Display device

Abstract

A display device is provided. The display device includes a display panel, a chassis assembly in which the display panel is received, a back cover surrounding at least a portion of the chassis assembly, and a control assembly disposed between the chassis assembly and the back cover and controlling the display panel, wherein a flat portion of a jumper connector included in the control assembly faces the chassis assembly.

Description

Technical Field

[0001] This disclosure relates to display devices, and more particularly to thin display devices. Background Technology

[0002] A display device is an output device that converts electrical information into visual information and displays that visual information to a user. Display devices can include not only television sets (TVs) and monitors, but also portable devices such as laptop computers (PCs), smartphones, and tablet PCs.

[0003] Display devices may include self-emitting display panels such as organic light-emitting diodes (OLEDs) or light-receiving display panels such as liquid crystal displays (LCDs).

[0004] At the same time, many consumers value the design of display devices, leading to a trend towards thinner displays. Various solutions have been conceived to achieve ultra-thin displays. Summary of the Invention

[0005] Technical issues

[0006] This disclosure provides a display device including a slim control component.

[0007] This disclosure also provides a display device that uses components of a control assembly as spacers.

[0008] Technical solution

[0009] A display device according to an embodiment includes a display panel configured to display an image, a rack assembly housing the display panel, a rear cover surrounding at least a portion of the rack assembly, and a power supply assembly disposed between the rack assembly and the rear cover to supply power to the display panel, wherein the power supply assembly includes: a single-sided printed circuit board (PCB) including a circuit surface facing the rear cover and having circuit patterns printed thereon and an insulating surface facing the rack assembly; and a circuit module including a first circuit module disposed on the circuit surface of the single-sided PCB and a second circuit module passing through a first hole in the single-sided PCB.

[0010] The power supply assembly may further include a jumper connector that electrically connects two points of a circuit pattern on a circuit surface and includes a portion of an insulating surface disposed on a single-sided PCB. The height at which the jumper connector protrudes from the circuit surface may be less than or equal to the height at which the second circuit module protrudes from the circuit surface.

[0011] A jumper connector may include a first protrusion and a second protrusion that pass through a second and a third hole in a single-sided PCB and are electrically connected to a circuit pattern, and a flat portion that is connected to the first and second protrusions and disposed on an insulating surface, the flat portion of the jumper connector being able to contact a rack assembly.

[0012] The flat portion of the jumper connector can directly contact the insulating surface.

[0013] The first and second protruding portions of the jumper connector can be arranged to apply a tensile force to the flat portion of the jumper connector.

[0014] The first and second protruding portions of the jumper connector can be bent outward from the flat portion of the jumper connector.

[0015] At least one of the second or third holes may include an elliptical cross-section.

[0016] The major axis of the elliptical cross-section can be parallel to the longitudinal direction of the flat portion of the bridging connector.

[0017] The separation distance between the insulating surface of a single-sided PCB and the rack assembly can be less than or equal to about 1 mm.

[0018] The display device may further include a spacer that contacts and supports the single-sided PCB in contact with at least one of the single-sided PCBs or rack assemblies.

[0019] The spacer may include an elastic material.

[0020] The display device may further include a heat dissipation component that contacts at least one of the single-sided PCBs or circuit modules.

[0021] The heat dissipation component may include a first region that protrudes from the insulating surface toward the rack assembly through a fourth hole in the single-sided PCB.

[0022] The protruding height of the first region can be equal to the thickness of the flat portion of the bridging connector.

[0023] The display device may further include retainer-type spacers disposed in the edge of the single-sided PCB to prevent bending of the single-sided PCB.

[0024] The display device may further include a sub-power assembly through a fifth hole in the single-sided PCB, wherein the height of the sub-power assembly protruding from the single-sided PCB toward the base frame is equal to the thickness of the jumper connector.

[0025] The rack assembly may include: a top frame including an opening that exposes the display panel; a middle frame supporting the side of the display panel; and a bottom frame supporting the lower part of the display panel, wherein the bottom frame faces the insulating surface of a single-sided PCB.

[0026] The base frame may include a protruding portion that extends toward a single-sided PCB.

[0027] The height of the protruding part can be less than or equal to about 1 mm.

[0028] A display device according to another embodiment includes a display panel configured to display an image, a rack assembly housing the display panel, a rear cover surrounding at least a portion of the rack assembly, and a control assembly disposed between the rack assembly and the rear cover to control the display panel, wherein the control assembly includes: a single-sided printed circuit board (PCB) including a circuit surface facing the rear cover and having a circuit pattern printed thereon and an insulating surface facing the rack assembly; a circuit module disposed on the circuit surface; and a jumper connector including a first hole and a second hole through the single-sided PCB and electrically connected to a first protrusion and a second protrusion of the circuit pattern, and a flat portion connected to the first protrusion and the second protrusion and disposed on the insulating surface. Attached Figure Description

[0029] Figure 1 The appearance of the display device according to an embodiment is shown.

[0030] Figure 2 This is an exploded perspective view showing a display device according to an embodiment.

[0031] Figure 3 A control component according to an embodiment is shown.

[0032] Figure 4a shows a circuit module arranged on the circuit surface of a printed circuit board (PCB) according to an embodiment.

[0033] Figure 4b shows a jumper connector arranged on the insulating surface of a PCB according to an embodiment.

[0034] Figure 5 The diagram shows a comparative example where the circuit surface of the PCB is arranged facing the chassis.

[0035] Figure 6 The structure of a crossover connector subjected to tensile force according to an embodiment is shown.

[0036] Figure 7 The structure of a crossover connector under applied stress is shown as a comparative example.

[0037] Figure 8 A method for ensuring uniform compression of a bridging connector according to another embodiment is shown.

[0038] Figure 9 This is a view used to describe a method for ensuring uniform extrusion according to another embodiment.

[0039] Figure 10 The shape of the holes in a PCB according to an embodiment is shown.

[0040] Figure 11An example is shown of applying a first protective layer to the surface of a jumper connector and the surface of a circuit module, according to an embodiment.

[0041] Figure 12 A control component including a second protective layer according to another embodiment is shown.

[0042] Figure 13 A control component including spacers is shown according to an embodiment.

[0043] Figure 14 A control assembly including a retainer-type spacer is shown according to an embodiment.

[0044] Figure 15 A base frame having integrally formed spacers is shown according to an embodiment.

[0045] Figure 16 Several control components according to an implementation method are shown.

[0046] Figure 17a This is a plan view of multiple control components according to another embodiment.

[0047] Figure 17b yes Figure 17a A cross-sectional view of the control components.

[0048] Figure 18 A control assembly including a heat dissipation component is shown according to an embodiment.

[0049] Figure 19 A heat dissipation component according to another embodiment is shown.

[0050] Figure 20 A heat dissipation component according to another embodiment is shown.

[0051] Figure 21 A heat dissipation member fixed by a connecting member according to an embodiment is shown.

[0052] Figure 22 Another form of heat dissipation component is shown.

[0053] Figure 23 Another form of heat dissipation component is shown.

[0054] Figure 24 A heat dissipation component including a heat dissipation cover is shown according to an embodiment.

[0055] Figure 25 A heat dissipation component suitable for a single in-line package (SIP) type circuit module is shown according to an embodiment.

[0056] Figure 26The relationship between another circuit module and a heat dissipation component according to another embodiment is shown. Detailed Implementation

[0057] The embodiments described herein and the components shown in the accompanying drawings are preferred embodiments of this disclosure, and various modifications that can replace the embodiments and drawings may exist at the time of filing this application.

[0058] The same reference numerals or symbols presented in each of the figures here indicate parts or components that perform essentially the same function. For clarity, the size and shape of the parts or components shown in the figures may be exaggerated.

[0059] The terminology used herein is for describing embodiments of this disclosure and is not intended to limit and / or constrain this disclosure. Singular forms include plural forms unless explicitly indicated in the context.

[0060] It should be understood that the terms "comprising," "having," etc., as used herein mean the presence of the features, numbers, steps, operations, elements, parts, or combinations thereof described in the specification, and do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, parts, or combinations thereof.

[0061] The terms used herein, including ordinal numbers such as "first" and "second," may be used to describe various components, but these components are not limited by the terms; the terms are used to distinguish a component from other components. For example, a first component may be referred to as a second component without departing from the scope of this disclosure, and similarly, a second component may be referred to as a first component.

[0062] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0063] Figure 1 The appearance of the display device 1 according to the embodiment is shown. Figure 2 This is an exploded perspective view of the display device 1 according to the embodiment.

[0064] Reference Figure 1 The display device 1 can process image signals received from an external source and visually display the processed image signals. Although the display 1 is exemplified by a television (TV), this disclosure is not limited thereto. For example, the display device 1 can be implemented in various forms, such as a monitor, a portable multimedia device, a portable communication device, a portable computing device, etc., and the form of the display device 1 is not limited, as long as the display device 1 visually displays images.

[0065] Furthermore, the display device 1 can be a large outdoor display (LFD) such as one installed on the roof of a building or at a bus stop. Here, "outdoor" is not limited to the outside, so that the display device 1 according to the embodiment can be installed indoors, such as in subway stations, shopping malls, cinemas, offices, shops, etc., where many people may come and go.

[0066] Display device 1 can receive video and audio signals from various content sources and output video and audio signals corresponding to the video and audio signals. For example, display device 1 can receive TV broadcast content via a broadcast receiving antenna or wired cable, receive content from a content playback device, or receive content from a content provider's content delivery server.

[0067] The display device 1 may include a display panel 10 for displaying images, and may be as follows: Figure 1 The flat panel display device shown. Although not shown, the display device 1 may be a curved display device in which the display panel 10 is bent, or a flexible display device in which the display panel 10 can be deformed from a flat surface to a curved surface or from a curved surface to a flat surface or the curvature of the curved surface can be changed.

[0068] The display device 1 may include a display panel 10 capable of displaying images, a frame assembly 20 for housing and supporting the display panel 10, and a rear cover 30 surrounding the frame assembly 20 to protect it. Although not shown, the display device 1 may further include legs (not shown) for supporting the display device 1 on a mounting surface.

[0069] The display device 1 can be implemented in various ways to display images. For example, the display device 1 may include a liquid crystal display (LCD) panel, a light-emitting diode (LED) panel, or an organic LED (OLED) panel.

[0070] In the following text, a display device including an LCD panel will be described as an example of display device 1.

[0071] Reference Figure 2 The display panel 10 may include a backlight unit 12 that emits surface light forward and a liquid crystal panel 14 that blocks the light emitted from the backlight unit 12 or allows the light to pass through.

[0072] The backlight unit 12 may include a point light source that emits monochromatic light or white light and converts the light emitted from the point light source into uniform surface light, refracting, reflecting, and scattering the light. For example, the backlight unit 12 may include a light source that emits monochromatic light or white light, a light guide plate that receives light from the light source and diffuses the incident light, a reflective sheet that reflects light emitted from the rear surface of the light guide plate, and an optical sheet that refracts and scatters light emitted from the front surface of the light guide plate.

[0073] Accordingly, the backlight unit 12 can emit uniform surface light by refracting, reflecting and scattering the light emitted from the light source.

[0074] The liquid crystal panel 14 can be provided in front of the backlight unit 12 and can block light emitted from the backlight unit 12 or allow the light to pass through to form an image.

[0075] The liquid crystal panel 14 may include multiple pixels. The multiple pixels included in the liquid crystal panel 14 may independently block the light from the backlight unit 12 or allow the light to pass through, and the light passing through the multiple pixels may form an image.

[0076] The liquid crystal panel 14 may include a thin-film transistor (TFT) substrate, a color filter substrate connected to face the TFT substrate, and liquid crystal injected between the TFT substrate and the color filter substrate. The TFT substrate may be a transparent substrate, wherein the TFTs, which serve as switching elements, are formed in a matrix form. The color filter substrate may be a transparent substrate, wherein RGB color pixels, which represent specific colors, are formed by a thin-film process.

[0077] The display device 1 may include a frame assembly 20 that houses and supports the display panel 10. The frame assembly 20 may include a top frame 22, a middle frame 24, and a base frame 26.

[0078] The top frame 22 may include an opening for exposing the liquid crystal panel 110. The intermediate mold 24 may include an intermediate mold side and an intermediate support portion, the intermediate support portion protruding inward from the intermediate mold side to support the liquid crystal panel 14 and maintain the gap therebetween.

[0079] The base frame 26 can support the backlight unit 12. Various components of the display device 1, such as the top frame 22 and the middle frame 24, can be fixed and supported on the base frame 26.

[0080] On the top surface of the base frame 26, the PCB (not shown) of the backlight unit 12 can be mounted. The base frame 26 can be used to dissipate the heat generated in the light source of the backlight unit 12 to the outside. The heat generated in the light source of the backlight unit 12 can be transferred to the base frame 26 through the PCB and can be dissipated in the base frame 26.

[0081] The base frame 26 can be formed from various metal materials such as aluminum and stainless steel with good thermal conductivity, or plastic materials such as acrylonitrile butadiene styrene (ABS) resin.

[0082] At least one of the top frame 22, the middle mold 24, and the base frame 26 may be omitted or integrally formed. The display device 1 may further include a rear cover 30 surrounding the frame assembly 20 to protect the frame assembly 20.

[0083] The display device 1 may further include a control component 40 disposed between the frame assembly 20 and the rear cover 30 to control the display panel 10. The control component 40 may include control circuitry for controlling the operation of the backlight unit 12 and the liquid crystal panel 14, and power supply circuitry for supplying power to the backlight unit 12 and the liquid crystal panel 14.

[0084] The control circuit can process image data received from an external content source, send the image data to the liquid crystal panel 14, and send dimming data to the backlight unit 12. The power supply circuit can supply power to the liquid crystal panel 14 and the backlight unit 12, so that the backlight unit 12 outputs surface light, and the liquid crystal panel 14 blocks the light from the backlight unit 12 or allows the light to pass through.

[0085] The control component 40 can be implemented using a PCB and various circuit modules mounted on the PCB. For example, the circuit modules may include at least one of a power supply circuit and a control circuit. The power supply circuit includes capacitors, coils, resistors, processors, etc., and supplies power to the display panel 10. The control circuit includes a memory, processors, etc., and supplies control signals to the display panel 10. The power supply circuit and the PCB may be referred to as a power supply assembly.

[0086] Simultaneously, to achieve a slim display device, the thickness of the display panel 10 or the thickness of the control component 40 can be reduced. Reducing the thickness of the control component 40 allows for the use of smaller circuit modules, thereby increasing the cost of the circuit modules. For power modules capable of efficiently supplying power within a given volume, there are limitations to reducing their size. Therefore, to achieve a slim display device, it is necessary to increase the mounting area of ​​the board while reducing the height of the control component 40.

[0087] According to the embodiment, the control component 40 can ensure the price competitiveness of the board by using a single-sided PCB. Furthermore, by utilizing the relative arrangement of the circuit modules and jumper connectors in the control component 40, as well as the arrangement between the control component 40, the rack assembly 20, and the rear cover 30, a slim display device can be realized.

[0088] Figure 3 Figure 4a shows a control component according to an embodiment, and Figure 4b shows a circuit module arranged on the circuit surface of a PCB according to an embodiment.

[0089] like Figure 3 As shown in Figures 4a and 4b, the control component 40 may include a PCB 110 in which a plurality of circuit patterns 114 are formed, a plurality of circuit modules 120 arranged on the PCB 110, and a bridging connector 130 electrically connecting the plurality of non-connected circuit patterns 114.

[0090] PCB 110 may include an insulating board 112 and multiple circuit patterns 114 printed on the insulating board 112. The insulating board 112 may be rigid or flexible. The insulating board 112 may include glass or plastic. For example, the insulating board 112 may include: chemically tempered / semi-tempered glass, such as soda-lime glass, aluminosilicate glass, etc.; reinforced or flexible plastics, such as polyimide (PI), polyethylene terephthalate (PET), propylene glycol (PPG), or polycarbonate (PC), etc.; or sapphire.

[0091] Multiple circuit patterns 114 may be arranged on the first surface of the insulating plate 112. At least some of the multiple circuit patterns 114 may not be connected to each other on the insulating plate 112. The circuit patterns 114 may be interconnects for transmitting electrical signals, heat dissipation patterns for heat transfer, or shielding patterns for shielding signals, and may be formed of a highly conductive metallic material.

[0092] The circuit pattern 114 can be formed from at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). The circuit pattern 114 can also be formed from a paste or solder paste with excellent bonding strength, comprising at least one metallic material selected from Au, Ag, Pt, Ti, Sn, Cu, and Zn. For example, the circuit pattern 114 can be formed from Cu, which is highly conductive and relatively inexpensive. The conductivity or bonding strength of the circuit pattern 114 can be improved by plating at least one of Au, Ag, Pt, Ni, and palladium (Pd) onto a highly conductive metal (e.g., Cu).

[0093] PCB 110 can be a single-sided PCB, wherein the circuit pattern 114 is printed on one surface of the insulating board 112. Since it is cheaper than a double-sided PCB in which the circuit pattern 14 is printed on two surfaces, a single-sided PCB can improve the cost competitiveness of the display device.

[0094] In a single-sided PCB, the surface on which the printed circuit pattern 114 is printed can be referred to as the circuit surface S1, and the surface opposite to the circuit surface S1, namely the surface of the insulating plate 112, can be referred to as the insulating surface S2. The circuit surface S1 can be arranged to face the back cover 30 of the display device 1, and the insulating surface S2 can be arranged to face the rack assembly 20, especially the base frame 26.

[0095] Various holes can be arranged in PCB 110. Jumper connectors 130, connectors of circuit module 120, etc., can be arranged as through holes.

[0096] Multiple circuit modules 120 can be arranged on the circuit surface S1. Each circuit module 120 can be a component of a control circuit that controls the operation of the display panel 10 or a component of a power supply circuit that supplies power to the display panel 10.

[0097] Circuit module 120 can be categorized as a surface mount device (SMD), single in-line package (SIP), dual in-line package (DIP), quad in-line package (QIP), etc., depending on the type on which it is mounted on PCB 110. Although in Figure 3 The first circuit module 122 of type SMD and the second and third circuit modules 124 and 126 of type DIP are shown, but they are shown only for the purpose of description and this disclosure is not limited thereto.

[0098] The SMD type first circuit module 122 can be mounted on the circuit surface S1, and the connector 122c of the first circuit module 122 can be electrically connected to the circuit pattern 114. The connector 122c of the first circuit module 122 can be fixed to the circuit pattern 114 by soldering. The first circuit module 122 can be arranged to extend from the circuit surface S1 to the rear cover 30.

[0099] The second circuit module 124, of type DIP, can be arranged to protrude orientally from the PCB 110 through a first hole h1. The hole through which the circuit module passes in the PCB 110 is referred to as the first hole h1. For example, the second circuit module 124 can be arranged to be directed through the first hole h1 to the rear cover 30 and the base frame 26. The connector 124c of the second circuit module 124 can be electrically connected to the circuit pattern 114. The connector 124c of the second circuit module 122 can be soldered to the circuit module 120.

[0100] The third circuit module 126 of type DIP can be arranged to pass through the first hole h1 of PCB 110 and be led from PCB 110 to the rear cover 30 and the base frame 26. The connector 126c of the third circuit module 126 can be electrically connected to the circuit pattern 114 of PCB 110.

[0101] For example, one end of the connector 126c of the third circuit module 126 can be connected to the third circuit module 126 in the area where the third circuit module 126 is led from the PCB 110 to the base frame 26. The other end of the connector 126c of the third circuit module 126 can be arranged to be led from the PCB 110 to the rear cover 30 through a second hole h2 formed in the PCB 110. The hole through which the connector of the circuit module passes in the hole of the PCB 110 will be referred to as the second hole h2. The connector of the circuit module and the connector 126c of the third circuit module 126 can be soldered to the circuit pattern 114 on the circuit surface S1 of the PCB 110.

[0102] The jumper connector 130 can electrically connect two unconnected points in the circuit pattern 114 of the PCB 110. The jumper connector 130 may include a first protrusion 130a and a second protrusion 130b that protrude toward the rear cover 30 through a third hole h3 formed in the PCB 110, and a flat portion 130c that connects the first protrusion 130a to the second protrusion 130b and is arranged flatly along the insulating surface S2 of the PCB 110. In the holes of the PCB 110, the hole through which the protrusion of the jumper connector passes will be referred to as the third hole h3.

[0103] The thickness t of the jumper connector 130, especially the thickness of the flat portion 130c of the jumper connector 130, can serve as a reference for the separation distance between the PCB 110 and the base frame 26. The thickness t of the jumper connector 130 can be from about 0.5 mm to about 1 mm, and the separation distance between the PCB 110 and the base frame 26 can be from about 0.5 mm to about 1 mm.

[0104] The control assembly 40 may include a plurality of jumper connectors 130, wherein the flat portion 130c of the jumper connector 130 may serve as a support member supporting the PCB 110 and a spacer 152 forming a separation space between the PCB 110 and the base frame 26.

[0105] The height of the regions protruding from the circuit surface S1 in the first protrusion 130a and the second protrusion 130b of the jumper connector 130 can be less than or equal to the protrusion height of the circuit module. Therefore, the height of the control assembly 40 can be considered as the sum of the thickness of the PCB 110, the thickness of the circuit module, and the thickness of the jumper connector 130. As described below, when the control assembly 40 includes a heat sink, the thickness of the heat sink can also be considered.

[0106] By arranging the control assembly 40 between the base frame 26 and the rear cover 30, such that the flat portion 130c of the jumper connector 130 is oriented towards the base frame 26, and the first protrusion 130a and second protrusion 130b of the jumper connector 130, the circuit surface S1 of the circuit module 120 and the PCB 110 are oriented towards the rear cover 30, the height of the control assembly 40 is reduced. Furthermore, the protrusions of the connector with sharp ends are oriented towards the physically rigid rear cover, thereby reducing the possibility of the connector protrusions damaging the rear cover.

[0107] Furthermore, as mentioned above, the base frame 26 can be formed of a material with high thermal conductivity. For example, such as... Figure 3 As shown, the base frame 26 may include a body 26a made of a metallic material with excellent thermal conductivity and an insulating paper 26b covering the surface of the body 26a. However, this disclosure is not limited thereto. The base frame 26 may be formed of an insulating material with excellent thermal conductivity.

[0108] Figure 5 The diagram shows a comparative example where the circuit surface S1 of PCB 110 is arranged facing the base frame 26. For example... Figure 5 As shown, when the circuit surface S1 of PCB 110 is arranged facing the base frame 26, the distance d2 between PCB 110 and base frame 26 can be affected by the height of the circuit module 120 and the first protrusion 130a and the second protrusion 130b of the jumper connector 130. Specifically, the ends of the first protrusion 130a and the second protrusion 130b of the jumper connector 130 are relatively sharp and have a small area, so the base frame 26 may be scratched. Therefore, the separation distance between PCB 110 and base frame 26 can be maintained greater than the height of the jumper connector 130 protruding from PCB 110.

[0109] However, as Figure 3 As shown, when the flat portion 130c of the jumper connector 130 is oriented toward the base 26, the flat portion 130c of the jumper connector 130 is smooth, so no additional separation distance is required between the base 26 and the PCB 110. That is, the jumper connector 130 can be arranged to contact the base 26.

[0110] Furthermore, even when the first protrusion 130a and the second protrusion 130b of the jumper connector 130 are arranged toward the rear cover 30, the rear cover 30 is formed of an insulating material such as plastic, and therefore its thickness is greater than that of the insulating paper 26b. Therefore, even when the rear cover 30 is pressed by the jumper connector 130, no major problems such as scratches will occur.

[0111] The flat portion 130c of the jumper connector 130 serves as a spacer 152 between the PCB 110 and the base frame 26, thus reducing the overall height of the assembly 40.

[0112] To prevent the jumper connector 130 from leaving the third hole h3 of the PCB 110 during PCB 110 movement or soldering after the first protrusion 130a and the second protrusion 130b of the jumper connector 130 have been inserted into the third hole h3 of the PCB 110.

[0113] The flat portion 130c of the jumper connector 130 separates the distance between the PCB 110 and the base frame 26, and thus can protrude from the PCB 110 to a certain height. For example, the jumper connector 130 can be arranged on the PCB 110 to apply a tensile force to the flat portion 130c of the jumper connector 130.

[0114] Figure 6The structure of a crossover connector 130 subjected to tensile force according to an embodiment is shown. (See figure) Figure 6 As shown, after the jumper connector 130 is mounted on the PCB 110, the first protrusion 130a and the second protrusion 130b of the jumper connector 130 can be bent so that tensile force is applied to the flat portion 130c of the jumper connector 130.

[0115] For example, the flat portion 130c of the jumper connector 130 can be arranged on the insulating surface S2 of the PCB 110, and the first protruding portion 130a and the second protruding portion 130b of the jumper connector 130 can be arranged to protrude from the circuit surface S1 of the PCB 110 through the third hole h3.

[0116] By bending the first protrusion 130a and the second protrusion 130b of the jumper connector 130 in a direction opposite to the center of the jumper connector 130, i.e., bending it outward relative to the flat portion 130c of the jumper connector 130, a tensile force can be applied to the flat portion 130c of the jumper connector 130. Then, the flat portion 130c of the jumper connector 130 can make close contact with the insulating surface S2 of the PCB 110, thereby reducing protrusion errors between multiple jumper connectors 130.

[0117] Figure 7 The structure of a stress-applied jumper connector 130, as a comparative example, is shown. Figure 7 As shown, the jumper connector 130 can be bent toward the center of the jumper connector 130, that is, toward the flat portion 130c of the jumper connector 130.

[0118] Accordingly, by bending the first protrusion 130a and the second protrusion 130b of the jumper connector 130, stress can be applied to the flat portion 130c of the jumper connector 130, thus raising the flat portion 130c away from the PCB 110. This raised shape of the jumper connector 130 may increase the protrusion error between the jumper connectors 130. This could hinder the thinness of the display device, and the control assembly 40 may not be stably mounted on the base frame 26.

[0119] Figure 8 A method for ensuring uniform compression of the jumper connector 130 according to another embodiment is shown. For example... Figure 8 As shown, a pressing clamp G can be used to solder the jumper connector 130 to the PCB 110. Since the pressing clamp G presses the flat portion 130c of the jumper connector 130 when soldering the jumper connector 130, the flat portion 130c of the jumper connector 130 can be maintained at a certain height during soldering without being lifted off the PCB 110.

[0120] Although the jumper connector 130 is shown in the appendix, this disclosure is not limited thereto. During soldering, the circuit module 120 can also be pressed using the pressing clamp G. Thus, the height at which the jumper connector 130 protrudes from the PCB 110 and the height at which the circuit module 120 protrudes from the PCB 110 can also become uniform.

[0121] Figure 9 This is a view used to describe a method for ensuring uniform extrusion according to another embodiment. Mechanical errors may occur during the bending of the jumper connector 130, and the jumper connector 130 may rise away from the PCB 110 due to heat during the soldering of the jumper connector 130. Before soldering the jumper connector 130, the control component 40 according to the embodiment may spray adhesive material onto the flat portion 130c of the jumper connector 130. Therefore, the flat portion 130c of the jumper connector 130 can be adhered to the insulating surface S2 of the PCB 110 through the adhesive layer 142.

[0122] The adhesive layer 142 can fix the flat portion 130c of the jumper connector 130 to the insulating surface S2 of the PCB 110, thereby preventing the flat portion 130c of the jumper connector 130 from lifting during soldering. In addition, the height at which the jumper connector 130 protrudes from the insulating surface S2 of the PCB 110 can also be made uniform.

[0123] Although the jumper connector 130 is shown in the accompanying drawings, this disclosure is not limited thereto. Adhesive may also be sprayed onto the circuit module 120 prior to soldering. Therefore, the circuit module 120 can also be secured to the PCB 110 via the adhesive layer 142.

[0124] Figure 10 The shape of the third hole in a PCB according to an embodiment is shown. Figure 10 As shown, the cross-section of the third hole h3 formed in PCB 110 can be elliptical. A jumper connector can pass through the third hole h3 of PCB 110.

[0125] The jumper connector 130 can be bent to pass through the first hole h1, and when the third hole h3 is circular, the jumper connector 130 can be bent such that a portion of the jumper connector 130 can be recessed into the third hole h3.

[0126] According to the embodiment, the third hole h3 of the PCB 110 can be elliptical, and the major axis of the third hole h3 can be parallel to the longitudinal direction of the flat portion 130c of the jumper connector 130. Therefore, even when the jumper connector 130 is bent, the space of the third hole h3 in the direction parallel to the bending direction is large, thereby preventing the jumper connector 130 from being recessed.

[0127] Although Figure 10 The cross-section of the third hole h3 through which the intermediate jumper connector passes is elliptical, but this disclosure is not limited thereto. The cross-section of the second hole h2 through which the connector of the circuit module passes can also be elliptical. The connector of the circuit module needs to be bent to pass through the second hole h2 such that the major axis of the second hole h2 can be parallel to the direction in which the connector of the circuit module is connected in the circuit module.

[0128] Figure 11 An example is shown of applying a first protective layer to the surface of a jumper connector and the surface of a circuit module, according to an embodiment.

[0129] As described above, the jumper connector 130 and circuit module 120 of the control component 40 according to the embodiment can directly contact the insulating paper 26b of the base frame 26. In order to reduce scratches on the insulating paper 26c, a first protective layer 144 for reducing surface roughness can be further coated on the surface of the jumper connector 130 and the surface of the circuit module 120.

[0130] like Figure 11 As shown, the first protective layer 144 can be arranged on the insulating surface S1 of the PCB 110 to cover the flat portion 130c of the jumper connector 130. Although Figure 11 The diagram shows a first protective layer 144 covering the flat portion 130c of the jumper connector 130 and the circuit module 120, but this disclosure is not limited thereto. The first protective layer 144 may cover the entire insulating surface S2 of the PCB 110. The first protective layer 144 may include a moisture-resistant insulating coating material with low surface roughness.

[0131] Figure 12 A control assembly including a second protective layer according to another embodiment is shown. Because the circuit pattern 144 and circuit module 120 of PCB 110 are exposed towards the rear cover 30, the control assembly 40 according to the embodiment may not be resistant to moisture, etc. Therefore, as Figure 12 As shown, the control component 40 may further include a second protective layer 146, which covers the circuit module 120 and the jumper connector 130 on the circuit surface S1 of the PCB 110. The second protective layer 146 may be formed by spraying a component protective material such as a moisture-proof oil.

[0132] Figure 13 A control assembly further including spacers is shown according to an embodiment. Figure 3 and Figure 13In comparison, the control assembly 40 may further include spacers 152 supporting the PCB 110. Even when the flat portion 130c of the jumper connector 130 supports the PCB 110, the jumper connector 130 may be positioned in a specific area of ​​the PCB 110. Therefore, the force from the PCB 110 to the base frame 26 may be uneven.

[0133] Spacer 152 can be placed in the space between PCB 110 and base 26 in areas where the jumper connector 130 is not located. Spacer 152 can prevent PCB 110 from bending. Spacer 152 can be placed on the insulating surface S2 of PCB 110 or on base 26.

[0134] The thickness of spacer 152 can preferably be equal to the thickness t of jumper connector 130. However, this disclosure is not limited thereto. When spacer 152 is formed of an elastic material such as a polymer, spacer 152 can be slightly larger than the thickness t of jumper connector 130. Therefore, when PCB 110 is mounted on base 26, the thickness of spacer 152 can become equal to the thickness t of jumper connector 130. Here, when “equal thickness” or “equal protrusion height” is used, it can mean not only that they are exactly equal in value, but also that they have an error range of 10% or less.

[0135] Figure 14 A control assembly including a retainer-type spacer according to an embodiment is shown. For example... Figure 14 As shown, the control component 40 may further include a retainer-type spacer 154 in the edge of the PCB 110. As the size of the PCB 110 increases, the PCB 110 can be bent, allowing the spacer 154 to distribute the forces applied to the PCB 110. The thickness of the region 154a in the spacer 154 disposed between the PCB 110 and the base 26 may preferably be equal to the thickness t of the jumper connector 130.

[0136] Figure 15 A base frame 26 having an integrally formed spacer 156 is shown according to an embodiment. For example... Figure 15 As shown, the spacer 156 supporting the PCB 110 can be integrally formed on the base frame 26. When the spacer 156 is formed on the base frame 26, Figure 15 The retainer-type spacer 154 shown can be omitted.

[0137] The base frame 26 can be formed of a material with good heat dissipation properties to dissipate the heat generated in the display panel 10 to the outside. The spacer 156 can be formed of the same material as the base frame 26 and contact the insulating surface S2 of the PCB 110, thus performing the heat dissipation function to dissipate the heat generated in the control assembly 40 to the outside.

[0138] Meanwhile, the thickness of the spacer 156 can preferably be equal to the thickness t of the jumper connector 130. The base frame 26 can include a body 26a and insulating paper 26b, and when the spacer 156 is integrated with the body 26a, the thickness of the spacer 156 can be less than the thickness t of the jumper connector 130, but the difference between the two can be small.

[0139] Figure 16 Several control components according to an implementation method are shown. For example... Figure 16 As shown, the control component 40 may include multiple control components 40a and 40b. For example, the control component 40 may include a first control component 40a containing control circuitry and a second control component 40b containing power supply circuitry. Each of the first control component 40a and the second control component 40b may include a PCB and circuit modules and jumpers disposed on the PCB.

[0140] The control assembly 40 includes multiple control components, thus distributing the force applied to the PCB and making it easier to maintain the control assembly 40.

[0141] Although the accompanying drawings show that both the first control component 40a and the second control component 40b include a single-sided PCB and a jumper connector, this disclosure is not limited thereto. Either the first control component 40a or the second control component 40b may include a double-sided PCB 110.

[0142] Figure 17a This is a plan view of multiple control components according to another embodiment. Figure 17b yes Figure 17a A cross-sectional view of the control components. For example... Figure 17a and Figure 17b As shown, the third control component 40c can be arranged in the fourth hole h4 of the fourth control component 40d. Here, the hole formed in the PCB that passes through another PCB will be referred to as the fourth hole h4.

[0143] For example, the third control component 40c may include a third PCB 110c and a fourth circuit module 128, such as a capacitor, mounted on the third PCB 110c. The fourth control component 40d may include a fourth PCB 110d and a circuit module (not shown). The fourth circuit module 128 may be mounted on the third PCB 110c as an SMD type. The fourth control component 40d may include a single-sided PCB 110d, a circuit module (not shown), and a jumper connector (not shown).

[0144] The third control component 40c can pass through the fourth hole h4 of the fourth control component 40d, so that the third PCB 110c of the third control component 40c and the fourth PCB 110d of the fourth control component 40d can be arranged and fixed perpendicular to each other.

[0145] Meanwhile, the third PCB 110c can be arranged to protrude from the insulating surface S2 of the fourth PCB 110d to the thickness t of the jumper connector 130, i.e., the thickness of the flat portion 130c. The third PCB 110c can be used as a spacer between the fourth PCB 110d and the base frame 26.

[0146] Heat may be generated in the control assembly 40 due to the use of electricity. In order to dissipate the generated heat to the outside, the control assembly 40 may further include a heat dissipation component.

[0147] Figure 18 A control assembly including a heat dissipation member is shown according to an embodiment. The heat dissipation member 161 according to the embodiment can not only dissipate the heat generated in the control assembly 40, but also serve as a spacer 152 separating the PCB 110 from the base frame 26.

[0148] like Figure 18 As shown, the heat dissipation member 161 according to the embodiment may include a region that bends at least twice. A first region 161a of the heat dissipation member 161 may contact the circuit module 122, and a second region 161b connected to the first region 161a may pass through a fifth hole h5 of the PCB 110. Among the holes in the PCB 110, the hole through which the heat dissipation member passes will be referred to as the fifth hole h5.

[0149] The third region 161c of the heat dissipation component 161 can contact the insulating surface S2 of the PCB 110 while simultaneously contacting the second region 161b. The first region 161a of the heat dissipation component 161 can cover the top surface of the circuit module 122. Therefore, the heat dissipation component 161 can not only dissipate the heat of the circuit module 122 to the outside, but also protect the circuit module 122.

[0150] The thickness of the third region 161c of the heat dissipation component 161 can be equal to the thickness of the jumper connector 130. The heat dissipation component 161 can separate the PCB 110 from the base frame 26 and fix the circuit module 122. The heat dissipation component 161 can dissipate the heat generated in the circuit module 122 to the outside through the base frame 26.

[0151] Figure 19 A heat dissipation member 162 according to another embodiment is shown. For example... Figure 19As shown, the heat dissipation component 162 may contact the circuit pattern 114 instead of the circuit module 122. More specifically, the heat dissipation component 162 may include a first region 162a that contacts the circuit pattern 114, a second region 162b that is connected to the first region 162a and passes through the fifth hole h5 of the PCB 110, and a third region 162c that is connected to the second region 162b and contacts the insulating surface S2 of the PCB 110.

[0152] The thickness of the third region 162c of the heat dissipation component 162 can be equal to the thickness of the jumper connector 130. Therefore, the heat dissipation component 162 can dissipate the heat generated in the circuit pattern 114 to the outside through the base frame 26 while separating the PCB 110 from the base frame 26.

[0153] Figure 20 A heat dissipation member 163 according to another embodiment is shown. For example... Figure 20 As shown, the heat dissipation component 163 can contact both the circuit pattern 114 and the circuit module 122. For example, the heat dissipation component 163 may include a first region 163a that contacts the circuit pattern 114 and a second region 163b that contacts the circuit module 122. The heat dissipation component 163 may contact the circuit pattern 114 and the circuit module 122 via an adhesive layer (not shown).

[0154] Figure 21 A heat dissipation member 164, fixed by a connecting member 164a according to an embodiment, is shown. For example... Figure 21 As shown, the heat dissipation component 164 can be fixed by the connecting member 164a. Like the heat dissipation component 164, the connecting member 164a can also be formed of a material with good heat dissipation properties. The connecting member 164a can be a screw, and the heat dissipation component 164 can have a groove formed therein, with the connecting member 164a engaging with the groove. The connecting member 164a can be inserted into the groove of the heat dissipation component 165 through the sixth hole h6 of the PCB 110 on the insulating surface S2 of the PCB 110, thereby fixing the heat dissipation component 164 to the PCB 110. The hole through which the connecting member of the heat dissipation component passes in the hole of the PCB 110 will be referred to as the sixth hole h6.

[0155] The head thickness of the connecting member 164a can preferably be less than or equal to the thickness t of the jumper connector 130. When the head thickness of the connecting member 164a is similar to the thickness t of the jumper connector 130, the head of the connecting member 164a can not only contact the base frame 26 to separate the base frame 26 from the PCB 110, but also connect the heat dissipation member 161 to the base frame 26, thereby further improving the heat dissipation effect.

[0156] Figure 22 Another form of heat dissipation component is shown. For example... Figure 22As shown, the heat dissipation component 165 can be arranged to contact the circuit pattern 114 of the PCB 110. The thickness of the heat dissipation component 165, i.e., the height at which the heat dissipation component 165 protrudes from the circuit pattern 114, can be equal to or greater than the thickness of the circuit module 122. Therefore, the heat dissipation component 165 can prevent the circuit module 122 from being damaged by external factors such as the back cover 30.

[0157] Figure 23 Another form of heat dissipation component is shown. For example... Figure 23 As shown, the heat dissipation component 166 can be a board-like structure disposed on the insulating surface S2 of the PCB 110. In the region of the heat dissipation component 166, a connecting member 166a is led through the sixth hole h6 of the PCB 110 to the circuit surface S1 of the PCB 110; for example, pins can be disposed thereon. The connecting member 166a can be fixed to the circuit surface S1 of the PCB 110 by soldering. The heat dissipation component 167 can be disposed on the insulating surface S2 of the PCB 110 to overlap with the circuit module 122.

[0158] The thickness of the heat sink 166 can be equal to or very similar to the thickness t of the jumper connector 130. Therefore, the heat sink 166 can separate the PCB 110 from the base frame 26. Furthermore, the heat sink 166 can directly contact the PCB 110 and the base frame 26, allowing heat generated in the circuit module 122 or in the circuit pattern 114 to be sequentially transferred to the insulating plate 112, the heat sink 166, and the base frame 26.

[0159] Figure 24 A heat dissipation member including a heat dissipation cover according to an embodiment is shown. For example... Figure 24 As shown, the heat dissipation component 167 may include a heat dissipation plate 167a disposed on the insulating surface S2 of the PCB 110, a heat dissipation cover 167b covering the circuit module 120, and connecting components 167c and 167d connecting the heat dissipation plate 167a to the heat dissipation cover 167b.

[0160] Heat sink 167a can be disposed on the insulating surface S2 of PCB 110 to overlap with circuit module 122. The thickness of heat sink 167a can be equal to or very similar to the thickness t of jumper connector 130. Therefore, heat sink 167a can separate PCB 110 from base frame 26.

[0161] The heat sink 167b can be arranged to cover the circuit module 122. The heat sink 167b can transfer the heat generated in the circuit module 122 and protect the circuit module 122 and the circuit pattern 114.

[0162] Connecting members 167c and 167d can be connected to the heat sink 167a and include a first connecting member 167c protruding through a sixth hole h6 of the PCB 110 toward the circuit surface S1 of the PCB 110, and a second connecting member 167d connecting to the first connecting member 167c through a seventh hole h7. The first connecting member 167c may have a groove formed therein, and the second connecting member 167d may be a screw.

[0163] Figure 25 A heat dissipation component suitable for a SIP-type circuit module according to an embodiment is shown. For example... Figure 25 As shown, circuit module 129 can be arranged through the eighth hole h8 of PCB 110, and connector 129c of circuit module 129 can be electrically connected to circuit pattern 114 of PCB 110. Among the holes of PCB 110, at least two holes through which the connector of the circuit module and the heat dissipation component pass will be referred to as the eighth hole h8.

[0164] Figure 25 The connector 129c of the circuit module 129 shown can be arranged and fixed to protrude through the seventh hole h7 of the PCB 110 toward the circuit surface S1 of the PCB 110.

[0165] Another surface of the circuit module 129 can be fixed to the PCB 110 by a heat dissipation member 168. The heat dissipation member 168 may include a first region 168a covering the circuit module 129, a second region 168b connected to the first region 168a and passing through an eighth hole h8 of the PCB 110, and a third region 168c connected to the second region 168b and contacting the insulating surface S2 of the PCB 110.

[0166] The thickness of the connector of circuit module 129, the protrusion height of circuit module 129, and the thickness of the third region 168c of heat dissipation member 168 can be equal to the thickness t of jumper connector 130. Therefore, the connector 129c of circuit module 129 and the third region 168c of heat dissipation member 168, protruding from the insulating surface S2 of PCB 110 toward base frame 26, can separate PCB 110 from base frame 26. However, this disclosure is not limited thereto. At least one of the thickness of the connector of circuit module 129, the protrusion height of circuit module 129, and the thickness of the third region 168c of heat dissipation member 168 can be less than the thickness t of jumper connector 130.

[0167] Figure 26 The relationship between another circuit module 129 and a heat dissipation member 169 according to another embodiment is shown. For example... Figure 26As shown, the circuit module 129 can be arranged through the eighth hole h8 of the PCB 110, and the connector 129c of the circuit module 129 can be electrically connected to the circuit pattern 114 of the PCB 110.

[0168] The heat dissipation component 169 may include a first region 169a that contacts the circuit module 120 and a second region 169b that contacts the circuit surface S1 of the PCB 110. Neither the connector 129c of the circuit module 129 nor the heat dissipation component 169 may protrude toward the insulating surface S2 of the PCB 110.

[0169] Meanwhile, a portion of the circuit module 129 can protrude from the insulating surface S2 of the PCB 110. The protrusion height of the circuit module 129 can be equal to the thickness t of the jumper connector 130. Therefore, the circuit module 129, together with the jumper connector 130, can serve as a spacer.

[0170] Despite the large size of the PCB 110, components of the control assembly 40, such as the jumper connector 130, heat sink 161, circuit module 120, and connectors of the circuit module 120, can be used as spacers to separate the PCB 110 from the base frame 26, thereby dispersing forces and thus preventing the PCB 110 from bending.

[0171] Exemplary embodiments have now been described and illustrated in the accompanying drawings to facilitate understanding of this disclosure. However, it should be understood that these embodiments are merely illustrative and not intended to limit the scope of this disclosure. It should be understood that this disclosure is not limited to the illustrations and descriptions provided, as various other modifications can be conceived by those skilled in the art.

Claims

1. A display device, comprising: Display panel, configured to display images; Rack assembly for housing the display panel; Rear cover, surrounding at least a portion of the rack assembly; as well as A power supply assembly, disposed between the rack assembly and the rear cover, supplies power to the display panel. The power supply component includes: A single-sided printed circuit board (PCB) includes a circuit surface facing the back cover and on which circuit patterns are printed, and an insulating surface facing the rack assembly. as well as The circuit module includes a first circuit module disposed on the circuit surface of the single-sided printed circuit board and a second circuit module passing through a first hole in the single-sided printed circuit board. The power supply assembly further includes a jumper connector that electrically connects two points of the circuit pattern on the circuit surface and includes a portion of the insulating surface disposed on the single-sided printed circuit board. The height at which the jumper connector protrudes from the circuit surface is less than or equal to the height at which the second circuit module protrudes from the circuit surface.

2. The display device of claim 1, wherein the jumper connector comprises a first protruding portion and a second protruding portion passing through a second hole and a third hole on the single-sided printed circuit board and electrically connected to the circuit pattern, and a flat portion connected to the first protruding portion and the second protruding portion and disposed on the insulating surface, and The flat portion of the jumper connector contacts the rack assembly.

3. The display device of claim 2, wherein the first protruding portion and the second protruding portion of the jumper connector are arranged to apply a tensile force to the flat portion of the jumper connector.

4. The display device according to claim 2, wherein the first protruding portion and the second protruding portion of the jumper connector are bent outward from the flat portion of the jumper connector.

5. The display device according to claim 2, wherein at least one of the second hole or the third hole comprises an elliptical cross-section.

6. The display device according to claim 5, wherein the major axis of the elliptical cross-section is parallel to the longitudinal direction of the flat portion of the bridging connector.

7. The display device according to claim 1, wherein the separation distance between the insulating surface of the single-sided printed circuit board and the frame assembly is less than or equal to 1 mm.

8. The display device of claim 1, further comprising a spacer that contacts and supports the single-sided printed circuit board in contact with at least one of the single-sided printed circuit board or the rack assembly.

9. The display device according to claim 8, wherein the spacer comprises an elastic material.

10. The display device according to claim 1, further comprising a heat dissipation member, the heat dissipation member contacting at least one of the single-sided printed circuit board or the circuit module.

11. The display device of claim 10, wherein the heat dissipation member includes a first region protruding from the insulating surface toward the rack assembly through a fourth hole in the single-sided printed circuit board.

12. The display device of claim 1, further comprising a retainer-type spacer disposed in the edge of the single-sided printed circuit board to prevent bending of the single-sided printed circuit board.

13. The display device of claim 1, further comprising a sub-power supply assembly passing through a fifth hole in the single-sided printed circuit board. The height of the area where the sub-power assembly protrudes from the single-sided printed circuit board toward the rack assembly is equal to the thickness of the jumper connector.

14. A display device, comprising: Display panel, configured to display images; Rack assembly for housing the display panel; Rear cover, surrounding at least a portion of the rack assembly; as well as A control assembly, disposed between the rack assembly and the rear cover, controls the display panel. The control component includes: A single-sided printed circuit board (PCB) includes a circuit surface facing the back cover and on which circuit patterns are printed, and an insulating surface facing the rack assembly. The circuit module includes a first circuit module disposed on the circuit surface of the single-sided printed circuit board and a second circuit module passing through a first hole in the single-sided printed circuit board; and A jumper connector includes a first protruding portion and a second protruding portion passing through a second and a third hole on the single-sided printed circuit board and electrically connected to the circuit pattern, and a flat portion connected to the first and second protruding portions and disposed on the insulating surface. The height at which the jumper connector protrudes from the circuit surface is less than or equal to the height at which the second circuit module protrudes from the circuit surface.

Images