Apparatus for supplying a solution, apparatus for processing a substrate, and method for processing a substrate

Abstract

Apparatuses for supplying a solution, apparatuses for processing a substrate, and methods of processing a substrate are provided. An apparatus for processing a substrate can include a chemical liquid discharging portion configured to discharge a chemical liquid having a first specific gravity onto a substrate, a chemical liquid supplying portion configured to supply the chemical liquid to the chemical liquid discharging portion, a fluid supplying portion configured to supply a fluid having a second specific gravity different from the first specific gravity, and a monitoring portion including a trapping portion configured to trap the fluid flowing into the chemical liquid supplying portion and a sensing portion configured to sense inflow of the fluid. Heat transfer can occur between the fluid and the chemical liquid such that the chemical liquid has a desired temperature. The fluid can be trapped at a top portion or a bottom portion of the trapping portion according to a difference between the first specific gravity and the second specific gravity.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 2021-0189056, filed on December 27, 2021 with the Korean Intellectual Property Office (KIPO), the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Exemplary embodiments of the present invention relate to apparatus for supplying a solution, equipment for processing a substrate, and a method for processing a substrate. More specifically, exemplary embodiments of the present invention relate to apparatus for supplying a solution capable of providing a chemical liquid to manufacture an integrated circuit device, equipment for processing a substrate including such apparatus for supplying a solution, and a method for processing a substrate using the equipment for processing a substrate. Background Technology

[0004] In the manufacturing process of integrated circuit devices such as semiconductor devices or display devices, a process for discharging chemical liquids onto a substrate can be performed. For example, a process for coating a substrate with a chemical liquid including a photoresist can be performed.

[0005] Photoresist coated on a substrate needs to be at a required temperature depending on the process conditions, and therefore the apparatus for supplying the chemical liquid typically has a dual-pipe configuration. For example, the apparatus for supplying the chemical liquid may include a first line for supplying a chemical liquid comprising the photoresist and a second line partially surrounding the first line. However, fluid used to allow the chemical liquid to reach the required temperature may leak from the second line into the first line, and the fluid may also mix with the chemical liquid. Such leakage of fluid and mixing of fluid and chemical liquid can lead to defects in the process performed using the chemical liquid. Summary of the Invention

[0006] One object of the present invention is to provide an apparatus for supplying a chemical liquid at a desired temperature, which can be supplied according to process conditions.

[0007] Another object of the present invention is to provide an apparatus for processing a substrate, including means for supplying a solution, the means for supplying the solution being capable of supplying a chemical liquid having a desired temperature according to process conditions.

[0008] Another object of the present invention is to provide a method for processing a substrate using an apparatus for processing a substrate, said apparatus for processing a substrate including means for supplying a chemical liquid having a desired temperature according to process conditions.

[0009] According to one aspect of the invention, an apparatus for supplying a solution is provided, comprising: a fluid supply section configured to supply a fluid; a chemical liquid supply section configured to supply a chemical liquid having a specific gravity different from that of the fluid; and a monitoring section including a trapping section configured to trap the fluid flowing into the chemical liquid supply section and a sensing section configured to sense the inflow of the fluid, wherein heat transfer is generated between the fluid and the chemical liquid, and wherein the fluid is trapped at a top or bottom portion of the trapping section according to the difference between the specific gravity of the fluid and the specific gravity of the chemical liquid.

[0010] In an exemplary embodiment, the fluid supply unit may be configured to provide fluid along a first direction, and the chemical liquid supply unit may be configured to provide chemical liquid in a second direction different from the first direction.

[0011] In an exemplary embodiment, the fluid supply section may be configured to partially surround or pass through the chemical liquid supply section.

[0012] In some exemplary embodiments, the apparatus for supplying the solution may additionally include a control unit configured to interrupt the supply of chemical liquid from the chemical liquid supply unit when the monitoring unit detects the inflow of fluid.

[0013] According to another aspect of the invention, an apparatus for processing a substrate is provided. The apparatus for processing a substrate may include: a chemical liquid discharge section configured to discharge a chemical liquid having a first specific gravity onto the substrate; a chemical liquid supply section configured to supply the chemical liquid to the chemical liquid discharge section; a fluid supply section configured to supply a fluid having a second specific gravity different from the first specific gravity; and a monitoring section including a collection section configured to collect the fluid flowing into the chemical liquid supply section and a sensing section configured to sense the inflow of the fluid. Heat transfer can be generated between the fluid and the chemical liquid, causing the chemical liquid to have a desired temperature. The fluid can be collected at the top or bottom portion of the collection section based on the difference between the first and second specific gravities.

[0014] In an exemplary embodiment, the chemical liquid discharge section may include a slit nozzle configured to discharge chemical liquid onto the substrate in a scanning manner or an inkjet head configured to discharge chemical liquid onto the substrate in a jet manner.

[0015] In an exemplary embodiment, when the first specific gravity of the chemical liquid is greater than the second specific gravity of the fluid, the fluid can be captured at the top of the capturing section, and the sensing section can be disposed at the top of the capturing section.

[0016] In some exemplary embodiments, when the first specific gravity of the chemical liquid is less than the second specific gravity of the fluid, the fluid can be captured at the bottom of the capturing section, and the sensing section can be disposed at the bottom of the capturing section.

[0017] In an exemplary embodiment, the chemical liquid supply unit may be configured to provide chemical liquid in a first direction, and the fluid supply unit may be configured to provide fluid in a second direction different from the first direction.

[0018] In an exemplary embodiment, the fluid supply section may be configured to partially surround or pass through the chemical liquid supply section.

[0019] In some exemplary embodiments, the apparatus for processing the substrate may further include a control unit configured to interrupt the supply of chemical liquid when the monitoring unit detects the inflow of fluid.

[0020] In some exemplary embodiments, the control unit may be configured to interrupt the supply of chemical liquid from the chemical liquid supply unit and the discharge of chemical liquid from the chemical liquid discharge unit.

[0021] According to another aspect of the present invention, a method for processing a substrate is provided. In this method, a chemical liquid having a first specific gravity can be supplied from a chemical liquid supply section to a chemical liquid discharge section, and the chemical liquid having the first specific gravity can be discharged from the chemical liquid discharge section onto the substrate. A fluid having a second specific gravity different from the first specific gravity can be supplied around the chemical liquid by a fluid supply section. The fluid flowing into the chemical liquid supply section can be captured by a capturing section, and the inflow of fluid into the capturing section can be sensed by a sensing section. Heat transfer can be generated between the fluid and the chemical liquid, causing the chemical liquid to have a desired temperature. The fluid can be captured at the top or bottom portion of the capturing section based on the difference between the first and second specific gravities.

[0022] In an exemplary embodiment, the chemical liquid discharge section can discharge chemical liquid onto the substrate in a scanning or spraying manner.

[0023] In an exemplary embodiment, when the first specific gravity of the chemical liquid is greater than the second specific gravity of the fluid, the fluid can be captured at the top of the capturing section, and the sensing section can be disposed at the top of the capturing section.

[0024] In some exemplary embodiments, when the first specific gravity of the chemical liquid is less than the second specific gravity of the fluid, the fluid can be captured at the bottom of the capturing section, and the sensing section can be disposed at the bottom of the capturing section.

[0025] In an exemplary embodiment, the chemical liquid may be provided in a first direction, and the fluid may be provided in a second direction different from the first direction.

[0026] In an exemplary embodiment, the fluid supply section may partially surround or pass through the chemical liquid supply section.

[0027] In some exemplary embodiments, the supply of chemical liquid can be interrupted when the sensing unit detects the inflow of fluid.

[0028] In some exemplary embodiments, the supply of chemical liquid from the chemical liquid supply unit can be interrupted, and the discharge of chemical liquid from the chemical liquid discharge unit can be interrupted.

[0029] According to an exemplary embodiment, the chemical liquid supplied from the chemical liquid supply unit can be heated to a desired temperature using the fluid supplied from the fluid supply unit, while preventing the fluid and chemical liquid from mixing. Furthermore, even if fluid inflow is detected, defects in the process performed using the chemical liquid can be prevented, while also preventing the fluid and chemical liquid from mixing. Attached Figure Description

[0030] Exemplary embodiments will become clearer from the following detailed description taken in conjunction with the accompanying drawings. The following drawings represent non-limiting exemplary embodiments as described herein.

[0031] Figure 1 This is a schematic cross-sectional view illustrating an apparatus for processing a substrate according to an exemplary embodiment of the present invention.

[0032] Figure 2 and Figure 3 This is an enlarged cross-sectional view schematically illustrating the monitoring section of a solution supply apparatus according to an exemplary embodiment of the present invention. Detailed Implementation

[0033] Various embodiments will be described more fully below with reference to the accompanying drawings, some of which illustrate specific embodiments. However, the invention can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make this specification thorough and complete, and to fully convey the scope of the invention to those skilled in the art. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for clarity.

[0034] It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to," or "attached to" another element or layer, it may be directly on, connected to, or attached to the other element or layer, or there may be an intervening element or layer. Conversely, when an element is referred to as being "directly on" another element or layer, "directly connected to," or "directly attached to" another element or layer, there is no intervening element or layer. The same reference numerals always refer to the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, and / or portion from another region, layer, or portion. Therefore, without departing from the teachings of the invention, the first element, first component, first region, first layer, or first portion discussed below may be referred to as a second element, second component, second region, second layer, or second portion.

[0036] For ease of description, spatially relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or feature and another element(s) shown in the figures. It will be understood that, in addition to the orientations shown in the figures, spatially relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features will subsequently be oriented “above” other elements or features. Thus, the exemplary term “below” can include both above and below orientations. The device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein are interpreted accordingly.

[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well. It will also be understood that the terms “comprises” and / or “comprising,” when used in this specification, designate the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0038] Embodiments are described herein with reference to cross-sectional views as schematic diagrams of idealized embodiments (and intermediate structures). Thus, variations from the illustrated shapes can be anticipated, for example, due to manufacturing techniques and / or tolerances. Therefore, embodiments should not be construed as limited to the specific shapes of the regions shown herein, but should include, for example, shape deviations due to manufacturing processes. For instance, an implantation region shown as rectangular will typically have rounded or curved features at its edges and / or a gradient of implantation concentration, rather than a binary variation from the implantation region to the non-implantation region. Similarly, a buried region formed by implantation can result in some implantation in the region between the buried region and the surface where implantation occurs. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to represent the actual shapes of the regions of the device, nor are they intended to limit the scope of the invention.

[0039] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms, such as those defined in common dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and shall not be construed as having an idealized or overly formal meaning unless expressly defined herein.

[0040] In the following description, an apparatus for supplying chemical liquids according to an exemplary embodiment will be described with reference to the accompanying drawings.

[0041] Figure 1 This is a schematic cross-sectional view illustrating an apparatus for processing a substrate according to an exemplary embodiment of the present invention.

[0042] Figure 1 The apparatus 100 shown for processing a substrate can be configured to provide a predetermined chemical liquid onto the substrate to manufacture an integrated circuit device, such as a semiconductor device or a display device. (Reference) Figure 1 The apparatus 100 for processing the substrate may include a device for supplying a solution. This device may include a chemical liquid supply unit 13, a fluid supply unit 15, a monitoring unit 17, and a control unit 23. Additionally, the apparatus 100 for processing the substrate may include a chemical liquid discharge unit 11.

[0043] The chemical liquid discharge section 11 of the device 100 for processing a substrate can be configured to provide a solution having a first specific gravity onto the substrate. For example, the solution having the first specific gravity can be a chemical liquid. Examples of such chemical liquids having the first specific gravity may include, but are not limited to, photoresist, developer, etchant, or cleaning solution. In an exemplary embodiment, the chemical liquid discharge section 11 may include a slit nozzle for coating the chemical liquid onto the substrate in a scanning manner or an inkjet head for coating the chemical liquid onto the substrate in a jet manner.

[0044] The chemical liquid supply unit 13 can be configured to supply chemical liquid to the chemical liquid discharge unit 11. The chemical liquid supply unit 13 may include a chemical liquid storage unit for storing chemical liquid therein and a chemical liquid supply line connecting the chemical liquid storage unit to the chemical liquid discharge unit 11 to supply chemical liquid from the chemical liquid storage unit to the chemical liquid discharge unit 11.

[0045] The fluid supply unit 15 can be configured to allow the chemical liquid to have a temperature according to process conditions as it is supplied from the chemical liquid supply unit 13 to the chemical liquid discharge unit 11. In an exemplary embodiment, the fluid supply unit 15 can raise or lower the temperature of the chemical liquid so that it can have a desired temperature. For example, the fluid supply unit 15 can provide a fluid, such as a liquid with a predetermined temperature, around the chemical liquid supplied from the chemical liquid supply unit 13 to the chemical liquid discharge unit 11. Here, the liquid supplied from the fluid supply unit 15 may have a second specific gravity different from the first specific gravity of the chemical liquid. In an exemplary embodiment, the liquid supplied from the fluid supply unit 15 may include temperature-controlled water (CTW). Alternatively, the fluid supply unit 15 may provide other fluids suitable for regulating the temperature of the chemical liquid.

[0046] If the fluid supplied from fluid supply unit 15 mixes with the chemical liquid supplied from chemical liquid supply unit 13, the composition of the chemical liquid may change, and may therefore cause adverse effects in the process performed using such chemical liquid. In an exemplary embodiment, fluid supply unit 15 and chemical liquid supply unit 13 may have a dual-pipe configuration. For example, fluid supply unit 15 may substantially surround a portion of chemical liquid supply unit 13. Alternatively, fluid supply unit 15 may extend through chemical liquid supply unit 13.

[0047] According to an exemplary embodiment, heat transfer can be achieved between the fluid in the fluid supply unit 15 and the chemical liquid in the chemical liquid supply unit 13. Specifically, when the temperature of the chemical liquid is lower than the desired process temperature, heat can be transferred from the fluid with a relatively high temperature to the chemical liquid. When the chemical liquid has a temperature higher than the desired process temperature, heat can move from the chemical liquid to the fluid with a relatively low temperature. Therefore, the temperature of the chemical liquid supplied from the chemical liquid supply unit 13 can be appropriately adjusted by using the fluid supply unit 15.

[0048] In an exemplary embodiment, as described above, the fluid supplied from the fluid supply unit 15 may have a second specific gravity that differs from the first specific gravity of the chemical liquid. For example, the second specific gravity may be substantially higher or substantially lower than the first specific gravity. Since the fluid and the chemical liquid may each have different specific gravities, the fluid and the chemical liquid may not mix even if the fluid flows into the chemical liquid supply unit 13.

[0049] In some exemplary embodiments, the fluid may flow in a direction different from that of the chemical liquid. For example, while the chemical liquid flows from the chemical liquid supply section 13 in a first direction, the fluid from the fluid supply section 15 may flow in a second direction different from the first direction. If the fluid flows in the first direction, the chemical liquid may have a relatively low temperature near the chemical liquid discharge section 11. When the chemical liquid and the fluid flow in different directions, the chemical liquid can maintain a desired temperature.

[0050] According to the above configuration of the equipment 100 for processing substrates, the chemical liquid supplied from the chemical liquid supply unit 13 can be brought to a desired temperature using the fluid supplied from the fluid supply unit 15, while preventing the fluid and chemical liquid from mixing. For example, the chemical liquid including photoresist supplied by the chemical liquid supply unit 13 can be kept at the desired process temperature using the CTW supplied by the fluid supply unit 15.

[0051] During the supply of chemical liquid from chemical liquid supply unit 13 and fluid from fluid supply unit 15, fluid may flow from fluid supply unit 15 into chemical liquid supply unit 13. Specifically, when the apparatus 100 for processing substrates has a dual-pipe configuration where fluid supply unit 15 passes through chemical liquid supply unit 13, fluid may leak from fluid supply unit 15 into chemical liquid supply unit 13. Although the fluid has a second specific gravity different from the first specific gravity of the chemical liquid, if the fluid partially mixes with the chemical liquid, it may lead to defects in the process performed using the chemical liquid. Considering this problem, the apparatus 100 for processing substrates may include a monitoring unit 17.

[0052] like Figure 1As shown, the monitoring unit 17 can sense and identify the fluid flowing from the fluid supply unit 15 to the chemical liquid supply unit 13. In other words, the monitoring unit 17 can monitor for fluid leakage from the fluid supply unit 15 to the chemical liquid supply unit 13. In this case, the monitoring unit 17 can be located between the fluid supply unit 15 and the chemical liquid discharge unit 11, or between the chemical liquid supply unit 13 and the chemical liquid discharge unit 11.

[0053] Figure 2 and Figure 3 This is an enlarged cross-sectional view schematically illustrating the monitoring section of a device for supplying a solution according to an exemplary embodiment of the present invention.

[0054] In an exemplary embodiment, the monitoring unit 17 may include a collection unit 19 and a sensing unit 21. The collection unit 19 may be connected to the chemical liquid supply unit 13. The collection unit 19 may collect the fluid at its top or bottom portion by utilizing the difference between the specific gravity of the fluid and the specific gravity of the chemical liquid. Figure 2 As shown, when the second specific gravity of the fluid is substantially less than the first specific gravity of the chemical liquid, the fluid can be trapped at the top portion of the trapping section 19. Conversely, as... Figure 3 As shown, when the second specific gravity is substantially greater than the first specific gravity, the fluid can be captured at the bottom of the capturing section 19. In order to capture such fluid, the monitoring section 17 may have a substantially tubular shape in which its vertical axis is longer than its horizontal axis.

[0055] Now for reference Figure 1 The sensing unit 21 can be configured to sense the fluid trapped in the trapping section 19. The sensing unit 21 can be positioned at the top or bottom of the trapping section 19 depending on the difference between the specific gravity of the fluid and the specific gravity of the chemical liquid. The sensing unit 21 may include a resistance sensor. For example, when the chemical liquid supplied from the chemical liquid supply section 13 includes a photoresist having a first specific gravity and the fluid supplied from the fluid supply section 15 includes CTW having a second specific gravity, the sensing unit 21 can sense the fluid trapped at the top of the trapping section 19 (see [link to documentation]). Figure 2 When the fluid supplied from the fluid supply unit 15 includes other fluids having a second specific gravity that is smaller than the first specific gravity, the sensing unit 21 can sense the fluid captured at the bottom portion of the capturing unit 19 (see...). Figure 3 ).

[0056] With the monitoring unit 17 having the above configuration, the fluid leaking from the fluid supply unit 15 can be prevented from mixing with the chemical liquid, and the fluid leak can be monitored.

[0057] The control unit 23 of the device for supplying the solution can interrupt the supply of chemical liquid from the chemical liquid supply unit 13. Furthermore, the control unit 23 can terminate the discharge of chemical liquid from the chemical liquid discharge unit 11 onto the substrate. In an exemplary embodiment, the sensing unit 21 can generate a sensing signal when it senses the inflow of fluid and can transmit the sensing signal to the control unit 23. After receiving the sensing signal from the sensing unit 21, when the control unit 23 identifies fluid trapped in the trapping unit 19, the control unit 23 can terminate the supply of chemical liquid from the chemical liquid supply unit 13 and the discharge of chemical liquid from the chemical liquid discharge unit 11. Therefore, even if the inflow of fluid is detected, defects in the process performed using chemical liquids can be prevented, while preventing the mixing of fluid and chemical liquid.

[0058] Equipment for processing substrates, including means for supplying solutions, can be effectively used in the manufacture of integrated circuit devices such as semiconductor devices or display devices, particularly organic light-emitting display (OLED) devices or quantum dot light-emitting display (QLED) devices.

[0059] The above is a description of the embodiments and should not be construed as limiting the embodiments. Although some embodiments have been described, those skilled in the art will readily understand that many modifications can be made to the embodiments without substantially departing from the novel teachings and advantages of the invention. Therefore, all such modifications are intended to be included within the scope of the invention as defined in the claims. In the claims, the means plus function clause is intended to cover the structures described herein that perform the functions, and not only structural equivalents but also equivalent structures. Therefore, it should be understood that the above is a description of various embodiments and should not be construed as limiting oneself to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims.

Claims

1. An apparatus for supplying a solution, comprising: The fluid supply unit is configured to provide fluid; A chemical liquid supply unit is configured to provide a chemical liquid having a specific gravity different from that of the fluid. The monitoring unit includes a collection unit configured to capture the fluid flowing into the chemical liquid supply unit and a sensing unit configured to sense the inflow of the fluid; as well as The control unit is configured to interrupt the supply of the chemical liquid from the chemical liquid supply unit when the monitoring unit detects the inflow of the fluid, wherein heat transfer occurs between the fluid and the chemical liquid, and wherein the fluid is captured at the top or bottom portion of the capturing unit based on the difference between the specific gravity of the fluid and the specific gravity of the chemical liquid.

2. The apparatus for supplying a solution according to claim 1, wherein, The fluid supply unit is configured to provide the fluid along a first direction, and the chemical liquid supply unit is configured to provide the chemical liquid in a second direction different from the first direction.

3. The apparatus for supplying a solution according to claim 2, wherein, The fluid supply section is configured to partially surround or pass through the chemical liquid supply section.

4. An apparatus for processing a substrate, comprising: The chemical liquid discharge section is configured to discharge a chemical liquid having a first specific gravity onto the substrate; A chemical liquid supply unit is configured to supply the chemical liquid to the chemical liquid discharge unit; The fluid supply unit is configured to provide a fluid having a second specific gravity that is different from the first specific gravity; as well as The monitoring unit includes a collection unit configured to capture the fluid flowing into the chemical liquid supply unit and a sensing unit configured to sense the inflow of the fluid; as well as The control unit is configured to interrupt the supply of the chemical liquid when the monitoring unit detects the inflow of the fluid. Heat transfer occurs between the fluid and the chemical liquid, causing the chemical liquid to reach a desired temperature. The fluid is captured at the top or bottom of the capturing section based on the difference between the first specific gravity and the second specific gravity.

5. The apparatus for processing a substrate according to claim 4, wherein, The chemical liquid discharge section includes a slit nozzle configured to discharge the chemical liquid onto the substrate in a scanning manner or an inkjet head configured to discharge the chemical liquid onto the substrate in a jet manner.

6. The apparatus for processing a substrate according to claim 4, wherein, When the first specific gravity of the chemical liquid is greater than the second specific gravity of the fluid, the fluid is captured at the top portion of the capturing section, and the sensing section is disposed at the top portion of the capturing section.

7. The apparatus for processing a substrate according to claim 4, wherein, When the first specific gravity of the chemical liquid is less than the second specific gravity of the fluid, the fluid is captured at the bottom portion of the capturing section, and the sensing section is disposed at the bottom portion of the capturing section.

8. The apparatus for processing a substrate according to claim 4, wherein, The chemical liquid supply unit is configured to supply the chemical liquid in a first direction, and the fluid supply unit is configured to supply the fluid in a second direction different from the first direction.

9. The apparatus for processing a substrate according to claim 4, wherein, The fluid supply section is configured to partially surround or pass through the chemical liquid supply section.

10. The apparatus for processing a substrate according to claim 4, wherein, The control unit is configured to interrupt the supply of the chemical liquid from the chemical liquid supply unit and the discharge of the chemical liquid from the chemical liquid discharge unit.

11. A method for processing a substrate, comprising: A chemical liquid with a first specific gravity is supplied from the chemical liquid supply section to the chemical liquid discharge section; The chemical liquid having the first specific gravity is discharged from the chemical liquid discharge section onto the substrate; A fluid with a second specific gravity, different from the first specific gravity, is supplied around the chemical liquid by a fluid supply unit; The fluid flowing into the chemical liquid supply unit is captured by the capturing section; as well as The inflow of the fluid into the trapping section is sensed by a sensing unit; as well as When the sensing unit detects the inflow of the fluid, it interrupts the supply of the chemical liquid. Heat transfer occurs between the fluid and the chemical liquid, causing the chemical liquid to reach a desired temperature. The fluid is captured at the top or bottom of the capturing section based on the difference between the first specific gravity and the second specific gravity.

12. The method for processing a substrate according to claim 11, wherein, The chemical liquid discharge section discharges the chemical liquid onto the substrate in a scanning or spraying manner.

13. The method for processing a substrate according to claim 11, wherein, When the first specific gravity of the chemical liquid is greater than the second specific gravity of the fluid, the fluid is captured at the top portion of the capturing section, and the sensing section is disposed at the top portion of the capturing section.

14. The method for processing a substrate according to claim 11, wherein, When the first specific gravity of the chemical liquid is less than the second specific gravity of the fluid, the fluid is captured at the bottom portion of the capturing section, and the sensing section is disposed at the bottom portion of the capturing section.

15. The method for processing a substrate according to claim 11, wherein, The chemical liquid is provided in a first direction, and the fluid is provided in a second direction different from the first direction.

16. The method for processing a substrate according to claim 11, wherein, The fluid supply section partially surrounds or passes through the chemical liquid supply section.

17. The method for processing a substrate according to claim 11, wherein, The supply of the chemical liquid from the chemical liquid supply unit is interrupted, and the discharge of the chemical liquid from the chemical liquid discharge unit is also interrupted.

Images