A high impact resistant integrated miniaturized controller and method of assembly thereof

Abstract

This invention belongs to the field of controller applications, specifically relating to a high-impact integrated miniaturized controller and its assembly method. It includes a housing, a printed circuit board assembly, and vibration damping pads. The printed circuit board assembly includes a control board and a power drive board, spaced apart and interconnected by flexible wires. The housing is cylindrical with a flange, divided into an upper cavity and a lower cavity by a housing partition. The vibration damping pads are mounted at the housing flange using countersunk screws. The printed circuit board assembly is potted in the upper cavity of the housing. The printed circuit board assembly uses aluminum-based COB integration technology for the bare chip, achieving a high-integration and miniaturized design. This invention also achieves cost reduction and impact resistance through integrated housing structure and lightweight design, including flexible board connections, multi-hole spaced potting process, and high-damping material at the bottom for vibration damping and buffering. Overall, it provides good impact protection while solving the heat dissipation problem caused by high integration and miniaturization.

Description

Technical Field

[0001] This invention belongs to the field of controller applications, specifically relating to a high-impact integrated miniaturized controller and its assembly method. Background Technology

[0002] For controllers designed for use in high-impact overload environments, traditional design methods cannot meet the requirements for adaptability to high-impact environments. Measures such as potting internal electronic components and adding vibration damping devices are required to meet the development needs of controllers for high integration and miniaturization.

[0003] As the internal space of controllers becomes smaller and the number of functional components increases, the power components inside the controllers become more and more densely packed, and the heat dissipation space shrinks accordingly. In addition, the internal potting of the controllers results in a high local heat flux density of the power components, making heat dissipation a prominent problem. Considering that adding heat sinks would affect the impact resistance, increasing the heat capacity and adding heat dissipation devices would result in a large controller size and high cost. Therefore, impact resistance and thermal design issues have become the main design challenges of this type of controller, and have become the main technical bottlenecks restricting the miniaturization and low-cost design of controllers. Summary of the Invention

[0004] This invention proposes a high-impact integrated miniaturized controller and its assembly method to solve the problem that traditional design methods cannot meet the requirements of controller impact resistance, heat dissipation, miniaturization and high integration.

[0005] To achieve the above objectives, the present invention proposes the following technical solution:

[0006] A high-impact integrated miniaturized controller includes a printed circuit board assembly, a housing, and a vibration damping pad;

[0007] The printed circuit board assembly includes a control board and a power drive board. The control board and the power drive board are connected by nylon studs and nylon screws, and the control board and the power drive board are interconnected by flexible wires. A frame is provided around the bare chip of the power device.

[0008] The shell is cylindrical with a flange at the bottom. The shell is divided into an upper cavity and a lower cavity by a shell partition. Multiple countersunk holes are drilled in the shell partition.

[0009] The vibration damping pads are mounted on the flange at the bottom of the housing by mounting screws; the printed circuit board assembly is encapsulated in the upper cavity of the housing.

[0010] Preferably, the shell has a filling hole and a test hole on its side.

[0011] Preferably, the bottom of the housing is provided with an external mounting hole.

[0012] Preferably, the power drive board is an aluminum substrate, on which bare power device chips are integrated using aluminum-based COB integration technology; the aluminum substrate of the power drive board is tightly mounted on the housing partition using insulating and thermally conductive silicone grease.

[0013] Preferably, the inner ring of the enclosure is encapsulated with epoxy resin. The enclosure is made of polytetrafluoroethylene (PTFE) and is bonded to the power drive board with silicone rubber.

[0014] Preferably, the vibration damping pad is made of MC nylon material, and the vibration damping pad has multiple wire outlet holes.

[0015] Preferably, the housing partition is provided with a wire passage hole.

[0016] Preferably, the control board has a wire-passing notch.

[0017] An assembly method for a high-impact resistant integrated miniaturized controller includes the following steps:

[0018] The printed circuit board assembly is bundled with cables, and then the cables are led from the upper cavity to the lower cavity through the cable through the cable hole. After functional decomposition, they are converted into four sets of cables, and the four sets of cables are led out through a cable outlet hole to interconnect with the outside.

[0019] The test leads of the control board are led out through the test holes;

[0020] The vibration damping pad is installed in the first threaded mounting hole on the housing using three mounting screws;

[0021] The upper and lower ends of the housing are clamped by a clamping fixture, and the wire outlet and test hole are sealed with silicone rubber.

[0022] The potting compound is injected through the potting hole and flows into the lower cavity through the wire hole;

[0023] After the potting compound has cured, the clamping fixture is removed, and the controller is connected to the external device through the external mounting holes provided on the housing.

[0024] Preferably, the potting compound is a polyurethane foam or epoxy potting compound with a density of 0.3-0.6 g / cm3.

[0025] The advantages of this invention are:

[0026] The shell is divided into upper and lower cavities with partitions to ensure structural integrity. Multiple countersunk holes are drilled in the partitions to facilitate the penetration of potting compound and improve the potting bonding strength. At the same time, it enhances the interfacial stress wave reflection effect, improves impact resistance, and contributes to lightweight design. The potting compound is used to further reinforce the structure, and vibration damping pads are set for buffering, thus improving the overall impact protection structure.

[0027] The plates are flexibly connected by nylon screws to ensure buffer space under high impact and avoid rigid pulling. The plates are potted with medium-low density potting compound to ensure sufficient rigidity after sealing, avoid excessive relative displacement between components, and the potting compound has certain energy absorption and buffering characteristics to attenuate the input impact load.

[0028] The power driver board adopts aluminum-based COB integration technology, which directly integrates the bare core of the power device onto the aluminum substrate and partially encapsulates it, achieving the goal of high integration and miniaturization. The aluminum substrate is directly attached to the housing layer with thermal grease, and the heat of the power device can be directly transferred into the housing through the aluminum substrate, which can solve the heat dissipation problem under high-density assembly.

[0029] By incorporating potting holes and wire passage / exit holes, combined with a multi-layer structure, a reasonable layout and wiring design is achieved, which facilitates the implementation of potting and interconnection assembly processes, improves process reliability, and highlights the design concept of low cost and high reliability. Attached Figure Description

[0030] The accompanying drawings, which form part of this specification, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0031] Figure 1 This is a cross-sectional view of the overall structure of the controller.

[0032] Figure 2 This is a bottom view of the overall structure of the controller.

[0033] Figure 3 This is a bottom view of the controller housing structure.

[0034] Figure 4 This is a top view of the overall structure of the controller.

[0035] In the diagram: 1 is the external mounting hole; 2 is the printed circuit board assembly; 3 is the mounting screw; 4 is the cable exit hole; 5 is the cable through hole; 6 is the first mounting threaded hole; 7 is the countersunk hole; 8 is the second mounting threaded hole; 9 is the housing; 10 is the control board; 11 is the power drive board; 12 is the lower cavity; 13 is the housing partition; 14 is the MC nylon vibration damping pad; 15 is the PTFE frame; 16 is the potting hole; 17 is the test hole; 18 is the nylon screw; 19 is the nylon stud; 20 is the upper cavity. Detailed Implementation

[0036] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0037] The following detailed description is exemplary and intended to provide further detailed explanation of the invention. Unless otherwise specified, all technical terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention.

[0038] Example 1:

[0039] Please see Figure 1 As shown, the present invention provides a high-impact integrated miniaturized controller, including an external mounting hole 1, a printed circuit board assembly 2, mounting screws 3, a cable outlet hole 4, a cable through hole 5, a first mounting threaded hole 6, a countersunk hole 7, a second mounting threaded hole 8, a housing 9, a control board 10, a power drive board 11, a lower cavity 12, a housing partition 13, an MC nylon vibration damping pad 14, a polytetrafluoroethylene frame 15, a potting hole 16, a test hole 17, a nylon screw 18, a nylon stud 19, and an upper cavity 20.

[0040] The housing 9 is made of high-strength aluminum alloy, which is lightweight and high-strength. The overall shape is cylindrical with a flange. The housing 9 has openings at the top and bottom, and a mounting boss with screw holes at the bottom for connecting the controller to external structures.

[0041] The housing 9 has a potting hole 16 and a test hole 17 on its side, which are used for potting reinforcement and functional pre-testing, respectively. The housing 9 is divided into an upper cavity 20 and a lower cavity 12 by the housing partition 13. The upper cavity 20 has a larger space and is used for the installation and potting of the printed circuit board assembly 2. The lower cavity 12 has a smaller space and is used for wiring and bottom potting material filling.

[0042] Multiple countersunk holes 7 are drilled on the housing partition 13, wire through holes 5 are opened on the side of the housing partition 13, and threaded holes are drilled in the middle of the housing partition 13 for the installation of the printed circuit board assembly 2.

[0043] The printed circuit board assembly 2 mainly consists of a control board 10 and a power drive board 11. The control board 10 is an epoxy glass cloth board, while the power drive board 11 is an aluminum substrate, which facilitates heat dissipation of the power devices. The power drive board 11 uses COB integration technology to directly integrate the bare chips of the power devices onto the aluminum substrate, enabling high-density assembly. A frame 15 is set around the bare chips, which is made of polytetrafluoroethylene (PTFE) to facilitate the implementation of local epoxy potting reinforcement process for the bare chips. When assembling the power drive board 11, the bare chips of the power devices are first integrated onto the aluminum substrate using COB integration technology. Then, PTFE is bonded to the power drive board 11 with silicone rubber to form the frame 15. Finally, epoxy resin is used to initially pot the inside of the frame 15, taking care not to let the epoxy resin overflow the frame 15.

[0044] The control board 10 and the power drive board 11 are interconnected by flexible wires and assembled using a stacked flexible component, i.e., connected by nylon studs 19 and nylon screws 18. Considering heat dissipation requirements, after the two boards are assembled, the power drive board 11, i.e., the aluminum substrate, is directly and tightly attached to the housing partition 13 using insulating and thermally conductive silicone grease.

[0045] To reduce the impact of shock input, an MC nylon vibration damping pad 14 is installed at the bottom of the housing 9 via mounting screws 3; the MC nylon vibration damping pad 14 has a cable outlet hole 4 for the cable of the printed circuit board assembly 2 to be led out and interconnected externally. The vibration damping pad 14 is an MC nylon vibration damping pad.

[0046] Example 2:

[0047] A method for assembling a high-impact resistant, miniaturized integrated controller includes the following steps:

[0048] After the cable is bundled with the printed circuit board assembly 2, it is led from the upper cavity 20 to the lower cavity 12 through the cable through the cable hole 5. Then, after functional decomposition, it is converted into 4 sets of cables. The 4 sets of cables are led out through a cable outlet hole 4 to interconnect with the outside. The test line of the control board 10 is led out through the test hole 17. The vibration damping pad 14 is installed in the first mounting thread hole 6 on the housing 9 through 3 mounting screws 3.

[0049] The upper and lower ends of the housing 9 are clamped by a clamping fixture, and the wire outlet hole 4 and the test hole 17 are sealed with silicone rubber.

[0050] The potting compound is injected through the potting hole 16 and flows into the lower cavity 12 through the wire hole 5. This increases the contact area between the potting compound and the shell partition 13, thereby improving the bonding strength between the potting compound and the shell.

[0051] After the potting compound has cured, the clamping fixture is removed, and the controller is finally connected to the external device through the external mounting hole 1 provided on the housing 9.

[0052] The filling operation is carried out through the filling hole 16 on the side wall of the shell. The filling material is generally polyurethane foam or epoxy filling material with a density of 0.3-0.6 g / cm3.

[0053] The structure is formed in one piece, without any separate parts, thus ensuring the overall strength of the structure.

[0054] The advantages of this invention compared to the prior art are as follows:

[0055] Existing methods for protecting controllers from high impact typically only employ potting reinforcement, failing to comprehensively address impact resistance issues from the perspectives of system vibration damping, lightweighting, and miniaturization. They cannot simultaneously protect against low-frequency impact inertial forces and high-frequency impact stress waves, resulting in low impact reliability. This invention, in addition to potting reinforcement, comprehensively addresses the controller's impact resistance through integrated shell structure, lightweight design, flexible plate connections, multi-hole spaced potting technology, and high-damping material at the bottom for vibration damping. The overall impact protection effect is excellent.

[0056] To address the application requirements of shock resistance, heat dissipation, and high integration miniaturization, current controller structural designs generally struggle to simultaneously meet these requirements, primarily due to the inherent conflict between potting reinforcement and heat dissipation. This invention directly utilizes bare chips and aluminum-based COB integration technology, combined with a multi-hole spaced potting process, achieving both high integration and miniaturization while simultaneously solving the problems of heat dissipation for the power drive board and shock protection for the printed circuit board assembly. It overcomes the design challenges of shock resistance and environmental adaptability for controllers.

[0057] The existing controller potting, assembly, and interconnection processes are complex and costly to develop. This invention fully considers the feasibility and reliability of potting, layout wiring, and interconnection assembly processes. It also closely follows the low-cost design concept in terms of machining and material selection. Furthermore, the design scheme can be flexibly adapted according to the impact spectrum and installation method, and can be widely applied to the design of controllers with high impact protection requirements, demonstrating strong applicability.

[0058] The high integration and heat dissipation method of this invention:

[0059] For high integration, COB technology is used to achieve high-density assembly of the controller's power drive section using an aluminum substrate and bare die. First, the silicon wafer is firmly fixed to the substrate through heat treatment. Then, an electrical connection is directly established between the silicon wafer and the substrate using wire bonding. Finally, resin is used to cover the wafer to ensure reliability. The heat from the power chip on the power drive board 11 is directly conducted to the aluminum substrate. Due to its high thermal conductivity, the aluminum substrate acts as a heat sink, transferring the heat to the housing partition 13, and further conducting it to the outer surface of the housing, where it is dissipated through convection heat transfer.

[0060] The impact resistance method of this invention:

[0061] The controller's shock resistance is primarily achieved through a comprehensive approach of multi-layered media isolation and energy absorption. It consists of three different media layers: MC nylon, potting compound, and an aluminum shell. These layers dissipate the energy of the impact load at the interfaces between the different media. The MC nylon and potting compound are made of materials with high damping and high energy absorption efficiency, used to achieve the controller's vibration damping and energy absorption. The specific implementation method is explained below:

[0062] First, the impact load is transmitted from the bottom damping pad 14. Because MC nylon has high wave resistance and high impact energy absorption rate, it has a certain absorption effect on the transmitted medium and high frequency impact stress waves, and can reduce the impact load amplitude to a certain extent.

[0063] When the impact load reaches the lower cavity 12, there is a certain amount of impact energy dissipation at the interface between MC nylon and potting compound. Secondly, the potting compound further dissipates and absorbs the impact load. The energy absorption effect depends on the stress-strain mechanical properties of the material.

[0064] When the impact load reaches the shell partition 13 through the lower cavity 12, the stress wave will be reflected and refracted multiple times in the pores because the countersunk hole 7 is similar to a honeycomb porous structure, which enhances the effect of impact energy dissipation.

[0065] When the impact load is further transmitted to the power drive board, the bare core is reinforced with epoxy and is relatively lightweight, thus exhibiting a certain degree of impact resistance. Along the path from the power drive board to the control board, the buffering effect of nylon screws 18 and nylon studs 19, along with the energy absorption effect of the potting compound, ensures that the amplitude of the mid-to-high frequency impact load reaching the control board is relatively small, preventing serious damage to the printed circuit board and vulnerable components. For low-frequency impact loads, the integrated structure, high-strength aluminum material, and potting reinforcement provide the controller with high structural rigidity and strength. Furthermore, the miniaturized and highly integrated design results in a lighter weight and lower stress, making it more resistant to the effects of impact overload inertial forces.

[0066] As is known from common technical knowledge, this invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones. All modifications within the scope of this invention or its equivalents are included in this invention.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A high impact resistant integrated miniaturized controller, characterized in that, Includes printed circuit board assembly (2), housing (9) and vibration damping pad (14); The printed circuit board assembly (2) includes a control board (10) and a power drive board (11). The control board (10) and the power drive board (11) are connected by nylon studs and nylon screws. The control board (10) and the power drive board (11) are interconnected by flexible wires. The power drive board (11) is an aluminum substrate. Power device bare chips are integrated on the aluminum substrate using aluminum-based COB integration technology. A frame (15) is provided around the power device bare chips. The inner ring of the frame (15) is encapsulated with epoxy resin. The frame (15) is made of polytetrafluoroethylene material. The frame (15) is bonded to the power drive board (11) with silicone rubber. The housing (9) is cylindrical with a flange at the bottom. The housing (9) is divided into an upper cavity (20) and a lower cavity (12) by a housing partition (13). The aluminum substrate of the power drive board (11) is attached to the housing partition (13) with insulating thermally conductive silicone grease. The housing partition (13) has multiple countersunk holes (7) and wire through holes (5). The housing (9) has potting holes (16) and test holes (17) on its side. The vibration damping pad (14) is mounted on the flange at the bottom of the housing (9) by mounting screws (3); the printed circuit board assembly (2) is encapsulated in the upper cavity (20) of the housing (9); The potting compound is injected from the potting hole (16) and flows into the lower cavity (12) through the wire hole (5). The plurality of countersunk holes (7) are used to increase the contact area between the potting compound and the shell partition (13) to improve the bonding strength between the potting compound and the shell (9).

2. A high impact resistant integrated miniaturized controller according to claim 1, wherein, The bottom of the housing (9) is provided with an external mounting hole (1).

3. The high-impact integrated miniaturized controller as described in claim 1, characterized in that, The vibration damping pad (14) is made of MC nylon material, and the vibration damping pad (14) has multiple wire outlet holes (4).

4. The high-impact integrated miniaturized controller as described in claim 1, characterized in that, The control board (10) has a wire-passing notch.

5. An assembly method for a high-impact integrated miniaturized controller as described in any one of claims 1-4, characterized in that, Includes the following steps: The printed circuit board assembly (2) is bound with cables. Then the cables are led from the upper cavity (20) to the lower cavity (12) through the cable through hole (5). After functional decomposition, they are converted into four sets of cables. The four sets of cables are led out through a cable outlet hole (4) for external interconnection. The test leads of the control board (10) are led out through the test holes (17); The vibration damping pad (14) is installed in the first mounting threaded hole (6) on the housing (9) by three mounting screws (3); The upper and lower ends of the housing (9) are clamped by the clamping fixture, and the wire outlet (4) and test hole (17) are sealed with silicone rubber. The potting compound is injected through the potting hole (16) and flows into the lower cavity (12) through the wire hole (5); After the potting compound has cured, the clamping fixture is removed, and the controller is connected to the external device through the external mounting hole (1) provided on the housing (9).

6. The assembly method of a high-impact integrated miniaturized controller as described in claim 5, characterized in that, The potting compound is a polyurethane foam or epoxy potting compound with a density of 0.3-0.6 g / cm3.

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