temperature controller

Abstract

The inventive concept provides a temperature controller for performing a comparison measurement process and a sensing calibration process for temperature sensors that control temperature in a semiconductor manufacturing facility without separating the temperature sensors from input channels when performing the comparison measurement process and the sensing calibration process.

Description

[0001] Cross-reference of related applications

[0002] This application claims priority and benefit to Korean patent applications filed on December 30, 2021, with application number 10-2021-0192299, and filed on August 31, 2022, with application number 10-2022-0109706, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiment of the inventive concept described in this article relates to a temperature controller. Background Technology

[0004] Temperature controllers are installed and operated in semiconductor manufacturing facilities to monitor temperature in order to provide constant temperature and humidity or to meet the temperature conditions in the manufacturing process.

[0005] To examine the connection configuration of the input section of a known temperature controller, the sensor input connector is electrically connected to the temperature controller, while the temperature sensor is electrically connected to the sensor input connector.

[0006] In this scenario, the known temperature controller connects the temperature sensor to the measuring device to check if the temperature sensor outputs a normal temperature value, and then performs a comparison measurement to measure the temperature sensor's measured value.

[0007] In addition, since the output value of a temperature sensor is known to change slightly over a long period of use due to various factors, a sensing calibration process is performed to use a calibrator to correct for these changes.

[0008] However, in order to perform comparative measurements or sensing calibration on the temperature sensor, the electrical connection between the temperature sensor installed in the semiconductor manufacturing facility and the sensor input connector at the input channel must be disconnected.

[0009] Therefore, it is known that comparative measurement and sensing calibration processes require linking the electrical connection between the temperature sensor and the sensor input connector to the semiconductor manufacturing facility, which may lead to the need to shut down the semiconductor manufacturing facility.

[0010] In detail, after comparative measurement and sensing calibration, the electrical connection between the temperature sensor and the sensor input connector at the input end must be reconnected. At this time, depending on the type of temperature sensor, wiring errors may occur, and unexpected operational errors may also occur, such as touching or disconnecting other wires during the process of connecting the tight electrical connection of the temperature sensor, or electrical contact errors due to the influence of other components.

[0011] Existing technical documents Patent documents Korean Patent Publication No. 10-200-0135259 (published on December 2, 2020). Summary of the Invention

[0012] An embodiment of the present invention provides a temperature controller for performing a comparative measurement process and a sensing calibration process (sensor calibration process) of a temperature sensor used to control the temperature of a semiconductor manufacturing facility without separating the temperature sensor from the input channel.

[0013] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0014] The present invention provides a temperature controller. The temperature controller includes a temperature sensor unit installed within a semiconductor manufacturing facility and configured to detect a temperature value; a signal control unit configured to be electrically connected to the temperature sensor unit and input the temperature value; and a measuring device for inputting the temperature value when electrically connected to the temperature sensor unit for measurement, wherein when an internal switch is turned on, the signal control unit electrically connects the temperature sensor unit and the measuring device and sends the temperature value detected by the temperature sensor unit to the measuring device.

[0015] In one embodiment, the temperature sensor unit is a thermocouple temperature sensor.

[0016] In one embodiment, the temperature controller further includes: a converter unit configured to be electrically connected to a signal control unit and to perform digital conversion of temperature values; and a temperature control unit configured to be electrically connected to the converter unit and to generate control drive regarding the temperature within the semiconductor manufacturing facility by inputting digitally converted temperature values.

[0017] In the implementation, the temperature controller further includes an input connector that provides an electrical connection area between the temperature sensor unit and the signal control unit.

[0018] In one embodiment, the input connector includes: an input-side connector body that is integrated with the periphery of the semiconductor manufacturing facility; and an input-side coupling terminal unit that is screwed into the input-side connector body to electrically and mechanically connect the output of the signal control unit to the temperature sensor unit.

[0019] In the implementation, the temperature controller further includes a branch connector that provides an electrical connection area between the signal control unit and the measuring device.

[0020] In one embodiment, the branch connector includes: a branch-side connector body, which is integrated with the periphery of the semiconductor manufacturing facility; and a branch input-side coupling terminal unit, which is screwed into the branch-side connector body to electrically and mechanically connect the input terminals of the measuring device and the signal control unit.

[0021] In the implementation scheme, the temperature control unit is electrically connected to the heating equipment used in the converter unit and the semiconductor manufacturing facility. It receives a temperature value measured by the temperature sensor unit from the converter unit and controls the temperature of the heating equipment so that the measured temperature value follows the set temperature value.

[0022] The present invention provides a temperature controller. The temperature controller includes a temperature sensor unit installed in a semiconductor manufacturing facility and configured to detect a temperature value; a signal control unit configured to be electrically connected to the temperature sensor unit and input the temperature value; and a measuring device for inputting the temperature value for measurement when electrically connected to the temperature sensor unit, wherein the signal control unit turns on an internal switch connected to the measuring device and turns off an internal switch connected to the temperature control unit.

[0023] In the implementation scheme, the temperature sensor unit is a resistance temperature detector (RTD) temperature sensor.

[0024] In one embodiment, the temperature controller further includes: a converter unit configured to be electrically connected to a signal control unit and to perform digital conversion of temperature values; and a temperature control unit configured to be electrically connected to the converter unit and to generate control drive regarding the temperature within the semiconductor manufacturing facility by inputting the digitally converted temperature values.

[0025] In the implementation, the temperature controller further includes an input connector that provides an electrical connection area between the temperature sensor unit and the signal control unit.

[0026] In the implementation, the temperature controller further includes a branch connector that provides an electrical connection area between the signal control unit and the measuring device.

[0027] In the implementation, the temperature controller further includes a signal operating unit configured to be electrically connected to the signal control unit and to selectively hold an internal switch of the signal control unit in an ON or OFF state by sending an input switch command to the signal control unit.

[0028] In the implementation scheme, the signal control unit is configured as an analog multiplexer.

[0029] In the implementation scheme, when the measuring device is connected, the signal control unit turns off the switch connected to the temperature sensor unit in the internal switch, so that the temperature value of the temperature sensor unit is not sent to the converter unit.

[0030] In one embodiment, the temperature controller further includes a buffer unit configured to be electrically connected between the converter unit and the temperature control unit to store the temperature value output from the converter unit and continuously send the stored temperature value to the temperature control unit.

[0031] In one embodiment, the temperature controller further includes a sensor power supply unit configured to be electrically connected to part of an internal switch of the signal control unit to supply power to the temperature sensor unit.

[0032] In the implementation scheme, the temperature control unit is electrically connected to the heating equipment used in the converter unit and the semiconductor manufacturing facility, receives the temperature value measured by the temperature sensor unit from the converter unit, and controls the temperature of the heating equipment so that the measured temperature value follows the set temperature value.

[0033] This invention provides a temperature controller. The temperature controller includes a temperature sensor unit installed within a semiconductor manufacturing facility to detect temperature values, and configured as a thermocouple temperature sensor or a resistance thermometer temperature sensor; a signal control unit configured to be electrically connected to the temperature sensor unit and input a temperature value; and a measuring device for inputting a temperature value for measurement when electrically connected to the temperature sensor unit. If the temperature sensor unit is configured as a thermocouple temperature sensor, the signal control unit electrically connects the temperature sensor unit and the measuring device when an internal switch is on, to transmit the temperature value detected by the temperature sensor unit to the measuring device. If the temperature sensor unit is configured as a resistance thermometer temperature sensor, the signal control unit connects the internal switch connected to the measuring device when the internal switch of the internal switch connected to the temperature control unit is off.

[0034] According to an embodiment of the present invention, when performing a comparative measurement process and a sensing calibration process for temperature control of a semiconductor manufacturing facility, the comparative measurement process and the sensing calibration process can be performed without separating the temperature sensor from the input channel.

[0035] The effects of this invention are not limited to those described above, and other effects not mentioned will become apparent to those skilled in the art from the following description. Attached Figure Description

[0036] The foregoing and other objects and features will become apparent from the following description with reference to the accompanying figures, wherein, unless otherwise specified, similar reference numerals throughout the figures refer to similar parts.

[0037] Figure 1 This is a plan view of a semiconductor manufacturing facility using a temperature controller according to an embodiment of the present invention.

[0038] Figure 2 This is a block diagram of a temperature controller according to an embodiment of the present invention.

[0039] Figure 3 yes Figure 2 A detailed view of the coupling status of the input connector shown.

[0040] Figure 4 yes Figure 2 A detailed view of the coupling state of the branch connector shown.

[0041] Figure 5 This is a block diagram showing the state of the temperature value of the temperature sensor unit detected by the measuring device when the temperature sensor unit is configured as a thermocouple temperature sensor.

[0042] Figure 6 This is a block diagram showing the state of the temperature sensor unit being sent to the measuring device by the control signal control unit when the temperature sensor unit is configured as a temperature resistance temperature sensor.

[0043] Figure 7 yes Figure 6 The block diagram shows the state in which the measuring device is removed and the signal control unit is controlled so that the temperature value of the temperature sensor unit is sent to the temperature control unit.

[0044] [Symbol Explanation] 1: Semiconductor manufacturing facility; 10: Temperature sensor unit; 20: Input connector; 21: Input-side connector body; 21a: First contact terminal; 22: Input-side coupling terminal unit; 22a: Input-side coupling bolt; 22b: Input-side contact terminal; 30: Branch connector; 31: Branch-side connector body; 31a: Second contact terminal; 32: Branch-side coupling terminal; 32a: Branch-side coupling bolt; 32b: Branch-side contact terminal; 40: Signal control unit; 50: Signal operation unit; 60: Sensor power supply unit; 70: Converter unit; 80: Buffer unit; 90: Measuring device; 91: Temperature control unit; 100: Temperature controller Detailed Implementation The present invention can be modified and taken in various forms, and specific embodiments thereof will be illustrated and described in detail in the drawings. However, embodiments of the present invention are not intended to limit the specific forms disclosed, and it should be understood that the present invention includes all variations, equivalents, and substitutions encompassed within the spirit and technical scope of the present invention. In the description of the present invention, descriptions of relevant known technologies may be omitted where such detailed descriptions may obscure the essence of the present invention.

[0045] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly specifies otherwise. It will be further understood that, when used in this specification, the terms "comprises" and / or "comprising" designate the presence of the stated features, integers, steps, operations, components, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, components, and / or groups. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Furthermore, the term "exemplary" is intended to refer to an embodiment or illustration.

[0046] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various components, parts, areas, layers, and / or portions, these components, parts, areas, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one component, part, area, layer, or portion from another. Therefore, without departing from the teachings of the inventive concept, the first component, part, area, layer, or portion discussed below may be referred to as the second component, part, area, layer, or portion.

[0047] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0048] Figure 1 This is a plan view of a substrate processing apparatus in a semiconductor manufacturing facility using a temperature controller, according to an embodiment of the present invention. Figure 2 This is a block diagram of a temperature controller according to an embodiment of the present invention. Figure 3 It is a diagram. Figure 2 A detailed view of the coupling status of the input connector shown. Figure 4 It is a diagram. Figure 2 A detailed view of the coupling state of the branch connector shown.

[0049] like Figures 1 to 4As shown, the temperature controller 100 according to an embodiment of the present invention includes a temperature sensor unit 10, an input connector 20, a branch connector 30, a signal control unit 40, a signal operation unit 50, a sensor power supply unit 60, a converter unit 70, a buffer unit 80, a measuring device 90, and a temperature control unit 91.

[0050] The temperature sensor unit 10 consists of a thermocouple TC temperature sensor or a resistance thermometer RTD temperature sensor. Figure 2 The diagram illustrates both the case where the temperature sensor unit 10 is configured as a thermocouple temperature sensor and the case where it is configured as a resistance thermometer. The temperature sensor unit 10 is installed in the semiconductor manufacturing facility 1 to detect the temperature within the facility. In this case, if the temperature sensor unit 10 is configured as a thermocouple temperature sensor, the temperature value is measured via two output terminals for a + voltage terminal and a - voltage terminal. Alternatively, if the temperature sensor unit 10 consists of a resistance temperature sensor, the temperature value is measured via three output terminals for a + current terminal, a - current terminal, and a ground terminal (common terminal).

[0051] The input connector 20 electrically connects the temperature sensor unit 10 and the signal control unit 40.

[0052] In this invention, the input connector 20 includes an input-side connector body 21 and an input-side coupling terminal unit 22.

[0053] The input-side connector body 21 is coupled to the semiconductor manufacturing facility 1 or a peripheral facility. Furthermore, the input-side connector body 21 further has a first contact terminal 21a for multitasking connection to an external body, and in this case, the first contact terminal 21a for multitasking connection is electrically connected to the signal control unit 40.

[0054] The input-side connector body 21 is coupled near the container of the semiconductor manufacturing facility 1 to prevent flow by external forces, thereby ensuring coupling safety.

[0055] The input-side coupling unit 22 includes an input-side coupling bolt 22a and an input-side contact terminal 22b. The input-side coupling bolt 22a is threadedly coupled to the input-side connector body 21. The input-side contact terminal 22b is electrically connected to the output terminal of the signal control unit 40 and the temperature sensor unit 10. More specifically, when the input-side coupling bolt 22a is tightened to contact the output terminal of the temperature sensor unit 10, the input-side coupling unit 22 is pressurized, thereby pressurizing the output terminal of the temperature sensor unit 10 to the multi-tasking connection first contact terminal 21a to maintain electrical connection while combining. Therefore, the output terminal of the temperature sensor unit 10 is strongly coupled through the input-side coupling unit 22, making the electrical coupling difficult to release by external force. Furthermore, when installing or replacing the temperature sensor unit 10, the electrical coupling between the output terminal of the temperature sensor unit 10 and the temperature controller 100 can be easily released by loosening the input-side coupling bolt 22a and the input-side connector body 21.

[0056] Branch connector 30 electrically connects signal control unit 40 and measuring device 90.

[0057] In this invention, the branch connector 30 includes a branch-side connector body 31 and a branch-side coupling end 32.

[0058] The branch-side connector body 31 is coupled to the semiconductor manufacturing facility 1 or a peripheral facility. Furthermore, the branch-side connector body 31 further has a second contact terminal 31a for multitasking connections to the outside of the main body, and in this case, the second contact terminal 31a for multitasking connections is electrically connected to the signal control unit 40.

[0059] The branch-side connector body 31 is coupled near the container of the semiconductor manufacturing facility 1 to prevent flow by external forces, thereby ensuring coupling safety.

[0060] The branch-side coupling terminal 32 includes a branch-side coupling bolt 32a and a branch-side contact terminal 32b. The branch-side coupling bolt 32a is threadedly coupled to the branch-side connector body 31. The branch-side contact terminal 32b is electrically connected to the input terminal of the measuring device 90 and the signal control unit 40. More specifically, when the branch-side coupling bolt 32a is tightened to contact the input terminal of the measuring device 90, the branch-side coupling terminal 32 is pressurized to subsequently pressurize the multi-tasking connection first contact terminal 21a to combine while maintaining the electrical connection. Therefore, when measuring the temperature sensor unit 10, the input terminal of the measuring device 90 is strongly coupled through the branch-side coupling terminal 32, making the electrical coupling difficult to release by external force. Furthermore, when the temperature sensor unit 10 is not being measured, the electrical coupling between the input terminal of the measuring device 90 and the temperature controller 100 can be easily released by unscrewing the branch-side coupling bolt 32a and the branch-side connector body 31.

[0061] The signal control unit 40 is electrically connected to the input connector 20, receives temperature values ​​from the temperature sensor unit 10, and sends the received temperature values ​​to the converter unit 70.

[0062] In this embodiment, the signal control unit 40 is configured as an analog multiplexer. Therefore, in all cases where the temperature sensor unit 10 is configured as a thermocouple temperature sensor or a resistance thermometer temperature sensor, the temperature value input from the temperature sensor unit 10 can be sent to the converter unit 70. Furthermore, the signal control unit 40, which consists of the analog multiplexer, is electrically connected to the signal operation unit 50. In this case, if the signal operation unit 50 is connected to the measuring device 90 used to measure the temperature sensor unit 10, the signal operation unit receives a switch command according to the switch command value and selectively turns on and off each of the internal switches of the analog multiplexer. In this case, if it remains on, the internal switch of the analog multiplexer electrically connected to the temperature sensor unit 10 allows the temperature value detected by the temperature sensor unit 10 to be sent to the converter unit 70. Conversely, if it remains off, the internal switch of the analog multiplexer electrically connected to the temperature sensor unit 10 does not send the temperature value detected by the temperature sensor unit 10 to the converter unit 70.

[0063] The signal operation unit 50 is electrically connected to the signal control unit 40. As described above, the signal operation unit 50 selectively switches each of the internal switches of the signal control unit, which consists of analog multiplexers, according to a switch command, to keep each of the internal switches in an ON or OFF state. Here, the switch command set in the signal operation unit 50 can be set by a program command linked to the temperature control unit 91, or by using a separate control device that controls each of the internal switches of each analog multiplexer. When the measuring device 90 is connected to measure the temperature value of the resistance thermometer temperature sensor, the signal operation unit 50 generates a switch command in the signal control unit 40 to selectively switch the internal switches to an ON or OFF state, so that the measuring device 90 can receive signals and perform measurements. Furthermore, in the case of a thermocouple temperature sensor, the signal control unit 40 keeps the internal switch ON so that the temperature value of the temperature sensor unit 10 is supplied to both the signal control unit 40 and the measuring device 90.

[0064] The sensor power supply unit 60 is a power supply device that supplies power to the temperature sensor unit 10 and is electrically connected to some of the internal switches of the signal control unit 40, which consists of an analog multiplexer. In this case, the sensor power supply unit 60 supplies power to the temperature sensor unit 10 via the analog multiplexer. Furthermore, if the temperature sensor unit 10 consists of a thermocouple temperature sensor, the temperature sensor unit will not receive power from the sensor power supply unit 60, but will only receive power if the temperature sensor unit 10 consists of a resistance thermometer temperature sensor.

[0065] The converter unit 70 is electrically connected between the signal control unit 40 and the temperature control unit 91. The converter unit 70 converts the analog temperature value in the input signal control unit 40 into a digital temperature value.

[0066] If the temperature sensor unit 10 is configured as a resistance thermometer temperature sensor, the buffer unit 80 is electrically connected between the converter unit 70 and the temperature control unit 91. If the temperature sensor unit 10 is configured as a resistance temperature sensor, the buffer unit 80 stores the temperature value output from the converter unit 70, and continuously sends the previously stored temperature value to the temperature control unit 91 even when some of the internal switches are turned off.

[0067] The measuring device 90 is a device that measures the temperature value detected by the temperature sensor unit 10 and displays the temperature measurement value to the measuring operator. If the temperature sensor unit 10 wants to detect a measured analog temperature value, it is used by electrically connecting such a measuring device 90 to the branch connector 30.

[0068] Temperature control unit 91 is electrically connected to converter unit 70 and heating device (not shown) used in semiconductor manufacturing facility 1. Temperature control unit 91 receives temperature values ​​measured by temperature sensor unit 10 from converter unit 70 and controls the temperature of heating device in semiconductor manufacturing facility 1 so that the measured temperature value follows a set temperature value.

[0069] The measurement method of the temperature sensor unit 10 of the temperature controller 100 described above will be described below, as well as the various cases of <the temperature sensor unit 10 being configured as a thermocouple TC temperature sensor> and <the temperature sensor unit 10 being configured as a temperature resistance RTD temperature sensor>.

[0070] <If temperature sensor unit 10 is configured as a thermocouple temperature sensor> Figure 5 This is a block diagram showing the state of the temperature value of the temperature sensor unit 10 detected by the measuring device 90 when the temperature sensor unit 10 is configured as a thermocouple temperature sensor.

[0071] like Figure 5As shown, if the temperature sensor unit 10 is configured as a thermocouple temperature sensor, the operator connects the measuring device 90 to the branch connector 30 and checks the analog temperature value of the temperature sensor unit 10 displayed on the measuring device 90. In this case, the signal control unit 40 keeps the internal switches of both the thermocouple temperature sensor and the measuring device 90 in the ON state.

[0072] Next, the operator compares the temperature value displayed on the measuring device 90 with the temperature value output by the temperature control unit 91. If an error occurs, the temperature control unit, which is a thermocouple temperature sensor, is calibrated.

[0073] In this way, the temperature controller 100 according to the embodiment of the present invention can perform comparative measurement and sensing calibration without separating the temperature sensor unit 10 from the input channel, so that the semiconductor manufacturing facility 1 can operate uninterruptedly.

[0074] <If temperature sensor unit 10 is configured as a resistance temperature sensor> Figure 6 This is a block diagram showing the state when the temperature sensor unit 10 is configured as a temperature resistance temperature sensor, and the temperature value of the temperature sensor unit 10 is sent to the measuring device 90 through the control signal control unit 40. Figure 7 yes Figure 6 The block diagram shows the state in which the measuring device 90 is removed and the signal control unit 40 is controlled so that the temperature value of the temperature sensor unit 10 is sent to the temperature control unit 91.

[0075] like Figure 6 As shown, if the temperature sensor unit 10 is configured as a temperature resistance temperature sensor, the operator connects the measuring device 90 to the branch connector 30 and checks the simulated temperature value of the temperature sensor unit 10 displayed on the measuring device 90.

[0076] At this time, the measurement operator drives the signal operation unit 50. In particular, in the internal switch of the signal control unit 40, the internal switch of the sensor power supply unit 60 is turned on to supply power to the resistance thermometer temperature sensor, and the remaining internal switches are turned off to prevent the temperature value of the resistance thermometer from being sent to the converter unit 70.

[0077] Next, the operator compares the temperature value displayed on the measuring device 90 with the temperature value output to the temperature control unit 91, and corrects the temperature control unit 91, which is a temperature resistance temperature sensor, if an error occurs.

[0078] At this time, the buffer unit 80 stores the temperature value finally output from the converter unit 70, and the temperature control unit 91 continuously receives the temperature value stored in the buffer unit 80 and continuously executes temperature control drive. Therefore, even when measuring the temperature sensor unit 10, the temperature controller will drive the temperature control to the pre-stored temperature value, so as not to interrupt the operation of the semiconductor manufacturing facility 1.

[0079] Next, after completing the measurement, the operator disconnects the measuring device 90 from the branch connector 30, as follows: Figure 7 As shown in the figure, the internal switch of the signal control unit 40 is turned on to the on state by the drive signal operation unit 50.

[0080] Next, the temperature sensor unit 10 sends the detected temperature value to the signal control unit 40, and at the same time receives power from the sensor power supply unit 60. The sent temperature value is converted into a digital temperature value by the converter unit 70, and the converted digital temperature value is sent to the temperature control unit 91 of the semiconductor manufacturing facility 1 via the converter unit 70.

[0081] In this manner, when performing comparative measurement and sensing calibration on the temperature sensor unit 10, which is a resistance thermometer, the temperature controller 100 according to the embodiment of the present invention can perform comparative measurement and sensing calibration without separating the temperature sensor unit 10 from the input channel.

[0082] The effects of this invention are not limited to those described above. Effects not mentioned can be clearly understood by those skilled in the art from the specification and accompanying drawings.

[0083] Although preferred embodiments of the inventive concept have been illustrated and described to date, the inventive concept is not limited to the specific embodiments described above, and it is noted that those skilled in the art can implement the inventive concept in various ways without departing from the essence of the inventive concept claimed in the claims, and these modifications should not be interpreted separately from the technical spirit or prospect of the inventive concept.

Claims

1. A temperature controller, the temperature controller comprising: A temperature sensor unit, which is installed in a semiconductor manufacturing facility and configured to detect temperature values; A signal control unit configured to be electrically connected to the temperature sensor unit and input the temperature value; A buffer unit is configured to be electrically connected between the converter unit and the temperature control unit to store the temperature value output from the converter unit and continuously send the stored temperature value to the temperature control unit. and A measuring device, used to input the temperature value for measurement when electrically connected to the temperature sensor unit. The signal control unit turns on the internal switch among the multiple internal switches that is connected to the measuring device and the power supply unit, while turning off the other internal switches among the multiple internal switches, and sends the temperature value detected by the temperature sensor unit to the measuring device. When the measuring device is connected, the signal control unit turns off multiple switches among the multiple internal switches connected to the temperature sensor unit, so that the temperature value of the temperature sensor unit is not sent to the converter unit.

2. The temperature controller according to claim 1, wherein, The temperature sensor unit is a resistance thermometer (RTD) temperature sensor.

3. The temperature controller according to claim 1, wherein, The converter unit is configured to be electrically connected to the signal control unit and to perform digital conversion on the temperature value; and The temperature control unit is configured to be electrically connected to the converter unit and to generate a control drive for the temperature within the semiconductor manufacturing facility by inputting a digitally converted temperature value.

4. The temperature controller according to claim 3, wherein, The temperature controller further includes an input connector that provides an electrical connection area between the temperature sensor unit and the signal control unit.

5. The temperature controller according to claim 1, wherein, The temperature controller further includes a branch connector that provides an electrical connection area between the signal control unit and the measuring device.

6. The temperature controller according to claim 1, wherein, The temperature controller further includes a signal operation unit configured to be electrically connected to the signal control unit and to selectively keep the internal switch of the signal control unit in an on or off state by sending an input switch command to the signal control unit.

7. The temperature controller according to claim 6, wherein, The signal control unit is configured as an analog multiplexer.

8. The temperature controller of claim 1, further comprising a sensor power supply unit configured to be electrically connected to a portion of the plurality of internal switches of the signal control unit to supply power to the temperature sensor unit.

9. The temperature controller according to claim 3, wherein, The temperature control unit is electrically connected to the converter unit and the heating equipment used in the semiconductor manufacturing facility. It receives the temperature value measured by the temperature sensor unit from the converter unit and controls the temperature of the heating equipment so that the measured temperature value follows a set temperature value.

10. A temperature controller, the temperature controller comprising: A temperature sensor unit, which is installed in a semiconductor manufacturing facility to detect temperature values, and is configured as a thermocouple temperature sensor or a resistance thermometer temperature sensor. A signal control unit, configured to be electrically connected to the temperature sensor unit and input the temperature value; and A measuring device, used to input the temperature value for measurement when electrically connected to the temperature sensor unit. in, If the temperature sensor unit is configured as a thermocouple temperature sensor, the signal control unit electrically connects the temperature sensor unit and the measuring device when multiple internal switches are on. The temperature value detected by the temperature sensor unit is sent to both the measuring device and the temperature control unit. The temperature control unit is electrically connected to the signal control unit via a converter unit. If the temperature sensor unit is configured as a resistance thermometer temperature sensor, the temperature controller further includes a buffer unit, which is electrically connected between the converter unit and the temperature control unit to store the temperature value output from the converter unit and continuously send the stored temperature value to the temperature control unit; the signal control unit turns on multiple internal switches connected to the measuring device, while turning off the other internal switches, and sends the temperature value detected by the temperature sensor unit to the measuring device.

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