一种通用化弹载综合电子系统
The modularly designed general-purpose missile-borne integrated electronic system solves the problems of large size, heavy weight, and low integration in existing technologies, realizing the miniaturization and integration of equipment and improving the reliability and maintainability of the system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI AEROSPACE CONTROL TECH INST
- Filing Date
- 2023-03-01
- Publication Date
- 2026-07-17
AI Technical Summary
Existing missile-borne integrated electronic systems are large in size, heavy in weight, and have low integration. Furthermore, the electrical connections and data exchanges between individual units consume a large amount of cable network resources, making it difficult to meet the miniaturization, modularization, and integration requirements of tactical weapons.
The modular, universal airborne integrated electronic system includes a main control module, an intelligent information processing module, a satellite guidance anti-jamming module, a power supply module, an electronic control module, a high-precision inertial measurement module, a bus backplane module, and an I/O interface module. Interconnection between modules is achieved through the SRIO bus and the VITA 74 standard bus, and electrical connections are simplified by using a cableless network and mixed-type electrical connectors.
It has enabled the miniaturization, modularization, and integration of equipment, improved the reliability and maintainability of the system, reduced the scale of equipment, lowered the size and weight of equipment, and improved the serialization, modularization, and generalization of models and equipment.
Smart Images
Figure CN116381751B_ABST