Antenna device

Abstract

The present invention relates to an antenna device, comprising: an antenna arrangement part in which at least one radiating element is arranged on a front surface; a front cover including a heat radiating part formed between adjacent antenna arrangement parts, and transferring heat generated at the rear to the front by exposing to the outside air; and a rear cover combined with the front cover, including a filter for filtering radio frequency signals and a main board on which a radio frequency device is mounted, and heat generated in the filter is transferred to the front surface of the front cover by contacting the rear surface of the front cover and transferring to the front surface of the front cover using the filter as a heat transfer medium.

Description

Technical Field

[0001] This invention relates to antenna devices, and more specifically, to antenna devices in which the radar radome of an existing antenna device is removed and the radiating device is placed in the front cover of the antenna device, thereby improving heat dissipation performance, enabling miniaturization, and reducing product manufacturing costs. Background Technology

[0002] Base station antennas, including repeaters used in mobile communication systems, come in various forms and structures. Typically, they have a structure in which multiple radiating devices are appropriately arranged on at least one reflector erected along the length direction.

[0003] Recently, research has been actively underway to meet the high-performance requirements of MIMO-based antennas and to achieve miniaturized, lightweight, and low-cost structures. In particular, in the case of antenna devices applicable to patch-type radiating devices that embody linear or circular polarization, it is common practice to gold-plate the radiating devices formed on dielectric substrates of plastic or ceramic materials and then bond them to printed circuit boards, etc.

[0004] Figure 1 An exploded perspective view illustrating an example of a prior art antenna device.

[0005] like Figure 1 As shown, in the prior art antenna device 1, multiple radiating devices 35 output in the desired direction and are configured to face the front surface of the antenna radome body 10, which is the beam output direction, to promote beamforming. In order to protect from the external environment, the radar radome 50 is arranged with multiple radiating devices 35 at the front end of the antenna radome body 10.

[0006] More specifically, it includes: an antenna cover body 10, which is a thin, regular hexahedral box shape with an open front face and a plurality of heat dissipation pins 11 integrally formed on the rear face; a main board 20, which is stacked on the rear face inside the antenna cover body 10; and an antenna board 30, which is stacked on the front face inside the antenna cover body 10.

[0007] Multiple power-related components for calibrating power control are installed on the motherboard 20. During the power supply process, the heat generated by these components is dissipated to the rear through multiple heat dissipation pins 11 at the rear of the antenna housing body 10.

[0008] Furthermore, power supply unit boards 40, which are stacked on the lower side of the motherboard 20 or the lower side of the antenna cover body 10, or arranged at the same height, dissipate heat generated from the power supply unit devices through the aforementioned multiple heat dissipation pins 11 that are integrally formed on the rear side of the antenna cover body 10, or through the power supply unit heat dissipation pins 16 of the power supply unit cover 15 that are separately formed with the antenna cover body 10 and attached to the back side of the antenna cover body 10. Multiple radio frequency filters 25, formed in the form of cavity filters, are arranged on the front surface of the motherboard 10, and the rear surface of the antenna board 30 is stacked on the front surface of the multiple radio frequency filters 25.

[0009] The front surface of the antenna plate 30 is then equipped with patch-type radiating devices or multiple dipole-type radiating devices 35. A radar radome 50 can be installed on the front surface of the antenna radome body 10 to protect the various components from the outside and to enable smooth radiation from the multiple radiating devices 35.

[0010] However, in one example of the prior art antenna device, the front part of the antenna housing body 10 is shielded by the radar antenna radome 50, so the heat dissipation area can only be limited to the area of ​​the radar antenna radome 50. It is designed to only perform multiple radiating devices 35 or radio frequency signal transmission and reception. As a result, the heat generated in the multiple radiating devices 35 cannot be released forward, and the heat generated inside the antenna housing body 10 cannot be discharged to the rear of the antenna housing body 10. Therefore, the heat dissipation efficiency is greatly limited, and the need for new heat dissipation structure designs to solve this problem increases.

[0011] Furthermore, according to an example 1 of the prior art antenna device, due to the volume of the radar radome 50 and the volume occupied by the configuration structure that forms the radiating device 35 separated from the front surface of the antenna plate 30, it is difficult to realize the small-sized base station required in-building or 5G shadow areas. Summary of the Invention

[0012] The present invention is proposed to solve the above-mentioned technical problems. The purpose of the present invention is to provide an antenna device in which the radar radome is removed and the radiating device is disposed in the front outer cover of the antenna device. Thus, both the front and rear outer covers of the antenna device are used for heat dissipation, thereby greatly improving the heat dissipation performance.

[0013] Furthermore, another object of the present invention is to provide an antenna device in which a filter is used as a heat transfer medium, thereby effectively transferring heat from inside the antenna housing to the front of the antenna device.

[0014] Meanwhile, another object of the present invention is to provide an antenna device that can easily realize a small-sized base station required for building installation or 5G shadow areas by reducing the front and rear volume occupied by the existing radar radome by removing the radar radome.

[0015] The technical problems of this invention are not limited to those mentioned above. Those skilled in the art to which this invention pertains can clearly understand other technical problems not mentioned from the following description.

[0016] The antenna device of the present invention includes: an antenna configuration section having at least one radiating device disposed on its front surface; a front heat dissipation cover including a heat dissipation section integrally formed between adjacent antenna configuration sections in at least one of the above-mentioned antenna configuration sections, which is exposed to the outside air to transfer heat generated in the rear; and a rear heat dissipation cover combined with the front heat dissipation cover, which internally includes a filter for filtering radio frequency signals and a motherboard for mounting radio frequency devices, wherein the heat generated in the filter directly transfers the filter itself as a heat transfer medium through contact with the back of the front heat dissipation cover to the front surface of the front heat dissipation cover.

[0017] Furthermore, the antenna device of the present invention includes: a plurality of radiating devices for generating one polarization in a dual polarization; a front heat dissipation cover including a plurality of antenna configuration portions and a heat dissipation portion, wherein the plurality of antenna configuration portions are spaced apart from each other such that the plurality of radiating devices are respectively configured on the front surface, and the heat dissipation portion is formed integrally between adjacent plurality of antenna configuration portions, and is exposed to the outside air to transfer heat generated in the rear; and a rear heat dissipation cover combined with the front heat dissipation cover, including a filter for filtering radio frequency signals and a motherboard for mounting radio frequency devices.

[0018] Furthermore, the aforementioned radiating device may include: an antenna patch circuit section printed on a radiating device printed circuit board disposed on the aforementioned antenna configuration section; and a radiating guide formed of a conductive metal material and electrically connected to the aforementioned antenna patch circuit section.

[0019] Furthermore, the aforementioned radiation guide can direct the radiation beam forward and simultaneously transfer the heat generated behind the printed circuit board of the aforementioned radiation device forward through thermal conduction.

[0020] Furthermore, the present invention may also include a power supply unit, which is stacked in the internal space of the aforementioned rear heat dissipation shroud at the same height as the aforementioned motherboard, including a power supply unit substrate. Multiple electrical devices, including power supply unit devices, are mounted on one of the front or rear surfaces of the aforementioned power supply unit substrate. The heat generated behind the aforementioned printed circuit board for the radiating device can be defined as the heat generated from the aforementioned filter and the aforementioned multiple electrical devices.

[0021] Furthermore, the aforementioned radiation guide can be formed from a thermally conductive material capable of achieving the aforementioned heat conduction.

[0022] Furthermore, a power supply line for supplying power signals to the antenna patch circuit section can be formed on the upper surface of the printed circuit board for the aforementioned radiating device.

[0023] Furthermore, at least two of the aforementioned antenna patch circuit sections and the aforementioned radiation guide can form an antenna module, and the aforementioned antenna module also includes an antenna module cover to seal the aforementioned antenna patch circuit sections except for the aforementioned radiation guide which is exposed to the outside air.

[0024] Furthermore, a through hole can be formed on one side of the antenna module cover, and the radiation guide is connected in such a way that it exposes to the outside air on the front surface of the antenna module cover, and is electrically connected to the patch circuit section through the through hole.

[0025] Furthermore, the antenna module cover can be injection molded, and a guide fixing part that fits the back of the radiation guide is formed on one side of the antenna module cover. At least one guide fixing protrusion that can be combined with the radiation guide is formed in the guide fixing part, and the radiation guide is pressed into and fixed in at least one guide fixing groove. The at least one guide fixing groove is recessed in the back of the antenna module cover at a position corresponding to at least one guide fixing protrusion.

[0026] Furthermore, the antenna module cover can be injection molded, and a filter fixing hole for combining with the filter is formed through the antenna module cover.

[0027] Furthermore, the antenna module cover can be injection molded, and at least one substrate fixing hole is formed in the antenna module cover by means of fixing bolts fastening to the printed circuit board bolts of the radiating device.

[0028] Furthermore, at least one fixing boss can be formed on the back of the aforementioned radiation guide, through the aforementioned substrate fixing hole, to expose the back of the aforementioned antenna module cover. The aforementioned radiating device printed circuit board is fixed to the back of the aforementioned antenna module cover by fastening the aforementioned fixing bolt to the aforementioned fixing boss.

[0029] Furthermore, the aforementioned fixing bolts can be composed of countersunk bolts whose rear end face is fastened in a manner that matches the front face of the aforementioned filter.

[0030] Furthermore, the antenna module cover can be injection molded, and at least one reinforcing rib is integrally formed on one side of the antenna module cover.

[0031] Furthermore, at least four position setting holes can be formed on the printed circuit board for the radiating device. In the radiating printed circuit board, at least two position setting protrusions formed on the back of the antenna module cover, which is provided in a manner that covers the front surface, are pressed into and inserted into two of the four position setting holes. At least two position setting protrusions formed on the front surface of the front heat dissipation cover, which is provided in a manner that covers the back surface, are pressed into and inserted into two of the four position setting holes.

[0032] Furthermore, a thermal pad can be formed between the aforementioned filter and the back of the aforementioned front heat dissipation shroud.

[0033] Furthermore, a Field Programmable Gate Array (FPGA) is configured on the upper surface of the aforementioned motherboard, and the heat generated by the aforementioned FPGA is transferred to the heat dissipation section on the front surface of the aforementioned front heat dissipation cover through the back of the aforementioned front heat dissipation cover.

[0034] Furthermore, the heat generated in the field-programmable gate array can be transferred via a heat pipe or a vapor chamber on the back of the front heat sink as a medium.

[0035] Furthermore, at the rear end of the aforementioned filter, the clamshell that performs the signal shielding function can be formed as a single unit, and the heat generated inside the filter, which is shielded by the clamshell, is dissipated to the rear through the rear heat dissipation cover.

[0036] Furthermore, the filter can be fixed to the main board using a hollow-shaped fixing tube as a medium. The fixing tube protrudes rearward at the end of the clamshell portion, and a heat dissipation hole communicating with the fixing tube is formed on the main board.

[0037] Furthermore, a thermally conductive material can be applied to the aforementioned heat dissipation holes.

[0038] Furthermore, the aforementioned front heat dissipation cover is made of metal, and at least one of the aforementioned antenna configuration parts is configured to expose to the outside air. As the rear of the aforementioned front heat dissipation cover, a portion of the heat generated towards the front of the aforementioned motherboard is dissipated towards the front using at least one of the aforementioned radiating devices as a medium, and the remaining heat is dissipated towards the front using the aforementioned front heat dissipation cover as a medium. The heat generated towards the rear of the aforementioned motherboard can be dissipated towards the rear using the aforementioned rear heat dissipation cover as a medium.

[0039] According to one embodiment of the antenna device of the present invention, the present invention can have the following effects.

[0040] First, the radar radome, which obstructs heat dissipation at the front of the antenna, is removed. The radiating device is positioned in front of the antenna device in a way that exposes it to the outside air. This allows for heat dissipation from both the front and back of the antenna device, thereby significantly improving heat dissipation performance.

[0041] Secondly, the radar radome, a necessary structure for existing antenna devices, can be removed, thus significantly reducing the product's manufacturing costs.

[0042] Third, the system heat inside the antenna radome can be dissipated forward due to the increased heat dissipation area of ​​the heat dissipation cover caused by removing the radar antenna radome, thus greatly improving heat dissipation performance.

[0043] Fourth, it can achieve full heat dissipation in front, thus reducing the length of the heat dissipation pins on the rear heat dissipation cover, thereby simplifying the overall miniaturization design of the product.

[0044] Fifth, by using a radiator as a medium to dissipate heat, the heat dissipation area of ​​the front heat dissipation cover can be maximized, thus enabling the radiation function of electromagnetic waves in the antenna module to be performed.

[0045] The effects of this invention are not limited to those mentioned above. Those skilled in the art to which this invention pertains can clearly understand other effects not mentioned from the description of the scope of protection of the invention. Attached Figure Description

[0046] Figure 1 An exploded perspective view illustrating an example of a prior art antenna device.

[0047] Figure 2 This is a perspective view of the front of an antenna device according to an embodiment of the present invention.

[0048] Figure 3a and Figure 3b These are the front and rear views of an antenna device according to an embodiment of the present invention.

[0049] Figure 4 To show Figure 2 An exploded perspective view of the internal space of the antenna device shown.

[0050] Figure 5 For along Figure 3a A sectional view taken along line AA and a partial enlarged view.

[0051] Figure 6a and Figure 6b To show Figure 2 An exploded perspective view of the front and rear sides of the motherboard and filter, which are stacked inside the rear heat dissipation shroud in the structure.

[0052] Figure 7 To show Figure 2 An exploded perspective view of the direct rear heat dissipation structure through the rear heat dissipation shroud in the structure.

[0053] Figure 8a and Figure 8b To show Figure 2 The structure shows the front and rear layers of the motherboard's subboards and shielding plates in an exploded perspective view.

[0054] Figure 9 For illustrative purposes Figure 2 An exploded 3D view of the electrical connection status of the power supply unit of the motherboard in the structure.

[0055] Figure 10 For illustrative purposes Figure 2 The structure is a decomposed 3D diagram of the combined state of the motherboard's filters.

[0056] Figure 11 For illustrative purposes Figure 2 The structure is shown in the exploded cutaway perspective of the heat dissipation state of the heat generated from the filter and the heat dissipation cover behind it.

[0057] Figure 12a and Figure 12b To show Figure 2 The structure includes exploded perspective views of the front and rear sides showing the assembly process of the internal structural components of the rear heat dissipation shroud.

[0058] Figure 13 For illustrative purposes Figure 2 An exploded perspective view of the assembly process of the outer components of the rear heat dissipation shroud in the structure.

[0059] Figure 14 For illustrative purposes Figure 2 An exploded perspective view of the front side of the structure showing the configuration of the antenna module in the front heat dissipation shroud.

[0060] Figure 15 To show Figure 14 An exploded perspective view of the front and rear sides of the front surface of the antenna module's front heat dissipation cover in the structure.

[0061] Figure 16 To show Figure 14 A three-dimensional view of the antenna module in the structure.

[0062] Figure 17a and Figure 17b for Figure 14 Exploded perspective view of the front side and the exploded perspective view of the back side.

[0063] Figure 18 for Figure 14The structure includes the main view of the antenna module, the sectional view taken along line BB, and the cut perspective view.

[0064] Explanation of reference numerals in the attached figures

[0065] 1: Antenna device 100: Front heat dissipation cover

[0066] 110: Antenna module cover; 120: Printed circuit board

[0067] 121: Guide 122: Antenna Patch Section

[0068] 124: Power supply cable; 125: Guide mounting hole

[0069] 140: Antenna configuration section; 150: Heat dissipation section

[0070] 170: Filter; 180: Fixing bolt

[0071] 200: Rear heat dissipation cover; 210: Rear heat dissipation pin.

[0072] 220: Motherboard Detailed Implementation

[0073] Hereinafter, with reference to the accompanying drawings, an antenna device according to an embodiment of the present invention will be described in detail.

[0074] When affixing reference numerals to the structural elements of the various figures, it is important to note that the same reference numerals should be assigned to the same structural elements whenever possible, even when they appear in different figures. Furthermore, in describing embodiments of the invention, detailed descriptions of related well-known structures or functions will be omitted if it is determined that such detailed descriptions would hinder understanding of the embodiments of the invention.

[0075] In describing the structural elements of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are used to distinguish between two structural elements, and the nature, sequence, or order of the corresponding structural elements are not limited to the aforementioned terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries have the same meaning as those in the context of related technologies, and unless explicitly stated in this application, they should not be construed as having an abnormal or excessive form of meaning.

[0076] Figure 2 This is a perspective view of the front of an antenna device according to an embodiment of the present invention. Figure 3a and Figure 3b These are the front view and rear view of an antenna device according to an embodiment of the present invention. Figure 4 To show Figure 2An exploded perspective view of the internal space of the antenna device is shown. Figure 5 For along Figure 3a A sectional view taken along line AA and a partial enlarged view.

[0077] like Figure 2 As shown, an antenna device 1 according to an embodiment of the present invention includes a front heat dissipation cover 100 forming the front appearance of the antenna device 1 and a rear heat dissipation cover 200 forming the rear appearance of the antenna device 1. The front heat dissipation cover 100 includes: an antenna mounting section (see below). Figure 14 Reference numeral 170 indicates that at least one radiating device 116, 117 is disposed on the front surface; and a heat dissipation portion 105 is exposed to the outside air to transfer heat generated at the rear forward. In particular, at least one antenna arrangement portion 170 may be integrally formed on the front surface of the front heat dissipation cover 100 and disposed spaced apart from each other, and the heat dissipation portion 105 is formed in the overall area of ​​the front surface of the front heat dissipation cover 100 in such a way that it fills the space between adjacent antenna arrangement portions 170.

[0078] Reference Figures 2 to 5 The front heat dissipation cover 100 can be made of a metal material with excellent thermal conductivity so that it can directly dissipate the heat generated between it and the rear heat dissipation cover 200 described later. As mentioned above, the front surface of the front heat dissipation cover 100 can be roughly divided into an antenna configuration section 170 and a heat dissipation section 105.

[0079] The remaining space, excluding the antenna configuration section 170, can mainly function as a heat dissipation section 105. The heat dissipation section 105 is formed as multiple heat dissipation pins in a manner with a prescribed pattern shape and is integrated with the front heat dissipation cover 100. The heat generated in the internal space between the front heat dissipation cover 100 and the rear heat dissipation cover 200 can be quickly dissipated forward through the heat dissipation section 150, which is provided in the form of multiple heat dissipation pins.

[0080] That is, in one embodiment (1) of the antenna device of the present invention, compared with the prior art having a radar radome, the structure that restricts heat dissipation to the front of the antenna device 1 is improved and a new concept of heat dissipation through the front of the antenna device 1 is proposed.

[0081] More specifically, in one embodiment (1) of the antenna device of the present invention, a front heat dissipation cover 100 is introduced, thereby converting the area occupied by the existing radar antenna cover into a heat release area.

[0082] The front heat dissipation shroud 100 converts at least the entire area of ​​the heat dissipation section 105, excluding the area occupied by the antenna module 110 (described later), into a usable area for heat dissipation. Meanwhile, in the structure of the antenna module 110, the radiation guide 117 is formed of a thermally conductive metal material, thereby ensuring even more usable area for heat dissipation.

[0083] like Figure 3a As shown, the front heat dissipation cover 100 is shaped like a right hexahedral box that covers the front end of the rear heat dissipation cover 200, and can be roughly in the shape of a rectangular plate.

[0084] An antenna configuration section 170, which is formed on the front surface of the front heat dissipation cover 100, is formed by combining multiple antenna modules 110 (described later).

[0085] Multiple antenna configuration sections 170 can be matched with the shape of multiple antenna modules 110. The multiple antenna modules 110 are rectangular plates formed in a vertical direction. Each antenna module 110 is arranged in rows and columns with a predetermined distance between them in the horizontal and vertical directions. The multiple antenna configuration sections 170 can also be arranged in the same shape on the front surface of the front heat dissipation cover 100.

[0086] In this case, multiple antenna configuration sections 170 may not be formed on the lower side of the internal space of the rear heat dissipation cover 200 (described later), so that the heat generated by the multiple power supply unit devices 417 of the power supply unit 400 (described later) can be easily dissipated directly forward through the heat dissipation section 105.

[0087] In the front surface of the front heat dissipation cover 100, the aforementioned heat dissipation portion 105 fills the remaining area corresponding to the area not occupied by the multiple antenna configuration portions 170 in the form of multiple heat dissipation pins. Unlike the shape design that takes into account the dispersion or rapid exhaust of the rising airflow dissipating rear heat dissipation from the multiple rear heat dissipation pins 201 integrated with the rear heat dissipation cover 200 (described later), the heat dissipation portion 105 can be formed in a suitable shape by increasing the heat dissipation area through the front heat dissipation cover 100. That is, the heat dissipation portion 105 does not need to be shaped solely for dissipating or rapidly exhausting the dissipated front heat; such a shape necessarily increases heat dissipation performance. Within the limits of increasing the surface area of ​​the front heat dissipation cover 100, any shape can be adopted.

[0088] On the other hand, the rear heat dissipation cover 200 and the front heat dissipation cover 100 are combined to form the rear appearance of the overall antenna device 1. The rear heat dissipation cover 200 forms multiple filters 350 for filtering radio frequency signals and a mainboard 310 for mounting multiple radio frequency devices (not shown). The rear heat dissipation cover 200 can be made of a metal material with excellent thermal conductivity to facilitate heat dissipation based on thermal conduction. It is roughly in the shape of a thin rectangular hexahedron box with an opening on the front side. An internal space 200S for mounting the mainboard 310 can be formed on the internal side. Multiple radio frequency filters 350, various radio frequency devices, and field programmable gate arrays 317 are mounted on the mainboard 310.

[0089] according to Figure 3b On the back of the rear heat dissipation cover 200, multiple rear heat dissipation pins 201 can be integrally formed with the rear heat dissipation cover 200 in a prescribed pattern. Within the internal space 200S of the rear heat dissipation cover 200, heat generated on the rear side can be directly dissipated to the rear through the multiple rear heat dissipation pins 201. The multiple rear heat dissipation pins 201 can be designed to be angled upwards from the middle of the left and right widths (refer to...). Figure 3b The reference numerals 201a and 201b in the accompanying drawings are used to form rising airflows that disperse towards the left and right sides of the rear heat dissipation cover 200, respectively, to more quickly dissipate the heat. However, the shape of the heat dissipation pin 201 is not limited to this. Although not shown in the figures, preferably, when an air supply fan module (not shown) is provided on the rear side of the rear heat dissipation cover 200, the rear heat dissipation pin is formed parallel to the left and right ends from the air supply fan module located in the middle, so that the heat dissipation through the air supply fan module can be dissipated more quickly.

[0090] Furthermore, although not shown, a portion of the plurality of rear heat dissipation pins 201 may be integrated with a bracket mounting portion 205 for attaching the antenna device 1 to a mounting rod (not shown). The clamping device may be a structure that adjusts the directivity of the antenna device 1 by rotating it left-right or tilting it up-down in a left-right or right-up-down direction, as per an embodiment of the present invention, which provides the antenna device 1 at its front end.

[0091] On the other hand, the space between the back of the front heat sink 100 and the rear heat sink 200 allows heat generated around the multiple filters 350 to be directly transferred to the front surface of the front heat sink 100 by contacting its back or the filters 170, using either the front heat sink 100 or the filters 170 as heat transfer media. Simultaneously, a portion of the heat generated inside the multiple filters 350 can be directly dissipated to the rear via the rear heat sink 200. A detailed explanation of this will follow later.

[0092] On the front of the rear heat dissipation shroud 200, multiple radio frequency filters 350 can be integrated with the clamshell part that performs the function of shielding and interfering with external electromagnetic waves, so that they can be installed and arranged in the predetermined position on the motherboard 310.

[0093] In an embodiment of the antenna device 1 of the present invention, a total of 8 radio frequency filters 350 can be arranged adjacently along the left and right directions. At the same time, the multiple radio frequency filters 350 are arranged in 4 columns along the up and down directions, but are not limited thereto. The arrangement and the number of radio frequency filters 170 can be designed and modified in various ways.

[0094] Although not shown, the multiple RF filters 3500 can be configured as cavity filters, in which multiple cavities are provided internally, and the frequency bands of the output signal and input signal are filtered by utilizing the frequency adjustment of the resonators in each cavity. However, the RF filter 170 is not limited to cavity filters, and ceramic waveguide filters are also excluded.

[0095] The small thickness of the RF filter 350 in the front-to-back direction is beneficial for overall product miniaturization. In terms of miniaturization design, compared to cavity filters where the reduction in front-to-back thickness is limited, the RF filter 350 can be considered a ceramic waveguide filter, which offers advantages in miniaturization design. However, to meet the high output performance requirements of base station antennas in 5G frequency environments, the accompanying antenna heat dissipation problem must be addressed. To effectively release the heat generated inside the antenna, preferably, a cavity filter can be used, where the RF filter 350 is used as a heat transfer medium to transfer the heat generated within the filter 350 to the front surface of the front heat dissipation casing 100.

[0096] The heat generated in the aforementioned RF filter 350 can be transferred to the front surface of the front heat sink 100 through contact with the back side of the front heat sink 100. A thermal pad 109 can be formed between the filter 350 and the back side of the front heat sink 100. The thermal pad 109 not only performs the function of smoothly transferring the heat generated in the filter 350 through contact with the surface of the front heat sink 100, but also performs the function of relieving tolerances when assembling the filter 350 and the front heat sink 100.

[0097] On the other hand, such as Figure 4 As shown, the inner side of the internal space 200S forming the rear heat sink 200 can be formed in a shape that fits the back of the motherboard 310 and the daughterboard 320 (described later). That is, heat dissipation performance can be improved by increasing the thermal contact area with the back of the motherboard 310 and the daughterboard 320.

[0098] Handles 160 can also be provided on the left and right sides of the rear heat dissipation cover 200, so that on-site personnel can easily transport the antenna device 1 of an embodiment of the present invention or easily install the pole (not shown) to hold it.

[0099] Meanwhile, various external mounting components 500 for cable connection with a base station device (not shown) and for coordinating internal components can be assembled through the lower outer side of the rear heat dissipation cover 200.

[0100] Figure 6a and Figure 6b To show Figure 2 An exploded perspective view of the front and rear sides of the motherboard and filter, which are stacked inside the rear heat sink shroud in the structure. Figure 7 To show Figure 2 An exploded perspective view of the direct rear heat dissipation structure through the rear heat dissipation shroud in the structure. Figure 8a and Figure 8b To show Figure 2 The structure shows the front and rear layers of the motherboard's sub-boards and shielding plates in their configuration. Figure 9 For illustrative purposes Figure 2 An exploded 3D view of the electrical connection status of the power supply unit of the motherboard in the structure.

[0101] like Figure 6a and Figure 6b As shown, an antenna device 1 according to an embodiment of the present invention may include an antenna stacking assembly 300, which is stacked in the internal space 200S of the rear heat dissipation cover 200.

[0102] like Figure 6a and Figure 6bAs shown, the antenna stack assembly 300, as an RF filter stacked on the front surface with the motherboard 310 as a reference, may include multiple filters 350 and a daughterboard 320 stacked on the back surface with the motherboard 310 as a reference.

[0103] Although not shown, the motherboard 310 can be stacked in multiple layers, and power supply circuits for powering multiple filters 350 can be patterned inside or on the surface. In particular, LNA devices 312 from multiple power supply components can be mounted on the front surface of the motherboard 310, and multiple power connectors 360 for power supply connections to the multiple filters 350 can be inserted and mounted.

[0104] On the other hand, such as the motherboard 310, the daughterboard 320 may have a pair of power supply circuits 321 printed on the front side as the transmission path and the reception path for powering multiple filters 350, and PA devices 322 of multiple power supply components may be installed.

[0105] In this process, multiple through-sections 312 can be formed on the motherboard 310 so that the power supply circuit 321 and PA device 322 on the front side of the sub-board 320 stacked on its back are exposed to the back side of multiple filters 350.

[0106] Furthermore, as described above, the clamshell portion (not shown) can be integrally formed on the lower end side of the plurality of filters 350, and a predetermined air layer is formed between the rear end side of the plurality of filters 350 and the main board 310 and the daughter board 320. Heat generated from the LNA device 312 and PA device 322, which are representative light-emitting devices, can be released through the heat release hole formed on the main board 310 (see reference). Figure 11 The attached figure shows 357a) heat dissipation from the rear heat dissipation cover 200 side.

[0107] like Figure 7 As shown, multiple field-programmable gate array devices 317a and RFIC devices 317b, representing heat-generating devices, can be installed and configured on the back of the motherboard 310. The multiple field-programmable gate array devices 317a and RFIC devices 317b are semiconductor devices that release a large amount of heat when driven, and adopt a structure in which they are in direct thermal contact with the inner surface of the internal space 200S of the rear heat sink 200 and dissipate heat to the rear through the rear heat sink 200.

[0108] More in detail, such as Figure 7As shown, on the inner side of the rear heat sink 200, a thermal contact receiving surface 203a, which is in direct thermal contact with the surfaces of multiple field-programmable gate array devices 317a and RFIC devices 317b, protrudes forward. Simultaneously, thermal contact grooves 203b, formed by printing or mounting multiple protruding components on the back side of the daughter board 320 using embossed patterns, protrude rearward. Therefore, the entire back side of the motherboard 310 and daughter board 320 is in contact with the inner thermal surface of the rear heat sink 200, thus significantly improving heat dissipation performance.

[0109] On the other hand, such as Figure 8a and Figure 8b As shown, in the front face of the motherboard 310, a shielding plate 330 can be stacked and combined in the portion excluding the area occupied by the multiple filters 350. The shielding plate 330 is a shielding component that is disposed between the motherboard 310 and the front heat sink 100 to shield the remaining electrical components or signals affected by external electromagnetic waves, except for the electrical signal lines passing through the multiple filters 350, thereby ensuring more stable signal performance.

[0110] like Figure 6a and Figure 6b and Figure 7 As shown, an antenna device 1 according to an embodiment of the present invention may further include a power supply unit 400 for supplying power to a plurality of filters 350 and an antenna module 110.

[0111] like Figure 6a and Figure 6b and Figure 7 As shown, the power supply unit 400 can be stacked on the underside of the motherboard 310, at the same height as the motherboard 310, in the internal space 200S of the rear heat dissipation shroud 200.

[0112] The power supply unit 400 may include: a power supply unit substrate 410; and a plurality of electrical devices 419, including a plurality of power supply unit devices 417 disposed on one of the front or rear surfaces of the power supply unit substrate 410.

[0113] The power supply unit 400 can distribute power to the motherboard 310 via multiple busbars 340. More specifically, as... Figure 6a , Figure 6b and Figure 9 As shown, multiple busbars 340 can be connected to the left and right ends of the power supply unit substrate 410 and the main board 310 respectively. In particular, multiple busbars 340 can be connected to the main board 310 by being inserted into the formed contact holes 319.

[0114] In particular, in the power supply unit 400, the power supply unit device 417 and electrical device 419 dissipate a large amount of heat when driven, such as Figure 7As shown, in the internal space 200S of the rear heat dissipation cover 200, in the portion occupied by the power supply unit substrate 410, the thermal contact receiving portion 217 can be recessed rearward in a manner corresponding to the shape of the power supply unit device 417 and the electrical device 419. Therefore, the heat generated from the power supply unit device 417 and the electrical device 419 of the power supply unit 400 can be dissipated rearward using the rear heat dissipation cover 200 as a heat transfer medium.

[0115] However, the heat generated in the power supply unit 400 does not need to be dissipated rearward through the rear heat dissipation cover 200, and can be dissipated forward through a separately provided steam chamber or heat pipe structure as the heat transfer medium, even if not shown. This is because, in the case of the antenna device 1 according to an embodiment of the present invention, unlike the case with a conventional radar radome, it has a structure that facilitates heat dissipation through the front heat dissipation cover 100.

[0116] Figure 10 For illustrative purposes Figure 2 The structure is a decomposed 3D diagram of the combined state of the motherboard's filters. Figure 11 For illustrative purposes Figure 2 The structure is shown in the exploded cutaway perspective of the heat dissipation state of the heat generated from the filter and the heat dissipation cover behind it.

[0117] As described above, if a shielding plate 330 and a daughter board 320 are stacked on the front and back sides of the motherboard 310 respectively, then as follows: Figure 10 and Figure 11 As shown, multiple filters 350, which serve as radio frequency filters, are mounted and configured on the front side of the motherboard 310.

[0118] In this case, multiple filters 350 are cavity filters in which the shell portion is formed as a whole at their respective rear ends. At least one filter assembly protrusion 357 can be formed at the location where the shell portion is formed. The filter assembly protrusion 357 is used to be inserted into and assembled into the filter assembly hole 317 formed on the main board 310. The filter assembly protrusion 357 can be in the shape of a hollow tube.

[0119] Therefore, in the air layer between the rear ends of the multiple filters 350 and the motherboard 310, the heat generated and captured from the LNA device 312 and PA device 322 can be easily dissipated to the rear heat dissipation cover 200 side through the tubular filter assembly protrusion 357 and the heat release hole 357a formed on the motherboard 310.

[0120] On the other hand, a pair of motherboard-side coaxial connectors 353a can be formed at the rear end of the plurality of filters 350 to be electrically connected to the power supply connector 360 mounted on the motherboard 310, and a pair of antenna-side coaxial connectors 353b can be formed at the front end of the plurality of filters 350 to be electrically connected to the antenna module 110 disposed on the front surface of the front heat dissipation cover 100.

[0121] Meanwhile, a thermal pad 109 that acts as a medium for heat transfer to the back of the front heat dissipation cover 100 can be configured at the front end of the multiple filters 350. The heat generated from each of the multiple filters 350 can be dissipated more quickly forward by using the front heat dissipation cover 100 as a heat transfer medium.

[0122] Furthermore, bolt fastening holes 359 can be formed at the front end of the plurality of filters 350 for screw engagement with the fixing screws 351 of the front heat dissipation cover 100. The working of fastening the fixing screws 351 through the bolt through holes 119 formed in the front heat dissipation cover 100 to the bolt fastening holes 359, and the front heat dissipation cover 100 can be stacked on the front surface of the plurality of filters 350.

[0123] According to the above structure, the heat generated in the filter 350 can directly contact the back of the front heat dissipation shroud 100 or the radiation guide 117 in the structure of the antenna module 110. Therefore, it can be confirmed that the heat generated in the filter 350 can be reduced by 14°C to 16°C compared to the past. This is due to the following effects: the removal of the radar radome, which was an obstacle to heat dissipation, and the improved heat transfer performance of the filter 350 through the back of the front heat dissipation shroud 100 made of a heat-dissipating material and through direct heat transfer (heat conduction) to the radiation guide 117.

[0124] Figure 12a and Figure 12b To show Figure 2 The structure includes exploded perspective views of the front and rear sides showing the assembly process of the internal structural components of the rear heat sink cover. Figure 13 For illustrative purposes Figure 2 An exploded perspective view of the assembly process of the outer components of the rear heat dissipation shroud in the structure.

[0125] like Figures 2 to 11 As shown, if the assembly of the structural components of the motherboard 310 and the assembly of the stacked components 300 of the rear heat dissipation cover 200 are completed, the outer component 500 is moved from the rear end of the rear heat dissipation cover 200 to complete the assembly.

[0126] The rear heat dissipation cover 200 completely shields and seals the internal space 200S through the assembly of the front heat dissipation cover 100 and the antenna module 110, which will be described later, without the need for additional protective components such as radar antenna covers.

[0127] Figure 14 For illustrative purposes Figure 2 An exploded perspective view of the front side of the structure showing the configuration of the antenna module in the front heat dissipation shroud. Figure 15 To show Figure 14 Exploded perspective views of the front and rear sides of the front surface of the antenna module's front heat dissipation shroud in the structure. Figure 16 To show Figure 14 A 3D view of the antenna module in the structure. Figure 17a and Figure 17b for Figure 14 Exploded perspective view of the front side and the rear side. Figure 18 for Figure 14 The structure includes the main view of the antenna module, the sectional view taken along line BB, and the cut perspective view.

[0128] To demonstrate beamforming, such as Figures 14 to 18 As shown, multiple radiating devices are needed as an array antenna. These multiple radiating devices can generate narrow directional beams to increase the concentration of radio waves in a specified direction. Recently, multiple radiating devices have been designed to be isolated at the highest frequencies using dipole antennas or patch antennas to minimize mutual signal interference. Previously, to prevent changes in the arrangement of multiple radiating devices as described above due to external environmental factors, a radome must be constructed to protect the multiple radiating devices from the outside. Therefore, for the area covered by the radome, the multiple radiating devices and the antenna plate on which they are mounted are not exposed to the outside air, thus severely limiting the dissipation of system heat generated by the operation of antenna device 1.

[0129] The radiating device 117 of an antenna device 1 according to an embodiment of the present invention includes: an antenna patch circuit section 116, printed on a radiating device printed circuit board 115 disposed on an antenna mounting section 170; and a radiating guide 117, formed of a conductive metal material, electrically connected to the antenna patch circuit section 116. The antenna patch circuit section 116 printed on the radiating device printed circuit board 115 is formed as a dual-polarized patch device capable of generating orthogonal ±45° polarization or vertical / horizontal polarization. On the upper surface of the radiating device printed circuit board 115, power supply lines (not shown) supplying power signals to the antenna patch circuit sections 116 are patterned to interconnect the respective antenna patch circuit sections 116.

[0130] Conventionally, power supply lines in antenna devices are formed on the lower part of the printed circuit board where the antenna patch circuit section is mounted. This results in a complex power supply structure with multiple through holes, which occupies the lower space of the radiating device printed circuit board 115. This can hinder direct surface thermal contact between the filter 350 and the radiating device printed circuit board 115. In the embodiment of the present invention, the power supply lines are patterned on the front surface of the radiating device printed circuit board 115 of the patterned antenna patch circuit section 116. This simplifies the power supply structure and provides the advantage of ensuring sufficient space for direct surface thermal contact between the filter 350 and the radiating device printed circuit board 115.

[0131] On the other hand, the radiation guide 117 is made of a thermally conductive or electrically conductive metal and is electrically connected to the antenna patch circuit section 116. The radiation guide 117 can perform the function of directing the radiation beam forward and simultaneously transferring the heat generated behind the printed circuit board 115 of the radiating device forward through thermal conduction. The radiation guide 117 can be made of a conductive metal that propagates radio waves well and is spaced apart on the upper part of each antenna patch circuit section 116.

[0132] The height of the heat dissipation part 105 (heat dissipation pin) of the front heat dissipation cover 100 can be the height of the radiation guide 117 that is combined with the antenna module cover 111 described later. The height of the radiation guide 117 can be changed, thereby adjusting the heat dissipation by changing the height of the heat dissipation part 105 (heat dissipation pin).

[0133] In an embodiment of the present invention, a radiating device utilizing an antenna patch circuit section 116 and a radiating guide 117 is described. When a dipole antenna is used, the structure of the radiating guide can be omitted. Since the height of the dipole antenna is relatively high, the heat dissipation can be increased by increasing the height of the heat dissipation section 105 (heat dissipation pin).

[0134] Reference Figures 14 to 18 The protrusion 117a formed on the back of the radiating guide 117 is electrically connected to the antenna patch circuit section 116 through the through hole 114a of the antenna module cover 111. The overall size, shape, and placement of the radiating guide 117 can be appropriately designed by measuring the characteristics of the radiation beam radiated in the corresponding antenna patch circuit section 116 and conducting experiments or simulations of the corresponding characteristics. The radiating guide 117 serves to guide the direction of the radiation beam occurring in the antenna patch circuit section 116 forward, further reducing the overall antenna beamwidth and improving the sidelobe characteristics. Moreover, it can compensate for the losses caused by the patch antenna and, being made of a conductive metal, can also perform a heat dissipation function. Preferably, the shape of the radiating guide 117 is appropriate for guiding the direction of the radiation beam forward, that is, it is a non-directional circle, but it is not limited to this.

[0135] On the other hand, at least two antenna patch circuit sections 116 and a radiation guide 117 can form an antenna module 110. Figures 14 to 18 The diagram shows an example of a unit antenna module 110 formed by three antenna patch circuit sections 116 and radiating guides 117. The number of antenna patch circuit sections 116 and radiating guides 117 can be changed according to the optimal design of the antenna module for improving gain.

[0136] Antenna module 110 may also include an antenna module cover 111 on at least one side of the printed circuit board 115 for radiating devices in the structure of the antenna module 110.

[0137] In the antenna module cover 111 and the printed circuit board 115 for the radiating device, a cover through hole 113 and a substrate through hole 115b are formed in the front-to-back direction. After the fixing bolt 351 passes through the cover through hole 113 and the substrate through hole 115b in sequence on the outside of the front heat dissipation cover 100, the bolt through hole 119 of the front heat dissipation cover 100 is passed through and fastened to the bolt fastening hole 359 formed at the front end of the plurality of filters 350, so that each antenna module 110 is fixed to the front surface of the antenna configuration section 170.

[0138] Among them, such as Figure 15 As shown in part (a), preferably, a receiving rib 178 for receiving at least the edge end of the antenna module cover 111 is formed at the edge of the antenna configuration portion 170, and the antenna module cover 111 has a size that forcibly fastens into the receiving rib 178 of the antenna configuration portion 170 to achieve airtightness or waterproofness.

[0139] On the other hand, such as Figure 15As shown, on the printed circuit board 115 for the radiating device, position setting holes 115-1 to 115-4 are formed at four positions on the corner sides of the quadrilateral, extending in the front-rear direction. Two position setting protrusions 173a and 173b are formed on the front surface of the antenna mounting section 170. These two position setting protrusions 173a and 173b are pressed into two diagonally opposite position setting holes 115-1 and 115-2 among the four position setting holes 115-1 to 115-4 formed on the printed circuit board 115 for the radiating device. Two position setting protrusions 111-3 and 111-4 can be formed on the back of the antenna module cover 111. The two position setting protrusions 111-3 and 111-4 are pressed into the remaining two position setting holes 115-3 and 115-4. The remaining two position setting holes 115-3 and 115-4 do not contact the two position setting protrusions 173a and 173b formed on the front surface of the antenna configuration section 170 in the four position setting holes 115-1 to 115-4 formed on the printed circuit board 115 for radiating devices.

[0140] Therefore, as Figure 15 As shown, when the antenna module 110 is installed in the antenna configuration section 170, it can be fixed by moving the radiating device printed circuit board 115 to the back side of the antenna module cover 111, pressing it into the two position setting holes 115-3 and 115-4, and inserting it into the two position setting protrusions 115-3 and 115-4 formed on the back side of the antenna module cover 111 (refer to...). Figure 15 (b) The antenna module cover 111, which is combined with the radiating device printed circuit board 115, is moved toward the antenna configuration section 170 side formed on the front surface of the front heat dissipation cover 110 to press and insert the two position setting protrusions 173a and 173b into the two position setting holes 115-1 and 115-2 of the radiating device printed circuit board 115 to temporarily fix the antenna module cover 111.

[0141] That is, in the printed circuit board 115 for radiating devices, on the back of the antenna module cover 111 formed in a manner covering the front surface and on the front surface of the antenna arrangement part 170 of the front heat dissipation cover 100 formed in a manner close to the back surface, the position setting protrusions 111-3, 111-4, 173a, and 173b can be pressed into and inserted into the position setting holes 115-1 to 115-4 respectively, so that the two can be stably configured.

[0142] On the other hand, such as Figure 15As shown, the antenna patch circuit section 116 can be printed on the front side of the radiating device printed circuit board 115, and a conductive contact pattern 115c is printed on the back side of the radiating device printed circuit board 115. Power is supplied to the antenna patch circuit section 116 through the contact between the antenna-side coaxial connector 353b formed at the front end of the filter 350 and the contact pattern 115c.

[0143] The antenna module cover 111 can be injection molded from plastic material, such as... Figure 17a As shown, a guide fixing portion 114 is formed on one side of the antenna module cover 111 and conforms to the back side of the radiation guide 117. A guide fixing protrusion 114b that can be combined with the radiation guide 117 is formed in the guide fixing portion 114 and protrudes forward.

[0144] At the same time, such as Figure 17b As shown, the radiation guide 117 can be pressed into and fixed in at least one guide fixing groove, which is recessed on the back side at a position corresponding to at least one of the guide fixing protrusions.

[0145] Furthermore, a filter mounting hole 113 for coupling with the filter 350 can be formed through the antenna module cover 111. If a filter mounting screw (not shown) passes through the filter mounting hole 113, through the through hole 115b formed in the printed circuit board 115 for the radiating device, and is tightened into the bolt fastening hole 359 formed in the filter 350, then the front heat dissipation cover 100 can be securely laminated to the front surface of the filter 350. Figure 16 As shown, preferably, the filter fixing hole 113 is sealed by the controlled shielding cover 119.

[0146] At least one substrate mounting hole 114a is formed in the antenna module cover 111, which is bolted to the printed circuit board 115 for the radiating device by a fixing bolt 180. Furthermore, at least one fixing boss 117a is formed on the back side of the radiating guide 117, extending through the substrate mounting hole 114a to expose the back side of the antenna module cover 111. The printed circuit board 115 for the radiating device is secured to the back side of the antenna module cover 111 by means of a guide mounting hole 178 formed through which the fixing bolt 180 passes through the antenna mounting portion 170 of the front heat dissipation cover 110 in the front-rear direction, and then secured to the fixing boss 117a.

[0147] On the other hand, preferably, the fixing bolt 180 is formed by a countersunk bolt whose rear end is fastened to match the front surface of the filter 350 located at the rear. This is to ensure that the rear end face of the fixing bolt 180 formed by the countersunk bolt has the largest possible surface area thermal contact with the front surface of the filter 350. The fixing bolt 180 and the radiation guide 117 can be formed of a thermally conductive material, and the heat released to the internal space 200S between the front heat dissipation cover 100 with the filter 350 and the motherboard 310 and power supply unit 400 can be dissipated to the front side through thermal conduction of the front heat dissipation cover 100 itself or through the aforementioned thermal conduction of the fixing bolt 180 and the radiation guide 117.

[0148] Furthermore, at least one reinforcing rib 111a can be formed on one side of the antenna module cover 111, thereby forming the appearance of the antenna module cover 111 and strengthening the plastic material of the antenna module cover 111.

[0149] The heat dissipation state of the antenna device 1 of an embodiment of the present invention described above is briefly explained as follows.

[0150] Based on the motherboard 310, the heat generated between the front heat dissipation shrouds 100 and the heat generated by the filter 350 corresponding to the space between them can be dissipated to the front of the front heat dissipation shrouds 100 through direct surface thermal contact with the back of the front heat dissipation shrouds 100 or through the filter 350 and the radiation guide 117 as a medium.

[0151] In this case, in the case of antenna device 1 according to an embodiment of the present invention, instead of removing the existing radar radome, the area occupied by the radar radome is converted into a heat dissipation area, thereby achieving better heat dissipation performance.

[0152] Based on the motherboard 310, the heat generated on the back side of the motherboard 310 and the heat generated on the back side of the power supply unit 400 can directly contact the surface of the rear heat dissipation cover 200 and be quickly dissipated to the rear by using multiple heat dissipation pins 201 that are integrated with the rear heat dissipation cover 200.

[0153] In this case, the heat captured by the clamshell portion, which is the space between the filter 350 and the motherboard 310, can dissipate heat to the rear by using the rear heat dissipation cover 200 as a heat transfer medium through the filter assembly protrusion 357 of the filter 350 and the heat release hole 357a of the motherboard 310.

[0154] As described above, the antenna device 1 of an embodiment of the present invention has the following effect: by increasing the area of ​​the front heat dissipation cover 100 due to the removal of the radar radome, the system heat inside the antenna device 1 can be released in all directions, including the rear and front. The antenna module 110 is disposed on the front heat dissipation cover 100 of the antenna device 1 and exposed to the outside air. Thus, heat dissipation performance can be greatly improved by achieving heat dissipation from both the front and rear of the antenna device 1.

[0155] An embodiment of the antenna device of the present invention has been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the above-described embodiments, and those skilled in the art can implement them in various modifications and equivalents. Therefore, the true scope of protection of the present invention is defined by the scope of protection described below.

Claims

1. An antenna device, characterized in that, include: At least one antenna configuration section, with at least one radiating device configured on the front surface; A front heat dissipation shroud, including a heat dissipation section, is integrally formed between adjacent antenna configuration sections in at least one of the aforementioned antenna configuration sections, and is exposed to the outside air to transfer heat generated at the rear forward; and The rear heat dissipation cover, combined with the aforementioned front heat dissipation cover, includes a filter for filtering radio frequency signals and a motherboard for mounting radio frequency devices inside, and a thermal pad is formed between the filter and the back of the aforementioned front heat dissipation cover. The aforementioned radiation devices include: The antenna patch circuit section is printed on a printed circuit board for the radiating device disposed on the antenna configuration section; and The radiation guide is made of conductive metal and is electrically connected to the antenna patch circuit section mentioned above. The aforementioned radiation guide directs the radiation beam forward and simultaneously transfers the heat generated behind the printed circuit board of the aforementioned radiation device forward through thermal conduction. Therefore, the heat generated in the filter directly transfers the filter itself as a heat transfer medium through contact with the back of the front heat dissipation cover and to the front surface of the front heat dissipation cover.

2. An antenna device, characterized in that, include: Multiple radiating devices are used to generate one of the polarizations in a dual polarization; The front heat dissipation cover includes multiple antenna configuration sections and heat dissipation sections. The multiple antenna configuration sections are arranged apart from each other in such a way that the multiple radiating devices are respectively arranged on the front surface. The heat dissipation sections are formed as a whole between adjacent multiple antenna configuration sections, and are exposed to the outside air to transfer the heat generated at the rear to the front. as well as The rear heat dissipation cover, combined with the aforementioned front heat dissipation cover, includes a filter for filtering radio frequency signals and a motherboard for mounting radio frequency devices. A thermal pad is formed between the aforementioned filter and the back of the aforementioned front heat dissipation shroud; The aforementioned radiation devices include: The antenna patch circuit section is printed on a printed circuit board for radiating devices disposed on the antenna configuration section. as well as The radiation guide is made of conductive metal and is electrically connected to the antenna patch circuit section mentioned above. The aforementioned radiation guide directs the radiation beam forward and simultaneously transfers the heat generated behind the printed circuit board of the aforementioned radiation device forward through thermal conduction.

3. The antenna device according to claim 1, characterized in that, It also includes a power supply unit, which is stacked at the same height as the motherboard within the internal space of the aforementioned rear heat dissipation shroud. The power supply unit includes a substrate, on which multiple electrical components, including power supply unit devices, are mounted. The heat generated behind the printed circuit board of the aforementioned radiating device is defined as the heat generated from the aforementioned filter and the aforementioned multiple electrical devices.

4. The antenna device according to claim 1, characterized in that, The aforementioned radiation guide is formed of a thermally conductive material capable of achieving the aforementioned heat conduction.

5. The antenna device according to claim 1, characterized in that, A power supply line for supplying power signals to the antenna patch circuit section is formed on the upper surface of the printed circuit board for the aforementioned radiating device.

6. The antenna device according to claim 1, characterized in that, At least two of the above-mentioned antenna patch circuit sections and the above-mentioned radiation guide form an antenna module. The antenna module also includes an antenna module cover, which is used to seal the antenna patch circuit section except for the radiation guide that is exposed to the outside air.

7. The antenna device according to claim 6, characterized in that, A through hole is formed on one side of the aforementioned antenna module cover. The aforementioned radiation guide is integrated in such a way that it exposes the front surface of the antenna module cover to the outside air, and is electrically connected to the aforementioned patch circuit section through the aforementioned through hole.

8. The antenna device according to claim 6, characterized in that, The antenna module cover mentioned above is injection molded. A guide fixing portion is formed on one side of the antenna module cover, which fits with the back of the radiation guide. At least one guide fixing protrusion capable of engaging with the radiation guide is formed in the guide fixing portion, protruding forward. The aforementioned radiation guide is pressed and fixed in at least one guide fixing groove, which is recessed on the back side at a position corresponding to at least one of the aforementioned guide fixing protrusions.

9. The antenna device according to claim 6, characterized in that, The antenna module cover mentioned above is injection molded. In the antenna module cover, a filter mounting hole for connection with the filter is formed.

10. The antenna device according to claim 6, characterized in that, The antenna module cover mentioned above is injection molded. The antenna module cover is formed by a through-hole in at least one substrate fixing hole that is fastened to the radiating device by a printed circuit board bolt.

11. The antenna device according to claim 10, characterized in that, At least one fixing boss is formed on the back of the aforementioned radiation guide, through the mounting hole of the aforementioned substrate, to expose the back of the aforementioned antenna module cover. The printed circuit board for the aforementioned radiating device is fixed to the back of the aforementioned antenna module cover by fastening the aforementioned fixing bolts to the aforementioned fixing boss.

12. The antenna device according to claim 11, characterized in that, The aforementioned fixing bolts are countersunk bolts whose rear end face is fastened in a manner that matches the front face of the aforementioned filter.

13. The antenna device according to claim 6, characterized in that, The antenna module cover is injection molded, and at least one reinforcing rib is integrally formed on one side of the antenna module cover.

14. The antenna device according to claim 6, characterized in that, At least four holes are formed at specific locations on the printed circuit board used in the aforementioned radiation device. In the aforementioned radiating printed circuit board, at least two protrusions formed on the back of the antenna module cover, which is provided in a manner that covers the front surface, are pressed into and inserted into two of the four position setting holes. At least two protrusions formed on the front surface of the front heat dissipation cover, which is provided in a manner that covers the back surface, are pressed into and inserted into two of the four position setting holes.

15. The antenna device according to claim 1, characterized in that, A field-programmable gate array (FPGA) is configured on the upper surface of the aforementioned motherboard. The heat generated by the FPGA is transferred to the heat dissipation section on the front surface of the aforementioned front heat dissipation shroud through the back of the aforementioned front heat dissipation shroud.

16. The antenna device according to claim 15, characterized in that, The heat generated in the field programmable gate array is transferred via a heat pipe or a vapor chamber on the back of the front heat sink as a medium.

17. The antenna device according to claim 1 or 2, characterized in that, At the rear end of the aforementioned filter, the clamshell portion that performs the signal shielding function is formed as a single unit. The heat generated inside the filter, which is shielded by the clamshell-like part, is dissipated to the rear through the rear heat dissipation cover.

18. The antenna device according to claim 17, characterized in that, The aforementioned filter is fixed to the aforementioned main board using a hollow-shaped fixing tube as a medium. The fixing tube protrudes rearward from the end of the aforementioned clamshell portion. A heat dissipation hole is formed on the aforementioned motherboard, which is connected to the aforementioned fixing pipe.

19. The antenna device according to claim 18, characterized in that, A thermally conductive material is applied to the aforementioned heat dissipation holes.

20. The antenna device according to claim 1, characterized in that, The aforementioned front heat dissipation cover is made of metal, and at least one of the aforementioned antenna mounting sections is configured to expose to the outside air. Behind the aforementioned front heat dissipation shroud, a portion of the heat generated towards the front of the motherboard is dissipated forward using at least one of the aforementioned radiating devices as a medium, while the remaining heat is dissipated forward using the aforementioned front heat dissipation shroud as a medium. The heat generated at the rear of the motherboard is dissipated to the rear through the aforementioned rear heat dissipation shroud.

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