Electronic device processing tape and method for manufacturing electronic device processing tape

Abstract

An electronic device processing tape is provided with a base material tape laminated with a release film, wherein the base material tape has a label portion, a waste release portion, and a peripheral portion. The label portion is formed at a predetermined interval in a conveying direction of the electronic device processing tape and has a predetermined plan view shape. The waste release portion has a waste portion removed therefrom, which surrounds a plan view outer side of the label portion and has an interval portion forming the predetermined interval. The peripheral portion is in contact with an outer edge of the waste release portion in plan view, and cutting lines of the outer edge of the waste portion extending forward and backward from the conveying direction have a crossing point at the interval portion of the waste portion. A first cutting line extension from the crossing point to a terminal of the cutting line extending in one direction is located closer to the peripheral portion than an imaginary line in a direction parallel to the conveying direction from the crossing point.

Description

Technical Field

[0001] This invention relates to a processing tape for electronic devices, particularly a processing tape for electronic devices used in the cutting and picking of semiconductor wafers, and a method for manufacturing such a processing tape. Background Technology

[0002] As a processing tape for semiconductor wafers, an electronic device processing tape comprising a dicing tape and a chip bonding film is used. The dicing tape and chip bonding film are formed on a long strip of substrate tape with multiple label portions having a predetermined top view shape at predetermined intervals. An adhesive layer is provided at the location corresponding to the label portions of the substrate tape. By attaching the semiconductor wafer to the label portions where the adhesive layer is provided, the semiconductor wafer is positioned by the label portions. The positioned semiconductor wafer is cut while attached to the label portions, thereby manufacturing a semiconductor chip. By using a UV-based curing process or the like to reduce the adhesive strength of the adhesive layer, the manufactured semiconductor chip is picked up from the label portions.

[0003] As a processing tape for a semiconductor wafer in which multiple label portions are formed on a substrate tape at predetermined intervals, for example, a processing tape for a semiconductor wafer is disclosed, which performs a predetermined pre-cutting process on the processing tape for the semiconductor wafer, and peels off unwanted portions between the label portions arranged at predetermined intervals along the cutting line of the pre-cutting process (Patent Document 1).

[0004] In this way, the substrate strip is divided into a label portion with a semiconductor wafer attached, a waste portion that is an unwanted part surrounding the label portion when viewed from above, and a peripheral portion that is in contact with the outer edge of the waste portion when viewed from above. The substrate film and the adhesive layer disposed on the surface of the substrate film are pre-cut using a rotary punch arranged opposite to the substrate strip (Patent Document 2).

[0005] Furthermore, before dicing the semiconductor wafer, the waste portion of the substrate tape is pre-wound along the length direction (the transport direction of the substrate tape) by a winding device, thereby peeling it off from the electronic device processing tape. Therefore, with the waste portion of the substrate tape removed from the electronic device processing tape, the electronic device processing tape is placed on the semiconductor wafer bonding machine.

[0006] From the perspective of electronic device manufacturing processes, such as scalability and pick-up capabilities, the material and thickness of the substrate tape are optimized. Therefore, when removing waste portions of the substrate tape from electronic device manufacturing tapes, the following defects may sometimes occur.

[0007] As described above, since a rotary punch is used in the pre-cutting process to form the cutting lines on the substrate strip, when continuous cutting lines are formed on a long strip of substrate strip, cutting lines extending from one direction and cutting lines extending from another direction intersect at the interval between the label portions along the length direction of the substrate strip, forming an intersection point. However, depending on the thickness or material of the substrate strip and the cutting state of the cutting lines, when performing waste removal processing from a cutting line extending in one direction to a cutting line extending in another direction, the waste removal sometimes derails from the cutting line starting from the intersection point of the cutting lines, making it impossible to smoothly remove the waste portion along the cutting line. In particular, regarding the cutting state of the cutting lines, while the cutting state is approximately the same in a continuous single cutting line, at the intersection point where multiple cutting lines intersect, there are cases where the cutting state of a cutting line extending in one direction is inconsistent with that of a cutting line extending in another direction, and sometimes cutting lines with different cutting states intersect at the intersection point. When the cutting state of a cutting line extending in one direction is inconsistent with that of a cutting line extending in another direction, the scrap material may sometimes derail from the cutting line, starting from the intersection of the cutting lines. If the scrap material derails due to the difference in cutting state between the cutting lines extending in one direction and those extending in another, large tears may occur in the scrap material section, especially between the label sections formed at specified intervals, due to the tension applied to the scrap material section when peeling off the scrap material section of the substrate tape. Depending on the situation, there may be a problem where the scrap material section breaks off between the label sections, making it impossible to peel off the scrap material section smoothly from the electronic device processing tape. (Existing technical literature) (Patent Documents)

[0008] Patent Document 1: Japanese Patent Application Publication No. 2011-111530 Patent document 2 Japanese Patent Application Publication No. 2014-017357 Summary of the Invention (The problem the invention aims to solve)

[0009] In view of the above, the object of the present invention is to provide a processing belt for electronic devices and a method for manufacturing a processing belt for electronic devices, which prevents the waste material from being lifted off the cutting line starting from the intersection of the pre-cut cutting lines and smoothly removes the waste material part, thereby preventing the waste material part from remaining in the waste material stripping part. (Methods used to solve problems)

[0010] The main components of this invention are as follows. [1] A strip for processing electronic devices, comprising: Peel-off film; A substrate tape, which is laminated with the release film, and an adhesive layer is formed on the main surface of the substrate film. The substrate tape includes: a label portion formed at predetermined intervals in the conveying direction of the electronic device processing tape, having a predetermined top view shape; a waste removal portion from which waste portions are removed, the waste portions surrounding the top view outer side of the label portion, and having interval portions for forming the predetermined intervals; and a peripheral portion that, when viewed from above, is in contact with the outer edge of the waste removal portion. The cutting lines used to form the outer edge of the waste section extending from the front in the conveying direction and the cutting lines used to form the outer edge of the waste section extending from the rear in the conveying direction have an intersection point where they intersect at the interval portion of the waste section. Compared to an imaginary line extending from the intersection point in a direction parallel to the conveying direction, the first cutting line extension of the cutting line extending from the intersection point to the terminal point is located in a direction closer to the periphery. [2] According to the electronic device processing belt of [1], in the interval portion of the waste section, at least one of the cutting line extending in one direction and the cutting line extending in another direction has a turning portion, the turning portion extending from the intersection point toward the center line of the substrate belt parallel to the conveying direction and away from the end of the cutting line. [3] According to the electronic device processing tape described in [1] or [2], the first cutting line extension at the intersection forms an angle θ1 with the imaginary line, and the cutting line extending from another direction across the imaginary line and the first cutting line extension forms an angle θ2 with the imaginary line, and θ1 is greater than θ2. [4] The electronic device processing strip according to any one of [1] to [3], wherein the first cutting line extension has a length of 0.5 mm or more. [5] According to the electronic device processing tape of [2], wherein the turning portion of the cutting line extending from one direction at the intersection forms an angle θ3 with the imaginary line, and the cutting line extending from another direction at a position opposite to the extension portion of the first cutting line across the imaginary line forms an angle θ2 with the imaginary line, and θ3 is greater than θ2. [6] The electronic device processing strip according to [2] or [5], wherein the turning part has a top-view curved part. [7] According to the electronic device processing belt described in [6], the top-view curved portion of the steering portion has a portion that is an arc-shaped curve portion with a radius of curvature of R1.0 mm or more. [8] The electronic device processing belt according to [2] or [5], wherein the turning part has a top-view straight section. [9] The electronic device processing strip according to any one of [1] to [8], wherein the cutting line extending from another direction has a second cutting line extension from the intersection to the terminal.

[10] The electronic device processing tape according to any one of [1] to [9], wherein it further includes an adhesive layer partially disposed on the main surface of the release film, the substrate tape covering the adhesive layer and in contact with the release film around the adhesive layer.

[11] A method for manufacturing a strip for processing electronic devices, comprising the following steps: The process of coating an adhesive layer onto a substrate film to produce a substrate tape; The process of overlapping the substrate tape with the release film; In a pre-cutting process using a rotary die, a label portion, a scrap portion, and a peripheral portion are formed on the substrate strip. The label portions are formed at predetermined intervals in the conveying direction of the substrate strip and have a predetermined top-view shape. The scrap portions surround the top-view outer side of the label portions and have interval portions forming the predetermined intervals. The peripheral portion connects to the outer edge of the scrap portion in top view. A cutting line for forming the outer edge of the scrap portion extending forward in the conveying direction and a cutting line for forming the outer edge of the scrap portion extending backward in the conveying direction have an intersection point at the interval portion of the scrap portion. Compared to an imaginary line extending from the intersection point in a direction parallel to the conveying direction, a first cutting line extension from the intersection point to its end of the cutting line extending in one direction is located closer to the peripheral portion. The process of performing waste removal treatment on the waste section to form a waste stripping section on the substrate strip. (Invention Effects)

[0011] According to the method of the electronic device processing belt of the present invention, the cutting lines forming the outer edge of the waste portion extending forward from the conveying direction of the electronic device processing belt and the cutting lines forming the outer edge of the waste portion extending backward from the conveying direction have an intersection point at the interval of the waste portion. Compared with the imaginary line in the direction parallel to the conveying direction drawn from the intersection point, the first cutting line extension portion of the cutting line extending from one direction from the intersection point to the terminal is located in the direction closer to the peripheral portion that connects with the outer edge of the waste portion. Therefore, when the waste is lifted in such a way that the intersection point of the cutting line extending from one direction is located closer to the upstream of the waste lifting than the terminal, it is possible to prevent the waste from being derailed from the cutting line starting from the intersection point, and the waste portion can be peeled off smoothly. Therefore, it is possible to prevent the waste portion from remaining in the waste peeling portion.

[0012] According to the method of processing belt for electronic devices according to the present invention, at least one of the cutting lines extending in one direction and the cutting lines extending in another direction has a turning portion in the interval portion of the waste section. The turning portion extends from the intersection point to the center line of the substrate belt parallel to the conveying direction and away from the end of the cutting line. Thus, the cutting line is formed in the shape along the label section. At the same time, the end of the cutting line extending in one direction can be easily positioned closer to the periphery than the intersection point.

[0013] According to the method of the electronic device processing belt of the present invention, the first cutting line extension at the intersection point forms an angle θ1 with the imaginary line, and the cutting line extending from another direction opposite to the first cutting line extension across the imaginary line forms an angle θ2 with the imaginary line. θ1 is larger than θ2, thereby more reliably preventing the waste from derailing from the cutting line starting from the intersection point. The waste can be smoothly lifted from the cutting line extending from one direction via the intersection point along the cutting line extending from the other direction. As a result, it is more reliably possible to prevent waste from remaining in the waste stripping section.

[0014] According to the method of the electronic device processing belt of the present invention, the first cutting line extension has a length of 0.5 mm or more, thereby enabling the cutting line extending from one direction to reliably intersect with the cutting line extending from another direction, and thus enabling the waste lifting process to be carried out more smoothly along the cutting line, thereby reliably preventing the waste part from remaining in the waste stripping part.

[0015] According to the method of the electronic device processing belt of the present invention, the angle θ3 formed by the turning part of the cutting line extending in one direction at the intersection and the imaginary line is larger than the angle θ2 formed above. This can more reliably prevent the scrap from being lifted off the cutting line starting from the intersection. As a result, it can more reliably prevent the scrap from remaining in the scrap stripping part. Attached Figure Description

[0016] Figure 1 This is a cross-sectional view showing the outline of the laminated structure of the electronic device processing belt before waste removal and processing according to the first embodiment of the present invention. Figure 2 This is an explanatory diagram showing a top view of the waste material of the electronic device processing belt according to the first embodiment of the present invention before it is lifted and processed. Figure 3 This is an enlarged top view showing the outline of the electronic device processing belt before the waste material is lifted and processed according to the first embodiment of the present invention. Figure 4 This is an explanatory diagram showing a general outline of a rotary punch for pre-cutting a strip used in electronic device processing according to the first embodiment of the present invention. Figure 5 This is an enlarged top view showing the outline of the electronic device processing belt before the waste material is lifted and processed according to the first embodiment of the present invention. Figure 6 This is an explanatory diagram illustrating an example of a method for using a processing tape for electronic devices according to the first embodiment of the present invention. Figure 7 This is a cross-sectional view showing the outline of the laminated structure of the electronic device processing belt before waste removal and processing according to another embodiment of the present invention. Detailed Implementation

[0017] First, the electronic device processing tape according to the first embodiment of the present invention will be described using the accompanying drawings. Furthermore, Figure 1 This is a cross-sectional view showing the outline of the laminated structure of the electronic device processing belt before waste removal and processing according to the first embodiment of the present invention. Figure 2 This is an explanatory diagram showing a top view of the waste material of the electronic device processing belt according to the first embodiment of the present invention before it is lifted and processed. Figure 3 This is an enlarged top view showing the outline of the electronic device processing belt before the waste material is lifted and processed according to the first embodiment of the present invention.

[0018] like Figure 1 As shown, the electronic device processing tape 1 according to the first embodiment of the present invention is a laminate composed of a release film 11, an adhesive layer 12, and a substrate tape 13. The adhesive layer 12 is disposed on a portion of the main surface 61 of the release film 11, and the substrate tape 13 covers the adhesive layer 12 and contacts the release film 11 around the adhesive layer 12. As described later, the substrate tape 13 is a laminated structure in which an adhesive layer 15 is formed on the main surface 71 of the substrate film 14.

[0019] The release film 11 is rectangular in shape and is formed such that its length in the longitudinal direction is sufficiently long relative to its length in the direction orthogonal to the longitudinal direction (width direction). The release film 11 functions as a support during the manufacture and use of the electronic device processing tape 1. When a semiconductor wafer is bonded to the electronic device processing tape 1, the release film 11 is peeled off from the electronic device processing tape 1. The semiconductor wafer is then bonded to the adhesive layer 12 exposed after the release film 11 has been peeled off.

[0020] Examples of materials for the release film 11 include polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN); and polyolefins such as polyethylene (PE) and polypropylene (PP). The thickness of the release film 11 is not particularly limited and can be appropriately selected based on the usage conditions of the electronic device processing tape 1; for example, 25μm to 50μm is acceptable. Furthermore, the width dimension of the release film 11 is not particularly limited and can be appropriately selected based on the usage conditions of the electronic device processing tape 1, such as the size of the semiconductor wafer; for example, 20cm to 70cm is acceptable.

[0021] The adhesive layer 12 is disposed in a local area of ​​the main surface 61 of the release film 11, and has a top view shape corresponding to the top view shape of the semiconductor wafer cut and adhered to the adhesive layer 12. It should be noted that, in this specification, "top view" refers to the state observed from a position opposite to the main surface 61 of the release film 11 and the main surface 71 of the substrate film 14.

[0022] Additionally, an adhesive layer 12 is disposed between the release film 11 and the substrate tape 13. The adhesive layer 12 contacts the adhesive layer 15 of the substrate tape 13 and is peeled off from the adhesive layer 15 while still attached to the semiconductor chip during pick-up.

[0023] Examples of materials that can be used as the adhesive layer 12 include epoxy resins, (meth)acrylic resins, phenolic resins, polyurethane resins, polyester resins, polyimide resins, and silicone resins. The thickness of the adhesive layer 12 is not particularly limited and can be appropriately selected based on the usage conditions of the tape 1 used in electronic equipment processing; for example, a thickness of 5 μm to 100 μm can be used.

[0024] The substrate strip 13 is a laminated structure of the substrate film 14 and the adhesive layer 15. The adhesive layer 15 is formed over the entire main surface 71 of the substrate film 14. The substrate strip 13 covers the entire adhesive layer 12 and is in contact with the release film 11 over the entire area surrounding the adhesive layer 12. Like the release film 11, the substrate strip 13 is a rectangular strip, formed such that its length in the longitudinal direction is sufficiently long relative to its length in the direction orthogonal to the longitudinal direction (width direction). The substrate strip 13 functions as a fixing component during the dicing process of the semiconductor wafer.

[0025] Examples of materials that can be used as the substrate film 14 include homopolymers or copolymers of α-olefins such as polyethylene, polypropylene, ethylene-propylene copolymer, poly-1-butene, poly-4-methyl-1-pentene, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylate copolymer, ethylene-(meth)acrylate copolymer, ethylene-(meth)acrylate copolymer, ionomers, etc., or mixtures thereof; polyesters such as polyethylene terephthalate and poly(meth)acrylate; polycarbonate; polyurethane; thermoplastic elastomers such as styrene-ethylene-butene or pentene copolymers and polyamide-polyol copolymers.

[0026] The thickness of the substrate film 14 is not particularly limited and can be appropriately selected according to the usage conditions of the electronic device processing tape 1, for example, 50μm to 200μm. The width dimension of the substrate film 14 is not particularly limited and can be appropriately selected according to the usage conditions of the electronic device processing tape 1, such as the size of the semiconductor wafer, for example, the same dimension as the width dimension of the release film 11. Specifically, the width dimension of the substrate film 14 can be, for example, 20cm to 70cm.

[0027] Examples of materials that can be used for the adhesive layer 15 include polypropylene resin, (meth)acrylic resin, polyester resin, polyurethane resin, and epoxy resin. Alternatively, an ultraviolet-curable compound can be incorporated into the adhesive layer 15, making it easy to peel off from the adhesive layer 12 through curing treatment based on ultraviolet light irradiation. By incorporating an ultraviolet-curable compound, the pick-up performance of the semiconductor chip is improved.

[0028] As UV-curable compounds, for example, compounds that can be three-dimensionally networked by UV irradiation and have at least two photopolymerizable carbon-carbon double bonds within their molecules can be used. Specific examples of UV-curable compounds include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, or low-polyester (meth)acrylate monomers with two or more functionalities.

[0029] Specific examples of UV-curable compounds, besides the aforementioned (meth)acrylate monomers, include urethane (meth)acrylate oligomers. Uramate (meth)acrylate oligomers can be obtained by reacting a polyester-type or polyether-type polyol compound with a polyfunctional isocyanate compound (e.g., 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) to obtain a urethane prepolymer terminally containing isocyanate groups. This urethane prepolymer is then reacted with a (meth)acrylate compound containing hydroxyl groups (e.g., 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, polyethylene glycol (meth)acrylate, etc.) to obtain the oligomer.

[0030] Furthermore, when using UV-curable compounds, photopolymerization initiators can be added as needed to ensure successful curing. Examples of photopolymerization initiators include benzoin isopropyl ether, benzoin isobutyl ether, benzophenone, micriton, chlorothioxanone, dodecylthioxanone, dimethylthioxanone, diethylthioxanone, benzyl dimethyl ketal, α-hydroxycyclohexylphenyl ketone, and 2-hydroxymethylphenylpropane.

[0031] like Figure 2 As shown, the substrate strip 13 of the electronic device processing strip 1 is divided into a label portion 21 for attaching semiconductor wafers before the waste portion 31 is removed, an unwanted portion (i.e., waste portion 31) surrounding the outer edge 22 of the label portion 21 when viewed from above, and a peripheral portion 41 that is in contact with the outer edge 34 of the waste portion 31 when viewed from above and located in the width direction of the substrate strip 13. By performing a waste removal process on the substrate strip 13 to remove the waste portion 31, the area that is the waste portion 31 becomes a waste stripping portion, thereby forming the electronic device processing strip 1 according to the first embodiment of the present invention. In the electronic device processing strip 1, the peripheral portion 41 is in contact with the outer edge of the waste stripping portion when viewed from above. Furthermore, in the drawings illustrating the electronic device processing strip 1 according to the first embodiment of the present invention, for ease of explanation, the form in which the waste portion 31 is not removed and remains is shown. In the substrate strip 13, the portion that overlaps with the adhesive layer 12 when viewed from above and the vicinity of the overlapping portion as needed correspond to the label portion 21. Therefore, the label portion 21 has a structure in which the release film 11, adhesive layer 12, adhesive layer 15, and substrate film 14 are stacked in the above-described order. On the other hand, the adhesive layer 12 is not provided on the waste portion 31 and the peripheral portion 41. Therefore, the waste portion 31 and the peripheral portion 41 have a structure in which the release film 11, adhesive layer 15, and substrate film 14 are stacked in the above-described order.

[0032] exist Figure 2In the middle, the electronic equipment processing belt 1 before the waste removal section 31 is wound on the roll body.

[0033] Multiple label portions 21 are formed at predetermined intervals along the transport direction D of the electronic device processing belt 1. The shape and area of ​​the label portions 21 in plan view are not particularly limited; for example, they can be a shape and area that roughly corresponds to the plan view shape of the semiconductor wafer being bonded and cut. In the electronic device processing belt 1, the plan view shape of the label portions 21 is circular.

[0034] The waste section 31 has: an outer peripheral portion 33 that surrounds the top-view outer edge 22 of each label portion 21; and a spacing portion 32 that forms a predetermined interval between adjacent label portions 21. The outer edge 34 of the outer peripheral portion 33 is a portion that extends along the top-view outer edge 22 of the label portion 21. In addition, the outer peripheral portion 33 and the spacing portion 32 are formed continuously. As described above, the outer peripheral portion 33 surrounding the top-view outer edge 22 of each label portion 21 is continuous with the outer peripheral portion 33 surrounding the top-view outer edge 22 of another label portion 21-2, which is adjacent to a predetermined label portion 21-1 across the spacing portion 32.

[0035] like Figure 3 As shown, the spacing portion 32 of the waste section 31 is defined in the width direction by an outer edge 34 extending from the outer periphery 33 surrounding the label portion 21-2 defined among the plurality of label portions 21, 21, 21... towards another label portion 21-1 adjacent to the aforementioned label portion 21-2, and an outer edge 34 extending from the outer periphery 33 surrounding the other label portion 21-1 adjacent to the defined label portion 21-2 (hereinafter sometimes simply referred to as the other label portion 21-1) towards the aforementioned label portion 21-2. Hereinafter, the outer edge 34 extending from the outer periphery 33 surrounding the other label portion 21-1 towards the defined label portion 21-2 will sometimes be simply referred to as the first outer edge 34-1, and the outer edge 34 extending from the outer periphery 33 surrounding the defined label portion 21-2 towards the other label portion 21-1 will sometimes be simply referred to as the second outer edge 34-2. Figure 3 In the process, the label part 21-2 is the label part 21 on the upstream side of the conveying direction D of the electronic device processing belt 1, and the other label part 21-1 is the label part 21 on the downstream side of the conveying direction D of the electronic device processing belt 1.

[0036] The first outer edge 34-1 extending from the outer periphery 33 surrounding the other label portion 21-1 toward the designated label portion 21-2 intersects with the second outer edge 34-2 extending from the outer periphery 33 surrounding the designated label portion 21-2 toward the other label portion 21-1 at the interval 32 to form an intersection point 35. That is, the outer edge 34 of the outer periphery 33 of the waste portion 31 extending forward from the conveying direction D of the electronic device processing belt 1 and the outer edge 34 of the outer periphery 33 of the waste portion 31 extending backward from the conveying direction D have an intersection point 35 at the interval 32 of the waste portion 31.

[0037] The first outer edge 34-1, extending from the outer periphery 33 surrounding the other label portion 21-1 towards the designated label portion 21-2, extends beyond the second outer edge 34-2 and further towards the designated label portion 21-2. Furthermore, the second outer edge 34-2, extending from the outer periphery 33 surrounding the designated label portion 21-2 towards the other label portion 21-1, extends beyond the first outer edge 34-1 and further towards the other label portion 21-1. Therefore, the terminal (front end) 63 of the first outer edge 34-1 extending from the outer periphery 33 surrounding the other label portion 21-1 towards the designated label portion 21-2 is located closer to the designated label portion 21-2 than the intersection point 35. The first outer edge 34-1 has a first outer edge extension 62 extending from the intersection point 35 to the terminal 63. Furthermore, the terminal (front end) 53 of the second outer edge 34-2, which extends from the outer periphery 33 surrounding the defined label portion 21-2 toward the other label portion 21-1, is located closer to the other label portion 21-1 than the intersection point 35. The second outer edge 34-2 has a second outer edge extension 52 extending from the intersection point 35 to the terminal 53.

[0038] In addition, such as Figure 3 As shown, compared to the imaginary line L extending from the intersection point 35 of the imaginary lines in a direction parallel to the conveying direction D of the electronic device processing belt 1, the first outer edge extension 62 of the first outer edge 34-1 is located closer to the peripheral portion 41. As described above, the first outer edge extension 62 of the first outer edge 34-1 extends outward from the position of the imaginary line L in the width direction of the substrate belt 13.

[0039] Furthermore, compared to the imaginary line L extending from the intersection 35 in a direction parallel to the conveying direction D of the electronic device processing belt 1, the second outer edge extension 52 of the second outer edge 34-2 is located in the direction of the peripheral portion 41. As described above, the second outer edge extension 52 of the second outer edge 34-2 extends outward from the position of the imaginary line L in the width direction of the substrate belt 13.

[0040] exist Figure 3In order to form the electronic device processing belt 1, the waste removal process of the substrate belt 13 waste removal section 31 is performed from the first outer edge 34-1 surrounding another label section 21-1 to the second outer edge 34-2 surrounding the specified label section 21-2.

[0041] like Figure 3 As shown, in the interval portion 32 of the waste section 31, the first outer edge 34-1 extending from the outer periphery 33 surrounding the other label portion 21-1 towards the designated label portion 21-2 has a turning portion 60 extending from the intersection 35 towards the center line C of the substrate strip 13 parallel to the conveying direction D. The turning portion 60 of the first outer edge 34-1 is a portion whose extension direction is different from that of the first outer edge 34-1 on the portion surrounding the other label portion 21-1. The turning portion 60 is formed on the interval portion 32 of the waste section 31. The first outer edge 34-1 extending along the other label portion 21-1 to the interval portion 32 terminates from the center line C towards the peripheral portion 41 via the turning portion 60. Thus, the first outer edge 34-1 can be formed in a shape along the other label portion 21-1, and the terminal 63 can be positioned closer to the peripheral portion 41 than the intersection 35. As described below, the first outer edge 34-1, including the turning portion 60, extending from the outer periphery 33 surrounding another label portion 21-1 towards the designated label portion 21-2, is a pre-cutting line formed through the substrate strip 13. Alternatively, the pre-cutting line may not be formed on the release film 11 and the adhesive layer 12.

[0042] The first outer edge 34-1, including the turning portion 60, extending from the outer periphery 33 surrounding the other label portion 21-1 towards the designated label portion 21-2, is formed only in a portion closer to the outer side than the centerline C of the substrate strip 13 parallel to the conveying direction D of the electronic device processing strip 1. That is, the first outer edge 34-1, including the turning portion 60, does not extend in a manner that cuts across the centerline C of the substrate strip 13 parallel to the conveying direction D. Furthermore, two turning portions 60 are formed at each interval 32, arranged approximately symmetrically about the centerline C. Moreover, the arrangement of forming two turning portions 60 can be appropriately selected according to conditions such as waste lifting and processing, and may also be arranged not approximately symmetrically about the centerline C.

[0043] The top view of the turning section 60 is that it has a curved portion 61. Furthermore, the curved portion 61 of the turning section 60 is an outward-directing portion extending from the base point (the portion closest to the center line C) 66 of the curved portion 61 towards the peripheral portion 41. The outward-directing portion of the curved portion 61 is a portion in the spacer portion 32 that extends outward from the center line C toward the width direction of the substrate belt 13, that is, from the center line C of the substrate belt 13 toward the edge in a direction orthogonal to the conveying direction D. Corresponding to the curved portion 61 in the top view of the turning section 60, the top view of the first outer edge extension 62, which is continuous with the turning section 60, also has a curved portion.

[0044] In addition, such as Figure 3 As shown, in the interval portion 32 of the waste section 31, the second outer edge 34-2 extending from the outer periphery 33 surrounding the designated label portion 21-2 toward the other label portion 21-1 has a turning portion 50 extending from the intersection 35 toward the centerline C of the substrate strip 13 parallel to the conveying direction D. The turning portion 50 of the second outer edge 34-2 is a portion with a different extension direction than the second outer edge 34-2 on the portion surrounding the designated label portion 21-2. The turning portion 50 is formed on the interval portion 32 of the waste section 31. The second outer edge 34-2 extending along the designated label portion 21-2 to the interval portion 32 terminates in the direction of the centerline C toward the peripheral portion 41 via the turning portion 50. Thus, the second outer edge 34-2 can be formed in the shape of the designated label portion 21-2, and the terminal 53 can be positioned closer to the peripheral portion 41 than the intersection 35. As described below, the second outer edge 34-2, including the turning portion 50, extending from the outer periphery 33 surrounding the designated label portion 21-2 toward the other label portion 21-1, is a pre-cutting line formed through the substrate strip 13. Alternatively, the pre-cutting line may not be formed on the release film 11 and the adhesive layer 12.

[0045] The second outer edge 34-2, including the turning portion 50, extending from the outer periphery 33 surrounding the designated label portion 21-2 towards the other label portion 21-1, is formed only in a portion closer to the outer side than the centerline C of the substrate strip 13 parallel to the conveying direction D of the electronic device processing strip 1. That is, the second outer edge 34-2, including the turning portion 50, does not extend in a manner that cuts across the centerline C of the substrate strip 13 parallel to the conveying direction D. Furthermore, two turning portions 50 are formed at each interval 32, arranged approximately symmetrically about the centerline C. Moreover, the arrangement of having two turning portions 50 can be appropriately selected depending on conditions such as waste lifting and processing, or it can be arranged not approximately symmetrically about the centerline C.

[0046] The top view of the turning section 50 is that it has a curved section 51. Furthermore, the curved section 51 of the turning section 50 is an outward-directing portion extending from the base point (the portion closest to the center line C) 56 of the curved section 51 towards the peripheral portion 41. The outward-directing portion of the curved section 51 is a portion in the spacer portion 32 that extends outward from the center line C toward the width direction of the substrate belt 13, that is, from the center line C of the substrate belt 13 toward the edge in a direction orthogonal to the conveying direction D. Corresponding to the curved section 51 in the top view of the turning section 50, the top view of the second outer edge extension 52, which is continuous with the turning section 50, also has a curved section.

[0047] In the electronic device processing belt 1, the cutting line forming the outer edge 34 of the waste section 31 extending forward from the conveying direction D of the electronic device processing belt 1 and the cutting line forming the outer edge 34 of the waste section 31 extending backward from the conveying direction D intersect at the interval 32 of the waste section 31, and have an intersection point 35. Compared with the imaginary line L parallel to the conveying direction D drawn from the intersection point 35, the first outer edge extension 62, which is the cutting line of the first outer edge 34-1 extending from one direction, is located closer to the peripheral portion 41 that is connected to the outer edge 34 of the waste section 31. Therefore, when waste material is lifted from the first outer edge 34-1 surrounding the outer periphery 33 of another label portion 21-1 towards the second outer edge 34-2 surrounding the outer periphery 33 of the designated label portion 21-2, i.e., when the waste material is lifted in such a way that the intersection 35 of the cutting lines (the first outer edge 34-1 extending in one direction) is located closer to the upstream of the waste material lifting point than the end 63 of the first outer edge 34-1, it is possible to prevent the waste material from derailing from the outer edge 34 starting from the intersection 35. The intersection 35 is formed by intersecting the cutting line of the first outer edge 34-1 extending in one direction with the cutting line of the second outer edge 34-2 extending in another direction. For the cutting state of the cutting lines, the cutting states are approximately the same in a continuous single cutting line, but the cutting states are different at the intersection 35. Therefore, for example, if the cutting condition of the first outer edge 34-1 extending from one direction is good, but the cutting condition of the second outer edge 34-2 extending from another direction is slightly poor, the waste material after the intersection 35 may still travel along the first outer edge 34-1 and not transfer to the second outer edge 34-2. During waste material lifting, the tensile force acts on the substrate belt 13 in the length direction (i.e., the conveying direction D), so that near the outer edge 34 of the waste portion 31 of the substrate belt 13, the tension acts in a direction parallel to the waste material lifting direction and in a direction toward the center line C. Therefore, especially when the first outer edge extension 62 extending from the intersection 35 to the terminal 63 extends toward the center line C, compared to the imaginary line L in the direction parallel to the conveying direction D, the possibility of the waste material still traveling along the first outer edge 34-1 during lifting is increased. In the electronic device processing belt 1, compared to the imaginary line L extending from the intersection 35 in the direction parallel to the conveying direction D, the first outer edge extension 62 of the first outer edge 34-1 is located further outward in the width direction than the imaginary line L extending from the intersection 35 in the direction parallel to the conveying direction D. Therefore, the stripping force of the substrate belt 13 is less likely to act in the direction of the first outer edge extension 62, suppressing the scrap lifting after the intersection 35 from continuing to travel along the first outer edge 34-1, and enabling smooth transfer from the cutting line as the first outer edge 34-1 to the cutting line as the second outer edge 34-2.

[0048] Furthermore, in the electronic device processing belt 1, in the interval portion 32 of the waste section 31, there is a turning portion 60 as the cutting line of the first outer edge 34-1 extending from one direction. The turning portion extends from the intersection 35 to the center line C of the substrate belt parallel to the conveying direction D. There is a turning portion 50 as the cutting line of the second outer edge 34-2 extending from another direction. The turning portion 50 extends from the intersection 35 to the center line C of the substrate belt parallel to the conveying direction D. This allows the outer edge 34 to be formed in the shape along the label portion 21, and the terminals 53 and 63 to be positioned closer to the peripheral portion 41 than the intersection 35.

[0049] At intersection 35, the first outer edge extension 62 of the first outer edge 34-1 forms an angle θ1 with the imaginary line L. The second outer edge 34-2 (i.e., the turning portion 50 of the second outer edge 34-2) located opposite the first outer edge extension 62 across the imaginary line L at intersection 35 forms an angle θ2 with the imaginary line L. The relationship between θ1 and θ2 is not particularly limited, but from the perspective of more reliably preventing the waste material from derailing from the outer edge 34 starting from intersection 35, it is preferable that the formed angle θ1 is greater than the formed angle θ2. By more reliably preventing the waste material from derailing from the outer edge 34 starting from intersection 35, the waste material lifting process can be smoothly performed from the cutting line of the first outer edge 34-1 extending in one direction via intersection 35 along the cutting line of the second outer edge 34-2 extending in another direction. As a result, it is more reliably possible to prevent waste material residue 31 from remaining in the waste stripping section.

[0050] The length of the first outer edge extension 62 is not particularly limited, but from the viewpoint of reliably intersecting the cutting line of the first outer edge 34-1 extending from one direction and the cutting line of the second outer edge 34-2 extending from another direction, it is preferably 0.5 mm or more, and particularly preferably 1.0 mm or more. The upper limit of the length of the first outer edge extension 62 can be appropriately selected according to the dimension of the width direction of the substrate strip 13, for example, 2.0 mm. By reliably intersecting the cutting line of the first outer edge 34-1 extending from one direction and the cutting line of the second outer edge 34-2 extending from another direction, the waste material can be lifted and processed more smoothly and according to the design along the outer edge 34, and thus the waste material part 31 can be more reliably prevented from remaining in the waste material stripping part. In addition, the length of the first outer edge extension 62, when the first outer edge extension 62 has a curved shape, refers to the straight extension length.

[0051] The relationship between the angle θ3 formed by the turning portion 60 of the cutting line at intersection 35 (which serves as the first outer edge 34-1 extending in one direction) and the imaginary line L and the angle θ2 formed is not particularly limited. However, from the viewpoint of more reliably preventing the waste material from being lifted off the track from the outer edge 34 starting from intersection 35, it is preferable that the angle θ3 is greater than the angle θ2. By more reliably preventing the waste material from being lifted off the track from the outer edge 34 starting from intersection 35, it is possible to more reliably prevent the waste material portion 31 from remaining in the waste material stripping portion.

[0052] In the electronic device processing belt 1, the curved portion 61 of the turning portion 60 is a curved portion that appears as an arc when viewed from above. That is, the outward portion extending from the base point 66 of the curved portion 61 towards the peripheral portion 41 is a curved portion that appears as an arc when viewed from above. The radius of curvature of the curved portion that appears as an arc when viewed from above is not particularly limited, but from the viewpoint of reliably preventing tearing from the first outer edge 34-1 towards the center line C of the substrate belt 13 at the interval portion 32 of the waste portion 31, its lower limit is preferably R1.0 mm, and particularly preferably R2.0 mm. On the other hand, the upper limit of the radius of curvature of the curved portion 61 can be appropriately selected according to the size of the electronic device processing belt 1, for example, R20 mm is preferred from the viewpoint of minimizing the distance between the label portions 21.

[0053] In the electronic device processing belt 1, the curved portion 51 of the turning portion 50 is a curved portion that appears as an arc when viewed from above. That is, the outward portion extending from the base point 56 of the curved portion 51 towards the peripheral portion 41 is a curved portion that appears as an arc when viewed from above. The radius of curvature of the curved portion that appears as an arc when viewed from above is not particularly limited, but from the viewpoint of reliably preventing tearing from the second outer edge 34-2 towards the center line C of the substrate belt 13 at the interval portion 32 of the waste portion 31, its lower limit is preferably R1.0 mm, and particularly preferably R2.0 mm. On the other hand, the upper limit of the radius of curvature of the curved portion 51 can be appropriately selected according to the size of the electronic device processing belt 1, for example, from the viewpoint of minimizing the distance between the label portions 21, R20 mm is preferred.

[0054] Next, the method for forming the label portion 21, the waste portion 31, and the peripheral portion 41 on the substrate strip 13 will be described. Regarding the method of forming the label portion 21 for attaching the semiconductor wafer, the waste portion 31 surrounding the top-view outer edge 22 of the label portion 21, and the peripheral portion 41 located at the edge of the substrate strip 13 in the width direction and connected to the outer edge 34 of the waste portion 31, a method of pre-cutting the substrate strip 13 using a rotary die can be cited as an example. In this case, the partitions of the label portion 21, the waste portion 31, and the peripheral portion 41 are all formed by cutting lines provided on the substrate strip 13.

[0055] In the electronic device processing belt 1 used to form the electronic device processing belt 1, which has a waste section 31, by using a... Figure 4 The rotary cutting blade 100 with the blade pattern shown pre-cuts the substrate strip 13, thereby forming sections of label portion 21, waste portion 31, and peripheral portion 41, and forming turning portions 50 and 60 in the interval portion 32 of the waste portion 31. The rotary cutting blade 100 is wound and mounted on the outer surface of a cylindrical roller (not shown). While pressing the substrate strip 13 onto the rotary cutting blade 100, the cylindrical roller rotates, thereby pre-cutting the substrate strip 13. One rotation of the cylindrical roller forms a pre-cut label portion 21.

[0056] like Figure 4 As shown, the rotary punch 100 includes: a label forming blade 110 for forming the top-view outer edge 22 of the label portion 21; and a scrap forming blade 120 disposed on the outer periphery of the label forming blade 110 for forming the outer edge 34 of the scrap portion 31. In the electronic device processing belt 1, the top-view shape of the label portion 21 is circular, and correspondingly, the label forming blade 110 is circular.

[0057] The waste section forming blade 120 includes: a first outer edge extension forming blade 122 for forming a first outer edge extension 62 and a turning portion 60; a second outer edge extension forming blade 121 for forming a second outer edge extension 52 and a turning portion 50; and an outer peripheral edge forming blade 123 for forming an outer edge 34 surrounding the outer peripheral portion 33 of the label portion 21. The first outer edge extension forming blade 122 is formed opposite to the second outer edge extension forming blade 121. Furthermore, the outer peripheral edge forming blade 123 is connected to both the first and second outer edge extension forming blades 122 and 121. Additionally, the first outer edge extension forming blade 122 is connected to the second outer edge extension forming blade 121 via the outer peripheral edge forming blade 123.

[0058] The first outer edge 34-1 extending from the outer periphery 33 surrounding the other label portion 21-1 toward the designated label portion 21-2 intersects with the second outer edge 34-2 extending from the outer periphery 33 surrounding the designated label portion 21-2 toward the other label portion 21-1 at the interval 32 to form an intersection point 35. Correspondingly, the interval S1 of the second outer edge extension forming blade 121 is set to be approximately equal to the interval S2 of the first outer edge extension forming blade 122.

[0059] Furthermore, the first outer edge 34-1 and the second outer edge 34-2 intersect at the interval 32 to form an intersection point 35. Correspondingly, when the part where the first outer edge extension forms the cutting edge 122 coincides with the part where the second outer edge extension forms the cutting edge 121, the positions of the first outer edge extension forming cutting edge 122 and the second outer edge extension forming cutting edge 121 are set in the following manner: the middle part between the starting point 126 and the end point 127 of the first outer edge extension forming cutting edge 122 and the middle part between the starting point 124 and the end point 125 of the second outer edge extension forming cutting edge 121 intersect.

[0060] During the first rotation of the rotary cutting blade 100, a designated label portion 21-2 is formed by the label portion forming blade 110, and an outer edge 34 (second outer edge 34-2) surrounding the designated label portion 21-2 is formed by the outer peripheral edge forming blade 123. A second outer edge extension 52 and a turning portion 50 are formed by the second outer edge extension forming blade 121. Then, during the second rotation of the rotary cutting blade 100, a first outer edge extension 62 and a turning portion 60 are formed by the first outer edge extension forming blade 122, intersecting with the portions formed by the second outer edge extension 52 and the turning portion 50. Simultaneously, another label portion 21-1 adjacent to the designated label portion 21-2 is formed by the label portion forming blade 110, and an outer edge 34 (first outer edge 34-1) surrounding the outer peripheral edge 33 of the other label portion 21-1 is formed by the outer peripheral edge forming blade 123. By repeating the above pre-cutting process, the label portion 21, waste portion 31 and peripheral portion 41 can be continuously formed on the substrate strip 13.

[0061] In addition, Figure 2 , 3 In the electronic device processing tape 1 according to the first embodiment shown, the turning portion 50 of the second outer edge 34-2 extending from the outer peripheral portion 33 surrounding the designated label portion 21-2 toward the other label portion 21-1 has a shape with a curved portion 51 when viewed from above, but it can also be as follows: Figure 5 The turning portion 50 of the second outer edge 34-2 shown is an electronic device processing belt 2 that has a straight section shape when viewed from above. More specifically, the turning portion 50 may also have a straight section shape when viewed from above.

[0062] also, Figure 5 In the middle, the turning part 50 at the second outer edge 34-2 becomes a shape with a straight part when viewed from above, which is consistent with... Figure 2 , 3 This is a different, and is an enlarged top view of the electronic device processing belt according to the first embodiment of the present invention before waste removal processing.

[0063] exist Figure 5In the electronic device processing belt 2 according to the first embodiment shown, the turning portion 50 of the second outer edge 34-2 is located along the imaginary line L, which extends from the intersection 35 and is parallel to the transport direction D of the electronic device processing belt 1. Therefore, the angle θ2 between the turning portion 50 and the imaginary line L is 0°. Furthermore, in the electronic device processing belt 2, corresponding to the turning portion 50 having a top-view straight line shape, the second outer edge extension 52, which is continuous with the turning portion 50 via the intersection 35, also has a top-view straight line shape along the imaginary line L.

[0064] In the electronic equipment processing belt 2, by setting the shape of the second outer edge extension forming blade 121 of the rotary punch 100 to a straight line along the rotation direction, the turning portion 50 of the second outer edge 34-2 can be set to have a straight line shape when viewed from above.

[0065] In the electronic device processing conveyor belt 2, compared to the imaginary line L extending from the intersection point 35 parallel to the conveying direction D, the first outer edge extension 62 of the first outer edge 34-1 extending in one direction is located closer to the peripheral portion 41 that connects with the outer edge 34 of the waste portion 31. Therefore, when waste is lifted from the first outer edge 34-1 surrounding the outer peripheral portion 33 of another label portion 21-1 to the second outer edge 34-2 surrounding the outer peripheral portion 33 of the designated label portion 21-2, it is possible to prevent the waste from derailing from the outer edge 34 starting from the intersection point 35. Furthermore, in the electronic device processing conveyor belt 2, by making the turning portion 50 of the second outer edge 34-2 a straight portion along the imaginary line L, the removal of the waste portion 31 from the first outer edge 34-1 to the second outer edge 34-2 can be performed more reliably according to the design.

[0066] As described above, in the electronic device processing belt of the present invention, as long as the first outer edge extension 62 of the first outer edge 34-1 extending in one direction is closer to the peripheral portion 41 than the imaginary line L extending from the intersection 35 in the direction parallel to the conveying direction D, the top view shape of the second outer edge 34-2 extending in another direction downstream of the waste lifting process is not particularly limited.

[0067] Next, an example of a manufacturing method using the "1" symbol for electronic equipment processing will be described.

[0068] First, for the laminate with the adhesive layer 12 coated on the main surface 61 of the release film 11, a pre-cut is made by using a rotary die to form a pre-cut. After the pre-cut, the unwanted portions of the adhesive layer 12 (the portions other than those corresponding to the label portion 21) are removed. In addition, a laminated structure, namely a substrate strip 13, with an adhesive layer 15 coated on the main surface 71 of the substrate film 14 is pre-fabricated. Next, the substrate strip 13 is laminated onto the release film 11 and the adhesive layer 12 with the adhesive layer 15 facing each other, so that the substrate strip 13 overlaps with the release film 11.

[0069] Next, a secondary pre-cutting is performed using a rotary punch 100 positioned opposite to the substrate strip 13, forming a label portion 21 for attaching a semiconductor wafer, a waste portion 31 surrounding the top-view outer edge 22 of the label portion 21, and a peripheral portion 41 located at the width direction edge of the substrate strip 13, which is connected to the outer edge 34 of the waste portion 31. During the secondary pre-cutting, a first outer edge extension 62, a second outer edge extension 52, and turning portions 50 and 60, serving as cutting lines, are also formed on the interval portion 32 of the waste portion 31. Furthermore, during the secondary pre-cutting, in the interval portion 32 of the waste portion 31, the first outer edge 34-1, extending from the outer peripheral portion 33 surrounding another label portion 21-1 towards a predetermined label portion 21-2, intersects with the second outer edge 34-2, extending from the outer peripheral portion 33 surrounding a predetermined label portion 21-2 towards another label portion 21-1. Therefore, by pre-cutting twice, a first outer edge extension 62 is formed on a cutting line extending in one direction, wherein the distance from the intersection 35 to the terminal 63 is located closer to the peripheral portion 41 than the imaginary line L in the direction parallel to the conveying direction D drawn from the intersection 35.

[0070] Next, a waste removal process is performed, in which the waste portion 31 of the substrate strip 13 with the cutting lines is peeled off using a winding device or the like, thereby forming a waste stripping portion. This enables the manufacture of the electronic device processing strip 1.

[0071] Next, an example of using the electronic device processing tape of the present invention will be described. Here, an example of using the electronic device processing tape 1 according to the first embodiment will be used to describe an example of using the electronic device processing tape of the present invention. Furthermore, Figure 6 This is an explanatory diagram illustrating an example of a method for using a processing tape for electronic devices according to the first embodiment of the present invention.

[0072] like Figure 6As shown, firstly, the electronic device processing belt 1, with the waste portion 31 removed and wound into a roll shape, is pulled out from the roll body of the electronic device processing belt 1 using the peeling film take-up roller 200. A peeling member 201 is provided along the pull-out path of the electronic device processing belt 1, and using the front end of the peeling member 201 as a turning point, only the peeling film 11 is peeled off from the electronic device processing belt 1. The peeled peeling film 11 is then wound onto the peeling film take-up roller 200, which has the function of pulling out the electronic device processing belt 1 from its roll body.

[0073] A bonding portion 202 is provided in front of the release member 201. A semiconductor wafer W and an annular frame 205 surrounding the semiconductor wafer W are placed on the upper surface of the bonding portion 202. The laminate of the adhesive layer 12 and the substrate tape 13 after the release film 11 has been removed is guided onto the semiconductor wafer W opposite to the adhesive layer 12, and the semiconductor wafer W is bonded to the adhesive layer 12 by the bonding roller 203.

[0074] Next, with the laminate of adhesive layer 12 and substrate tape 13 bonded to the semiconductor wafer W and annular frame 205, the semiconductor wafer W is cut to form a semiconductor chip (not shown). After cutting the semiconductor chip, the substrate tape 13 is subjected to curing treatment such as ultraviolet irradiation to cure the adhesive components of the adhesive layer 15 constituting the substrate tape 13, thereby reducing the adhesive strength of the adhesive components. If the adhesive strength of the adhesive layer 15 is reduced, the adhesive layer 12 can be easily peeled off from the adhesive layer 15, and the semiconductor chip is picked up with the adhesive layer 12 attached to the back side of the semiconductor chip. Furthermore, when bonding the semiconductor chip to lead frames, packaging substrates, or other semiconductor chips, the adhesive layer 12 attached to the back side of the semiconductor chip functions as a chip bonding film.

[0075] Next, other embodiments of the electronic device processing belt of the present invention will be described. In the electronic device processing belts 1 and 2 according to the first embodiment described above, the turning portion 60 of the first outer edge 34-1 has a curved portion 61 in plan view, but it is also possible that the turning portion 60 has a straight portion in plan view instead. In addition, in the electronic device processing belts 1 and 2 according to the first embodiment described above, the turning portion 60 of the first outer edge 34-1 extends from the intersection 35 toward the center line C of the substrate belt 13, but it is also possible that it extends from the intersection 35 along an imaginary line L parallel to the transport direction D.

[0076] In addition, in the electronic device processing belts 1 and 2 according to the first embodiment, the second outer edge 34-2 has a second outer edge extension 52 extending from the intersection 35 to the terminal 53. However, it is also possible that the second outer edge 34-2 does not have a second outer edge extension 52, and the intersection 35 is the terminal 53 of the second outer edge 34-2.

[0077] Furthermore, in the electronic device processing tapes 1 and 2 according to the first embodiment described above, an adhesive layer 12 is provided between the release film 11 and the substrate tape 13, but it can be replaced by something else, such as... Figure 7 As shown, an electronic device processing tape 3 is manufactured in which no adhesive layer 12 is provided between the release film 11 and the substrate tape 13. In the electronic device processing tape 3, the adhesive layer 15 of the substrate tape 13 is directly connected to the release film 11 even at the label section 21. Industrial availability

[0078] The electronic device processing belt of the present invention can prevent the waste material from being lifted off the cutting line starting from the intersection of the pre-cut cutting lines, thereby smoothly removing the waste material part. Therefore, it is of great value in the field of cutting and bonding integrated films, for example. Symbol Explanation

[0079] 1, 2, 3 Belts for electronic equipment processing 11. Peel-off membrane 12 adhesive layers 13 substrate strip 14 Substrate Film 15 adhesive layers 21 Label Department 31 Waste Department 34 outer edge 35 intersection 62 First outer edge extension

Claims

1. A strip for processing electronic equipment, comprising: Peel-off film; A substrate tape, which is laminated with the release film, and an adhesive layer is formed on the main surface of the substrate film. The substrate tape includes: a label portion formed at predetermined intervals in the conveying direction of the electronic device processing tape, having a predetermined top view shape; A waste stripping section, from which a waste portion has been stripped away, the waste portion surrounding the top outer side of the label portion, and having a spacing portion for forming the predetermined interval; a peripheral portion, which, when viewed from above, is in contact with the outer edge of the waste stripping section. The cutting lines used to form the outer edge of the waste section extending from the front in the conveying direction and the cutting lines used to form the outer edge of the waste section extending from the rear in the conveying direction have an intersection point where they intersect at the interval portion of the waste section. Compared to the imaginary line extending from the intersection point in a direction parallel to the conveying direction, the first cutting line extension of the cutting line extending from one direction to the terminal is located closer to the peripheral portion, while the second cutting line extension of the cutting line extending from the intersection point to the terminal is a top-view straight line along the imaginary line extending from the intersection point in a direction parallel to the conveying direction.

2. The strip for processing electronic devices according to claim 1, wherein, In the interval of the waste section, at least one of the cutting line extending in one direction and the cutting line extending in another direction has a turning portion, the turning portion extending from the intersection point toward the center line of the substrate strip parallel to the conveying direction and away from the end of the cutting line.

3. The strip for processing electronic devices according to claim 1 or 2, wherein, The extension of the first cutting line at the intersection point forms an angle with the imaginary line. θ 1. The cutting line extending from another direction, located opposite the extension of the first cutting line and separated from the imaginary line, forms an angle with the imaginary line. θ 2, and θ 1 greater than θ 2.

4. The strip for processing electronic devices according to claim 1 or 2, wherein, The first cutting line extension has a length of 0.5 mm or more.

5. The strip for processing electronic devices according to claim 2, wherein, The turning portion of the cutting line extending from one direction at the intersection point forms an angle with the imaginary line. θ 3. The cutting line extending from another direction, located opposite the extension of the first cutting line and separated from the imaginary line, forms an angle with the imaginary line. θ 2, and θ 3 greater than θ 2.

6. The strip for processing electronic devices according to claim 2 or 5, wherein, The turning portion of the cutting line extending in one direction has a top-view curved portion.

7. The strip for processing electronic devices according to claim 6, wherein, The top view of the turning portion of the cutting line extending in one direction has a portion that is an arc-shaped curve with a radius of curvature of R1.0 mm or more.

8. The strip for processing electronic devices according to claim 2 or 5, wherein, The steering unit has a straight section when viewed from above.

9. The tape for processing electronic devices according to any one of claims 1, 2, and 5, wherein, It also includes an adhesive layer partially disposed on the main surface of the release film, the substrate tape covering the adhesive layer and being in contact with the release film around the adhesive layer.

10. A method for manufacturing a strip for electronic equipment processing, comprising the following steps: The process of producing a substrate tape by coating an adhesive layer onto a substrate film; The process of overlapping the substrate tape with the release film; The process of pre-cutting using a rotary punch, wherein... A label portion, a waste portion, and a peripheral portion are formed on the substrate strip. The label portions are formed at predetermined intervals in the conveying direction of the substrate strip and have a predetermined top view shape. The waste portion surrounds the top view outer side of the label portion and has a spacing portion for forming the predetermined interval. The peripheral portion is connected to the outer edge of the waste portion when viewed from above. Furthermore, the cutting lines for forming the outer edge of the waste portion extending from the front in the conveying direction and the cutting lines for forming the outer edge of the waste portion extending from the rear in the conveying direction have an intersection point where they intersect at the spacing portion of the waste portion. Compared with an imaginary line drawn from the intersection point in a direction parallel to the conveying direction, the first cutting line extension of the cutting line extending from one direction from the intersection point to the end is located in a direction closer to the peripheral portion. The second cutting line extension of the cutting line extending from the intersection point to the end is a top view straight line shape along an imaginary line drawn from the intersection point in a direction parallel to the conveying direction. as well as The process of performing waste removal treatment on the waste section to form a waste stripping section on the substrate strip.

Images