Sensor package structure

Abstract

A sensor package structure is disclosed, which includes a substrate, a sensing chip disposed on the substrate, a photocuring layer disposed on the sensing chip, a light-transmissive layer disposed on the photocuring layer, a shielding layer in a ring shape and disposed on the inner surface of the light-transmissive layer, and a package formed on the substrate. A projection area of the shielding layer orthographically projected to the top surface of the sensing chip surrounds the outside of the sensing area of the sensing chip. The part of the shielding layer contacting the photocuring layer defines a ring-shaped configuration area, which forms at least one light-transmissive slot. The sensing chip, the photocuring layer, the light-transmissive layer, and the shielding layer are all embedded in the package, and at least part of the light-transmissive layer is exposed. In this way, the photocuring layer can be completely cured to avoid the light-transmissive layer from being tilted, and the delamination defect can be effectively avoided, so as to improve the yield of the sensor package structure.

Description

Technical Field

[0001] This application relates to a packaging structure, and more particularly to a sensor packaging structure. Background Technology

[0002] Existing sensor packaging structures involve attaching a glass plate to a sensor chip via an adhesive layer, with the adhesive layer surrounding the sensing area of ​​the sensor chip. However, since some light passing through the glass plate may be reflected by the adhesive layer, this can affect the sensing area of ​​the sensor chip (e.g., glare).

[0003] As described above, existing sensor packaging structures form a shielding layer between the glass plate and the adhesive layer to reduce glare. However, the shielding layer embedded in the adhesive layer can make it difficult for the adhesive layer to be fully cured and can easily cause delamination.

[0004] Therefore, the applicant believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed a sensor packaging structure that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0005] This application aims to provide a sensor packaging structure that can effectively improve the defects that may arise from existing sensor packaging structures.

[0006] This application discloses a sensor packaging structure, comprising: a substrate; a sensing chip disposed on the substrate along a default direction and electrically coupled to the substrate; wherein a sensing area is included on a top surface of the sensing chip; a photocurable layer, annular in shape and disposed on the top surface of the sensing chip and surrounding the outer side of the sensing area; a light-transmitting layer having an outer surface and an inner surface located on opposite sides, the light-transmitting layer being disposed on the photocurable layer with its inner surface above the sensing chip; wherein the inner surface of the light-transmitting layer, the photocurable layer, and the sensing chip are... The top surface together forms a closed space; a shielding layer, which is annular and disposed on the inner surface of the light-transmitting layer, and the shielding layer is projected onto a projection area formed by the top surface in a predetermined direction, which surrounds the outside of the sensing area; wherein, the portion of the shielding layer that contacts the photocurable layer defines an annular configuration area, and the annular configuration area forms at least one light-transmitting slot; and a package is formed on the substrate; wherein, the sensing chip, the photocurable layer, the light-transmitting layer and the shielding layer are all embedded in the package, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the package.

[0007] Optionally, the annular configuration area is separated from the inner edge of the shielding layer by a distance of 90 micrometers to 110 micrometers, and the annular configuration area is separated from the outer edge of the shielding layer by a distance of 90 micrometers to 110 micrometers.

[0008] Optionally, the annular configuration area is separated from the inner edge of the photocurable layer by a distance of 45 micrometers to 55 micrometers, and the annular configuration area is separated from the outer edge of the photocurable layer by a distance of 45 micrometers to 55 micrometers.

[0009] Optionally, the width of the annular configuration area is 25% to 100% of the distance between the inner and outer edges of the photocurable layer.

[0010] Optionally, at least one light-transmitting slot is annular and occupies 25% to 100% of the annular configuration area.

[0011] Optionally, the number of at least one light-transmitting slot is further limited to one and it occupies 100% of the area of ​​the annular configuration.

[0012] Optionally, the number of at least one light-transmitting slot is further limited to multiple slots, and these slots occupy 25% to 100% of the area of ​​the annular configuration.

[0013] Optionally, at least one light-transmitting slot is C-shaped and occupies 25% to 95% of the area of ​​the annular configuration.

[0014] Optionally, the sensing chip is square, and the number of at least one light-transmitting slot is further limited to multiple slots, each of which is elongated, and the positions of the multiple light-transmitting slots correspond to multiple sides of the sensing chip.

[0015] Optionally, each side of the sensing chip corresponds to and is parallel to a light-transmitting slot, and the multiple light-transmitting slots occupy 25% to 100% of the area of ​​the annular configuration region.

[0016] Optionally, each side of the sensing chip corresponds to and is perpendicular to at least two light-transmitting slots, and the multiple light-transmitting slots occupy 25% to 100% of the area of ​​the annular configuration region.

[0017] This application also discloses a sensor packaging structure, comprising: a substrate; a square-shaped sensing chip disposed on the substrate along a predetermined direction, and electrically coupled to the substrate; wherein a sensing area is included on one top surface of the sensing chip; a photocurable layer, annular in shape, disposed on the top surface of the sensing chip and surrounding the outer side of the sensing area; and a light-transmitting layer having an outer surface and an inner surface located on opposite sides, wherein the light-transmitting layer is disposed on the photocurable layer with a mounting area, positioned above the sensing chip; wherein the inner surface of the light-transmitting layer, the photocurable layer, and the top surface of the sensing chip together form a... The device includes a closed space; a shielding layer disposed on the inner surface of a light-transmitting layer, the shielding layer comprising a plurality of shielding strips spaced apart from each other; wherein the area between two adjacent shielding strips corresponds to a corner of a sensing chip, and each shielding strip forms at least one light-transmitting slot; wherein the shielding layer is projected orthogonally onto a top surface to form a projection area that surrounds the outer side of the sensing area; and a package formed on a substrate; wherein the sensing chip, photocurable layer, light-transmitting layer, and shielding layer are all embedded in the package, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the package.

[0018] Optionally, each side of the sensing chip corresponds to and is parallel to a shielding strip, and at least 25% of the area of ​​each shielding strip is formed with at least one light-transmitting slot.

[0019] Optionally, in each shielding strip, at least one light-transmitting slot is spaced 45 to 55 micrometers away from the inner edge of the photocurable layer, and at least one light-transmitting slot is spaced 45 to 55 micrometers away from the outer edge of the photocurable layer.

[0020] Optionally, in each shielding strip, the width of at least one light-transmitting slot is 25% to 100% of the distance between the inner and outer edges of the photocurable layer.

[0021] Optionally, in each shielding strip, at least one light-transmitting slot is elongated and extends through the length of the corresponding shielding strip.

[0022] Optionally, in each shielding strip, the number of at least one light-transmitting slot is further limited to a plurality and they are parallel to each other.

[0023] Optionally, in each shielding strip, at least one light-transmitting slot is adjacent to one end of the corresponding shielding strip.

[0024] Optionally, in each shielding strip, the number of at least one light-transmitting slots is further limited to multiple and each of them is elongated, and each light-transmitting slot is through-hole along the width direction of the corresponding shielding strip.

[0025] Optionally, each side of the sensing chip corresponds to and is perpendicular to at least two light-transmitting slots.

[0026] In summary, the sensor packaging structure disclosed in this application, while achieving the goal of reducing glare caused by reflection from the photocurable layer by blocking light with the shielding layer, allows light to pass through at least one of the light-transmitting slots in the shielding layer to irradiate the photocurable layer, facilitating its complete curing and preventing the light-transmitting layer from tilting. Furthermore, the shielding layer and the photocurable layer can effectively avoid delamination defects, thereby improving the yield of the sensor packaging structure.

[0027] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0028] Figure 1 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 1 of this application.

[0029] Figure 2 for Figure 1 A top-down view.

[0030] Figure 3 for Figure 2 A schematic cross-sectional view along section line III-III.

[0031] Figure 4 for Figure 3 An enlarged schematic diagram of region IV.

[0032] Figure 5 for Figure 1 A top view of the light-transmitting layer and the encapsulation body is omitted.

[0033] Figure 6 for Figure 5 A schematic diagram of the changing configuration of the shielding layer (I).

[0034] Figure 7 for Figure 5 Schematic diagram of the changing configuration of the shielding layer (II).

[0035] Figure 8 for Figure 5 Schematic diagram of the changing configuration of the shielding layer (III).

[0036] Figure 9 for Figure 5 Schematic diagram of the changing configuration of the shielding layer (IV).

[0037] Figure 10 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 2 of this application.

[0038] Figure 11 for Figure 10 A top view of the light-transmitting layer and the encapsulation body is omitted.

[0039] Figure 12 for Figure 11 An enlarged schematic diagram of region XII.

[0040] Figure 13 for Figure 10 A schematic diagram of the changing configuration of the shielding layer (I).

[0041] Figure 14 for Figure 10 Schematic diagram of the changing configuration of the shielding layer (II).

[0042] Figure 15 for Figure 10 Schematic diagram of the changing configuration of the shielding layer (III). Detailed Implementation

[0043] The following specific embodiments illustrate the implementation of the "sensor packaging structure" disclosed in this application. Those skilled in the art can understand the advantages and effects of the invention from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings in this application are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0044] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0045] Please refer to Example 1 Figures 1 to 9 As shown, this is an embodiment of this application. Figure 1 and Figure 2 As shown, this embodiment discloses a sensor packaging structure 100; that is, the internal structure is not any structure for packaging a sensor, and its structural design basis is different from the sensor packaging structure 100 referred to in this embodiment, so the two are not suitable for comparison.

[0046] like Figures 3 to 5As shown, the sensor packaging structure 100 includes a substrate 1, a sensing chip 2 disposed on the substrate 1, multiple metal lines 3 electrically coupled to the sensing chip 2 and the substrate 1, a photocurable layer 4 arranged in a ring and disposed on the sensing chip 2, a light-transmitting layer 5 disposed on the photocurable layer 4, a shielding layer 6 disposed on the light-transmitting layer 5, and a package 7 formed on the substrate 1.

[0047] In this embodiment, the sensor package structure 100 is described as including the aforementioned components, but it can be adjusted and varied according to design requirements. For example, in other embodiments not shown in this application, the sensor package structure 100 may omit multiple metal lines 3, and the sensing chip 2 may be fixed and electrically coupled to the substrate 1 via a flip-chip method; alternatively, the sensor package structure 100 may omit or replace the package body 7 with other structures. The structure and connection relationship of each component of the sensor package structure 100 in this embodiment will be described below.

[0048] In this embodiment, the substrate 1 is square or rectangular, but this application is not limited to this. The substrate 1 has a chip fixing region 111 approximately at the center of its upper surface 11, and a plurality of bonding pads 112 are formed on the upper surface 11 of the substrate 1, located outside the chip fixing region 111. In this embodiment, the plurality of bonding pads 112 are generally arranged in a ring, but this application is not limited to this. For example, in other embodiments not shown in this application, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the chip fixing region 111.

[0049] In addition, the substrate 1 may also have a plurality of solder balls 8 on its lower surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component (not shown in the figure) by the plurality of solder balls 8, so that the sensor package structure 100 can be electrically connected to the electronic component.

[0050] In this embodiment, the sensing chip 2 is square (e.g., rectangular or square) and is described as an image sensing chip, but is not limited thereto. The bottom surface 22 of the sensing chip 2 is fixed to the chip fixing area 111 of the substrate 1 along a predetermined direction P; that is, the sensing chip 2 is located inside the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a supporting area 212 surrounding the sensing area 211 (and in an annular shape), and the sensing chip 2 includes a plurality of connecting pads 213 located in the supporting area 212 (that is, the plurality of connecting pads 213 are located outside the sensing area 211).

[0051] In this embodiment, the number and position of the plurality of connection pads 213 of the sensing chip 2 correspond to the number and position of the plurality of bonding pads 112 of the substrate 1, respectively. Furthermore, one end of each of the plurality of metal wires 3 is connected to one of the plurality of bonding pads 112, and the other end of each of the plurality of metal wires 3 is connected to one of the plurality of connection pads 213 (that is, each metal wire 3 has its two ends connected to one bonding pad 112 and a corresponding connection pad 213), thereby enabling the substrate 1 to be electrically coupled to the sensing chip 2 through the plurality of metal wires 3.

[0052] The photocurable layer 4 is disposed on the top surface 21 of the sensing chip 2 and surrounds the outer side of the sensing chip 2. In this embodiment, the photocurable layer 4 is located inside the plurality of metal lines 3 and does not contact any of the metal lines 3, but this application is not limited thereto. For example, in other embodiments not illustrated in this application, at least a portion of one of the metal lines 3 may also be embedded within the photocurable layer 4. Furthermore, in this embodiment, the photocurable layer 4 is further defined as an ultraviolet (UV) photocurable layer, meaning a structure cured by UV light irradiation.

[0053] In this embodiment, the light-transmitting layer 5 is described as a transparent flat glass plate, but this application is not limited to this. In this embodiment, the light-transmitting layer 5 includes an outer surface 51 and an inner surface 52 located opposite to the outer surface 51. The light-transmitting layer 5 is disposed on the photocurable layer 4 with the inner surface 52 above the sensing chip 2; that is, the photocurable layer 4 is sandwiched between the light-transmitting layer 5 and the substrate 1, and the inner surface 52 of the light-transmitting layer 5, the photocurable layer 4, and the top surface 21 of the sensing chip 2 together form a closed space E.

[0054] The shielding layer 6 is annular and disposed on the inner surface 52 of the light-transmitting layer 5 to block light from passing through. The shielding layer 6 projects onto the top surface 21 along the predetermined direction P, forming a projection area that surrounds the outer side of the sensing area 211. In other words, the inner edge of the shielding layer 6 forms an opening directly above the sensing area 211.

[0055] Furthermore, an annular configuration area 6a is defined at the location of the shielding layer 6 in contact with the photocurable layer 4, and the annular configuration area 6a has at least one light-transmitting slot 61. The photocurable layer 4 is filled into at least one of the light-transmitting slots 61 and is thus connected to the inner surface 52 of the light-transmitting layer 5.

[0056] Accordingly, the sensor packaging structure 100 disclosed in this application embodiment, while achieving the goal of blocking light with the shielding layer 6 to reduce glare caused by reflection from the photocurable layer 4, allows light to pass through at least one light-transmitting slot 61 of the shielding layer 6 to irradiate the photocurable layer 4, facilitating its complete curing and preventing the light-transmitting layer 5 from tilting. Furthermore, the shielding layer 6 and the photocurable layer 4 can effectively avoid delamination defects, thereby improving the yield of the sensor packaging structure 100.

[0057] It should be noted that, in order for at least one of the light-transmitting slots 61 formed in the annular configuration area 6a to be more conducive to both reducing the glare phenomenon and facilitating the complete curing of the photocurable layer 4, the annular configuration area 6a preferably meets at least one of the following structural conditions, but is not limited thereto.

[0058] Specifically, the annular configuration area 6a is separated from the inner edge of the shielding layer 6 by a distance D1-1 of 90 micrometers (μm) to 110 micrometers, and the annular configuration area 6a is separated from the outer edge of the shielding layer 6 by a distance D1-2 of 90 micrometers to 110 micrometers. The annular configuration area 6a is separated from the inner edge of the photocurable layer 4 by a distance D1-3 of 45 micrometers, and the annular configuration area 6a is separated from the outer edge of the photocurable layer 4 by a distance D1-4 of 45 micrometers to 55 micrometers. The width W6a of the annular configuration area 6a is 25% to 100% of the width W4 between the inner and outer edges of the photocurable layer 4.

[0059] Furthermore, the number and shape of at least one light-transmitting slot 61 formed in the annular configuration area 6a can be adjusted and varied according to different design requirements in this embodiment. However, in order to simultaneously reduce the glare phenomenon and facilitate the complete curing of the photocurable layer 4, this embodiment will list several feasible implementations of the shielding layer 6 below, but this application is not limited thereto.

[0060] like Figure 5 and Figure 6 As shown, at least one light-transmitting slot 61 is annular and occupies 25% to 100% of the annular arrangement area 6a. Further, as... Figure 5 As shown, the number of at least one of the light-transmitting slots 61 is limited to one, and it occupies 100% of the area of ​​the annular configuration region 6a. Alternatively, as... Figure 6 As shown, the number of at least one of the light-transmitting slots 61 is limited to a plurality (e.g., two) and it occupies 25% to 100% of the area of ​​the annular configuration region 6a.

[0061] like Figure 7As shown, at least one of the light-transmitting slots 61 is C-shaped and occupies 25% to 95% of the annular arrangement area 6a. In this embodiment... Figure 7 In this application, the number of at least one light-transmitting slot 61 is described as one, but this application is not limited thereto. For example, in other embodiments not illustrated in this application, the number of C-shaped light-transmitting slots 61 may also be multiple.

[0062] like Figure 8 and Figure 9 As shown, the number of at least one light-transmitting slot 61 is limited to a plurality, each of which is elongated, and the positions of the plurality of light-transmitting slots 61 respectively correspond to the plurality of edges 23 of the sensing chip 2. Further, as... Figure 9 As shown, each edge 23 of the sensing chip 2 corresponds to and is perpendicular to at least two light-transmitting slots 61, and the plurality of light-transmitting slots 61 occupy 25% to 100% of the area of ​​the annular configuration region 6a.

[0063] Or, such as Figure 8 As shown, each edge 23 of the sensing chip 2 corresponds to and is parallel to one of the light-transmitting slots 61, and the plurality of light-transmitting slots 61 occupy 25% to 100% of the annular configuration area 6a, but this application is not limited thereto. For example, in other embodiments not shown in this application, each edge 23 of the sensing chip 2 may also correspond to and be parallel to at least two of the light-transmitting slots 61.

[0064] In this embodiment, the encapsulation 7 is opaque to block visible light from passing through. The encapsulation 7 is described as a molding compound, and it is formed on the upper surface 11 of the substrate 1 with its edges flush with the edges of the substrate 1. The sensing chip 2, the photocurable layer 4, the light-transmitting layer 5, and the shielding layer 6 are all embedded within the encapsulation 7, and at least a portion of the outer surface 51 of the light-transmitting layer 5 is exposed outside the encapsulation 7; however, this application is not limited to this.

[0065] Please refer to Example 2 Figures 11 to 12 As shown, this is Embodiment Two of this application. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated (e.g., the substrate 1, the sensing chip 2, the multiple metal lines 3, the photocurable layer 4, the light-transmitting layer 5, and the package 7). The main difference between this embodiment and Embodiment One is:

[0066] The shielding layer 6.

[0067] In this embodiment Figures 9 to 11In this structure, the shielding layer 6 is formed on the inner surface (not shown) of the light-transmitting layer 5, and the shielding layer 6 includes a plurality of shielding strips 6b spaced apart from each other. The shielding layer 6 (or the plurality of shielding strips 6b) is projected orthogonally along the predetermined direction P onto a projection area formed by the top surface 21, which surrounds the outer side of the sensing area 211; that is, the sensing area 211 is approximately located inside the projection area, thereby reducing the aforementioned glare phenomenon through the shielding layer 6.

[0068] More specifically, each edge 23 of the sensing chip 2 corresponds to and is parallel to one of the shielding strips 6b, and the area between two adjacent shielding strips 6b corresponds to a corner 24 of the sensing chip 2. Accordingly, the photocurable layer 4 located at each corner 24 is not covered by the shielding layer 6, so as to facilitate its complete curing.

[0069] Furthermore, the shielding layer 6 has at least one light-transmitting slot 61 formed in each of the shielding strips 6b, and the photocurable layer 4 fills into at least one light-transmitting slot 61 in each of the shielding strips 6b, thereby connecting to the inner surface (not shown) of the light-transmitting layer 5. From another perspective, since the multiple corners 24 of the sensing chip 2 are not shielded by the shielding layer 6 in this embodiment, the configuration of the light-transmitting slots 61 formed by the shielding layer 6 in this embodiment differs from that in Embodiment 1.

[0070] It should be noted that the number and shape of at least one light-transmitting slot 61 formed in each of the shielding strips 6b can be adjusted and varied according to different design requirements in this embodiment. However, in order to simultaneously reduce the glare phenomenon and facilitate the complete curing of the photocurable layer 4, the following will list several feasible embodiments of the shielding layer 6, but this application is not limited thereto.

[0071] like Figure 11 and Figure 13 As shown, at least 25% of the area of ​​each of the shielding strips 6b is formed with at least one of the light-transmitting slots 61; in each of the shielding strips 6b, at least one of the light-transmitting slots 61 is elongated and extends through the length of the corresponding shielding strip 6b, and the number of at least one light-transmitting slot 61 can be one (e.g.: Figure 11 ), or multiple (e.g.: Figure 13 And they are parallel to each other.

[0072] Furthermore, Yu Figure 11 and Figure 12In each of the shielding strips 6b shown, at least one light-transmitting slot 61 is separated from the inner edge of the shielding layer 6 by a distance D2-1 of 90 micrometers to 110 micrometers, and at least one light-transmitting slot 61 is separated from the outer edge of the shielding layer 6 by a distance D2-2 of 90 micrometers to 110 micrometers, at least one light-transmitting slot 61 is separated from the inner edge of the photocurable layer 4 by a distance D2-3 of 45 micrometers, and at least one light-transmitting slot 61 is separated from the outer edge of the photocurable layer 4 by a distance D2-4 of 45 micrometers to 55 micrometers. Furthermore, in Figure 11 and Figure 12 In each of the shielding strips 6b shown, the width W61 of at least one of the light-transmitting slots 61 is 25% to 100% of the width W4 between the inner edge and the outer edge of the photocurable layer 4.

[0073] In addition, Figure 14 In each of the shielding strips 6b shown, at least one of the light-transmitting slots 61 may be located near the end of the corresponding shielding strip 6b, that is, near a corner 24 of the sensing chip 2. It should be further noted that the number and size of at least one light-transmitting slot 61 of any shielding strip 6b can be adjusted and varied according to design requirements, and are not limited to the drawings of the above embodiments.

[0074] At Figure 15 In each of the shielding strips 6b shown, at least 25% of the area of ​​each shielding strip 6b is formed with at least one light-transmitting slot 61, and the number of at least one light-transmitting slot 61 is limited to a plurality, each of which is elongated. Each light-transmitting slot 61 is through-hole along the width direction of the corresponding shielding strip 6b. Each edge 23 of the sensing chip 2 corresponds to and is perpendicular to at least two light-transmitting slots 61.

[0075] In summary, the sensor packaging structure disclosed in this application, while achieving the goal of reducing glare caused by reflection from the photocurable layer by blocking light with the shielding layer, allows light to pass through at least one of the light-transmitting slots in the shielding layer to irradiate the photocurable layer, facilitating its complete curing and preventing the light-transmitting layer from tilting. Furthermore, the shielding layer and the photocurable layer can effectively avoid delamination defects, thereby improving the yield of the sensor packaging structure.

[0076] The content disclosed above is only an optional and feasible embodiment of this application, and is not intended to limit the patent scope of this application. Therefore, all equivalent technical changes made using the content of this application specification and drawings are included in the patent scope of this application.

Claims

1. A sensor package structure, characterized by, The sensor packaging structure includes: One substrate; A sensing chip is disposed on the substrate along a predetermined direction and is electrically coupled to the substrate; wherein, a sensing area is included on one top surface of the sensing chip; A photocurable layer, in the shape of a ring, is disposed on the top surface of the sensing chip and surrounds the outside of the sensing area; A light-transmitting layer has an outer surface and an inner surface located on opposite sides, and the light-transmitting layer is disposed on the photocurable layer with the inner surface thereon, so as to be located above the sensing chip; wherein the inner surface of the light-transmitting layer, the photocurable layer, and the top surface of the sensing chip together surround and form a closed space; A shielding layer, annular in shape and disposed on the inner surface of the light-transmitting layer, and the shielding layer projecting orthographically onto the top surface along the preset direction to form a projection area, which surrounds the outer side of the sensing area; wherein, the portion of the shielding layer in contact with the photocurable layer defines an annular configuration area, and the annular configuration area forms at least one light-transmitting slot; and A package is formed on the substrate; wherein the sensing chip, the photocurable layer, the light-transmitting layer, and the shielding layer are all embedded in the package, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the package.

2. The sensor package structure according to claim 1, wherein The annular configuration area is 90 to 110 micrometers away from the inner edge of the shielding layer, and the annular configuration area is 90 to 110 micrometers away from the outer edge of the shielding layer.

3. The sensor package structure of claim 1, wherein The annular configuration area is 45 to 55 micrometers away from the inner edge of the photocurable layer, and the annular configuration area is 45 to 55 micrometers away from the outer edge of the photocurable layer.

4. The sensor packaging structure according to claim 1, characterized in that, The width of the annular configuration area is 25% to 100% of the distance between the inner and outer edges of the photocurable layer.

5. The sensor packaging structure according to claim 1, characterized in that, At least one of the light-transmitting slots is annular and occupies 25% to 100% of the area of ​​the annular configuration region.

6. The sensor packaging structure according to claim 5, characterized in that, The number of at least one of the light-transmitting slots is further limited to one, and it occupies 100% of the area of ​​the annular configuration region.

7. The sensor packaging structure according to claim 5, characterized in that, The number of at least one of the light-transmitting slots is further limited to a plurality, and they occupy 25% to 100% of the area of ​​the annular configuration region.

8. The sensor packaging structure according to claim 1, characterized in that, At least one of the light-transmitting slots is C-shaped and occupies 25% to 95% of the area of ​​the annular configuration region.

9. The sensor packaging structure according to claim 1, characterized in that, The sensing chip is square, and the number of at least one light-transmitting slot is further limited to multiple slots, each of which is elongated, and the positions of the multiple light-transmitting slots correspond to multiple sides of the sensing chip.

10. The sensor packaging structure according to claim 9, characterized in that, Each edge of the sensing chip corresponds to and is parallel to one of the light-transmitting slots, and the plurality of light-transmitting slots occupy 25% to 100% of the area of ​​the annular configuration region.

11. The sensor packaging structure according to claim 9, characterized in that, Each edge of the sensing chip corresponds to and is perpendicular to at least two of the light-transmitting slots, and the plurality of light-transmitting slots occupy 25% to 100% of the area of ​​the annular configuration region.

12. A sensor packaging structure, characterized in that, The sensor packaging structure includes: One substrate; A sensing chip, square in shape and disposed on the substrate along a predetermined direction, is electrically coupled to the substrate; wherein, a sensing area is included on one top surface of the sensing chip; A photocurable layer, in the shape of a ring, is disposed on the top surface of the sensing chip and surrounds the outside of the sensing area; A light-transmitting layer has an outer surface and an inner surface located on opposite sides, and the light-transmitting layer is disposed on the photocurable layer so as to be located above the sensing chip; wherein the inner surface of the light-transmitting layer, the photocurable layer, and the top surface of the sensing chip together surround and form a closed space; A shielding layer is disposed on the inner surface of the light-transmitting layer, the shielding layer comprising a plurality of shielding strips spaced apart from each other; wherein the area between two adjacent shielding strips corresponds to a corner of the sensing chip, and each shielding strip forms at least one light-transmitting slot; wherein the shielding layer is projected orthographically onto a projection area formed by projecting it onto the top surface along a predetermined direction, which surrounds the outer side of the sensing area; and A package is formed on the substrate; wherein the sensing chip, the photocurable layer, the light-transmitting layer, and the shielding layer are all embedded in the package, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the package.

13. The sensor packaging structure according to claim 12, characterized in that, Each side of the sensing chip corresponds to and is parallel to one of the shielding strips, and at least 25% of the area of ​​each shielding strip is formed with at least one of the light-transmitting slots.

14. The sensor packaging structure according to claim 12, characterized in that, In each of the shielding strips, at least one of the light-transmitting slots is spaced 45 to 55 micrometers apart from the inner edge of the photocurable layer, and at least one of the light-transmitting slots is spaced 45 to 55 micrometers apart from the outer edge of the photocurable layer.

15. The sensor packaging structure according to claim 12, characterized in that, In each of the shielding strips, the width of at least one of the light-transmitting slots is 25% to 100% of the distance between the inner and outer edges of the photocurable layer.

16. The sensor packaging structure according to claim 12, characterized in that, In each of the shielding strips, at least one of the light-transmitting slots is elongated and extends through the length of the corresponding shielding strip.

17. The sensor packaging structure according to claim 16, characterized in that, In each of the shielding strips, the number of at least one of the light-transmitting slots is further limited to a plurality and they are parallel to each other.

18. The sensor packaging structure according to claim 12, characterized in that, In each of the shielding strips, at least one of the light-transmitting slots is adjacent to one end of the corresponding shielding strip.

19. The sensor packaging structure according to claim 12, characterized in that, In each of the shielding strips, the number of at least one light-transmitting slot is further limited to a plurality, each of which is elongated, and each light-transmitting slot is through-hole along the width direction of the corresponding shielding strip.

20. The sensor packaging structure according to claim 19, characterized in that, Each side of the sensing chip corresponds to and is perpendicular to at least two of the light-transmitting slots.

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