radar sensor

Abstract

The invention relates to a radar sensor (101) for receiving radar waves. The radar sensor (101) comprises at least one control instrument (105, 107) and at least one circuit board (117), wherein the at least one circuit board (117) comprises a substrate (111) and a structure (115) with a plurality of metallized structures (123) arranged on the substrate (111), the radar sensor (101) is configured to be arranged on a radome (103) such that the substrate (111) is arranged on a side facing away from the radome (103) and the structure (115) is arranged between the radome (103) and the substrate (111), and the at least one control instrument (105, 107) is arranged on a side of the substrate (111) facing away from the radome (103) and is in a communication connection with the at least one circuit board (117), at least one interspace (119) is introduced into the structure (115), only an environmental medium is between the radome (103) and the at least one interspace (119).

Description

Technical Field

[0001] This invention relates to radar sensors, radar systems, and manufacturing methods for manufacturing radar systems. Background Technology

[0002] Radar systems are used, particularly for measuring distances to objects. This involves emitting radar waves into the environment and detecting the time it takes for the radar waves to travel as reflected by the object.

[0003] Modern radar systems must meet high requirements for high-frequency transmission and reception power, electromagnetic radiation, heating, energy efficiency, and cost efficiency.

[0004] The known construction of radar systems is based on an arrangement in which a high-frequency substrate is aligned with, or rather, disposed toward, the corresponding radome. The integrated HF circuitry for connecting the antenna is also disposed toward the radome, thus incurring additional costs for EMV protection and heat dissipation requirements of the HF circuitry. Consequently, target collisions occur when the high-frequency substrate is aligned with the radome, in which the selected requirement is particularly well satisfied at the expense of other requirements.

[0005] For example, US 2020 220273 A1 describes a radar system in which a microcontroller and a high-frequency switch are in contact with a substrate constructed of a circuit board. Here, the high-frequency switch is disposed in the gap between the substrate and the radome, thereby causing power loss during the transmission and reception of high-frequency signals. Summary of the Invention

[0006] Against this backdrop, the objective of this invention is to provide a radar sensor for radar systems that simultaneously meets the highest requirements for high-frequency transmit and receive power, electromagnetic radiation, heating, energy efficiency, and cost efficiency. In particular, the objective of this invention is to provide a radar sensor that simultaneously meets the aforementioned requirements when operating with radar signals in the frequency range of 76-81 GHz.

[0007] The aforementioned task is solved by means of the features of the invention. Further features and details of the invention are derived from the dependent claims, the description, and the drawings.

[0008] In a first aspect, the present invention relates to a radar sensor for transmitting and receiving radar waves. The radar sensor includes at least one control instrument and at least one circuit board, wherein the at least one circuit board includes a substrate and a configuration having multiple metallized structures disposed on the substrate. The radar sensor is configured to be disposed on a radome such that the substrate is disposed on a side opposite to the radome and the configuration is disposed between the radome and the substrate. The at least one control instrument is disposed on the side of the substrate opposite to the radome and is communicatively connected to the at least one circuit board. At least one gap is introduced into the configuration, wherein only ambient medium is present between the radome and the at least one gap.

[0009] In the context of this invention, the construction of a circuit board should be understood as a structure formed on a substrate of a circuit board, particularly a certain number of metallization layers having corresponding conductor circuits and electronic components.

[0010] The substrate of the proposed radar sensor circuit board can be, in particular, a so-called "high-frequency substrate" or "high-frequency circuit board" substrate, characterized by conductor circuits specifically optimized for high-frequency applications and materials with correspondingly optimized dielectric constants and minimum impedance.

[0011] In the context of this invention, the radome should be understood as the outer shell of a radar system that is in contact with the environment and is permeable to radar waves.

[0012] The structure and the alignment of the corresponding components of the radar sensor according to the invention with respect to the radome, as determined by the invention, combined with at least one gap provided according to the invention, simultaneously meet the highest requirements for high-frequency transmission and reception power, electromagnetic radiation, thermal radiation, energy efficiency, and cost efficiency.

[0013] At least one gap in the circuit board construction according to the invention functions as a broadband waveguide antenna that guides radar signals to a radar sensor, specifically to the substrate of the circuit board, which functions as a high-frequency active surface. Accordingly, additional antennas, such as so-called "patch antennas," can be omitted when using the proposed radar sensor.

[0014] The circuit board construction of the radar sensor, with its arrangement between the substrate and the corresponding radome, minimizes the attenuation of radar waves incident on the radar sensor as they pass through the substrate and, consequently, maximizes the received power of the radar sensor. This allows the utilization of a very wide frequency band, including, for example, radar signals in the frequency range of 76-81 GHz.

[0015] It can be specified that all control instruments communicating with the substrate are thermally coupled to at least one cooling body, which is disposed at a distance from the substrate on the side of the substrate opposite to the structure.

[0016] The arrangement of the corresponding control instruments on the side of the substrate opposite to the aforementioned structure enables space-saving thermal control of the control instruments using only a single common cooling body.

[0017] By directly mounting the control instrument, such as a microcontroller, processor, ASIC, or any other programmed component, on the substrate of a circuit board provided according to the invention, the conduction path and corresponding conduction loss can be minimized in communication between the at least one control instrument and the corresponding component of the circuit board.

[0018] Furthermore, it can be specified that the at least one void is metallized on its surface.

[0019] The metallization of the at least one gap maximizes the function of the at least one gap as an antenna by minimizing the power loss of radar waves radiated through the gap.

[0020] Furthermore, it can be specified that a metallized portion for shielding electromagnetic radiation is provided on the outer side of the circuit board according to the present invention, facing away from the substrate or towards the corresponding radome.

[0021] By shielding the outer side of the circuit board structure of the proposed radar sensor, so-called "electromagnetic compatibility" (EMC) can be maximized, i.e., the interference power emitted by the radar sensor to other instruments can be minimized. Here, the shielding can be formed by a metallization layer within the circuit board itself, thus eliminating the need to introduce additional shielding material into or apply to the circuit board, and allowing for low-cost manufacturing of the radar sensor. Correspondingly, the metallization on the outer side of the circuit board structure of the proposed radar sensor results in improved immunity to external interference radiation, so-called "EMI optimization," without the need for additional EMI filters.

[0022] Furthermore, it can be specified that the structure is an FR4 circuit board.

[0023] FR4 circuit boards are present as standard components in all electronic instruments and can be manufactured more cost-effectively than specialized components.

[0024] In a second aspect, the present invention relates to a radar system for transmitting and receiving radar waves. The radar system includes a possible design of the proposed radar sensor and an radome, wherein the substrate of the radar sensor's circuit board is disposed on a side facing away from the radome, and the circuit board of the radar sensor is configured between the radome and the substrate.

[0025] It can be specified that the radar system includes a base, the base including a receiving portion for mounting the radar sensor, wherein the receiving portion is configured to align the radar sensor relative to an antenna radome such that the substrate of the radar sensor's circuit board is on a side away from the antenna radome, and the configuration of the radar sensor's circuit board is located between the antenna radome and the substrate.

[0026] With the aid of a receiving part, such as a clamp (Klemmleiste), a simple and precise arrangement structure of the proposed radar sensor on the substrate of the proposed radar system can be achieved.

[0027] In a third aspect, the present invention relates to a method for manufacturing a radar system, wherein a possible design of the proposed radar sensor is disposed on a substrate such that the substrate of the radar sensor's circuit board is located on a side away from the radome of the radar system, and the circuit board of the radar sensor is constructed between the radome and the substrate.

[0028] It can be specified that at least one gap is introduced into the structure of the circuit board and is metallized on its surface.

[0029] In order to introduce the at least one gap into the structure, the structure may be processed independently of the substrate or separately from or together with the substrate in, for example, a stamping process, a milling process, or a cutting process.

[0030] By introducing a metallization layer, i.e. a metal coating, into the corresponding gap, thereby metallizing the wall surrounding the corresponding gap, the function of the gap as a waveguide antenna can be maximized.

[0031] Furthermore, it can be specified that the structure is manufactured in a first manufacturing step, independent of the second manufacturing step used to manufacture the substrate.

[0032] By employing manufacturing steps independent of the fabrication of the corresponding substrate for the fabrication of the structure, in which gaps are introduced into the structure, the components of the proposed radar sensor circuit board, i.e., the substrate and the structure, can be provided efficiently and rapidly. To introduce the gaps into the structure, the structure can be, for example, stamped, cut, or milled and optionally subsequently at least partially surrounded, for example, by a metallization layer. In another manufacturing step, the structure provided with the gaps can be attached to the substrate to form a circuit board. Attached Figure Description

[0033] The invention will now be explained in detail with reference to the accompanying drawings. In the drawings:

[0034] Figure 1 This paper illustrates one possible design of the proposed radar system with the proposed radar sensor.

[0035] Figure 2 This paper presents one possible design scheme for the proposed manufacturing method. Detailed Implementation

[0036] exist Figure 1 The image shows a radar system 100. The radar system 100 includes a radar sensor 101 and an antenna radome 103.

[0037] The radar sensor 101 includes a component 105 in the form of an integrated HF circuit for generating and processing HF signals and a control instrument 107 in the form of an integrated circuit for controlling or regulating the radar sensor 101.

[0038] The component 105 and the control instrument 107 are disposed on the metal body 109, which is used to extract heat energy from the component 105 and the control instrument 107.

[0039] The component 105 and the control instrument 107 are respectively connected to the substrate 111 of the radar sensor 101. The substrate serves as a support for the component 105 and the control instrument 107, and is connected via a high-frequency signal conductor circuit 113 to a waveguide antenna formed by a corresponding gap 119 in the structure 115 of the circuit board 117 of the radar sensor.

[0040] The void 119 can be filled with an environmental medium, such as air.

[0041] Here, the metallization or metal coating 121 on the exterior of the structure 115 of the circuit board 117 acts as a shield against electromagnetic radiation and thus maximizes electromagnetic compatibility or minimizes the electromagnetic radiation of the radar sensor 101.

[0042] The metallization structure 123 integrated into the configuration 115 is specifically used for the distribution of low-frequency or digital signals within the configuration 115, or circuit board 117, and for providing voltage to components of the radar sensor 101, such as the component 105.

[0043] The structure 115 is disposed on the substrate 111 and together with the substrate 111 forms a circuit board 117.

[0044] exist Figure 2 A manufacturing method 200 is shown. The manufacturing method 200 includes a providing step 201, which is used to provide a radar sensor, for example, according to... Figure 1 The radar sensor 101 and the substrate, as well as the radome, for example, according to Figure 1 Antenna radome 103.

[0045] In the bonding step 203, the radar sensor 101 is inserted into the receiving portion of the substrate. Here, the receiving portion is designed such that the radar sensor 101 can only be introduced into the receiving portion, such that the configuration 115 of the radar sensor 101 is disposed between the substrate 111 and the radome 103, the substrate being, for example, a high-frequency substrate.

[0046] In an optional gapping step 205, at least one gap may be introduced into the construction consisting of a metallization layer or metallization structure. For this purpose, the at least one gap may be, for example, stamped, cut, or milled. The construction having the at least one gap can then be disposed on a substrate to, for example, form a radar sensor 101.

[0047] List of reference numerals

[0048] 100 radar system

[0049] 101 radar sensor

[0050] 103 radome

[0051] 105 First Control Instrument

[0052] 107 Second Control Instrument

[0053] 109 metal body

[0054] 111 substrate

[0055] 113 High-frequency signal conductor circuit

[0056] 115 Structure

[0057] 117 circuit board

[0058] 119 gap

[0059] 121 coating

[0060] 123 Metallized Structure

[0061] 200 Manufacturing Method

[0062] 201 provides steps

[0063] 203 Joining Steps

[0064] 205 gap step

Claims

1. A radar sensor (101) for transmitting and receiving radar waves. in, The radar sensor (101) includes: - At least one control instrument (105, 107). - At least one circuit board (117). The at least one circuit board (117) includes a substrate (111) and a structure (115) having a plurality of metallized structures (123) disposed on the substrate (111). The radar sensor (101) is configured to be mounted on the radome (103), such that the substrate (111) is mounted on the side opposite to the radome (103) and the structure (115) is mounted between the radome (103) and the substrate (111). The at least one control instrument (105, 107) is disposed on the side of the substrate (111) away from the radome (103) and is in communicative connection with the at least one circuit board (117). At least one gap (119) is introduced into the configuration (115), with only the ambient medium between the radome (103) and the at least one gap (119), wherein the at least one gap in the configuration of the circuit board functions as a broadband waveguide antenna that guides radar signals onto the substrate of the circuit board, the substrate functioning as a high-frequency active surface. A metallization portion for shielding electromagnetic radiation is provided on the outer side of the structure (115) away from the substrate (111).

2. The radar sensor (101) according to claim 1. Its features are, The at least one void (119) is metallized on its surface.

3. The radar sensor (101) according to claim 1 or 2. Its features are, All control instruments (105, 107) that are communicatively connected to the substrate (111) are thermally coupled to at least one cooling body, which is disposed at a distance from the substrate (111) on the side of the substrate (111) opposite to the structure (115).

4. The radar sensor (101) according to claim 1 or 2. Its features are, The at least one circuit board (117) includes a printed circuit board with a high-frequency substrate as the substrate (111).

5. The radar sensor (101) according to claim 1 or 2. Its features are, The at least one structure (115) is an FR4 circuit board.

6. A radar system for transmitting and receiving radar waves (100). in, The radar system (100) includes: - The radar sensor (101) according to any one of claims 1 to 5. - Radome (103). The substrate (111) of at least one circuit board (117) of the radar sensor (101) is disposed on the side away from the radome (103), and the configuration (115) of the circuit board (117) of the radar sensor (101) is disposed between the radome (103) and the substrate (111).

7. The radar system (100) according to claim 6. Its features are, The radar system (100) includes a base including a receiving portion for mounting the radar sensor (101), wherein the receiving portion is configured to align the radar sensor (101) relative to a radome (103) such that the substrate (111) of at least one circuit board (117) of the radar sensor (101) is on a side away from the radome (103), and the configuration (115) of the at least one circuit board (117) of the radar sensor (101) is located between the radome (103) and the substrate (111).

8. A manufacturing method (200) for a radar system (100), In the method, a radar sensor (101) according to any one of claims 1 to 5 is disposed on a substrate such that the substrate (111) of at least one circuit board (117) of the radar sensor (101) is located on a side away from the radome (103) of the radar system (100), and the configuration (115) of the at least one circuit board (117) of the radar sensor (101) is located between the radome (103) and the substrate (111).

9. The manufacturing method according to claim 8, Its features are, At least one void is introduced into the construction (115) of the at least one circuit board (117) and is metallized on its surface.

10. The manufacturing method according to claim 8 or 9, Its features are, The structure (115) is manufactured in a first manufacturing step, independent of the second manufacturing step for manufacturing the substrate (111).

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