一种化学机械抛光系统
By introducing a walking mechanism and a flipping mechanism into the chemical mechanical polishing system, efficient wafer flipping is achieved, solving the problem of insufficient space utilization in the existing system and improving space utilization and the flexibility of module layout.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HWATSING TECHNOLOGY CO LTD
- Filing Date
- 2023-04-11
- Publication Date
- 2026-07-17
AI Technical Summary
In existing chemical mechanical polishing systems, flipping a wafer from a vertical to a horizontal position requires a large amount of space, which increases the length of the machine, leads to insufficient space utilization, increases material usage and costs, and is not conducive to the rational layout of the machine.
In a chemical mechanical polishing system, a walking mechanism and a flipping mechanism are configured. The flipping mechanism in the narrow space vertically carries the wafer and moves it to a more open flipping space for flipping, reducing the space occupied in the length direction of the machine.
By effectively utilizing the internal space of the machine tool, the flexibility and space utilization of the modules are improved, unnecessary space occupation is reduced, costs are lowered, and the flexibility and selectivity of the machine tool layout are enhanced.
Smart Images
Figure CN116352593B_ABST