Substrate, display panel and manufacturing method

Abstract

Embodiments of the present disclosure provide a substrate, a display panel and a preparation method. The substrate comprises: a color filter layer comprising a plurality of filter units located in a first region of the substrate, the first region comprising an area extending to an outer side edge of the substrate along a first boundary of the substrate, the first boundary being a boundary between the first region and a second region of the substrate, the second region being an area of the substrate other than the first region; wherein the filter units in the first region are sequentially arranged in a direction in which the first boundary points to the outer side edge, a film thickness of a gth filter unit located in the first region being H g , H g ≤ H g+1 , g being a positive integer. Embodiments of the present disclosure can improve the phenomenon of edge lightening failure.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a substrate, a display panel, and a method for manufacturing it. Background Technology

[0002] In AMOLED (Active Matrix Organic Light Emitting Diode) products, polarizers are laminated onto the panel to reduce reflectivity and improve the contrast of the display. Existing AMOLED products use COE (Color On Encapsulation) technology to set the filters. In this process, the CF (Color Filter) layer can effectively export the RGB (red, green, blue) color light excited by the EL (Electroluminescent) device, while the BM (Black Matrix) layer can effectively absorb ambient light, thereby reducing the overall reflectivity of the product.

[0003] However, because the product's TFE (Thin Film Encapsulation) uses IJP (Ink Jet Printing) technology to allow organic materials to flow, diffuse, and ultimately form a film, this film layer has a gentle edge slope at the substrate edge or the edge of the holes in the substrate. During the subsequent COE process on the substrate, the COE material tends to flow towards the lower elevation, resulting in a relatively thinner COE film at the substrate edge, thus causing poor edge gloss. Summary of the Invention

[0004] This disclosure provides a substrate, a display panel, and a manufacturing method to solve or alleviate one or more technical problems in the prior art.

[0005] As a first aspect of the present disclosure, the present disclosure provides a substrate, including:

[0006] A color filter layer includes a plurality of filter units located in a first region of a substrate. The first region includes a region extending along a first boundary of the substrate to the outer edge of the substrate. The first boundary is the boundary between the first region and a second region of the substrate. The second region is the region of the substrate other than the first region.

[0007] In this configuration, the filter units in the first region are sequentially arranged along the direction from the first boundary towards the outer edge, and the film thickness of the g-th filter unit located in the first region is H. g H g ≤Hg+1 g is a positive integer.

[0008] As a second aspect of the present disclosure, an embodiment of the present disclosure provides a substrate, including:

[0009] An organic material layer includes a plurality of beveled openings located in a first region of a substrate, the first region including a region extending along a first boundary of the substrate to an outer edge of the substrate, the first boundary being the boundary between the first region and a second region of the substrate, the second region being the region of the substrate other than the first region;

[0010] A pixel defining layer, located below the organic material layer, includes a plurality of pixel openings located in the first region;

[0011] In this region, the beveled openings and pixel openings are sequentially arranged in the direction from the first boundary towards the outer edge. The orthographic projection of the h-th beveled opening in the first region onto the substrate at least covers the side of the orthographic projection of the h-th pixel opening away from the outer edge on the substrate. The orthographic projection distance between the boundary of the h-th beveled opening away from the outer edge and the boundary of the h-th pixel opening away from the outer edge on the substrate is D. h D h ≤D h+1 h is a positive integer.

[0012] As a third aspect of the present disclosure, the present disclosure provides a display panel that includes any of the substrates described in the present disclosure embodiments.

[0013] As a fourth aspect of this disclosure, this disclosure provides a preparation method, comprising:

[0014] A color filter layer is formed on a substrate, wherein the color filter layer includes a plurality of filter units located in a first region of the substrate, the first region including a region extending along a first boundary of the substrate to the outer edge of the substrate, the first boundary being the boundary between the first region and a second region of the substrate, the second region being the region other than the first region.

[0015] As a fifth aspect of the present disclosure, the present disclosure provides a preparation method, comprising:

[0016] A pixel defining layer is formed on a substrate, wherein the pixel defining layer includes a plurality of pixel openings located in a first region of the substrate, the first region including a region extending along a first boundary of the substrate to the outer edge of the substrate, the first boundary being the boundary between the first region and a second region of the substrate, the second region being a region other than the first region;

[0017] An organic material layer is formed above the pixel defining layer, wherein the organic material layer is located at multiple beveled openings in the first region;

[0018] In this region, the beveled openings and pixel openings are sequentially arranged in the direction from the first boundary towards the outer edge. The orthographic projection of the h-th beveled opening in the first region onto the substrate at least covers the side of the orthographic projection of the h-th pixel opening away from the outer edge on the substrate. The orthographic projection distance between the boundary of the h-th beveled opening away from the outer edge and the boundary of the h-th pixel opening away from the outer edge on the substrate is D. h D h ≤D h+1 h is a positive integer.

[0019] The technical solution provided in this disclosure is that each filter unit of each pixel unit on the corresponding substrate in the color filter film gradually thickens from the bright position on the substrate to the outer edge, thereby improving the filtering effect of the edge area, reducing the luminous intensity of the edge area, and improving the problem of poor edge brightness.

[0020] The above overview is for illustrative purposes only and is not intended to be limiting in any way. Further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description, in addition to the illustrative aspects, embodiments, and features described above. Attached Figure Description

[0021] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this disclosure and should not be construed as limiting the scope of this disclosure.

[0022] Figure 1 This is a plan view of a substrate according to an embodiment of the present disclosure;

[0023] Figure 2 This is a cross-sectional view of a substrate according to an embodiment of the present disclosure;

[0024] Figure 3 This is a plan view of a substrate according to another embodiment of the present disclosure;

[0025] Figure 4 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure;

[0026] Figure 5 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure;

[0027] Figure 6 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure;

[0028] Figure 7 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure;

[0029] Figure 8 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure;

[0030] Figure 9 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure;

[0031] Figure 10 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure;

[0032] Figure 11 This is a flowchart of a preparation method according to an embodiment of the present disclosure;

[0033] Figure 12 This is a flowchart of a preparation method according to an embodiment of the present disclosure;

[0034] Figure 13 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure. Detailed Implementation

[0035] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure. Therefore, the drawings and description are to be considered exemplary in nature and not restrictive.

[0036] Figure 1 This is a plan view of a substrate according to an embodiment of the present disclosure. Figure 2 This is a cross-sectional view of a substrate according to an embodiment of the present disclosure.

[0037] like Figure 1As shown, the substrate 100 includes a first region 210 and a second region 220. The first region 210 includes a region extending along a first boundary 230 of the substrate 100 to the outer edge 240 of the substrate 100. The first boundary 230 is the boundary between the first region 210 and the second region 220. The second region 220 includes the region of the substrate 100 other than the first region 210. The outer edge 240 may include the outer edges of the substrate 100 and the outer edges of the vias. The first boundary 230 may be a boundary line that includes the illuminated area of ​​the substrate 100 and is parallel to the outer edge. The first region 210 may be a bent area of ​​the substrate 100, and the second region 220 may be a non-bent area of ​​the substrate 100. The first boundary 230 may be the boundary line between the bent area and the non-bent area on the substrate 100, i.e., a bending boundary.

[0038] like Figure 2 As shown, the substrate 100 includes a color filter layer 180 and a pixel defining layer 130. The color filter layer 180 includes a plurality of filter units 181 located in a first region 210 of the substrate 100. The pixel defining layer 130 is located below the color filter layer 180 and includes a plurality of pixel openings located in the first region 210.

[0039] The orthographic projections of each filter unit 181 in the color filter layer 180 onto the substrate 100 and the orthographic projections of their respective pixel openings 131 in the pixel defining layer 130 onto the substrate 100 have at least a partial overlap. For example, Figure 2 The orthographic projection of the first filter unit 181 on the left side of the image onto the substrate 100 covers the orthographic projection of the first pixel opening 131 on the left side onto the substrate 100.

[0040] Each pixel opening 131 is used to deposit corresponding pixel material to form a corresponding light-emitting pixel unit. For example, Figure 2 The pixel anode 132 (AND, Ancode) formed in the pixel opening 131 is shown. Light from each light-emitting pixel unit is emitted from its corresponding light-transmitting opening 111. Below the pixel defining layer 130, there may be a thin-film transistor 140, which can control the light emission of the corresponding light-emitting pixel unit.

[0041] The filter units 181 in the first region 210 are sequentially arranged along the direction from the first boundary 230 to the outer edge 240, and the film thickness of the g-th filter unit 181 in the first region 210 is H. g H g ≤H g+1 g is a positive integer. Figure 2 H in g For illustrative purposes only, it is represented as H1 to H. n In any one of them, n is a positive integer.

[0042] For example, H g ≤H g+1 This can be represented as: H1≤H2≤···≤H n-1 ≤H n .

[0043] In some embodiments, H g It is an arithmetic sequence function or a piecewise arithmetic sequence function with g as the independent variable.

[0044] Due to limitations in actual manufacturing processes, H g The thickness variation is not necessarily a precise arithmetic sequence or a piecewise arithmetic sequence. It should be understood that, for example, for the first region 210, if the error between the thickness differences of any two adjacent filter units 181 is within a set error range, the thickness of the filter units 181 in the first region 210 is still considered to be an arithmetic sequence. For example, this error range can be greater than or equal to 0.01 μm.

[0045] In some technologies, a COE structure is introduced into AMOLED products. The color filter layer in the COE structure can effectively extract the RGB color light excited by the EL device. However, in the COE manufacturing process, the COE film thickness is relatively thinner in the edge area of ​​the panel. Correspondingly, the color filter layer is also thinner, resulting in poor brightness in the edge area.

[0046] According to the above example, each filter unit 181 corresponding to each light-emitting pixel unit on the substrate 100 continuously thickens from the first boundary 230 on the substrate 100 to the outer edge 240. Thus, in the edge region on the substrate, the color filter layer will not be thinned due to the COE process, which can effectively improve the filtering effect of the edge region, reduce the light emission level of the edge region, and improve the problem of poor edge brightness.

[0047] In practical applications, the scheme of continuously thickening the filter unit 181 from the first boundary to the outer edge 240 in the first region 210 includes, in addition to, Figure 2 In addition to the embodiments described herein, the embodiments may also include a configuration where each filter unit 181 protrudes upwards, and the lower surface of the color filter layer 180 is flush with or protrudes downwards from each filter unit 181. Figure 2 An embodiment is shown in which the upper surface of the color filter is made flush by a coating process and the inorganic film layer 120 below the filter unit is etched by an etching process, thereby causing each filter unit 181 in the lower surface to bulge downward.

[0048] Figure 3 This is a cross-sectional view of a substrate 100 according to another embodiment of the present disclosure.

[0049] like Figure 3As shown, this embodiment of the disclosure provides a substrate 100, including a black matrix layer 110 and a touch sensing layer ( Figure 3 Only the inorganic membrane layer 120 in this layer is shown. The black matrix layer 110 includes multiple light-transmitting openings 111, into which a colored filter membrane material can be deposited to form a colored filter layer 180. Figure 3 Not shown, but can be seen Figure 2 (Shown 180). The touch sensing layer 120 is located below the black matrix layer 110. Below the touch sensing layer 120 is the pixel defining layer 130. The touch sensing layer includes an inorganic film layer 120 composed of multiple insulating layers that is in contact with the black matrix layer 110, and touch layers TMA and TMB (such as...) sandwiched between the insulating layers. Figure 13 As shown). Figure 9 or Figure 13 As shown, the inorganic film layer 120 may include a buffer layer, a first coated protective layer VIA (via protection layer), and a second coated protective layer CLD (protective layer along the channel length direction).

[0050] The black matrix layer 110 includes a plurality of light-transmitting openings 111 located in a first region 210 of the substrate 100. The inorganic film layer 120 includes a plurality of light-transmitting regions 121 located in the first region 210 of the substrate 100. The light-transmitting regions 121 in the first region 210 are regions formed by etching the inorganic film layer 120 downward along the light-transmitting openings 111 in the black matrix layer 110, and in the first region 210, the orthographic projection of each light-transmitting opening 111 in the black matrix layer 110 onto the substrate 100 at least partially overlaps with the orthographic projection of the corresponding light-transmitting region 121 in the inorganic film layer 120 onto the substrate 100. For example, the orthographic projection of the light-transmitting opening 111 onto the substrate 100 covers the orthographic projection of its corresponding light-transmitting region 121 onto the substrate 100.

[0051] The plurality of filter units 181 on the substrate are units formed by depositing color filter material on the plurality of light-transmitting regions 121 for the plurality of light-transmitting openings 111. If a coating process is used, the surface of the color filter layer 180 away from the pixel defining layer 130 is flush.

[0052] Therefore, as Figure 3 As shown, the light-transmitting regions 121 in the first region 210 are sequentially arranged along the direction from the first boundary 230 to the outer edge 240. The thickness of the inorganic film layer 120 of the iuth light-transmitting region 121 in the first region 210 is denoted as A. i A i ≥A i+1 , where i is a positive integer, and i is the sorting of the light-transmitting region 121 in the first region 210. Figure 3 A ini For illustrative purposes only, it is represented as A1 to A. n Any one of them.

[0053] For example, A i ≥A i+1 This can be represented as: A1>A2>···>A n-1 >A n , 0≤j≤n.

[0054] The thickness of the first light-transmitting region 121 (the starting light-transmitting region) is denoted as A1, and the thickness of the nth light-transmitting region 121 (the ending light-transmitting region) is denoted as A. n Here, n can be the number of light-transmitting areas 121 or light-transmitting openings 111 in the first region 210, and the number of light-transmitting areas 121 is the same as the number of light-transmitting openings 111.

[0055] In this example, the thickness of the inorganic film layer 120 in the light-transmitting region 121 continuously decreases from the first boundary 230 of the substrate 100 to the outer edge 240. Consequently, the color filter film deposited on the light-transmitting region 121 by the coating process can continuously thicken from the first boundary 230 to the outer edge 240, increasing the filtering effect in this region and thus improving the problem of poor edge brightness.

[0056] Specifically, for the light-transmitting opening 111, the diameter of the opening on the side away from the touch-sensing layer 120 is greater than or equal to the diameter of the opening on the side closer to the touch-sensing layer 120.

[0057] The plurality of light-transmitting regions 121 in the first region 210 include at least one of red, green, and blue light-transmitting regions. Colored filter material is deposited onto the surface of the corresponding light-transmitting region 121 along the plurality of light-transmitting openings 111 in the first region 210 to form a colored filter layer 180. These light-transmitting openings 111 can be one of green, red, or blue light-transmitting openings. Green filter units can be formed in the green light-transmitting openings, red filter units can be formed in the red light-transmitting openings, and blue filter units can be formed in the blue light-transmitting openings.

[0058] In practical applications, AMOLED products can be designed as dual-curved or quad-curved surfaces, which can effectively shrink the black edges of the panel to achieve a deeper display effect and enhance the overall design of the product. However, such curved designs can cause a greenish tinge at the product edges. The solution provided in this disclosure can mitigate the degree of greenish tinge at the edges of curved screens.

[0059] Figure 4 This is a cross-sectional view of a substrate 100 according to another embodiment of the present disclosure.

[0060] like Figure 4 As shown, the multiple light-transmitting areas 121 in the first region 210 are all green light-transmitting areas. That is, etching is performed only on the inorganic film layer 120 below the green light-transmitting opening in the first region 210. The pixels corresponding to the multiple light-transmitting areas 121 are green pixels, and the filter units 181 formed thereon are green filter units 182.

[0061] For curved screen products, such as Figure 1 As shown, the first region 210 is a bending region. Starting from the bending boundary 230 between the bending region 210 and the non-bending region 220 and ending at the outer edge 240 of the substrate 100, the inorganic film layer 120 is etched downwards from the green light-transmitting opening 111 in this region, and the etching depth continuously increases, and the inorganic film layer 120 continuously thins.

[0062] According to this example, the inorganic film layer 120 is etched downwards into the green light-transmitting opening 111 in the bending region 210 of the substrate 100 to thicken the green filter film in the bending region 210 of the substrate 100 made by the coating process, thereby increasing the degree of green light filtering and reducing the degree of greening at the edges.

[0063] In some embodiments, A i This is an arithmetic sequence function or a piecewise arithmetic sequence function with variable i as the independent variable. That is, the thickness of the inorganic film layer 120 in the light-transmitting region 121 of the first region 210 is an arithmetic sequence or a piecewise arithmetic sequence according to the order of the light-transmitting regions 121 in the first region 210. For example, A1-A2=A n-1 -A n .

[0064] Due to limitations in actual manufacturing processes, A i The thickness variation is not necessarily a precise arithmetic sequence or a piecewise arithmetic sequence. It should be understood that, for example, for the first region, if the error between the thickness differences of the inorganic film between any two adjacent transparent regions is within a set error range, the film thickness of the transparent regions in the first region is still considered to be an arithmetic sequence. For example, this error range can be less than or equal to 0.01 μm.

[0065] In some embodiments, 0≤A i ≤m, where m is the thickness of the inorganic film layer 120 located in the second region 220 of the substrate 100. For example... Figure 1 As shown, if the first region 210 is a bent region, then the second region 220 is a non-bent region. Therefore, the maximum thickness of the inorganic film layer 120 in the light-transmitting region 121 is the same as the thickness of the inorganic film layer 120 in the non-bent region 220. For example, the thickness A1 of the inorganic film layer 120 in the aforementioned starting light-transmitting region 121 is m.

[0066] In the substrate 100, the inorganic film layer 120 may include a buffer layer, a first coating protective layer VIA (via protection layer), and a second coating protective layer CLD (protective layer along the channel length direction). Therefore, the thickness A1 of the initial light-transmitting region 121 can be the sum of the thicknesses of these three layers in the non-bending region 220.

[0067] In some embodiments, A1-A n ≤20μm. In this example, the etching depth of the inorganic film 120 does not exceed 20μm.

[0068] like Figure 3 As shown, the substrate 100 further includes a pixel defining layer 130. Located below the touch sensing layer 120, it includes a plurality of pixel openings 131 located in the first region 210. The pixel openings 131 can also be referred to as pixel pits. The orthographic projections of each light-transmitting opening 111 in the black matrix layer 110 onto the substrate 100 at least partially overlap with the orthographic projections of their corresponding pixel openings 131 in the pixel defining layer 130 onto the substrate 100. Figure 3 As shown, the orthographic projection of the first light-transmitting opening 111 in the first region 210 onto the substrate 100 covers the orthographic projection of the first pixel opening 131 onto the substrate 100.

[0069] For each pixel opening 131, the diameter of the opening on the side of the pixel opening 131 closest to the black matrix layer 110 is greater than or equal to the diameter of the opening on the side of the pixel opening furthest from the black matrix layer 110.

[0070] Figure 5 This is a cross-sectional view of a substrate 100 according to an embodiment of the present disclosure.

[0071] like Figure 5 As shown, the pixel openings 131 in the first region 210 are sequentially arranged along the direction from the first boundary 230 to the outer edge 240, and the diameter of the j-th pixel opening 131 in the first region 210 is B. j B j ≤B j+1 , j is a positive integer, j is the order of the pixel opening 131 in the first region 210. The diameter is the diameter of the opening on the side of the pixel opening 131 away from the black matrix layer 110.

[0072] For example, B j ≤B j+1 This can be represented as: B1≤B2≤···≤B n-1 ≤B n , 0≤j≤n, where n is a positive integer.

[0073] The diameter of the first pixel opening 131 (the starting pixel opening) is denoted as B1, and the diameter of the nth pixel opening 131 (the ending pixel opening) is denoted as B. n .

[0074] Furthermore, the light-transmitting openings 111 in the first region 210 are sequentially arranged along the direction from the first boundary 230 to the outer edge 240, and the diameter of the k-th light-transmitting opening 111 in the first region 210 is C. k C k ≥C k+1 k is a positive integer, and k is the order of the light-transmitting opening 111 in the first region 210. The diameter is the diameter of the opening of the light-transmitting opening 111 on the side closest to the pixel defining layer 130.

[0075] For example, C k ≥C k+1 This can be represented as: C1≥C2≥···≥C n-1 ≥C n , 0≤k≤n.

[0076] The diameter of the first light-transmitting opening 111 (the starting light-transmitting opening) is denoted as C1, and the diameter of the nth light-transmitting opening (the ending light-transmitting opening) is denoted as C. n .

[0077] According to this example, the opening diameter of the pixel opening 131 is continuously enlarged along the direction from the first boundary 230 of the substrate 100 to the outer edge 240, and the opening diameter of the light-transmitting opening 111 is continuously reduced, thereby reducing the light-guiding width of the black matrix layer 110 in the edge region to the pixel unit, reducing the amount of light emitted from the edge region, and thus reducing the undesirable phenomenon of bright edges on the product.

[0078] In some embodiments, B j C is an increasing function with j as its independent variable. k It is an increasing function with k as the independent variable. The diameter of the pixel opening 131 in the first region 210 is an increasing function as the arrangement order of the pixel opening 131 in the first region 210 changes, and the diameter of the light-transmitting opening in the first region 210 is a decreasing function as the arrangement order of the light-transmitting opening 111 in the first region 210 changes.

[0079] In some embodiments, B j C is an arithmetic sequence function or a piecewise arithmetic sequence function with j as the independent variable. kThis is an arithmetic sequence function or a piecewise arithmetic sequence function with k as the independent variable. The diameter of the pixel opening 131 in the first region 210 can be an arithmetic sequence or a piecewise arithmetic sequence according to the arrangement order of the pixel opening 131 in the first region 210, and the diameter of the light-transmitting opening 111 in the first region 210 can be an arithmetic sequence or a piecewise arithmetic sequence according to the arrangement order of the light-transmitting opening 111 in the first region 210.

[0080] Due to limitations in actual manufacturing processes, B j The change in the opening diameter is not necessarily a precise arithmetic sequence or a piecewise arithmetic sequence. C k The variation in the aperture diameter is not necessarily a precise arithmetic sequence or a piecewise arithmetic sequence. It should be understood that, for example, for a first region, if the error between the diameter differences of any two adjacent pixel apertures is within a set error range, the diameters of the pixel apertures in the first region are still considered to be an arithmetic sequence. Similarly, for a first region, if the error between the diameter differences of any two adjacent light-transmitting apertures is within a set error range, the diameters of the light-transmitting apertures in the first region are still considered to be arithmetic data. For example, this error range can be less than or equal to 0.05 μm.

[0081] In some embodiments, the range of values ​​for the diameter of the pixel opening 131 in the first region 210 can be limited to: (B n -B1)≤100μm, where B1 is the diameter of the first pixel opening 131 in the first region 210, B n It is the diameter of the opening 131 of the nth pixel in the first region 210.

[0082] Wherein, the diameter B1 of the first pixel opening 131 is the diameter of the pixel opening in the second region 220 of the substrate 100.

[0083] In some embodiments, the diameter of the light-transmitting opening 111 in the first region 210 can be limited to the following range: (C1-C n )≤100μm, where C1 is the diameter of the first light-transmitting opening in the first region 210, C n The diameter of the nth light-transmitting opening in the first region 210.

[0084] Wherein, the diameter C1 of the first light-transmitting opening is the diameter of the light-transmitting opening in the second region 220 of the substrate 100.

[0085] The pixel opening 131 in the first region 210 can be at least one of the RGB light-emitting units. For example, it can be only a green light-emitting unit. Alternatively, it can be any one of a green light-emitting unit, a red light-emitting unit, and a blue light-emitting unit.

[0086] According to the above example, in the form of an arithmetic sequence or a piecewise arithmetic sequence, the opening diameter of the pixel opening 131 is continuously increased along the direction starting from the first boundary 230 of the substrate 100 and ending at the outer edge 240, and the opening diameter of the light-transmitting opening 111 is continuously decreased. This reduces the light-guiding width of the black matrix layer 110 to the pixel unit in the edge region, reduces the amount of light emitted from the edge region, and thus reduces the undesirable phenomenon of bright edges on the product.

[0087] In some embodiments, the opening width of the light-transmitting opening 111 is continuously increased along the bending junction 230 between the bending area 210 and the non-bending area 220 of the substrate 100 toward the outer edge 240 of the substrate 100, thereby increasing the amount of light emitted from the bending area 210 and improving the color shift of the bending area 210, so as to reduce or weaken the phenomenon of greening at the curved edge of the product.

[0088] Figure 6 This is a cross-sectional view of a substrate 100 according to another embodiment of the present disclosure.

[0089] like Figure 6 As shown, the substrate 100 includes an organic material layer 190 and a pixel defining layer 130. The organic material layer 190 includes a plurality of beveled openings 191 located in a first region 210 of the substrate 100. The pixel defining layer 130 is located below the organic material layer 190 and includes a plurality of pixel openings 131 located in the first region 210 of the substrate 100.

[0090] In the first region 210, the beveled openings 191 and pixel openings 131 are sequentially arranged in the direction from the bend junction 230 to the outer edge 240. The orthographic projection of the h-th beveled opening 191 in the first region 210 onto the substrate 100 at least covers the side of the orthographic projection of the h-th pixel opening 131 onto the substrate 101 that is away from the outer edge 240. The orthographic projection distance on the substrate 100 between the boundary of the h-th beveled opening 191 away from the outer edge 240 and the boundary of the h-th pixel opening 131 away from the outer edge 240 is D. h D h ≤D h+1 h is a positive integer.

[0091] For example, D h ≤D h+1 This can be represented as: D1≤D2≤···≤D n-1 ≤D n , 0≤h≤n.

[0092] by Figure 6 For example, for each opening, the boundary furthest from the outer edge 240 is its left opening, and the boundary closest to the outer edge 240 is its right opening.

[0093] The orthographic projection distance on the substrate 100 between the left edge of the first light-transmitting opening 111 and the left edge of the first pixel opening 131 is D1, and the orthographic projection distance on the substrate 100 between the left edge of the nth light-transmitting opening 111 and the left edge of the nth pixel opening 131 is D. n .

[0094] In this example, for the organic material layer 190 above the pixel defining layer 130, a beveled opening 191 corresponding to the pixel opening 131 in the pixel defining layer 130 is provided in the organic material layer 190. In the bending area, the distance between the boundary of the beveled opening 191 away from the outer edge 240 and the boundary of the corresponding pixel opening 131 away from the outer edge 240 increases continuously along the bending junction 230 towards the outer edge 240. This can increase the amount of light emitted from the front of the bending area, improve color shift, and thus improve the phenomenon of greening at the curved edge of the product.

[0095] In some embodiments, the organic material layer 190 may be located between the color filter layer 180 and the pixel defining layer 130.

[0096] Figure 7 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure.

[0097] like Figure 6 and Figure 7 As shown, the organic material layer 190 is a black matrix layer 110, and the beveled opening 191 in the organic material layer 190 is a light-transmitting opening 111 in the black matrix layer. The pixel openings 131 in the bending region 210 are sequentially arranged along the bending boundary 230 between the bending region 210 and the non-bending region 220, pointing towards the outer edge 240. The light-transmitting openings 111 in the bending region 210 are sequentially arranged along the bending boundary 230, pointing towards the outer edge 240.

[0098] In this case, the orth projection of the h-th light-transmitting opening 111 in the bending region 210 onto the substrate 100 covers the orth projection of the h-th pixel opening 131 in the bending region 210 onto the substrate 100. The orth projection distance on the substrate 100 between the boundary of the h-th light-transmitting opening 111 away from the outer edge 240 and the boundary of the h-th pixel opening 131 away from the outer edge 240 is D. h The orthographic projection distance on the substrate 100 between the boundary near the outer edge 240 of the h-th light-transmitting opening 111 and the boundary near the outer edge 240 of the h-th pixel opening 131 is E. h D h ≤D h+1 E h ≥E h+1 h is a positive integer, and h is the order of the pixel opening 131 or the light-transmitting opening 111 in the bending area 210.

[0099] For each opening, the boundary furthest from the outer edge 240 is its left opening, and the boundary closest to the outer edge 240 is its right opening.

[0100] For example, E h ≥E h+1 This can be represented as: E1≥E2≥···E n-1 ≥E n , 0≤h≤n.

[0101] The projected distance on the substrate 100 between the right edge of the first light-transmitting opening 111 and the right edge of the first pixel opening 131 is E1, and the projected distance on the substrate 100 between the right edge of the nth light-transmitting opening 111 and the right edge of the nth pixel opening 131 is E1. n .

[0102] In this example, in the bending area 210, while maintaining the orthogonal projection of the light-transmitting opening 111 on the substrate 100 covering the orthogonal projection of its corresponding pixel opening 131 on the substrate 100, along the bending junction 230 between the bending area 210 and the non-bending area 220 pointing towards the outer edge 240, the distance between the boundary of the light-transmitting opening 111 away from the outer edge 240 and the boundary of the corresponding pixel opening 131 away from the outer edge 240 is continuously increased, and the distance between the boundary of the light-transmitting opening 111 near the outer edge 240 and the boundary of the corresponding pixel opening 131 near the outer edge 240 is continuously decreased. This can increase the front light emission of the bending area, improve color shift, and thus improve the phenomenon of greening at the curved edge of the product.

[0103] In some embodiments, D h and E h It is an arithmetic sequence function or a piecewise arithmetic sequence function with h as the independent variable.

[0104] Due to limitations in actual manufacturing processes, D h The change in boundary distance is not necessarily a precise arithmetic sequence or a piecewise arithmetic sequence. h The change in boundary distance is not necessarily an exact arithmetic sequence or a piecewise arithmetic sequence. It should be understood that, for example, for the bend region 210, any two |D h -D h+1 If the error in the distance difference is within the set error range, the boundary distance D in the bending zone is still considered to be within the set error range. h It is an arithmetic sequence. For example, the error range can be less than or equal to 0.05 μm.

[0105] In some embodiments, 0≤D h ≤22μm, 0≤E h ≤22μm.

[0106] In some embodiments, negative photoresist can be used for coating, exposure, and development processes to create the aforementioned black matrix layer BM. Alternatively, this step can employ an organic resin material containing a thermosetting agent or a photocuring agent for inkjet printing or transfer processes to complete the corresponding material curing.

[0107] After forming the black matrix layer 110, negative photoresist can be used for coating, exposure, and development to sequentially form the red filter film R-CF, green filter film G-CF, and blue filter film B-CF, or the RGB process order can be changed to fabricate the color filter. Each RGB color filter corresponds to its corresponding RGB EL film layer. The boundary of the color filter has a distance of 0–20 μm between it and the boundary of the corresponding pixel opening 131 in the pixel defining layer 130.

[0108] After fabricating the color filter layer and the black matrix layer 110, a planarization process using a high-transparency organic material, i.e., COC, is applied. The selected high-transparency organic material can be a thermosetting or photocurable organic material such as acrylic resin or epoxy resin. The organic material can be filled using methods such as blade coating or inkjet printing, with a thickness of 0.1–50.0 μm after film application. This film layer is not essential to the substrate 100 and can be selectively omitted. This description focuses on the COC planarization functional layer; it can be extended to an inorganic or organic-inorganic stack with reflectivity reduction capabilities. BM, RCF, GCF, BCF, and COC can collectively form a COE structure.

[0109] Figure 8 This is a cross-sectional view of a substrate 100 according to an embodiment of the present disclosure.

[0110] In some embodiments, the use of low- and high-fold film layers of TOC and HOC in the touch sensing layer enables total internal reflection of light through the sloping openings in the TOC film, which can reduce the phenomenon of poor edge brightness.

[0111] like Figure 6 and Figure 8 As shown, the aforementioned organic material layer 190 is a TOC protective layer 160, which includes multiple beveled openings 161. An HOC protective layer 150 is disposed above the TOC protective layer 160.

[0112] The orthographic projection of the HOC protective layer 150 on the substrate 100 covers the first region 210 of the substrate 100 and the bending junction 230 between the first region 210 and the second region 220, but does not cover the second region 220.

[0113] The TOC protective layer 160 includes a plurality of beveled openings 161 located in the first region 210. The orthographic projection of the TOC protective layer 160 on the substrate 100 covers a portion of the first region 210 of the substrate 100, the bend junction 230 between the first region 210 and the second region 220, and the second region 220.

[0114] In the first region 210, the orthographic projection of each beveled opening 161 in the TOC protective layer 160 onto the substrate 100 at least covers the side of the pixel opening 131 in the pixel defining layer 130 that is away from the outer edge 240 in its orthographic projection onto the substrate 100.

[0115] The refractive index of the HOC protective layer 150 is higher than that of the TOC protective layer 160. The HOC protective layer 150 is an HOC film layer, and its material can be a high-refractive-index, highly transparent organic material. The TOC protective layer 160 is a TOC film layer, and its material can be a low-refractive-index, highly transparent organic material.

[0116] In actual production, these two types of films are formed using methods such as coating, exposure, development, and inkjet printing.

[0117] In this example, since the refractive index of the HOC layer material is greater than that of the TOC layer material, light can undergo total internal reflection on the inclined surface of the inclined opening 161 in the TOC layer, reducing color shift and thus improving the greening phenomenon at the edges.

[0118] In some embodiments, for the beveled opening 161, the diameter of the opening on the side closer to the HOC protective layer 150 is greater than or equal to the diameter of the opening on the side farther from the HOC protective layer 150. The bevel angle of the beveled opening 161 is R, where 40° ≤ R ≤ 90°.

[0119] In some embodiments, in the pixel defining layer 130, the pixel openings 131 in the bending region 210 are sequentially arranged along the bending junction 230 between the bending region 210 and the non-bending region 220 towards the outer edge 240, and in the TOC protective layer 160, the inclined openings 161 in the bending region 210 are sequentially arranged along the bending junction 230 towards the outer edge 240.

[0120] The orthographic projection of the r-th inclined opening 161 in the bending region 210 onto the substrate 100 at least covers the boundary away from the outer edge 240 in the orthographic projection of the r-th pixel opening 131 in the bending region 210 onto the substrate 100. The orthographic projection displacement of the boundary near the outer edge 240 in the r-th inclined opening 161 and the boundary near the outer edge 240 in the r-th pixel opening 131 onto the substrate 100 is F. rThe orthographic projection displacement on the substrate 100 of the boundary of the r-th inclined opening 161 away from the outer edge 240 and the boundary of the r-th pixel opening 131 away from the outer edge 240 is G. r F r ≥F r+1 G r ≤G r+1 r is a positive integer. For the direction of the above orthogonal projection displacement, the direction from the bend junction 230 to the outer edge 240 is taken as the positive direction.

[0121] Among them, such as Figure 8 As shown, the boundary of each opening furthest from the outer edge 240 is the left boundary of the opening, and the boundary of each opening closest to the outer edge 240 is the right boundary of the opening.

[0122] For example, F r ≥F r+1 This can be represented as: F1≥F2≥···≥F n-1 ≥F n , 0≤r≤n.

[0123] In this example, r can be equivalent to h mentioned above.

[0124] The orthographic projection displacement of the right boundary of the first inclined surface opening 161 (starting inclined surface opening) and the right boundary of the first pixel opening 131 (starting pixel opening) on ​​the substrate 100 is F1, and the orthographic projection displacement of the right boundary of the nth inclined surface opening 161 (ending inclined surface opening) and the right boundary of the nth pixel opening 131 (ending pixel opening) on ​​the substrate 100 is F. n .

[0125] For example, G r ≤G r+1 This can be represented as: G1≤G2≤···≤G n-1 ≤G n , 0≤r≤n.

[0126] Wherein, the orthographic projection displacement on the substrate 100 of the left boundary of the first inclined surface opening 161 (starting inclined surface opening) and the left boundary of the first pixel opening 131 (starting pixel opening) is G1, and the orthographic projection displacement on the substrate 100 of the left boundary of the nth inclined surface opening 161 (ending inclined surface opening) and the left boundary of the nth pixel opening 131 (ending pixel opening 131) is G. n .

[0127] In some embodiments, -20μm≤F r ≤22μm, 0≤G r ≤22μm.

[0128] In some embodiments, F r and G r It is an arithmetic sequence function or a piecewise arithmetic sequence function with r as the independent variable.

[0129] Due to limitations in actual manufacturing processes, F r The changes in the boundary positions are not necessarily exact arithmetic sequences or piecewise arithmetic sequences. r The changes in the boundary positions are not necessarily exact arithmetic sequences or piecewise arithmetic sequences. It should be understood that, for example, for the third region, any two |F... r -F r+1 If the error in the boundary distance difference is within the set error range, it is still considered that F in the first region... r It is an arithmetic sequence. For example, the error range can be less than or equal to 0.05 μm.

[0130] In some embodiments, the thickness of the HOC protective layer 150 is L, where 0.1 μm ≤ L ≤ 50 μm.

[0131] In some embodiments, the orthographic projection distance on the substrate 100 between the boundary of the HOC protective layer 150 away from the outer edge 240 and the boundary of the starting pixel opening 131 away from the outer edge 240 of the substrate 100 is C, where C ≤ 50 μm.

[0132] Figure 9 This is a cross-sectional view of a substrate 100 according to another embodiment of the present disclosure.

[0133] In some embodiments, such as Figure 9 As shown, the IJP in the TFE structure is referred to as the 1st-IJP. After the CLD process is completed, the 2nd-IJP is fabricated using highly transparent organic materials such as acrylates and epoxy resins, which can be thermo-cured or photocured. The coverage area of ​​the 2nd-IJP includes areas with a thinner IJP film thickness compared to the display area, areas without IJP coverage, and the gaps between adjacent panels (PNL). The film thickness of the 2nd-IJP can be the same as or different from that of the 1st-IJP.

[0134] Figure 10 This is a cross-sectional view of a substrate 100 according to another embodiment of the present disclosure.

[0135] For example, such as Figure 10 As shown, the substrate 100 in this embodiment may further include:

[0136] An encapsulation stratification layer 170 is located above the inorganic film layer 120. The orthographic projection of the encapsulation stratification layer onto the substrate 100 covers a first region 210 in the substrate 100, such that the surface of the first region near the black matrix layer is flat. For example, the surface of the encapsulation stratification layer 170 is aligned with the surface of the inorganic film layer 120 away from the outer edge 240.

[0137] In this example, a secondary encapsulation layer is used to make the thinner edge area flush with the surface of the central area of ​​the substrate 100, thereby improving the phenomenon of poor edge gloss.

[0138] This disclosure also provides a display panel, which includes any of the substrates 100 in this disclosure.

[0139] This disclosure also provides a preparation method, including: forming a color filter layer on a substrate, wherein the color filter layer includes a plurality of filter units located in a first region of the substrate, the first region includes a region extending along a first boundary of the substrate to the outer edge of the substrate, the first boundary is the boundary between the first region and a second region, and the second region is the region other than the first region;

[0140] In the first region, the color filter units are sequentially arranged along the direction from the first boundary towards the outer edge, and the film thickness of the g-th filter unit in the first region is H. g H g ≤H g+1 g is a positive integer.

[0141] The preparation method provided in this example achieves the same effect as the above embodiments, and will not be described in detail here.

[0142] Figure 11 This is a flowchart of a preparation method according to an embodiment of the present disclosure.

[0143] like Figure 11 As shown, this disclosure provides a preparation method, including:

[0144] S110, a touch sensing layer is formed on the substrate 100;

[0145] S120, a black matrix layer 110 is formed on the inorganic film layer 120 of the touch sensing layer;

[0146] S130, etch the black matrix layer 110 to form multiple light-transmitting openings 111;

[0147] S140, etching is performed on the inorganic film layer 120 below the plurality of light-transmitting openings 111 in the first region 210 of the substrate 100 to form a plurality of light-transmitting regions 121; wherein, the first region 210 includes a region extending along the first boundary 230 of the substrate 100 to the outer edge 240 of the substrate 100.

[0148] S150, depositing color filter material on multiple light-transmitting areas for multiple light-transmitting openings to form a color filter layer 180, wherein the color filter layer 180 includes multiple filter units 181 housed in the multiple light-transmitting openings, and the surface of the color filter layer 180 away from the touch sensing layer is flush.

[0149] In the first region 210, the light-transmitting regions 121 are sequentially arranged with the first boundary 230 as the starting point and the outer edge 240 as the ending point. The thickness of the inorganic film layer 120 of the i-th light-transmitting region 121 in the first region 210 is A. i A i ≥A i+1 , where i is a positive integer, and i is the sorting of the light-transmitting region 121 in the first region 210.

[0150] For the inorganic film layer 120 extending from the first boundary 230 to the outer edge 240 of the substrate 100, the inorganic film layer 120 is etched downwards from the light-transmitting opening 111 of the black matrix layer 110 to form multiple light-transmitting regions 121. The thickness of the inorganic film layer 120 in the light-transmitting regions 121 is lower than that in other regions. Furthermore, the thickness of the inorganic film layer 120 in the light-transmitting regions 121 continuously decreases from the first boundary 230 to the outer edge 240. As a result, the color filter film deposited on the light-transmitting regions 121 by the coating process continuously thickens from the first boundary 230 to the outer edge 240, reducing the luminescence intensity in this region from the first boundary 230 to the outer edge 240 and improving the problem of poor edge brightness.

[0151] Figure 12 This is a flowchart of a preparation method according to another embodiment of this disclosure.

[0152] like Figure 12 As shown, the preparation method includes:

[0153] S210, a pixel defining layer 130 is formed on the substrate, wherein the pixel defining layer 130 includes a plurality of pixel openings 131 located in a first region 210 of the substrate, and the first region 210 includes a region extending along the bending junction 230 of the substrate to the outer edge of the substrate.

[0154] S220, an organic material layer 190 is formed above the pixel defining layer 130, wherein the organic material layer 190 is located in a plurality of beveled openings in the first region 210.

[0155] In the first region 210, the beveled openings and pixel openings 131 are sequentially arranged in the direction of the bend junction 230 pointing towards the outer edge. The orthographic projection of the h-th beveled opening in the first region 210 onto the substrate at least covers the side of the orthographic projection of the h-th pixel opening 131 away from the outer edge onto the substrate. The orthographic projection distance on the substrate between the boundary of the h-th beveled opening away from the outer edge and the boundary of the h-th pixel opening 131 away from the outer edge is D. h D h ≤D h+1 h is a positive integer.

[0156] In this example, for the organic material layer 190 above the pixel defining layer 130, a beveled opening corresponding to the pixel opening 131 in the pixel defining layer 130 is formed in the organic material layer 190. In the bending area, the distance between the boundary of the beveled opening away from the outer edge and the boundary of the corresponding pixel opening 131 away from the outer edge increases continuously along the bending junction 230 in the direction pointing to the outer edge. This can increase the amount of light emitted from the front of the bending area, improve color shift, and thus improve the phenomenon of greening at the curved edge of the product.

[0157] Figure 13 This is a cross-sectional view of a substrate according to another embodiment of the present disclosure.

[0158] like Figure 9 and Figure 13 As shown in the figures, the substrate formation process of the present disclosure embodiment will be described below with reference to the figures, specifically as follows:

[0159] Step 1: On the general substrate SS of the display panel, a thin film transistor (TFT) structure for the active matrix light-emitting diode display is formed using methods such as exposure, development, magnetron sputtering, dry etching, and wet etching. Metal, organic, and inorganic films are patterned to form the TFT structure, which has current and voltage regulation capabilities. The general substrate SS of the display panel can be transparent alkali-free glass or a quartz substrate coated with organic or inorganic films of a specific thickness.

[0160] Step 2 involves forming an AND (Anode) layer with a thickness of 10-1000 nm using methods such as magnetron sputtering, exposure development, and etching. The AND layer can be made of highly reflective metals such as silver (Ag), gold (Au), palladium (Pd), and platinum (Pt), or alloys or stacks of such metals. The AND layer can also be a composite film of inert tin oxide (ITO) and a metal reflective layer.

[0161] Step 3 involves coating, exposing, and developing a 0.5-1.5µm photoresist to create a regularly arranged PDL (pixel delimiting layer 130) structure, which limits the subsequent filling of the light-emitting material (EL).

[0162] Step 4: Apply photoresist to the PDL with a thickness of 0.5-1.5µm, and then perform subsequent exposure and development processes to create a regularly arranged PS structure. This structure supports the FMM mask used in the EL deposition process, reducing the possibility of EL fill misalignment. The PS is a non-essential structure or process and can be replaced by the PDL structure or implemented simultaneously during the PDL process. The photoresist used for PDL and PS can be a transparent material or a black opaque material.

[0163] Step 5: Using methods not limited to vacuum high-temperature evaporation, inkjet printing, or transfer, fill the pixel pits in the corresponding PDL (pixel definition layer 130) with REL (red emitting material), GEL (green emitting material), and BEL (blue emitting material), and then perform subsequent EL device film filling. The EL device includes a hole injection layer, a hole transport layer, an electron blocking layer, an electron transport layer, and an electron injection layer.

[0164] Step 6: After the luminescent layer is deposited, a CTD (cathode) with a certain transmittance and a film thickness of 1-30 nm is made using metals or metal oxides such as silver (Ag), magnesium (Mg), and aluminum (Al). AND works together with the CTD to adjust the state of the luminescent layer and regulate the product's display effect.

[0165] Step 7: An inorganic thin film with a thickness of 0.1-5.0 μm is formed using methods such as PECVD (Plasma Enhanced Chemical Vapor Deposition), CVD (Chemical Vapor Deposition), ALD (Atomic Layer Deposition), and HDMSO (Hexamethyldisiloxane) coating processes. For CVD1, the film material can be a stack of one or more of the following materials: SiOxNy, SiNx, SiOx, and AlOx.

[0166] Step 8: Select highly transparent organic materials such as acrylates and epoxy resins, which can be thermo-cured or photo-cured, to fabricate the IJP (Integrated Film Panel). This structure can alleviate stress in the inorganic layer and protect the color filter layer. The organic material can be filled using methods such as blade coating or inkjet printing, and the film thickness can be set from 0.1 to 50.0 μm. Then, perform thermo-curing or photo-curing processes to complete the curing of the organic resin material.

[0167] Step 9: An inorganic thin film with a thickness of 0.1-2.0 μm is formed using methods such as PECVD, CVD, ALD, and HDMSO, namely CVD2. The film material can be a stack of one or more of the following materials: SiOxNy, SiNx, SiOx, and AlOx.

[0168] Among them, CVD1, IJP, and CVD2 are combined to form TFE. Here, only a three-layer packaging structure is described, but it can actually be expanded into a multi-layer inorganic-organic stacked packaging structure.

[0169] Step 10 involves forming a buffer layer with a thickness of 0.1-5.0 μm using methods such as PECVD, CVD, HDMSO, coating, and printing. The film material can be one or more of the following organic materials: SiOxNy, SiNx, SiOx, AlOx, acrylic resin, epoxy resin, etc. When the buffer film material is inorganic, it can be replaced by CVD2 to thicken the film layer, thereby reducing the process steps and product costs.

[0170] Step 11: Using methods such as magnetron sputtering, one or more of the following metals—silver (Ag), gold (Au), palladium (Pd), platinum (Pt), or metal oxides such as inertia tin (TO)—are used to prepare a multilayer or mixed touch connection electrode (TMA). The orthogonal projection of the TMA onto the substrate lies within the orthogonal projection range of the PDL onto the substrate. The thickness of the TMA is 10-500 nm.

[0171] Step 12: On the substrate with the aforementioned pattern, a first protective coating layer VIA with a thickness of 0.1-5.0 μm is formed using methods such as PECVD, CVD, HDMSO, coating, and printing. The VIA has multiple vias that expose the surface of the touch connection electrode TMA.

[0172] Step 13: Using magnetron sputtering or other methods, a multilayer or mixed touch connection electrode (TMB) is prepared by depositing one or more of the following metals: silver (Ag), gold (Au), palladium (Pd), platinum (Pt), or metal oxides such as inertia tin oxide (ITO). The thickness of the TMB is 10-500 nm. The TMB is uniformly deposited on the surface of the VIA, and some locations in the TMB are connected to the TMA through vias in the VIA to achieve touch functionality.

[0173] Step 14: Apply a protective treatment using a high-transparency material, namely a TOC film layer. The TOC layer can be made of organic or inorganic materials, and the TOC film thickness is set to 0.1-50.0 μm. This film layer is not necessary and can be removed.

[0174] TOC material can be one or more of the following: organic materials that can be thermocured or photocured, such as acrylates and epoxy resins, or inorganic materials such as SiOxNy, SiNx, and SiOx.

[0175] The TSP structure is composed of Buffer, TMA, VIA, TMB, and TOC.

[0176] Step 15: Use negative photoresist for coating, exposure, and development to create the black matrix layer BM. The PDL covers a consistent area, and the distance between the BM boundary and the PDL boundary is -2 to 10 μm. This step can also be performed using an organic resin material containing a thermosetting agent or a photocuring agent for inkjet printing or transfer printing, followed by the corresponding material curing.

[0177] Step 16: Apply negative photoresist, expose, and develop to sequentially form RCF (red filter), GCF (green filter), and BCF (blue filter), or change the RGB process order to fabricate the color filter structure. Each RGB color filter corresponds to its respective RGB EL layer. The color filter boundary has a distance of 0–20 μm from the PDL boundary.

[0178] Step 17: After fabricating the color filter layer and BM layer, a high-transparency organic material is used for planarization, i.e., COC (Coefficient of Contents). The selected high-transparency organic material can be a thermosetting or photocurable organic material such as acrylic resin or epoxy resin. The organic material can be filled using methods such as blade coating or inkjet printing, with a backsheet thickness of 0.1–50.0 μm. This film layer is not essential and can be selectively omitted. This description only refers to the COC planarization functional layer; it can be extended to inorganic or organic-inorganic stacks with reflectivity reduction functions.

[0179] Among them, BM, RCF, GCF, BCF, and COC together form the COE structure.

[0180] This disclosure also provides an electronic device, including a display panel according to any embodiment of this disclosure. The electronic device may be a mobile phone, tablet, computer, smartwatch, in-vehicle device, etc.

[0181] In this disclosure, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0182] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0183] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0184] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify this disclosure, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0185] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A substrate, characterized in that, include: A color filter layer includes a plurality of filter units located in a first region of a substrate. The first region includes a region extending along a first boundary of the substrate to the outer edge of the substrate. The first boundary is the boundary between the first region and a second region of the substrate. The second region is the region of the substrate other than the first region. Among them, the filter units in the first region are arranged sequentially along the direction from the first boundary to the outer edge, and the filter unit located in the first region is the first one. The film thickness of each filter unit is , , It is a positive integer; The substrate further includes: A pixel defining layer, located below the touch sensing layer, includes a plurality of pixel openings located in the first region. The orthographic projection of each filter unit in the color filter layer on the substrate and the orthographic projection of their respective pixel openings in the pixel defining layer on the substrate have at least a partial overlap area. An organic material layer, located between the color filter layer and the pixel defining layer, includes a plurality of beveled openings located in the first region; In the first region, the beveled openings and pixel openings are sequentially arranged in the direction from the first boundary to the outer edge, respectively. The orthographic projection of the beveled opening on the substrate at least covers the first... The first pixel opening is located on the side away from the outer edge in the orthographic projection onto the substrate. The boundary of the inclined opening away from the outer edge and the first The orthographic projection distance of the boundary of the pixel opening furthest from the outer edge onto the substrate is: , , It is a positive integer; The pixel openings in the first region are sequentially arranged along the direction from the first boundary toward the outer edge, and the openings located in the first region are... The diameter of the opening of each pixel is , , It is a positive integer.

2. The substrate according to claim 1, characterized in that, Also includes: The black matrix layer, located below the color filter layer, includes multiple light-transmitting openings in the first region; A touch-sensing layer, located below the black matrix layer, includes an inorganic film layer in contact with the black matrix layer. The inorganic film layer includes multiple light-transmitting areas located in the first region. The multiple light-transmitting areas are areas formed by etching the inorganic film layer downward along the multiple light-transmitting openings. The plurality of filter units are units formed by depositing color filter material on the plurality of light-transmitting areas for the plurality of light-transmitting openings.

3. The substrate according to claim 1, characterized in that, For Arithmetic sequence function or piecewise arithmetic sequence function of independent variable.

4. The substrate according to claim 2, characterized in that, The first one located in the first region The thickness of the inorganic film layer in each light-transmitting region is: , , It is a positive integer. The thickness of the inorganic film layer located in the second region.

5. The substrate according to claim 1, characterized in that, The light-transmitting openings in the first region are sequentially arranged along the direction from the first boundary toward the outer edge, and the openings located in the first region are the first... The diameter of each light-transmitting opening is , , It is a positive integer.

6. The substrate according to claim 5, characterized in that, The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; ,in, Let be the diameter of the opening of the first pixel in the first region. Let n be the diameter of the opening of the nth pixel in the first region, where n is a positive integer; The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; ,in, The diameter of the first light-transmitting opening in the first region is [missing information]. Let be the diameter of the nth light-transmitting opening in the first region.

7. The substrate according to claim 2, characterized in that, Also includes: An encapsulation stratification layer is located above the inorganic film layer. The orthographic projection of the encapsulation stratification layer on the substrate covers the first region, so that the surface of the first region near the black matrix layer is flat.

8. The substrate according to claim 1, characterized in that, The organic material layer is a black matrix layer, and the beveled opening is a light-transmitting opening in the black matrix layer; Among them, the first region of the first region The orthogonal projection of the light-transmitting opening on the substrate covers the first... The orthographic projection of the pixel opening on the substrate, the first region of the first pixel opening The boundary of the light-transmitting opening near the outer edge and the first The orthographic projection distance of the boundary of the pixel opening near the outer edge on the substrate is... , .

9. The substrate according to claim 8, characterized in that, The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; ； The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; 。 10. The substrate according to claim 1, characterized in that, The organic material layer is a TOC protective layer, and the substrate further includes an HOC protective layer located above the TOC protective layer, wherein the refractive index of the HOC protective layer is higher than that of the TOC protective layer.

11. The substrate according to claim 10, characterized in that, The first The boundary of the inclined opening near the outer edge and the first The orthographic projection displacement of the boundary near the outer edge of the pixel opening on the substrate is: , .

12. The substrate according to claim 11, characterized in that, The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; ； The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; 。 13. A substrate, characterized in that, include: An organic material layer includes a plurality of beveled openings located in a first region of a substrate, the first region including a region extending along a first boundary of the substrate to an outer edge of the substrate, the first boundary being the boundary between the first region and a second region of the substrate, the second region being the region of the substrate other than the first region; A pixel defining layer, located below the organic material layer, includes a plurality of pixel openings located in the first region; In the first region, the beveled openings and pixel openings are sequentially arranged in the direction from the first boundary to the outer edge, respectively. The orthographic projection of the beveled opening on the substrate at least covers the first... The first pixel opening is located on the side away from the outer edge in the orthographic projection onto the substrate. The boundary of the inclined opening away from the outer edge and the first The orthographic projection distance of the boundary of the pixel opening furthest from the outer edge onto the substrate is: , , It is a positive integer; The pixel openings in the first region are sequentially arranged along the direction from the first boundary toward the outer edge, and the openings located in the first region are... The diameter of the opening of each pixel is , , It is a positive integer.

14. The substrate according to claim 13, characterized in that, The organic material is a black matrix layer, and the sloping opening is a light-transmitting opening in the black matrix layer. The first region... The orthogonal projection of the light-transmitting opening on the substrate covers the first... The orthographic projection of the pixel opening on the substrate, the first region of the first pixel opening The boundary of the light-transmitting opening near the outer edge and the first The orthographic projection distance of the boundary of the pixel opening near the outer edge on the substrate is... , .

15. The substrate according to claim 14, characterized in that, The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; ； The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; 。 16. The substrate according to claim 13, characterized in that, The organic material layer is a TOC protective layer, and the substrate further includes an HOC protective layer located above the TOC protective layer, wherein the refractive index of the HOC protective layer is higher than that of the TOC protective layer.

17. The substrate according to claim 16, characterized in that, in, The first The boundary of the inclined opening near the outer edge and the first The orthographic projection displacement of the boundary near the outer edge of the pixel opening on the substrate is: , .

18. The substrate according to claim 17, characterized in that, The value can be at least one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; ； The value can be one of the following: For An arithmetic sequence function or a piecewise arithmetic sequence function with the independent variable as the independent variable; 。 19. A display panel, characterized in that, Includes the substrate described in any one of claims 1-18.

20. A preparation method, characterized in that, include: A color filter layer is formed on a substrate, wherein the color filter layer includes a plurality of filter units located in a first region of the substrate, the first region including a region extending along a first boundary of the substrate to the outer edge of the substrate, the first boundary being the boundary between the first region and a second region of the substrate, the second region being the region other than the first region; Among them, the filter units in the first region are arranged sequentially along the direction from the first boundary to the outer edge, and the filter unit located in the first region is the first one. The film thickness of each filter unit is , , It is a positive integer; A pixel defining layer is formed on a substrate, wherein the pixel defining layer includes a plurality of pixel openings located in a first region of the substrate, the first region including a region extending along a first boundary of the substrate to the outer edge of the substrate, the first boundary being the boundary between the first region and a second region of the substrate, the second region being a region other than the first region; An organic material layer is formed above the pixel defining layer, wherein the organic material layer is located at multiple beveled openings in the first region; In the first region, the beveled openings and pixel openings are sequentially arranged in the direction from the first boundary to the outer edge, respectively. The orthographic projection of the beveled opening on the substrate at least covers the first... The first pixel opening is located on the side away from the outer edge in the orthographic projection onto the substrate. The boundary of the inclined opening away from the outer edge and the first The orthographic projection distance of the boundary of the pixel opening furthest from the outer edge onto the substrate is: , , It is a positive integer; The pixel openings in the first region are sequentially arranged along the direction from the first boundary toward the outer edge, and the openings located in the first region are... The diameter of the opening of each pixel is , , It is a positive integer.

21. The preparation method according to claim 20, characterized in that, include: A touch-sensing layer is formed on the substrate; A black matrix layer is formed on the inorganic film layer of the touch sensing layer; The black matrix layer is etched to form multiple light-transmitting openings; The inorganic film layer below the multiple light-transmitting openings in the first region of the substrate is etched to form multiple light-transmitting regions; The process of forming a color filter layer on a substrate includes: depositing a color filter material on the plurality of light-transmitting areas for the plurality of light-transmitting openings to form the color filter layer.

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