and the recess 340 will have a depth equal to the thickness of the buffer layer 320 and the adhesive layer 330. The connection path 350 will have a similar thickness (i.e., a thickness corresponding to both the buffer layer 320 and the adhesive layer 330). Therefore, in an alternative embodiment, the recess 340 will be deeper to allow more excess antistatic solution. In another embodiment, the recess 340 may be formed by removing only a portion of the heat dissipation layer 310. The connection path 350 will then correspond to the unremoved portion of the heat dissipation layer 310.

[0083] like Figure 3 As shown in the embodiment, the bottom of the recess 340 is the first plate 210. If the recess 340 is disposed in the buffer layer 320 (e.g., by removing only the heat dissipation layer 310 and the buffer layer 320), the bottom of the recess 340 will be the adhesive layer 330. Similarly, if the recess 340 is disposed in the heat dissipation layer 310 (e.g., by removing only the heat dissipation layer 310), the bottom of the recess 340 will be the buffer layer 320. Furthermore, the sides of the recess 340 include one or more of the removed heat dissipation layer 310, the buffer layer 320, the adhesive layer 330, and portions of the anti-lift layer.

[0084] also, Figure 3 The width of the connection path 350 is shown to be greater than the width of the groove 340. However, in an alternative embodiment, the width of the groove 340 may be greater than the width of the connection path 350. The larger width of the groove 340 advantageously allows more antistatic material 700 to be filled into the groove 340, thus preventing overfilled antistatic material 700 from reaching or overflowing onto the sides or bottom surface of the buffer plate 300.

[0085] Next, Figure 4 It is along Figure 1C The cross-sectional view taken from line III-III'. Specifically, Figure 4 This is a cross-sectional view showing the connection path 350 of the buffer plate 300. As shown, the connection path 350 is formed by stacking the heat dissipation layer 310 in the area where one or more of the buffer layer 320, adhesive layer 330, and anti-lift layer are removed. Furthermore, the bottom and sides of the connection path 350 correspond to the heat dissipation layer 310.

[0086] like Figure 4As shown, the connection path 350 is a groove path that guides the antistatic solution from the first plate 210 to the groove portion 340, and is formed in other areas below the buffer plate 300. Furthermore, the connection path 350 transfers the charge and electric field of the cover member 20 to the heat dissipation layer 310.

[0087] As described above, the recess 340 and the connection path 350 can be formed by removing layers of the buffer plate 300, thereby simplifying the manufacturing process. For example, in the area where the recess 340 and the connection path 350 are located and overlap, the recess 340 and the connection path 350 can be formed by removing one or more of the buffer layer 320, the adhesive layer 330, and the anti-lifting layer, and forming a heat dissipation layer 310 in the remaining area excluding the recess 340.

[0088] Next, Figure 5A yes Figure 1C An enlarged plan view of region "A". (Refer to...) Figure 5A The recess 340 and the connection path 350 are formed by removing one or more of the buffer layer 320, the adhesive layer 330, and the anti-lift layer, and forming a heat dissipation layer 310 in the remaining area excluding the recess 340. Furthermore, the recess of the connection path 350 is formed to connect with the recess 340.

[0089] The lengths of the groove 340 and the connecting path 350 can be adjusted according to the amount of antistatic solution 710 to be applied. If the amount of antistatic solution 710 to be applied is large, a larger amount of antistatic solution 710 can be filled by increasing the length of the groove 340 and the connecting path 350.

[0090] Furthermore, since the recess 340 is positioned closer to the effective area (AA) of the display panel 100, increasing the length of the recess 340 can degrade heat dissipation and shock absorption performance within the effective area (AA). Therefore, by forming a connection path 350 that is longer than the recess 340, heat dissipation and shock absorption performance can be maintained, and the antistatic solution 710 can be effectively prevented from flowing to areas other than the recess 340.

[0091] Furthermore, with a longer connection path 350, the distribution of charge transferred from the cover member 20 is improved. For example, since the connection path 350 is provided along the upper, left, and right sides of the buffer plate 300, and not at the lower end where the pad portion (PAD) is provided, charge mobility is improved. That is, the connection path 350 can be provided entirely along the upper, left, and right sides of the buffer plate 300.

[0092] Furthermore, the antistatic component 700 can be formed using an antistatic coating process, which involves applying an antistatic solution 710 to the side of the display device 10. The antistatic solution 710 includes a conductive material to help transfer charge from the cover component 20 to the heat dissipation layer 310 or the connection path 350. Therefore, the antistatic solution 710 includes a conductive material (such as a conductive polymer compound). For example, the conductive polymer compound may be poly(3,4-ethylenedioxythiophene)polystyrene sulfonate (PEDOT:PSS).

[0093] Furthermore, the thickness of the antistatic component 700 can range from 1 μm to 10 μm. When the thickness of the antistatic component 700 is 1 μm or less, the conductivity of the conductive compound decreases significantly, resulting in less discharge of charge from the antistatic component 700. If the thickness of the antistatic component 700 is 10 μm or greater, the adhesion of the grounding strip decreases due to the greater thickness of the antistatic component 700.

[0094] Furthermore, the conductive materials included in the antistatic solution 710 include, for example, molybdenum (Mo), chromium (Cr), titanium (Ti), neodymium (Nd), copper (Cu), and alloys of silver (Ag) and magnesium (Mg). As shown, the antistatic solution 710 can be applied sequentially along three sides (upper side, left side, and right side) of the display device 10. In particular, the antistatic solution 710 can be applied to the first plate 210, such that the antistatic solution 710 flows from the cover member 20 to the connection path 350.

[0095] For more details, see [link to relevant documentation]. Figure 3 The first plate 210 protrudes further than the connection path 350, so the antistatic solution 710 can be applied to the protruding first plate 210. The applied antistatic solution 710 then flows toward the connection path 350 and forms from the cover member 20 to the connection path 350.

[0096] When the display device 10 is inverted and the cover member 20 is positioned facing the bottom, the applied antistatic solution 710 flows towards the connection path 350 and the cover member 20 due to applied pressure and gravity. The antistatic solution 710 can also be applied to the connection path 350 to form an antistatic member 700. As the amount of antistatic solution 710 flowing into the recess 340 decreases and the amount of antistatic solution 710 flowing into the cover member 20 by gravity increases, the applied pressure decreases compared to when the solution is applied to the first plate 210.

[0097] Furthermore, the antistatic solution 710 flowing through the connection path 350 can fill the recess 340, and the sides of the recess 340 can be formed higher so that the antistatic solution 710 does not overflow. Therefore, the recess 340 includes the boundary for applying the antistatic member 700. Furthermore, as... Figure 3 As shown, for example, the antistatic component 700 does not extend beyond the recess 340.

[0098] More specifically, the antistatic component 700 extends continuously on the sides of the cover component 20, the display panel 100, the buffer plate 300, the connection path 350, and the recess 340. Therefore, the cured antistatic component 700 covers the sides of the components. For example, the antistatic component 700 is formed on the sides of the first connecting member 150 and the first plate 210. If a light-blocking unit 21 is also included, the antistatic component 700 is also formed on the light-blocking unit 21 provided on the cover component 20.

[0099] The following describes a method for manufacturing a buffer plate 300 including a recessed portion 340 and a connecting path 350. In particular, the buffer plate 300 can be formed by stacking a heat dissipation layer 310, a buffer layer 320, and an adhesive layer 330.

[0100] More specifically, the buffer plate 300 can be formed by the following steps: stacking the heat dissipation layer 310 on the buffer layer 320 and the adhesive layer 330 after removing the groove portion 340 and the connection path 350; punching (penetrating or removing) the groove portion 340 using a punching device or a trimming device; bending a portion of the heat dissipation layer 310 containing the connection path 350.

[0101] Alternatively, the buffer plate 300 can be formed by the following steps: stacking a heat dissipation layer 310 on a buffer layer 320 and an adhesive layer 330 with the connection path 350 removed; punching (penetrating or removing) the recess 340 using a punching or trimming device; and bending a portion of the heat dissipation layer 310 containing the connection path 350. The buffer plate 300 with the recess 340 and the connection path 350 formed can be stacked (attached or fixed) on the first plate 210.

[0102] Next, Figure 5B yes Figure 1C An enlarged view of region "A" is shown, and connection path 350 according to another embodiment of this disclosure is illustrated. Figure 5B As shown, the connecting path 350 can be formed in a zigzag or horseshoe shape on a plane (when viewed from the Z-axis). That is, the connecting path 350 may include a protrusion 350a protruding from the base portion 350b of the connecting path 350. For example, the protrusion 350a can be formed by cutting off a portion of the connecting path 350, thus forming the connecting path 350 in a zigzag or horseshoe shape with the base portion 350b and the protrusion portion 350a.

[0103] As the original width (W2) of the connection path 350 narrows, the size of the recess 340 increases. Therefore, the capacity of the recess 340 for storing the antistatic solution 710 also increases, thereby preventing the antistatic solution 710 from overflowing into other areas. Thus, the connection path 350 can have a narrower width (W1), which is, for example, a cut-out portion of the original width (W2) of the connection path 350.

[0104] Furthermore, as the width of the connection path 350 narrows, the strength of the connection path 350 in securing or attaching it weakens, and the connection path 350 may be lifted away from the first plate 210. Therefore, one embodiment of the present invention forms a connection path 350 with a protrusion 350a to more firmly secure the connection path 350 to the first plate 210. Thus, the protrusion 350a protruding from the base portion 350b of the connection path 350 increases the size of the recess portion 340 and also helps to more firmly secure the connection path 350 to the first plate 210.

[0105] Next, Figure 5C This is an enlarged perspective view showing a connection path 350 according to another embodiment of the present disclosure. Figure 5D It is along Figure 5C The cross-sectional view taken from line III-III'. As shown, the connecting path 350 can also be formed with a tapered cross-section (when viewed from the Y-axis). That is, the connecting path 350 can decrease in thickness towards the center of the display device 10.

[0106] Therefore, the tapered connection path 350 has a large surface area to accommodate the applied antistatic solution 710, thereby helping to prevent the antistatic solution 710 from spilling into other areas. Furthermore, the greater the amount of antistatic solution 710 on the tapered connection path 350, the greater the amount of charge transferred from the cover member 20 to the connection path 350.

[0107] This invention includes various modifications to each of the examples and embodiments discussed herein. According to the invention, one or more features described above in one embodiment or example may be equally applicable to another embodiment or example described above. Features of one or more embodiments or examples described above may be combined in each of the embodiments or examples described above. Any combination of all or part of one or more embodiments or examples of the invention is also part of this invention.

[0108] Since the invention can be implemented in several forms without departing from its spirit or essential characteristics, it should also be understood that the above-described embodiments are not limited by any details of the foregoing description, unless otherwise specified, but should be interpreted broadly within the spirit and scope defined in the appended claims. Therefore, all variations and modifications falling within the boundaries and limits of the claims or equivalents of such boundaries and limits are intended to be included in the appended claims.

Claims

1. A display device, comprising: Display panels, including display substrates; A protective cover component is provided on the display panel; A connecting member is disposed on the display panel and below the protective cover member; The first plate is located below the display panel; A buffer plate positioned below the first plate; A connection path is formed below the first plate and spaced at a predetermined distance from the buffer plate to form a groove between the connection path and the buffer plate; as well as An antistatic component is disposed on the rear surface of the protective cover component, extending on the sides of the display panel and the first plate, and extending to the recessed portion on the sides and bottom of the connection path. The antistatic component is configured to transfer electrostatic charge from the protective cover component to the buffer plate. The antistatic components are continuously disposed on the rear surface of the protective cover component, the side surface of the connecting component, the top and side surfaces of the display substrate, the side and bottom of the first plate, and the side and bottom of the connecting path.

2. The display device according to claim 1, wherein, The buffer plate includes: Heat dissipation layer; A buffer layer disposed on the heat dissipation layer; and An adhesive layer is disposed on the cushioning layer and configured to secure the cushioning plate to the first plate. The connection path includes the same heat dissipation material as the heat dissipation layer.

3. The display device according to claim 2, wherein, The antistatic component is also disposed in a groove formed in the space between the adhesive layer and the connection path.

4. The display device according to claim 1, wherein, The display panel also includes: Pixel array units disposed on the display substrate; An encapsulation layer, the encapsulation layer encapsulating the pixel array unit; and An optical plate disposed on the encapsulation layer.

5. The display device according to claim 4, wherein, The display substrate and the first plate protrude outward relative to the connecting member and the buffer plate.

6. The display device according to claim 5, wherein, The antistatic component is also provided on the side of the protruding display substrate and the protruding first plate.

7. The display device according to claim 5, wherein, The protruding display substrate and the protruding first plate protrude a predetermined distance from the connection path.

8. The display device according to claim 2, wherein, The adhesive layer, the groove, and the connection path have the same thickness.

9. The display device according to claim 1, wherein, The connection path has a tapered shape that tapers towards the buffer plate.

10. The display device according to claim 9, wherein, The conical shape guides excess antistatic solution to fill the groove.

11. The display device according to claim 1, further comprising: The pad portion is disposed on the lower end of the display device and includes a display driver and a flexible printed circuit board for driving the display panel. The connection path and the groove are located on the top, left, and right sides of the display device, but not on the bottom of the display device.

12. The display device according to claim 1, wherein, The antistatic component includes a cured antistatic solution, which includes a conductive material.

13. The display device according to claim 1, wherein, The antistatic component is connected to the ground via a grounding path to release the electrostatic charge of the protective cover component to the outside.

14. The display device according to claim 2, wherein, The antistatic component is continuously provided to connect the protective cover component to the heat dissipation layer in the buffer plate, so as to transfer the electrostatic charge from the protective cover component to the heat dissipation layer.

15. The display device according to claim 1, wherein, The width of the groove is greater than the width of the connection path.

16. A display device, comprising: Display panels, including display substrates; A cover component is disposed on the display panel; A connecting member is disposed on the display panel and below the cover member; The first plate is located below the display panel; A buffer plate disposed below the first plate, the buffer plate comprising a heat dissipation layer, a buffer layer and an adhesive layer; A recess and a connection path are formed in the buffer plate, wherein a portion of at least one of the heat dissipation layer, the buffer layer, and the adhesive layer is removed, the recess is located in the removed portion, and the connection path is formed by providing the heat dissipation layer in the remaining area of ​​the removed portion excluding the recess; and An antistatic component is disposed on the rear surface of the cover component, extending on the side of the display panel and extending to the recessed portion on the side and bottom of the connection path. The antistatic component is configured to transfer electrostatic charge from the cover component to the buffer plate. The antistatic components are continuously disposed on the rear surface of the cover component, the side surface of the connecting component, the top and side surfaces of the display substrate, the side and bottom of the first plate, and the side and bottom of the connecting path.

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