Work device analysis system and work device analysis method, and data collection device

Abstract

The work device analysis method includes: acquiring work history information from a work device equipped with a work unit that performs a work for manufacturing an electronic circuit substrate (ST1); generating a first file including a log of action events of the work device and a second file including a log of manufacturing of the electronic circuit substrate based on the acquired work history information (ST2-ST4); determining whether the work unit needs maintenance based on the first file (ST5); and estimating a condition of the work unit based on the second file (ST6).

Description

Technical Field

[0001] This disclosure relates to a work apparatus analysis system and method for analyzing the state of a work apparatus used in manufacturing electronic circuit boards, and a data collection device. Background Technology

[0002] In the manufacturing of electronic component circuit boards, the suction nozzles and component mounting heads used in assembly equipment can become contaminated, worn, or strained during repetitive manufacturing processes, leading to reduced mounting accuracy. Therefore, these assembly units undergo periodic inspections and maintenance, sometimes requiring interruptions to manufacturing. To minimize productivity losses, it is desirable to minimize the frequency of these inspections and maintenance, and to perform them at appropriate intervals.

[0003] Patent Document 1 discloses a solution whereby log data is collected regarding the correction amount of the suction position when the suction nozzle picks up electronic components during the operation of the component mounting device, as well as error events such as component suction failure caused by the suction nozzle. If a certain amount of log data accumulates, the equipment diagnostic system diagnoses whether there are any abnormalities in the working device. Furthermore, based on the diagnostic results, it determines whether maintenance is required and instructs maintenance work. Thus, without interrupting manufacturing operations, abnormalities in the working device can be appropriately diagnosed and maintenance performed.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: JP 2020-27329 Summary of the Invention

[0007] However, in the prior art, including Patent Document 1, although it is possible to diagnose malfunctions of the work equipment without interrupting the manufacturing operation, the log data used for diagnosis is enormous. Therefore, when the diagnostic device is located in a different facility than the work equipment, there is a problem of creating a heavy burden in data transmission and reception.

[0008] Therefore, the purpose of this disclosure is to provide a working device analysis system, a working device analysis method, and a data collection device that can appropriately analyze the state of the working device.

[0009] The work equipment analysis system disclosed herein includes: an acquisition unit that acquires work history information from a work equipment equipped with a work unit for manufacturing electronic circuit boards; a document generation unit that generates a first document containing an operation event log of the work equipment and a second document containing a manufacturing log of the electronic circuit boards based on the acquired work history information; a maintenance need determination unit that determines whether the work unit needs maintenance based on the first document; and a condition estimation unit that estimates the condition of the work unit based on the second document.

[0010] The work device analysis method disclosed herein includes: obtaining work history information from a work device equipped with a work unit for performing work for manufacturing electronic circuit boards; generating a first file containing an action event log of the work device and a second file containing a manufacturing log of the electronic circuit boards based on the obtained work history information; determining whether the work unit needs maintenance based on the first file; and estimating the condition of the work unit based on the second file.

[0011] The data collection apparatus disclosed herein includes: an acquisition unit that acquires work history information from a work apparatus equipped with a work unit for performing work on manufacturing an electronic circuit board; a document generation unit that generates a first document containing an action event log of the work apparatus and a second document containing a manufacturing log of the electronic circuit board based on the acquired work history information; and a transmission unit that transmits the first document and the second document.

[0012] According to this disclosure, the status of the working device can be appropriately analyzed. Attached Figure Description

[0013] Figure 1 This is a structural diagram illustrating an embodiment of the work device analysis system disclosed herein.

[0014] Figure 2 This is a structural illustration of a component mounting device according to one embodiment of the present disclosure.

[0015] Figure 3 This is a block diagram illustrating the structure of an operation device analysis system according to one embodiment of the present disclosure.

[0016] Figure 4 This is a flowchart of an embodiment of the working device analysis method disclosed herein. Detailed Implementation

[0017] The following detailed description uses the accompanying drawings to illustrate one embodiment of the present disclosure. The structures, shapes, etc., described below are illustrative examples and can be adapted to correspond to specifications such as the work device analysis system, component assembly line, component assembly device, and component supply device. Hereinafter, in all the drawings, the same or corresponding elements will be labeled with the same reference numerals, and repeated descriptions will be omitted. Figure 2 In the diagram, the X-axis, representing the substrate transport direction, is shown as one of two mutually orthogonal axes in the horizontal plane. Figure 2 The direction perpendicular to the paper surface) and the Y-axis orthogonal to the substrate transport direction ( Figure 2 (The left and right directions in the middle). In addition, the Z-axis is shown as the height direction orthogonal to the horizontal plane. Figure 2 (Up and down directions in the middle).

[0018] First, refer to Figure 1 To illustrate the structure of the working device analysis system 1. Figure 1 This is a structural diagram illustrating an embodiment of the work device analysis system 1 disclosed herein. The work device analysis system 1 comprises a factory F and a support center S located separately from the factory F. At the factory F, two component mounting lines L1 and L2 are provided, each consisting of multiple component mounting devices M1 to M3 connected together. Each component mounting line L1 and L2 has electronic components (hereinafter referred to as "components D") sequentially mounted on a circuit board via component mounting devices M1 to M3. (See reference...) Figure 2 It also has the function of manufacturing electronic circuit boards.

[0019] Each component mounting device M1 to M3 is connected to the manufacturing management device 3 via an on-site communication network 2, such as a LAN (Local Area Network). Furthermore, factory F is equipped with an email receiving device 4 for receiving emails sent from the support center S. Additionally, the component mounting lines L1 and L2 installed in factory F do not need to be two; they can be one or more than three. Furthermore, the component mounting devices M1 to M3 constituting component mounting lines L1 and L2 do not need to be three; they can be one, two, or more than four. Moreover, in addition to the manufacturing management device 3, each component mounting line L1 and L2 may also have a line management device that manages the manufacturing of electronic circuit boards within the component mounting lines L1 and L2.

[0020] exist Figure 1 In this system, the support center S is located in a position to efficiently perform analyses of whether the work units of multiple factories F (customers) require maintenance, and to provide various forms of support to the personnel responsible for each factory F. The support center S is equipped with a maintenance management device 5 and a mail server 6.

[0021] The mail server 6 is connected to the maintenance management device 5 via an on-site communication network 7, such as a LAN. The manufacturing management device 3 and the maintenance management device 5 exchange information via an off-site communication network 8, such as the Internet or mobile communication lines. The mail receiving device 4 and the mail server 6 exchange emails and other information via an off-site communication network 9.

[0022] Furthermore, off-site communication networks 8 and 9 can share the same off-site communication network. Additionally, manufacturing management device 3 and maintenance management device 5 can exchange information not directly, but via the cloud. That is, information sent from manufacturing management device 3 and maintenance management device 5 can be stored in the cloud, and information can be sent from the cloud to manufacturing management device 3 and maintenance management device 5 upon request. Furthermore, information can be communicated using communication tools that utilize data communication lines in addition to email, or via the touch panel 22 of manufacturing management device 3 or component mounting devices M1-M3 (see reference). Figure 2 They can access each other to exchange information.

[0023] Next, refer to Figure 2 The structure of component mounting devices M1 to M3 will be explained. Figure 2 This is a structural illustration of a component mounting device M1 (M2, M3) according to one embodiment of the present disclosure. Component mounting devices M1 to M3 have the same structure. The component mounting device M1 will be described below.

[0024] The component mounting device M1 is a working device that assembles component D onto a circuit board B. A board transport mechanism 12, located on the upper surface of the base 11, transports the circuit board B from the positive X-axis direction to the negative X-axis direction and positions it for holding. A head moving mechanism 13, located above the base 11, enables the mounting head 14, which is detachably mounted via a board 13a, to move in the positive and negative X-axis and Y-axis directions. A suction nozzle 15 is detachably mounted on the lower end of the mounting head 14.

[0025] Multiple belt feeders 16 are arranged side-by-side along the X-axis on a feeder base 17a, which is located on the upper part of a trolley 17 that is coupled to a base 11 on the side of the substrate transport mechanism 12. The feeder base 17a has multiple slots for equipping the belt feeders 16. Feeder addresses are assigned to each slot. In the component mounting device M1, the feeders are positioned at the front and rear (…). Figure 2 The positive and negative directions of the Y-axis are respectively equipped with trolleys 17. In the component mounting device M1, the mounting position of the belt feeder 16 can be determined by the configuration position of the feeders arranged at the front and rear and the feeder addresses.

[0026] On the trolley 17, the carrier belt 18, which stores the components D supplied to the component mounting device M1, is wound and stored in the tray 19 and held. The carrier belt 18, inserted into the belt feeder 16, is fed at fixed intervals by the belt feeding mechanism 16a built into the belt feeder 16. As a result, the components D stored on the carrier belt 18 are sequentially supplied to the component supply port 16b provided at the top of the belt feeder 16.

[0027] During the component installation process, the installation head 14 moves above the belt feeder 16 via the head moving mechanism 13, and the component D supplied to the component supply port 16b of the belt feeder 16 is vacuum-adsorbed through the suction nozzle 15, thereby picking up ( Figure 2 Arrow a). The mounting head 14 of the retaining component D is moved above the circuit board B held by the substrate transport mechanism 12 by the head moving mechanism 13, and the component D is mounted at a given component mounting position Ba on the circuit board B. Figure 2 Arrow b).

[0028] exist Figure 2 In this configuration, a substrate recognition camera 20 is mounted on board 13a, oriented with its optical axis pointing in the negative Z-axis direction. The substrate recognition camera 20 moves integrally with the mounting head 14 in the positive and negative X-axis and Y-axis directions via a head moving mechanism 13. The substrate recognition camera 20 moves above the belt feeder 16 to capture an image of component D supplied to the component supply port 16b. Recognition processing unit 36 ​​(see reference) Figure 3 The image recognition unit 36 ​​performs image recognition on the camera footage to calculate the amount by which the component D supplied to the component supply port 16b deviates from its expected (predetermined) normal supply position. Based on the calculated amount of supply position deviation, the suction position (stop position of the mounting head 14) when the suction nozzle 15 picks up the component D is corrected. In addition, the recognition processing unit 36 ​​also detects supply errors where the component D is not supplied to the component supply port 16b and therefore cannot be recognized.

[0029] exist Figure 2 The mounting head 14 includes a flow sensor 14a that measures the flow rate of air flowing into the suction nozzle 15. If the suction nozzle 15 properly adsorbs the component D, less air flows into the suction nozzle 15, and the vacuum pressure of the suction nozzle 15 decreases. On the other hand, in the event of a suction failure where the suction nozzle 15 can no longer hold the component D or adsorbs it in an abnormal posture, air flows into the suction nozzle 15. Therefore, the vacuum pressure of the suction nozzle 15 does not decrease.

[0030] The presence or absence of adsorption errors is detected by measuring the air flow rate using the flow sensor 14a. Alternatively, a vacuum gauge (pressure gauge) can be provided instead of the flow sensor 14a, and the presence or absence of adsorption errors is determined by measuring the vacuum pressure of the vacuum gauge. Furthermore, by measuring the air flow rate flowing into the adsorption nozzle 15 after component installation using the flow sensor 14a, installation errors caused by the mounting head 14 failing to install component D onto the circuit board B are detected.

[0031] exist Figure 2In this system, a component recognition camera 21 with its optical axis pointing upwards is mounted on the upper surface of the base 11 between the substrate transport mechanism 12 and the belt feeder 16. When the suction nozzle 15, which has picked up component D, passes overhead, the component recognition camera 21 captures an image of the lower surface of the component D held in the suction nozzle 15 (or, the suction nozzle 15 that cannot hold component D). The recognition processing unit 36 ​​performs image recognition on the captured image to determine whether the posture of the component D held in the suction nozzle 15 is normal or abnormal, or whether a recognition error has occurred indicating that the component D, which should be held in the suction nozzle 15, cannot be recognized. In addition to capturing the lower surface of component D, the component recognition camera 21 also captures images of the side surfaces.

[0032] Furthermore, the recognition processing unit 36 ​​performs image recognition on the camera image to calculate the adsorption position deviation of the component D held by the adsorption nozzle 15 equipped on the component mounting device M1 (working device) from the expected (predetermined) normal adsorption position, i.e., the normal holding position. When mounting the component D at the component mounting position Ba on the circuit board B, mounting position correction and mounting posture correction are performed based on the adsorption position deviation.

[0033] exist Figure 2 In the component mounting device M1, at the operator's work position, a touch panel 22 is provided for operator control. Various information is displayed on the display section of the touch panel 22. Furthermore, the operator uses operation buttons and other input methods displayed on the display section to input data or operate the component mounting device M1.

[0034] The mounting head 14, suction nozzle 15, and belt feeder 16 are appropriately selected according to the type of component D mounted on the circuit board B and installed in the component mounting device M1. Thus, the mounting head 14 that mounts component D to the circuit board B, the suction nozzle 15 equipped on the mounting head 14 to suction component D, or the belt feeder 16 (component supply device) that supplies component D to the mounting head 14 are work units equipped in the component mounting device M1 (work device) for performing operations for manufacturing electronic circuit boards.

[0035] Next, refer to Figure 3 To illustrate the structure of the working device analysis system 1. Figure 3 This is a block diagram showing the structure of the work device analysis system 1. The component installation devices M1 to M3 (work devices) of the component assembly lines L1 and L2 are designed with the same structure. The component installation device M1 of the component assembly line L1 will be described below.

[0036] exist Figure 3In this assembly, the component mounting device M1 includes a mounting control unit 30, a substrate transport mechanism 12, a head moving mechanism 13, a mounting head 14, a belt feeder 16, a substrate recognition camera 20, a component recognition camera 21, and a touch panel 22. The mounting control unit 30 includes a mounting storage unit 31, a recognition processing unit 36, a mounting action processing unit 37, a suitability determination unit 38, and an on-site communication unit 39. The on-site communication unit 39 transmits and receives data with other component mounting devices M2, M3, and the manufacturing management device 3 via the on-site communication network 2. The mounting storage unit 31 is a storage device that stores mounting data 32, action parameters 33, position deviation information 34, and abnormality list information 35, etc.

[0037] The mounting data 32 is created for each type of electronic circuit board manufactured, and includes data such as the component type, size, and mounting position Ba (XY coordinates) of the component D mounted on the circuit board B. The mounting data 32 stored in the mounting storage unit 31 of the component mounting device M1 contains at least the data required for the component mounting operation in the working device. The recognition processing unit 36 ​​performs image recognition on the imaging results of the component supply port 16b of the belt feeder 16 based on the board recognition camera 20, calculates the correction value of the suction position of the suction nozzle 15, and stores it as an action parameter 33 in the mounting storage unit 31.

[0038] exist Figure 3 In this process, the recognition processing unit 36 ​​performs image recognition on the image captured by the component recognition camera 21 of the component D held by the suction nozzle 15, calculates the amount of suction position deviation from the normal holding position, and stores it as position deviation information 34 in the mounting storage unit 31. Furthermore, based on the suction position deviation, the recognition processing unit 36 ​​calculates the component mounting position Ba and mounting posture correction values ​​when the component D is mounted on the circuit board B, and stores them as operation parameters 33 in the mounting storage unit 31.

[0039] Furthermore, the identification processing unit 36 ​​performs image recognition on the camera results to detect supply errors or identification errors. The identification processing unit 36 ​​creates a manufacturing log that associates the detected supply error with information identifying the belt feeder 16 that detected the supply error, the type of the supplied component D, and the carrier belt 18, and sends this log as work history information to the manufacturing management device 3. Additionally, the identification processing unit 36 ​​creates a manufacturing log that associates the detected identification error with information identifying unheld components D, suction nozzles 15 that cannot be held, and mounting heads 14, and sends this log as work history information to the manufacturing management device 3.

[0040] exist Figure 3In this process, the installation action processing unit 37 controls the substrate transport mechanism 12, head movement mechanism 13, mounting head 14, and belt feeder 16 based on the installation data 32, action parameters 33, and position deviation information 34 stored in the installation storage unit 31, thereby executing the component installation action. Furthermore, whenever component D is installed onto the circuit board B, the installation action processing unit 37 sends a manufacturing log, obtained by associating component D with the correction value (action parameter 33) used in the component installation action, the flow rate value of the flow sensor 14a when component D is adsorbed, the pressure value of the vacuum gauge when component D is adsorbed, and the current value when the belt feeder 16 is activated, as work history information to the manufacturing management device 3.

[0041] Furthermore, if the installation action processing unit 37 detects an operational error during the component installation process, it sends a manufacturing log, which establishes a correlation between the content of the operational error and the time of occurrence, as operational history information to the manufacturing management device 3. Examples of operational errors include: adsorption errors where the suction nozzle 15 fails to adsorb component D; identification errors where the component recognition camera 21 fails to recognize component D adsorbed and held by the suction nozzle 15; installation errors where the mounting head 14 fails to install component D onto the circuit board B and brings it back; and supply errors where the board recognition camera 20 fails to recognize component D supplied by the belt feeder 16 (component supply device). In addition, if the component installation production lines L1 and L2 are equipped with an installation inspection device for inspecting components D installed on the circuit board B in addition to the component installation devices M1 to M3, the installation action processing unit 37 can also detect installation errors based on the presence or absence of component D or the amount of positional deviation detected by the installation inspection device.

[0042] Furthermore, if an operation stop event occurs, such as a temporary halt to component installation due to a work error, or an operation restart event occurs, such as the operator restarting the component installation after resuming work following an error, the installation operation processing unit 37 will send an operation event log, which establishes a correlation between the content of the operation event and the time of occurrence, as operation history information to the manufacturing management device 3. In the operation event log of the operation stop event, the detailed content of the work error that caused the operation stop includes information about the associated work units such as the belt feeder 16, the installation head 14, and the suction nozzle 15.

[0043] exist Figure 3 In this manufacturing management device 3, a manufacturing processing unit 40 is included. The manufacturing processing unit 40 includes a manufacturing storage unit 41, an acquisition unit 47, a document generation unit 48, a transmission processing unit 49, an on-site communication unit 50, and an off-site communication unit 51.

[0044] The on-site communication unit 50 transmits and receives data between itself and the component installation devices M1 to M3 of the component installation production lines L1 and L2 via the on-site communication network 2. The off-site communication unit 51 transmits and receives data between itself and the maintenance management device 5 located in the support center S via the off-site communication network 8. The manufacturing storage unit 41 is a storage device that stores installation data 42, work history information 43, first document 44, second document 45, and abnormality list information 46, etc.

[0045] exist Figure 3 The installation data 42 stored in the manufacturing storage unit 41 is the same data as the installation data 32 stored in the installation storage unit 31 of the component mounting device M1. However, the installation data 42 includes data required for the component mounting operations of all component mounting devices M1 to M3 in the component mounting production lines L1 and L2.

[0046] The acquisition unit 47 sequentially acquires the operation history information sent by the component installation devices M1 to M3 (operation devices) of the component assembly lines L1 and L2, and stores it as operation history information 43 in the manufacturing storage unit 41.

[0047] The acquisition unit 47 can collect work history information from the assembly line management device at given intervals, based on the time when the type of electronic circuit board being manufactured is changed, or the time when the operator's shift is rotated, for example, outside of the component assembly devices M1 to M3. Examples of devices that collect this information from outside the component assembly devices M1 to M3 include: an assembly line management device capable of collecting work history information for each of the component assembly lines L1 and L2; a production scheduler that stores production plans or operator shifts; or a production simulator that predicts the optimal production plan. In other words, the acquisition unit 47 acquires work history information 43 during the operation of the work equipment or at given intervals.

[0048] In addition, the maintenance history information, which is the result of maintenance performed by the work unit, is collected by the acquisition unit 47. This maintenance history information can be input by the operator or collected from the maintenance results of an automated maintenance work unit (not shown). Furthermore, maintenance results performed by the support center S, located separately from the factory F, can also be obtained as maintenance history information. Examples of automated maintenance work units include, for instance, a nozzle cleaning assembly for cleaning the nozzles included in the mounting head 14, a feeder maintenance assembly for adjusting the feed mechanism of the belt feeder 16, or a head maintenance assembly for checking or adjusting the slippage of the mounting head 14. In addition to the work results, the maintenance history information also includes the identification information of the work unit, the date and time of maintenance, the location of the maintenance, the number of maintenance operations, and the clearing of the work history information.

[0049] exist Figure 3 In this process, the document generation unit 48 creates a first file 44 containing the operation event logs and maintenance history information of the component mounting devices M1 to M3 (operation devices) based on the installation data 42 and operation history information stored in the manufacturing storage unit 41. Furthermore, the document generation unit 48 generates a second file 45 containing the manufacturing log of the electronic circuit board based on the installation data 42 and operation history information stored in the manufacturing storage unit 41.

[0050] The manufacturing log of the electronic circuit board, included in the work history information 43 collected from the component mounting devices M1 to M3, includes the number of times component D was mounted onto the electronic circuit board by the component mounting devices M1 to M3, the number of identification errors, adsorption errors, mounting errors, and supply errors of component D, etc. Furthermore, the manufacturing log of the electronic circuit board includes positional deviation information 34 of component D held by the adsorption nozzle 15 equipped on the component mounting devices M1 to M3 from its normal holding position. Moreover, the manufacturing log of the electronic circuit board includes the dimensions of component D mounted on the electronic circuit board.

[0051] exist Figure 3 In this process, the document generation unit 48 generates a second document 45 containing the manufacturing log of the electronic circuit board. For example, the document generation unit 48 generates a second document 45 that includes information such as the total number of times component D is mounted and the number of mounting errors of component D for each combination of work units such as the belt feeder 16, the mounting head 14, and the suction nozzle 15. In addition, the second document 45 may include not only the total value of various counts for each given period (e.g., each day), but also an error rate calculated based on the number of errors and the number of suctions.

[0052] Furthermore, the document generation unit 48 performs statistical processing on the correction amount of the suction position of the suction nozzle 15 when the component D is removed from the belt feeder 16 and the correction amount of the installation position of the suction nozzle 15 when the component D is installed onto the circuit board B, generating a second document 45 that includes information such as calculated moving averages or standard deviations. In other words, the document generation unit 48 performs statistical processing on the manufacturing log of the electronic circuit board to generate the second document 45. The manufacturing log of the electronic circuit board is created according to the installation position Ba of each component on the circuit board B, which is manufactured with hundreds to thousands of components installed. Therefore, the amount of data in the manufacturing log of the electronic circuit board is enormous. On the other hand, the amount of data in the information created by statistically processing the manufacturing log of the electronic circuit board is significantly reduced compared to the original data amount.

[0053] exist Figure 3In this process, the document generation unit 48 creates a second document 45 based on the installation data 42, which includes a summary of the dimensions of component D mounted on the electronic circuit board, such as length, width, and thickness. Similar to the information generated by statistical processing of the manufacturing log of the electronic circuit board, the amount of data on the dimensions of component D collected from the installation data 42 is significantly reduced compared to the original data. Furthermore, by extracting only the information related to the dimensions of component D required for processing based on the status of the work unit from the installation data 42, which contains customer information, to create the second document, the leakage of customer information can be prevented.

[0054] exist Figure 3 In this process, the sending processing unit 49 sends the first file 44 and the second file 45 generated by the document generation unit 48 to the maintenance management device 5 via the off-site communication unit 51. That is, the sending processing unit 49 and the off-site communication unit 51 are the sending units that send the first file 44 and the second file 45 to the maintenance management device 5. The document generation unit 48 generates the first file 44 and the second file 45 at a preset time, such as once a week. The sending processing unit 49 sends the generated first file 44 and the second file 45 to the maintenance management device 5. In other words, the first file 44 and the second file 45 are sent to the maintenance management device 5 at a preset time (e.g., every Wednesday at 8:00 AM).

[0055] exist Figure 3 In this device, the maintenance management unit 5 includes a maintenance processing unit 60, an off-site communication unit 61, an on-site communication unit 62, and a display unit 63. The maintenance processing unit 60 includes a maintenance storage unit 64, a maintenance need determination unit 67, a condition estimation unit 68, a report creation unit 69, and an abnormality list creation unit 70. The maintenance storage unit 64 is a storage device that stores a first file 65 and a second file 66, etc.

[0056] The off-site communication unit 61 transmits and receives data with the manufacturing management device 3 located at factory F via the off-site communication network 8. The on-site communication unit 62 transmits and receives data with the mail server 6 via the on-site communication network 7. The display unit 63 is a display device such as an LCD panel, which displays various data and information.

[0057] The first document 44 and the second document 45, sent from the manufacturing management device 3 at factory F, are received by the maintenance storage unit 64 via the off-site communication unit 61. The received first document 44 and the second document 45 are associated with information identifying the sending source, factory F or the manufacturing management device 3, and stored as first document 65 and second document 66 in the maintenance storage unit 64. The maintenance storage unit 64 stores not only the latest information sent from the manufacturing management device 3, but also information for a given period, including previously sent information. Furthermore, the maintenance management device 5 located at the support center S periodically sends the first document 44 and the second document 45 not only from one factory F, but from multiple factories F.

[0058] exist Figure 3 In this process, the maintenance need determination unit 67 determines whether a work unit (belt feeder 16, mounting head 14, and suction nozzle 15, etc.) needs maintenance based on the first document 65 stored in the maintenance storage unit 64. Specifically, the maintenance need determination unit 67 determines that a work unit needs maintenance if the cumulative number of times related to work stoppage events or the total number of times over a given period exceeds a given judgment benchmark.

[0059] exist Figure 3 In this process, the condition estimation unit 68 performs condition estimation processing on the work unit based on the second document 66 stored in the maintenance storage unit 64. Specifically, the condition estimation unit 68 estimates that the work unit is abnormal or becoming abnormal based on various information contained in the second document 66, and decides whether maintenance is required to determine whether the work unit needs maintenance. For example, if the error rate tends to increase in a given period, if the error rate does not increase but the correction amount tends to increase, or if the deviation of the correction amount (standard deviation) becomes larger than the judgment benchmark, the condition estimation unit 68 determines that maintenance of the work unit is required. The given period is, for example, the number of days elapsed since the last maintenance execution date or the date of manufacture (delivery). This number of days is set in days, weeks, months, or years for each work unit.

[0060] Furthermore, the condition estimation unit 68 can also estimate the abnormality of the work unit based on the parameters and error occurrence conditions (number of times or frequency, etc.) contained in the second document 66, using an abnormality diagnosis model pre-created through machine learning. Additionally, in cases where the tendency for abnormality to become apparent, for example, when component D is large or small, is evident based on the size of component D contained in the second document 66, the condition estimation unit 68 establishes a correlation between the size information of component D (recommended size range, etc.) and information related to the maintenance of the determined work unit.

[0061] exist Figure 3In this process, the report creation unit 69 creates a report for the management of plant F based on information about work units requiring maintenance as determined by the maintenance need determination unit 67 or information about work units requiring repair due to abnormalities as estimated by the condition estimation unit 68. The report includes information confirming the work units requiring maintenance or repair, the reasons for requiring maintenance or repair, and recommended repair methods such as cleaning during repairs. The report created by the report creation unit 69 is sent to the mail server 6 via the on-site communication unit 62. The mail server 6 sends the report as an email to a pre-set address. The email sent from the mail server 6 is received by the mail receiving device 4 installed in plant F.

[0062] exist Figure 3 In this process, the abnormality list creation unit 70 creates a list of abnormal work units (abnormality list) based on information about work units requiring maintenance determined by the maintenance need determination unit 67 or information about work units requiring repair due to abnormality estimated by the condition estimation unit 68. The abnormality list includes information confirming the work units requiring repair or maintenance, the reasons for the estimation of abnormality, and usage restrictions such as the recommended size range of component D. The abnormality list created by the abnormality list creation unit 70 is sent to the manufacturing management device 3 at factory F via the off-site communication unit 61.

[0063] Furthermore, if the component mounting devices M1 to M3 contain work units requiring maintenance or repair, the abnormality list also includes the location of the work unit, determined based on manufacturing log information from the component mounting devices M1 to M3. Additionally, there may be separate abnormality lists created by the maintenance need determination unit 67 and those created by the condition estimation unit 68. In this case, the abnormality list created by the condition estimation unit 68 can be used to create a maintenance plan since the work unit is about to require maintenance or repair. Furthermore, the abnormality list created by the maintenance need determination unit 67 can be used to create a production plan so that it is not used in production, since the work unit requires maintenance or repair.

[0064] The manufacturing management device 3 stores the received abnormality list as abnormality list information 46 in the manufacturing storage unit 41 and sends it to the component mounting devices M1 to M3 (operating devices) of the component mounting production lines L1 and L2. The abnormality list received by the component mounting devices M1 to M3 is stored as abnormality list information 35 in the mounting storage unit 31.

[0065] exist Figure 3In this system, the suitability determination unit 38 for component mounting devices M1 to M3 determines whether the work unit equipped with the component mounting devices M1 to M3 is included in the abnormality list information 35 during production change adjustments, production start-up, or production end-up, such as when the type of electronic circuit board being manufactured is changed. If the equipped work unit is included in the abnormality list information 35, the suitability determination unit 38 displays a warning on the touch panel 22. The warning may include, for example, the reason why the work unit is presumed to be abnormal, recommended maintenance procedures, or a recommendation to replace it with another work unit. Furthermore, based on the warning, the operator can be prompted to make a decision about use, and an interlock can be automatically applied to prevent use. In addition, by combining multiple analyses of maintenance needs and abnormality presumptions, production stoppages caused by work unit abnormalities can be further reduced.

[0066] As described above, the manufacturing management device 3 is a data collection device, comprising: an acquisition unit 47 that acquires work history information 43 from a work unit (component mounting device M1 to M3) equipped with a work unit (belt feeder 16, mounting head 14, suction nozzle 15) for manufacturing electronic circuit boards; a document generation unit 48 that generates a first document 44 containing the operation event log of the work unit and maintenance history information, and a second document 45 containing the manufacturing log of the electronic circuit board, based on the acquired work history information 43; and a transmission unit (transmission processing unit 49, off-site communication unit 51) that transmits the first document 44 and the second document 45.

[0067] Furthermore, the maintenance management device 5, equipped with a maintenance need determination unit 67, determines whether a work unit requires maintenance based on a first document 65. Additionally, the maintenance management device 5, equipped with a condition estimation unit 68, estimates the condition of the work unit based on a second document 66. Moreover, the data collection device (manufacturing management device 3) sends the first document 44 to the maintenance need determination device and the second document 45 to the condition estimation device.

[0068] Thus, in the manufacturing management device 3, the information required for analysis and processing is extracted and processed to create two small files, the first file 44 and the second file 45, which are then sent to the maintenance management device 5 (maintenance need determination device and condition estimation device). This reduces the burden of data transmission and reception. As a result, even if the work device and the maintenance need determination device and condition estimation device for analyzing the status of the work unit are located in a different facility than the factory F where the work device is located, the status of the work device can be appropriately analyzed.

[0069] Next, according to Figure 4This describes a work device analysis method that analyzes the status of work units equipped with work devices (component installation devices M1 to M3) using a process described above. Figure 4 This is a flowchart of an embodiment of the working device analysis method disclosed herein.

[0070] First, the acquisition unit 47 acquires operation history information 43 and installation data 32 (ST1) from the operation device (component installation device M1 to M3) equipped with operation units (belt feeder 16, installation head 14 and suction nozzle 15).

[0071] The operation history information 43 is obtained during the operation of the work device or at given intervals. Next, the document generation unit 48 generates a first document 44 (ST2) containing the operation event log of the work device and maintenance history information based on the obtained operation history information 43.

[0072] Next, the document generation unit 48 performs statistical processing (ST3) on the manufacturing log of the electronic circuit board contained in the obtained work history information 43.

[0073] Next, the document generation unit 48 generates a second document 45 (ST4) containing the manufacturing log of the electronic circuit board based on the statistical processing results obtained by statistically processing the acquired work history information 43 and installation data 32. The first document 44 and the second document 45 are sent to the maintenance management device 5 and stored in the maintenance storage unit 64 as the first document 65 and the second document 66.

[0074] Next, the maintenance need determination department 67 determines whether the work unit needs maintenance based on document 65 1 (ST5).

[0075] Next, the condition estimation unit 68 estimates the condition of the work unit (ST6) based on the second document 66. As a result, the condition of the work equipment can be analyzed appropriately.

[0076] exist Figure 4 Next, the report creation department 69, based on the information of the work units that have been determined to require maintenance and the information of the work units that are presumed to need repair due to abnormality, creates a report (ST7) that includes information on the work units that need maintenance or repair and recommended repair methods. The created report is then sent as an email to the mail receiving device 4 of plant F.

[0077] Next, the abnormality list creation unit 70 creates an abnormality list (ST8) based on the information of the work units that need maintenance and the information of the work units that are presumed to need repair due to abnormality. This abnormality list includes information on the work units that need repair or maintenance. The abnormality list is sent to the manufacturing management device 3 of plant F and used for warnings when the work units included in the abnormality list are equipped on the work equipment (parts mounting devices M1 to M3).

[0078] As described above, the work apparatus analysis system 1 of this embodiment includes: an acquisition unit 47 that acquires work history information 43 from a work apparatus (component mounting apparatus M1 to M3) equipped with a work unit (belt feeder 16, mounting head 14, suction nozzle 15) for manufacturing electronic circuit boards; a document generation unit 48 that generates a first document 44 containing an operation event log and maintenance history information of the work apparatus and a second document 45 containing a manufacturing log of the electronic circuit board based on the acquired work history information 43; a maintenance need determination unit 67 that determines whether the work unit needs maintenance based on the first document 65 (first document 44); and a condition estimation unit 68 that estimates the condition of the work unit based on the second document 66 (second document 45). Thus, the condition of the work apparatus can be appropriately analyzed.

[0079] Furthermore, examples of machine learning involved in this embodiment include: supervised learning, which uses teaching data that assigns labels (output information) to the input information to learn the relationship between input and output; unsupervised learning, which constructs data based solely on unlabeled input; semi-supervised learning, which processes both labeled and unlabeled input; and reinforcement learning, which learns the action that will receive the most feedback by obtaining feedback for the selected action from observations of the state. In addition, specific machine learning methods include neural networks (including deep learning that utilizes multi-layered neural networks), genetic programming, decision trees, Bayesian networks, and support vector machines (SVM).

[0080] In the above description, the following embodiment was described: A work apparatus equipped with a work unit performing operations for manufacturing electronic circuit boards sends work history information to a maintenance need determination unit 67 to determine whether the work unit needs maintenance, and then sends it to a condition estimation unit 68 to estimate the condition of the work unit. However, this embodiment can also be applied beyond the one described above, as long as the work apparatus equipped with the work unit performing operations for manufacturing electronic circuit boards sends the work history information to multiple devices. For example, it could be a work analysis device that performs work analysis and a work estimation device that estimates the work condition.

[0081] In addition, in the above Figure 4 In the workflow of the work unit analysis method according to one embodiment of the present disclosure, some steps can be performed in a different order. For example, in the creation of the first document (ST2), the statistical processing of the manufacturing log (ST3), and the creation of the second document (ST4), ST2 can be performed after ST4. Furthermore, the order of determining whether the work unit needs maintenance based on the first document (ST5) and estimating the condition of the work unit based on the second document (ST6) can be reversed.

[0082] Furthermore, the terms defined in the above description are not limited to these specific terms. For example, the condition of a work unit may include the degree of signs or risks of failure, the degree of occurrence of operational errors, and the degree of deterioration.

[0083] Furthermore, the maintenance requirement determination unit 67 may also include a first document 65 stored in the maintenance storage unit 64 and operational specification data measured at the time of manufacture or installation of each work unit, to determine whether maintenance is required for the work unit (belt feeder 16, mounting head 14, and suction nozzle 15, etc.). Examples of operational specification data measured at the time of manufacture or installation include, for example, the flow rate value of the flow sensor 14a when a component is being suctioned; the pressure value of the vacuum gauge when a component is being suctioned; and the current value when the belt feeder 16 is activated.

[0084] Industrial availability

[0085] The operating device analysis system, operating device analysis method, and data collection device disclosed herein have the effect of appropriately analyzing the state of the operating device and are useful in the field of mounting electronic components on a substrate.

[0086] Explanation of reference numerals in the attached figures

[0087] 1. Operating Device Analysis System

[0088] 3. Manufacturing Management Device (Data Collection Device)

[0089] 5. Maintenance management devices (device for determining maintenance needs, device for estimating condition)

[0090] 14 Installation Heads (Working Units)

[0091] 15 suction nozzles (working unit)

[0092] 16-belt feeder (working unit)

[0093] Component D

[0094] M1~M3 component installation device (working device).

Claims

1. A working device analysis system, comprising: The acquisition unit obtains historical information about operations from the work equipment that is equipped with work units that perform operations for manufacturing electronic circuit boards. The document generation unit generates a first file containing the operation event log of the work device and a second file containing the manufacturing log of the electronic circuit board based on the obtained work history information. The maintenance requirement determination department determines whether the work unit requires maintenance based on the first document; and The condition estimation unit estimates the condition of the work unit based on the second document.

2. The operating device analysis system according to claim 1, wherein, The manufacturing log of the electronic circuit board includes the number of installation errors of the components in the work apparatus that mounts the components onto the electronic circuit board.

3. The operating device analysis system according to claim 2, wherein, The manufacturing log of the electronic circuit board includes information on the positional deviation of the component held by the suction nozzle equipped on the work device from its normal holding position.

4. The working device analysis system according to claim 2 or 3, wherein, The acquisition unit further acquires installation data used in the operation of the working device. The document generation unit generates a second document, which also includes the dimensions of the component mounted on the electronic circuit board, based on the obtained installation data.

5. The operating device analysis system according to any one of claims 1 to 3, wherein, The document generation unit performs statistical processing on the manufacturing log of the electronic circuit board to generate the second document.

6. The operating device analysis system according to any one of claims 1 to 3, wherein, The acquisition unit acquires the operation history information during the operation of the operating device or at given intervals.

7. A method for analyzing a working device, comprising: Operation history information is obtained from the work unit equipped with work cells used for manufacturing electronic circuit boards. Based on the obtained work history information, a first file containing the action event log of the work device and a second file containing the manufacturing log of the electronic circuit board are generated. The need for maintenance of the work unit is determined based on the first document. The status of the work unit is inferred based on the second document.

8. The method for analyzing operating devices according to claim 7, wherein, The manufacturing log of the electronic circuit board includes the number of installation errors of the components in the work apparatus that mounts the components onto the electronic circuit board.

9. The method for analyzing operating devices according to claim 8, wherein, The manufacturing log of the electronic circuit board includes information on the positional deviation of the component held by the suction nozzle equipped on the work device from its normal holding position.

10. The method for analyzing a working device according to claim 8 or 9, wherein, The operating device analysis method further obtains installation data used in the operation of the operating device. The second document, which also includes the dimensions of the components mounted on the electronic circuit board, is generated based on the obtained installation data.

11. The method for analyzing the working device according to any one of claims 7 to 9, wherein, The manufacturing log of the electronic circuit board is statistically processed to generate the second file.

12. The method for analyzing the working device according to any one of claims 7 to 9, wherein, The operation history information is obtained during the operation of the operating device or at given intervals.

13. A data collection device, comprising: The acquisition unit obtains historical information about operations from the work equipment that is equipped with work units that perform operations for manufacturing electronic circuit boards. The document generation unit generates a first file containing the operation event log of the work device and a second file containing the manufacturing log of the electronic circuit board based on the obtained work history information; and The sending unit sends the first file and the second file. The sending unit sends the first document to a maintenance need determination device that determines whether the work unit needs maintenance, and sends the second document to a condition estimation device that estimates the condition of the work unit.

14. The data collection apparatus according to claim 13, wherein, The manufacturing log of the electronic circuit board includes the number of installation errors of the components in the work apparatus that mounts the components onto the electronic circuit board.

15. The data collection apparatus according to claim 14, wherein, The manufacturing log of the electronic circuit board includes information on the positional deviation of the component held by the suction nozzle equipped on the work device from its normal holding position.

16. The data collection apparatus according to claim 14 or 15, wherein, The acquisition unit also acquires installation data used in the operation of the working device. The document generation unit generates the second document containing the dimensions of the component mounted on the electronic circuit board based on the obtained installation data.

17. The data collection apparatus according to any one of claims 13 to 15, wherein, The document generation unit performs statistical processing on the manufacturing log of the electronic circuit board to generate the second document.

18. The data collection apparatus according to any one of claims 13 to 15, wherein, The acquisition unit acquires the operation history information during the operation of the operating device or at given intervals.

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