1.x-dimensional ultrasound transducer array with elevation control for bore and associated devices, systems, and methods

Abstract

An ultrasound imaging system includes an ultrasound probe. The ultrasound probe includes a housing and a transducer array having a first acoustic element, a second acoustic element, and a third acoustic element. The first acoustic element is arranged between the second acoustic element and the third acoustic element in an elevation dimension. The first acoustic element generates a first analog ultrasound signal, and the second and third acoustic elements are electrically coupled to generate a second analog ultrasound signal. The ultrasound probe includes a first amplifier in communication with the first acoustic element. The ultrasound probe includes a second amplifier and a third amplifier in communication with the second acoustic element and the third acoustic element. The first amplifier and the second amplifier apply gain to the first analog ultrasound signal and the second analog ultrasound signal, respectively, according to a first gain profile. The third amplifier applies gain to the second analog ultrasound signal only according to a second gain profile that is different from the first gain profile.

Description

Technical Field

[0001] This disclosure generally relates to ultrasound imaging using a 1.X-dimensional transducer array. In particular, different gain profiles can be applied to the facade transducer elements to modify the facade dimensions of the aperture of the 1.X-dimensional array and to focus the imaging beam at different depths. Background Technology

[0002] Ultrasound imaging systems are frequently used in medical imaging. An ultrasound imaging system typically includes a transducer probe and a main processing system. The transducer probe may include an array of ultrasound transducer elements. The ultrasound transducer elements transmit sound waves through the patient's body and subsequently record the echo signals as the sound waves are reflected back by tissues and / or organs within the patient's body. The timing and / or intensity of the echo signals can correspond to the size, shape, and mass of the patient's tissues, organs, or other features. The patient's tissues, organs, or other features can then be displayed to the user of the ultrasound system.

[0003] Ultrasonic imaging systems utilize various types of transducer arrays. For example, an ultrasound system can have a one-dimensional array or a two-dimensional matrix array. While two-dimensional matrix arrays offer the greatest capability for focusing or manipulating the imaging beam, they require many transducer elements and can be expensive. 1.X-dimensional transducer arrays may require fewer transducer elements but still retain some aspects of control in the vertical direction, including the ability to focus the ultrasound imaging beam at different depths. However, focusing the ultrasound imaging beam using a 1.X-dimensional array often requires complex circuitry with many electrical components, leading to increased costs for the ultrasound imaging system. Summary of the Invention

[0004] Embodiments of this disclosure are systems, apparatus, and methods for ultrasound imaging using a 1.X-dimensional transducer array. The ultrasound system may include a main unit, a probe, and connecting cables. The ultrasound imaging probe may include a 1.X-dimensional transducer array. The transducer array can transmit ultrasound signals toward a region of a patient's anatomical structure and receive reflected waves to form an image. Facade rows of ultrasound transducers positioned on either side of the central row of transducers can be used to focus the ultrasound imaging beam. The gain of the facade transducers can be gradually increased as the imaging depth increases, or as the distance between the region to be imaged and the ultrasound probe increases. This increase in the gain of the facade elements effectively increases the elevation dimension of the transducer array's aperture and results in improved data quality in deeper regions of the anatomical structure.

[0005] Some embodiments of this disclosure apply individual gain profiles to the exterior and center elements to progressively increase the gain of the external transducer elements. Other embodiments apply a common gain profile to all transducer elements and a weighted profile to the external transducer elements to progressively increase the gain of the external elements. Still other embodiments facilitate imaging beam focusing by converting the received analog signal to a digital signal and applying a delay to the external and / or internal transducer elements. The disclosed embodiments provide increased signal and image quality at different depths within the patient's anatomy while reducing the required circuitry, resulting in a simpler and more cost-effective ultrasound imaging probe.

[0006] In an exemplary aspect of this disclosure, an ultrasound imaging system is provided. The ultrasound imaging system includes an ultrasound probe comprising: a housing; a transducer array mechanically coupled to the housing, wherein the transducer array includes a first acoustic element, a second acoustic element, and a third acoustic element, wherein the first acoustic element is arranged in an elevation dimension between the second and third acoustic elements, wherein the first acoustic element is configured to generate a first analog ultrasound signal, and the second and third acoustic elements are electrically coupled to generate a second analog ultrasound signal; a first amplifier disposed within the housing and communicating with the first acoustic element; and a second and third amplifier disposed within the housing and communicating with the second and third acoustic elements, wherein the first and second amplifiers are configured to apply gain to the first and second analog ultrasound signals respectively according to a first gain profile, and wherein the third amplifier is configured to apply gain only to the second analog ultrasound signal according to a second gain profile different from the first gain profile.

[0007] In some aspects, the transducer array comprises a 1.X-dimensional array. In some aspects, the transducer array comprises a first row of acoustic elements, a second row of acoustic elements, and a third row of acoustic elements, the first row of acoustic elements being arranged in the elevation dimension between the second row of acoustic elements and the third row of acoustic elements, the first row of acoustic elements comprising the first acoustic element, the second row of acoustic elements comprising the second acoustic element, and the third row of acoustic elements comprising the third acoustic element. In some aspects, the ultrasonic probe further comprises a first analog summing circuit communicating with a first amplifier and the third amplifier, the first analog summing circuit being configured to combine the first analog ultrasonic signal with the second analog ultrasonic signal to generate a first analog output.

[0008] In some aspects, the ultrasonic probe further includes circuitry communicating with the first, second, and third acoustic elements, the circuitry including the first, second, and third amplifiers, the circuitry communicating with a fourth, fifth, and sixth acoustic element, the fourth acoustic element being arranged in the elevation dimension between the fifth and sixth acoustic elements, the first, second, and third acoustic elements being arranged in a first column of the transducer array, the fourth, fifth, and sixth acoustic elements being arranged in a second column of the transducer array, and the first and second columns being spaced apart from each other in the azimuth dimension such that other columns of the transducer array are arranged between the first and second columns.

[0009] In some aspects, the ultrasonic probe further includes: a fourth amplifier disposed within the housing and communicating with the fourth acoustic element; a fifth amplifier and a sixth amplifier disposed within the housing and communicating with the fifth acoustic element and the sixth acoustic element; and a second analog summing circuit communicating with the fourth amplifier and the sixth amplifier, the fourth acoustic element being configured to generate a third analog ultrasonic signal, and the fifth acoustic element and the sixth acoustic element being electrically coupled to generate a fourth analog ultrasonic signal, the fourth amplifier and the fifth amplifier being configured to apply gain to the third analog ultrasonic signal and the fourth analog ultrasonic signal respectively according to a first gain profile, the sixth amplifier being configured to apply gain to only the fourth analog ultrasonic signal according to a second gain profile, and the second analog summing circuit being configured to combine the third analog ultrasonic signal and the fourth analog ultrasonic signal to generate a second analog output.

[0010] In some aspects, the ultrasound probe further includes a multiplexer configured to translate the aperture of the transducer array in the azimuth dimension. In some aspects, the multiplexer is configured to select between a first analog output and a second analog output. In some aspects, the ultrasound probe further includes an analog-to-digital converter (ADC) communicating with the analog summing circuit, the ADC being configured to receive the output of the analog summing circuit and generate a digital ultrasound signal. In some aspects, the system further includes a host system spaced apart from the ultrasound probe and a cable extending between the host system and the ultrasound probe, the ultrasound probe being configured to transmit the digital ultrasound signal to the host system via the cable, and the host system including processor circuitry configured to generate an ultrasound image based on the digital ultrasound signal and output the ultrasound image to a display communicating with the processor circuitry. In some aspects, the third amplifier is configured to increase the elevation dimension of the aperture of the transducer array. In some aspects, the ultrasound probe further includes: a digital adder; a first analog-to-digital converter (ADC) communicatively positioned between the first amplifier and the digital adder; and a second ADC communicatively positioned between the second amplifier and the digital adder. In some aspects, the third amplifier includes a digital amplifier communicatively positioned between the second ADC and the digital adder. In some aspects, the ultrasound probe further includes: a first digital delay communicatively positioned between the first ADC and the digital adder; and a second digital delay communicatively positioned between the second ADC and the third amplifier. In some aspects, the ultrasound probe further includes: a first clock control communicating with the first ADC and the first digital delay; and a second clock control communicating with the second ADC and the second digital delay.

[0011] In an exemplary aspect of this disclosure, an ultrasound imaging probe is provided. The ultrasound imaging probe includes: a housing; a 1.X-dimensional transducer array mechanically coupled to the housing, wherein the transducer array includes a first row of acoustic elements, a second row of acoustic elements, and a third row of acoustic elements, wherein the first row of acoustic elements is arranged in an elevation dimension between the second row of acoustic elements and the third row of acoustic elements, wherein the second row of acoustic elements and the third row of acoustic elements are electrically coupled; a first amplifier, a second amplifier, and a third amplifier disposed within the housing; and an analog-to-digital converter (ADC) configured to generate a digital ultrasound signal such that the ultrasound imaging probe outputs the digital ultrasound signal, wherein... The first amplifier is configured to apply gain to a first analog ultrasonic signal associated with the first row of acoustic elements according to a first gain profile, wherein the second amplifier is configured to apply gain to a second analog ultrasonic signal associated with the second row of acoustic elements and the third row of acoustic elements according to the first gain profile, wherein the third amplifier is configured to apply gain to only the second analog ultrasonic signal according to a second gain profile different from the first gain profile, such that the elevation dimension of the aperture of the transducer array is increased, and wherein the ADC is configured to generate the digital ultrasonic signal based on at least one of the first analog ultrasonic signal or the second analog ultrasonic signal.

[0012] Additional aspects, features, and advantages of this disclosure will become apparent from the following detailed description. Attached Figure Description

[0013] Illustrative embodiments of this disclosure will be described with reference to the accompanying drawings, in which:

[0014] Figure 1 This is a schematic diagram of an ultrasound imaging system according to aspects of this disclosure.

[0015] Figure 2 This is a schematic diagram of a processor circuit according to aspects of this disclosure.

[0016] Figure 3 This is a schematic diagram of an example circuit of an ultrasound imaging system having a 1.X-dimensional transducer array according to aspects of this disclosure.

[0017] Figure 4 This is a graph illustrating an example gain profile of an electrical signal generated by transducer elements of a transducer array according to aspects of this disclosure.

[0018] Figure 5 This is a schematic diagram of an example circuit communicating with a transducer array according to aspects of this disclosure.

[0019] Figure 6 This is a schematic diagram of an example circuit communicating with a transducer array according to aspects of this disclosure.

[0020] Figure 7 This is a schematic diagram of an example circuit communicating with a transducer array according to aspects of this disclosure. Detailed Implementation

[0021] For the purpose of facilitating an understanding of the principles of this disclosure, reference will now be made to embodiments illustrated in the accompanying drawings, and these embodiments will be described using specific language. However, it should be understood that this disclosure is not intended to be limiting. As will be normally understood by those skilled in the art to which this disclosure pertains, any alterations and additional modifications to the described devices, systems, and methods, as well as any further application of the principles of this disclosure, are fully contemplated and included within this disclosure. In particular, it is fully contemplated that features, components, and / or steps described with respect to one embodiment may be combined with features, components, and / or steps described with respect to other embodiments of this disclosure. However, for the sake of brevity, numerous repetitions of these combinations will not be described separately.

[0022] Figure 1 This is a schematic diagram of an ultrasound imaging system according to aspects of this disclosure. System 100 is used to scan regions, areas, or volumes of a patient's body. System 100 includes an ultrasound imaging probe 110 that communicates with a host 130 via a communication link 150. At a high level, probe 110 emits ultrasound waves toward an anatomical object 105 (e.g., a patient's body) and receives ultrasound echoes reflected from the object 105. Probe 110 transmits an electrical signal representing the received echo to host 130 via link 150 for processing and image display. The signal representing the received echo can be transmitted via link 150 in analog, digital, and / or both analog and digital formats. Probe 110 can take any suitable form for imaging various body parts of a patient, whether positioned inside or outside the patient's body. For example, probe 110 can take the form of a handheld ultrasound scanner (such as a transthoracic echocardiography (TTE) probe) or a patch-based ultrasound device. In some embodiments, the ultrasound probe is not handheld but held in place via a strap, mechanical retainer, and / or adhesive. In some embodiments, probe 110 may be a catheter, a transesophageal echocardiography (TEE) probe, or other intraluminal or intravascular probe. Probe 110 may include Figure 1 Any component shown. Any component of probe 110 may be positioned or stored in housing 111. When probe 110 is a handheld probe, housing 111 is configured to be gripped by the user's hand.

[0023] The probe 110 includes a transducer array 112, circuitry 114, and a communication interface 140, all of which are mechanically coupled to a housing of the probe 110. The transducer array 112 emits ultrasonic signals toward the object 105 and receives echo signals reflected back from the object 105 to the transducer array 112. The transducer array 112 may include an array of acoustic elements. In an exemplary embodiment, the transducer array 112 is a 1.X-dimensional array, such as a 1.25D array or a 1.5D array. The acoustic elements may be referred to as transducer elements. Each transducer element may emit ultrasonic waves toward the object 105 and may receive echoes when the ultrasonic waves are reflected back from the object 105. Each transducer element generates an analog electrical signal representing the received ultrasonic echo. The transducer array 112 may include M transducer elements that generate M analog ultrasonic echo channel signals 160. In some embodiments, M can be about 2, 16, 64, 128, 192, 500, 1000, 5000, 9000 and / or larger, smaller or other suitable values ​​between them.

[0024] The circuitry 114 located within probe 110 can be of any suitable type and can serve several functions. For example, circuitry 114 may include resistors, capacitors, transistors, inductors, relays, clocks, timers, or any other suitable electrical components that can be integrated into an integrated circuit. Additionally, circuitry 114 may be configured to support analog and / or digital signals transmitted to or from transducer array 112 and / or probe 110. In some embodiments, circuitry 114 may include an analog front-end (AFE), an analog-to-digital converter (ADC), a multiplexer (MUX), and an encoder, as well as various other components. In some embodiments, circuitry 114 may include hardware components, software components, and / or a combination of hardware and software components.

[0025] Communication interface 122 is coupled to circuit 114 via L signal lines. In some embodiments, circuit 114 can reduce the required number of lines from M signal lines to L signal lines. This can be achieved by any suitable method using any suitable components. For example, a MUX, beamformer, or other components can be used to reduce the M signal lines from transducer array 112 to L signal lines 166. Figure 1In this embodiment, L is less than M. Communication interface 122 is configured to transmit L signals 166 to host 130 via communication link 150. Communication interface 122 may include a combination of hardware and software components configured to generate a signal 168 carrying information from the signals 166 for transmission over communication link 150. In an exemplary embodiment, signal 168 is a digital signal causing digital ultrasound data to be transmitted from probe 110 to host 130. Communication link 150 may include L data channels for transmitting digital signal 168 to host 130.

[0026] The host 130 can be any suitable computing and display device, such as a workstation, personal computer (PC), laptop computer, tablet computer, mobile phone, or patient monitor. In some embodiments, the host 130 can be positioned on a mobile cart. At the host 130, a communication interface 140 can receive digital signals 168 from a communication link 150. The communication interface 140 may include hardware components, software components, or a combination of hardware and software components. The communication interface can be substantially similar to the communication interface 122 in the probe 110.

[0027] The circuitry 134 located within the host unit 130 can be of any suitable type and can serve any suitable function. For example, circuitry 134 may include resistors, capacitors, transistors, inductors, relays, clocks, timers, processing components, memory components, or any other suitable electrical components that can be integrated into an integrated circuit. Additionally, circuitry 134 can be configured to support analog and / or digital signals sent to or from probe 110. Circuitry 134 can be configured to process digital signals 168 received from probe 110. For example, circuitry 134 can extend L signal lines received from probe 110 to the original M signal lines corresponding to specific transducer elements or groups of transducer elements or patches within transducer array 112. Circuitry 134 can be configured to generate image signals 174 for display to the user and / or perform image processing and image analysis for various diagnostic modalities or ultrasound types (B-mode, CW Doppler, etc.). Circuit 134 may additionally include a central processing unit (CPU), a digital signal processor (DSP), a graphics processing unit (GPU), an application-specific ensemble (ASIC), a controller, a field-programmable gate array (FPGA), another hardware device, a firmware device, or any combination thereof. Circuit 134 may also be implemented as a combination of computing devices, such as a DSP and a microprocessor, a GPU and a microprocessor, multiple microprocessors, one or more microprocessor cores combined with a DSP, or any other combination of such configurations. Circuit 134 may be configured to generate image signals 174 for display to a user and / or perform image processing and image analysis for various diagnostic modalities.

[0028] Display unit 132 is coupled to circuit 134. Display unit 132 may include a monitor, touchscreen, or any suitable display. Display unit 132 is configured to display images and / or diagnostic results processed by circuit 134. Host 130 may also include a keyboard, mouse, touchscreen, or any suitable user input device configured to receive user input for controlling system 100.

[0029] Although described in the context of transmitting detected ultrasound echo data from probe 110 to host 130 for display. Figure 1 However, the host 130 can generate and send control signals for controlling the probe 110 (e.g., the excitation of the transducer elements at the transducer array 112).

[0030] Figure 2 This is a schematic diagram of a processor circuit according to aspects of this disclosure. The processor circuit 210 can be integrated with probe 110, Figure 1 The host system 130 or any other suitable location may be implemented. One or more processor circuits may be configured to perform the operations described herein. Processor circuit 210 may be part of circuits 114 and / or 134, or may be a separate circuit. In the example, processor circuit 210 may communicate with transducer array 112, circuit 114, communication interface 122, communication interface 140, circuit 134 and / or display 132, and any other suitable components or circuits within the ultrasound system 100. As shown, processor circuit 210 may include processor 260, memory 264, and communication module 268. These components may communicate directly or indirectly with each other, for example, via one or more buses.

[0031] Processor 260 may include a CPU, GPU, DSP, application-specific integrated circuit (ASIC), controller, FPGA, another hardware device, firmware device, or any combination thereof configured to perform the operations described herein. Processor 260 may also be implemented as a combination of computing devices, such as a DSP and a microprocessor, multiple microprocessors, one or more microprocessor cores combined with a DSP, or any other combination of such configurations.

[0032] Memory 264 may include cache memory (e.g., cache memory of processor 260), random access memory (RAM), magnetoresistive RAM (MRAM), read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory, solid-state memory device, hard disk drive, solid-state drive, other forms of volatile and non-volatile memory, or combinations of different types of memory. In embodiments, memory 264 includes a non-transient computer-readable medium. Memory 264 may store instructions 266. Instructions 266 may include, when executed by processor 760, causing processor 260 to perform the functions described herein, reference probe 110 and / or host 130 (…). Figure 1 Instructions describing operations. Instruction 266 may also be referred to as code. The terms "instruction" and "code" should be interpreted broadly to include any type of computer-readable statement(s). For example, the terms "instruction" and "code" can refer to one or more programs, routines, subroutines, functions, procedures, etc. The terms "instruction" and "code" can include a single computer-readable statement or many computer-readable statements.

[0033] Communication module 268 may include any electronic circuitry and / or logic circuitry to facilitate direct or indirect data communication between processor circuitry 210, probe 110, and / or host 130 and / or display 132. In this respect, communication module 268 may be an input / output (I / O) device. In some instances, communication module 268 facilitates direct or indirect data communication between processor circuitry 210 and / or probe 110. Figure 1 ) and / or host 130 ( Figure 1 Direct or indirect communication between various components.

[0034] Figure 3 This is a schematic diagram of an example circuit of an ultrasound imaging system 100 having a 1.X-dimensional transducer array according to aspects of this disclosure. For example, Figure 3 A more detailed view of the circuitry within probe 110 is provided. (e.g.) Figure 3 As shown, the circuitry of probe 110 includes a transducer array 112. The transducer array 112 communicates with multiple circuits or circuit systems 310 via multiple conductors 390 (including conductors 391, 392, 393, and 394, etc.). Any of the conductors 390 may also be referred to as a conductive path or conductive trace. Probe 110 may additionally include a combiner 322 and a serializer and / or a high-speed current-mode logic cable driver (CML) 324. Figure 3As shown, the host 130 can also communicate with the probe 110 via multiple connecting conductors. Specifically, the connecting conductors may include power and control conductors 380 and multiple transducer conductors 386. The connecting conductors (including power and control conductors 380 and transducer conductors 386) may be formed together as a cable, may be formed as multiple separate cables, or may be arranged in any other suitable configuration. Any component of the probe 110 may be positioned or stored in a housing.

[0035] In some embodiments, transducer array 112 is a 1.X-dimensional array. For example, transducer array 112 may be a 1.25D array, a 1.5D array, a 1.75D array, or any suitable type of 1.X-dimensional array. In some aspects, the 1.25D array may include circuitry for controlling aperture size in elevation. The 1.5D array may include additional circuitry configured to apply various delays in the elevation dimension to signals received from elements in order to focus those signals. In some embodiments, the 1.25D and 1.5D arrays may assume symmetry, wherein gain and delay are centrally symmetric about the elevation dimension. The 1.75D array may apply different delays in elevation to each external element and may be configured to redirect the sound beam. The 1.75D array may be row-symmetric about the center of the elements, or it may be asymmetrical.

[0036] 1. An X-dimensional array refers to a transducer array comprising a single row of internal transducer elements, wherein additional rows of external transducer elements are located on either side of the row of internal transducer elements. These additional rows of external transducer elements may be symmetrical, such that there are an equal number of external element rows on both sides of the row of internal transducer elements. The external transducer element rows are used to provide elevation control or focus control. These additional external transducer element rows are electrically coupled together such that they are operated for consistent transmission and reception.

[0037] As an example, Figure 3 The transducer array 112 shown is a 1.5-dimensional array. Axes 398 and 399 provide... Figure 3 The orientation of the transducer array 112 is shown. Specifically, axis 398 illustrates the elevation or height direction, and axis 399 illustrates the azimuth or lateral direction. The transducer array 112 includes one row of inner transducer elements 305b and two rows of outer transducer elements 305a, with one row of outer transducer elements 305a on each side of the inner row 305b in the elevation direction. The outer elements 305a include twice the number of transducer elements as the inner elements 305b and are positioned such that one outer element 305a is positioned above each inner element 305b in the elevation direction, and another outer element 305a is positioned below each inner element 305b in the elevation direction, as shown. Figure 3 As shown. Figure 3The embodiment shown with one row of internal elements 305b and two rows of external elements 305a can be referred to as three elements at elevation or three rows of elements at elevation. In some embodiments, the transducer array 112 may include only Figure 3 The diagram shows three rows of elements. In other embodiments, transducer array 112 includes additional rows of elements. In other embodiments, transducer array 112 may include five rows of transducer elements at elevation, seven rows of transducer elements at elevation, nine rows or more rows. Some embodiments of this disclosure include symmetrical rows of transducer elements, such that an odd number of rows of transducer elements are used. Similar to... Figure 3 The transducer array 112 shown, in embodiments with additional rows of external transducer elements, can also couple the external rows so that the external rows are driven together. For example, two external rows directly adjacent to the center row and located on either side of the center row can be coupled together, as can two or more external rows adjacent to the first external row and located on either side of the first external row, and so on. For example, row 305a is coupled together.

[0038] In other embodiments, row 305a may alternatively be simply a single row of transducer elements positioned above or below transducer row 305b in the elevation direction 398. In such embodiments, transducer array 112 may include only two rows of transducer elements. In still other embodiments, transducer array 112 may include an even number of rows of transducer elements, greater than two.

[0039] As will be discussed in more detail below, different gain profiles are applied to transducer elements in different rows to enable imaging at different depths within the patient's anatomy. For example, in Figure 3 In the illustrated embodiment, signals received only from the inner row 305b can be used for imaging at locations close to the transducer array 112. Alternatively, when imaging at locations further away from the transducer array 112, signals from the outer row 305a can be gradually added to widen the aperture of the array in elevation. For simplicity, reference is made to odd-numbered rows that are wired symmetrically (e.g., Figure 3 The three-row configuration of the transducer elements shown provides a description of the various components within probe 110. However, it is entirely expected that additional rows could be implemented based on the same principles presented.

[0040] In embodiments with only two transducer rows (row 305b and a single row 305a positioned only above or below row 305b), signals received from the transducer elements of row 305b can be used for near-field imaging, and signals from both row 305b and row 305a can be used for far-field imaging. In such embodiments, the resulting near-field and far-field beams may be slightly misaligned, but the misalignment can be kept within clinically acceptable limits. Embodiments with only two rows of transducers within transducer array 112 can reduce manufacturing costs by reducing the number of required transducer elements and do not require... Figure 3 The electrical coupling between the external components is shown. This disclosure can also be applied to embodiments having descriptions of internal components associated with rows used for near-field imaging and external components associated with additional rows used for far-field imaging.

[0041] The transducer rows within the transducer array 112 can include any suitable number of transducer elements. For example, the row of transducer elements 305b and both rows of transducer elements 305a can each include 1, 2, 16, 50, 64, 75, 80, 90, 100 transducer elements, or any suitable number of transducer elements larger, smaller, or somewhere in between. Each row of transducer elements 305 can include an odd or even number of transducer elements. In some embodiments, such as Figure 3 As shown, the transducer array 112 can be further organized into columns 301. For example, a column of transducers 301a in Figure 3 At the azimuth or lateral end of the transducer array 112 on the left. For example... Figure 3As shown, column 301a includes three transducer elements: a central transducer element 305b and two outer elements 305a. The central transducer element may also be referred to as the first transducer element, and the outer transducer elements may also be referred to as the second and third transducer elements. In an embodiment where transducer array 112 includes five rows of transducer elements, column 301a will include five transducer elements, and so on. Adjacent to column 301a in the azimuth direction and to the right of column 301a, column 301b is shown. Column 301b also includes three transducer elements: a central element 305b and two outer elements 305a. Although not labeled, the transducer column adjacent to and to the right of column 301b may be an additional column 301c, etc., as indicated by the ellipse. Transducer column 301 may continue in a similar manner up to column 301l. Columns 301a to 301l may represent the first portion of a transducer column. For example, columns 301a to 301l may constitute half of the transducer elements in transducer array 112. A second portion (e.g., a second half) of transducer column 301 or transducer elements in transducer array 112 is depicted to the right of column 301l. In various embodiments, the arrangement of transducer elements is not necessarily limited to half of the array, but may be divided into sections or groups corresponding to one-third, one-quarter, two-thirds, or any other fractional portion or suitable arrangement or configuration. Column 301m may represent a first transducer column 301 corresponding to the second portion of transducer column 301. Adjacent to and to the right of column 301m may be additional columns 301n, followed by columns 301o, etc., as indicated by the second set of ellipses. Thus, such transducer elements may continue up to transducer column 301z at the rightmost end of transducer array 112. Although reference numerals 301a to 301z have been used to indicate... Figure 3 The transducer element array 305 shown, but Figure 3 The transducer array 112 shown does not necessarily contain 26 columns of transducer elements 305. Rather, and as previously stated, the transducer array 112 may include any suitable number of rows and / or columns.

[0042] In some embodiments, an ultrasound image is generated based on a series of acoustic lines or A-lines, wherein each line is formed by an array of elements translated through an aperture. For example, the first line may use a set of elements 332, the second line may use a set of elements 334, and so on, with the last line using a set of elements 336.

[0043] During an ultrasound examination, the ultrasound imaging system 100 may designate a set of transducer elements 305 to transmit ultrasound signals, allowing ultrasound energy to propagate into the patient's anatomical structures. The ultrasound imaging system 100 may also designate a set of transducer elements 30 to receive reflected waves. In some embodiments, the ultrasound transducers 305 selected to transmit ultrasound signals may be the same transducers used to receive reflected waves. In other embodiments, the ultrasound transducer elements 305 used to transmit ultrasound signals are different from the elements used to receive ultrasound signals. For example, in some embodiments, the ultrasound imaging system may select half of the ultrasound transducer elements 305 to transmit ultrasound signals into the patient's anatomical structures. Figure 3 As shown in boxes 332, 334, and 336, the elements selected for signal transmission can be any transducer element. In some embodiments, the transducer elements may all be adjacent to each other. For example, Figure 3 Box 332 indicates that transducer elements 305 in columns 301a to 301l are selected by the ultrasound imaging system 100 to transmit ultrasound signals into anatomical structures and form apertures in the transducer array 112. The ultrasound imaging system 100 can shift the apertures by adjustments in the circuitry of the analog processor 310, as discussed later, such that the apertures are defined by columns 301b to 301m, as shown by box 334. The apertures can also be shifted to include columns 301c to 301n, columns 301d to 301o, and so on, until, as shown by box 336, the apertures can be configured as columns 301m to 301z. In some embodiments, the transducer elements 305 selected to transmit ultrasound signals do not need to be directly adjacent to each other, but can be spaced apart by one or more transducer elements 305 not used to transmit ultrasound signals. Since boxes 332, 334, and 336 identify the elements of the transducer array 112 that together form apertures, boxes 332, 334, and 336 may also be referred to as apertures.

[0044] like Figure 3 As shown, the transducer elements of the transducer array 112 communicate with multiple circuits 310 via multiple conductors 390. The conductors 390 electrically couple the transducer elements 305 of the transducer array 112 to the circuits 310. The conductors 390 can be of any suitable form or type. In some embodiments, the conductors 390 may include conductive paths or traces located on a printed circuit board (PCB), a flexible or non-flexible substrate, or in any other suitable configuration. Figure 3 As shown, each circuit 310 communicates with six transducer elements 305 via four conductors 390. Specifically, as Figure 3As shown, the external transducer elements 305a of column 301a can be electrically coupled to each other and to circuit 310 via conductor 391. Internal elements 305b can communicate with the same circuit 310 via conductor 392. The external elements 305a of column 301m can be coupled to each other and to the same circuit 310 via conductor 393. Finally, the internal elements 305b of column 301m can communicate with the same circuit 310 via conductor 394. The next circuit 310 can communicate with the internal elements 305b and external elements 305a of columns 301b and 301n in a similar manner. The next circuit 310 can communicate with the elements of columns 301c and 301o in a similar manner, and so on, so that all transducer elements 305 communicate with their respective circuits 310.

[0045] In other embodiments, circuit 310 may communicate with more or fewer transducer elements 305. For example, in an embodiment with five transducer rows, circuit 310 may still communicate with the two described transducer columns 301, but each column may include five transducer elements. In such an embodiment, the outermost elements may be coupled together and coupled to analog processor 310 via a conductor 390, and additional conductors 390 may couple elements between the outermost and innermost elements and to the same circuit 310, and the additional conductors 390 may provide communication between the innermost elements and circuit 310. In such an embodiment, instead of four conductors 390 communicating with circuit 310, six such conductors 390 may communicate with circuit 310. Additional transducer element rows 305 will require additional conductors 390 as can be extrapolated. Additionally, other embodiments involve one or more circuits 310 communicating with more than four transducer columns 301. These embodiments will require additional changes to the circuitry of analog processor 310 according to the embodiments outlined and discussed below.

[0046] As described in more detail herein, circuit 310 may include an analog-to-digital converter (ADC) such that the output of circuit 310 is digital data or a bit stream. As indicated by reference numeral 340, in some embodiments, the output of circuit 310 may be a 12-bit output. However, the output of circuit 310 may have any suitable bit rate (e.g., 4 bits, 8 bits, 16 bits, 24 bits, 32 bits, 64 bits, or any suitable value less than, greater than, or between those listed bit rates).

[0047] Circuit 310 can communicate with combiner 322. Combiner 322 represents circuitry that can reduce the total number of signal lines received from circuit 310 and reduce the number of signal lines required to send data to host 130. Combiner 322 can reduce the number of signal lines by any suitable method. In some embodiments, combiner 322 may include a summing node. Combiner 322 and any other suitable component or circuitry within system 100 may include features similar to those described in WO2018041636 (corresponding to U.S. application US 16 / 329,433) entitled “ULTRASOUND PROBEWITH MULTILINE DIGITAL MICROBEAMFORMER” and / or WO2019158363 (claiming priority from U.S. Provisional Application US 62 / 631,549, filed February 16, 2018, entitled “DIGITAL ULTRASOUND CABLE AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS”), both of which are incorporated herein by reference in their entirety. In some embodiments, combiner 322 may be a multiplexer that multiplexes data received from circuit 310 into a high-speed serial link and then transmits the data to host 130 for processing. In some embodiments, combiner 322 may be a digital beamformer that performs a second stage of beamforming (delay and summation of signals) after an optional analog beamformer has completed the first stage of beamforming.

[0048] Combiner 322 can communicate with serializer and high-speed current-mode logic (CML) 324. Serializer / CML 324 can rearrange lines received from combiner 322 and / or circuitry 310 into a high-speed serial data stream. In some embodiments, serializer / CML 324 can operate at a higher data rate than other circuitry within probe 110. For example, the serial data stream can operate at 2.4 GHz, while other circuitry within the ultrasound signal path can operate at 20 MHz. Serializer / CML 324 can operate in a similar manner to the serializer disclosed in WO2019158363 (titled “DIGITAL ULTRASOUND CABLE AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS”, filed February 16, 2018, U.S. Provisional Application US 62 / 631,549), which is incorporated herein by reference in its entirety. Therefore, in one of the signal paths of probe 110, digital ultrasound data (e.g., B-mode data) can be transmitted from probe 110 to host 130 via conductor 386. Conductor 386 can be a twisted-pair conductor or any other suitable form of conductor.

[0049] As mentioned earlier, detector 110 can be transmitted via Figure 1 The communication interface or link 150 communicates with the host 130. The link 150 may have any suitable number or type of conductors, but may include one or more power and / or control conductors 380 and one or more transducer conductors 386.

[0050] One or more power and / or control communication lines 380 may include one or more signal and / or power lines, including conductors, twisted pairs, or any other suitable device for transmitting data, signals, or power. For example, one or more communication lines 380 may include conductors dedicated to providing control signals or other data from host 130 to probe 110. Conductors 380 may also include conductors providing necessary power from host 130 to components within probe 110. Signal conductors may communicate with the controller or any other suitable component within host 130 and may provide signals for controlling the previously mentioned clock, switch, pulser, transducer array 112, circuit 310, combiner 322, serializer / CML324, and / or any other component within probe 110. In some embodiments, one or more signal-carrying conductors in conductor 380 may be twisted pairs. In other embodiments, they may be a single conductor or any other suitable device for transmitting data signals. In some embodiments, the data transmitted via conductor 380 may be 800 Mbps data, or data of any suitable frequency or type. Conductor 380 may also include a power line capable of communicating with a power source within host 130 or at any suitable location. Conductor 380 may provide DC or AC electrical signals to various components within probe 110.

[0051] Further connection between probe 110 and host 130 may be provided by multiple signal lines 386. Transducer lines or conductors 386 may correspond to a reduced number of signal lines output from the serializer / CML324. In some embodiments, transducer line 386 may comprise only a single signal line. In other embodiments, transducer line 386 may comprise multiple signal lines. In some embodiments, transducer line 386 may be a twisted pair. In other embodiments, they may be a single conductor, a coaxial conductor, or any other suitable communication path for transmitting data signals. Additionally, in some embodiments, transducer conductor 386 may carry analog signals. In other embodiments, conductor 386 may carry digital signals. In some embodiments, signals may be carried on an optical link. In some embodiments, signals may be carried wirelessly.

[0052] Conductor 380 and transducer line 386 can be formed together with reference. Figure 1The described connecting cable 150 is similar to a connecting cable. Specifically, conductor 380 and transducer wire 386 can be wound together using cable shielding. Conductor 380, transducer conductor 386, and any corresponding conductors encapsulated together can have any suitable length and / or can be flexible elongated members. For example, the lengths of conductor 380, transducer wire 386, and all associated conductors can be 1 meter, 2 meters, 3 meters, or larger, smaller, or other suitable values ​​between these. In other embodiments, conductor 380 and transducer wire 386 can be formed into separate connecting cables of the same or different lengths.

[0053] Figure 3 Depicted in and previously referenced Figure 1 The described host 130 may include any suitable circuitry or may have any suitable form. For example, host 130 may include circuitry such as integrated circuits, field-programmable gate arrays (FPGAs), processors, mixers, power supplies, controllers, filters, operational amplifiers, or any other suitable circuitry configured to perform various functions related to beamforming, filtering, processing, ultrasound image generation, and / or display of ultrasound images or data.

[0054] Figure 4 This is a graph 400 illustrating an example gain profile of an electrical signal generated by transducer elements 305 of transducer array 112 according to aspects of this disclosure. The gain profile depicted in graph 400 can be applied to signals received from various transducer elements 305 to improve image or data quality corresponding to structures within anatomy at various locations or depths relative to probe 110. Figure 3 The components shown can be communicatively and / or electrically positioned on a signal path, signal path, electrical path, electrical path, or any other suitable item.

[0055] The graph 400 includes a vertical axis 405 and a horizontal axis 410. Along the horizontal axis 410 are five positions 411, 412, 413, 414, and 415. The graph 400 also includes an internal component gain profile 420, an external component gain profile 425, and a weighted gain profile 430.

[0056] like Figure 4The vertical axis 405, marked in the graph, corresponds to the gain applied to the electrical signal generated by one or more transducer elements 305 within the transducer array 112. Points at lower positions along the vertical axis 405 within the graph 400 correspond to lower gain values ​​applied to the electrical signal. Conversely, points at higher positions along the vertical axis 405 correspond to higher gain values ​​applied to the electrical signal. The gain ratio between low and high gains can be in the range of 10 dB to 60 dB or any other suitable range. For example, the low gain could be -20 dB, and the high gain could be +20 dB.

[0057] like Figure 4 The horizontal axis 410 marked in the center corresponds to the depth of the anatomical object within the anatomical structure. In some cases, the depth of the anatomical object may correspond to the distance of the object from the transducer array 112. In some applications, this depth or distance can be determined by measuring the amount of time from when ultrasonic energy is emitted from probe 110 to when the reflected wave or echo is received at probe 110. In such applications, the measured depth of the anatomical object may also be referred to in terms of time or in units of time. Figure 4 The horizontal axis 410 is marked as the measurement results of depth and / or time. Points to the left of the graph 400, or lower values ​​along the horizontal axis 410, correspond to shallower depths or smaller distances from the anatomical object to the transducer array 112. For example, for anatomical structures closer to the array 112 and not too deep within the patient, the time between the transmission of the ultrasound signal and the reception of the reflected signal is shorter. In contrast, points to the right of the graph 400, or higher values ​​along the horizontal axis 410, correspond to deeper depths. For example, for anatomical structures farther from the array 112 and deeper within the patient, the time between the transmission of the ultrasound signal and the reception of the reflected signal is longer. Positions 411, 412, 413, 414, and 415 specify various depths or times related to gain profiles 420, 425, and / or 430. In the example, position 411 can correspond to 0 cm or 0 μs, position 412 can correspond to 2 cm or 26 μs, position 413 can correspond to 3 cm or 39 μs, position 414 can correspond to 5 cm or 65 μs, and position 415 can correspond to 30 cm or 390 μs. In other examples, positions 411, 412, 413, 414, and 415 can correspond to any suitable depth or time measurement appropriate for a particular application.

[0058] Gain profiles 420, 425, and 430 illustrate how the gain applied to the signal received from external element 305a can increase with increasing depth or time, thereby effectively increasing the aperture's facade size. Considering the increased attenuation associated with increased depth, this increase in aperture size increases the amplitude of the received signal, resulting in better image quality in the far field. Gain profiles 420 and 425 together relate to one method of increasing the aperture's facade size. Gain profiles 420 and 430 together relate to another method of increasing the aperture's facade width. In the near field of an image, a pinhole is used to generate a sound beam with a narrow elevation, resulting in good detail and contrast resolution. However, this pinhole lacks sufficient energy to see deep within the body. To achieve the desired penetration in the far field, all elements within an elevation aperture are used.

[0059] In some embodiments, gain profiles 420 and 425 can be used to apply separate gain profiles to the electrical signals of internal element 305b and external element 305a, respectively. Gain profile 420, shown in graph 400, can represent the gain profile applied to internal element 305b within transducer array 112. At point 411, representing a location near transducer array 112 along the horizontal depth / time axis 410, the gain applied to the signal received from internal element 305b is low or has a reduced amplitude. The gain applied to the signal received from external element 305a, as shown by gain profile 425, can be zero at location 411 because external element 305a may not need to receive echoes from shallow location 411.

[0060] As depth and / or time increase along the horizontal depth / time axis 410 from point 411 to point 412, the gain applied to the signal received from internal element 305b gradually increases, as by Figure 4 The gain profile 420 is shown. At points 411 and 412, the gain applied to the signal received from the external element 305a can remain zero. Therefore, between points 411 and 412, the aperture dimensions remain unchanged, but the gain applied to the electrical signal generated by the internal element 305b increases to account for the attenuation caused by the ultrasound traveling a greater distance through the medium across the patient's anatomy.

[0061] At point 412, when the gain profile 420 applied to the internal element 305b is close to its maximum value, a small amount of gain is applied to the signal received from the external element 305a, as shown by gain profile 425. At point 412, the gain applied to the signal from the internal element 305b can be significantly greater than the gain applied to the signal from the external element 305a, as shown by graph 400. The reduced gain applied to the signal from the external element 305a can be used to gradually expand the aperture of the transducer array 112 in elevation. The gain applied to the signal from the external element 305a increases the influence of the echo signal received by the external element 305a on the ultrasound data, corresponding to the emitted ultrasound imaging beam propagating deeper and wider into the anatomical structures.

[0062] At point 414, the gain profile 420 applied to the signal received from the internal element 305b can be substantially at its maximum. Additionally, as shown by gain profile 425, the gain applied to the signal received from the external element 305a can be significantly increased, which in turn increases the aperture width. This widening of the aperture can then be accounted for by the attenuation caused by the ultrasound echo traveling through the anatomical structure from a location of increased depth, and enhances the quality of the received data or the constructed ultrasound image. At point 415, both gain profiles 420 and 425 applied to the internal element 305b and external element 305a, respectively, can be at their maximum values.

[0063] Graph 400 further illustrates an alternative method of implementing separate gain profiles for the signals received from the internal element 305b and the external element 305a, such that the elevation scale of the aperture can increase with depth or time. In some embodiments, and as will be referenced... Figure 6 In more detail, the same gain profile can be applied to both the signal received from internal element 305b and the signal received from external element 305a. This gain profile can have the same characteristics as... Figure 4The gain profile 420 shown may have similar characteristics, or may differ. For example, the gain profile applied to both internal element 305b and external element 305a may increase with depth to account for attenuation due to deeper travel through the patient's anatomy. Instead of applying a separate gain profile to the signal received from external element 305a to increase the aperture width with depth, gain profile 430 may be applied to external element 305a such that at shallow depths where the imaged anatomical object is positioned close to transducer array 112, there is virtually no effect from the signal received from external element 305a. For example, when the signal from internal element 305b and the signal from external element 305a are at shallower depths, the signal component received from internal element 305b contributes significantly more to the summed signal than the signal component from external element 305a. However, as depth increases, as shown by gain profile 430, external element 305a gradually engages, allowing for the full application of a common gain profile similar to gain profile 420. This gradually increases the aperture width. Figure 4 As shown, at all depth points to the left of point 412, gain profile 430 can suppress all gain applied to the signal from external element 430. However, between points 412 and 413, gain profile 430 can gradually allow increased gain of the signal from external element 305a, thus increasing the aperture's facade size. At all points to the right of point 413, gain profile 430 can allow full gain of external element 305a, resulting in the aperture's facade width at its maximum. Gain profile 430 can also be referred to as a weighted profile because it is selectively applied to the electrical signals generated by external element 305a, such that the effect of these electrical signals varies based on profile 430.

[0064] It should be noted that Figure 4 The gain profiles disclosed herein and described are merely example gain profiles, and any number of different gain profiles can be generated and applied to internal element 305b and / or external element 305a. For example, various gain profiles may begin a gradual increase in gain for the transducer elements more quickly, or at a closer distance from the dissected object to the transducer array 112. In other embodiments, the gain may begin to increase at a greater depth. In still other embodiments, the rate of increase of gain in each of the disclosed gain profiles may be greater or less, or may involve different, varying, or inconsistent rates of gain increase.

[0065] Figure 5 This is a schematic diagram of an example circuit communicating with transducer array 112 according to aspects of this disclosure. Figure 5 A more detailed view of one embodiment of the circuitry within one of the circuits 310 is provided.

[0066] Figure 5 The circuit 310 depicted may include four input conductors, including conductors 391, 392, 393, and 394. Each of these four conductors may be coupled to a transmit / receive switch (T / R switch) 514. Each T / R switch 514 may be additionally coupled to a pulser 516 and a preamplifier 518. The preamplifier 518 may be coupled to a summing unit 530. Each summing unit 530 may be coupled to an aperture shift multiplexer (MUX) 540, which may be coupled to an analog-to-digital converter 520. The MUX 540 may operate as a switch. In some embodiments, the MUX 540 may be a switch. In some embodiments, the ADC 520 may be a low-power ADC.

[0067] Figure 5 The conductor 392 shown will be in column 301a ( Figure 3 The internal element 305b of column 301a is connected to the T / R switch 514. Similarly, conductor 391 connects the external element 305a of column 301a to the additional T / R switch 514, conductor 394 connects the internal element 305b of column 301m to the T / R switch, and connector 393 connects the external element 305a of column 301m to... Figure 5 The final T / R switch 514 is shown.

[0068] T / R switch 514 can be configured to switch between a transmit signal path and a receive signal path. For example, in the transmit position, T / R switch 514 can receive a signal from pulser 516 and subsequently send the signal to transducer array 112 to excite the array to emit ultrasonic energy. Pulser 516 can also be referred to as a transmit pulser. Pulser 516 can receive a transmit signal generated by host 130. Pulser 516 can communicate with host 130 via conductor 380. For example, pulser 516 can communicate with the host via an 800 Mbps data conductor or any other suitable conductor or cable. In other embodiments, pulser 516 can also be configured to output electrically excited pulses timed to excite the elements of transducer array 112 to generate an acoustic wavefront. The pulser circuitry can be located within the transducer housing.

[0069] In the receiving position, the T / R switch 514 can receive signals corresponding to the reflected waves received by the transducer array 112 and send them to the preamplifier 518. The T / R switch 514 can also communicate with the host 130 via an 800Mbps data line or any suitable conductor cable and can receive instructions regarding switching between the transmit and receive signal paths. This communication cable may be included in... Figure 1 Communication cables or links 150 and / or Figure 3 The cable is 380.

[0070] The preamplifier 518 can be used with, for example Figure 5 The output of the T / R switch 514 is communicated and can communicate with the elements of the transducer array 112 via the T / R switch 514. Specifically, when the T / R switch 514 is configured to receive by the ultrasound system 100, the received signal corresponding to the reflected wave can be sent through the T / R switch 514 to a connected preamplifier 518. In some embodiments, the number of pulsers 516 can be equal to the number of preamplifiers 518 and the number of T / R switches 514. For example, each T / R switch 514 can be configured to receive data from one pulser 516 and send data from the transducer array 112 to one preamplifier 518. The preamplifier 518 can amplify the signal received from the T / R switch 514 to improve the quality of the received signal, for example, by reducing the noise floor. The output of the preamplifier 518 can additionally communicate with the summing unit 530.

[0071] In addition to amplifying the signal received from the output of T / R switch 514, preamplifier 518 can also implement a reference. Figure 4 Gain profiles 420 or 425 are discussed. For example, a preamplifier 518 communicating with conductors 392 and 394 that receive signals from internal transducer element 305b can implement gain profile 420 on the received signal. In contrast, a preamplifier 518 communicating with conductors 391 and 393 that receive signals from external element 305a can implement gain profile 425 on the received signal. The signal to which the gain is applied can be referred to as a gain-adjusted signal.

[0072] Various methods can be employed to implement gain profiles 420 and 425. In some embodiments, programmable resistors can be implemented in communication with each other. Preamplifier 518 communicates with conductors 392 and 394 corresponding to internal element 305b. Alternatively, individual programmable resistors can be implemented in communication with preamplifier 518, which in turn communicates with conductors 391 and 393 corresponding to external element 305a. The programmable resistors can include a set of resistors controlled using sweep control, which can select from a plurality of different resistor selections. In some embodiments, the programmable resistors can include 30 different resistor selections. In other embodiments, the programmable resistors can include more or fewer resistor selections, such as two, four, eight, ten, 15, 20, 40, 50, or any suitable number greater than, less than, or between those listed. The sweep control that selects different resistor selections can digitally control the programmable resistors according to gain profiles 420 or 425, depending on which preamplifiers 518 are controlled. In some embodiments, two programmable resistors may be implemented in probe 110. Each programmable resistor may control several components in preamplifier 518. In other embodiments, additional programmable resistors may be implemented.

[0073] At the summing unit 530, the signal received from the internal transducer element 305b via conductor 392 and the signal received from the external element 305a via conductor 391 are combined in an analog manner and sent to the aperture translation MUX 540. The signals from the internal element 305b via conductor 394 and from the external element 305a via conductor 393 are similarly combined with the summing unit 530, as follows: Figure 5 As shown. The summing component 530 can also be an analog adder circuit, a summing mixer, or any suitable electronic component for summing signals.

[0074] Figure 5 The aperture translation MUX 540 shown can be switched between different positions to make the aperture move along the transducer array 112 as shown by... Figure 3 The aperture is shifted in the lateral / azimuth dimension as shown by axis 399. The aperture translation MUX 540 may also be referred to as a switch. For example, as previously discussed, in some embodiments, half (or any other suitable fraction, arrangement, or configuration) of transducers 305 of transducer array 112 may be used to send and receive ultrasound imaging signals into anatomical structures, thereby forming an aperture in transducer array 112. When conductors 392 and 391 provide signals to and from transducer column 301a and conductors 394 and 393 provide signals to and from transducer column 301m, Figure 5The hole translation MUX 540 shown can switch between these two columns (column 301a and column 301m). In this way, column 301a or column 301m is engaged at a time. Return to Reference Figure 3 The ultrasound imaging system 100 can define aperture 332 as transducer rows 301a to 301l. In this configuration, the aperture translation MUX 540 within the analog processor 310 communicating with rows 301a and 301m will be switched to engage row 301a instead of 301m. Similarly, the aperture translation MUX 540 communicating with rows 301b and 301n will be switched to engage row 301b instead of 301n, and so on. Finally, the aperture translation MUX 540 communicating with rows 301i and 301z will be switched to engage row 301i instead of 301z. If the ultrasound imaging system 100 shifts the aperture to the right (aperture 334) by one transducer element 305, the only necessary change would be to switch the aperture translation MUX 540 communicating with rows 301a and 301m to engage row 301m. Similarly, to move the aperture 336 in the ultrasound imaging system 100, each aperture translation MUX 540 will switch to engage another column 301. In this way, the aperture can be moved to any suitable position using any suitable transducer column 301 within the transducer array 112. Imaging data from each aperture in the azimuth or lateral direction can be used to form one or more A-lines of a B-mode image. A-lines generated from data obtained from multiple apertures can be combined to generate a B-mode image.

[0075] Figure 5 The output of the aperture translation MUX 540 shown communicates with the ADC 520. The ADC 520 can be configured to convert analog ultrasonic echo signals into digital ultrasonic echo signals. For example, the ADC 520 can receive analog ultrasonic echo signals generated by a given aperture of the transducer array 112 and transmitted via a T / R switch 514 to a preamplifier 518, and convert them into digital ultrasonic echo signals. The digital ultrasonic echo signals may include digital samples of the waveform representing the corresponding analog ultrasonic echo signals. The ADC 520 can employ a successive approximation ADC architecture to provide high performance and lower power consumption, and thus keep the total power consumption of the probe 110 within the thermal budget of the probe 110. However, any suitable ADC architecture can be used for the ADC 520.

[0076] Figure 5 The figure shown, reference numeral 340, was previously referenced. Figure 3 It is mentioned that the bit rate of ADC 520 is indicated, and more generally, the bit rate of the output of analog circuit 310 is indicated. Figure 5The components shown may be referred to together as a signal path, signal path, electrical path, electrical circuit, or any other suitable term. For example, conductor 392 communicating with T / R switch 514 and preamplifier 518 may be referred to as a signal path or an internal component signal path. Figure 5 Any other grouping of components within the circuit can be additionally referred to as signal paths, and is also expected to be so.

[0077] Figure 6 This is a schematic diagram of an example circuit communicating with transducer array 112 according to aspects of this disclosure. Figure 6 All the components shown can be substantially similar to Figure 5 The components depicted in the text. However, Figure 6 The circuit 310 shown also includes a weighting component 619. In this respect, the weighting component 619 is an additional amplifier in the signal path of the analog ultrasonic signal from the external element 305a of the transducer array 112. Therefore, the weighting component 619 can be referred to as a weighting amplifier. Figure 6 The component group shown may be similarly referred to as a signal path, signal path, electrical path, electrical path, or any other suitable term.

[0078] The weighting component 619 communicates with the output of the preamplifier 518, which in turn communicates with the external component 305a via conductors 391 and 393. Figure 6 The illustrated embodiment may correspond to gain profile 430. Specifically, in Figure 6 In the illustrated embodiments, a common gain profile is applied to both the internal element 305b and the external element 305a of the preamplifier 518, as previously described. In some of these embodiments, all preamplifiers 518 may communicate with a common programmable resistor. The programmable resistor may be very similar to the reference [reference value]. Figure 5 The programmable resistor is described. For example, a programmable resistor can be progressively selected through a series of resistors to implement [something related to resistors]. Figure 4 The gain profile is similar to the one disclosed in the reference. A common gain profile can be similar to the one in the reference. Figure 4 The gain profile 420 is described. Then, the weighting component 619 will be similar to the reference. Figure 4The additional gain profile of the described gain profile 430 is applied to the signal received from the external transducer element 305a via conductors 391 and 393. As previously mentioned, the gain profile 430 may also be referred to as a weighted profile and is selectively applied to the electrical signals generated by the external element 305a such that the effect of these electrical signals is altered based on profile 430. This selective application is achieved by positioning the weighting component 619 only in the signal path communicating with the external element 305a. In some embodiments, the weighting component 619 may also be a programmable resistor with a set of resistor selections, which can be implemented in a similar manner. Figure 4 The gain profile or weighted profile 430. However, the programmable resistor implemented as the control weighting component 619 can include far fewer resistor choices than the programmable resistors implementing the common gain profile of all preamplifiers 518. In this way, the external component 305a can still be progressively joined to widen the aperture face width, but fewer components are required. The result is a simpler, cheaper, and more compact circuit within probe 110. It should also be noted that any suitable method for implementing gain profiles 420, 425, and / or 430 or any other suitable gain profile can be used within circuit 310. In some embodiments, the weighting component 619 can be a variable gain amplifier, which is based on a similar... Figure 4 The additional gain profile of gain profile 430 further acts on the signal received from external component 305a, which was previously acted upon by preamplifier 518. Variable gain amplifier 619 can be configured to amplify or attenuate the input signal.

[0079] Figure 7 This is a schematic diagram of an example circuit communicating with transducer array 112 according to aspects of this disclosure. Figure 7 Additional embodiments of this disclosure are illustrated. Figure 7 All the components shown can be substantially similar to Figure 6 and / or Figure 5 The components depicted in the text. However, Figure 7 The circuit 310 shown may additionally include multiple ADCs 720, delay components 722, and ADC clock control 730. Figure 7 The component group shown can be similarly referred to as a signal path, signal pathway, electrical path, electrical circuit, or any other suitable term. Additionally, located in... Figure 7 The components following the ADC 720 in the middle can be Figure 5 and 6 The digital implementation of the components. For example, Figure 7 The weighting component or amplifier 619 shown can be a digital weighting component or amplifier.

[0080] exist Figure 7In the illustrated embodiment, the analog signal received from the transducer array 112 can be converted into a digital signal before the weighting rule 430 is applied by the weighting component 619. The ADC 720 can be positioned to communicate with the output of the preamplifier 518. Similar to... Figure 5 and 6 The ADC 520 and ADC 720 can be configured to convert analog ultrasound echo signals into digital ultrasound echo signals. The ADC 720 can be substantially similar to the ADC 520, as they can use a successive approximation ADC architecture or can be any other suitable type of ADC. The ADC 720 can have any of the characteristics or features of the ADC 520.

[0081] The delay component 722 can communicate with the output of the ADC 720. The delay component 722 can include hardware components, software components, or a combination of hardware and software components. The primary purpose of the delay component 722 can be to focus the ultrasound imaging beam to produce a narrower beam than that achievable using aperture width control alone. This enhanced focusing is achieved by delaying the signals so that they are aligned in time for coherent summation. For example, the delay component 722 can apply a delay to signals received from internal transducer element 305b and / or external element 305a to control the position of the focus of the ultrasound imaging beam in the elevation dimension. In an example, the delay component 722 can receive a command from host 130 to delay the signal received from external element 305a by a specified amount of time. The delay can correspond to multiple samples. In an example, the delay component 722 can receive ultrasound data from the ADC 720 and, after delaying the data by the amount of time of one sample, send the data to the summing component 750 or the weighting component 619 according to the signal path. The delay component 722 can delay the data by any suitable number of samples. In embodiments where the ultrasonic echo signal from external element 305a is delayed, as the delay to external element 305a increases, the focus of the imaging data can be moved closer to the ultrasonic transducer array 112, and vice versa. The delay element 722 can be implemented using a memory element or a shift register. Fine-grained delay control can be achieved by adjusting the sampling phase of the ADC. In other embodiments, an additional purpose of the delay element 722 can be to perform beamforming on the signal received from transducer element 305. Thus, the delay element 722 can be used to apply delay to the signal between transducer elements in the elevation direction or azimuth direction, or both. In some embodiments, beamforming in the azimuth dimension can occur for a portion of an element or subarray (such as an element pair). This partial beamforming can reduce the amount of data transmitted to the system. For example, beamforming an element pair halves the data transmitted to the system, thereby halving the number of associated wires. When partial beamforming is performed on a collection of multiple elements, the data transmitted to the system and associated wires is further reduced.

[0082] Figure 7 Also depicted is the ADC clock control 730. The ADC clock control 730 may also be referred to as delay clock control, clock, or any other suitable term. The ADC clock control 730 can communicate with both the ADC 720 and the delay element 722. The ADC clock control 730 may include various circuitry and can perform various functions. In some embodiments, the previously discussed delay element 722 can delay the signal received from the ADC 720 by shifting digital samples received in time. The ADC clock control 730 can then provide fine control over the delay time by allowing different sampling phases of the internal transducer element 305b and / or the external element 305a. The control of the ADC clock control 730 can be static for a fixed focus or dynamic for a variable focus with depth. Fixed or dynamic focusing can be implemented in the elevation or azimuth direction. The ADC clock control 730 and its communication and control with the ADC 720 and delay unit 722 may include features similar to those described in U.S. Application 16 / 329,433, entitled “ULTRASOUND PROBE WITH MULTILINE DIGITAL MICROBEAMFORMER” and / or U.S. Provisional Application 62 / 631,549, filed February 16, 2018, entitled “DIGITAL ULTRASOUND CABLE AND ASSOCIATEDDEVICES, SYSTEMS, AND METHODS”, the entire contents of which are incorporated herein by reference. (The full contents of both applications are incorporated herein by reference later.) Figure 7 The signal path of the analog processor 310 shown includes a summing unit 750 and an aperture translation MUX 740. The summing unit 750 can be substantially similar to... Figure 5 and Figure 6 The summation component 530. However, due to... Figure 7 In the disclosed embodiments, the analog-to-digital conversion performed by the ADC 720, and the summing unit 750 digitally combines the signals from the internal element 305b and the external element 305a. Similarly, the aperture translation MUX 740 can perform the same... Figure 5 and Figure 6 The aperture translation MUX540 serves essentially the same purpose; however, it can be implemented digitally. The summing unit 750 may additionally include digital adder circuitry, a summing mixer, or any suitable hardware, software, or combination of hardware and software components for summing signals.

[0083] Those skilled in the art will recognize that the above-described apparatus, systems, and methods can be modified in various ways. Therefore, those skilled in the art will appreciate that the embodiments covered by this disclosure are not limited to the specific exemplary embodiments described above. In this regard, although illustrative embodiments have been shown and described, various modifications, alterations, and substitutions are contemplated within the foregoing disclosure. It should be understood that such changes can be made to the foregoing without departing from the scope of this disclosure. Therefore, the claims should be interpreted broadly in accordance with this disclosure.

Claims

1. An ultrasound imaging system (100), comprising: An ultrasonic probe (110) includes: Shell (111); 1. An X-dimensional transducer array (112) mechanically coupled to the housing, wherein the transducer array comprises: First row of acoustic components, The second row of acoustic components, and Third row of acoustic components, The first row of acoustic elements is arranged in the elevation dimension between the second row of acoustic elements and the third row of acoustic elements, and Wherein, the first row of acoustic elements includes a first acoustic element, the second row of acoustic elements includes a second acoustic element, and the third row of acoustic elements includes a third acoustic element. Wherein, the first acoustic element is arranged between the second acoustic element and the third acoustic element in the elevation dimension, and The first acoustic element is configured to generate a first analog ultrasonic signal, and the second and third acoustic elements are electrically coupled to generate a second analog ultrasonic signal. A first amplifier (518), which is disposed within the housing and communicates with the first acoustic element; and A second amplifier (518), which is disposed within the housing and communicates with the second acoustic element and the third acoustic element, and A third amplifier (619) is disposed within the housing and communicates with the second acoustic element and the third acoustic element. Wherein, the first amplifier and the second amplifier are configured to apply gain to the first analog ultrasound signal and the second analog ultrasound signal respectively according to a first gain profile, and The third amplifier is configured to apply additional gain only to the second analog ultrasound signal according to a second gain profile that differs from the first gain profile. The second gain profile increases with increasing imaging depth, thereby increasing the elevation dimension of the aperture in the transducer array.

2. The system according to claim 1, wherein, The ultrasonic probe (110) also includes: A first analog summing circuit (530) communicates with the first amplifier (518) and the third amplifier (619), wherein the first analog summing circuit is configured to combine the first analog ultrasound signal with the second analog ultrasound signal to generate a first analog output.

3. The system according to claim 2, in, The ultrasonic probe (110) also includes circuitry that communicates with the first acoustic element, the second acoustic element, and the third acoustic element. The circuit includes the first amplifier (518), the second amplifier (518), and the third amplifier (619). The circuit communicates with the fourth, fifth, and sixth acoustic elements. The fourth acoustic element is arranged between the fifth and sixth acoustic elements in the elevation dimension. The first acoustic element, the second acoustic element, and the third acoustic element are arranged in the first column (301a) of the transducer array. The fourth, fifth, and sixth acoustic elements are arranged in the second column (301z) of the transducer array, and The first column and the second column are spaced apart from each other in the azimuth dimension, such that the other columns of the transducer array are arranged between the first column and the second column.

4. The system according to claim 3, wherein, The ultrasonic probe (110) also includes: A fourth amplifier (518) is disposed within the housing and communicates with the fourth acoustic element; A fifth amplifier (518) and a sixth amplifier (619), the fifth amplifier and the sixth amplifier being disposed within the housing and communicating with the fifth acoustic element and the sixth acoustic element; and The second analog summing circuit (530) communicates with the fourth amplifier and the sixth amplifier. The fourth acoustic element is configured to generate a third analog ultrasonic signal, and the fifth and sixth acoustic elements are electrically coupled to generate a fourth analog ultrasonic signal. The fourth amplifier and the fifth amplifier are configured to apply gain to the third analog ultrasound signal and the fourth analog ultrasound signal, respectively, according to the first gain profile. The sixth amplifier is configured to apply gain only to the fourth analog ultrasound signal according to the second gain profile, and The second analog summing circuit is configured to combine the third analog ultrasound signal with the fourth analog ultrasound signal to generate a second analog output.

5. The system according to claim 4, wherein, The ultrasonic probe (110) also includes a multiplexer (540) configured to translate the aperture of the transducer array in the azimuth dimension.

6. The system according to claim 5, wherein, The multiplexer (540) is configured to select between the first analog output and the second analog output.

7. The system according to claim 2, wherein, The ultrasonic probe (110) also includes: An analog-to-digital converter (520) communicates with the analog summing circuit, wherein the analog-to-digital converter is configured to receive the output of the analog summing circuit (530) and generate a digital ultrasound signal.

8. The system according to claim 7 further includes a host system (130) spaced apart from the ultrasound probe (110) and a cable (150) extending between the host system and the ultrasound probe. in, The ultrasound probe is configured to transmit the digital ultrasound signal to the host system via the cable, and The host system includes a processor circuit (210) configured to generate an ultrasound image based on the digital ultrasound signal and output the ultrasound image to a display in communication with the processor circuit.

9. The system according to claim 1, wherein, The ultrasonic probe (110) also includes: Digital adder (750); A first analog-to-digital converter (720) is communicatively positioned between the first amplifier (518) and the digital adder; and A second analog-to-digital converter (720) is communicatively positioned between the second amplifier (518) and the digital adder.

10. The system according to claim 9, wherein, The third amplifier (619) includes a digital amplifier that is communicatively positioned between the second analog-to-digital converter (720) and the digital adder (750).

11. The system according to claim 10, wherein, The ultrasonic probe (110) also includes: A first digital delay (722) is communicatively positioned between the first analog-to-digital converter (720) and the digital adder; and A second digital delay (722) is communicatively positioned between the second analog-to-digital converter (720) and the third amplifier (619).

12. The system according to claim 11, wherein, The ultrasonic probe (110) also includes: A first clock control (730) communicates with the first analog-to-digital converter (720) and the first digital delay (722); and The second clock control (730) communicates with the second analog-to-digital converter (720) and the second digital delay (722).

13. An ultrasonic imaging probe (110), comprising: Shell (111); 1. An X-dimensional transducer array (112) mechanically coupled to the housing, wherein the transducer array includes a first row of acoustic elements, a second row of acoustic elements and a third row of acoustic elements, wherein the first row of acoustic elements is arranged in an elevation dimension between the second row of acoustic elements and the third row of acoustic elements, wherein the second row of acoustic elements and the third row of acoustic elements are electrically coupled; A first amplifier (518), a second amplifier, and a third amplifier, wherein the first amplifier, the second amplifier, and the third amplifier are disposed within the housing; and Analog-to-digital converters (520, 720) are configured to generate digital ultrasound signals, such that the ultrasound imaging probe outputs the digital ultrasound signals. The first amplifier is configured to apply gain to a first analog ultrasonic signal associated with the first row of acoustic elements according to a first gain profile, in order to obtain a gain-adjusted first analog ultrasonic signal. The second amplifier is configured to apply gain to a second analog ultrasonic signal associated with the second row of acoustic elements and the third row of acoustic elements according to the first gain profile, to obtain a gain-adjusted second analog ultrasonic signal. The third amplifier is configured to apply gain only to the second analog ultrasound signal according to a second gain profile, which differs from the first gain profile. This second gain profile increases with increasing imaging depth, thereby increasing the elevation dimension of the apertures in the transducer array. The analog-to-digital converter is configured to generate the digital ultrasound signal based on at least one of the gain-adjusted first analog ultrasound signal or the gain-adjusted second analog ultrasound signal.

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