Display panel, preparation method thereof and display device

Abstract

Embodiments of the present application provide a display panel, a preparation method thereof and a display device. The display panel has an opening area, an isolation area and a display area; the display area surrounds the opening area, and the isolation area is located between the opening area and the display area; the display panel comprises a back plate, a cathode layer, a light-emitting layer and an isolation structure which are arranged on the same side of the back plate; the light-emitting layer is arranged between the back plate and the cathode layer; the isolation structure is located in the isolation area; the cathode layer and the light-emitting layer extend from the display area to the isolation area and are disconnected at the isolation structure; the isolation structure comprises a first isolation part and a second isolation part which are stacked in a direction away from the back plate, and the second isolation part is arranged on a side of the first isolation part away from the back plate; the width of the second isolation part is greater than the width of the first isolation part, and the orthographic projection of the second isolation part on the back plate covers the orthographic projection of the first isolation part on the back plate, so that the cathode layer and the first isolation part do not contact, and the occurrence of encapsulation failure caused by the conduction of the cathode layer at the isolation structure is avoided.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] In related technologies, a metal isolation structure is typically placed around the display area opening (AA hole) of the display panel to separate the light-emitting layer and the cathode layer. The light-emitting layer is made of organic materials. The metal isolation structure effectively isolates the light-emitting layer, preventing moisture from entering the display area (AA area) along the organic material under reliable high-temperature and high-humidity static conditions. Reliability refers to the verification of relevant functionalities through simulating the application of the product under customer and real working conditions, thereby ensuring that the product meets the customer's final requirements. The cathode layer in the display panel is a metal layer, usually formed by sputtering. During the sputtering process, a shadow mask phenomenon sometimes occurs. This phenomenon causes part of the cathode layer to overlap with the metal isolation structure, and cathode layers that should be disconnected become interconnected. Display panels prepared in this way will generate an electric field during operation and testing. Metal ions and moisture between the film layers will produce a galvanic cell reaction, corroding the isolation structure and the anti-oxidation film layer (encapsulation layer), causing encapsulation failure. Summary of the Invention

[0003] The purpose of this invention is to provide a display panel, its manufacturing method, and a display device to avoid encapsulation failure caused by the cathode layer becoming conductive at the isolation structure. The specific technical solution is as follows:

[0004] An embodiment of the first aspect of this application provides a display panel having an opening area, an isolation area, and a display area; the display area surrounds the opening area, and the isolation area is located between the opening area and the display area; the display panel includes a back plate and a cathode layer, a light-emitting layer, and an isolation structure disposed on the same side of the back plate; the light-emitting layer is disposed between the back plate and the cathode layer; the isolation structure is located in the isolation area; the cathode layer and the light-emitting layer extend from the display area to the isolation area and are disconnected at the isolation structure; the isolation structure includes a first isolation portion and a second isolation portion stacked along a direction away from the back plate, the second isolation portion being disposed on the side of the first isolation portion away from the back plate; the width of the second isolation portion is greater than the width of the first isolation portion, and the orthographic projection of the second isolation portion on the back plate covers the orthographic projection of the first isolation portion on the back plate, so that the cathode layer and the first isolation portion do not contact each other.

[0005] In some embodiments of this application, the first isolation portion includes a first lower layer, a first middle layer, and a first upper layer that are sequentially stacked along a direction away from the back plate;

[0006] The second isolation section includes a second lower sublayer, a second middle sublayer, and a second upper sublayer, which are sequentially stacked in a direction away from the back plate;

[0007] The second lower sublayer is disposed on the side of the first upper sublayer away from the backplate.

[0008] In some embodiments of this application, each side of the first neutron layer is recessed inward by a first recess distance relative to the first lower sublayer and the first upper sublayer to form a first undercut structure, and the longitudinal section of the first isolation portion is I-shaped.

[0009] Each side of the second neutron layer is recessed inward by a second recess distance relative to the second lower sublayer and the second upper sublayer to form a second undercut structure, and the longitudinal section of the second isolation part is I-shaped.

[0010] In some embodiments of this application, the difference between the width of the first isolation portion and the width of the second isolation portion is in the range of 0.2-0.5 μm; the value range of the first indentation distance is 0.3-0.5 μm; and the value range of the second indentation distance is 0.3-0.5 μm.

[0011] In some embodiments of this application, the widths of the first lower sub-layer and the first upper sub-layer are equal;

[0012] The widths of the second lower sublayer and the second upper sublayer are equal;

[0013] The width of the first lower sub-layer is greater than the width of the second lower sub-layer.

[0014] The width of the second neutron layer is greater than the width of the first neutron layer.

[0015] In some embodiments of this application, the cathode layer is formed using a sputtering process.

[0016] In some embodiments of this application, a portion of the light-emitting layer and a portion of the cathode layer are sequentially stacked and cover the second upper sublayer;

[0017] The portion of the light-emitting layer is not in contact with the remaining portion of the light-emitting layer;

[0018] The portion of the cathode layer is not in contact with the remaining portion of the cathode layer;

[0019] The display panel further includes an encapsulation layer that covers the isolation structure, the light-emitting layer, and the cathode layer.

[0020] The second aspect of this application provides a method for manufacturing a display panel, used to manufacture the display panel in any embodiment of the first aspect, comprising:

[0021] Preparation of backplate;

[0022] A first isolation transition structure is fabricated on the backplate;

[0023] Prepare a planarization layer;

[0024] Etching the planarization layer;

[0025] A second isolation transition structure is fabricated on the first isolation transition structure;

[0026] Remove the planarization layer and form a second undercut structure;

[0027] The first undercut structure is etched out to form an isolation structure.

[0028] In some embodiments of this application, the method for manufacturing the display panel further includes:

[0029] After the isolation structure is formed, the light-emitting layer, the cathode layer, and the encapsulation layer are prepared sequentially.

[0030] An embodiment of the third aspect of this application provides a display device including the display panel in any embodiment of the first aspect.

[0031] Beneficial effects of the embodiments of the present invention:

[0032] The display panel of this application has an opening area, an isolation area, and a display area; the display area surrounds the opening area, and the isolation area is located between the opening area and the display area; the display panel includes a back plate and a cathode layer, a light-emitting layer, and an isolation structure disposed on the same side of the back plate; the light-emitting layer is disposed between the back plate and the cathode layer; the isolation structure is located in the isolation area; the cathode layer and the light-emitting layer extend from the display area to the isolation area and are disconnected at the isolation structure; the isolation structure includes a first isolation portion and a second isolation portion stacked in a direction away from the back plate, the second isolation portion being disposed on the side of the first isolation portion away from the back plate; the width of the second isolation portion is greater than the width of the first isolation portion, and the orthographic projection of the second isolation portion on the back plate covers the orthographic projection of the first isolation portion on the back plate, so that when the cathode layer is prepared, the second isolation portion will play a shielding role, so that the cathode layer and the first isolation portion do not contact each other. Although some cathode layer material may overlap with the second isolation part during the fabrication process, this part of the cathode layer material is not connected to the fabricated cathode layer, and the cathode layer and the first isolation part are not in contact. Therefore, the cathode layer can be effectively disconnected by the isolation structure. During operation and testing, the cathode layer will not conduct at the isolation structure to generate an electric field, which effectively reduces the corrosion of the isolation structure and the encapsulation layer, thereby avoiding the encapsulation failure caused by the cathode layer conducting at the isolation structure.

[0033] The display panel fabricated according to the method of this application utilizes a second isolation portion to shield the cathode layer during fabrication, preventing contact between the cathode layer and the first isolation portion. Although some cathode layer material may overlap the second isolation portion during fabrication, this portion of the cathode layer material is not connected to the fabricated cathode layer, and the cathode layer and the first isolation portion do not contact each other. Therefore, the cathode layer can be effectively disconnected by the isolation structure. During operational testing, the cathode layer will not conduct electricity at the isolation structure, effectively reducing the corrosion of the isolation structure and encapsulation layer, thus preventing encapsulation failure caused by cathode layer conduction at the isolation structure. Furthermore, no new equipment or materials are required; adjustments to the existing processing technology are sufficient, making the process simple and easy to implement.

[0034] The display device of this application includes a display panel according to any embodiment of the first aspect. The cathode layer is effectively disconnected by the isolation structure. During operation and testing, the cathode layer will not conduct at the isolation structure to generate an electric field, which effectively reduces the corrosion of the isolation structure and the encapsulation layer, thereby avoiding the encapsulation failure caused by the cathode layer conducting at the isolation structure.

[0035] Of course, implementing any product or method of the present invention does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0037] Figure 1 This is a top view of a display panel in the related technology;

[0038] Figure 2 for Figure 1 Sectional view at point AA;

[0039] Figure 3 This is a top view of the display panel according to an embodiment of this application;

[0040] Figure 4 for Figure 3 A cross-sectional view of BB with the encapsulation layer removed;

[0041] Figure 5 for Figure 3 Sectional view at BB;

[0042] Figure 6 This is a flowchart illustrating the method for manufacturing a display panel according to an embodiment of this application;

[0043] Figure 7 This is a schematic diagram illustrating the manufacturing process of the display panel according to an embodiment of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] exist Figure 1 and Figure 2 Middle: Display panel 1000; Opening area 1; Isolation area 2; Display area 3; Backplate 4; Cathode layer 5; Metal isolation structure 6; Lower sublayer 61; Neutron layer 62; Upper sublayer 63; Light-emitting layer 7; Encapsulation layer 8;

[0046] exist Figures 3 to 7 middle:

[0047] Display panel 10; opening area 11; isolation area 12; display area 13; back plate 100; cathode layer 200; isolation structure 300; first isolation section 310; first lower sublayer 311; first neutron layer 312; first upper sublayer 313; second isolation section 320; second lower sublayer 321; second neutron layer 322; second upper sublayer 323; light-emitting layer 400; encapsulation layer 500; planarization layer 600; first isolation section transition structure 800; first lower transition layer 810; first middle transition layer 820; first upper transition layer 830; second isolation section transition structure 900; second lower transition layer 910; second middle transition layer 920; second upper transition layer 930. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of the present invention.

[0049] like Figure 1 As shown, the display panel 1000 in the related art has an opening area 1, an isolation area 2 and a display area 3, the display area 3 is arranged around the opening area 1, and the isolation area 2 is arranged between the display area 3 and the opening area 1.

[0050] like Figure 2 As shown, the display panel 1000 includes a backplate 4, a metal isolation structure 6, and a light-emitting layer 7, a cathode layer 5, and an encapsulation layer 8 arranged sequentially in a direction away from the backplate 4. The metal isolation structure 6 is located in the isolation area 2. The light-emitting layer 7 and the cathode layer 5 extend from the display area 3 to the isolation area 2, and the light-emitting layer 7 and the cathode layer 5 are disconnected at the metal isolation structure 6. The encapsulation layer 8 covers the cathode layer 5, the metal isolation structure 6, and the light-emitting layer 7. The metal isolation structure 6 includes a lower sublayer 61, a middle sublayer 62, and an upper sublayer 63 arranged sequentially in a direction away from the backplate 4.

[0051] The metal isolation structure 6 disconnects the light-emitting layer 7, preventing moisture from entering the display area 3 along the light-emitting layer 7 under reliable high-temperature and high-humidity static conditions. The cathode layer 5 in the display panel 1000 is a metal layer; for example, silver can be used to prepare the cathode layer 5. It is typically formed by sputtering, and during the sputtering process, a shadow mask phenomenon occurs, causing part of the cathode layer 5 to overlap with the metal isolation structure 6 (e.g., ...). Figure 2 As shown by the dotted circle in the middle, the cathode layers 5, which should have been disconnected by the metal isolation structure 6, are interconnected. During the operation and testing, the electric field is generated by the conduction. The metal ions and water vapor between the film layers will produce a galvanic cell reaction, which will corrode the metal isolation structure 6 and the anti-oxidation film layer (encapsulation layer 8), causing the encapsulation to fail.

[0052] like Figure 3 As shown, an embodiment of the first aspect of this application provides a display panel 10 having an opening area 11, an isolation area 12 and a display area 13; the display area 13 surrounds the opening area 11, and the isolation area 12 is located between the opening area 11 and the display area 13.

[0053] like Figure 4 As shown, the display panel 10 includes a back plate 100 and a cathode layer 200, a light-emitting layer 400, and an isolation structure 300 disposed on the same side of the back plate 100; the light-emitting layer 400 is disposed between the back plate 100 and the cathode layer 200; the isolation structure 300 is located in the isolation area 12; the cathode layer 200 and the light-emitting layer 400 extend from the display area 13 to the isolation area 12 and are disconnected at the isolation structure 300; the isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 stacked in a direction away from the back plate 100, the second isolation portion 320 being disposed on the side of the first isolation portion 310 away from the back plate 100; the width W2 of the second isolation portion 320 is greater than the width W1 of the first isolation portion 310, and the orthographic projection of the second isolation portion 320 on the back plate 100 covers the orthographic projection of the first isolation portion 310 on the back plate 100, so that the cathode layer 200 and the first isolation portion 310 do not contact each other.

[0054] The display panel 10 of this application has an opening area 11, an isolation area 12, and a display area 13; the display area 13 surrounds the opening area 11, and the isolation area 12 is located between the opening area 11 and the display area 13; the display panel 10 includes a back plate 100 and a cathode layer 200, a light-emitting layer 400, and an isolation structure 300 disposed on the same side of the back plate 100; the light-emitting layer 400 is disposed between the back plate 100 and the cathode layer 200; the isolation structure 300 is located in the isolation area 12; the cathode layer 200 and the light-emitting layer 400 extend from the display area 13 to the isolation area 12 and are disconnected at the isolation structure 300; The isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 stacked along the direction away from the back plate 100. The second isolation portion 320 is disposed on the side of the first isolation portion 310 away from the back plate 100. The width W2 of the second isolation portion 320 is greater than the width W1 of the first isolation portion 310. The orthographic projection of the second isolation portion 320 on the back plate 100 covers the orthographic projection of the first isolation portion 310 on the back plate 100. Thus, when the cathode layer 200 is fabricated, the second isolation portion 320 will play a shielding role, so that the cathode layer 200 and the first isolation portion 310 do not come into contact. Although some of the cathode layer 200 material may overlap with the second isolation portion 320 during the fabrication process, this portion of the cathode layer 200 material is not connected to the fabricated cathode layer 200, and the cathode layer 200 and the first isolation portion 310 are not in contact. Therefore, the cathode layer 200 can be effectively disconnected by the isolation structure 300. During operation and testing, the cathode layer 200 will not conduct at the isolation structure 300 to generate an electric field, effectively reducing the corrosion of the isolation structure 300 and the encapsulation layer 500, thereby avoiding encapsulation failure caused by the cathode layer 200 conducting at the isolation structure 300.

[0055] In some embodiments of this application, a first lower sublayer 311, a first neutron layer 312, and a first upper sublayer 313 are stacked to form a first isolation pillar, and a second lower sublayer 321, a second neutron layer 322, and a second upper sublayer 323 are stacked to form a second isolation pillar. The first and second isolation pillars are stacked sequentially along a direction away from the backplate 100 to form an isolation structure 300. The number of isolation structures 300 can be one or more, and all isolation structures 300 can be arranged around the opening area 11.

[0056] In some embodiments of this application, such as Figure 4As shown, the first isolation section 310 includes a first lower sublayer 311, a first neutron layer 312, and a first upper sublayer 313 stacked sequentially in a direction away from the backplate 100; the second isolation section 320 includes a second lower sublayer 321, a second neutron layer 322, and a second upper sublayer 323 stacked sequentially in a direction away from the backplate 100; the second lower sublayer 321 is disposed on the side of the first upper sublayer 313 away from the backplate 100. Specifically, the first lower sublayer 311, the first upper sublayer 313, the second lower sublayer 321, and the second upper sublayer 323 can be made of titanium, and the first neutron layer 312 and the second neutron layer 322 can be made of aluminum.

[0057] It is understandable that the widths of the first isolation section 310 and the second isolation section 320 are the widths of their widest points as projected onto the back plate 100. For example... Figure 3 and Figure 4 As shown, Figure 4 for Figure 3 The cross-sectional view of BB without the encapsulation layer 500 shows that the direction of BB can be perpendicular to the edge of the opening area 11. Figure 3 If the opening area 11 is circular, then the BB direction is its radial direction. Taking the first isolation part 310 as an example, Figure 4 The diagram shows the case where the widths of the first sublayer 311 and the first upper sublayer 313 are equal and greater than the width of the first middle sublayer 312. In this case, the width of the first isolation portion 310 is the width of the first sublayer 311 and the first upper sublayer 313, i.e., W1. When the width of the orthographic projection of the first sublayer 311 on the backplate 100 is greater than the width of the orthographic projection of the first middle sublayer 312 and the first upper sublayer 313 on the backplate 100, the width of the first isolation portion 310 is the width of the first sublayer 311. When the width of the orthographic projection of the first upper sublayer 313 on the backplate 100 is greater than the width of the orthographic projection of the first sublayer 311 and the first middle sublayer 312 on the backplate 100, the width of the first isolation portion 310 is the width of the first upper sublayer 313.

[0058] In some other embodiments of this application, the orthographic projection of the upper surface of the first lower layer 311 onto the back plate 100 can be within the orthographic projection range of its lower surface onto the back plate 100. In this case, the width of the first lower layer 311 is the width of its lower surface, and the same applies to other film layers.

[0059] In some embodiments of this application, such as Figure 4As shown, each side of the first neutron layer 312 is recessed inward by a first recess distance relative to the first lower sublayer 311 and the first upper sublayer 313, forming a first undercut structure. The longitudinal section of the first isolation portion 310 is I-shaped. Each side of the second neutron layer 322 is recessed inward by a second recess distance relative to the second lower sublayer 321 and the second upper sublayer 323, forming a second undercut structure. The longitudinal section of the second isolation portion 320 is I-shaped. Both the first isolation portion 310 and the second isolation portion 320 form an undercut structure, which facilitates the formation of the subsequent encapsulation film. The encapsulation film encapsulates the light-emitting layer 400, which can better disconnect the light-emitting layer 400 (EL layer) at the isolation structure 300, effectively slowing down the diffusion of moisture along the organic layer and improving the service life of the display panel 10.

[0060] In some embodiments of this application, the difference between the width of the first isolation portion 310 and the width of the second isolation portion 320 is in the range of 0.2-0.5 μm. Meeting this range allows the second isolation portion 320 to effectively shield the first isolation portion 310 during the fabrication of the cathode layer 200; and the first isolation portion 310 can provide good support for the second isolation portion 320.

[0061] In some embodiments of this application, the numerical range of the first indentation distance is 0.3-0.5 μm; the numerical range of the second indentation distance is 0.3-0.5 μm.

[0062] In some embodiments of this application, such as Figure 4 As shown, the widths of the first lower sublayer 311 and the first upper sublayer 313 are equal; the widths of the second lower sublayer 321 and the second upper sublayer 323 are equal; the width of the first lower sublayer 311 is greater than the width of the second lower sublayer 321. Equal widths facilitate processing and can be formed in a single etching step.

[0063] In other embodiments of this application, the widths of the first lower sublayer 311 and the first upper sublayer 313 may not be equal; the widths of the second lower sublayer 321 and the second upper sublayer 323 may also not be equal; this application does not limit this.

[0064] In some embodiments of this application, such as Figure 4 As shown, the width of the second neutron layer 322 is greater than the width of the first neutron layer 312. Since the width of the second isolation portion 320 is greater than the width of the first isolation portion 310, and the width of the second neutron layer 322 is greater than the width of the first neutron layer 312, the film layer above it can be better supported while ensuring effective disconnection of the light-emitting layer 400 and the cathode layer 200.

[0065] In some embodiments of this application, the cathode layer 200 can be formed using a sputtering process. The sputtered cathode layer 200 is more uniform and robust.

[0066] In some embodiments of this application, such as Figure 5 As shown, a portion of the light-emitting layer 400 and a portion of the cathode layer 200 are sequentially stacked and cover the second upper sublayer 323; the aforementioned portion of the light-emitting layer 400 does not contact the remaining portion of the light-emitting layer 400; the aforementioned portion of the cathode layer 200 does not contact the remaining portion of the cathode layer 200; the display panel 10 also includes an encapsulation layer 500, which covers the isolation structure 300, the light-emitting layer 400, and the cathode layer 200. The encapsulation layer 500 can be an anti-oxidation film layer, which acts as a barrier against water and oxygen, preventing the display panel 10 from failing due to water and oxygen intrusion.

[0067] The display panel 10 of this application, by fabricating an isolation structure 300, effectively isolates the cathode layer 200, preventing it from overlapping with the isolation structure 300 and thus avoiding encapsulation failure caused by the cathode layer 200 conducting at the isolation structure 300. Furthermore, it better isolates the light-emitting layer 400, thereby improving the display panel 10's resistance to moisture intrusion during reliability testing or normal use, significantly extending the screen's lifespan. The display panel 10 of this application can be an OLED (Organic Light-Emitting Diode) display panel.

[0068] like Figure 6 and Figure 7 As shown, an embodiment of the second aspect of this application provides a method for manufacturing a display panel 10, for manufacturing the display panel 10 in any embodiment of the first aspect, comprising:

[0069] S1. Prepare backplate 100;

[0070] S2. Prepare a first isolation transition structure 800 (SD1 Dep) on the back plate 100;

[0071] S3. Prepare planarization layer 600 (PLN Dep);

[0072] S4, Etch planarization layer 600 (PLN Etch);

[0073] S5. Fabricate a second isolation transition structure 900 (SD2 Dep) on the first isolation transition structure 800;

[0074] S6. Remove the planarization layer 600 and form the second undercut structure;

[0075] S7. Etch out the first undercut structure to form an isolation structure 300.

[0076] In some embodiments of this application, such as Figure 7As shown, the method for preparing the display panel 10 further includes: after forming the isolation structure 300, sequentially preparing the light-emitting layer 400, the cathode layer 200 and the encapsulation layer 500.

[0077] The display panel 10 prepared according to the preparation method of this application has a shielding effect during the preparation of the cathode layer 200, where the second isolation portion 320 acts as a shield, preventing the cathode layer 200 from contacting the first isolation portion 310. Although some material of the cathode layer 200 may overlap the second isolation portion 320 during the preparation process, this portion of the cathode layer 200 material is not connected to the prepared cathode layer 200, and the cathode layer 200 and the first isolation portion 310 do not contact each other. Therefore, the cathode layer 200 can be effectively disconnected by the isolation structure 300. During operation and testing, the cathode layer 200 will not conduct electricity at the isolation structure 300, effectively reducing the corrosion of the isolation structure 300 and the encapsulation layer 500, thereby avoiding encapsulation failure caused by the cathode layer 200 conducting electricity at the isolation structure 300. Furthermore, no new equipment or materials are required; adjustments to the existing processing technology are sufficient, making the process simple and easy to implement.

[0078] Figure 7 This is a schematic diagram of the manufacturing process of the display panel 10 according to an embodiment of this application.

[0079] like Figure 7 As shown in ①, corresponding Figure 6 Step S1: Prepare back plate 100; Step S2: Prepare first isolation transition structure 800 on back plate 100; Step S3: Prepare planarization layer 600.

[0080] The first isolation transition structure 800 includes a first lower transition layer 810, a first middle transition layer 820 and a first upper transition layer 830 stacked sequentially in a direction away from the back plate 100; a planarization layer 600 covers the back plate 100 and the first isolation transition structure 800, and the planarization layer 600 can extend from the display area 13 to the isolation area 12.

[0081] like Figure 7 As shown in ②, corresponding Figure 6 Step S4: Etching the planarization layer 600; Step S5: Preparing the second isolation transition structure 900 on the first isolation transition structure 800.

[0082] The second isolation transition structure 900 includes a second lower transition layer 910, a second middle transition layer 920, and a second upper transition layer 930 sequentially stacked along a direction away from the back plate 100; the first isolation transition structure 800 and the second isolation transition structure 900 can be directly contacted, or other membrane layers can be disposed between the first isolation transition structure 800 and the second isolation transition structure 900, which is not limited in this application; the planarization layer 600 can provide support for the formation of the second isolation transition structure 900.

[0083] like Figure 7 As shown in ③, corresponding Figure 6 In step S6, the planarization layer 600 is removed and a second undercut structure is formed.

[0084] Each side of the second intermediate transition layer 920 is recessed inward relative to the second lower transition layer 910 and the second upper transition layer 930 to form a second isolation portion 320; the longitudinal section of the second isolation portion 320 is I-shaped; the second isolation portion 320 includes a second lower sublayer 321, a second intermediate sublayer 322, and a second upper sublayer 323 arranged sequentially in a direction away from the back plate 100. Specifically, the planarization layer 600 can be removed using an exposure process to form the second undercut structure.

[0085] like Figure 7 As shown in ④, corresponding Figure 6 In step S7, the first undercut structure is etched to form the isolation structure 300.

[0086] Each side of the first intermediate transition layer 820 is recessed inward relative to the first lower transition layer 810 and the first upper transition layer 830 to form a first isolation section 310; the longitudinal section of the first isolation section 310 is I-shaped; the first isolation section 310 includes a first lower layer 311, a first neutron layer 312 and a first upper layer 313 arranged sequentially in a direction away from the back plate 100.

[0087] The first isolation section 310 and the second isolation section 320 constitute the isolation structure 300.

[0088] like Figure 7 As shown in step ⑤, after forming the isolation structure 300, the light-emitting layer 400, the cathode layer 200, and the encapsulation layer 500 are prepared sequentially.

[0089] The cathode layer 200, the light-emitting layer 400, and the isolation structure 300 are disposed on the same side of the back plate 100, with the light-emitting layer 400 disposed between the back plate 100 and the cathode layer 200. The cathode layer 200 can be prepared by sputtering, and the light-emitting layer 400 can be prepared by vacuum evaporation. The isolation structure 300 is located in the isolation region 12. The cathode layer 200 and the light-emitting layer 400 extend from the display region 13 to the isolation region 12 and are disconnected at the isolation structure 300. A portion of the light-emitting layer 400 and a portion of the cathode layer 200 are sequentially stacked and cover the upper sublayer 323. The aforementioned portion of the light-emitting layer 400 does not contact the remaining portion of the light-emitting layer 400. The aforementioned portion of the cathode layer 200 does not contact the remaining portion of the cathode layer 200. The cathode layer 200 and the first isolation portion 310 do not contact each other. The encapsulation layer 500 covers the isolation structure 300, the light-emitting layer 400, and the cathode layer 200.

[0090] An embodiment of the third aspect of this application provides a display device including a display panel 10 of any embodiment of the first aspect.

[0091] The display device of this application includes a display panel 10 according to any embodiment of the first aspect. The cathode layer 200 is effectively disconnected by the isolation structure 300. During operation and testing, the cathode layer 200 will not conduct at the isolation structure 300 to generate an electric field, which effectively reduces the corrosion of the isolation structure 300 and the encapsulation layer 500, thereby avoiding the encapsulation failure caused by the cathode layer 200 conducting at the isolation structure 300.

[0092] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0093] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0094] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that, The display panel has an opening area, an isolation area, and a display area; the display area surrounds the opening area, and the isolation area is located between the opening area and the display area; The display panel includes: a back plate and a cathode layer, a light-emitting layer and an isolation structure disposed on the same side of the back plate; The light-emitting layer is disposed between the back plate and the cathode layer; The isolation structure is located in the isolation area; the cathode layer and the light-emitting layer extend from the display area to the isolation area and are disconnected at the isolation structure; The isolation structure includes a first isolation portion and a second isolation portion stacked together along a direction away from the back plate, wherein the second isolation portion is disposed on the side of the first isolation portion away from the back plate; The longitudinal section of the first isolation part is I-shaped; the longitudinal section of the second isolation part is I-shaped; The width of the second isolation portion is greater than the width of the first isolation portion, and the orthographic projection of the second isolation portion on the back plate covers the orthographic projection of the first isolation portion on the back plate, so that the cathode layer and the first isolation portion do not contact each other; The first isolation section includes a first lower layer, a first neutron layer, and a first upper layer, which are stacked sequentially along a direction away from the back plate; The second isolation section includes a second lower sublayer, a second middle sublayer, and a second upper sublayer, which are sequentially stacked in a direction away from the back plate; The second lower sublayer is disposed on the side of the first upper sublayer away from the backplate; The first lower sublayer, the first upper sublayer, the second lower sublayer, and the second upper sublayer are made of titanium, and the first neutron layer and the second neutron layer are made of aluminum.

2. The display panel according to claim 1, characterized in that, Each side of the first neutron layer is recessed inward by a first recess distance relative to the first lower sublayer and the first upper sublayer to form a first undercut structure; Each side of the second neutron layer is recessed inward by a second recess distance relative to the second lower sublayer and the second upper sublayer to form a second undercut structure.

3. The display panel according to claim 2, characterized in that, The difference between the width of the first isolation portion and the width of the second isolation portion is in the range of 0.2-0.5µm; the value range of the first indentation distance is 0.3-0.5µm; and the value range of the second indentation distance is 0.3-0.5µm.

4. The display panel according to claim 2, characterized in that, The widths of the first lower sub-layer and the first upper sub-layer are equal; The widths of the second lower sublayer and the second upper sublayer are equal; The width of the first lower sub-layer is greater than the width of the second lower sub-layer; The width of the second neutron layer is greater than the width of the first neutron layer.

5. The display panel according to claim 1, characterized in that, The cathode layer is formed using a sputtering process.

6. The display panel according to claim 1, characterized in that, A portion of the light-emitting layer and a portion of the cathode layer are sequentially stacked and cover the second upper sub-layer; The portion of the light-emitting layer does not contact the remaining light-emitting layers; The portion of the cathode layer does not contact the remaining cathode layers; The display panel further includes an encapsulation layer that covers the isolation structure, the light-emitting layer, and the cathode layer.

7. A method for manufacturing a display panel, characterized in that, To prepare the display panel according to claim 1, the following are included: Preparation of backplate; A first isolation transition structure is fabricated on the backplate; Prepare a planarization layer; Etching the planarization layer; A second isolation transition structure is fabricated on the first isolation transition structure; Remove the planarization layer and form a second undercut structure; The first undercut structure is etched out to form an isolation structure.

8. The method for manufacturing a display panel according to claim 7, characterized in that, Also includes: After the isolation structure is formed, the light-emitting layer, the cathode layer, and the encapsulation layer are prepared sequentially.

9. A display device, characterized in that, Includes the display panel as described in any one of claims 1-6.

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