Substrate connector

Abstract

A substrate connector includes a plurality of RF contact pieces for transmitting an RF (Radio Frequency) signal, an insulating portion supporting the plurality of RF contact pieces, a plurality of transmission contact pieces coupled to the insulating portion between a first RF contact piece among the plurality of RF contact pieces and a second RF contact piece among the plurality of RF contact pieces to separate the first RF contact piece and the second RF contact piece from each other in a first axis direction, a ground housing to which the insulating portion is coupled, a first ground contact piece coupled to the insulating portion to shield between the first RF contact piece and the plurality of transmission contact pieces with reference to the first axis direction, and a second ground contact piece coupled to the insulating portion to shield between the second RF contact piece and the plurality of transmission contact pieces with reference to the first axis direction, the first RF contact piece including a first RF inspection plane for contact with an inspection mechanism, and the second RF contact piece including a second RF inspection plane for contact with the inspection mechanism.

Description

Technical Field

[0001] The present invention relates to a substrate connector provided in an electronic device for electrical connection between a plurality of substrates. Background Technology

[0002] A connector is a device used for electrical connection in various electronic devices. For example, connectors are used in electronic devices such as mobile phones, computers, and tablets to electrically connect various components within these devices.

[0003] Typically, in electronic devices, RF connectors and board-to-board connectors (hereinafter referred to as "board connectors") are located inside wireless communication devices such as smartphones and tablet PCs. RF connectors transmit RF (Radio Frequency) signals. Board connectors handle digital signals from cameras, etc.

[0004] This type of RF connector and substrate connector is mounted on a PCB (Printed Circuit Board). Because existing technologies involve mounting multiple substrate connectors and RF connectors along with multiple components within a limited PCB space, the PCB mounting area becomes larger. Therefore, with the trend towards miniaturization in smartphones, there is a need for a technology that optimizes the PCB mounting area by integrating the RF connector and substrate connector.

[0005] Figure 1 This is a schematic perspective view of a substrate connector in the prior art.

[0006] Reference Figure 1 The existing substrate connector 100 includes a first connector 110 and a second connector 120.

[0007] The first connector 110 is used to attach to a first substrate (not shown). The first connector 110 can be electrically connected to the second connector 120 via a plurality of first contacts 111.

[0008] The second connector 120 is used to attach to a second substrate (not shown). The second connector 120 can be electrically connected to the first connector 110 via a plurality of second contacts 121.

[0009] With a plurality of first contacts 111 and a plurality of second contacts 121 connected to each other, the prior art substrate connector 100 can electrically connect the first substrate and the second substrate to each other. Furthermore, if a portion of the plurality of first contacts 111 and the plurality of second contacts 121 are used as a plurality of RF contacts for transmitting RF signals, the prior art substrate connector 100 can be implemented to transmit RF signals between the first substrate and the second substrate via the RF contacts.

[0010] The existing substrate connector 100 has the following problems.

[0011] First, in the existing substrate connector 100, when a plurality of closely spaced contacts 111 and 121 are used as RF contacts, signal transmission cannot be performed smoothly due to RF signal interference between the plurality of RF contacts 111', 111", 121', and 121".

[0012] Second, in the existing substrate connector 100, there is an RF signal shielding part 112 at the outermost part of the connector, which can shield RF signals from being radiated to the outside, but cannot achieve shielding between RF signals.

[0013] Third, in the prior art substrate connector 100, a plurality of RF contacts 111', 111", 121', and 121" each include a plurality of mounting portions 111a', 111a", 121a', and 121a" mounted on the substrate, and the plurality of mounting portions 111a', 111a", 121a', and 121a" are configured to be exposed to the outside. Therefore, the prior art substrate connector 100 cannot achieve shielding of the plurality of mounting portions 111a', 111a", 121a', and 121a". Summary of the Invention

[0014] The problem that the invention aims to solve

[0015] The present invention was made to solve the above-mentioned problems and aims to provide a substrate connector that can reduce the possibility of RF signal interference between multiple RF contacts.

[0016] Technical solutions to the problem

[0017] To address the problems described above, the present invention may include the following configuration.

[0018] The substrate connector of the present invention may include: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion supporting the plurality of RF contacts; a plurality of transmission contacts, wherein a first RF contact and a second RF contact among the plurality of RF contacts are spaced apart from each other along a first axial direction, and are coupled to the insulating portion between the first RF contact and the second RF contact; a grounding housing coupled to the insulating portion; a first grounding contact coupled to the insulating portion, shielding between the first RF contact and the plurality of transmission contacts with respect to the first axial direction; and a second grounding contact coupled to the insulating portion, shielding between the second RF contact and the plurality of transmission contacts with respect to the first axial direction. The first RF contact may include a first RF inspection plane for contacting an inspection mechanism. The second RF contact may include a second RF inspection plane for contacting an inspection mechanism. The first RF inspection plane and the second RF inspection plane may be configured on a plane of the same height.

[0019] Invention Effects

[0020] According to the present invention, the following effects can be achieved.

[0021] This invention utilizes a grounded enclosure to shield signals and electromagnetic waves from multiple RF contacts. Therefore, this invention prevents electromagnetic waves generated from the multiple RF contacts from being interfered with by signals from multiple circuit components located around the electronic device, and also prevents electromagnetic waves generated from multiple circuit components located around the electronic device from being interfered with by RF signals transmitted through the multiple RF contacts. Thus, this invention can help improve EMI (Electromagnetic Interference) shielding performance and EMC (Electromagnetic Compatibility) performance using a grounded enclosure.

[0022] This invention can be implemented such that all of the plurality of RF contacts, including the portion mounted on the substrate, are located inside the grounding housing. Therefore, this invention utilizes the grounding housing to enhance the shielding function of the plurality of RF contacts, thereby achieving complete shielding.

[0023] This invention ensures an area sufficient for contact with the inspection mechanism, thereby improving the ease and accuracy of contact with the inspection mechanism. Consequently, this invention improves the accuracy of inspection results obtained using the inspection mechanism.

[0024] In this invention, the surface in contact with the inspection mechanism is formed as a plane, thus preventing slippage or other issues during contact with the inspection mechanism. Therefore, this invention improves the reliability of contact with the inspection mechanism. Attached Figure Description

[0025] Figure 1 This is a schematic perspective view of a substrate connector in the prior art.

[0026] Figure 2 This is a schematic perspective view of the socket connector and plug connector in the substrate connector of the present invention.

[0027] Figure 3 This is a schematic perspective view of the substrate connector of the first embodiment.

[0028] Figure 4 This is a schematic exploded perspective view of the substrate connector of the first embodiment.

[0029] Figure 5 This is a schematic top view of the substrate connector of the first embodiment.

[0030] Figure 6 This is a schematic top view of a plurality of contacts in the substrate connector of the first embodiment.

[0031] Figure 7 and Figure 8 This is a schematic top view showing an enlarged view of the inspection plane of the contacts in the substrate connector of the first embodiment.

[0032] Figure 9 This is a schematic top view of a plurality of contacts in the substrate connector of the first embodiment.

[0033] Figure 10 Therefore Figure 6 A schematic cross-sectional view with line II as the reference.

[0034] Figure 11 Therefore Figure 6 A schematic cross-sectional view with line II-II as the reference.

[0035] Figure 12 Therefore Figure 9 A schematic cross-sectional view based on line III-III.

[0036] Figure 13 Therefore Figure 9 A schematic cross-sectional view based on line VI-VI.

[0037] Figure 14 This is a schematic top view illustrating a modified embodiment of the arrangement of a plurality of contacts in the substrate connector of the first embodiment.

[0038] Figure 15 This is a top view illustrating a conceptual grounding loop in the substrate connector of the first embodiment.

[0039] Figure 16 It is shown that in order to Figure 15 A schematic side sectional view of a configuration in which the substrate connectors of the first embodiment and the substrate connectors of the second embodiment are arranged apart from each other, with the AA line as a reference.

[0040] Figure 17 This is a schematic perspective view of the substrate connector of the second embodiment.

[0041] Figure 18 This is a schematic exploded perspective view of the substrate connector of the second embodiment.

[0042] Figure 19 This is a schematic top view of the substrate connector of the second embodiment.

[0043] Figure 20 This is a schematic top view of a plurality of contacts in the substrate connector of the second embodiment.

[0044] Figure 21 This is a conceptual top view of the substrate connector in the second embodiment, used to illustrate the grounding loop. Detailed Implementation

[0045] Hereinafter, embodiments of the substrate connector of the present invention will be described in detail with reference to the accompanying drawings. Figure 14 The dashed boxes in the middle represent the positions of the portions of the multiple contact elements that correspond to the inspection plane. Figure 16 The second embodiment of the substrate connector is shown in the figure. Figure 2 and Figure 17 The orientation is reversed and incorporated into the shape of the substrate connector of the first embodiment. Figure 16 The second embodiment of the substrate connector is shown in the figure. Figure 19 A schematic side sectional view based on the BB line.

[0046] Reference Figure 2The substrate connector 1 of the present invention can be disposed in electronic devices such as mobile phones, computers, and tablet computers (not shown). The substrate connector 1 of the present invention can be used to electrically connect a plurality of substrates (not shown). The substrate can be a printed circuit board (PCB). For example, when the first substrate and the second substrate are electrically connected, a receptacle connector mounted on the first substrate and a plug connector mounted on the second substrate can be connected to each other. Thus, the first substrate and the second substrate can be electrically connected to each other using the receptacle connector and the plug connector. The plug connector mounted on the first substrate and the receptacle connector mounted on the second substrate can also be connected to each other.

[0047] The substrate connector 1 of the present invention can be implemented by the socket connector. The substrate connector 1 of the present invention can also be implemented by the plug connector. The substrate connector 1 of the present invention can also be implemented by simultaneously including both the socket connector and the plug connector. Hereinafter, an embodiment in which the substrate connector 1 of the present invention is implemented by the socket connector is defined as the substrate connector 200 of the first embodiment, and an embodiment in which the substrate connector 1 of the present invention is implemented by the plug connector is defined as the substrate connector 300 of the second embodiment, and will be described in detail with reference to the accompanying drawings. Furthermore, the description will be based on an embodiment in which the substrate connector 200 of the first embodiment is mounted on the first substrate, and the substrate connector 300 of the second embodiment is mounted on the second substrate. Therefore, those skilled in the art to which this invention pertains can readily deduce embodiments in which the substrate connector 1 simultaneously includes both the socket connector and the plug connector.

[0048] <Baseboard connector 200 of the first embodiment>

[0049] Reference Figures 2 to 4 The substrate connector 200 of the first embodiment may include a plurality of RF contacts 210, a plurality of transmission contacts 220, a ground housing 230, and an insulating portion 240.

[0050] The plurality of RF contacts 210 are used to transmit RF (Radio Frequency) signals. The plurality of RF contacts 210 can transmit ultra-high frequency RF signals. The plurality of RF contacts 210 can be supported on the insulating portion 240. The plurality of RF contacts 210 can be assembled to the insulating portion 240. Alternatively, the plurality of RF contacts 210 can be integrally formed with the insulating portion 240 by injection molding.

[0051] The plurality of RF contacts 210 may be spaced apart from each other. The plurality of RF contacts 210 are mounted on the first substrate, thereby enabling electrical connection to the first substrate. The plurality of RF contacts 210 are connected to the plurality of RF contacts of the opposing connector, thereby enabling electrical connection to the second substrate on which the opposing connector is mounted. Thus, the first substrate and the second substrate are electrically connected. In the case where the substrate connector 200 of the first embodiment is a receptacle connector, the opposing connector may be a plug connector. In the case where the substrate connector 200 of the first embodiment is a plug connector, the opposing connector may be a receptacle connector.

[0052] The first RF contact 211 and the second RF contact 212 of the plurality of RF contacts 210 may be spaced apart from each other along a first axial direction (X-axis direction). The first RF contact 211 and the second RF contact 212 may be supported on the insulating portion 240 at positions spaced apart from each other along the first axial direction (X-axis direction).

[0053] The first RF contact 211 may include a first RF mounting member 2111. The first RF mounting member 2111 may be mounted on the first substrate. Thus, the first RF contact 211 can be electrically connected to the first substrate via the first RF mounting member 2111. The first RF contact 211 may be formed of an electrically conductive material. For example, the first RF contact 211 may be formed of metal. The first RF contact 211 may connect to any one of the plurality of RF contacts of the opposing connector.

[0054] The second RF contact 212 may include a second RF mounting member 2121. The second RF mounting member 2121 may be mounted on the first substrate. Thus, the second RF contact 212 can be electrically connected to the first substrate via the second RF mounting member 2121. The second RF contact 212 may be formed of an electrically conductive material. For example, the second RF contact 212 may be formed of metal. The second RF contact 212 may connect to any one of the plurality of RF contacts of the opposing connector.

[0055] Reference Figures 2 to 5A plurality of the transmission contacts 220 are coupled to the insulating portion 240. The plurality of transmission contacts 220 can function as transmitters of signals, data, power, etc. The plurality of transmission contacts 220 can be coupled to the insulating portion 240 through an assembly process. Alternatively, the plurality of transmission contacts 220 can be integrally formed with the insulating portion 240 through injection molding.

[0056] A plurality of the transmission contacts 220 can be arranged between the first RF contact 211 and the second RF contact 212 with reference to the first axial direction (X-axis direction). Therefore, in order to reduce RF signal interference between the first RF contact 211 and the second RF contact 212, the plurality of transmission contacts 220 can be arranged in a space that separates the first RF contact 211 and the second RF contact 212 from each other. Thus, the substrate connector 200 of the first embodiment not only reduces RF signal interference by increasing the distance between the first RF contact 211 and the second RF contact 212, but also improves the space utilization of the insulating portion 240 by arranging a plurality of the transmission contacts 220 in the space between them.

[0057] The plurality of transmission contacts 220 may be spaced apart from each other. The plurality of transmission contacts 220 are mounted on the first substrate, thereby enabling electrical connection to the first substrate. In this case, each of the plurality of transmission contacts 220 has a plurality of transmission mounting members 2211, 2221 that can be mounted on the first substrate. The plurality of transmission contacts 220 may be formed of an electrically conductive material. For example, the plurality of transmission contacts 220 may be formed of metal. The plurality of transmission contacts 220 connect with the plurality of transmission contacts of the opposing connector, thereby enabling electrical connection to the second substrate on which the opposing connector is mounted. Thus, the first substrate and the second substrate can be electrically connected.

[0058] A plurality of first transmission contacts 221 and a plurality of second transmission contacts 222 of the plurality of transmission contacts 220 may be spaced apart from each other along a second axial direction (Y-axis direction). The second axial direction (Y-axis direction) is an axial direction perpendicular to the first axial direction (X-axis direction). The plurality of first transmission contacts 221 may be spaced apart from each other along the first axial direction (X-axis direction). The plurality of second transmission contacts 222 may be spaced apart from each other along the first axial direction (X-axis direction).

[0059] Reference Figures 2 to 5The grounding housing 230 is combined with the insulating portion 240. The grounding housing 230 can be grounded by being mounted on the first substrate. Thus, the grounding housing 230 can shield signals, electromagnetic waves, etc., from the plurality of RF contacts 210. In this case, the grounding housing 230 can prevent electromagnetic waves generated from the plurality of RF contacts 210 from being interfered with by signals from a plurality of circuit components located around the electronic device, and can also prevent electromagnetic waves generated from the plurality of circuit components located around the electronic device from being interfered with by RF signals transmitted by the plurality of RF contacts 210. Therefore, the substrate connector 200 of the first embodiment can help improve EMI (Electromagnetic Interference) shielding performance and EMC (Electromagnetic Compatibility) performance by utilizing the grounding housing 230. The grounding housing 230 can be formed of an electrically conductive material. For example, the grounding housing 230 can be formed of metal.

[0060] The grounding housing 230 can be configured to surround the sides of the inner space 230a. A portion of the insulation portion 240 can be located in the inner space 230a. The first RF contact 211, the second RF contact 212, and the plurality of transmission contacts 220 can all be located in the inner space 230a. In this case, the first RF mounting member 2111, the second RF mounting member 2121, and the plurality of transmission mounting members 2211, 2221 can also all be located in the inner space 230a. Therefore, by implementing a shielding wall for all the first RF contacts 211 and the second RF contacts 212, the grounding housing 230 can enhance the shielding function of the first RF contacts 211 and the second RF contacts 212, thereby achieving complete shielding. The opposing connector can be inserted into the inner space 230a.

[0061] The grounding housing 230 can be configured to surround all sides based on the inner space 230a. The inner space 230a can be disposed inside the grounding housing 230. When the grounding housing 230 is generally formed in a quadrilateral ring shape, the inner space 230a can be formed in a cuboid shape. In this case, the grounding housing 230 can be configured to surround four sides based on the inner space 230a.

[0062] The grounding housing 230 can be integrally formed without seams. The grounding housing 230 can be integrally formed without seams using metal injection molding processes such as die casting or MIM (Metal Injection Molding). The grounding housing 230 can also be integrally formed without seams using CNC (Computer Numerical Control) machining or MCT (Machining Center Tool) machining.

[0063] Reference Figures 2 to 5 The insulating portion 240 supports a plurality of the RF contacts 210. The plurality of RF contacts 210 and the plurality of transmission contacts 220 may be coupled to the insulating portion 240. The insulating portion 240 may be formed of an insulating material. The insulating portion 240 may be coupled to the grounding housing 230 such that the plurality of RF contacts 210 are located in the inner space 230a.

[0064] Reference Figures 2 to 6 The substrate connector 200 in the first embodiment may include a first grounding contact 250.

[0065] The first grounding contact 250 is coupled to the insulating portion 240. The first grounding contact 250 can be grounded by being mounted on the first substrate. The first grounding contact 250 can be coupled to the insulating portion 240 by an assembly process. The first grounding contact 250 can also be integrally formed with the insulating portion 240 by injection molding.

[0066] The first grounding contact 250, together with the grounding housing 230, can provide shielding for the first RF contact 211. In this case, the first grounding contact 250 can be configured between the first RF contact 211 and a plurality of the transmission contacts 220, with reference to the first axial direction (X-axis direction). The first grounding contact 250 can be formed of an electrically conductive material. For example, the first grounding contact 250 can be formed of metal. If the opposing connector is inserted into the inner space 230a, the first grounding contact 250 can connect with the grounding contact of the opposing connector.

[0067] Reference Figures 2 to 5 The substrate connector 200 in the first embodiment may include a second grounding contact 260.

[0068] The second grounding contact 260 is coupled to the insulating portion 240. The second grounding contact 260 can be grounded by being mounted on the first substrate. The second grounding contact 260 can be coupled to the insulating portion 240 by an assembly process. The second grounding contact 260 can also be integrally formed with the insulating portion 240 by injection molding.

[0069] The second grounding contact 260, together with the grounding housing 230, can provide shielding for the second RF contact 212. The second grounding contact 260 can be configured between a plurality of the transmission contacts 220 and the second RF contact 212 with reference to the first axial direction (X-axis direction). The second grounding contact 260 can be formed of an electrically conductive material. For example, the second grounding contact 260 can be formed of metal. If the opposing connector is inserted into the inner space 230a, the second grounding contact 260 can connect with the grounding contacts of the opposing connector.

[0070] Here, in order to confirm whether the performance of the substrate connector 200 of the first embodiment is abnormal when it is mounted on the first substrate, an inspection mechanism (not shown) can be used for inspection. The inspection mechanism can perform inspection on the substrate connector 200 of the first embodiment with a plurality of probes in contact with at least one of a plurality of contacts 210, 220, 250, and 260. For example, the inspection mechanism can be a probe card. As described above, the substrate connector 200 of the first embodiment can be implemented in such a way that inspection based on the contact of the inspection mechanism can be smoothly performed.

[0071] First, the first RF contact 211 can be implemented in the following manner.

[0072] Reference Figures 2 to 10 The first RF contact 211 may include a first RF inspection plane 2112.

[0073] The first RF inspection plane 2112 is used to contact the inspection mechanism. The inspection mechanism can perform inspection on the first RF contact 211 while in contact with the first RF inspection plane 2112. The first RF inspection plane 2112 can be formed as a plane. Therefore, the substrate connector 200 of the first embodiment can utilize the first RF inspection plane 2112 to ensure the area for contact between the inspection mechanism and the first RF contact 211, thereby improving the ease and accuracy of contact between the inspection mechanism and the first RF contact 211. Therefore, the substrate connector 200 of the first embodiment can utilize the first RF inspection plane 2112 to improve the accuracy of the inspection results of the first RF contact 211. In addition, in the comparative example where the surface of the first RF contact 211 for contacting the inspection mechanism is formed as a curved surface, slippage may occur during the contact between the inspection mechanism and the curved surface, which may reduce the contact reliability between the inspection mechanism and the first RF contact 211. In contrast, the substrate connector 200 of the first embodiment is implemented such that the first RF inspection plane 2112 is formed as a plane, thus preventing slippage or the like during contact between the inspection mechanism and the first RF inspection plane 2112. Therefore, the substrate connector 1 of the first embodiment can improve the contact reliability between the inspection mechanism and the first RF contact 211.

[0074] The first RF inspection plane 2112 can be formed with a width H (based on the first axial direction (X-axis direction)) Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8 (As shown in the diagram) is a plane with a length L of 0.5 or greater. If the ratio of the length L to the width H of the first RF inspection plane 2112 is less than 0.5, then the length L of the first RF inspection plane 2112 is too short, making it difficult to achieve accurate contact between the inspection mechanism and the first RF contact 2112. Therefore, the substrate connector 200 of the first embodiment is formed such that the ratio of the length L to the width H of the first RF inspection plane 2112 is 0.5 or greater, thereby improving the ease and accuracy of contact between the inspection mechanism and the first RF contact 211.

[0075] The first RF inspection plane 2112 can also be formed with a width H (based on the first axial direction (X-axis direction)) Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8 (As shown in the diagram) is a plane with a length L of 1.5 or less. If the ratio of the length L to the width H of the first RF inspection plane 2112 exceeds 1.5, the length of the first RF contact 211 becomes too long due to the first RF inspection plane 2112, making miniaturization difficult. Therefore, the substrate connector 200 of the first embodiment is formed such that the ratio of the length L to the width H of the first RF inspection plane 2112 is 1.5 or less, thereby enabling miniaturization.

[0076] The first RF inspection plane 2112 can also be formed with a width H (based on the first axial direction (X-axis direction)) Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8 (As shown in the diagram) is a plane with a length L of 0.5 or more and a width H of 1.5 or less. That is, the first RF inspection plane 2112 can be formed as a plane with a length L of 0.5 or more and a width H of 1.5 or less. Thus, by utilizing the first RF inspection plane 2112, the substrate connector 200 of the first embodiment can not only ensure the area for contacting the inspection mechanism with the first RF contact member 211, but also achieve miniaturization by reducing the overall size.

[0077] The first RF contact 211 may include a first RF connection member 2113.

[0078] The first RF connecting member 2113 is used to connect with the RF contacts of the opposing connector. The first RF connecting member 2113 connects with the RF contacts of the opposing connector, so that the first RF contact 211 can be electrically connected to the RF contacts of the opposing connector. The first RF connecting member 2113 can be connected to the first RF mounting member 2111. The first RF connecting member 2113 can also be directly coupled to the first RF mounting member 2111. The first RF connecting member 2113 can also be coupled to other components of the first RF connecting member 2113, so that it can also be connected to the first RF mounting member 2111 via corresponding components. The first RF connecting member 2113 can be implemented in a form that combines vertically arranged plates and horizontally arranged plates through a bending process.

[0079] When the first RF contact 211 includes the first RF connection member 2113 and the first RF mounting member 2111, the first RF inspection plane 2112 may be formed on the first RF connection member 2113 or the first RF mounting member 2111. For example... Figure 9 As shown, when the first RF inspection plane 2112 is formed on the first RF connecting member 2113, the first RF inspection plane 2112 can be formed on the surface of the first RF connecting member 2113 facing the inner space 230a. In this case, the first RF connecting member 2113 can have a connection function for the RF contacts of the opposing connector and a contact function for the inspection mechanism. Although not shown, when the first RF inspection plane 2112 is formed on the first RF mounting member 2111, the first RF inspection plane 2112 can be formed on the surface of the first RF mounting member 2111 facing the inner space 230a. In this case, the first RF mounting member 2111 can have a mounting function for the substrate and a contact function for the inspection mechanism.

[0080] The first RF contact 211 may also include a first RF inspection member 2114.

[0081] The first RF inspection member 2114 is used to contact the inspection mechanism. In this case, such as Figure 5 and Figure 6 As shown, the first RF inspection plane 2112 can be formed on the first RF inspection member 2114. The first RF inspection plane 2112 can be formed on the surface of the first RF inspection member 2114 facing the inner space 230a. The first RF inspection member 2114 can be coupled to the first RF connection member 2113 or the first RF mounting member 2111. Figure 6 As shown, the first RF inspection member 2114 can be coupled to the first RF connecting member 2113 in a manner that protrudes from the first RF connecting member 2113. In this case, the first RF inspection member 2114 can have a support function supporting the insulating portion 240 and a contact function with the inspection mechanism. The first RF inspection member 2114 can also be coupled to both the first RF connecting member 2113 and the first RF mounting member 2111. In this case, the first RF inspection member 2114 can have a connection function connecting the first RF connecting member 2113 and the first RF mounting member 2111, as well as a contact function with the inspection mechanism. With the first RF inspection member 2114, the first RF inspection plane 2112 can also be formed on either the first RF mounting member 2111 or the first RF connecting member 2113. In this case, the first RF inspection member 2114 can have a support function for the insulating portion 240 or a connection function connecting the first RF connecting member 2113 and the first RF mounting member 2111.

[0082] On the other hand, when the portion of the first RF contact 211 that is shielded by the insulating portion 240 has the first RF inspection plane 2112 formed thereon, an inspection connection window (not shown) can be formed in the insulating portion 240. Thus, the first RF inspection plane 2112 can be configured to be exposed to the inner space 230a through the inspection connection window without being shielded by the insulating portion 240.

[0083] Next, the second RF contact 212 can be implemented in the following manner.

[0084] Reference Figures 2 to 14 The second RF contact 212 may include a second RF inspection plane 2122. The second RF inspection plane 2122 is used to contact the inspection mechanism. The second RF inspection plane 2122 is implemented to substantially coincide with the first RF inspection plane 2112 of the first RF contact 211 described above; therefore, a detailed description of it is omitted.

[0085] The second RF contact 212 may include a second RF connection member 2123. The second RF connection member 2123 is used for connection with the RF contact of the opposing connector. The second RF connection member 2123 is implemented to be substantially identical to the first RF connection member 2113 of the first RF contact 211 described above, therefore a detailed description thereof is omitted. The second RF inspection plane 2122 may also be formed on the second RF connection member 2123 or the second RF mounting member 2121.

[0086] The second RF contact 212 may also include a second RF inspection member 2124. The second RF inspection member 2124 is used to contact the inspection mechanism. The second RF inspection member 2124 is implemented to be substantially identical to the first RF inspection member 2114 of the first RF contact 211 described above, therefore a detailed description thereof is omitted. A second RF inspection plane 2122 may also be formed on the second RF inspection member 2124.

[0087] like Figures 10 to 13As shown, the second RF inspection plane 2122 and the first RF inspection plane 2112 can be configured on a plane at the same height. Therefore, the inspection mechanism can rise and fall at the same height to contact each of the second and first RF inspection planes 2122 and 2112, thus further improving the ease and accuracy of inspection operations on the first RF contact 211 and the second RF contact 212 in the first embodiment of the substrate connector 1. Furthermore, in the first embodiment of the substrate connector 1, the inspection mechanism can simultaneously contact the second RF inspection plane 2122 and the first RF inspection plane 2112, thereby helping to shorten the time required to perform inspection operations on the first RF contact 211 and the second RF contact 212.

[0088] On the other hand, the portion of the second RF contact 212 with the second RF inspection plane 2122 and the portion of the first RF contact 211 with the first RF inspection plane 2112 can function identically to each other. For example, as Figure 6 As shown, when the second RF inspection plane 2122 is formed on the second RF inspection member 2124, the first RF inspection plane 2112 can be formed on the first RF inspection member 2114. For example, as Figure 9 As shown, when the second RF inspection plane 2122 is formed on the second RF connecting member 2123, the first RF inspection plane 2112 may be formed on the first RF connecting member 2113. For example, when the second RF inspection plane 2122 is formed on the second RF mounting member 2121, the first RF inspection plane 2112 may be formed on the first RF mounting member 2111.

[0089] Next, each of the plurality of the first transmission contacts 221 can be implemented in the following manner.

[0090] Reference Figures 2 to 14 The first transmission contact 221 may include a first transmission mounting component 2211.

[0091] The first transmission mounting member 2211 is used for mounting on the first substrate. The first transmission contact 221 can be electrically connected to the first substrate through the first transmission mounting member 2211. The first transmission mounting member 2211 can be formed as a plate arranged in a horizontal direction.

[0092] The first transmission contact 221 may include a first transmission inspection plane 2212.

[0093] The first transmission inspection plane 2212 is used to contact the inspection mechanism. The inspection mechanism can perform inspection on the first transmission contact 221 while in contact with the first transmission inspection plane 2212. The first transmission inspection plane 2212 can be formed as a plane. Therefore, the substrate connector 200 of the first embodiment can utilize the first transmission inspection plane 2212 to ensure the area for contact between the inspection mechanism and the first transmission contact 221, thereby improving the ease and accuracy of contact between the inspection mechanism and the first transmission contact 221. Therefore, the substrate connector 200 of the first embodiment can utilize the first transmission inspection plane 2212 to improve the accuracy of the inspection result of the first transmission contact 221. In addition, compared to a comparative example where the surface of the first transmission contact 221 for contact with the inspection mechanism is formed as a curved surface, the substrate connector 200 of the first embodiment is implemented such that the first transmission inspection plane 2212 is formed as a plane, thereby preventing slippage or the like during contact between the inspection mechanism and the first transmission inspection plane 2212. Therefore, the substrate connector 1 of the first embodiment can improve the contact reliability between the inspection mechanism and the first transmission contact 221.

[0094] The first transmission inspection plane 2212 can be formed with a width H (based on the first axial direction (X-axis direction)) Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8 The first transmission inspection plane 2212 can also be configured such that its width H (as shown in the diagram) is 0.5 or greater. Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8 The first transmission inspection plane 2212 can also be formed with a width H (( shown in the figure) based on the first axial direction (X-axis direction)). Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8(As shown in the diagram) is a plane with a length L of 0.5 or more and a width H of 1.5 or less. That is, the first transmission inspection plane 2212 can be formed as a plane with a length L of 0.5 or more and a width H of 1.5 or less. Thus, by utilizing the first transmission inspection plane 2212, the substrate connector 200 of the first embodiment can not only ensure the area for contacting the inspection mechanism with the first transmission contact member 221, but also achieve miniaturization by reducing the overall size.

[0095] The first transmission contact 221 may include a first transmission connection member 2213.

[0096] The first transmission connection member 2213 is used to connect with the transmission contact of the opposing connector. The first transmission connection member 2213 is connected to the transmission contact of the opposing connector, so that the first transmission contact 221 can be electrically connected to the transmission contact of the opposing connector. The first transmission connection member 2213 can be connected to the first transmission mounting member 2211. The first transmission connection member 2213 can also be directly coupled to the first transmission mounting member 2211. The first transmission connection member 2213 can also be coupled to other members of the first transmission connection member 2213, so that it can also be connected to the first transmission mounting member 2211 through corresponding members. The first transmission connection member 2213 can be implemented as a combination of a plate arranged vertically and a plate arranged horizontally by bending the plate.

[0097] The first transmission contact 221 may also include a first transmission inspection member 2214.

[0098] The first transfer inspection member 2214 is used to contact the inspection mechanism. In this case, such as Figure 5 and Figure 6As shown, the first transmission inspection plane 2212 can be formed on the first transmission inspection member 2214. The first transmission inspection plane 2212 can be formed on the surface of the first transmission inspection member 2214 facing the inner space 230a. The first transmission inspection member 2214 can be coupled to each of the first transmission connecting member 2213 and the first transmission mounting member 2211. In this case, the first transmission inspection member 2214 can have a connection function connecting the first transmission connecting member 2213 and the first transmission mounting member 2211 and a contact function with the inspection mechanism. The first transmission inspection member 2214 can also be coupled to either the first transmission connecting member 2213 or the first transmission mounting member 2211. In this case, the first transmission inspection member 2214 can have a support function supporting the insulating portion 240 and a contact function with the inspection mechanism.

[0099] Although not illustrated, when the first transmission inspection member 2214 is present, the first transmission inspection plane 2212 may also be formed on the first transmission mounting member 2211 or the first transmission connecting member 2213. When the first transmission inspection plane 2212 is formed on the first transmission mounting member 2211, the first transmission mounting member 2211 may have a mounting function for the substrate and a contact function for the inspection mechanism. When the first transmission inspection plane 2212 is formed on the first transmission connecting member 2213, the first transmission connecting member 2213 may have a connection function for the connecting contacts of the opposing connector and a contact function for the inspection mechanism. When the first transmission inspection plane 2212 is formed on the first transmission mounting member 2211 or the first transmission connecting member 2213, the first transmission inspection member 2214 may have a supporting function for the insulating portion 240 or a connecting function for connecting the first transmission connecting member 2213 and the first transmission mounting member 2211.

[0100] On the other hand, when the first transmission inspection plane 2212 is formed on the portion of the first transmission contact 221 that is covered by the insulating portion 240, an inspection connection window (not shown) can be formed on the insulating portion 240. Thus, the first transmission inspection plane 2212 can be configured to be exposed to the inner space 230a through the inspection connection window without being covered by the insulating portion 240.

[0101] Next, each of the plurality of the second transmission contacts 222 can be implemented in the following manner.

[0102] Reference Figures 2 to 14The second transmission contact 222 may include a second transmission mounting member 2221. The second transmission mounting member 2221 is used for mounting on the first substrate. The second transmission mounting member 2221 is implemented to be substantially the same as the first transmission mounting member 2211 of the first transmission contact 221 described above, therefore a detailed description thereof is omitted.

[0103] The second transmission contact 222 may include a second transmission inspection plane 2222. The second transmission inspection plane 2222 is used to contact the inspection mechanism. The second transmission inspection plane 2222 is implemented to substantially coincide with the first transmission inspection plane 2212 of the first transmission contact 221 described above, therefore a detailed description of it is omitted.

[0104] The second transmission contact 222 may include a second transmission connection member 2223. The second transmission connection member 2223 is used to connect to the transmission contact of the opposing connector. The second transmission connection member 2223 is implemented to be substantially identical to the first transmission connection member 2213 of the first transmission contact 221 described above, therefore a detailed description thereof is omitted.

[0105] The second transmission contact 222 may also include a second transmission inspection member 2224. The second transmission inspection member 2224 is used to contact the inspection mechanism. The second transmission inspection member 2224 is substantially the same as the first transmission inspection member 2214 of the first transmission contact 221 described above, therefore a detailed description of it is omitted. The second transmission inspection plane 2222 may be formed in one of the second transmission inspection member 2224, the second transmission connection member 2223, and the second transmission mounting member 2221.

[0106] like Figures 10 to 13As shown, the second transmission inspection plane 2222 and the first transmission inspection plane 2212 can be configured on a plane at the same height. Therefore, the inspection mechanism can rise and fall to the same height to contact each of the second and first transmission inspection planes 2222 and 2212, thus further improving the ease and accuracy of inspection operations on the first transmission contact 221 and the second transmission contact 222 in the first embodiment of the substrate connector 1. Furthermore, in the first embodiment of the substrate connector 1, the inspection mechanism can simultaneously contact both the second and first transmission inspection planes 2222 and 2212, thus helping to shorten the time required to perform inspection operations on the first and second transmission contact 221 and 222. On the other hand, the portion of the second transmission contact 222 with the second transmission inspection plane 2222 and the portion of the first transmission contact 221 with the first transmission inspection plane 2212 can function identically to each other.

[0107] like Figure 10 and Figure 11 As shown, the second transmission inspection plane 2222, the first transmission inspection plane 2212, the second RF inspection plane 2122, and the first RF inspection plane 2112 can be configured on a plane at the same height. This ensures that the inspection mechanism rises and falls at the same height to contact each of the inspection planes, thus further improving the ease and accuracy of inspection operations on the second transmission contact 222, the first transmission contact 221, the second RF contact 212, and the first RF contact 2111. Furthermore, in the first embodiment of the substrate connector 1, the inspection mechanism can simultaneously contact the second transmission inspection plane 2222, the first transmission inspection plane 2212, the second RF inspection plane 2122, and the first RF inspection plane 2112, thereby helping to further shorten the time required to perform inspection operations on the second transmission contact 222, the first transmission contact 221, the second RF contact 212, and the first RF contact 2111.

[0108] like Figure 12 and Figure 13As shown, the first RF inspection plane 2112 can also be configured at a higher position than the plurality of first transmission inspection planes 2212. In this case, the first RF inspection plane 2112 and the second RF inspection plane 2122 can be configured on a plane at the same height. The plurality of first transmission inspection planes 2212 and the plurality of second transmission inspection planes 2222 are configured on a plane at the same height, and can also be configured at a lower position than the first RF inspection planes 2112 and the second RF inspection planes 2122. Thus, the substrate connector 1 of the first embodiment can be suitably implemented such that the inspection mechanism simultaneously inspects the first RF contact 211 and the second RF contact 212, and the inspection mechanism simultaneously inspects the plurality of first transmission contacts 221 and the plurality of second transmission contacts 222, are performed separately. Although not shown, the first RF inspection plane 2112 can also be configured at a lower position than the plurality of first transmission inspection planes 2212. In this case, a plurality of the first transmission inspection planes 2212 and a plurality of the second transmission inspection planes 2222 are configured on a plane at the same height, and may be configured at a position higher than the first RF inspection planes 2112 and the second RF inspection planes 2122.

[0109] like Figure 5 and Figure 6 As shown, the first RF inspection plane 2112 and a plurality of the first transmission inspection planes 2122 can be configured on a first column R1 parallel to the first axial direction (X-axis direction). The second RF inspection plane 2122 and a plurality of the second transmission inspection planes 2212 can be configured on a second column R2 parallel to the first axial direction (X-axis direction). The first column R1 and the second column R2 can be spaced apart from each other along the second axial direction (Y-axis direction). Thus, the substrate connector 1 of the first embodiment can be suitably implemented such that the inspection mechanism simultaneously inspects the first RF contact 211 and the plurality of the first transmission contacts 221, and the inspection mechanism itself, are performed separately. The inspection process simultaneously checks the second RF contact 212 and the second transmission contact 222. Furthermore, the substrate connector 1 of the first embodiment can be suitably implemented such that the inspection mechanism simultaneously inspects the first RF contact 211, a plurality of the first transmission contacts 221, the second RF contact 212, and the second transmission contacts 222. Therefore, the substrate connector 1 of the first embodiment is implemented such that, depending on the inspection conditions, inspection environment, etc., the inspection mechanism can inspect the first RF contact 211, a plurality of the first transmission contacts 221, the second RF contact 212, and the plurality of the second transmission contacts 222 in various inspection methods.

[0110] like Figure 5 , Figure 9 as well as Figure 14 As shown, a plurality of the first transmission inspection planes 2212 can be configured on the first column R1. A plurality of the second transmission inspection planes 2222 can be configured on the second column R2. The first RF inspection planes 2112 and the second RF inspection planes 2122 can be configured on a third column R3 parallel to the first axial direction (X-axis direction). The first column R1, the second column R2, and the third column R3 can be spaced apart from each other along the second axial direction (Y-axis direction). Therefore, the substrate connector 1 of the first embodiment is implemented such that, depending on the inspection conditions, inspection environment, etc., the inspection mechanism can inspect the first RF contact 211, a plurality of the first transmission contacts 221, the second RF contacts 212, and a plurality of the second transmission contacts 222 in a more diverse range of inspection methods. Figure 14 The diagram shows the third column R3 positioned in the center with the second axis direction (Y-axis direction) as a reference, but it is not limited to this; the first column R1 or the second column R2 could also be positioned in the center.

[0111] Next, the first grounding contact 250 can be implemented in the following manner.

[0112] Reference Figures 2 to 14 The first grounding contact 250 may include a first-1 grounding contact 251 and a first-2 grounding contact 252.

[0113] The first-1 grounding contact 251 is configured between the first RF contact 211 and the plurality of first transmission contacts 221 with reference to the first axial direction (X-axis direction). Thus, the first-1 grounding contact 251 can shield the area between the first RF contact 211 and the plurality of first transmission contacts 221.

[0114] The first-1 grounding contact 251 may include a first-1 grounding inspection plane 2511.

[0115] The first-first grounding inspection plane 2511 is used to contact the inspection mechanism. The inspection mechanism can perform an inspection on the first-first grounding contact 251 while in contact with the first-first grounding inspection plane 2511. The first-first grounding inspection plane 2511 can be formed as a plane. Therefore, the substrate connector 200 of the first embodiment, by utilizing the first-first grounding inspection plane 2511, not only ensures the area for contact between the inspection mechanism and the first-first grounding contact 251, but also improves the ease and accuracy of contact between the inspection mechanism and the first-first grounding contact 251. Therefore, the substrate connector 200 of the first embodiment can utilize the first-first grounding inspection plane 2511 to improve the accuracy of the inspection results of the first-first grounding contact 251. Furthermore, compared to a comparative example where the surface of the first-1 grounding contact 251 that contacts the inspection mechanism is curved, the substrate connector 200 of the first embodiment is implemented such that the first-1 grounding inspection plane 2511 is formed as a plane, thereby preventing slippage or other issues during contact between the inspection mechanism and the first-1 grounding inspection plane 2511. Therefore, the substrate connector 1 of the first embodiment can improve the contact reliability between the inspection mechanism and the first-1 grounding contact 251.

[0116] The first-1 grounding inspection plane 2511 can be formed such that, with a width H (based on the first axial direction (X-axis direction)) Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8 The first grounding check plane 2511, as shown in the figure, has a width of 0.5 or greater. The first-1 grounding check plane 2511 can also be formed such that its width H (based on the first axial direction (X-axis direction)) is greater than 0.5. Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8 The first grounding check plane 2511, as shown in the figure, is a plane with a width H (1.5 or less) based on the first axial direction (X-axis direction). Figure 7 and Figure 8 The length L (shown in the figure) is based on the second axis direction (Y-axis direction) when it is 1. Figure 7 and Figure 8(As shown in the diagram) is a plane with a length L of 0.5 or more and a width H of 1.5 or less. That is, the first-first grounding inspection plane 2511 can be formed as a plane with a length L of 0.5 or more and a width H of 1.5 or less. Thus, by utilizing the first-first grounding inspection plane 2511, the substrate connector 200 of the first embodiment can not only ensure the area for contacting the inspection mechanism with the first-first grounding contact member 251, but also achieve miniaturization by reducing the overall size.

[0117] The first-1 grounding contact 251 may include the first-1 grounding mounting member 2512.

[0118] The first-1 grounding mounting member 2512 is used for mounting on the first substrate. The first-1 grounding contact 251 can be electrically connected to the first substrate via the first-1 grounding mounting member 2512. The first-1 grounding mounting member 2512 can also be configured to be connected to the length of the grounding housing 230 with reference to the second axial direction (Y-axis direction). In this case, the first-1 grounding mounting member 2512 can be connected to the sidewall of the grounding housing 230. The first-1 grounding mounting member 2512 can be configured as a plate shape arranged along the horizontal direction.

[0119] The first-1 grounding contact 251 may include the first-1 grounding connection member 2513.

[0120] The first-1 grounding connection member 2513 is used to connect to the grounding contact of the opposing connector. The first-1 grounding connection member 2513 is connected to the grounding contact of the opposing connector, so that the first-1 grounding contact 251 can be electrically connected to the transmission contacts of the opposing connector. This strengthens the shielding force of the first-1 grounding contact 251 against the plurality of first RF contacts 211. The first-1 grounding connection member 2513 can be connected to the first-1 grounding mounting member 2512. The first-1 grounding connection member 2513 can also be directly coupled to the first-1 grounding mounting member 2512. The first-1 grounding connection member 2513 can also be coupled to other components of the first-1 grounding connection member 2513, and thus can also be connected to the first-1 grounding mounting member 2512 through corresponding components. The first-1 grounding connection member 2513 can be formed as a plate arranged in a vertical direction. The first-1 grounding connection member 2513 can be implemented as a combination of a plate arranged in a vertical direction and a plate arranged in a horizontal direction by bending the plate. On the other hand, the first-1 grounding inspection plane 2511 can be formed on the first-1 grounding mounting member 2512 or the first-1 grounding connection member 2513.

[0121] The first-1 grounding contact 251 may also include a first-1 grounding inspection member 2514.

[0122] The first-1 grounding inspection member 2514 is used to contact the inspection mechanism. In this case, such as Figure 6As shown, the first-1 grounding inspection plane 2511 can be formed on the first-1 grounding inspection member 2514. The first-1 grounding inspection plane 2511 can be formed on the surface of the first-1 grounding inspection member 2514 facing the inner space 230a. The first-1 grounding inspection member 2514 can be coupled to the first-1 grounding connection member 2513 and the first-1 grounding mounting member 2512, respectively. In this case, the first-1 grounding inspection member 2514 can have a connection function connecting the first-1 grounding connection member 2513 and the first-1 grounding mounting member 2512, and a contact function with the inspection mechanism. The first-1 grounding inspection member 2514 can also be coupled to either the first-1 grounding connection member 2513 or the first-1 grounding mounting member 2512. In this case, the first-1 grounding inspection member 2514 can have a support function supporting the insulation portion 240 and a contact function with the inspection mechanism. Although not shown, when the first-1 grounding inspection member 2514 is included, the first-1 grounding inspection plane 2511 may also be formed on the first-1 grounding mounting member 2512 or the first-1 grounding connection member 2513. In this case, the first-1 grounding inspection member 2514 may have a supporting function for the insulation portion 240 or a connecting function for connecting the first-1 grounding connection member 2513 and the first-1 grounding mounting member 2512.

[0123] On the other hand, when the first-first grounding inspection plane 2511 is formed on the portion of the first-first grounding contact 251 that is covered by the insulating portion 240, an inspection connection window (not shown) can be formed on the insulating portion 240. Thus, the first-first grounding inspection plane 2511 can be configured to be exposed to the inner space 230a through the inspection connection window without being covered by the insulating portion 240.

[0124] Next, the first and second grounding contacts 252 can be implemented in the following manner.

[0125] Reference Figures 2 to 14 The first-second grounding contact 252 may include a first-second grounding inspection plane 2521. The first-second grounding inspection plane 2521 is used to contact the inspection mechanism. The first-second grounding inspection plane 2521 is implemented to be substantially consistent with the first-first grounding inspection plane 2511 of the first-first grounding contact 251 described above, therefore a detailed description thereof is omitted.

[0126] The first-2 grounding contact 252 may include a first-2 grounding mounting member 2522. The first-2 grounding mounting member 2522 is used for mounting on the first substrate. The first-2 grounding mounting member 2522 is implemented in a manner substantially identical to the first-1 grounding mounting member 2512 of the first-1 grounding contact 251 described above, therefore a detailed description thereof is omitted.

[0127] The first-2 grounding contact 252 may include a first-2 grounding connection member 2523. The first-2 grounding connection member 2523 is used for connection with the grounding contact of the opposing connector. The first-2 grounding connection member 2523 is implemented to be substantially identical to the first-1 grounding connection member 2513 of the first-1 grounding contact 251 described above, therefore a detailed description thereof is omitted. The first-2 grounding inspection plane 2521 may be formed on the first-2 grounding mounting member 2522 or the first-2 grounding connection member 2523.

[0128] The first-second grounding contact 252 may also include a first-second grounding inspection member 2524. The first-second grounding inspection member 2524 is used to contact the inspection mechanism. The first-second grounding inspection member 2524 is implemented to be substantially identical to the first-first grounding inspection member 2514 of the first-first grounding contact 251 described above, therefore a detailed description thereof is omitted. The first-second grounding inspection plane 2521 may be formed on one of the first-second grounding inspection member 2524, the first-second grounding connection member 2523, and the first-second grounding mounting member 2522.

[0129] like Figures 10 to 13As shown, the first-2 grounding inspection plane 2521 and the first-1 grounding inspection plane 2511 can be configured on a plane at the same height. This ensures that the inspection mechanism rises and falls at the same height to contact each of the first-2 and first-1 grounding inspection planes 2521 and 2511, thus further improving the ease and accuracy of inspection operations on the first-1 grounding contact 251 and the first-2 grounding contact 252 in the first embodiment of the substrate connector 1. Furthermore, in the first embodiment of the substrate connector 1, the inspection mechanism can simultaneously contact the first-2 and first-1 grounding inspection planes 2521 and 2511, thereby helping to shorten the time required to perform inspection operations on the first-1 grounding contact 251 and the first-2 grounding contact 252. On the other hand, the portion of the first-2 grounding contact 252 with the first-2 grounding inspection plane 2521 and the portion of the first-1 grounding contact 251 with the first-1 grounding inspection plane 2511 can perform the same function.

[0130] like Figure 10 and Figure 11As shown, the first-2 grounding inspection plane 2521, the first-1 grounding inspection plane 2511, the second RF inspection plane 2122, the first RF inspection plane 2112, the plurality of second transmission inspection planes 2222, and the plurality of first transmission inspection planes 2212 can be arranged on a plane at the same height. Therefore, the inspection mechanism can be raised and lowered at the same height to contact each of the inspection planes, including the first-2 grounding inspection plane 2521, the first-1 grounding inspection plane 2511, the second RF inspection plane 2122, the first RF inspection plane 2112, the plurality of second transmission inspection planes 2222, and the plurality of first transmission inspection planes 2212. Thus, the substrate connector 1 of the first embodiment can further improve the ease and accuracy of inspection operations on the first-2 grounding contact 252, the first-1 grounding contact 251, the second RF contact 212, the first RF contact 211, the plurality of second transmission contacts 222, and the plurality of first transmission contacts 221. Furthermore, in the substrate connector 1 of the first embodiment, the inspection mechanism can simultaneously contact the first-2 grounding inspection plane 2521, the first-1 grounding inspection plane 2511, the second RF inspection plane 2122, the first RF inspection plane 2112, a plurality of second transmission inspection planes 2222, and a plurality of first transmission inspection planes 2212. This helps to further shorten the time required to perform inspection operations on the first-2 grounding contact 252, the first-1 grounding contact 251, the second RF contact 212, the first RF contact 211, a plurality of second transmission contacts 222, and a plurality of first transmission contacts 221.

[0131] like Figure 12 and Figure 13 As shown, the first RF inspection plane 2112 and the second RF inspection plane 2122 can also be configured at a higher position than the first-1 ground inspection plane 2511 and the first-2 ground inspection plane 2521. Although not shown, the first RF inspection plane 2112 and the second RF inspection plane 2122 can also be configured at a lower position than the first-1 ground inspection plane 2511 and the first-2 ground inspection plane 2521.

[0132] like Figure 5 and Figure 6As shown, the first-1 grounding inspection plane 2511 and the plurality of first transmission inspection planes 2212 can be configured on the first column R1. The first-2 grounding inspection plane 2521 and the plurality of second transmission inspection planes 2222 can be configured on the second column R2. Therefore, the substrate connector 1 of the first embodiment is implemented such that, depending on the inspection conditions, inspection environment, etc., the inspection mechanism can inspect the first-1 grounding contact 251, the plurality of first transmission contacts 221, the first-2 grounding contact 252, and the plurality of second transmission contacts 222 in various inspection methods.

[0133] In this case, the first RF inspection plane 2112 can be configured on the first column R1, and the second RF inspection plane 2122 can be configured on the second column R2. Therefore, the substrate connector 1 of the first embodiment is implemented such that, depending on the inspection conditions, inspection environment, etc., the inspection mechanism can inspect the first RF contact 211, the first-1 ground contact 251, a plurality of first transmission contacts 221, the second RF contact 212, the first-2 ground contact 252, and a plurality of second transmission contacts 222 in various inspection methods.

[0134] like Figure 5 , Figure 9 as well as Figure 14 As shown, the first RF inspection plane 2112 and the second RF inspection plane 2122 can also be configured on the third column R3. Therefore, the substrate connector 1 of the first embodiment is implemented such that, depending on the inspection conditions, inspection environment, etc., the inspection mechanism can inspect the first RF contact 211, the first-1 ground contact 251, a plurality of first transmission contacts 221, the second RF contact 212, the first-2 ground contact 252, and a plurality of second transmission contacts 222 in a more diverse range of inspection methods.

[0135] Next, the second grounding contact 260 can be implemented in the following manner.

[0136] Reference Figures 2 to 14 The second grounding contact 260 may include a second-first grounding contact 261 and a second-second grounding contact 262.

[0137] The second-first grounding contact 261 is configured between the second RF contact 212 and the plurality of first transmission contacts 221 with reference to the first axial direction (X-axis direction). Thus, the second-first grounding contact 261 can shield the area between the second RF contact 212 and the plurality of first transmission contacts 221.

[0138] The second-first grounding contact 261 may include a second-first grounding inspection plane 2611, a second-first grounding mounting member 2612, and a second-first grounding connection member 2613. The second-first grounding contact 261 may further include a second-first grounding inspection member 2614. The second-first grounding inspection plane 2611 may be formed on one of the second-first grounding mounting member 2612, the second-first grounding connection member 2613, and the second-first grounding inspection member 2614. The second-first grounding inspection plane 2611, the second-first grounding mounting member 2612, the second-first grounding connection member 2613, and the second-first grounding inspection member 2614 can be implemented to be substantially the same as the first-first grounding inspection plane 2511, the first-first grounding mounting member 2512, the first-first grounding connection member 2513, and the first-first grounding inspection member 2514, respectively, therefore specific descriptions of them are omitted.

[0139] The second-first grounding contact 261 and the first-first grounding contact 251 can be formed with the same shape as each other. Therefore, the substrate connector 200 of the first embodiment can improve the ease of manufacturing the second-first grounding contact 261 and the first-first grounding contact 251 respectively. In this case, the second-first grounding contact 261 and the first-first grounding contact 251 can be positioned at symmetrical points SP ( Figure 6 and Figure 9 As shown in the figure, the grounding housing 230 is configured in a point-symmetric manner with respect to the first axial direction (X-axis direction). The symmetric points SP are the two side walls 230b and 230c of the grounding housing 230, which are respectively spaced apart from each other with respect to the first axial direction (X-axis direction). Figure 15 As shown in the figure, while being spaced at the same distance, the two side walls 230d and 230e of the grounding housing 230, which are respectively spaced apart from each other with reference to the second axial direction (Y-axis direction), are respectively arranged from the second axial direction (Y-axis direction). Figure 15 (As shown in the diagram) positions spaced at the same distance. Therefore, the substrate connector 200 of the first embodiment is implemented such that the second-first ground contact 261 and the first-first ground contact 251 are formed with the same shape and differ only in their configuration direction, thus further improving the ease of manufacturing the second-first ground contact 261 and the first-first ground contact 251. In this case, the second RF contact 212 and the first RF contact 211 can be configured to be symmetrical about the symmetry point SP.

[0140] The second-2 grounding contact 262 is configured between the second RF contact 212 and the plurality of second transmission contacts 222 with reference to the first axial direction (X-axis direction). Thus, the second-2 grounding contact 262 can shield the area between the second RF contact 212 and the plurality of second transmission contacts 222.

[0141] The second-second grounding contact 262 may include a second-second grounding inspection plane 2621, a second-second grounding mounting member 2622, and a second-second grounding connection member 2623. The second-second grounding contact 262 may further include a second-second grounding inspection member 2624. The second-second grounding inspection plane 2621 may be formed on one of the second-second grounding mounting member 2622, the second-second grounding connection member 2623, and the second-second grounding inspection member 2624. The second-second grounding inspection plane 2621, the second-second grounding mounting member 2622, the second-second grounding connection member 2623, and the second-second grounding inspection member 2624 can be implemented to be substantially the same as the first-second grounding inspection plane 2521, the first-second grounding mounting member 2522, the first-second grounding connection member 2523, and the first-second grounding inspection member 2524, respectively, therefore specific descriptions of them are omitted.

[0142] The second-2nd grounding contact 262 and the first-2nd grounding contact 252 can be formed in the same form. Therefore, the substrate connector 200 of the first embodiment can improve the ease of manufacturing the second-2nd grounding contact 262 and the first-2nd grounding contact 252 respectively. In this case, the second-2nd grounding contact 262 and the first-2nd grounding contact 252 can be configured such that, at the symmetrical point SP ( Figure 6 and Figure 9 (As shown in the figure) is symmetrical about the reference point. The second-second grounding contact 262, the first-second grounding contact 252, the second-first grounding contact 261, and the first-first grounding contact 251 can also be formed in the same form as each other.

[0143] Reference Figures 2 to 16 In the substrate connector 200 of the first embodiment, the ground housing 230 can be implemented in the following manner.

[0144] The grounding housing 230 may include an inner grounding wall 231, an outer grounding wall 232, and a grounding connection wall 233.

[0145] The grounding inner wall 231 faces the insulating portion 240. The grounding inner wall 231 can also be configured to face the inner space 230a. The first-1 grounding contact 251 and the second-1 grounding contact 261 can also be connected to the grounding inner wall 231, respectively. The grounding inner wall 231 can be configured to surround all sides relative to the inner space 230a. Although not shown, the grounding inner wall 231 can also be implemented as including a plurality of secondary grounding inner walls, and the plurality of secondary grounding inner walls are arranged on different sides relative to the inner space 230a. In this case, the plurality of secondary grounding inner walls can be spaced apart from each other.

[0146] The grounding inner wall 231 can be connected to the grounding housing of the opposing connector inserted into the inner space 230a. For example, as Figure 16 As shown, the grounding inner wall 231 can be connected to the grounding housing 330 of the opposite connector. As described above, the substrate connector 200 of the first embodiment can further enhance its shielding function through the connection between the grounding housing 230 and the grounding housing of the opposite connector. Furthermore, the substrate connector 200 of the first embodiment can reduce adverse electrical effects such as crosstalk caused by different capacitances or inductances between adjacent terminals through the connection between the grounding housing 230 and the grounding housing of the opposite connector. In this case, the substrate connector 200 of the first embodiment can ensure a path for electromagnetic waves to flow into the ground of at least one of the first and second substrates, thereby further enhancing EMI shielding performance.

[0147] The grounding outer wall 232 is spaced apart from the grounding inner wall 231. The grounding outer wall 232 may be disposed outside the grounding inner wall 231. The grounding outer wall 232 may be configured to surround all sides relative to the grounding inner wall 231. The grounding outer wall 232 and the grounding inner wall 231 may be implemented by shielding walls surrounding the sides of the inner space 230a. The first RF contact 211 and the second RF contact 212 may be located in the inner space 230a surrounded by the shielding walls. Thus, the grounding housing 230 can utilize the shielding walls to achieve shielding for a plurality of the RF contacts 210. Therefore, the substrate connector 200 of the first embodiment can utilize the shielding walls to further improve EMI shielding performance and EMC performance.

[0148] The grounding outer wall 232 can be grounded by being mounted on the first substrate. In this case, the grounding housing 230 can be grounded through the grounding outer wall 232. With one end of the grounding outer wall 232 connected to the grounding connection wall 233, the other end of the grounding outer wall 232 can be mounted on the first substrate. In this case, the grounding outer wall 232 can be formed to have a higher height than the grounding inner wall 231.

[0149] The grounding connection wall 233 is connected to both the grounding inner wall 231 and the grounding outer wall 232. The grounding connection wall 233 can be disposed between the grounding inner wall 231 and the grounding outer wall 232. Through the grounding connection wall 233, the grounding inner wall 231 and the grounding outer wall 232 can be electrically connected to each other. Therefore, if the grounding outer wall 232 is mounted on the first substrate and grounded, the grounding connection wall 233 and the grounding inner wall 231 are also grounded, thereby achieving a shielding function.

[0150] The grounding connection wall 233 can be connected to one end of the grounding outer wall 232 and one end of the grounding inner wall 231, respectively. Figure 16 When used as a reference, one end of the grounding outer wall 232 can correspond to the upper end of the grounding outer wall 232, and one end of the grounding inner wall 231 can correspond to the upper end of the grounding inner wall 231. The grounding connection wall 233 is formed as a plate shape arranged in the horizontal direction, and the grounding outer wall 232 and the grounding inner wall 231 can each be formed as a plate shape arranged in the vertical direction. The grounding connection wall 233, the grounding outer wall 232, and the grounding inner wall 231 can also be formed as a single unit.

[0151] The grounding connection wall 233 can be connected to the grounding housing of the opposite connector inserted into the inner space 230a. Therefore, since the grounding outer wall 232 and the grounding connection wall 233 are connected to the grounding housing of the opposite connector, the substrate connector 200 of the first embodiment increases the contact area between the grounding housing 230 and the grounding housing of the opposite connector, thereby further enhancing the shielding function.

[0152] The grounding bottom 234 protrudes from the lower end of the grounding inner wall 231 toward the inner space 230a. That is, the grounding bottom 234 can protrude inward toward the inner side of the grounding inner wall 231. The grounding bottom 234 can be formed into a closed annular shape extending along the lower end of the grounding inner wall 231. The grounding bottom 234 can also be grounded by being mounted on the first substrate. In this case, the grounding housing 330 can be grounded through the grounding bottom 234. If the opposing connector is inserted into the inner space 230a, the grounding bottom 234 can be connected to the grounding housing of the opposing connector. The grounding bottom 234 can be formed into a plate shape arranged in the horizontal direction.

[0153] Here, the grounding housing 230, together with the first grounding contact 250, can provide shielding for the first RF contact 211. The grounding housing 230, together with the second grounding contact 260, can provide shielding for the second RF contact 212.

[0154] In this case, such as Figure 15 As shown, the grounding housing 230 may include a first shielding wall 230b, a second shielding wall 230c, a third shielding wall 230d, and a fourth shielding wall 230e. The first shielding wall 230b, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e can be implemented by the grounding inner wall 231, the grounding outer wall 232, and the grounding connection wall 233, respectively. The first shielding wall 230b and the second shielding wall 230c are arranged facing each other with respect to the first axial direction (X-axis direction). With respect to the first axial direction (X-axis direction), the first RF contact 211 and the second RF contact 212 can be located between the first shielding wall 230b and the second shielding wall 230c. With respect to the first axial direction (X-axis direction), the first RF contact 211 can be located at a position where the distance between it and the first shielding wall 230b is shorter than the distance between it and the second shielding wall 230c. With the first axial direction (X-axis direction) as a reference, the second RF contact 212 can be located at a distance shorter than the distance between it and the second shielding wall 230c. The third shielding wall 230d and the fourth shielding wall 230e are arranged opposite each other with respect to the second axial direction (Y-axis direction). With the second axial direction (Y-axis direction) as a reference, the first RF contact 211 and the second RF contact 212 can be located between the third shielding wall 230d and the fourth shielding wall 230e.

[0155] The first grounding contact 250 can be configured between the first RF contact 211 and the transmission contact 220 with reference to the first axial direction (X-axis direction). Thus, the first RF contact 211 is located between the first shielding wall 230b and the first grounding contact 250 with reference to the first axial direction (X-axis direction), and between the third shielding wall 230d and the fourth shielding wall 230e with reference to the second axial direction (Y-axis direction). Therefore, the substrate connector 200 of the first embodiment can utilize the first grounding contact 250, the first shielding wall 230b, the third shielding wall 230d, and the fourth shielding wall 230e to enhance the shielding function of the first RF contact 211. The first grounding contact 250, the first shielding wall 230b, the third shielding wall 230d, and the fourth shielding wall 230e are configured on four sides with reference to the first RF contact 211, thereby achieving effective shielding of RF signals. In this case, the first grounding contact 250, the first shielding wall 230b, the third shielding wall 230d, and the fourth shielding wall 230e can form the first grounding loop 250a for the first RF contact 211. Figure 15 (As shown in the figure). Therefore, the substrate connector 200 of the first embodiment utilizes the first ground loop 250a to further enhance the shielding function of the first RF contact 211, thereby achieving complete shielding of the first RF contact 211.

[0156] The second grounding contact 260 can be configured with reference to the first axial direction (X-axis direction) between the second RF contact 212 and the plurality of transmission contacts 220. Thus, the second RF contact 212 can be located with reference to the first axial direction (X-axis direction) between the second shielding wall 230c and the second grounding contact 260, and with reference to the second axial direction (Y-axis direction) between the third shielding wall 230d and the fourth shielding wall 230e. Therefore, the substrate connector 200 of the first embodiment can utilize the second grounding contact 260, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e to enhance the shielding function of the second RF contact 212. The second grounding contact 260, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e are configured on four sides with reference to the second RF contact 212, thereby achieving effective shielding of RF signals. In this case, the second grounding contact 260, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e can form the second grounding loop 260a for the second RF contact 212. Figure 15 (As shown in the figure). Therefore, the substrate connector 200 of the first embodiment utilizes the second ground loop 260a to further enhance the shielding function of the second RF contact 212, thereby achieving complete shielding of the second RF contact 212.

[0157] Reference Figures 2 to 16 In the substrate connector 200 of the first embodiment, the insulating portion 240 can be implemented in the following manner.

[0158] The insulating part 240 may include an insulating member 241, an insertion member 242, and a connecting member 243.

[0159] The insulating member 241 supports a plurality of the RF contacts 210 and a plurality of the transmission contacts 220. The insulating member 241 may be located in the inner space 230a. The insulating member 241 may be located inside the grounding inner wall 231. The insulating member 241 may be inserted into the inner space of the opposing connector.

[0160] The insertion member 242 is inserted between the inner grounding wall 231 and the outer grounding wall 232. With the insertion member 242 inserted between the inner grounding wall 231 and the outer grounding wall 232, the insulating portion 240 can engage with the grounding housing 230. The insertion member 242 can be inserted between the inner grounding wall 231 and the outer grounding wall 232 in an interference fit manner. The insertion member 242 can be disposed outside the insulating member 241. The insertion member 242 can be configured to surround the outer side of the insulating member 241.

[0161] The connecting member 243 is coupled to both the insertion member 242 and the insulating member 241. The insertion member 242 and the insulating member 241 can be connected to each other using the connecting member 243. With respect to the vertical direction, the connecting member 243 can be formed to be thinner than the insertion member 242 and the insulating member 241. This allows for the arrangement of a space between the insertion member 242 and the insulating member 241, and the insertion member 242 can be inserted into this space. The connecting member 243, the insertion member 242, and the connecting member 243 can also be formed as a single unit.

[0162] The insulating part 240 may include a welding inspection window 244. Figure 4 (as shown in the image).

[0163] The solder inspection window 244 can be formed through the insulating portion 240. The solder inspection window 244 can be used to inspect the state of the plurality of RF mounting members 2111, 2121 mounted on the first substrate. In this case, the plurality of RF contacts 210 can be combined with the insulating portion 240 so that the plurality of RF mounting members 2111, 2121 are located in the solder inspection window 244. Therefore, the plurality of RF mounting members 2111, 2121 are not obstructed by the insulating portion 240. Thus, when the substrate connector 200 of the first embodiment is mounted on the first substrate, the operator can inspect the state of the plurality of RF mounting members 2111, 2121 mounted on the first substrate through the solder inspection window 244. Therefore, even if all of the RF contacts 210, including the plurality of RF mounting members 2111 and 2121, are located inside the grounding housing 230, the substrate connector 200 of the first embodiment can improve the accuracy of the mounting operation of mounting the plurality of RF contacts 210 onto the first substrate. The solder inspection window 244 can be formed through the insulating member 241.

[0164] The insulating portion 240 may also include a plurality of solder inspection windows 244. In this case, the plurality of RF mounting members 2111, 2121 may be located in different solder inspection windows 244. A plurality of transmission mounting members 2211, 2221 may also be provided in a portion of the plurality of solder inspection windows 244. A plurality of grounding mounting members 2512, 2522, 2612, 2622 may also be provided in a portion of the plurality of solder inspection windows 244. Therefore, when the substrate connector 200 of the first embodiment is mounted on the first substrate, an operator can inspect the mounting status of the plurality of RF mounting members 2111, 2121, the plurality of transmission mounting members 2211, 2221, and the plurality of grounding mounting members 2512, 2522, 2612, 2622 on the first substrate through the plurality of solder inspection windows 244. Therefore, the substrate connector 200 of the first embodiment can improve the accuracy of the operation of mounting a plurality of the RF mounting members 2111, 2121, a plurality of the transmission mounting members 2211, 2221, and a plurality of the grounding mounting members 2512, 2522, 2612, 2622 to the first substrate. A plurality of the solder inspection windows 244 can be formed by penetrating the insulating portion 240 at spaced-apart locations.

[0165] <Substrate connector 300 of the second embodiment>

[0166] Reference Figures 2 to 20 The substrate connector 300 of the second embodiment can be mounted on the second substrate. If the substrate connector 300 of the second embodiment and the opposing connector are assembled together, the second substrate on which the substrate connector 300 of the second embodiment is mounted and the first substrate on which the opposing connector is mounted can be electrically connected. In this case, the opposing connector can also be implemented by the substrate connector 200 of the first embodiment. On the other hand, the opposing connector in the substrate connector 200 of the first embodiment can also be implemented by the substrate connector 300 of the second embodiment.

[0167] The substrate connector 300 of the second embodiment may include a plurality of RF contacts 310, a plurality of transmission contacts 320, a ground housing 330, an insulating portion 340, a first ground contact 350, and a second ground contact 360. The plurality of RF contacts 310, the plurality of transmission contacts 320, the ground housing 330, the insulating portion 340, the first ground contact 350, and the second ground contact 360 may be implemented such that they are substantially the same as the plurality of RF contacts 210, the plurality of transmission contacts 220, the ground housing 230, the insulating portion 240, the first ground contact 250, and the second ground contact 260 in the substrate connector 200 of the first embodiment. Therefore, the following description mainly focuses on the differences.

[0168] The first RF contact 311 and the second RF contact 312 of the plurality of RF contacts 310 can be supported on the insulating portion 340 at positions spaced apart from each other along the first axial direction (X-axis direction).

[0169] The first RF contact 311 may include: a first RF mounting member 3111 for mounting on the second substrate; a first RF inspection plane 3112 for contacting the inspection mechanism; and a first RF connection member 3113 for connecting to the RF contact of the opposing connector. The first RF contact 311 may also include a plurality of first RF mounting members 3111, 3111'(( Figure 20 (As shown in the diagram). The first RF contact 311 may further include a first RF inspection member 3114 for contacting the inspection mechanism. The first RF mounting member 3111, the first RF inspection plane 3112, the first RF connection member 3113, and the first RF inspection member 3114 may be implemented to be substantially the same as the first RF mounting member 2111, the first RF inspection plane 2112, the first RF connection member 2113, and the first RF inspection member 2114 in the substrate connector 200 of the first embodiment described above, and therefore specific descriptions thereof are omitted.

[0170] The second RF contact 312 may include: a second RF mounting member 3121 for mounting on the second substrate; a second RF inspection plane 3122 for contacting the inspection mechanism; and a second RF connection member 3123 for connecting to the RF contact of the opposing connector. The second RF contact 312 may also include a plurality of second RF mounting members 3121, 3121'(( Figure 20(As shown in the diagram). The second RF contact 312 may further include a second RF inspection member 3124 for contacting the inspection mechanism. The second RF mounting member 3121, the second RF inspection plane 3122, the second RF connection member 3123, and the second RF inspection member 3124 may be implemented to be substantially consistent with the second RF mounting member 2121, the second RF inspection plane 2122, the second RF connection member 2123, and the second RF inspection member 2124 in the substrate connector 200 of the first embodiment described above, and therefore specific descriptions thereof are omitted.

[0171] A plurality of the transmission contacts 320 may be configured between the first RF contact 311 and the second RF contact 312 with reference to the first axial direction (X-axis direction). A plurality of the first transmission contacts 321 and a plurality of the second transmission contacts 322 may be configured to be spaced apart from each other along the second axial direction (Y-axis direction).

[0172] A plurality of the first transmission contacts 321 may be spaced apart from each other along the first axial direction (X-axis direction). Each of the plurality of first transmission contacts 321 may include: a first transmission mounting member 3211 for mounting on the second substrate; a first transmission inspection plane 3212 for contacting the inspection mechanism; and a first transmission connecting member 3213 for connecting to the transmission contacts of the opposing connector. Each of the plurality of first transmission contacts 321 may further include a first transmission inspection member 3214 for contacting the inspection mechanism. The first transmission mounting member 3211, the first transmission inspection plane 3212, the first transmission connecting member 3213, and the first transmission inspection member 3214 may be implemented to be substantially consistent with the first transmission mounting member 2211, the first transmission inspection plane 2212, the first transmission connecting member 2213, and the first transmission inspection member 2214 in the substrate connector 200 of the first embodiment described above, and therefore a detailed description thereof is omitted.

[0173] A plurality of second transmission contacts 322 may be spaced apart from each other along the first axial direction (X-axis direction). Each of the plurality of second transmission contacts 322 may include: a second transmission mounting member 3221 for mounting on the second substrate; a second transmission inspection plane 3222 for contacting the inspection mechanism; and a second transmission connecting member 3223 for connecting to the transmission contacts of the opposing connector. The plurality of second transmission contacts 322 may further include a second transmission inspection member 3224 for contacting the inspection mechanism. The second transmission mounting member 3221, the second transmission inspection plane 3222, the second transmission connecting member 3223, and the second transmission inspection member 3224 may be implemented to be substantially consistent with the second transmission mounting member 2221, the second transmission inspection plane 2222, the second transmission connecting member 2223, and the second transmission inspection member 2224 in the substrate connector 200 of the first embodiment described above, and therefore a detailed description thereof is omitted.

[0174] The grounding housing 330 is combined with the insulating portion 340. The grounding housing 330 can be grounded by being mounted on the second substrate. The grounding housing 330 can be configured to surround the sides of the inner space 330a. The insulating portion 340 can be located in the inner space 330a. The first RF contact 311, the second RF contact 312, the plurality of transmission contacts 320, the first ground contact 350, and the second ground contact 360 can all be located in the inner space 330a. In this case, some or all of the first RF contact 311, the second RF contact 312, the plurality of transmission contacts 320, the first ground contact 350, and the second ground contact 360 mounted on the second substrate can be located in the inner space 330a. The opposing connector can be inserted into the inner space 330a. In this configuration, a portion of the opposing connector is inserted into the inner space 330a, and a portion of the substrate connector 300 of the second embodiment can be inserted into the inner space of the opposing connector. The grounding housing 330 can be configured to surround all sides relative to the inner space 330a.

[0175] The insulating portion 340 supports a plurality of the RF contacts 310. The insulating portion 340 may incorporate a plurality of the RF contacts 310, a plurality of the transmission contacts 320, the first ground contact 350, and the second ground contact 360. The insulating portion 340 may be integrated with the grounding housing 330 such that the plurality of RF contacts 310, the plurality of transmission contacts 320, the first ground contact 350, and the second ground contact 360 are located within the inner space 330a.

[0176] The first grounding contact 350, together with the grounding housing 330, can provide shielding for the first RF contact 311. The first grounding contact 350 can be configured with respect to the first axial direction (X-axis direction) between the first RF contact 311 and a plurality of the transmission contacts 320. If the opposing connector is inserted into the inner space 330a, the first grounding contact 350 can connect with the grounding contacts of the opposing connector.

[0177] The first grounding contact 350 may include a first-first grounding contact 351 and a first-second grounding contact 352.

[0178] The first-1 grounding contact 351 is configured with reference to the first axial direction (X-axis direction) between the first RF contact 311 and a plurality of the first transmission contacts 321. Thus, the first-1 grounding contact 351 can shield the area between the first RF contact 311 and the plurality of the first transmission contacts 321. The first-1 grounding contact 351 may include: a first-1 grounding inspection plane 3511 for contacting the inspection mechanism; a first-1 grounding mounting member 3512 for mounting on the second substrate; and a first-1 grounding connection member 3513 for connecting to the grounding contact of the opposing connector. The first-1 grounding contact 351 may also include a plurality of the first-1 grounding mounting members 3512. The first-1 grounding contact 351 may further include a first-1 grounding inspection member 3514 for contacting the inspection mechanism. The first-1 grounding inspection plane 3511, the first-1 grounding mounting member 3512, the first-1 grounding connection member 3513, and the first-1 grounding inspection member 3514 can be implemented to be substantially the same as the first-1 grounding inspection plane 2511, the first-1 grounding mounting member 2512, the first-1 grounding connection member 2513, and the first-1 grounding inspection member 2514 in the substrate connector 200 of the first embodiment described above, and therefore specific descriptions thereof are omitted.

[0179] The first-second grounding contact 352 is configured with reference to the first axial direction (X-axis direction) between the first RF contact 311 and a plurality of second transmission contacts 322. Thus, the first-second grounding contact 352 can shield the area between the first RF contact 311 and the plurality of second transmission contacts 322. The first-second grounding contact 352 may include: a first-second grounding inspection plane 3521 for contacting the inspection mechanism; a first-second grounding mounting member 3522 for mounting on the second substrate; and a first-second grounding connection member 3523 for connecting to the grounding contact of the opposing connector. The first-second grounding contact 352 may also include a plurality of the first-second grounding mounting members 3522. The first-second grounding contact 352 may further include a first-second grounding inspection member 3524 for contacting the inspection mechanism. The first-second grounding inspection plane 3521, the first-second grounding mounting member 3522, the first-second grounding connection member 3523, and the first-second grounding inspection member 3524 can be implemented to be substantially the same as the first-second grounding inspection plane 2521, the first-second grounding mounting member 2522, the first-second grounding connection member 2523, and the first-second grounding inspection member 2524 in the substrate connector 200 of the first embodiment described above, so a detailed description of them is omitted.

[0180] The second grounding contact 360, together with the grounding housing 330, can provide shielding for the second RF contact 312. The second grounding contact 360 can be configured with respect to the first axial direction (X-axis direction) between the second RF contact 312 and a plurality of the transmission contacts 320. If the opposing connector is inserted into the inner space 330a, the second grounding contact 360 can connect with the grounding contacts of the opposing connector.

[0181] The second grounding contact 360 may include a second-first grounding contact 361 and a second-second grounding contact 362.

[0182] The second-first grounding contact 361 is configured with reference to the first axial direction (X-axis direction) between the second RF contact 312 and the plurality of second transmission contacts 322. Thus, the second-first grounding contact 361 can shield the area between the second RF contact 312 and the plurality of second transmission contacts 322. The second-first grounding contact 361 may include: a second-first grounding inspection plane 3611 for contacting the inspection mechanism; a second-first grounding mounting member 3612 for mounting on the second substrate; and a second-first grounding connection member 3613 for connecting to the grounding contact of the opposing connector. The second-first grounding contact 361 may also include a plurality of the second-first grounding mounting members 3612. The second-first grounding contact 361 may further include a second-first grounding inspection member 3614 for contacting the inspection mechanism. The second-first grounding inspection plane 3611, the second-first grounding mounting member 3612, the second-first grounding connection member 3613, and the second-first grounding inspection member 3614 can be implemented to be substantially the same as the second-first grounding inspection plane 2611, the second-first grounding mounting member 2612, the second-first grounding connection member 2613, and the second-first grounding inspection member 2614 in the substrate connector 200 of the first embodiment described above, and therefore specific descriptions thereof are omitted.

[0183] The second-2 grounding contact 362 is configured between the second RF contact 312 and a plurality of the first transmission contacts 321 with reference to the first axial direction (X-axis direction). Thus, the second-2 grounding contact 362 can shield the area between the second RF contact 312 and the plurality of the first transmission contacts 321. The second-2 grounding contact 362 may include: a second-2 grounding inspection plane 3621 for contacting the inspection mechanism; a second-2 grounding mounting member 3622 for mounting on the second substrate; and a second-2 grounding connection member 3623 for connecting to the grounding contact of the opposing connector. The second-2 grounding contact 362 may also include a plurality of the second-2 grounding mounting members 3622. The second-2 grounding contact 362 may further include a second-2 grounding inspection member 3624 for contacting the inspection mechanism. The second-second grounding inspection plane 3621, the second-second grounding mounting member 3622, the second-second grounding connection member 3623, and the second-second grounding inspection member 3624 can be implemented to be substantially the same as the second-second grounding inspection plane 2621, the second-second grounding mounting member 2622, the second-second grounding connection member 2623, and the second-second grounding inspection member 2624 in the substrate connector 200 of the first embodiment described above, and therefore specific descriptions thereof are omitted.

[0184] In the substrate connector 300 of the second embodiment, as Figure 20 As shown, the first-1 grounding inspection plane 3511, a plurality of first transmission inspection planes 3212, the second-2 grounding inspection plane 3621, and the second RF inspection plane 3122 can be configured on the first column R1. The first RF inspection plane 3112, the first-2 grounding inspection plane 3512, a plurality of second transmission inspection planes 3222, and the second-1 grounding inspection plane 3611 can be configured on the second column R2. In the substrate connector 300 of the second embodiment, the plurality of inspection planes 3112, 3122, 3212, 3222, 3511, 3521, 3611, and 3621 can also be configured as follows: Figure 6 , Figure 9 or Figure 14 That configuration.

[0185] Reference Figures 16 to 21 In the substrate connector 300 of the second embodiment, the ground housing 330 can be implemented in the following manner.

[0186] The grounding housing 330 may include a grounding side wall 331, a grounding upper wall 332, and a grounding lower wall 333.

[0187] The grounding sidewall 331 faces the insulating portion 340. The grounding sidewall 331 may be configured to face the inner space 330a. The grounding sidewall 331 may be configured to surround all sides relative to the inner space 330a.

[0188] The grounding sidewall 331 can be connected to the grounding housing of the opposing connector inserted into the inner space 330a. For example, as Figure 16 As shown, the grounding sidewall 331 can be connected to the grounding inner wall 231 of the grounding housing 230 of the first embodiment's substrate connector 200. As described above, the second embodiment's substrate connector 300 can further enhance its shielding function through the connection between the grounding housing 330 and the grounding housing of the opposing connector. Furthermore, the second embodiment's substrate connector 300 can reduce adverse electrical effects such as crosstalk caused by different capacitances or inductions between adjacent terminals through the connection between the grounding housing 330 and the grounding housing of the opposing connector. In this case, the second embodiment's substrate connector 300 can ensure a path for electromagnetic waves to flow into the ground of at least one of the second and first substrates, thereby further enhancing EMI shielding performance.

[0189] The upper grounding wall 332 is coupled to the lower grounding sidewall 331. The upper grounding wall 332 may be coupled to one end of the lower grounding sidewall 331. The upper grounding wall 332 may protrude from the lower grounding sidewall 331 toward the inner space 330a. The upper grounding wall 332 may be connected to the grounding housing of the opposite connector inserted into the inner space 330a. Therefore, since the upper grounding wall 332 and the lower grounding sidewall 331 are connected to the grounding housing of the opposite connector, the substrate connector 300 of the second embodiment can increase the contact area between the grounding housing 330 and the grounding housing of the opposite connector, thereby further enhancing the shielding function. For example, as... Figure 9 As shown, the grounding upper wall 332 can be connected to the grounding bottom 234 of the grounding housing 230 of the substrate connector 200 of the first embodiment.

[0190] The lower grounding wall 333 is coupled to the grounding sidewall 331. The lower grounding wall 333 may be coupled to the other end of the grounding sidewall 331. The lower grounding wall 333 may protrude from the grounding sidewall 331 toward the opposite side of the inner space 330a. The lower grounding wall 333 may be configured to surround all sides relative to the grounding sidewall 331. The lower grounding wall 333 and the grounding sidewall 331 may be implemented by shielding walls surrounding the sides of the inner space 330a. The first RF contact 311 and the second RF contact 312 may be located in the inner space 330a surrounded by the shielding walls. Thus, the grounding housing 330 may utilize the shielding walls to provide shielding for a plurality of the RF contacts 310. Therefore, the substrate connector 300 of the second embodiment may utilize the shielding walls to further improve EMI shielding performance and EMC performance. The lower grounding wall 333 may be grounded by mounting it to the second substrate. In this case, the grounding housing 330 can be grounded through the grounding lower wall 333.

[0191] The lower grounding wall 333 and the upper grounding wall 332 can be formed into a plate shape arranged along the horizontal direction, and the side grounding wall 331 can be formed into a plate shape arranged along the vertical direction. The lower grounding wall 333, the upper grounding wall 332, and the side grounding wall 331 can also be formed as a single unit.

[0192] Here, the grounding housing 330, together with the first grounding contact 350, can provide shielding for the first RF contact 311. The grounding housing 330, together with the second grounding contact 360, can provide shielding for the second RF contact 312.

[0193] In this case, such as Figure 21As shown, the grounding housing 330 may include a first shielding wall 330b, a second shielding wall 330c, a third shielding wall 330d, and a fourth shielding wall 330e. The first grounding contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e can form the first grounding loop 350a for the first RF contact 311. The second grounding contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e can form the second grounding loop 360a for the second RF contact 312. The first shielding wall 330b, the second shielding wall 330c, the third shielding wall 330d, the fourth shielding wall 330e, the first grounding loop 350a, and the second grounding loop 360a are implemented such that they are substantially the same as the first shielding wall 230b, the second shielding wall 230c, the third shielding wall 230d, the fourth shielding wall 230e, the first grounding loop 250a, and the second grounding loop 260a in the substrate connector 200 of the first embodiment described above, so a detailed description of them is omitted.

[0194] Reference Figures 2 to 21 In the substrate connector 300 of the second embodiment, the insulating portion 340 may include a solder inspection window 341 for inspecting the state of the substrate mounted on the second substrate. The solder inspection window 341 is substantially the same as the solder inspection window 244 in the substrate connector 200 of the first embodiment described above, so a detailed description of it is omitted.

[0195] The present invention described above is not limited to the foregoing embodiments and drawings. Those skilled in the art will clearly understand that various substitutions, modifications and alterations can be made without departing from the technical concept of the present invention.

Claims

1. A substrate connector, characterized in that, include: Multiple RF contacts for transmitting RF signals; The insulating part supports a plurality of the RF contacts; A plurality of transmission contacts, wherein a first RF contact and a second RF contact are spaced apart from each other along a first axis, and an insulating portion is attached between the first RF contact and the second RF contact; A grounding housing, incorporating the insulating portion, with a plurality of RF contacts and a plurality of transmission contacts located in the inner space of the grounding housing, the grounding housing being integrally formed seamlessly to surround all sides based on the inner space; The first grounding contact, coupled to the insulating portion, shields the first RF contact and the plurality of transmission contacts with reference to the first axial direction. as well as The second grounding contact, coupled to the insulating portion, shields the second RF contact and the plurality of transmission contacts with reference to the first axial direction. The first RF contact includes a first RF inspection plane for contacting the inspection mechanism. The second RF contact includes a second RF inspection plane for contacting the inspection mechanism. The first RF inspection plane and the second RF inspection plane are configured on a plane at the same height. The plurality of RF contacts and the plurality of transmission contacts are completely shielded from external exposure along the first axial direction and the second axial direction intersecting the first axial direction by the grounding housing. At least one of the first RF inspection plane and the second RF inspection plane is formed as a plane with a width of 1 based on the first axial direction and a length of 0.5 or more and 1.5 or less based on a second axial direction perpendicular to the first axial direction.

2. The substrate connector according to claim 1, characterized in that, A plurality of first transmission contacts and a plurality of second transmission contacts are arranged spaced apart from each other along a second axis direction perpendicular to the first axis direction. Each of the plurality of the first transmission contacts includes a first transmission inspection plane for contacting the inspection mechanism. Each of the plurality of the second transmission contacts includes a second transmission inspection plane for contacting the inspection mechanism. A plurality of the first transmission check planes and a plurality of the second transmission check planes are arranged on a plane at the same height.

3. The substrate connector according to claim 2, characterized in that, The first RF inspection plane, the second RF inspection plane, a plurality of the first transmission inspection planes, and a plurality of the second transmission inspection planes are arranged on a plane at the same height.

4. The substrate connector according to claim 1, characterized in that, The first RF contact includes: A first RF mounting component is used for mounting on a substrate; and The first RF connection member is used to connect with the RF contact of the opposite connector. The first RF inspection plane is formed on the first RF mounting member or the first RF connection member.

5. The substrate connector according to claim 1, characterized in that, The first RF contact includes: First RF mounting component, used for mounting on a substrate; A first RF connection member is used for connection with the RF contacts of a corresponding connector; and The first RF inspection component is used to contact the inspection mechanism. The first RF inspection plane is formed on the first RF inspection member.

6. The substrate connector according to claim 1, characterized in that, A plurality of first transmission contacts and a plurality of second transmission contacts are arranged spaced apart from each other along a second axis direction perpendicular to the first axis direction. Each of the plurality of the first transmission contacts includes: The first transmission mounting component is used for mounting on the substrate; A first transmission connection member is used to connect with the transmission contact of a corresponding connector; and The first transfer inspection plane is used to contact the inspection mechanism. The first transmission inspection plane is formed on the first transmission mounting member or the first transmission connection member.

7. The substrate connector according to claim 1, characterized in that, A plurality of first transmission contacts and a plurality of second transmission contacts are arranged spaced apart from each other along a second axis direction perpendicular to the first axis direction. Each of the plurality of the first transmission contacts includes: The first transmission mounting component is used for mounting on the substrate; The first transmission connection member is used to connect with the transmission contact of the opposite connector; A first transfer inspection plane is used to contact the inspection mechanism; and The first transmission inspection component has the first transmission inspection plane formed thereon.

8. The substrate connector according to claim 1, characterized in that, The first grounding contact includes a first-1 grounding contact and a first-2 grounding contact that are spaced apart from each other along a second axis direction perpendicular to the first axis direction. The first-1 grounding contact includes: The first-1 grounding mounting component is used for mounting on the substrate; The first-1 grounding connection member is used for connection to the grounding contact of the opposite connector; and The first-to-first grounding inspection plane is used for contact with the inspection mechanism. The first-1 grounding inspection plane is formed on the first-1 grounding mounting member or the first-1 grounding connection member.

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