Transfer method and transfer machine

Abstract

The present invention relates to a transfer method and a transfer machine. The present invention proposes a method and an apparatus in which, with respect to components arranged on a first substrate, the components are transferred to a second substrate while correcting positional displacement and using laser light. Actual positional information of the components on the first substrate is acquired, the components are grouped in accordance with a reference determined on the basis of an allowable positional displacement amount, the position of the first substrate is corrected in units of each group in such a manner that the positions of the components are limited to within a range of the allowable positional displacement amount, and the components are transferred to the second substrate by irradiating laser light from the back surface of the first substrate.

Description

Technical Field

[0001] This invention relates to a method for transferring components, a component transfer machine, a method for transferring objects, and a transfer machine for objects. Background Technology

[0002] In recent years, nitride semiconductor optical elements have been used as backlights for liquid crystal displays (LCDs) or for signage displays. These applications require high-speed transfer technology to accommodate large numbers of optical elements at once. High-speed transfer technology utilizes methods such as stamping to transfer multiple elements simultaneously, enabling the transfer of approximately 1,000 to tens of thousands at a time.

[0003] Tiny components, as small as approximately 100 μm, are manufactured along the extended lines of conventional semiconductor component manufacturing processes. A dicing tape is applied to the semiconductor wafer, and slicing lines or internal cracks are created using a mechanical cutter or laser irradiation, thereby dividing the components. The spacing between the components is widened by stretching the dicing tape in a way that allows a robotic arm to pick them up. The positional accuracy caused by stretching the dicing tape is approximately ±30 μm.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2014-036060

[0007] Patent Document 2: Japanese Patent Application Publication No. 2006-041500 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] However, the positional accuracy caused by stretching and cutting the tape is about ±30μm. This positional accuracy is not a problem for the robot to pick up and transfer various components, but when transferring them together by means of stamping, the positional accuracy directly affects the installation accuracy of the components.

[0010] Patent document 1 proposes a method in which the positional offset of each component is pre-determined before transfer, and the component is transferred to the bonding sheet while correcting the positional offset for each component. However, since the components are transferred one by one, it takes a huge amount of time for one machine. Although multiple machines are considered to be in parallel, the cost increases and it is impossible to make use of the high-speed transfer technology in subsequent processes.

[0011] Furthermore, Patent Document 2 proposes a technique for selectively and rapidly transferring minute components using a constant current scanner (galvano scanner), but does not mention a method for correcting the arrangement and positional offset of the components to be transferred.

[0012] Therefore, the present invention proposes a method to solve the problem of simultaneously improving positional accuracy and achieving high speed.

[0013] Technical means to solve the problem

[0014] To address the aforementioned problem, the present invention provides a method for transferring elements from a first substrate to a second substrate. The method utilizes a first substrate and a second substrate. Elements are mounted on the surface of the first substrate at approximately equal intervals with a position offset exceeding a permissible amount. The second substrate is arranged facing the first substrate with a substantially uniform gap and is configured with an adhesive layer on its surface. The method includes: obtaining actual position information of the elements on the first substrate; comparing ideal position information with the actual position information and grouping the elements according to a predetermined reference determined by the permissible position offset; selecting a group to be transferred; correcting the relative positions of the first and second substrates in the planar direction of the selected group based on the predetermined reference; and transferring the elements to the second substrate by continuously irradiating them with a laser from the back of the first substrate only to the elements contained in the selected group.

[0015] To address the aforementioned problem, the component transfer machine of the present invention transfers components from a first substrate to a second substrate. The first substrate has the components mounted on its surface at approximately equal intervals with a position offset exceeding an allowable amount. The second substrate is arranged facing the first substrate with a substantially uniform gap and is configured with an adhesive layer on its surface. The component transfer machine is characterized by comprising: an image processing device for acquiring actual position information of the components on the first substrate; a processing device for comparing ideal position information of the components on the first substrate with the actual position information, grouping the components according to a predetermined reference determined by the allowable position offset, and selecting a group to be transferred; a platform and a platform controller for correcting the relative position of the first substrate and the second substrate in the planar direction of the substrate based on the predetermined reference of the selected group; and a laser device and a constant current scanner optical system for continuously irradiating the selected group of components with laser light from the back of the first substrate.

[0016] To address the aforementioned problem, the object transfer method of the present invention transfers an object from a first substrate to a second substrate, using both the first and second substrates. The first substrate has a region on the first substrate where the object is located with an offset exceeding an allowable amount. The second substrate is disposed opposite to the first substrate with a gap between them. The object transfer method includes: obtaining actual position information of the object on the first substrate; comparing ideal position information of the object on the first substrate with the actual position information to group the object; selecting a group to be transferred; and irradiating the object contained in the selected group with a laser to transfer it to the second substrate.

[0017] To solve the aforementioned problem, the object transfer machine of the present invention transfers an object from a first substrate to a second substrate, wherein the object is disposed on the first substrate with an offset exceeding an allowable positional amount, and the second substrate is disposed facing the first substrate with a gap between them. The object transfer machine includes: an image processing device for acquiring actual position information of the object on the first substrate; a computational processing device for comparing ideal position information of the object on the first substrate with the actual position information, grouping the object into groups, and selecting the group to be transferred; and a laser device and an optical system for irradiating only the object contained in the selected group with a laser.

[0018] The effects of the invention

[0019] Therefore, components can be transferred while correcting the position offset for each group, which has the following effect: a second substrate can be manufactured at high speed with the position accuracy of all transferred components within the allowable position offset. Attached Figure Description

[0020] Figure 1 This diagram illustrates the structure of an LED supply substrate according to an embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram illustrating the configuration of LEDs according to an embodiment of the present invention (in this diagram, each LED has a certain degree of positional offset).

[0022] Figure 3 This is a schematic diagram illustrating the acquisition of the actual position information of an LED according to an embodiment of the present invention.

[0023] Figure 4 A diagram illustrating the LED grouping algorithm according to an embodiment of the present invention.

[0024] Figure 5 This is a flowchart illustrating the transfer operation of the component transfer machine according to an embodiment of the present invention.

[0025] Figure 6This is a diagram illustrating the processing flow of the component transfer machine according to an embodiment of the present invention.

[0026] [Explanation of Symbols]

[0027] 1: Synthetic quartz substrate

[0028] 2: LED

[0029] 5: Grid points

[0030] 4: Grid lines

[0031] 7: Carrier substrate

[0032] 6: Observation tube Detailed Implementation

[0033] Hereinafter, an example of an embodiment of the present invention will be described. Furthermore, in all the accompanying drawings, the dimensions and proportions of each structural element are appropriately different from the actual figures in order to facilitate easy identification of the structural elements on the drawings.

[0034] In this embodiment, a light-emitting diode (LED) based on GaN (gallium nitride) semiconductor will be used for explanation. Typically, LED manufacturers form multiple LEDs on a sapphire substrate. After this process, dicing tape is applied to the sapphire substrate, which is then cut using a laser cutter. A high-precision expander is used to stretch the dicing tape, widening each LED to a specified interval, and transferring it to a wafer or substrate for supply to manufacturers of displays using LEDs. Here, the processing of a substrate with LEDs mounted at approximately equal intervals will be described.

[0035] First, use Figure 1 The structure of the LED supply substrate is explained. Figure 1 This is an overall view of the LED supply substrate. The LED supply substrate is an example of a substrate on which the target element is mounted in the element transfer method of this embodiment.

[0036] The LED supply substrate is constructed by arranging a plurality of LEDs 2, each an element, in a matrix on a double-sided polished synthetic quartz substrate 1. The LEDs 2 are arranged at equal intervals within a specified precision. The positional precision of each LED is defined as: the offset from the ideal position of the LED in the horizontal XY direction, with the center of the synthetic quartz substrate 1 as a reference, at equally spaced grid points; and the offset from the grid line connecting the grid points in the rotational direction θ.

[0037] Figure 2The diagram illustrates the relationship between LED2, grid point 5, and grid line 4. The specified precision depends on the characteristics of the cutting tape and the mechanical precision and control of the extender, with a horizontal XY precision within ±30μm and a rotational precision θ of each component within ±1 degree. Regarding the actual position information of each LED2 used in the transfer process, the position information pre-obtained by the visual inspection machine can also be used after coordinate transformation; however, the method for timely acquisition in the component transfer machine will be explained.

[0038] In the component transfer machine, the synthetic quartz substrate 1 and the carrier substrate 7, which serve as LED supply substrates, are respectively disposed on the XYθ upper substrate platform and the XYZθ lower substrate platform. Figure 3 The diagram below illustrates the acquisition of actual position information. The component transfer machine moves the synthetic quartz substrate 1 with the center as a reference, and the observation tube 6 is positioned directly above the grid point 5 corresponding to the ideal position of each LED. The control unit (not shown) of the component transfer machine photographs the LED 2 through the quartz substrate 1 and calculates the positional offset from the grid point 5 through image processing. Figure 3 As shown, the LEDs are spaced at different intervals, A and B, with deviations within a specified precision. These deviations are repeatedly accumulated for all LEDs on the synthetic quartz substrate 1 to obtain actual position information. Visual inspections for defects such as cracks, gaps, and flaws, in addition to positional offsets, can also be performed simultaneously, incorporating appearance defects into the actual position information.

[0039] Next, use Figure 4 The algorithm for grouping LED2 is explained. Grouping is determined for each LED separately.

[0040] The first criterion is whether the positional offsets of X, Y, and θ are all within the reference value. If this criterion is met, the LED is added to the first group. Here, the reference value is the allowable positional offset of the substrate after transfer, which is the target. X and Y are ±10μm respectively. Since the offset in the rotational direction is less, θ is set to ±1μm.

[0041] The second criterion is whether the offset in the positive X direction exceeds the reference value of 10 μm and is within 3 times the reference value, i.e., 30 μm. If this criterion is met, the LED is added to the second group.

[0042] The third criterion is whether the offset in the negative X direction exceeds the reference value of -10μm and is within 3 times the reference value, i.e., -30μm. If this criterion is met, the LED is added to the third group.

[0043] Similarly, the positive and negative values ​​of Y, the four tilt directions of XY, and the positive and negative values ​​of θ are also determined. If the determination is met, they are added to the fourth to eleventh groups respectively.

[0044] If any of the criteria are not met, the LED will be considered to have exceeded the allowable value for positional offset, or if the actual position information contains information about poor appearance, and it will be managed as a defective LED group.

[0045] Next, use Figure 5 The process of the component transfer machine's transfer operation is explained.

[0046] First, as an initial step, the lower substrate platform is moved to the junction position, the carrier substrate is set up, and it is mounted in the alignment position and aligned using the external shape reference. Specifically, the ends of the carrier substrate are inspected using an observation lens. In the case of a circular substrate, a prescribed alignment operation consistent with the platform's coordinate system is performed at the reference plane (orientation flat). In the case of a square substrate, a prescribed alignment operation consistent with the platform's coordinate system is performed at the ends and corners. The center coordinates and rotation coordinates of the set carrier substrate, with the observation lens as the reference, are saved. During the alignment operation, the adjustment is completed in a manner that aligns the rotation direction with the platform's coordinate system.

[0047] As the second step, the upper substrate platform is moved to the junction position, the synthetic quartz substrate is placed, and it is mounted in the alignment position for alignment using the LEDs as a reference. Specifically, the ends of the LED array are located using an observation lens. At the found ends and corners of the LED array, a prescribed alignment operation is performed, consistent with the platform's coordinate system, maintaining the center coordinates and rotational coordinates of the synthetic quartz substrate relative to the observation lens. The alignment operation is completed by adjusting the rotational direction in accordance with the platform's coordinate system.

[0048] As a third step, the LED arrangement information and permissible position offsets are input into the graphical user interface (GUI) of the control unit. The input values ​​include the total number of LEDs, the number of LEDs per row, the column spacing in the X direction, and the row spacing in the Y direction. The permissible position offsets are EX in the X direction, EY in the Y direction, and Eθ in the θ direction. Furthermore, the offsets are considered to be the same value in both positive and negative directions.

[0049] As the fourth step, based on the input arrangement information, the actual position information of each LED is obtained. Specifically, based on the center coordinates of the synthetic quartz substrate and the input arrangement information, the ideal position coordinates of the corner LEDs are calculated, and the upper substrate platform is moved to the ideal position coordinates. The LEDs are photographed using an observation lens, and the position offset is calculated and saved through image processing. This process is repeated for all LEDs to obtain the actual position information.

[0050] The fifth step, grouping based on actual location information, is used as described above. Figure 4 As explained.

[0051] As the sixth step, processing actions are performed on each group. Figure 6 The processing flow describes the specific processing actions. Furthermore, processing actions are skipped for groups of defective LEDs. If LEDs are assigned to a group of defective LEDs, this is displayed on the component transfer machine's GUI.

[0052] As the initial step in the processing, the synthetic quartz substrate and the carrier substrate 7 are moved to the processing center of the constant current scanner using the horizontal distance between the mechanically specified observation tube and the constant current scanner, the center coordinates of the observation tube reference of the previously obtained synthetic quartz substrate, and the center coordinates of the observation tube reference of the carrier substrate 7.

[0053] As the second step in the processing, the substrate is moved along the Z-axis of the lower substrate platform in a manner that the gap between the synthetic quartz substrate and the carrier substrate 7 is twice the height of the LED plus α. For example, in the case of a height of 100 μm, the platform is moved in a manner that the gap at the center is 220 μm. The reason for determining the gap at the center is that the center sags due to the size of the synthetic quartz substrate. If the process range becomes narrower due to the material and requires strict adjustment, a height sensor capable of detecting transparent materials can be used to measure the gap at the center each time.

[0054] As the third step in the processing operation, the ideal position information (coordinate data group) of the LEDs contained in the currently selected group is input into the control unit of the constant current scanner as the laser irradiation position.

[0055] As the fourth step in the processing, the upper substrate platform is moved with a correction value corresponding to the currently selected group to correct the relative position of the synthetic quartz substrate and the carrier substrate 7. The correction value is explained in detail below. For example, if the allowable position offset EX is set to 10 μm, then the second group of X(+) will have a position offset in the positive X direction exceeding 10 μm but within 30 μm, while others will be within the reference value. The correction value in this case is -20 μm in the X direction. Similarly, for other groups, a value twice the reference value with the sign reversed becomes the correction value.

[0056] As the final step in the processing, a processing instruction is sent to the control unit of the constant current scanner. Upon receiving this instruction, the control unit of the constant current scanner, based on the input coordinate data set, performs the following actions for all coordinate data: adjusting the laser irradiation position and sending an oscillation trigger to the laser, irradiating the LED from the back of the synthetic quartz substrate, etc. The irradiated LED is ejected due to thermomechanical phenomena and / or chemical explosion phenomena, and transferred to the carrier substrate.

[0057] The embodiments of the present invention have been described in detail above. However, if the present invention is presented from a different viewpoint, it will be as follows (1) to (42).

[0058] (1) A method for transferring a component, wherein a component is transferred from a first substrate to a second substrate, and

[0059] Using a first substrate and a second substrate, the first substrate has components mounted on its surface at approximately equal intervals with an offset exceeding a permissible amount, and the second substrate is arranged facing the first substrate with a substantially uniform gap and is configured to have an adhesive layer on its surface.

[0060] The method for transferring the component includes:

[0061] The steps for obtaining the actual position information of components on the first substrate;

[0062] The step of comparing the ideal position information of the components on the first substrate with the actual position information and grouping the components according to a predetermined reference determined by the allowable position offset;

[0063] The steps to select the group to be migrated;

[0064] The step of correcting the relative positions of the first substrate and the second substrate in the planar direction of the substrate based on the specified reference of the selected group; and

[0065] The step of transferring components from the back of the first substrate to the second substrate by continuously irradiating the selected group of components with a laser.

[0066] (2) The component transfer method according to (1), wherein the permissible position offset is an offset relative to the ideal position information in the longitudinal (X) and / or lateral (Y) and / or rotational (θ) directions of the substrate surface, and the specified reference is below the permissible position offset.

[0067] (3) The component transfer method described in (2), wherein the grouping includes: comparing ideal position information with actual position information, and designating components whose XYθ values ​​are within the specified reference as the first group; and

[0068] For the six positive and negative values ​​of X, Y, and θ, the steps are as follows: elements that exceed the specified reference and are within three times the specified reference value, and the other five elements are within the specified reference value, are set as the second to seventh groups.

[0069] (4) The component transfer method according to (2), wherein the grouping includes: comparing ideal position information with actual position information, and adding components within the specified reference to the first group; and

[0070] In the ten grouping patterns, including six positive and negative X, Y, and θ and four positive and negative combinations of XY, at least one pattern is selected. The selected patterns are compared sequentially. If the compared pattern exceeds the specified benchmark but is within three times the value of the specified benchmark, and other selected patterns are within the specified benchmark, the elements are added to the group corresponding to the selected pattern, i.e., the second to eleventh groups.

[0071] (5) The method of transferring the element according to any one of (1) to (4), wherein the actual position information of the element on the first substrate includes defective information, and the elements are grouped in such a way that the selected group for irradiation does not contain defective elements.

[0072] (6) The method of transferring the element according to any one of (1) to (5), wherein the laser is irradiated by a constant current scanner.

[0073] (7) A method for transferring an element according to any one of (1) to (6), wherein the element is an LED.

[0074] (8) A method for transferring an element according to any one of (1) to (7), wherein the element is arranged in a matrix on the first substrate.

[0075] (9) The method of transferring an element according to any one of (1) to (8), wherein the element is arranged in the longitudinal direction (X) of the first substrate surface with an accuracy of within ±30 μm relative to ideal position information.

[0076] (10) The method of transferring an element according to any one of (1) to (9), wherein the element is arranged in the lateral (Y) direction of the first substrate surface with an accuracy of ±30 μm relative to ideal position information.

[0077] (11) The method of transferring an element according to any one of (1) to (10), wherein the element is arranged in a rotational direction (θ) in the direction of the first substrate surface with an accuracy of ±1 degree relative to the ideal position information.

[0078] (12) A component transfer machine for transferring components from a first substrate to a second substrate, wherein the components are mounted on the surface of the first substrate at approximately equal intervals with an offset exceeding a permissible positional amount, and the second substrate is disposed facing the first substrate with a substantially uniform gap and is configured to have an adhesive layer on its surface, and the component transfer machine is characterized by comprising:

[0079] An image processing device acquires the actual position information of components on the first substrate;

[0080] The processing unit compares the ideal position information of the components on the first substrate with the actual position information, groups the components according to a predetermined reference determined by the allowable position offset, and selects the group to be transferred.

[0081] The platform and platform controller, based on the specified reference of the selected group, correct the relative positions of the first and second substrates in the planar direction of the substrates; and

[0082] The laser device and constant current scanner optical system continuously irradiate the selected group of elements with laser light from the back of the first substrate.

[0083] (13) A method for transferring an object, wherein the object is transferred from a first substrate to a second substrate, and

[0084] Using a first substrate and a second substrate, the first substrate has an object located in a region of the first substrate in a state exceeding the permissible positional offset, and the second substrate is disposed facing the first substrate with a gap between them.

[0085] The method for transferring the object includes:

[0086] The steps for obtaining the actual position information of the object on the first substrate;

[0087] The step of grouping objects by comparing the ideal position information of objects on the first substrate with the actual position information;

[0088] The steps for selecting the group to be migrated; and

[0089] The step of transferring the objects contained in the selected group to a second substrate by irradiating them with a laser.

[0090] (14) The object transfer method according to (13) wherein the permissible position offset includes at least one of the group consisting of a longitudinal (X) offset, a lateral (Y) offset, and a rotational (θ) offset relative to the first substrate surface direction of the ideal position information.

[0091] (15) The object transfer method according to (13) or (14) wherein, in the step of grouping the objects by comparing the ideal position information of the objects on the first substrate with the actual position information, the objects are grouped according to a predetermined reference determined by the allowable position offset.

[0092] (16) The object transfer method described in (15), wherein the permissible position offset is the specified reference.

[0093] (17) The object transfer method according to any one of (14) to (16), wherein the permissible position offset in the longitudinal (X) direction of the first substrate surface is within ±10 μm.

[0094] (18) The object transfer method according to any one of (14) to (17), wherein the permissible positional offset in the lateral (Y) direction of the first substrate surface is within ±10 μm.

[0095] (19) The object transfer method according to any one of (14) to (18), wherein the permissible positional offset of the rotation direction (θ) in the direction of the first substrate surface is within ±1 degree.

[0096] (20) The method for transferring objects according to any one of (15) to (19), wherein the grouping includes the steps of: comparing ideal position information with actual position information, and designating objects whose XYθ is at least within the specified reference as the first group; and

[0097] The step of designating an object in the first group whose remaining at least one undetermined XYθ is within the specified reference, or an object in the first group whose determined XYθ exceeds the specified reference, as an object in the second group.

[0098] (21) The method for transferring objects according to any one of (13) to (20), wherein in the step of transferring objects contained in the selected group to a second substrate by irradiating them with a laser, the objects contained in the selected group are continuously irradiated with a laser.

[0099] (22) The method for transferring an object according to any one of (13) to (21), wherein the object is an element.

[0100] (23) The object transfer method described in (22), wherein the element is an LED.

[0101] (24) The object transfer method described in any one of (13) to (23), wherein the object is arranged in the longitudinal direction (X) of the first substrate surface with an accuracy of ±30 μm relative to the ideal position information.

[0102] (25) The object transfer method described in any one of (13) to (24), wherein the object is arranged in the lateral (Y) direction of the first substrate surface with an accuracy of ±30 μm relative to the ideal position information.

[0103] (26) The object transfer method described in any one of (13) to (25), wherein the object is arranged with an accuracy of ±1 degree in the rotation direction (θ) of the first substrate surface relative to the ideal position information.

[0104] (27) An object transfer machine for transferring an object from a first substrate to a second substrate, wherein the object is disposed on the first substrate in a state exceeding an allowable positional offset, and the second substrate is disposed facing the first substrate with a gap therebetween, and the object transfer machine comprises:

[0105] An image processing device acquires the actual position information of an object on a first substrate;

[0106] The processing unit compares the ideal position information of the objects on the first substrate with the actual position information, groups the objects, and selects the group to be transferred; and

[0107] The laser device and optical system irradiate the objects contained in the selected group only.

[0108] (28) The object transfer machine according to (27), wherein the laser device and optical system continuously irradiate the objects contained in the selected group with laser light only.

[0109] (29) The object transfer machine according to (27) or (28), wherein the optical system is a constant current scanner optical system.

[0110] (30) The object transfer machine according to any one of (27) to (29), wherein the permissible position offset includes at least one of the group consisting of a longitudinal (X) offset, a lateral (Y) offset, and a rotational (θ) offset relative to the first substrate surface direction of the ideal position information.

[0111] (31) The transfer machine of the object described in any one of (27) to (30), wherein the arithmetic processing device groups objects according to a predetermined reference determined by the permissible position offset.

[0112] (32) The transfer machine of the object described in (31), wherein the permissible position offset is the specified reference.

[0113] (33) The object transfer machine according to any one of (27) to (32), wherein the permissible positional offset in the longitudinal (X) direction of the first substrate surface is within ±10 μm.

[0114] (34) The object transfer machine according to any one of (27) to (33), wherein the permissible positional offset in the lateral (Y) direction of the first substrate surface is within ±10 μm.

[0115] (35) The object transfer machine according to any one of (27) to (34), wherein the permissible positional offset of the rotation direction (θ) in the direction of the first substrate surface is within ±1 degree.

[0116] (36) A transfer machine for objects according to any one of (31) to (35), wherein the grouping includes the steps of comparing ideal position information with actual position information and designating objects whose XYθ is at least within the specified reference as the first group; and

[0117] The step of designating an object in the first group whose remaining at least one undetermined XYθ is within the specified reference, or an object in the first group whose determined XYθ exceeds the specified reference, as an object in the second group.

[0118] (37) A transfer machine for objects described in any one of (31) to (36), comprising: a platform and a platform controller, which corrects the relative positions of the first substrate and the second substrate in the planar direction of the substrate based on the specified reference of the selected group.

[0119] (38) A transfer machine for an object as described in any one of (27) to (37), wherein the object is an element.

[0120] (39) The transfer machine for the object described in (38), wherein the element is an LED.

[0121] (40) The object transfer machine according to any one of (27) to (39), wherein the object is arranged in the longitudinal direction (X) of the first substrate surface with an accuracy of ±30 μm relative to the ideal position information.

[0122] (41) The object transfer machine according to any one of (27) to (40), wherein the object is arranged in the lateral (Y) direction of the first substrate surface with an accuracy of ±30 μm relative to the ideal position information.

[0123] (42) The object transfer machine according to any one of (27) to (41), wherein the object is arranged with an accuracy of ±1 degree in the rotation direction (θ) of the first substrate surface relative to the ideal position information.

[0124] Furthermore, if the present invention is presented from different viewpoints, it becomes as described below (U1) to (U42).

[0125] (U1) A component transfer system for transferring a component from a first substrate to a second substrate, and

[0126] Using a first substrate and a second substrate, the first substrate has components mounted on its surface at approximately equal intervals with an offset exceeding a permissible amount, and the second substrate is arranged facing the first substrate with a substantially uniform gap and is configured to have an adhesive layer on its surface.

[0127] The component transfer system includes:

[0128] A mechanism for acquiring the actual position information of components on the first substrate;

[0129] A mechanism that compares the ideal position information of components on a first substrate with the actual position information and groups the components according to a predetermined reference determined by the allowable position offset.

[0130] Select the organization of the group to be transferred;

[0131] A mechanism for correcting the relative positions of the first and second substrates in the planar direction of the substrates based on the specified references of the selected group; and

[0132] A mechanism for transferring components from the back of a first substrate to a second substrate by continuously irradiating them with a laser only to the selected group of components.

[0133] (U2) The component transfer system according to (U1), wherein the permissible position offset is the offset relative to the ideal position information in the longitudinal (X) and / or lateral (Y) and / or rotational (θ) directions of the substrate surface, and the specified reference is below the permissible position offset.

[0134] (U3) The component transfer system according to (U2), wherein the grouping includes the step of comparing ideal position information with actual position information and setting components with XYθ within the specified reference as the first group;

[0135] For the six positive and negative values ​​of X, Y, and θ, the steps are as follows: elements that exceed the specified reference and are within three times the specified reference value, and the other five elements are within the specified reference value, are set as the second to seventh groups.

[0136] (U4) The component transfer system according to (U2), wherein the grouping includes: comparing ideal position information with actual position information, and adding components within the specified reference to the first group; and

[0137] In the ten grouping patterns, including six positive and negative X, Y, and θ and four positive and negative combinations of XY, at least one pattern is selected. The selected patterns are compared sequentially. If the compared pattern exceeds the specified benchmark but is within three times the value of the specified benchmark, and other selected patterns are within the specified benchmark, the elements are added to the group corresponding to the selected pattern, i.e., the second to eleventh groups.

[0138] (U5) A transfer system for an element as described in any one of (U1) to (U4), wherein the actual position information of the element on the first substrate includes defect information, and the elements are grouped in such a way that the selected group for irradiation does not contain defective elements.

[0139] (U6) A transfer system for an element described in any one of (U1) to (U5), wherein the laser is irradiated by a constant current scanner.

[0140] (U7) A transfer system for an element described in any one of (U1) to (U6), wherein the element is an LED.

[0141] (U8) A transfer system for the elements described in any one of (U1) to (U7), wherein the elements are arranged in a matrix on the first substrate.

[0142] (U9) A transfer system for an element according to any one of (U1) to (U8), wherein the element is arranged in the longitudinal direction (X) of the first substrate surface with an accuracy within ±30 μm relative to ideal position information.

[0143] (U10) A transfer system for an element according to any one of (U1) to (U9), wherein the element is arranged in the lateral (Y) direction of the first substrate surface with an accuracy within ±30 μm relative to ideal position information.

[0144] (U11) A transfer system for an element according to any one of (U1) to (U10), wherein the element is arranged with an accuracy of ±1 degree in the rotation direction (θ) in the direction of the first substrate surface relative to ideal position information.

[0145] (U12) A component transfer machine having a substrate, wherein a first substrate is provided in the component transfer machine, the component transfer machine transfers components from the first substrate to a second substrate, the components are mounted on the surface of the first substrate at approximately equal intervals with an offset exceeding an allowable amount, the second substrate is arranged facing the first substrate with a substantially uniform gap, and is configured to have an adhesive layer on its surface, and the component transfer machine having a substrate is characterized by comprising:

[0146] An image processing device acquires the actual position information of the components on the first substrate;

[0147] The processing unit compares the ideal position information of the components on the first substrate with the actual position information, groups the components according to a predetermined reference determined by the allowable position offset, and selects the group to be transferred.

[0148] The platform and platform controller, based on the specified reference of the selected group, correct the relative positions of the first and second substrates in the planar direction of the substrates; and

[0149] The laser device and constant current scanner optical system continuously irradiate the selected group of elements with laser light from the back of the first substrate.

[0150] (U13) A transfer system for an object, wherein an object is transferred from a first substrate to a second substrate, and

[0151] Using a first substrate and a second substrate, the first substrate has an object located in a region of the first substrate with an object offset exceeding a permissible positional offset, the second substrate is disposed facing the first substrate with a gap, and the object transfer system includes:

[0152] A mechanism for acquiring the actual position information of an object on the first substrate;

[0153] A mechanism that compares the ideal position information of objects on the first substrate with the actual position information to group the objects;

[0154] The organization that selects the group to be migrated; and

[0155] A mechanism for transferring objects from a selected group to a second substrate by irradiating them with a laser.

[0156] (U14) The object transfer system according to (U13) wherein the permissible position offset includes at least one of the group consisting of a longitudinal (X) offset, a lateral (Y) offset, and a rotational (θ) offset relative to the first substrate surface direction of the ideal position information.

[0157] (U15) According to the object transfer system described in (U13) or (U14), in the mechanism for grouping objects by comparing the ideal position information of the objects on the first substrate with the actual position information, the grouping is performed based on a predetermined reference determined by the allowable position offset.

[0158] (U16) The object transfer system according to (U15), wherein the permissible position offset is the specified reference.

[0159] (U17) The object transfer system according to any one of (U14) to (U16), wherein the permissible positional offset in the longitudinal (X) direction of the first substrate surface is within ±10 μm.

[0160] (U18) The object transfer system according to any one of (U14) to (U17), wherein the permissible positional offset in the lateral (Y) direction of the first substrate surface is within ±10 μm.

[0161] (U19) The object transfer system described in any of (U14) to (U18) wherein the permissible positional offset of the rotation direction (θ) in the direction of the first substrate surface is within ±1 degree.

[0162] (U20) A transfer system for objects according to any one of (U15) to (U19), wherein the grouping includes the steps of: comparing ideal position information with actual position information, and designating objects whose XYθ is at least within the specified reference as the first group; and

[0163] The step of designating an object in the first group whose remaining at least one undetermined XYθ is within the specified reference, or an object in the first group whose determined XYθ exceeds the specified reference, as an object in the second group.

[0164] (U21) The object transfer system according to any one of (U13) to (U20), wherein the mechanism for transferring the objects contained in the selected group to the second substrate by irradiating them with a laser continuously irradiates the objects contained in the selected group with a laser.

[0165] (U22) A transfer system for an object as described in any one of (U13) to (U21), wherein the object is an element.

[0166] (U23) The object transfer system according to (U22), wherein the element is an LED.

[0167] (U24) The object transfer system according to any one of (U13) to (U23), wherein the object is arranged in the longitudinal direction (X) of the first substrate surface with an accuracy of ±30 μm relative to the ideal position information.

[0168] (U25) The object transfer system according to any one of (U13) to (U24), wherein the object is arranged in the lateral (Y) direction of the first substrate surface with an accuracy of ±30 μm relative to the ideal position information.

[0169] (U26) The object transfer system according to any one of (U13) to (U25), wherein the object is arranged with an accuracy of ±1 degree in the rotation direction (θ) in the direction of the first substrate surface relative to the ideal position information.

[0170] (U27) A transfer machine for an object having a substrate, wherein a first substrate is provided in the transfer machine, the transfer machine transfers the object from the first substrate to a second substrate, the first substrate having the object disposed on the first substrate in a state exceeding an allowable positional offset, the second substrate being disposed facing the first substrate with a gap, and the transfer machine for an object having a substrate includes:

[0171] An image processing device acquires the actual position information of an object on a first substrate;

[0172] The processing device compares the ideal position information of the objects on the first substrate with the actual position information, groups the objects, and selects the group to be transferred.

[0173] The laser device and optical system irradiate the objects contained in the selected group only.

[0174] (U28) The transfer machine for objects provided with a substrate as described in (U27), wherein the laser device and optical system continuously irradiate the objects contained in the selected group with laser light only.

[0175] (U29) A transfer machine for an object having a substrate as described in (U27) or (U28), wherein the optical system is a constant current scanner optical system.

[0176] (U30) A transfer machine for an object having a substrate as described in any one of (U27) to (U29), wherein the permissible position offset includes at least one of the group consisting of a longitudinal (X) offset, a lateral (Y) offset, and a rotational (θ) offset relative to the first substrate surface direction of the ideal position information.

[0177] (U31) A transfer machine for an object having a substrate as described in any one of (U27) to (U30), wherein the arithmetic processing device groups objects according to a predetermined reference determined by the permissible position offset.

[0178] (U32) A transfer machine for an object having a substrate as described in (U31), wherein the permissible position offset is the specified reference.

[0179] (U33) A transfer machine for an object having a substrate as described in any one of (U27) to (U32), wherein the permissible positional offset in the longitudinal (X) direction of the first substrate surface is within ±10 μm.

[0180] (U34) A transfer machine for an object having a substrate as described in any one of (U27) to (U33), wherein the permissible positional offset in the lateral (Y) direction of the first substrate surface is within ±10 μm.

[0181] (U35) A transfer machine for an object having a substrate as described in any one of (U27) to (U34), wherein the permissible positional offset of the rotation direction (θ) in the direction of the first substrate surface is within ±1 degree.

[0182] (U36) A transfer machine for objects having a substrate provided according to any one of (U31) to (U35), wherein the grouping includes the steps of comparing ideal position information with actual position information and designating objects whose at least one of XYθ is within the specified reference as the first group; and

[0183] The step of designating an object in the first group whose remaining at least one undetermined XYθ is within the specified reference, or an object in the first group whose determined XYθ exceeds the specified reference, as an object in the second group.

[0184] (U37) A transfer machine for an object having a substrate as described in any one of (U31) to (U36), comprising:

[0185] The platform and platform controller, based on the specified reference of the selected group, correct the relative positions of the first substrate and the second substrate in the planar direction of the substrate.

[0186] (U38) A transfer machine for an object having a substrate as described in any one of (U27) to (U37), wherein the object is an element.

[0187] (U39) A transfer machine for providing a substrate according to the object described in (U38), wherein the element is an LED.

[0188] (U40) A transfer machine for providing a substrate according to any one of (U27) to (U39), wherein the object is arranged in the longitudinal direction (X) of the first substrate surface with an accuracy within ±30 μm relative to ideal position information.

[0189] (U41) A transfer machine for an object having a substrate as described in any one of (U27) to (U40), wherein the object is arranged with an accuracy of ±30 μm in the lateral (Y) direction of the first substrate surface relative to ideal position information.

[0190] (U42) A transfer machine for an object having a substrate as described in any one of (U27) to (U41), wherein the object is arranged with an accuracy of ±1 degree in the rotation direction (θ) in the direction of the first substrate surface relative to ideal position information.

[0191] Moreover, various institutions can have different functions, or one institution can have multiple functions.

[0192] Industrial availability

[0193] This invention can be used in component transfer methods and component transfer machines.

Claims

1. A method for transferring a component, comprising transferring a component from a first substrate to a second substrate, and Using a first substrate and a second substrate, the first substrate has components mounted at equal intervals on its surface with an offset exceeding a permissible amount, and the second substrate is arranged facing the first substrate with a uniform gap and is configured to have an adhesive layer on its surface. The method for transferring the component includes: The steps for obtaining the actual position information of components on the first substrate; The step of comparing the ideal position information of the components on the first substrate with the actual position information and grouping the components according to a predetermined reference determined by the allowable position offset; The steps to select the group to be migrated; The step of correcting the relative positions of the first substrate and the second substrate in the planar direction of the substrate based on the specified reference of the selected group; as well as The step of transferring components from the back of the first substrate to the second substrate by continuously irradiating the selected group of components with a laser.

2. The component transfer method according to claim 1, wherein, The permissible position offset is the offset relative to the ideal position information in the longitudinal (X) and / or lateral (Y) and / or rotational (θ) directions of the substrate surface, and the specified reference is below the permissible position offset.

3. The component transfer method according to claim 2, wherein, The grouping includes: comparing ideal position information with actual position information, and classifying elements whose XYθ values ​​are within the specified reference as the first group; and... For the six positive and negative values ​​of X, Y, and θ, the steps are as follows: elements that exceed the specified reference and are within three times the specified reference value, and the other five elements are within the specified reference value, are set as the second to seventh groups.

4. The component transfer method according to claim 2, wherein, The grouping includes the steps of comparing ideal location information with actual location information and adding elements within the specified reference to the first group; and In the ten grouping patterns, including six positive and negative X, Y, and θ and four positive and negative combinations of XY, at least one pattern is selected, and the selected patterns are compared sequentially. Elements whose compared patterns exceed the specified benchmark and are within three times the value of the specified benchmark, and whose other selected patterns are within the specified benchmark, are added to the group corresponding to the continued selected pattern, namely the second group to the eleventh group.

5. The component transfer method according to claim 1, wherein, The actual location information of the components on the first substrate includes defect information, and the components are grouped in such a way that the selected group for irradiation does not contain defective components.

6. The component transfer method according to claim 1, wherein, The laser is applied by a constant current scanner.

7. The component transfer method according to claim 1, wherein, The component is a light-emitting diode (LED).

8. The method for transferring an element according to claim 1, wherein, The elements are arranged in a matrix on the first substrate.

9. The component transfer method according to claim 1, wherein, The elements are arranged with an accuracy within ±30 μm in the longitudinal direction (X) of the first substrate surface relative to the ideal position information.

10. The method for transferring an element according to claim 1, wherein, The elements are arranged with an accuracy within ±30 μm in the lateral (Y) direction of the first substrate surface relative to the ideal position information.

11. The method for transferring an element according to any one of claims 1 to 10, wherein, The elements are arranged with an accuracy within ±1 degree in rotation direction (θ) relative to the ideal position information in the direction of the first substrate surface.

12. A component transfer machine for transferring components from a first substrate to a second substrate, wherein the components are equally spaced on the surface of the first substrate at a position exceeding a permissible offset, and the second substrate is disposed facing the first substrate with a uniform gap and is configured to have an adhesive layer on its surface, and the component transfer machine is characterized by comprising: An image processing device acquires the actual position information of the components on the first substrate; The processing unit compares the ideal position information of the components on the first substrate with the actual position information, groups the components according to a predetermined reference determined by the allowable position offset, and selects the group to be transferred. The platform and platform controller, based on the specified reference of the selected group, correct the relative positions of the first substrate and the second substrate in the planar direction of the substrate; as well as The laser device and constant current scanner optical system continuously irradiate the selected group of elements with laser light from the back of the first substrate.

13. A method for transferring an object, wherein the object is transferred from a first substrate to a second substrate, and The objects are arranged in a grid pattern on the surface of the first substrate with an offset exceeding the allowable positional deviation. The object transfer method uses a first substrate and a second substrate disposed opposite to the first substrate with a gap, and includes: The steps for obtaining the actual position information of the object on the first substrate; The step of grouping objects by comparing the grid points or grid lines connecting the grid points, which are the ideal position information of objects on the first substrate, with the actual position information; The steps to select the group to be migrated; as well as The step of transferring the objects contained in the selected group to a second substrate by irradiating them with a laser.

14. The method for transferring an object according to claim 13, wherein, The permissible position offset includes at least one of the group consisting of a longitudinal (X) offset, a lateral (Y) offset, and a rotational (θ) offset relative to the first substrate surface direction of the ideal position information.

15. The method for transferring an object according to claim 13, wherein, In the step of grouping objects by comparing the ideal position information of the objects on the first substrate with the actual position information, the objects are grouped according to a predetermined reference determined by the allowable position offset.

16. The method for transferring an object according to claim 15, wherein, The permissible position offset is the specified reference.

17. The method for transferring an object according to claim 14, wherein, The permissible positional offset in the longitudinal (X) direction of the first substrate surface is within ±10μm.

18. The method for transferring an object according to claim 14, wherein, The permissible positional offset in the lateral (Y) direction of the first substrate surface is within ±10μm.

19. The method for transferring an object according to claim 14, wherein, The permissible positional offset of the rotation direction (θ) in the direction of the first substrate surface is within ±1 degree.

20. The method for transferring an object according to claim 15, wherein, The grouping includes the steps of: comparing ideal location information with actual location information, and classifying objects whose XYθ values ​​are at least within the specified reference as belonging to the first group; and... The step of designating an object in the first group whose remaining at least one undetermined XYθ is within the specified reference, or an object in the first group whose determined XYθ exceeds the specified reference, as an object in the second group.

21. The method for transferring an object according to claim 13, wherein, In the step of transferring the objects contained in the selected group to the second substrate by irradiating them with a laser, the objects contained in the selected group are continuously irradiated with a laser.

22. The method for transferring an object according to claim 13, wherein, The object being referred to is a component.

23. The method for transferring an object according to claim 22, wherein, The component is a light-emitting diode (LED).

24. The method for transferring an object according to claim 13, wherein, The objects are arranged with an accuracy within ±30 μm in the longitudinal direction (X) of the first substrate surface relative to the ideal position information.

25. The method for transferring an object according to claim 13, wherein, The objects are arranged with an accuracy within ±30 μm in the lateral (Y) direction of the first substrate surface relative to the ideal position information.

26. The method for transferring an object according to any one of claims 13 to 25, wherein, The objects are arranged within ±1 degree of rotation direction (θ) in the direction of the first substrate surface relative to the ideal position information.

27. An object transfer machine for transferring an object from a first substrate to a second substrate, wherein the object is disposed on the first substrate at a position exceeding a permissible positional offset, and the second substrate is disposed facing the first substrate with a gap therebetween, and the object transfer machine comprises: An image processing device acquires the actual position information of an object on a first substrate; The processing device compares the ideal position information of the objects on the first substrate with the actual position information, groups the objects, and selects the group to be transferred. as well as The laser device and optical system irradiate the objects contained in the selected group only.

28. The object transfer machine according to claim 27, wherein, The laser device and optical system continuously irradiate the objects contained in the selected group with laser light only.

29. The object transfer machine according to claim 27, wherein, The optical system is a constant current scanner optical system.

30. The object transfer machine according to claim 27, wherein, The permissible position offset includes at least one of the group consisting of a longitudinal (X) offset, a lateral (Y) offset, and a rotational (θ) offset relative to the first substrate surface direction of the ideal position information.

31. The object transfer machine according to claim 27, wherein, The processing unit groups data according to a predetermined reference determined by the permissible position offset.

32. The object transfer machine according to claim 31, wherein, The permissible position offset is the specified reference.

33. The object transfer machine according to claim 30, wherein, The permissible positional offset in the longitudinal (X) direction of the first substrate surface is within ±10μm.

34. The object transfer machine according to claim 30, wherein, The permissible positional offset in the lateral (Y) direction of the first substrate surface is within ±10μm.

35. The object transfer machine according to claim 30, wherein, The permissible positional offset of the rotation direction (θ) in the direction of the first substrate surface is within ±1 degree.

36. The object transfer machine according to claim 31, wherein, The grouping includes the steps of: comparing ideal location information with actual location information, and classifying objects whose XYθ values ​​are at least within the specified reference as belonging to the first group; and... The step of designating an object in the first group whose remaining at least one undetermined XYθ is within the specified reference, or an object in the first group whose determined XYθ exceeds the specified reference, as an object in the second group.

37. The object transfer machine according to claim 31, comprising: The platform and platform controller, based on the specified reference of the selected group, correct the relative positions of the first substrate and the second substrate in the planar direction of the substrate.

38. The object transfer machine according to claim 27, wherein, The object being referred to is a component.

39. The object transfer machine according to claim 38, wherein, The component is a light-emitting diode (LED).

40. The object transfer machine according to claim 27, wherein, The objects are arranged with an accuracy within ±30 μm in the longitudinal direction (X) of the first substrate surface relative to the ideal position information.

41. The object transfer machine according to claim 27, wherein, The objects are arranged with an accuracy within ±30 μm in the lateral (Y) direction of the first substrate surface relative to the ideal position information.

42. The object transfer machine according to any one of claims 27 to 41, wherein, The objects are arranged within ±1 degree of rotation direction (θ) in the direction of the first substrate surface relative to the ideal position information.

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