Security camera with angled cable attachment for increased downward viewing angle

Abstract

A security camera with an angled cable attachment that enables increased downward viewing angles is described herein. The security camera is powered by a battery and can be magnetically coupled to a mounting device and electrically connected to another device via a cable. The cable has a cable attachment that is angled toward the front of the security camera when coupled to the security camera. The cable angle enables increased downward tilt angles of the security camera by reducing interference of the cable attachment with the mounting device when the security camera is tilted downward. The security camera also has exposed contacts on a printed circuit board that connect with pins on the cable attachment.

Description

Background Technology

[0001] Security cameras are often installed at heights that are difficult for many people to reach, which reduces the likelihood of tampering. Due to this installation location, security cameras are typically angled downwards from horizontal to record images and / or video of a large area in front of and below them. However, many security cameras have limited articulation connections due to the associated mounting structures used to attach the security camera to a surface (e.g., a wall), the mechanical hinges connecting the security camera to the mounting structure, and / or the cables connecting the security camera to a power source or other device. These limitations of the security camera's articulation connections can restrict the camera's field of view and thus diminish its usefulness. Summary of the Invention

[0002] This document describes a security camera with an angled cable attachment that enables an increased downward viewing angle. The security camera is battery powered and can be magnetically coupled to a mounting device and electrically connected to another device via a cable. The cable has a cable attachment that tilts forward of the security camera when coupled to it. This cable angle increases the downward tilt angle of the security camera by reducing interference between the cable attachment and the mounting device when the security camera tilts downward. The security camera also has exposed contacts on a printed circuit board (PCB) that connect to pins on the cable attachment.

[0003] According to one aspect, a system including an electronic device and a coupler is disclosed. The electronic device includes a housing, a front element, a camera module, a magnetizable member, and a recessed region. The housing has a generally cup-shaped shell and is generally symmetrical about a central axis. The housing has a front end defined by an opening in the housing and a rear end defined by a circular cover of the housing. The front element is positioned at the front end of the housing and is oriented to substantially cover the opening in the housing. The front element includes a lens cover. The camera module is disposed within the housing and aligned with the lens cover of the front element. The magnetizable member is positioned within the housing near the rear end. Furthermore, the magnetizable member is configured to magnetically couple the electronic device to a mounting device. The recessed region is located on a side of the housing relative to the central axis of the housing and includes a generally flat surface and a plurality of conductive contacts exposed through the generally flat surface. The coupler has a contact surface configured to contact the generally flat surface. The coupler is attached to a cable and configured to removably connect the cable to the electronic device via the recessed region. Furthermore, the coupler is configured to define an acute angle between the cable and the contact surface. Additionally, the coupler extends the cable toward the front end of the housing to increase the downward tilt angle of the electronic device relative to the mounting device.

[0004] This invention is provided to introduce a simplified concept for a security camera with an angled cable attachment that provides an increased downward viewing angle, which is further described in the following detailed description and accompanying drawings. This invention is not intended to identify the essential features of the claimed technical solution, nor is it intended to define the scope of the claimed technical solution. Attached Figure Description

[0005] This document describes in detail one or more aspects of a safety camera with an angled cable attachment that achieves an increased downward viewing angle, with reference to the following figures. The same reference numerals are used in different instances in the description and figures to indicate similar elements:

[0006] Figure 1-1 The illustration shows an example electronic device according to one or more embodiments;

[0007] Figure 1-2 An exploded view of some components of the electronic device in Figure 1 is shown;

[0008] Figure 2 The illustration shows a front view of the electronic device in Figure 1;

[0009] Figure 3 The diagram shows Figure 2 A cross-sectional view of the electronic equipment along line 3-3;

[0010] Figure 4 The diagram illustrates a cable attachment coupled to an electronic device. Figure 3 An enlarged view of a portion of the cross-sectional view of an electronic device in the diagram;

[0011] Figure 5 The illustration shows an example implementation of the electronic device in Figure 1 coupled to the mounting device;

[0012] Figure 6 The illustration shows an isometric view of the electronic device in Figure 1, which is coupled to the mounting device and tilted downwards.

[0013] Figure 7 The diagram shows Figure 6 The right view of the electronic device coupled to the mounting device;

[0014] Figure 8 The diagram shows Figure 6 A cross-sectional view of the electronic equipment along line 8-8;

[0015] Figure 9A This is a front right perspective view of the installation device according to some implementation methods;

[0016] Figure 9B It is based on some implementation methods from Figure 9A A three-dimensional view of the installation equipment from the left rear.

[0017] Figure 10 It is based on some implementation methods from Figure 9A An exploded view of the installed equipment;

[0018] Figure 11 This is a bottom plan view of an electronic device according to some embodiments;

[0019] Figure 12 The diagram illustrates the different assembly states of the components from... Figure 3 A three-dimensional view of the right front of the coupler;

[0020] Figure 13 The diagram illustrates the different assembly states of the components from... Figure 12 A rear left perspective view of the coupler;

[0021] Figure 14 The diagram shows a perspective view of the connector sub-assembly and an exploded view of some of its components.

[0022] Figure 15A The diagram shows Figure 14 The upper right 3D view of the connector sub-assembly;

[0023] Figure 15B The diagram shows Figure 15A The lower left perspective view of the connector sub-assembly;

[0024] Figure 16 The diagram shows Figure 15A A front view of the connector sub-component;

[0025] Figure 17 The diagram shows Figure 16 A cross-sectional view of the connector sub-assembly taken along line 17-17;

[0026] Figure 18 The diagram shows Figure 16 A cross-sectional view of the connector sub-assembly taken along line 18-18; and

[0027] Figure 19 This is a block diagram illustrating an example system including an example device, which can be implemented as any electronic device (e.g., the electronic device in Figure 1), implemented as shown in Figures 1 to 12. Figure 18 The description covers various aspects of a security camera with an angled cable attachment that achieves an increased downward viewing angle. Detailed Implementation

[0028] This document describes a security camera with an angled cable attachment that achieves an increased downward viewing angle. The technology described herein provides a compact, battery-powered security camera that can be magnetically coupled to a mounting device. The security camera has an angled cable attachment facing forward to reduce interference between the cable attachment and the mounting device, and to increase the downward tilt angle of the security camera. This increased downward tilt angle allows the security camera to have a downward viewing angle sufficient to observe the ground near the wall to which the mounting device is attached, regardless of the height at which the security camera (and the mounting device) are mounted. Thus, the maximum downward viewing angle does not vary significantly based on the height of the security camera. For example, whether the security camera is mounted at 6 feet (1.829 meters) or 16 feet (4.877 meters), the security camera can capture images of packages on the ground below the security camera.

[0029] The cable attachment connects to the security camera via a port. This port is a recessed area providing contact with multiple corrosion-resistant contacts (e.g., gold), which are part of the PCB located within the security camera. These contacts are exposed to air and are designed to reduce the distance between the pins (e.g., pogo pins) on the cable attachment and the PCB in the security camera, which also reduces losses due to the resistance of the signal medium. Some of the contacts can be used for USB negotiation, and some can be used for device detection.

[0030] Although the features and concepts of the security camera with angled cable attachment that achieves an increased downward viewing angle can be implemented in any number of different environments, the aspects are described in the following example scenarios.

[0031] Example device

[0032] Figure 1-1 An example electronic device 100 according to one or more embodiments is illustrated. In various aspects, the electronic device 100 is a battery-operated camera device (e.g., a security camera) that can be used in indoor or outdoor environments. The electronic device 100 includes an elongated shape having a longitudinal axis 102. In various aspects, the electronic device 100 is generally symmetrical about the longitudinal axis 102. The electronic device 100 may have a cross-section orthogonal to the longitudinal axis 102, which has any suitable shape, including an elliptical shape, a circular shape, a triangular shape, a rectangular shape, a hexagonal shape, etc. Furthermore, the electronic device 100 has opposing first ends 104 and second ends 106 intersecting the longitudinal axis 102, respectively. The first end 104 may be circular, thereby forming a convex curved outer surface. The second end 106 may be substantially planar and orthogonal to the longitudinal axis 102. For convenience, the electronic device 100 is described herein with respect to the xyz directions, as... Figure 1-1 As illustrated. For example, the vertical axis 102 is described as parallel to the z-axis, and the first end 104 and the second end 106 are separated by a distance along the vertical axis 102. Furthermore, the side of the electronic device 100 refers to the surface that intersects with a plane defined by the x-axis and y-axis, such as the xy-plane.

[0033] Figure 1-2 An exploded view of some components of the electronic device in Figure 1 is illustrated. The electronic device 100 includes a housing 108 and a front element 110, which, when assembled together, define an internal space housing the various components of the electronic device 100. The housing 108 forms about a central axis (e.g., Figure 1-1 The housing is a generally symmetrical cup-shaped housing (vertical axis 102). The housing includes an open end and a closed circular end (e.g., the first end 104 of the electronic device 100). The front element 110 has a generally disc-shaped shape and is configured to be assembled to the housing 108 at the open end of the housing.

[0034] Electronic device 100 includes a middle frame 112, a battery 114, a front frame 116, a main logic board (MLB) 118, a magnetic shield 120, a plunger subassembly 122, a rear frame 124, a button 126, a connector subassembly 128, and a speaker module 130. In various aspects, the speaker module 130 is aligned with a perforation 132 located on the side of the housing 108 during assembly. The front element 110 may include a camera module for capturing images and / or video, a passive infrared (PIR) sensor for detecting motion, and one or more IR irradiators for providing IR light for motion detection via the PIR sensor. Furthermore, a flexible printed circuit (FPC) 134 is included to electrically connect the PIR sensor and camera module on the front element 110 and directly connect them to the MLB 118.

[0035] The front element 110 is attached to the intermediate frame 112 via a twist locking mechanism. For example, the front element 110 is fastened to the intermediate frame 112 and twisted away from the intermediate frame 112. In this way, the front element 110 does not need to be directly attached to the housing 108.

[0036] The intermediate frame 112, battery 114, and front frame 116 together form a front frame subassembly. This front frame assembly may also include thermal foam 136 disposed between the battery 114 and the front frame 116. During assembly, the battery 114 is cantilevered to the intermediate frame 112 via adhesive, and the intermediate frame is connected to the front frame 116, with the battery 114 located between the intermediate frame 112 and the front frame 116. The front frame 116 comprises a metallic material (e.g., magnesium) and is configured to act as a heat sink to conduct heat away from the battery 114 and MLB 118 and to protect the battery 114. Thermal foam 136 is disposed inside the front frame assembly between the battery 114 and the front frame 116. Thermal foam 136 is flexible (e.g., compressible), allowing the battery 114 to expand and contract due to heat. In addition, thermal foam 136 is configured to prevent the battery from contacting hard surfaces (e.g., front frame 116) when the battery 114 expands or when the electronic device 100 is subjected to an impact force (e.g., dropped to the ground).

[0037] Electronic device 100 also includes various thermal interface materials (TIMs), including TIMs 136 and 138 for thermal management. For example, TIMs may be positioned close to thermal components (e.g., system-on-chip (SoC) or other integrated circuit devices) mounted on the MLB.

[0038] The rear frame 124 comprises a metallic material (e.g., magnesium) and can be used as a heat sink to conduct heat toward the housing 108. The rear frame 124 is a magnetizable component and can be used for magnetic mounting. For example, the rear frame 124 is positioned within the housing 108 near the circular end of the housing 108 (e.g., the second end 106 of the electronic device 100). When the electronic device 100 is magnetically coupled to the mounting device, the rear frame 124 is attracted to a magnet in the mounting device, and the magnetic force holds a portion of the convex, curved outer surface of the circular end against the mounting device. This will be described in further detail below.

[0039] Magnetic shielding 120 protects MLB 118 from the magnetic forces acting on the rear frame 124 by the magnetic mounting device. A plunger assembly 122 is positioned between the magnetic shielding and the rear frame 124 to allow a user to press button 126 to trigger a function performed by MLB 118, which is accessible via the center point of the circular end of housing 108. For example, plunger assembly 122 shifts the user input (pressing force) from the plane of button 126 to the plane of MLB 118 (e.g., when the user presses button 126, plunger assembly 122 presses against the center button on MLB 118).

[0040] Figure 2The illustration shows a front elevation view of the electronic device in Figure 1. The front element 110 is illustrated as having a first portion 200 (e.g., an upper portion), a second portion 202 (a lower portion), and a third portion 204 (e.g., a lens cover), which is surrounded by the first portion 200 and the second portion 202. The first portion 200 and the second portion 202 together form a ring shape, wherein the third portion 204 is concentrically located in the middle of the ring shape.

[0041] In an embodiment, the first portion 200 may be polycarbonate having a specific color mixture (e.g., black, gray, blue). The first portion 200 is IR-transparent and is located in front of an IR illuminator (e.g., an IR LED) that can be used for night vision. Any suitable number of IR illuminators can be implemented, including 1, 2, 3, 4, etc. In the example described herein, the electronic device 100 includes six IR LEDs disposed behind the first portion 200. The first portion 200 also defines a microphone aperture (e.g., aperture 206) aligned with an audio sensor disposed within the housing 108 behind the first portion 200. Additionally, a status LED 208 may be disposed within the first portion 200 (e.g., as part of the first portion 200, or positioned within the aperture defined by the first portion) and configured to provide light in a pattern and / or color corresponding to the operating state of the electronic device 100.

[0042] The second portion 202 is also IR-transparent and is positioned in front of the PIR sensor. In various aspects, the second portion 202 may include any suitable IR-transparent material, including high-density polyethylene (HDPE). Furthermore, the second portion 202 may include a lens pattern (e.g., a Fresnel lens) on the back of the second portion 202 that can be used by the PIR sensor. The third portion 204 is transparent to visible light and is aligned with the camera module to enable the camera module to capture images and / or video of the scene. In various aspects, the front element 110 may include a fourth portion 210 that is IR-opaque and surrounds the periphery of the third portion 204 to block IR light spots (e.g., IR light traveling through the first portion 200 cannot enter the camera lens of the camera module via the third portion 202). Figure 2 The diagram also illustrates a cable 212 connected to the electronic device 100, which can be configured to transmit signals between the electronic device 100 and additional electronic devices (e.g., accessory devices, power supplies).

[0043] In some aspects, one or both of the first portion 200 and the second portion 202 of the front element 110 may include a tapered thickness (e.g., a thickness from front to back). For example, the second portion may have a greater thickness (e.g., in the range of 0.64 mm to 0.7 mm) toward the left and right sides as illustrated, and a smaller thickness (e.g., in the range of 0.55 mm to 0.63 mm) in the central region aligned with the PIR sensor (e.g., near the dashed line).

[0044] Figure 3 The diagram shows Figure 2 A cross-sectional view of the electronic device 100 taken along line 3-3 is shown. In the illustrated example, the electronic device 100 is shown in an assembled state. The camera module (e.g., camera module 300) includes a camera lens 302 aligned (e.g., coaxial) with the longitudinal axis 102 of the electronic device 100. In this way, the camera lens 302 is centered within the housing 108 of the electronic device 100. Furthermore, the camera lens 302 is aligned with the third portion 204 of the front element 110. The camera module 300 also includes a PIR sensor 304 aligned with the second portion 202 of the front element 110. In addition, the camera module 300 includes a PCB (e.g., camera board 306) having one or more integrated circuits and sensors, including an image sensor for recording images of the scene captured by the camera lens 302.

[0045] As described above, battery 114 is positioned between intermediate frame 112 and front frame 116. Furthermore, thermal foam 136 protects battery 114 from contact with the hard surface of front frame 116. On one side of housing 108 (e.g., the bottom surface in the figure), housing 108 includes a perforation 132 that allows audio waves from speaker module 130 to pass through and reach the environment surrounding electronics 100. Proximity to the perforation 132, housing 108 includes a recessed area configured to accommodate a connection mechanism for cables (e.g., cable 212). The connection mechanism may be a coupler 308, which will combine... Figure 4 The coupler 308 is described in more detail. The recessed area is located between the through hole 132 and the threaded insert 310, which is configured to connect to a mounting structure (e.g., a tripod, a desktop stand).

[0046] Also illustrated is a plunger subassembly 122 disposed between the rear frame 124 and the magnetic shield 120. The plunger subassembly 122 is axially aligned with the button 126. The button 126 is formed via a two-shot molding technique that chemically bonds two different materials together. The outer portion 312 of the button 126 is a rigid material (e.g., hard plastic) and can substantially match the material of the housing 108. The inner portion 314 of the button 126 is a flexible material (e.g., silicone, thermoplastic elastomer (TPE), thermoplastic polyurethane (TPU)) and is adhered to the housing 108 to establish a water-proof seal. The inner portion 314 includes one or more ribs 316 that abut against the outer surface of the rear frame 124 and help maintain a water seal when the user presses the outer portion 312 of the button 126. In this example, the rear frame 124 includes a substantially flat area on its outer surface that is configured to receive the button 126. This planar area provides structural support for button 126, especially when the user presses button 126. In addition, the diameter of button 126 is significantly larger than the diameter of the hole in the rear frame 124 to prevent button 126 from being excessively displaced and damaging the water seal when the user presses button 126.

[0047] In various aspects, the PIR sensor 304 includes a mount 318, which can be any suitable material including high-temperature nylon. The mount 318 is used to define the sensor-to-lens distance between the PIR sensor and a lens (e.g., a Fresnel lens) implemented on the second portion 202 of the front element 110. Using the mount 318, the PIR sensor 304 is directly mounted to the camera board 306. In this way, both the PIR sensor 304 and the image sensor of the camera module 300 are mounted on the same PCB (e.g., camera board 306). One challenge that arises when implementing the mount 318 is that the leads of the PIR sensor 304 act as antennas and capture noise caused by stray electromagnetic interference (EMI) or other radiation. To prevent noise, a PIR shield 320 is disposed around the base of the PIR sensor 304, the leads of the PIR sensor 304, and the mount 318. In various aspects, the PIR shield 320 has a tubular shape (e.g., a cylinder) and comprises a metal material with a plating (e.g., copper-nickel). However, the PIR shield 320 can have any suitable cross-sectional shape corresponding to the cross-sectional shape of the PIR sensor 304. The PIR shield 320 contacts the sidewall of the PIR sensor 304 and is mounted (e.g., soldered) to the camera plate 306. In this way, the PIR shield 320 covers the leads of the PIR sensor 304 and grounds the sidewall of the PIR sensor to the camera plate 306. Additional grounding and shielding can be added in the form of a conductive adhesive positioned on the back of the PIR sensor 304 (e.g., between the PIR sensor 304 and the support 318). Grounding and shielding the PIR sensor 304 in this way significantly reduces the impact of noise on the performance of the PIR sensor 304.

[0048] Another challenge in mounting the PIR sensor 304 and the image sensor of the camera module 300 onto the same PCB is thermal management. To prevent heat from the image sensor from reaching the PIR sensor 304, the camera board 306 includes a cutout between the sensors. This cutout can extend in a direction substantially orthogonal to the line connecting the PIR sensor 304 and the image sensor. Therefore, the cutout mitigates changes in the temperature gradient of the camera board 306 caused by heat generated by the image sensor, which helps protect the PIR sensor 304 from rapid changes in the temperature gradient of the camera board 306.

[0049] continue, Figure 4 The diagram shows Figure 3 The cross-sectional view of the electronic device shows an enlarged view of the portion of the cable attachment coupled to the electronic device. This enlarged view shows... Figure 1-2The connector subassembly 128 is part of the coupler 308. The coupler 308 is held in a recessed region of the housing 108 by one or more magnets. For example, one or both of the coupler 308 and the electronic device 100 may include magnets. In the illustrated example, the coupler 308 includes a coupler magnet 400, and the electronic device 100 includes a connector magnet 402. These magnets 400 and 402 are aligned to provide sufficient magnetic force to maintain an electrical connection between the pins on the coupler 308 and the electrical contacts on the electronic device 100. When assembled to the electronic device 100, the coupler 308 defines an acute angle between the cable 212 and the side outer surface 404 of the housing 108. This acute angle is defined by an overmold 406 that provides strain relief. The coupler 308 also includes an undermold 408 that provides strain relief and also holds the coupler magnet 400, the wires of the cable 212, and the pins (e.g., Figure 12 The spring pins shown are held together. Additionally, coupler 308 includes a pin retainer 410 that holds the pins together with a predetermined spacing between them. Coupler 308 also includes a cover material 412, which can be any suitable material (e.g., silicone, polyester film) that is non-conductive, corrosion-resistant, and protects the coupler magnet 400 from environmental factors (e.g., air, moisture). Furthermore, coupler 308 includes a housing 414 that acts as a shell for the coupler 308 to house its components.

[0050] Although the illustrated example shows magnets in both coupler 308 and connector subassembly 128, some implementations may include a single magnet. For example, coupler subassembly 128 may include a ferromagnetic component (e.g., a magnetizable metal) instead of coupler magnet 400, wherein the ferromagnetic component is attracted to connector magnet 402 in connector subassembly 128 to magnetically retain coupler 308 to connector subassembly 128. In another example, connector subassembly 128 may include a ferromagnetic component (e.g., a magnetizable metal) instead of connector magnet 402, wherein the ferromagnetic component in connector subassembly 128 is magnetically attracted to coupler magnet 400 in coupler 308 to magnetically retain coupler 308 to connector subassembly 128.

[0051] Figure 5An example embodiment of the electronic device in FIG1 coupled to a mounting device is illustrated. The electronic device 100 is illustrated in an unmounted state 500-1 and an mounted state 500-2. The electronic device 100 is configured to be magnetically coupled to the mounting device 502, which avoids the need for mechanical fasteners that require additional components, manufacturing costs, and additional user interaction. Instead, a user can place the electronic device 100 on the mounting device 502 such that the protruding curved outer surface 504 of the first end 104 abuts against the mounting surface 506 of the mounting device 502. A magnet disposed within the mounting device 502 (e.g., behind the mounting surface 506) provides a magnetic force that attracts the rear frame 124 inside the housing 108 of the electronic device 100 and magnetically holds the electronic device 100 on the mounting device 502 in the mounted state. Because the circular end of the electronic device 100 is magnetically mounted to the mounting device 502, the electronic device 100 is pivotally movable relative to the mounting device 502, such that the outer surface of the circular end (e.g., the protruding curved outer surface 506) slides against the mounting surface 506 of the mounting device 502.

[0052] Figure 6 The illustration shows an isometric view of the electronic device 100 coupled to the mounting device 502 and tilted downwards. In the illustrated example, the electronic device 100 is tilted downwards relative to the mounting device 502.

[0053] Figure 7 The diagram shows Figure 6 The electronic device 100 is coupled to the mounting device in the right view. Coupler 308 defines an acute angle 700 pointing towards the front of the electronic device 100 (e.g., front element 110), wherein the acute angle 700 is defined between the longitudinal axis 702 of a portion of the cable 212 connected to the coupler 308 and the outer side surface 404 of the housing 108 near the cable 212. When the electronic device 100 is tilted downward relative to the mounting device 502, the coupler 308 enables the electronic device 100 to tilt downward more significantly relative to the mounting device 502 based on the acute angle 700. For example, a larger angle between the cable 212 and the outer side surface 404 of the electronic device 100 will cause the cable 212 or the coupler 308 to contact the mounting device 502 and reduce the amount of downward tilt through the electronic device 100.

[0054] In all aspects, the acute angle 700 is generally in the range of 15 to 30 degrees, including 25 degrees. Compared to conventional camera equipment that defines the orthogonal angle between the outer surfaces of the cable and the housing, the acute angle 700 of the coupler 308 provides an increased range of tilt for the electronics 100 relative to the mounting device 502. The coupler 308 is attached to the bottom surface of the electronics 100 to reduce the possibility of water ingress in outdoor environments.

[0055] Figure 8 The diagram shows Figure 6 The electronic device shown is a cross-sectional view taken along line 8-8. In the illustrated example, mounting device 502 includes a back surface 800 that defines a plane 802 (e.g., the xy plane indicated by dashed lines) and is configured to attach to a surface (e.g., a wall, table, or inclined surface). Mounting device 502 includes a magnet 804 aligned with a mounting support 806 having a mounting surface 506. Furthermore, magnet 804 and mounting support 806 are axially aligned because they share a common axis (e.g., a central axis 808).

[0056] Due to the architecture of the electronic device 100 coupled to the mounting device 502, the electronic device 100 is capable of pivoting about a pivot point located within the housing 108. To pivot in this manner, a protruding curved outer surface 504 is slidably movable across a mounting surface 506, which is a concave surface substantially matching the curvature of the protruding curved outer surface 504 of the housing 108. When the user tilts the electronic device 100 downward relative to the mounting device 502, the coupler 308 attached to the electronic device 100 moves with the electronic device 100 and approaches the surface of the front cover 810 of the mounting device 502. As described above, because the coupler 308 is angled toward the front of the electronic device 100 (e.g., the first end 104), the downward tilt angle 812 of the electronic device 100 (e.g., the angle between the longitudinal axis 102 of the electronic device 100 and the central axis 808 of the mounting device 502) is greater than that of conventional camera devices with cable connectors forming an approximately orthogonal angle to the camera housing. Therefore, the downward tilt angle 812 can reach approximately 60 degrees. The increased downward tilt angle 812 enables the electronic device 100 to have a downward viewing angle sufficient to observe the ground near the wall to which the mounting device 502 is attached, regardless of the height at which the electronic device 100 is mounted to the wall. Thus, the maximum downward viewing angle does not vary based on the height of the electronic device 100. In one example, whether the electronic device 100 is mounted at 6 feet (1.829 meters) or 16 feet (4.877 meters), the electronic device 100 is able to capture an image of a package on the ground below the electronic device 100, which is at least 6.5 inches (0.165 meters) from the wall.

[0057] Figure 9A This is a front right perspective view of the installation device according to some implementation methods. Figure 9B It is based on some implementation methods from Figure 9A The left rear perspective view of the mounting device. The mounting device 502 includes a front cover 810 and a mounting surface 506. The mounting surface 506 may be flexible and recessed to accommodate the components shown in Figures 1 to 12. Figure 8 The continuously protruding curved outer surface 504 of the electronic device 100 (e.g. Figure 8 (as shown) is part of it.

[0058] continue, Figure 10 It is based on some implementation methods from Figure 9A An exploded view of the mounting device. In the illustrated example, the mounting device 502 includes a front cover 810, a mounting support 806 having a mounting surface 506, a magnet 804, an adhesive 1000, and a rear support 1002. In some aspects, the front cover 810, the mounting support 806, the magnet 804, and the rear support 1002 are coaxially aligned because they share a common axis (e.g., a central axis 808). Furthermore, the front cover 810 and the mounting support 806 each have a disc-shaped shape centered on the central axis 808. The mounting surface 506 of the mounting support 806 has a generally circular periphery. Additionally, the mounting surface 506 is a flexible material to provide cushioning between the electronic device 100 and the magnet 804, and to absorb impact forces when the electronic device 100 is mounted to the mounting device 502. The magnet 804, adhesive 1000, and rear support 1002 may have any suitable shape and size that is sufficient to be accommodated within or covered by the front cover 810.

[0059] Figure 11 This is a bottom plan view of an electronic device from FIG1 according to some embodiments. In the illustrated example, the electronic device 100 includes a threaded insert 310 for mechanically attaching the electronic device 100 to a mounting structure (e.g., a tripod, desktop stand). Additionally, a through-hole 132 is included, and the through-hole 132 connects to a speaker (e.g., a speaker located within the housing 108 of the electronic device 100). Figure 3 The speaker module 130 is aligned with the housing. A perforation 132 allows audio waves generated by the speaker module 130 to pass through. The housing 108 also defines an aperture 1100 that provides contact with an input / output (I / O) port. Figure 1-2 This is a portion of the connector subassembly 128 shown. The connector subassembly 128 includes a plurality of contacts 1102 exposed to air and is configured as a contact coupler 308. Figure 11One or more conductive pins on the connector 308 (not shown). In various respects, contact 1102 is part of a printed circuit board (PCB) on the connector subassembly 128 located inside housing 108 (e.g., printed on the PCB). These exposed contacts on the PCB (e.g., contact 1102) reduce the distance between the conductive pins on the PCB and the coupler 308, which reduces losses associated with resistance in the material. Contact 1102 can comprise any suitable conductive and corrosion-resistant material, including gold or gold alloys. Furthermore, any suitable number of individual and separate contacts 1102 (e.g., 2, 3, 4, 5, 6, 7, 8, etc.) can be implemented in any suitable pattern or distribution. In the example shown, contacts 1102 are arranged in two subsets (e.g., rows). A first subset 1104 of contacts 1102 can comprise four contacts in a first row, and a second subset 1106 of contacts can comprise two contacts in a second row.

[0060] In one implementation, the four contacts in the first row can be used to perform USB negotiation and detect the required charging level of the electronic device. The two additional contacts in the second row can be used for accessory detection. For example, different accessory devices (e.g., wall mounts, floodlights, desktop mounts) can have different resistor values, and the electronic device 100 can use these resistor values ​​to determine the information corresponding to the connected accessory device. In this way, the electronic device can perform automatic setup for specific accessory devices without requiring end-user intervention.

[0061] For example, if a third-party solar panel is electrically connected to electronic device 100, electronic device 100 can detect a first resistor value, identify the solar panel based on the first resistor value associated with it, and then adjust functions, including those related to power consumption due to the determination that electronic device 100 is not receiving constant power but is receiving some kind of power. In another example, electronic device 100 can detect a second resistor value associated with a desktop stand, identify the desktop stand based on the second resistor value, and adjust functions based on the connection to the desktop stand. In yet another example, electronic device 100 can detect a third resistor value associated with a wall mount (e.g., mounting device 502), identify the wall mount based on the third resistor value, and adjust functions based on the connection to the wall mount. Such functions for any of the examples described may include: activating a camera module, adjusting (e.g., increasing or decreasing) the brightness of one or more LEDs, adjusting (e.g., increasing or decreasing) the time between motion detection operations, increasing the length of video clip recording to achieve additional recording when additional power is available for consumption, decreasing the length of video clip recording to save power, etc.

[0062] Additionally, the electronic device 100 includes a non-conductive material layer (e.g., a polyester film) 1108 located at the bottom of the recessed area contacted through the aperture 1100. The non-conductive material layer 1108 surrounds each of the contacts 1102 and provides a protective layer for the connector subassembly 128.

[0063] Figure 12 The diagram shows Figure 2 Right front perspective views of the coupler in different assembly states (e.g., views 1200-1, 1200-2 and 1200-3). Figure 13 The diagram shows Figure 12 The coupler is shown in left rear perspective views (e.g., views 1300-1, 1300-2, and 1300-3) in different assembly states. Coupler 308 includes a plurality of pins 1202 (e.g., spring pins) configured to directly abut against contacts of connector subassembly 128 (e.g., ...). Figure 11 (Contact part 1102 in the middle). Figure 12 In the diagram, coupler 308 is illustrated as having four spring pins (e.g., pins 1202), which can be used for, for example, ground, bus voltage, and differential pairs. However, any suitable number of pins 1202 can be implemented for power supply and / or transmission of signals and data. As shown in view 1200-1, coupler 308 includes a retainer (e.g., pin retainer 410) configured to hold pins 1202 together, with a predetermined spacing between pins 1202. Furthermore, coupler magnet 400 is positioned near pin retainer 410 to provide magnetic coupling with electronic device 100, sufficient to maintain contact between pins 1202 and contacts 1102 on connector subassembly 128. As described, coupler 308 is configured to connect wires 1204 of cable 212 to electronic device 100, and particularly to connector subassembly 128 within electronic device 100.

[0064] As shown in View 1200-2, Coupler 308 includes a bottom mold (e.g., bottom mold 408) that holds pin 1202, pin holder 410, and coupler magnet 400 together. As shown in View 1200-3, Coupler 308 includes a top mold (e.g., top mold 406) that provides strain relief for cable 212. In various respects, top mold 406 is a decorative component and is exposed to the surrounding environment. Additionally, a cover material 412 of Coupler 308 forms contact surface 1206, which is substantially flat. In various respects, cover material 412 covers coupler magnet 400 and includes holes through which pin 1202 extends. Cover material 412 is non-conductive and may provide a corrosion-resistant layer to protect coupler magnet 400 from environmental factors such as air and moisture.

[0065] Coupler 308 also includes a housing (e.g., housing 414) that at least partially houses the coupler magnet 400, pins 1202, pin holder 410, undermolded part 408, and a portion of overmolded part 406. In various aspects, coupler 308 includes a head portion 1208 and a tail portion 1210. The head portion 1208 includes housing 414 and components housed within housing 414. The tail portion 1210 includes a portion of the overmolded part 406 covering a portion of the cable 212 and forms an acute angle with respect to the contact surface 1206 of the covering material 412 (e.g., ...). Figure 7 (The acute angle 700 described herein). For example, the tail portion 1210 may form an angle 1212 between the cable 212 and the plane defined by the contact surface 1206 of the head portion 1208. In all respects, the coupler 308 is sized to fit through a 0.5-inch (0.0127m) hole, which is a common size for large drill bits owned by the user.

[0066] exist Figure 13 In view 1300-1, pin 1202 is connected to wire 1204 of cable 212 at connector 1302 and is configured for USB connection. View 1300-2 illustrates bottom mold 408, which covers connector 1302 together with magnet 804 and pin holder 410. View 1300-3 illustrates overmolding 406 and housing 414.

[0067] Figure 14The illustration shows a perspective view of a connector subassembly and an exploded view of some of its components. In the illustrated example, connector subassembly 128 includes a body 1400 forming a rigid structure to which other components of connector subassembly 128 are attached. Connector subassembly 128 also includes an adhesive 1402, one or more wedges 1404, a non-conductive material sheet 1108 (e.g., polyester film), a printed circuit board assembly (PCBA) 1406, an FPC 1408, a connector magnet 402, and a support 1410.

[0068] Adhesive 1402 secures the body 1400 to the inner surface of the housing 108 (e.g., Figure 6 and Figure 11 As shown), it provides a water seal around one or more holes in the housing 108 (e.g., hole 1100 and hole aligned with threaded insert 310). A wedge 1404 is located on the opposite side of the body 1400. Furthermore, the wedge 1404 is disposed on the opposite side of the connector magnet 402. In all respects, the wedge 1404 is oriented in a longitudinal direction substantially orthogonal to the lengthwise direction of the connector magnet 402. When the electronic device 100 is assembled, the wedge 1404 receives compressive forces from one or more internal components of the electronic device 100, which bias the wedge 1404 against a flange on the body 1400, and consequently bias the body 1400 against the inner surface of the housing 108 of the electronic device 100.

[0069] A sheet of non-conductive material 1108 protects PCBA 1406 from debris and water ingress. The non-conductive material 1108 includes a set of holes 1412 aligned with contacts 1102 on PCBA 1406. In this way, contacts 1102 are exposed to air via the holes 1412 in the non-conductive material 1108. An FPC 1408 is attached to PCBA 1406 on the side opposite to the contacts 1102. The FPC 1408 electrically connects PCBA 1406 to the MLB 118 of the electronic device 100. Connector magnet 402 is secured against body 1400 by a bracket 1410. In all aspects, the non-conductive material sheet 1108 is disposed between body 1400 and connector magnet 402 to protect connector magnet 402 from debris and moisture. In addition, connector subassembly 128 may include a spacer 1414 located near a vent hole. Figure 14 (Not shown in the image) Positioning.

[0070] Figures 15A to 18 The diagram shows Figure 11 A different view from the connector subassembly 1102 in Figure 15. Specifically, Figure 15A The diagram shows Figure 14The upper right 3D view of the connector sub-assembly. Figure 15B The diagram shows Figure 15A The lower left perspective view of the connector sub-assembly. Figure 16 yes Figure 14 A front view of the connector sub-component in the image. Figure 17 yes Figure 16 The cross-sectional view of the connector sub-assembly taken along line 17-17. Figure 18 yes Figure 16 The cross-sectional view of the connector sub-assembly along line 18-18.

[0071] like Figure 15A As shown, the FPC 1408 includes a pin array 1500 configured to connect to a spring contact on the MLB 118 of the electronic device 100. In the illustrated example, the pin array 1500 includes eight pins orthogonal to the contact 1102. The array 1500 may include pins for ground, bus voltage, differential pairs for USB negotiation, and two additional ground pins. However, any suitable number of pins can be implemented in the array 1500.

[0072] like Figure 15B As illustrated, connector subassembly 128 defines a first recessed region (e.g., first recess 1502) and a second recessed region (e.g., second recess 1504). The first recess 1502 provides contact with an I / O port of connector subassembly 128 configured to receive coupler 308 and make contact with pins 1202 on coupler 308 (e.g., ...). Figure 13 (As shown) It can be physically connected to the contact portion 1102 on the connector subassembly 128. The second recess 1504 includes a threaded insert 310, which can be used to attach the electronic device 100 to a support structure (e.g., a bracket, tripod). The second recess 1504 also includes a vent located at the bottom of the second recess 1504 to act as an exhaust channel to relieve internal pressure of the electronic device 100. Figure 15A The partition 1416 shown is positioned on the vent. For structural support, the wedges 1404 are each longitudinally positioned in a direction substantially aligned with the line intersecting the center of the first recess 1502 and the center of the second recess 1504.

[0073] Figure 16 The diagram shows Figure 15A A front view of the connector sub-component in the image. Figure 17 The diagram shows Figure 16 The cross-sectional view of the connector sub-assembly along line 17-17. Figure 18 The diagram shows Figure 16 The cross-sectional view of the connector sub-assembly along line 18-18.

[0074] like Figure 17 As shown in the cross-sectional view, the body 1400 of the connector subassembly 128 has a generally L-shaped cross-section. The connector magnet 402 is illustrated as a generally rectangular cross-section having at least one recessed edge 1700, which provides a first portion 1702 of the connector magnet 402 having a first width 1704 and a second portion 1706 of the connector magnet 402 having a second width 1708, the second width 1708 being greater than the first width 1704 of the first portion 1702. The first portion 1702 of the connector magnet 402 is positioned within a hole (e.g., a cutout) in the PCBA 1406 to reduce the size of the connector magnet 402 and the coupler magnet 400 of the coupler 308 when the coupler 308 is coupled to the connector subassembly 128. Figure 13 The distance between the connector magnet 402 and the coupler magnet 400 is approximately equal to the combination of the thickness of the non-conductive material 1108 and the thickness of the covering material 412 of the coupler 308 (as shown). Figure 4 and Figure 12 (As shown).

[0075] Figure 18 The cross-sectional view is along Figure 16 The line 18-18 is cut off, and this line 18-18 intersects with two pins in the pin array 1500 on PCBA 1406. Therefore, when the pins of coupler 308 (e.g., Figure 12 When pin 1202 in the circuit touches contact portion 1102, an electrical signal can be transmitted through PCBA 1406 to FPC 1408, and then to MLB of electronic device 100 (e.g., in...). Figure 1-2 (MLB 118 in the example). By directly implementing the contact 1102 on the PCBA 1406, the distance between the pins and the PCBA 1406 is reduced, which also reduces losses associated with the resistance of the material through which the signal travels. The distance between the pins on the coupler 308 and the PCBA 1406 is equal to the thickness of the contact 1102. Furthermore, the contact 1102 is orthogonal to the pin array 1500, which reduces signal interference between the contact 1102 and the pin array 1500.

[0076] Example computing system

[0077] Figure 19 This is a block diagram of an example system 1900, which includes an example device 1902. The example device 1902 can be implemented as any electronic device (e.g., electronic device 100 in Figure 1), which implements the following as shown in Figures 1 to 1902. Figure 18The aforementioned aspects of a security camera with angled cable attachments that achieves an increased downward viewing angle. Example device 1902 can be any type of computing device, client device, mobile phone, tablet, communication, entertainment, gaming, media playback, and / or other type of device. Furthermore, example device 1902 can be implemented as any other type of electronic device configured for communication over a network, such as a thermostat, doorbell, hazard detector, camera, lighting unit, debugging device, router, border router, connector router, connection device, terminal device, guide, access point, hub, and / or other electronic device. Example device 1902 can be integrated with electronic circuits, microprocessors, memory, input / output (I / O) logic control, communication interfaces and components, and other hardware, firmware, and / or software for communication over a network. Furthermore, device 1902 can be implemented using a variety of components, such as any number of different components and combinations of different components, as further described below.

[0078] Device 1902 includes a communication device 1904 that enables device data 1906 to perform wired and / or wireless communication, such as data communicating between devices in a network, data being received, data scheduled for broadcast, data packets, data synchronized between devices, etc. Device data can include any type of communication data, as well as audio, video, and / or image data generated by applications running on the device. Communication device 1904 can also include transceivers for cellular telephone communication and / or for network data communication. Communication device 1904 can include radio systems for multiple different wireless communication systems. Radio systems can include Wi-Fi, Bluetooth, etc. TM Mobile broadband, Bluetooth Low Energy (BLE), and / or point-to-point IEEE 802.15.4. Each of the different radio systems can include radio devices, antennas, and chipsets implemented for a specific wireless communication technology.

[0079] Device 1902 also includes an input / output (I / O) interface 1908, such as a data network interface that provides connections and / or communication links between the device, data networks (e.g., internal networks, external networks, etc.), and other devices. The I / O interface can be used to couple the device to any type of component, peripheral device, and / or accessory device. The I / O interface also includes a data input port through which any type of data, media content, and / or input can be received, such as user input to the device, and any type of communication data, such as audio, video, and / or image data received from any content and / or data source.

[0080] Device 1902 includes a processing system 1910, which can be implemented at least partially in hardware, such as using any type of microprocessor, controller, etc., that processes executable instructions. The processing system can include integrated circuits, programmable logic devices, components of logic devices formed using one or more semiconductors, and other implementations of silicon and / or hardware, such as processors and memory systems implemented as a system-on-a-chip (SoC). Alternatively or additionally, the device can be implemented using any one or a combination of software, hardware, firmware, or fixed logic circuitry, which can be implemented using processing and control circuitry. Device 1902 may further include any type of system bus or other data and command transmission system coupling various components within the device. The system bus can include any one or a combination of different bus structures and architectures, as well as control lines and data lines.

[0081] Device 1902 also includes computer-readable storage memory 1912, such as a data storage device capable of being accessed by a computing device and providing persistent storage for data and executable instructions (e.g., software applications, modules, programs, functions, etc.). The computer-readable storage memory described herein excludes propagated signals. Examples of computer-readable storage memory include volatile and non-volatile memory, fixed-media devices and removable-media devices, and any suitable memory device or electronic data storage device that maintains data for access by a computing device. Computer-readable storage memory can include various implementations of random access memory (RAM), read-only memory (ROM), flash memory, and other types of storage memory with various memory device configurations.

[0082] Computer-readable storage 1912 provides storage for device data 1906 and various device applications 1914, such as an operating system, which is maintained as a software application along with the computer-readable storage and executed by the processing system 1910. Device applications may also include device managers, such as any form of control application, software application, signal processing control module, device-specific local code, device-specific hardware abstraction layer, etc. In this example, the device applications also include: a smart home application 1916 that implements aspects of a security camera with angled cable attachments, such as when example device 1902 is implemented as electronic device 100 as described herein. Device 1902 also includes a power source 1918, such as a battery 114. Alternating current (AC) power can also be used to charge the device's battery.

[0083] In all respects, at least a portion of the technology described for electronic device 100 can be implemented in a distributed system, such as on a “cloud” 1920 in platform 1922. Cloud 1920 includes and / or represents platform 1922 for services 1924 and / or resources 1926.

[0084] Platform 1922 abstracts the low-level functionality of hardware, such as server devices (e.g., included in service 1924), and / or software resources (e.g., included as resource 1926), and communicatively connects example device 1902 to other devices, servers, etc. Resource 1926 may also include applications and / or data that can be utilized when computer processing is performed on a server remote from example device 1902. Additionally, service 1924 and / or resource 1926 can facilitate subscriber network services, such as via the Internet, cellular networks, or Wi-Fi networks. Platform 1922 can also be used to abstract and scale resources to serve the demand for resource 1926 implemented via the platform, such as in interconnected device implementations with functionality distributed throughout system 1900. For example, this functionality may be implemented partly at example device 1902 and via platform 1922 through the functionality of abstract cloud 1920.

[0085] Here are some examples:

[0086] A system includes an electronic device comprising: a housing having a generally cup-shaped housing and being generally symmetrical about a central axis, the housing having a front end defined by an opening in the housing and a rear end defined by a circular cover of the housing; a front element positioned at the front end of the housing and oriented to substantially cover the opening in the housing, the front element having a lens cover; a camera module disposed within the housing and aligned with the lens cover of the front element; a magnetizable member positioned within the housing near the rear end of the housing, the magnetizable member being configured to magnetically couple the electronic device to a mounting device; and a recessed region located on a side of the housing and including a substantially flat surface and a plurality of contacts that are conductive and exposed through the substantially flat surface. The system may further include a coupler having a contact surface configured to contact a substantially flat surface, the coupler being attached to a cable and configured to removably connect the cable to an electronic device via a recessed area, the coupler being configured to define an acute angle between the cable and the contact surface, the coupler causing the cable to extend in a direction toward the front end of the housing to increase the downward tilt angle of the electronic device relative to the mounting device.

[0087] The coupler may include a head portion configured to be positioned within a recessed area. The coupler may also include a tail portion configured to cause the cable to extend at an acute angle in a direction toward the front end of the housing.

[0088] The coupler may include a coupler magnet positioned within the head portion of the coupler and close to the contact surface of the coupler, and the coupler magnet may be configured to magnetically attract ferromagnetic components disposed within the housing of the electronic device to magnetically secure the coupler to a substantially flat surface of the recessed area.

[0089] A ferromagnetic component that can be placed inside the casing of an electronic device is a connector magnet.

[0090] Ferromagnetic components that can be located inside the casing of electronic devices are magnetizable metals.

[0091] The connector subassembly may include a connector magnet disposed within the housing and on a substantially flat surface near the recessed area, and the connector magnet may be configured to magnetically attract ferromagnetic components disposed within the head portion of the coupler to magnetically secure the coupler to the connector subassembly.

[0092] The ferromagnetic component that can be placed inside the coupler body is a magnetizable metal.

[0093] The multiple contacts may include: a first subset of contacts that can be used for Universal Serial Bus negotiation; and a second subset of contacts that can be used for accessory detection.

[0094] Multiple contacts may be part of a printed circuit board (PCB) located within the housing.

[0095] Each of the multiple contacts may include gold or a gold alloy.

[0096] Acute angles can generally range from 15 to 30 degrees.

[0097] The electronic device may further include a mounting device. This mounting device may have a central axis. The downward tilt angle is defined by the central axis of the housing relative to the central axis of the mounting device.

[0098] The electronic device may further include: a camera board disposed within the housing. A camera module may be mounted on the camera board. The electronic device may further include: a passive infrared PIR sensor mounted on the camera board and aligned with the infrared-transparent portion of the front element near the lens cover.

[0099] The electronic device may further include a support between the PIR sensor and the camera plate. The support may be configured to define a sensor-to-lens distance between the PIR sensor and a lens implemented on a portion of the front element aligned with the PIR sensor.

[0100] The electronic device may further include a PIR shield having a generally tubular shape. The PIR shield may be disposed around the base of the PIR sensor, the leads of the PIR sensor, and the support to provide grounding for the sidewalls of the PIP sensor and to provide shielding for the leads of the PIMR sensor.

[0101] in conclusion

[0102] Although aspects of a security camera with an angled cable attachment that implements an increased downward viewing angle have been described using feature- and / or method-specific language, the subject matter of the appended claims is not necessarily limited to the specific features or methods described. Rather, specific features and methods are disclosed as exemplary embodiments of the claimed security camera that implements an increased downward viewing angle with an angled cable attachment, and other equivalent features and methods are intended to fall within the scope of the appended claims. Furthermore, various different aspects have been described, and it should be understood that each described aspect can be implemented independently or in combination with one or more other described areas.

Claims

1. A system for providing a compact camera, the system comprising: An electronic device, the electronic device comprising: The housing has a generally cup-shaped shell and is generally symmetrical about a central axis, and has a front end defined by an opening in the shell and a rear end defined by a circular cover of the shell; A front element, which is positioned at the front end of the housing and oriented to cover the opening of the housing, the front element having a lens cover; A camera module, which is disposed within the housing and aligned with the lens cover of the front element; A magnetizable member, positioned within the housing near its rear end, the magnetizable member being configured to magnetically couple the electronic device to a mounting device; and A recessed region, located on a side of the housing, comprising a flat surface and a plurality of conductive contacts exposed through the flat surface; and A coupler having a contact surface configured to contact the flat surface, the coupler being attached to a cable and configured to removably connect the cable to the electronic device via the recessed area, the coupler being configured to define an acute angle between the cable and the contact surface, the coupler causing the cable to extend in a direction toward the front end of the housing to increase the downward tilt angle of the electronic device relative to the mounting device.

2. The system according to claim 1, wherein, The coupler includes: The head portion is configured to be positioned within the recessed area; and The tail portion is configured such that the cable extends at the acute angle in a direction toward the front end of the housing.

3. The system according to claim 2, wherein: The coupler includes a coupler magnet positioned within the head portion of the coupler and close to the contact surface of the coupler; and The coupler magnet is configured to magnetically attract ferromagnetic components disposed within the housing of the electronic device to magnetically secure the coupler to the flat surface of the recessed region.

4. The system according to claim 3, wherein, The ferromagnetic component disposed within the housing of the electronic device is a connector magnet.

5. The system according to claim 3, wherein, The ferromagnetic component located within the housing of the electronic device is a magnetizable metal.

6. The system according to claim 2, wherein: The electronic device includes a connector sub-assembly, the connector sub-assembly including a connector magnet disposed within the housing and near the flat surface of the recessed region; and The connector magnet is configured to magnetically attract ferromagnetic components disposed within the head portion of the coupler to magnetically secure the coupler to the connector subassembly.

7. The system according to claim 6, wherein, The ferromagnetic component disposed within the body of the coupler is a magnetizable metal.

8. The system according to any one of claims 1-7, wherein, The plurality of contact portions include: A first subset of the plurality of contacts, the first subset being capable of being used for Universal Serial Bus negotiation; and A second subset of the plurality of contact portions, which can be used for accessory detection.

9. The system according to any one of claims 1-7, wherein, The plurality of contacts are part of a printed circuit board (PCB) disposed within the housing.

10. The system according to any one of claims 1-7, wherein, Each of the plurality of contacts comprises gold or a gold alloy.

11. The system according to any one of claims 1-7, wherein, The acute angle is in the range of 15 degrees to 30 degrees.

12. The system according to any one of claims 1-7, further comprising the installation device, wherein, The mounting device has a central axis, and the downward tilt angle is defined by the central axis of the housing relative to the central axis of the mounting device.

13. The system according to any one of claims 1-7, further comprising: A camera board, wherein the camera board is disposed within the housing, and the camera module is mounted to the camera board; and A passive infrared PIR sensor is mounted on the camera plate and aligned with the infrared-transparent portion of the front element near the lens cover.

14. The system of claim 13, further comprising: A support between the PIR sensor and the camera plate, wherein the support is configured to define a sensor-to-lens distance between the PIR sensor and a lens implemented on a portion of the front element aligned with the PIR sensor.

15. The system of claim 14, further comprising: A PIR shield, having a generally tubular shape, is disposed around the base of the PIR sensor, the leads of the PIR sensor, and the support, to provide grounding to the sidewalls of the PIR sensor and to provide shielding for the leads of the PIR sensor.

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