Cpu cooling device and server

Abstract

The application provides a CPU heat dissipation device and a server, and belongs to the technical field of computers, wherein the CPU heat dissipation device comprises a heat conduction base, a heat dissipation module and a rotating support module, the heat conduction base is used for bearing the whole CPU heat dissipation device, the heat conduction base is fixedly connected with a mainboard and is in contact with a CPU, so as to conduct the heat released by the CPU, a plurality of guide rails are arranged on the heat conduction base, the plurality of guide rails are located around the heat dissipation module, a movable fan is arranged on each guide rail, the heat dissipation module comprises a plurality of heat conduction surfaces, the inside of the heat dissipation module comprises a plurality of heat dissipation fins, the plurality of heat conduction surfaces are in contact with the heat conduction base through rotation, are used for conducting the heat conducted by the heat conduction base to the heat dissipation fins, and the movable fan blows away the heat, and the rotating support module is used for controlling the rotation of the heat dissipation module. The application can realize rapid and efficient cooling of the CPU, and makes the CPU run stably and efficiently for a long time.

Description

Technical Field

[0001] This invention relates to the field of computer technology, and in particular to a CPU heat dissipation device and a server. Background Technology

[0002] With the increasing demands for high-speed and complex big data processing, the functional requirements of CPUs are becoming more demanding. Consequently, the power consumption of high-performance CPUs is also increasing, generating a large amount of heat during high-speed operation. Prolonged operation of a CPU at high temperatures not only affects its performance but also shortens its lifespan. Therefore, it is essential to ensure that the CPU operates within a certain temperature range.

[0003] Current technologies mostly use cooling fans and shrouds to cool the CPU, but the cooling effect is still not ideal. Furthermore, due to space limitations within server chassis, adding more heatsinks is clearly impractical. Summary of the Invention

[0004] This invention provides a CPU cooling device and a server to solve the shortcomings of the existing technology that uses a cooling fan and air guide shroud to cool the CPU, resulting in poor cooling performance.

[0005] This invention provides a CPU heat dissipation device, comprising: a heat-conducting base, a heat dissipation module, and a rotating support module, wherein... The thermal base is used to support the entire central processing unit (CPU) heat dissipation device. The thermal base is fixedly connected to the motherboard and in contact with the CPU to conduct the heat released by the CPU. The heat-conducting base is provided with multiple guide rails, which are located around the heat dissipation module, and each guide rail is provided with a movable fan. The heat dissipation module includes multiple heat-conducting surfaces, and the interior of the heat dissipation module includes multiple heat sinks. The multiple heat-conducting surfaces rotate to contact the heat-conducting base, and are used to conduct the heat conducted by the heat-conducting base to the heat sinks, and the movable fan removes the heat by blowing air. The rotating support module is used to control the rotation of the heat dissipation module.

[0006] According to a CPU heat dissipation device provided by the present invention, the heat-conducting base is further provided with multiple temperature sensors for measuring the temperature of the heat-conducting base in real time. Each of the heat-conducting surfaces is provided with multiple temperature sensors for measuring the temperature of each heat-conducting surface in real time; Multiple temperature sensors are installed on both sides of each heat sink to measure the temperature on both sides of each heat sink in real time.

[0007] According to a CPU heat dissipation device provided by the present invention, the rotating support module is specifically used to control the heat dissipation module to rotate cyclically when a decrease in the heat conduction efficiency between the heat-conducting surface in contact with the heat-conducting base is detected, so that the heat dissipation module always contacts the heat-conducting base with the heat-conducting surface at the lowest temperature.

[0008] According to the present invention, a CPU heat dissipation device includes a rotating support module comprising: a rotating shaft, a motor, a telescopic rod, and a telescopic device. The heat dissipation module is fixed on the rotating shaft, which is driven by the motor. The motor is fixed on the telescopic rod, and a telescopic device is connected to the lower part of the telescopic rod. The telescopic device drives the motor and the heat dissipation module to move up and down by moving the telescopic rod up and down.

[0009] According to a CPU heat dissipation device provided by the present invention, the plurality of guide rails include: a first guide rail, a second guide rail and a third guide rail; The first guide rail and the second guide rail intersect above the heat dissipation module; The third guide rail is positioned below the CPU and is combined with the first guide rail to form a closed guide rail.

[0010] According to a CPU heat dissipation device provided by the present invention, a first fan is provided on the first guide rail. The first fan changes its position according to the real-time data of the temperature sensor on the heat conduction surface of the heat dissipation module in order to dissipate heat from the outer surface of the heat dissipation module. A second fan is provided on the second guide rail. The second fan faces the heat sink. The second fan moves on the second guide rail following the real-time data of the heat dissipation module and the temperature sensors on both sides of the heat sink to dissipate heat from the heat sink. The third guide rail is equipped with multiple temperature sensors and a third fan. The multiple temperature sensors on the third guide rail are used to detect the temperature of the third guide rail after the CPU conducts heat downward to the motherboard. The third fan moves below the CPU based on the real-time data from the multiple temperature sensors on the third guide rail to dissipate the heat transferred downward by the CPU to the motherboard.

[0011] According to a CPU cooling device provided by the present invention, when the temperature difference between the third guide rail and the heat-conducting surface of the non-contact heat-conducting base in the cooling module exceeds a preset threshold, the first fan moves to the third guide rail and works together with the third fan to dissipate the heat transferred downward from the CPU to the motherboard.

[0012] According to a CPU cooling device provided by the present invention, an interference detection sensor is provided at the intersection of the first guide rail and the second guide rail. The detection range of the interference detection sensor is the range that overlaps when the first fan and the second fan move to the intersection position. The interference detection sensor is used to control the first fan and the second fan to prevent interference.

[0013] According to a CPU cooling device provided by the present invention, the rotational speed of the movable fan is negatively correlated with a first duration, wherein the first duration is the contact duration between the heat-conducting surface and the heat-conducting base.

[0014] The present invention also provides a server, including a CPU and a motherboard, and further including a CPU heat dissipation device as described in any of the above.

[0015] The CPU cooling device and server provided by this invention, through the continuous rotation of the cooling module, allows multiple heat-conducting surfaces to contact the heat-conducting base through rotation, and through the movable fans on multiple guide rails, continuously cools the cooling module with air, so that the heat of the cooling module is quickly removed, which can achieve rapid and efficient cooling of the CPU, and enable the CPU to run stably and efficiently for a long time. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the CPU heat dissipation device provided in an embodiment of the present invention; Figure 2 A top view of a CPU heat dissipation device provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the heat dissipation module provided in an embodiment of the present invention; Figure 4 A left view of a CPU heat dissipation device provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the rotation of the heat dissipation module provided in an embodiment of the present invention.

[0018] Figure label: 101: Thermal conductive base; 102: Heat dissipation module; 103: Rotary support module; 104: Motherboard; 105: CPU; 1011: First rail; 1012: Second rail; 1013: Temperature sensor on the thermally conductive base; 1014: Third guide rail; 1015: Screw; 1016: Hole; 1021: Thermal conductive surface; 1022: Heat sink; 1023: Temperature sensor on the heat sink; 1031: Shaft; 1032: Motor; 1033: Telescopic pole; 1034: Telescopic device; 10141: Third fan; 10142: Temperature sensor on the third guide rail; 10111: First fan; 10121: Second fan; 10211: Temperature sensor on the heat-conducting surface. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0020] Figure 1 This is a schematic diagram of the CPU heat dissipation device provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the CPU cooling device includes: a heat-conducting base 101, a heat dissipation module 102, and a rotating support module.

[0021] The thermal base 101 is used to support the entire central processing unit (CPU) heat dissipation device.

[0022] The heat-conducting base 101 is fixedly connected to the motherboard 104 by screws.

[0023] The heat-conducting base 101 contacts the CPU 105 and can conduct the heat released by the CPU 105.

[0024] The heat-conducting base 101 is provided with multiple guide rails, such as Figure 1 The first guide rail 1011, the second guide rail 1012, and the third guide rail 1014 are located around the heat dissipation module 102. Each guide rail is equipped with a movable fan, such as the first fan 10111 on the first guide rail 1011, the third fan 10141 on the third guide rail 1014, and a fan is also provided on the second guide rail 1012. The movable fans on the multiple guide rails form a movable fan module.

[0025] The plurality of guide rails include a guide rail located below the CPU 105, such as the third guide rail 1014, and a guide rail located above the heat dissipation module 102, such as the first guide rail 1011 and the second guide rail 1012.

[0026] The number of rails located below the CPU can be one or more, and this invention does not limit this.

[0027] A fan 10141 is installed on the rail located below the CPU. It can move along the rail to dissipate the heat transferred from the CPU to the motherboard.

[0028] Multiple temperature sensors 10142 are also installed on the guide rail located below the CPU. The number of guide rails located above the heat dissipation module 102 can be one or more, and the present invention does not limit this.

[0029] Figure 2 This is a top view of a CPU heat dissipation device provided in an embodiment of the present invention. Figure 2 As shown, the guide rail base 101 is fixedly connected to the motherboard 104 by screws 1015. The heat-conducting base 101 is provided with holes 1016. Taking multiple guide rails, including a first guide rail 1011 and a second guide rail 1012, as an example, a first fan 10111 that can move along the first guide rail 1011 is provided, and a second fan 10121 that can move along the second guide rail 1012 is provided. The first guide rail 1011 and the second guide rail 1012 are located around the heat dissipation module 102, specifically, they intersect above the heat dissipation module 102.

[0030] A fan is installed on the guide rail above the heat dissipation module 102, which can move along the guide rail to dissipate the heat conducted by the heat dissipation module 102.

[0031] In some embodiments, the heat-conducting base 101 is further provided with a plurality of temperature sensors 1013 for measuring the temperature of the heat-conducting base in real time.

[0032] The heat dissipation module 102 is made of a metal with good thermal conductivity, which is conducive to rapid heat dissipation.

[0033] The heat dissipation module 102 includes multiple heat-conducting surfaces. It is understood that the heat-conducting surfaces are located on the outer surface of the heat dissipation module 102. The number of heat-conducting surfaces can be designed according to requirements; this invention does not impose a specific limit on the number of heat-conducting surfaces.

[0034] Multiple temperature sensors 10211 are installed on each heat-conducting surface to measure the temperature of each heat-conducting surface in real time.

[0035] The heat dissipation module 102 includes multiple heat sinks inside, which are optionally arranged in a crisscross pattern.

[0036] In some embodiments, multiple temperature sensors are provided on both sides of each heat sink to measure the temperature on both sides of each heat sink in real time.

[0037] Multiple heat-conducting surfaces of the heat dissipation module 102 rotate to contact the heat-conducting base 101. During the contact process, the heat-conducting surfaces in contact with the heat-conducting base 101 can conduct the heat from the CPU 105 conducted by the heat-conducting base 101 to the heat sink. The heat conducted to the heat sink is then carried away by the airflow from the movable fan modules on multiple guide rails, thereby achieving rapid heat dissipation.

[0038] Figure 3 This is a schematic diagram of the heat dissipation module provided in an embodiment of the present invention. Figure 3 As shown, multiple surfaces of the heat dissipation module 102 in the same direction are heat-conducting surfaces 1021. Taking four heat-conducting surfaces as an example, each heat-conducting surface 1021 in contact with the heat-conducting base is provided with multiple temperature sensors 10211 to detect the real-time temperature of the heat-conducting surface. The interior of the heat dissipation module is composed of horizontally and vertically intersecting heat sinks 1022, and the two sides of the heat sinks 1022 are open, allowing air to pass through the middle of the heat sinks. Multiple temperature sensors 1023 are provided on each side of the heat sinks 1022 to detect the real-time temperature on both sides of the heat sinks 1022.

[0039] A rotating support module is used to control the rotation of the heat dissipation module 102. Specifically, the rotating support module controls the rotation of the heat dissipation module 102 based on the temperature difference between the heat-conducting surface 1021 and the heat-conducting base 101. Due to angle limitations, the rotating support module... Figure 1 Not shown in the image.

[0040] The CPU cooling device provided in this embodiment of the invention uses the continuous rotation of the cooling module to make multiple heat-conducting surfaces contact the heat-conducting base through rotation, and the movable fans on multiple guide rails continuously cool the cooling module with air, so that the heat of the cooling module is quickly removed, which can achieve rapid and efficient cooling of the CPU, and enable the CPU to run stably and efficiently for a long time.

[0041] In some embodiments, the rotating support module is specifically used to control the heat dissipation module to rotate cyclically when a decrease in the heat conduction efficiency between the heat-conducting surface in contact with the heat-conducting base is detected, so that the heat dissipation module always contacts the heat-conducting base with the heat-conducting surface at the lowest temperature.

[0042] It is understandable that when the temperature difference between the multiple sensors on the heat-conducting surface 1021 and the multiple sensors on the heat-conducting base 101 exceeds a preset threshold, for example, when the temperature difference between the multiple sensors on the heat-conducting surface and the multiple sensors on the heat-conducting base is greater than 5 degrees, it indicates that the heat between the heat-conducting base and the heat-conducting surface can continue to be conducted rapidly. At this time, the heat dissipation module is in a static state.

[0043] When the temperature difference between the multiple sensors on the heat-conducting surface 1021 and the multiple sensors on the heat-conducting base 101 is less than a preset threshold, for example, when the temperature difference between the multiple sensors on the heat-conducting surface and the multiple sensors on the heat-conducting base is less than 5 degrees, it indicates that the heat conduction efficiency between the heat-conducting base and the heat-conducting surface has begun to slow down. At this time, the rotating support module needs to control the heat dissipation module to rotate cyclically so that the heat dissipation module always contacts the heat-conducting base with the heat-conducting surface at the lowest temperature.

[0044] The heat dissipation module 102 rotates continuously to ensure that the lowest temperature heat-conducting surface 1021 is always in contact with the heat-conducting base 101, creating a large temperature difference. The larger the temperature difference, the faster the heat from the CPU 105 can be conducted from the heat-conducting base 101 to the heat-conducting surface 1021, and then to the heat sink 1022. The movable fan module located on multiple guide rails around the heat dissipation module 102 then blows away the heat, forming a cycle, thereby achieving the purpose of rapid heat dissipation and cooling.

[0045] In this embodiment of the invention, the continuous rotation of the heat dissipation module ensures that the lowest temperature heat-conducting surface is always in contact with the heat-conducting base, creating a high temperature difference. This enables rapid and efficient cooling of the CPU, allowing it to operate stably and efficiently for extended periods. It also reduces frequency reduction and system crashes caused by excessive CPU temperature during server operation and improves the CPU's lifespan.

[0046] Figure 4 This is a left view of a CPU cooling device provided in an embodiment of the present invention. Figure 4 As shown, the rotating support module 103 includes: a rotating shaft 1031, a motor 1032, a telescopic rod 1033, and a telescopic device 1034. The heat dissipation module 102 is fixed on the rotating shaft 1031. The rotating shaft 1031 is driven by the motor 1032. The motor 1032 is fixed on the telescopic rod 1033. The telescopic device 1034 is connected to the lower part of the telescopic rod 1033. The telescopic device 1034 drives the motor 1032 and the heat dissipation module 102 to move up and down through the up and down movement of the telescopic rod 1033.

[0047] It should be noted that Figure 4The system also includes a third rail 1014 located below the CPU, on which a fan 10141 is mounted and can move to dissipate heat transferred from the CPU to the motherboard. A second rail 1012 is equipped with a fan 10121 that can move along the second rail.

[0048] When the temperature difference between the multiple sensors on the heat-conducting surface and the multiple sensors on the heat-conducting base is less than a preset threshold, a signal is transmitted to the telescopic device. The telescopic device controls the telescopic rod to extend upward, causing the motor and the heat dissipation module to rise synchronously. When the telescopic rod reaches its highest point, a signal is sent to the motor to rotate it by a preset angle, thereby causing the heat dissipation module to rotate by that preset angle. After rotating by the preset angle, a signal is sent to the telescopic device, which controls the telescopic rod to retract to its shortest length, thereby causing the heat dissipation module to descend and contact the heat-conducting base. At this time, the heat from the heat-conducting base begins to be conducted to the heat-conducting surface, achieving a heat dissipation and cooling effect.

[0049] The preset angle is determined by the number of heat-conducting surfaces, i.e., preset angle = 360° / number of heat-conducting surfaces. For example, if the number of heat-conducting surfaces is 4, the heat dissipation module will rotate 90 degrees each time.

[0050] Figure 5 This is a schematic diagram illustrating the rotation of the heat dissipation module provided in an embodiment of the present invention. Figure 5 As shown, during the operation of the heat dissipation module 102, the fan on the guide rail continuously blows air onto the heat sink and outer surface of the heat dissipation module 102, continuously carrying away a large amount of heat. The temperature of the heat-conducting surface will continuously decrease. When it completes the 360-degree rotation and comes into contact with the heat-conducting base again, the temperature difference between the heat-conducting surface and the heat-conducting base will be relatively large. The larger temperature difference can more quickly conduct the heat in the heat-conducting base to the heat-conducting surface, and then to the heat sink. The heat is carried away by air cooling, forming a cycle, thereby achieving the purpose of rapid cooling.

[0051] In this embodiment of the invention, the heat dissipation module is continuously rotated by the rotating support module, so that the lowest temperature heat-conducting surface is always in contact with the heat-conducting base, forming a high temperature difference. This enables the CPU to cool down quickly and efficiently, allowing the CPU to run stably and efficiently for a long time. It also reduces the frequency reduction and downtime problems caused by excessive CPU temperature during server operation and improves the service life.

[0052] In some embodiments, reference Figure 1 The multiple guide rails include: first guide rail 1011, second guide rail 1012 and third guide rail 1014; The first guide rail 1011 and the second guide rail 1012 intersect above the heat dissipation module; The third guide rail 1014 is located below the CPU 105 and is combined with the first guide rail 1011 to form a closed guide rail.

[0053] The heat-conducting base 101 is provided with holes, and a movable fan 10141 is provided on the third guide rail 1014. The third guide rail 1014 can be connected to the first guide rail 1011 through the holes to form a whole and a closed guide rail.

[0054] The third rail 1014 is located below the CPU 105. Multiple temperature sensors 10142 are installed on the third rail 1014 to detect the temperature after the CPU conducts heat downwards to the motherboard.

[0055] In this embodiment of the invention, a guide rail and a fan can be set below the CPU and combined with the guide rail above the CPU to form a closed guide rail. The fan can move below the CPU to dissipate the heat transferred from the CPU to the motherboard.

[0056] Optionally, a first fan 10111 is provided on the first guide rail 1011. The first fan changes its position according to the real-time data of the temperature sensor on the heat conduction surface of the heat dissipation module in order to dissipate heat from the outer surface of the heat dissipation module. The first fan 10111 adjusts its position based on real-time data from the heat-conducting surface temperature sensor to dissipate heat from the outer surface of the heat dissipation module, achieving temperature equilibrium. This includes the following scenarios: 1) Command 1: When it is detected that the highest temperature of the temperature sensor on the heat-conducting surface other than the heat-conducting base is more than 5 degrees higher than the lowest temperature, and only one point is overheated, the first fan will move to the highest temperature point to perform air cooling; when two or more points are overheated, the first fan will continuously switch positions at several high temperature points, staying at each point for 5 seconds to dissipate heat, until only one overheated point remains.

[0057] 2) Command 2: When the highest temperature of the temperature sensor on the heat-conducting surface (excluding the surface in contact with the heat-conducting base) is less than 5 degrees Celsius lower than the lowest temperature, the first fan will move to... Figure 4 Air cooling is applied to the right side of the first guide rail (the heat-conducting surface corresponding to the right side of the first guide rail is the heat-conducting surface with the highest temperature among the non-contact surfaces, because this heat-conducting surface has just been separated from the heat-conducting base).

[0058] 3) Command 3: When the temperature difference between the heat-conducting base and the heat-conducting surface is less than 5 degrees, the first fan will move to the bottom of the first guide rail as close as possible to its current position. At this time, the heat dissipation module will also rise synchronously, ready to rotate and replace the heat-conducting surface. The first fan will directly blow air onto the heat dissipation base to assist in cooling the heat-conducting base.

[0059] Instruction 3 has a higher priority than instruction 1 and instruction 2.

[0060] 4) After the heat-conducting surface contacts the heat-conducting base, the first fan operates according to instructions 1 and 2.

[0061] A second fan 10121 is provided on the second guide rail 1012. The second fan faces the heat sink 1023. The second fan moves on the second guide rail according to the real-time data of the heat dissipation module and the temperature sensors on both sides of the heat sink to dissipate heat from the heat sink.

[0062] The second fan 10121 will move on the second guide rail, facing the heatsink, and the air will pass through the middle of the heatsink of the heat dissipation module to achieve fast and efficient air cooling.

[0063] When the heat dissipation module moves up and down, the second fan moves up and down synchronously to ensure that air can flow through the heat sink inside the heat dissipation module at all times, continuously carrying away heat and avoiding air-cooling gaps, thus achieving efficient heat dissipation.

[0064] Multiple temperature sensors are installed on both sides of the heatsink. When the average temperature detected by one sensor is 5 degrees Celsius higher than the average temperature of the other sensor, the second fan will move to the side with the higher temperature via the second guide rail to dissipate heat from the heatsink, ensuring temperature balance throughout the entire heat dissipation module and avoiding uneven heat dissipation. When the temperatures on both sides are less than 5 degrees Celsius, the second fan will remain fixed on one side to continuously provide air cooling for the heatsink.

[0065] The third rail 1014 is equipped with multiple temperature sensors 10142 and a third fan 10141. The multiple temperature sensors on the third rail are used to detect the temperature of the third rail after the CPU conducts heat downward to the motherboard. The third fan moves below the CPU based on the real-time data from the multiple temperature sensors on the third rail to dissipate the heat transferred downward by the CPU to the motherboard.

[0066] The third guide rail is combined with the first guide rail to form a closed guide rail, which is fixed below the CPU. The first and third fans can move on the closed guide rail formed by the first and third guide rails. The primary function of the third fan is to dissipate heat from the motherboard at the bottom of the CPU. In some embodiments, the following scenarios are included: 1) When the highest temperature of the sensor on the third guide rail is detected to be 3 degrees higher than the lowest temperature, and only one point is overheating, the third fan moves to the highest temperature position for air cooling to reduce the temperature. 2) When the highest temperature of the sensor on the third guide rail is detected to be 3 degrees higher than the lowest temperature, and there are two or more points that are overheating, the third fan will continuously switch positions at several high temperature points, staying at each point for 5 seconds to dissipate heat, until only one overheating point remains.

[0067] 3) When the temperature difference between the highest and lowest temperatures detected by the sensor on the third guide rail is less than 3 degrees, the fan moves to the middle of the third guide rail to cool the CPU.

[0068] In this embodiment of the invention, a guide rail is provided around the heat dissipation module, and a movable fan module is provided on the guide rail. Based on real-time data from multiple temperature sensors, the fan is controlled to move to different positions to cool down, so that the heat dissipation module can maintain rapid cooling and temperature balance.

[0069] In some embodiments, when the temperature difference between the third guide rail and the heat-conducting surface of the non-contact heat-conducting base in the heat dissipation module exceeds a preset threshold, the first fan moves onto the third guide rail and works with the third fan to dissipate the heat transferred from the CPU to the motherboard.

[0070] That is, when the temperature on the third rail is detected to be more than 5 degrees higher than the temperature on the heat-conducting surface of the non-contact heat-conducting base in the heat dissipation module, the first fan will move to the third rail to cool the motherboard together with the third fan until the temperature is less than 3 degrees. Then the first fan will return to the first rail and execute the above instructions 1 and 2.

[0071] In some embodiments, an interference detection sensor is provided at the intersection of the first guide rail and the second guide rail. The detection range of the interference detection sensor is the range that overlaps when the first fan and the second fan move to the intersection position. The interference detection sensor is used to control the first fan and the second fan to prevent interference.

[0072] Specifically, an interference detection sensor is installed at the intersection of the first and second guide rails. The sensor range is the overlapping range when each fan moves to this position. When the second fan on the second guide rail moves, it will detect whether the first fan is in the overlapping position to avoid interference during the fan movement.

[0073] 1) When the first fan is in the phase overlap position, a signal will be sent to the first fan to move to the nearest phase overlap range. After the second fan has finished moving, the first fan will return to its original position.

[0074] 2) When the first fan is not in the overlapping position, a signal will be sent to the first fan to control it to remain stationary. After the second fan has moved, the first fan will continue to execute the original command.

[0075] It should be noted that, in the embodiments of the present invention, the first fan, the second fan, and the third fan are used to refer to the fan on the first guide rail, the fan on the second guide rail, and the fan on the third guide rail, respectively.

[0076] The temperature difference thresholds mentioned in the above embodiments, such as 5 degrees and 3 degrees, can also be other temperatures. This invention uses 5 degrees and 3 degrees as examples for illustration, and does not represent a specific limitation on the temperature difference threshold.

[0077] The present invention does not limit the number of guide rails, and may include, for example, a fourth guide rail, a fifth guide rail, a sixth guide rail, etc., and can refer to the structure of the first guide rail, the second guide rail and the third guide rail.

[0078] In this embodiment of the invention, by setting an interference detection sensor, collisions between fans on different guide rails during the heat dissipation process can be avoided, which can effectively improve the reliability of the CPU heat dissipation device.

[0079] In some embodiments, the rotational speed of the movable fan is negatively correlated with a first duration, which is the contact duration between the heat-conducting surface and the heat-conducting base.

[0080] The contact time between the heat-conducting surface and the heat-conducting base controls the fan speed (such as the first, second, and third fans mentioned above). A longer contact time indicates that the CPU is releasing less heat, resulting in a lower fan speed; a shorter contact time indicates that the CPU is releasing a large amount of heat, resulting in a higher fan speed. The speed of a movable fan is negatively correlated with the contact time, for example, the following scenarios may be included: 1) When the contact time is less than 1 minute, the fan runs at maximum power and speed reaches 100% to remove the heat from the heat sink as quickly as possible; 2) When the contact time is greater than 1 minute but less than 2 minutes, the fan speed will operate at 90% of its maximum speed; 3) When the contact time is greater than 2 minutes but less than 3 minutes, the fan speed will operate at 80% of its maximum speed; 4) When the contact time is greater than 3 minutes but less than 4 minutes, the fan speed will operate at 70% speed; 5) When the contact time is greater than 4 minutes but less than 5 minutes, the fan speed will operate at 60% of its maximum speed; 6) When the contact time is greater than 5 minutes but less than 6 minutes, the fan speed shall be 50%; 7) When the contact time is greater than 6 minutes but less than 8 minutes, the fan speed will operate at 40% of its maximum speed; 8) When the contact time is greater than 8 minutes, the fan speed will operate at the minimum speed of 30%.

[0081] In this embodiment of the invention, the temperature difference between the heat-conducting surface and the heat-conducting base controls the rotation of the heat dissipation module, while the contact time between the heat-conducting surface and the heat-conducting base can control the fan speed. This allows for optimal reduction of the power consumption of the CPU heat dissipation device while cooling the CPU, thus saving energy.

[0082] It should be noted that in the above embodiments of the present invention, the logic implementation of the control part can all be implemented on the CPU. The CPU runs a heat dissipation control method, which includes: When the temperature difference between the multiple sensors on the heat-conducting surface and the multiple sensors on the heat-conducting base is less than a preset threshold, the heat dissipation module is controlled to rotate.

[0083] When it is detected that the highest temperature of the temperature sensor on the heat-conducting surface other than the one in contact with the heat-conducting base is more than 5 degrees higher than the lowest temperature, and only one point is overheating, the first fan is controlled to move to the highest temperature point to perform air cooling.

[0084] When it is detected that the highest temperature of the temperature sensor on the heat-conducting surface other than the heat-conducting base is less than 5 degrees compared to the lowest temperature, the first fan is controlled to move to the corresponding position on one side of the first guide rail for air cooling.

[0085] When the temperature difference between the heat-conducting base and the heat-conducting surface is less than 5 degrees, the first fan is controlled to move to the bottom of the first guide rail according to its current position. At this time, the heat dissipation module is also raised synchronously, ready to rotate and replace the heat-conducting surface. The first fan is controlled to blow air onto the heat dissipation base to help cool the heat-conducting base.

[0086] When the average temperature of one sensor is detected to be 5 degrees higher than the average temperature of the other sensor, the second fan is controlled to move along the second guide rail to the side with the higher temperature to dissipate heat from the heat sink.

[0087] When the temperature on both sides is less than 5 degrees, the second fan is fixed on one side to continuously cool the heat sink.

[0088] When the highest temperature detected by the sensor on the third guide rail is 3 degrees higher than the lowest temperature, and only one point is overheating, the third fan is controlled to move to the highest temperature position for air cooling to reduce the temperature. When the highest temperature detected by the sensor on the third guide rail is 3 degrees higher than the lowest temperature, and there are two or more points that are overheating, the third fan is controlled to continuously switch positions at several high-temperature points, staying at each point for 5 seconds to dissipate heat, until only one overheating point remains.

[0089] When the temperature difference between the highest and lowest temperatures detected by the sensor on the third guide rail is less than 3 degrees, the fan is controlled to move to the middle of the third guide rail to cool the CPU.

[0090] When the temperature difference between the third guide rail and the heat-conducting surface of the non-contact heat-conducting base in the heat dissipation module exceeds 3 degrees, the first fan moves to the third guide rail and works with the third fan to dissipate the heat transferred from the CPU to the motherboard.

[0091] When the first fan is in the overlapping position, control the first fan to move to the nearest point outside the overlapping range. After the second fan has finished moving, control the first fan to return to its original position.

[0092] When the first fan is not in the overlapping position, control the first fan to remain stationary. After the second fan has moved, the first fan will continue to execute the original command.

[0093] This invention also provides a server, including a CPU and a motherboard, and a CPU heat dissipation device as described in the foregoing embodiments. For an understanding of the server, please refer to the previous embodiments, which will not be repeated here.

[0094] The server provided in this embodiment of the invention can achieve the same beneficial effects as the CPU heat dissipation devices described in the foregoing embodiments, and will not be repeated here.

[0095] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0096] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A CPU heat dissipation device, characterized in that, include: The components include a heat-conducting base, a heat dissipation module, and a rotating support module. The thermal base is used to support the entire central processing unit (CPU) heat dissipation device. The thermal base is fixedly connected to the motherboard and in contact with the CPU to conduct the heat released by the CPU. The heat-conducting base is provided with multiple guide rails, which are located around the heat dissipation module, and each guide rail is provided with a movable fan. The heat dissipation module includes multiple heat-conducting surfaces, and the interior of the heat dissipation module includes multiple heat sinks. The multiple heat-conducting surfaces rotate to contact the heat-conducting base, and are used to conduct the heat conducted by the heat-conducting base to the heat sinks, and the movable fan removes the heat by blowing air. The rotating support module is used to control the rotation of the heat dissipation module based on the temperature difference between the heat-conducting surface and the heat-conducting base. The rotating support module includes: a rotating shaft, a motor, a telescopic rod, and a telescopic device. The heat dissipation module is fixed on the rotating shaft, which is driven by the motor. The motor is fixed on the telescopic rod, and a telescopic device is connected to the lower part of the telescopic rod. The telescopic device drives the motor and the heat dissipation module to move up and down by moving the telescopic rod up and down.

2. The CPU heat dissipation device according to claim 1, characterized in that, The heat-conducting base is also equipped with multiple temperature sensors for real-time measurement of the temperature of the heat-conducting base; Each of the heat-conducting surfaces is provided with multiple temperature sensors for measuring the temperature of each heat-conducting surface in real time; Multiple temperature sensors are installed on both sides of each heat sink to measure the temperature on both sides of each heat sink in real time.

3. The CPU heat dissipation device according to claim 2, characterized in that, The rotating support module is specifically used to control the heat dissipation module to rotate cyclically when a decrease in the heat conduction efficiency between the heat-conducting surface in contact with the heat-conducting base is detected, so that the heat dissipation module always contacts the heat-conducting base with the heat-conducting surface at the lowest temperature.

4. The CPU heat dissipation device according to any one of claims 2-3, characterized in that, The plurality of guide rails includes: a first guide rail, a second guide rail, and a third guide rail; The first guide rail and the second guide rail intersect above the heat dissipation module; The third guide rail is positioned below the CPU and is combined with the first guide rail to form a closed guide rail.

5. The CPU heat dissipation device according to claim 4, characterized in that, A first fan is provided on the first guide rail. The first fan changes its position according to the real-time data of the temperature sensor on the heat conduction surface of the heat dissipation module in order to dissipate heat from the outer surface of the heat dissipation module. A second fan is provided on the second guide rail. The second fan faces the heat sink. The second fan moves on the second guide rail following the real-time data of the heat dissipation module and the temperature sensors on both sides of the heat sink to dissipate heat from the heat sink. The third guide rail is equipped with multiple temperature sensors and a third fan. The multiple temperature sensors on the third guide rail are used to detect the temperature of the third guide rail after the CPU conducts heat downward to the motherboard. The third fan moves below the CPU based on the real-time data from the multiple temperature sensors on the third guide rail to dissipate the heat transferred downward by the CPU to the motherboard.

6. The CPU heat dissipation device according to claim 5, characterized in that, When the temperature difference between the third guide rail and the heat-conducting surface of the non-contact heat-conducting base in the heat dissipation module exceeds a preset threshold, the first fan moves to the third guide rail and works with the third fan to dissipate the heat transferred from the CPU to the motherboard.

7. The CPU heat dissipation device according to claim 5, characterized in that, An interference detection sensor is provided at the intersection of the first guide rail and the second guide rail. The detection range of the interference detection sensor is the range that overlaps when the first fan and the second fan move to the intersection position. The interference detection sensor is used to control the first fan and the second fan to prevent interference.

8. The CPU heat dissipation device according to claim 1, characterized in that, The rotational speed of the movable fan is negatively correlated with the first duration, which is the contact duration between the heat-conducting surface and the heat-conducting base.

9. A server, comprising a CPU and a motherboard, characterized in that, It also includes a CPU cooling device as described in any one of claims 1 to 8.

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