Method and apparatus for digital fabrication and structures fabricated using the same

Abstract

Manufacturing devices include a build surface for receiving layers of material for producing a three-dimensional physical representation of a digital model and an imaging component for binding portions of the build material to cross sections representing portions of data contained in the digital model. The devices can include systems for recycling and / or homogenizing the material prior to use in the manufacturing process. The devices can include systems for controlling the density of the printed components. Exemplary objects produced by the manufacturing devices can include powder composite components using any of a variety of powder materials. Exemplary objects can also be post-processed to produce high-precision metal or ceramic components. The manufacturing devices can include selective deposition units for selectively depositing supplemental build material at high resolution. The manufacturing devices can include imaging units with extended lifespans.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 089,405, filed October 8, 2020. This application is a partial continuation of a co-pending U.S. Patent Application No. 17 / 438,853, filed September 13, 2021, which is a national phase application of Patent Cooperation Treaty (PCT) Patent Application PCT / US2020 / 021378, filed March 6, 2020, which claims priority to U.S. Provisional Patent Application No. 62 / 817,431, filed March 12, 2019. Priority is expressly claimed to both provisional and non-provisional patent applications, the disclosures of which are hereby incorporated herein by reference in their entirety and for all purposes. Technical Field

[0003] The disclosed embodiments generally relate to solid freeform fabrication of objects, and more specifically, but not exclusively, to methods and apparatus for digital fabrication of high-density objects using dynamic density control.

[0004] background

[0005] Additive manufacturing (AM), also known as solid freeform manufacturing (SFF), 3D printing (3DP), direct digital manufacturing (DDM), and solid imaging, has increasingly become a widely adopted method for prototyping both visual demonstrations and functional parts. In some cases, it has also become a cost-effective means of production manufacturing. Various methods exist for producing parts based on digital models, and these methods reduce the time and cost required for a complete design cycle, accelerating the pace of innovation in many industries.

[0006] Typically, SFF (Self-Factoring Frame) is done in a layered manner, where the digital model is divided into horizontal slices, and each slice is generated as a two-dimensional image of the building surface. The continuous manufacturing of these slices produces an assembly of thin layers that together form a three-dimensional object represented by the digital model. Compared to traditional manufacturing techniques such as Computer Numerical Control (CNC) machining, injection molding, and other methods, SFF has significantly reduced production time and costs, and has therefore been widely used for research and development purposes, where small-batch production using traditional methods would be very expensive. Furthermore, SFF devices generally require less expertise to operate compared to CNC machines. Individual parts produced by CNC machines are typically more expensive due to longer setup times and higher machine operating costs. CNC-produced parts generally have stronger and more detailed features than SFF-produced parts, which may make them ideal for certain applications. Until SFF technology can produce parts with the resolution and functionality of CNC-produced parts, the use of SFF in part manufacturing will remain limited.

[0007] Powder injection molding (PIM) is a mass production technology widely adopted as a means of producing high-precision parts in materials that would not be possible with traditional molding methods. Powder is blended with a resin binder to form an injection material, which is injected into a mold, similar to plastic injection molding. The resulting part is a powder composite part, called a "green" part. The green part undergoes a process called debinding, in which most of the binder is removed. The resulting part is called a "palm blank." The palm blank is then heat-treated to sinter the powder particles together. During this process, the part shrinks, and voids between the powder particles are removed. These ultimately result in a part with near-full density. Further post-processing can be used to achieve densities exceeding 99.5%, depending on the composition of the powder raw material used.

[0008] Some of the most common SFF techniques include stereolithography (SLA), selective deposition modeling (SDM), fused deposition modeling (FDM), and selective laser sintering (SLS). These methods differ in the types of materials they can use, how they create layers, and the resolution and quality of the subsequently produced parts. Typically, layers are produced using either bulk material deposition methods or selective material deposition methods. In techniques that use bulk deposition methods for layer production, layer imaging is typically achieved through thermal, chemical, or optical processes. One technique, binder jetting, utilizes an inkjet printhead to deposit binder into a powder bed to produce a part similar to the green part in the previously described PIM process. This green part can be post-processed in the same way to produce the final part. Unfortunately, due to defects in the process of producing the green part, the final part produced by this process often does not meet the tolerances required for high-precision applications, especially when surface finish is involved. Furthermore, the accuracy and speed of the binder jetting process are limited.

[0009] The limitations of existing SFF technology restrict the structures that can be fabricated using SFF. Some micro-medical devices cannot be fabricated using SFF in a cost-effective manner, or cannot be fabricated using SFF at all. Furthermore, existing medical devices cannot be modified because the manufacturing techniques are not available to implement such modifications.

[0010] Overview

[0011] According to the first aspect disclosed herein, a method for creating three-dimensional objects is described, including:

[0012] To homogenize the building materials of blends including powder materials and photopolymer resins;

[0013] Depositing construction materials onto a construction platform; and

[0014] Selectively process building materials to form three-dimensional objects.

[0015] In some embodiments of the disclosed method, homogenization occurs during deposition, during a settling period prior to deposition, or during both the deposition and the settling period prior to deposition.

[0016] In some embodiments of the disclosed method, selective processing includes at least a portion of the building material being at least partially cured by irradiation.

[0017] In some embodiments of the disclosed method, the build material is densified after being deposited on the build platform.

[0018] In some embodiments of the disclosed method, the building material is densified by removing at least a portion of the photopolymer resin via differential pressure.

[0019] In some embodiments of the disclosed method, deposition includes using a slot die to produce one or more layers of building material.

[0020] In some embodiments of the disclosed method, the slit mold is modified to increase the uniformity of one layer in the layer over a wider range of deviations in the layer flatness of previously deposited layers in the layer.

[0021] In some embodiments of the disclosed method, modification of the slit mold includes enlarging the stabilizing bead region of the slit mold.

[0022] In some embodiments of the disclosed method, deposition includes producing layers of building material;

[0023] Selective processing includes at least partially curing at least a portion of a building material via irradiation, wherein the building material includes a photosensitive component that changes state upon irradiation; and

[0024] Repeated deposition and selective processing are used to form three-dimensional objects.

[0025] In some embodiments of the disclosed method, state changes include detected color changes to verify curing.

[0026] According to another aspect disclosed herein, a method for creating a three-dimensional object is described, the method comprising:

[0027] Deposit the building materials onto the building platform;

[0028] To densify the building materials; and

[0029] Selectively process building materials to form three-dimensional objects.

[0030] In some embodiments of the disclosed method, the deposition includes depositing layers of building material on a building platform;

[0031] Densification includes densifying the layers of the building material;

[0032] Selective processing includes selectively processing layers of building materials; and

[0033] The method also includes repeatedly depositing, densifying, and selectively processing one or more layers of building material stacked on top of each other to form a three-dimensional object.

[0034] In some embodiments of the disclosed method, the building material comprises a blend of powder material and a fluid-carrying agent.

[0035] In some embodiments of the disclosed method, deposition includes depositing the building material via slot diecoating.

[0036] In some embodiments of the disclosed method, deposition includes depositing the building material via blade coating.

[0037] In some embodiments of the disclosed method, deposition includes depositing the building material via patch coating.

[0038] In some embodiments of the disclosed method, densification includes increasing the loading density of the powder material in the building material.

[0039] In some embodiments of the disclosed method, densification includes removing at least a portion of the fluid-carrying material from the building material.

[0040] In some embodiments of the disclosed method, removal includes at least a portion of the fluid carrier being drawn from the building material via a building platform.

[0041] In some embodiments of the disclosed method, removal includes removing at least a portion of the fluid-carrying material from the building material via applying ultrasonic waves to the building platform.

[0042] In some embodiments of the disclosed method, at least a portion of the carrier fluid, including thermal evaporation from the building material, is removed.

[0043] In some embodiments of the disclosed method, the carrier fluid includes a filler material and a skeleton material, wherein removal includes removing only at least a portion of the filler material.

[0044] In some embodiments of the disclosed method, removal includes removing at least a portion of the filler material via evaporation.

[0045] In some embodiments of the disclosed method, the method further includes depositing powder material by applying ultrasonic waves to the build platform prior to selective processing.

[0046] In some embodiments of the disclosed method, the building material includes foam in which a plurality of air bubbles are defined.

[0047] In some embodiments of the disclosed method, densification includes rupturing at least some of the bubbles in the foam.

[0048] In some embodiments of the disclosed method, rupture includes applying suction to the building material via a building platform.

[0049] In some embodiments of the disclosed method, fracturing includes applying ultrasonic agitation to the building material.

[0050] In some embodiments of the disclosed method, cracking includes applying heat to the building material.

[0051] In some embodiments of the disclosed method, densification includes applying a densifying fluid to the building material, the densifying fluid reacting with the carrier fluid to produce gaseous products, and reducing the fluid volume in the building material.

[0052] In some embodiments of the disclosed method, the carrier fluid includes a photopolymer resin, and selective treatment includes at least a portion of the building material being at least partially cured by irradiation.

[0053] In some embodiments of the disclosed method, at least partially solidification is performed using a two-dimensional slice irradiation construction material based on a digital model of a three-dimensional object.

[0054] In some embodiments of the disclosed method, selective processing includes depositing supplementary building material on at least one target area of ​​the building material.

[0055] In some embodiments of the disclosed method, densification includes densifying the building material such that the building material remains substantially wetted after densification.

[0056] In some embodiments of the disclosed method, densification includes densifying the building material such that the building material defines a plurality of voids therein, and the powder material remains wetted after densification.

[0057] In some embodiments of the disclosed method, the supplementary building material is adapted to enable a curing reaction, a solidification reaction, or a combination thereof for bonding the powder material to the target area.

[0058] In some embodiments of the disclosed method, the target region is generated based on two-dimensional slices of a digital model of a three-dimensional object.

[0059] In some embodiments of the disclosed method, the supplementary building material is adapted to enable a photocuring reaction for bonding the powder material to the target area.

[0060] In some embodiments of the disclosed method, selective processing includes irradiating the building material in a non-selective manner.

[0061] In some embodiments of the disclosed method, supplementary building materials include photocurable resins.

[0062] In some embodiments of the disclosed method, supplementary building materials and carrier fluids together provide a photocurable resin comprising a skeleton resin and a photoinitiator.

[0063] In some embodiments of the disclosed method, the supplementary building material is adapted to enable a thermosetting reaction for bonding the powder material to the target area.

[0064] In some embodiments of the disclosed method, selective processing includes heating the building material in a non-selective manner.

[0065] In some embodiments of the disclosed method, supplementary building materials include thermosetting resins.

[0066] In some embodiments of the disclosed method, supplementary building materials and carrier fluids together provide a thermosetting resin comprising a skeleton resin and a thermal initiator.

[0067] In some embodiments of the disclosed method, the supplementary building material is adapted to enable a passive curing reaction for bonding the powder material to the target area.

[0068] In some embodiments of the disclosed method, supplementary building materials include passively curable resins.

[0069] In some embodiments of the disclosed method, supplementary building materials and carrier fluids together provide a passively curable resin comprising a skeleton resin and a thermal initiator.

[0070] In some embodiments of the disclosed method, the supplementary building material includes a wax that melts during deposition and solidifies upon cooling, at least via thermal absorption through the carrier fluid.

[0071] In some embodiments of the disclosed method, the supplementary building material includes a monomer that melts during deposition and is cured at deposition via photocuring, thermal curing, passive curing, or a combination thereof.

[0072] In some embodiments of the disclosed method, the supplementary building material is adapted to inhibit the curing reaction, and the carrier fluid includes a curable material.

[0073] In some embodiments of the disclosed method, the target region is generated based on a complementary image of a two-dimensional slice of a digital model of a three-dimensional object.

[0074] In some embodiments of the disclosed method, the supplementary building material is adapted to suppress the photocuring reaction, and the carrier fluid includes a photocurable material.

[0075] In some embodiments of the disclosed method, selective processing includes irradiating the building material in a non-selective manner.

[0076] In some embodiments of the disclosed method, the supplementary building material includes a sintering inhibitor, and the method further includes sintering the powder material after selective treatment.

[0077] In some embodiments of the disclosed method, the target region is generated based on two-dimensional slices of a digital model of a support surface layer located between a three-dimensional object and a support structure.

[0078] According to another aspect disclosed herein, a system for fabricating three-dimensional objects is described, including means for performing the disclosed methods.

[0079] According to another aspect disclosed herein, a device for fabricating three-dimensional objects is described, comprising:

[0080] Build a platform;

[0081] A deposition module, configured to translate across the build platform and deposit layers of build material onto the build platform or previously deposited layers;

[0082] A material delivery unit, which is connected to the deposition module; and

[0083] A reservoir for containing build material and communicating with a material delivery unit configured to homogenize the build material in the reservoir, feed the build material from the reservoir to a deposition module, or a combination thereof; and

[0084] A projection module is used to solidify at least a portion of a deposited layer to define a layer of a three-dimensional object.

[0085] In some embodiments of the disclosed device, the material delivery unit includes at least one circulation pump for supplying build material from a reservoir to a deposition module.

[0086] In some embodiments of the disclosed device, the material delivery unit includes one or more homogenizing pumps for continuously homogenizing the build material in the reservoir.

[0087] In some embodiments of the disclosed device, the build platform and the reservoir are positioned such that the reservoir receives build material exiting the deposition module, build material discharged from the side of the build platform, or a combination thereof.

[0088] In some embodiments of the disclosed device, the build platform includes a build platform working surface that defines a plurality of holes.

[0089] In some embodiments of the disclosed device, the building material comprises a blend of powder material and photopolymer resin, wherein the photopolymer resin of the deposited layer of building material is at least partially removed through a plurality of pores, thereby densifying the layer.

[0090] According to another aspect disclosed herein, a method for fabricating a solid freeform manufacturing system is described, comprising:

[0091] Establish a platform for building;

[0092] Constructing construction material units for depositing construction materials onto the construction platform; and

[0093] Construct selective processing units for selectively processing building materials to form three-dimensional objects.

[0094] In some embodiments of the disclosed method,

[0095] The build material unit is configured to deposit layers of build material onto the build platform and densify the layers of build material.

[0096] The selective processing unit is configured to selectively process layers of building material; and

[0097] The building material units and selective processing units are configured to collectively and repeatedly perform deposition, densification, and selective processing on one or more layers of building material stacked on top of each other to form a three-dimensional object.

[0098] In some embodiments of the disclosed method, the building material comprises a blend of powder material and a fluid-carrying agent.

[0099] In some embodiments of the disclosed method, the building material unit is coupled to a building platform and configured to remove at least a portion of the fluid-carrying material from the building material via the building platform.

[0100] In some embodiments of the disclosed method, the carrier fluid includes a photopolymer resin, and the selective processing unit is configured to at least partially cure at least a portion of the building material via irradiation.

[0101] According to another aspect disclosed herein, a system for fabricating freeform manufacturing systems for solids is described, comprising means for performing the disclosed methods.

[0102] According to another aspect disclosed herein, an apparatus for illuminating an image onto an imaging surface at high resolution is described, the apparatus comprising:

[0103] An array of illumination source groups aligned in the scanning direction.

[0104] Each illumination source group comprises an array of subsets of illumination sources aligned in the cross-scan direction, and each subset of illumination sources comprises multiple illumination sources.

[0105] The illumination sources within each subset of illumination sources are distributed along the scanning direction and shifted by an offset distance along the cross-scan direction, which is greater than zero and not greater than the width of each illumination source along the cross-scan direction; and

[0106] A projection optics element is located between an array of illumination sources and an imaging surface and is configured to project illumination from the array of illumination sources onto the imaging surface.

[0107] An imaging surface defines an array of pixel regions thereon, each pixel region comprising an array of images, each image being imaged by at least one of the illumination sources.

[0108] The illumination is shifted in the scanning direction so that the array of illumination sources images the pixel regions, wherein each pixel region is fully imaged by at least one of the subsets of illumination sources.

[0109] In some embodiments of the disclosed device, the number of pixel regions in the cross-scanning direction is no greater than the number of subsets of illumination sources in each illumination source group.

[0110] In some embodiments of the disclosed device, the offset distance is equal to the width of each illumination source in the cross-scan direction.

[0111] In some embodiments of the disclosed device, the offset distance is less than the width of each illumination source in the cross-scan direction.

[0112] In some embodiments of the disclosed device, an array of lighting sources is integrated on a micro light-emitting diode (micro LED) chip, with each lighting source including a micro LED.

[0113] In some embodiments of the disclosed device, the microLED chip and the projection optics are simultaneously translated relative to the imaging surface in the scanning direction.

[0114] In some embodiments of the disclosed device, the microLED chip is translated relative to the imaging surface in the scanning direction, and the projection optics are static relative to the imaging surface.

[0115] In some embodiments of the disclosed device, the device further includes at least one refractive element configured to rotate about an axis parallel to the cross-scanning direction and located between the imaging surface and the microLED chip, the refractive element being configured to translate illumination from the microLED chip in the scanning direction.

[0116] In some embodiments of the disclosed device, the selected subset of illumination sources includes faulty illumination sources, and the area of ​​the imaging surface corresponding to the faulty illumination source is imaged by non-faulty illumination sources from another subset of illumination sources aligned with the selected subset of illumination sources in the scanning direction.

[0117] According to another aspect disclosed herein, a system for fabricating three-dimensional objects is described, the system comprising:

[0118] Constructing material units, which are used to deposit one or more layers of photocurable material; and

[0119] The disclosed device is used to solidify each layer based on slices of a digital model of a three-dimensional object.

[0120] According to another aspect disclosed herein, a method for curing photocurable materials is described, the method comprising:

[0121] The photocurable material is irradiated by an array of illumination sources aligned in the scanning direction.

[0122] Each illumination source group comprises an array of subsets of illumination sources aligned in the cross-scan direction.

[0123] Each subset of lighting sources includes multiple lighting sources.

[0124] The illumination sources within each subset of illumination sources are distributed along the scanning direction and shifted by an offset distance along the cross-scan direction, which is greater than zero and not greater than the width of each illumination source along the cross-scan direction; and

[0125] A photocurable material defines an array of pixel regions thereon, each pixel region comprising an array of images, each image being imaged by at least one of the illumination sources; and

[0126] The illumination from the array of illumination sources is shifted in the scanning direction so that the array of illumination sources images the pixel region, wherein each pixel region is fully imaged by at least one of the subsets of illumination sources.

[0127] According to another aspect disclosed herein, a needle for insertion into the skin of a living organism is described, comprising a porous tip section.

[0128] In some embodiments of the disclosed needle, the tip region is not defined as a lumen extending through the tip region.

[0129] In some embodiments of the disclosed needle, the tip region defines a plurality of orifices and one or more channels between the orifices for fluid to flow through the tip region.

[0130] In some embodiments of the disclosed needle, the tip region defines a plurality of orifices smaller than the size of the solid component of blood, such that the solid component does not pass through the orifices.

[0131] In some embodiments of the disclosed needle, the plurality of holes each have a diameter between 100 nanometers and 10 micrometers.

[0132] According to another aspect disclosed herein, a microneedle for insertion into the skin of a living organism is described, comprising a tip region defining one or more orifices that open in a direction perpendicular to the insertion direction of the needle during operation.

[0133] In some embodiments of the disclosed needle, each of the holes has a diameter between 100 nanometers and 50 micrometers, the needle is shorter than 3 millimeters, and the tip region has a length ranging from 10 micrometers to 250 micrometers and a tip radius of no more than 10 micrometers.

[0134] According to another aspect disclosed herein, an apparatus for fabricating three-dimensional objects is described, the apparatus comprising:

[0135] Build a platform;

[0136] A deposition module, configured to deposit multiple layers of build material onto a build platform or previously deposited layers;

[0137] A selective processing unit for modifying at least a portion of at least some deposited layers to define a three-dimensional object.

[0138] The building material comprises a blend of powdered material and liquid components, wherein the liquid components of the building material are at least partially removed from the deposited layer, thereby densifying the layer.

[0139] In some embodiments of the disclosed device, the liquid component includes a photopolymer resin.

[0140] In some embodiments of the disclosed device, the selective processing unit is configured to irradiate a photopolymer resin.

[0141] According to another aspect disclosed herein, an apparatus for fabricating three-dimensional objects is described, the apparatus comprising:

[0142] Build a platform;

[0143] A deposition module, configured to deposit multiple layers of build material onto a build platform or previously deposited layers;

[0144] A selective processing unit for modifying at least a portion of at least some deposited layers to define a three-dimensional object.

[0145] The construction platform defines the working surface of the construction platform, and the working surface of the construction platform defines multiple holes.

[0146] The building material comprises a blend of powdered material and liquid components, wherein the liquid components of the building material are at least partially removed from the deposited layer through multiple pores, thereby densifying the layer.

[0147] In some embodiments of the disclosed device, the liquid component includes a photopolymer resin.

[0148] In some embodiments of the disclosed device, the selective processing unit is configured to irradiate a photopolymer resin.

[0149] According to another aspect disclosed herein, a method for creating three-dimensional objects is described, the method comprising:

[0150] At least one component and a component tray are manufactured using the disclosed method;

[0151] Sintered component tray, the geometry of the sintered component tray is complementary to the geometry of the component before sintering;

[0152] Load the components into the component tray; and

[0153] Components in a sintered component tray.

[0154] In some embodiments of the disclosed method, loading includes loading the component into the component tray via vacuum suction applied through the component tray.

[0155] In some embodiments of the disclosed method, sintering the component tray includes sintering the component tray into a porous structure such that the sintered component tray is porous and defines holes with dimensions smaller than the size of each of at least one component, through which vacuum suction is applied.

[0156] In some embodiments of the disclosed method, fabrication includes fabricating multiple components; and

[0157] Loading involves loading multiple components into a component tray simultaneously.

[0158] According to another aspect disclosed herein, a method for creating three-dimensional objects is described, the method comprising:

[0159] Tools and components are made using the disclosed methods; and

[0160] Use tools to modify the geometry of the parts.

[0161] In some embodiments of the disclosed method, the modification includes:

[0162] Immerse the tools and components in the electrolyte solution; and

[0163] Apply an electric current to the tool and component to remove at least a portion of the material from the component.

[0164] In some embodiments of the disclosed method, manufacturing the tool includes determining in a digital model that the geometry of the tool is complementary to one or more surfaces of a target geometry of the part, in order to determine the desired surfaces of the tool for imparting the target geometry to the part.

[0165] In some embodiments of the disclosed method, the tool is porous.

[0166] In some embodiments of the disclosed method, tool fabrication includes controlling the porosity of the tool by controlling the sintering temperature of the tool.

[0167] In some embodiments of the disclosed method, the tool defines a hole, the size of which is such that the geometry of the hole is not imparted to the component by modification, and the electrolyte solution flows through at least some of the holes in the hole during modification.

[0168] According to another aspect disclosed herein, a method for creating three-dimensional objects is described, the method comprising:

[0169] At least one component and a component tray are manufactured using solid freeform forming;

[0170] Sintered component tray, the geometry of the sintered component tray is complementary to the geometry of the component before sintering;

[0171] Load the components into the component tray; and

[0172] Components in a sintered component tray.

[0173] In some embodiments of the disclosed method, loading includes loading the component into the component tray via vacuum suction applied through the component tray.

[0174] In some embodiments of the disclosed method, sintering the component tray includes sintering the component tray into a porous structure such that the sintered component tray is porous and defines holes with dimensions smaller than the size of each of at least one component, through which vacuum suction is applied.

[0175] In some embodiments of the disclosed method, fabrication includes fabricating multiple components; and

[0176] Loading involves loading multiple components into a component tray simultaneously.

[0177] According to another aspect disclosed herein, a method for creating three-dimensional objects is described, the method comprising:

[0178] Tools and components are manufactured using solid freeform forming; and

[0179] Use tools to modify the geometry of the parts.

[0180] In some embodiments of the disclosed method, the modification includes:

[0181] Immerse the tools and components in the electrolyte solution; and

[0182] Apply an electric current to the tool and component to remove at least a portion of the material from the component.

[0183] In some embodiments of the disclosed method, manufacturing the tool includes determining in a digital model that the geometry of the tool is complementary to one or more surfaces of a target geometry of the part, in order to determine the desired surfaces of the tool for imparting the target geometry to the part.

[0184] In some embodiments of the disclosed method, the tool is porous.

[0185] In some embodiments of the disclosed method, tool fabrication includes controlling the porosity of the tool by controlling the sintering temperature of the tool.

[0186] In some embodiments of the disclosed method, the tool defines a hole, the size of which is such that the geometry of the hole is not imparted to the component by modification, and the electrolyte solution flows through at least some of the holes in the hole during modification.

[0187] Further features of the invention will become more apparent from the following detailed description of the invention taken in conjunction with the accompanying drawings. Brief description of the attached diagram

[0189] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings, in which:

[0190] Figure 1 This is a high-angle right perspective view of a machine for freeform manufacturing of solids according to an embodiment of the subject matter of this disclosure.

[0191] Figure 2 yes Figure 1 A high-angle left perspective view of the machine.

[0192] Figure 3 yes Figure 1 A cross-sectional view of the machine.

[0193] Figure 4 yes Figure 2 A cross-sectional view of the machine.

[0194] Figure 5 yes Figure 1A high-angle perspective view of the material deposition system used in the machine.

[0195] Figure 6 yes Figure 5 A cross-sectional view of the material deposition system in the image.

[0196] Figure 7 It is in the first configuration Figure 5 A cross-sectional view of a portion of the material deposition system.

[0197] Figure 8 It is in the second configuration Figure 5 A cross-sectional view of a portion of the material deposition system.

[0198] Figure 9 It is in the third configuration Figure 5 A cross-sectional view of a portion of the material deposition system.

[0199] Figure 10 It is in the fourth configuration Figure 5 A cross-sectional view of a portion of the material deposition system.

[0200] Figure 11 It comes from Figure 1 A perspective view from below of the machine's first pumping system.

[0201] Figure 12 It comes from Figure 1 A perspective view from below of the machine's second pumping system.

[0202] Figure 13 yes Figure 1 A schematic representation of the first step of a material handling process that the machine in the diagram can use.

[0203] Figure 14 yes Figure 1 A schematic representation of the second step of the material handling process that the machine in the diagram can use.

[0204] Figure 15 yes Figure 1 A schematic representation of the third step in the material handling process that the machine in the diagram can use.

[0205] Figure 16 Is to implement Figure 1 A high-angle perspective view of the building platform used in the machine.

[0206] Figure 17 yes Figure 16 A cross-sectional view of the building platform.

[0207] Figure 18 yes Figure 16 A high-angle perspective view of the building platform, where the building portion is complete.

[0208] Figure 19 yes Figure 16 A high-angle perspective view of the building platform, where the building is complete.

[0209] Figure 20 It is used in Figure 16 The high-angle perspective view of the first configuration of the system that has been built is processed on the build platform.

[0210] Figure 21 yes Figure 20 A cross-sectional view of the system.

[0211] Figure 22 yes Figure 16 A high-angle perspective view of the top section of the building platform, where the construction is complete.

[0212] Figure 23 yes Figure 16 A high-angle perspective view of the top section of the building platform, where the building is complete after the process of removing excess material is finished.

[0213] Figure 24 This is a perspective view from below of the first configuration of a system for removing a batch of printed parts intended for sintering.

[0214] Figure 25 This is a perspective view from below of a second configuration of a system for removing a batch of printed parts intended for sintering.

[0215] Figure 26 yes Figure 25 A cross-sectional view of the system.

[0216] Figure 27 This is a schematic representation of the first step in the finishing process of a component, which can be achieved using... Figure 1 Parts and / or tools produced by the machines in the process.

[0217] Figure 28 This is a schematic representation of the second step in the component finishing process, which can be achieved using... Figure 1 Parts and / or tools produced by the machines in the process.

[0218] Figure 29 This is a schematic representation of the third step in the component finishing process, which can be achieved using... Figure 1 Parts and / or tools produced by the machines in the process.

[0219] Figure 30 This is an exemplary diagram illustrating a system for the free-form manufacturing of objects.

[0220] Figure 31 It shows based on Figure 30 An exemplary top-level flowchart of an embodiment of a method for manufacturing a system of free-form solids.

[0221] Figure 32 It is shown Figure 30 An exemplary diagram of an alternative embodiment of the system, wherein the object comprises one or more layers.

[0222] Figure 33 It shows based on Figure 32 An exemplary flowchart of an embodiment of a method for manufacturing a system of free-form solid objects.

[0223] Figure 34 It shows based on Figure 32 An exemplary flowchart of an alternative embodiment of a method for manufacturing a system of free-form solids, wherein the method includes densifying the building material.

[0224] Figure 35A and Figure 35B It is shown Figure 32 An exemplary diagram of another alternative embodiment of the system is shown, in which the building materials are illustrated before and after the application of the ultrasonic unit.

[0225] Figure 36A and Figure 36B It is shown Figure 32 An exemplary diagram of another alternative embodiment of the system is shown, in which the building material is shown before and after the application of the ultrasonic unit, and in which the ultrasonic unit causes the powder to precipitate.

[0226] Figure 37 It is shown Figure 32 An exemplary diagram of another alternative embodiment of the system, wherein the system includes an evaporation unit.

[0227] Figures 38A-38C It is shown in Figure 32 An exemplary diagram of an exemplary process for densifying building materials in a system.

[0228] Figure 39A and Figure 39B It is shown Figure 32 An exemplary diagram of another alternative embodiment of the system is shown, in which the build material is illustrated before and after the application of the densification fluid.

[0229] Figure 40 It shows based on Figure 30 An exemplary flowchart of an alternative embodiment of a method for manufacturing a freeform solid model of a system, wherein the method is based on irradiation.

[0230] Figure 41 It is shown Figure 32An exemplary diagram of another alternative embodiment of the system, wherein the system includes a selective deposition unit.

[0231] Figure 42A and Figure 42B It is shown Figure 41 An exemplary diagram of the system is shown, in which the deposition of supplementary building materials on dry powder and wet powder are illustrated, respectively.

[0232] Figure 43 It shows based on Figure 30 An exemplary flowchart of another alternative embodiment of a method for manufacturing a system of freeform building blocks, wherein the method includes depositing supplementary building material.

[0233] Figure 44 It is shown Figure 41 An exemplary diagram of an alternative embodiment of the system, wherein objects are formed based on a target region.

[0234] Figure 45 It is shown Figure 41 An exemplary diagram of another alternative embodiment of the system, in which objects are formed based on non-target regions.

[0235] Figure 46 It is shown Figure 41 An exemplary diagram of another alternative embodiment of the system, wherein an object is formed based on a supporting surface layer.

[0236] Figures 47-56 It is shown Figure 41 Various detailed diagrams of embodiments of the system.

[0237] Figure 57 This is an exemplary diagram illustrating an embodiment of a manufacturing system, wherein the system includes an imaging unit.

[0238] Figure 58 It is shown Figure 57 An exemplary diagram of an embodiment of an imaging unit, wherein the imaging unit includes a plurality of illumination source groups.

[0239] Figure 59 It is shown by Figure 58 An exemplary diagram of the image group generated by the imaging unit.

[0240] Figure 60 It is shown by Figure 58 An exemplary diagram of the pixel region generated by the imaging unit.

[0241] Figure 61 It is shown Figure 57 An exemplary diagram of an alternative embodiment of the imaging unit, wherein the imaging unit includes a plurality of illumination source groups, wherein the size of the illumination sources is in Figure 61 and Figure 58 They are different.

[0242] Figure 62 It is shown by Figure 58 An exemplary diagram of the image group generated by the imaging unit.

[0243] Figure 63 It is shown by Figure 58 An exemplary diagram of the pixel region generated by the imaging unit.

[0244] Figure 64 It is shown by Figure 57 An exemplary diagram of an array of images produced by another alternative embodiment of the imaging unit.

[0245] Figure 65 It is shown by Figure 57 An exemplary diagram of an array of images produced by another alternative embodiment of the imaging unit, wherein the size of the images is in... Figure 65 and Figure 64 They are different.

[0246] Figures 66-70 It is shown Figure 57 Exemplary diagrams of various embodiments of the system.

[0247] Figure 71 It is shown by Figure 30 An exemplary diagram of an embodiment of a component made from a system.

[0248] Figure 72 It is shown Figure 71 An exemplary diagram of an alternative embodiment of the component, wherein the component defines a hole therein.

[0249] Figure 73 It is shown Figure 71 An exemplary diagram of another alternative embodiment of the component, wherein the component defines a hole in the tip region.

[0250] Figure 74 It is shown by Figure 30 An exemplary diagram of an embodiment of a component made of a system, wherein the component is configured to enter a blood vessel.

[0251] Figure 75 It is shown Figure 74 An exemplary diagram of an alternative embodiment of the component, wherein the component defines a hole in the tip region.

[0252] Figure 76 It is shown by Figure 30 An exemplary diagram of an embodiment of a component made of a system, wherein the component defines one or more holes oriented in a lateral direction.

[0253] Figure 77 It is shown by Figure 30An exemplary diagram of an embodiment of a microneedle array made using a system.

[0254] Figure 78 It shows the control Figure 30 An exemplary diagram of an embodiment of the system's control system.

[0255] It should be noted that the accompanying drawings are not drawn to scale, and for illustrative purposes, elements with similar structures or functions are generally represented by the same reference numerals throughout the drawings. It should also be noted that the drawings are intended only to facilitate the description of preferred embodiments. The drawings do not illustrate every aspect of the described embodiments and do not limit the scope of this disclosure.

[0256] Detailed Description of Preferred Embodiments

[0257] The embodiments described herein generally relate to apparatus and methods for manufacturing objects by free-form shaping from a variety of material entities. Exemplary materials may include materials such as metals, plastics, ceramics, and / or composite materials comprising a combination of one or more types of materials.

[0258] Stereolithography (SLA) fabrication utilizes photopolymer resins and a polymerization irradiation source to create three-dimensional objects. Several methods have been developed to produce powder composite parts using slurry raw materials, which can then be further processed to produce solid metal or ceramic parts. Many of these methods involve inherent design trade-offs between speed and part quality. Figures 1-4 A system (100) designed to overcome these limitations is shown.

[0259] This system can be used to process any mixture of photopolymer resins and powders. In some embodiments, the mixture may be in the form of a slurry. In some cases, powder composite parts can be produced using this method, followed by post-processing to remove the polymer binder and sinter the powder material into a solid part. The powder material may be any combination of metal, ceramic, or sinterable materials.

[0260] In an exemplary embodiment, the system includes: a material deposition system (130); and optionally, one or more air blades (140, 150) for depositing material and controlling the location allowing material to accumulate on a build platform working surface (162). In various embodiments, the processes as set forth in this disclosure may be performed on an effective working surface (167). The effective working surface (167) may include a surface on which material is being or will be deposited. In some embodiments, such as during the deposition of a first layer, the effective working surface (167) may include the build platform working surface (162). Additionally and / or alternatively, such as when each subsequent layer is deposited after the first layer, the effective working surface (167) may include the outermost deposited layer. In some embodiments, the deposition system (130) may be mounted on linear guides (103, 105) to allow the deposition system (130) to translate linearly across the build platform working surface (162). Generally, it should be understood that any system that enables the movement of the deposition system (130) relative to the working surface (162) of the build platform to deposit material onto the effective working surface (167) is considered to be within the scope of the subject matter currently disclosed. Following material deposition, a projection module (106) is used to at least partially solidify at least a portion of the deposited layer to define a layer of a printed part or array of printed parts. This layer image can be obtained by calculating the intersection of a horizontal plane and a three-dimensional digital representation of the object. Furthermore, the image can be modified to have a lattice structure or additional support features, including but not limited to non-contact support features, wherein these support features are designed in the layer image to have gaps separating the support features from the printed part, as will be described in more detail in the following figures. Generating the layer image using generally accepted methods may be sufficient, or it may be necessary to include any combination of the modifications listed above. This process is repeated until the build is complete.

[0261] The process can be monitored by a camera (104), which can provide data for feedback and / or for quality control purposes in a configuration utilizing closed-loop control. Specifically, for certain photopolymer resin formulations, color changes can be observed during the curing process to control and / or verify the integrity of the curing process. For example, some resin formulations containing phosphine-based photoinitiators can change from a transparent or light translucent yellow to a darker yellow during curing. In this case, the build area can be illuminated with light of a specific wavelength corresponding to changes in resin absorption during curing. The emitted light from the build area can be imaged by the camera (104), and the brightness of that wavelength measured in the camera image can be used to verify the curing process. In some embodiments, the brightness level can be measured by control software using data from the camera to determine the degree of curing that has occurred. In a control configuration, this can be used to determine when to stop the curing process after the camera observes a brightness threshold and the control software detects the brightness threshold. In an alternative embodiment, the brightness level can be measured and stored as quality control data. Additional metadata can be added to indicate whether the level exceeds a predetermined minimum to confirm that sufficient curing has occurred. In addition, the acceptable range can be compared with the brightness level observed by the camera and measured by the control software to determine whether the layer has been sufficiently cured but not over-cured.

[0262] When using slurries of photopolymer resins and powders as raw materials, homogenization of the material can be useful, for example, by means including but not limited to circulating, agitating, and / or stirring the material to limit the extent to which the powder material can precipitate from the slurry and / or the extent to which agglomerates may form that could impair the quality of the material layer or the printed part or the array of parts as a whole. While the use of dispersed powders in slurries is common in industry, it is worth noting that many slurries use nanoparticles that can be bound into a stable suspension that does not require continuous homogenization to maintain material quality and uniformity. In many cases of additive manufacturing, larger (e.g., diameters ranging from 0.5 micrometers to 50 micrometers) and denser particles (e.g., metals and / or ceramics) can be used, making it more difficult to produce a stable suspension. Exemplary particles used in various embodiments can have a density of 1.5 g / cm³. 3 Up to 20g / cm 3 Or 1.5g / cm 3 Up to 25g / cm 3Within the range of [specific ranges]. In a suspension, a settling time may exist, which represents the time (e.g., 30 seconds) from when the homogenization process stops until the slurry or suspension is no longer homogenized enough to be distributed to form a layer of acceptable quality. By continuously homogenizing the slurry during the build-up process, higher quality and more reproducible results can be obtained than if all suspensions were only premixed. In various embodiments, the settling time of the disclosed process can be significantly shorter than that of many existing slurries using nanoparticles. Exemplary settling times can range from 1 second to 5 minutes, and this makes homogenization necessary for some practical manufacturing processes as disclosed. A particular settling time can depend on the particle size and / or density and the properties of the fluid (e.g., viscosity). For example, when the fluid viscosity is low, the settling time can be short, and when the fluid viscosity is high, the settling time can be long. For example, the settling time for a metallic material in a low-viscosity fluid can be 2 seconds. In another example, the settling times for various types of metallic materials can be 10 seconds, 30 seconds, or 5 minutes, respectively. In another example, the settling time for a ceramic material can be 2 minutes.

[0263] In various embodiments, continuous homogenization can be performed without interruption during the printing process. Additionally and / or alternatively, continuous homogenization can be performed at least immediately before and / or during the deposition of the build material, with possible pauses at other times. In some embodiments, if a pause occurs during the process, the pause time between stopping homogenization and layer deposition needs to be less than the deposition time. In various embodiments, this circulation can be achieved using a set of pumps (110, 112, 114, 116, 118). Four of these pumps (110, 112, 114, 116) are homogenization pumps, while one pump (118) is used for circulation and supplying material to the deposition module (130). As will be shown in other figures, the outflow from the supply pump (118) flows through a pipe (e.g., Figure 11 The outlet port 121 shown in the figure can be connected to the inflow section for the deposition module (130) (e.g., Figure 5The input line 132 is shown in the figures. Although the complete piping loop is not depicted, it is understood from the figures that such a connection is readily achievable. During the printing process, the slurry reservoir (102) can be filled with slurry. Homogenizing pumps (110, 112, 114, 116) can be configured to homogenize the slurry in their respective areas, such that inflow and outflow occur near a given pump. Additionally and / or alternatively, the homogenizing pumps (110, 112, 114, 116) can be configured to circulate the slurry around the reservoir (102), such that the outflow from one homogenizing pump is directed toward the inflow from another homogenizing pump. As will be shown in other figures, an exemplary homogenizing pump (110, 112, 114, 116) can be a hammer mill pump, which can generate a localized annular flow during homogenization. In some embodiments, additional features (not depicted) may be added to direct the output flow from the pump in a specific direction; these additional features may be, for example, a shroud or other diversion structures that can be implemented in an impeller pump system. In some embodiments, the reservoir (102) includes an inner wall, an outer wall, and a bottom surface, which together comprise an annular reservoir for receiving excess slurry from the deposition module (130) and any excess slurry discharged from the side of the build platform (160). When the deposition module (130) is positioned above the reservoir (102), slurry may exit the deposition module (130) and fall back into the reservoir (102). If the deposition module (130) translates across the work surface (162) of the build platform, this will produce a layer of material for printing. An exemplary printing process may include translating a deposition module (130) across the build platform working surface (162) in one direction to produce a material layer on the effective working surface (167), processing the material layer with a projection module (106), lowering the build platform (160) by one layer thickness, and translating the deposition module (130) back across the build platform working surface (162) to produce another material layer, which may then be processed by the projection module (106). This configuration and style of the pump are intended to be illustrative and not limiting; any suitable circulation and homogenization system for supplying material to the deposition module (130) should be understood to be included in this specification. In some embodiments, translation of the deposition module (130) may be achieved by any combination of linear actuators, driven screw drives, or rotary actuators with drives, or any other methods commonly understood by those skilled in the art for achieving linear motion. Additionally, in some embodiments, control of the pump motor, build platform motion, and deposition module motion may be achieved using standard means. Although Figures 1-4The system (100) shown includes a pump system comprising pumps (110, 112, 114, 116, 118), each pump having the aforementioned functions for illustrative purposes only. However, the system (100) can achieve this functionality through, and is not limited to, a material delivery unit (108) having any suitable components and / or structure. An exemplary material delivery unit (108) can include any suitable type of pump, conveyor, vacuum, fan, turbine, mixer, agitator, processor, and / or combination thereof. Although... Figures 1-4 The system (100) shown includes pumps (110, 112, 114, 116, 118), each having the functions described above for illustrative purposes only. However, the system (100) may include one pump, or any suitable number (more or less than five) of the same and / or different pumps, and is not limited thereto. The functions of the pumps can be implemented via any configuration and / or combination. In one embodiment, one or more pumps may each provide homogenization and circulation functions. In another embodiment, one or more pumps may be homogenization pumps, and one or more other pumps may be circulation pumps.

[0264] In one configuration, the deposition module (130) can be a slot die, the details of which are as follows: Figure 5 and Figure 6 As shown. The slot die works by pumping slurry into the central cavity (131) through the input line (132) and out between two opposing surfaces (133, 134). Two vacuum zones (137, 138) can be used to improve the deposition process by applying vacuum pressure through the right vacuum line (135) or the left vacuum line (136), as will be shown. Figure 8 As described in [the text].

[0265] As will be explained further below, it may be desirable to limit the locations where deposited material is allowed to accumulate on the build platform working surface (162). In one example, it may be desirable to limit the accumulation of deposited material on the feed / discharge edges (or surfaces, or areas) (164, 166) of the build platform working surface (162). Figure 16 and Figure 17 (as shown). The air scraper (140, 150) includes inlet lines (142, 152) that supply air to the central cavity (144, 154) and allow air to flow out through the outlet slits (146, 156). The air scraper can be used to blow excess material away from the working surface (162) of the build platform and back into the reservoir (102) for reuse on subsequent layers.

[0266] Figures 7-10 The process of using a slot die in a deposition module (130) is described, as well as the modifications that can be made to improve the properties of such a slot die system. Figure 7 A standard slit mold exit path is depicted, wherein slurry (201) is allowed to pass between opposite faces (133, 134) of the slit mold before forming a carcass with a forward meniscus (202) and a backward meniscus (204), which in turn produces a layer (206) of deposited material. The volume of the carcass between the forward meniscus (202) and the backward meniscus (204) defines a stable carcass region. In this depiction and in Figures 8-10 In the process, the slit die moves to the left, leaving a layer of material (206) behind it. As understood in slit extrusion coating, when operating conditions are fixed and the process occurs at atmospheric pressure, there is a limitation on the ratio of carcass height to layer height. In this case, the carcass height is considered to be the height of the forward bend (202). Figure 8 As shown, this ratio can be increased by exposing the forward-curved meniscus (202) to vacuum pressure, thereby creating a thin layer while still maintaining a high clearance between the slit mold and the substrate, and reducing shear stress on the substrate. The increase in the ratio of carcass height to layer height is likely at least in part due to the forward displacement of the carcass under vacuum pressure. Since the flow within the carcass is typically laminar, there is also a shift in the velocity distribution within the carcass, which is a major factor in determining shear stress. These characteristics are generally understood in existing applications of slit extrusion coating and can be advantageously applied in some embodiments. In some embodiments, as shown in the previous figure, the vacuum pressure can be provided by the vacuum region (138) on the left.

[0267] In some embodiments, conditions (flow rate, lateral velocity, etc.) can be controlled to provide a stable matrix during deposition, which in turn produces a very uniform layer (206). However, if deviations exist in the preceding layer, these deviations can be somewhat compensated for due to the nature of the slot die deposition process. A low area on the preceding layer will result in a larger gap between the slot die and the substrate (200) (in this case, the substrate is the preceding layer). This larger gap will draw more material from the matrix and produce a thicker layer (206), which will at least partially compensate for the low area. The opposite behavior will occur in the high area. The limitation on this behavior is at least partly determined by the size of the matrix; if too much material is drawn from the matrix, the leading meniscus (202) will no longer be stable, and bubbles may be incorporated into the layer (206). Conversely, if too little material is used from the matrix, the leading meniscus (202) may extend too far beyond the slot die and result in wetting on the inclined outer surface of the slot die. This additional material may directly cause defects in layer (206) and may also produce residual material that can drip onto the next layer as the slot die moves in the opposite direction across the build platform, causing defects in the next layer.

[0268] Figure 9 and Figure 10 Modification of the relative surfaces (133, 134) defining the flow path of the slurry (201) is shown to increase the matrix size without fundamentally altering other aspects of the deposition process, thereby introducing greater tolerance for deviations in the system. If the flow rate is related to the deposition module (130) (e.g., Figure 6 By keeping the ratio of the linear velocity (shown) within a range that prevents excessive flow from making the carcass too large, the forward meniscus (202) can be prevented from extending too far beyond the slit mold and causing wetting on the inclined outer surface of the slit mold. For this purpose, chamfers (210, 212) or rounded corners (214, 216) can be added to the slit mold surfaces (133, 134); additionally and / or alternatively, other cutout shapes can be used to produce the desired effect. The chamfers (210, 212), rounded corners (214, 216), and / or other cutout shapes formed on the slit mold surfaces (133, 134) can expand the size of the opening defined at the end regions of the slit mold surfaces (133, 134) and can enlarge the stable carcass area. The inventors have found that the increased carcass size can increase the stability and / or uniformity of deposition in the deposition module (130). Conventional slot-extruded coating applications apply only a single layer, such as a coating on paper to give it a gloss, or a limited number of continuous layers, such as multiple colors or coatings, of about five or fewer. In contrast, the disclosed system (100) (as...) Figures 1-4 (As shown) Slot extrusion coating can be used in SFF. When deposition involves multiple layers, such as hundreds or thousands, it is important to ensure that the system (100) is stable at such a high level of repeatability. Therefore, by modifying the slot die to increase stability in SFF applications, the system (100) addresses problems unique to SFF applications and not necessarily present in other applications of slot extrusion coating. The exemplary number of layers required to fabricate a three-dimensional object can be equal to or approximately 10, 20, 50, 100, 200, 500, or 1000. Such numbers are significantly greater than any other technique using slot extrusion coating. Therefore, using slot extrusion coating in SFF encounters unique technical problems that have not been encountered or resolved in conventional slot extrusion coating techniques. The methods and systems described in this disclosure can solve such technical problems.

[0269] Figure 11 A circulation pump (118) is depicted, which can be used to feed the previously depicted deposition module (130). The pump (118) may include an outer casing (120), a rotor (119), and an outlet port (121). In this configuration, the pump (118) may be an impeller pump that can operate continuously to circulate the slurry through the deposition module (130). Figure 12A homogenizing pump (110) is depicted, comprising a shroud (115) with an outlet slit (117) and a rotor (111) with a pumping channel (113). In this configuration, the homogenizing pump (110) can be a hammer mill, which uses centrifugal pumping motion to drive collisions between suspended particles in the slurry and the outlet slit (117) of the shroud (115). This has the effect of breaking up powder agglomerates and homogenizing the slurry. The continuous circulation of the slurry through these pumps can help maintain slurry quality and prevent sedimentation and / or agglomeration.

[0270] Figures 13-15 A schematic representation of a material handling method that can be used in the aforementioned system is shown. As will be described in a separate figure, the working surface (162) of the construction platform can be porous to allow fluid flow through the platform. In this configuration, a low-density blend of powder (310) and resin (312) is deposited on the effective working surface (167). Vacuum pressure is applied to the slurry through the porous construction platform working surface (162) and the pre-deposited layer (if present) to remove excess resin (312) and increase the effective powder loading density of the slurry, thereby densifying the powder (310). In extreme cases, such as Figure 15 As shown, all excess resin (312) can be removed, so that resin (312) is only found at the tangent points between powder particles (310). In cases where not all resin (312) is removed (e.g., as...), Figure 14 As shown, layers can be imaged using a lattice structure to allow fluid flow and removal from subsequent layers. Slightly different, these layers can be imaged according to a lattice pattern. Advantageously, resin can be removed from unimaged areas of the layer, allowing fluid pathways to be opened within the layer. If the lattice size and boundaries are appropriately designed, for example, mostly solid with few or no pores, the lattice can trap uncured powder within a three-dimensional part, enabling the production of solid parts through a sintering process, despite the lattice being used during exposure. Figure 15 In the cases shown, it may not be necessary to use these lattice imaging techniques; even when using solid-state images, fluid paths within the component can be available because such fluid evacuation processes leave behind an inherent porous structure.

[0271] The value of densifying the deposited layer lies in its ability to allow the use of low-viscosity feedstock that can be deposited rapidly during deposition, while simultaneously producing highly uniform, high-density printed parts. If feedstock with a low powder load is used, it may not sinter properly because there are minimum density requirements for the printed parts to achieve high density after sintering. If feedstock with a high powder load is used, the viscosity will be very high, and the layer deposition (and therefore printing) process will be very slow. Furthermore, metal powders tend to precipitate out of the slurry particularly quickly, and in layers with low powder loads, this can result in printed layers with more powder in the bottom region than in the top region. This effect affects the mechanical properties of the sintered part, producing a weaker part when a tensile load is applied in the vertical direction compared to when a load is applied in any horizontal direction. Densifying the layer eliminates any density variation within the layer, resulting in isotropic sintered parts. Additionally, higher-density printed parts shrink less during sintering, allowing for greater control over dimensional tolerances. Furthermore, if the slurry is deposited on a porous substrate without applying vacuum pressure, the layer can be densified as fluid is passively absorbed into the substrate; however, this densification process can occur very slowly compared to when the process is assisted by vacuum pressure. Moreover, the rate of this densification process can be significantly reduced and can be completely stopped with the deposition of additional layers.

[0272] In some embodiments, the suction process can be performed using a camera (104) (e.g., Figure 1 Imagery (shown) is used to control and / or verify the process. The effective working surface (167) may be illuminated (and / or irradiated) by a light source that is absorbed by the resin material and reflected by the powder material, and the emitted light may be imaged by a camera (104) to determine the relative amounts of resin and powder in a given build layer. This data obtained from the imaging by the camera (104) can be used as feedback to control the level of vacuum pressure applied during densification. For example, a very high vacuum pressure may initially be applied, and as the amount of resin in the layer decreases, the vacuum pressure may be reduced to maintain the resin level in the layer at a stable target value. In some embodiments, the maximum vacuum pressure (approximately 14.7 psi in a non-limiting example) may not necessarily be sufficient to achieve layer densification at the desired rate. In such cases, it may be desirable for the entire build process to be enclosed in a sealed container that can be pressurized to increase the effective differential pressure relative to the side of the effective working surface (167) near the working surface (162) of the build platform in the direction opposite to the effective working surface (167). In various embodiments, “vacuum pressure” can be understood as the magnitude of the differential pressure applied as described herein. For example, "high vacuum pressure" can include high differential pressure.

[0273] Figure 16 and Figure 17A build platform (160) is shown having a build platform working surface (162) that can be used in the previously described system. The build platform working surface (162) may be removable and may have a central porous region (165) and feed / discharge surfaces (164, 166). As previously described, the porous region (165) allows for densification of the slurry deposited on the build platform working surface (162) or the effective working surface (167). Considering that densification may not occur in the feed / discharge regions (164, 166), this further clarifies the benefits of using an air scraper to remove excess material as previously described.

[0274] The build platform (160) may also have an open cavity with a porous top surface (161). In this case, the porous region (165) of the build platform working surface (162) may have holes small enough to prevent printed parts from falling through but large enough to allow powder to flow through, while the porous top surface (161) of the build platform (160) may have smaller holes that allow resin to flow through but not powder. In some embodiments, the size (e.g., diameter) of each hole in the porous region (165) may be smaller than the size of each printed part and larger than the size of the powder, while the size (e.g., diameter) of each hole in the porous top surface (161) may be smaller than the size of the powder. During the printing process, powder and resin may fill the holes in the build platform working surface (162), but powder will not fall into or below the build platform (160). The build platform working surface (162) having porous regions (165) allows for removal of the build platform working surface (162) to clean excess material (e.g., powder contained within uncured resin material) from a batch of parts and / or leaving the build platform working surface (162), which will be further described in subsequent figures. During the cleaning process, excess unbonded powder can be removed through the build platform working surface (162), thus facilitating the cleaning process. During cleaning, only unbonded powder and resin can be removed because the pores defined in the build platform working surface (162) can be smaller than the printed parts and / or support structures. In various embodiments, the unbonded powder may include portions of powder blended with resin, wherein the resin is not exposed to UV light and is not solid.

[0275] Figure 18 and Figure 19 The build platform (160) and the build platform working surface (162) during the build process are shown. Figure 18A partially completed construction is shown, comprising a component block (a collection of components and / or support structures and uncured material) (170) with partially completed parts (190) and support structures (192). In this case, dense construction material (520) (such as...) Figure 30 The support structure (192) (as shown) (e.g., deposited in the form of a slurry) can provide sufficient support for the printed part (190), so the support structure (192) is not bonded to the part (190) and does not necessarily serve the purpose of certain conventional support materials or structures. In various embodiments, bonding may include fixedly and / or rigidly attaching, joining, or adhering. Slightly different, even if the support structure (192) can contact and / or reach the part (190) at selected locations to hold the part (190) in place, the support structure (192) will not be fixedly attached, joined, or adhered to the part (190) because gaps may exist between the part (190) and the support structure (192) during the printing process. In some embodiments, the gap can be defined by modifying the layer image input to the projection module (106). For example, modifying the layer image may include defining one or more image pixels between the support structure (192) and the part (190). The support structure (192) can be used to hold the part (190) in position during post-processing, which may include cleaning processes and / or removal for sintering.

[0276] Figure 20 and Figure 21 Systems and methods for pretreating a component block (170) prior to any additional steps for removing excess material and sintering components are illustrated. Removing any uncured resin from the component block (170) prior to further processing may be advantageous, as this may help facilitate the process of fluidizing (and / or loosening) and removing unbound powder. In some embodiments, the removal of uncured resin does not necessarily result in a visible change in the appearance of the component block (170). In this case, a shield (180) is placed around the component block (170). The shield (180) may be filled with a solvent that can be drawn through the component block (170) using the same system used for layer densification during the printing process. This may involve running the pretreatment process within the printer itself or at a separate station that may have its own suction system, or it may involve completely removing the build platform (160) from the printer. Any and all forms of modularity involving the movement of any build platform working surface (162) or build platform (160) or other components within any of the aforementioned systems to facilitate these secondary processes are understood to be within the scope of the disclosed subject matter.

[0277] Figure 22The build platform working surface (162) and part block (170) removed from the printer after build are depicted. This can be done before or after the aforementioned pretreatment process, or it can be done without a pretreatment process. As previously described, the porosity in the build platform working surface (162) allows powder to flow through the build platform working surface, but the part remains on top of the build platform working surface (162). Therefore, the assembly can be placed in a cleaning tank with a cleaning solution that allows the part block (170) to be subjected to ultrasonic treatment, heat, flow of the cleaning solution induced by a pumping system, agitation, etc., in order to fluidize unbonded powder and remove any excess material, including unbonded powder. The end result of this process is as follows: Figure 23 As shown, the component (190) is held in place by the support structure (192), but is not necessarily coupled to the support structure (192). In some embodiments, the component (190) and / or the support structure (192) may each be coupled internally, but the component (190) is not coupled to the support structure (192) at any point on the component (190).

[0278] Figures 24-26A system and method for removing components (190) in preparation for sintering are described. A vacuum module (196) may have a porous ceramic tray (194) mounted therein, the geometry of which matches the top of the components (190) and provides support for these components (190) during sintering. Vacuum suction can be applied through the component tray (194) to remove the components (190) from their support structure (192). The component tray (194) can then be inverted and loaded into a furnace for sintering. In some embodiments, the components (190) may be printed inverted (or in any other desired orientation) such that when the component tray (194) is inverted, the component tray is in the desired orientation for sintering. After determining the optimal orientation of these components for sintering, the ceramic component tray (194), the geometry of which is determined to be complementary to the downward-facing surface of the component or assembly of components, may also be printed and sintered using the aforementioned system. Because the sintering temperature of ceramics is significantly higher than that of metal materials, ceramic printing trays can be reused multiple times to process batches of metal parts. In this way, low-cost tools can be obtained for automating part handling in the production of metal parts, increasing the overall efficiency of the process for producing metal parts through the previously described system, particularly by reducing labor costs. In some embodiments, the part tray (194) may define holes therein smaller than the size of each part (190). For example, a controlled level of porosity in the part tray (194) can be achieved by adjusting the sintering cycle to reduce peak temperature and / or soaking time. By using a porous part tray (194), multiple parts (190) can be loaded simultaneously in the part tray (194). Conventionally, when parts are very small (e.g., on the order of millimeters), manual loading of parts is required, and sintering is performed one after another. This operation is inefficient and error-prone. In contrast, the disclosed method described above can advantageously load parts (190) in an efficient and accurate manner. Therefore, the speed and quantity of manufacturing can be significantly increased.

[0279] Figures 27-29Systems and methods for refining specific geometries of printed parts in a scalable and cost-effective manner are described. In some cases, it may be desirable to produce parts with sharp points or edges, which may be located in areas that are not easily reached by standard sharpening methods, or there may be a large number of such areas requiring finishing, making conventional methods uneconomical when producing a large number of parts. In such cases, conventional methods can be replaced by electrochemical machining using a printing tool (410), the geometry of which has been determined to sharpen all relevant features in a single process. In this case, a part (400) with blunt points (402) is depicted. Tool geometries (412, 414) can be determined by extrapolation from the desired final geometry (404, 406, 408). The desired final geometry or target geometry of the part (400) may include the geometry of the part (400) as the target of modifying the part (400) via electrochemical machining. In this case, the modified surfaces (404, 406, 408) are directly affected by the portions of the tool (410) closest to the part (400) (412, 414) (where the current density is highest during electrochemical machining), thus determining what material to remove. Depending on the current level, the proximity of the tool geometry to the part geometry, and in some cases the waveform used during machining, the influence of features of the tool (410) further away from the part (400) on the shape of the part (400) is negligible, and therefore negligible in determining the geometry of the tool (410). This provides a direct method for determining the tool geometry based on the features that need to be modified on a particular part (400). This method can be applied to many features on a part or array of parts. The printing tool (410) can be used to finish one part (400) or multiple parts (400) simultaneously, thus providing a method for achieving very fine geometries in a scalable and cost-effective manner. In some embodiments, the part (400) may have multiple features that need to be modified. The tool (410) can be printed with multiple features having geometries complementary to the geometry of multiple features of the part (400), and / or having other suitable geometries, to simultaneously modify all desired features of the part (400). This can be inferred to provide methods for modifying multiple parts (400) with multiple tools (410), modifying a single part (400) with multiple tools (410), and / or modifying multiple parts (400) with a single tool (410). The geometry of the tool (410) can be automatically generated by modeling software after the user has specified which surfaces need to be treated. By simultaneously modifying multiple parts (400), the process can become highly scalable and can be implemented cost-effectively in mass production.

[0280] Additionally and / or alternatively, it may be desirable to produce a porous tool (410) through which an electrolytic fluid can flow to remove waste during the electrochemical machining process. A tool (410) having pores (not shown) that are large enough to allow electrolyte flow and small enough to produce a uniform current density in the relevant region between the tool (410) and the part (400) can be suitable for this type of electrochemical machining process because the pores allow for optimal thermal control of the tool (410) and for guiding electrolyte flow at the working surface of the part (400) to effectively remove any increase in ion concentration during the machining process. In some embodiments, the pores may be less than half the average diameter of the powder particles, and / or may be about an order of magnitude smaller than the average diameter of the powder particles. Additionally and / or alternatively, the diameter of the pores may be at least 50 nanometers (nm). While achieving the highest density may be desirable when sintering printed 3D objects, if porosity is desired in some embodiments, the sintering cycle can be tuned to reduce peak temperatures and soaking times to achieve a controlled porosity level in the final 3D object. The electrochemical machining process described above can be further improved by sintering the component (400) to a maximum density, sintering the tool (410) to a lower density such that the tool (410) has a sufficiently high porosity to allow fluid flow, and allowing an electrolyte to flow through the tool (410) while an electric current is applied to remove material from the component (400). In some embodiments, the porosity can be high, such that the pores have the dimensions described above, and / or the pores are internally connected to form channels and / or networks in the tool (410). In some embodiments, utilizing the dimensions described above, the pores can be small enough that their effect on the geometry of the component (400) during electrochemical machining is negligible. In some embodiments, the pores can be uniformly distributed through the tool (410), such that heat generated during electrochemical machining can be uniformly and efficiently dissipated from the tool (410) via the pores, thereby achieving uniform cooling. Additionally and / or alternatively, an increase in ion concentration near the tool (410) can be uniformly and efficiently eliminated. Conversely, any conventional tool used in electrochemical machining processes, even if made into an opening with certain structures, cannot achieve uniform porosity and therefore cannot achieve an effective electrochemical machining process as described above.

[0281] Turn Figure 30 An exemplary diagram of system (101) is shown as including a building platform (163). In some embodiments, system (101) may include system (100) (e.g., in... Figure 1 (as shown in the diagram). In some embodiments, the build platform (163) may include the build platform (160) (e.g., in...). Figure 1 and Figure 17(As shown in the figure). The system (101) may include a build material unit (500) and a selective processing unit (600). The build material unit (500) is configured to set build material (520) on a build platform (163). An exemplary build material unit (500) may include a deposition module (130) (as shown in the figure). Figure 1 (as shown), and / or any other suitable component associated with the setup of the building material (520). An exemplary building material (520) may include a slurry (201) (as shown). Figure 7 As shown), or powder (or powder material) (310) (as shown) Figure 13 (as shown) and resin (312) (as shown) Figure 13 The blend shown is a blend of (shown).

[0282] A selective processing unit (600) is configured to selectively process a building material (520) such that a portion of the building material (520) can form a three-dimensional object (800). Selective processing may include applying at least one process that modifies only a selected portion of the building material (520) such that one or more properties of the selected portion differ from the properties of the remaining portions of the building material (520). In one embodiment, the selective processing unit (600) may modify the photosensitive material by irradiating the selected portion. In one embodiment, the selective processing unit (600) may modify the photosensitive material by irradiating all areas other than the selected portion. In one embodiment, the selective processing unit (600) may modify the ability of the selected portion to be cured, solidified, sintered, or a combination thereof. In one example, the selective processing unit (600) may modify a selected portion of the building material (520) such that the selected portion can be cured (or sintered), while unmodified portions of the building material (520) cannot be cured (or sintered). During modification, the selected portion can be formed into a three-dimensional object (800) after any other optional and / or suitable post-processing. In another example, a selective processing unit (600) can modify a selected portion of the building material (520) such that the selected portion cannot be cured (or sintered), while the unmodified portion of the building material (520) can be cured (or sintered). After modification, the remaining building material (520) other than the selected portion can be formed into a three-dimensional object (800) after any other optional and / or suitable post-processing. The selective processing unit (600) and / or any other suitable equipment can apply additional processes as needed to achieve or complete curing (and / or sintering).

[0283] In another embodiment, the selective processing unit (600) can modify the material state of a selected portion. For example, the selective processing unit (600) can at least solidify and / or coagulate a selected portion of the building material (520) according to the shape of the three-dimensional object (800). An exemplary selective processing unit (600) may include a projection module (106) (such as...). Figure 1 (As shown).

[0284] Turn Figure 31 An exemplary flowchart of an embodiment of a method (700) for making a three-dimensional object (800) is shown. At (720), building material (520) may be placed on a building platform (163). At (740), the building material (520) may be selectively processed to form the three-dimensional object (800).

[0285] Turn Figure 32 The building material (520) is shown as comprising one or more layers (522). The layers (522) may extend in the x and y directions (perpendicular to the plane of the figure) and be stacked in the z direction. Each layer (522) may be selectively processed. Depending on the selective processing, a portion of each layer (522) may form a layer (820). The layers (820) within the layers (522) may be stacked to form an object (800).

[0286] Go to Figure 33 An exemplary flowchart of an alternative embodiment of method (700) is shown. At (720A), a layer (522) of building material (520) may be set on the building platform (163). This layer (522) may be an initial layer and / or a first layer of building material (520). At (740A), the layer (522) may be selectively processed to form a layer (820) of a three-dimensional object (800). At (760), one or more stacked layers 820 may be repeatedly set and selectively processed. Slightly different, (760) may include repeating the setting and selective processing a selected number of times, each time for subsequent layers (522) stacked on top of the previous layer (522).

[0287] In various embodiments, the building material (520) may include powder (310) (e.g., as shown in the figure). Figure 35A (as shown) and the current-carrying fluid (320) (e.g., as shown) Figure 35A A mixture and / or blend of (as shown). An exemplary flow-carrying fluid (320) may include a resin (312) (such as...) Figure 13 (As shown). The blend can be in the form of a slurry (201) (e.g., as shown). Figure 7 (as shown). In some embodiments, the building material may also include a gas (or gas phase) consisting of bubbles, which may be blended with the fluid and solid components of the building material (520).

[0288] In one embodiment, the layers (522) of the building material (520) can be applied via slot extrusion coating.

[0289] Additionally and / or alternatively, the layers (522) of the building material (520) can be applied via a blade coating. Blade coating (particularly for various open processes that may involve multiple repeated layer applications and treatments) can be advantageous because blade coating has self-leveling characteristics. Slightly different, the surface height produced by a given layer application can be largely unaffected by irregularities in the previous layer.

[0290] Additionally and / or alternatively, layers (522) of the build material (520) may be provided via patch coating. Patch coating may include the use of a slit mold or other similar apparatus, wherein the flow of the build material (520) may be interrupted at selected intervals to deposit material only in specific target areas. For example, the build material (520) may be deposited on an array of sub-regions. Patch coating can limit material waste.

[0291] Additionally and / or alternatively, layers (522) of the build material (520) may be applied via continuous flow coating. In some embodiments, continuous flow coating may include the use of a slit mold or other similar apparatus, wherein the flow of the build material (520) is uninterrupted and the build material (520) may be deposited over the entire working area.

[0292] Go to Figure 34 An exemplary flowchart of an alternative embodiment of method (700) is shown. At (730A), a layer (522) of building material (520) can be densified. The densification at (730A) can be after the setting at (720A) and before the selective processing at (740A). Densification can be achieved using any suitable device, which includes, for example, building material units (500) (such as... Figure 30 (as shown), selective processing unit (600) (as shown) Figure 30 As shown), build platform (163) (as shown) Figure 30(shown) and / or any other device. At (760), setup, densification, and selective processing may be repeated. Slightly different, 760 may include repeating setup, densification, and selective processing a selected number of times, each time for subsequent layers (522) stacked on top of the previous layer (522). Although different terms (e.g., setup, deposition, or coating) are used in various embodiments for illustrative purposes only to describe the process of forming the build material (520) or layer (522), the characteristics of the process of forming the build material (520) or layer (522) are illustrated by the description in each embodiment and are not limited by which of the terms setup, deposition, or coating is used. In some embodiments, setup, deposition, coating, and / or other suitable terms describing the formation of the build material (520) or layer (522) on the effective working surface (167) may be used interchangeably.

[0293] Densification may include increasing the amount of powder (310) (e.g., as Figure 35A The loading density (or loading percentage) in the layer (522) shown. Slightly differently, densifying the build material (520) may include increasing the proportion of powder (310) in the deposited build material (520). In some embodiments, densification may include at least partially removing the carrier fluid (320) from the blend (e.g., as shown). Figure 35A (As shown). In one embodiment, vacuum pressure and / or differential pressure can be transmitted through the porous build platform working surface (162) (as shown). Figures 13-15 (As shown) is applied to layer (522) to remove the carrier fluid (320). Slightly different, a vacuum pressure and / or differential pressure can be generated between the working surface (162) of the build platform and the side of the build platform (163) opposite to the working surface (162) of the build platform.

[0294] Go to Figure 35A and Figure 35B The diagrams show the build material (520) before and after the application of ultrasound. The system (101) may include an ultrasound unit 540. In various embodiments, the ultrasound unit 540 may be integrated and / or coupled to a build platform (163). The ultrasound unit 540 may generate ultrasound waves. The ultrasound unit 540 may have a direct mechanical connection to the build platform (163) via an acoustic transmission medium (not shown), such that ultrasound waves can be transmitted to the build platform (163) to generate ultrasonic agitation of the build platform (163). Exemplary acoustic transmission media may include solids and / or liquids. The ultrasound unit 540 may apply ultrasound waves to the disposed layer (522) and densify the layer (522). The ultrasound waves may break the carrier fluid (320) into droplets and thus accelerate the evaporation of the carrier fluid (320). By using the ultrasound unit 540, the build material (520) can be densified in a simplified manner.

[0295] Additionally and / or alternatively, ultrasound can agitate the powder (310) and thus cause it to settle, allowing it to sink closer to the build platform (163) under gravity and become more compactly packed. This improves the uniformity of the powder (310). By using the ultrasonic unit 540, the powder (310) in the build material (520) can be settled in a novel way. This improves the uniformity of the constructed layer (522). It should be noted that ultrasound is not conventionally used to remove fluid from a slurry to increase its density or to settle powder deposited through the slurry.

[0296] Go to Figure 36A and Figure 36B The diagrams show the build material (520) before and after the application of ultrasound. The powder (310) is deposited via ultrasound, but the carrier fluid (320) is not necessarily significantly reduced. In various embodiments, ultrasound can be applied to deposit the powder (310) regardless of how densified the build material (520). For example, the carrier fluid (320) may not necessarily be removed using ultrasound, but ultrasound can be applied to deposit the powder (310). Advantageously, when the selected carrier fluid (320) is not easily reduced by ultrasound, another method, such as evaporation or suction, can be applied to remove the carrier fluid (320) more quickly.

[0297] Go to Figure 37 The system (101) is shown as including an evaporation unit 560. The evaporation unit 560 can apply heat to the disposed layer (522) and evaporate the carrier fluid (320). The evaporation unit 560 can apply heat via conduction, convection, irradiation, or a combination thereof. Irradiation can include any suitable type of irradiation, including, for example, microwaves, lasers, infrared (IR) and / or any other light irradiation. In various embodiments, the evaporation process can be used only to the extent that most of the fluid is removed from the material layer, but a sufficient amount of fluid remains within the material layer such that the fluid can be selectively processed (740) (e.g., Figure 31 (as shown) during use. At this point, the carrier fluid (320) can be used for selective processing to define additional purposes for the component being constructed.

[0298] In one embodiment, evaporation can be applied to a multi-component system comprising a filler and a skeleton. In this embodiment, the filler material may require less energy to evaporate than the skeleton material, and the skeleton material may remain in the layer (522) after the evaporation process is complete. The skeleton material may be further processed during selective processing (740) to define the component being constructed.

[0299] Turn Figure 38AThe building material (520) is shown as foam. Slightly different, the carrier fluid (320) can define multiple bubbles therein. This can be achieved by adding a suitable bubble generator and / or foaming agent, prior to deposition via the building material unit (500) (e.g., Figure 30 (As shown) Agitating the building material (520) or a combination thereof introduces air bubbles into the building material (520). In one embodiment, the building material (520) may include a slurry (201) (such as...) Figure 7 As shown), air bubbles can be introduced into the slurry (201).

[0300] Go to Figure 38B The diagram illustrates a bubble-free flow-carrying fluid (320). In some embodiments, densification of the build material (520) may include causing at least some bubbles to burst and / or break down. Bursting bubbles can reduce or eliminate the air volume in the build material (520), increase the amount of powder (310) per unit volume of build material (520), and densify the build material (520). In one embodiment, bubbles can be burst by suction. For example, suction can be applied directly and / or via a low pressure or differential pressure applied to the build material (520) through a build platform (163). Slightly different, the low pressure or differential pressure can be established between sides of the build platform (163) respectively near and away from the build material (520). In another embodiment, ultrasonic agitation can be applied to burst the bubbles. In another embodiment, heat can be applied to burst the bubbles. Additionally and / or alternatively, bubbles may burst naturally over a period of time (i.e., without suction). In any of these embodiments, the relative volume of air in the original building material can be high enough that after the powder (310) has precipitated into a dense layer, the collapsed layer has a certain amount of remaining porosity.

[0301] Go to Figure 38C The carrier fluid (320) is shown to be further reduced. Therefore, the number and / or size of voids between the powders (310) wetted by the carrier fluid (320) can be increased, thus increasing the porosity in the building material (520). This reduction in the carrier fluid (320) can be achieved via any suitable densification method as described above (including, but not limited to, bubble bursting). Although Figure 38B and Figure 38C Bubbles are not shown for illustrative purposes only, but even if the total number of bubbles is reduced, bubbles may still be present in the carrier fluid (320) at any densification stage.

[0302] Go to Figure 39AThe system (101) is shown to include a densification fluid deposition unit (510). The densification fluid deposition unit (510) can apply a densification fluid (340) to the build material (520). In various embodiments, the densification fluid (340) can react with the carrier fluid (320) to produce one or more products in a gaseous state. For example, the densification fluid (340) can include an acidic component while the carrier fluid (320) can include a carbonate, or the densification fluid (340) can include a carbonate while the carrier fluid (320) can include an acidic component. In various embodiments, the densification fluid (340) can be uniformly applied to the build material (520). The densification fluid (340) can be applied in any suitable manner. In one embodiment, the densification fluid (340) can be deposited via spraying. Advantageously, the layer (520) can react with the densification fluid (340) at all locations and be densified in a uniform manner. Although Figure 39A The densifying fluid (340) is shown to be separated from the carrier fluid (320) for illustrative purposes only, but the densifying fluid (340) may be miscible with the carrier fluid (320) to react chemically with the carrier fluid (320), but is not limited thereto.

[0303] Go to Figure 39B ,and Figure 39A In comparison, the volumes of the carrier fluid (320) and the densifying fluid (340) are shown to be significantly reduced. Slightly different, when the reaction occurs between the densifying fluid (340) and the carrier fluid (320), the fluid volume in the building material (520) is reduced, the amount of powder (310) per unit volume of building material (520) can be increased, and the building material (520) can be densified.

[0304] Go to Figure 40 An exemplary flowchart of an alternative embodiment of method (700) is shown. At (722), a building material (520) may be disposed on a building platform (163) and may optionally be densified using the methods described herein. The building material (520) may include a photosensitive material. When exposed to electromagnetic irradiation, the photosensitive material may alter its chemical composition and / or properties. At (742), at least a portion of the photosensitive material may be modified via irradiation. In various embodiments, the selective processing unit (600) (e.g. Figure 30 (As shown) can be irradiated with photosensitive materials. In one embodiment, the modified portion can form a three-dimensional object (800) (e.g. Figure 32 At least a portion or layer (820) of (as shown) Figure 32 (As shown). For example, the photosensitive material may include resin (312) (as shown). Figure 13(As shown). The resin (312) can be cured by irradiation with, for example, UV (ultraviolet) light. Thus, a portion of the irradiated resin (312) can solidify and form a layer (820) of a three-dimensional object (800). The building material (520) can be irradiated based on a two-dimensional image of a slice corresponding to a digital model of the three-dimensional object (800).

[0305] Turn Figure 41 A selective processing unit (600) is shown comprising a selective deposition unit (620). The selective deposition unit (620) may be configured to deposit supplementary build material (360) on one or more target regions (524) of the build material (520). Non-target regions (526) are regions of the build material (520) where no supplementary build material (360) is deposited. The properties of the target regions (524) may differ from those of the non-target regions (526). Exemplary properties may include curing capability, sintering capability, or a combination thereof. In various embodiments, the supplementary build material (360) may include a fluid. The selective deposition unit (620) may deposit the supplementary build material (360) in any suitable manner. In one embodiment, the selective deposition unit (620) may deposit the supplementary build material (360) via jetting and / or inkjet printing.

[0306] The building material (520) is shown as powder (310) wetted with a carrier fluid (320). The amount of carrier fluid (320) can be very small, such that the building material (520) can define voids 380 between the particles of the powder (310). In various embodiments, the building material (520) can be densified to reduce the amount of carrier fluid (320) to a suitable extent that the powder (310) can be wetted by the carrier fluid (320), but the voids 380 are defined to accommodate more material (in order to accommodate supplementary building material (360)). In various embodiments, densification can be limited by the tap density of the powder (310). The tap density can be controlled by the particle size distribution and morphology of the powder (310). One goal of the densification process can be to get as close as possible to the tap density.

[0307] The resolution of the SFF can be affected by the precision to which the target region (524) can be defined by the deposition and / or wetting of the supplementary build material (360) on the build material (520). In various embodiments, the droplet size and the reaction kinetics of the binder activation reaction can be designed to optimize resolution and other properties.

[0308] Go to Figure 42AThe system (101) is shown to deposit supplementary build-up material (360) onto powder (310) without a carrier fluid (320). Slightly different, the powder (310) can be dry. The supplementary build-up material (360) is shown to form a matrix on top of the powder (310) because the supplementary build-up material (360) does not readily wet the powder (310). As a result, a certain amount of waiting time is required for the supplementary build-up material (360) to soak into the powder (310). In many SFF processes, small droplets are desirable because large droplets forcefully impact the dry powder layer and cause pits in the powder (310). Small droplets may also be ideal for achieving high resolution. Pitting reduces the resolution of the formed 3D object and adversely affects the powder density within the part and the uniformity of powder packing within the part. However, the effect of surface tension is significant for smaller droplets, thus requiring a long waiting time to wet the powder (310). For at least the reasons mentioned above, conventional adhesive spraying processes are impractical for high-resolution SFFs.

[0309] Go to Figure 42B The system (101) is shown as depositing supplementary building material (360) onto powder (310) mixed with a suitable amount of flow-carrying fluid (320). Slightly different, the powder (310) can be wet. Figure 42A Unlike other materials, the supplementary building material (360) is shown to be rapidly immersed into the voids (380). Slightly different, the carrier fluid (320) promotes the wetting of the supplementary building material (360). As a result, the supplementary building material (360) is immersed into the powder (310) with little or no waiting time. Therefore, the supplementary building material (360) can be deposited as very small droplets without significantly increasing the immersion time. Thus, high resolution of SFF can be achieved in a practical and cost-effective manufacturing process.

[0310] Go to Figure 43 An exemplary flowchart of an alternative embodiment of method (700) is shown. At (724), a build material (520) may be disposed on a build platform (163). The build material may include a powder material (310) and a flow carrier fluid (320), and may optionally be densified using the methods described herein. At (744), supplementary build material (360) may be deposited on one or more target regions (524) of the build material (520). Although as Figure 40The method described in (700) can achieve high-resolution SFF, but the high resolution is achieved via irradiation, and this method is not necessarily compatible with all kinds of build materials (520). For example, when the powder material (310) includes certain active metals (e.g., titanium), the powder material (310) may react with photosensitive (or photocurable) materials, thereby adversely affecting the sintering process. For example, most photocurable materials have a certain oxygen content; during sintering, oxygen can be extracted from the polymer and react with the metal to form oxides, which may damage the final properties of the sintered metal. Conversely, when no suitable photosensitive (or photocurable) material is available for the build material (520), such as Figure 43 The method described in (700) can achieve high-resolution SFF using a variety of adhesive materials.

[0311] Turn Figure 44 The three-dimensional object (800) is shown as being formed based on a target region (524). In some embodiments, a supplementary building material (360) may induce and / or promote a curing reaction and / or a change in state. Examples of supplementary building materials (360) may include azo compounds or organic peroxides that promote thermal free radical polymerization, and / or alkaline aqueous solutions in the case of curing cyanoacrylate adhesives. Any polymerization initiator suitable for use in a given adhesive material in a carrier fluid (320) should be understood to be within the scope of this embodiment. Thus, powder (310) may be incorporated into the target region (524). In one embodiment, powder (310) in the target region (524) may form at least a portion or layer (820) of the three-dimensional object (800). The supplementary building material (360) may be deposited based on a two-dimensional image of a slice corresponding to a digital model of the three-dimensional object (800).

[0312] In one embodiment, the curing reaction may include a photocuring reaction. The photocuring reaction may be induced by irradiation, including, for example, UV light irradiation. For example, the entire layer (522) of the building material (520) may be irradiated in a non-selective manner. In one embodiment, the supplementary building material (360) may include a photocurable resin. The photocurable resin may include a skeleton resin and a photoinitiator. In another embodiment, the supplementary building material (360) may include a skeleton resin, while the current-carrying fluid (320) may include a photoinitiator. In yet another embodiment, the current-carrying fluid (320) may include a skeleton resin, while the supplementary building material (360) may include a photoinitiator. Generally, in this and other embodiments, multiple components may be present, all of which may be necessary to produce or achieve a chemical reaction and / or a change of state, wherein one or more of these components may be included in the current-carrying fluid (320), and the remaining components may be included in the supplementary building material (360).

[0313] In another embodiment, the curing reaction and / or state change may include a thermosetting reaction and / or state change. Thermosetting can be caused by temperature changes (e.g., exposure to heat). For example, an entire layer (522) of the build material (520) may be heated in a non-selective manner. In one embodiment, the supplementary build material (360) may include a thermosetting resin. The thermosetting resin may include a skeleton resin and a thermal initiator. In another example, the supplementary build material (360) may include a skeleton resin, while the flow carrier fluid (320) may include a thermal initiator. In yet another embodiment, the flow carrier fluid (320) may include a skeleton resin, while the supplementary build material (360) may include a thermal initiator.

[0314] In yet another embodiment, the curing reaction may include a passive curing reaction. The passive curing reaction may occur in a suitable environment and complete over a period of time. In one embodiment, the supplementary building material (360) may include a passively curable resin. The passively curable resin may include a skeleton resin and an initiator. In another example, the supplementary building material (360) may include a skeleton resin, while the flow carrier fluid (320) may include an initiator. In yet another embodiment, the supplementary building material (360) may include a skeleton resin, while the supplementary building material (360) may include an initiator. In yet another embodiment, the supplementary building material may include a binder material that is liquid during deposition but becomes solid shortly after deposition. In this embodiment, the flow carrier fluid (320) does not chemically interact with the supplementary building material (360). This can be achieved by using the supplementary building material (360), which is, for example, a wax and / or other polymer that melts within the selective deposition unit (620) and cools during deposition. The flow carrier fluid (320) may be selected to optimize its ability to absorb heat energy from the supplementary building material (360). An exemplary fluid (320) may include one or more components having a high heat capacity. For example, the fluid (320) may include water and / or oil.

[0315] In some embodiments, the supplementary building material (360) may include a binder that does not react with the carrier fluid (320). In one embodiment, the supplementary building material (360) may include a wax (and / or a polymer). The building material (520) may be deposited at a high temperature, allowing the wax to be in a molten state. Upon cooling, the wax may be in a solid state. In one embodiment, the carrier fluid (320) may include a component capable of absorbing heat energy from the wax, thus accelerating the solidification of the wax. Therefore, the wax can bind the powder (310).

[0316] Additionally and / or alternatively, the supplementary building material (360) may include monomers. In one embodiment, the monomer may be solid at room temperature. An exemplary monomer may include norbornene. The building material (520) may be deposited at a high temperature, such that the monomer may be in a molten state. During deposition, the monomer may be polymerized and / or solidified via a polymerization process including, for example, irradiation, chemical treatment, and / or heat treatment. Thus, the polymer may bind the powder (310), and the bond strength may be increased via polymerization. In some embodiments, the resulting polymer may decompose during sintering.

[0317] Additionally and / or alternatively, supplementary build-up material (360) can be deposited within a lattice structure. Before depositing the supplementary build-up material (360), fluid pathways within the part can be available, even when using solid-state curing images, because the densification process can leave an inherently porous structure. However, after depositing the supplementary build-up material (360), any material from the binder powder (310) may impede fluid flow. Therefore, a lattice structure can be used to deposit the supplementary build-up material (360) to allow fluid flow and fluid removal from subsequent layers.

[0318] Turn Figure 45 The three-dimensional object (800) is shown as being formed based on a non-target region (526). In some embodiments, a fluid-carrying fluid (320) (e.g., as shown in the figure) is used to transport the fluid. Figure 35A The material (360) may include a curable material, and the supplementary building material (360) may inhibit the curing reaction and / or state change of the curable material. Non-limiting examples may include using an acrylate or methacrylate resin and a photoinitiator as the carrier fluid (320), and a solution of any known free radical photoinhibitor as the supplementary building material (360), such as bis[2-(o-chlorophenyl)-4,5-diphenylimidazole] or other similar types complementary to the initiator. Thus, the powder (310) may be incorporated into the non-target region (526). In one embodiment, the powder (310) in the non-target region (526) may form at least a portion or layer (820) of the three-dimensional object (800). The supplementary building material (360) may be deposited based on a supplementary image of a two-dimensional image corresponding to a slice of a digital model of the three-dimensional object (800).

[0319] In one embodiment, the curing reaction may include a photocuring reaction. The photocuring reaction can be induced by irradiation, including, for example, UV light irradiation. For example, the entire layer (522) of the building material (520) may be irradiated in a non-selective manner. In one example, the flow carrier (320) may include a photocurable resin. The photocurable resin may include a matrix resin and a photoinitiator.

[0320] In another embodiment, the curing reaction may include a thermosetting reaction and / or a change of state. Thermosetting can be caused by a temperature change (e.g., exposure to heat). For example, the entire layer (522) of the building material (520) may be heated in a non-selective manner. In one example, the flow-carrying fluid (320) may include a thermosetting resin. The thermosetting resin may include a matrix resin and a thermal initiator.

[0321] In yet another embodiment, the curing reaction may include a passive curing reaction and / or a state change. A passive curing reaction may occur in a suitable environment and complete over a period of time. In one example, the carrier fluid (320) may include a passively curable resin. The passively curable resin may include a skeleton resin and an initiator.

[0322] Additionally and / or alternatively, similar to the description above, supplementary building material (360) may be deposited in a lattice structure and / or any other suitable porous structure to allow fluid flow and fluid removal from subsequent layers.

[0323] Go to Figure 46 A fluid deposition unit (620) is shown depositing supplementary building material (360) for one or more target regions (524) of each layer (522), the target regions (524) corresponding to a support surface layer (198). The support surface layer (198) may be located between the component (190) and the support structure (192). The supplementary building material (360) may include a sintering inhibitor (330). An exemplary sintering inhibitor (330) may consist at least in part of a peroxide solution, other oxidants, or other agents that inhibit sintering. The support surface layer (198) may be cured in the same manner as the curing of the component (190) and / or the support structure (192). Therefore, the component (190) and the support structure (192) may be connected by the support surface layer (198) prior to sintering for easy handling. The sintering inhibitor (330) can prevent the sintering of the support surface layer (198), so that the component (190) will not permanently adhere to the support structure (192) and can be easily separated from the support structure (192). An exemplary sintering inhibitor (330) may include hydrogen peroxide.

[0324] Figures 47-53 A detailed diagram of an exemplary system (101) is shown. Figure 49 and Figure 50 This is a cross-sectional view. The material deposition system (130) is shown positioned between two selective deposition units (620) (including selective deposition units (620A) and (620B)). During operation, the material deposition system (130) and the selective deposition unit (620A) can deposit a layer of building material (520) (as shown in the image) on the material deposition system (130). Figure 32Scroll to the right when (as shown). Selective deposition unit (620B) can be used to deposit supplementary building material (360) (as shown). Figure 41 The material deposition system (130) and selective deposition unit (620B) can roll to the left while the material deposition system (130) deposits the next layer of build material (520). The selective deposition unit (620A) can roll to the left while depositing supplementary build material (360). This operation can be repeated until all layers are deposited, with supplementary build material (360) deposited as needed. Advantageously, each pass of the conversion can complete one layer, thus improving the efficiency of the SFF. Figure 54 and Figure 55 Detailed illustrations and cross-sectional views of the material deposition system (130) and selective deposition units (620A) and (620B) are shown respectively. Figure 56 A detailed diagram of the selective deposition unit (620) is shown. The selective deposition unit (620) may include an array of ejector heads (or printheads) (622). Those skilled in the art will recognize that the material deposition system (130) and the selective deposition unit (620) may be moved at intervals and / or by separate motors.

[0325] Return to reference Figure 40 According to method (700), the state of the building material (520) can be modified by irradiation. The embodiment shown in the figure below illustrates an exemplary implementation of irradiation for SFF fabrication for illustrative purposes only. Those skilled in the art will understand that any other suitable type of imaging and / or irradiation system can be implemented using the system (101) illustrated in the above figures. Exemplary types of such imaging systems may include commercial digital micromirror device (DMD) imaging systems, liquid crystal display (LCD) masks, and / or the like. Irradiation may include optical illumination (and / or irradiation) of any suitable wavelength, visible or invisible, electron beam irradiation, ion beam irradiation, neutron beam irradiation, X-ray irradiation, and / or other forms of irradiation that can form an image, and the irradiation suitably modifies the irradiated material. Thus, although illumination in the various embodiments is used for illustrative purposes only to provide electromagnetic waves (or energy), any irradiation of a suitable wavelength can be used to provide electromagnetic energy without limitation. Figure 57An exemplary imaging unit (640) may be configured to translate over an imaging surface (521) along a direction (648) (or scanning direction) while irradiating a selected area on the imaging surface (521) with electromagnetic energy. For illustrative purposes only, the x-direction may be parallel to the scanning direction (648), and the y-direction may be a cross-scanning direction. In various embodiments, the scanning direction and the cross-scanning direction may be in any other suitable orientation relative to the x-direction and the y-direction. The direction (648) may include two opposite directions and / or a single direction. In various embodiments, the direction (648) may be parallel to the imaging surface (521) or the working surface (162) of the build platform. In some embodiments, the direction (648) may be parallel to the build material unit (500) (e.g., Figure 30 The translation direction shown. In some embodiments, the imaging unit (640) may be a selective processing unit (600) (as shown). Figure 30 At least a portion of the imaging surface (521) shown. The imaging surface (521) may include any substrate and / or material to be irradiated by the imaging unit (640). In some embodiments, the imaging surface (521) may include an effective working surface (167), a building material (520) (such as... Figure 30 The imaging unit (640) may be located in the top region of the building material (520), or a large portion of the top surface of the building material (520) (e.g., at a depth of 3-50 micrometers), or on the working surface of the building platform (162). However, the imaging unit (640) may be implemented in any other system not limited to the system (101).

[0326] The imaging unit (640) can be moved relative to the imaging surface (521) in any suitable manner. In one embodiment, the imaging unit (640) may be located within a housing (not shown) fixed relative to the imaging surface (521), and the imaging unit (640) may roll relative to the housing. In another embodiment, the imaging unit (640) may be fixed relative to the housing, and the housing may roll relative to the imaging surface (521). In another embodiment, the imaging unit (640) may be movable relative to the imaging surface (521). In another embodiment, the imaging surface (521) may be movable relative to the imaging unit (640).

[0327] Go to Figure 58A schematic diagram of an imaging unit (640) viewed relative to the z-direction is shown. The imaging unit (640) is shown as comprising a plurality of illumination source groups (646) (shown as 646A-646D). The illumination source groups (646) are shown distributed along the x-direction. In some embodiments, the illumination source groups (646) may be aligned along the x-direction. Each illumination source group (646) is shown as comprising an array (642) of illumination sources, the array of illumination sources including, for example, illumination sources (642A)-(642E). In the example shown, the alphabetical order of A, E, and E may indicate the order of approach to the imaging surface (521). Slightly different, in the selected illumination source group (646), illumination source (642A) may first approach a given position in the x-direction of the imaging surface (521), and illumination source (642E) may last approach the given position in the x-direction of the imaging surface (521). The array (642) of illumination sources may be aligned along the imaging surface (521) (e.g., Figure 57 The array (662) that produces the image at the location shown (partially as shown) Figure 59 (As shown). The array of illumination sources (642) can directly correspond to the array of images (662). Slightly different, at a given moment during the operation of the imaging unit (640), each illumination source (642) illuminating the imaging surface (521) can generate an image (662) separately.

[0328] In some embodiments, the shape, size, and / or dimensions of the array of illumination sources (642) and the array of images (662) may be identical. Optionally, the imaging unit (640) may include projection optics (645) in the illumination path (e.g., Figure 66 As shown, (e.g., including optical lenses and / or mirrors), to reduce and / or increase the distance between the generated images and / or the generated images. For example, the projection optics (645) can change the linear size of the image (662) corresponding to the illumination source (642), such that the ratio between the linear size of the illumination source (642) and the corresponding image (662) can be greater than or less than 1. Therefore, although Figure 58 An illumination source (642) of selected size, spacing, and shape is shown for illustrative purposes only, but the imaging unit (640) may use any other suitable arrangement and / or size of the illumination source (642) and projection optics (645) to produce an image as shown. Figure 59 The array of images (662).

[0329] Each group of lighting sources (646) is shown as comprising a plurality of subsets (641) of lighting sources distributed along the y-direction. In some embodiments, the plurality of subsets (641) of lighting sources may be aligned along the y-direction. For example, a designated lighting source (642) in a selected subset (641) of a group of lighting sources (646) (e.g., lighting source (642A) or lighting source (642B) in a selected subset (641) etc.) may be positioned along a line parallel to the y-direction.

[0330] Each subset of illumination sources (641) includes multiple illumination sources (642). For example, illumination sources (642A)-(642E) may form one of the subsets of illumination sources (641). Each subset of illumination sources (641) is configured to generate an image (662) capable of illuminating at least the entire pixel region (664) via translation of the imaging unit (640) (e.g., as shown in the image). Figure 60 (As shown). In some embodiments, the number of illumination source subsets (641) in the illumination source group (646) may be greater than or equal to the number of pixel regions (664) spanning the width of the target area (not shown) illuminated by the imaging unit (640), which is measured perpendicular to the direction (648). Therefore, the target area can be fully imaged via a single scroll of the imaging unit (640). In other embodiments, the number of illumination source subsets (641) in the illumination source group (646) may be less than the number of pixel regions (664) spanning the width of the target area, thus allowing for complete imaging of the target area via multiple scrolls of the imaging unit (640). In some embodiments, the illumination source group (646) may be aligned along the x-direction such that a selected illumination source subset (641) from each illumination source group (646) can be positioned along the x-direction. For example, a designated lighting source (642) from a selected subset (641) of each lighting source group (646) (e.g., lighting source (642A) or lighting source (642B) from the selected subset (641) of the lighting source group (646) can be positioned along a line parallel to the x-direction.

[0331] In various embodiments, the imaging unit (640) may include a micro-light-emitting diode (micro-LED) chip or array, wherein each illumination source (642) includes a micro-LED. Additionally and / or alternatively, the imaging unit (640) may include a digital micromirror device (DMD) chip configured to reflect illumination from an incident light source. Additionally and / or alternatively, the imaging unit (640) may include a combination of a light source and a liquid crystal display (LCD) mask. The LCD mask may include an array of LCD lenses (or LCD apertures), wherein each illumination source (642) includes an LCD lens with transparency that can be turned on and off via an electronic control signal.

[0332] In some embodiments, micro-LEDs may be a preferred configuration because when the size of the light source (642) is smaller than the spacing between adjacent light sources (642), the micro-LEDs can limit illumination (and / or illumination) only within the desired area of ​​each light source (642). In contrast, both DMD and LCD configurations provide illumination to the area between the light sources (642), which wastes some light energy and unnecessarily overheats the DMD chip or LCD mask.

[0333] The projection optics (645) may include any suitable optics that alter the size, shape, and / or position of the incident beam from the illumination source (642) via any mechanism including, for example, reflection, refraction, astigmatism, and / or aberrations. In some embodiments, for any selected type of illumination source (642), the imaging unit (640) may include an array of microlenses, each microlens corresponding to a microLED, and may direct illumination from the microLEDs to the imaging surface (521) or other optical devices, and then to the imaging surface (521), while focusing (and / or defocusing) the illumination to obtain the size of the image (662).

[0334] Go to Figure 59 For clarity and illustration purposes, a magnified view is shown of the group of lighting sources (646) (as shown in the image). Figure 58 As shown, this is a portion of the image group (666) generated by the illumination source group (646A), (646B), respectively. In the example shown, the image groups (666A) and (666B) are generated by the illumination source group (646A) and (646B), respectively. Figure 58 The image group (666) is generated as shown. The image group (666) is shown as distributed and aligned along the x-direction. The image group (666) formed by all the illumination source groups (646) can constitute a complete image (660) (partially shown) after repeated exposure of the illumination source group (642) and the imaging surface (521) and relative movement in the x-direction between the illumination source group (642) and the imaging surface (521).

[0335] The image group (666) may include an array (642) of illumination sources (e.g. Figure 58 An array (662) of images generated by illumination sources (642A)-(642E) (as shown). In this example, images (662A)-(662E) are generated by illumination sources (642A)-(642E) respectively. Figure 58 The array (662) of images is shown as comprising multiple rows (668) parallel to the y-direction. Within a given row (668), the center-to-center distance D between two adjacent images (662) is shown as greater than the width W of the image (662). Each of the multiple rows (668) can be offset from the adjacent row (668) by an offset distance S greater than zero and not greater than the width W of each image (662). Therefore, when the illumination source (642) is translated along the x-direction, it is impossible for an unlit gap to exist between two images (662) with an offset therebetween (e.g., such as between images (662C) and (662D)).

[0336] The number of rows (668) can be chosen such that rows (668) are sufficient to be linearly translated across pixel regions (664) (e.g., in...). Figure 60 (As shown in the figure) to at least completely image the pixel region (664). Slightly different, the number of rows (668) in the image group (666) can be equal to the number of illumination sources (642) in the subset of illumination sources (641) (as shown in the figure). Figure 58 (As shown). This number can be based on the size of the image (662), the pixel region (664), and / or the offset distance S, all in the y-direction. In the example shown, the width W and offset distance S of each image (662) are 1 / 5 of the width of the pixel region (664). Therefore, the image group (666) can include at least 5 rows (668).

[0337] In one embodiment, the spacing between adjacent rows (668) can be equal to the size of the pixel region (664) in the x-direction. However, this distance can be any suitable value that is greater than or less than the size of the pixel region (664) in the x-direction. The spacing between adjacent rows (668) in the x-direction can be shorter to reduce the amount of movement required to complete the image and can reduce the size of the imaging unit (640). A larger spacing between adjacent rows (668) can increase the size of the imaging unit (640) and reduce the average heat load per unit area on the microLED chip, but can increase the amount of movement required to complete the image. The spacing can be optimized for a specific application. Subpixel-length shifting in the x-direction can be achieved by selecting the timing of turning the illumination source (642) on and off. In some embodiments, exposure does not have to be at discrete locations. The illumination source (642) can be turned on and off as the chip moves continuously, similar to in a laser grating system.

[0338] Go to Figure 60 This shows the effect of translational motion on a subset of the illumination source (641) (as shown in the example). Figure 58 An exemplary pixel region (664) illuminated by an illumination source (642A)-(642E) (as shown). The pixel region (664) may include multiple columns of images (662), each column of images being illuminated by an illumination source (642A)-(642E) (as shown). Figure 58 Illumination (as shown). By turning the illumination sources (642A)-(642E) on and off during translation, the image resolution within the pixel region (664) can be based on the offset distance S of the image (662).

[0339] As above Figures 58-60 The imaging unit (640) described herein is superior to other exposure and / or illumination systems for at least the following reasons: A subset of illumination sources (641) is configured to illuminate the entire pixel region (664). Even if one of the illumination sources (642A)-(642E) malfunctions (cannot emit light or cannot be turned off), the corresponding illumination source (642) in the other illumination source group (646) can be shifted over the pixel region (664) to provide some degree of compensation for the malfunctioning illumination source. Figure 58 The example shown includes four groups of illumination sources (646), thus the imaging surface (521) Figure 57 A selected point on the image (640) can be illuminated by four illumination sources (642). If one illumination source fails to emit light, the remaining three sources will have already illuminated the pixel area to 3 / 4 of the desired intensity when full illumination (and / or illumination) is desired. If the illumination sources cannot be turned off, the illumination will be 1 / 4 of the full value when no illumination of the pixel area is desired. The number of redundant illumination source groups (646) can be chosen large enough that the impact of a faulty pixel is minimized to the point of having no substantial detrimental effect on the exposure of the material. This redundancy can be crucial for ensuring high yields in small-scale SFFs, where an illumination failure at one location can result in defective products. Furthermore, even new illumination sources (642) for the imaging unit (640) (e.g., microLEDs mounted on microLED chips) may have a certain failure rate due to limitations in microelectronics manufacturing technology, and this failure rate increases with use. The combination of illumination source groups (646) can tolerate the failure rate and thus reduce the cost of the illumination sources (642) by allowing the use of imperfect sources and extend the lifespan of the imaging unit (640).

[0340] Although the imaging unit (640) is shown for illustrative purposes only for SFF, the imaging unit (640) can be used in any suitable application that uses optical imaging. Exemplary applications may include plastic printing systems (e.g., stereolithography), printed circuit board (PCB) lithography and / or any other system that produces polymer parts using photocurable materials, or any other manufacturing process that uses irradiation-sensitive materials that require selective exposure to desired geometries.

[0341] Furthermore, by exposing small-sized images (662), the imaging unit (640) can achieve high resolution. Because at a given moment, only one or some of all images (662) are formed for each pixel region (664) at any given time, the effective number of pixels in the control / drive system can be reduced compared to the case where all images (662) of each pixel region (664) are exposed simultaneously. Slightly different, by utilizing the given capabilities of the control / drive system, a larger number of pixel regions (664) can be exposed, thus increasing the exposure area and potentially increasing the productivity of the SFF. Even if the exposure does not require the rolling imaging unit (640), for example, as... Figure 64 and Figure 65 The example shown can also achieve this advantage in the imaging unit (640).

[0342] Turn Figure 61 Another exemplary imaging unit (640) is shown. Figure 58 and Figure 61 The imaging unit (640) is similar, except that the size of the illumination source (642) is different. Figure 61 It is larger in the middle.

[0343] Go to Figure 62 For clarity and illustration purposes, a magnified view is shown of the group of lighting sources (646)( Figure 61 (shown) is part of the image group (666) generated. Figure 59 and Figure 62 The image group (666) is similar, except that the size of image (662) is in the same range. Figure 62 The offset distance S is shown as a linear dimension (or width in the y-direction) smaller than that of the image (662). In the example shown, the width W of each image (662) is the pixel region (664) (as shown in the figure). Figure 63 The offset distance S is 2 / 5 of the width of the pixel region (664), and the offset distance S is 1 / 5 of the width of the pixel region (664). Therefore, the image group (666) can include 5 rows (668) to expose 5 exposure positions within the pixel region (664).

[0344] Go to Figure 63This shows the effect of translational motion on a subset of the illumination source (641) (as shown in the example). Figure 61 An exemplary pixel region (664) illuminated by an illumination source (642A)-(642E) (as shown). The pixel region (664) may include multiple columns of images (662), each column of images being illuminated by an illumination source (642A)-(642E) (as shown). Figure 62 Illumination (as shown). By turning the illumination sources (642A)-(642E) on and off during translation, the image resolution within the pixel region (664) can be at least partially based on the offset distance S (as shown). Figure 62 (As shown).

[0345] Therefore, the imaging unit (640) (as shown) Figure 61 As shown, a finer resolution than the linear size of the image (662) can be achieved by introducing an offset distance S smaller than the width W of the image (662). However, the resulting final image may have an optical exposure intensity gradient at the edges because the size of each image (662) is larger than the offset distance S (which can be the smallest spacing achieved). While the sharpness of the final image may be reduced, such an imaging unit (640) can provide the advantage of increased light power output (and thus increased exposure efficiency). In various embodiments, the light power output can be increased because Figures 61-63 The area of ​​each image (662) and / or illumination source (642) can be greater than Figures 58-60 The area of ​​each image (662) and / or lighting source (642). Slightly different, Figures 61-63 A larger image (662) can be used, and a higher resolution can be achieved by utilizing the offset distance S. This increases the optical power output while reducing image sharpness. Therefore, depending on the specific application, the size of the image (662) can be chosen to achieve a trade-off between optical power output and image sharpness.

[0346] Figure 64 A complete image (660) generated by an alternative imaging unit (not shown) is shown, comprising an array (662) of images. The images (662) can be formed within corresponding pixel regions (664), and the complete image (660) can be formed by shifting the image (662) within the pixel regions (664) along both the x and y directions. The size of the image (662) is smaller than the size of the pixel regions (664). Therefore, the resolution of the illumination can be based on the size of the image (662). The shifting of the image (662) within the pixel regions (664) can be achieved by using projection optics (645) in the illumination path (e.g., ...). Figure 66As shown, the projection optics include, for example, one or more rotatable refractive lenses. Additionally and / or alternatively, image shifting can be achieved by mounting a micro-LED array on a 2-axis motion stage (not depicted) to move the chip and produce a proportional shift in the projected image.

[0347] Figure 65 A complete image (660) produced by another alternative imaging unit (not shown) is shown. Figure 64 and Figure 65 The described imaging units are similar, the difference being that the size of the image (662) is... Figure 65 China and Belgium in Figure 64 The image (662) can be formed within the corresponding pixel region (664), and the complete image (660) can be formed by shifting the image (662) within the pixel region (664) by a distance smaller than the width or length of the image (662) in both the x and y directions. Therefore, the resolution of the illumination can be based on the distance the image (662) is shifted. Similarly, for the reasons stated above, with... Figure 64 compared to, Figure 65 The obtained image (660) can increase the optical power output while reducing the image sharpness.

[0348] Figure 64 and Figure 65 The described imaging unit achieves the advantages of high resolution and a larger exposure area. However, Figure 64 and Figure 65 Without Figure 58 and Figure 61 The same motion control described in [the text] achieves the advantage of redundancy. To achieve redundancy, [it is used in] diagonal pixel systems (such as... Figure 58 and Figure 61 Compared to (as shown), the imaging unit may require more motion and a greater range of motion across more axes. The imaging unit can use a 2-axis motion system instead of a single-axis system, thus requiring a larger, more expensive, and potentially more complex control.

[0349] Turning Figure 66 An exemplary embodiment of an imaging unit (640) is shown. The imaging unit (640) is shown as including a chip (643) and a projection optics (645), both of which are static relative to each other. The chip (643) may include an illumination source (642) coupled thereon in an array as described above. The exemplary chip (643) may include a microLED chip. The chip (643) and the projection optics (645) may be simultaneously translated along a direction (648) on a printed area as shown on the imaging surface (521). The projection optics (645), shown as a single lens, may include multiple optical elements and may include a microlens array.

[0350] Turning Figure 67 An alternative exemplary embodiment of the imaging unit (640) is shown. The chip (643) may be movable relative to the imaging surface (521), but other components of the imaging unit (640) (e.g., projection optics (645)) may be static relative to the imaging surface (521). The chip (643) can translate the image by translating it back and forth within the imaging unit (640). For example, the housing of the imaging unit (640) may be static, and the chip (643) may be movable within the housing.

[0351] Go to Figure 68 An array of imaging units (640) is shown. Each imaging unit (640) can be similar to... Figure 67 The example shown. An array of imaging units (640) can cover an arbitrarily large imaging area. In many embodiments, the image size can be larger than the footprint of a single imaging unit (640). Advantageously, large imaging areas can be exposed efficiently.

[0352] Go to Figure 69 Another alternative exemplary embodiment of the imaging unit (640) is shown. The chip (643) may be static relative to the imaging surface (521). The imaging unit (640) may include at least one refractive element (647) that may rotate (or tilt) within the imaging unit (640). The refractive element (647) may provide a refractive window that translates the image via rotation. Advantageously, the imaging unit (640) can achieve high-precision image shifting with relatively simple and low-precision mechanical control. The refractive element (647) is shown as being located between the chip (643) and the projection optics (645). However, the refractive element (647) may be located at any suitable location between the chip (643) and the imaging surface (521). For example, the refractive element (647) may be located between the projection optics (645) and the imaging surface (521).

[0353] Go to Figure 70 An array of imaging units (640) is shown. Each imaging unit (640) can be similar to... Figure 69 The example shown. An array of imaging units (640) can cover an arbitrarily large imaging area. In many embodiments, the image size can be larger than the footprint of a single imaging unit (640). Advantageously, large imaging areas can be exposed efficiently.

[0354] Turning Figure 71An exemplary component (400) is shown. Component (400) is shown as a needle comprising an elongated body (420). The needle may include any type of needle for insertion into the skin or tissue of a living organism (e.g., an animal or a human). The elongated body (420) may include a tip region (440), a hub region (460), and an axial region (480) located between the tip region (440) and the hub region (460). The tip region (440) is shown as sharp and has a cross-sectional area smaller than that of the axial region (480) for insertion into the skin. The hub region (460) may be used to attach to a syringe barrel (and / or any other suitable device, not shown). The syringe barrel may supply substance (not shown) to and / or withdraw substance from the living organism via the needle. The axial region (480) may form the shaft of the needle to create a distance from the tip region (440) and the hub region (460).

[0355] The tip region (440), hub region (460), and / or shaft region (480) may be porous. Slightly differently, the tip region (440), hub region (460), and / or shaft region (480) may define multiple orifices (430). Conventionally, the needle has a solid outer wall and defines a single straight lumen enclosed by the solid wall and extending through the entire length of the needle. Conversely, when the tip region (440) (or hub region (460), or shaft region (480)) defines multiple orifices (430), the tip region (440) (or hub region (460), or shaft region (480)) does not necessarily define a lumen extending through the tip region (440). The orifices (430) may accommodate and / or receive material delivered through the needle without requiring a lumen.

[0356] In various embodiments, the pores (430) can be digitally introduced. Slightly different, the digital model of the needle can be defined by porosity, and thus the component (400) made according to the digital model can have porosity. Additionally and / or alternatively, the pores (430) can be defined by adjusting the sintering cycle of the component (400) (via incomplete sintering). As described above, the sintering cycle can be adjusted to reduce peak temperature and immersion time to achieve a controlled porosity level in the final component (400). Additionally and / or alternatively, at least some of the pores (430) can be filled by any suitable method, including, for example, electroplating. Thus, one or more selected portions of the needle can be solid or non-porous. In one embodiment, electroplating of only some of the pores (430) can be achieved by partially immersing the component (400) in an electroplating solution.

[0357] In various embodiments, the pore (430) may have a diameter not exceeding 50 micrometers. At 50 micrometers, the pore (430) does not impose significant flow restriction on most fluids. At smaller sizes (e.g., less than 10 micrometers), the pore (430) can provide the benefit of filtering out cellular media. Preferably, the diameter may have a lower limit of 100 nanometers, because even the flow rate of low-viscosity fluids can be significantly limited at this pore size.

[0358] The shaft portion (480) may have a circular cross-section with a diameter ranging from 10 micrometers to 300 micrometers. The tip portion (440) may have a length ranging from 10 micrometers to 250 micrometers, and the tip or tip edge radius may not exceed 10 micrometers, preferably not exceeding 5 micrometers. The needle may have a non-circular shape, in which case the maximum or minimum cross-sectional dimensions can be understood to be within the constraints of the diameter of the circular cross-section needle described above. In various embodiments, the needle may be particularly used for microneedle applications in drug or vaccine delivery.

[0359] Go to Figure 72 The tip region (440), hub region (460), and shaft region (480) shown each define a hole (430) therein. In one embodiment, the needle does not define a lumen that extends through the entire needle. Without a lumen, the needle can be mechanically stronger. Therefore, the needle can be sufficiently strong even with an increased aspect ratio (length to diameter). Advantageously, the needle can be sharper and thinner, and thus can penetrate deeper into the skin, and is suitable for a wider variety of medical procedures.

[0360] At least some of the holes (430) at the tip region (440), hub region (460), and shaft region (480) are shown as communicating. Slightly different, one or more channels (401) may be formed between the holes (430) so that material (not shown) can be transported between the tip region (440) and hub region (460) via the channels (401). The holes (430) in the shaft region (480) are shown as including holes (430A) as part of the channels (401).

[0361] In some embodiments, it may be desirable to isolate the material from the outside of the shaft region (480). Therefore, the hole (430) at the shaft region (480) may include one or more holes (430B) that do not open to the outside of the shaft region (480). Additionally and / or alternatively, the hole (430) at the shaft region (480) may include one or more holes (430C) that open to the outside of the shaft region (480) but do not communicate with any channel (401).

[0362] Although the shaft section (480) is shown as defining an aperture (430) for illustrative purposes only, the shaft section (480) may define any other structure for receiving material, and is not limited thereto. In one embodiment, the shaft section (480) may define an aperture (430) to form a channel (401) with the aperture (430) at the tip section (440) and / or the hub section (460). In another embodiment, the shaft section (480) may define one or more lumens therein.

[0363] Go to Figure 73 The shaft region (480) and hub region (460) are shown as defining a lumen (470) communicating with at least some of the holes (430) at the tip region (440). The lumen (470) can pass through the shaft region (480) and hub region (460) to form a complete flow path from the holes (430) to the hub region (460). Therefore, the tip region (440) does not define a lumen through which it passes. Without a lumen, the tip region (440) can be mechanically more robust. Thus, the tip region (440) can be sufficiently robust even with an increased aspect ratio (length to diameter). Advantageously, the tip region (440) can be sharper and thinner, and therefore can penetrate deeper into the skin and be suitable for a wider variety of medical procedures. Since the cross-section of the needle is typically smallest at the tip region (440), eliminating the need for at least a portion of the lumen in the tip region (440) provides a significant improvement, even though the shaft region (480) and hub region (460) still define the lumen (470).

[0364] Although both the shaft region (480) and the hub region (460) are shown for illustrative purposes only as defining a lumen (470), the lumen (470) may be defined within at least a portion of the shaft region (480), at least a portion of the hub region (460), and / or a portion of the tip region (440), and is not limited thereto. Although both the shaft region (480) and the hub region (460) are shown for illustrative purposes only as defining a lumen (470), one or more uniform and / or different lumens (470) may be defined in the needle without limitation.

[0365] like Figure 73 The needle shown can be made by any suitable method. In various embodiments, the holes (430) can be digitally introduced. Additionally and / or alternatively, the holes (430) can be defined via a sintering cycle (via incomplete sintering) of the regulating member (400). At least some of the holes (430) can be filled by any suitable method, including, for example, electroplating. For example, the walls surrounding the lumen (470) can be made solid or non-porous via electroplating.

[0366] Turning Figure 74Another exemplary component (400) is shown. Component (400) is shown as a needle entering a blood vessel (450) encapsulating blood. The blood comprises one or more solid components (452) suspended in a liquid component (454). In various embodiments, the solid component (452) may include blood cells and / or platelets. The liquid component (454) may include plasma. The tip region (440), hub region (460), and / or shaft region (480) may be formed with suitable structures to filter blood such that only the liquid component (454) is discharged at the hub region (460). For various medical diagnostic purposes, only sampling of the liquid component (454) is required, and the liquid component (454) has a longer shelf life than the solid component (452). Advantageously, the disclosed needle can sample the liquid component (454) in a simplified manner, extending the shelf life of blood samples and thus simplifying medical laboratory procedures.

[0367] In various embodiments, the shaft portion (480) may have a circular cross-section with a diameter ranging from 10 micrometers to 300 micrometers. With a diameter less than 300 micrometers, the shaft portion (480) can be smaller than a standard measuring needle and approach a painless size. A diameter less than 10 micrometers is not particularly useful even as a solid needle, because if the diameter is less than 10 micrometers, it is more difficult to make the needle long enough to penetrate the stratum corneum.

[0368] The tip region (440) can have a length ranging from 10 micrometers to 250 micrometers, and the tip radius is no greater than 10 micrometers. The needle can have a non-circular cross-sectional shape, in which case the maximum or minimum cross-sectional size can be in the range of 10 micrometers to 300 micrometers.

[0369] Go to Figure 75 The tip region (440) is shown as defining a plurality of orifices (430) leading to blood in the blood vessel (450). Each orifice (430) may have a size smaller than the size of a blood cell, such that blood cells do not enter the orifice (430). Thus, the orifice (430) can be used as a filter. The orifice (430) may communicate with a suitable outlet at the hub region (460) via any suitable channel, hole, lumen and / or the like, but is not limited thereto. In various embodiments, the orifice (430) may have a diameter of no more than 5 micrometers to serve as a filter.

[0370] Although the orifice (430) at the tip region (440) is shown for illustrative purposes only as filtering blood, any part of the needle (e.g., the shaft region (480) and / or the hub region (460)) can be configured to filter blood, and is not limited thereto. The disclosed needle can filter any other suitable substance from the body, but is not limited thereto. Additionally and / or alternatively, the disclosed needle can filter substances injected into the body from a syringe. In this case, the substance can flow from the hub region (460) to the tip region (440). Thus, large or solid contents can be removed, while smaller or liquid contents can enter the body.

[0371] Go to Figure 76 The tip region (440) is shown defining an aperture (430) therein. One or more of the apertures (430) may be oriented in a lateral direction (490). The lateral direction (490) may include any direction perpendicular to the insertion direction (492). The insertion direction (492) may be the direction in which the needle is inserted into the body during operation. The insertion direction (492) is shown parallel to the axial region (480). Conventional needles have apertures that are open in a direction at least partially aligned with the insertion path of the needle. Therefore, cellular tissue and / or celluloid may block the apertures, and thus fluid cannot pass through the needle. Advantageously, as Figure 76 The needle shown can be defined in a closed hole (430) in the insertion path, thus preventing blockage. In some embodiments, the hole (430) can communicate with a central lumen (not shown) in the tip region (440) via a channel (401). In some embodiments, the channel (401) can extend to the surface of the tip region (440) to form an opening instead of forming a hole (430).

[0372] In various embodiments, the orifice (430) may have a diameter not greater than 50 micrometers. In one embodiment, the orifice (430) may have a diameter not greater than 5 micrometers for use as a filter. The needle may be shorter than 3 millimeters. The shaft section (480) may have a circular cross-section with a diameter ranging from 10 to 300 micrometers and an internal orifice or lumen (a central channel below the axis of the shaft section (480)) less than 100 micrometers. An internal orifice less than 100 micrometers allows the overall needle size to easily allow fluid to pass through while remaining painless. The tip section (440) may have a length ranging from 10 to 250 micrometers and a tip radius not greater than 10 micrometers. The needle may have a non-circular shape, in which case the maximum or minimum cross-sectional size can be understood as being within the constraints of the diameter of the circular cross-section needle described above.

[0373] The hole (430) in the tip region (440) is shown as including a hole (430A) as part of a channel (401), which may extend into any channel and / or lumen in the shaft region (480). Therefore, the hole (430) at the tip region (440) may include one or more holes (430D) that do not open to the outside of the tip region (440). In various embodiments, the shaft region (480) and / or the hub region (460) may have, as Figures 71-75 The appropriate structure is shown.

[0374] Although three lateral directions 490 are shown for illustrative purposes only, the lateral directions 490 can be included in any direction in the plane perpendicular to the insertion direction 492, and are not limited thereto.

[0375] although Figures 71-76 The hub region (460) and shaft region (480) are shown for illustrative purposes only, but the hub region (460) and / or shaft region (480) may be optional. For example, the needle may include a hypodermal injection needle for deeper subcutaneous access and may require the hub region (460) and / or shaft region (480). In another example, the needle may include a microneedle having only a tip region (440). In yet another example, the microneedle may taper seamlessly between regions such as the shaft region and the tip region without clear dividing lines between the regions.

[0376] Go to Figure 77 An object (800) is shown comprising a microneedle array. The microneedle array is shown comprising a substrate (462) and a plurality of needles coupled to the substrate (462), wherein a tip region (440) points distal to the substrate (462). The substrate (462) may define a reservoir (not shown) therein, which may communicate with any orifice and / or lumen of the needles. The reservoir may be used to contain fluid drawn from the body by the needles and / or fluid supplied to the needles. The needles may be as follows: Figures 71-76 Any of the components shown.

[0377] Figures 71-77 The component 400 shown can be used with method (700) (e.g.) Figure 31 , Figure 33 , Figure 34 , Figure 40 and Figure 43 (as shown) and / or system (101) (as shown) Figure 30The component 400 is manufactured using conventional methods or systems without the method (700) or system (101). Even if any of the components 400 could be manufactured using some conventional method or system, the cost and production time of the components 400 would be too high for mass production. The method (700) and / or system (101) can advantageously enable the mass production of components 400 at low cost and high efficiency.

[0378] Turning Figure 78 The control system (900) for SFF is shown. The control system (900) can be configured for the control system (101) (as shown). Figure 30 (As shown). The control system (900) may include a processor (910). The processor (910) may include one or more microprocessors (e.g., single-core or multi-core processors), application-specific integrated circuits, application-specific instruction set processors, graphics processing units, physical processing units, digital signal processing units, coprocessors, network processing units, encryption processing units, etc.

[0379] The processor (910) can perform actions to implement the control system (900) and / or the object (800) (such as... Figure 30 Instructions for a computerized model (shown). In a non-limiting example, the instructions include one or more SFF software programs. Exemplary SFF software programs may include G-code to control the system (101). These programs can operate to control the system (101) having various printing options, settings, and techniques for implementing increased printing.

[0380] These programs may include CAD and / or CAM programs to generate 3D computer models of the object (800). Additionally and / or alternatively, the 3D computer model may be imported from any other conventional CAD and / or CAM program and / or from another computer system. The 3D computer model may be in industry-standard solid, surface, or mesh file formats. These programs may include CAM slicing software to “slice” the 3D computer model of the object (800) into layers (820) (e.g., ...). Figure 32 (as shown), and calculate the tool path used to define each layer (820).

[0381] The program can generate machine code (e.g., including G-code) for controlling the system (101) to print the object (800). For example, the program can control a material deposition system (130) for depositing materials (e.g., ...). Figure 1 (as shown) and air scrapers (140, 150) (as shown) Figure 1 As shown), via camera (104) (as shown) Figure 1The monitoring includes the curing process, pump motor, construction platform movement, deposition module movement, densification process imaged by a camera (104), electrochemical processing process, construction material unit (500), selective processing unit (600), and / or imaging unit (640).

[0382] like Figure 78 As shown, the control system (900) may include one or more additional hardware components as needed. Exemplary additional hardware components include, but are not limited to, memory (920) (or, herein, a non-transitory computer-readable medium). Exemplary memory (920) may include, for example, random access memory (RAM), static RAM, dynamic RAM, read-only memory (ROM), programmable ROM, erasable programmable ROM, electrically erasable programmable ROM, flash memory, security digital (SD) card, and / or the like. Instructions for implementing a computerized model of the control system (900) and / or object (800) may be stored on memory (920) for execution by processor (910).

[0383] Additionally and / or alternatively, the control system (900) may include a communication module (930). The communication module (930) may include any conventional hardware and software operable to exchange data and / or instructions between the control system (900) and another computer system (not shown) using any wired and / or wireless communication method. For example, the control system (900) may receive computer-designed data corresponding to an object (800) via the communication module (930). Exemplary communication methods include, for example, radio, Wi-Fi, cellular, satellite, broadcasting, or combinations thereof.

[0384] Additionally and / or alternatively, the control system (900) may include a display device (940). The display device (940) may include any device that operates to present programming instructions for operating the control system (900), displays a 3D computer model of an object (800), and / or presents data relating to components of the system (100) and / or system (101). Additionally and / or alternatively, the control system (900) may include one or more input / output devices (950) (e.g., buttons, keyboards, keypads, trackballs) as needed.

[0385] The processor (910), memory (920), communication module (930), display device (940) and / or input / output device (950) may be configured to communicate, for example, using hardware connectors and buses and / or wirelessly.

[0386] This document discloses embodiments of apparatus and associated methods for solid freeform manufacturing of parts (e.g., plastic, metal, and ceramic parts) for various applications.

[0387] In some embodiments, the SFF method and apparatus disclosed herein may include a surface of a layer for receiving a material for producing a three-dimensional solid representation of a digital model, one or more components for depositing a layer of desired build material, and one or more components for imaging the build material into a cross-section representing data contained in the digital model. In one embodiment, the build material consists of particulate material and photocurable resin material. The materials may be blended prior to the build process, and the density of the blend may be changed during the build process to optimize the properties of the printed part.

[0388] Furthermore, in some embodiments, the methods and apparatus described below may utilize particulate materials (e.g., ceramics, plastics, or metals) as one of the building materials. Components produced by this apparatus may be processed after the building process to promote bonding between adjacent particles. Such processing includes, but is not limited to, heat treatment, chemical treatment, and pressure treatment, as well as combinations of these treatments. The results of this manufacturing and processing process include, but are not limited to, solid metal components, solid ceramic components, porous metal components, porous ceramic components, porous plastic components, solid composite plastic components, and composite components comprising one or more types of materials.

[0389] Methods for producing layers of slurry blends of powders and binders may include depositing the material via a pumping system. Such a deposition system may include features that reduce shear stress applied to the preceding layer during deposition. Additionally and / or alternatively, the deposition system may include features that increase the system's ability to self-correct any deviations in layer flatness. Additionally and / or alternatively, the density of the deposited layer may be modified by removing a portion of the binder volume from the slurry. Additionally and / or alternatively, the slurry material may be continuously conditioned to provide a high degree of uniformity in the slurry material and the parts produced therefrom.

[0390] Layer imaging can be achieved through several means, including but not limited to bulk imaging using programmable light sources (such as digital light processing (DLP) projectors or laser imaging systems).

[0391] In one aspect, a solid freeform manufacturing apparatus is provided, which enables the production of objects using photocurable resin materials based on digital data representing a given three-dimensional object.

[0392] On the other hand, an SFF device is provided that can produce a composite material consisting of particulate material and photocurable resin material.

[0393] On the other hand, an SFF device is provided that utilizes bulk deposition technology to produce layers of material.

[0394] On the other hand, an SFF apparatus is provided that processes a blend of particulate material and photocurable resin material to produce a composite layer of material.

[0395] On the other hand, objects produced by the SFF device can be subjected to heat treatment, chemical treatment, or mechanical treatment to improve the internal adhesion of material components.

[0396] On the other hand, blended raw materials that can be altered during the build process can be used to increase the particle loading density in the printed parts.

[0397] On the other hand, the feedback system can be used to verify or control the increase in particle loading density of the deposited blend, optionally by reading one or more brightness values ​​from a camera monitoring the process.

[0398] On the other hand, a method is provided for determining a favorable geometry for a tool that can be used to sinter or finish a printed part, which in turn can be produced by the same process used to produce the printed part.

[0399] The various embodiments described above include the use of terms such as "photopolymer resin," "photosensitive material," "photocurable material," "irradiation-sensitive material," "irradiation-curable material," and / or any other similar or related terms. These terms may be used for the same purpose in those embodiments and may refer to a substance that can be modified, undergo a physical state transition, undergo a phase transition, and / or undergo a chemical reaction in response to irradiation, so that the desired partial modification of the material can be made in the manner described in those embodiments. In various embodiments, irradiation may include irradiation of energy emitted and / or transmitted in the form of rays, waves (e.g., electromagnetic waves), and / or particles.

[0400] The direction shown in the diagram can be any physical direction relative to gravity. For example, Figure 30 The system can be oriented so that the effective working surface is parallel to a local surface of the Earth, or it can be at other angles, such as a 30-degree inclination to the local surface of the Earth. Any use of directional terms such as “up,” “down,” “above,” “below,” “above,” and “below” is understood to apply to systems in which the effective working surface is parallel to the local surface of the Earth, and these orientations should be modified accordingly if the system is at other angles.

[0401] Although specific combinations of systems have been described herein, any combination of the foregoing subsystems can achieve similar purposes. Any system providing slurry deposition, slurry densification, and irradiation according to any of the foregoing methods or systems can be understood as an embodiment of the disclosed subject matter.

[0402] This subject matter may be embodied in other forms without departing from its spirit and essential characteristics. Therefore, the described embodiments are to be considered illustrative rather than limiting in all respects. Although this subject matter has been described according to certain preferred embodiments, other embodiments that will be apparent to those skilled in the art are also within the scope of this subject matter.

Claims

1. A method for creating a three-dimensional object, comprising: Layers of building materials are deposited on a building platform, the building materials comprising blends of powdered materials and fluid-carrying materials; The layers of the building material are densified; The layers of the building material are selectively processed; as well as The deposition, densification, and selective processing are repeated on one or more layers of the building material stacked on the layers to form a three-dimensional object, wherein the selective processing includes depositing supplementary building material on at least one target region of the building material, and wherein: - The supplementary building material comprises a skeleton resin, and the carrier fluid comprises a polymerization initiator for initiating polymerization of the skeleton resin; or - The carrier fluid includes a skeleton resin, and the supplementary building material includes a polymerization initiator for initiating the polymerization of the skeleton resin.

2. The method according to claim 1, wherein, The deposition includes depositing the building material via slotted extrusion coating.

3. The method according to claim 1, wherein, The densification includes densifying the building material such that the building material remains substantially wetted after densification.

4. The method according to claim 3, wherein, The densification includes densifying the building material such that the building material defines a plurality of voids in the building material, and the powder material remains wetted after densification.

5. The method according to claim 3 or claim 4, wherein, The supplementary building material is adapted to enable curing, solidification, or a combination thereof for bonding the powder material to the target area.

6. The method according to claim 5, wherein, The target region is generated based on two-dimensional slices of the digital model of the three-dimensional object.

7. The method according to claim 5 or claim 6, wherein, The supplementary building material is adapted to enable a photocuring reaction for bonding the powder material to the target area.

8. The method according to claim 7, wherein, The selective treatment includes irradiating the building material in a non-selective manner.

9. The method according to any one of claims 7-8, wherein, The supplementary building material and the flow carrier fluid together provide a photocurable resin comprising the skeleton resin and the polymerization initiator, wherein the polymerization initiator includes a photoinitiator.

10. The method according to any one of claims 5-9, wherein, The supplementary building material is adapted to enable a thermosetting reaction for bonding the powder material to the target area.

11. The method according to claim 10, wherein, The selective processing includes heating the building material in a non-selective manner.

12. The method according to any one of claims 10-11, wherein, The supplementary building material and the flow-carrying fluid together provide a thermosetting resin comprising the skeleton resin and the polymerization initiator, wherein the polymerization initiator includes a thermal initiator.

13. The method according to any one of claims 5-12, wherein, The supplementary building material is adapted to enable a passive curing reaction for bonding the powder material to the target area.

14. The method according to claim 13, wherein, The supplementary building material and the flow carrier fluid together provide a passively curable resin comprising the skeleton resin and the polymerization initiator.

15. The method according to any one of claims 5-14, wherein, The supplementary building material includes a wax that melts during deposition and solidifies upon cooling, at least via thermal absorption through the carrier fluid.

16. The method according to any one of claims 5-15, wherein, The supplemental building material comprises monomers that melt during deposition and are cured at deposition via photocuring, thermal curing, passive curing, or a combination thereof.

17. The method according to any one of claims 1-4, wherein, The supplementary building material is adapted to inhibit the curing reaction, and the carrier fluid includes a curable material.

18. The method according to claim 17, wherein, The target region is generated based on a complementary image of a two-dimensional slice of the digital model of the three-dimensional object.

19. The method according to claim 17 or claim 18, wherein, The supplementary building material is adapted to suppress the photocuring reaction, and the carrier fluid includes a photocurable material.

20. The method according to claim 19, wherein, The selective treatment includes irradiating the building material in a non-selective manner.

21. The method according to any one of claims 1-20, wherein, The supplementary building material includes a sintering inhibitor, and the method further includes sintering the powder material after the selective treatment.

22. The method according to claim 21, wherein, The target area is generated from two-dimensional slices of a digital model of the support surface layer located between the three-dimensional object and the support structure.

23. The method according to any one of claims 3-22, wherein, The deposition includes depositing the building material via slotted extrusion coating.

24. The method according to any one of claims 1-23, wherein, The deposition includes depositing the building material via a scraper coating.

25. The method according to any one of claims 1-24, wherein, The deposition includes depositing the building material via patch coating.

26. The method according to any one of claims 1-25, wherein, The densification includes increasing the loading density of the powder material in the building material.

27. The method according to any one of claims 1-26, wherein, The densification includes removing at least a portion of the flow-carrying fluid from the building material.

28. The method according to claim 27, wherein, The removal includes aspirating at least a portion of the fluid-carrying material from the building material via the building platform.

29. The method according to claim 27 or claim 28, wherein, The removal includes removing at least a portion of the fluid-carrying material from the building material by applying ultrasonic waves to the building platform.

30. The method according to any one of claims 27-29, wherein, The removal includes thermally evaporating at least a portion of the carrier fluid from the building material.

31. The method according to any one of claims 27-30, wherein, The fluid-carrying material includes a filler material and a skeleton material, wherein the removal includes removing only at least a portion of the filler material.

32. The method according to claim 31, wherein, Removal includes removing at least a portion of the filler material via evaporation.

33. The method according to any one of claims 1-32, further comprising depositing the powder material by applying ultrasonic waves to the construction platform prior to the selective processing.

34. The method according to any one of claims 1-33, wherein, The building material includes foam in which multiple air bubbles are defined.

35. The method according to claim 34, wherein, The densification includes breaking at least some of the bubbles in the foam.

36. The method according to claim 35, wherein, The rupture involves applying suction to the building material via the building platform.

37. The method according to claim 35 or claim 36, wherein, The fracturing involves applying ultrasonic agitation to the building material.

38. The method according to any one of claims 35-37, wherein, The cracking involves applying heat to the building material.

39. The method according to any one of claims 1-38, wherein, The densification includes applying a densifying fluid to the building material, the densifying fluid reacting with the carrier fluid to produce gaseous products and reduce the fluid volume in the building material.

40. The method according to any one of claims 1-39, wherein, The carrier fluid includes a photopolymer resin, and the selective treatment includes curing at least a portion of the building material at least partially via irradiation.

41. The method according to claim 40, wherein, The at least partial curing involves irradiating the building material with two-dimensional slices based on a digital model of the three-dimensional object.

42. A system for producing a three-dimensional object, comprising means for performing the method according to any one of claims 1-41.

43. An apparatus for projecting an image onto an imaging surface at high resolution, comprising: An array of illumination source groups aligned in the scanning direction. Each illumination source group comprises an array of subsets of illumination sources aligned in the cross-scan direction. Each subset of lighting sources includes multiple lighting sources. The illumination sources within each subset of illumination sources are distributed in the scanning direction and shifted by an offset distance in the cross-scanning direction, the offset distance being greater than zero and not greater than the width of each illumination source in the cross-scanning direction; as well as A projection optics element is located between the array of illumination sources and the imaging surface and is configured to project illumination from the array of illumination sources onto the imaging surface. The imaging surface defines an array of pixel regions thereon, each pixel region comprising an array of images, each image being imaged by at least one of the illumination sources. The illumination is translated in the scanning direction such that the array of illumination sources images the pixel region, wherein each pixel region is fully imaged by at least one of the subsets of illumination sources.

44. The device according to claim 43, wherein, The number of pixel regions in the cross-scanning direction is no greater than the number of the subsets of illumination sources in each illumination source group.

45. The device according to claim 43 or claim 44, wherein, The offset distance is equal to the width of each illumination source in the cross-scan direction.

46. ​​The device according to any one of claims 43-44, wherein, The offset distance is less than the width of each illumination source in the cross-scan direction.

47. The device according to claim 45, wherein, The offset distance is less than the width of each illumination source in the cross-scan direction.

48. The device according to any one of claims 43-44 and 47, wherein, The array of lighting sources is integrated on a micro LED chip, and each lighting source includes a micro LED.

49. The device according to claim 45, wherein, The array of lighting sources is integrated on a micro LED chip, and each lighting source includes a micro LED.

50. The device according to claim 46, wherein, The array of lighting sources is integrated on a micro LED chip, and each lighting source includes a micro LED.

51. The device according to claim 48, wherein, The micro LED chip and the projection optics are simultaneously translated relative to the imaging surface in the scanning direction.

52. The device according to claim 49, wherein, The micro LED chip and the projection optics are simultaneously translated relative to the imaging surface in the scanning direction.

53. The device according to claim 50, wherein, The micro LED chip and the projection optics are simultaneously translated relative to the imaging surface in the scanning direction.

54. The device according to claim 48, wherein, The micro LED chip is translated relative to the imaging surface in the scanning direction, and the projection optics are static relative to the imaging surface.

55. The device according to any one of claims 49-53, wherein, The micro LED chip is translated relative to the imaging surface in the scanning direction, and the projection optics are static relative to the imaging surface.

56. The device of claim 48, further comprising at least one refractive element configured to rotate about an axis parallel to the cross-scanning direction and located between the imaging surface and the micro-LED chip, the refractive element being configured to translate illumination from the micro-LED chip in the scanning direction.

57. The device of claim 55, further comprising at least one refractive element configured to rotate about an axis parallel to the cross-scanning direction and located between the imaging surface and the micro-LED chip, the refractive element being configured to translate illumination from the micro-LED chip in the scanning direction.

58. The device according to any one of claims 49-54, further comprising at least one refractive element configured to rotate about an axis parallel to the cross-scanning direction and located between the imaging surface and the micro-LED chip, the refractive element being configured to translate illumination from the micro-LED chip in the scanning direction.

59. The device according to any one of claims 43-44, 47, 49-54, and 56-57, wherein, The selected subset of illumination sources includes faulty illumination sources, and the region of the imaging surface corresponding to the faulty illumination source is imaged by non-faulty illumination sources from another subset of illumination sources aligned with the selected subset of illumination sources in the scanning direction.

60. The device according to claim 45, wherein, The selected subset of illumination sources includes faulty illumination sources, and the region of the imaging surface corresponding to the faulty illumination source is imaged by non-faulty illumination sources from another subset of illumination sources aligned with the selected subset of illumination sources in the scanning direction.

61. The device according to claim 46, wherein, The selected subset of illumination sources includes faulty illumination sources, and the region of the imaging surface corresponding to the faulty illumination source is imaged by non-faulty illumination sources from another subset of illumination sources aligned with the selected subset of illumination sources in the scanning direction.

62. The device according to claim 48, wherein, The selected subset of illumination sources includes faulty illumination sources, and the region of the imaging surface corresponding to the faulty illumination source is imaged by non-faulty illumination sources from another subset of illumination sources aligned with the selected subset of illumination sources in the scanning direction.

63. The device according to claim 55, wherein, The selected subset of illumination sources includes faulty illumination sources, and the region of the imaging surface corresponding to the faulty illumination source is imaged by non-faulty illumination sources from another subset of illumination sources aligned with the selected subset of illumination sources in the scanning direction.

64. The device according to claim 58, wherein, The selected subset of illumination sources includes faulty illumination sources, and the region of the imaging surface corresponding to the faulty illumination source is imaged by non-faulty illumination sources from another subset of illumination sources aligned with the selected subset of illumination sources in the scanning direction.

65. A system for creating three-dimensional objects, comprising: Construct material units, which are used to deposit one or more layers of photocurable material; as well as The device according to any one of claims 43-64 is used to solidify each of the layers based on slices of a digital model of a three-dimensional object.

66. A method for curing a photocurable material, comprising: The photocurable material is irradiated with an array of illumination sources aligned in the scanning direction. Each illumination source group comprises an array of subsets of illumination sources aligned in the cross-scan direction. Each subset of lighting sources includes multiple lighting sources. The illumination sources within each subset of illumination sources are distributed in the scanning direction and shifted by an offset distance in the cross-scanning direction, the offset distance being greater than zero and not greater than the width of each illumination source in the cross-scanning direction; and The photocurable material defines an array of pixel regions thereon, each pixel region comprising an array of images, each image being imaged by at least one of the illumination sources; as well as The illumination from the array of illumination sources is shifted in the scanning direction, such that the array of illumination sources images the pixel region, wherein each pixel region is fully imaged by at least one of the subsets of illumination sources.

Images