Component repair fixture and system

Abstract

The application discloses a component repair jig and system, which comprises a bottom plate for fixing a PCB on which components to be repaired are located, an upper cover with a plurality of countersunk holes and fixedly connected with the bottom plate, a first connecting piece with one end connected with the components to be repaired, a second connecting piece connected with the other end of the first connecting piece through the countersunk holes, and an elastic piece located in the countersunk holes. The scheme can repair a plurality of damaged PCBs at one time, and the damaged PCBs do not need to be repaired continuously for several times and then discarded, so that the scrap rate is reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit board component rework, and specifically to a component rework fixture and system. Background Technology

[0002] As server memory requirements increase, the number of DIMM (Dimm) modules also rises, with some servers requiring up to 48 modules (the memory needs to be installed on DIMM modules before being mounted on the motherboard). During reflow soldering, various manufacturing defects can lead to DIMM defects such as open solder joints or damage to the DIMMs themselves, necessitating repair. Currently, DIMM repair is done one by one by removing them because PTH (Plain Oldest Terminal) rework stations need to preheat the entire product before localized heating in a small solder pot (direct heating in a small solder pot would require a longer time and could damage the circuit board). However, server circuit boards are large, and repeated heating can deform the motherboard and damage various components. Industry standards stipulate that a motherboard should not be repeatedly heated more than three times, otherwise it will damage the PCB. Therefore, if more than three DIMMs are defective, repair is impossible, and the board will be scrapped. Therefore, there is an urgent need for a rework method that can automatically remove all defective DIMM modules at once. Summary of the Invention

[0003] In view of this, in order to overcome at least one aspect of the above-mentioned problems, embodiments of the present invention provide a component rework fixture, comprising:

[0004] The base plate is used to fix the PCB board containing the component to be repaired.

[0005] The top cover has multiple countersunk holes and is fixedly connected to the bottom plate;

[0006] A first connector, one end of which is connected to the component to be repaired;

[0007] The second connector passes through the countersunk hole and connects to the other end of the first connector.

[0008] An elastic element is located in the countersunk hole.

[0009] In some embodiments, before the component to be repaired is repaired, the elastic element is in a compressed position and the first connector is close to the base plate;

[0010] After the component to be repaired is repaired, the elastic element is in the extended position, and the first connector is away from the base plate.

[0011] In some embodiments, the base plate further includes a T-shaped platform, and the top cover further includes a clamping member;

[0012] The clamping member clamps the T-shaped platform to connect the upper cover to the base plate.

[0013] In some embodiments, the base plate further includes positioning holes, and the top cover further includes positioning pins;

[0014] The positioning pin engages with the positioning hole.

[0015] In some embodiments, the second connector is a screw, and the elastic element is a spring.

[0016] Based on the same inventive concept, according to another aspect of the present invention, embodiments of the present invention also provide a component rework system, including a wave soldering oven and a fixture, wherein the fixture includes:

[0017] The base plate is used to fix the PCB board containing the component to be repaired.

[0018] The top cover has multiple countersunk holes and is fixedly connected to the bottom plate;

[0019] A first connector, one end of which is connected to the component to be repaired;

[0020] The second connector passes through the countersunk hole and connects to the other end of the first connector.

[0021] An elastic element is located in the countersunk hole.

[0022] In some embodiments, before the component to be repaired enters the wave soldering oven, the elastic element is in a compressed position and the first connector is close to the base plate;

[0023] After being repaired by heating in the wave soldering oven, the elastic element is in an extended position, and the first connector is away from the base plate.

[0024] In some embodiments, the base plate further includes a T-shaped platform, and the top cover further includes a clamping member;

[0025] The clamping member clamps the T-shaped platform to connect the upper cover to the base plate.

[0026] In some embodiments, the base plate further includes positioning holes, and the top cover further includes positioning pins;

[0027] The positioning pin engages with the positioning hole.

[0028] In some embodiments, the second connector is a screw, and the elastic element is a spring.

[0029] The present invention has one of the following beneficial technical effects: the solution proposed in the present invention can repair PCB boards with multiple damaged components in one go, without having to scrap them after multiple consecutive repairs, thus reducing the scrap rate. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0031] Figure 1 A schematic diagram of the component repair fixture provided in the embodiments of the present invention;

[0032] Figure 2 A schematic diagram showing the positional relationship between the first connector and the second connector provided for an embodiment of the present invention;

[0033] Figure 3 A schematic diagram of the countersunk hole provided for an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of the T-shaped platform and clamping member provided for an embodiment of the present invention. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to specific examples and the accompanying drawings.

[0036] It should be noted that all uses of "first" and "second" in the embodiments of the present invention are for the purpose of distinguishing two entities or parameters with the same name but different names. It is clear that "first" and "second" are only for the convenience of expression and should not be construed as limiting the embodiments of the present invention. Subsequent embodiments will not explain this in detail.

[0037] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] In the embodiments of the present invention, PCB: Printed Circuit Board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components.

[0039] Dimm: This stands for Dual In-line Module, a new type of memory module that appeared after the introduction of the Pentium CPU. It provides a 64-bit data channel and has 168 pins, hence it is also known as a 168-pin memory module.

[0040] A dry solder joint is a joint that should have been soldered but wasn't. Dry solder joints can be caused by insufficient solder paste, problems with the component itself, improper component placement, or improper placement after soldering.

[0041] PTH Through-Hole Component Rework Station: This is a semi-automatic rework equipment suitable for removing and soldering PTH through-hole components on PCB substrates. The PTH rework station has two heating systems. One of them is a preheating heating zone, which is an infrared heating element with independent upper and lower infrared heating. After preheating, the product moves to the small area heating zone, which is above the small solder pot, for high-temperature heating of the DIMM that needs to be reworked.

[0042] PCB rework: There are multiple components on the motherboard. When a faulty component is found after testing, the solder on the component pins needs to be melted with a soldering iron before the component can be removed. The DIMM component described in this invention cannot be reworked by melting the solder with a soldering iron because it has too many pins. It needs to be reworked using a PTH rework station.

[0043] Wave soldering: The soldering surface of the plug-in board comes into direct contact with high-temperature liquid tin to achieve the soldering purpose. The high-temperature liquid tin is kept on an inclined plane, and a special device makes the liquid tin form waves, hence the name "wave soldering". Its main material is solder bar.

[0044] According to one aspect of the present invention, embodiments of the present invention provide a component rework fixture, such as... Figure 1 As shown, it may include:

[0045] Base plate 1, used to fix the PCB board 6 where the component 61 to be repaired is located;

[0046] The upper cover 2 has multiple countersunk holes 21 and is fixedly connected to the base plate 1;

[0047] First connector 3, one end of which is connected to the component 61 to be repaired;

[0048] The second connector 4 passes through the countersunk hole 21 and is connected to the other end of the first connector 3;

[0049] The elastic element 5 is located in the countersunk hole 21.

[0050] The solution proposed in this invention can repair multiple damaged PCB boards in one go, eliminating the need for repeated repairs and scrapping, thus reducing the scrap rate.

[0051] In some embodiments, the solution proposed in this invention can be applied to reworked multi-pin components, such as DIMM strips, and a corresponding first connector 3 can be made according to the component to be reworked. For example, for DIMM strips, since memory is inserted into the DIMM strip, a memory strip profile can be made as the first connector.

[0052] In some embodiments, before the component 61 to be repaired is repaired, the elastic member 5 is in a compressed position and the first connecting member 3 is close to the base plate 1;

[0053] After the component 61 to be repaired is repaired, the elastic member 5 is in the extended position, and the first connecting member 3 is away from the base plate 1.

[0054] Specifically, such as Figure 2 and Figure 3 As shown, multiple first connectors 3 can be inserted into the corresponding components 61 to be repaired. Then, after aligning the top cover 2 with the multiple first connectors 3, the second connector 4 is connected to the first connector 3 by passing through the countersunk hole 21 of the top cover. At this time, since the elastic element 5 is in the countersunk hole 21, it will be in a compressed position under the action of the second connector.

[0055] When the component is repaired, the solder on the pins melts, and the adhesion between the component and the PCB board disappears. At this time, the elastic element 5 gives the second connector 4 an upward push. Then the second connector 4 drives the first connector to rise, and the first connector drives the component to be repaired to rise, thereby realizing the automatic separation of the component to be repaired from the PCB board.

[0056] In some embodiments, the base plate 1 further includes a T-shaped platform 11, and the upper cover 2 further includes a clamping member 22;

[0057] The clamping member 22 clamps the T-shaped platform 11 to connect the upper cover 2 with the base plate 1.

[0058] In some embodiments, the base plate 1 further includes positioning holes, and the upper cover 2 further includes positioning pins 23;

[0059] The positioning pin 23 engages with the positioning hole.

[0060] Specifically, such as Figure 1 and Figure 4As shown, the T-shaped stage 11 and the clamping member 22 work together to keep the base plate 1 and the top cover 2 fixedly connected, preventing the PCB board from being accidentally lifted when disassembling components to be repaired. The positioning pin 23 and the positioning hole work together to make the alignment between the top cover and the base plate faster.

[0061] The following uses Dimm strips as an example to illustrate how the fixture proposed in this invention performs component rework.

[0062] After confirming which DIMM strips on the circuit board require rework, the operator places the PCB board on the base plate and secures it to the base plate with screws to prevent accidental lifting during DIMM removal. The memory module template is then inserted into the DIMM strip, and the top cover is aligned with the base plate using positioning pins, ensuring the template aligns with the countersunk hole. Screws are then used to connect the top cover to the base plate, compressing the spring. After assembly, the board and fixture are placed in a wave soldering oven for solder melting. Once the solder on the pins melts, the defective DIMM strip is pulled out of the circuit board by the spring force (the memory template is firmly inserted into the DIMM strip; when the solder melts, the strip loses its adhesion and is easily pulled out by the spring force). Components that do not require rework can be cured normally after removal from the oven. Damaged DIMM strips are simply replaced with new ones.

[0063] The solution proposed in this invention can repair multiple damaged PCB boards in one go, eliminating the need for repeated repairs and scrapping, thus reducing the scrap rate.

[0064] Based on the same inventive concept, according to another aspect of the present invention, embodiments of the present invention also provide a component rework system, including a wave soldering oven and a fixture, such as... Figure 1 As shown, the fixture includes:

[0065] Base plate 1, used to fix the PCB board 6 where the component 61 to be repaired is located;

[0066] The upper cover 2 has multiple countersunk holes 21 and is fixedly connected to the base plate 1;

[0067] First connector 3, one end of which is connected to the component 61 to be repaired;

[0068] The second connector 4 passes through the countersunk hole 21 and is connected to the other end of the first connector 3;

[0069] The elastic element 5 is located in the countersunk hole 21.

[0070] The solution proposed in this invention can repair multiple damaged PCB boards in one go, eliminating the need for repeated repairs and scrapping, thus reducing the scrap rate.

[0071] In some embodiments, the solution proposed in this invention can be applied to reworked multi-pin components, such as DIMM strips, and a corresponding first connector 3 can be made according to the component to be reworked. For example, for DIMM strips, since memory is inserted into the DIMM strip, a memory strip profile can be made as the first connector.

[0072] In some embodiments, before the component 61 to be repaired is repaired, the elastic member 5 is in a compressed position and the first connecting member 3 is close to the base plate 1;

[0073] After the component 61 to be repaired is repaired, the elastic member 5 is in the extended position, and the first connecting member 3 is away from the base plate 1.

[0074] Specifically, such as Figure 2 and Figure 3 As shown, multiple first connectors 3 can be inserted into the corresponding components 61 to be repaired. Then, after aligning the top cover 2 with the multiple first connectors 3, the second connector 4 is connected to the first connector 3 by passing through the countersunk hole 21 of the top cover. At this time, since the elastic element 5 is in the countersunk hole 21, it will be in a compressed position under the action of the second connector.

[0075] When the component is repaired, the solder on the pins melts, and the adhesion between the component and the PCB board disappears. At this time, the elastic element 5 gives the second connector 4 an upward push. Then the second connector 4 drives the first connector to rise, and the first connector drives the component to be repaired to rise, thereby realizing the automatic separation of the component to be repaired from the PCB board.

[0076] In some embodiments, the base plate 1 further includes a T-shaped platform 11, and the upper cover 2 further includes a clamping member 22;

[0077] The clamping member 22 clamps the T-shaped platform 11 to connect the upper cover 2 with the base plate 1.

[0078] In some embodiments, the base plate 1 further includes positioning holes, and the upper cover 2 further includes positioning pins 23;

[0079] The positioning pin 23 engages with the positioning hole.

[0080] Specifically, such as Figure 1 and Figure 4 As shown, the T-shaped stage 11 and the clamping member 22 work together to keep the base plate 1 and the top cover 2 fixedly connected, preventing the PCB board from being accidentally lifted when disassembling components to be repaired. The positioning pin 23 and the positioning hole work together to make the alignment between the top cover and the base plate faster.

[0081] The following uses Dimm strips as an example to illustrate how the fixture proposed in this invention performs component rework.

[0082] After confirming which DIMM strips on the circuit board require rework, the operator places the PCB board on the base plate and secures it to the base plate with screws to prevent accidental lifting during DIMM removal. The memory module template is then inserted into the DIMM strip, and the top cover is aligned with the base plate using positioning pins, ensuring the template aligns with the countersunk hole. Screws are then used to connect the top cover to the base plate, compressing the spring. After assembly, the board and fixture are placed in a wave soldering oven for solder melting. Once the solder on the pins melts, the defective DIMM strip is pulled out of the circuit board by the spring force (the memory template is firmly inserted into the DIMM strip; when the solder melts, the strip loses its adhesion and is easily pulled out by the spring force). Components that do not require rework can be cured normally after removal from the oven. Damaged DIMM strips are simply replaced with new ones.

[0083] The solution proposed in this invention can repair multiple damaged PCB boards in one go, eliminating the need for repeated repairs and scrapping, thus reducing the scrap rate.

[0084] Those skilled in the art will also understand that the various exemplary logic blocks, modules, circuits, and algorithm steps described in conjunction with the disclosure herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability between hardware and software, the functionality of various illustrative components, blocks, modules, circuits, and steps has been generally described. Whether this functionality is implemented as software or as hardware depends on the specific application and the design constraints imposed on the system as a whole. Those skilled in the art can implement the functionality in various ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the embodiments disclosed herein.

[0085] The above are exemplary embodiments disclosed in this invention. However, it should be noted that various changes and modifications can be made without departing from the scope of the embodiments of this invention as defined by the claims. The functions, steps, and / or actions of the methods according to the disclosed embodiments described herein do not need to be performed in any particular order. Furthermore, although the elements disclosed in the embodiments of this invention may be described or claimed individually, they may be understood as multiple unless explicitly limited to a singular number.

[0086] It should be understood that, as used herein, the singular form “a” is intended to include the plural form as well, unless the context clearly supports an exception. It should also be understood that, as used herein, “and / or” refers to any and all possible combinations of one or more of the associated listed items.

[0087] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0088] The embodiment numbers disclosed in the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0089] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0090] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention (including the claims) is limited to these examples. Within the framework of the invention, technical features of the above embodiments or different embodiments can be combined, and many other variations of different aspects of the invention exist, which are not provided in the details for the sake of brevity. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the protection scope of the invention.

Claims

1. An element rework jig characterized by comprising: include: The base plate is used to fix the PCB board where the component to be repaired is located. The component to be repaired is a multi-pin component. The top cover has multiple countersunk holes and is fixedly connected to the bottom plate; A first connector, one end of which is connected to the component to be repaired; The second connector passes through the countersunk hole and connects to the other end of the first connector. The elastic element is located in the countersunk hole; Before the component to be repaired is repaired, the elastic element is compressed into the countersunk hole by the second connector; after the solder of the component to be repaired melts, the elastic element is reset and moves away from the base plate through the second connector, thereby separating the component to be repaired from the PCB board.

2. The jig of claim 1, wherein The base plate also includes a T-shaped platform, and the top cover also includes clamping components; The clamping member clamps the T-shaped platform to connect the upper cover to the base plate.

3. The jig of claim 1, wherein The base plate also includes positioning holes, and the top cover also includes positioning pins; The positioning pin engages with the positioning hole.

4. The fixture as described in claim 1, characterized in that, The second connecting component is a screw, and the elastic component is a spring.

5. A component rework system, characterized in that, Includes a wave soldering oven and a fixture, wherein the fixture includes: The base plate is used to fix the PCB board where the component to be repaired is located. The component to be repaired is a multi-pin component. The top cover has multiple countersunk holes and is fixedly connected to the bottom plate; A first connector, one end of which is connected to the component to be repaired; The second connector passes through the countersunk hole and connects to the other end of the first connector. The elastic element is located in the countersunk hole; Before the component to be repaired is repaired, the elastic element is compressed into the countersunk hole by the second connector; after the solder of the component to be repaired melts, the elastic element is reset and moves away from the base plate through the second connector, thereby separating the component to be repaired from the PCB board.

6. The system as described in claim 5, characterized in that, The base plate also includes a T-shaped platform, and the top cover also includes clamping components; The clamping member clamps the T-shaped platform to connect the upper cover to the base plate.

7. The system as described in claim 5, characterized in that, The base plate also includes positioning holes, and the top cover also includes positioning pins; The positioning pin engages with the positioning hole.

8. The system as described in claim 5, characterized in that, The second connecting component is a screw, and the elastic component is a spring.

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